Electrical connection structure of one-section or multi-section intelligent dimming film

Through the electrical connection structure between the FPC soft circuit board and the dimming film, the U-shaped long groove and breathable hole are designed, which solves the short circuit and circuit breaking problems of the connection parts of the dimming film, and achieves stable electrical conduction.

CN223093142UActive Publication Date: 2025-07-11GERMAN FEIYI AUTOMOTIVE ELECTRIC CO LTD +1
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Patent Information

Application Number
CN202422064040.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-08-23
Publication Date
2025-07-11
Estimated Expiration
2034-08-23

AI Technical Summary

Technical Problem

The existing dimming film is prone to short circuits and breakages at the connection parts of the external control device and the dimming film, and the existing ACF lamination process is instability.

Method used

The FPC soft circuit board is used to connect to the dimming film, and the U-shaped long groove and breathable hole are designed, and the conductive adhesive film layer is used for electrical conduction to increase the stability and reliability of the connection.

Benefits of technology

It effectively avoids the risks of short circuit and circuit breaking of the dimming film, improves the reliability and stability of electrical connections, and reduces the risk of poor conduction.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides an electrical connection structure of one or more sections of intelligent dimming films. The electrical connection structure specifically comprises a dimming film body, a flexible circuit board and a control unit. Wherein U-shaped long grooves are designed between independent circuits of the flexible circuit board, and air holes are formed in the conductive adhesive film layer connecting the dimming film body and the flexible circuit board. According to the design of the electrical conduction structure part of the dimming film, the ACF conductive adhesive lamination is used for replacing the solder paste welding technology, the risk of circuit pseudo soldering is avoided, special design is carried out on the FPC and the ACF conductive adhesive, the operation stability of the dimming film is improved, and the risks of short circuit and open circuit which are easily generated by circuit connection are avoided.
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Description

Technical Field

[0001] The utility model relates to a dimming film, in particular to an electrical connection structure of one or more segments of intelligent dimming film. Background Art

[0002] The existing dimming film uses a simple ACF lamination process. Affected by the free distribution of ACF conductive particles, there is a risk of short circuit and open circuit at the connection part between the external control device and the inside of the dimming film. Summary of the Invention

[0003] Therefore, in order to overcome the above-mentioned disadvantages of the prior art, the utility model provides an electrical connection structure of one or more segments of intelligent dimming film. The design of the electrical conduction structure part of the one or more segments of dimming film realizes a trouble-free connection between the dimming film body and the control unit.

[0004] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0005] An electrical connection structure of one or more segments of intelligent dimming film, characterized by comprising:

[0006] A dimming film body, having a control area and a plurality of dimming areas. Each dimming area is provided with a dimming film and a metal wire, and the metal wires are led out and converge to the control area;

[0007] A flexible printed circuit board, which sequentially includes a first insulating layer, a plurality of independent circuits, and a second insulating layer from bottom to top. The part of the first insulating layer of the flexible printed circuit board laminated to the control area is removed, and the exposed plurality of independent circuits are fixed on the metal wires through a conductive adhesive film layer, so as to be connected to the metal wires in the control area;

[0008] A control unit, which controls the dimming film through the flexible printed circuit board;

[0009] Wherein,

[0010] The connection part between the dimming film body and the flexible printed circuit board is an electrical conduction structure;

[0011] Vent holes are provided on the conductive adhesive film layer, and the vent holes are arranged between the independent circuits and the metal wires;

[0012] U-shaped long grooves are arranged between the independent circuits of the flexible printed circuit board.

[0013] Specifically, the dimming film is a PDLC polymer dispersed liquid crystal film.

[0014] Specifically, the metal wire is located at the conductive contact of the top dimming film or the conductive contact of the bottom dimming film.

[0015] Specifically, a covering layer is provided on the side of the second insulating layer of the control partition. The material of the covering layer is epoxy resin glue or polyimide film, which is used to increase the tensile strength of the flexible printed circuit board.

[0016] Specifically, the length of the U-shaped long groove on the flexible printed circuit board is 5 mm to 8 mm, and the width is 1 mm to 2 mm.

