Electronic component test equipment, sockets, and replacement parts for electronic component test equipment

Abstract

To provide an electronic component testing device with which it is possible to carry out the OTA test of a DUT having an antenna in a near field.SOLUTION: An electronic component testing device 1 comprises a socket 5 electrically connectable to a DUT 10, a load board 4, and a tester 3. The socket 5 includes a top socket 60 arranged so as to face an upper surface 11A of the DUT 10 and electrically connectable to the DUT 10, and a bottom socket 70 being in contact with an underside 11b of the DUT 10 and electrically connectable to the top socket 60, the bottom socket 70 including a base part 71 being in contact with the under side 11b of the DUT 10 and a test antenna 73 electrically connected to the tester 3 and arranged so as to face the device antenna 12.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present invention relates to an electronic device test apparatus used for testing an electronic device under test (DUT) having an antenna, a socket, and a replacement part for the electronic device test apparatus. [Background technology]

[0002] A known method for determining the radiation performance characteristics of a wireless device is to mount the wireless device on a mounting mechanism in a far-field anechoic chamber and measure a signal from the wireless device (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Special Publication No. 2008-518567 Summary of the Invention [Problem to be solved by the invention]

[0004] As an over-the-air (OTA) test for a wireless device, a near-field test may be performed instead of the far-field test described above.

[0005] The problem to be solved by the present invention is to provide an electronic device test apparatus, a socket, and a replacement part capable of performing OTA testing in the near field. [Means for solving the problem]

[0006] [1] An electronic device testing apparatus according to the present invention is an electronic device testing apparatus for testing a DUT having a device antenna and a terminal formed on a first main surface, the electronic device testing apparatus comprising: a socket electrically connectable to the DUT; a first wiring board; and a tester having a test head to which the first wiring board is attached, the socket comprising: a first socket arranged to face the first main surface and electrically connectable to the DUT; and a second socket mounted on the first wiring board, abutting a second main surface of the DUT opposite the first main surface and electrically connectable to the first socket, the second socket comprising: a base portion abutting the second main surface of the DUT; and a test antenna electrically connected to the tester and arranged to face the device antenna, the tester being an electronic device testing apparatus for testing the DUT by transmitting and receiving radio waves between the device antenna and the test antenna with the DUT and the first socket electrically connected and the first socket electrically connected to the test head via the second socket.

[0007] [2] An electronic device test apparatus according to the present invention is an electronic device test apparatus for testing a DUT having a device antenna and a terminal formed on a first main surface, comprising: a socket electrically connectable to the DUT; a first wiring board having a first opening; and a tester having a test head on which the first wiring board is mounted, the socket being disposed to face the first main surface and electrically connectable to the DUT; a first socket electrically connectable to the first wiring board; and a second socket exposed from the first wiring board through the first opening and facing the first main surface of the DUT. and a second socket abutting the opposite second main surface, the second socket having a base portion abutting the second main surface of the DUT and a test antenna electrically connected to the tester and arranged to face the device antenna, the tester being an electronic device testing apparatus that tests the DUT by transmitting and receiving radio waves between the device antenna and the test antenna with the DUT and the first socket electrically connected and the first socket electrically connected to the test head via the first wiring board.

[0008] [3] In the above invention, the second socket may include a first attenuation member that attenuates radio waves radiated from the device antenna or the test antenna, and the first attenuation member may be interposed between the test antenna and the device antenna.

[0009] [4] In the above invention, the device antenna may include a first device antenna provided on the second main surface, the test antenna may include a first test antenna arranged to face the first device antenna, and the base portion may have a second opening that faces the first test antenna to the first device antenna.

[0010] [5] In the above invention, the first attenuation member may be provided within the second opening so as to be interposed between the first test antenna and the device antenna.

[0011] [6] In the above invention, the second socket may include a second attenuation member provided on an inner surface of the second opening for attenuating radio waves radiated from the first device antenna or the first test antenna, and a shielding layer provided on an outer surface of the base for blocking radio waves from the outside.

[0012] [7] In the above invention, the first test antenna may be a patch antenna including a substrate, a radiating element provided on the substrate, and a wiring pattern provided on the substrate and connected to the radiating element.

[0013] [8] In the above invention, the first test antenna may include a plurality of the radiating elements arranged in a matrix on the substrate, and one of the wiring patterns connected to the plurality of radiating elements.

[0014] [9] In the above invention, the first test antenna may include a plurality of the radiating elements arranged in a matrix on the substrate, and a plurality of wiring patterns respectively connected to the plurality of radiating elements.

[0015]

[10] In the above invention, the device antenna may include a second device antenna provided on a side of the DUT, and the test antenna may include a second test antenna arranged to face the second device antenna, and the second test antenna may be arranged in a direction substantially parallel to the first main surface with respect to the DUT.

[0016]

[11] In the above invention, the electronic device testing apparatus may further include an electronic device handling device having a moving means capable of holding and moving the DUT and pressing the DUT relative to the socket.

[0017]

[12] In the above invention, the moving means may include a holder having an adsorption mechanism for holding the DUT, and the first socket may be attached to a tip of the holder.

[0018]

[13] In the invention of [1] above, the first socket comprises a first connection portion electrically connectable to the terminal of the DUT, a first conductive path having one end connected to the first connection portion, and a second connection portion connected to the other end of the first conductive path, the second socket comprises a third connection portion electrically connectable to the second connection portion of the first socket, the first wiring board comprises a fourth connection portion electrically connectable to the third connection portion of the base portion and a third conductive path connected to the fourth connection portion, and the third conductive path may be electrically connected to the test head.

[0019]

[14] In the above invention, the first socket comprises a main body and a third wiring board to which the main body is attached, the first connection portion is a first pogo pin, the main body has a first retaining hole into which the first pogo pin is inserted and holds the first pogo pin, the first conductive path includes a first wiring pattern formed on the third wiring board, the second connection portion is a first pad provided at one end of the first wiring pattern, the third connection portion is a second pogo pin electrically connectable to the first pad, and the base portion has a second retaining hole into which the second pogo pin is inserted and holds the second pogo pin.

[0020]

[15] In the above invention, the test antenna may be fixed to the base portion.

