Pressure sensing apparatus and method

Abstract

The pressure sensing device (1000) comprises first and second electrodes (10, 20) spaced apart from one another. At least one of the electrodes is made of or comprises an integral part of a non-metallic, electrically conductive material. The distance is variable in response to pressure or force applied to the first and / or second electrodes. The pressure sensing device (1000) comprises a measurement module (500) connected to the first and / or second electrodes at multiple sensing points (e.g., S1) on the electrodes. The measurement module is configured to measure changes in capacitance between the first and / or second electrodes individually at each sensing point and / or simultaneously at all sensing points in response to changes in distance when pressure or force is applied to the first and / or second electrodes. The measurement module is configured to determine the location, area, and magnitude of the pressure applied to the first and / or second electrodes from the individual measurements and / or from simultaneous measurements of the magnitude of the pressure.

Description

[Technical field]

[0001] The present invention relates generally to pressure sensing devices, and particularly, but not exclusively, to devices for determining the location, area and magnitude of pressure exerted by human touch, a human body or an object on a surface of the device, and to methods of operation and manufacture of such devices. [Background technology]

[0002] There is a growing need to embed devices and functionalities such as touch and pressure sensors into previously passive objects and surfaces. Developments in this field make human-machine interaction seamless in everyday life. They also play a key role in acquiring new knowledge in academic fields, collecting useful research data, and driving businesses to discover new insights into consumer behavior.

[0003] An area of ​​interest is the ability to continuously monitor, using novel sensing devices, the changes in the various pressures exerted by different parts of the human body on objects that we come into contact with on a daily basis. This can activate parts of the system in response to the detected movements or collect data that can be later analyzed to provide useful feedback to the end user. In particular, foot pressure monitoring has applications in multiple fields, such as biomedical diagnostics, prevention of foot ulcers, such as in diabetic feet, physical rehabilitation, training for sports performance, injury prevention, and electronic gaming. By determining the distribution of static and dynamic pressure exerted by the human body through the foot over the sole, it is possible to determine and improve balance, detect excessive pressure in certain areas of the foot, analyze gait stability, detect mobility patterns to understand user behavior and actions, monitor posture, etc. Similarly, by monitoring the pressure exerted by the human body on the seat, it can also be used in the automotive industry to monitor the comfort, posture, and overall behavior of the user while driving. Seat design is fundamental to prevent problems related to poor sitting posture, and collecting data on sitting behavior through pressure mapping can help manufacturers improve seat design, comfort, and driver safety. Pressure mapping also opens up the possibility of detecting different driving situations and providing active feedback to the user.

[0004] These emerging applications present new challenges in the design and manufacture of pressure mapping devices, requiring flexible, durable devices that can naturally follow the user's movements during daily activities, as well as simple, cost-effective methods for obtaining high-resolution measurements.

[0005] Common solutions for creating an accurate pressure map of the foot, such as those described in EP3235428AI and US5323650A, include flexible XY sensor array structures consisting of multiple individual force / pressure sensors. These solutions utilize multiple layers with numerous electrical components, interconnects / traces, and manufacturing steps. The individual sensors that make up the XY sensor array are typically split into multiple sensor layers (e.g., one for X position and one for Y position) that require assembly and overlay, and each layer of the device typically requires different conductive / non-conductive materials and properties, coatings (e.g., pressure-sensitive coatings), printed conductive tracks / traces, and manufacturing techniques / steps. As such, these sensor array solutions inherently complicate device fabrication. Furthermore, the logic behind the array sensing system necessitates miniaturization and multiplication of sensing points tuned in two separate directions that are designed to intersect to provide XY resolution. This approach imposes design constraints, especially for improved spatial resolution, as the conductive traces must be tightly fitted into the available space within a limited margin of error, as shown in US5323650A.

[0006] Similarly, solutions developed for seat pressure mapping use multiple printed conductive traces terminating at sensing points on a sensing layer to measure localized pressures or forces. For example, CN1882460A discloses a device for measuring seat occupancy by measuring the change in resistance due to pressure in a sensing layer composed of multiple layers and coatings of resistive and conductive materials. The location of pressure is determined by measuring the change in resistance between a pair of sensing points on opposite sides of the sensing layer. Thus, to achieve high resolution pressure mapping, a significant amount of resistors, sensing points, and printed traces are required, which increases the complexity of the device and manufacturing / materials costs.

[0007] In applications where surfaces are constantly subject to repetitive movement and stress, such as wearable devices and seating / bedding, devices with complex sensor arrays can make traditional printed traces and coatings prone to degradation through breakage and delamination, which may ultimately limit commercialization in industries such as consumer electronics, wearables, healthcare products, and automotive interiors.

[0008] Therefore, to enable mass production of such pressure mapping devices, a significantly simplified sensor system is needed that provides high-resolution pressure mapping with a minimum of sensor elements and that can be manufactured using affordable materials and manufacturing processes.

[0009] It is with the foregoing in mind that aspects and embodiments of the present invention have been devised. Summary of the Invention [Means for solving the problem]

[0010] According to a first aspect of the present invention, there is provided a pressure sensing device. The device comprises a first electrode and a second electrode. The first electrode and the second electrode may be spaced apart or separated from each other. The first and second electrodes may be spaced apart or separated by a distance. The first electrode and / or the second electrode may be formed of or comprise a non-metallic conductive material. The first electrode and / or the second electrode may be formed of or comprise a unitary non-metallic conductive material. The first and / or the second electrode may be formed of or comprise a movable and / or deformable and / or flexible non-metallic conductive material (such as conductive plastic, foam and / or rubber) such that the distance changes in response to pressure or force applied (at one or more locations) to the first and / or the second electrode. The change in distance may be uniform or non-uniform. As used herein, a "non-metallic" conductive material means a material that is not a metal, such as gold, silver, aluminum, etc. The device may further comprise a measurement module. The measurement module may be connected or connectable to the first and / or second electrodes at one or more sensing points (or multiple sensing points) on the electrodes. The measurement module may be configured to measure a change in an electrical signal at one or more of the sensing points in response to a pressure or force applied on or to the first and / or second electrodes, e.g., by changing or decreasing a distance (e.g., at one or more locations). The electrical signal may be or include a change in capacitance between the first and second electrodes. The measurement module may be configured to measure the change in capacitance at each sensing point individually or at all sensing points simultaneously. The measurement module may be configured to determine the location, area, and / or magnitude of the pressure applied to the first and / or second electrodes from measurements from the individual measurements. The measurement module may be configured to determine the magnitude of the applied pressure from measurements from the simultaneous measurements. The amount of applied pressure may be a relative value or an actual pressure value.

[0011] The space between the first and second electrodes may be at least partially filled or occupied by a non-conductive, compressible, and / or flexible spacer layer or material. Alternatively, the distance between the first and second electrodes may be or include one or more gaps. The gap may exceed the distance. The gap may be or comprise an air gap, an empty space, or a cavity. The first and second electrodes may be spaced and / or separated from each other by one or more gaps. The gap may be alterable and / or closable in response to pressure or force applied to the first and second electrodes. The measurement module may be configured to measure a change in an electrical signal at one or more sensing points in response to a pressure or force applied on or to the first and / or second electrodes, e.g., a change in an electrical signal that changes, reduces, or closes one or more gaps.

[0012] The device uses one or more non-metallic conductive electrodes to achieve pressure sensing without the need for traditional metal electrode sensors. The use of non-metallic conductive materials for the first and / or second electrodes provides many advantages over traditional sensor technologies using metal electrodes. The material cost and weight can be significantly reduced compared to traditional metal electrode materials (e.g., gold, silver, aluminum, etc.). The non-metallic conductive materials can be formable, simplifying the manufacture and assembly of the sensor device and reducing the associated manufacturing and assembly costs. Additionally, the first and second electrodes can be formed and / or molded into almost any arbitrary size, shape, and three-dimensional (3D) configuration due to the nature of the molding process. This provides many practical and functional advantages. The electrodes are an integral part enabling XY-resolution pressure sensing without the need for multiple pressure / force sensors, thus greatly simplifying the construction and operation of the device. The electrodes may be formed from or comprise recyclable materials. Electrodes may be conformed to any surface or shape, regardless of its complexity, which may eliminate the need for flexible printed circuits that complicate electrode placement and wiring and increase wear and tear and assembly costs. Because the electrodes have a three-dimensional volume and can cover a larger area, they are more sensitive to capacitance changes and can generate larger signal changes than typically found with small metal electrodes. · The electrodes may be formed of or include the same or similar materials in place of the original product materials. For example, a foam shoe sole insert that is not pressure sensitive may be turned into a pressure sensitive insert by replacing the non-conductive foam with conductive foam, and the sensing electrode material provides the same physical and / or ergonomic functionality as the original product material, making it easier for manufacturers to incorporate the electrodes. If there is a gap, the dimensions of the gap can be selected to tailor the pressure response. For example, for a given electrode material and dimensions, the depth and width of the gap can be configured to set a given pressure or force required to shrink and / or close the gap and produce a change in capacitance. This allows the design to control the pressure sensitivity and dynamic range of the device.

[0013] Overall, the degree of freedom in designing the sensor device itself is greatly improved.

[0014] Thus, in use, pressure or force applied directly or indirectly to the first and second electrodes causes the first and second electrodes to deform and the distance / gap between them to change / reduce, resulting in a change in capacitance which is measured (individually or simultaneously) at the sensing points by the measurement module. Based on the location of each sensing point on the first and / or second electrodes and the strength of the signal measured at the respective sensing point, the location, area and / or magnitude of the applied pressure / force can be determined.

[0015] This device can be used in many pressure sensing applications, including but not limited to pressure sensing in seats and shoe soles. Conventional seat and shoe sole pressure sensing devices rely on metal electrode materials and metal-based electronics, so additional electronic components are required to incorporate pressure sensing functionality into traditionally non-sensor objects (e.g. shoe soles). Conventional sensor approaches cannot utilize the inherent materials of the object / product, such as polyurethane (PU) foam, ethylene vinyl acetate (EVA), and rubber, as the sensing electrodes themselves. This requires manufacturers and technology implementers to introduce additional assembly processes that are different from the original manufacturing process, resulting in higher risks and costs.

[0016] The determined pressure or force location may be or comprise a point or coordinates. The determined area of ​​applied pressure or force may be or comprise a spatial extent and / or shape of the applied pressure distribution. The area may include a location. For example, a large area may be applied with pressure or force at a location, and a small area may be applied with pressure or force. The location of the area may correspond to a center of the area. The magnitude of the applied pressure or force may be or be configured to be a value that is positively related to the strength of the applied pressure or force. The magnitude of the applied pressure or force may be a qualitative value (e.g., a normalized or relative value) or a quantitative value (e.g., an actual pressure or force value). If quantitative data is required, the device may be calibrated with known pressure or force values, and the capacitance measurements may be converted to pressure or force values ​​using a predefined relationship.

