Atomization core, atomizer and electronic atomization device

Abstract

To provide an atomization core, an atomizer, and an electronic atomization device.SOLUTION: An atomization core 10 includes a porous base material 11, a heat generation layer 12, and an oxide layer 13. The porous base material 11 includes an atomization surface 111, the heat generation layer 12 is installed on the atomization surface 111 of the porous base material 11, and the oxide layer 13 is installed on the surface of the heat generation layer 12 separate from the porous base material 11. Since the heat generation layer 12 is installed on the atomization surface 111 of the porous base material 11 and the oxide layer 13 is installed on the surface of the heat generation layer 12 separate from the porous base material 11, the heat generation layer 12 of the atomization core 10 is protected so that it is possible to avoid the influence on heat generating performance of the atomization core 10 by the oxidization of the heat generation layer 12 during an atomization process and resultant breakdown, and avoid the influence on the stability and service life of the product.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present application relates to the technical field of atomizers, and in particular to an atomizing core, an atomizer, and an electronic atomizing device. [Background technology]

[0002] The electronic atomization device generally consists of an atomizer and a power supply assembly. The power supply assembly is used to supply power to the atomizer. The atomizer is energized to heat and atomize the aerosol-generating substrate to generate an aerosol for inhalation by the user. The atomization core includes a porous substrate and a heating component. In the heating and atomization process of the atomizer, the heating component of the atomization core is mainly energized to generate heat, thereby realizing the heating and atomization of the aerosol-generating substrate.

[0003] Generally, the heating element of the atomizing core is a metal heating film layer. If the oil supply is insufficient during the atomizing process, the metal heating film layer will be easily oxidized and broken, which will affect the stability and service life of the product. Summary of the Invention [Problem to be solved by the invention]

[0004] The present application mainly provides an atomizing core, an atomizer and an electronic atomizing device, which can solve the problem in the prior art that the metal heating film layer of the atomizing core is prone to failure during the atomization process and has a short service life. [Means for solving the problem]

[0005] In order to solve the above technical problems, the first technical solution provided in this application provides an atomization core, the atomization core includes a porous substrate, a heat generation layer and an oxide layer, the porous substrate has an atomization surface, the heat generation layer is disposed on the atomization surface of the porous substrate, and the oxide layer is disposed on a surface of the heat generation layer away from the porous substrate.

[0006] Here, the oxide layer includes aluminum oxide and / or silicon oxide.

[0007] Here, the oxide layer has a thickness of 200 nm to 600 nm.

[0008] Here, the oxide layer is formed on the surface of the heating layer remote from the porous substrate by a physical vapor deposition method.

[0009] Here, the atomizing core further includes two electrodes, the two electrodes being disposed on a surface of the heat generating layer away from the porous substrate, and the heat generating layer being covered by both the oxide layer and the two electrodes.

[0010] Here, the thickness of the oxide layer is less than the thickness of the electrode.

[0011] Here, the heat generating layer is a porous heat generating film.

[0012] Here, the oxide layer is a porous structure.

[0013] Here, the porous substrate is a porous ceramic substrate or a porous dense substrate.

[0014] In order to solve the above technical problems, another technical solution provided in the present application provides an atomizer, which includes a liquid storage chamber for storing an aerosol-generating substrate and any one of the atomization cores, and the atomization core is used to absorb, heat and atomize the aerosol-generating substrate in the liquid storage chamber.

[0015] In order to solve the above technical problems, another technical solution provided in this application provides an electronic atomization device, which includes a power supply assembly and the atomizer, and the power supply assembly is used to supply energy to the atomizer. Effect of the Invention

[0016] Different from the state of the art, this application discloses an atomizing core, an atomizer and an electronic atomizing device. The atomizing core includes a porous substrate, a heating layer and an oxide layer. The porous substrate has an atomizing surface, the heating layer is disposed on the atomizing surface of the porous substrate, and the oxide layer is disposed on the surface of the heating layer remote from the porous substrate. By disposing the oxide layer on the surface of the heating layer remote from the porous substrate, during the heating atomization process, the oxide layer protects the heating layer, avoids the heating layer being damaged due to oxidation during the atomization process, improves the stability of the heating layer, and extends the service life of the heating layer. [Brief description of the drawings]

