Resonator

Abstract

To provide a resonator having excellent vibration characteristics.SOLUTION: A vibrational structure 200 includes a vibration region 210, a projection part 220, an opening 230, and a frame part 240. The vibration region 210 includes a first surface and a second surface facing the first surface; the projection part 220 surrounds the vibration region 210; the opening 230 is provided between the vibration region 210 and the projection part 220 on one side of the vibration region 210; the opening 230 has a first side 232 adjacent to the vibration region 210 and a second side 234 distant from a vibration part; the second side 234 faces the first side 232; the length of the first side 232 is longer than that of the second side 234; the frame part 240 surrounds the projection part 220; and a first electrode 110 is provided on the first surface; and a second electrode is provided on the second surface.SELECTED DRAWING: Figure 2A

Description

[Background technology]

[0001] The present invention relates to electronic components, and more particularly to resonators.

[0002] A resonator is an electronic component that utilizes the piezoelectric properties of a material and the natural resonant frequency of the material. A common material used for resonators is quartz. When a spectral resonator is manufactured, a quartz wafer is usually cut into multiple pieces of quartz. For example, a laser is used for the cutting.

[0003] However, when the laser heats and cuts the quartz wafer, it can easily transform the single crystal quartz material into bi-crystalline or polycrystalline quartz material, thereby affecting the natural resonant frequency of the quartz crystal.

[0004] In addition, when the vibration structure of the quartz chip is adhesively fixed to the base, the stress transmitted from the adhesive application position to the vibration area also affects the vibration characteristics of the chip.

[0005] For this reason, one of the important research and development challenges in this field is how to reduce the impact of the bicrystal or polycrystal phenomenon caused by laser cutting of the wafer and the stress transmitted from the adhesive application position to the vibration area on the vibration characteristics of the chip. Summary of the Invention [Problem to be solved by the invention]

[0006] The present invention provides a resonator with good vibration characteristics. [Means for solving the problem]

[0007] One embodiment of the present invention provides a resonator including a vibrating structure, a first electrode, and a second electrode. The vibrating structure includes a vibrating region, a protrusion, an opening, and a frame. The vibrating region includes a first surface and a second surface opposite the first surface. The protrusion surrounds the vibrating region. The opening is provided on one side of the vibrating region and between the vibrating region and the protrusion. The opening has a first side adjacent to the vibrating region and a second side remote from the vibrating portion. The second side faces the first side. The length of the first side is longer than the length of the second side. The frame surrounds the protrusion. The first electrode is provided on the first surface, and the second electrode is provided on the second surface. Effect of the Invention

[0008] According to an embodiment of the present invention resonator In the present invention, the opening is located between the vibration region of the vibration structure and the protrusion, and the length of a first side of the opening adjacent to the vibration region is longer than the length of a second side farther from the vibration region. Therefore, when the protrusion is adhesively fixed on the base, the opening can block stress transmitted from the adhesive fixing position to the vibration region, optimizing the vibration characteristics of the vibration region. In addition, resonator In the present invention, the periphery of the protrusion of the vibrating structure has a frame, which can be used for laser cutting to keep the bi-crystal or poly-crystal phenomenon on the frame without affecting the vibrating region. resonator has good vibration characteristics. [Brief description of the drawings]

[0009] [Figure 1A] FIG. 2 is a schematic exploded view of a resonator according to one embodiment of the present invention. [Figure 1B] FIG. 1B is a schematic cross-sectional view of the resonator in FIG. 1A. [Figure 2A] FIG. 1B is a schematic top view of the vibrating structure in FIG. 1A. [Figure 2B] FIG. 2B is a schematic perspective view of the vibrating structure in FIG. 2A. [Figure 2C] FIG. 2C is a schematic cross-sectional view of the vibrating structure along line II in FIG. 2B. [Figure 3A]5A-5C are schematic top views of the vibration structure of a resonator according to two further embodiments of the present invention. [Figure 3B] 5A-5C are schematic top views of the vibration structure of a resonator according to two further embodiments of the present invention. [Figure 4] 4 is a schematic cross-sectional view of a vibration structure of a resonator according to yet another embodiment of the present invention. [Diagram 5] 1 is a schematic cross-sectional view of a resonator according to yet another embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] FIG. 1A illustrates a schematic diagram of a semiconductor device according to one embodiment of the present invention. resonator FIG. 1B is a schematic exploded view of the resonator 1A. FIG. 2B is a schematic perspective view of the vibration structure in FIG. 2A. FIG. 2C is a schematic cross-sectional view of the vibration structure in FIG. 2B taken along line II, and the schematic cross-sectional view of the vibration structure in FIG. 1B is a schematic cross-sectional view of the vibration structure taken along line II-II in FIG. 2B. With reference to FIGS. 1A, 1B, and 2A to 2C, resonator 100 includes a vibrating structure 200, a first electrode 110, and a second electrode 120. In this embodiment, the material of the vibrating structure 200 is a piezoelectric material, such as quartz or other piezoelectric material.

