Wafer transfer equipment

Abstract

A wafer transfer apparatus is disclosed. A wafer transfer apparatus according to one aspect of the present invention is a wafer transfer apparatus for transferring a wafer placed on a loader to a stage, and may include: a first arm on which the wafer can be placed and which transfers the wafer from the loader to the stage; a second arm on which the wafer can be placed and which transfers the wafer from the stage to the loader; and a transfer base positioned above the first and second arms, which moves between the loader and the stage, and which sprays fluid to lift the wafer in a non-contact manner and separate the wafer from the first or second arm when the first or second arm is positioned below it.

Description

Technical Field

[0001] The present invention relates to a wafer transfer device, and more particularly, to a wafer transfer device for transferring a wafer placed on a loader to a stage where tests or the like are performed.

Background Art

[0002] As the thickness of the wafer decreases, the occurrence of warpage increases. Therefore, when the wafer has a thickness below a certain level, it is difficult to load the wafer onto the chuck in the bottom handling method where the arm transfers from the lower side of the wafer.

[0003] To solve such problems, a method using a top handling arm that utilizes Bernoulli's principle to inject a fluid such as an inert gas or CDA (Compressed Dry Air) onto the upper surface of the wafer and lift and transfer the wafer non - contact, a method of transferring the wafer using a folding - type wafer transfer, etc. have been proposed.

[0004] However, in the case of the method using the top handling arm, since there is no additional safety device, there is a risk of a wafer drop accident when a problem occurs in the fluid supply line or the pressure of the fluid decreases. On the other hand, when using a folding - type wafer transfer, a swing - up operation of the wafer transfer is required during the process of loading the wafer, which causes the chuck to be displaced forward or backward. As a result, the loading time of the wafer increases, and the problem of reduced production efficiency occurs. [[ID=- 21]] <>

[0005] (Prior Art Document) Registered Patent No. 1980137, "Wafer Transfer Robot", registered on May 14, 2019

Summary of the Invention

Problems to be Solved by the Invention

[0006] The present invention aims to solve the above-mentioned problems, and the objective of the present invention is to provide a wafer transfer device that can avoid the risk of wafer dropping while using an upper handling method that transfers wafers in a non-contact manner by injecting fluid onto the upper surface of the wafer during wafer transfer.

[0007] Another object of the present invention is to provide a wafer transfer apparatus that allows wafers to be handled from above, can move horizontally between the loader and the stage, and has high space efficiency.

[0008] The problems that the present invention will address are not limited to those described above, and any other problems not described will be clearly understood by an ordinary person skilled in the art to which the present invention pertains from the following description. [Means for solving the problem]

[0009] According to one aspect of the present invention, a wafer transfer apparatus is provided for transferring a wafer placed on a loader to a stage, comprising: a first arm on which the wafer can be placed and which transfers the wafer from the loader to the stage; a second arm on which the wafer can be placed and which transfers the wafer from the stage to the loader; and a transfer having a transfer base positioned above the first arm and the second arm, which moves between the loader and the stage, and which sprays fluid to lift the wafer in a non-contact manner and separate the wafer from the first arm or the second arm when the first arm or the second arm is positioned below it.

[0010] In this case, the transfer base can behave on a horizontal plane when moving from the loader to the stage, or when moving from the stage to the loader.

[0011] Furthermore, the transfer can be fixedly positioned on the loader.

[0012] Furthermore, the stage includes a chuck on which the wafer is placed, and the chuck is displaceable in the vertical direction during the wafer transfer process.

[0013] The transfer may further include a transfer arm, which is arranged to rotate on a horizontal plane around a vertically positioned fixed axis and to which the transfer base is connected at one end; and an actuator for rotating the transfer arm.

[0014] Furthermore, the fixed shaft and the actuator are fixedly positioned on the loader.

[0015] Furthermore, the transfer arm may be provided with a guide formed along its longitudinal direction so as to accommodate a tube for transporting the fluid supplied to the transfer base.

[0016] Furthermore, when the wafer is transferred from the loader to the stage, the first arm loads the wafer onto its upper body and moves from the loader to the stage, and the transfer base moves from the loader to the stage together with the first arm, and the fluid is injected to lift the wafer from the first arm.