[0017] In order to more clearly describe the technical solutions in the embodiments of the present application or the prior art, the following briefly describes the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. Those skilled in the art can obtain other drawings from these drawings without creative efforts. [Figure 1] FIG. 1 is a structural schematic diagram of an electronic atomization device according to an embodiment of the present application; [Diagram 2] FIG. 2 is a schematic structural diagram of an atomizer in the electronic atomization device provided in FIG. 1; [Diagram 3] FIG. 3 is a schematic structural diagram of an embodiment of the atomizing core of FIG. 2; [Figure 4] FIG. 4 is a schematic top view of the atomizing core of FIG. 3; [Diagram 5] FIG. 3 is a schematic structural diagram of another embodiment of the atomizing core of FIG. 2; [Figure 6] FIG. 3 is a schematic structural diagram of yet another embodiment of the atomizing core of FIG. 2;

[0018] Hereinafter, the technical solutions of the embodiments of the present application will be described clearly and completely with reference to the drawings of the embodiments of the present application. It is understood that the described embodiments are only some of the embodiments of the present application, but not all of them. Based on the embodiments of the present application, all other embodiments that a person skilled in the art can obtain without inventive work are all within the scope of protection of the present application.

[0019] The terms "first", "second", "third", etc. in this application are used for descriptive purposes only and should not be construed as indicating or implying a relative importance or the number of technical features depicted. Thus, a feature defined as "first", "second", "third" may explicitly or implicitly include at least one of the features. In the description of this application, "plurality" means at least two, e.g., two, three, etc., unless otherwise clearly and specifically defined. Also, the terms "comprise", "have" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the recited steps or units, but may optionally further include unrecited steps or units, or may optionally further include other steps or units inherent to these processes, methods, products, or apparatus.

[0020] The term "embodiment" as used herein means that a particular feature, structure, or characteristic described with reference to the embodiment may be included in at least one embodiment of the present application. The appearance of the term in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. As will be understood by those skilled in the art, both explicitly and implicitly, the embodiments described herein can be combined with other embodiments.

[0021] Referring to FIG. 1 and FIG. 2, FIG. 1 is a schematic structural diagram of an electronic atomization device provided in the present application, and FIG. 2 is a schematic structural diagram of an atomizer in the electronic atomization device provided in FIG.

[0022] 1, the present application provides an electronic atomization device 300. The electronic atomization device 300 includes an atomizer 100 and a power supply assembly 200. The power supply assembly 200 is used to provide energy to the atomizer 100. When the atomizer is energized, it heats and atomizes an aerosol-generating substrate to generate an aerosol for inhalation by a user.

[0023] Optionally, the atomizer 100 and the power assembly 200 in the electronic atomization device 300 may be of integral construction or may be removably connected, and may be designed as required.

[0024] As shown in Fig. 2, the nebulizer 100 includes a liquid storage chamber 90, an outlet tube 30, an atomizing core 10 and an atomizing chamber 20 formed in the nebulizer 100. The liquid storage chamber 90 is used to store an aerosol-generating substrate. The atomizing core 10 is used to absorb the aerosol-generating substrate in the liquid storage chamber 90, and heats and atomizes the absorbed aerosol-generating substrate to finally generate an aerosol. The aerosol generated by atomization flows into the atomizing chamber 20 through the outlet tube 30 together with the external airflow, and finally flows out of the nebulizer 100 and is inhaled by the user.

[0025] The heating component of the atomizing core 10 is generally a metal heating film layer. The nanoparticles of the metal heating film layer are easily oxidized and broken during the sintering and atomizing process, especially when the oil supply is insufficient. In response to the problem that the metal heating film layer is easily oxidized and broken, the prior art generally installs a protective layer made of precious metals such as gold and platinum on the surface of the metal heating film layer to solve this technical problem. However, particles such as gold and platinum are easily burned too much when there is a small amount of aerosol-generating substrate, and the precious metal particles are agglomerated, which causes the metal heating film layer to be exposed to air and oxidized and broken. In view of this, the present application provides an atomizing core 10, which will be described in detail below.

