Secondary injection molded rubber coated IC tray
The secondary injection-molded rubber-coated IC tray addresses the lack of effective buffer mechanisms in conventional trays by integrating a soft rubber portion with the base through secondary molding, forming a three-dimensional cushioning network that enhances bonding strength and prevents damage to precision components during transportation.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Utility models
- Current Assignee / Owner
- Z S TECH CO LTD
- Filing Date
- 2026-03-05
- Publication Date
- 2026-05-07
AI Technical Summary
Conventional electronic component trays lack effective buffer mechanisms to prevent damage from vibrations and impacts during transportation, leading to issues like solder joint breakage and component detachment, particularly in precision devices, due to insufficient bonding strength, single dimension of vibration damping, and low functional integration.
A secondary injection-molded rubber-coated IC tray with a soft rubber portion integrated into the receiving base through secondary injection molding, featuring corner cushioning assemblies, partitioned storage compartments, misinsertion prevention grooves, and stress-relieving structures, forming a three-dimensional cushioning network and molecular-level fusion for enhanced bonding.
The integrated structure effectively absorbs impact energy, prevents solder joint breakage and component detachment, ensures optimal positioning, and improves bending resistance while reducing debris generation and material costs.
Smart Images
Figure 0003255744000001_ABST
Abstract
Description
Technical Field
[0004] , ,
[0001] This invention relates to the technical field of electronic component packaging equipment, and specifically relates to a secondary injection molded rubber-coated IC tray.
Background Art
[0002] As electronic components develop in the direction of miniaturization and high integration, the requirements for the protection performance in the transportation, storage, and assembly processes of precision electronic components are becoming increasingly strict. Most conventional electronic component trays are integrally injection molded with hard plastic, and the groove structure is used to realize the fixing and receiving of components. However, such trays do not have an effective buffer mechanism for situations such as vibration during transportation and accidental dropping, so they are likely to cause breakage of the soldering parts of the components and deformation of the leads. In particular, in the field of precision devices such as 5G communication modules and microsensors, potential damage caused by impact is one of the main causes of the reduction in the product yield rate. In the industry, there is a strong demand for the development of a new protective carrier that combines structural strength and dynamic buffer performance.
[0003] Existing improvement solutions mainly focus on two directions: material composite and structure optimization. One of them is to add independent rubber pads on the hard receiving base and realize local buffering by the bonding process. However, there is a risk of interface peeling due to the deterioration of the adhesive. The other is to adopt a honeycomb-shaped vibration damping structure and provide a hollow lattice inside the receiving base to disperse the impact force. However, the bending rigidity of the entire tray decreases by more than 40%. The above solutions generally have drawbacks such as insufficient bonding strength between the buffer unit and the substrate, single vibration damping dimension, and low functional integration, making it difficult to meet the protection requirements in all situations of precision electronic components.
Summary of the Invention
Problems to be Solved by the Invention
[0004] Therefore, the purpose of this application is to solve the technical problems in the prior art, such as insufficient bonding strength between the buffer unit and the substrate, a single dimension of vibration damping, and low integration of functions. [Means for solving the problem]
[0005] The above technical objectives of this invention can be achieved by the following technical solutions.
[0006] The secondary injection-molded rubber-coated IC tray includes a receiving base, and further includes a soft rubber portion and a housing portion, the housing portion being formed by a recess in the top surface of the receiving base, the soft rubber portion being fixed within the housing portion by secondary injection molding, and is used to receive electronic products.
[0007] Preferably, the soft rubber portion includes four sets of corner cushioning assemblies, each set of cushioning assemblies includes two mutually perpendicular strip-shaped pad layers, and each pad layer is provided with a restricting projection on its outer circumference that adheres tightly to it.
[0008] Preferably, a partition is provided on the receiving base, and the receiving base is divided into different storage compartments by the partition, each of which is used to receive one electronic product.
[0009] Preferably, a recess for stress relief is provided at the end of the partition portion.
[0010] Preferably, a groove to prevent misinsertion is provided on the side wall of the housing portion, and this groove is located on one side in the longitudinal direction of the housing portion, with its opening direction aligned with the direction in which the electronic product is mounted.
[0011] Preferably, side lugs are provided at both ends in the longitudinal direction of the receiving base, and a label area is provided on the surface of the side lugs.
