Improved heating structure for optical sensor device that can automatically remove foreign objects

Abstract

The present invention provides an optical sensor device capable of automatically removing foreign matter, which uses a flexible and rigid material structure to seal the optical sensor device and transmit vibrations generated by a piezoelectric element, and provides a heating improvement structure for the optical sensor device. [Solution] The optical sensor device 20 includes a housing 260, a transparent protective cover 240, an optical sensor 210, a lens module 230, a flexible and rigid sealant 241, and a piezoelectric element 244, and further includes a heating element 245 installed between the side of the transparent protective cover and the sealant, thereby optimizing the automatic removal performance of foreign matter. By reducing the frequency of use of the piezoelectric element, power consumption can be reduced, the service life can be extended, and the removal efficiency of minute droplets can be improved.

Description

[Technical field]

[0001] The present invention relates to an improved heating structure for an optical sensor device that can automatically remove foreign objects, in particular, an optical sensor device that uses a flexible and rigid material structure to seal the optical sensor device and transmit the vibration generated by a piezoelectric element, and further combines a heating element to optimize the automatic removal performance of foreign objects. [Background technology]

[0002] An optical detection system is a system equipped with an optical sensor device, which collects optical information from the external environment through an optically transparent observation window, converts it into an electrical signal by the optical sensor, and then generates a corresponding response through processing by a processor. This system includes simple optical detection devices that receive light, such as cameras and some passive optical sensors, as well as optical emission devices that actively project light, such as structured light devices, ToF (Time of Flight) cameras, and optical radars. However, in outdoor environments or complex environments with many foreign objects, optical sensor devices are susceptible to contamination due to foreign objects adhering to the observation window. For example, foreign objects such as rain (water) droplets, snowfall, frost, and mud may adhere to the observation window and block, refract, or reflect the incident light, affecting the optical signal received by the optical sensor, causing the signal to deteriorate or degrade.

[0003] In response to this, many corresponding cleaning solutions have been proposed. US Patent Publication No. US11002954B2 discloses an imaging unit that includes a cleaning device and can clean the surface of a transparent body by vibrating the transparent body using a vibrator. However, the vibrator needs to have a cylindrical structure (e.g., a first cylindrical member and a second cylindrical member) to provide a vibration space. Such a vibration device makes the structure of the light detection system (camera in this technology) larger and more complicated. The present inventor also proposed a method for removing foreign objects on an imaging system and an imaging system ICVS (Instant Clear View System) in US Patent Publication No. US11489988B2. In the ICVS, a piezoelectric element is placed on a transparent protective cover of a camera device, and the piezoelectric element generates vibration to remove foreign objects from the transparent protective cover, and the transparent protective cover is surrounded by a soft sealing material to seal the optical sensor device. However, when such a soft sealing material (e.g., O-ring) is used in the interface design between the vibration source (i.e., the piezoelectric element) and the surroundings, a conflict occurs between the waterproof grade and the vibration capability. Specifically, a higher O-ring compression amount is required to improve the waterproof capability of the optical detection system, but this limits the vibration capability of the vibration source relative to the surroundings and reduces the foreign object removal capability. Conversely, if the O-ring compression amount is reduced to improve the vibration capability, steam or even water may easily enter (seep out) into the sealed space of the optical detection system. For this reason, the inventor went further and proposed an optical detection system ICVS (Instant Clear View System) and method capable of automatically removing foreign objects in Patent Publication No. JP7281843B2. This optical detection system uses a material having flexibility and rigidity to seal the optical detection system, uses a material different from the conventional technology to seal the optical sensor device, and transmits the vibration generated by the piezoelectric element, thereby automatically removing foreign objects stably and effectively.

