Electroplating systems and electroplating production lines

Abstract

The present application relates to an electroplating system (100) and an electroplating production line. The electroplating system (100) comprises a plating bath (120), an unwinding mechanism (130), a winding mechanism (140), and a magnetic field generator (150). The plating bath (120) contains a plating solution, a plating roller (121) is movably mounted within the plating bath (120), the unwinding mechanism (130) and the winding mechanism (140) are located on both sides of the plating bath (120), and the unwinding mechanism (130) ) is used to accommodate and transport the substrate (110) to be plated at a uniform speed, and can transport the substrate (110) to the plating roller (121) for electroplating. The winding mechanism (140) is used to accommodate and wind the substrate (110) to be plated after electroplating. The magnetic field generator (150) is installed outside the plating tank (120) and is used to emit a uniform magnetic field into the plating tank (120), and the plating roller (121) can cross the uniform magnetic field when moving.

Description

[Technical Field]

[0001] The present application relates to the technical field of electroplating thin films, and in particular to electroplating systems and electroplating production lines. [Background technology]

[0002] Batteries are widely used in consumer electronics and electric vehicles due to their advantages, such as high energy density, long service life, green and pollution-free performance, and high safety. As people's demand for batteries continues to grow, how to achieve high battery safety and high energy density has become a key research focus. With the continuous development of the battery industry, a current collector with superior performance has emerged: a composite current collector combining a polymer thin film and a metal. Composite current collectors are generally divided into aluminum foil and copper foil. Copper foil is typically formed by first depositing a copper metal layer 50-80 nm thick on the surface of a polymer thin film 2 μm-10 μm thick using magnetron sputtering, followed by wet plating to increase the copper metal layer to 1 μm-2 μm thick, resulting in a composite copper foil with a total thickness of 3 μm-12 μm.

[0003] Currently, wet plating is generally carried out using two electroplating methods. One is cathode roller electroplating. However, in this electroplating method, the conductive roller comes into direct or indirect contact with the plating solution at the same time as it contacts the copper film, resulting in copper being plated back onto the conductive roller. During the long-term electroplating process, if the plated copper on the conductive roller accumulates to a certain extent, an irregularly shaped copper crystal layer will form, causing defects on the surface of the plated film. The other is clip electroplating. However, in this electroplating method, the current required for the surface of the polymer film is transmitted through clips on both sides, and the current is transmitted from both ends to the middle, resulting in uneven lateral current distribution and poor thickness uniformity of the metal plated layer. The lateral thickness uniformity of the metal plated layer is extremely poor, reaching more than 1 μm in the worst cases, which greatly affects the plating quality of the polymer film and deteriorates the performance of the composite current collector. Summary of the Invention

[0004] According to various embodiments of the present application, an electroplating system and an electroplating production line are provided.

[0005] In a first aspect, the present electroplating system is used to deposit a metal plating layer on a surface of a substrate to be plated, The electroplating system includes: a plating tank in which a plating solution is stored and in which a plating roller is movably provided; an unwinding mechanism and a winding mechanism located on both sides of the plating tank, respectively; a magnetic field generator provided outside the plating tank and used to generate a uniform magnetic field into the plating tank, the magnetic field being capable of being traversed by the plating roller as it moves; The unwinding mechanism is used to store and transport the substrate to be plated at a constant speed, and is capable of transporting the substrate to the plating roller for electroplating, and the winding mechanism is used to store and wind the substrate to be plated after it has been electroplated.

[0006] In one embodiment thereof, the magnetic field generator comprises at least one electromagnet.

[0007] In one embodiment, if there is only one electromagnet, it is installed on the outer wall of the plating tank; if there are multiple electromagnets, all of them are installed on the outer wall of the plating tank, and the electromagnets installed on two opposing outer walls of the plating tank have opposite polarities on the sides that are closest to each other.

[0008] In one embodiment, the plating tank further includes a guide rail and a first driving source disposed within the plating tank, and the plating roller is movably mounted on the guide rail and is power-transmittedly connected to the first driving source, and crosses the uniform magnetic field when moving on the guide rail.

