Electronic components and their manufacturing method

Abstract

To provide an electronic component that can be easily detected by detection devices such as a laser sensor and a camera.SOLUTION: An electronic component includes a glass substrate having a glass body portion including a top surface, a bottom surface, and a first side surface connecting the bottom surface and the top surface, and a protruding crystallized portion provided on the first side surface of the glass body portion, a colored insulating layer provided on the first side surface of the glass body portion, and a penetrating conductor which is provided in the glass body portion and penetrating the top surface and the bottom surface. The crystallized portion extends along a first direction which is parallel to the bottom surface when viewed from a direction perpendicular to the first side surface. At least a part of the colored insulating layer extends along the first direction when viewed from a direction perpendicular to the first side surface, and is arranged to be adjacent to the crystallized portion in a second direction perpendicular to the first direction.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present disclosure relates to electronic components and methods for manufacturing the same. [Background technology]

[0002] A conventional electronic component is described in JP 2013-98350 A (Patent Document 1). This electronic component includes a glass body and a conductor provided inside the glass body. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2013-98350 A Summary of the Invention [Problem to be solved by the invention]

[0004] Glass is widely used as an insulator and structure for electronic components due to its advantages such as insulating properties and physical and chemical stability. In particular, electronic components that have a structure in which a conductor is embedded inside a glass body, as in the past, are suitable as small inductor components for high-frequency signals, which require a non-magnetic structure.

[0005] On the other hand, when highly transparent glass is used as the glass, there are also problems due to its transparency. For example, many mounters in recent years have the function of detecting the side of electronic components using a laser sensor or a camera to detect the presence or absence of electronic components and the thickness of the electronic components. Transparent electronic components using glass have the problem that they are difficult to recognize with the mounter's laser sensor or camera. There is also the problem that appearance inspection using a camera is difficult.

[0006] Therefore, an object of the present disclosure is to provide an electronic component that can be easily detected by a detection device such as a laser sensor or a camera, and a manufacturing method thereof. [Means for solving the problem]

[0007] In order to solve the above problems, an electronic component according to one aspect of the present disclosure comprises: A glass substrate having a glass main body portion including a top surface, a bottom surface, and a first side surface connecting the bottom surface and the top surface, and a protruding crystallized portion provided on the first side surface of the glass main body portion; a colored insulating layer provided on the first side surface of the glass body; a through conductor provided in the glass body and penetrating the top surface and the bottom surface; Equipped with the crystallized portion extends along a first direction parallel to the bottom surface when viewed from a direction perpendicular to the first side surface, At least a portion of the colored insulating layer extends along the first direction when viewed from a direction perpendicular to the first side surface, and is disposed adjacent to the crystallized portion in a second direction perpendicular to the first direction.

[0008] Here, when viewed from a direction perpendicular to the first side surface, the extension direction of the crystallized portion does not only completely coincide with the first direction, but also only needs to substantially coincide with the first direction. For example, the inclination angle between the extension direction of the crystallized portion and the first direction may be 10° or less. The same applies to the extension direction of the colored insulating layer.

[0009] According to the above aspect, the crystallized portion and the colored insulating layer are provided on the first side surface of the glass main body, so that when detecting electronic components from the first side surface of the glass main body using a detection device such as a laser sensor or a camera, the crystallized portion and the colored insulating layer, which have low transparency, can be easily recognized, and the electronic components can be easily detected.

[0010] Furthermore, since the crystallized portion and the colored insulating layer extend along the first direction when viewed from a direction perpendicular to the first side, when the detection device is scanned in the first direction to detect the electronic component, the crystallized portion or the colored insulating layer can be easily recognized, and the electronic component can be easily detected.

[0011] Furthermore, since the crystallized portion and the colored insulating layer are provided on the first side surface of the glass main body, the exposed area of ​​the glass main body can be reduced, improving the mechanical strength of the electronic component against external forces.

[0012] Preferably, in one embodiment of the electronic component, the colored insulating layer is provided in the entire area of ​​the first side surface where the crystallized portion is not present.

[0013] According to the embodiment, the entire area of ​​the first side surface can be covered with the crystallized portion and the colored insulating layer, which makes it easier for the electronic component to be detected by a detection device and improves the mechanical strength of the electronic component.

[0014] In one embodiment of the electronic component, a thickness of the crystallized portion in a direction perpendicular to the first side surface and a thickness of the colored insulating layer in a direction perpendicular to the first side surface are preferably the same.

[0015] Here, the thickness refers to an average thickness, specifically, an average value when a plurality of points are measured on a cross section including a direction perpendicular to the first side surface and the second direction.

[0016] According to the embodiment, the crystallized portion and the colored insulating layer can be formed flush in the direction perpendicular to the first side surface, thereby eliminating steps between the crystallized portion and the colored insulating layer in the direction perpendicular to the first side surface, thereby reducing the possibility of the colored insulating layer peeling off or the crystallized portion cracking or chipping due to contact with an object.

[0017] In one embodiment of the electronic component, the height of the crystallized portion in the second direction is preferably smaller than the height of the colored insulating layer in the second direction.

[0018] Here, the height refers to the maximum height, and more specifically, the maximum value when measured in a cross section including a direction perpendicular to the first side surface and the second direction.

[0019] According to the embodiment, the crystallized portion can be made small, which reduces the possibility of an object coming into contact with the crystallized portion, thereby reducing the possibility of cracking and chipping of the crystallized portion, and also reduces the possibility of stray capacitance occurring in the crystallized portion. In addition, the colored insulating layer can be made large, which further improves the mechanical strength of the electronic component.

[0020] In one embodiment of the electronic component, a relationship between a height h1 of the crystallized portion in the second direction and a height H of the first side surface in the second direction is preferably 1 / 5

[0021] According to the embodiment, since h1 / H<1 / 2 is satisfied, the crystallized portion does not become larger than necessary, and the possibility of an object coming into contact with the crystallized portion is reduced, thereby reducing the possibility of cracking and chipping of the crystallized portion, and also reducing the possibility of stray capacitance occurring in the crystallized portion.

[0022] Preferably, in one embodiment of the electronic component, a terminal electrode disposed above the bottom surface and electrically connected to the through conductor; The crystallized portion is disposed closer to the bottom surface than the colored insulating layer.

[0023] According to the embodiment, since the crystallized portion can be separated from the top surface side, when an outer conductor is disposed above the top surface, the possibility of stray capacitance occurring near the outer conductor can be reduced.

[0024] In addition, after the terminal electrodes of the electronic component are mounted on the mounting board so that the bottom side of the glass main body faces the mounting board, it becomes easy for objects to come into contact with the electronic component on the top side of the glass main body. However, since the crystallized portion is positioned on the bottom side, it is possible to reduce the likelihood of objects coming into contact with the crystallized portion, thereby reducing the possibility of the crystallized portion cracking or chipping.

[0025] Preferably, in one embodiment of the electronic component, ​​a terminal electrode disposed above the bottom surface and electrically connected to the through conductor; The crystallized portion is disposed closer to the top surface than the colored insulating layer.

[0026] According to the embodiment, since the crystallized portion can be separated from the terminal electrode, the possibility of stray capacitance occurring in the vicinity of the terminal electrode can be reduced.

[0027] In addition, when the top side of the glass main body is held by a mounter and the terminal electrodes of the electronic component are mounted on the mounting board with the bottom side of the glass main body facing the mounting board, objects are likely to come into contact with the electronic component on the bottom side of the glass main body. However, because the crystallized portion is positioned on the top side, it is possible to reduce the chance of objects coming into contact with the crystallized portion, thereby reducing the possibility of the crystallized portion cracking or chipping.

[0028] Preferably, in one embodiment of the electronic component, a terminal electrode disposed above the bottom surface and electrically connected to the through conductor; The colored insulating layer includes a first region disposed closer to the top surface than the crystallized portion, and a second region disposed closer to the bottom surface than the crystallized portion.