[0017] Furthermore, when the wafer is transferred from the stage to the loader, the transfer base sprays the fluid over the chuck of the stage to lift the wafer from the chuck, the second arm moves from the loader to the stage to load the wafer on top, and then moves from the stage to the loader. [Effects of the Invention]

[0018] One aspect of the present invention is a wafer transfer apparatus that combines an arm for loading wafers on top and a transfer mechanism that handles the wafers non-contact at the top of the arm, thereby enabling wafer handling at the top while avoiding the risk of wafer dropping.

[0019] One aspect of the present invention relates to a wafer transfer apparatus in which the transfer mechanism that handles the wafer at the top is arranged to operate on a horizontal plane. This configuration eliminates the need for horizontal movement of the chuck during the wafer transfer process, thereby improving the efficiency of the wafer manufacturing process.

[0020] One aspect of the present invention relates to a wafer transfer apparatus that minimizes the space required for the transfer mechanism that handles the wafers at the top, thereby improving the spatial efficiency of the wafer transfer apparatus.

[0021] The effects of the present invention are not limited to those described above, but should be understood to include all effects that can be inferred from the detailed description of the present invention or the configuration of the invention as described in the claims. [Brief explanation of the drawing]

[0022] [Figure 1] Figure 1 is a schematic diagram showing the configuration of a wafer transfer apparatus according to one embodiment of the present invention. [Figure 2] Figure 2 shows a detailed configuration of the transfer mechanism of a wafer transfer apparatus according to one embodiment of the present invention. [Figure 3] Figure 3 shows the lower surface of the transfer base of a wafer transfer apparatus according to one embodiment of the present invention. [Figure 4] Figure 4 shows the state in which the transfer of the wafer transfer apparatus according to one embodiment of the present invention is positioned in the first position. [Figure 5] Figure 5 shows a state in which the transfer mechanism of a wafer transfer apparatus according to one embodiment of the present invention is positioned at the second position. [Figure 6]FIG. 6 is a diagram showing a wafer loading process by a wafer transfer device according to an embodiment of the present invention. [Figure 7] FIG. 7 is a diagram showing an unloading process of a wafer by a wafer transfer device according to an embodiment of the present invention.

Embodiments for Carrying Out the Invention

[0023] Hereinafter, referring to the accompanying drawings, embodiments of the present invention will be described in detail so that those having ordinary knowledge in the technical field to which the present invention belongs can easily implement it. The present invention can be implemented in various different forms and is not limited to the embodiments described herein. In order to clearly explain the present invention, parts not related to the description in the drawings are omitted, and the same reference numerals are assigned to the same or similar components throughout the specification.

[0024] The words and terms used in this specification and the claims are not to be construed as being limited to the ordinary meaning or dictionary meaning, but should be construed as meanings and concepts consistent with the technical idea of the present invention in accordance with the principle that the inventor can define the terms and concepts in order to best explain his own invention.

[0025] In this specification, terms such as "comprising" or "having" are used to explain the presence of features, numerical values, steps, operations, components, parts, or combinations thereof described in the specification, and should be understood not to preclude the presence or addition of one or more other features, numerical values, steps, operations, components, parts, or combinations thereof in advance.

[0026] Unless otherwise specified, the presence of one component "in front of," "behind," "beside," "above," or "below" another component includes not only cases where the component is directly in contact with the other component and positioned "in front of," "behind," "behind," "above," or "below," but also cases where the other component is positioned between them. Furthermore, unless otherwise specified, the "connection" of one component to another includes not only cases where the components are directly connected to each other, but also cases where they are indirectly connected.

[0027] Figure 1 is a schematic diagram showing the configuration of a wafer transfer apparatus according to one embodiment of the present invention.

[0028] A wafer transfer apparatus 100 according to one embodiment of the present invention can transfer a wafer W from a loader L to a stage S. More specifically, the wafer transfer apparatus 100 can load a wafer W placed in the loader L into a chuck C located in the stage S.

[0029] Furthermore, the wafer transfer apparatus 100 according to one embodiment of the present invention can also transfer wafers from the stage S to the loader L. That is, the wafer transfer apparatus 100 can unload wafers placed in the chuck C located within the stage S to the loader L.

[0030] For example, a loader L may contain wafers W in which the semiconductor front-end processes have been completed. More specifically, multiple wafers may be placed in the loader L stacked within a Front Opening Unified Pod (FOUP).

[0031] Furthermore, a prober can be placed on stage S to test the electrical characteristics of semiconductor chips formed on wafers that have completed the semiconductor front-end processes, and to check for defects before proceeding to the back-end processes.