[0009] In one embodiment, there are two plating rollers, and the two plating rollers are spaced apart on the transport path of the substrate to be plated, and there are also two guide rails, and the two guide rails are connected to correspond to the two plating rollers.

[0010] In one embodiment, a conductive wire is connected between the two guide rails, and the two ends of the plating roller are conductive, while the intermediate portion is insulating.

[0011] In one embodiment, the first driving source is an electric element or an aerodynamic element.

[0012] In one embodiment, the unwinding mechanism includes an unwinding shaft, a first pressure roller, and a first pass roller, which are sequentially arranged along a transport path of the substrate to be plated, the unwinding shaft being located farther from the plating tank, and the substrate to be plated is sequentially wound around the unwinding shaft, the first pressure roller, and the first pass roller during the transport process; The winding mechanism includes a second pass roller, a second pressure roller, and a winding shaft, which are arranged in sequence along the transport path of the substrate to be plated, the winding shaft being located farther from the plating tank, and the substrate to be plated being wound around the second pass roller, the second pressure roller, and the winding shaft in sequence during the transport process.

[0013] In one embodiment, the apparatus further includes two tension adjustment mechanisms, one of which is located between the plating tank and the unwinding mechanism and the other is located between the plating tank and the winding mechanism, and the substrate to be plated is wound around the tension adjustment mechanism during the transport process.

[0014] In one embodiment, the tension adjustment mechanism includes a tension detection roller, a second drive source, and an oscillating roller that is power-transmitted to the second drive source, the tension detection roller being capable of detecting the surface tension of the substrate to be plated, and the second drive source being capable of driving the oscillating roller to oscillate within a set angle range.

[0015] In one embodiment thereof, the oscillating roller is provided with a position sensor.

[0016] In one embodiment, the plating system further includes a spray mechanism and a baking mechanism, which are sequentially arranged along the transport path of the substrate to be plated and are both located near the winding mechanism of the plating tank, and the spray mechanism is used to clean the surface of the substrate to be plated after electroplating, and the baking mechanism is used to dry the substrate to be plated after being cleaned by the spray mechanism.

[0017] In one embodiment, the apparatus further includes a sputtering device provided at the front end of the unwinding mechanism, the sputtering device comprising a vacuum chamber, a constant voltage power supply, a magnetron sputtering source, and a table, the magnetron sputtering source and the table are both provided within the vacuum chamber and spaced apart from each other, the substrate to be plated can be placed inside the vacuum chamber and placed on the table, the constant voltage power supply is provided within the vacuum chamber and can form an electric field within the vacuum chamber, and the vacuum chamber has a gas inlet.

[0018] In one embodiment, a magnet is provided below the magnetron sputtering source.

[0019] In a second aspect, the present invention provides an electroplating production line comprising an electroplating system according to any one of the above claims. [Brief explanation of the drawings]

[0020] In order to more clearly explain the technical aspects of the embodiments in the present application or the prior art, the drawings that need to be used in the description of the embodiments or the prior art will be briefly introduced below. However, the drawings described below are only embodiments of the present application, and it is obvious that a person skilled in the art can further obtain other drawings according to the disclosed drawings without paying any creative labor.

[0021] [Figure 1] 1 is a structural schematic diagram of an electroplating system shown in some embodiments of the present application. [Explanation of symbols]

[0022] 100...Electroplating system, 110...Substrate to be plated, 120...Plating tank, 121...Plating roller, 130...Unwinding mechanism, 131...Unwinding shaft, 132...First pressure roller, 133...First pass roller, 140...Winding mechanism, 141...Winding shaft, 142...Second pressure roller, 143...Second pass roller, 150...Magnetic field generator, 151...Uniform magnetic field, 160...Guide rail, 161...Conductive wire, 170...Tension adjustment mechanism, 171...Tension detection roller, 172...Oscillating roller. DETAILED DESCRIPTION OF THE INVENTION

[0023] The technical solutions in the embodiments of the present application will be clearly and completely explained below in conjunction with the drawings in the embodiments of the present application, and it is clear that the described embodiments are only some of the embodiments of the present application, not all of the embodiments. Any other embodiments that can be obtained by those skilled in the art based on the embodiments of the present application without any creative work will fall within the scope of protection of the present application.

