Multilayer Capacitor

Abstract

To provide a multilayer capacitor capable of securing a high degree of freedom in mounting while having a small size and high capacitance.SOLUTION: A multilayer capacitor includes: a body including a first internal electrode layer including first and second internal electrodes spaced apart from each other with an insulating portion interposed therebetween and a second internal electrode layer including a third internal electrode, the first and second internal electrode layers being alternately disposed with respective dielectric layers interposed therebetween; first and second external electrodes disposed on the body to be connected to the first and second internal electrodes, respectively; a connection electrode penetrating through the body to be connected to the third internal electrode; and a third external electrode disposed on the body to be connected to the connection electrode. A spacing distance between the first and second internal electrodes is greater than the rest around the connection electrode.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to a multilayer capacitor. [Background technology]

[0002] Among ceramic electronic components, multi-layer ceramic capacitors (MLCCs) have the advantages of being small in size, guaranteed to have high capacitance, and being easy to mount.

[0003] Multilayer ceramic capacitors are chip-type capacitors that are mounted on circuit boards of various electronic products such as visual devices such as liquid crystal displays (LCDs) and plasma display panels (PDPs), computers, personal digital assistants (PDAs), and mobile phones, and play an important role in charging and discharging electricity.

[0004] Multilayer ceramic capacitors come in a variety of sizes and lamination configurations depending on the application and capacity to be used.

[0005] In particular, in accordance with the recent trend of electronic products becoming smaller, lighter and more multifunctional, multilayer ceramic capacitors used in the electronic products are also required to be smaller, have higher capacitance and be capable of boosting voltage.

[0006] Therefore, multilayer ceramic capacitors are being manufactured in which the thicknesses of the dielectric layers and internal electrode layers are reduced in order to miniaturize the product, and as many dielectric layers as possible are laminated in order to achieve ultra-high capacitance.

[0007] However, while capacitors are becoming increasingly miniaturized, the reality is that the mounting technology required to mount such miniaturized capacitors is not yet in place, making it difficult to apply them to actual products. [Prior art documents] [Patent documents]

[0008] [Patent Document 1] JP 2008-118078 A Summary of the Invention [Problem to be solved by the invention]

[0009] An object of the present invention is to provide a multilayer capacitor which can ensure high flexibility in mounting while meeting the trend towards smaller capacitor sizes and higher capacitances. [Means for solving the problem]

[0010] According to one aspect of the present invention, there is provided a semiconductor device comprising: a first internal electrode layer including first and second internal electrodes spaced apart from each other with an insulating portion therebetween; and a second internal electrode layer including a third internal electrode, the first and second internal electrode layers being alternately arranged with a dielectric layer therebetween; and first and second external electrodes arranged on the body so as to be connected to the first and second internal electrodes, respectively. The present invention provides a multilayer capacitor including: a connecting electrode penetrating the body and connected to the third internal electrode; and a third external electrode disposed on the body so as to be connected to the connecting electrode, wherein a distance between the first and second internal electrodes is greater around the connecting electrode than in other portions.

[0011] Another aspect of the present invention provides a multilayer capacitor including: a first internal electrode layer including first and second internal electrodes spaced apart from each other with an insulating portion therebetween; a second internal electrode layer including a third internal electrode; and a third internal electrode layer including a fourth internal electrode, the first to third internal electrode layers being alternately arranged with a dielectric layer therebetween; a first external electrode arranged on the body to be connected to the first and fourth internal electrodes; a second external electrode arranged on the body to be connected to the second internal electrode; a connecting electrode penetrating the body and connected to the third internal electrode; and a third external electrode arranged on the body to be connected to the connecting electrode, the fourth internal electrode being stacked to partially overlap the first and third internal electrodes but not to overlap the second internal electrode, and a distance between the first and second internal electrodes is greater around the connecting electrode than in other areas.

[0012] According to yet another aspect of the present invention, there is provided a multilayer capacitor including: a first internal electrode layer including first and second internal electrodes spaced apart from each other with a first insulating portion therebetween; a second internal electrode layer including a third internal electrode; and a third internal electrode layer including a dummy electrode and a fourth internal electrode arranged opposite each other with a second insulating portion therebetween, the first to third internal electrode layers being alternately arranged with a dielectric layer therebetween; a first external electrode arranged on the body to be connected to the first internal electrode; a second external electrode arranged on the body to be connected to the second and fourth internal electrodes; a connecting electrode penetrating the body and connected to the third internal electrode; and a third external electrode arranged on the body to be connected to the connecting electrode, wherein the dummy electrode is only insulated from the first to third external electrodes, and a distance between the first and second internal electrodes is greater around the connecting electrode than around other parts. Effect of the Invention

[0013] According to one embodiment of the present invention, by providing a stacked capacitor having the same effect as two capacitors connected together, it is possible to solve the problem that mounting becomes difficult as the capacitor becomes smaller, and it is possible to minimize the mounting area and reduce the number of mounting processes.

