Light emitting device package

Abstract

To provide a light-emitting element package, a display device, and a method for manufacturing a display device.SOLUTION: A light-emitting element package includes a first substrate, at least one light emitting element, a sealing layer, and multiple conductive pads. The first substrate has opposing top and bottom surfaces and a notch at the edge of the bottom surface. At least one light emitting element is provided on the upper surface of the first substrate and has a positive electrode and a negative electrode. The sealing layer covers the light emitting element. The multiple conductive pads are provided on the bottom surface of the first substrate and are electrically connected to the positive electrode and the negative electrode of the light emitting element, respectively.SELECTED DRAWING: Figure 1A

Description

[Technical field]

[0001] The present disclosure relates to a light emitting device package, a display device, and a manufacturing method thereof. [Background technology]

[0002] A color display is generally composed of pixels that emit three colors of light: red, green, and blue. The display may be, for example, a liquid crystal display, an organic light-emitting diode display, or a micro light-emitting diode (LED) display. A micro LED display uses micro LEDs to emit light. The biggest challenge in manufacturing a micro LED display is how to mount a large number of micro LEDs at precise positions on the display substrate to form a pixel array. The method of mounting the micro LEDs may, for example, be to pick up the micro LEDs one by one from a supply substrate by a pick-up member, and then sequentially mount the micro LEDs on the display substrate. Alternatively, a mass transfer method may be used to fill the micro LEDs on an auxiliary substrate as a stamper, and then the stamper may be used to mount the micro LEDs on the display substrate. However, with the increase in pixel density and the miniaturization of displays, the above-mentioned technologies are rapidly becoming more complex and more expensive. Summary of the Invention [Problem to be solved by the invention]

[0003] In view of the above, there is currently a strong need for new manufacturing methods to overcome the above problems. [Means for solving the problem]

[0004] The present disclosure provides a light emitting device package including a first substrate, at least one light emitting element, a sealing layer, and a plurality of conductive pads. The first substrate has opposing upper and lower surfaces, and has a notch at an edge of the lower surface. The at least one light emitting element is provided on the upper surface of the first substrate and has a positive electrode and a negative electrode. The sealing layer covers the light emitting element. The plurality of conductive pads are provided on the lower surface of the first substrate and are electrically connected to the positive electrode and the negative electrode of the light emitting element, respectively.

[0005] In some embodiments, the light emitting elements include red, green and blue light emitting elements, each of which has a positive electrode and a negative electrode.

[0006] In some embodiments, the conductive pads are electrically connected to the positive and negative terminals of the red, green and blue light emitting elements, respectively.

[0007] In some embodiments, the conductive pads include a first conductive pad electrically connected to the positive electrode of the red light-emitting element, a second conductive pad electrically connected to the positive electrode of the green light-emitting element, a third conductive pad electrically connected to the positive electrode of the blue light-emitting element, and a fourth conductive pad electrically connected to the negative electrodes of the red, green, and blue light-emitting elements.

[0008] In some embodiments, the bottom surface of each of the conductive pads is polygonal.

[0009] In some embodiments, the bottom surfaces of the conductive pads are substantially flush.

[0010] In some embodiments, the light-emitting device package has a polygonal outline in plan view.

[0011] In some embodiments, the light-emitting device package has a rectangular outline in a plan view.

[0012] In some embodiments, the light-emitting device package further comprises a pillar disposed on the encapsulation layer.

[0013] In some embodiments, the light-emitting device package further comprises an adhesive layer disposed between the pillar and the encapsulation layer.

[0014] The present disclosure includes a light-emitting device package according to any one of the above embodiments, a second substrate, and a plurality of conductive connection surfaces. The second substrate has a groove and a protrusion extending from a sidewall of the groove. The plurality of conductive connection surfaces are provided on a bottom surface of the groove. The light-emitting device package is provided in the groove, and the protrusion of the second substrate is located in the notch of the first substrate of the light-emitting device package, and the conductive pads of the light-emitting device package are electrically connected to the conductive connection surfaces, respectively.