[0032] Referring to Figure 1, a wafer transfer apparatus 100 according to one embodiment of the present invention transfers a wafer W placed on a loader L to a stage S, or transfers a wafer placed on a stage S to a loader L. The wafer transfer apparatus 100 according to one embodiment of the present invention includes a first arm 110, a second arm 120, and a transfer 130.

[0033] The first arm 110 can place a wafer on top of it and transfer the wafer W from the loader L to the stage S. The first arm 110 can be displaced horizontally; that is, the first arm 110 can operate on the XY plane during the wafer transfer process. The first arm 110 can also be displaced vertically as needed; in other words, the first arm 110 can also behave in the Z-axis direction during the wafer transfer process.

[0034] In summary, the first arm 110 can move horizontally during the wafer transfer process. Furthermore, the first arm 110 can also move vertically during the wafer transfer process. That is, the first arm 110 can move in the X, Y, and Z axis directions.

[0035] The first arm 110 may include a plate-shaped mounting portion on which a wafer can be placed. Furthermore, the first arm 110 can grip and hold the wafer by suction. More specifically, the first arm 110 can create negative pressure on the underside of the wafer, causing the wafer to adhere tightly to the first arm 110.

[0036] The first arm 110 can be driven by a first arm drive unit 110a. The first arm drive unit 110a may include one or more joints and actuators that drive the joints. For example, the actuator of the first arm drive unit 110a is a motor.

[0037] Furthermore, the first arm drive unit 110a may include negative pressure providing means to provide negative pressure to the first arm 110 for wafer adsorption. For example, the negative pressure providing means may include a pump and a conduit connecting the pump and the first arm 110.

[0038] The second arm 120 can support a wafer and transfer the wafer from the stage S to the loader L. The second arm 120 can be displaced horizontally; that is, it can move in the XY plane during the wafer transfer process. The second arm 120 can also be displaced vertically as needed. In other words, the first arm 120 can also move in the Z-axis direction during the wafer transfer process.

[0039] In other words, the second arm 120 can move horizontally during the wafer transfer process. Furthermore, the second arm 120 can also move vertically during the wafer transfer process. That is, the second arm 120 can move in the X, Y, and Z axis directions.

[0040] The second arm 120 may include a plate-shaped mounting section on which a wafer can be placed. Furthermore, the second arm 120 can grip and hold the wafer by suction. More specifically, the second arm 120 can create negative pressure on the underside of the wafer, causing the wafer to adhere tightly to the second arm 120.

[0041] The second arm 120 may be driven by a second arm drive unit 120a. The second arm drive unit 120a may include one or more joints and actuators that drive the joints. For example, the actuator of the second arm drive unit 120a may be a motor.

[0042] Furthermore, the second arm drive unit 120a may include negative pressure providing means for providing negative pressure to the first arm 120 for wafer adsorption. For example, the negative pressure providing means may include a pump and a conduit connecting the pump and the second arm 120a.

[0043] In one embodiment of the present invention, the second arm 120 may be positioned above the first arm 110. In other words, the first arm 110 may be positioned below the second arm 120. Of course, this is illustrative, and the relative vertical positions of the first arm 110 and the second arm 120 may change as needed.

[0044] The transfer 130 is positioned above the first arm 110 and the second arm 120. The transfer 130 can handle wafers using a top handling method, which involves non-contact handling of the wafer from above. More specifically, when a wafer is loaded onto the top of the first arm 110 or the second arm 120, the transfer 130 injects the fluid from above the wafer. According to Bernoulli's principle, a lift force acts on the wafer, causing it to move away from the first arm 110 or the second arm 120 and lift towards the transfer 130.

[0045] In this case, the fluid that the transfer 130 sprays onto the upper surface of the wafer may be CDA (Compressed Dry Air). Alternatively, the fluid may be an inert gas.

[0046] Figure 2 shows a detailed configuration of the transfer mechanism of a wafer transfer apparatus according to one embodiment of the present invention.

[0047] Referring to Figure 2, the transfer 130 may include a transfer base 131, a transfer arm 132, and an actuator 133.

[0048] The transfer base 131 operates between the loader L and the stage S, and with the first arm 110 or the second arm 120 positioned below it, it sprays fluid to lift the wafer in a non-contact manner, separating the wafer from the first arm 110 or the second arm 120.