[0014] In addition, by controlling the shape and position of the internal electrodes, it is possible to obtain the same effect as when two capacitors with different capacitances are connected, thereby improving the degree of freedom in design. [Brief description of the drawings]

[0015] [Figure 1] 1 is a perspective view illustrating a multilayer capacitor according to an embodiment of the present invention; [Diagram 2] 2 is a cross-sectional view taken along line II' in FIG. [Figure 3a] 3 is a diagram showing a ceramic sheet for forming the first internal electrode layer of FIG. 2. FIG. [Figure 3b] 3 is a diagram showing a ceramic sheet for forming the second internal electrode layer of FIG. 2. FIG. [Figure 3c] 3A to 3C are diagrams illustrating a stacking process for manufacturing the stacked capacitor of FIG. 2. [Figure 4] 2 is a cross-sectional view taken along line II' of a multilayer capacitor according to another embodiment of the present invention; [Figure 5a] 5 is a diagram showing a ceramic sheet for forming the first internal electrode layer of FIG. 4. FIG. [Figure 5b] 5 is a diagram showing a ceramic sheet for forming the second internal electrode layer of FIG. 4. FIG. [Figure 5c] 5A to 5C are diagrams illustrating a stacking process for manufacturing the stacked capacitor of FIG. [Figure 6] 11 is a cross-sectional view taken along line II' of a multilayer capacitor according to still another embodiment of the present invention. [Figure 7a] FIG. 7 is a diagram showing a ceramic sheet for forming the first internal electrode layer of FIG. 6. [Figure 7b] 7 is a diagram showing a ceramic sheet for forming the second internal electrode layer of FIG. 6. FIG. [Figure 7c] 7A to 7C are diagrams illustrating a stacking process for manufacturing the stacked capacitor of FIG. 6. [Figure 8] 2 is a cross-sectional view taken along line II' of a multilayer capacitor according to still another aspect of the present invention; [Figure 9a] 9 is a diagram showing a ceramic sheet for forming the first internal electrode layer of FIG. 8. FIG. [Figure 9b] 9 is a diagram showing a ceramic sheet for forming the second internal electrode layer of FIG. 8. FIG. [Figure 9c] 9 is a diagram showing a ceramic sheet for forming the third internal electrode layer of FIG. 8. FIG. [Figure 9d] 9A to 9C are diagrams illustrating a stacking process for manufacturing the stacked capacitor of FIG. 8. [Figure 10] 2 is a cross-sectional view taken along line II' of a multilayer capacitor according to still another aspect of the present invention; [Figure 11a] 11 is a diagram showing a ceramic sheet for forming the first internal electrode layer of FIG. 10. FIG. [Figure 11b] 11 is a diagram showing a ceramic sheet for forming the second internal electrode layer of FIG. 10. FIG. [Figure 11c] 11 is a diagram showing a ceramic sheet for forming the third internal electrode layer of FIG. 10. FIG. [Figure 11d] 11A to 11C are diagrams illustrating a stacking process for manufacturing the stacked capacitor of FIG. [Figure 12] 1 is a basic circuit diagram of a multilayer capacitor according to an embodiment of the present invention; [Figure 13] 1 shows a circuit in which a multilayer capacitor according to an embodiment of the present invention is configured to have the same effect as two capacitors connected in parallel. [Figure 14] 1 shows a circuit in which a multilayer capacitor according to an embodiment of the present invention is configured to have the same effect as two capacitors connected in series. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0016] Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. However, the embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Furthermore, the embodiments of the present invention are provided to more completely explain the present invention to those having average knowledge in the art. Therefore, the shapes and sizes of elements in the drawings may be enlarged or reduced (or highlighted or simplified) for clearer explanation, and elements indicated by the same reference numerals in the drawings are the same elements.

[0017] In order to clearly explain the present invention, the drawings omit parts that are not relevant to the description, exaggerate the thickness to clearly show various layers and regions, and use the same reference numerals to refer to components that have the same function within the same concept. Furthermore, throughout the specification, the term "comprises" a certain component does not mean to exclude other components, but means that the other components can be further included, unless otherwise specified to the contrary.

[0018] In the drawings, the X direction can be defined as the first direction or length direction, the Y direction can be defined as the second direction or width direction, and the Z direction can be defined as the third direction, thickness direction or stacking direction.

[0019] FIG. 1 is a schematic perspective view of a multilayer capacitor according to one embodiment of the present invention, FIG. 2 is a cross-sectional view taken along line I-I' in FIG. 1, FIG. 3a is a diagram showing a ceramic sheet for forming a first internal electrode layer in FIG. 2, FIG. 3b is a diagram showing a ceramic sheet for forming a second internal electrode layer in FIG. 2, and FIG. 3c is a diagram showing a stacking process for manufacturing the multilayer capacitor of FIG. 2.