[0015] In some embodiments, the light emitting elements include red, green and blue light emitting elements, each of which has a positive electrode and a negative electrode.

[0016] In some embodiments, these conductive pads include a first conductive pad electrically connected to the positive electrode of the red light emitting element, a second conductive pad electrically connected to the positive electrode of the green light emitting element, a third conductive pad electrically connected to the positive electrode of the blue light emitting element, and a fourth conductive pad electrically connected to multiple negative electrodes of the red light emitting element, the green light emitting element, and the blue light emitting element, and these conductive connection surfaces are four in number and are electrically connected to the first conductive pad, the second conductive pad, the third conductive pad, and the fourth conductive pad, respectively.

[0017] In some embodiments, the protrusion substantially matches the shape of the notch.

[0018] In some embodiments, the groove has a polygonal outline in plan view.

[0019] The present disclosure provides a method for manufacturing a display device, comprising: (a) providing a first substrate having a groove and a protrusion extending from a sidewall of the groove, and a plurality of conductive connection surfaces provided on a bottom surface of the groove; (b) pouring a liquid suspension onto an upper surface of the first substrate, the liquid suspension including a light-emitting element package including a second substrate having opposing upper and lower surfaces and a notch at an edge of the lower surface, at least one light-emitting element provided on the upper surface of the second substrate and having a positive electrode and a negative electrode, a sealing layer covering the light-emitting element, pillars provided on the sealing layer, and a plurality of conductive pads provided on the lower surface of the second substrate and electrically connected to the positive electrode and negative electrode of the light-emitting element, respectively; and (c) placing the light-emitting element package in the groove such that the protrusion of the first substrate is located within the notch of the second substrate.

[0020] In some embodiments, the method of manufacturing a display device further comprises removing the pillars from the encapsulation layer after the light-emitting device packages are placed in the grooves.

[0021] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are intended to provide further explanation of the present disclosure as claimed. [Brief description of the drawings]

[0022] The above and other aspects, features and advantages of the present disclosure will become more clearly understood with reference to the following specification taken in conjunction with the accompanying drawings. [Figure 1A] 1A and 1B are schematic cross-sectional views of light-emitting device packages according to various embodiments of the present disclosure. [Figure 1B] 1A to 1C are schematic structural diagrams of a light-emitting element in a light-emitting element package according to various embodiments of the present disclosure in a plan view. [Figure 1C] 1A and 1B are schematic cross-sectional views of light-emitting device packages according to various embodiments of the present disclosure. [Figure 2A] 1A and 1B are schematic cross-sectional views of light-emitting device packages according to various embodiments of the present disclosure. [Figure 2B]1A to 1C are schematic structural diagrams of a light-emitting element in a light-emitting element package according to various embodiments of the present disclosure in a plan view. [Diagram 3] 1A and 1B are schematic diagrams illustrating wiring of a substrate of a light-emitting device package according to various embodiments of the present disclosure. [Figure 4] 1A and 1B are schematic diagrams illustrating wiring of a substrate of a light-emitting device package according to various embodiments of the present disclosure. [Diagram 5] 1A and 1B are schematic cross-sectional views of light-emitting device packages according to various embodiments of the present disclosure. [Figure 6] 1A to 1C are schematic cross-sectional views of display devices according to various embodiments of the present invention. [Figure 7] 1A-1D are schematic cross-sectional views of a substrate and a conductive interface according to various embodiments of the present disclosure. [Figure 8] 1A-1D are schematic plan views of a substrate and a conductive connecting surface according to various embodiments of the present disclosure. [Figure 9] 1A-1D are schematic diagrams illustrating a display device during manufacture according to various embodiments of the present disclosure. [Figure 10] 1A-1D are schematic diagrams illustrating a display device during manufacture according to various embodiments of the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0023] Hereinafter, several embodiments of the present disclosure are disclosed with the aid of drawings, and many practical details are described together in the following description for clarity of description. However, it should be understood that these practical details are not applied to limit the present disclosure. That is, in some embodiments of the present disclosure, these practical details are not necessary. Also, in order to simplify the drawings, some conventional and common structures and assemblies are simply and diagrammatically shown in the drawings. The same numbers in the drawings represent the same or similar components.