[0017] Where there are multiple locations / areas, regions and / or distributions of applied pressure or force, the measurement module may be configured to determine multiple locations, regions and / or magnitudes of the applied pressure and map the pressure distribution. Thus, the device may be or comprise a pressure mapping device.

[0018] The measurement module may be configured to map each measurement obtained from an individual sensing point to a distance or proximity from the individual sensing point to a point where pressure / force is applied. The measurement module may be configured to determine a location (e.g., XY or absolute) of the pressure applied to the device from the mapped distances. The measurement module may be configured to determine an area or shape of the pressure applied to the device from the mapped distances. For example, the mapped distances may correspond to the location of a boundary of the area. The location of the area can then be determined from the location of the boundary lines. By knowing the relative location of each sensing point on the first and / or second electrodes, this information can be used to construct a distribution of the pressure area.

[0019] The first electrode and / or the second electrode may be formed or comprised of a non-metallic, electrically conductive thermoformable material and / or may be formed by a molding process.

[0020] Suitable materials for the first and / or second electrodes include, but are not limited to, conductive plastics, conductive rubbers, conductive polymeric materials and conductive foams, such as conductive acrylonitrile butadiene styrene (ABS) or conductive PU, conductive EVA, conductive thermoplastic elastomers (TPE) and conductive thermoplastic polyurethanes (TPU). Such materials may be formed by processes such as injection molding, heat pressing, heat lamination, thermoforming, etc. Alternatively, such materials may be formed by 3D printing, computer numerical control (CNC) machining / milling, laser or water jet cutting (e.g., cutting a uniform sheet of material). Such materials may be substantially rigid or flexible and deformable.

[0021] The first and second electrodes may be formed or composed of the same or different materials. The first and / or second electrodes may have a uniform or non-uniform thickness. The first and second electrodes may have the same or different thicknesses.

[0022] The sensing points may be located at or near the periphery or edges of the first and second electrodes. The sensing points may be distributed near the periphery or edges of the first or second electrodes. The sensing points may be evenly or unevenly distributed around the periphery / edge of the first and / or second electrodes.

[0023] The second electrode can be positioned over, beneath, above, below, on top of, or below the first electrode. The device may be configured such that the first and second electrodes are permanently separated from each other in some areas and not in other areas such that they cannot contact each other.

[0024] The electrode with the sensing point (i.e., the first electrode or the second electrode) may be referred to as the sensing electrode. The other electrode (i.e., the second electrode or the first electrode) may be referred to as the reference or ground electrode. The reference electrode may be connected to the measurement module at one or more reference or ground points on the reference electrode. The reference electrode may be electrically grounded (e.g., by connecting to a ground / reference terminal of the measurement module). The first electrode and second electrode together may form a pressure sensing layer.

[0025] Each sensing point may be selectively connected to the measurement module by a conductive trace or track, which may be or comprise a wire, a conductive thread, or a conductive trace / track printed / deposited on a substrate (e.g. a thin flexible substrate, PCB, etc.).

[0026] The measurement module may be or comprise a sensing circuit configured to measure a change in capacitance, for example at a sensing point connected to the sensing circuit. The sensing circuit may be or comprise a capacitive sensing chip with one or more sensing or input channels, such as a capacitive sensing microprocessor or microcontroller. The capacitive sensing chip may be configured to measure a change in capacitance of the sensing electrodes via respective sensing points connected to its input pins. The capacitance measurement may be based on the self-capacitance of the sensing electrodes. The capacitance measurement may optionally be a frequency-based measurement. A change in the distance between the first and second electrodes (e.g., via a change in distance / gap) affects the capacitive coupling between the first and second electrodes, resulting in a change in the measured capacitance.

[0027] Each sensing point can be connected to the sensing circuit at the same sense input pin of the sensing circuit. This minimizes the number of channels required for the capacitive sensing chip. Such capacitive sensing chips are low cost. It is also possible to connect more than one sensing point (or each sensing point) to the sensing circuit at different sense input pins of the sensing circuit.

[0028] The measurement module may further comprise a switching unit connected between the sensing circuit and the sensing points. The switching unit may be configured to selectively connect and / or disconnect each sensing point to and from the sensing circuit. The switching unit may be comprised of one or more switching elements, such as transistors (such as general-purpose, PNP and / or NPN transistors), relays, and / or other controllable switching elements known in the art. Each sensing point may be connected or connectable to an input pin of the sensing circuit via a switching element. In this way, the switching unit selectively connects / disconnects each sensing point from the (single) input pin, thereby enabling the sensing circuit to obtain measurements or readings from each sensing point individually (i.e., by scanning the sensing points), simultaneously for all sensing points, or simultaneously for any combination of sensing points. For example, when obtaining measurements from an individual sensing point, the sensing circuit may be configured to connect that sensing point to the input pin and to disconnect all other sensing points from the input pin. This allows for the determination of the location, area, and magnitude of applied pressure from each sensing point to be short circuit-free.

[0029] The measurement module may further comprise a control unit connected to the switching unit and configured to control the connection and / or disconnection of each sensing point. The control unit may be configured to provide one or more control signals to switching elements of the switching circuit to control their operation. The control unit may be configured to control the timing and / or frequency of the switching.

[0030] The measurement module may be configured to operate in a first mode and / or a second mode. In the first mode, the switching unit may scan each sensing point (i.e., selectively connect each individual sensing point to the sensing circuit one at a time) so that the sensing circuit can obtain measurements or readings from each individual sensing point separately. In the first mode, only one sensing point at a time is actively connected to the sensing circuit. For example, while taking measurements or readings from one sensing point, the other (inactive) sensing points can be disconnected from the sensing circuit. The frequency of scanning or switching may be high enough compared to typical movements of the body, e.g., to minimize measurement lag so that measurements / detections appear real-time. For example, the scanning rate may be in the range of 100-200 Hz. Depending on the application, the scanning or switching rate may be slower or faster.

[0031] In the second mode, the switching unit may simultaneously connect each of the sensing points to the sensing circuit such that the sensing circuit can obtain capacitance measurements or readings from each of the sensing points simultaneously, such that in the second mode, each of the sensing points contributes to the measurement or reading.

[0032] The first mode may provide information regarding the position, area and / or magnitude of the applied pressure. The second mode may provide information regarding the (total) amount of applied pressure. The measurement in the second mode may be performed before or after the measurement in the first mode. The measurement module may be configured to periodically and / or continuously switch / alternate between the first and second operating modes during operation of the device. The first and second modes may be controlled by a control unit.

[0033] Considering the conductivity of the electrodes, the change in capacitance measured at the sensing point depends on the change / reduction in the distance or one or more gaps between the first and second electrodes, i.e., the magnitude of the applied pressure, the distance / proximity of the sensing point to the point where the pressure is applied (or the location where the distance / gap is changed), and the area where the pressure is applied. Thus, for a constant location and area of ​​the applied pressure, the measurement value is positively related to the magnitude of the applied pressure, for a constant location and area of ​​the applied pressure, the measurement value is positively related to the distance or proximity of the pressure location from the sensing point, and for a constant location and area of ​​the applied pressure, the measurement value is positively related to the area where the pressure is applied. When pressure is applied to an area, the measurement provides information about the relative location of the boundary of the area to the sensing point. Thus, the measurement value from each individual sensing point contains information about the location, area, and size of the applied pressure. By performing measurements from multiple sensing points arranged around the sensing electrode, the location, area, and size of the applied pressure can be known (first mode). This information can be used to construct a distribution of pressure regions.

[0034] If all sensing points are measured simultaneously (second mode), a value is obtained that is positively related to the magnitude of the pressure. This (second mode) measurement can be used together with the (first mode) measurements from the individual sensing points to improve the reliability of the determined location, area and / or magnitude of the applied pressure. For example, a simultaneous (second mode) measurement can be used to verify whether the applied pressure is a small pressure distributed over a large area or a large pressure distributed over a small area. In other words, a simultaneous (second mode) measurement can be used to infer the correct origin of the values ​​obtained from the individual (first mode) measurements and / or to find a unique solution for the location, area and / or magnitude of the applied pressure.

[0035] The first mode of operation (scanning mode) requires several measurements with electrodes of the same integral part in order to minimize engineering complexity. Scanning several sensing points (in the first mode) allows measuring different locations of the periphery individually in a short (negligible) time, without adjusting the material to prevent short circuits, collectively building up a distribution of pressure areas and informing the amount of pressure applied to each area. This allows a significant reduction in manufacturing costs compared to conventional sensing technologies consisting of several sensing electrodes, where each electrode only covers a small localized area and a significant amount of electrode modules (i.e. sensing elements) is required to cover a large sensing surface, such as a seat.

[0036] The device may include multiple sensing electrodes sharing the same reference electrode. Each sensing electrode may be connected to a measurement module. Alternatively, the device may include multiple sensing electrodes and multiple corresponding reference electrodes. In that case, each sensing electrode may be connected to the sensing circuit (e.g., to the same input pin) via a switching circuit. Each reference electrode may be connected to the same reference or ground terminal of the measurement module. In either case, the measurement module may be configured to obtain a pressure field distribution from each sensing electrode. These may be combined to build an overall pressure field distribution for the device. Multiple sensing electrodes may be used to meet the spatial resolution and mechanical specifications of the product. For example, in a shoe sole application, a device with multiple sensing electrodes may improve the spatial resolution of the overall combined pressure field distribution.

[0037] A gap portion or region may be formed or provided by one or each of the portions of the device where the first and second electrodes are spaced apart or separated by a gap. The device may comprise one or more gap portions or regions where the first and second electrodes are spaced apart and / or separated by a gap. The first and second electrodes may be configured to approach / contact each other at their respective gap portions / regions when a pressure or force is applied to the respective gap portions / regions such that the respective gaps are changed / reduced / closed.

[0038] Each of the first and second electrodes may have an inner surface and an outer surface. The inner surfaces of the first and second electrodes may face each other. Also, in one or each of the gap portions / regions, the inner surfaces of the first and second electrodes may be separated by a gap. The gap may extend substantially between the inner surfaces of the first and second electrodes in the gap. One or each of the gaps may have a width and a height.

[0039] The apparatus may further comprise one or more separation elements configured to separate, e.g., space, the first electrode and the second electrode. Further, the one or more separation elements may be configured to provide, form, and / or define one or more gaps or gap portions / regions. A width and height of the gap may be defined by the separation elements.

