Relay device

Abstract

To provide a relay device with superior performance. [Solution] The relay device 100 includes a switch assembly 120, a plurality of pins 130, 131, an insulating member, and a magnetic member. The plurality of pins are electrically connected to the switch assembly. The insulating member covers the switch assembly and some of the plurality of pins. The magnetic member is adjacent to the switch assembly and the plurality of pins. The insulating member and the magnetic member are integrally molded colloidal structure 110. The switch assembly includes a switch 121 and a coil 122, both of which are housed within the colloidal structure.

Description

Technical Field

[0001] This invention relates to a relay device.

Background Art

[0002] The performance of a relay device usually depends on the strength of the magnetic force generated from its switch assembly. However, with the evolution of the size of the relay device, increasing the strength of the generated magnetic force and further improving its performance has become an issue.

Summary of the Invention

Problems to be Solved by the Invention

[0003] The performance of a relay device usually depends on the strength of the magnetic force generated from its switch assembly. However, with the evolution of the size of the relay device, increasing the strength of the generated magnetic force and further improving its performance has become an issue.

Means for Solving the Problems

[0004] This invention provides a relay device with better performance.

[0005] The relay device of this invention includes a switch assembly, a plurality of pins, an insulating member, and a magnetic member. The plurality of pins are electrically connected to the switch assembly. The insulating member covers the switch assembly and some of the plurality of pins. The magnetic member is adjacent to the switch assembly and the plurality of pins.

[0006] In one embodiment of this invention, the above-mentioned insulating member and magnetic member have an integrally formed colloidal structure.

[0007] In one embodiment of this invention, the above-mentioned switch assembly includes a switch and a coil, and both the switch and the coil are installed within the colloidal structure.

[0008] In one embodiment of the present invention, the relay device described above further includes a housing. The housing has a chamber surrounding a switch assembly and a portion of a plurality of pins, and a colloidal structure fills the chamber.

[0009] In one embodiment of the present invention, the relay device described above further includes a base. The base has opposing first and second sides. The switch assembly is mounted on the first side. Multiple pins penetrate from the first side to the second side. The magnetic member includes a first magnetic member and a second magnetic member. The first magnetic member is mounted on the first side. The second magnetic member is mounted on the second side.

[0010] In one embodiment of the present invention, the second magnetic member described above is in direct contact with a plurality of pins on the second side.

[0011] In one embodiment of the present invention, the insulating member described above includes a first insulating member and a second insulating member separated by a base. The first insulating member and the first magnetic member are integrally molded colloidal structures. The second insulating member and the second magnetic member are integrally molded colloidal structures.

[0012] In one embodiment of the present invention, there is a connection portion between the switch assembly and the plurality of pins, and the magnetic member covers only the connection portion.

[0013] In one embodiment of the present invention, the insulating member and the magnetic member described above are in a separate structure.

[0014] In one embodiment of the present invention, the magnetic member described above shrinks inward towards the insulating member. [Effects of the Invention]

[0015] As described above, the relay device of this invention achieves the effect of increasing magnetic force by introducing a magnetic member and arranging it in a layered structure between the switch assembly and multiple pins. In this way, the relay device can have superior performance.

[0016] To make the above-mentioned features and advantages of this invention easier to understand, embodiments are described below in detail in conjunction with the attached drawings. [Brief explanation of the drawing]

[0017] [Figure 1] This is a schematic partial top view of a relay device according to several embodiments of the present invention. [Figure 2] Figure 1 is a schematic diagram of the relay device viewed from different angles. [Figure 3] Figure 1 is a schematic diagram of the relay device viewed from different angles. [Figure 4] This is a schematic partial top view of a relay device according to several embodiments of the present invention. [Figure 5] Figure 4 is a schematic diagram of the relay device viewed from different angles. [Figure 6] Figure 4 is a schematic diagram of the relay device viewed from different angles. [Figure 7] This is a schematic partial side view of a relay device according to several embodiments of the present invention.

[0018] To clarify what needs to be explained, Figure 3 is drawn in perspective and the housing from Figure 1 is omitted. Figure 4 omits the second magnetic member from Figure 6. Figure 5 is drawn in perspective and the housing from Figure 4 and the second magnetic member from Figure 6 are omitted. Figure 6 is drawn in cross-sectional view and the first magnetic member from Figure 5 is omitted. [Modes for carrying out the invention]

[0019] Some embodiments of the present invention will be described in detail below in combination with the accompanying drawings. When the following description cites component symbols, the same component symbols in different drawings are regarded as the same or similar components. These embodiments are only a part of the present invention and do not disclose all possible implementation methods of the present invention. More precisely, these embodiments are only examples in the claims for utility model registration of the present invention.

[0020] Unless otherwise defined, all technical terms (including technical and scientific terms) used in this specification have the same meaning as commonly understood by those skilled in the art to which the present invention pertains.

[0021] The term "between ~" used to define a numerical range in this specification is intended to include the described endpoint values and the range between the described endpoint values. For example, when a dimensional range is between a first numerical value and a second numerical value, it means that the dimensional range includes the first numerical value, the second numerical value, and any value between the first numerical value and the second numerical value.