[0024] Although the methods disclosed herein are illustrated below using a sequence of operations or steps, the order in which these operations or steps are presented should not be construed as limiting the disclosure. For example, certain operations or steps may be performed in different orders and / or simultaneously with other steps. Moreover, not all of the illustrated operations, steps and / or features need to be performed to achieve an embodiment of the present disclosure. Moreover, each operation or step described herein may include several sub-steps or operations.

[0025] The present disclosure provides a light-emitting device package. Please refer to Figures 1A and 1B. Figure 1A is a schematic cross-sectional view of a light-emitting device package according to various embodiments of the present disclosure. Figure 1B is a schematic plan view of a light-emitting device in the light-emitting device package according to various embodiments of the present disclosure.

[0026] As shown in FIG. 1A, the light-emitting device package 100 includes a substrate 110, at least one light-emitting device L, a sealing layer 120, conductive pads 140, 150, and a pillar 130. The substrate 110 has an upper surface S1 and a lower surface S2 facing each other, and an edge E of the lower surface S2 has a notch N. The light-emitting device L is provided on the upper surface S1 of the substrate 110. The sealing layer 120 covers the light-emitting device L. The pillar 130 is provided on the sealing layer 120. A plurality of conductive pads 140, 150 are provided on the lower surface S2 of the substrate 110. As shown in FIG. 1B, the light-emitting device L has a positive electrode L1 and a negative electrode L2. The conductive pads 140, 150 shown in FIG. 1A are electrically connected to the positive electrode L1 and the negative electrode L2 of the light-emitting device L shown in FIG. 1B, respectively. For example, the conductive pads 140, 150 may be electrically connected to the positive electrode L1 and the negative electrode L2, respectively, via wiring (not shown) in the substrate 110. In other words, the substrate 110 is provided with a wiring layout for connecting the light emitting element L and the target substrate to each other.

[0027] The light-emitting device package 100 of the present disclosure can be mounted in the groove of the substrate by fluid self-assembly to form a display device. It should be noted that in the process of performing fluid self-assembly, the encapsulation layer 120 can isolate the light-emitting device L from the liquid, protect the light-emitting device L, and avoid damage to the light-emitting device L caused by the collision of the light-emitting device package 100 when the liquid flows. After mounting, the pillars 130 are removed from the encapsulation layer 120. In another embodiment, the light-emitting device package 100 further includes an adhesive layer (not shown) disposed between the pillars 130 and the encapsulation layer 120. The details of the mounting process by fluid self-assembly will be described later.

[0028] 1A shows an example of one light-emitting element L, but the number of light-emitting elements is not limited thereto, and may be adjusted according to design needs, for example, two, three, four, etc., but is not limited thereto. In some embodiments, the light-emitting element L is a red light-emitting element, a green light-emitting element, a blue light-emitting element, or a white light-emitting element, but is not limited thereto. FIG. 1A shows an example of two conductive pads 140, 150, but the number of conductive pads is not limited thereto, and may be adjusted according to design needs or the number of light-emitting elements, for example, two, three, four, etc., but is not limited thereto.

[0029] 1A, the bottom surfaces of the conductive pads 140, 150 are substantially flush, as shown, but not limited to, in FIG. 1A. In other embodiments, the thickness of the conductive pad 140 is greater than the thickness of the conductive pad 150. In yet other embodiments, the thickness of the conductive pad 140 is less than the thickness of the conductive pad 150.