[0024] In order to make the above-mentioned objects, features, and advantages of the present application clearer and easier to understand, specific embodiments of the present application will be described in detail below with reference to the drawings. In the following description, many specific details will be described to fully understand the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the spirit of the present application, so the present application is not limited by the specific examples disclosed below.

[0025] In the description of this application, orientations or positional relationships indicated by terms such as "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," etc. are based on the orientations or positional relationships shown in the drawings, and are intended merely to facilitate and simplify the description of this application, and are not intended to indicate or imply that the referred devices or elements must have a particular orientation, be configured and operated in a particular orientation, and therefore should not be understood as limiting this application.

[0026] Furthermore, the terms "first" and "second" are for descriptive purposes only and cannot be understood as indicating or implying the relative importance or the quantity of the technical features indicated. Accordingly, a feature qualified as "first" or "second" may explicitly or implicitly include at least one of the feature. In the description of this application, unless otherwise clearly and specifically limited, "plurality" means at least two or more, e.g., two, three, etc.

[0027] In this application, unless otherwise clearly specified or limited, the terms "attach," "connect," "couple," "fix," etc. should be understood in a broad sense, and may refer to, for example, a fixed connection, a detachable connection, or integration, a mechanical connection, an electrical connection, a direct connection, an indirect connection via an intermediate medium, internal communication between two elements, or an interaction between two elements. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0028] In this application, unless otherwise clearly specified or limited, a first feature being "above" or "below" a second feature may include direct contact between the first feature and the second feature, or indirect contact between the first feature and the second feature via an intermediate medium. Furthermore, a first feature being "above," "above," and "on the upper surface" of a second feature may mean that the first feature is directly above or diagonally above the second feature, or simply that the horizontal height of the first feature is higher than that of the second feature. A first feature being "below," "below," and "on the lower surface" of a second feature may mean that the first feature is directly below or diagonally below the second feature, or simply that the horizontal height of the first feature is lower than that of the second feature.

[0029] It should be noted that when an element is said to be "fixed to" or "mounted on" another element, it may be directly on the other element, or there may be intervening elements present. When an element is referred to as being "connected" to another element, it may be directly connected to the other element, or there may also be intervening elements present. The terms "vertical," "horizontal," "top," "bottom," "left," "right," and similar terms used herein are for descriptive purposes only and do not represent the only embodiment.

[0030] As shown in FIG. 1 , the present application provides an electroplating system 100, which includes a plating bath 120, an unwinding mechanism 130, a winding mechanism 140, and a magnetic field generator 150. The electroplating system 100 is used to deposit a metal plating layer on the surface of a substrate 110 to be plated. In this embodiment, the substrate 110 has a combined structure in which a metal plating layer is deposited on a polymer thin film using a sputtering device. The electroplating system 100 primarily increases the thickness of the metal plating layer on the surface of the substrate 110 to be plated, thereby enhancing the conductivity of the metal plating layer. The polymer thin film may be one of PET (packaging film), BOPP (biaxially oriented polypropylene film), and PI (polyimide film). Of course, the polymer thin film may also be composited with other polymer materials. The metal plating layer may be one of copper and aluminum.

[0031] A plating solution containing metal ions for the metal plating layer is stored in the plating tank 120. A plating roller 121 is movably installed in the plating tank 120, and the substrate 110 to be plated can be wound around the plating roller 121 when it enters the plating tank 120 for electroplating. In this embodiment, a portion of the substrate 110 to be plated is wound around the plating roller 121, i.e., a portion of the substrate 110 is in contact with the outer surface of the plating roller 121, so that the substrate 110 to be plated can be fixed in the plating tank 120 for electroplating, and can be transported out of the plating tank 120 after electroplating of the substrate 110 to be plated is completed.