[0040] The first electrode or the second electrode may be supported or suspended above / below the other by one or more separation elements. The separation elements may provide one or more support portions or regions adjacent to and / or extending between the gap regions. The separation elements may be configured to maintain a separation between the first and second electrodes and / or the inner surfaces of the first and second electrodes. The separation elements may extend between the first and second electrodes and / or may extend from either or both of the first and second electrodes. The separation elements may be integrally formed with the first and second electrodes. Alternatively or additionally, the separation elements may be separate from the first and second electrodes.

[0041] The separation element may be formed of or comprise a substantially rigid / incompressible material, or a substantially flexible / compressible material, in which case the gap can be reduced and / or closed by pressure applied directly onto the gap or gap portion / region and / or pressure applied onto the support region (i.e., not applied directly onto the gap).

[0042] In an embodiment, one or each of the separation elements is or comprises a non-conductive separation or spacer layer. The spacer layer may be sandwiched between the first and second electrodes to separate or maintain separation between the first and second electrodes and / or the inner surfaces of the first and second electrodes. The first and / or second electrodes may be supported by the spacer layer. The spacer layer may be constructed of a material in a unitary piece.

[0043] The spacer layer may comprise one or more through holes, openings or cutouts. The gap or gap portion / region may be formed, defined or provided by the one or more through holes, openings or cutouts. The portions and / or regions of the spacer layer adjacent between the through holes, openings or cutouts may form the support regions. The spacer layer may comprise an array of such through holes or openings. The thickness of the spacer layer may define the size / height of the gap. The width of each through hole or opening may also define the width of the gap or gap portion / region. The first and second electrodes may extend across the width of one or each of the through holes, openings or cutouts.

[0044] One or each of the through holes or openings may extend through the thickness of the spacer layer. One or each of the through holes or openings may have a cross-section that is circular, square, rectangular, polygonal, or any other shape. The shape and / or size of each of the through holes or openings may be the same or different. The through holes or openings may comprise one or more holes, depressions, and / or repeating geometric patterns / tracks. Alternatively, one or more of the openings may extend partially through the thickness of the spacer layer. For example, one or more of the openings may be or comprise a recess or a thickness transition in the spacer layer.

[0045] The spacer layer may have conductive traces or tracks that connect each sensing point to a measurement module and / or sensing circuitry.

[0046] The spacer layer may be substantially flexible, deformable and / or compressible. The spacer layer may be formed or comprised of a thermoformable non-conductive material or may be formed by a molding process. Suitable materials for the spacer layer include, but are not limited to, non-conductive plastics, non-conductive polymeric materials, non-conductive foams, such as non-conductive acrylonitrile butadiene styrene (ABS), polyurethane (PU), polycarbonate (PC), polyvinyl chloride (PVC), ethylene vinyl acetate (EVA), thermoplastic elastomers (TPE), thermoplastic polyurethanes (TPU), silicone rubber, etc. Such materials may be substantially rigid, flexible, or deformable and may be formed via processes such as injection molding, heat pressing, heat lamination, thermoforming, etc. Alternatively, such materials may be formed by 3D printing, computer numerically controlled (CNC) machining / milling, laser or water jet cutting (e.g., cutting a uniform sheet of material), etc. The spacer layer may also be formed or comprised of cloth, paper, latex, etc. The spacer layer may have similar or greater elasticity and / or flexibility as the first and second electrodes.

[0047] In some cases, it may be advantageous to not require a separate separation / spacer layer (made of a separate material) to further minimize assembly costs and complexity. The spacer layer may be integral with the first and second electrodes. The first and second electrodes may be moldable and thus formed into customizable 3D structures, resulting in natural overhangs and / or protrusions that can be used as integral spacers.

[0048] For example, in another embodiment, the one or more separation elements may be or comprise one or more protrusions extending from (an inner surface) of the first and / or second electrodes. The one or more separation elements may be or comprise an array of such protrusions. The protrusions may be configured to function as spacers. The spacers may be configured to hold the first and second electrodes in a spaced apart relationship. The spacers may be integrally formed with the first and / or second electrodes to form a monolithic structure. The spacers may have a proximal end attached to an inner surface of one of the first or second electrodes, respectively, and a distal end.

[0049] A gap or gap portion / region may be formed, provided or defined between and / or adjacent to the spacers. One or more gaps (of one or each of the gap portions) or one or each of the gap portions / regions may extend substantially in the region around, on either side of and / or between one or more protrusions / spacers. In other words, a gap or gap portion may be defined on either side of and / or between one or more protrusions / spacers.

[0050] The spacer may be spaced from an inner surface of the first and / or second electrode at a distance determined in the longitudinal direction thereof. The size or height (thickness direction) of the gap may be determined, at least in part, by the length of one or each of the protrusions or spacers. The width of the gap may be determined by the shape / design of the protrusions / spacers, e.g., the spacing between adjacent protrusions / spacers.

[0051] The spacer may be formed of the same or different material as the first and second electrodes, or may be composed of different materials. The spacer may have the same or different electrical, thermal, and mechanical properties as the first and second electrodes. This can be achieved by forming the spacer in the same (single) molding process as the first and / or second electrodes, or by forming the spacer using a two-step overmolding process.

[0052] The distal end of the or each spacer may contact the (inner surface of) the other of the first and second electrodes. In this case, the spacer may support the or each of the first and second electrodes relative to the other of the first and second electrodes, or the other of the first and second electrodes may be supported by the spacer (depending on the orientation of the device). Either or both of the first and second electrodes may include one or more protrusions that function as spacers.

[0053] Also, the spacer may not contact the other of the first and second electrodes. In one embodiment, the other of the first and second electrodes may include one or more corresponding through holes, openings, or notches configured to receive a portion of the spacer such that the spacer does not contact the other of the first and second electrodes. In another embodiment, the first and second electrodes may be sized such that the spacer is located outside the perimeter of the other of the first and second electrodes and the spacer does not contact the other of the first and second electrodes.

[0054] The length of the spacer (or the distance the spacer extends away from the inner surface of the first / second electrode) may be greater than the depth of the through hole or opening (or the thickness of the electrode that constitutes the through hole or opening). In this way, the electrode with the spacer and the electrode with the through hole or opening are separated in the thickness direction by a gap (where the length of the spacer is the same as the direction of the hole). The spacer may be configured to fit within the through hole or opening without contacting the sides of the through hole or opening. Furthermore, the size or height of the gap (in the thickness direction) may be determined at least in part by the depth of the through hole or opening or the thickness of the electrode that constitutes the through hole or opening.

[0055] The spacer may be configured to minimize the footprint of the distal end. In this way, when the distal end contacts the other of the first and second electrodes, electrical contact between the two electrodes is minimized and does not affect the capacitance measurement. The spacer may include a sidewall connecting the proximal end to the distal end. The sidewall may extend in a direction substantially perpendicular to the inner surface of each of the first and second electrodes. Alternatively, the sidewall may be angled relative to the inner surface of each of the first and second electrodes such that the spacer is substantially pointed or the distal end of the spacer has a smaller footprint or cross-sectional area than the proximal end. This may reduce the footprint of the distal end. Additionally, if the spacer is angled, the footprint or contact area between the distal end and the other of the first and second electrodes may increase as the spacer and / or the electrodes compress under applied pressure. This may increase the total amount of capacitance change measured in addition to the change due to the reduction in the gap.

[0056] The protrusions and / or spacers may be formed of or include the same material as the first and / or second electrodes that comprise the protrusions / spacers. The protrusions may be integrally formed with the first and / or second electrodes that comprise the protrusions, e.g., formed in the same moulding process.

[0057] The protrusions / spacers may also be formed or constructed of a material and have different material properties (e.g., electrical conductivity and / or mechanical properties) than the material of the first and second electrodes that comprise the protrusions / spacers. In this manner, the protrusions / spacers may have a different stiffness than the remainder of the first and / or second electrodes that comprise the protrusions. For example, the protrusions / spacers may be formed by a different molding process.

[0058] The protrusions / spacers may be substantially rigid such that they maintain a fixed separation between the first and second electrodes proximate the protrusions / spacers when pressure or force is applied, hi another example, the protrusions / spacers may be substantially flexible and / or resilient such that they compress when pressure or force is applied resulting in a variable separation / gap between the first and second electrodes proximate the protrusions / spacers.

[0059] The pressure or force required to change / change and / or close the gap may be determined in part by the flexibility or deformability of the first and / or second electrodes and / or the separation element, and in part by the dimensions (i.e. width and height) of the gap or gap portion / area. Thus, the thickness of the spacer layer and the configuration of the width of one or each of the through holes or openings may set a predetermined pressure or force required to reduce / change or close the gap (in one or each of the gap portions / areas). Alternatively, the configuration of the length of one or more protrusions / spacers and the width of the areas on either side and / or between one or more protrusions / spacers may set a predetermined pressure or force required to close the gap (in each of the gap portions / areas). This allows adjusting the pressure sensitivity of the device instead of adjusting the flexibility or deformability of the first and / or second electrodes.

[0060] The first electrode and / or the second electrode are substantially 1x10 2 -1x10 6 The first and / or second electrodes may have an electrical resistivity in the range of Ω / cm. The resistance between any two points of the first and / or second electrodes may be substantially between 1 kΩ and 1 MΩ, measured at a distance of about 10 cm. A higher resistivity means that the magnitude of the measured capacitance change varies more strongly with the distance between the location of pressure applied to the device and the individual sensing points, improving the pressure sensitivity and / or position sensing resolution of the device.

[0061] The resistivity and / or resistance of the first and / or second electrodes can be adjusted by intrinsic material properties (i.e., inherent resistivity). Alternatively or additionally, the resistivity and / or resistance of the first and / or second electrodes can be adjusted without changing the intrinsic material properties by instead introducing one or more holes, dimples, indentations, thickness variations, and / or repeating geometric patterns / tracks in the first and / or second electrodes. For example, the first and / or second electrodes can be or comprise complex shapes and / or repeating geometric patterns to define a predetermined resistance between any two points. Also, multiple dimples or indentations can be arranged in a regular pattern. One or more holes, dimples, and / or indentations can define a nonlinear conductive path between two points. Alternatively or additionally, one or more dimples and / or indentations can define multiple linear and / or nonlinear conductive paths between two points.

[0062] The first and second electrodes may be interchangeable, for example the second electrode may instead constitute one or more sensing points connectable to a measurement module and / or sensing circuitry.

