Semiconductor packages and electrical sockets

Abstract

To obtain semiconductor packages and power sockets that can suppress lead terminal bending and power socket wear.SOLUTION: A semiconductor element 1 is mounted on the top surface of a stem 2. A plurality of lead terminals 3 penetrates the stem 2 and is electrically connected to the semiconductor element 1. The tips of the plurality of lead terminals 3 drawn from the bottom surface of the stem 2 are spherical.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present disclosure relates to a semiconductor package and a current-carrying socket. [Background technology]

[0002] In a semiconductor package such as a CAN package, multiple lead terminals are extended from the bottom surface of the stem. When measuring the electrical characteristics of a semiconductor package, the multiple lead terminals of the semiconductor package are inserted into a current-carrying socket (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 08-313586 Summary of the Invention [Problem to be solved by the invention]

[0004] The tip of the lead terminal is flattened when it is cut to the desired length. Therefore, when the tip of the lead terminal comes into contact with the tapered guide portion or flat portion of the socket, a load is applied to the lead terminal, causing it to bend. The guide portion of the socket also wears out.

[0005] The present disclosure has been made to solve the problems described above, and its purpose is to obtain a semiconductor package and a current-carrying socket that can suppress bending of lead terminals and wear of the current-carrying socket. [Means for solving the problem]

[0006] The semiconductor package according to the present disclosure includes a stem, a semiconductor element mounted on an upper surface of the stem, and a plurality of lead terminals that penetrate the stem and are electrically connected to the semiconductor element, and the tips of the plurality of lead terminals that are drawn out from the lower surface of the stem are spherical.The tips of the lead terminals are made of spherical glass. It is characterized by: Effect of the Invention

[0007] In the present disclosure, the tip of the lead terminal drawn out from the stem is spherical. This makes it difficult for the tip of the lead terminal to get caught in the guide portion of the socket when the lead terminal is inserted into the socket. This reduces the load on the lead terminal and prevents the lead terminal from bending. In addition, the contact area between the tip of the lead terminal and the guide portion is reduced, which also prevents wear on the guide portion of the socket. [Brief description of the drawings]

[0008] [Figure 1] 1 is a side view showing a semiconductor package according to a first embodiment. [Diagram 2] 1 is a cross-sectional view showing an electrical socket according to a first embodiment. [Diagram 3] 4 is a cross-sectional view showing the relationship between the lead diameter of a semiconductor package and the opening diameter of a sleeve of a current-carrying socket. FIG. [Figure 4] 1 is a side view showing a method for measuring electrical characteristics of a semiconductor package. [Diagram 5] 1 is a bottom view showing a method for measuring electrical characteristics of a semiconductor package. [Figure 6] 1 is a side view showing a method for measuring electrical characteristics of a semiconductor package. [Figure 7] FIG. 11 is a side view showing a semiconductor package according to a second embodiment. [Figure 8] FIG. 11 is a top view showing an electric socket according to a third embodiment. [Figure 9] FIG. 9 is a cross-sectional view taken along line I-II of FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] A semiconductor package and a current-carrying socket according to an embodiment will be described with reference to the drawings. The same or corresponding components are designated by the same reference numerals, and repeated description may be omitted.

[0010] Embodiment 1 FIG. 1 is a side view showing a semiconductor package according to a first embodiment. This semiconductor package is a CAN package. A semiconductor element 1, such as a laser diode, is mounted on the upper surface of a metallic stem 2. A plurality of lead terminals 3 penetrate the stem 2 and are fixed to the stem 2 by sealing glass. The semiconductor element 1 is connected to the lead terminals 3 by wires or the like. A cap 5 with a lens 4 is joined to the upper surface of the stem 2 so as to cover the semiconductor element 1.

[0011] A spherical glass 6 is provided at the tip of the lead terminal 3 drawn out from the underside of the stem 2. The method for processing the glass 6 into a spherical shape is not particularly limited, and for example, cutting or a mold may be used. Also, as long as the tip of the lead terminal 3 is processed into a spherical shape, the tip of the lead terminal 3 itself may be processed into a spherical shape. The method for processing the lead terminal 3 into a spherical shape is not particularly limited, and for example, cutting or pressing may be used, or the corners of the tip may be removed by chamfering.

[0012] FIG. 2 is a cross-sectional view showing the current-carrying socket according to the first embodiment. The socket body 7 is made of an insulating material. A plurality of sleeves 8 are provided on the socket body 7. The sleeves 8 are cylindrical metal objects. A measuring device (not shown) for measuring electrical characteristics of the semiconductor package is electrically connected to the sleeves 8. On the upper surface of the socket body 7, tapered guide portions 9 are provided around the insertion openings of the plurality of sleeves 8. That is, on the upper surface of the socket body 7, the insertion openings of the sleeves 8 are located at the bottoms of the guide portions 9 which are recessed in a mortar shape. On the upper surface of the socket body 7, flat portions 10 are provided between adjacent guide portions 9.