[0022] The relay device of the present invention includes a switch assembly, a plurality of pins, an insulating member, and a magnetic member. Here, the plurality of pins are electrically connected to the switch assembly, the insulating member covers the switch assembly and some of the plurality of pins, and the magnetic member is adjacent to the switch assembly and the plurality of pins. Thereby, the relay device of the present invention introduces a magnetic member and achieves the effect of enhancing the magnetic force through the arrangement relationship of the laminated structure between it and the switch assembly and the plurality of pins. In this way, the relay device can have better performance. Also, based on the factor that the magnetic force is effectively enhanced, the size of the relay device can also conform to the trend of miniaturization, so it has excellent product competitiveness.

[0023] The relay device described above may be a reed relay device that needs to be controlled by magnetic force, a mechanical relay device, or something similar thereto, and specific embodiments of the relay device described above will be described below by different embodiments. However, the present invention is not limited thereto, and depending on the actual requirements, the technical means relating to the arrangement of the magnetic members, switch assemblies, and laminated structures between multiple pins described herein may be used in combination with each other or applied to other types of relay devices.

[0024] Referring to Figures 1 to 3, the insulating member and magnetic member of the relay device 100 in this embodiment are integrally molded colloidal structures 110 (having magnetism). Here, the magnetic force direction of the switch assembly 120 is horizontal, and the relay device 100 is joined to appropriate external elements (not shown) via pins 130 in the vertical direction. Further explanation is provided that the colloidal structure 110 can be formed by stirring and mixing magnetic powder and insulating adhesive, and then coating the switch assembly 120 and some of the pins 130 with the mixture. In this way, the colloidal structure 110 can simultaneously possess the dielectric strength of the insulating member and the internal magnetic collection effect of the magnetic member, thereby significantly improving the performance of the relay device 100. Here, the magnetic powder is, for example, an oxide material of a magnetic metal, such as iron oxide, cobalt oxide, manganese zinc oxide (Mn-Zn), nickel zinc oxide (Ni-Zn), or similar, and the insulating adhesive is, for example, epoxy resin, AB adhesive, liquid silicone rubber, or similar. The switch assembly 120 also includes a switch 121 and a coil 122 (e.g., a coil set), and the pin 130 has a first pin 131 electrically connected to the switch 121 and a second pin 132 electrically connected to the coil 122.

[0025] In this embodiment, the weight ratio of magnetic powder to the colloidal structure 110 is in the range of 20 wt% to 70 wt%, which allows for a better balance between dielectric strength and internal magnetic collection capability, but the present invention is not limited thereto.

[0026] In some embodiments, the particle size range of the magnetic powder is 5 μm to 50 μm, which can result in better dispersibility, but the present invention is not limited to this.

[0027] In some embodiments, the thickness of the colloidal structure 110 is greater than the height of the switch assembly 120, so that the switches 121 and coils 122 of the switch assembly 120 are both located within the colloidal structure 110, while some of the pins 130 are also located within the colloidal structure 110; however, the present invention is not limited thereto.

[0028] In this embodiment, the relay device 100 further includes a housing 140, where the housing 140 has a chamber surrounding the switch assembly 120 and some pins 130, and the colloidal structure 110 fills the chamber (for example, by casting), but the invention is not limited thereto. Here, in order to reduce the probability of adversely affecting the magnetic field of the relay device 100, the housing 140 may be any suitable plastic housing.

[0029] In embodiments not shown, a diode or similar may optionally be further included between the coil 122 and the second pin 132.

[0030] It should be noted that the following embodiments will utilize the same or similar reference numerals and some of the details of the embodiments described above. Here, the same or similar reference numerals will be used to represent the same or similar components, and the same technical details will be omitted. Since the omitted parts can be explained by referring to the embodiments described above, they will not be repeated in the following embodiments.

[0031] Referring to Figures 4 to 6, compared to the relay device 100 described above, the relay device 200 of this embodiment includes a first colloidal structure 211 in which a first magnetic member and a first insulating member are integrally molded, a second colloidal structure 212 in which a second magnetic member and a second insulating member are integrally molded, a switch assembly 220 having a switch 221 and a coil 222, a pin 230, a housing 240, and a base 250. Furthermore, the magnetic force direction of the switch assembly 220 is perpendicular, and the first colloidal structure 211 and the second colloidal structure 212 are separated by the base 250. Here, the first colloidal structure 211 and the second colloidal structure 212 are similar to the colloidal structure 110, that is, both the first colloidal structure 211 and the second colloidal structure 212 are composed of magnetic powder and insulating adhesive similar to the colloidal structure 110, and a corresponding ratio of particle size range, etc., but these will not be described in detail here.

[0032] To further explain, the first colloidal structure 211 and the switch assembly 220 are mounted on the first side 251 of the base 250, the housing 240 has a chamber surrounding the switch assembly 220 and some of the pins 230, and the first colloidal structure 211 fills the chamber. In this way, the first colloidal structure 211 can simultaneously provide dielectric strength and internal magnetic collection effect, thereby significantly improving the performance of the relay device 200.