[0063] According to a second aspect of the present invention, there is provided a method of manufacturing a pressure sensing device of the first aspect. The method may include forming a first electrode and a second electrode. The first electrode and / or the second electrode may be formed of or may include an integral piece of non-metallic conductive material. The first electrode and / or the second electrode may be formed of or comprise a moveable and / or deformable and / or flexible non-metallic conductive material. The method may include arranging the first and second electrodes separately such that the first and second electrodes are arranged at a distance apart. The method may further include providing a measurement module. The method may further include connecting the measurement module to one of the first or second electrodes with one or more sensing points or a plurality of sensing points on the electrodes. The one or more sensing points may be distributed (evenly or unevenly) around the periphery or rim of the first or second electrode. The method may further include connecting the measurement module to the other of the first or second electrodes at one or more reference or ground points provided on the other of the first or second electrodes.

[0064] The method may further include stacking the first electrode over the second electrode, or vice versa. For example, the method may further include stacking the second electrode over, beneath, above, below, on, or below the first electrode, with the second electrode spaced a distance from the first electrode, and optionally stacking the first and second electrodes such that there are one or more gap portions / regions such that the first and second electrodes are separated by a gap. The first and second electrodes may be arranged in a substantially planar manner.

[0065] The electrode with the sensing point (i.e., the first electrode or the second electrode) may be called the sensing electrode, and the other electrode (i.e., the second electrode or the first electrode) may be called the reference electrode or ground electrode.

[0066] The method may further include forming a plurality of sensing electrodes and disposing the plurality of sensing electrodes above or below a same reference electrode. The method may further include connecting a measurement module to each sensing electrode at a sensing point on each sensing electrode.

[0067] The method may further include forming a plurality of sensing electrodes and a plurality of corresponding reference electrodes, and positioning each sensing electrode relative to a corresponding reference electrode, e.g., over, beneath, above, below, on or below (e.g., in planar alignment with) the corresponding reference electrode. The method may further include connecting a measurement module to each sensing electrode at a sensing point on the respective sensing electrode, and optionally connecting the measurement module to each reference electrode at one or more reference or ground points on the respective reference electrode.

[0068] The first and / or second electrodes may be formed using a thermoforming and / or molding process. Multiple segmented electrodes may be formed in a single mold.

[0069] The method may further include forming one or more isolation elements configured to separate the one electrode and the second electrode. The one or more isolation elements may further be configured to provide or form a gap.

[0070] Thermoforming and / or molding processes may be used to form the separation element or elements.

[0071] Forming the one or more isolation elements may include forming a non-conductive isolation or spacer layer. The spacer layer may be substantially flexible or rigid. The method may further include disposing the spacer layer between the first and second electrodes to separate the first and second electrodes.

[0072] The first electrode, the second electrode, and / or the separating / spacer layer may be formed by any of the following methods: injection molding, heat pressing, heat lamination, and / or thermoforming. Such manufacturing processes are inexpensive. The first electrode, the second electrode, and / or the separating layer may be formed by 3D printing, CNC (computer numerical control) machining / milling, laser or water jet cutting (e.g., cutting a uniform sheet of material), and the like. The method of forming each electrode may include attaching the first and / or second electrode to a non-conductive surface and / or object to form them together (e.g., overmolding the first and / or second electrode onto a fabric on one side). In this arrangement, one mold is required to form multiple split electrodes of any electrode.

[0073] Forming the separation / spacer layer may further include forming one or more through holes, apertures, or notches in the spacer layer to define one or each of the gap portions. Forming the spacer layer may further include forming an array of through holes in the spacer layer.

[0074] In another embodiment, forming the first and / or second electrodes may include forming one or more protrusions extending from (a surface of) the first and / or second electrodes. Forming the one or more protrusions may include forming an array of such protrusions. The protrusions may be configured to function as spacers. The spacers may be configured to hold the first and second electrodes in a spaced apart relationship. The spacers may be integrally formed with the first and / or second electrodes to form a monolithic structure (e.g., formed in the same molding process). Forming the spacers may include forming spacers with sidewalls extending in a direction substantially perpendicular to the respective surfaces of the first and second electrodes. Alternatively, the spacers may be formed with sidewalls that are substantially angled relative to the respective surfaces of the first and second electrodes, such that the spacers have a substantially pointed shape and / or a distal end of the spacer has a smaller footprint or cross-sectional area than the proximal end.

[0075] Forming the first and second electrodes may further include forming one or more through holes, openings or notches in one of the first and second electrodes configured to accommodate a portion of the protrusion / spacer such that the spacer does not contact the other of the first and second electrodes when the first and second electrodes are spaced apart.

[0076] Optionally or preferably, forming the first and second electrodes may include forming an array of through holes, apertures or notches in one of the first and second electrodes to accommodate a corresponding array of protrusions / spacers in the other of the first and second electrodes.

[0077] According to a third aspect of the present invention there is provided a method of operating the pressure sensing device of the first aspect. The method may comprise measuring, at each sensing point individually, or optionally simultaneously at all sensing points, a change in capacitance between the first and second electrodes in response to a change in distance (or optionally one or more gaps) between the first and second electrodes when a pressure or force is applied to the first and / or second electrodes. The method may further comprise determining the area, location and / or magnitude of the pressure applied to the first and / or second electrodes.

[0078] The step of determining the area, location and / or magnitude of the applied pressure on the first and / or second electrodes may further comprise mapping each measurement obtained from an individual sensing point to a distance or proximity from the individual sensing point to a point where the pressure / force is applied. The step may further comprise determining the area and / or location of the applied pressure on the first and / or second electrodes from the mapped distances. Determining the area may comprise determining a shape of the applied pressure. The method may further comprise determining a pressure area distribution from the determined area, location and / or magnitude of the applied pressure.

[0079] The change in capacitance may be measured with a measurement module. Measuring the change in capacitance at each sensing point individually requires sequential scanning of each sensing point. Scanning may include selectively connecting and disconnecting each sensing point to the measurement module such that only one sensing point or any combination of sensing points is connected to the measurement module at any one time. This may ensure that no short circuits are created when determining the location, area, and magnitude of applied pressure from individual sensing points.

[0080] For example, while measurements or readings are being taken from one sensing point, other (inactive) sensing points may be isolated from the sensing circuit. The scanning frequency may be high enough compared to typical body movements, e.g., to minimize measurement lag so that measurements / detections are perceived as real-time. For example, the scan rate may be in the range of 100-200 Hz. Depending on the application, the scan rate may be slower or faster.

[0081] By scanning multiple sensing points, measurements / readings can be taken from different locations individually within a short (negligible) time, collectively building up the distribution of pressure areas and reporting the amount of pressure on an area without having to adjust materials to prevent short circuits. This allows for a significant reduction in manufacturing costs compared to traditional sensing technologies consisting of multiple sensing electrodes, where each electrode only covers a small localized area and a significant amount of electrode modules (i.e. sensing elements) are required to cover a large sensing surface such as a seat.

[0082] Simultaneously measuring the change in capacitance at each of the sensing points may include connecting each of the sensing points to a measurement module.

[0083] Measuring the change may include measuring in the measurement module using a single input pin of the capacitive sensing chip.

[0084] According to a fourth aspect of the present invention there is provided a shoe insole including one or more pressure sensing devices according to the first aspect.

[0085] According to a fifth aspect of the present invention there is provided a seat for a motor vehicle or aircraft including one or more pressure determining devices according to the first aspect.

[0086] According to a sixth aspect of the present invention, there is provided a consumer product including one or more pressure sensing devices according to the first aspect. The consumer product may be or consist of a phone case, a laptop, or a surface of a wall, table, or object, and the one or more pressure sensing devices are configured to implement one or more track pads. The consumer product is connectable to a computing device and may provide a user interface for controlling one or more functions of the computing device based on a determined position, area, and / or magnitude of pressure applied to the one or more sensing devices.

[0087] Aspects and / or embodiments of the invention may include any one or more of the features described or defined herein. Features described in the context of separate aspects and / or embodiments of the invention may be used together, removed or interchanged, and / or are interchangeable. Similarly, features are described for brevity in the context of a single embodiment, but they may also be provided separately or in any suitable subcombination. Features described in the context of an apparatus may have corresponding features definable in the context of a method, and vice versa, and these embodiments are specifically contemplated. [Brief description of the drawings]

[0088] In order that the invention may be better understood, embodiments will now be described, by way of example only, with reference to the accompanying drawings, in which: [Figure 1] 1(a) and (b) show a schematic diagram of a pressure sensing device according to the present invention at the top and a switching unit of the device at the bottom. [Figure 2a] FIG. 2a is a schematic cross-sectional view of a sensing layer of the device of FIG. 1 according to an embodiment of the present invention. [Figure 2b] FIG. 2b is a schematic cross-sectional view of the sensing layer of the device of FIG. 1 according to an embodiment of the present invention. [Diagram 3] FIG. 3 is a schematic cross-sectional view of a sensing layer of the device of FIG. 1 according to the invention. [Figure 4] 4(a)-(c) are schematic cross-sectional views of the sensing layer of the device of FIG. 1 according to further embodiments of the present invention. [Diagram 5] 5(a)-(c) are top, side and exploded views, respectively, of the sensing layer of FIG. 3 according to one embodiment. [Figure 6] Figures 6(a) and (b) are exploded and side views, respectively, of an embodiment of a pressure mapping device with the sensing layer of Figures 2 and 5 incorporated into a shoe insole, and Figure 6(c) is an example pressure map from the device of Figures 6(a) and (b). [Figure 7] Figures 7(a) and (b) are exploded and side views, respectively, of another embodiment of a pressure mapping device with the sensing layer of Figures 3 and 5 incorporated into a shoe insole, and Figure 7(c) is an example pressure map from the device of Figures 7(a) and (b). [Figure 8] Figures 8(a)-(c) are cross-sectional, exploded, top and side views, respectively, of the sensing layer of Figure 4(b) according to an embodiment, and Figure 8(d) is an example pressure map of the sensing layer of Figures 8(a)-(c). [Figure 9] 9(a)-(c) are top, side and exploded views, respectively, of the sensing layer of FIG. 4(b) according to another embodiment. [Figure 10] 10(a)-(c) show different measurement configurations of the apparatus of FIG. [Figure 11] FIG. 11 illustrates a technique for determining pressure regions and locations. [Figure 12] 12(a) to (f) show measurement examples for different pressure distributions. [Figure 13] 13(a)-(g) show different configurations for controlling the resistance of the electrodes in the sensing layer of FIG. [Figure 14] 14(a)-(c) show a sensing layer conforming to an arbitrarily shaped surface, and FIGS. 14(d)-(e) show a sensing layer formed to an arbitrarily shaped surface. [Figure 15] FIG. 15 shows a system consisting of the devices shown in FIG. [Figure 16] Figure 16(a) shows multiple pressure sensing devices integrated into a seat, and Figure 16(b) shows schematic different pressure maps obtained from the seat of Figure 16(a). [Figure 17] FIG. 17 shows the device of FIG. 1 incorporated into a smartphone or tablet case. [Figure 18] FIG. 18 shows the apparatus of FIG. 1 incorporated into the track pad of a computing device. [Figure 19] FIG. 19 shows the device of FIG. 1 installed in a wall surface. [Figure 20] FIG. 20 shows the device of FIG. 1 installed on the surface of a table.