[0021]

[16] In the invention [2] above, the first socket may include a first connection portion electrically connectable to the terminal of the DUT, a first conductive path having one end connected to the first connection portion, and a second connection portion connected to the other end of the first conductive path, and the first wiring board may include a fourth connection portion electrically connectable to the second connection portion of the first socket, and a third conductive path connected to the fourth connection portion, and the third conductive path may be electrically connected to the test head.

[0022]

[17] In the above invention, the first socket comprises a main body and a third wiring board to which the main body is attached, the first connection portion is a first pogo pin, the main body has a first retaining hole into which the first pogo pin is inserted and holds the first pogo pin, the first conductive path includes a first wiring pattern formed on the third wiring board, the second connection portion is a third pogo pin, the main body has a third retaining hole into which the third pogo pin is inserted and holds the third pogo pin, and the fourth connection portion may be a second pad formed on the first wiring board and electrically connectable to the third pogo pin.

[0023]

[18] In the above invention, the test antenna may be fixed to the base portion.

[0024]

[19] A socket according to the present invention is a socket used for testing a DUT having a device antenna and a terminal formed on a first main surface, the socket comprising: a first socket arranged to face the first main surface and electrically connectable to the DUT; and a second socket abutting a second main surface of the DUT opposite the first main surface and electrically connectable to the first socket, the second socket comprising a base portion abutting the second main surface of the DUT and a test antenna arranged to face the device antenna.

[0025]

[20] A socket according to the present invention is a socket used for testing a DUT having a device antenna and a terminal formed on a first main surface, the socket comprising: a first socket arranged to face the first main surface and electrically connectable to the DUT; a second socket abutting a second main surface of the DUT opposite the first main surface; and a first wiring board having a first opening for exposing the second socket and electrically connectable to the first socket, the second socket comprising a base portion abutting the second main surface of the DUT and a test antenna arranged to face the device antenna.

[0026]

[21] In the above invention, the second socket may include a first attenuation member that attenuates radio waves radiated from the device antenna or the test antenna, and the first attenuation member may be interposed between the test antenna and the device antenna.

[0027]

[22] In the above invention, the device antenna may include a first device antenna provided on the second main surface, the test antenna may include a first test antenna arranged to face the first device antenna, and the base portion may have a second opening that faces the first test antenna to the first device antenna.

[0028]

[23] In the above invention, the first attenuation member may be provided within the second opening so as to be interposed between the first test antenna and the device antenna.

[0029]

[24] In the above invention, the second socket may include a second attenuation member provided on an inner surface of the second opening for attenuating radio waves radiated from the first device antenna or the first test antenna, and a shielding layer provided on an outer surface of the base for blocking radio waves from the outside.

[0030]

[25] In the above invention, the first test antenna may be a patch antenna having a substrate, a radiating element provided on the second substrate, and a wiring pattern connected to the radiating element.

[0031]

[26] In the above invention, the first test antenna may include a plurality of the radiating elements arranged in a matrix on the substrate, and one of the wiring patterns connected to the plurality of radiating elements.

[0032]

[27] In the above invention, the first test antenna may include a plurality of the radiating elements arranged in a matrix on the substrate, and a plurality of wiring patterns respectively connected to the plurality of radiating elements.

[0033]

[28] In the above invention, the device antenna may include a second device antenna provided on a side of the DUT, and the test antenna may include a second test antenna arranged to face the second device antenna, and the second test antenna may be arranged in a direction substantially parallel to the first main surface with respect to the DUT.

[0034]

[29] A replacement part according to the present invention is a replacement part for electronic device testing equipment that tests a DUT having a device antenna and a terminal formed on a first main surface, the replacement part comprising a base portion that abuts the DUT with a second main surface opposite the first main surface, and a first test antenna arranged to face the device antenna, the base portion having a second opening that faces the first test antenna to the first device antenna.

[0035]

[30] In the above invention, the replacement part may include a first attenuation member that attenuates radio waves radiated from the device antenna or the first test antenna, and the first attenuation member may be provided in the second opening so as to be interposed between the test antenna and the device antenna.

[0036]

[31] In the above invention, the replacement part may include a second attenuation member provided on an inner surface of the second opening and configured to attenuate radio waves radiated from the first device antenna or the first test antenna, and a shielding layer provided on an outer surface of the base portion and configured to block radio waves from the outside.

[0037]

[32] In the above invention, the first test antenna may be a patch antenna including a substrate, a radiating element provided on the substrate, and a wiring pattern provided on the substrate and connected to the radiating element.

[0038]

[33] In the above invention, the first test antenna may include a plurality of the radiating elements arranged in a matrix on the substrate, and one of the wiring patterns connected to the plurality of radiating elements.

[0039]

[34] In the above invention, the first test antenna may include a plurality of the radiating elements arranged in a matrix on the substrate, and a plurality of wiring patterns respectively connected to the plurality of radiating elements.

[0040]

[35] In the above invention, the device antenna may include a second device antenna provided on a side of the DUT, and the test antenna may include a second test antenna arranged to face the second device antenna, and the second test antenna may be arranged in a direction substantially parallel to the first main surface with respect to the DUT. Effect of the Invention

[0041] In the present invention, a second socket that abuts against the second main surface of the DUT is provided with a test antenna arranged to face the device antenna of the DUT. By abutting the second main surface of the DUT against the base part of this second socket, the positional relationship between the device antenna and the test antenna is set so that radio waves from the device antenna reach the test antenna in the near field, making it possible to perform OTA testing in the near field. [Brief description of the drawings]