[0049] The transfer base 131 may have a circular plate shape. The transfer base 131 receives the fluid from an external source and injects it to the underside of the transfer base 131. The flow of the fluid generates lift, causing the wafer placed below the transfer base 131 to be lifted upwards.

[0050] More specifically, the transfer base 131 may have one or more connecting portions 131a connected to an external fluid supply pipe (not shown). The transfer base 131 may also include an internal hydraulic line that guides the fluid flowing in through the connecting portions 131a to the underside of the transfer base 131.

[0051] Figure 3 shows the lower surface of the transfer base of a wafer transfer apparatus according to one embodiment of the present invention.

[0052] Referring to Figure 3, the lower surface of the transfer base 131 may be provided with one or more cyclone pads 131b for injecting the fluid. In one embodiment of the present invention, six cyclone pads 131b are arranged in a circle at regular intervals from one another. Of course, this is illustrative, and the number and arrangement of the cyclone pads 131b can be changed as needed.

[0053] The transfer arm 132 is positioned to rotate on a horizontal plane around a fixed axis A, which is located vertically (in the Z-axis direction). A transfer base 131 is connected to one end of the transfer arm 132. The other end of the transfer arm 132 is rotatably connected to the fixed axis A and can be connected to an actuator 133.

[0054] The transfer arm 132 may be provided with a guide 132a formed along its longitudinal direction, such as a fluid supply pipe (not shown) for transporting fluid supplied to the transfer base 131. In one embodiment of the present invention, the guide 132a may be formed as a groove with an open top. Alternatively, the guide 132a may be covered by another cover. On the other hand, the guide 132a may have a tubular structure.

[0055] The actuator 133 rotates the transfer arm 132. The actuator 133 supplies torque to the transfer arm 132 so that the transfer arm 132 can pivot around the fixed axis A.

[0056] In one embodiment of the present invention, the actuator 133 may include a rod 133a that is rotatably coupled to a fixed shaft A and coupled to the other end of a transfer arm 132 to which a transfer base 131 is connected, and which is displaced in one or the other direction to provide torque to the transfer arm 132, and a rod drive unit 133b that provides a driving force so that the rod 133a is linearly displaced in one or the other direction.

[0057] For example, the rod drive unit 133b may include a cylinder that drives the rod 133a by the pressure of a fluid. More specifically, the fluid may be air; that is, the cylinder may be an air cylinder.

[0058] On the other hand, the transfer case 130 may further include a control unit 130a that controls the actuator 133. The control unit 130a can control the actuator 133 by receiving commands from a higher-level control unit.

[0059] In one embodiment of the present invention, the transfer 130 is capable of operating on a horizontal plane. Specifically, the transfer base 131 of the transfer 130 is capable of moving on a horizontal plane when moving from the loader L to the stage S, and when moving from the stage S to the loader L.

[0060] On the other hand, in one embodiment of the present invention, the transfer 130 may not have vertical displacement. For example, the transfer base 131 can move on the XY plane without displacement in the Z-axis direction during the wafer transfer process.

[0061] If the transfer 130 is configured using a folding method, a swing-up motion is required during the operation of the transfer 130, resulting in considerable displacement not only in the XY plane but also in the Z-axis direction. Therefore, when loading a wafer into the chuck C of the stage S, interference with the chuck C may occur, requiring the chuck C to be displaced forward or backward from the stage S. As a result, a problem arises in which the wafer loading efficiency decreases.

[0062] However, in the present invention, the transfer 130 operates on a horizontal plane located above the chuck C, i.e., on the XY plane located above the chuck C, minimizing displacement in the Z-axis direction. Therefore, interference with the chuck C located on the stage S can be minimized. This minimizes the displacement of the chuck C, improving the efficiency of the wafer manufacturing process.

[0063] Figure 4 shows the state in which the transfer of the wafer transfer apparatus according to one embodiment of the present invention is positioned in the first position. Figure 5 shows the state in which the transfer of the wafer transfer apparatus according to one embodiment of the present invention is positioned in the second position.

[0064] Referring to Figures 4 and 5, the first position is defined as the position where the transfer base 131 is positioned as far away from the stage S as possible and on the loader L side, and the second position is defined as the position where the transfer base 131 is positioned above the chuck C of the stage S.

[0065] When the transfer base 131 moves from a first position to a second position or from a second position to a first position, the transfer base 131 can behave on a horizontal plane. For example, the transfer base 131 may not have any horizontal displacement. That is, the transfer base 131 may move on the XY plane and not have any displacement in the Z-axis direction.