[0089] It should be noted that the figures are schematic and may not be drawn to scale. The relative dimensions and proportions of parts in these figures may be exaggerated or reduced for clarity and convenience of the drawings. The same reference signs are generally used to refer to corresponding or similar features in modified and / or different embodiments. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0090] 1(a) (top) is a schematic diagram of a pressure sensing device 1000 according to an embodiment of the present invention. The device 1000 includes a pressure sensing layer 100 connected to a measurement module 500 at a number of sensing points S1, S2 located at or near the periphery of the sensing layer 100. The sensing layer 100 is configured to output a change in electrical signal (capacitance) in response to a pressure or force applied on or (to either side of) the sensing layer 100, as will be described in more detail below with reference to FIG. 2. The measurement module 500 is configured to measure the electrical signal and determine the location, area and magnitude of the pressure applied to the sensing layer 100 based on the measured electrical signal.

[0091] The measurement module 500 comprises a sensing circuit 300 configured to measure pressure-induced changes in capacitance at sensing points S1, S2. In one embodiment, the sensing circuit 300 is a capacitive sensing chip having one or more sensing / input channels or pins 320, such as a capacitive sensing microprocessor or microcontroller. The sensing circuit 300 is connected to the sensing points S1, S2 via a switching unit 200 (an example of which is shown in detail in the lower part of FIG. 1(a)). The switching unit 200 is configured to selectively connect / disconnect the sensing points S1, S2 to / from the sensing circuit 300. The switching circuit 200 comprises a number of switching elements SW1, SW2, such as transistors (e.g., general purpose, PNP and / or NPN transistors), relays and / or other controllable switching elements known in the art. In the embodiment shown in FIG. 1(a), each sensing point S1, S2 is connected to the same input pin 320 of the sensing circuit 300 via the switching elements SW1, SW2. Thus, by selectively connecting / disconnecting each sensing point S1, S2 by the switching unit 200, the sensing circuit 300 can obtain measurements or readings from each sensing point S1, S2 individually, all sensing points S1, S2 simultaneously, and / or from any combination of sensing points S1, S2 using only a single input pin 320. Alternatively, as shown in Figure 1(b), each sensing point S1, S2 may be connected to a different input pin 320 of the sensing circuit 300. The measurement configuration is described in more detail below with reference to Figures 10 and 11.

[0092] Each sensing point S1, S2 is connected to the measurement module 500 via a conductive trace 40. For example, the conductive trace 40 may be or consist of wires, conductive threads, or conductive tracks on a substrate or printed circuit board (or a separate spacer layer, see Figs. 7a and 7b), which may be flexible (not shown). In Figs. 1(a) and 1(b), only the connection to the input pin 320 is shown, but there may be additional connections between the sensing layer 100 and the sensing circuit 300 required for measurement (not shown). For example, one or more portions of the sensing layer 100 may be connected to a ground or reference pin of the sensing circuit 300 via a conductive trace 40 (see below).

[0093] The measurement module 500 further comprises a control unit 400 connected to the switching unit 200 for controlling the switching elements SW1, SW2 and thus the connection between the sensing points S1, S2 and the sensing circuit 300. The control unit 400 may be or comprise a microcontroller or microprocessor chip. The control unit 400 comprises a number of input / output (I / O) channels 410 connected to respective control inputs / terminations of the switching elements SW1, SW2 and configured to control the timing and / or frequency of switching of each switching element SW1, SW2. It should be noted that the timing and / or frequency of switching may be controlled by a software program running on the control unit 400 or another computing device in communication with the control unit 400. An example of the configuration of the controllable switching elements SW1, SW2 when they are transistors is shown in the lower part of Fig. 1(a) and Fig. 1(b). It will be appreciated that the above switching operations may be realized in other ways and / or using other active or passive switching components.

[0094] The control unit 400 is further configured to receive measurement data from the sensing circuit 300 (e.g., via the I / O channel 410) to determine the location, area, and magnitude of the applied pressure. Calculation of the location, area, and magnitude of the applied pressure can be performed on-chip using appropriate software running on the control unit 400. The control unit 400 may be configured to store, process, and / or analyze the data. Alternatively or additionally, the control unit 400 may communicate with a remote computing device (not shown) running software configured to receive, process, store, and / or analyze the measurement data from the control unit 400. For example, the computing device may be configured to visualize the data obtained from the apparatus 1000. The computing device may comprise a user interface configured to visualize the data and control the apparatus 1000. Determining the location, area, and magnitude of the pressure is described in more detail below with reference to FIG. 12.

[0095] The sensing layer 100 is configured to output a pressure-induced change in capacitance through deformation of the sensing layer 100 that can be measured by the sensing circuit 300 at the sensing points S1, S2. Alternatively, the sensing circuit 300 may be or comprise a commercially available capacitive sensing microprocessor (CSM) or microcontroller. Such CSMs are generally less expensive and require fewer sensing input pins 320 compared to pressure sensing microprocessors and load cells. In the embodiment of FIG. 1(a) where each sensing point S1, S2 is connected to the same input pin 320, the fewer input pins used allows the use of a cheaper alternative CSM (e.g., fewer channels) rather than a multi-channel CSM with a higher pin count (e.g., 8 channels vs. 16 channels).

[0096] FIG. 2a is a cross-sectional view of a typical pressure sensing layer 100 to illustrate the general form and working principle of the device 1000. The sensing layer 100 comprises a first electrode 10 and a second electrode 20 spaced apart from the first electrode 10 in a thickness direction Z, such that the electrodes 10, 20 are separated from each other by a distance d. In other words, the two electrodes 10, 20 are arranged one on top of the other. Although the second electrode 20 is shown arranged on top of the first electrode 10, the order of the two electrodes 10, 20 is interchangeable. For example, the second electrode 20 may be arranged below the first electrode 10.

[0097] The first electrode 10 and / or the second electrode 20 are formed of or have a movable and / or deformable and / or flexible material. Either or each of the first electrode 10 and the second electrode 20 can be moved relative to each other, or the first electrode 10 and / or the second electrode 20 can be deformed and / or bent in response to a pressure or force applied to either electrode 10, 20 (i.e. from either or both sides of the sensing layer 100) to reduce / change the distance d between the electrodes 10, 20 (uniformly or non-uniformly) at one or more locations. This is shown in Fig. 2a as the second electrode 20 being in a substantially undeformed / unbent position (i) in the absence of pressure / force, and in a substantially deformed / bent position (ii) in response to a pressure or force applied to the second electrode 20 from the second electrode 20 side of the sensing layer 100 that reduces the distance d as indicated by the arrow. Thus, for the device 1000 to work, at least the electrode to which pressure or force must be applied is substantially deformable and / or flexible or bendable. The other electrode may be substantially rigid or deformable depending on the application. For example, if the entire sensing layer 100 is required to be flexible, then both electrodes 10, 20 will be deformable / flexible.

[0098] The capacitance of the first electrode 10 is affected by its proximity or distance to the second electrode 20 and vice versa. Thus, a change / decreasing of the distance d in response to pressure or force applied to the sensing layer 100 will result in a change in the capacitance between the first and second electrodes 10, 20, which can be measured by the sensing circuit 300 at the sensing points S1, S2. This is the basis of the operating principle of the device 1000, which will be explained in detail below. Furthermore, the operation of the device 1000 does not depend on capacitive coupling between the electrodes 10, 20 and the object or body applying the pressure / force.

[0099] The sensing points S1, S2 can be located on either the first electrode 10 or the second electrode 20. The electrode with the sensing points S1, S2 is the sensing electrode. The other electrode is a reference electrode that is connected to a ground or reference pin (not shown) of the sensing circuit 300 at one or more reference points.

[0100] The distance d or space between the electrodes 10, 20 may be substantially empty such that the electrodes 10, 20 are separated from one another by a gap, such as an air gap or void. Alternatively, the space between the electrodes 10, 20 may be at least partially filled or occupied by a non-conductive spacer layer or spacer material that is substantially compressible and resilient to allow the distance d between the electrodes 10, 20 to change under an applied pressure / force (not shown). For example, the spacer layer / material may be formed of or comprise ABS, EVA, PU, ​​rubber, or foam.

[0101] FIG. 2b shows an example of a sensing layer 100 in which the electrodes 10, 20 are separated from each other by a gap. In this embodiment, the sensing layer 100 includes one or more gap portions 110 in which the first and second electrodes 10, 20 are separated by a gap. Outside the gap portion 110 are one or more support portions 120 in which the first and second electrodes 10, 20 are separated by one or more separation elements (not shown). The separation elements maintain the separation between the first and second electrodes 10, 20 and are configured such that the gap is provided or formed. In this way, the separation elements support the overall structure of the sensing layer 100. As shown in FIG. 3 and FIGS. 4 to 7 and described below, the separation elements may be separate or integral to the first and / or second electrodes 10, 20.

[0102] The first electrode 10 and the second electrode 20 are formed from or comprised of a single piece of non-metallic conductive material such as a conductive plastic or polymer (e.g., conductive acrylonitrile butadiene styrene (ABS), conductive ethylene vinyl acetate (EVA), conductive polyurethane (PU)). Such materials are thermoformable and can be formed using known molding processes such as injection molding, heat pressing, and other thermoforming processes. This allows for a great deal of freedom in the design of the electrode shape and the device 1000 itself.

[0103] In one embodiment, the electrical resistivity of the sensing electrode (i.e., the first or second electrode 10, 20) is substantially 1×10 2 ~1x10 6 Ω / cm range. This means that the resistance between any two points on the sensing electrode measured over a distance of about 10 cm is substantially between 1 kΩ and 1 MΩ. The reference electrode (i.e., the other of the first or second electrodes 10, 20) may have the same resistivity as the sensing electrode or may have a different resistivity. For example, the reference electrode may have a substantially lower resistivity than the sensing electrode.

[0104] 3 shows an embodiment of the sensing layer 101 in which the separation element is or includes a non-conductive separation or spacer layer 30 disposed between the first and second electrodes 10, 20. The spacer layer 30 comprises one or more openings 32 that form / provide a gap, resulting in a gap portion 110 and a support portion 120. A width W of the gap or gap portion 110 is defined by the size and shape of the opening 32. Thus, the spacer layer 30 separates and electrically insulates the first and second electrodes 10, 20 at the support portion 120.

