A dual laser head perforating device and method

Abstract

The application provides a double laser head punching device, which comprises a rotating table assembly, a ball screw table transmission mechanism, a control system and a laser head device; the rotating table assembly comprises a support frame, a first rotating table support and a first rotating table; one end of the support frame is installed on a device base, and the other end of the support frame is connected with the first rotating table support; the first rotating table is installed below the first rotating table support; the ball screw table transmission mechanism is installed below the first rotating table; two laser head devices capable of moving towards each other are installed on the ball screw table transmission mechanism, and are used for punching workpieces on the device base; the control system is used for controlling the work of the laser head device, the rotating table assembly and the ball screw table transmission mechanism; through the arrangement of the two laser head devices capable of moving towards each other, the processing position and the processing angle of the laser head can be adjusted correspondingly, and various special-shaped holes meeting the requirements can be punched as much as possible.

Description

Technical Field

[0001] This invention relates to the field of laser drilling technology, specifically to a dual-laser-head drilling device and method. Background Technology

[0002] Laser drilling is one of the applications of laser processing. A high-energy laser beam passes through a controlled optical path to burn the surface of a workpiece, causing the material to vaporize and form a hole. It has a very wide range of applications in industrial production. Lasers can perform drilling and cutting operations on textiles, leather products, paper products, metal products, and plastic products. With the increasing application of laser drilling in aerospace, weaponry, and electronics industries, the requirements for laser drilling quality are also becoming increasingly stringent.

[0003] The laser beam is highly concentrated in space and time. By using a lens to focus it, the spot diameter can be reduced to the micrometer level, thus achieving 10 5 -10 15 W / cm 2 Laser power density. Laser drilling is fast, efficient, and economical. Because laser drilling utilizes a laser power density of l0... 7 -10 9 W / cm 2 A high-energy laser beam instantaneously acts on the material, with an interaction time of only 10 seconds. -5 -10 -3 Laser drilling is extremely fast, with a speed of only seconds per second. By combining a high-efficiency laser with a high-precision machine tool and control system, and using a microprocessor for program control, high-efficiency drilling can be achieved. Compared with electrical discharge machining (EDM) and mechanical drilling, laser drilling is 10-1000 times more efficient on different workpieces.

[0004] In actual laser micro-drilling processes, uncertainties in material properties and process parameters can affect production stability, leading to quality problems such as inconsistent hole shapes, hole diameters, and uneven surface protrusions.

[0005] For holes with very small diameters (e.g., within 0.5mm), the precision requirements of the motion mechanism are extremely high, resulting in high costs for laser drilling mechanisms, and the roundness of the holes is often still not ideal. For materials with anisotropic thermal conductivity, the focal spot of both pulsed single-point drilling and hole cutting has a Gaussian energy distribution, causing the heat-affected zone to be inconsistent in size in different directions, directly affecting the roundness and edge quality of the hole, and easily causing thermal stress deformation. The high pulse energy of pulsed single-point drilling and hole cutting all act simultaneously in the same direction with inconsistent magnitudes, directly affecting the roundness and edge quality of the hole, and easily causing thermal stress deformation. The high pulse energy of pulsed single-point drilling and hole cutting all act simultaneously at the same location, causing violent melting, vaporization, and plasma phenomena. A large amount of laser energy is wasted in excessive melting, vaporization, and plasma absorption, increasing the heat-affected zone and making it difficult to improve the drilling quality. Summary of the Invention

[0006] To address the shortcomings of existing technologies, this invention provides a dual-laser-head drilling device and method. Two laser heads are simultaneously applied to the workpiece to create the approximate shape of the desired hole. The power of the dual laser heads is adjusted, and the ranging laser head accurately locates the inner wall of the hole and areas with unacceptable taper. The position angle of the dual laser heads is changed to apply a second laser treatment to the hole. Simultaneously, a variable magnetic field is used to constrain the movement of abrasive particles, polishing and deburring the inner wall to improve its quality and remove excess material to improve the hole's taper.

[0007] The present invention achieves the above-mentioned technical objectives through the following technical means.

[0008] A dual-laser-head drilling device includes a rotary table assembly, a ball screw transmission mechanism, a control system, and a laser head device;

[0009] The rotary table assembly includes a support frame, a first rotary table bracket, and a first rotary table; one end of the support frame is mounted on the device base, and the other end of the support frame is connected to the first rotary table bracket; the first rotary table is mounted below the first rotary table bracket; the ball screw drive mechanism is mounted below the first rotary table; two laser head devices that can move in opposite directions are mounted on the ball screw drive mechanism for drilling holes in the workpiece on the device base;

[0010] The control system is used to control the operation of the laser head device, the rotary table assembly, and the ball screw drive mechanism.