[0032] The unwinding mechanism 130 and the winding mechanism 140 are located on both sides of the plating tank 120. Specifically, both the unwinding mechanism 130 and the winding mechanism 140 are located outside the plating tank 120, and are installed on both sides of the plating tank 120 with a gap between them along the transport path of the substrate 110 to be plated. The unwinding mechanism 130 is used to receive and transport the substrate 110 to be plated at a constant speed, and the unwinding mechanism 130 can transport the substrate 110 to the plating roller 121 for electroplating. The winding mechanism 140 is used to receive and wind the electroplated substrate 110, thereby winding and storing the electroplated substrate 110. During the process of winding the substrate 110 to be plated, the extension space where the substrate 110 to be plated protrudes from the unwinding mechanism 130 or the winding mechanism 140 is the accommodation space for the substrate 110 to be plated.

[0033] The magnetic field generator 150 is installed outside the plating tank 120 and emits a uniform magnetic field 151 into the plating tank 120 to form a stable and uniform magnetic field within the plating tank 120. The plating roller 121 can cross the uniform magnetic field 151 when moving. In this embodiment, the direction of movement of the plating roller 121 within the plating tank 120 is perpendicular to the direction of the magnetic flux lines of the uniform magnetic field 151, so that when the crossing mechanism crosses the uniform magnetic field 151, a large induced current can be generated.

[0034] The electroplating system 100 includes a magnetic field generator 150 disposed outside the plating bath 120, which generates a uniform magnetic field 151 within the plating bath 120. The unwinding mechanism 130 transports the substrate 110 to be plated at a constant speed to the plating roller 121. The plating roller 121 moves within the plating bath 120, causing the substrate 110 to cross the uniform magnetic field 151. As the substrate 110 crosses the uniform magnetic field 151, a uniform induced current is generated on its surface, forming a stable external electric field around the substrate 110. The metal ions in the plating solution are deposited on the surface of the substrate 110 under the action of the external electric field, forming a metal plating layer on the surface of the substrate 110. After electroplating, the substrate 110 can be wound up by the winding mechanism 140 and stored, completing the electroplating process of the substrate 110. In the electroplating system 100, when the substrate 110 to be plated crosses the uniform magnetic field 151, an induced current is generated on its surface, and the current density is uniform across the entire width of the substrate 110 to be plated. This significantly improves the uniformity of the thickness of the metal plating layer deposited on the surface of the substrate 110 to be plated, and does not have any adverse effects such as piercing or scratching the metal plating layer deposited on the surface of the substrate 110 to be plated, thereby significantly improving the quality of the electroplating of the substrate 110 to be plated.

[0035] 1, in order to project the uniform magnetic field 151 into the plating bath 120, in one embodiment, the magnetic field generator 150 includes at least one electromagnet, and as the plating roller 121 reciprocates within the plating bath 120, the direction of the magnetic flux lines projected by the electromagnet can be changed by changing the direction of the current passing through the electromagnet, ensuring that the direction of the induced current generated on the surface of the substrate 110 to be plated is always consistent as the plating roller 121 crosses the uniform magnetic field 151, thereby realizing the deposition of a metal plating layer on the surface of the substrate 110 to be plated. When there is only one electromagnet, the electromagnet is mounted on the outer wall of the plating bath 120 by magnetic attraction, and projects the uniform magnetic field 151 into the plating bath 120. As the substrate 110 crosses the uniform magnetic field 151, an induced current can be generated on its surface, causing metal ions in the plating solution to deposit on the surface of the substrate 110 under the action of the external electric field. If there is only one electromagnet, the magnetic field density of the electromagnet emitted into the plating tank 120 is equivalently the same, and thus a uniform magnetic field 151 is emitted into the plating tank 120. If there are multiple electromagnets, they are all mounted on the outer walls of the plating tank 120 in a magnetic attraction manner, and the electromagnets mounted on the two opposing outer walls of the plating tank 120 have opposite polarities on the sides that are closer to each other. That is, the two opposing outer walls of the plating tank 120 are both equipped with electromagnets, and the electromagnet mounted on one outer wall has a south pole on the side facing the inside of the plating tank 120, and the electromagnet mounted on the other outer wall has a north pole on the side facing the inside of the plating tank 120. As a result, a uniform magnetic field 151 is emitted into the plating tank 120, and when the substrate 110 to be plated crosses the uniform magnetic field 151, an induced current is generated on its surface, and metal ions in the plating solution are deposited on the surface of the substrate 110 to be plated by the action of the external electric field.