[0013] When measuring the electrical characteristics of a semiconductor package, multiple lead terminals 3 of the semiconductor package are inserted into sleeves 8 of a socket for current supply. FIG. 3 is a cross-sectional view showing the relationship between the lead diameter of the semiconductor package and the opening diameter of the sleeve of the socket for current supply. In order to insert each lead terminal 3 into the sleeve 8 and make electrical contact, the diameter D of the lead terminal 3 is L and the opening diameter D of sleeve 8 S There is not much clearance between the two. Therefore, the alignment is performed as described below.

[0014] Figures 4 and 6 are side views showing a method for measuring the electrical characteristics of a semiconductor package. Figure 5 is a bottom view showing a method for measuring the electrical characteristics of a semiconductor package. The positions of the tips of the multiple lead terminals 3 vary due to the curvature of the lead terminals 3, and do not match the position of the sleeve 8 of the current-carrying socket as is. Therefore, as shown in Figures 4 and 5, lead correction comb teeth 11, 12 with countersunk holes at intervals between the multiple lead terminals 3 are inserted into the base parts of the lead terminals 3 from the left and right directions.

[0015] 6, the lead straightening comb teeth 11, 12 are moved to the tip of the lead terminal 3. This makes it possible to suppress the spread of the multiple lead terminals 3. In this state, the multiple lead terminals 3 are inserted into the sleeve 8 of the current-carrying socket.

[0016] By narrowing the intervals A, B, C, and D between the lead straightening comb teeth 11 and 12, it is possible to suppress variation in the position of the lead terminal 3 and make it easier to insert it into the sleeve 8. However, if the intervals between the lead straightening comb teeth 11 and 12 and the lead terminal 3 are reduced, there is a high possibility that the lead straightening comb teeth 11 and 12 will come into contact with the lead terminal 3 when inserted into the base of the stem 2. If the lead straightening comb teeth 11 and 12 come into contact, the lead terminal 3 will be scraped off, resulting in a defective product. Therefore, there is a limit to the lead straightening using the lead straightening comb teeth 11 and 12. To compensate for this, a guide portion 9 is provided on the upper surface of the socket body 7.

[0017] Conventionally, the tip of the lead terminal 3 was flattened. Therefore, the corner of the tip of the lead terminal 3 was caught on the guide portion 9 or the flat portion 10. Therefore, the lead terminal 3 was bent under load. In contrast, in the present embodiment, the tip of the lead terminal 3 drawn out from the stem 2 is spherical. This makes it difficult for the tip of the lead terminal 3 to be caught on the guide portion 9 and the flat portion 10 of the socket for current application when the lead terminal 3 is inserted into the socket for current application. Therefore, the load on the lead terminal 3 can be reduced, and the lead terminal 3 can be prevented from bending. In addition, the contact area between the tip of the lead terminal 3 and the guide portion 9 is reduced, so that the wear of the guide portion 9 of the socket for current application can also be suppressed. As a result, damage to the socket for current application can be prevented.

[0018] Furthermore, if resin is provided at the tip of the lead terminal 3, debris is likely to be generated due to friction. Therefore, it is preferable that the tip of the lead terminal 3 is made of glass 6 having a spherical surface.

[0019] Embodiment 2 FIG. 7 is a side view showing a semiconductor package according to a second embodiment. In this embodiment, the tips of the multiple lead terminals 3 drawn out from the lower surface of the stem 2 are cut at an angle. This makes it possible to reduce the contact area between the tips of the multiple lead terminals 3 and the guide portion 9 of the power socket. This reduces the load on the lead terminals 3 and makes it possible to prevent the lead terminals 3 from bending. In addition, wear on the guide portion 9 of the power socket can also be suppressed. As a result, damage to the power socket can be prevented. The other configurations and effects are the same as those of the first embodiment.

[0020] Embodiment 3 Fig. 8 is a top view showing an energization socket according to embodiment 3. Fig. 9 is a cross-sectional view taken along line I-II in Fig. 8. A plurality of sleeves 8 are provided on a socket body 7. A plurality of lead terminals 3 of a semiconductor package are inserted into the plurality of sleeves 8, respectively. On the top surface of the socket body 7, tapered guide portions 9 are provided around the insertion openings of the plurality of sleeves 8, respectively.

[0021] In this embodiment, no flat portion 10 is provided between adjacent guide portions 9 on the upper surface of the socket body 7. This allows the area of ​​the guide portion 9 to be expanded, making it easier for the lead terminal 3 to come into contact with the guide portion 9 and be guided into the sleeve 8. This reduces the load on the lead terminal 3 and prevents the lead terminal 3 from bending. In addition, wear of the guide portion 9 of the current-carrying socket can be suppressed. As a result, damage to the current-carrying socket can be prevented. The other configurations and effects are the same as those of the first or second embodiment. The tip of the lead terminal 3 of the semiconductor package may be flat. [Explanation of symbols]

[0022] 1 semiconductor element, 2 stem, 3 lead terminal, 6 glass, 7 socket body, 8 sleeve, 9 guide portion, 10 flat portion

Claims

[Claim 1] Stem and a semiconductor element mounted on an upper surface of the stem; a plurality of lead terminals passing through the stem and electrically connected to the semiconductor element; the tips of the lead terminals drawn out from the lower surface of the stem are spherical; A semiconductor package, wherein the tips of the plurality of lead terminals are made of spherical glass.

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