Wafer posture adjustment rotating table and nanoimprint device

By designing a wafer attitude adjustment rotary stage, the problem of relative rotation between the imprint head and the wafer in nanoimprint equipment was solved, achieving high-precision positioning and servo stability, improving imprint quality, and meeting the integration requirements of semiconductor equipment.

CN122362737APending Publication Date: 2026-07-10张江国家实验室
View PDF 2 Cites 0 Cited by

Patent Information

Application Number
CN202510032630.5
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-01-08
Publication Date
2026-07-10

AI Technical Summary

Technical Problem

In existing nanoimprinting equipment, lateral deflection forces can easily occur between the imprint head and the wafer during the imprinting process, causing the imprint template and the wafer to rotate relative to each other, which affects the processing quality. Furthermore, the existing equipment lacks precision and cannot meet high-precision requirements.

Method used

A wafer attitude adjustment rotary stage, including a wafer stage, a rotary stage driver, an angle measurement mechanism, sensors, and a controller, is used to achieve rotation adjustment and dynamic compensation within a 360° range. The position of the wafer stage is adjusted in real time through angle and position information, providing high-precision positioning and servo stability.

Benefits of technology

It achieves high-precision positioning of the imprint head and wafer during the imprinting process, ensuring imprinting quality. The compact design of the equipment can be integrated into semiconductor equipment, is compatible with laser beam measurements, and has high rigidity and resistance to external interference.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN122362737A_ABST
    Figure CN122362737A_ABST
Patent Text Reader

Abstract

The present invention discloses a wafer attitude adjustment rotating table and a nanoimprinting device. The rotating table includes: a wafer stage; a turntable driver for driving the wafer stage to rotate along an axis; an angle measurement mechanism connected to the wafer stage and capable of联动 with the wafer stage. When the wafer stage rotates, it is used to measure the rotation angle of the wafer stage to generate angle information; a sensor, the sensor is installed on the wafer stage and is used to obtain the positions of the wafer stage before and after rotation to generate position information; a controller, which controls the turntable driver to adjust the position of the wafer stage based on the angle information and the position information. This application can perform rotation adjustment within a range of 360°, achieve precise adjustment and dynamic compensation of the rotation direction, has the characteristics of high rigidity and high-precision positioning, provides better positioning accuracy and servo stability, and ensures the imprint quality. It should be noted that the term "联动" in the original text may not have a very accurate and common English equivalent in this context. I have tried to translate it as "联动", but it may need to be adjusted according to the specific technical meaning in the relevant field. If there is a more appropriate English expression, it can be further optimized.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] This invention relates to the technical field of nanoimprinting equipment, and in particular to a wafer orientation adjustment rotary table and nanoimprinting equipment. Background Technology

[0002] Nanoimprint lithography is a micro-nano fabrication technology that uses photoresist to transfer micro-nano structures from a template onto the material to be processed. The accuracy of the wafer's position during the pattern transfer process is crucial and is the key to ensuring the precision of the imprint.

[0003] Currently, the motion stage of nanoimprinting equipment is mainly based on two axes, XY. In the actual imprinting process, a deflection lateral force will occur between the imprint head and the wafer, causing the imprint template and the wafer to rotate relative to each other, which affects the wafer processing quality.

[0004] In the prior art, Chinese invention patent application No. 202310159994.0 discloses an angle adjustment device and a wafer stage, including a support disk, a rotating disk, and a drive mechanism. The rotating disk is movably connected above the support disk and has axial and circumferential degrees of freedom relative to the support disk. A cavity for applying positive or negative pressure is formed between the support disk and the rotating disk. The drive mechanism is driven by the rotating disk and is used to drive the rotating disk to rotate circumferentially. The drive mechanism includes a power component, a connecting rod, a linear bearing, and a rocker arm. The power component has a direction parallel to the axis of rotation. The power output terminal for linear motion in the horizontal direction is connected at both ends of the connecting rod to the power output terminal and the linear bearing, respectively. The linear bearing is fixed to the rotating disk via the rocker arm. The power assembly includes a base, a rotary motor, a lead screw, and a sliding seat. The rotary motor is mounted on the base, which has a slide rail extending in a direction parallel to the horizontal plane. The lead screw is connected to the rotary motor. The sliding seat is the power output terminal of the power assembly, threadedly connected to the lead screw and slidingly engaged with the slide rail. The rotary motor drives the lead screw to rotate, which in turn drives the sliding seat to rotate the rotating disk via a linkage transmission. While this solution provides a wafer rotation mechanism, its accuracy is relatively poor and does not meet the high-precision requirements of nanoimprint lithography equipment.