[0020] 1 and 2, a multilayer capacitor 100 according to an embodiment of the present invention includes a body 110 and first to third external electrodes 141, 142, and 143.

[0021] The body 110 may include an active area that contributes to forming the capacitance of the capacitor, and upper and lower covers 112 that are formed on the upper and lower parts of the active area as upper and lower margins, respectively.

[0022] In one embodiment of the present invention, the body 110 is not particularly limited in shape, but may be substantially hexahedral.

[0023] That is, the body 110 may have a shape that is substantially close to a hexahedron, although it is not a perfect hexahedron, due to thickness differences resulting from the arrangement of the internal electrodes and grinding of the ends.

[0024] In order to clearly explain the embodiments of the present invention, the directions of the hexahedron are defined as follows: in the main body 110, both surfaces facing each other in the Z direction are defined as the first surface 1 and the second surface 1, 2; both surfaces connected to the first surface 1 and the second surface 1, 2 and facing each other in the X direction are defined as the third surface 3 and the fourth surface 3, 4; and both surfaces connected to the first surface 1 and the second surface 1, 2, connected to the third surface 3 and the fourth surface 3, 4 and facing each other in the Y direction are defined as the fifth surface 5 and the sixth surface 6. In this case, the first surface 1 can be a mounting surface.

[0025] Referring to FIG. 3c, the active region may have a structure in which a plurality of dielectric layers 111 are sandwiched between a plurality of first internal electrode layers 120 and second internal electrode layers 130, which are alternately stacked.

[0026] The active region may include a first active region in which the first internal electrode 121 and the third internal electrode 131 overlap to form a capacitance, and a second active region in which the second internal electrode 122 and the third internal electrode 131 overlap to form a capacitance. This provides the same effect as two capacitors being connected, and therefore simplifies the mounting process and reduces the mounting area. In addition, as described below, the capacitance of the first active region and the capacitance of the second active region can be designed to be different, which has the advantage of realizing a wider variety of capacitances.

[0027] The dielectric layer 111 is made of a ceramic powder having a high dielectric constant, such as barium titanate (BaTiO 3 ) system or strontium titanate (SrTiO 3 ) type powders, but the present invention is not limited thereto.

[0028] In this case, the thickness of the dielectric layer 111 can be arbitrarily changed in accordance with the capacitance design of the multilayer ceramic capacitor 100, and can be configured so that the thickness of one layer after firing is 0.1 to 10 μm, taking into consideration the size and capacitance of the body 110, but the present invention is not limited to this.

[0029] The first internal electrode layer 120 includes first and second internal electrodes 121, 122 disposed opposite each other with an insulating portion 123 interposed therebetween.

[0030] 3a, the first and second internal electrodes 121 and 122 may be formed by printing a conductive paste containing a conductive metal on the dielectric layer 111 to a predetermined thickness. The first internal electrode 121 may be exposed to a third surface 3 of the body 110, and the second internal electrode 122 may be exposed to a fourth surface 4 of the body 110. In addition, the first internal electrode 121 and the second internal electrode 122 may be electrically insulated from each other by an insulating part 123 disposed in between. That is, the first internal electrode 121 may be exposed to one of both surfaces in the length direction (X direction) of the body 110, and the second internal electrode 122 may be exposed to the other surface opposite to the surface where the first internal electrode 121 is exposed.

[0031] The first and second internal electrodes 121 and 122 are electrically connected to first and second external electrodes 141 and 142, respectively, formed on the main body.

[0032] The second internal electrode layer 130 includes a third internal electrode 131. The second internal electrode layer 130 may include a space 132 separated from the third and fourth surfaces 3, 4 to insulate the third internal electrode 131 from the first and second external electrodes 141, 142.

[0033] 3b, the third internal electrode 131 may be formed by printing a conductive paste including a conductive metal on the dielectric layer 111 to a predetermined thickness, and may be formed so as not to be exposed to the outside of the body 110. That is, the third internal electrode 131 may be formed to be spaced apart from the third, fourth, fifth, and sixth surfaces of the body 110 by a predetermined distance.

[0034] The third internal electrode 131 is electrically connected to a third external electrode 143 formed on the body 110 via a connecting electrode 151 .

[0035] The thickness of the first to third internal electrodes 121, 122, 131 may be determined according to the application, for example, in the range of 0.2 to 1.0 μm taking into consideration the size and capacity of the ceramic body 110, but the present invention is not limited thereto.

[0036] Furthermore, the conductive metal contained in the first to third internal electrodes 121, 122, 131 may be nickel (Ni), copper (Cu), palladium (Pd), or an alloy thereof, but the present invention is not limited to this.