[0011] Furthermore, the ball screw stage transmission mechanism includes a guide rail platform, a support end, a rotating platform, a lead screw, and a guide rail slider; the guide rail platform is mounted on the base of the ball screw stage transmission mechanism; the lead screw has support ends at both ends; a laser head device is mounted on the rotating platform; both ends of the lead screw are threadedly connected to a connecting platform; the guide rail slider is slidably connected to the guide rail platform, and the connecting platform is installed between the rotating platform and the guide rail slider; two laser head devices are respectively mounted on the rotating platforms on both sides of the lead screw, and the rotating platforms are provided with rotating devices for driving the laser head devices to rotate; one end of the lead screw is connected to a transmission mechanism for driving the two laser head devices to move towards each other.

[0012] Furthermore, the screw has a midpoint as the dividing point, and the threads on both sides of the midpoint are positive and negative threads.

[0013] Furthermore, the laser head device includes a laser head rotating disk, a laser head rotating shaft, and a third motor. The laser head rotating disk is mounted on the rotating platform, the laser head rotating shaft connects the laser head to the laser head support, and the third motor is mounted on one side of the laser head support. The third motor drives the laser head rotating shaft to rotate, thereby adjusting the rotation angle of the laser head.

[0014] Furthermore, a lifting platform is provided below the first rotating platform, and an abrasive flow device is provided on the lifting platform. The lifting platform is driven by a lifting motor to move the abrasive flow device up and down.

[0015] Furthermore, the abrasive flow device includes a telescopic pipe, a nozzle rotary disk, a first motor, and a nozzle rotating shaft. The telescopic pipe is used to connect the nozzle and the fluid channel. The nozzle rotary disk and the nozzle rotating shaft adjust the working position of the nozzle under the drive of the first motor. The nozzle sprays the abrasive flow into the hole. The abrasive flow is deflected under the action of the magnetic force generated by the magnetic field generator and moves in a circular motion along the inner wall of the hole to process the inner wall surface of the hole.

[0016] Furthermore, a moving guide rail parallel to the ball screw transmission mechanism is provided below the first rotary table. A ranging laser head device is installed on the moving guide rail to detect the taper of the hole shape in the initial state. The ranging laser head device can move left and right along the moving guide rail under the drive of the guide rail motor.

[0017] Furthermore, the ranging laser head device includes a ranging head rotating disk, a second motor, and a ranging laser head rotating shaft. The ranging head rotating disk is connected to a moving guide rail, and the ranging laser head rotating shaft connects the ranging laser head to the ranging laser head bracket. The second motor is installed on one side of the ranging laser head bracket and drives the ranging laser head rotating shaft to rotate, thereby adjusting the rotation angle of the ranging laser head.

[0018] Furthermore, the abrasive flow device also includes a pressure shroud and a recovery pipe; the two ends of the recovery pipe are respectively connected to the pressure shroud and the fluid channel, and the fluid channel, pressure shroud and recovery pipe form a closed loop for the recovery and transport of abrasive flow.

[0019] A processing method for a dual-laser-head drilling device includes the following steps:

[0020] The two laser head devices are controlled to process the initial hole shape on the surface of the workpiece at a first power.

[0021] The taper of the initial aperture shape is detected using a ranging laser head device. The control system compares the detected taper of the initial aperture shape with a set value to determine the cone angle of the cone surface that exceeds the set value and the starting position of the cone surface that exceeds the set value.

[0022] Adjust the deflection angle of any laser head device so that the laser head device is aligned with a conical surface that exceeds the set value; use a lower power than the first power to process the conical surface that exceeds the set value according to the starting position of the conical surface until its taper is less than the set value;

[0023] The visual sensor identifies the hole wall surface of the workpiece. When burrs or uneven surfaces are detected, the workpiece is moved below the abrasive flow nozzle, and a pressure cover is placed over the workpiece. The abrasive flow nozzle sprays abrasive flow into the hole wall. The magnetic field generated by the magnetic field generator causes the abrasive flow to deflect under the magnetic force, making the abrasive flow move in a circle along the inner wall of the hole, thus processing the inner wall surface of the hole.

[0024] The beneficial effects of this invention are as follows:

[0025] 1. The dual-laser-head drilling device and method of the present invention, by installing laser heads on both sides of the drilling device and connecting them with guide rails, allows the laser heads to move left and right along the direction of the guide rails. The dual laser heads can use two laser beams to drill holes simultaneously. Compared with a single laser head, more drilling tasks can be completed in the same time, thus improving production efficiency.

[0026] 2. The dual-laser-head drilling device and method of the present invention can better control and position the drilling position by rotating the laser head at a certain angle so that the laser hits different positions on the inner wall of the hole, providing more accurate hole size and shape, and producing holes with higher inner wall quality.

[0027] 3. The dual-laser-head drilling device and method of the present invention, by setting an abrasive flow device, polishes and deburrs the inner wall of the hole, so that the processed hole has a high surface finish and processing accuracy.