[0011] The vibrating structure 200 includes a vibrating region 210, a protrusion 220, an opening 230, and a frame 240. The vibrating region 210 includes a first surface 212 and a second surface 214 opposite to the first surface 212. A first electrode 110 is provided on the first surface 212, and a second electrode 120 is provided on the second surface 214. The region between the first electrode 110 and the second electrode 120 is the vibrating region 210. When a voltage difference is applied between the first electrode 110 and the second electrode 120, the vibrating region 210 is deformed due to the inverse piezoelectric effect. Then, when the voltage difference is removed, the vibrating region 210 vibrates, and due to the piezoelectric effect, a voltage change occurs between the first electrode 110 and the second electrode 120 with the vibration, and the first electrode 110 and the second electrode 120 output a voltage signal. The vibration region 210 may be, for example, a flat plate, and the first electrode 110 and the second electrode 120 may be electrode layers provided on two opposing surfaces of the flat vibration region 210 .

[0012] In addition, the protrusion 220 surrounds the vibrating region 210, and the opening 230 is provided on one side of the vibrating region 210 and between the vibrating region 210 and the protrusion 220. The opening 230 has a first side 232 adjacent to the vibrating region 210 and a second side 234 far from the vibrating region 210. The second side 234 faces the first side 232, and the length L1 of the first side 232 is longer than the length L2 of the second side 234. In addition, the frame 240 surrounds the protrusion 220. In this embodiment, the thickness T3 of the frame 240 is less than the thickness T2 of the protrusion 220, and the thickness T1 of the vibrating region 210 is less than the thickness T2 of the protrusion 220. When the vibrating structure 200 is manufactured, the vibrating structures 200 arranged in an array may be formed on a wafer (e.g., a quartz wafer). Each vibrating structure 200 includes a vibrating region 210, a protrusion 220, and a frame 240, where the frame 240 of adjacent vibrating structures 200 are connected to each other. The frame 240 is then cut with a laser to cut the originally connected vibrating structures 200 into separate individual vibrating structures 200.

[0013] In this embodiment, the resonator 100 further includes a base 130 and at least one adhesive 140 (two adhesives are shown in FIG. 1A as an example). The vibrating structure 200 is provided on the base 130. In this embodiment, the base 130 has a recess 132, and the vibrating structure 200 is provided in the recess 132. In addition, in this embodiment, the resonator 100 further includes a top cover 150 provided on the base 130 and covering the vibrating structure 200. In this embodiment, the top cover 150 may be provided on the base 130 via a sealing ring 160.

[0014] The adhesive 140 bonds the protrusion 220 and the base 130, and is provided near the opening 230 to fix the vibration structure 200 on the base 130. In this embodiment, two adhesives 140 are provided near two ends of the opening 230, respectively, and are provided on the back side of the region R1 in FIG. 2A.

[0015] In the resonator 100 of this embodiment, the opening 230 is between the vibration region 210 and the protrusion 220 of the vibration structure 200, and the length L1 of the first side 232 of the opening 230 adjacent to the vibration region 210 is longer than the length L2 of the second side 234 far from the vibration region 210. Therefore, when the protrusion 220 is fixed to the base 130 via the adhesive 140, the opening 230 can block the stress transmitted from the fixed position (i.e., the region R1) to the vibration region 210, optimizing the vibration characteristics of the vibration region 210. In this embodiment, the opening 230 further includes two opposing stepped short sides 236 connected to the first side 232 and the second side 234. Each stepped short side 236 includes sub-sides 236a, 236b, and 236c, which are connected in sequence between the first side 232 and the second side 234 in a bent shape to form a step shape.