[0012] Preferably, a plurality of through grooves are provided within the housing, and the arrangement of the through grooves is either circumferential or array-like. [Effects of the Invention]
[0013] Compared to prior art, this application offers the following beneficial effects.
[0014] The secondary injection molding process integrates the soft rubber portion and the receiving base into a single structure, creating molecular-level fusion at the bonding interface between the soft rubber portion and the receiving base, significantly improving the bonding strength.
[0015] The strip-shaped pad layers and limiting protrusions of the soft rubber section work together to form an elastic support system in three dimensions. The horizontal pad layers can absorb lateral impact energy, the vertical limiting protrusions can suppress displacement of the electronic product, and the soft rubber assemblies provided at the corners form a three-dimensional cushioning network. This structure reduces the impact acceleration received by the bottom of the electronic product, effectively preventing solder joint breakage and component detachment of precision electronic components caused by vibrations during transportation. Combined with the directional guidance function of the misinsertion prevention groove, it ensures that the electronic product is always positioned in the optimal protective position, and combined with the lightweight design of the through groove and the stress-relieving structure of the recess, it improves the overall bending resistance of the product.
[0016] Furthermore, the design of the soft rubber section reduces the risk of debris being generated due to contact and friction between electronic components and the tray. [Brief explanation of the drawing]
[0017] [Figure 1] This is a schematic diagram of the overall structure of the secondary injection-molded rubber-coated IC tray of the present invention. [Figure 2] This is a schematic cross-sectional view of the secondary injection-molded rubber-coated IC tray of the present invention. [Modes for carrying out the invention]
[0018] The present invention will be described in more detail below with reference to the attached drawings and embodiments.
[0019] Referring to Figure 1, the secondary injection-molded rubber-coated IC tray includes a receiving base 1 and a soft rubber portion 2, the soft rubber portion 2 forming an integrated structure with the receiving base 1 by the secondary injection molding process and fixed above the receiving base 1, and used to receive electronic products. Due to the elastic cushioning properties of the soft rubber portion 2, it effectively absorbs the impact energy received by the bottom of the electronic product, preventing damage to electronic components due to vibration or dropping. In one embodiment, the receiving base is made of a hard plastic material and the soft rubber portion is made of TPE or TPU material, and in other embodiments, the soft rubber portion may be made of rubber or other soft rubber material.
[0020] Referring to Figure 1, a concave storage section 11 is formed on the receiving base 1 and is used to restrict the placement of electronic products. In one embodiment, a partition section 12 is provided in the center of the receiving base 1, dividing the storage section 11 into two symmetrically arranged independent receiving areas, allowing the tray to stably support two electronic products simultaneously and improving space utilization. Multiple through grooves 111 are provided within the storage section 11, optimizing the material distribution of the receiving base 1, thereby reducing the overall weight while ensuring structural strength, and lowering material costs and transportation energy consumption.
[0021] Referring to Figure 2, there are two embodiments for the arrangement of the through grooves 111. Embodiment 1 is a circumferential arrangement, in which the through grooves 111 are distributed at equal intervals along the inner wall of the housing section 11, forming a continuous lightweight structure. Embodiment 2 is an array arrangement, in which the outermost layer of through grooves 111 maintains equal spacing with the inner wall of the housing section 11, ensuring the structural integrity of the edge of the receiving base 1. Both arrangements achieve a balance between weight reduction and structural rigidity through a rational groove design.
[0022] A U-shaped anti-misinsertion groove 112 is provided on the side wall of the accommodating part 11, and its opening direction is aligned with the specific structure of the electronic product, guiding the only correct placement direction of the electronic product through physical restrictions and completely preventing misoperations such as reverse insertion. A recess 13 is provided at the end of the partition part 12, releasing the internal stress of the receiving base 1 through a local structure weakening design and preventing bending and deformation of the receiving base 1 caused by external pressure or temperature changes. Side lugs 14 are provided at both ends of the receiving base 1. The outer extension structure of the side lugs 14 facilitates manual gripping and mechanical clamping and positioning. The label area provided on its surface supports the display of product information, realizing the operation traceability and parameter warning functions.