[0036] In order to drive the plating roller 121 to move within the plating tank 120, in one embodiment, as shown in FIG. 1, the electroplating system 100 further includes a guide rail 160 and a first driving source (not shown), and the guide rail 160 is installed within the plating tank 120 by screwing, welding, or other methods to achieve a fixed connection of the guide rail 160, and the guide rail 160 may also be installed on the side wall of the plating tank 120. The plating roller 121 is movably mounted on a guide rail 160 and is power-connected to a first driving source. The first driving source drives the plating roller 121 to move along the guide rail 160. When the plating roller 121 moves along the guide rail 160, it crosses the uniform magnetic field 151. Since the substrate 110 to be plated is wrapped around the plating roller 121, the substrate 110 to be plated also moves across the uniform magnetic field 151. As a result, an induced current is generated on the surface of the substrate 110 to be plated, forming a stable external electric field in the area surrounding the substrate 110 to be plated. Metal ions in the plating solution are deposited on the surface of the substrate 110 to be plated under the action of the external electric field, forming a metal plating layer on the surface of the substrate 110 to be plated.

[0037] The first driving source may be an electric or aerodynamic element, and may drive the plating roller 121 to move across the uniform magnetic field 151 in the plating tank 120 by an electric or aerodynamic means. Of course, the first driving source may be a hydraulic element or other driving element capable of outputting power, and the present application does not limit the specific type of the first driving source.

[0038] For example, when the first driving source is an aerodynamic element, the first driving source is an air cylinder, the cylinder block of which is outside the plating liquid, and the piston rod of the air cylinder enters the plating liquid and connects to the plating roller 121, driving the plating roller 121 to move across the uniform magnetic field 151 within the plating tank 120. Also, when the first driving source is an electric element, the first driving source is an electric cylinder, the body of which is located outside the plating liquid, and the output push rod of the electric cylinder enters the plating liquid and contacts the plating roller 121, driving the plating roller 121 to move across the uniform magnetic field 151 within the plating tank 120.

[0039] 1, there are two plating rollers 121, which are spaced apart along the transport path of the substrate 110 to be plated, and which fix the substrate 110 to be plated in the plating tank 120 and spread the substrate 110 within the plating tank 120 so that the surface of the substrate 110 can be electroplated. There are also two guide rails 160, which are connected to the two plating rollers 121, respectively. In other words, one of the two guide rails 160 is connected to one of the two plating rollers 121, and the other is connected to the other of the two plating rollers 121. As a result, the two plating rollers 121 reciprocate along the two guide rails 160, causing the substrate 110 to move across the uniform magnetic field 151 within the plating tank 120, generating a uniform induced current on the surface of the substrate 110 to be plated. A conductive wire 161 is connected between the two guide rails 160, and a closed circuit is formed between the plating roller 121, the guide rails 160, and the substrate 110 to be plated. The plating roller 121, which participates in forming the closed circuit, moves transversely within the uniform magnetic field 151, thereby generating an induced current on the surface of the substrate 110 to be plated. Furthermore, both ends of the plating roller 121 are conductive, and the middle position of the plating roller 121 is insulating. If a closed circuit is not formed between the plating roller 121, the guide rail 160, and the substrate 110 to be plated, an induced current cannot be generated on the surface of the substrate 110 to be plated. Therefore, if the two ends of the plating roller 121 are conductive and the middle position of the plating roller 121 is insulating, the induced current generated on the surface of the substrate 110 to be plated does not charge the middle position of the plating roller 121, and can be conducted to the guide rail 160 only by the ends of the plating roller 121. When the plating roller 121 reciprocates on the guide rail 160 and is in contact with the plating solution, metal ions in the plating solution do not accumulate at the middle position of the plating roller 121, but only at the ends of the plating roller 121. This prevents the metal ions from being plated in the middle position of the plating roller 121, and prevents defects such as piercing or scratching the metal plating layer deposited on the surface of the substrate 110 to be plated.