[0029] According to the embodiment, the crystallized portion can be separated from the top and bottom surfaces, and therefore the crystallized portion can be separated from the corners of the glass substrate where stress is likely to concentrate, reducing the possibility of the crystallized portion cracking or chipping.

[0030] Furthermore, since the crystallized portion can be separated from the top surface side, when an outer conductor is disposed above the top surface, the possibility of stray capacitance occurring near the outer conductor can be reduced.

[0031] In addition, after mounting the terminal electrodes of the electronic component on the mounting board so that the bottom side of the glass main body faces the mounting board, objects are likely to come into contact with the electronic component on the top side of the glass main body. However, since the crystallized portion can be separated from the top side, the likelihood of objects coming into contact with the crystallized portion can be reduced, thereby reducing the possibility of the crystallized portion cracking or chipping.

[0032] Furthermore, since the crystallized portion can be separated from the terminal electrode, the possibility of stray capacitance occurring in the vicinity of the terminal electrode can be reduced.

[0033] In addition, when the top side of the glass main body is held by a mounter and the terminal electrodes of the electronic component are mounted on the mounting board with the bottom side of the glass main body facing the mounting board, objects are likely to come into contact with the electronic component on the bottom side of the glass main body. However, since the crystallized portion can be separated from the bottom side, it is possible to reduce the chance of objects coming into contact with the crystallized portion and thereby reduce the possibility of the crystallized portion cracking or chipping.

[0034] Preferably, in one embodiment of the electronic component, an outer conductor disposed above at least one of the top surface and the bottom surface and electrically connected to the through conductor; a protective layer provided above the at least one surface so as to cover the outer surface conductor; Equipped with.

[0035] According to the embodiment, the protective layer covers the outer conductors, so that the outer conductors can be protected. Also, the protective layer covers at least one of the top surface and the bottom surface of the glass main body, so that the glass main body can be protected.

[0036] Preferably, in one embodiment of the method for manufacturing an electronic component, providing a mother substrate made of photosensitive glass and including a first main surface and a second main surface; a step of irradiating a cut region of the first main surface with ultraviolet light and then crystallizing the mother substrate by heat treatment to form a crystallized portion extending in a direction parallel to the first main surface and extending from the first main surface to the second main surface; removing a portion of the crystallized portion by etching in the cutting region while leaving a portion of the crystallized portion, thereby forming a groove extending in a direction parallel to the first main surface; forming a through conductor penetrating the first main surface and the second main surface of the mother substrate; embedding a colored insulating layer in the groove and bringing the colored insulating layer into contact with the crystallized portion; cutting the colored insulating layer and the crystallized portion along the cutting region to divide the mother substrate into a plurality of electronic components; Equipped with.

[0037] According to the embodiment, since the mother substrate is divided by cutting the colored insulating layer and the crystallized portion along the cutting region, the cutting is easier than cutting photosensitive glass. Also, since the crystallized portion is in contact with the colored insulating layer, the crystallized portion is fixed to the colored insulating layer, and the possibility of the crystallized portion cracking or chipping can be reduced when the colored insulating layer and the crystallized portion are cut.

[0038] In addition, since the colored insulating layer is provided on the motherboard, this can be achieved easily and at low cost compared to applying a colored insulating layer to each component after dividing the motherboard, which increases the labor and cost required to apply a colored insulating layer to each of the divided components.

[0039] Preferably, in one embodiment of the method for manufacturing an electronic component, Furthermore, before the step of dividing the motherboard to obtain a plurality of electronic components, forming an outer surface conductor electrically connected to the through conductor above at least one of the first main surface and the second main surface; forming a protective layer over the at least one surface so as to cover the outer surface conductor; Equipped with.

[0040] According to the embodiment, the protective layer covers the outer conductors, so that the outer conductors can be protected. Also, the protective layer covers at least one of the top surface and the bottom surface of the glass main body, so that the glass main body can be protected. Effect of the Invention

[0041] According to an electronic component and a method for manufacturing the same which are one aspect of the present disclosure, detection can be easily performed using a detection device such as a laser sensor or a camera. [Brief description of the drawings]

[0042] [Figure 1] 1 is a perspective view showing a first embodiment of an inductor component as an electronic component. [Diagram 2] FIG. 2 is an exploded perspective view of the inductor component. [Diagram 3] FIG. 2 is a cross-sectional view of an inductor component. [Figure 4A] 1 is a top view of a coil of an inductor component as viewed from the top surface side. [Figure 4B] 1 is a bottom view of a coil of the inductor component as viewed from the bottom side. FIG. [Figure 5A] 1A to 1C are perspective views illustrating a method for manufacturing an inductor component. [Figure 5B] 1A to 1C are perspective views illustrating a method for manufacturing an inductor component. [Figure 5C] 1A to 1C are perspective views illustrating a method for manufacturing an inductor component. [Figure 5D] 1A to 1C are cross-sectional views illustrating a method for manufacturing an inductor component. [Figure 5E] 1A to 1C are cross-sectional views illustrating a method for manufacturing an inductor component. [Figure 5F] 1A to 1C are cross-sectional views illustrating a method for manufacturing an inductor component. [Figure 5G] 1A to 1C are cross-sectional views illustrating a method for manufacturing an inductor component. [Figure 5H] 1A to 1C are cross-sectional views illustrating a method for manufacturing an inductor component. [Figure 5I] 1A to 1C are cross-sectional views illustrating a method for manufacturing an inductor component. [Figure 5J] 1A to 1C are cross-sectional views illustrating a method for manufacturing an inductor component. [Figure 5K] 1A to 1C are cross-sectional views illustrating a method for manufacturing an inductor component. [Figure 6] 1 is an enlarged cross-sectional view showing a second embodiment of an inductor component as an electronic component. [Figure 7] FIG. 11 is an enlarged cross-sectional view showing a third embodiment of an inductor component as an electronic component. [Figure 8A] 1A to 1C are cross-sectional views illustrating a method for manufacturing an inductor component. [Figure 8B] 1A to 1C are cross-sectional views illustrating a method for manufacturing an inductor component. [Figure 9] FIG. 11 is an enlarged cross-sectional view showing a fourth embodiment of an inductor component as an electronic component. [Figure 10] FIG. 11 is a cross-sectional view showing a fifth embodiment of a capacitor component as an electronic component. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0043] Hereinafter, an electronic component and a method for manufacturing the same according to an embodiment of the present disclosure will be described in detail with reference to the drawings. Note that the drawings include some schematic views and may not reflect actual dimensions or ratios.

[0044] First Embodiment (composition) In the first embodiment, an inductor component will be described as an example of an electronic component according to the present invention. Fig. 1 is a perspective view of the inductor component as viewed from the top surface side. Fig. 2 is an exploded perspective view of the inductor component as viewed from the top surface side. Fig. 3 is a cross-sectional view of the inductor component. Fig. 4A is a top view of the coil of the inductor component as viewed from the top surface side, and Fig. 4B is a bottom view of the coil of the inductor component as viewed from the bottom surface side.

[0045] The inductor component 1 is a surface-mount type inductor component used in, for example, a high-frequency signal transmission circuit. As shown in Figures 1, 2, 3, 4A, and 4B, the inductor component 1 includes a glass substrate 10, a coil 110 provided on the glass substrate 10, a first protective layer 15 provided on the top surface of the glass substrate 10 and covering a part of the coil 110, a second protective layer 16 provided on the bottom surface of the glass substrate 10 and covering a part of the coil 110, a colored insulating layer 30 provided on the side surface of the glass substrate 10, and a first terminal electrode 121 and a second terminal electrode 122 provided on the second protective layer 16 and electrically connected to the coil 110.

[0046] The glass substrate 10 has a glass main body 100 and a protruding crystallized portion 101 provided on the glass main body 100. The glass main body 100 is a rectangular parallelepiped having a length, a width, and a height. The glass main body 100 has a first side surface 100s1 and a second side surface 100s2 at both ends in the length direction, a third side surface 100s3 and a fourth side surface 100s4 at both ends in the width direction, and a bottom surface 100b and a top surface 100t at both ends in the height direction. That is, the outer surface of the glass main body 100 includes the first side surface 100s1 and the second side surface 100s2, the third side surface 100s3 and the fourth side surface 100s4, the bottom surface 100b, and the top surface 100t. The bottom surface 100b is a surface that faces the mounting board when the inductor component 1 is mounted on the mounting board.