[0026] 3 and 4, FIG. 3 is a schematic structural view of one embodiment of the atomizing core of FIG. 2, and FIG. 4 is a schematic top structural view of the atomizing core of FIG. 3 provided.

[0027] The atomizing core 10 includes a porous substrate 11, a heat generating layer 12, and an oxide layer 13. The porous substrate 11 has an atomizing surface 111, the heat generating layer 12 is disposed on the atomizing surface 111 of the porous substrate 11, and the oxide layer 13 is disposed on the surface of the heat generating layer 12 remote from the porous substrate 11. By disposing the oxide layer 13 on the surface of the heat generating layer 12 remote from the porous substrate 11, the heat generating layer 12 is protected and the heat generating layer 12 is prevented from directly contacting with the air. This can prevent the heat generating layer 12 from being damaged due to oxidation in the heating environment. It is beneficial to improve the stability of the heat generating layer 12 and extend the service life of the heat generating layer 12.

[0028] In this embodiment, specifically, the material of the oxide layer 13 may be aluminum oxide, silicon oxide, or a mixture of aluminum oxide and silicon oxide. The materials of the oxide layer 13 are all oxides, which have strong oxidation resistance, and both aluminum oxide and silicon oxide are highly stable oxides, and their performance is relatively stable. Thus, even if the oxide layer 13 comes into contact with air during the atomization process, the oxide layer 13 does not easily generate an oxidation reaction and does not change its performance, so that the stability of the atomization core 10 is guaranteed. At the same time, the melting point and boiling point of aluminum oxide and silicon oxide are relatively high, and their high temperature resistance is strong. During the atomization process, even if the aerosol-generating substrate in the atomization core 10 is insufficient and the aerosol-generating substrate is over-combusted, the oxide layer 13 will not cause particles to aggregate due to over-combustion, and will not cause the failure of the atomization core 10. Thus, when precious metal materials such as gold and platinum are used as the protective layer of the atomizing core 10, and the amount of aerosol-generating substrate in the atomizing core 10 is small, the over-burning of the precious metal material causes the aggregation of precious metal particles, which leads to the failure of the atomizing core 10. The stability of the atomizing core 10 is improved, and the service life of the atomizing core 10 is extended. At the same time, compared with the case where a precious metal material is used as the protective layer, the cost of forming the protective layer of the heating layer 12 with oxide is low, which can effectively save the manufacturing cost of the atomizer 100.

[0029] The oxide layer 13 is formed by depositing an oxide on the surface of the heating layer 12 away from the porous substrate 11. Specifically, in this embodiment, the oxide layer 13 is formed by sputtering an oxide by a sputtering method. Alternatively, the sputtering method may employ techniques such as DC sputtering, AC sputtering, and magnetron sputtering. The material itself, such as aluminum oxide or silicon oxide, employed for the oxide layer 13 is a highly dense material. However, since the oxide layer 13 is formed on the surface of the heating layer 12 by a sputtering method, the structure of the oxide layer 13 also becomes a porous structure by this manufacturing process.

[0030] The thickness of the oxide layer 13 is 200nm to 600nm, which allows the oxide layer 13 to better protect the heat generating layer 12. As can be seen, if the thickness of the oxide layer 13 is too small, the strength of the structure of the oxide layer 13 is reduced, and the ability of the oxide layer 13 to block air is also weakened, and the protection performance of the oxide layer 13 against the heat generating layer 12 is weakened. This causes air to contact the heat generating layer 12, which causes the heat generating layer 12 to be oxidized, and further causes the atomization core 10 to break down. At the same time, the inventor has found that the thickness of the oxide layer 13 should not be too thick. On the one hand, the thermal conductivity of the oxide layer 13 itself is smaller than that of the metal material, and if the thickness of the oxide layer 13 is too thick, it will affect the temperature rise rate of the atomization surface 111 and also affect the amount of aerosol generated by atomization. On the other hand, since the atomization surface 111 has a porous structure, if the thickness of the oxide layer 13 is too thick, the oxide layer 13 will block the porous structure, reduce the liquid conductivity, and cause problems such as abnormal high temperature and empty burning.

[0031] In other embodiments, oxide layer 13 can be formed by other techniques as long as protection of heat generating layer 12 is achieved.