[0005] Chinese utility model patent application number 202122205516.8 discloses a wafer positioning device and a nanoimprinting apparatus. The wafer positioning device includes: a wafer positioning platform, comprising an annular transfer stage and a positioning clamping mechanism. The annular transfer stage is used to place the wafer to be positioned, and the positioning clamping mechanism is used to position the center of the wafer to a predetermined position; a wafer adsorption device, located below the hollow portion of the annular transfer stage, is used to adsorb and fix the wafer placed in the annular transfer stage; a rotation drive device, connected to the wafer adsorption device, is used to drive the wafer adsorption device to rotate the wafer clockwise or counterclockwise; a fiber optic sensor, located on the outer periphery of the annular transfer stage, is used to identify positioning notches on the wafer; and a main control device, which is signal-connected to the positioning clamping mechanism, the wafer adsorption device, the rotation drive device, and the fiber optic sensor, respectively. This design solves the problem of the inability to quickly position and adjust wafers with varying positions and angles during current nanoimprinting processes. The above-mentioned solutions are mainly used to quickly position and adjust the wafer during wafer loading, but they cannot guarantee the accuracy of the wafer during operation. Furthermore, during the imprinting process, a lateral force will occur between the imprint head and the wafer, causing the imprint template and the wafer to rotate relative to each other, which affects the wafer processing quality. In addition, the above-mentioned equipment occupies a large area and has poor compatibility with nanoimprinting equipment.

[0006] To address the aforementioned issues, this application provides a wafer orientation adjustment rotary stage and a nanoimprinting apparatus. Summary of the Invention

[0007] This invention provides a wafer attitude adjustment rotary table and a nanoimprinting device, which can perform rotational adjustment within a 360° range, achieving precise adjustment and dynamic compensation of the rotation direction. It features high rigidity and high-precision positioning, providing better positioning accuracy and servo stability, and ensuring imprinting quality.

[0008] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:

[0009] A wafer attitude adjustment rotary stage, comprising:

[0010] Wafer stage;

[0011] A turntable driver for driving the wafer stage to rotate along an axis;

[0012] An angle measuring mechanism is connected to the wafer stage and can be linked with the wafer stage. When the wafer stage rotates, it is used to measure the rotation angle of the wafer stage to generate angle information.

[0013] A sensor, mounted on a wafer stage, is used to acquire the position of the wafer stage before and after rotation to generate position information;

[0014] The controller controls the turntable driver to adjust the position of the wafer stage based on the angle and position information.

[0015] Preferably, the wafer stage and the turntable driver are respectively provided with central holes along the rotation axis, and the wafer stage and the angle measuring mechanism are respectively located on opposite sides of the turntable driver.

[0016] Preferably, the turntable driver includes a coreless direct-drive motor, and the wafer stage is connected to the inner rotating ring of the turntable driver.

[0017] Preferably, the wafer stage includes a mounting plate and a drive feedback adapter, wherein the mounting plate is connected to the turntable driver via the drive feedback adapter.

[0018] Preferably, the turntable driver is provided with an adapter ring, which is connected to the drive feedback adapter and can be linked with the drive feedback adapter. The angle measuring mechanism is mounted on the adapter ring.

[0019] Preferably, the angle measuring mechanism includes a circular grating and a reading head. The circular grating is connected to the wafer stage and can rotate with the wafer stage. The reading head is located outside the turntable driver and is fixed relative to the turntable driver position, used to read the rotation angle of the circular grating.

[0020] Preferably, the wafer stage, turntable driver, angle measuring mechanism, and sensor are encapsulated within the turntable base.

[0021] Preferably, the turntable base is provided with a mounting chamber, the turntable driver is embedded in the mounting chamber, and the reading head of the angle measuring mechanism is located on the side wall of the mounting chamber; the outer periphery of the wafer stage is provided with a rotating collar, the rotating collar is fixed in the mounting chamber by a guide rail fixing ring, and the guide rail fixing ring is connected to the turntable base.