[0004] However, even if the above-mentioned advanced methods for improving the vibration transmission of the vibration source are adopted, the remaining microdroplets of foreign matter when removing foreign matter by vibration are still a problem to be solved. In the conventional technology, a vibration source such as lead zirconate is used, and a method is used in which microdroplets on an observation window are heated and evaporated by the thermal energy generated during high-frequency vibration. However, high-frequency vibration means relatively high energy consumption, and furthermore, in this type of vibration source, the temperature of the vibration source itself rises rapidly due to high-frequency voltage driving. The accumulation of heat due to sustained high temperature can adversely affect the vibration capability of the vibration source, and in severe cases, it can cause permanent depolarization and lose the vibration capability. In U.S. Patent Publication No. US11366076B2, a temperature sensor and a temperature threshold are installed to limit the operating temperature of a piezoelectric transducer, thereby protecting the vibration source and achieving the effect of maintaining the vibration capability. However, such a vibration source protection method is similarly limited in the efficiency of removing foreign matter, and cannot be applied to applications that require rapid removal, such as unmanned aerial vehicles and driving assistance systems. Furthermore, even in fixed optical monitoring systems, it is necessary to avoid the expansion of blind spots on the observation time axis as much as possible, which places significant limitations on their practicality. Summary of the Invention [Problem to be solved by the invention]

[0005] Therefore, the inventor has developed an improved heating structure for the optical sensor device in the optical detection system for removing foreign objects, which can automatically remove foreign objects. In this improved structure, the heating element is arranged more efficiently and the structure of the optical sensor device is improved to solve the problems faced by the optical detection system for removing foreign objects. [Means for solving the problem]

[0006] The present invention relates to a heating improvement structure for an optical sensor device, which includes an optical sensor device, the optical sensor device comprising a housing having an opening on one side, a transparent protective cover disposed in the opening and defining an internal space of the optical sensor device together with the housing, an optical sensor disposed in the internal space of the optical sensor device, a lens module disposed between the transparent protective cover and the optical sensor, a piezoelectric element disposed on an edge of the transparent protective cover in the internal space of the optical sensor device, and a ring-shaped sheet-shaped piezoelectric element disposed between the edge of the transparent protective cover and the edge of the piezoelectric element, the piezoelectric element being elongated. and a heating element disposed between a side surface of the transparent protective cover and the sealing material, the piezoelectric element vibrating and the vibration being transmitted to the transparent protective cover via the sealing material to remove foreign matter from the transparent protective cover, and the heating element generating thermal energy which is transmitted to the transparent protective cover via the sealing material to remove minute liquid droplets from the transparent protective cover, thereby providing an improved heating structure for an optical sensor device capable of automatically removing foreign matter.

[0007] In another embodiment, the lens module is disposed in the opening, and is the transparent protective cover of the optical sensor device, and includes a top lens disposed on the outermost side of the lens module with respect to the internal space of the optical sensor device, a side housing included in the housing of the optical sensor device, a bottom lens disposed on the opposite side of the top lens, and one or more inner lenses disposed between the top lens and the bottom lens in the internal space of the lens module, and the heating element is disposed between the side of the top lens and the sealing material, and the top lens is disposed in front of the side housing including the side housing. The top lens, together with the housing of the optical sensor device, defines the internal space of the optical sensor device, and the top lens, together with the side housing and the bottom lens, define the internal space of the lens module, and in the internal space of the lens module, the piezoelectric element is installed on the edge of the top lens, and the sealing material is installed between the edge of the top lens and the edge of the piezoelectric element and is stretched and fixed to the side housing to seal the internal space of the optical sensor device, and the piezoelectric element vibrates, and the vibrations are transmitted to the top lens via the sealing material, thereby removing foreign matter from the top lens.

[0008] In a preferred embodiment, the optical sensor device further includes a soft shielding material having an annular sheet shape and being placed on the outside of the housing and the transparent protective cover to shield the gap between the housing, the transparent protective cover, and the sealing material.

[0009] In a preferred embodiment, the heating improvement structure further includes a heat insulating buffer element disposed between the piezoelectric element and the sealing material, and coupled with the piezoelectric element and the sealing material respectively.