[0042] [Figure 1] FIG. 1 is a schematic cross-sectional view showing the overall configuration of an electronic device test apparatus according to a first embodiment of the present invention. [Diagram 2] FIG. 2 is a cross-sectional view showing a contact chuck in the first embodiment of the present invention, illustrating a state before the contact chuck comes into contact with a DUT. [Diagram 3] FIG. 3 is a diagram showing a state before the DUT is pressed against the socket in the first embodiment of the present invention, and is an enlarged cross-sectional view of part III in FIG. [Figure 4] FIG. 4 is a diagram showing a state in which the DUT is pressed against the socket in the first embodiment of the present invention, and corresponds to FIG. [Diagram 5] FIG. 5 is an enlarged cross-sectional view of a portion V in FIG. [Figure 6] FIG. 6 is a plan view showing a test antenna in the first embodiment of the present invention. [Figure 7] FIG. 7 is a plan view showing a modified example of the test antenna in the first embodiment of the present invention. [Figure 8] FIG. 8 is a cross-sectional view showing a first modified example of the top socket and the bottom socket in the first embodiment of the present invention. [Figure 9] FIG. 9 is a diagram showing a first modified example of the bottom socket in the first embodiment of the present invention, and is a cross-sectional view taken along line IX-IX in FIG. [Figure 10] FIG. 10 is a sectional view showing a second modified example of the bottom socket in the first embodiment of the present invention. [Figure 11] FIG. 11 is a cross-sectional view showing a modified example of the electronic device test apparatus in the first embodiment of the present invention. [Figure 12] FIG. 12 is a schematic cross-sectional view showing the overall configuration of an electronic device test apparatus according to the second embodiment of the present invention. [Figure 13] FIG. 13 is a diagram showing a state before the DUT is pressed against the socket in the second embodiment of the present invention, and is an enlarged cross-sectional view of a portion XIII in FIG. [Figure 14] FIG. 14 is a diagram showing a state in which a DUT is pressed against a socket in the second embodiment of the present invention, and corresponds to FIG. [Figure 15] FIG. 15 is an enlarged cross-sectional view of a portion XV in FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0043] Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

[0044] First Embodiment FIG. 1 is a schematic cross-sectional view showing the overall configuration of an electronic device test apparatus according to this embodiment.

[0045] The electronic device test apparatus 1 in this embodiment is an apparatus for performing an OTA test on a DUT having a device antenna. Specifically, the electronic device test apparatus 1 is an apparatus for testing the radio wave radiation characteristics of the DUT 10 by having a test antenna 73 (described later) receive radio waves (so-called millimeter waves) having a frequency of 24.250 to 52.600 GHz radiated from a DUT 10 equipped with a device antenna 12 in the near field, and for testing the radio wave reception characteristics of the DUT 10 by having the DUT 10 receive millimeter waves radiated from the test antenna 73 in the near field.

[0046] The DUT 10 to be tested is a so-called AiP (Antenna in Package) device, and includes a device antenna 12 formed on the lower surface 11b of a substrate 11, a semiconductor chip 13 mounted on the lower surface 11b of the substrate 11, and an input / output terminal 14 formed on the upper surface 11a of the substrate 11 (see FIG. 2). The semiconductor chip 13 is a device that controls transmission and reception of the device antenna 12. Specific examples of the device antenna 12 included in the DUT 10 include a patch antenna, a dipole antenna, and a Yagi antenna. Although not particularly shown, the semiconductor chip 13 may be mounted on the upper surface 11a of the substrate 11.

[0047] The DUT 10 in this embodiment corresponds to an example of a "DUT" in the present invention, the device antenna 12 in this embodiment corresponds to an example of a "first device antenna" in the present invention, the input / output terminal 14 in this embodiment corresponds to an example of a "terminal" in the present invention, the upper surface 11a in this embodiment corresponds to an example of a "first main surface" in the present invention, and the lower surface 11b in this embodiment corresponds to an example of a "second main surface" in the present invention.

[0048] As shown in FIG. 1, the electronic device test apparatus 1 in this embodiment includes a handler 2 that moves a DUT 10, a tester 3 that tests the DUT 10, a load board 4 that is attached to a test head 32 (described later) of the tester 3, and a socket 5 that is attached to the load board 4 and can be electrically connected to the DUT 10. The handler 2 presses the DUT 10 against the socket 5 to electrically connect the DUT 10 to the tester 3. The tester 3 then performs the following test on the DUT 10. First, the tester 3 transmits a test signal to the DUT 10 via the socket 5, and causes the device antenna 12 of the DUT 10 to radiate radio waves. The tester 3 receives the radio waves at a test antenna 73 (described later) of the socket 5, thereby testing the radio wave radiation characteristics of the DUT 10. Next, the tester 3 radiates radio waves from the test antenna 73, and receives the radio waves at the DUT 10, thereby testing the radio wave reception characteristics of the DUT 10.

[0049] The electronic device testing apparatus 1 in this embodiment corresponds to an example of an "electronic device testing apparatus" in the present invention, the handler 2 in this embodiment corresponds to an example of an "electronic device handling apparatus" in the present invention, the tester 3 in this embodiment corresponds to an example of a "tester" in the present invention, the load board 4 in this embodiment corresponds to an example of a "first wiring board" in the present invention, and the socket 5 in this embodiment corresponds to an example of a "socket" in the present invention.

[0050] As shown in FIG. 1, the handler 2 includes a thermostatic chamber 20 and a contact arm 21. The handler 2 has a portion protruding laterally, and the thermostatic chamber 20 is housed in the protruding portion, and the test head 32 is disposed in the space below the protruding portion. That is, the thermostatic chamber 20 is disposed above the test head 32. The thermostatic chamber 20 has a socket 5 disposed inside through an opening formed in the bottom of the thermostatic chamber 20. The thermostatic chamber 90 is a device that applies high or low temperature to the DUT 10 disposed in the socket 5. Although not particularly limited, it is preferable that the temperature of the thermostatic chamber 20 can be adjusted in the range of −55° C. to +155° C. The contact arm 21 in this embodiment corresponds to an example of the “moving means” in the present invention.

[0051] The contact arm 21 is a moving means for moving the DUT 10, and is supported by rails (not shown) provided on the handler 2. The contact arm 21 is provided with an actuator (not shown) for horizontal movement, and can move back and forth and left and right along the rail. The contact arm 21 is also provided with an actuator (not shown) for vertical drive, and can move in the vertical direction. The contact arm 21 is provided with a contact chuck 22 attached to the tip of the contact arm 21, and can hold and move the DUT 10. The contact chuck 22 in this embodiment corresponds to an example of the "holding portion" in the present invention.

[0052] FIG. 2 is a cross-sectional view showing a contact chuck in this embodiment, illustrating a state before the contact chuck comes into contact with a DUT.