[0047] As shown in the drawings, for the sake of convenience, the length direction (longitudinal direction) of the glass main body 100, which is a direction from the first side surface 100s1 to the second side surface 100s2, is defined as the X direction. The width direction of the glass main body 100, which is a direction from the third side surface 100s3 to the fourth side surface 100s4, is defined as the Y direction. The height direction of the glass main body 100, which is a direction from the bottom surface 100b to the top surface 100t, is defined as the Z direction. The X direction, Y direction, and Z direction are mutually orthogonal, and when arranged in the order of X, Y, Z, they form a left-handed system.

[0048] In this specification, the outer surface of the glass main body 100 does not simply mean a surface facing the outer periphery of the glass main body 100, but a surface that is a boundary between the outside and the inside of the glass main body 100. In addition, "above the outer surface (top surface, bottom surface, side surface) of the glass main body 100" does not mean an absolute direction such as vertically upward defined by the direction of gravity, but refers to a direction toward the outside of the outside and the inside with the outer surface as a boundary, based on the outer surface. Therefore, "above the outer surface" is a relative direction determined by the direction of the outer surface. In addition, "above" with respect to a certain element includes not only an upper side away from the element, that is, an upper position through another object on the element or an upper position with a space therebetween, but also a position directly above the element (on).

[0049] The glass substrate 10 has insulating properties. The glass substrate 10 is preferably a photosensitive glass substrate such as Foturan II (registered trademark of Schott AG). In particular, the glass substrate 10 preferably contains cerium oxide (ceria: CeO2), and in this case, the cerium oxide acts as a sensitizer, making processing by photolithography easier.

[0050] However, the glass substrate 10 may be a glass plate that does not have photosensitivity because it can be processed by mechanical processing such as drilling and sandblasting, dry / wet etching processing using a photoresist / metal mask, laser processing, etc. Also, the glass substrate 10 may be formed by sintering a glass paste, or may be formed by a known method such as a float method.

[0051] The glass body 100 is a non-crystallized amorphous portion of the glass substrate 10. The glass body 100 has high transparency. The crystallized portion 101 is a crystallized portion of the glass substrate 10. The transparency of the crystallized portion 101 is lower than that of the glass body 100. By providing the crystallized portion 101, it is possible to adjust the effective dielectric constant of the glass substrate 10. That is, the stray capacitance formed between the conductors 11b, 11t, 13, 14, the terminal electrodes 121, 122, and any of the wiring patterns of the mounting board can be increased or decreased, and in particular, the self-resonant frequency of the inductor component 1 can be adjusted. For example, in the case of the above-mentioned Foturan II, the dielectric constant of the glass body 100 is 6.4, while the dielectric constant of the crystallized portion 101 can be reduced to 5.8. This allows the stray capacitance between the conductors near the crystallized portion 101 to be reduced.

[0052] The crystallized portion 101 is provided so as to surround the periphery of the first side surface 100s1 to the fourth side surface s4 of the glass main body portion 100. Specifically, the crystallized portion 101 extends along the Y direction (corresponding to an example of the "first direction" described in the claims) parallel to the bottom surface 100b when viewed from a direction perpendicular to the first side surface 100s1. Similarly, the crystallized portion 101 extends along the Y direction parallel to the bottom surface 100b when viewed from a direction perpendicular to the second side surface 100s2. Moreover, the crystallized portion 101 extends along the X direction parallel to the bottom surface 100b when viewed from a direction perpendicular to the third side surface 100s3, and extends along the X direction parallel to the bottom surface 100b when viewed from a direction perpendicular to the fourth side surface 100s4.

[0053] The crystallized portion 101 may be provided on at least one of the first side surface 100s1 to the fourth side surface s4. In this case, the at least one side surface corresponds to an example of the "first side surface" described in the claims. In addition, in one side surface, for example, the first side surface 100s1, there is one crystallized portion 101, but there may be multiple crystallized portions.

[0054] In addition, in one side surface, for example the first side surface 100s1, the crystallized portion 101 extends continuously from both the left and right ends in the Y direction, but may be partially present in the Y direction (left and right direction). In other words, the length of the crystallized portion 101 in the Y direction may be shorter than the length of both the left and right ends of the first side surface 100s1.

[0055] In addition, when viewed from a direction perpendicular to one side surface, for example, the first side surface 100s1, the extension direction of the crystallized portion 101 completely coincides with the Y direction, but it is sufficient if they substantially coincide with each other. For example, the inclination angle between the extension direction of the crystallized portion 101 and the Y direction may be 10° or less.

[0056] The glass main body 100 is a rectangular parallelepiped, but may be a cylinder, in which case the circumferential surface of the cylinder corresponds to an example of the "first side surface" described in the claims. The crystallized portion 101 is provided on at least a part of the circumferential surface of the cylinder.

[0057] The coil 110 is wound in a spiral shape along an axis AX. The axis AX of the coil 110 is disposed parallel to the bottom surface 100b. The coil 110 includes a plurality of bottom surface conductors 11b, a plurality of top surface conductors 11t, a plurality of first through conductors 13, and a plurality of second through conductors 14. The bottom surface conductor 11b and the top surface conductor 11t correspond to an example of an "external surface conductor" as defined in the claims.

[0058] The multiple bottom conductors 11b are disposed above the bottom surface 100b. The multiple bottom conductors 11b are arranged along the axis AX in contact with the bottom surface 100b. The multiple top conductors 11t are disposed above the top surface 100t. The multiple top conductors 11t are arranged along the axis AX in contact with the top surface 100t.

[0059] The multiple first penetrating conductors 13 are provided in the glass body 100 and penetrate the bottom surface 100b and the top surface 100t. The multiple first penetrating conductors 13 extend from the bottom surface conductor 11b toward the top surface conductor 11t and are arranged along the axis AX.

[0060] The second through conductors 14 are provided in the glass main body 100 and penetrate the bottom surface 100b and the top surface 100t. The second through conductors 14 extend from the bottom surface conductor 11b toward the top surface conductor 11t and are arranged along the axis AX. The second through conductors 14 are provided on the opposite side of the axis AX to the first through conductor 13. The bottom surface conductor 11b, the first through conductor 13, the top surface conductor 11t, and the second through conductor 14 are electrically connected in this order to form at least a part of the spiral coil 110.

[0061] The top conductor 11t extends in the Y direction at a slight incline toward the X direction. All the top conductors 11t are arranged in parallel along the X direction. The bottom conductor 11b has a shape that extends in the Y direction. All the bottom conductors 11b are arranged in parallel along the X direction.

[0062] The first through conductor 13 is disposed on the third side surface 100s3 side with respect to the axis AX in the through hole of the glass main body 100, and the second through conductor 14 is disposed on the fourth side surface 100s4 side with respect to the axis AX in the through hole of the glass main body 100. The first through conductor 13 and the second through conductor 14 each extend in a direction perpendicular to the bottom surface 100b and the top surface 100t. All the first through conductors 13 and all the second through conductors 14 are each disposed in parallel along the X direction.

[0063] The bottom conductor 11b and the top conductor 11t are made of a conductive material such as copper, silver, gold, or an alloy thereof. The bottom conductor 11b and the top conductor 11t may be a metal film formed by plating, vapor deposition, sputtering, or the like, or may be a metal sintered body formed by applying and sintering a conductive paste. The first through conductor 13 and the second through conductor 14 are made of the same material as the bottom conductor 11b and the top conductor 11t.