[0023] Referring to FIG. 1, the soft rubber part 2 is provided in the receiving area between the inner wall of the accommodating part 11 and the through groove 111 and includes four sets of buffer assemblies provided at the corners. Each set of buffer assemblies includes two strip-shaped pad layers 21 perpendicular to each other, and multiple sets of buffer assemblies cooperate to form a three-dimensional protection network. In one embodiment, as shown in FIG. 1, the pad layers 21 of the same set are not continuous, and the pad layers 21 of adjacent sets are also provided at intervals. In another embodiment, the pad layers 21 of the same set are provided continuously, and the pad layers 21 of adjacent sets are provided at intervals.
[0024] In other embodiments, the pad layers 21 of the same set are provided at intervals, and the pad layers 21 on the adjacent side are provided continuously. Further, all the pad layers 21 may be provided continuously.
[0025] <0000%95>The soft rubber part 2 is further provided with limiting protrusions 22, which wrap around the edge of the electronic product together with the pad layer 21 to prevent displacement and collision during the transportation process.
[0026] In this application, the soft rubber part 2 and the receiving base 1 are integrated into a single structure by a secondary injection molding process, creating molecular-level fusion at the bonding interface between the soft rubber part 2 and the receiving base 1, significantly improving the bonding strength. The strip-shaped pad layer 21 and limiting protrusions 22 of the soft rubber part 2 work together to form an elastic support system in three dimensions. The horizontal pad layer 21 can absorb lateral impact energy, the vertical limiting protrusions 22 can suppress displacement of the electronic product, and the soft rubber assemblies provided at the corners form a three-dimensional cushioning network. This structure reduces the impact acceleration received by the bottom of the electronic product, effectively preventing solder joint breakage and component detachment of precision electronic components due to vibrations during transportation. Combined with the directional guidance function of the misinsertion prevention groove 112, it is ensured that the electronic product is always positioned in the optimal protective position, and combined with the lightweight design by the through groove 111 and the stress-relieving structure of the recess 13, it improves the overall bending resistance of the product. Furthermore, the design of the soft rubber part 2 reduces the risk of abrasion debris due to contact and friction between electronic components and the tray. Referring to Figure 1, the secondary injection-molded rubber-coated IC tray includes a receiving base 1 and a soft rubber portion 2. The soft rubber portion 2 is integrated with the receiving base 1 by the secondary injection molding process and is fixed above the receiving base 1, and is used to receive electronic products. Due to the elastic cushioning properties of the soft rubber portion 2, it effectively absorbs the impact energy received by the bottom of the electronic product, preventing damage to electronic components due to vibration or dropping.
[0027] Referring to Figure 1, a concave storage section 11 is formed on the receiving base 1 and is used solely for restricting electronic products. In one embodiment, a partition section 12 is provided in the center of the receiving base 1, dividing the storage section 11 into two symmetrically arranged independent receiving areas, allowing the tray to stably support two electronic products simultaneously and improving space utilization. Multiple through grooves 111 are provided within the storage section 11, optimizing the material distribution of the receiving base 1, thereby reducing overall weight while ensuring structural strength, and lowering material costs and transportation energy consumption.
[0028] Referring to Figure 1, there are two embodiments for the arrangement of the through grooves 111. Embodiment 1 is a circumferential arrangement, in which the through grooves 111 are distributed at equal intervals along the inner wall of the housing section 11, forming a continuous lightweight structure. Embodiment 2 is an array arrangement, in which the outermost layer of through grooves 111 and the inner wall of the housing section 11 maintain equal intervals, ensuring the structural integrity of the edge of the receiving base 1. Both arrangements achieve a balance between weight reduction and structural rigidity through a rational groove design.
[0029] A U-shaped misinsertion prevention groove 112 is provided on the side wall of the housing section 11, and its opening direction is aligned with the specific structure of the electronic product, guiding the electronic product to the only correct placement direction through physical constraints and completely preventing misoperation such as reverse insertion. A recess 13 is provided at the end of the partition section 12, releasing internal stress on the receiving base 1 through a localized structural weakening design, and preventing bending and deformation of the receiving base 1 due to external pressure or temperature changes.
[0030] Side lugs 14 are provided at both ends of the receiving base 1. The external structure of the side lugs 14 facilitates manual gripping and mechanical clamping and positioning, and the label area provided on its surface supports the display of product information, enabling operation traceability and parameter warning functions.