[0017] Specifically, the air holes provided on the conductive adhesive film layer are circular air holes with a diameter of 1 mm - 2 mm.

[0018] Specifically, the thickness of the conductive adhesive film layer is 20 um to 30 um.

[0019] Specifically, the thickness ratio among the insulating layer, the conductive copper layer, and the conductive adhesive film layer of the flexible printed circuit board is close to 3:2:2.

[0020] Specifically, the width of the metal wire and the center point spacing are 2 - 3 mm.

[0021] Compared with the prior art, the advantages of the present utility model are as follows: connecting the FPC flexible printed circuit board with the dimming film to complete the on-off control of multiple areas of the dimming film and avoid complex circuits; designing a U-shaped long groove between the independent circuits of the FPC flexible printed circuit board to increase the non-pressured surface and cut off the electrical connection of the anisotropic conductive film (ACF conductive adhesive) between two independent circuits, avoiding the risk of short circuit between adjacent two independent circuits; designing circular air holes on the ACF conductive adhesive for laminating exhaust of the ACF conductive adhesive layer, improving the lamination flatness of the ACF conductive adhesive layer, preventing the laminated bubbles from affecting the contact of conductive particles, and avoiding the risk of poor conduction and open circuit between the FPC flexible printed circuit board and the intelligent dimming film; filling a covering layer (the material of the covering layer can be epoxy resin glue or polyimide film) on the non-bonding opening surface of the FPC flexible printed circuit board to increase the tensile strength of the FPC. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required to be used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0023] Figure 1 It is a schematic diagram of the completed connection state of the flexible printed circuit board and the dimming film body in the embodiment of the present utility model;

[0024] Figure 2 It is a schematic cross-sectional view of the completed connection state of the flexible printed circuit board and the dimming film body in the embodiment of the present utility model;

[0025] Figure 3 It is a schematic diagram of a flexible printed circuit board in an embodiment of the present utility model;

[0026] Figure 4 It is a schematic diagram of an electrically conductive adhesive film layer in an embodiment of the present utility model;

[0027] Figure 5 It is a schematic diagram of a cover layer (the material of the cover layer can be epoxy resin glue or polyimide film) in an embodiment of the present utility model. Detailed implementation manners

[0028] The following describes the embodiments of the present application in detail with reference to the accompanying drawings.

[0029] The following illustrates the implementation manners of the present application through specific specific examples. Those skilled in the art can easily understand other advantages and effects of the present application from the content disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments. The present application can also be implemented or applied through other different specific implementation manners. Various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present application. It should be noted that, without conflict, the following embodiments and the features in the embodiments can be combined with each other. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without making creative efforts belong to the scope of protection of the present application.

[0030] It should be noted that the following describes various aspects of the embodiments within the scope of the appended claims. It should be obvious that the aspects described herein can be embodied in a wide variety of forms, and any specific structure and / or function described herein is illustrative only. Based on the present application, those skilled in the art should understand that one aspect described herein can be implemented independently of any other aspect, and two or more of these aspects can be combined in various ways. For example, any number and aspects described herein can be used to implement the device and / or practice the method. In addition, this device and / or this method can be implemented using other structures and / or functions in addition to one or more of the aspects described herein.

[0031] It also needs to be noted that the drawings provided in the following embodiments only illustrate the basic concept of the present application in a schematic manner. The drawings only show the components related to the present application and are not drawn according to the number, shape, and size of the components in actual implementation. The type, quantity, and ratio of each component in its actual implementation can be an arbitrary change, and the component layout type may also be more complex.

[0032] Additionally, in the following description, specific details are provided to facilitate a thorough understanding of the examples. However, it will be understood by those skilled in the art that the aspects described may be practiced without these specific details.

[0033] The utility model provides an electrical connection structure of one or more segments of intelligent dimming films, such as Figure 1 As shown, the one or more segments of dimming film include: a dimming film body 1 , a flexible circuit board 2 and a control unit 3 .

[0034] The connection part between the dimming film body and the flexible circuit board is an electrical conduction structure.