[0032] The shape and size of the porous substrate 11 are not limited. The porous substrate 11 is formed from a material having a porous structure. For example, the porous substrate 11 can be formed from porous ceramic, porous glass, porous plastic, porous metal, etc. In this embodiment, the material of the porous substrate 11 is porous ceramic. Since the porous ceramic has pores and has the function of conducting and storing liquid, the aerosol-generating substrate in the liquid storage chamber 90 is absorbed by the porous substrate 11 and penetrates into the atomization surface 111 to be heated and atomized. At the same time, the porous ceramic has stable chemical properties and does not chemically react with the aerosol-generating substrate, and the porous ceramic can withstand high temperatures and is not deformed by excessive heating temperatures during the atomization process. The porous ceramic is an insulator and is electrically connected to the heating layer 12 installed on its surface, which does not short-circuit and cause the atomization core 10 to fail, and the porous ceramic is easy to manufacture and has a low cost. In this embodiment, the porous substrate 11 is a rectangular parallelepiped porous ceramic substrate.

[0033] In some embodiments, the porous ceramic has a porosity of 30% to 70%. Porosity refers to the ratio of the total volume of small pores in a porous medium to the total volume of the porous medium. The size of the porosity can be adjusted according to the components of the aerosol-generating substrate. For example, when the viscosity of the aerosol-generating substrate is relatively high, a higher porosity is selected to ensure the conductive effect of the liquid.

[0034] In other embodiments, the porosity of the porous ceramic may be 50% to 60%. The porosity of the porous ceramic is 50% to 60%, which, on the one hand, ensures that the porous ceramic has good liquid conduction efficiency, prevents the occurrence of dry burning caused by poor circulation of the aerosol generating substrate, and improves the atomization effect of the atomizer 100. On the other hand, it can avoid that the porosity of the porous ceramic is too large and the liquid conduction speed is too fast, making it difficult to lock the liquid, greatly increasing the possibility of liquid leakage and affecting the performance of the atomizer 100.

[0035] In other embodiments, when other materials having a porous structure are used to form the porous substrate 11, the settings such as the porosity ratio of the porous substrate 11 can be set with reference to the settings of porous ceramics, but the present application will not repeat them here.

[0036] As can be appreciated, when the porous substrate 11 is a porous glass, a porous plastic, or a porous metal, the porous glass, the porous plastic, or the porous metal can be formed by drilling holes in a dense glass, plastic, or metal substrate.

[0037] When the porous substrate 11 is a porous metal, an insulating layer is provided between the porous substrate 11 and the heating layer 12. The insulating layer is used to insulate the porous substrate 11 from the heating layer 12, and prevents the porous substrate 11 and the heating layer 12 from being electrically connected to each other and causing a short circuit.

[0038] The heating layer 12 is disposed on the atomizing surface 111 of the porous substrate 11. When the heating layer 12 is energized, the heating layer 12 generates heat, which heats and atomizes the aerosol-generating substrate. Optionally, the heating layer 12 is at least one of a heating film, a heating coating, a heating circuit, a heating sheet, or a heating net. In this embodiment, the heating layer 12 is a porous heating film structure. As can be seen, the porous structure of the heating layer 12 allows the liquid aerosol-generating substrate to more efficiently penetrate the surface of the heating layer 12 or the atomizing surface 111, thereby improving the liquid conductivity and heat conduction efficiency of the heating layer 12 and improving the atomization effect of the atomizing core 10.

[0039] The material of the heat generating layer 12 can be selected from materials that are more stable when bonded to the porous substrate 11. For example, the heat generating layer 12 can be made of materials such as titanium, zirconium, titanium-aluminum alloy, titanium-zirconium alloy, titanium-molybdenum alloy, titanium-niobium alloy, iron-aluminum alloy, tantalum-aluminum alloy, and stainless steel.