[0031] Referring to Figures 1 and 2, the soft rubber portion 2 is provided in the receiving area between the inner wall of the housing portion 11 and the through groove 111, and includes four sets of cushioning assemblies provided at the corners. Each set of cushioning assemblies includes two strip-shaped pad layers 21 perpendicular to each other, and multiple sets of cushioning assemblies cooperate to form a three-dimensional protective network. In one embodiment, as shown in Figure 1, the pad layers 21 of the same set are not continuous, and adjacent sets of pad layers 21 are spaced apart. In another embodiment, the pad layers 21 of the same set are continuous, and adjacent sets of pad layers 21 are spaced apart.
[0032] In other embodiments, the same set of pad layers 21 are provided with gaps between them, while adjacent pad layers 21 are provided continuously. Furthermore, all of the pad layers 21 may be provided continuously.
[0033] The soft rubber portion 2 is further provided with restricting protrusions 22, which, together with the pad layer 21, enclose the edges of the electronic product to prevent shifting or collision during transportation.
[0034] In this application, the soft rubber portion 2 and the receiving base 1 are integrated into a single structure by a secondary injection molding process, creating molecular-level fusion at the bonding interface between the soft rubber portion 2 and the receiving base 1, significantly improving the bonding strength. The strip-shaped pad layer 21 and limiting protrusions 22 of the soft rubber portion 2 work together to form an elastic support system in three dimensions. The horizontal pad layer 21 can absorb lateral impact energy, the vertical limiting protrusions 22 can suppress displacement of the electronic product, and the soft rubber assemblies provided at the corners form a three-dimensional cushioning network. This structure reduces the impact acceleration received by the bottom of the electronic product, effectively preventing solder joint breakage and component detachment of precision electronic components caused by vibrations during transportation. Combined with the directional guidance function of the misinsertion prevention groove 112, it ensures that the electronic product is always positioned in the optimal protective posture, and combined with the lightweight design of the through groove 111 and the stress-relieving structure of the recess 13, it improves the overall bending resistance of the product. Furthermore, the design of the soft rubber section 2 reduces the risk of debris being generated due to contact and friction between electronic components and the tray. [Explanation of symbols]
[0035] 1. Based on receipt 11. Storage Unit 111 Through groove 112 Misinsertion prevention groove 12 Partition section 13 recess 14 side lugs 2. Soft rubber part 21 pad layers 22 Restrictive projection
Claims
1. A secondary injection molded rubber-coated IC tray including a receiving base, It further includes a soft rubber part and multiple housing parts, The aforementioned receiving section is formed by a recess on the top surface of the receiving base, and the soft rubber portion is fixed inside the receiving section by secondary injection molding, and is used to receive electronic products, characterized in that it is a secondary injection molded rubber-coated IC tray.
2. The secondary injection molded rubber coated IC tray according to claim 1, characterized in that the soft rubber portion includes four sets of corner cushioning assemblies, each set of cushioning assemblies includes two strip-shaped pad layers perpendicular to each other, and each pad layer is provided with a limiting projection on its outer circumference that adheres tightly to the pad layers.
3. The secondary injection-molded rubber-coated IC tray according to claim 1, characterized in that a partition is provided on the receiving base, the receiving base is divided into different storage sections by the partition, and each storage section is used to receive one electronic product.
4. The secondary injection molded rubber coated IC tray according to claim 3, characterized in that a recess for stress relief is provided at the end of the partition portion.
5. The secondary injection molded rubber coated IC tray according to claim 1, characterized in that a misinsertion prevention groove is provided on the side wall of the housing portion, the misinsertion prevention groove is located on one side in the longitudinal direction of the housing portion, and its opening direction is aligned with the mounting direction of the electronic product.
6. The secondary injection molded rubber coated IC tray according to claim 1, characterized in that side lugs are provided at both ends in the longitudinal direction of the receiving base, a label area is provided on the surface of the side lugs, and the label area is a planar area formed by recessing the surface of the side lugs.
7. The secondary injection-molded rubber-coated IC tray according to claim 1, characterized in that a plurality of through grooves are provided within the housing portion, and the arrangement of the through grooves is either a circumferential arrangement or an array arrangement.