[0010] In a preferred embodiment, the piezoelectric element further includes a heat insulating buffer element disposed between the piezoelectric element and the heating element and coupled to the heating element and the piezoelectric element, respectively. [Brief description of the drawings]

[0011] [Figure 1] FIG. 2 is a schematic diagram showing an embodiment of the heating improvement structure of an optical sensor device capable of automatically removing foreign objects according to the present invention; [Diagram 2] FIG. 4 is a schematic diagram showing a heating improvement structure of an optical sensor device capable of automatically removing foreign objects according to another embodiment of the present invention; [Diagram 3] FIG. 10 is a schematic diagram showing a heating improvement structure of an optical sensor device capable of automatically removing foreign objects according to still another embodiment of the present invention; [Figure 4] FIG. 4 is a diagram showing a lens module of the heating improvement structure of the optical sensor device of the present invention that can automatically remove foreign objects shown in FIG. 3 . [Figure 5A] 4A and 4B are diagrams illustrating the coupling of an encapsulant, a heating element, and a piezoelectric element in accordance with one embodiment of the present invention; [Figure 5B] FIG. 2 is a diagram showing the coupling method of the sealing material, the heating element, the piezoelectric element and the thermal insulation and buffer element in a more preferred embodiment of the present invention. [Figure 5C] FIG. 4 is a diagram showing the coupling manner of the sealing material, the heating element, the piezoelectric element and the thermal insulation and buffer element in another more preferred embodiment of the present invention. [Figure 5D] FIG. 4 is a diagram showing a coupling manner of a sealant, a heating element, a piezoelectric element and a thermal insulation buffer element in yet another more preferred embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] Hereinafter, the detailed structure of the heating improvement structure of the optical sensor device capable of automatically removing foreign matter according to the present invention will be described with reference to the drawings. FIG. 1 shows the heating improvement structure of the optical sensor device capable of automatically removing foreign matter according to one embodiment of the present invention, and FIGS. 2 to 4 show the detailed structure of the optical sensor device 20 capable of automatically removing foreign matter according to each embodiment of the present invention. Since the following description focuses on the structural features, some elements described with reference to the following FIGS. 5A, 5B, and 5C may not be further described or illustrated in FIGS. 1 to 4. However, it should be understood that such elements may be integrated into the optical sensor device (20 in FIGS. 2 to 4) and disposed within the optical detection system 10 (not shown). The optical detection system 10 may be an imaging system, and the optical sensor device 20 may be a camera device. However, the present invention is not limited to the above arrangement.

[0013] Referring to Fig. 1, the present invention provides an improved heating structure for an optical sensor device, which can automatically remove foreign matter. In an embodiment of the present invention, the optical sensor device 20 includes a housing 260, a transparent protective cover 240, an optical sensor 210, a lens module 230, a flexible and rigid encapsulant 241, a piezoelectric element 244, and a heating element 245. Fig. 3 shows an embodiment in which the transparent protective cover 240 has a planar shape (e.g., a flat lens), and Fig. 4 shows an embodiment in which the transparent protective cover 240 has a curved shape (e.g., a convex lens or a concave lens).

[0014] One side (e.g., the upper side in Figs. 3 and 4) of the housing 260 has an opening, and the transparent protective cover 240 is installed in the opening. The housing 260 together with the transparent protective cover 240 defines an internal space of the optical sensor device 20. The optical sensor 210 is installed in the internal space of the optical sensor device 20. The lens module 230 is installed between the transparent protective cover 240 and the optical sensor 210.

[0015] In the internal space of the optical sensor device 20, the piezoelectric element 244 is installed on the edge of the transparent protective cover 240. The piezoelectric element 244 includes a piezoelectric material, such as PZT. The piezoelectric element 244 can be electrically connected to the circuit board 220 by the electric cable 222. The sealant 241 has an annular sheet shape, and is installed (attached) between the edge of the transparent protective cover 240 and the edge of the piezoelectric element 244, and is stretched and fixed to the housing 260 to seal the internal space of the optical sensor device 20. The piezoelectric element 244 vibrates, and the vibration is transmitted to the transparent protective cover 240 via the sealant 241, thereby removing foreign matter from the transparent protective cover 240.