[0053] 2, the contact chuck 22 includes a suction mechanism 23 for suctioning and holding the DUT 10. The suction mechanism 23 includes a suction pipe 24, a suction pad 25, and a vacuum pump 26. The suction pipe 24 is formed vertically inside the contact chuck 22 and a top socket 60 (described later) attached to the tip of the contact chuck 22, and one end of the suction pipe 24 is connected to the suction pad 25. The vacuum pump 26 is connected to the other end of the suction pipe 24. The suction pad 25 is connected to the suction pipe 24 and opens at the bottom surface of the top socket 60. The suction mechanism 23 in this embodiment corresponds to an example of the "suction mechanism" in the present invention.

[0054] 2, when the contact chuck 22 holds the DUT 10, the contact arm 21 moves the contact chuck 22 to a position directly above the DUT 10. Next, the contact arm 21 brings the suction pad 25 into contact with the DUT 10, forming a sealed space surrounded by the suction pad 25 and the DUT 10. At this time, the suction pad 25 comes into contact with a flat portion of the upper surface 11a of the DUT 10 where the input / output terminals 14 are not formed. Thereafter, the vacuum pump 26 sucks air from the sealed space through the suction pipe 24, and the DUT 10 is held by the contact chuck 22.

[0055] 1, the tester 3 includes a mainframe (tester body) 31 and a test head 32. The mainframe 31 is connected to the test head 32 via a cable 33. The mainframe 31 sends a test signal to the DUT 10 via the test head 32 to test the DUT 10, and evaluates the DUT 10 according to the test results.

[0056] The test head 32 is connected to the mainframe 31 via a cable 33, and sends a test signal to the DUT 10 when testing the DUT 10. Although not specifically shown, this main test head 32 contains a pin electronics card that is electrically connected to the socket 5.

[0057] 1, the load board 4 is a wiring board mounted on the test head 32 and electrically connected to the test head 32. The load board 4 includes a conductive path 41 that electrically connects the test head 32 and the socket 5, and a pad 42 provided at an end of the conductive path 41 (see FIG. 5). A test signal sent from the tester 3 is sent to the DUT 10 via this conductive path 41. The conductive path 41 is composed of a wiring pattern, through holes, etc.

[0058] FIG. 3 is a diagram showing the state before the DUT is pressed against the socket in this embodiment and is an enlarged cross-sectional view of part III in FIG. 1, FIG. 4 is a diagram showing the state in which the DUT is pressed against the socket in this embodiment and is a diagram corresponding to FIG. 3, and FIG. 5 is an enlarged cross-sectional view of part V in FIG. 3.

[0059] As shown in FIG. 3, the socket 5 includes a top socket 60 attached to the contact chuck 22 and a bottom socket 70 attached to the load board 4. As shown in FIG. 4, the top socket 60 held by the contact chuck 22 abuts against the bottom socket 70 by the contact arm 21, so that the top socket 60 and the bottom socket 70 can be electrically connected to each other. The top socket 60 is detachably fixed to the contact chuck 22 by screwing or the like. The bottom socket 70 is also detachably fixed to the load board 4 by screwing or the like. The top socket 60 and the bottom socket 70 are replaced according to a change in the type of the DUT 10. The top socket 60 in this embodiment corresponds to an example of the "first socket" in the present invention, and the bottom socket 70 in this embodiment corresponds to an example of the "second socket" in the present invention.

[0060] The top socket 60 includes a socket body 61, a pogo pin 62, and a wiring board 63. The socket body 61 is fixed to the wiring board 63. The socket body 61 can be fixed to the wiring board 63 by, for example, screw fastening.

[0061] 5, the pogo pins 62 are disposed inside holding holes 611 formed in the socket body 61, and are held in the socket body 61 by the holding holes 611. The pogo pins 62 are connected to the input / output terminals 14 of the DUT 10, whereby the DUT 10 is electrically connected to the electronic device test apparatus 1.

[0062] The wiring board 63 includes a conductive path 631 electrically connected to the pogo pin 62, and a pad 632 provided at an end of the conductive path 631. The conductive path 631 is composed of a wiring pattern, a through hole, etc. The pad 632 is exposed from the socket body 61 via a through hole 612 formed in the socket body 61.

[0063] Although not shown, a cutout for exposing pad 632 may be formed in socket body 61 instead of through hole 612. Alternatively, socket body 61 may be made smaller than wiring board 63 to expose pad 632 from socket body 61.

[0064] The bottom socket 70 includes a base portion 71, a pogo pin 72, a test antenna 73, and an attenuation member 74. The bottom socket 70 abuts against the lower surface 11b of the substrate 11 to hold the DUT 10, and can be electrically connected to the top socket 60. The base portion 71 in this embodiment corresponds to an example of the "base portion" in the present invention, the test antenna 73 in this embodiment corresponds to an example of the "test antenna" and "first test antenna" in the present invention, and the attenuation member 74 in this embodiment corresponds to an example of the "first attenuation member" in the present invention.

[0065] The base portion 71 is fixed to the load board 4. For example, a method of fixing the base portion 71 to the load board 4 can be exemplified by screw fastening. The base portion 71 is made of an electrically insulating material such as a resin material. As shown in FIG. 4, the base portion 71 has a flat contact surface 711 on its upper portion, and the contact surface 711 can contact the lower surface 11b of the substrate 11 to hold the DUT 10. The base portion 71 also has an opening 712 that faces the test antenna 73 to the device antenna 12 of the DUT 10 when the top socket 60 contacts the bottom socket 70. Furthermore, the base portion 71 has a holding hole 713 that penetrates the base portion 71 in the thickness direction as shown in FIG. 5. The pogo pin 72 is inserted into the holding hole 713, and the pogo pin 72 is held by the base portion 71. The opening 712 in this embodiment corresponds to an example of the "second opening" in the present invention.

[0066] The pogo pin 72 is a contactor connectable to a pad 632 of the top socket 60. The lower end of the pogo pin 72 contacts a pad 42 of the load board 4, and the pogo pin 72 is electrically connected to the pad 42. The upper end of the pogo pin 72 can contact a pad 632 of the top socket 60 when the top socket 60 abuts against the bottom socket 70. When the pogo pin 72 contacts the pad 632, the bottom socket 70 and the top socket 60 are electrically connected, and a test signal sent from the tester 3 can be transmitted to the top socket 60.