[0028] 4. The dual-laser-head drilling device and method of the present invention can effectively control the flow direction and speed of the fluid by using a magnetic field to confine the abrasive flow, and accurately act on the inner wall of the hole. The magnetic field can change its size and direction according to the shape of the hole being drilled, and is suitable for holes of various shapes. Attached Figure Description

[0029] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. The drawings described below are some embodiments of the present invention. For those skilled in the art, it is obvious that other drawings can be obtained from these drawings without creative effort.

[0030] Figure 1 This is a schematic diagram of the dual-laser-head drilling device of the present invention;

[0031] Figure 2 This is a schematic diagram of the structure of the ball screw stage transmission mechanism described in this invention;

[0032] Figure 3 This is a schematic diagram of the laser head device described in this invention;

[0033] Figure 4 This is a schematic diagram of the abrasive flow device described in this invention;

[0034] Figure 5 This is a schematic diagram of the ranging laser head device described in this invention;

[0035] Figure 6 This is a partial enlarged view of the dual-laser-head drilling device of the present invention drilling a round hole;

[0036] Figure 7 This is a cross-sectional view of the laser head described in this invention acting on an area with unacceptable hole taper;

[0037] Figure 8 This is a cross-sectional view of the laser head device position during the taper elimination process described in this invention;

[0038] Figure 9 This is a schematic diagram of the laser head position after eliminating the hole taper as described in this invention;

[0039] Figure 10 This is a schematic diagram of the process of drilling a regular hexagonal hole according to the present invention, wherein... Figure 10-1 This is the front view of a regular hexagonal hole. Figure 10-2 This is a cross-sectional view of a regular hexagonal hole;

[0040] Figure 11 This is a schematic diagram of the countersinking process described in this invention;

[0041] Figure 12This is a schematic diagram of the square hole punching method described in this invention, wherein... Figure 12-1 This is the front view of a square hole. Figure 12-2 This is a cross-sectional view of a square hole;

[0042] Figure 13 This is a partial schematic diagram of the device for applying abrasive flow to a hole according to the present invention;

[0043] Figure 14 This is a schematic diagram of the force on the abrasive grains under the action of a magnetic field when drilling a round hole, as described in this invention.

[0044] Figure 15 This is a schematic diagram of the force on the abrasive grains under the action of a magnetic field during the drilling of square holes as described in this invention;

[0045] Figure 16 This is a schematic diagram illustrating the working principle of the ranging laser head described in this invention.

[0046] Figure 17 This is a flowchart of the drilling method described in this invention.

[0047] In the picture:

[0048] 1-Device base; 2-Vision sensor; 3-Support frame; 4-First rotary table bracket; 5-First rotary table; 6-Ball screw transmission mechanism; 7-Motor device; 8-Coupling device; 9-Control computer; 10-Laser head device; 11-Workpiece to be processed; 12-Lifting platform; 13-Abrasive flow device; 14-Range measuring laser head device; 15-Moving guide rail; 16-Pressure cover; 17-Sealing ring; 18-Recovery pipe; 1-1-Magnetic field generator; 1-2-Adjustable AC power supply; 1-3-Wire; 6-1-Guide rail platform; 6-2-Support end; 6-3-Rotating platform; 6-4-Screw; 6-5-Connecting platform; 6-6-Guide rail slide Block; 10-1-Laser head; 10-2-Laser head bracket; 10-3-Laser head rotating shaft; 10-4-6 mm connecting screw; 10-5-Laser head rotating disk; 10-6-Third motor; 12-1-Lifting motor; 13-1-Nozzle; 13-2-Nozzle bracket; 13-3-Telescopic pipe; 13-4-Nozzle rotating disk; 13-5-Fluid channel; 13-6-First motor; 13-7-Nozzle rotating shaft; 14-1-Range measuring laser head; 14-2-Range measuring laser head bracket; 14-3-Range measuring laser head rotating disk; 14-4-Second motor; 14-5-Range measuring laser head rotating shaft; 15-1-Guide rail motor. Detailed Implementation

[0049] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0050] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "axial," "radial," "vertical," "horizontal," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0051] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0052] like Figure 1 As shown, the dual-laser-head drilling device of the present invention includes a rotary table assembly, a ball screw transmission mechanism 6, a control computer 9, a laser head device 10, an abrasive flow device 13, and a ranging laser head device 14.