[0037] The top and bottom covers 112 may have the same material and composition as the dielectric layer 111 of the active region, except that they do not include internal electrodes.

[0038] In other words, the upper and lower covers 112 can be regarded as being formed by stacking a single dielectric layer or two or more dielectric layers in the Z direction on the upper and lower surfaces of the active region, respectively, and can basically serve to prevent damage to the first to third internal electrodes 121, 122, 131 due to physical or chemical stress.

[0039] The first and second external electrodes 141, 142 are disposed on the body 110 so as to be connected to the first and second internal electrodes 121, 122, respectively. Conventional multilayer capacitors are intended to reduce equivalent series inductance (ESL) and have a configuration in which the first and second external electrodes are electrically connected via internal electrodes. In contrast, in the multilayer capacitor of the present invention, the first and second internal electrodes 121, 122 are insulated by the insulating part 123, so that the first and second external electrodes 141, 142 can be used without being electrically connected, which is advantageous in that it can be used in various ways.

[0040] The first and second external electrodes 141 and 142 may be disposed opposite each other on both sides of the body 110 in the length direction (X direction).

[0041] The connecting electrode 151 penetrates the body 110 and is connected to the third internal electrode 131 .

[0042] Referring to the position 151a where the connecting electrode is formed as shown in Figures 3a to 3c, the connecting electrode 151 may be formed to penetrate the insulating portion 123 and the third internal electrode 131 and be spaced apart from the first and second internal electrodes 121 and 122.

[0043] In this case, a plurality of connection electrodes 151 may be formed to penetrate the body 110 in the thickness direction (Z direction).

[0044] Furthermore, although the shape of the connecting electrode 151 is illustrated as being circular, it may be rectangular or triangular, and the shape is not limited to this.

[0045] Also, the connecting electrode 151 may be formed to occupy 10 to 65% of the width direction (Y direction) of the main body 110, but is not limited thereto.

[0046] The connecting electrode 151 may be formed by forming a via in the body 110 and then filling the via with a conductive material. In order to form the via, a physical penetration method using a mechanical pin puncher or a laser drill may be used. However, if the body 110 is too thick, using a laser drill may cause damage around the via, weakening the electrode connectivity, and therefore it is preferable to use the physical penetration method.

[0047] The third external electrode 143 is disposed on the body 110 to be connected to the connecting electrode 151. The third external electrode 143 may be electrically connected to the third internal electrode 131 by being connected to the connecting electrode 151 connected to the third internal electrode 131.

[0048] The third external electrode 143 may be disposed on at least one of both surfaces 1 and 2 in the thickness direction (Z direction) of the body 110, and may be formed on both surfaces 1 and 2 as shown in FIG.

[0049] In addition, the third external electrode 143 may be formed to surround the surface of the body 110 excluding both surfaces 3 and 4 in the length direction (X direction) of the body 110 and may be formed spaced apart from the first and second external electrodes 141 and 142 .

[0050] In this case, the first to third external electrodes 141, 142, and 143 may be insulated from each other. However, it should be noted that this does not exclude the case where they are connected to each other by applying them to a circuit.

[0051] The multilayer capacitor of the present invention can realize capacitors having various capacitances depending on what electrodes or terminals the first to third external electrodes are designed to be.

[0052] 12 is a basic circuit diagram of a three-terminal multilayer capacitor according to an embodiment of the present invention. As described above, the active region may include a first active region in which a capacitance is formed by overlapping the first internal electrode 121 and the third internal electrode 131, and a second active region in which a capacitance is formed by overlapping the second internal electrode 122 and the third internal electrode 131, and the same effect as when a capacitor having a capacitance C1 formed by the first active region and a capacitor having a capacitance C2 formed by the second active region are connected to each other is obtained.

[0053] Referring to FIG. 12, the second external electrode 142 is made floating, and the first external electrode 141 is set as an input terminal, and the third external electrode 143 is set as an output terminal, thereby realizing a capacitor having a capacitance C1.

[0054] Furthermore, by floating the first external electrode 141 and setting the second external electrode 142 as an input terminal and the third external electrode 143 as an output terminal, a capacitor having a capacitance C2 can be realized.

[0055] FIG. 13 shows a circuit in which a multilayer capacitor according to an embodiment of the present invention is configured to have the same effect as two capacitors connected in parallel, and FIG. 14 shows a circuit in which a multilayer capacitor according to an embodiment of the present invention is configured to have the same effect as two capacitors connected in series.

[0056] As shown in FIG. 13, when the first and second external electrodes 141, 142 are set as GND (ground) terminals and the third external electrode 143 is set as a signal terminal, two capacitors having capacitances C1 and C2 are connected in parallel, thereby realizing a capacitor with a total capacitance of C1+C2.