[0030] In some embodiments, the bottom surface of the conductive pads 140, 150 is polygonal, such as, but not limited to, a triangle, a square, a pentagon, or a hexagon, hi other embodiments, the bottom surface of the conductive pads 140, 150 is circular, elliptical, or any other shape.

[0031] In some embodiments, the outline of the light-emitting device package 100 in plan view is a polygon, such as, but not limited to, a triangle, a rectangle, a pentagon, or a hexagon, In other embodiments, the outline of the light-emitting device package 100 in plan view is a circle, an ellipse, or any other shape.

[0032] In some embodiments, the light-emitting device package 100 does not include a pillar 130. As shown in FIG. 1C, FIG. 1C is a schematic cross-sectional view of a light-emitting device package 100A according to various embodiments of the present disclosure. The difference between the light-emitting device package 100A and the light-emitting device package 100 is that the encapsulation layer 120 of the light-emitting device package 100A does not include a pillar.

[0033] The present disclosure provides another light-emitting device package. Please refer to Figures 2A and 2B. Figure 2A is a schematic cross-sectional view of a light-emitting device package according to various embodiments of the present disclosure. Figure 2B is a schematic plan view of a light-emitting device in the light-emitting device package according to various embodiments of the present disclosure.

[0034] As shown in FIG. 2A, the light emitting device package 200 includes a substrate 110, a red light emitting device R, a green light emitting device G, a blue light emitting device B, a sealing layer 220, conductive pads 420, 430, and a pillar 130. The substrate 110 has an upper surface S1 and a lower surface S2 facing each other, and an edge E of the lower surface S2 has a notch N. The red light emitting device R, the green light emitting device G, and the blue light emitting device B are provided on the upper surface S1 of the substrate 110. The sealing layer 220 covers the red light emitting device R, the green light emitting device G, and the blue light emitting device B. The pillar 130 is provided on the sealing layer 220. The conductive pads 420, 430 are provided on the lower surface S2 of the substrate 110. As shown in FIG. 2B, the red light emitting device R has a positive electrode R1 and a negative electrode R2, the green light emitting device G has a positive electrode G1 and a negative electrode G2, and the blue light emitting device B has a positive electrode B1 and a negative electrode B2. The conductive pads 420 and 430 shown in Fig. 2A are electrically connected to the positive electrodes R1, G1, B1 and negative electrodes R2, G2, B2 of the red light emitting element R, the green light emitting element G, and the blue light emitting element B shown in Fig. 2B. For example, the conductive pads 420 and 430 may be electrically connected to the positive electrodes R1, G1, B1 and negative electrodes R2, G2, B2 via wiring (not shown) in the substrate 110. In other words, the substrate 110 is provided with a wiring layout for connecting the red light emitting element R, the green light emitting element G, and the blue light emitting element B to the target substrate.

[0035] Please refer to Figures 2B, 3 and 4. Figures 3 and 4 are wiring schematic diagrams of the substrate 110 of the light-emitting device package 200 according to various embodiments of the present disclosure. The positive electrode R1 of the red light-emitting element R is connected to the wiring 310 therebelow, the wiring 310 is connected to the guide hole 312 therebelow, and the guide hole 312 is connected to the conductive pad 410 therebelow. The positive electrode G1 of the green light-emitting element G is connected to the wiring 320 therebelow, the wiring 320 is connected to the guide hole 322 therebelow, and the guide hole 322 is connected to the conductive pad 420 therebelow. The positive electrode B1 of the blue light-emitting element B is connected to the wiring 330 therebelow, the wiring 330 is connected to the guide hole 332 therebelow, and the guide hole 332 is connected to the conductive pad 430 therebelow. The negative electrodes R2, G2, B2 of the red light-emitting element R, the green light-emitting element G, and the blue light-emitting element B are connected to wiring 340 below these negative electrodes R2, G2, B2, the wiring 340 is connected to a guide hole 342 below it, and the guide hole 342 is connected to a conductive pad 440 below it.