[0022] Preferably, the outer side of the turntable base is provided with an adjustment mechanism for positioning the wafer stage, and the outer periphery of the wafer stage is provided with a mounting groove that engages with the adjustment mechanism.

[0023] Preferably, the adjustment mechanism includes a fixing part disposed on the turntable base, the fixing part having an oblong hole with its long axis arranged in the horizontal direction, the fixing part being connected to the turntable base by fastening screws, the fixing part being able to be adjusted in position along the long axis of the oblong hole; the fixing part having a locking protrusion that mates with the mounting groove.

[0024] This invention discloses a nanoimprinting apparatus, including a wafer orientation adjustment rotary table.

[0025] Compared with the prior art, the present invention has the following advantages:

[0026] 1. This application can be rotated within a 360° range to achieve precise adjustment and dynamic compensation of the rotation direction. It features high rigidity and high-precision positioning, providing better positioning accuracy and servo stability, and ensuring imprinting quality.

[0027] 2. In the imprinting process, if a lateral force of deflection occurs between the imprint head and the wafer, causing the imprint template and the wafer to rotate relative to each other, the angle measuring mechanism will transmit the wafer stage position data to the external controller. The sensor will feed back the wafer stage position to the controller, and the controller will control the turntable driver to adjust the wafer stage position in real time to achieve high-precision positioning.

[0028] 3. This application encapsulates the wafer precision control mechanism and drive mechanism in a turntable base to achieve a compact design, which can be well integrated into semiconductor equipment, meeting device size selection requirements. Furthermore, the design of the center hole can be well compatible with laser through-beam measurement applications. In addition, the above-mentioned components have high rigidity and load-bearing capacity, can achieve high dynamic response, and have high resistance to external interference.

[0029] The invention will now be further described with reference to the accompanying drawings. Attached Figure Description

[0030] Figure 1 This is a schematic diagram of the structure of the present invention;

[0031] Figure 2 This is an exploded view of the present invention;

[0032] Figure 3 This is a cross-sectional view of the present invention.

[0033] Figure label:

[0034] 1. Turntable driver; 2. Sensor; 3. Turntable base; 4. Mounting plate; 5. Drive feedback adapter; 6. Center hole; 7. Adapter ring; 8. Circular grating; 9. Reading head; 10. Rotary collar; 11. Guide rail fixing ring; 12. Adjustment mechanism; 12.1. Fixing part; 12.2. Fastening screw; 12.3. Locking protrusion; 13. Mounting groove. Detailed Implementation

[0035] This invention discloses a wafer orientation adjustment rotary stage and a nanoimprinting device.

[0036] Example 1:

[0037] like Figures 1-3As shown, the wafer attitude adjustment rotary table includes a wafer stage, a rotary table driver 1, an angle measuring mechanism, a sensor 2, a controller, and a rotary table base 3. The rotary table base 3 has a mounting chamber that extends through its top. The wafer stage, rotary table driver 1, angle measuring mechanism, and sensor 2 are encapsulated within the rotary table base 3.

[0038] The wafer stage can rotate along the rotation axis and is used to mount wafer chucks. The wafer stage includes a mounting plate 4 and a drive feedback adapter 5. The mounting plate 4 and the drive feedback adapter 5 are connected and fixed together. The turntable driver 1 drives the drive feedback adapter 5 to rotate, which in turn drives the mounting plate 4 to rotate, thereby controlling the position of the wafer on it.

[0039] The turntable driver 1 is used to drive the wafer stage to rotate along the rotation axis. Its driving end is connected to the drive feedback adapter 5, which drives the drive feedback adapter 5 to rotate.

[0040] In another embodiment of this application, a coreless direct drive motor is selected for rotation drive. The drive feedback adapter 5 is connected to the inner rotating ring of the turntable driver 1. The use of a coreless direct drive motor reduces driving force fluctuations and improves accuracy and stability.

[0041] An angle measuring mechanism rotates with the wafer stage and reads the rotation angle of the wafer stage when it rotates. Sensor 2 is mounted on the wafer stage and reads the position of the wafer stage before and after rotation. During the imprinting process, if a lateral force deflects between the imprint head and the wafer, causing the imprint template and the wafer to rotate relative to each other, the angle measuring mechanism reads the rotation angle of the wafer stage to generate angle information. Sensor 2 monitors the position of the wafer stage before and after the angle change to generate position information. Based on the angle information and position information, the controller controls the turntable driver 1 to adjust and reset the position of the wafer stage in real time, achieving high-precision positioning.