[0057] Furthermore, as shown in FIG. 14, when the third external electrode is floated and the first external electrode 141 is set as an input terminal and the second external electrode 142 is set as an output terminal, two capacitors having capacitances C1 and C2 are connected in series to realize a capacitor with a total capacitance of C1×C2 / (C1+C2).

[0058] Furthermore, as will be shown in various embodiments described later, it is possible to obtain the same effect as when two capacitors with different capacitances are connected, thereby further improving the degree of freedom in design.

[0059] FIG. 4 is a cross-sectional view taken along line II' of a multilayer capacitor according to another embodiment of the present invention, FIG. 5a is a diagram showing a ceramic sheet for forming a first internal electrode layer of FIG. 4, FIG. 5b is a diagram showing a ceramic sheet for forming a second internal electrode layer of FIG. 4, and FIG. 5c is a diagram showing a lamination process for manufacturing the multilayer capacitor of FIG. 4.

[0060] 4 and 5a to 5c, in a multilayer capacitor 200 according to another embodiment of the present invention, the overlapping area between the first internal electrode 221 and the third internal electrode 231 may be different from the overlapping area between the second internal electrode 222 and the third internal electrode 231.

[0061] As shown in FIG. 5a, by making the area of ​​the first internal electrode 221 and the area of ​​the second internal electrode 222 different, the overlapping area between the first internal electrode 221 and the third internal electrode 231 and the overlapping area between the second internal electrode 222 and the third internal electrode 231 can be controlled according to the desired capacitance, thereby achieving the same effect as connecting two capacitors with different capacitances.

[0062] Referring to the position 251a where the connecting electrode is formed as shown in Figures 5a to 5c, the connecting electrode 251 may be formed to penetrate the insulating portion 223 and the third internal electrode 231 and be spaced apart from the first and second internal electrodes 221 and 222.

[0063] In addition, since the area of ​​the first internal electrode 221 is different from the area of ​​the second internal electrode 222, the connecting electrode 251 can be formed at a position biased toward the third surface 3 or the fourth surface 4. As a result, the third external electrode 243 connected to the connecting electrode 251 can also be formed at a position biased toward the third surface 3 or the fourth surface 4.

[0064] FIG. 6 is a cross-sectional view along line I-I' of a multilayer capacitor 300 according to another embodiment of the present invention, FIG. 7a is a diagram showing a ceramic sheet for forming a first internal electrode layer of FIG. 6, FIG. 7b is a diagram showing a ceramic sheet for forming a second internal electrode layer of FIG. 6, and FIG. 7c is a diagram showing a lamination process for manufacturing the multilayer capacitor of FIG. 6.

[0065] 6 and 7a to 7c, a distance L1 between the third internal electrode 331 and the first external electrode 341 may be different from a distance L2 between the third internal electrode 331 and the second external electrode 342.

[0066] That is, the second internal electrode layer 330 may include spaces 332, 332' spaced apart from the third and fourth surfaces so that the third internal electrode 331 is insulated from the first and second external electrodes 341, 342. Also, the sizes of the spaces 332, 332' may be different from each other.

[0067] This makes it possible to control the overlapping area between the first internal electrode 321 and the third internal electrode 331, and the overlapping area between the second internal electrode 322 and the third internal electrode 331, in accordance with a desired capacitance.

[0068] According to yet another aspect of the present invention, a multilayer capacitor 400 includes a first internal electrode layer including first and second internal electrodes arranged opposite to each other with an insulating portion therebetween, a second internal electrode layer including a third internal electrode, and a third internal electrode layer including a fourth internal electrode, the first to third internal electrode layers being alternately arranged with a dielectric layer therebetween, a first external electrode arranged on the body to be connected to the first and fourth internal electrodes, a second external electrode arranged on the body to be connected to the second internal electrode, a connecting electrode penetrating the body and connected to the third internal electrode, and a third external electrode arranged on the body to be connected to the connecting electrode, the fourth internal electrode being stacked to partially overlap the first and third internal electrodes and not to overlap the second internal electrode.

[0069] FIG. 8 is a cross-sectional view taken along line I-I' of a multilayer capacitor 400 according to another aspect of the present invention, FIG. 9a is a diagram showing a ceramic sheet for forming a first internal electrode layer of FIG. 8, FIG. 9b is a diagram showing a ceramic sheet for forming a second internal electrode layer of FIG. 8, FIG. 9c is a diagram showing a ceramic sheet for forming a third internal electrode layer of FIG. 8, and FIG. 9d is a diagram showing a lamination process for manufacturing the multilayer capacitor of FIG. 8.

[0070] Referring to FIG. 8, the first external electrode 441 is arranged to be connected to the first and fourth internal electrodes 421 and 421 ′, and the second external electrode 442 is arranged to be connected to the second internal electrode 422 .