[0036] According to the above wiring structure design, the conductive pad 410 is electrically connected to the positive electrode R1 of the red light emitting element R, the conductive pad 420 is electrically connected to the positive electrode G1 of the green light emitting element G, the conductive pad 430 is electrically connected to the positive electrode B1 of the blue light emitting element B, and the conductive pad 440 is electrically connected to the negative electrodes R2, G2, and B2 of the red light emitting element R, the green light emitting element G, and the blue light emitting element B. Although FIG. 4 shows four conductive pads 410, 420, 430, and 440 as an example, the number of conductive pads is not limited thereto, and the number of conductive pads may be adjusted according to design needs or the number of light emitting elements, for example, two, three, four, five, six, and the like, but is not limited thereto.

[0037] The light-emitting device package 200 of the present disclosure can be mounted in the groove of the substrate by fluid self-assembly to form a display device. It should be noted that during the process of fluid self-assembly, the encapsulation layer 220 can isolate the red light-emitting device R, the green light-emitting device G, and the blue light-emitting device B from the liquid to protect the light-emitting devices and avoid damage to the light-emitting devices caused by the collision of the light-emitting device package 200 when the liquid flows. After mounting, the pillars 130 are removed from the encapsulation layer 220. In other words, in another embodiment, the light-emitting device package 200 does not include the pillars 130. The process of mounting the light-emitting device package 200 by fluid self-assembly will be described in detail below.

[0038] The embodiment of the light-emitting device package 200 in Fig. 2A may refer to the embodiment of the light-emitting device package 100 in Fig. 1A. In some embodiments, the lower surfaces of the conductive pads 410, 420, 430, 440 are substantially flush with each other. In other embodiments, the thicknesses of the conductive pads 410, 420, 430, 440 are different. For example, but not limited to, the thickness of the conductive pad 440 is greater than the thickness of the conductive pads 410, 420, 430 or less than the thickness of the conductive pads 410, 420, 430.

[0039] In some embodiments, the bottom surface of each of the conductive pads 410, 420, 430, 440 is polygonal, such as, but not limited to, a triangle, a square, a pentagon, or a hexagon, hi other embodiments, the bottom surface of each of the conductive pads 410, 420, 430, 440 is circular, elliptical, or any other shape.

[0040] In some embodiments, the outline of the light-emitting device package 200 in plan view is a polygon, such as, but not limited to, a triangle, a rectangle, a pentagon, or a hexagon, In other embodiments, the outline of the light-emitting device package 200 in plan view is a circle, an ellipse, or any other shape.

[0041] 5 is a schematic cross-sectional view of a light-emitting device package 500 according to various embodiments of the present disclosure. The difference between the light-emitting device package 500 in FIG. 5 and the light-emitting device package 200 in FIG. 2A is that the light-emitting device package 500 further includes an adhesive layer 510 disposed between the pillars 130 and the encapsulation layer 220. The adhesive layer 510 can easily attach the pillars 130 to the encapsulation layer 220. The adhesive layer 510 is, for example, but not limited to, silica. In some embodiments, the adhesive layer 510 may be wet-etched to remove the pillars 130.

[0042] 6 is a schematic cross-sectional view of a display device 600 according to various embodiments of the present disclosure. The display device 600 includes the light-emitting device package 200 shown in FIG. 2, a substrate 610, and conductive connecting surfaces 612, 614. The substrate 610 has a groove T and a protrusion TP extending from a side wall SW of the groove T. The conductive connecting surfaces 612, 614 are provided on a bottom surface BS of the groove T. The light-emitting device package 200 is provided in the groove, and the protrusion TP of the substrate 610 is located in a notch N of the substrate 110 of the light-emitting device package 200.

[0043] Although only one groove T is shown in FIG. 6, the number of grooves T is not limited thereto, and the number of grooves may be adjusted according to design needs, and the substrate 610 may include multiple grooves.