[0016] In addition, in the resonator 100 of this embodiment, the periphery of the protrusion 220 of the vibration structure 200 has a frame 240. The frame 240 is used for laser cutting, and keeps the bi-crystal or poly-crystal phenomenon caused by the laser cutting in the frame 240 without affecting the vibration region 210. That is, the vibration region 210 is maintained in a single crystal state without affecting its natural resonance frequency. Therefore, the resonator 100 of this embodiment has good vibration characteristics. In addition, in a design in which the thickness T3 of the frame 240 is less than the thickness T2 of the protrusion 220, a low laser output can be used. in It is expected that the frame 240 can be cut, reducing the bi-crystal range and the effect on the vibration region 210 caused by the laser cutting. In addition, the design in which the thickness T2 of the protrusion 220 is less than the thickness T3 of the frame 240 helps to block the heat generated by the laser cutting around the protrusion 220, protecting the vibration region 210 from bi-crystal or poly-crystal phenomenon. In one embodiment, the thickness T3 of the frame 240 can be equal to the thickness T1 of the vibration region 210. In this embodiment, the ratio of the width W1 of the frame 240 to the thickness T1 of the vibration region 210 is greater than 0.1 and less than 10. Such a design can allow the bi-crystal or poly-crystal phenomenon caused by the laser cutting of the frame 240 to remain in the frame 240 without affecting the vibration region 210.

[0017] In this embodiment, the protrusion 220 has an inner slope 222 adjacent to the vibration region 210, an outer slope 224 far from the vibration region 210, and a top surface 226 connected to the inner slope 222 and the outer slope 224. In this embodiment, both the inner slope 222 and the outer slope 224 are inclined with respect to the extension direction of the vibration region 210, and the top surface 226 may be parallel to the extension direction of the vibration region 210. In this embodiment, the protrusion 220 may protrude upward and downward with respect to the vibration region 210. Therefore, both the upper side and the lower side of the protrusion 220 may have the inner slope 222, the outer slope 224, and the top surface 226.

[0018] In this embodiment, the resonator 100 further includes a number of pads 170 disposed below the pedestal 130. The pads 170 may be electrically connected to the first electrode 110 and the second electrode 120, respectively, via conductive traces 180. In this manner, an external voltage may be applied to the pads 170 and changes in the output voltage of the pads may be sensed.

[0019] 3A and 3B show two alternative embodiments of the present invention. resonator 3A and 3B, the vibrating structure 200d in the embodiment of FIG. 3A and the vibrating structure 200e in the embodiment of FIG. 3B are similar to the vibrating structure 200 in FIG. 2C, with the following differences: In the embodiment of FIG. 3A, the opening 230d includes two opposing slanted short sides 236d that connect to the first side 232 and the second side 234. In this embodiment, the slanted short sides 236d are slanted with respect to the first side 232 and the second side 234. In the embodiment of FIG. 3B, the opening 230e includes two opposing arcuate short sides 236e that connect to the first side 232 and the second side 234.

[0020] FIG. 4 shows yet another embodiment of the present invention. resonator4 is a schematic cross-sectional view of the vibrating structure of FIG. 4. Referring to FIG. 4, the vibrating structure 200f of this embodiment is similar to the vibrating structure 200 in FIG. 2C, and the difference is as follows. Compared with the vibrating structure 200 in FIG. 2C, the vibrating structure 200f of this embodiment further includes another protrusion 250 and another frame 260. The protrusion 250 surrounds the frame 240, and the frame 260 surrounds the protrusion 250. The design of the another protrusion 250 and the another frame 260 allows the cutting position of the laser to hit the frame 260. In this way, the frame 260 cut by the laser is further away from the vibrating region 210, and the bi-crystal or poly-crystal phenomenon caused by the laser cutting can be kept in the frame 260 without affecting the vibrating region 210. In other embodiments, the number of the another protrusion 250 and the another frame 260 may be one or more. For example, the number of the other protrusions 250 may be two or more, and the number of the other frame portions 260 may be two or more. That is, there may be two or more pairs of protrusions 250 and frame portions 260. The innermost protrusion 250 surrounds the frame portion 240, and the rear frame portion 260 and the other protrusions 250 alternately surround the innermost protrusion 250. In this way, the cutting position of the laser hits the outermost frame portion 260, and the frame portion 260 cut by the laser is further away from the vibration region 210, and further, the bicrystal or polycrystal phenomenon caused by the laser cutting can be kept in the frame portion 260 without affecting the vibration region 210. In this embodiment, the thickness T4 of the protrusion 250 is thicker than the thickness T5 of the frame portion 240, which helps to block the heat generated by the laser cutting around the protrusions 250 and protects the vibration region 210 from the bicrystal or polycrystal phenomenon.

[0021] It should be noted that thicknesses T1, T2, T3, T4, and T5 are thicknesses in a direction perpendicular to the vibration region 210. Width W1 is a width in a direction parallel to the vibration region 210, and lengths L1 and L2 are lengths in a direction parallel to the vibration region 210.