[0040] 1, in order to transport, wind, and store the substrate 110 to be plated, an unwinding mechanism 130 includes an unwinding shaft 131, a first pressure roller 132, and a first pass roller 133. The unwinding shaft 131, the first pressure roller 132, and the first pass roller 133 are sequentially arranged on the transport path of the substrate 110 to be plated, with the unwinding shaft 131 located farther from the plating tank 120 and the first pass roller 133 located closer to the plating tank 120. The substrate 110 to be plated is sequentially wound around the unwinding shaft 131, the first pressure roller 132, and the first pass roller 133 during the transport process. As the unwinding shaft 131 rotates, the substrate 110 to be plated is sequentially transported into the plating tank 120 by the first pressure roller 132 and the first pass roller 133 for electroplating.

[0041] Similarly, the winding mechanism 140 includes a winding shaft 141, a second pressure roller 142, and a second pass roller 143. The second pass roller 143, the second pressure roller 142, and the winding shaft 141 are sequentially arranged on the transport path of the substrate 110 to be plated, with the winding shaft 141 located farther from the plating tank 120 and the second pass roller 143 located closer to the plating tank 120. The substrate 110 to be plated is sequentially wound around the second pass roller 143, the second pressure roller 142, and the winding shaft 141 during the transport process. As the winding shaft 141 rotates, the substrate 110 to be plated after electroplating is sequentially transported out of the plating tank 120 by the second pass roller 143 and the second pressure roller 142, and the electroplated substrate 110 can be wound and stored.

[0042] In order to adjust the tension of the substrate 110 to be plated during transportation, in one embodiment, as shown in Figure 1, the electroplating system 100 further includes two tension adjustment mechanisms 170. One of the two tension adjustment mechanisms 170 is located between the plating tank 120 and the unwinding mechanism 130, and the other is located between the plating tank 120 and the winding mechanism 140. The substrate 110 to be plated is wound around a tension adjusting mechanism 170 during the transport process, and the tension adjusting mechanism 170 adjusts the tension of the substrate 110 to be plated, thereby ensuring an appropriate tension for the substrate 110 to be plated during transport. This prevents defects such as wrinkles and overlaps on the surface of the substrate 110 to be plated that are caused by insufficient tension on the substrate 110 to be plated, thereby improving the quality of the electroplating of the substrate 110 to be plated, and also prevents defects such as breakage and jamming that are caused by excessive tension on the substrate 110 to be plated, thereby reducing the cost of electroplating the substrate 110 to be plated.

[0043] 1, the tension adjustment mechanism 170 further includes a tension detection roller 171, a second drive source (not shown), and an oscillating roller 172. The tension detection roller 171 detects the surface tension of the substrate 110 to be plated and provides feedback on the surface tension of the substrate 110 to a user interface, allowing the user to timely grasp the tension level of the substrate 110 during its transport. If a defect occurs in the substrate 110, such as the surface tension being too high or too low, the user can manually adjust the surface tension of the substrate 110 to improve the quality of electroplating on the substrate 110. The oscillating roller 172 is connected to a second drive source, which can drive the oscillating roller 172 to oscillate within a set angle range. The oscillating roller 172 is provided with a position sensor (not shown) that detects the oscillating angle of the oscillating roller 172 in real time. If the angle of the oscillating roller 172 detected by the position sensor is deviated, it indicates that the surface tension of the substrate 110 to be plated is too large or too small. The position sensor can timely feed back the detected angle deviation signal of the oscillating roller 172 to the second driving source. The second driving source will automatically adjust the rotation speed to adjust the oscillating angle of the oscillating roller 172, and automatically adjust the tension during the transportation process of the substrate 110 to be plated, thereby ensuring the quality of electroplating of the substrate 110 to be plated and the cost of electroplating.

