Air-conditioned clothing

The clothing cooling system addresses the inefficiencies of existing cooling devices by utilizing a semiconductor cooling fan assembly to collect and circulate cold air within the clothing, resulting in enhanced cooling performance and energy efficiency.

JP3251285UActive Publication Date: 2025-05-16SHENZHEN CHENXING ELECTRICAL APPLIANCE CO LTD
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Patent Information

Application Number
JP2024004384U
Authority / Receiving Office
JP · JP
Patent Type
Utility models
Current Assignee / Owner
Priority Date
2024-10-09
Filing Date
2024-12-27
Publication Date
2025-05-16
Estimated Expiration
2034-12-27

AI Technical Summary

Technical Problem

Existing clothing cooling devices have a high rate of cold air dissipation, low efficiency in using electrical energy, and poor cooling effects due to the inability to collect and circulate cold air effectively.

Method used

A clothing cooling system with a semiconductor cooling fan assembly removably attached to the back of the clothing, featuring a gasket with a flange to form a cavity, allowing cold air to be collected and circulated within the cavity and the fan assembly, enhancing heat exchange with the human body and improving cooling efficiency.

Benefits of technology

The system achieves improved cooling effects by maintaining a circulation of cold air within the cavity and the semiconductor cooling fan, reducing energy wastage, and enhancing the utilization of electrical energy.

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Abstract

To provide an air-conditioned garment including a garment and a cooling fan assembly detachably provided on the garment. [Solution] The garment 1 includes a back inner layer 10, and the cooling fan assembly 2 includes a gasket 20 and a semiconductor cooling fan, and a flange is provided on the side of the gasket close to the back inner layer to support the back inner layer and form a cavity, and the semiconductor cooling fan includes a cold air intake port, a cold air exhaust port, and a blower, and the cold air blown out from the cold air exhaust port exchanges heat with the human body in the cavity, and then is sucked into the semiconductor cooling fan from the cold air intake port by the blower for cooling, and is further exhausted from the cold air exhaust port, and the cold air circulates in the cavity and the semiconductor cooling fan. The air, whose temperature has increased after heat exchange with the human body, is sucked into the semiconductor cooling fan by the blower again for cooling, and the cooling effect is better.
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Description

[Technical field]

[0001] The present invention relates to the technical field of air conditioning equipment, and more specifically, to air-conditioned clothing. [Background technology]

[0002] The invention of air conditioners has greatly improved people's lives, but air conditioners can only be used in relatively closed spaces, and cannot be used outdoors or in special environments such as die-casting factories and heat treatment factories. This creates a poor working environment for workers in such places, and the high temperature and cold environment is harmful to people's health and prone to mistakes during work.

[0003] In order to improve the comfort of workers in the above-mentioned special environment, a patent document with the disclosure number WO2024101094A1 discloses a clothing cooling device including a Peltier element in a housing, a cooling fin formed on one side of the Peltier element, a heat dissipation fin formed on the other side, and a blower that blows air to the cooling fin and the heat dissipation fin. The clothing cooling device is attached to the clothing to cool the inside of the clothing. The clothing cooling device includes an air intake port opened in the housing for the blower to take in outside air, a cold air port through which the cold air that has passed through the cooling sheet is discharged, and a heat dissipation port through which the cold air that has passed through the cooling sheet is discharged. The hot air that has passed through the heat dissipation fin is discharged, and the opening faces the opposite direction of the housing. The cold air port includes a flange that is detachably attached to the inner and outer circumferential surfaces of the opening formed in the clothing.

[0004] According to the above technical solution, the clothing cooling device is installed in a clothing pocket, and the cold air outlet of the clothing cooling device is provided inside the clothing, so that the cold air generated by the heat dissipation fins can be efficiently used directly on the part of the body that needs to be cooled.

[0005] However, in this cooling configuration, the cool air dissipates quickly, the efficiency of the use of electrical energy is low, and the cooling effect is low.

[0006] This invention aims to solve the problem that the clothing cooling device in the prior art is unable to collect cold air, and after the cold air flows through the body, it is quickly dissipated into the surrounding environment, resulting in poor cooling effect and low utilization efficiency of electrical energy.

[0007] In order to solve the above-mentioned problems, the present invention provides an air-conditioned garment comprising a garment and a cooling fan assembly detachably attached to a back of the garment, the garment comprising a back inner layer that contacts the back of a human body, the cooling fan assembly comprising a gasket and a semiconductor cooling fan detachably attached to the gasket, a flange for supporting the back inner layer and forming a cavity on the side of the gasket closer to the back inner layer is provided, the semiconductor cooling fan comprises a cold air intake port, a cold air exhaust port, and a blower, the cold air intake port and the cold air exhaust port are both connected to the cavity, the cold air blown out from the cold air exhaust port exchanges heat with the human body within the cavity, and is then sucked into the semiconductor cooling fan through the cold air intake port by the blower for cooling, and then exhausted out from the cold air exhaust port, the cold air circulating within the cavity and the semiconductor cooling fan.