[0053] The rotary table assembly includes a support frame 3, a first rotary table bracket 4, and a first rotary table 5. Several support frames 3 are provided, with one end mounted on the device base 1. In this device, the other end of each support frame is fixedly connected to the first rotary table bracket 4 with screws. The first rotary table bracket 4 is installed parallel to the device base 1. The first rotary table 5 is installed below the first rotary table bracket 4, and a rotating device is provided between the first rotary table 5 and the first rotary table bracket 4, allowing the first rotary table 5 to rotate 360°. A ball screw drive mechanism 6 is installed below the first rotary table 5, and two laser head devices 10 that can move in opposite directions are mounted on the ball screw drive mechanism. One end of the ball screw drive mechanism 6 is connected to a coupling 8. A control computer 9 is provided at one end of the device base 1, and the control computer 9 controls the operation of the laser head devices 10, the rotary table assembly, and the ball screw drive mechanism 6 by changing different parameters.

[0054] like Figure 2 As shown, the ball screw transmission mechanism 6 includes a guide platform 6-1, a support end 6-2, a rotating platform 6-3, a lead screw 6-4, a connecting platform 6-5, and a guide slider 6-6. The lead screw 6-4 has support ends 6-2 at both ends. The guide platform 6-1 is mounted on the base of the ball screw transmission mechanism 6. The guide slider 6-6 is slidably connected to the guide platform 6-1, and the guide platform 6-1 is parallel to the lead screw 6-4. The guide slider 6-6 can move left and right on the guide platform 6-1. The connecting platform 6-5... -5 is fixedly installed between the guide rail slider 6-6 and the rotating platform 6-3. The connecting platform 6-5, the guide rail slider 6-6, and the rotating platform 6-3 form an integral structure, which cannot achieve relative movement, but can only move linearly along the guide rail platform 6-1 as a whole; the laser head device 10 is installed on the rotating platform 6-3; the rotating platform 6-3 is provided with a rotating shaft, which rotates under the drive of a motor, driving the laser head rotating disk 10-5 in contact with the rotating platform 6-3 to rotate; the connecting platform 6-5 is threadedly connected to the lead screw 6-4, such as... Figure 6 As shown, the screw 6-4 is divided at its midpoint, with the threads on both sides of the midpoint being opposite threads. That is, the screw 6-4 has both forward and reverse threads. When the motor device 7 is started, it will drive the coupling device 8 to rotate. The coupling device 8 drives the screw 6-4 to rotate. At the same time as the screw 6-4 rotates, the connecting platforms 6-5 on both sides will move together with the guide rail slider 6-6 and the laser head device 10 mounted on the rotating platform 6-3 towards the middle of the screw 6-4. Through the cooperation between the guide rail slider 6-6 and the guide rail platform 6-1, the movement of the entire device will be smoother and more stable.

[0055] The laser head device 10 is mounted on the rotating platform 6-3 of the ball screw transmission mechanism 6, such as... Figure 3 As shown, the laser head 10-1 of the laser head device 10 is conical. The laser head 10-1 is connected to the laser head support 10-2 via a laser head rotation shaft 10-3. A third motor 10-6 is provided at one end of the laser head support 10-2 to drive the laser head rotation shaft 10-3 to rotate, thereby causing the laser head 10-1 to rotate at a certain angle. The laser head support 10-2 is fixed to one end of the laser head rotating disk 10-5 by several 6mm connecting screws 10-4. The laser head rotates... The other end of the disk 10-5 contacts the rotating platform 6-3. A rotating shaft is provided between the laser head rotating disk 10-5 and the rotating platform 6-3. The rotating device is used to drive the laser head rotating disk 10-5 to rotate 360° close to the surface of the rotating platform 6-3 under the drive of the motor. Under the combined action of the first rotating table 5, the laser head rotating disk 10-5, the laser head rotating shaft 10-3 and the motor, the laser head 10-1 can perform drilling work on the workpiece from as many directions as possible.

[0056] The abrasive flow device 13 is installed on the lifting platform 12 below the first rotating platform 5. The lifting platform 12 does not contact the ball screw transmission mechanism 6. A lifting motor 12-1 is provided on the lifting platform 12. The lifting motor 12-1 is used to drive the lifting platform 12 to drive the abrasive flow device 13 to move up and down in a straight line, so that the abrasive flow device 13 releases abrasive flow into the hole at a suitable height.

[0057] like Figure 4As shown, the abrasive flow device 13 includes a nozzle 13-1, a nozzle support 13-2, a telescopic pipe 13-3, a nozzle rotating disk 13-4, a fluid channel 13-5, a first motor 13-6, and a nozzle rotating shaft 13-7. The nozzle 13-1 is connected to the nozzle support 13-2 via the nozzle rotating shaft 13-7. The first motor 13-6 is located on one side of the nozzle support 13-2 to drive the nozzle rotating shaft 13-7 to rotate, thus rotating the nozzle 13-1 by a certain angle. The nozzle support 13-2 is fixedly connected to the nozzle rotating disk 13-4, which can rotate 360°. Under the combined action of the lifting platform 12, the nozzle rotating disk 13-4, and the nozzle rotating shaft 13-7, the abrasive flow device can... This allows the nozzle 13-1 to release the abrasive flow into the hole at the most suitable height and angle. The telescopic pipe 13-3 is connected to the nozzle 13-1 and the fluid channel 13-5 at both ends, respectively. The telescopic pipe 13-3 is used to transport the abrasive flow stored in the fluid channel 13-5 to the nozzle 13-1, which then sprays the abrasive flow into the hole to be polished. A magnetic field generator 1-1 is provided below the worktable. The magnetic field generator 1-1 is connected to the variable AC power supply 1-2 through the wire 1-3. The magnitude of the magnetic field can be controlled by changing the magnitude and direction of the current and the number of turns of the energized coil. The abrasive flow in the hole will be affected by the magnetic field force, deflected in the hole, and make a circular motion along the inner wall of the hole. During the motion, the inner wall of the hole is polished and deburred for precision processing.