[0044] In order to more clearly understand the structure of the display device 600, please refer to FIG. 4, FIG. 6, FIG. 7 and FIG. 8 at the same time. FIG. 7 is a schematic cross-sectional view of a substrate 610 and conductive connection surfaces 612, 614 according to various embodiments of the present disclosure. FIG. 8 is a schematic plan view of a substrate 610 and conductive connection surfaces 612, 614, 616, 618 according to various embodiments of the present disclosure. The light emitting device package 200 is disposed in the groove T, and the conductive pads 410, 420, 430, 440 of the light emitting device package 200 are electrically connected to the conductive connection surfaces 618, 612, 614, 616, respectively. FIG. 8 takes four conductive connection surfaces 612, 614, 616, 618 as an example, but the number of conductive connection surfaces is not limited thereto, and the number of conductive connection surfaces may be adjusted according to the design and number of conductive pads, for example, two, three, four, five, six, etc., and is not limited thereto. In some embodiments, the conductive connecting surfaces 612 , 614 , 616 , 618 are connected to traces (not shown) in the substrate 610 to control the light emission of the light-emitting device package 200 .

[0045] 8, in some embodiments, the outline of the groove T in plan view is a polygon, such as, but not limited to, a triangle, a rectangle, a pentagon, or a hexagon. In other embodiments, the outline of the groove T in plan view is a circle, an ellipse, or any other shape. In some embodiments, the groove T substantially matches the shape of the light-emitting device package 200.

[0046] Please refer to FIG. 4 and FIG. 8 at the same time. In some embodiments, the protrusion TP substantially matches the shape of the notch N. In some embodiments, the volume of the protrusion TP is substantially equal to the volume of the notch N. In other embodiments, the volume of the protrusion TP is smaller than the volume of the notch N. When the light-emitting device package 200 is to be installed in the groove T of the substrate 610, the light-emitting device package 200 is placed in the groove T only when the protrusion TP of the substrate 610 is aligned with the notch N of the substrate 110, thereby ensuring that the conductive pads 410, 420, 430, 440 of the light-emitting device package 200 abut against the conductive connecting surfaces 612, 614, 616, 618 in the correct direction and polarity.

[0047] The present disclosure provides a method for manufacturing a display device. Please refer to FIG. 2A, FIG. 2B, and FIG. 6 to FIG. 9. FIG. 9 is a schematic diagram of a display device 600 according to various embodiments of the present disclosure during manufacturing. The method includes the following operations: (a) providing a substrate 610 having a groove T and a protrusion TP extending from a sidewall SW of the groove T, and a plurality of conductive connection surfaces 612, 614, 616, 618 provided on a bottom surface BS of the groove T, as shown in FIG. 7 to FIG. 8; (b) pouring a liquid suspension containing a light-emitting element package 200 onto an upper surface S3 of the substrate 610, as shown in FIG. 9. Since the light-emitting element package 200 has a pillar 130, when the pillar 130 contacts the upper surface S3 of the substrate 610, the light-emitting element package 200 is inverted on the substrate 610 by the flow of liquid until it falls into the groove T. For example, as shown in FIG. 2A and FIG. 4, the light emitting device package 200 includes a substrate 110, a red light emitting device R, a green light emitting device G, a blue light emitting device B, a sealing layer 220, conductive pads 410, 420, 430, 440, and a pillar 130. The substrate 110 has an upper surface S1 and a lower surface S2 facing each other, and an edge E of the lower surface S2 has a notch N. The red light emitting device R, the green light emitting device G, and the blue light emitting device B are provided on the upper surface S1 of the substrate 110. The sealing layer 220 covers the red light emitting device R, the green light emitting device G, and the blue light emitting device B. The pillar 130 is provided on the sealing layer 220. The conductive pads 410, 420, 430, 440 are provided on the lower surface S2 of the substrate 110. As shown in FIG. 2B, the red light emitting device R has a positive electrode R1 and a negative electrode R2, the green light emitting device G has a positive electrode G1 and a negative electrode G2, and the blue light emitting device B has a positive electrode B1 and a negative electrode B2. The conductive pads 410, 420, 430, 440 are electrically connected to the positive electrodes R1, G1, B1 and negative electrodes R2, G2, B2 of the red light emitting element R, the green light emitting element G, and the blue light emitting element B, respectively. (c) As shown in FIG. 6, the light emitting element package 200 is disposed in the groove T, and the protrusion TP of the substrate 610 is located in the notch N of the substrate 110.In detail, when the light-emitting element package 200 rolls up to the groove T of the substrate 610, it falls into the groove T, and only when the protrusion TP of the substrate 610 is aligned with the notch N of the substrate 110, the light-emitting element package 200 is positioned in the groove T, thereby ensuring that the conductive pads 410, 420, 430, 440 of the light-emitting element package 200 abut with the conductive connection surfaces 612, 614, 616, 618 in the correct direction and polarity.