[0071] The connecting electrode 451 penetrates the body 410 and is connected to the third internal electrode 431, and the third external electrode 443 is arranged to be connected to the connecting electrode 451, so that the third internal electrode 431 and the third external electrode 443 are electrically connected.

[0072] Referring to FIG. 9a, the first internal electrode layer 420 includes first and second internal electrodes 421 and 422 disposed opposite each other with an insulating portion 423 interposed therebetween.

[0073] 9b, the second internal electrode layer 430 of the multilayer capacitor 400 according to another aspect of the present invention may have the same components as the second internal electrode layer 130 according to the above-described embodiment of the present invention, and may also have the same components as the second internal electrode layer 330 according to another embodiment of the present invention.

[0074] 9c, the third internal electrode layer 420' includes a fourth internal electrode 421'. The fourth internal electrode 421' is laminated so as to overlap the first and third internal electrodes 421 and 431, but not to overlap the second internal electrode 422. That is, the third internal electrode layer 421' is the same as the first internal electrode layer 420 except that the second internal electrode 422 is removed. This provides the same effect as when two capacitors having different capacitances are connected.

[0075] According to yet another aspect of the present invention, a multilayer capacitor 500 includes a first internal electrode layer including first and second internal electrodes arranged opposite to each other with a first insulating portion therebetween, a second internal electrode layer including a third internal electrode, and a third internal electrode layer including a dummy electrode and a fourth internal electrode arranged opposite to each other with a second insulating portion therebetween, the first to third internal electrode layers being alternately arranged with a dielectric layer therebetween, a first external electrode arranged on the body to be connected to the first internal electrode, a second external electrode arranged on the body to be connected to the second and fourth internal electrodes, a connecting electrode penetrating the body and connected to the third internal electrode, and a third external electrode arranged on the body to be connected to the connecting electrode, the dummy electrode being insulated from the first to third external electrodes.

[0076] 10 is a cross-sectional view along line I-I' of a multilayer capacitor 500 according to another aspect of the present invention, FIG. 11a is a diagram showing a ceramic sheet for forming the first internal electrode layer of FIG. 10, FIG. 11b is a diagram showing a ceramic sheet for forming the second internal electrode layer of FIG. 10, FIG. 11c is a diagram showing a ceramic sheet for forming the third internal electrode layer of FIG. 10, and FIG. 11d is a diagram showing a stacking process for manufacturing the multilayer capacitor of FIG. 10.

[0077] 10, the first external electrode 541 is arranged to be connected to the first internal electrode 521, and the second external electrode 542 is arranged to be connected to the second and fourth internal electrodes 522, 522'.

[0078] The connecting electrode 551 penetrates the body 510 and is connected to the third internal electrode 531, and the third external electrode 543 is arranged to be connected to the connecting electrode 551, so that the third internal electrode 531 and the third external electrode 543 are electrically connected to each other.

[0079] 11a, the first internal electrode layer 520 includes first and second internal electrodes 521 and 522 arranged opposite to each other with a first insulating portion 523 interposed therebetween.

[0080] 11b, the second internal electrode layer 530 of the multilayer capacitor 500 according to another aspect of the present invention may have the same components as the second internal electrode layer 130 according to the above-described embodiment of the present invention, and may also have the same components as the second internal electrode layer 330 according to another embodiment of the present invention.

[0081] 11c, the third internal electrode layer 520' includes a dummy electrode 521' and a fourth internal electrode 522' disposed opposite to each other with a second insulating portion 523' therebetween. The dummy electrode 521' is insulated from the first to third external electrodes 541, 542, and 543. Unlike the first internal electrode 521 of the first internal electrode layer 520, a space 524' separated from the third surface is formed, so that the dummy electrode 521' can be insulated from the first external electrode 541.

[0082] Since the dummy electrode 521' is insulated from the first to third external electrodes 541, 542, and 543 and does not contribute to capacitance formation, the multilayer capacitor 500 according to another aspect of the present invention can achieve the same effect as two capacitors having different capacitances being connected together.

[0083] In addition, when the capacitance is controlled by forming regions 422' where no internal electrodes are formed, as in multilayer capacitor 400 according to another aspect of the present invention, as the number of layers increases, a problem of stacking defects due to the thickness of the internal electrodes may occur. In contrast, when the capacitance is controlled by forming dummy electrodes 521', the problem of stacking defects due to the thickness of the internal electrodes can be eliminated.