[0058] like Figure 13 As shown, when the abrasive flow device 13 is performing precision machining on the hole, the workpiece 11 is completely covered by the pressure cover 16. A sealing ring 17 is provided at the contact position between the pressure cover 16 and the abrasive flow device 13 to ensure that the pressure cover 16 is completely sealed. The two ends of the recovery pipe 18 are connected to the pressure cover 16 and the fluid channel 15 respectively. The fluid channel 15, the pressure cover 16, and the recovery pipe 18 form a closed loop. The recovery pipe 18 is used to recover the abrasive flow in the pressure cover 16 and transport it to the fluid channel 15.

[0059] Below the first rotary table 5, there is a movable guide rail 15 parallel to the ball screw transmission mechanism 6. The ranging laser head device 14 is mounted on the movable guide rail 15. Driven by the guide rail motor 15-1, the ranging laser head device 14 can move left and right along the movable guide rail 15.

[0060] like Figure 5As shown, the ranging laser head device 14 includes a ranging laser head 14-1, a ranging laser head support 14-2, a ranging laser head rotating disk 14-3, a second motor 14-4, and a ranging laser head rotating shaft 14-5. The ranging laser head 14-1 is cylindrical in shape and is connected to the ranging laser head support 14-2 via the ranging laser head rotating shaft 14-5. A second motor 14-4 is provided on one side of the ranging laser head support 14-2 to drive the ranging laser head rotating shaft 14-5 to rotate. A rotating mechanism is provided between the ranging laser head rotating disk 14-3 and the moving guide rail 15. The ranging laser head rotating disk 14-3 can move linearly along the moving guide rail 15 or rotate 360° via the rotating mechanism.

[0061] Work process:

[0062] like Figure 17 As shown, the specific working method of the dual-laser head drilling device of the present invention is as follows:

[0063] The laser head device 10 is moved to its initial position, which is located on both sides of the ball screw transmission mechanism 6, with the laser head devices 10 on both sides pointing vertically downwards. The workpiece 11 is fixed on the worktable. Here, the workpiece can be fixed by using a fixture, clamping device, or vacuum chuck. According to the required drilling diameter, depth, taper, and other parameters such as the power and rotation speed of the laser head device 10 are input into the control computer 9. According to the signal instructions issued by the control computer 9, the laser head 10 scans the surface of the workpiece 11 to confirm the drilling coordinate point. Driven by the motor device 7, the laser... The laser head assembly 10 moves to the corresponding position on the lead screw 6-4. Under the combined action of the laser head rotary disk 10-5 and the laser head rotating shaft 10-3, the angle of the laser head 10-1 is adjusted. The two laser heads 10-1 emit high-energy laser beams towards the workpiece 11. During the drilling process, in order to meet the required drilling shape, the first rotary table 5, the laser head rotating shaft 10-3, and the laser head rotary disk 10-5 also rotate continuously, constantly changing the position of the laser head 10-1. By setting different parameter values ​​and changing the position of the laser head 10-1, various irregular holes can be drilled, such as... Figure 10-1 and Figure 10-2 As shown, a regular hexagonal hole can be punched; as Figure 11 As shown, a countersunk hole can be drilled; and so on. Figure 12-1 and Figure 12-2 As shown, square holes can also be made.