[0067] 4, the test antenna 73 is disposed inside the opening 712 of the base portion 71 so as to face the device antenna 12 of the DUT 10 when the top socket 60 abuts against the bottom socket 70. The distance between the test antenna 73 and the device antenna 12 is adjusted so that radio waves radiated from the device antenna 12 can reach the test antenna 73 in the near field. Examples of the test antenna 73 include a patch antenna (microstrip antenna) and a horn antenna.

[0068] FIG. 6 is a plan view showing a test antenna in this embodiment.

[0069] Although not particularly limited, the test antenna 73 may include, for example, as shown in FIG. 6, a plurality of radiating elements 732 arranged in a matrix on the upper surface 731a of the substrate 731, and one wiring pattern 733 connected to the plurality of radiating elements 732. These radiating elements 732 are formed by patterning a metal layer on the substrate 731, and are connected to a signal line of a coaxial connector 734 mounted on the substrate 731 via the wiring pattern 733 formed on the substrate 731. Note that, although the plurality of radiating elements 732 are provided on the substrate 731 in this embodiment, this is not limited, and the number of radiating elements 732 may be one. Furthermore, although the plurality of radiating elements 732 are arranged in a matrix of 4 rows x 4 columns, the number of rows and columns is not limited to this. For example, the radiating elements 732 may be arranged in 8 rows x 8 columns, etc. Furthermore, the radiating elements 732 may be arranged in a single column without being arranged in a matrix.

[0070] The wiring pattern 733 is a microstrip line, and functions as a power supply wiring for supplying power to the radiating element 732, and also functions as a transmission path for transmitting an electrical signal from the radiating element 732 to the coaxial connector 734. The wiring pattern 733 branches out on one side and is connected to the multiple radiating elements 732. The wiring pattern 733 also merges into one on the other side and is connected to the coaxial connector 734.

[0071] Although not shown, a ground layer is formed on the entire lower surface of the test antenna 73, and this ground layer is connected to the ground line of the coaxial connector 734. A coaxial cable 735 (see FIG. 4) is connected to this coaxial connector 734 via a mating coaxial connector, and the test antenna 73 is electrically connected to the tester 3 via the coaxial connector 734. Although not shown, a coaxial waveguide conversion adapter may be connected to the coaxial connector 734 to interpose a waveguide between the test antenna 73 and the tester 3.

[0072] The substrate 731 is fixed to the base portion 71. Examples of a method for fixing the substrate 731 to the base portion 71 include screw fastening. A shim plate may be disposed between the substrate and the load board 4 to adjust the distance between the test antenna 73 and the device antenna 12. The substrate 731 in this embodiment corresponds to an example of the "substrate" in the present invention, the radiating element 732 in this embodiment corresponds to an example of the "radiating element" in the present invention, and the wiring pattern 733 in this embodiment corresponds to an example of the "wiring pattern" in the present invention.

[0073] Furthermore, although not particularly limited thereto, the substrate 731 and the base portion 71 of the test antenna 73 may be integrally formed. An example of a method for integrally forming the substrate 731 and the base portion 71 of the test antenna 73 is a method using a 3D printer.

[0074] FIG. 7 is a plan view showing a modified example of the test antenna in this embodiment.

[0075] 7, the test antenna 73 may include a plurality of wiring patterns 733 each connected to a plurality of radiating elements 732. The test antenna 73 includes a plurality of radiating elements 732, a plurality of wiring patterns 733, and a plurality of coaxial connectors 734.

[0076] In this modified example, one end of each wiring pattern 733 is connected to the radiating element 732, and the other end of each wiring pattern 733 is connected to a coaxial connector 734. Each wiring pattern 733 is independent of and not electrically connected to the other wiring patterns 733. A signal sent from each radiating element 732 is sent to each coaxial connector 734 via the wiring pattern 733, independent of signals sent from the other radiating elements 732.

[0077] As described above, in this modification, the signals sent from the radiating elements 732 do not merge in the wiring pattern 733 and the coaxial connector 734, and therefore the signals are sent independently to the test head 32. This makes it possible to measure the strength of the radio waves detected for each radiating element 732, and therefore makes it possible to evaluate the directivity based on the distribution of the strength in the OTA test.

[0078] 7, the same number of coaxial connectors 734 as the radiating elements 732 and the wiring patterns 733 are provided, but this is not particularly limited. For example, the test antenna 73 may include one coaxial connector 734 and a switch interposed between the coaxial connector 734 and the 16 wiring patterns 733, and the OTA test may be performed while appropriately switching the wiring pattern 733 to be connected to the coaxial connector 734 by the switch. This allows the number of coaxial connectors 734 to be reduced.

[0079] FIG. 8 is a cross-sectional view showing a first modified example of the top socket and bottom socket in this embodiment, and FIG. 9 is a cross-sectional view taken along line IX-IX in FIG. 8, showing the first modified example of the bottom socket in this embodiment.

[0080] The configuration of the bottom socket 70 is not particularly limited to the above. For example, as shown in FIG. 8, the DUT 10 may have a device antenna 12a provided on the side of the DUT 10 in addition to the device antenna 12 on the lower surface 11b. In this case, as shown in FIG. 8 and FIG. 9, the bottom socket 70 may have a test antenna 73a in addition to the above-mentioned test antenna 73. The test antenna 73a is arranged in a direction substantially parallel to the lower surface of the DUT 10 with respect to the device antenna 12a. By arranging the test antenna 56 in this way, it is possible to test even the device antenna 12a having radio wave directivity in a direction parallel to the mounting surface. As an example of such a device antenna 12a, a dipole antenna or the like can be exemplified. The test antenna 73a is also electrically connected to the tester 3, similar to the above-mentioned test antenna 73. The device antenna 12a in this embodiment corresponds to an example of the "second device antenna" in the present invention.

[0081] If the DUT 10 does not include the device antenna 12 but only includes the device antenna 12a, the bottom socket 70 may not include the test antenna 73 but only include the test antenna 73a.

[0082] 8, when the DUT 10 further includes a device antenna 12b on the surface opposite to the device antenna 12, a test antenna 73b may be disposed on the wiring board 63 of the top socket 60. In this case, the socket body 61 is provided with an opening 613 for allowing the test antenna 73b to face the device antenna 12. By disposing the test antenna 73b in this manner, even when the DUT 10 includes device antennas on both surfaces of the substrate 11, it is possible to perform an OTA test on each device antenna.