[0040] Titanium and zirconium have the following properties: Titanium and zirconium are metals with excellent biocompatibility, and titanium in particular is a metal element with high biocompatibility and is highly safe. Titanium and zirconium have relatively high resistivity even among metal materials. After titanium and zirconium are alloyed in a certain ratio at room temperature, the formed alloy has three times the original resistivity, making it more suitable as a material for the heating layer 12. Titanium and zirconium have a small thermal expansion coefficient, and the thermal expansion coefficient after titanium and zirconium are alloyed is even smaller, and the thermal compatibility with porous ceramics is high. After titanium and zirconium are alloyed in a certain ratio, the melting point of the alloy is lowered, improving the film formation characteristics of magnetron sputtering coating. After metal coating, electron microscope analysis shows that the fine particles are spherical, and the particles gather together to form a fine morphology similar to cauliflower. In contrast, the film made of titanium-zirconium alloy can be seen by electron microscope analysis that its fine grains are flaky, some of the grain boundaries between the grains disappear, and the continuity is improved. Both titanium and zirconium have good plasticity and elongation, which makes the titanium-zirconium alloy film more resistant to thermal cycles and current shock. Titanium is often used as a stress buffer layer for metals and ceramics, or as an active element in ceramic metallization. Titanium can react with the ceramic interface to form a relatively strong chemical bond and improve the adhesion of the film. Based on the above properties of titanium and zirconium, in this embodiment, the heating layer 12 can be made of titanium-zirconium alloy.

[0041] The thickness of the heat generating layer 12 is 0.1 μm to 10 μm. Specifically, the thickness of the heat generating layer 12 may be any one of 0.1 μm, 1 μm, 2 μm, 3 μm, 4 μm, 5 μm, 6 μm, 7 μm, 8 μm, 9 μm, or 10 μm. Preferably, the thickness of the heat generating layer 12 is 2 μm to 5 μm. This thickness can ensure that the thickness of the heat generating layer 12 is compatible with the pore size of the porous substrate 11, and can prevent the heat generating layer 12 from blocking the micropores of the porous substrate 11 for conducting and storing liquid, and can improve the stability of the liquid supply during the atomization process of the atomization core 10 and extend its service life.

[0042] Alternatively, the heat generating layer 12 can be formed on the atomizing surface 111 of the porous substrate 11 by techniques such as physical vapor deposition or chemical vapor deposition. For example, the heat generating layer 12 can be formed by techniques such as sputtering, evaporation coating, atomic layer deposition, and the like.

[0043] In this embodiment, the titanium-zirconium alloy film itself made of a titanium-zirconium alloy is a locally dense film. However, since the porous substrate 11 itself is a porous structure, the titanium-zirconium alloy film formed on the surface of the porous substrate 11 also has a porous continuous structure, and the pore size of the titanium-zirconium alloy film is slightly smaller than the pore size of the pores on the surface of the porous substrate 11.

[0044] 3, the atomizing core 10 further includes two electrodes 14. The two electrodes 14 are electrically connected to the power supply assembly 200 in the electronic atomizing device 300, respectively, and are used to supply power to the heating layer 12 of the atomizing core 10. Thus, when the heating layer 12 is energized, it generates heat, which heats and atomizes the aerosol-generating substrate absorbed in the porous substrate 11, thereby generating an aerosol.

[0045] Specifically, as shown in FIG. 3 and FIG. 4, the two electrodes 14 are both installed on the surface of the heating layer 12 away from the porous substrate 11, and are located on both sides of the oxide layer 13, respectively. The oxide layer 13 covers the part of the heating layer 12 that is not covered by the two electrodes 14, ensuring that the heating layer 12 is completely covered by the oxide layer 13 and the two electrodes 14. This prevents the heating layer 12 from contacting with air and being oxidized during the atomization process, and avoids the problem of the heating layer 12 failing due to oxidation. In addition, the stability of the atomization core 10 is improved, and the service life of the atomization core 10 is extended. The thickness of the two electrodes 14 is greater than the thickness of the oxide layer 13, which ensures that the electrodes 14 are in good contact with the heating layer 12, and at the same time, when the power supply assembly 200 and the electrodes 14 are electrically connected through an electrical connector, the contact stability between the electrodes 14 and the electrical connector is improved. At the same time, since the thickness of the oxide layer 13 is relatively small, the heat it absorbs itself is small, the electrical heat loss is low, and the heating rate of the atomizing core 10 is fast.