[0008] In the above structure, a flange is provided on the gasket, and the flange and the back inner layer of the clothing are surrounded to form a cavity, and the cold air inlet and cold air outlet of the semiconductor cooling fan are both connected to the cavity. This installation not only allows the cold air to be collected in the cavity and the back inner layer to cool the human body, but also allows the air whose temperature has increased after heat exchange with the human body to be sucked into the semiconductor cooling fan through the cold air inlet by the blower for cooling. At this time, since the air temperature in the cavity is lower than the air temperature outside the clothing, the temperature is lower after being cooled by the semiconductor cooling fan, and the cooling effect is better. The cold air of this structure is not easily released into the surrounding environment and is not wasted, so the utilization rate of electrical energy is higher. [Brief description of the drawings]

[0009] [Figure 1] FIG. 2 is a front view of the embodiment of the present invention. [Diagram 2]FIG. 2 is a schematic diagram of the internal structure of an embodiment of the present invention; [Diagram 3] FIG. 2 is a rear view of the embodiment of the present invention. [Figure 4] 2 is a structural schematic diagram of a cooling fan assembly according to an embodiment of the present invention; FIG. [Diagram 5] 2 is an exploded view of a cooling fan assembly according to an embodiment of the present invention; FIG. [Figure 6] 2 is an exploded view of a semiconductor cooling fan according to an embodiment of the present invention; FIG. [Figure 7] 2 is a schematic diagram of the flow of hot and cold air in an embodiment of the present invention; [Figure 8] FIG. 2 is a structural schematic diagram of a cooling unit in an embodiment of the present invention. [Figure 9] FIG. 2 is an exploded structural diagram of a cooling unit according to an embodiment of the present invention; Form for implementing a utility model

[0010] The present invention will be described in more detail below with reference to the drawings and detailed description of the preferred embodiment of the present invention.

[0011] As shown in Figs. 1 to 3, the air-conditioned suit includes a garment 1 and a cooling fan assembly 2 that is detachably provided on the back of the garment 1.

[0012] As shown in Figures 2 and 3, the garment 1 includes a back inner layer 10 that contacts the back of the human body, and a back outer layer 12, and the back outer layer 12 is sewn together with the back inner layer 10 to form a space for accommodating the cooling fan assembly 2. In this embodiment, the back inner layer 10 is a woven fabric that is gentle on the skin and has good breathability, and the back outer layer 12 is a woven fabric with a mesh.

[0013] An opening is provided at the top of the garment 1 to allow the cooling fan assembly 2 to enter and exit the space, and an opening and closing device is provided at the opening, which may be a Fuji zipper, a Velcro fastener, or the like. In this embodiment, the opening is provided in the back outer layer 12, and the opening and closing device is a Fuji zipper 121.

[0014] As shown in FIG. 4, the cooling fan assembly 2 includes a gasket 20 and a semiconductor cooling fan 21 that is detachably provided to the gasket 20.

[0015] In this embodiment, two solid-state cooling fans 21 are provided on the gasket 20, and the cool air exhaust ports of the two solid-state cooling fans 21 are provided apart from each other.

[0016] A flange 22 is provided on the side of the gasket 20 closer to the rear inner layer 10 to support the rear inner layer 10 and form a cavity 200, and the flange 22 is provided along the edge of the gasket 20 to form a sealed annular shape, and one or more first bosses 23 are provided to support the rear inner layer 10 within the cavity 200.

[0017] A hole matching the shape of the semiconductor cooling fan 21 is opened in the gasket 20, the semiconductor cooling fan 21 is fitted in the hole, a snap ring 24 is passed through, and a snap fit 241 engageable with the semiconductor cooling fan 21 is provided on the snap ring 24, so that the semiconductor cooling fan 21 and the gasket 20 are tightly attached to each other.

[0018] In this embodiment, the gasket 20 is made of a foam material, the flange 22 and the first boss 23 are integrally molded with the gasket 20, the cross section of the flange 22 is arch-shaped, and the first boss 23 is distributed around the two semiconductor cooling fans 21 and plays a role in supporting the rear inner layer 10 and preventing the rear inner layer 10 from being adsorbed by the suction force of the blower and blocking the blower.