[0083] Returning to FIG. 4, the attenuation member 74 is provided inside the opening 712 of the base portion 71, and is interposed between the test antenna 73 and the device antenna 12. The attenuation member 74 is a sheet-like member made of a material capable of absorbing radio waves (especially millimeter waves). The material of the attenuation member 74 may be the same as the material constituting the radio wave absorbing material used in the inner wall of the radio wave anechoic chamber, and specifically, ferrite, resin material, etc. may be exemplified. The attenuation amount of radio waves by the attenuation member 74 may be adjusted by changing the content rate or dielectric constant of the radio wave absorbing material of the attenuation member 74. The attenuation amount of radio waves by the attenuation member 74 may be adjusted by adjusting the thickness of the attenuation member 74.

[0084] The attenuation member 74 is provided inside the opening 712 of the base portion 71 so as to face the radiating element 732 of the test antenna 73. In this embodiment, the attenuation member 74 closes the opening 712 of the base portion 71 in a plan view (when viewed along the vertical direction) and covers the entire surface of the radiating element 732. Furthermore, the attenuation member 74 is disposed so as to face the device antenna 12 of the DUT 10 when the DUT 10 is in contact with the base portion 71, and is disposed so as to be interposed between the radiating element 732 and the device antenna 12.

[0085] Although not particularly shown, in this embodiment, the damping member 74 is fitted into grooves formed on three inner surfaces of the opening 712 of the base portion 71, and is connected to a fixing member via an opening formed on the remaining inner surface, and this fixing member is fixed to the outer surface of the base portion 71 by screws or the like, thereby being fixed to the base portion 71. Alternatively, the damping member 74 may be fixed to the base portion 71 by using an adhesive.

[0086] In this way, by interposing the attenuation member 74 between the radiating element 732 and the device antenna 12, it is possible to relatively shorten the actual distance between the test antenna 73 and the device antenna 12 while maintaining the distance in terms of radio communication between the test antenna 73 and the device antenna 12. As a result, it is possible to reduce the size of the socket 5.

[0087] Furthermore, by interposing the attenuation member 74 between the radiating element 732 and the device antenna 12, it is possible to increase the distance in radio communication between the test antenna 73 and the device antenna 12 while maintaining the actual distance between the test antenna 73 and the device antenna 12. This makes it possible to prevent the test accuracy from deteriorating due to mutual interference between the test antenna 73 and the device antenna 12.

[0088] FIG. 10 is a cross-sectional view showing a second modified example of the bottom socket in this embodiment.

[0089] 10, the bottom socket 70 may further include a damping member 74a provided on the inner surface of the opening 712, and a shielding layer 75 provided on the outer surface of the base portion 71. The damping member 74a in this embodiment corresponds to an example of the "second damping member" in the present invention, and the shielding layer 75 in this embodiment corresponds to an example of the "shielding layer" in the present invention.

[0090] By providing the attenuation member 74a on the inner surface of the opening 712, it is possible to attenuate and suppress reflection of radio waves emitted from the device antenna 12 or the test antenna 73, thereby improving the accuracy of the test. This attenuation member 74a is made of the same material as the attenuation member 74 described above.

[0091] Furthermore, by providing a shielding layer 75 on the outer surface of the base portion 71, when the DUT 10 is abutted against the abutment surface 711 of the base portion 71, the DUT 10 is surrounded by the shielding layer 75, making it possible to block radio waves from outside, thereby improving the accuracy of the test.

[0092] Note that the base portion 71 may have a radio wave blocking function by forming the base portion 71 itself from a conductive material such as a metal material instead of the shield layer 75. In this case, an insulator is interposed between the inner surface of the holding hole 713 of the base portion 71 and the pogo pin 72.

[0093] The OTA test of the DUT 10 performed by the electronic device test apparatus 1 in this embodiment will be described below with reference to FIGS.

[0094] First, the thermostatic chamber 20 is started and the temperature inside the thermostatic chamber 20 is adjusted to a predetermined temperature.

[0095] 2, the contact chuck 22 of the handler 2 is moved by the contact arm 21 to a position directly above the DUT 10 to be tested. After that, the contact chuck 22 descends toward the DUT 10, and the pogo pins 62 of the top socket 60 come into contact with the input / output terminals 14 of the DUT 10, and the suction pads 25 come into contact with the DUT 10. At this time, the DUT 10 is held by the contact chuck 22 in an inverted position from the normal position (where the input / output terminals 14 face downward).

[0096] Next, air is sucked through the suction pipe 24, so that the contact chuck 22 suctions and holds the DUT 10. Then, as shown in FIG.

[0097] 4, the contact chuck 22 is lowered by the contact arm 21 to press the DUT 10 against the bottom socket 70. As a result, the lower surface 11b of the DUT 10 abuts against the abutment surface 711 of the base portion 71 of the bottom socket 70, and the device antenna 12 faces the test antenna 73. At the same time, the pogo pin 72 of the bottom socket 70 abuts against the pad 632 of the top socket 60, and the DUT 10 is electrically connected to the test head 32 via the bottom socket 70 and the top socket 60.

[0098] Then, with the DUT 10 pressed against the bottom socket 70 and the top socket 60 pressed against the DUT 10, the following tests of the radio wave emission characteristics and the radio wave reception characteristics of the DUT 10 are carried out.

[0099] Specifically, first, a test signal output from the main frame 31 is sent to the DUT 10 via the conductive path 41 of the load board 4 mounted on the test head 32, the pogo pin 72 of the bottom socket 70, the conductive path 631 of the wiring board 63, and the pogo pin 62 of the top socket 60. Then, upon receiving this test signal, the DUT 10 radiates a radio wave downward from the device antenna 12. This radio wave is received by the test antenna 73, converted into an electrical signal, and sent to the main frame 31 via the coaxial connector 734, and the radio wave radiation characteristics of the DUT 10 are evaluated based on this signal.

[0100] Next, with the DUT 10 still pressed against the bottom socket 70, a test signal output from the main frame 31 is sent to the test antenna 73 via the coaxial connector 734. The test antenna 73 receives this test signal and radiates a radio wave upward. This radio wave is received by the device antenna 12 of the DUT 10, converted into an electrical signal, and sent to the main frame 31 via the top socket 60, the bottom socket 70, and the load board 4, and the radio wave receiving characteristics of the DUT 10 are evaluated based on this signal.