[0016] Preferably, the piezoelectric element 244 may be annular and disposed on the inner edge of the transparent protective cover 240, which contributes to removing foreign matter in a more efficient and material-saving manner. The piezoelectric element 244 may be attached to the transparent protective cover 240. The piezoelectric element 244 may be disposed to surround the periphery of the lens module 230.

[0017] The sealing material 241 may have flexibility and rigidity, and preferably includes one or more types selected from the group consisting of aluminum, steel (e.g., SUS304), titanium alloy, magnesium-aluminum alloy, polyimide (PI), polycarbonate (PC), and polyethylene terephthalate (PET). The sealing material 241 may be a metal foil such as aluminum, steel, titanium alloy, or magnesium-aluminum alloy, or may be a sheet or film made of polyimide, polycarbonate, or polyethylene terephthalate. The thickness of the sealing material 241 is preferably 10 to 200 μm. The sealing material 241 has waterproof properties, so that it can seal the internal space of the optical sensor device 20. The sealing material 241, which has flexibility and rigidity, can effectively transmit vibrations generated by the piezoelectric element 244 to the transparent protective cover, and can reduce vibrations transmitted to other surroundings (other than the transparent protective cover). In addition, the swing width due to vibration is not greater than the elongation rate. Therefore, when the sealing material 241 is used as the interface between the vibration source and the periphery, it has sufficient supporting strength and is unlikely to burst.

[0018] Meanwhile, in the present invention, instead of the soft sealant of the existing technology, the sealant 241 having flexibility and rigidity is used as a sealant between the transparent protective cover 240 and the housing 260, so that there may be a gap between the housing 260, the transparent protective cover 240, and the sealant 241. Therefore, the sealant 241 may be exposed to the outside due to such a gap, and water or other substances may adhere onto the sealant 241. Therefore, in order to prevent water or other substances from adhering onto the sealant 241, it has been found that by using a thin soft material as a shielding material and attaching it onto the transparent protective cover 240 and the sealant 241 to block the gap, water or other substances can be prevented from directly adhering onto the sealant 241. Therefore, in a preferred embodiment, the optical sensor device 20 further includes a soft shielding material 243. The soft shield material 243 has a ring-shaped sheet shape and is placed on the outside of the housing 260 and the transparent protective cover 240, thereby capable of shielding the gaps between the housing 260, the transparent protective cover 240, and the sealing material 241.

[0019] The heating element 245 is disposed between the transparent protective cover 240 and the sealing material 241, and is independently activated to generate heat energy when minute droplets are attached to the transparent protective cover 240. The heat energy is transferred to the transparent protective cover 240 via the sealing material 241, or directly heats the transparent protective cover 240 through thermal conduction by contact, so that the minute droplets can be removed.

[0020] According to some embodiments, the housing 260 may include a first housing 262, a lens module fixing member 264, and a second housing 266. Sealing may be performed by installing a sealing member, such as an O-ring, between adjacent ones of the first housing 262, the lens module fixing member 264, and the second housing 266. In the embodiment shown in FIG. 1 and FIG. 2, the opening of the housing 260 may be located in the second housing 266 (particularly the upper side). In each embodiment of the present invention, the lens module 230 may be fitted into the light sensor device 20 (as shown in FIG. 1 and FIG. 2), or at least a part of the lens module 230 may protrude outward from the light sensor device 20 (as shown in FIG. 3).

[0021] Referring to FIG. 3, in another embodiment, the lens module 230 is installed in an opening of the housing 260. In this case, the housing 260 only includes the first housing 262 and the lens module fixing member 264, and the opening of the housing 260 is installed in the lens module fixing member 264 (particularly the upper side). Referring to FIG. 4, the lens module 230 may include a top lens 230A, a side housing 230B, one or more internal lenses 230C, and a bottom lens 230D. The top lens 230A, the internal lens 230C, and the bottom lens 230D may be flat or curved, i.e., may be a flat lens, a convex lens, or a concave lens, respectively.