[0064] After the laser head 10-1 completes the basic shape of the required hole, the ranging laser head device 14 detects the taper of the hole. The working principle of the ranging laser head device 14 is as follows: Figure 16As shown, the ranging laser head 14-1 emits a laser beam that illuminates the surface of the drilled hole. A portion of the laser beam is reflected back from the hole surface. When the receiver receives the reflected laser beam, it records the time of receipt and calculates the distance between the ranging laser head 14-1 and the hole surface based on the time. If different distances are measured for the same surface of the same hole, it indicates a taper deviation in the drilled hole. Figure 7 As shown, the diameter of the upper cross-section of the drilled hole is much larger than the diameter of the lower cross-section, and the hole wall slopes from the periphery to the center. At this time, the ranging laser head device 14 records the conical surface with a taper exceeding the set value and the starting position of the conical surface and sends a correction signal. Based on the sent correction signal, the control computer 9 inputs a correction command, appropriately increases the distance between the two laser heads 10-1 and adjusts the angle of the laser heads 10-1, so that the laser heads 10-1 act on the conical surface with a taper exceeding the set value to eliminate the taper and cut off the protruding part; as Figure 8 As shown, although the taper of the hole is greatly improved after the taper elimination treatment, a taper still exists, so further elimination is needed. The laser head 10-1 is moved upwards to the starting point of the taper surface, and the angle and power of the laser head 10-1 are adjusted to cut the protruding part of the hole wall from top to bottom. This process is repeated several times until the taper of the hole wall is completely eliminated. Figure 9 As shown, the cross-section of the hole wall, which eliminates the taper, is rectangular, with the hole wall pointing vertically downwards.

[0065] Once the taper issue is resolved, and the diameter, depth, and taper of the circular hole all meet the requirements, the vision sensor 2 is activated for detailed observation of the hole. If burrs or surface unevenness are detected, the workpiece 11 is moved below the abrasive flow device 13, and the hole is completely covered by the pressure shield 16. A sealing ring 17 is provided at the contact point between the abrasive flow device 13 and the pressure shield 16 to ensure a complete seal within the pressure shield 16. The nozzle height is adjusted via the telescopic pipe 13-3, and the nozzle angle 13-1 is adjusted via the nozzle rotation shaft 13-7 to release a certain amount of abrasive flow into the hole at a 15° angle to the vertical. Simultaneously, the magnetic field generator 1-1 begins operation, adjusting the current to generate a suitable magnetic field. Figure 14 As shown, in a magnetic field with magnetic induction intensity B, the abrasive flow is subjected to a deflection force of magnitude F and moves in a circular motion along the inner wall of a circular hole at a velocity V, performing precision machining such as polishing and deburring on the inner surface of the hole; for example... Figure 15 As shown, when the hole is square, the abrasive flow moves along the perimeter of the square hole under the influence of the magnetic field, performing precision machining on the inner surface of the square hole.

[0066] Turn off the adjustable AC power supply 1-2, the magnetic field generator 1-1 stops working, and the abrasive flow no longer moves in a circle along the hole wall. The quality of the inner wall of the hole is detected by the vision sensor 2. If it is confirmed that the quality of the hole meets the requirements in all aspects, the abrasive flow in the pressure shroud 16 is completely recovered into the fluid channel 13-5 through the recovery pipe 18. The pressure shroud 16 and the recovery pipe 18 are removed, the abrasive flow device 13 is moved to the initial position, the vision sensor is turned off, and the drilling is completed. If there is still a deviation, precision machining needs to be continued until the drilled hole meets the accuracy requirements. If the deviation is too large, the workpiece is replaced and the machining is restarted.

[0067] Example 1:

[0068] The most common application of circular holes in aero-engines is the machining of cooling film holes for hot-end components, such as the film cooling holes (including blade body, cover plate, and coolant duct) of high-pressure turbine guide vanes, the head rotor stage, and the cooling holes of the flame tube. As the cooling efficiency of cooling holes improves, the precision requirements for drilling and the quality requirements for the inner wall are also constantly increasing. To better illustrate the method of the dual-laser-head drilling device described in this invention, taking the drilling of a 1mm diameter circular hole as an example, the steps are as follows:

[0069] S01: Before the drilling process, such as Figure 1 As shown, the workpiece 11 is placed on the base below and fixed with a fixture, clamping device or vacuum suction cup; the two laser heads 10-1 use a 300W laser beam to preheat the workpiece, remove impurities from the surface of the workpiece 11 and optimize the drilling environment.

[0070] S02: Input the parameters such as laser head power of 1000W, laser head rotary disk speed of 100RPM, and the required drilling diameter of 1mm and depth of 2mm into the control computer 9. The control computer 9 issues a command to drive the laser head device 10 to move left and right through the guide rail slider 6-6 and lead screw 6-4. The laser head 10-1 is moved to the designated position by the motor driving the guide rail slider 6-6 and lead screw 6-4. The laser head rotary disk 10-5 and the laser head rotating shaft 10-3 are rotated by the third motor 10-6. The deflection angle of the laser head 10-1 is adjusted.

[0071] S03: The laser head 10-1 processes the initial hole shape on the surface of the workpiece 11 with a power of 1000W. During the drilling process, according to the signal command issued by the control computer 9, the processing position of the laser head 10-1 is changed by controlling the rotation angle of the laser head rotating disk 10-5, the first rotating stage 5 and the laser head rotating shaft 10-3, so as to drill the basic shape of the required round hole.