[0084] Although the embodiments of the present invention have been described in detail above, it will be apparent to those skilled in the art that the scope of the present invention is not limited thereto, and that various modifications and variations are possible within the scope of the technical idea of ​​the present invention described in the claims. (Other possible items) (Item 1) a main body including a first internal electrode layer including first and second internal electrodes spaced apart from each other with an insulating portion therebetween, and a second internal electrode layer including a third internal electrode, the first internal electrode layer and the second internal electrode layer being alternately arranged with a dielectric layer therebetween; first and second external electrodes disposed on the body so as to be connected to the first and second internal electrodes, respectively; a connection electrode penetrating the body and connected to the third internal electrode; a third external electrode disposed on the body so as to be connected to the connecting electrode. (Item 2) 2. The multilayer capacitor according to item 1, wherein the first external electrode to the third external electrode are not connected to each other. (Item 3) 3. The multilayer capacitor according to item 1 or 2, wherein an overlapping area between the first internal electrode and the third internal electrode is different from an overlapping area between the second internal electrode and the third internal electrode. (Item 4) 4. The multilayer capacitor according to any one of items 1 to 3, wherein an area of ​​the first internal electrode is different from an area of ​​the second internal electrode. (Item 5) 5. The multilayer capacitor according to claim 1, wherein a distance between the third internal electrode and the first external electrode is different from a distance between the third internal electrode and the second external electrode. (Item 6) 6. The multilayer capacitor according to claim 1, wherein the connecting electrode penetrates the insulating portion and the third internal electrode and is spaced apart from the first and second internal electrodes. (Item 7) 7. The multilayer capacitor according to claim 1, wherein the connecting electrode is formed in a plurality of pieces and penetrates the body in a thickness direction. (Item 8) 8. The multilayer capacitor according to claim 1, wherein the third external electrode is disposed on at least one of both surfaces of the body in a thickness direction. (Item 9) 9. The multilayer capacitor according to claim 1, wherein the first and second external electrodes are disposed on both sides of the body in a longitudinal direction thereof so as to face each other. (Item 10) 10. The multilayer capacitor according to item 9, wherein the third external electrode is formed to surround a surface of the body excluding both surfaces in a longitudinal direction thereof and is spaced apart from the first and second external electrodes. (Item 11) a main body including a first internal electrode layer including first and second internal electrodes spaced apart from each other with an insulating portion therebetween, a second internal electrode layer including a third internal electrode, and a third internal electrode layer including a fourth internal electrode, the first internal electrode layer to the third internal electrode layer being alternately arranged with a dielectric layer therebetween; a first external electrode disposed on the body so as to be connected to the first internal electrode and the fourth internal electrode; a second external electrode disposed on the body so as to be connected to the second internal electrode; a connection electrode penetrating the body and connected to the third internal electrode; a third external electrode disposed on the body so as to be connected to the connecting electrode; the fourth internal electrode is laminated so as to partially overlap the first internal electrode and the third internal electrode, and is laminated so as not to overlap the second internal electrode. (Item 12) a main body including a first internal electrode layer including first and second internal electrodes arranged opposite to each other with a first insulating section therebetween, a second internal electrode layer including a third internal electrode, and a third internal electrode layer including a dummy electrode and a fourth internal electrode arranged opposite to each other with the second insulating section therebetween, the first internal electrode layer to the third internal electrode layer being alternately arranged with a dielectric layer therebetween; a first external electrode disposed on the body so as to be connected to the first internal electrode; a second external electrode disposed on the body so as to be connected to the second internal electrode and the fourth internal electrode; a connection electrode penetrating the body and connected to the third internal electrode; a third external electrode disposed on the body so as to be connected to the connecting electrode; the dummy electrode is insulated from the first external electrode to the third external electrode, in the multilayer capacitor. (Item 13) Item 13. The multilayer capacitor according to item 12, wherein the first external electrode to the third external electrode are insulated from each other. (Item 14) Item 14. The multilayer capacitor according to item 12 or 13, wherein the connecting electrode penetrates the first insulating portion, the second insulating portion, and the third internal electrode, and is formed apart from the first internal electrode, the second internal electrode, the fourth internal electrode, and a dummy electrode. (Item 15) Item 15. The multilayer capacitor according to any one of items 12 to 14, wherein the connecting electrode is formed in a plurality of pieces and penetrates the body in a thickness direction. (Item 16) Item 16. The multilayer capacitor according to any one of items 12 to 15, wherein the third external electrode is disposed on at least one of both surfaces of the body in a thickness direction. (Item 17) Item 17. The multilayer capacitor according to any one of items 12 to 16, wherein the first external electrode and the second external electrode are disposed opposite to each other in a longitudinal direction of the body. (Item 18) Item 18. The multilayer capacitor according to item 17, wherein the third external electrode is formed to surround a surface of the body excluding both surfaces in a longitudinal direction thereof and is formed spaced apart from the first external electrode and the second external electrode. [Explanation of symbols]

[0085] 100 Stacked Capacitor 110 Main unit 111 Dielectric layer 112 Cover 120 1st internal electrode layer 121 1st internal electrode 122 2nd internal electrode 123 Insulation 131 3rd internal electrode 151 Connecting electrode 141 1st external electrode 142 2nd external electrode 143 Third external electrode