[0022] Referring to FIG. 4, in this embodiment, the upper lens 230A is the transparent protective cover 240 of the optical sensor device 20, and is installed on the outermost side of the lens module 230 with respect to the internal space of the optical sensor device 20. The side housing 230B may be a cylindrical member, and as a part of the housing 260 of the optical sensor device 20, defines the internal space of the optical sensor device 20 together with the upper lens 230A and the housing 260. The bottom lens 230D is installed on the opposite side of the upper lens 230A. The upper lens 230A, the side housing 230B, and the bottom lens 230D together define the internal space of the lens module 230. In the internal space of the lens module 230, the one or more internal lenses 230C are installed between the upper lens 230A and the bottom lens 230D. In this embodiment, the piezoelectric element 244 is installed on the edge of the upper lens 230A in the internal space of the lens module 230. The sealant 241 is installed (attached) between the edge of the upper lens 230A and the edge of the piezoelectric element 244, and is stretched and fixed to the side housing 230B to seal the internal space of the optical sensor device 20. The piezoelectric element 244 vibrates, and the vibration is transmitted to the upper lens 230A via the sealant 241, thereby removing foreign matter from the upper lens 230A.

[0023] The heating element 245 is disposed between the transparent protective cover 240 and the sealing material 241, and is independently activated to generate heat energy when minute droplets are attached to the transparent protective cover 240. The heat energy is transferred to the transparent protective cover 240 or the upper lens 230A via the sealing material 241, or directly heats the transparent protective cover 240 or the upper lens 230A through thermal conduction by contact, thereby removing the minute droplets.

[0024] The optical sensor device 20 may further include the circuit board 220 electrically connected to the optical sensor 210 .

[0025] 5A, 5B, 5C, and 5D, in another preferred embodiment, a heat insulating buffer element 247 may be added. In a combination that does not include the heat insulating buffer element 247, the heating element 245 is installed on one side of the sealant 241 with respect to the piezoelectric element 244, to avoid direct thermal conduction from affecting the piezoelectric element 244. Preferably, when the heat insulating buffer element 247 is installed, the heat insulating buffer element 247 can be installed in a combination as shown in FIG. 5B, FIG. 5C, or FIG. 5D. In FIG. 5B, the heating element 245 is installed on one side of the sealant 241 with respect to the piezoelectric element 244, and the heat insulating buffer element 247 is installed between the sealant 241 and the piezoelectric element 244, to achieve a more effective thermal insulation effect. In FIG. 5C, the heat insulating buffer element 247 is installed between the heating element 245 and the piezoelectric element 244, to avoid direct thermal conduction from affecting the piezoelectric element 244 through the heat insulating buffer element 247. In FIG. 5D, the insulating buffer element 247 is installed below the piezoelectric element 244, thereby more efficiently using the thermal energy generated by the heating element 245, preventing the loss of thermal energy and removing microdroplets more quickly.

[0026] The attachment between any of the above components may be achieved by rubber gluing, welding, or any other method, including any rubber gluing using an adhesive with good tensile properties and low moisture absorption.

[0027] The piezoelectric element 244, the sealing material 241, the soft shielding material 243, the heating element 245, and the insulating buffer element 247 may be arranged in any suitable ring-shaped shape as long as it does not block incident light from entering the optical sensor 210. [Explanation of symbols]

[0028] 10 Optical detection system 20 Optical sensor device 210 Light Sensor 220 Circuit Board 222 Electrical Cable 230 Lens Module 230A Top lens 230B Side Housing 230C Internal Lens 230D Bottom lens 240 Transparent protective cover 241 Encapsulating materials 242 Transparent base material 243 Soft shielding material 244 Piezoelectric element 245 Heating Element 247 Thermal insulation buffer element 248 Electrode 260 Case 262 First Case 264 Lens module fixing member 266 Second Case