[0022] FIG. 5 shows yet another embodiment of the present invention. resonator 5 is a schematic cross-sectional view of the embodiment. resonator100g is the weight of Figure 1B resonator 100, and the difference between the two is resonator The vibration structure 200 of the vibration device 100 is fixed to the base by bonding the protrusion 220 to the base 130 with the adhesive 140. resonator At 100g, the frame 240 of the vibrating structure 200 is sandwiched between the edge of the upper cover 150 and the edge of the base 130. In addition, resonator 100g further includes an annular bonding layer 190 for bonding the edge of the base 130 to the frame 240. In addition, resonator 100g further includes another annular bonding layer 190 for bonding the edge of the top cover 150 and the frame 240. In this way, the vibrating structure 200 can still be fixed on the base 130, and the vibrating region 210 can vibrate.

[0023] Based on the above, according to an embodiment of the present invention resonator In the present invention, the opening is located between the vibration region of the vibration structure and the protrusion, and the length of a first side of the opening adjacent to the vibration region is longer than the length of a second side farther from the vibration region. Therefore, when the protrusion is adhesively fixed on the base, the opening can block stress transmitted from the adhesive fixing position to the vibration region, optimizing the vibration characteristics of the vibration region. In addition, resonator In the present invention, the periphery of the protrusion of the vibrating structure has a frame, which can be used for laser cutting to keep the bi-crystal or poly-crystal phenomenon on the frame without affecting the vibrating region. resonator has good vibration characteristics. [Industrial Applicability]

[0024] In the present invention resonator can be applied to laser cutting. [Explanation of symbols]

[0025] 100, 100g: resonator 110: First electrode 120: second electrode 130: Pedestal 132: Recess 140:Adhesive 150: Top cover 160: Sealing ring 170: Pad 180: Conductive trace 190: Annular bonding layer 200, 200d, 200e, 200f: Vibration structure 210: Vibration area 212: First Surface 214: Second Surface 220, 250: Protrusion 222: Inner slope 224: Outer slope 226:Top surface 130, 230d, 230e: Aperture 232: First side 234: Second side 236: Stepped short side 236a, 236b, 236c: Subside 236d: Sloping short side 240, 260: Frame L1, L2: Length R1: area T1, T2, T3, T4, T5: Thickness W1:Width

Claims

1. A vibration region including a first surface and a second surface opposite to the first surface; A protrusion surrounding the vibration region; an opening provided on one side of the vibration region and between the vibration region and the protrusion; A frame portion that surrounds the periphery of the protrusion and is used for laser cutting; Including, The opening has a first side adjacent to the vibration region and a second side far from the vibration portion, the second side faces the first side, and the length of the first side is longer than the length of the second side. A vibration structure; a first electrode disposed on the first surface; a second electrode provided on the second surface; Including, a thickness of the frame portion is less than a thickness of the protrusion portion, and a thickness of the vibration region is less than a thickness of the protrusion portion, The thickness of the frame is equal to the thickness of the vibration region, A resonator, wherein a ratio of a width of the frame to a thickness of the vibration region is greater than 0.1 and less than 10.

2. The resonator of claim 1 , wherein the opening further comprises two opposing stepped short sides connecting the first side and the second side.

3. A resonator as described in claim 2, wherein each of the stepped short sides includes a plurality of sub-sides, which are connected in sequence between the first side and the second side in a bent shape to form a stepped closed region.

4. The resonator of claim 1 , wherein the opening further comprises two opposing slanted short sides connecting the first side and the second side.

5. The resonator of claim 1 , wherein the opening further comprises two opposing arcuate short sides connecting the first side and the second side.

6. a base on which the vibration structure is mounted; The resonator according to claim 1 , further comprising at least one adhesive material that bonds the protrusion and the base and is provided in the vicinity of the opening.

7. The resonator of claim 6 , wherein the at least one adhesive material comprises two adhesive materials disposed respectively adjacent two ends of the opening.

8. The resonator according to claim 6 , wherein the base has a recess, and the vibrating structure is disposed in the recess.

9. The resonator of claim 8 , further comprising a top cover disposed on the pedestal and covering the vibrating structure.

10. The resonator of claim 1 , wherein the material of the vibrating structure is a piezoelectric material.

11. The vibrating structure comprises: Another protrusion surrounding the frame; and another frame portion surrounding the another protrusion portion; The resonator of claim 1 further comprising:

12. The resonator of claim 1 , wherein the protrusion has an inner slope adjacent to the vibration region, an outer slope remote from the vibration region, and a top surface connecting the inner slope and the outer slope.

13. With a pedestal, An upper cover; An annular bonding layer Another annular bonding layer Further comprising: the frame of the vibration structure is sandwiched between an edge of the upper cover and an edge of the base, the annular bonding layer bonds the edge portion and the frame portion of the base; The resonator of claim 1 , wherein the another annular bonding layer bonds the edge of the top cover and the rim.

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