Claims

1. a main body including a first internal electrode layer including first and second internal electrodes spaced apart from each other with an insulating portion therebetween, and a second internal electrode layer including a third internal electrode, the first and second internal electrode layers being alternately arranged with a dielectric layer therebetween; first and second external electrodes disposed on the body so as to be connected to the first and second internal electrodes, respectively; a connection electrode penetrating the body and connected to the third internal electrode; a third external electrode disposed on the body so as to be connected to the connecting electrode; A multilayer capacitor, wherein a distance between the first and second internal electrodes is greater around the periphery of the connecting electrode than in other portions.

2. The multilayer capacitor according to claim 1 , wherein the first to third external electrodes are not connected to each other.

3. 3. The multilayer capacitor according to claim 1, wherein an overlapping area between the first internal electrode and the third internal electrode is different from an overlapping area between the second internal electrode and the third internal electrode.

4. The multilayer capacitor according to claim 1 , wherein an area of ​​the first internal electrode is different from an area of ​​the second internal electrode.

5. 5 . The multilayer capacitor according to claim 1 , wherein a distance between the third internal electrode and the first external electrode is different from a distance between the third internal electrode and the second external electrode.

6. The multilayer capacitor of claim 1 , wherein the connecting electrode penetrates the insulating portion and the third internal electrode and is spaced apart from the first and second internal electrodes.

7. The multilayer capacitor of claim 1 , wherein the connecting electrode is formed in a plurality of portions and penetrates the body in a thickness direction.

8. The multilayer capacitor according to claim 1 , wherein the third external electrode is disposed on at least one of both surfaces of the body in a thickness direction.

9. The multilayer capacitor according to claim 1 , wherein the first and second external electrodes are disposed on opposite sides of the body in a longitudinal direction thereof, the first and second external electrodes being opposed to each other.

10. 10. The multilayer capacitor of claim 9, wherein the third external electrode is formed to surround a surface of the body excluding both surfaces in a longitudinal direction of the body and is spaced apart from the first and second external electrodes.

11. a main body including a first internal electrode layer including first and second internal electrodes spaced apart from each other with an insulating portion therebetween, a second internal electrode layer including a third internal electrode, and a third internal electrode layer including a fourth internal electrode, the first to third internal electrode layers being alternately arranged with a dielectric layer therebetween; a first external electrode disposed on the body so as to be connected to the first and fourth internal electrodes; a second external electrode disposed on the body so as to be connected to the second internal electrode; a connection electrode penetrating the body and connected to the third internal electrode; a third external electrode disposed on the body so as to be connected to the connecting electrode; The fourth internal electrode is laminated so as to partially overlap the first and third internal electrodes, and is laminated so as not to overlap the second internal electrode, A multilayer capacitor, wherein a distance between the first and second internal electrodes is greater around the periphery of the connecting electrode than in other portions.

12. a main body including a first internal electrode layer including first and second internal electrodes spaced apart from each other with a first insulating portion therebetween, a second internal electrode layer including a third internal electrode, and a third internal electrode layer including a dummy electrode and a fourth internal electrode opposed to each other with the second insulating portion therebetween, the first to third internal electrode layers being alternately arranged with a dielectric layer therebetween; a first external electrode disposed on the body so as to be connected to the first internal electrode; a second external electrode disposed on the body so as to be connected to the second and fourth internal electrodes; a connection electrode penetrating the body and connected to the third internal electrode; a third external electrode disposed on the body so as to be connected to the connecting electrode; The dummy electrode is insulated from the first to third external electrodes, A multilayer capacitor, wherein a distance between the first and second internal electrodes is greater around the periphery of the connecting electrode than in other portions.

13. The multilayer capacitor according to claim 12 , wherein the first to third external electrodes are insulated from each other.

14. 14. The multilayer capacitor according to claim 12, wherein the connecting electrode penetrates the first insulating portion, the second insulating portion and the third internal electrode, and is spaced apart from the first internal electrode, the second internal electrode, the fourth internal electrode and the dummy electrode.

15. The multilayer capacitor of claim 12 , wherein the connecting electrode is formed in a plurality of portions and penetrates the body in a thickness direction.

16. The multilayer capacitor of claim 12 , wherein the third external electrode is disposed on at least one of both surfaces of the body in a thickness direction.

17. The multilayer capacitor according to claim 12 , wherein the first and second external electrodes are disposed on both sides of the body in a longitudinal direction thereof, the first and second external electrodes being opposed to each other.

18. 18. The multilayer capacitor of claim 17, wherein the third external electrode is formed to surround a surface of the body excluding both surfaces in a longitudinal direction of the body and is spaced apart from the first and second external electrodes.

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