[0105] The spacer layer 30 may be formed of or comprised of a non-conductive plastic or polymeric material (e.g., ABS, EVA, or PU), or any other thermoformable non-conductive material. In this manner, the spacer layer 30 may also be formed using a molding process. Alternatively, the spacer layer 30 may be formed of or comprise a fibrous material, such as cloth or paper. When the spacer layer 30 is formed of or comprised of a thermoformable non-conductive material and is produced by a molding process, the openings 32 may be formed by the same molding process. Alternatively, the openings 32 may be formed by selectively cutting or removing material from a uniform sheet that forms the spacer layer 30.

[0106] The spacer layer 30 may be substantially rigid or deformable / flexible depending on the application. For example, if the entire sensing layer 100 is required to be flexible, both the first and second electrodes 10, 20 and the spacer layer 30 may be formed of or comprise a deformable / flexible material. If the spacer layer 30 is flexible / deformable, it may compress under an applied pressure, causing the gap between the first and second electrodes 10, 20 to change. In this case, the sensing layer 101 may respond to pressure applied to the support portion 120 as well as the gap portion 110.

[0107] Although the sensing layer 101 is shown as a three-layer structure, it will be appreciated that the sensing layer 101 may be composed of additional conductive / non-conductive layers without changing the operating principle of the device 1000. For example, the spacer layer 30 may itself be formed of a multi-layer structure.

[0108] 4(a)-(c) show an alternative embodiment of the sensing layer 102 in which the first and second electrodes 10, 20 are separated and a gap is formed without the use of a separate spacer layer 30. In this embodiment, the separation element is or includes one or more protrusions 24 extending from the inner surface 20i of the second electrode 20 and functioning as a spacer (although it will be understood that either or both of the electrodes 10, 20 may be provided with such protrusions). The spacers 24 of the sensing layer 102 are integrally formed with the first and / or second electrodes 10, 20, thus forming a monolithic structure (e.g., formed in the same molding process). In this embodiment, the width W of the gap or gap portion 110 is defined by the area between adjacent spacers 24 and / or the area surrounding the spacers 24.

[0109] In the embodiment of FIG. 4(a), the spacer 24 is disposed beyond the periphery of the first electrode 10 and extends to the (non-conductive) support surface S without contacting the first electrode 10. In the embodiment of FIG. 4(b), the spacer 24 extends to the support surface S through one or more openings 12 in the first electrode 10 and does not contact the first electrode 10 (i.e., the spacer 24 fits within the opening 12 so as not to contact the sides of the opening 12). In both examples, the spacer 24 extends in the thickness direction (i.e., Z direction) of the sensing layer 102 by a length greater than the thickness of the first electrode 10. Thus, when the first electrode 10 is placed against the surface S, the spacer 24 supports the second electrode 20 against the surface S in a spaced apart relationship with the first electrode 10, thereby forming / providing the gap shown. Furthermore, because the spacer 24 does not contact the first electrode 10, the first electrode and the second electrode are electrically insulated.

[0110] If the electrodes that the spacer 24 constitutes are deformable, the spacer 24 can compress under applied pressure, thereby changing the gap between the first and second electrodes 10, 20. In this case, the sensing layer 102 can respond to pressure applied to the support portion 120 as well as the gap portion 110.

[0111] In an alternative configuration shown in FIG. 4(c), the spacer 24 supporting the electrode 20 may be placed directly on the surface 10i of the first electrode 10. Due to the relatively high resistivity of the electrodes 10, 20, shorting of the electrodes is substantially avoided and does not affect the capacitance measurement. In this case, the spacer 24 may be configured to minimize the contact area between the distal end of the spacer 24 and the first electrode 10. For example, the spacer 24 may be substantially convex or pointed, as shown in FIG. 4(c). In this way, when pressure is applied to the sensing layer 102, a change in the measured capacitance occurs because the contact area between the spacer 24 and the first electrode 10 increases due to the deformation properties of the material of the first and / or second electrodes 10, 20, in addition to that resulting from the gap change alone. Thus, the sensing layer 102 can respond to pressure applied to the gap portion 110 as well as to the support portion 120.

[0112] Because the spacer 24 is integrally formed with the first and / or second electrodes 10, 20, manufacturing and assembly of the sensing layer 102 may be simplified compared to the sensing layer 101, which requires a separate spacer layer 30. The spacer 24 may be formed of or comprise the same material as the first and / or second electrodes 10, 20 and therefore have the same electrical and / or mechanical properties as the first and / or second electrodes 10, 20. Alternatively, the spacer 24 may be formed or comprised of a different material and / or have different electrical and / or mechanical properties than the first and / or second electrodes 10, 20, for example using a two-step overmolding process (as shown by the dotted lines in Figures 4(b) and 4(c)). Thus, the spacer 24 may be formed of or comprise a non-conductive material such that the electrodes 10, 20 remain electrically insulated even when the spacer 24 is placed directly on the inner surface 10i of the first electrode 10, for example as shown in FIG. 4(c).

[0113] Due to the absence of the spacer layer 30, the size and geometry of the integral spacer 24 and / or the opening 12 can be more precisely controlled during the molding process, which may make it suitable to scale down the sensing layer 102 to smaller sizes. For example, injection molding can achieve sizes down to 0.1 mm with a tolerance of 0.01 mm. This allows small pressure sensing devices, e.g., with XYZ dimensions of 0.5-1 mm, to be manufactured in specific shapes / contours and easily integrated into small products / objects. On the other hand, off-the-shelf electronic pressure sensors and load cells are difficult to mount on small products / objects.

[0114] The device 1000 responds not only to applied pressures that cause the gap to shrink, but also to applied pressures that cause the gap to close. The pressure sensitivity of the sensing layers 100, 101, 102 is determined by how easily the electrodes under pressure can deform, bend, and eventually close the gap. This is determined by the stiffness / flexibility of the first and / or second electrodes 10, 20 and the shape of the gap or gap portion 110, i.e., the height and width W of the gap. For example, the larger the gap width W, the easier it is to deform or bend the first and / or second electrodes 10, 20. Also, the smaller the gap height, the less pressure / force is required to close the gap. As mentioned above, the shape of the gap or gap portion 110 is mainly determined by the separation elements, i.e., the thickness of the spacer layer 30 and the size / shape of the opening 32 (in the case of the sensing layer 101) or the length and placement of the spacer 24 (in the case of the sensing layer 102). It will further be appreciated that the flexibility / rigidity of the electrodes 10, 20 of the sensing layer 100, 101, 102 is itself determined by the (intrinsic) mechanical properties of the electrode material and the geometry, such as thickness, of the first and / or second electrodes 10, 20. Due to the use of a moldable material, the shape and gap of the electrodes 10, 20 can be easily tailored at design time to tailor the flexibility and pressure sensitivity of the device 1000 to the needs of a particular application. For example, as shown in FIG. 4(a), the inner circumferential surface 10i, 20i of either electrode 10, 20 may include one or more recesses, ridges and / or undulations 20r to enhance flexibility.

[0115] Also, the magnitude of the signal (responsivity) measured by the sensing circuit 300 for a given applied pressure distribution is related to the total area of ​​the deformations. This is related not only to the size of the individual gaps 110 but also to the fill factor of the sensing layers 100, 101, 102, i.e., the ratio of the total area of ​​the sensing layers 100, 101, 102 occupied by the gaps 110. The fill factor can be controlled, for example, by the number and density of the openings 32 and spacers 24, independent of the size of the individual gaps 110. Thus, multiple design variables can be adjusted to tune the sensitivity of the device depending on the application.

[0116] 5(a)-(c) show an embodiment of the sensing layer 101 in which the spacer layer 30 comprises an array of apertures 32. Each aperture 32 forms and / or defines a separate gap portion 110. In this manner, pressure or force applied to the sensing layer 100 changes the gap of one or more of the gap portions 110, which can be detected as a change in capacitance by the sensing circuit 300 (not shown). In this example, the sensing layer 101 includes four sensing points S1, S2, S3, S4 on the second electrode 20. The first electrode 10 is grounded. Alternatively, the sensing points S1, S2, S3, S4 may be located on the first electrode 10 and the second electrode 20 may be grounded. The multiple apertures 32 may be substantially the same size and shape as shown, or may be different sizes and shapes (not shown). Furthermore, the apertures 32 may form a regular array (e.g., a repeating geometric pattern) as shown, or may form an irregular pattern (not shown). The one or more openings 32 may form elongated straight or curved lines, or a wavy pattern (not shown).

[0117] 6(a) and 6(b) show an embodiment of a device 1000 having a sensing layer 101 configured as a pressure-sensing shoe insole. The insole device 1000 comprises a plurality of first electrodes 10a-10f, a single integral spacer layer 30, and a single integral second electrode 20. Each of the first electrodes 10a-f is a sensing electrode having a plurality of sensing points S1-S12 arranged around its circumference, which are connected to the measurement module 500 via traces 40. The second electrode 20 is a reference electrode for connection to a ground / reference pin of the measurement module 500. In this way, the single integral reference electrode doubles as a reference electrode for each individual sensing electrode, simplifying assembly and manufacturing. In this example, the first electrodes 10a-f forming the sensing electrodes are underneath the reference electrode. This allows the sensing electrodes to conform to the (usually flat) sole of the shoe, and the reference electrode can be formed / molded to the 3D shape of a typical insole, as shown in FIG. 6(b). This arrangement also allows the grounded reference electrode to shield the sensing electrode from parasitic external capacitance, e.g., due to the user's foot. The top side of the second electrode 20 may be coated or covered with a non-conductive material to provide (electrical and physical) protection and / or water resistance, e.g., the coating may be a waterproof fabric.

[0118] The first electrodes 10a-f are arranged according to typical foot pressure zones. Splitting the sensing electrodes in this manner can improve the spatial resolution of pressure sensing. The spacer layer 30 is also arranged with a number of openings 32 divided into zones, each corresponding to one of the first electrodes 10a-f. Similarly, in this example, a single integral spacer layer 30 serves as the spacer layer 30 for each of the first electrodes 10a-f, simplifying assembly and manufacturing. It will be appreciated that the (second) reference electrode and / or the spacer layer 30 can alternatively be partitioned / split into a number of separate spacer layers 30 for the separate sensing electrodes.

[0119] The conductive traces 40 are formed in or on a flexible substrate (e.g., a flexible PCB) that extends to the periphery of the sensing layer 101 (which in this case corresponds to the periphery of the sole of the shoe). Positioning the traces 40 in this manner may increase the robustness of the insole device 1000 by reducing direct pressure or force on the traces 40 by the foot and the associated wear and tear.