[0064] The bottom conductor 11b and the top conductor 11t are preferably formed by a semi-additive method, which allows the bottom conductor 11b and the top conductor 11t to be formed with low electrical resistance, high precision, and high aspect ratio. The first penetrating conductor 13 and the second penetrating conductor 14 can be formed in through holes formed in advance in the glass main body 100 by using the materials and manufacturing methods exemplified for the bottom conductor 11b and the top conductor 11t.

[0065] The first protective layer 15 is disposed above the top surface 100t so as to cover the top surface wiring 11t. The first protective layer 15 contacts the top surface 100t and the top surface wiring 11t. By covering the top surface conductor 11t, the first protective layer 15 protects the top surface conductor 11t from external forces and prevents damage to the top surface conductor 11t. In addition, since the first protective layer 15 covers the top surface 100t of the glass main body 100, it is possible to protect the glass main body 100.

[0066] The second protective layer 16 is disposed above the bottom surface 100b so as to cover the bottom surface wiring 11b. The second protective layer 16 contacts the bottom surface 100b and the bottom surface wiring 11b. By covering the bottom surface conductor 11b, the second protective layer 16 protects the bottom surface conductor 11b from external forces and prevents damage to the bottom surface conductor 11b. In addition, since the second protective layer 16 covers the bottom surface 100b of the glass main body 100, the glass main body 100 can be protected.

[0067] The first protective layer 15 and the second protective layer 16 have insulating properties and are made of a resin such as epoxy or polyimide.

[0068] The first terminal electrode 121 is disposed above the bottom surface 100b and connected to a first end of the coil 110. The second terminal electrode 122 is disposed above the bottom surface 100b and connected to a second end of the coil 110. The first terminal electrode 121 is provided on the second protective layer 16 on the first side surface 100s1 side with respect to the center of the glass substrate 10 in the X direction. The second terminal electrode 122 is provided on the second protective layer 16 on the second side surface 100s2 side with respect to the center of the glass substrate 10 in the X direction.

[0069] The first terminal electrode 121 is connected to the bottom conductor 11b through a first via conductor 121v embedded in the second protective layer 16. The second terminal electrode 122 is connected to the bottom conductor 11b through a second via conductor 122v embedded in the second protective layer 16.

[0070] The first terminal electrode 121 has an underlayer and a plating layer covering the underlayer. The underlayer includes a conductive material such as Ag or Cu. The plating layer includes a conductive material such as Ni, Sn, Pd, or Au. Similarly, the second terminal electrode 122 has an underlayer and a plating layer covering the underlayer. Note that the first terminal electrode 121 and the second terminal electrode 122 may be made of a single layer of conductive material.

[0071] The colored insulating layer 30 is provided so as to surround the periphery of the first side surface 100s1 to the fourth side surface s4 of the glass main body 100. Specifically, the colored insulating layer 30 extends along the Y direction (corresponding to an example of the "first direction" described in the claims) parallel to the bottom surface 100b when viewed from a direction perpendicular to the first side surface 100s1, and is disposed adjacent to the crystallized portion 101 in the Z direction (corresponding to an example of the "second direction" described in the claims) perpendicular to the Y direction. That is, the colored insulating layer 30 is in contact with the crystallized portion 101 along the Y direction. Similarly, the colored insulating layer 30 extends along the Y direction parallel to the bottom surface 100b when viewed from a direction perpendicular to the second side surface 100s2, and is disposed adjacent to the crystallized portion 101 in the Z direction perpendicular to the Y direction.

[0072] Moreover, the colored insulating layer 30 extends along the X direction parallel to the bottom surface 100b when viewed from a direction perpendicular to the third side surface 100s3, and is disposed adjacent to the crystallized portion 101 in the Z direction perpendicular to the X direction. The colored insulating layer 30 extends along the X direction parallel to the bottom surface 100b when viewed from a direction perpendicular to the fourth side surface 100s4, and is disposed adjacent to the crystallized portion 101 in the Z direction perpendicular to the X direction.

[0073] The colored insulating layer 30 has insulating properties and is made of a resin such as epoxy or polyimide. The colored insulating layer 30 is colored, for example, green or blue, and the transparency of the colored insulating layer 30 is lower than the transparency of the glass main body 100.

[0074] The colored insulating layer 30 may be provided on at least one of the first side surface 100s1 to the fourth side surface s4. In this case, the at least one side surface corresponds to an example of the "first side surface" described in the claims. That is, at least a part of the colored insulating layer 30 extends along a first direction parallel to the bottom surface 100b when viewed from a direction perpendicular to the first side surface, and is disposed adjacent to the crystallized portion 101 in a second direction perpendicular to the first direction. Also, on one side surface, for example the first side surface 100s1, the colored insulating layer 30 may be divided into a plurality of regions.

[0075] Furthermore, on one side surface, for example the first side surface 100s1, the colored insulating layer 30 extends continuously across both the left and right ends in the Y direction, but may be partially present in the Y direction (left and right direction). In other words, the length of the colored insulating layer 30 in the Y direction may be shorter than the length of both the left and right ends of the first side surface 100s1.

[0076] Also, when viewed from one side, for example, a direction perpendicular to the first side 100s1, the extending direction of the colored insulating layer 30 completely coincides with the Y direction, but it is sufficient if they substantially coincide with each other. For example, the inclination angle between the extending direction of the colored insulating layer 30 and the Y direction may be 10° or less.

[0077] The glass body 100 is a rectangular parallelepiped, but may be a cylinder, and in this case, the circumferential surface of the cylinder corresponds to an example of the "first side surface" described in the claims. The colored insulating layer 30 is provided on at least a part of the circumferential surface of the cylinder.

[0078] According to the above configuration, the crystallized portion 101 and the colored insulating layer 30 are provided on the first side surface 100s1 of the glass main body portion 100. Therefore, when the inductor component 1 is detected from the first side surface 100s1 of the glass main body portion 100 using a detection device such as a laser sensor or a camera, the crystallized portion 101 and the colored insulating layer 30, which have low transparency, can be easily recognized, and the inductor component 1 can be easily detected.

[0079] Furthermore, since the crystallized portion 101 and the colored insulating layer 30 extend along the Y direction when viewed from a direction perpendicular to the first side 100s1, when the detection device is scanned in the Y direction to detect the inductor component 1, the crystallized portion 101 or the colored insulating layer 30 can be easily recognized, and the inductor component 1 can be easily detected.

[0080] Furthermore, since the crystallized portion 101 and the colored insulating layer 30 are provided on the first side surface 100s1 of the glass main body 100, it is possible to reduce exposure of the glass main body 100, thereby improving the mechanical strength of the inductor component 1 against external forces. Here, the mechanical strength of crystallized glass is higher than the mechanical strength of non-crystallized glass.

[0081] The second side surface 100s2, the third side surface 100s3, and the fourth side surface 100s4 have the same effects as those of the first side surface 100s1 described above.

[0082] Preferably, the colored insulating layer 30 is provided in the entire area of ​​the first side surface 100s1 where the crystallized portion 101 is not present. With the above configuration, the entire area of ​​the first side surface 100s1 can be covered with the crystallized portion 101 and the colored insulating layer 30. This allows the inductor component 1 to be more easily detected by a detection device, and also improves the mechanical strength of the inductor component 1. The second side surface 100s2, the third side surface 100s3, and the fourth side surface 100s4 have the same configuration and effects as those of the first side surface 100s1.

[0083] 3, in the first side surface 100s1, a thickness t1 of the crystallized portion 101 in a direction perpendicular to the first side surface 100s1 (X direction) is preferably the same as a thickness t2 of the colored insulating layer 30 in a direction perpendicular to the first side surface 100s1 (X direction). Here, the thickness refers to an average thickness, and more specifically, it is an average value when multiple points are measured in a cross section including the direction perpendicular to the first side surface 100s1 (X direction) and the second direction (Z direction).

[0084] According to the above configuration, the crystallized portion 101 and the colored insulating layer 30 can be formed flush in the direction perpendicular to the first side surface 100s1. This eliminates steps between the crystallized portion 101 and the colored insulating layer 30 in the direction perpendicular to the first side surface 100s1, reducing the possibility of peeling of the colored insulating layer 30 and cracking or chipping of the crystallized portion 101 due to contact with an object. The second side surface 100s2, the third side surface 100s3, and the fourth side surface 100s4 have the same configuration and effects as those of the first side surface 100s1.