[0019] As shown in Figures 5 and 6, the semiconductor cooling fan 21 includes a bottom case 210, a blower 211 is provided inside the bottom case 210, a cooling module 212 is provided on one side of the blower 211, and fins 213 are provided on the side of the cooling module 212 away from the blower 211.

[0020] The blower 211 is a worm wheel fan having annular blades 2110 with a partition plate 2111 provided in the radial direction of the blades 2110. By providing the partition plate 2111, it is possible to prevent the cold air and the hot air from mixing at the blades.

[0021] A cold air intake port 2101 and a cold air exhaust port 2102 are provided in the bottom case 210 , and the cold air intake port 2101 corresponds to the position of the blades 2110 .

[0022] The solid-state cooling fan 21 further includes a top case 214 , in which a hot air intake port 2141 and a hot air exhaust port 2142 are provided. The hot air intake port 2141 corresponds to the position of the blades 2110 .

[0023] The cross section of the fin 213 is arc-shaped, and the fin 213 has an intake end 2131 and an exhaust end 2132 .

[0024] The cooling module 212 includes a semiconductor cooling sheet 2120, which includes a cooling surface and a heating surface, both of which are connected with ventilated heat dissipation fins, and the cooling module 212 further includes a heat insulating layer 2125 covering the heat dissipation fins. The cooling module 212 is a mature prior art, and its specific structure will not be described here.

[0025] The intake end 2131 of the fin 213, the semiconductor cooling sheet 2120, and the partition plate 2111 of the blade 2110 are provided on the same plane, and in this embodiment, during operation, the side of the cooling module 212 close to the bottom case 210 cools, and the side close to the top case 214 heats. The blades 2110 of the blower 211 rotate after being energized, and because the partition plate 2111 is provided, the air that enters the blower 211 from the cold air intake port 2101 and the hot air intake port 2141 is not easily mixed, and a part of the air blown out from the blower 211 cools through the cooling surface side of the cooling module 212, then passes through the fins 213 and exits the cold air exhaust port 2141. The other part of the air blown into the cavity 200 through 102 and blown out from the blower 211 absorbs heat from the heating surface side of the cooling module 212 and is discharged from the hot air exhaust port 2142, and the cold air blown out from the cold air exhaust port 2102 exchanges heat with the human body in the cavity 200, and then is sucked into the cooling module 212 through the cold air intake port 2101 by the blades 2110 for cooling, and is discharged from the cold air exhaust port 2102, so that the cold air circulates within the cavity 200 and the semiconductor cooling fan 21 and is not easily discharged by the semiconductor cooling fan 21, and the hot air outside the semiconductor cooling fan 21 is also not easily allowed to enter the above-mentioned circulation circuit.

[0026] In FIG. 7, A indicates a circulation circuit of cool air, and B indicates a heat dissipation path of hot air.

[0027] The air, whose temperature has increased after exchanging heat with the human body, is sucked again by the blower 211 through the cool air intake 2101 into the semiconductor cooling fan 21 for cooling. At this time, since the air temperature in the cavity 200 is lower than the air temperature outside the clothing 1, the air temperature in the cavity 200 becomes lower after being cooled by the semiconductor cooling fan 21, and the cooling effect becomes better. The cool air of this structure is less likely to be released into the environment outside the clothing 1 and is not wasted, so the utilization rate of electrical energy is higher.

[0028] As shown in FIG. 5, in order to prevent the blower 211 from directly sucking in the cold air blown out from the cold air exhaust port 2102 through the cold air inlet port 2101, a second boss 2105 is provided on the outside of the bottom case 210 between the cold air inlet port 2101 and the cold air exhaust port 2102 to isolate the cold air inlet port 2101 and the cold air exhaust port 2102 and support the back inner layer 10.

[0029] Typically, the top case 214 and the bottom case 210 are injection molded from plastic, and the second boss 2105 is integrally molded with the bottom case 210 .

[0030] The top case 214 and the bottom case 210 are connected via a snap fit and then fastened together with screws.

[0031] In order to further improve the cooling effect of the air-conditioned clothing and prevent poor cooling effect at the front of the air-conditioned clothing, one air-conditioning unit 3 is provided on each of the left and right sides of the lower front of the clothing 1, as shown in Figures 1 and 2.

[0032] An air conditioning unit mounting hole is opened on each of the left and right sides below the front of the garment 1, and as shown in Figures 8 and 9, the air conditioning unit 3 has an mounting portion 31, which includes an extension portion 311 and a stop portion 312, and the air conditioning unit 3 further has a contact portion that contacts the human body and a fastener 32 for fixing the air conditioning unit 3 to the gasket 11, and when mounted, the extension portion 311 passes through the air conditioning unit mounting hole, the stop portion 312 abuts against the outside of the garment, and the fastener 32 abuts against the inside of the garment.