[0120] Each opening 32 defines a gap portion 110 that contributes to a measured change in capacitance at the sensing point in response to an applied pressure or force. By scanning each sensing point S1-S12 of each sensing layer 10a-10f, the locations and areas where multiple forces are applied can be determined and a pressure area map can be constructed. FIG. 6(c) shows an example of a pressure area map that may be obtained from the insole device 1000 of FIGS. 6(a) and 6(b) when worn by a user. Each circle represents an XY location on the map and the radius of each circle represents the intensity of the pressure or force determined at that location.

[0121] 7(a) and 7(b) show an alternative embodiment of an insole device 1000 having a sensing layer 101 in which the first electrode 10 is a single integral sensing electrode and the traces 40 are incorporated into the spacer layer 30. The traces 40 may be printed on a non-conductive material as described above. Alternatively, the traces 40 may be formed by incorporating conductive threads into / on a non-conductive material, such as a fabric. Incorporating the traces 40 into / on the spacer layer 30 can simplify the manufacture and assembly of the device 1000. FIG. 7(c) shows an example of a corresponding pressure region map that may be obtained from the insole device 1000 of FIG. 7(a) and FIG. 7(b) when worn by a user.

[0122] 6 and 7 are shown as comprising a sensing layer 101 having multiple gap portions 110, it will be understood that the device 1000 may be formed with one or more sensing layers 100 without any gap portions 110.

[0123] 8(a)-(c) show an embodiment of a sensing layer 102 consisting of three spacers 14 extending from the inner surface 10i of the first electrode 10 and three corresponding openings 22 formed in the second electrode 20. In this example, the spacers 14 and openings 22 are arranged in a linear fashion. The first electrode 10 is a sensing electrode with sensing points S1, S2 at either end of the array, and the second electrode 20 is a reference electrode that is grounded. Additional sensing points can be provided at the periphery of the sensing electrodes. In this example, the width of the sensing layer 102 is about 5 mm. In use, the lower electrode (in this case the second electrode 20) can be fixed to the surface S, for example by adhesive. FIG. 8(d) shows an example of a pressure field map that may be obtained from the sensing layer 102 of FIG. 8(a)-(c) when pressure is applied at two locations. As in FIG. 6 and FIG. 7, each circle represents an XY position on the map, and the radius of each circle represents the pressure or force intensity determined at that position.

[0124] 9(a)-(c) show an alternative embodiment of the sensing layer 102 consisting of a larger array of spacers 14 and apertures 22. In this example, the second electrode 20 is a sensing electrode with multiple sensing points S1-S4 distributed around its periphery, and the first electrode 20 is a reference electrode that is grounded (although either the first or second electrode 10, 20 may be used as the sensing electrode).

[0125] The measurement module 500 is configured to operate in a first mode and / or a second mode. In the first mode, the switching unit 300 scans each sensing point S1, S2 one by one, so that the sensing circuit 300 can obtain measurements or readings from each sensing point S1, S2 separately. In the second mode, the switching unit 300 connects all sensing points S1, S2 to the sensing circuit 300, so that the sensing circuit 300 can obtain a single measurement or reading of capacitance from all sensing points S1, S2 simultaneously. In this way, each sensing point S1, S2 contributes to the measurement or reading in the second mode. In the first mode, only one sensing point S1, S2 is actively connected to the sensing circuit 300 at a given time. For example, while a measurement or reading is being made from one sensing point S1, S2, the other (inactive) sensing point S1, S2 can be disconnected from the sensing circuit. The scanning frequency is sufficiently high compared to typical body movements, e.g., to minimize measurement delays so that measurements / detections are perceived as real-time. For example, the scanning rate may be in the range of 100-200 Hz. Depending on the application, the scanning speed can be slower or faster. The measurement module 500 is configured to periodically and / or continuously switch / alternate between the first and second operation modes during operation of the device 1000. Each period constitutes a reading or measurement cycle C1 consisting of N+1 readings, where N is the number of sensing points S1, S2. In one embodiment, the switching unit 300 is controlled by the control unit 400, and thus the first and second modes are controlled by the control unit 400.

[0126] 10(a)-(c) show an example of a measurement cycle for a sensing layer 100, 101, 102 having two sensing points S1, S2, each connected to a switching unit 200 with a single output at an input pin 320 of a sensing circuit 300. Each switching element SW1, SW2 is controllable (via a controller 400, not shown) to switch between a closed state in which the respective sensing point S1, S2 is connected to the input pin 320, and an open state in which the respective sensing point S1, S2 is disconnected from the input pin 320. A read cycle C1 performs three readings, two in the first operating mode and one in the second operating mode. To generate a first reading in the first operating mode, switch SW1 is closed, switch SW2 is opened and a reading from sensing point S1 is taken at input pin 320 (see FIG. 10(a)). To take a second reading in the first operating mode, switch SW1 is open, switch SW2 is closed and a reading from sensing point S2 is taken at input pin 320 (see FIG. 10(b)). To generate a reading in the second operating mode, both switches SW1 and SW2 are closed and a reading from both sensing points S1 and S2 is taken at input pin 320 (see FIG. 10(c)).

[0127] In a first mode, readings are taken from individual sensing points S1, S2, and in a second mode, readings are taken from all sensing points S1, S2 simultaneously to determine the location, area and magnitude of the applied pressure, as described in more detail below. The measurement cycle C1 is repeated (continuously or periodically) to monitor changes in pressure and interaction with the sensing layers 100, 101, 102 in near real time.

[0128] The capacitance measurement or reading from each sensing point S1, S2 is positively correlated to the amount of pressure applied. Due to the relatively high resistivity of the electrode material, the capacitance measurement or reading resulting from a given pressure will attenuate as a function of the distance (x) from the sensing point S1, S2. Thus, the reading from each individual sensing point S1, S2 is correlated to the distance / proximity of the area / location where the pressure was applied from / to the sensing point S1, S2 and the amount of pressure applied. Since the shape of the sensing layer 100, 101, 102 and the position / location of the sensing points S1, S2 on the sensing layer 100, 101, 102 are known, the location and area of ​​the applied pressure on the sensing layer 100, 101, 102 can be determined by calculating the distance from each sensing point S1, S2 to the location where the force was applied and determining the location and area from that distance.

[0129] The readings from each sensing point S1, S2 can be mapped to a distance x based on a known dependence of the readings on the distance x. For example, this relationship can be expressed as an exponential function f(x)=e -nx where e represents a constant and n is an adjustable parameter representing the damping rate, which can be experimentally determined / derived. Based on the capacitance readings recorded at each sensing point S1, S2, a circle of radius x1, x2 defined by the readings can be defined for each sensing point S1, S2. The circle drawn from each sensing point S1, S2 shows the periphery of the pressure applied area A. This allows the pressure applied location and area A (hatched area) to be reproduced as shown in FIG. 11. It can be seen that the more the number of sensing points (circles), the higher the accuracy and spatial resolution of the pressure area mapping. However, the sensing layer 100, 101, 102 can be formed of any number N of sensing points S1, S2, ...S depending on the needs of the application. N It will be understood that one or two sensing points S1, S2 can provide one-dimensional (e.g., X or Y) position, area, and detection, and three or more sensing points S1, S2 can provide two-dimensional (e.g., XY) position and area detection.

[0130] The measurements taken in the first mode of operation are used to determine the location, area and magnitude of the applied pressure. Although a rectangular area A is shown in FIG. 11, it will be appreciated that the method can determine an area A of any shape. The readings taken in the second mode of operation provide information about the total pressure applied across the sensing layer 100, 101, 102, which can be used in conjunction with the measurements from the first mode to improve the accuracy / reliability of the determined location, area and / or magnitude of the applied pressure. For example, since the readings taken in the first mode are dependent on both the magnitude of the pressure and the distance x, the measurements from the second mode can be used to verify whether the measurements taken in the first mode represent a small amount of pressure distributed over a large area, or vice versa. The combination of the two modes results in a more reliable pressure area map.

[0131] The pressure region map or information obtained from the device 1000 may be qualitative (i.e., showing normalized or relative values) or quantitative (i.e., if actual values ​​of pressure are desired). If quantitative data is desired, a predetermined relationship can be used to convert the capacitance readings to pressure values. For example, the device can be calibrated using known values ​​of pressure.

[0132] Figure 12(a)-(f) show examples of read cycles C1, C2 (see right side of the figure) obtained from a sensing layer 100, 101, 102 having two sensing points S1, S2 subjected to a pressure or force distribution A, indicated by hatched areas (see left side of the figure). Each cycle C1, C2 consists of three reads (i.e. N+1) as described above. Figure 12(a), (b) show the different read values ​​obtained when applying low and high pressure / force, respectively, to the same sized area A and location of the sensing layer 100, 101, 102. Figure 12(c)-(d) show how the read values ​​change when the pressure or force is applied at different locations and magnitudes. In particular, Figure 12(d) and Figure 12(e) show that different sized areas at the same central location can obtain different read values, i.e. pressure distributions. This information is used to build an accurate pressure region map of interaction with the sensing layers 100, 101, 102 as described above.

[0133] As mentioned above, the ability to resolve spatial locations or regions of applied pressure depends on the electrode material having a relatively high resistivity. As shown in Fig. 13(a)-(g), the resistivity and / or resistance value of the first electrode 10 and / or the second electrode 20 can be tuned without changing the intrinsic material properties by introducing one or more holes, dimples, notches, indentations, thickness variations, and / or repeating geometric patterns / tracks into the electrode geometry. This allows a predetermined resistance value to be obtained between any two points. The holes, dimples, notches, and / or indentations can form a regular or irregular array. One or more holes, dimples, and / or indentations can define a nonlinear conductive path between two points. Alternatively or additionally, one or more indentations and / or indentations can define multiple linear and / or nonlinear conductive paths between two points.

[0134] The first and second electrodes 10, 20 can be manufactured using many different inexpensive materials and manufacturing techniques, as described above. The first and second electrodes 10, 20 and the optional spacer layer 30 can be formed / molded separately and then later assembled together. The materials and their properties can be chosen based on the required properties for the application, such as shoe insoles, automotive interiors, wearables, etc. Furthermore, the first and second electrodes 10, 20 can be formed or molded into almost any size, shape, and three-dimensional (3D) form due to the nature of the molding process (see, for example, Figures 13 and 14(d)). For example, while Figures 2-9 show the sensing layers 100, 101, 102 and electrodes 10, 20 in a substantially planar configuration, as shown in Figures 14(a)-(c), the sensing layers 100, 101, 102 and electrodes 10, 20 can be formed / molded to conform to the exterior / interior surface S of an object of any shape, regardless of complexity. The sensing layer 100 can be formed / shaped into the required shape as shown in Figures 14(a), (b), (d), (e). Alternatively, if both the first and second electrodes 10, 20 and the optional spacer layer 30 are flexible, the sensing layers 100, 101, 102 can be deformed to conform to the surface profile S. In some applications, a cylindrical configuration as shown in Figures 14(c) and (e) can be used to facilitate mechanical connection of the sensing points S1-S4 to the measurement module 500, for example, since the sensing points S1-S4 can be placed closer together than in a substantially planar configuration.