[0085] 3, on the first side surface 100s1, a height h1 in the second direction (Z direction) of the crystallized portion 101 is preferably smaller than a height h2 in the second direction (Z direction) of the colored insulating layer 30. Here, the height refers to the maximum height, and more specifically, the maximum value when measured on a cross section including a direction perpendicular to the first side surface 100s1 and the second direction (Z direction).

[0086] According to the above configuration, the crystallized portion 101 can be made small, which reduces the possibility of an object coming into contact with the crystallized portion 101, thereby reducing the possibility of the crystallized portion 101 cracking and chipping, and also reduces the possibility of stray capacitance occurring in the crystallized portion 101. Furthermore, the colored insulating layer 30 can be made large, which further improves the mechanical strength of the inductor component 1. The second side surface 100s2, the third side surface 100s3, and the fourth side surface 100s4 have the same configuration and effects as those of the first side surface 100s1.

[0087] As shown in FIG. 3, in the first side surface 100s1, the relationship between the height h1 of the crystallized portion 101 in the second direction (Z direction) and the height H of the first side surface 100s1 in the second direction (Z direction) is preferably 1 / 5.

[0088] ​According to the above configuration, since h1 / H<1 / 2 is satisfied, the crystallized portion 101 does not become larger than necessary, and the possibility of an object coming into contact with the crystallized portion 101 is reduced, thereby reducing the possibility of the crystallized portion 101 cracking and chipping, and also reducing the possibility of stray capacitance occurring in the crystallized portion 101.

[0089] Preferably, as shown in FIGS. 2 and 3, on the first side surface 100s1, the crystallized portion 101 is disposed closer to the bottom surface 100b than the colored insulating layer 30.

[0090] According to the above configuration, the crystallization portion 101 can be separated from the top surface 100t, so that it is possible to reduce the possibility of stray capacitance occurring near the top surface conductor 11b arranged on the top surface 100t.

[0091] Furthermore, the terminal electrodes 121, 122 of the inductor component 1 are mounted on the mounting board so that the bottom surface 100b side of the glass main body 100 faces the mounting board. In this state, an object is likely to come into contact with the inductor component 1 on the top surface 100t side of the glass main body 100, but since the crystallized portion 101 is disposed on the bottom surface 100b side, it is possible to reduce the possibility of an object coming into contact with the crystallized portion 101, thereby reducing the possibility of the crystallized portion 101 cracking or chipping. The second side surface 100s2, the third side surface 100s3, and the fourth side surface 100s4 have the same configuration and effect as those of the first side surface 100s1.

[0092] ​Preferably, as shown in FIG. 3, at the first side surface 100s1, the first protective layer 15 contacts the colored insulating layer 30, and the second protective layer 16 contacts the crystallized portion 101. Specifically, when viewed from above in the Z direction, the first protective layer 15 covers the colored insulating layer 30. The side surface of the first protective layer 15 that is located in a direction perpendicular to the Z direction and the side surface of the colored insulating layer 30 that is located in a direction perpendicular to the Z direction are located on the same plane. When viewed from below in the Z direction, the second protective layer 16 covers the crystallized portion 101. The side surface of the second protective layer 16 that is located in a direction perpendicular to the Z direction and the side surface of the crystallized portion 101 that is located in a direction perpendicular to the Z direction are located on the same plane.

[0093] According to the above configuration, the colored insulating layer 30 and the crystallized portion 101 are fixed to the first protective layer 15 and the second protective layer 16, and when the colored insulating layer 30 and the crystallized portion 101 are cut, the possibility of peeling of the colored insulating layer 30 and cracking or chipping of the crystallized portion 101 can be reduced. The second side surface 100s2, the third side surface 100s3, and the fourth side surface 100s4 have the same configuration and effects as those of the first side surface 100s1. The first protective layer 15 and the second protective layer 16 may be in contact with one of the colored insulating layer 30 and the crystallized portion 101.

[0094] Preferably, at least one of the first protective layer 15 and the second protective layer 16 is colored, similar to the colored insulating layer 30. With this, when the inductor component 1 is detected from the top surface 100t side or the bottom surface 100b side of the glass main body 100 by a detection device such as a laser sensor or a camera, the protective layers 15 and 16 can be easily recognized, and the inductor component 1 can be easily detected.

[0095] (Manufacturing Method of Inductor Component 1) As shown in FIG. 5A, a mother substrate 200 made of photosensitive glass and including a first main surface 200a and a second main surface 200b is prepared. The first main surface 200a corresponds to the top surface 11t, and the second main surface 200b corresponds to the bottom surface 100b. For example, Foturan II can be used as the mother substrate 200. The mother substrate 200 generally contains an oxide of silicon, lithium, aluminum, cerium, or the like, making it compatible with high-precision photolithography.

[0096] The through conductor forming region 201 of the first main surface 201 is irradiated with ultraviolet light, and the mother substrate 200 is crystallized by a subsequent heat treatment (e.g., baking) to form a crystallized portion extending from the first main surface 200a to the second main surface 200b. The through conductor forming region 201 is a region in which a through conductor is formed, and is shown by hatching in FIG. 5A. Specifically, the mother substrate 200 is irradiated with ultraviolet light having a wavelength of about 310 nm. By the irradiation of the ultraviolet light, for example, metal ions such as cerium ions in the photosensitive glass are oxidized by light energy and emit electrons. Here, the processing depth finally obtained in the mother substrate 200 can be controlled by adjusting the irradiation amount of the ultraviolet light according to the thickness of the mother substrate 200.

[0097] As an exposure device used for the above-mentioned irradiation with ultraviolet light, a contact aligner or a stepper capable of obtaining ultraviolet light with a wavelength of about 310 nm can be used. Alternatively, a laser irradiation device including a femtosecond laser can be used as a light source. When a femtosecond laser is used, it is possible to emit electrons from the metal oxide only at the focused portion by concentrating the laser light inside the mother substrate 200. In other words, it is possible to expose only the inside of the mother substrate 200 without exposing the surface of the laser light irradiated portion.

[0098] As shown in FIG. 5B, in the through conductor formation region 201, all of the crystallized portions are removed by etching to form through holes 202 extending in the Z direction and penetrating the first main surface 200a and the second main surface 200b. For example, an aqueous hydrofluoric acid solution is used for the etching. The concentration of the aqueous hydrofluoric acid solution is preferably, for example, 5 to 10%. In the etching process, the entire mother substrate 200 is immersed in the aqueous hydrofluoric acid solution. As a result, only the crystalline phase in the substrate is etched, and the through holes 202 are formed.

[0099] Thereafter, the cutting region 203 of the first main surface 201 is irradiated with ultraviolet light, and the mother substrate 200 is crystallized by subsequent heat treatment (e.g., baking) to form a crystallized portion extending from the first main surface 200a to the second main surface 200b. The cutting region 203 is a region where a groove is to be formed, and is shown by hatching in Fig. 5B. The cutting region 203 coincides with a cut line when the mother substrate 200 is divided into individual pieces.

[0100] As shown in Figures 5C and 5D, in the cutting region 203, a part of the crystallized portion is left, and the other part of the crystallized portion is removed by etching to form a groove 204 extending in a direction parallel to the first main surface 200a. The crystallized portion 101 that remains without being removed is located on the second main surface 200b side and forms the bottom of the groove 204. The part of the mother substrate 200 other than the crystallized portion 101 corresponds to the glass main body portion 100 in Figure 1. In Figure 5C, the crystallized portion 101 is indicated by hatching with dots. Figure 5D is a cross-sectional view taken along the line AA in Figure 5C. Below, Figures 5E to 5H also correspond to the cross-sectional view AA in Figure 5C.