[0048] In some embodiments, after the light-emitting device package 200 is installed in the groove T, the pillars 130 are removed from the encapsulation layer 220 .

[0049] 10 is a schematic diagram of a display device 600 according to various embodiments of the present disclosure during manufacturing. As shown in FIG. 10, when the light-emitting device package 200 falls into the groove T, the conductive pads 410, 420, 430, 440 of the light-emitting device package 200 do not fall downward into the groove T, so the light-emitting device package 200 cannot be placed in the groove T, and may be separated from the groove T by the liquid suspension, continue to roll on the substrate 610, and may fall into another groove. Similarly, if the conductive pads 410, 420, 430, 440 of the light-emitting device package 200 fall downward into the groove T, but the protruding portion TP of the substrate 610 is not aligned with the recessed portion N of the substrate 110, the light-emitting device package 200 cannot be placed in the groove T, and may be separated from the groove T by the liquid suspension. The design of the protruding portion TP and the notch N of the present disclosure can avoid the occurrence of inaccurate abutment between the light-emitting device package 200 and the conductive connection surface, and improve the manufacturing yield.

[0050] When manufacturing a display device, light emitting device packages with different light emission colors may be mounted stepwise on a substrate having a plurality of grooves by the above-mentioned fluid self-assembly. For example, a light emitting device package emitting red light is mounted on a groove of a portion of the substrate, a light emitting device package emitting green light is mounted on another groove of the substrate, and then a light emitting device package emitting green light is mounted on the remaining groove of the substrate to form a display device. Therefore, to manufacture a display device according to the above-mentioned flow, three transfers are required. In addition, when manufacturing a display device, the light emitting device package 200 having light emitting devices of three different colors may be mounted at once in the groove of the substrate as a transfer unit by the above-mentioned fluid self-assembly. Therefore, when manufacturing a display device according to the above-mentioned flow, only one transfer is required. Since the light emitting device package 200 is a light emitting unit capable of emitting white light, compared to stepwise mounting, the time required for mounting the light emitting device package 200 of the present disclosure is only 1 / 3 of the time required for stepwise mounting. Therefore, the structural design of the light emitting device package 200 of the present disclosure can significantly reduce manufacturing costs, significantly save manufacturing time, and improve assembly speed. For example, assembly rates can exceed 50 million transfer units per hour. The manufacturing methods of the present disclosure can be used to produce LED displays with small pitch or high pixels per inch (PPI).

[0051] In summary, the structure design of the protrusions and notches in the light emitting device package of the present disclosure can ensure that the conductive pads of the light emitting device package abut with the conductive connection surface in the correct direction and polarity, thereby improving the manufacturing yield. In addition, the manufacturing method of the display device of the present disclosure can enable the package to be mass-transferred to the substrate through fluid self-assembly, which can greatly reduce the manufacturing cost and greatly save the manufacturing time, and greatly contribute to the production of the display device.