[0101] After the evaluation of the DUT 10, the contact arm 21 moves upward and the DUT 10 moves away from the bottom socket 70. This completes the test of the DUT 10.

[0102] As described above, in this embodiment, the bottom socket 70 that holds the DUT 10 includes the test antenna 73 arranged to face the device antenna 12 of the DUT 10. By abutting the lower surface 11b of the DUT 10 against the abutment surface 711 of this bottom socket 70, the positional relationship between the device antenna 12 and the test antenna 73 is set such that radio waves from the device antenna 12 reach the test antenna 73 in the near field, making it possible to perform an OTA test in the near field.

[0103] Another possible method is to place a test antenna on the contact chuck of the handler and perform the OTA test. However, this method requires a detachable connector between the test antenna and the test head, and this connector must be attached and detached for each test, which may result in poor connection reliability.

[0104] In contrast, in this embodiment, the test antenna 73 is disposed in the bottom socket 70 on the load board 4, and is electrically connected to the test head 32 via a coaxial connector 734. This allows the signal to be stably sent to the tester, improving the accuracy of the test.

[0105] Furthermore, in this embodiment, since the attenuation member 74 is interposed between the test antenna 73 and the device antenna 12, the actual distance between the test antenna 73 and the device antenna 12 can be relatively shortened while maintaining the distance in terms of radio communication between the test antenna 73 and the device antenna 12. This makes it possible to reduce the size of the socket 5.

[0106] FIG. 11 is a cross-sectional view showing a modified example of the electronic device test apparatus in this embodiment.

[0107] In this embodiment, the electronic device test apparatus 1 includes the handler 2, but the electronic device test apparatus 1 may be a so-called manual type test apparatus that does not include the handler 2. In this case, as shown in FIG. 11, the top socket 60 includes a socket cover 64 that is fitted to the bottom socket 70, and the base portion 71 includes a recess 714 that engages with the socket cover 64. The socket cover 64 includes a latch 641 that engages with the recess 714, and the latch 641 and the recess 714 engage with each other to fix the top socket 60 to the bottom socket 70. Since the top socket 60 includes the socket cover 64, the top socket 60 can be fixed to the bottom socket 70 without using the handler 2, and the DUT 10 can be pressed against the bottom socket 70. As a result, the device antenna 12 and the test antenna 73 can be opposed to each other, and the top socket 60 and the bottom socket 70 can be electrically connected to each other, so that an OTA test in the Near Field can be performed.

[0108] Second Embodiment FIG. 12 is a schematic cross-sectional view showing the overall configuration of an electronic device test apparatus in this embodiment.

[0109] The electronic device test apparatus 1B in this embodiment differs from the first embodiment in the configurations of the load board 4B, the top socket 60B, and the bottom socket 70B, but the other configurations are the same. Only the differences between the electronic device test apparatus 1B in the second embodiment and the first embodiment will be described below, and the same reference numerals will be used to denote the same parts as in the first embodiment, and the description thereof will be omitted.

[0110] 12, the load board 4B in this embodiment is formed with an opening 43 into which the bottom socket 70B is fitted. The DUT 10 held by the contact chuck 22 can be brought into contact with the bottom socket 70B via this opening 43. The opening 43 in this embodiment corresponds to an example of the "first opening" in the present invention.

[0111] FIG. 13 is a diagram showing the state before the DUT is pressed against the socket in this embodiment and is an enlarged cross-sectional view of part XIII in FIG. 12, FIG. 14 is a diagram showing the state in which the DUT is pressed against the socket in this embodiment and is a diagram corresponding to FIG. 13, and FIG. 15 is an enlarged cross-sectional view of part XV in FIG. 13.

[0112] As shown in Fig. 13, the top socket 60B has pogo pins 65 provided corresponding to the pads 42 of the load board 4B. As shown in Fig. 15, the pogo pins 65 are disposed inside the through holes 612 of the socket body 61B and held by the socket body 61B, and are in contact with the pads 632. When the DUT 10 abuts against the bottom socket 70B (see Fig. 14), the pogo pins 65 abut against the pads 42 of the load board 4B, and the top socket 60B and the load board 4B can be electrically connected.

[0113] 13, the bottom socket 70B is disposed so as to be embedded in the load board 4B and the test head 32. The bottom socket 70B is exposed from the load board 4B through an opening 43 formed in the load board 4B, and the test antenna 73 can face the device antenna 12 through this opening 43.

[0114] The bottom socket 70B is different from the bottom socket in the first embodiment in that it does not include a pogo pin electrically connected to the tester 3. In this embodiment, the test signal sent from the tester 3 is transmitted to the DUT 10 from the pad 42 of the load board 4B via the pogo pin 65 of the top socket 60B, without passing through the bottom socket 70B. In this embodiment, in addition to the top socket 60B and the bottom socket 70B, the load board 4B is also replaced according to a change in the type of the DUT 10. That is, in this embodiment, the socket 5B is composed of the top socket 60B, the bottom socket 70B, and the load board 4B. The load board 4B is detachably fixed to the test head 32 via a connector or the like.

[0115] The OTA test of the DUT 10 by the electronic device test apparatus 1B in this embodiment can be performed in the same procedure as the test in the first embodiment. During the test, a test signal sent from the tester 3 is transmitted to the DUT 10 via the test head 32, the load board 4B, and the top socket 60B.

[0116] As described above, in this embodiment, the bottom socket 70B that holds the DUT is provided with the test antenna 73 arranged to face the device antenna 12 of the DUT 10. By abutting the lower surface 11b of the DUT 10 against the abutment surface 711 of this bottom socket 70B, the positional relationship between the device antenna 12 and the test antenna 73 is set such that radio waves from the device antenna 12 reach the test antenna 73 in the near field, making it possible to perform an OTA test in the near field.

[0117] In addition, in this embodiment, as in the first embodiment, the attenuation member 74 is interposed between the test antenna 73 and the device antenna 12, so that the actual distance between the test antenna 73 and the device antenna 12 can be relatively shortened while maintaining the distance in terms of radio communication between the test antenna 73 and the device antenna 12. This makes it possible to reduce the size of the socket 5B.