[0101] When etching is performed so as to leave a part of the crystallized portion (crystallized portion 101), for example, the portion to be the crystallized portion 101 may be covered from the second main surface 200b side with a protective film 205 that is resistant to the hydrofluoric acid solution so that the hydrofluoric acid solution does not penetrate into the crystal phase. In Fig. 5D, the protective film 205 is indicated by a two-dot chain line.

[0102] Alternatively, the through conductor formation region 201 and the cutting region 203 may be crystallized simultaneously, and the protective film 205 may be provided only on the portion to be the crystallized portion 101, and unnecessary crystallized portions may be etched at the same time. This allows the through hole 202 and the groove 204 to be formed at the same time.

[0103] 5E, through conductors 13 and 14 are formed penetrating the first main surface 200a and the second main surface 200b of the mother substrate 200. Specifically, the first through conductor 13 and the second through conductor 14 are formed in the through hole 202 by, for example, a semi-additive method. The through conductors 13 and 14 may be formed from a single seed layer, or may be formed in separate steps.

[0104] 5F, the colored insulating layer 30 is embedded in the grooves 204 and brought into contact with the crystallized portion 101. Specifically, the colored insulating layer 30 is formed in the grooves 204 by, for example, spin coating. Note that the colored insulating layer 30 may be provided on the first main surface 200a while being provided in the grooves 204, and then the colored insulating layer 30 on the first main surface 200a may be removed by polishing or the like.

[0105] 5G, a top conductor 11t electrically connected to the through conductors 13, 14 is formed on the first main surface 200a, and a bottom conductor 11b electrically connected to the through conductors 13, 14 is formed on the second main surface 200b. The top conductor 11t and the bottom conductor 11b are formed, for example, by a semi-additive method, similar to the through conductors 13, 14.

[0106] 5H, a first protective layer 15 is formed above the first main surface 200a so as to cover the top conductor 11t, and a second protective layer 16 is formed above the second main surface 200b so as to cover the bottom conductor 11b. Specifically, the first protective layer 15 and the second protective layer 16 are formed by laminating a resin film or by applying a paste-like resin and thermally curing it.

[0107] As shown in FIG. 5I, a via hole is formed in the second protective layer 16, a first via conductor 121v is formed in the via hole, and a first terminal electrode 121 connected to the first via conductor 121v is formed above the second protective layer 16. The first via conductor 121v and the first terminal electrode 121 may be formed simultaneously or separately. The first via conductor 121v and the first terminal electrode 121 are formed by, for example, a semi-additive method. FIG. 5I corresponds to the BB cross section of FIG. 5C. Similarly, FIG. 5J and FIG. 5K below correspond to the BB cross section of FIG. 5C.

[0108] As shown in Fig. 5J, colored insulating layer 30 and crystallized portion 101 are cut along cutting region 203, and as shown in Fig. 5K, mother substrate 200 is divided to obtain a plurality of inductor components 1 shown in Fig. 1. Specifically, dicing blade 300 is moved along groove 204 from first protective layer 15 toward second protective layer 16. Note that cutting may be performed with a laser instead of dicing blade 300.

[0109] According to this, the mother substrate 200 is divided by cutting the colored insulating layer 30 and the crystallized portion 101 along the cutting region 203, which makes cutting easier than cutting photosensitive glass. Also, since the crystallized portion 101 is in contact with the colored insulating layer 30, the crystallized portion 101 is fixed to the colored insulating layer 30, which reduces the possibility of the crystallized portion 101 cracking or chipping when the colored insulating layer 30 and the crystallized portion 101 are cut.

[0110] In addition, since the colored insulating layer 30 is provided in the state of the mother substrate 200, this can be achieved easily and at a lower cost than when the colored insulating layer 30 is applied to each of the individual components after dividing the mother substrate 200. In contrast, when the colored insulating layer 30 is applied to each of the divided individual components, the labor and cost of the work increases.

[0111] <Second embodiment> 6 is an enlarged cross-sectional view showing a second embodiment of an inductor component as an electronic component. The second embodiment differs from the first embodiment in the position of the crystallized portion. This difference in configuration will be described below. The other configurations are the same as those of the first embodiment, and the description thereof will be omitted.

[0112] As shown in FIG. 6, in an inductor component 1A of the second embodiment, on a first side surface 100s1, a crystallized portion 101 is disposed closer to the top surface 100t than the colored insulating layer 30. As shown in FIG.

[0113] According to the above configuration, since the crystallized portion 101 can be separated from the terminal electrodes 121, 122 arranged on the bottom surface 100b side, the possibility of stray capacitance occurring near the terminal electrodes 121, 122 can be reduced.

[0114] In addition, when the top surface 100t side of the glass main body portion 100 is held by a mounter and the terminal electrodes 121, 122 of the inductor component 1A are mounted on the mounting board so that the bottom surface 100b side of the glass main body portion 100 faces the mounting board, objects are likely to come into contact with the inductor component 1A on the bottom surface 100b side of the glass main body portion 100. However, since the crystallized portion 101 is positioned on the top surface 100t side, the possibility of objects coming into contact with the crystallized portion 101 can be reduced, thereby reducing the possibility of the crystallized portion 101 cracking or chipping.

[0115] The second side surface 100s2, the third side surface 100s3, and the fourth side surface 100s4 have the same configuration and effects as the first side surface 100s1. It is sufficient that at least one of the first to fourth side surfaces 100s1 to 100s4 satisfies the above configuration.

[0116] <Third embodiment> 7 is an enlarged cross-sectional view showing a third embodiment of an inductor component as an electronic component. The third embodiment differs from the first embodiment in the position of the crystallized portion. This difference in configuration will be described below. The other configurations are the same as those of the first embodiment, and the description thereof will be omitted.

[0117] 7, in the inductor component 1B of the third embodiment, on the first side surface 100s1, the colored insulating layer 30 includes a first region 31 disposed closer to the top surface 100t than the crystallized portion 101, and a second region 32 disposed closer to the bottom surface 100b than the crystallized portion 101. The height h2 in the Z direction of the colored insulating layer 30 shown in FIG. 3 refers to the sum of the height in the Z direction of the first region 31 and the height in the Z direction of the second region 32.

[0118] According to the above configuration, the crystallized portion 101 can be separated from the top surface 100t and the bottom surface 100b, so that the crystallized portion 101 can be separated from the corners of the glass substrate 10 where stress is likely to concentrate, thereby reducing the possibility of the crystallized portion 101 cracking or chipping.

[0119] Furthermore, since the crystallization portion 101 can be separated from the top surface 100t, it is possible to reduce the possibility of stray capacitance occurring in the vicinity of the top surface conductor 11t disposed above the top surface 100t.

[0120] Furthermore, after mounting terminal electrodes 121, 122 of inductor component 1B on a mounting substrate so that bottom surface 100b of glass main body portion 100 faces the mounting substrate, objects are likely to come into contact with inductor component 1B on the top surface 100t side of glass main body portion 100. However, since crystallized portion 101 can be separated from the top surface 100t side, the possibility of objects coming into contact with crystallized portion 101 can be reduced, thereby reducing the possibility of crystallized portion 101 cracking or chipping.

[0121] Furthermore, since the crystallized portion 101 can be separated from the terminal electrodes 121 and 122, the possibility of stray capacitance occurring in the vicinity of the terminal electrodes 121 and 122 can be reduced.

[0122] In addition, when the top surface 100t side of the glass main body portion 100 is held by a mounter and the terminal electrodes 121, 122 of the inductor component 1B are mounted on the mounting board so that the bottom surface 100b side of the glass main body portion 100 faces the mounting board, objects are likely to come into contact with the inductor component 1B on the bottom surface 100b side of the glass main body portion 100. However, since the crystallized portion 101 can be separated from the bottom surface 100b side, the possibility of objects coming into contact with the crystallized portion 101 can be reduced, thereby reducing the possibility of the crystallized portion 101 cracking or chipping.