[0044] To further improve the quality of the electroplating of the substrate 110, in one embodiment, as shown in FIG. 1 , the electroplating system 100 further includes a spraying mechanism (not shown) and a baking mechanism (not shown). The spraying mechanism and the baking mechanism are both located near the take-up mechanism 140 of the plating bath 120, and are sequentially arranged on the transport path of the substrate 110, i.e., the spraying mechanism is located near the plating bath 120, and the baking mechanism is located farther from the plating bath 120. The spraying mechanism is used to clean the surface of the substrate 110 after electroplating, thereby removing residual liquid adhering to the surface of the substrate 110 after electroplating and preventing contamination of the surface of the substrate 110. The baking mechanism is used to dry the substrate 110 after cleaning with the spraying mechanism, thereby ensuring the dryness of the surface of the substrate 110 after electroplating. The spraying mechanism and the baking mechanism can ensure that the surface of the substrate 110 to be plated is clean and dry after being electroplated, and can further improve the quality of the electroplating of the substrate 110 to be plated.

[0045] To deposit a metal plating layer on the surface of the polymer thin film to form the substrate 110 to be plated, in one embodiment, as shown in FIG. 1 , the electroplating system 100 further includes a sputtering device (not shown). The sputtering device is located at the front end of the unwinding mechanism 130 and transports the substrate 110 to the unwinding mechanism 130 for electroplating. The sputtering device includes a vacuum chamber (not shown), a constant-voltage power supply (not shown), a magnetron sputtering source (not shown), and a table (not shown). The magnetron sputtering source has a built-in metal target (not shown). The magnetron sputtering source and the table (not shown) are both located within the vacuum chamber and spaced apart from each other. The polymer thin film can be placed on the table inside the vacuum chamber for sputter coating. The constant-voltage power supply is located within the vacuum chamber and can form an electric field within the vacuum chamber. The vacuum chamber has a gas inlet through which ambient gas can be injected into the vacuum chamber. In this example, argon gas was injected into the vacuum chamber, and incident ions (Ar + ) collide with the magnetron sputtering source due to the action of the electric field, the metal ions on the surface of the metal target built into the magnetron sputtering source gain sufficient kinetic energy to detach from the surface of the metal target and deposit on the surface of the polymer thin film to form a metal plating layer, which covers the surface of the polymer thin film to form the substrate to be plated 110.

[0046] Furthermore, after the metal ions are released from the surface of the metal target, they tend to drift due to the effects of the electric and magnetic fields, resulting in fewer metal ions deposited on the surface of the polymer thin film, resulting in a low sputtering efficiency of the metal ions. To increase the sputtering efficiency of the metal ions on the surface of the polymer thin film, a magnet (not shown) is installed below the magnetron sputtering source to form a magnetic field near the magnetron sputtering source. This causes the metal ions to be confined to the periphery of the metal target by the Lorentz force and continue to move in a circular motion around the metal target, resulting in a larger number of incident ions (Ar +) collides with the metal target, generating more metal ions that are deposited on the surface of the polymer thin film, significantly increasing the sputtering efficiency of the metal ions on the surface of the polymer thin film, and forming a metal plating layer of 50 nm to 100 nm on the surface of the polymer thin film.

[0047] The present application also provides an electroplating production line, as shown in Figure 1. The electroplating production line includes the electroplating system 100 according to any one of the above technical solutions.

[0048] In the above electroplating production line, the substrate 110 to be plated crosses the uniform magnetic field 151, generating an induced current on its surface. This ensures a uniform current density across the entire width of the substrate 110 to be plated, significantly improving the uniformity of the thickness of the metal plating layer deposited on the surface of the substrate 110 to be plated, and does not adversely affect or scratch the metal plating layer deposited on the surface of the substrate 110 to be plated, thereby significantly improving the quality of the electroplating of the substrate 110 to be plated.

[0049] The technical features of the above embodiments can be combined in any way. For the sake of simplicity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered within the scope of the present specification.

[0050] The above embodiments only show some examples of the present application, and the descriptions are specific and detailed, but they should not be understood as limiting the scope of the present invention. It should be noted that a person skilled in the art can make some modifications and improvements without departing from the concept of the present application, and all of these fall within the scope of protection of the present application. Therefore, the scope of protection of the present application should be governed by the appended claims.