Claims

1. A heating improvement structure for an optical sensor device, comprising: The optical sensor device includes: A housing having an opening on one side; a transparent protective cover disposed at the opening and defining an internal space of the optical sensor device together with the housing; an optical sensor disposed in the internal space of the optical sensor device; a lens module disposed between the transparent protective cover and the optical sensor; a piezoelectric element disposed on an edge of the transparent protective cover in the internal space of the optical sensor device; a sealing material having a ring-shaped sheet shape, which is disposed between an edge of the transparent protective cover and an edge of the piezoelectric element, and which has flexibility and rigidity and is elongated and fixed to the housing to seal an internal space of the optical sensor device; a heating element disposed between a side surface of the transparent protective cover and the encapsulant; A heating improvement structure for an optical sensor device capable of automatically removing foreign matter, characterized in that the piezoelectric element vibrates and the vibration is transmitted to the transparent protective cover via the sealing material, thereby removing foreign matter from the transparent protective cover, and the heating element generates thermal energy and the thermal energy is transmitted to the transparent protective cover via the sealing material, thereby removing microscopic liquid droplets from the transparent protective cover.

2. The heating improvement structure of the optical sensor device as claimed in claim 1 , wherein the heating element is disposed between the underside of the transparent protective cover and the encapsulant.

3. The lens module is disposed in the opening, and an upper lens which is the transparent protective cover of the optical sensor device and is disposed on the outermost side of the lens module with respect to the internal space of the optical sensor device; a side housing included in the housing of the optical sensor device; a bottom lens disposed opposite the top lens; The heating element includes one or more inner lenses disposed between the top lens and the bottom lens in the internal space of the lens module, the heating element being disposed between a side surface of the top lens and the encapsulant; the top lens defines, together with the housing of the light sensor device including the side housing, the interior space of the light sensor device; the top lens defines an internal space of the lens module together with the side housing and the bottom lens; In the internal space of the lens module, the piezoelectric element is disposed on the edge of the upper lens; the sealing material is disposed between an edge of the upper lens and an edge of the piezoelectric element, and is elongated and fixed to the side housing to seal an internal space of the optical sensor device; the piezoelectric element vibrates, and the vibration is transmitted to the upper lens via the sealing material, thereby removing foreign matter from the upper lens; The heating improvement structure of the optical sensor device as described in claim 1, characterized in that the heating element generates thermal energy, and the thermal energy is transmitted to the upper lens through the sealing material, thereby removing microscopic droplets from the upper lens.

4. The heating improvement structure of the optical sensor device as claimed in claim 3, characterized in that the heating element is installed under the upper lens and between the encapsulant.

5. The heating improvement structure of the optical sensor device according to claim 1 or 2, characterized in that the optical sensor device further comprises a soft shielding material having an annular sheet shape and installed on the outside of the housing and the transparent protective cover to shield the gap between the housing, the transparent protective cover, and the sealing material.

6. The heating improvement structure of the optical sensor device according to claim 3 or 4, characterized in that the optical sensor device further comprises a soft shielding material having an annular sheet shape and installed on the outside of the housing and the transparent protective cover to shield the gap between the housing, the transparent protective cover, and the sealing material.

7. The heating improvement structure of the optical sensor device according to claim 1, characterized in that the heating improvement structure further includes a heat insulating buffer element disposed between the piezoelectric element and the sealing material and coupled with the piezoelectric element and the sealing material respectively.

8. The heating improvement structure of the optical sensor device according to claim 1, characterized in that the heating improvement structure further includes a heat insulating buffer element disposed between the piezoelectric element and the heating element and coupled with the heating element and the piezoelectric element respectively.

9. 2. The heating improvement structure of claim 1, wherein the heating improvement structure further comprises a heat insulating buffer element disposed below the piezoelectric element and coupled with the heating element.

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