[0123] The second side surface 100s2, the third side surface 100s3, and the fourth side surface 100s4 have the same configuration and effects as the first side surface 100s1. It is sufficient that at least one of the first to fourth side surfaces 100s1 to 100s4 satisfies the above configuration.

[0124] A method for manufacturing the inductor component 1B will now be described.

[0125] First, the mother substrate 200 is manufactured by the same manufacturing method as that shown in Fig. 5A and Fig. 5B of the first embodiment. Then, as shown in Fig. 8A, the first main surface 200a and the second main surface 200b of the mother substrate 200 are etched without providing the protective film 205 shown in Fig. 5D. This allows the crystallized portion 101 that remains without being removed to be located in the center in the Z direction between the first main surface 200a and the second main surface 200b. In other words, the grooves 204 can be provided on both sides in the Z direction, sandwiching the crystallized portion 101.

[0126] 8B, first through conductors 13 and second through conductors 14 are formed in through holes 202 of mother substrate 200, and colored insulating layer 30 is embedded in groove 204 and brought into contact with crystallized portion 101. Thereafter, inductor component 1B is manufactured by the same manufacturing method as that shown in FIGS. 5G to 5K.

[0127] <Fourth embodiment> 9 is an enlarged cross-sectional view showing a fourth embodiment of an inductor component as an electronic component. The fourth embodiment differs from the first embodiment in the sizes of the first protective layer and the second protective layer. This difference in configuration will be described below. The other configurations are the same as those of the first embodiment, and the description thereof will be omitted.

[0128] As shown in FIG. 9, in the inductor component 1C of the fourth embodiment, on the first side surface 100s1, the first protective layer 15 does not overlap the colored insulating layer 30 when viewed from the Z direction, and the second protective layer 16 does not overlap the crystallized portion 101 when viewed from the Z direction. Specifically, when viewed from above in the Z direction, the first protective layer 15 is separated from the colored insulating layer 30. There is a step between the side surface of the first protective layer 15 located in a direction perpendicular to the Z direction and the side surface of the colored insulating layer 30 located in a direction perpendicular to the Z direction. When viewed from below in the Z direction, the second protective layer 16 is separated from the crystallized portion 101. There is a step between the side surface of the second protective layer 16 located in a direction perpendicular to the Z direction and the side surface of the crystallized portion 101 located in a direction perpendicular to the Z direction.

[0129] 5J, in manufacturing the inductor component 1C, the first protective layer 15 and the second protective layer 16 do not overlap the colored insulating layer 30 and the crystallized portion 101 when viewed from the Z direction, and therefore the dicing blade 300 does not come into contact with the first protective layer 15 and the second protective layer 16. Therefore, when cutting with the dicing blade 300, it is possible to prevent the first protective layer 15 and the second protective layer 16 from peeling off from the glass substrate 10 (mother substrate 200). The second side surface 100s2, the third side surface 100s3, and the fourth side surface 100s4 have the same configuration and effects as those of the first side surface 100s1. When viewed from the Z direction, one of the first protective layer 15 and the second protective layer 16 may be disposed so as to overlap the colored insulating layer 30 and the crystallized portion 101. It is sufficient that at least one of the first to fourth side surfaces 100s1 to 100s4 satisfies the above configuration.

[0130] <Fifth embodiment> In the fifth embodiment, a capacitor component will be described as an example of the electronic component according to the present invention. Fig. 10 is a cross-sectional view of the capacitor component. The capacitor component 2 is a surface mount type capacitor component used in, for example, a high frequency signal transmission circuit.

[0131] 10, the capacitor component 2 includes a glass substrate 10, a first plate electrode 21 and a second plate electrode 22 provided on the glass substrate 10, a first protective layer 15 provided on the glass substrate 10 and covering the first plate electrode 21 and the second plate electrode 22, a colored insulating layer 30 provided on the side surface of the glass substrate 10, and a first terminal electrode 221 and a second terminal electrode 222 provided on the glass substrate 10. The first plate electrode 21 and the second plate electrode 22 correspond to an example of an "external conductor" recited in the claims.

[0132] The material of the glass substrate 10 is the same as that of the glass substrate 10 in the first embodiment. That is, the glass substrate 10 has a glass main body portion 100 and a crystallized portion 101. The material of the first protective layer 15 is the same as that of the first protective layer 15 in the first embodiment. The material of the colored insulating layer 30 is the same as that of the colored insulating layer 30 in the first embodiment. The material of the first flat plate electrode 21 and the second flat plate electrode 22 is the same as that of the top surface conductor 11t and the bottom surface conductor 11b in the first embodiment. The material of the first terminal electrode 221 and the second terminal electrode 222 is the same as that of the first terminal electrode 121 and the second terminal electrode 122 in the first embodiment.

[0133] The first plate electrode 21 and the second plate electrode 22 are provided on the top surface 100t of the glass substrate 10. The first plate electrode 21 is in contact with the top surface 100t of the glass substrate 10, and the second plate electrode 22 is located above the first plate electrode 21. A dielectric film 25 is provided between the first plate electrode 21 and the second plate electrode 22. The first plate electrode 21, the second plate electrode 22, and the dielectric film 25 constitute a capacitor element.

[0134] The first terminal electrode 221 and the second terminal electrode 222 are in contact with the bottom surface 100b of the glass substrate 10. The first terminal electrode 221 and the second terminal electrode 222 are spaced apart from each other.

[0135] The capacitor component 2 further has a first through conductor 23 and a second through conductor 24 that penetrate the glass substrate 10. The first through conductor 23 is connected between the first terminal electrode 221 and the first plate electrode 21. The second through conductor 24 is connected between the second terminal electrode 222 and the second plate electrode 22.

[0136] As in the first embodiment, the crystallized portion 101 and the colored insulating layer 30 are provided on each of the first side surface 100s1 to the fourth side surface 100s4 of the glass main body 100. Note that the crystallized portion 101 and the colored insulating layer 30 may each be provided on at least one of the first side surface 100s1 to the fourth side surface s4.

[0137] According to the above configuration, the crystallized portion 101 and the colored insulating layer 30 are provided on the first side surface 100s1 of the glass main body portion 100. Therefore, when the capacitor component 2 is detected from the first side surface 100s1 of the glass main body portion 100 using a detection device such as a laser sensor or a camera, the crystallized portion 101 and the colored insulating layer 30, which have low transparency, can be easily recognized, and the capacitor component 2 can be easily detected.

[0138] Furthermore, since the crystallized portion 101 and the colored insulating layer 30 extend along the Y direction when viewed from a direction perpendicular to the first side surface 100s1, when the detection device is scanned in the Y direction to detect the capacitor component 2, the crystallized portion 101 or the colored insulating layer 30 can be easily recognized, and the capacitor component 2 can be easily detected.

[0139] In addition, since the crystallized portion 101 and the colored insulating layer 30 are provided on the first side surface 100s1 of the glass main body portion 100, it is possible to reduce exposure of the glass main body portion 100, thereby improving the mechanical strength of the capacitor component 2 against external forces. Here, the mechanical strength of crystallized glass is higher than that of non-crystallized glass.

[0140] The second side surface 100s2, the third side surface 100s3, and the fourth side surface 100s4 have the same configuration and effects as the first side surface 100s1. It is sufficient that at least one of the first to fourth side surfaces 100s1 to 100s4 satisfies the above configuration.

[0141] The present disclosure is not limited to the above-described embodiments, and design modifications are possible without departing from the scope of the present disclosure. For example, the features of the first to fifth embodiments may be combined in various ways. In the first to fourth embodiments, an inductor component is used as the electronic component, and in the fifth embodiment, a capacitor component is used as the electronic component, but other electronic components such as resistor components may be used, or a composite component that combines these components may be used.

[0142] In the first to fourth embodiments, outer conductors (bottom conductor and top conductor) are provided on the top and bottom surfaces of the glass body, respectively, and protective layers (first protective layer and second protective layer) are provided on the top and bottom surfaces to cover the outer conductors, respectively, but an outer conductor may be provided on at least one of the top and bottom surfaces of the glass body, and a protective layer may be provided on at least one of the surfaces to cover the outer conductors. Alternatively, a protective layer may not be provided on each of the top and bottom surfaces.