[0042] Preferably, sensor 2 is an absolute sensor, which does not require zeroing and has the function of saving position information after power failure.

[0043] In one embodiment of this application, the wafer stage and the turntable driver 1 are provided with a central hole 6 along the rotation axis. The central hole 6 penetrates the turntable base 3, providing space for the wafer chuck to route traces. On the other hand, the wafer stage and the angle measuring mechanism are located on opposite sides of the turntable driver 1. The turntable driver 1 is provided with a transition ring 7, which is connected to the drive feedback transition component 5 and can rotate together with the drive feedback transition component 5. The angle measuring mechanism is mounted on the transition ring 7.

[0044] Preferably, the angle measuring mechanism includes a circular grating 8 and a reading head 9. The circular grating 8 is fixedly installed on the outer circumferential surface of the adapter ring 7 and is linked with the wafer stage. The reading head 9 is fixed in position relative to the circular grating 8 and is used to read the rotation angle of the circular grating 8. By selecting a high-resolution circular grating 8, the rotation angle can be directly measured, meeting the accuracy requirements of a minimum displacement of 1 arcsecond, a positioning accuracy of 5 arcseconds, and a servo accuracy of 1 arcsecond for the rotary stage. This improves the rotation position accuracy in the nanoimprinting process and has broad application prospects in other applications such as wafer inspection and flexible panel processing.

[0045] In another embodiment of this application, the wafer stage, turntable driver 1, angle measuring mechanism, and sensor 2 are encapsulated within a turntable base 3. The turntable base 3 has a mounting chamber with a sealed bottom and an open top. The turntable driver 1 is embedded in the mounting chamber and is fixed relative to the turntable base 3. The reading head 9 is fixed to the side wall of the mounting chamber and is positioned at the same level as the circular grating 8. A rotating collar 10 is fixed to the outer periphery of the drive feedback adapter 5. A guide rail fixing ring 11 is provided on the top of the rotating collar 10. The guide rail fixing ring 11 and the side wall of the mounting chamber have a threaded engagement structure, which fixes the guide rail fixing ring 11 to the turntable base 3 and presses the rotating collar 10 tightly. Furthermore, the rotating collar 10 is supported by a cross roller collar, which can maximize the rigidity requirements. Through the above design, the wafer precision control mechanism and drive mechanism are encapsulated in the turntable base 3, achieving a compact design that can be well integrated into semiconductor equipment, meeting device size selection requirements. Furthermore, the design of the center hole 6 is well compatible with laser through-beam measurement applications. In addition, the above-mentioned components have high rigidity and load-bearing capacity, can achieve high dynamic response, and have high resistance to external interference.

[0046] Furthermore, the turntable base 3 is provided with an adjustment mechanism 12 at intervals on the outer side for positioning the wafer stage, and the mounting plate 4 is provided with mounting grooves 13 at intervals on the outer periphery for cooperating with the adjustment mechanism 12. The mounting grooves 13 can be evenly arranged along the circumferential distance of the mounting plate 4.

[0047] The adjustment mechanism 12 includes a fixing part 12.1 located on the outside of the turntable base 3. The fixing part 12.1 has a waist-shaped hole with its long axis arranged horizontally. Two waist-shaped holes can be spaced vertically. A fastening screw 12.2 passing through the waist-shaped hole connects the fixing part 12.1 and the turntable base 3. Tightening the fastening screw 12.2 fixes the fixing part 12.1 to the turntable base 3. Loosening the fastening screw 12.2 allows for minor position adjustments of the fixing part 12.1 along the length of the waist-shaped hole. The fixing part 12.1 also has a locking protrusion 12.3 that engages with the mounting groove 13 to position the mounting plate 4 and prevent rotation. The adjustment mechanism 12 allows for both small-range adjustments to the mounting plate 4 and, after adjustment, fixes its position.

[0048] Preferably, damping structures are installed on the left and right sides of the protrusion 12.3 to prevent the mounting plate 4 from colliding hard with the protrusion 12.3.