[0118] The above-described embodiments are described for the purpose of facilitating understanding of the present invention, and are not described for the purpose of limiting the present invention. Therefore, the elements disclosed in the above embodiments are intended to include all design modifications and equivalents that fall within the technical scope of the present invention.

[0119] For example, in the above embodiment, the electronic device test apparatus tests both the radio wave emission characteristics and the radio wave reception characteristics of the DUT as a test of the DUT, but is not limited to this. For example, the electronic device test apparatus may test only either the radio wave emission characteristics or the radio wave reception characteristics of the DUT as a test of the DUT. [Explanation of symbols]

[0120] 1,1B…Electronic component test equipment 2. Handler 20…Thermostatic oven 21…Contact arm 22...Contact chuck 23...Adsorption mechanism 24…Suction piping 25…Suction pad 26…Vacuum pump 3. Tester 31…Mainframe 32...Test head 33…Cable 4,4B 41...Conductive path 42…Pad 43…Aperture 5,5B…Socket 60,60B…Top socket 61...Socket body 611...Retaining hole 612...Through hole 613…Aperture 62…Pogo pin 63…Wiring version 631...Conductive path 632…Pad 64…Socket cover 65…Pogo pin 70,70B…Bottom socket 71,71…Base section 711…Abutting surface 712…Aperture 713...Retaining hole 714…Concave 72…Pogo pin 73, 73a, 73b...Test antenna 731... Circuit board 732...Radiating element 733...Wiring pattern 734...Coaxial connector 735…Coaxial cable 74, 74a...Damping member 75…Shield layer 10. Electronic components 12, 12a, 12b...Device antenna 13...Semiconductor chip 14…Input / output terminal

Claims

1. 1. An electronic device test apparatus for testing a DUT having a terminal formed on a first main surface and a first device antenna provided on a second main surface opposite to the first main surface, a socket electrically connectable to the DUT; a first wiring board having a first opening; a tester having a test head on which the first wiring board is mounted; The socket is a first socket disposed opposite the first main surface and electrically connectable to the DUT and to the first wiring board; a second socket exposed from the first wiring board through the first opening and in contact with a second main surface of the DUT opposite to the first main surface, The second socket comprises: a base portion in contact with the second main surface of the DUT; a test antenna electrically connected to the tester and positioned to face the first device antenna; a first attenuation member that attenuates radio waves radiated from the first device antenna or the test antenna; Equipped with the first attenuation member contains a radio wave absorbing material capable of absorbing millimeter waves and is interposed between the test antenna and the first device antenna; a positional relationship between the first device antenna and the test antenna is set such that radio waves from the first device antenna reach the test antenna in a near field by the second main surface of the DUT abutting against the base portion of the second socket; The tester is an electronic device testing apparatus that tests the DUT by transmitting and receiving radio waves between the first device antenna and the test antenna while the DUT and the first socket are electrically connected and the first socket is electrically connected to the test head via the first wiring board.

2. 2. The electronic device test apparatus according to claim 1, the test antenna includes a first test antenna disposed opposite the first device antenna; The base portion has a second opening that allows the first test antenna to face the first device antenna.

3. 3. The electronic device test apparatus according to claim 2, The second socket comprises: a second attenuation member provided on an inner surface of the second opening and configured to attenuate radio waves radiated from the first device antenna or the first test antenna; a shield layer provided on an outer surface of the base portion to block radio waves from the outside; The second attenuation member includes a radio wave absorbing material capable of absorbing millimeter waves.

4. 4. The electronic device test apparatus according to claim 2, The first test antenna comprises: A substrate; A radiating element provided on the substrate; and a wiring pattern provided on the substrate and connected to the radiating element, the wiring pattern being a patch antenna.

5. The electronic device test apparatus according to any one of claims 1 to 4, the DUT includes a second device antenna provided on a side of the DUT; the test antenna includes a second test antenna disposed to face the second device antenna by the second main surface of the DUT abutting against the base portion of the second socket, The electronic device test apparatus, wherein the second test antenna is disposed in a direction substantially parallel to the first main surface with respect to the DUT.

6. The electronic device test apparatus according to any one of claims 1 to 5, The electronic device testing apparatus further comprises an electronic device handling device having a moving means for holding and moving the DUT and for pressing the DUT relatively to the socket.

7. 7. The electronic device test apparatus according to claim 6, the moving means includes a holder having a suction mechanism for holding the DUT; The first socket is attached to the tip of the holding portion of the electronic device test apparatus.

8. A socket used for testing a DUT having a terminal formed on a first main surface and a first device antenna provided on a second main surface opposite to the first main surface, The socket is a first socket arranged to face the first main surface and electrically connectable to the DUT; a second socket that abuts against a second main surface of the DUT opposite the first main surface; a first wiring board having a first opening for exposing the second socket and electrically connectable to the first socket; The second socket comprises: a base portion in contact with the second main surface of the DUT; a test antenna disposed opposite the first device antenna; a first attenuation member that attenuates radio waves radiated from the first device antenna or the test antenna; Equipped with the first attenuation member contains a radio wave absorbing material capable of absorbing millimeter waves and is interposed between the test antenna and the first device antenna; A socket in which the second main surface of the DUT abuts the base portion of the second socket, thereby setting the positional relationship between the first device antenna and the test antenna such that radio waves from the first device antenna reach the test antenna in a near field.

9. 9. The socket of claim 8, the test antenna includes a first test antenna disposed opposite the first device antenna; The base portion has a second opening at the socket for allowing the first test antenna to face the first device antenna.

10. A replacement part for an electronic device test apparatus that tests a DUT having a terminal formed on a first main surface and a first device antenna provided on a second main surface opposite to the first main surface, The replacement part is a base portion that abuts against a second main surface of the DUT opposite to the first main surface; a first test antenna disposed opposite the first device antenna; a first attenuation member that attenuates radio waves radiated from the first device antenna or the first test antenna, the base portion has a second opening that allows the first test antenna to face the first device antenna; the first attenuation member contains a radio wave absorbing material capable of absorbing millimeter waves, and is provided in the second opening so as to be interposed between the first test antenna and the first device antenna; A replacement part in which, when the second main surface of the DUT abuts the base portion, the positional relationship between the first device antenna and the first test antenna is set to a positional relationship in which radio waves from the first device antenna reach the first test antenna in a near field.

Images