[0143] The present disclosure includes the following aspects. <1> A glass substrate having a glass main body portion including a top surface, a bottom surface, and a first side surface connecting the bottom surface and the top surface, and a protruding crystallized portion provided on the first side surface of the glass main body portion; a colored insulating layer provided on the first side surface of the glass body; a through conductor provided in the glass body and penetrating the top surface and the bottom surface; Equipped with the crystallized portion extends along a first direction parallel to the bottom surface when viewed from a direction perpendicular to the first side surface, An electronic component, wherein at least a portion of the colored insulating layer extends along the first direction when viewed from a direction perpendicular to the first side and is positioned adjacent to the crystallized portion in a second direction perpendicular to the first direction. <2> In the first side surface, the colored insulating layer is provided in all areas where the crystallized portion does not exist. <1> 2. An electronic component as described in claim 1. <3> The thickness of the crystallized portion in a direction perpendicular to the first side surface is the same as the thickness of the colored insulating layer in a direction perpendicular to the first side surface. <1> or <2> 2. An electronic component as described in claim 1. <4> The height of the crystallized portion in the second direction is smaller than the height of the colored insulating layer in the second direction. <1> from <3> 13. An electronic component according to any one of the preceding claims. <5> The relationship between the height h1 of the crystallized portion in the second direction and the height H of the first side surface in the second direction is 1 / 5 <1> from <4> 13. An electronic component according to any one of the preceding claims. <6> a terminal electrode disposed above the bottom surface and electrically connected to the through conductor; the crystallized portion is disposed closer to the bottom surface than the colored insulating layer; <1> from <5> 13. An electronic component according to any one of the preceding claims. <7> a terminal electrode disposed above the bottom surface and electrically connected to the through conductor; the crystallized portion is disposed closer to the top surface than the colored insulating layer; <1> from <5> 13. An electronic component according to any one of the preceding claims. <8> a terminal electrode disposed above the bottom surface and electrically connected to the through conductor; the colored insulating layer includes a first region disposed closer to the top surface than the crystallized portion and a second region disposed closer to the bottom surface than the crystallized portion, <1> from <5> 13. An electronic component according to any one of the preceding claims. <9> an outer conductor disposed above at least one of the top surface and the bottom surface and electrically connected to the through conductor; a protective layer provided above the at least one surface so as to cover the outer surface conductor; Equipped with <1> from <8> 13. An electronic component according to any one of the preceding claims. <10> providing a mother substrate made of photosensitive glass and including a first main surface and a second main surface; a step of irradiating a cut region of the first main surface with ultraviolet light and then crystallizing the mother substrate by heat treatment to form a crystallized portion extending in a direction parallel to the first main surface and extending from the first main surface to the second main surface; removing a portion of the crystallized portion by etching in the cutting region while leaving a portion of the crystallized portion, thereby forming a groove extending in a direction parallel to the first main surface; forming a through conductor penetrating the first main surface and the second main surface of the mother substrate; embedding a colored insulating layer in the groove and bringing the colored insulating layer into contact with the crystallized portion; cutting the colored insulating layer and the crystallized portion along the cutting region to divide the mother substrate into a plurality of electronic components; A method for manufacturing an electronic component comprising the steps of: <11> Furthermore, before the step of dividing the motherboard to obtain a plurality of electronic components, forming an outer surface conductor electrically connected to the through conductor above at least one of the first main surface and the second main surface; forming a protective layer over the at least one surface so as to cover the outer surface conductor; Equipped with <10> A method for manufacturing an electronic component according to claim 1. [Explanation of symbols]

[0144] 1,1A,1B,1C Inductor components (electronic components) 2. Capacitor parts (electronic parts) 10 Glass substrate 11b Bottom conductor (outer conductor) 11t Top conductor (outer conductor) 13,23 First through conductor 14,24 Second through conductor 15 1st protective layer 16 Second protective layer 21 First plate electrode (outer conductor) 22 Second plate electrode (outer conductor) 25 Dielectric Film 30 Colored Insulation Layer 31 First area 32 Second area 100 Glass body 100b bottom 100t Top 100s1~100s4 1st to 4th sides 101 Crystallization Department 110 Coil 121,221 1st terminal electrode 122,222 2nd terminal electrode 200 Motherboard 200a First main surface 200b 2nd principal surface 201 Through conductor forming area 202 Through hole 203 Cutting area 204 Groove 205 Protective film 300 Dicing Blade AX axis t1 Thickness of the crystallized part t2 Thickness of colored insulating layer h1 Height of crystallization area h2 Height of colored insulation layer H Height of first side

Claims

1. A glass substrate having a glass main body portion including a top surface, a bottom surface, and a first side surface connecting the bottom surface and the top surface, and a protruding crystallized portion provided on the first side surface of the glass main body portion; a colored insulating layer provided on the first side surface of the glass body; a through conductor provided in the glass body and penetrating the top surface and the bottom surface; Equipped with the crystallized portion extends along a first direction parallel to the bottom surface when viewed from a direction perpendicular to the first side surface, An electronic component, wherein at least a portion of the colored insulating layer extends along the first direction when viewed from a direction perpendicular to the first side, and is positioned adjacent to the crystallized portion in a second direction perpendicular to the first direction.

2. The electronic component according to claim 1 , wherein the colored insulating layer is provided in all areas of the first side surface that are not occupied by the crystallized portion.

3. 3 . The electronic component according to claim 1 , wherein a thickness of the crystallized portion in a direction perpendicular to the first side surface is the same as a thickness of the colored insulating layer in a direction perpendicular to the first side surface.

4. The electronic component according to claim 1 , wherein a height of the crystallized portion in the second direction is smaller than a height of the colored insulating layer in the second direction.

5. 3 . The electronic component according to claim 1 , wherein a relationship between a height h1 of the crystallized portion in the second direction and a height H of the first side surface in the second direction satisfies 1 / 5<h1 / H<1 / 2.

6. a terminal electrode disposed above the bottom surface and electrically connected to the through conductor; The electronic component according to claim 1 , wherein the crystallized portion is disposed closer to the bottom surface than the colored insulating layer.

7. a terminal electrode disposed above the bottom surface and electrically connected to the through conductor; The electronic component according to claim 1 , wherein the crystallized portion is disposed closer to the top surface than the colored insulating layer.

8. a terminal electrode disposed above the bottom surface and electrically connected to the through conductor; 3. The electronic component according to claim 1, wherein the colored insulating layer includes a first region disposed closer to the top surface than the crystallized portion, and a second region disposed closer to the bottom surface than the crystallized portion.

9. an outer conductor disposed above at least one of the top surface and the bottom surface and electrically connected to the through conductor; a protective layer provided above the at least one surface so as to cover the outer surface conductor; The electronic component according to claim 1 or 2, comprising:

10. providing a mother substrate made of photosensitive glass and including a first main surface and a second main surface; a step of irradiating a cut region of the first main surface with ultraviolet light and then crystallizing the mother substrate by heat treatment to form a crystallized portion extending in a direction parallel to the first main surface and extending from the first main surface to the second main surface; removing a portion of the crystallized portion by etching in the cutting region while leaving a portion of the crystallized portion, thereby forming a groove extending in a direction parallel to the first main surface; forming a through conductor penetrating the first main surface and the second main surface of the mother substrate; embedding a colored insulating layer in the groove and bringing the colored insulating layer into contact with the crystallized portion; cutting the colored insulating layer and the crystallized portion along the cutting region to divide the mother substrate into a plurality of electronic components; A method for manufacturing an electronic component comprising the steps of:

11. Furthermore, before the step of dividing the motherboard to obtain a plurality of electronic components, forming an outer surface conductor electrically connected to the through conductor above at least one of the first main surface and the second main surface; forming a protective layer over the at least one surface so as to cover the outer surface conductor; The method for manufacturing an electronic component according to claim 10, comprising:

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