[0035] The dimming film body 1 includes: a control partition 10 and several dimming partitions 11. The dimming partition 11 is provided with a dimming film 110 and a metal wire 111. The metal wire 111 is led out from each dimming film 110, gathered in the control partition 10 of the dimming film body 1, and arranged in the control partition 10.

[0036] In one embodiment, the dimming film type is a PDLC polymer dispersed liquid crystal film, and the metal wire is located at the conductive contact of the top dimming film or the conductive contact of the bottom dimming film. The flexible circuit board 2 is connected to the dimming film body 1 through the conductive adhesive film layer 4 in the control partition 10. The complete flexible circuit board 2 includes a first insulating layer, a plurality of independent circuits, and a second insulating layer from bottom to top. When the flexible circuit board 2 is connected to the dimming film body 1, part of the first insulating layer of the flexible circuit board 2 in the control partition 10 is first removed, and the plurality of independent circuits 21 and the second insulating layer 20 are retained. The exposed plurality of independent circuits 21 are fixed one by one with the metal wires through the conductive adhesive film 4, and the plurality of independent circuits 21 and the metal wires 111 are connected in the control partition 10.

[0037] In one embodiment, the conductive adhesive film layer is an anisotropic conductive adhesive film (ACF). ACF is a film formed by adding a certain amount of conductive particles into a polymer matrix. Before bonding, the conductive particles in the anisotropic conductive adhesive are generally approximately evenly distributed, do not contact each other, and are protected by a layer of insulating film. Therefore, the ACF film itself is not conductive. When the ACF film is pressurized and heated, it will soften (in a colloidal state), and the conductive particles can flow and be evenly distributed, so that each circuit has a certain number of conductive particles to ensure a stable resistance value. Under the action of the bonding pressure, the insulating film of the conductive particles is broken, and a plurality of compressed and deformed conductive particles are sandwiched between the bumps on the wafer and the corresponding metal wires on the dimming film substrate. These deformed conductive particles realize the electrical interconnection between the upper and lower bumps, and the particles in other areas that are not under pressure do not contact each other. Therefore, anisotropic interconnection is achieved.

[0038] In one embodiment, if Figure 3As shown in the figure, a U-shaped long groove 22 is provided between several independent circuits 21 in the control partition 10, and the second insulating layer 20 between the several independent circuits 21 is removed. When the exposed several independent circuits 21 are fixed one-to-one with the metal wires 111 through the conductive adhesive film layer 4, the conductive adhesive film layer 4 has three position states. The conductive adhesive film layer 40 located between the independent circuit 21 and the metal wire 111 is in a compressed state here and is completely conductive; the conductive adhesive film layer 41 located at the angle between the second insulating layer 20 and the independent circuit 21 is in a semi-compressed state here and there is a risk of conduction; the conductive adhesive film layer 42 located in the U-shaped long groove 22 is in a non-compressed state here and is completely non-conductive. The U-shaped long groove 22 is provided to increase the non-compressed surface of the conductive adhesive film layer, so that the conductive adhesive film layer 42 is completely non-conductive at the U-shaped long groove 22, cutting off the electrical connection of the conductive adhesive film layer 4 between two independent circuits 21 and avoiding the risk of short circuit between adjacent two independent circuits 21.

[0039] In one embodiment, the length of the U-shaped long groove 22 on the flexible circuit board 2 is 5 mm to 8 mm, and the width is 1 mm to 2 mm.

[0040] In one embodiment, a covering layer 5 (the material of the covering layer can be epoxy resin glue or polyimide film) is provided on the side of the second insulating layer 20 of the control partition 10 to increase the tensile force of the flexible circuit board 2.

[0041] In one embodiment, the thickness of the conductive adhesive film layer 4 is 20 um to 30 um.

[0042] In one embodiment, as Figure 4 shown, ventilation holes 43 are provided on the conductive adhesive film layer 4. The ventilation holes 43 are provided between the independent circuit 21 and the metal wire 111 for exhausting air during the lamination of the conductive adhesive film layer 4 and the flexible circuit board layer, preventing lamination bubbles, improving the lamination flatness of the conductive adhesive film layer 4, reducing poor contact of conductive particles, and avoiding the risk of open circuit caused by poor conduction between the independent circuit 21 and the metal wire 111.