[0033] On the other hand, the second colloidal structure 212 is installed on the second side 252 of the base 250, opposite the first side 251, and the multiple pins 230 penetrate from the first side 251 to the second side 252. Furthermore, the second colloidal structure 212, composed of the second magnetic material, directly contacts the pins 230 arranged on the second side 252 to connect to external elements. As a result, the second colloidal structure 212, composed of the second magnetic material, can guide the magnetic force back from the second side 252 to the switch assembly 220 on the first side 251, and does not continuously interfere with signals on the external elements below (e.g., a circuit board or similar). Therefore, through the design of the second colloidal structure 212 composed of the second magnetic material, wiring can still be laid on the external elements located below the relay device 200. In this way, the flexibility of the design layout and space utilization on the external elements can be improved.

[0034] It should be explained that, in the above explanation, the first colloidal structure 211 and the second colloidal structure 212 exist simultaneously. However, depending on the actual design requirements, the presence of either the first colloidal structure 211 or the second colloidal structure 212 is considered to fall within the scope of protection of this invention.

[0035] Referring to Figure 7, compared to the relay device 100 described above, the relay device 300 of this embodiment includes a magnetic member 311, an insulating member 312, a switch assembly 320 having a switch 321 and a coil 322, a plurality of pins 330, and a housing 340. Here, there is a connection portion between the switch 321 and the plurality of pins 330 of the switch assembly 320. Here, the magnetic member 311 covers only the connection portion. On the other hand, the insulating member 312 and the magnetic member 311 are separate structures, and the magnetic member 311 contracts inward into the insulating member 312, so in this embodiment, the magnetic member 311 can be designed only on the two sides of the switch assembly 320. In this way, the internal magnetic collection effect can still be achieved.

[0036] In this embodiment, the magnetic member 311 is formed by stirring and mixing magnetic powder and colloid and then applying it to the connection portion. Since the magnetic member 311 is installed only locally, the magnetic powder can occupy a larger weight ratio in the magnetic member 311 compared to the colloidal structures 110, 211, and 212. For example, the weight ratio of magnetic powder in the magnetic member 311 is in the range of 20 wt% to 70 wt%. On the other hand, since the insulating member 312 exists independently, the colloid in the magnetic member 311 may be an insulating adhesive or a non-insulating adhesive, depending on the actual design requirements. Here, the magnetic powder is similar to the colloidal structures 110, 211, and 212, for example, the magnetic powder is an oxide material of a magnetic metal, such as iron oxide, cobalt oxide, or something similar.

[0037] As described above, the relay device of this invention achieves the effect of increasing magnetic force by introducing a magnetic member and arranging it in a layered structure between the switch assembly and multiple pins. In this way, the relay device can have superior performance.

[0038] Although the present invention has been disclosed by the embodiments described above, these are not intended to limit the present invention, and any person with ordinary skill in the art may make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be defined by the attached utility model claims. [Industrial applicability]

[0039] Relay devices can be applied to the field of relay equipment. [Explanation of Symbols]

[0040] 100, 200, 300 relay device 110, 211, 212 colloidal structures 120, 220, 320 switch assemblies 121, 221, 321 switches 122, 222, 322 coils 130, 131, 132, 230, 330 pins 140, 240, 340 cabinets 250 base 251 1st side 252 2nd side 311 Magnetic material 312 Insulating material

Claims

1. Switch assembly and Multiple pins electrically connected to the switch assembly, An insulating member covering the switch assembly and some of the plurality of pins, The switch assembly and the magnetic members adjacent to the plurality of pins, A relay device including a relay device.

2. The relay device according to claim 1, wherein the insulating member and the magnetic member are integrally molded colloidal structures.

3. The relay device according to claim 2, wherein the switch assembly includes a switch and a coil, and both the switch and the coil are installed within the colloidal structure.

4. The relay device according to claim 2, further comprising a housing, wherein the housing has a chamber surrounding the switch assembly and some of the plurality of pins, and the colloidal structure fills the chamber.

5. Including the base, The base has a first side and a second side facing each other, The switch assembly is installed on the first side, The plurality of pins penetrate from the first side to the second side, The magnetic member includes a first magnetic member and a second magnetic member, The first magnetic member is installed on the first side, The relay device according to claim 1, wherein the second magnetic member is installed on the second side.

6. The relay device according to claim 5, wherein the second magnetic member is in direct contact with the plurality of pins on the second side.

7. The relay device according to claim 5, wherein the insulating member includes a first insulating member and a second insulating member separated by the base, the first insulating member and the first magnetic member are integrally molded colloidal structures, and the second insulating member and the second magnetic member are integrally molded colloidal structures.

8. The relay device according to claim 1, wherein there is a connection portion between the switch assembly and the plurality of pins, and the magnetic member covers only the connection portion.

9. The relay device according to claim 8, wherein the insulating member and the magnetic member are in a separated structure.

10. The relay device according to claim 8, wherein the magnetic member is contracted inward towards the insulating member.

Images