[0066] Furthermore, in one embodiment of the present invention, the transfer arm 132 and actuator 133 that drive the transfer 130 can also move in the XY plane. Alternatively, displacement along the Z axis can be minimized, or there may be no displacement in the Z axis direction. In this case, the XY plane on which the transfer 130 moves can be located above the chuck C positioned on the stage S.

[0067] This prevents interference between the transfer 130 and the chuck C when loading wafers into the chuck C on the stage S or unloading them from the chuck C on the stage S to the loader L. The chuck C positioned on the stage S minimizes horizontal displacement and can be displaced vertically as needed during the wafer transfer process. As a result, the displacement of the chuck C and the time required for displacement during the wafer loading and unloading processes can be minimized, improving the efficiency of the manufacturing process.

[0068] On the other hand, in one embodiment of the present invention, the transfer 130 may be fixedly positioned on the loader L. Specifically, the fixed shaft A and actuator 133 of the transfer 130 may be fixedly positioned on the loader.

[0069] More specifically, the transfer 130 can be positioned in the upper space of the loader L. As mentioned above, since the transfer 130 has an operating mechanism that operates mainly in the XY plane, it requires less space compared to a folding type transfer. This allows the transfer 130 to be positioned in the upper space of the loader L formed above the first arm 110 and the second arm 120, maximizing space efficiency.

[0070] The configuration of the wafer transfer apparatus 100 according to one embodiment of the present invention has been described in detail above. The operation process of the transfer apparatus 100 according to one embodiment of the present invention will now be described.

[0071] Figure 6 shows the wafer loading process using a wafer transfer apparatus according to one embodiment of the present invention. The wafer loading process will be explained with reference to Figure 6.

[0072] First, with the wafer W placed on the loader L, the first arm 110, the second arm 120, and the transfer base 131 are positioned on the loader L (Figure 6(a)). At this time, the wafer W may be one which has already undergone semiconductor front-end processing. Alternatively, multiple wafers may be stacked within a Front Opening Unified Pod (FOUP) and placed on the loader L.

[0073] Next, with the wafer W placed on top of the first arm 110, the first arm 110 and the transfer base 131 move together to the stage S (Figure 6(b)). At this time, the first arm 110 can grip the wafer W in an adsorption state.

[0074] Next, the transfer base 131 sprays the fluid to lift the wafer W from the first arm 110 (Figure 6(c)). At this time, the wafer W may not come into contact with the lower surface of the transfer base 131. In other words, the transfer 130 can handle the wafer W in a non-contact manner. On the other hand, the first arm 110 can move vertically upward to allow the transfer base 131 to handle the wafer smoothly.

[0075] Next, the first arm 11 returns to the loader L, leaving the wafer W on the stage S, and the chuck C moves vertically upward to support the wafer W (Figure 6(d)). At this time, the transfer 130 can stop spraying the fluid. This secures the wafer W to the chuck C. The chuck C also supplies negative pressure to the underside of the wafer W, allowing it to attract and hold the wafer W.

[0076] Finally, the chuck C moves vertically downward (Figure 6(e)). At this point, the chuck C can support the wafer W in a suction state. With the wafer W positioned in the chuck C, tests and other operations can be performed on the wafer W.

[0077] Thus, according to the present invention, when a wafer W is transferred from a loader L to a stage S, the first arm 110 places the wafer W on top of it and moves from the loader L to the stage S, and the transfer base 131 moves together with the first arm 110 from the loader L to the stage S and sprays the fluid to lift the wafer W from the first arm 110.

[0078] Thus, according to the present invention, upper handling can be performed in the wafer loading process without the risk of wafer drop accidents. Furthermore, wafers with warpage can be handled effectively.

[0079] Figure 7 shows the wafer unloading process using a wafer transfer apparatus according to one embodiment of the present invention. The wafer unloading process will be explained with reference to Figure 7.

[0080] First, with the wafer W placed in the chuck C, the transfer base 131 is positioned above the wafer W (Figure 7(a)). At this point, the wafer W may be in a state where testing or other procedures have been completed.

[0081] Next, the chuck C moves vertically upward, bringing the wafer W closer to the transfer base 131, and the transfer base 131 sprays the fluid to lift the wafer W (Figure 7(b)). At this time, the chuck C interrupts the supply of negative pressure so that the wafer W is lifted towards the transfer base 131.