[0043] In one embodiment, as Figure 4 shown, the ventilation holes 43 are circular ventilation holes with a diameter of 1 mm to 2 mm.

[0044] In one embodiment, the thickness ratio among the insulating layer 20 of the flexible circuit board 2, the circuit layer 21 of the flexible circuit board, the conductive adhesive film layer 4, and the metal wire 111 is close to 3:2:2.

[0045] The control unit 3 is connected to the dimming film 1 through the flexible circuit board 2 to control the dimming film therein.

[0046] In one embodiment, when the space of the dimming film is limited and the metal wires are very short and cannot converge to adjacent positions, the second insulating layer will be removed and the end of the FPC with a U-shaped long groove provided between several independent circuits will be lengthened. The end of the flexible printed circuit board will be pulled to the metal wire, and the exposed independent circuits are fixedly corresponding to the metal wires one by one through a conductive adhesive film layer to electrically connect each short metal wire. Among them, ventilation holes are provided on the conductive adhesive film layer. The ventilation holes are arranged between the independent circuits and the metal wires and are used for laminating and exhausting air from the conductive adhesive film layer and the FPC end, preventing lamination bubbles, improving the lamination flatness of the conductive adhesive film layer, reducing poor contact of conductive particles, avoiding poor conduction between the independent circuits and the metal wires, and the risk of open circuit.

Claims

1. Electrical connection structure of one or more segments of intelligent dimming film, characterized in that, Including: A dimming film body having control partitions and a plurality of dimming partitions. Each dimming partition is provided with a dimming film and metal wires, and the metal wires are led out and converged to the control partitions. A flexible printed circuit board, which sequentially includes a first insulating layer, a plurality of independent circuits, and a second insulating layer from bottom to top. The part of the first insulating layer of the flexible printed circuit board laminated to the control partition is removed, and the exposed plurality of independent circuits are fixed on the metal wires through a conductive adhesive film layer, so as to be connected to the metal wires in the control partition. A control unit for controlling the dimming film through the flexible printed circuit board. Wherein, The connection part between the dimming film body and the flexible printed circuit board is an electrically conductive structure. Vent holes are provided on the conductive adhesive film layer, and the vent holes are arranged between the independent circuits and the metal wires. U-shaped long grooves are arranged between the independent circuits of the flexible printed circuit board.

2. The electrical connection structure of one or more intelligent dimming films according to claim 1, characterized in that, The dimming film is a PDLC polymer dispersed liquid crystal film.

3. The electrical connection structure of one or more segments of intelligent dimming film according to claim 1, characterized in that, The metal wires are located at the conductive contacts of the top-layer dimming film or the conductive contacts of the bottom-layer dimming film.

4. The electrical connection structure of one or more intelligent dimming films according to claim 1, characterized in that, A covering layer is provided on the side of the second insulating layer of the control partition, and the material of the covering layer is epoxy resin glue or polyimide film, which is used to increase the tensile force of the flexible printed circuit board.

5. The electrical connection structure of one or more intelligent dimming films according to claim 1, characterized in that The length of the U-shaped long grooves on the flexible printed circuit board is 5 mm to 8 mm, and the width is 1 mm to 2 mm.

6. The electrical connection structure of one or more intelligent dimming films according to claim 1, characterized in that The vent holes provided on the conductive adhesive film layer are circular vent holes with a diameter of 1 mm - 2 mm.

7. The electrical connection structure of one or more intelligent dimming films according to claim 1, characterized in that, The thickness of the conductive adhesive film layer is 20 um to 30 um.

8. The electrical connection structure of one or more segments of intelligent dimming film according to claim 1, characterized in that The thickness ratio among the insulating layer, the conductive copper layer, and the conductive adhesive film layer of the flexible printed circuit board is close to 3:2:

2.

9. The electrical connection structure of one or more intelligent dimming films according to claim 1, characterized in that, The width and the center point spacing of the metal wires are 2 - 3 mm.

Citation Information

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