[0033] The cooling unit 3 further includes a fan 33, a cooling sheet 34, and a face cover 35, and the cold generated when the cooling sheet 34 is operated is transferred to the face cover 35, which contacts the human body to transfer the cold to the human body, and the heat generated when the cooling sheet 34 is operated is removed by the fan 33. By providing the cooling unit 3 at the front of the garment 1, the defect that the cold air from the cooling fan assembly 2 cannot cool the front of the human body can be compensated for, and the cooling effect of the air-conditioned suit can be further improved.

[0034] The specific structure of the cooling unit 3 is described in detail in another patent document of the same company, so the specific structure will not be described here.

[0035] 1 and 2, a pocket 13 for accommodating a battery and an electric wire restraining strap 14 are provided on the front chest of the garment 1. The power lines 36 of the cooling fan assembly 2 and the cooling unit 3 pass through the electric wire restraining strap 14, enter the pocket 13, and are connected to a power source.

[0036] This technical solution can collect cold air, has a high utilization rate of cold air, good cooling effect, and good utilization rate of electric energy.

Claims

1. An air-conditioned suit including a garment and a cooling fan assembly detachably provided on a back of the garment, The garment includes a back inner layer that contacts the back of the human body; The cooling fan assembly includes a gasket and a semiconductor cooling fan detachably attached to the gasket. A flange is provided on a side of the gasket close to the rear inner layer to support the rear inner layer and form a cavity. The semiconductor cooling fan is equipped with a cold air intake port, a cold air exhaust port, and a blower, both of which are connected to a cavity, and the cold air blown out from the cold air exhaust port exchanges heat with the human body within the cavity, after which it is sucked into the semiconductor cooling fan from the cold air intake port by the blower for cooling, and then discharged from the cold air exhaust port, with the cold air circulating within the cavity and the semiconductor cooling fan.

2. 2. The air-conditioned garment according to claim 1, characterized in that the flange is provided along the edge of the gasket to form a sealed annular shape, and one or more first bosses are provided within the cavity to support the back inner layer.

3. The air-conditioned garment according to claim 1, characterized in that two semiconductor cooling fans are provided in the gasket, the cold air exhaust ports of the two semiconductor cooling fans are provided apart from each other, and the garment is further provided with one or more cooling units.

4. The solid-state cooling fan further includes a bottom case, the blower is disposed within the bottom case, a cooling module is disposed on one side of the blower, and a fin is disposed on a side of the cooling module away from the blower; 2. The air-conditioned clothing according to claim 1, wherein the cold air intake port and the cold air exhaust port are both provided in the bottom case.

5. The air-conditioned clothing according to claim 1, characterized in that the cooling module includes a semiconductor cooling sheet, the semiconductor cooling sheet includes a cooling surface and a heating surface, ventilation-enabled heat dissipation fins are connected to both the cooling surface and the heating surface, and the cooling module further includes a heat insulating layer covering the heat dissipation fins.

6. The blower is a worm wheel fan, and the worm wheel fan has an annular blade and a partition plate provided in a radial direction of the blade. The cross section of the fin is arc-shaped, and the fin has an intake end and an exhaust end; The air-conditioned clothing according to claim 5, wherein the intake ends of the fins, the semiconductor cooling sheet and the partition plates of the blades are provided on the same plane.

7. The air-conditioned clothing according to claim 1, characterized in that a second boss is provided between the cold air intake port and the cold air exhaust port on the outside of the bottom case to isolate the cold air intake port and the cold air exhaust port and support the inner layer of the back.

8. 2. The air-conditioned clothing according to claim 1, wherein the garment comprises an outer back layer, the outer back layer is sewn together with the inner back layer to form a space for accommodating the cooling fan assembly, an opening is provided at a top of the garment for allowing the cooling fan assembly to enter and exit the space, and an opening / closing device is provided at the opening.

9. The air-conditioned clothing of claim 3, characterized in that the air-conditioning unit is provided at the lower end of the front of the garment, an attachment hole is opened in the garment, the air-conditioning unit has an attachment portion, the attachment portion includes an extension portion and a stop portion, the air-conditioning unit further has a contact portion that contacts the human body and a fastener for fixing the air-conditioning unit to the gasket, and when attached, the extension portion passes through the attachment hole, the stop portion abuts against the outside of the garment, and the fastener abuts against the inside of the garment.

10. 2. The air-conditioned suit according to claim 1, further comprising a pocket for accommodating a battery and a wire restraining strap on the front of the suit.