[0135] It will also be appreciated that the Z direction shown in Figures 2, 3 and 4 is not necessarily the vertical axis and that the sensing layers 100, 101, 102 can be oriented in any direction.

[0136] FIG. 15 shows a general system 2000 consisting of multiple separate sensing layers 100 whose readings can be combined to form a single pressure region map, for example, via a computer program or software running on the control unit 400 or a remote computing device.

[0137] FIG. 16(a) shows an embodiment of a system 2000 of multiple sensing layers 100 integrated into a seat. Similar to the insole device 1000 of FIG. 6, each sensing layer 100 provides information about the location, area and magnitude of pressure or force applied from a specific area within the system 2000. The information from each sensing layer 100 can be combined using software to create a global pressure map of the complex sensor system 2000, effectively treating the multiple sensing layers 100 as a single larger sensing layer 100 or pressure mapping area. For example, in the seat system 2000 of FIG. 16(a), multiple sensing layers 100 can be used to obtain weight distribution from which different seating behaviors can be derived, as shown by the vertical bars in FIG. 16(b). Each different sensing layer 100 of the system 2000 can be connected to the same sensing input 320 of the sensing circuit 300, for example, via one or more switching units 200. Alternatively, each different sensing layer 100 can be connected to a different sensing input 320.

[0138] In addition to underfoot and seat pressure mapping applications, the device 1000 can be incorporated into many everyday objects with which a user interacts. Figure 17 shows an embodiment of a sensing layer 100 molded and integrated into a mobile phone case that can be used to extend the trackpad functionality of modern touchscreen mobile phones.

[0139] 18 illustrates one embodiment of the sensing layer 100 for use as a track pad in a laptop. The sensing layer 100 can be used to replace traditional track pads based on touch / pressure sensor arrays with integrated non-metallic electrodes that are inexpensive to manufacture and provide accurate position information with fewer sensing input pins and sensing points.

[0140] 19 and 20 show further embodiments in which the sensing layer 100 is integrated into a common surface (eg, a wall or table surface) to provide a touch screen and / or interactive board.

[0141] An embodiment of the present invention provides a sensing layer 100, 101, 102 that generates a single capacitance measurement from a single sensing point S1, S2 indicative of a body / object interaction with the sensing layer 100, 101, 102 that can be registered via a single input pin 320 of the sensing circuit 300. Adding and switching between two or more sensing points S2, S2 can advantageously provide complementary information about the area where force is applied, allowing a more accurate position or pressure / force distribution to be constructed, since the readings from each sensing point S1, S2 will be different based on the relative proximity / location of the applied pressure / force or local interaction with the sensing layer 100, 101, 102 to each sensing point S1, S2.

[0142] Other variations and modifications will be apparent to persons skilled in the art upon reading this disclosure, and such variations and modifications may involve equivalent or other features already known in the art, which may be used instead of or in addition to features already described herein.

[0143] Although the appended claims are directed to particular combinations of features, it should be understood that the scope of the present disclosure also includes any novel feature or any novel combination of features, or generalizations thereof, explicitly or implicitly disclosed herein, whether or not related to the same invention as currently claimed in any claim and whether or not alleviating some or all of the same technical problems as the present invention.

[0144] Features that are described in the context of separate embodiments may also be provided in combination in a single embodiment. Conversely, various features that are, for brevity, described in the context of a single embodiment, may also be provided separately or in any suitable subcombination.

[0145] For clarity, it is also clarified that the word "comprising" does not exclude other elements or steps, the singular terms "a" or "an" do not exclude a plurality, and reference signs in the claims shall not be construed as limiting the scope of the claims.

Claims

1. a first electrode and a second electrode arranged at a distance from each other, at least one of said electrodes being made of or including an integral part of a non-metallic conductive material, said distance being variable in response to a pressure or force applied to said first and / or second electrode; a measurement module connected to the first or second electrode at a plurality of sensing points on the electrode; A pressure sensing device comprising: The measurement module includes: measuring a change in capacitance between the first and second electrodes in response to a change in the distance when pressure or force is applied to the first and / or second electrodes at each sensing point individually and simultaneously at all sensing points; determining the location, area and magnitude of the pressure applied to the first and / or second electrodes from the individual measurements from the individual measurements; and determining a magnitude of the pressure applied to the first and / or second electrodes from the simultaneous measurements; The measurement module includes: a sensing circuit configured to measure a change in capacitance at the sensing point; The measurement module includes: A switching unit is further provided connected between the sensing circuit and the sensing point, A pressure sensing device, wherein the switching unit is configured to selectively connect / disconnect each sensing point to / from the sensing circuit, such that a single sensing point is connected to the sensing circuit when individual measurements are performed, and all sensing points are connected to the sensing circuit when simultaneous measurements are performed.

2. 10. The device of claim 1, wherein the first and / or second electrodes are movable and / or deformable to vary the distance and / or are constructed of or include a thermoformable non-metallic conductive material and / or are formed by a molding process.

3. The measurement module includes: mapping each measurement obtained from an individual sensing point to a distance from said individual sensing point; 3. The apparatus of claim 1 or 2, further configured to determine the location, area and magnitude of the pressure applied to the first and / or second electrodes from the mapped distances.

4. The measurement module includes: operating in a first mode to obtain the individual measurements by sequentially scanning each of the plurality of sensing points; 4. Apparatus according to claim 1, configured to operate in a second mode to obtain said simultaneous measurements.

5. The apparatus of claim 4 , wherein the measurement module is configured to alternate between the first mode and the second mode.

6. 6. Apparatus according to any one of claims 1 to 5, wherein the sensing circuit is or includes a capacitive sensing microprocessor.

7. 7. Apparatus according to claim 1, wherein each of the sense points is connected to the sense circuit at a same sense input pin of the sense circuit or at different sense input pins of the sense circuit.

8. The apparatus of claim 1 , further comprising one or more isolation elements configured to isolate the first and second electrodes.

9. the distance between the first electrode and the second electrode is or includes one or more gaps; 9. An apparatus according to claim 1, wherein the gap is changeable in response to a pressure or force applied to the first and / or second electrodes.

10. 10. Apparatus according to claim 9, when dependent on claim 8, wherein the one or more separation elements are configured to provide the one or more gaps.

11. 11. The device of claim 8 or 10, wherein the one or more separation elements is or includes a non-conductive spacer layer disposed between the first and second electrodes.

12. The device described in claim 11, wherein the spacer layer has one or more openings for providing the one or more gaps.

13. The apparatus of claim 12 , wherein the spacer layer comprises an array of apertures.

14. 14. The apparatus of claim 11, wherein the spacer layer is formed of or comprises a non-conductive material.

15. The device of claim 14, wherein the spacer layer is flexible and / or compressible and / or formed by a molding process.

16. the first and / or second electrode comprises the one or more separation elements; 11. The apparatus of claim 9 or 10, wherein the one or more separation elements are or include one or more integrally molded protrusions, said protrusions acting as spacers separating the first and second electrodes and configured to provide the one or more gaps.

17. 17. The device of claim 16, wherein the first and / or second electrodes comprise one or more openings configured to accommodate a portion of the one or more protrusions of the other of the first and / or second electrodes without the first and second electrodes contacting each other.

18. the one or more protrusions of the first and / or second electrodes contact the other of the first and / or second electrodes; 17. The device of claim 16, wherein the one or more protrusions are configured to provide a variable contact area between the first and / or second electrodes and one another in response to a pressure or force applied to the first and / or second electrodes.

19. The device of claim 18 , wherein the one or more protrusions are substantially convex and / or pointed.

20. 20. An apparatus according to any one of claims 16 to 19, wherein each of the one or more gaps extends substantially within an area either around, on either side of and / or between the one or more protrusions.

21. 21. The apparatus of claim 20, wherein the size of the gap is determined at least in part by a length of the or each protrusion.

22. 22. A method of operating a device according to any one of claims 1 to 21, said method comprising the steps of: measuring with the sensing circuit a change in capacitance between the first and second electrodes in response to a change in distance between the first and second electrodes when pressure or force is applied to the first and / or second electrodes, at each sensing point individually and at all sensing points simultaneously; determining the location, area and magnitude of the pressure applied to the first and / or second electrodes from measurements from the separate measurements and / or determining the magnitude of the applied pressure from measurements from the simultaneous measurements.

23. The step of determining the location and area of ​​the pressure applied to the first and / or second electrodes comprises: mapping each measurement obtained from an individual sensing point to a distance from said individual sensing point; 23. The method of claim 22, comprising determining from the mapped distances the location and area of ​​the pressure applied to the first and / or second electrodes.

24. The measuring step includes:

24. A method according to claim 22 or 23, comprising selectively connecting / disconnecting each sensing point to / from the sensing circuit such that a single sensing point is connected to the sensing circuit when individual measurements are made and all sensing points are connected to the sensing circuit when simultaneous measurements are made.

25. 22. A method of manufacturing a pressure sensing device according to any one of claims 1 to 21, the method comprising the steps of: forming the first electrode and / or the second electrode such that the first electrode and / or the second electrode are formed of or include an integral piece of non-metallic conductive material; Separately disposing the first and second electrodes such that the first and second electrodes are disposed at a distance apart; connecting the measurement module to the first or second electrode at a plurality of sensing points on the electrode.

26. 26. The method of claim 25, wherein forming the first and second electrodes comprises a thermoforming and / or molding process.

27. 27. The method of claim 26, wherein the first and / or second electrodes are movable and / or deformable.

28. 28. The method of any one of claims 25 to 27, further comprising forming one or more isolation elements configured to isolate the first and second electrodes.

29. 30. The method of claim 28, wherein forming the one or more separation elements comprises a thermoforming and / or molding process.

30. the step of disposing includes disposing the first and second electrodes in a separated manner such that the first and second electrodes are separated by one or more gaps; 30. The method of claim 28 or 29, wherein forming the one or more isolation elements comprises forming one or more protrusions integrally formed with the first and / or second electrodes to function as spacers configured to separate the first and second electrodes and provide the one or more gaps.

Images