[0052] Although the present disclosure has been described in considerable detail with reference to certain embodiments, other embodiments are possible, and therefore, the spirit and scope of the appended claims should not be limited to the description of the embodiments contained herein.

[0053] It will be apparent to those skilled in the art that various modifications and variations can be made to the structure of the present disclosure without departing from the scope or spirit of the disclosure. In view of the foregoing, it is intended that the present disclosure cover modifications and variations of the present disclosure that fall within the scope of the appended claims. [Explanation of symbols]

[0054] 100, 100A, 200, 500 Light emitting device package 110, 610 board 120, 220 Sealing layer 130: Pillar 140, 150 Conductive pad 310, 320, 330, 340 Wiring 312, 322, 332, 342 Guide holes 410, 420, 430, 440 Conductive Pads 510 Adhesive layer 600 display device 612, 614, 616, 618 Conductive connection surface B Blue light emitting element B1 positive electrode B2 negative electrode BS bottom E-edge G Green light emitting element G1 Positive electrode G2 negative electrode L Light emitting element L1 positive electrode L2 negative electrode N Notch R Red light emitting element R1 Positive pole R2 negative electrode S1 top S2 bottom side S3 top SW side wall T groove TP protrusion

Claims

1. a first substrate having opposing upper and lower surfaces, the lower surface having a notch at an edge thereof; A plurality of light-emitting elements provided on the upper surface of the first substrate and having a positive electrode and a negative electrode; A sealing layer that covers the light-emitting element; a pillar provided on the sealing layer, the pillar being provided in contact with a surface of the sealing layer opposite to the first substrate across the light emitting element and extending in a direction away from the first substrate, the pillar being configured to place a light emitting element package in a groove of a second substrate, the second substrate having the groove and a protrusion extending from a side wall of the groove, the first substrate being placed in the groove, the protrusion of the second substrate being located within a notch of the first substrate after the light emitting element package is placed in the groove of the second substrate; a plurality of conductive pads provided on the lower surface of the first substrate, electrically connected to the positive electrode and the negative electrode of the light emitting device, respectively, and configured to be electrically connected to a plurality of conductive connection surfaces provided on a bottom surface of the groove of the second substrate after the light emitting device package is installed in the groove of the second substrate; A light emitting device package comprising:

2. The light emitting device package according to claim 1 , wherein the plurality of light emitting devices include a red light emitting device, a green light emitting device, and a blue light emitting device, each of the red light emitting device, the green light emitting device, and the blue light emitting device having a positive electrode and a negative electrode.

3. The light emitting device package according to claim 2 , wherein the conductive pads are electrically connected to the positive electrodes and the negative electrodes of the red light emitting device, the green light emitting device and the blue light emitting device, respectively.

4. 4. The light-emitting element package according to claim 3, wherein the plurality of conductive pads include a first conductive pad, a second conductive pad, a third conductive pad, and a fourth conductive pad, the first conductive pad being electrically connected to the positive electrode of the red light-emitting element, the second conductive pad being electrically connected to the positive electrode of the green light-emitting element, the third conductive pad being electrically connected to the positive electrode of the blue light-emitting element, and the fourth conductive pad being electrically connected to the negative electrodes of the red light-emitting element, the green light-emitting element, and the blue light-emitting element.

5. 5. The light emitting device package according to claim 1, wherein the lower surfaces of the plurality of conductive pads are each polygonal.

6. 6. The light-emitting device package according to claim 1, wherein lower surfaces of the plurality of conductive pads are substantially flush with each other.

7. The light emitting device package according to any one of claims 1 to 6, wherein the outline of the light emitting device package in a plan view is polygonal.

8. The light emitting device package according to claim 7 , wherein the outline of the light emitting device package in a plan view is a rectangle.

9. The light emitting device package according to claim 1 , further comprising an adhesive layer provided between the pillar and the encapsulation layer.

10. The light emitting device package according to claim 9 , wherein the adhesive layer is made of silica.

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