[0072] S04: After punching out the basic shape of the required hole, move the ranging laser head device 14 along the moving guide rail 15 to the corresponding position, adjust the deflection angle of the ranging laser head 14-1, and use the ranging laser head device 14 to detect the taper of the hole shape in the initial state. The control system compares the detected taper of the hole shape in the initial state with the set value to determine the cone angle of the cone surface that exceeds the set value and the starting position of the cone surface that exceeds the set value.

[0073] S05: If a conical surface exceeding the set value is detected, adjust the deflection angle of either laser head 10-1, appropriately increase the distance between the two laser heads 10-1, so that the laser head 10-1 is aligned with the conical surface exceeding the set value, adjust the operating parameters of the laser head device 10, reduce the power of the laser head device 10 to 600W, and process the conical surface exceeding the set value according to the starting position of the conical surface; if two conical surfaces exceeding the set value are detected, simultaneously adjust the positions of the two laser head devices 10, so that the two laser head devices 10 are respectively aligned with a conical surface exceeding the set value, adjust the operating parameters of the laser head device 10, so that the laser head device 10 processes the conical surface exceeding the set value from top to bottom according to the starting position of the conical surface with a 600W laser beam;

[0074] S06: Use the ranging laser head device 14 to detect the hole after the second laser to detect whether there are still conical surfaces exceeding the set value. If there are still conical surfaces exceeding the set value, record the cone angle and the starting position of the conical surfaces exceeding the set value. Adjust the angle and working parameters of the laser head device 10, reduce the power of the laser head device 10 to 400W, and process the conical surfaces exceeding the set value according to the starting position of the conical surfaces.

[0075] S07: Repeat steps S04 to S06 several times until the hole taper is less than the set value. Turn on the vision sensor 2 to observe the inner wall of the hole and check for burrs and uneven surfaces.

[0076] S08: When a quality defect is detected in the inner wall of the hole, the workpiece 11 is moved to the bottom of the abrasive flow device 13. The lifting platform motor 12-1 is started to move the nozzle 13-1 of the abrasive flow device 13 installed on the lifting platform 12 to a suitable position above the hole. The deflection angle of the abrasive flow device 13 is adjusted, and the abrasive flow is released into the hole from the nozzle 13-1. The hole is completely covered by the pressure cover 16. A sealing ring 17 is set at the contact position between the pressure cover 16 and the abrasive flow device 13 to ensure the sealing effect inside the pressure cover 16. The pressure cover 16 is connected to the fluid channel 13-5 of the abrasive flow device 13 by the recovery pipe 18.

[0077] S09: Connect magnetic field generator 1-1 and adjustable AC motor 1-2, adjust the effective voltage to 20V, generate a magnetic field of magnitude 0.5T, the abrasive flow is deflected by a deflection force of magnitude F in the secondary field and moves in a circle along the hole wall, and the abrasive flow performs precision processing such as polishing and deburring on the inner surface of the hole through friction.

[0078] S10: Turn on vision sensor 2 to inspect the quality of the precision-processed hole. If it meets the requirements, the drilling is complete. If there is still a small deviation, repeat steps S04 to S06 several times until the hole quality meets the requirements. If the deviation is too large, replace the workpiece and repeat steps S01 to S09 several times until a hole that meets the requirements is machined.

[0079] It should be understood that although this specification is described according to various embodiments, not every embodiment contains only one independent technical solution. This way of describing the specification is only for clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

[0080] The detailed descriptions listed above are merely specific illustrations of feasible embodiments of the present invention and are not intended to limit the scope of protection of the present invention. All equivalent embodiments or modifications made without departing from the spirit of the present invention should be included within the scope of protection of the present invention.

Claims

1. A dual-laser-head drilling device, characterized in that, It includes a rotary table assembly, a ball screw drive mechanism (6), a control system, and a laser head device (10). The rotary table assembly includes a support frame (3), a first rotary table bracket (4), and a first rotary table (5); one end of the support frame (3) is mounted on the device base (1), and the other end of the support frame (3) is connected to the first rotary table bracket (4); the first rotary table (5) is mounted below the first rotary table bracket (4); the ball screw stage transmission mechanism (6) is mounted below the first rotary table (5); two laser head devices (10) that can move in opposite directions are mounted on the ball screw stage transmission mechanism (6) for drilling holes in the workpiece on the device base (1); a lifting platform (12) is provided below the first rotary table (5), and an abrasive flow device (13) is provided on the lifting platform (12). The lifting platform (12) drives the abrasive flow device (13) to move up and down through the action of the lifting motor (12-1); The abrasive flow device (13) includes a telescopic pipe (13-3), a nozzle rotary disk (13-4), a first motor (13-6), a nozzle rotating shaft (13-7), a pressure shroud (16), and a recovery pipe (18). The telescopic pipe (13-3) connects the nozzle (13-1) and the fluid channel (13-5). The nozzle rotary disk (13-4) and the nozzle rotating shaft (13-7) adjust the working position of the nozzle (13-1) under the drive of the first motor (13-6). The nozzle (13-1) delivers abrasive particles... The abrasive flow is injected into the hole, and the abrasive flow is deflected under the magnetic force generated by the magnetic field generator (1-1), and moves in a circle along the inner wall of the hole to process the inner wall surface of the hole; the two ends of the recovery pipe (18) are respectively connected to the pressure shroud (16) and the fluid channel (13-5), and the fluid channel (13-5), the pressure shroud (16) and the recovery pipe (18) form a closed loop for the recovery and transportation of the abrasive flow; the control system is used to control the operation of the laser head device (10), the rotary table assembly and the ball screw table transmission mechanism (6).