[0046] In another embodiment, as shown in FIG. 5, the oxide layer 13 is installed on the surface of the heat generating layer 12 away from the porous substrate 11. Two electrodes 14 are installed on the surface of the oxide layer 13 away from the porous substrate 11 at a distance from each other. The two electrodes 14 cover the part of the heat generating layer 12 that is not covered by the oxide layer 13, and the two electrodes 14 are in contact with the oxide layer 13, the heat generating layer 12, and the porous substrate 11. The sides of the oxide layer 13 and the heat generating layer 12 are covered by the two electrodes 14. This prevents the atomizing core 10 from failing when the electrodes 14 are installed on both sides of the oxide layer 13 because a gap is generated between the electrodes 14 and the oxide layer 13, and the contact between the air and the heat generating layer 12 cannot be completely blocked.

[0047] In yet another embodiment, as shown in Fig. 6, the surface of the heating layer 12 remote from the porous substrate 11 and the side of the heating layer 12 can be completely covered by the oxide layer 13. That is, the heating layer 12 is completely enveloped in the oxide layer 13, completely isolating the heating layer 12 from contact with air. By drilling, two spaced apart through holes (not shown) are provided in the oxide layer 13, and the two electrodes 14 are electrically connected to the heating layer 12 through the two through holes of the oxide layer 13, respectively, and the two electrodes 14 are exposed on the surface of the oxide layer 13 remote from the porous substrate 11 and electrically connected to the power supply assembly 200.

[0048] Different from the prior art, this application discloses an atomizing core, an atomizer and an electronic atomizing device. The atomizing core includes a porous substrate, a heating layer and an oxide layer. The porous substrate has an atomizing surface, the heating layer is disposed on the atomizing surface of the porous substrate, and the oxide layer is disposed on the surface of the heating layer remote from the porous substrate. By disposing the oxide layer on the surface of the heating layer remote from the porous substrate, during the heating atomization process, the oxide layer protects the heating layer, avoids the heating layer being damaged due to oxidation during the atomization process, improves the stability of the heating layer, and extends the service life of the heating layer.

[0049] The above is an embodiment of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made by utilizing the contents of the specification and drawings of the present application, or directly or indirectly applicable to other related technical fields, is similarly included in the patent protection scope of the present application.

Claims

1. An atomizing core including a porous substrate, a heating layer, an oxide layer, and two electrodes, The porous substrate has an atomizing surface, The heat generating layer is disposed on the atomizing surface of the porous substrate, and the heat generating layer is formed of at least one material selected from the group consisting of zirconium, titanium-aluminum alloy, titanium-zirconium alloy, titanium-molybdenum alloy, and titanium-niobium alloy; The oxide layer is disposed on a surface of the heat generating layer away from the porous substrate, The two electrodes are spaced apart from each other on the surface of the oxide layer away from the porous substrate, the two electrodes cover the portion of the heat generating layer that is not covered by the oxide layer, and the two electrodes are in contact with the oxide layer, the heat generating layer and the porous substrate, and the sides of the oxide layer and the heat generating layer are covered by the two electrodes.

2. 2. The atomizing core according to claim 1, wherein the oxide layer comprises aluminum oxide and / or silicon oxide.

3. 2. The atomizing core according to claim 1, wherein the thickness of said oxide layer is 200 nm to 600 nm.

4. The atomizing core of claim 1 , wherein the oxide layer is formed on the surface of the heat generating layer remote from the porous substrate by a physical vapor deposition method.

5. 2. The atomizing core according to claim 1, wherein the thickness of the oxide layer is less than the thickness of the electrode.

6. 2. The atomizing core according to claim 1, wherein the heat generating layer is a porous heat generating film.

7. 2. The atomizing core according to claim 1, wherein the oxide layer is a porous structure.

8. The atomizing core according to claim 1 , wherein the porous substrate is a porous ceramic substrate or a porous dense substrate.

9. An atomizer comprising a liquid storage chamber for storing an aerosol-generating substrate and the atomizing core according to any one of claims 1 to 8, The atomizer, wherein the atomizing core is used to heat and atomize the aerosol-generating substrate.

10. 10. An electronic atomization device comprising a power assembly and the atomizer of claim 9, The power supply assembly is adapted to supply energy to the atomizer.

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