[0049] Preferably, the mounting plate 4 has a matte anodized surface treatment to reduce reflectivity and avoid affecting the function of optical components.

[0050] Mounting plate 4 is compatible with mounting 12-inch and 8-inch suction cups.

[0051] Example 2:

[0052] In another embodiment of this application, the angle measuring mechanism is located above the turntable driver, the circular grating is sleeved on the drive feedback adapter and located below the rotating collar, and the reading head is mounted on the side wall of the turntable base.

[0053] Example 3:

[0054] This application also provides a nanoimprinting apparatus, which is equipped with the rotary table described in Embodiment 1 or Embodiment 2 above.

[0055] The embodiments described above are merely preferred embodiments of the present invention and are not intended to limit the scope of the present invention. Various modifications and improvements made by those skilled in the art to the technical solutions of the present invention without departing from the spirit of the present invention should fall within the protection scope defined by the claims of the present invention.

Claims

1. A wafer attitude adjustment rotary stage, characterized in that, include: Wafer stage; A turntable driver for driving the wafer stage to rotate along an axis; An angle measuring mechanism is connected to the wafer stage and can be linked with the wafer stage. When the wafer stage rotates, it is used to measure the rotation angle of the wafer stage to generate angle information. A sensor, mounted on a wafer stage, is used to acquire the position of the wafer stage before and after rotation to generate position information; The controller controls the turntable driver to adjust the position of the wafer stage based on the angle and position information.

2. The wafer attitude adjustment rotary table according to claim 1, characterized in that, The wafer stage and the turntable driver are respectively provided with central holes along the rotation axis, and the wafer stage and the angle measuring mechanism are respectively located on opposite sides of the turntable driver.

3. The wafer attitude adjustment rotary table according to claim 2, characterized in that, The turntable driver includes a coreless direct-drive motor, and the wafer stage is connected to the inner rotating ring of the turntable driver.

4. The wafer attitude adjustment rotary table according to claim 3, characterized in that, The wafer stage includes a mounting plate and a drive feedback adapter, and the mounting plate is connected to the turntable driver through the drive feedback adapter.

5. The wafer attitude adjustment rotary table according to claim 4, characterized in that, The turntable driver is provided with an adapter ring, which is connected to the drive feedback adapter and can be linked with the drive feedback adapter. The angle measuring mechanism is installed on the adapter ring.

6. The wafer attitude adjustment rotary table according to claim 1, characterized in that, The angle measuring mechanism includes a circular grating and a reading head. The circular grating is connected to the wafer stage and can rotate with the wafer stage. The reading head is located outside the turntable driver and is fixed relative to the turntable driver position, and is used to read the rotation angle of the circular grating.

7. The wafer attitude adjustment rotary table according to any one of claims 1-6, characterized in that, The wafer stage, turntable driver, angle measuring mechanism, and sensor are encapsulated within the turntable base.

8. The wafer attitude adjustment rotary table according to claim 7, characterized in that, The turntable base is provided with an installation chamber, the turntable driver is embedded in the installation chamber, and the reading head of the angle measuring mechanism is located on the side wall of the installation chamber; the outer periphery of the wafer stage is provided with a rotating collar, the rotating collar is fixed in the installation chamber by a guide rail fixing ring, and the guide rail fixing ring is connected to the turntable base.

9. The wafer attitude adjustment rotary table according to claim 7, characterized in that, The turntable base is provided with an adjustment mechanism on the outside to position the wafer stage, and the wafer stage is provided with a mounting groove on its outer periphery that engages with the adjustment mechanism.

10. The wafer attitude adjustment rotary table according to claim 9, characterized in that, The adjustment mechanism includes a fixing part on the turntable base. The fixing part has an oblong hole with its long axis arranged in the horizontal direction. The fixing part is connected to the turntable base by fastening screws. The fixing part can be adjusted in position along the long axis of the oblong hole. The fixing part has a locking protrusion that cooperates with the mounting groove.

11. A nanoimprinting device, characterized in that, Includes the wafer attitude adjustment rotary table as described in claim 1.

Citation Information

Patent Citations

  • Angle adjusting device and wafer carrying table

    CN116313976A

  • Wafer positioning device and nanoimprint device

    CN216084826U