2. The dual-laser-head drilling device according to claim 1, characterized in that, The ball screw stage transmission mechanism (6) includes a guide rail platform (6-1), a support end (6-2), a rotating platform (6-3), a lead screw (6-4), and a guide rail slider (6-6). The guide rail platform (6-1) is mounted on the base of the ball screw stage transmission mechanism (6). The lead screw (6-4) has support ends (6-2) at both ends. A laser head device (10) is mounted on the rotating platform (6-3). The two ends of the lead screw (6-4) are threadedly connected to the connecting platform (6-5). Block (6-6) is slidably connected to the guide rail platform (6-1), and the connecting platform (6-5) is installed between the rotating platform (6-3) and the guide rail slider (6-6); the two laser head devices (10) are respectively installed on the rotating platform (6-3) on both sides of the lead screw (6-4), and the rotating platform (6-3) is provided with a rotating device for driving the laser head device (10) to rotate; one end of the lead screw (6-4) is connected to the transmission mechanism for driving the two laser head devices (10) to move towards each other.

3. The dual-laser-head drilling device according to claim 2, characterized in that, The screw (6-4) is divided at the midpoint, and the threads on both sides of the midpoint are opposite to each other.

4. The dual-laser-head drilling device according to claim 2, characterized in that, The laser head device (10) includes a laser head rotating disk (10-5), a laser head rotating shaft (10-3), and a third motor (10-6). The laser head rotating disk (10-5) is mounted on the rotating platform (6-3). The laser head rotating shaft (10-3) connects the laser head (10-1) to the laser head bracket (10-2). The third motor (10-6) is mounted on one side of the laser head bracket (10-2). The third motor (10-6) drives the laser head rotating shaft (10-3) to rotate, thereby adjusting the rotation angle of the laser head (10-1).

5. The dual-laser-head drilling device according to claim 1, characterized in that, Below the first rotary table (5), there is a moving guide rail (15) parallel to the ball screw transmission mechanism (6). A ranging laser head device (14) is installed on the moving guide rail (15) to detect the taper of the hole shape in the initial state. The ranging laser head device (14) can move left and right along the moving guide rail (15) under the drive of the guide rail motor (15-1).

6. The dual-laser-head drilling device according to claim 5, characterized in that, The ranging laser head device (14) includes a ranging head rotating disk (14-3), a second motor (14-4), and a ranging laser head rotating shaft (14-5). The ranging head rotating disk (14-3) is connected to the moving guide rail (15). The ranging laser head rotating shaft (14-5) connects the ranging laser head (14-1) to the ranging laser head bracket (14-2). The second motor (14-4) is installed on one side of the ranging laser head bracket (14-2). The second motor (14-4) drives the ranging laser head rotating shaft (14-5) to rotate, which is used to adjust the rotation angle of the ranging laser head (14-1).

7. A processing method for the dual-laser-head drilling device according to any one of claims 1-6, characterized in that, Includes the following steps: Control the two laser head devices (10) to process the initial state hole shape on the surface of the workpiece (11) at the first power; The taper of the hole shape in the initial state is detected by the ranging laser head device (14). The control system compares the detected taper of the hole shape in the initial state with the set value to determine the cone angle of the cone surface that exceeds the set value and the starting position of the cone surface that exceeds the set value. Adjust the deflection angle of any one of the laser head devices (10) so that the laser head device (10) is aligned with the conical surface that exceeds the set value; the laser head device (10) uses a power lower than the first power to process the conical surface that exceeds the set value according to the starting position of the conical surface until its taper is less than the set value. The visual sensor (2) identifies the hole wall surface of the workpiece (11). When a burr or uneven surface is detected, the workpiece (11) is moved to the underside of the abrasive flow nozzle (13-1), and the pressure cover (16) is placed over the workpiece (11). The abrasive flow nozzle (13-1) sprays abrasive flow onto the hole wall surface. The magnetic field generated by the magnetic field generator (1-1) causes the abrasive flow to deflect under the action of the magnetic field force, so that the abrasive flow moves in a circle along the inner wall of the hole to process the inner wall surface of the hole.

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