Claims

1. 1. An electroplating system for depositing a metal plating layer on a surface of a substrate to be plated, comprising: a plating tank in which a plating solution is stored and in which a plating roller is movably provided; an unwinding mechanism and a winding mechanism located on both sides of the plating tank, respectively; a magnetic field generator provided outside the plating tank and used to generate a uniform magnetic field into the plating tank, the magnetic field being capable of being traversed by the plating roller as it moves; the unwinding mechanism is used to store and transport the substrate to be plated at a constant speed, and is capable of transporting the substrate to the plating roller for electroplating, and the winding mechanism is used to store and wind the substrate to be plated after electroplating; Electroplating system comprising:

2. the magnetic field generator comprises at least one electromagnet; 10. The electroplating system of claim 1.

3. When there is only one electromagnet, it is provided on the outer wall of the plating tank; when there are multiple electromagnets, all of them are provided on the outer wall of the plating tank, and the electromagnets provided on two opposing outer walls of the plating tank have opposite polarities on the sides adjacent to each other.

3. The electroplating system of claim 2.

4. The plating tank further includes a guide rail and a first driving source disposed within the plating tank, wherein the plating roller is movably disposed on the guide rail and is power-transmittedly connected to the first driving source, and crosses the uniform magnetic field when moving on the guide rail.

10. The electroplating system of claim 1.

5. the number of the plating rollers is two, the two plating rollers are spaced apart on a conveying path for the substrate to be plated, the number of the guide rails is also two, and the two guide rails are connected to correspond to the two plating rollers; 5. The electroplating system of claim 4.

6. A conductive wire is connected between the two guide rails, and both ends of the plating roller are conductive, while the intermediate position is insulating.

6. The electroplating system of claim 5.

7. the first drive source is an electric element or an aerodynamic element; 6. The electroplating system of claim 5.

8. the unwinding mechanism includes an unwinding shaft, a first pressure roller, and a first pass roller, which are sequentially provided along a transport path of the substrate to be plated, the unwinding shaft being located farther from the plating tank, and the substrate to be plated being sequentially wound around the unwinding shaft, the first pressure roller, and the first pass roller during the transport process; the winding mechanism includes a second pass roller, a second pressure roller, and a winding shaft, which are sequentially provided along a transport path of the substrate to be plated, the winding shaft being located farther from the plating tank, and the substrate to be plated is sequentially wound around the second pass roller, the second pressure roller, and the winding shaft during the transport process; 10. The electroplating system of claim 1.

9. The plating apparatus further includes two tension adjustment mechanisms, one of which is located between the plating tank and the unwinding mechanism and the other of which is located between the plating tank and the winding mechanism, and the substrate to be plated is wound around the tension adjustment mechanism during the transport process.

10. The electroplating system of claim 1.

10. the tension adjustment mechanism includes a tension detection roller, a second drive source, and an oscillating roller that is power-transmitted and connected to the second drive source, the tension detection roller being capable of detecting the surface tension of the substrate to be plated, and the second drive source being capable of driving the oscillating roller to oscillate within a set angle range; 10. The electroplating system of claim 9.

11. The rocking roller is provided with a position sensor.

11. The electroplating system of claim 10.

12. The plating apparatus further includes a spray mechanism and a baking mechanism, which are sequentially provided along a transport path of the substrate to be plated and both located on the side of the plating tank near the winding mechanism, wherein the spray mechanism is used to clean the surface of the substrate to be plated after electroplating, and the baking mechanism is used to dry the substrate to be plated after being cleaned by the spray mechanism.

10. The electroplating system of claim 1.

13. The apparatus further includes a sputtering device provided at the front end of the unwinding mechanism and including a vacuum chamber, a constant voltage power supply, a magnetron sputtering source, and a table, wherein the magnetron sputtering source and the table are both provided within the vacuum chamber and spaced apart from each other, the substrate to be plated can be placed inside the vacuum chamber and placed on the table, the constant voltage power supply is provided within the vacuum chamber and can form an electric field within the vacuum chamber, and the vacuum chamber has a gas inlet.

10. The electroplating system of claim 1.

14. A magnet is provided below the magnetron sputtering source.

14. The electroplating system of claim 13.

15. An electroplating system according to any one of claims 1 to 14, An electroplating production line characterized by:

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