[0082] Next, while the transfer base 131 is injecting the fluid to hold the wafer W in a non-contact manner, the second arm 120 moves under the wafer W and places the wafer W on it (Figure 7(c)). At this time, the transfer base 131 stops injecting the fluid, and the second arm 120 can supply negative pressure to the underside of the wafer W to grip the wafer W in an adsorption state.

[0083] Finally, with the wafer W placed on top of the second arm 120, the second arm 120 and the transfer base 131 move together from the stage S to the loader L (Figure 7(d)). At this time, the second arm 120 can grip the wafer W in a suction state.

[0084] Thus, according to the present invention, when a wafer W is transferred from the stage S to the loader L, the transfer base 131 sprays the fluid above the chuck C of the stage S to lift the wafer W from the chuck C, the second arm 120 moves from the loader L to the stage S to place the wafer W on top, and then moves from the stage S to the loader L.

[0085] Thus, according to the present invention, upper handling can be performed in the wafer unloading process without the risk of wafer drop accidents. Furthermore, wafers with warpage can also be handled effectively.

[0086] As described above, the wafer transfer apparatus according to the present invention uses an upper handling method that transfers wafers in a non-contact manner by injecting fluid onto the upper surface of the wafer during wafer transfer, while also avoiding the risk of wafer dropping during the wafer loading and unloading processes.

[0087] More specifically, the present invention enables overhead handling of wafers without the risk of dropping them by combining a first arm 110 and a second arm 120 that support wafers on top, and a transfer 130 that handles wafers non-contact above the first arm 110 and the second arm 120.

[0088] Furthermore, the wafer transfer apparatus according to the present invention, with its configuration that allows wafers to be handled from above, provides high space efficiency through a configuration that moves horizontally between the loader and the stage. In addition, the wafer transfer apparatus according to the present invention improves the efficiency of the wafer manufacturing process by eliminating the need for horizontal movement of the chuck during the wafer transfer process.

[0089] Although embodiments of the present invention have been described, the spirit of the present invention is not limited to the embodiments shown herein. Those skilled in the art who understand the spirit of the present invention will be able to easily propose other embodiments within the same spirit by adding, changing, deleting, or adding components. These, too, can be said to fall within the spirit of the present invention.

Claims

1. In a wafer transfer apparatus that transfers wafers placed on a loader to a stage, A first arm capable of loading the wafers on top and transferring the wafers from the loader to the stage; A second arm capable of loading the wafers on top and transferring the wafers from the stage to the loader; and A transfer unit having a transfer base positioned above the first arm and the second arm, which moves between the loader and the stage, and which sprays fluid to lift the wafer in a non-contact manner when the first arm or the second arm is positioned below, thereby separating the wafer from the first arm or the second arm, A wafer transfer apparatus equipped with [a specific feature].

2. The wafer transfer apparatus according to claim 1, wherein the transfer base behaves on a horizontal plane when moving from the loader to the stage, or when moving from the stage to the loader.

3. The wafer transfer apparatus according to claim 1, wherein the transfer is fixedly positioned on the loader.

4. The stage includes a chuck in which the wafer is placed. The wafer transfer apparatus according to claim 1, wherein the chuck is displaced vertically during the wafer transfer process.

5. The aforementioned transfer is A transfer arm positioned to rotate on a horizontal plane around a vertically positioned fixed axis, with the transfer base connected to one end; and A wafer transfer apparatus according to claim 1, further comprising an actuator for rotating the transfer arm.

6. The wafer transfer apparatus according to claim 5, wherein the fixed shaft and the actuator are fixedly arranged on the loader.

7. The wafer transfer apparatus according to claim 5, wherein the transfer arm comprises a guide formed along its longitudinal direction so as to accommodate a tube for transporting fluid supplied to the transfer base.

8. The wafer transfer apparatus according to claim 1, wherein when the wafer is transferred from the loader to the stage, the first arm moves from the loader to the stage with the wafer on top, the transfer base moves from the loader to the stage together with the first arm, and the fluid is injected to lift the wafer from the first arm.

9. The wafer transfer apparatus according to claim 1, wherein when the wafer is transferred from the stage to the loader, the transfer base sprays the fluid on the upper part of the chuck of the stage to lift the wafer from the chuck, the second arm moves from the loader to the stage to load the wafer on top, and moves from the stage to the loader.

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