SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND STORAGE MEDIUM

Abstract

To provide a substrate processing device effective in speeding up adjustment of a removal width of a film formed on a substrate.SOLUTION: A substrate processing device includes a periphery removal unit that removes a peripheral portion of a film formed on the surface of a substrate, a profile acquisition unit that acquires a removal width profile representing a relationship between a position in the circumferential direction of the substrate and a width of the portion of the substrate on which the film has been removed, and a factor estimation unit that outputs factor information indicating the factors of a width error on the basis of the removal width profile.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present disclosure relates to a substrate processing apparatus, a substrate processing method, and a storage medium. [Background technology]

[0002] Patent Document 1 discloses a coating film removal method including a coating film removal step of rotating a circular substrate around its orthogonal axis while supplying solvent from a solvent nozzle to the peripheral edge of a coating film on the surface of the substrate to remove the coating film in a ring shape with a preset width dimension, a step of transporting the substrate to an inspection module for imaging the entire surface of the substrate to inspect the condition of the coating film, a step of detecting the area where the coating film has been removed based on image data acquired by the inspection module, and a step of correcting the transfer position of the subsequent substrate based on the detection result. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2014-91105 A Summary of the Invention [Problem to be solved by the invention]

[0004] The present disclosure provides a substrate processing apparatus that is effective in speeding up adjustment of the removal width of a coating formed on a substrate. [Means for solving the problem]

[0005] A substrate processing apparatus according to one aspect of the present disclosure includes an edge removal unit that removes a peripheral portion of a coating formed on a surface of a substrate, a profile acquisition unit that acquires a removal width profile indicating the relationship between a circumferential position of the substrate and a width of a portion of the substrate from which the coating has been removed, and a factor estimation unit that outputs factor information indicating a factor of a width error based on the removal width profile. Effect of the Invention

[0006] According to the present disclosure, it is possible to provide a substrate processing apparatus that is effective in speeding up adjustment of the removal width of a coating formed on a substrate. [Brief description of the drawings]

[0007] [Figure 1] 1 is a schematic diagram illustrating a schematic configuration of a substrate processing system; [Diagram 2] FIG. 2 is a schematic diagram illustrating a schematic configuration of a coating unit. [Diagram 3] FIG. 2 is a schematic diagram illustrating a schematic configuration of an inspection unit. [Figure 4] 4 is a schematic diagram illustrating a functional configuration of a control unit; FIG. [Diagram 5] 4 is a schematic diagram illustrating a hardware configuration of a control unit. FIG. [Figure 6] 1 is a flowchart illustrating a film formation control procedure. [Figure 7] 11 is a flowchart illustrating a procedure for obtaining a removal profile. [Figure 8] 11 is a flowchart illustrating an example of a procedure for outputting cause information. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] Hereinafter, the embodiments will be described in detail with reference to the drawings. In the description, the same elements or elements having the same functions are denoted by the same reference numerals, and duplicated description will be omitted.

[0009] [Substrate Processing System] The substrate processing system 1 is a system that performs the processes of forming a photosensitive film on a substrate, exposing the photosensitive film to light, and developing the photosensitive film. Examples of substrates to be processed include semiconductor wafers, glass substrates, mask substrates, and FPDs (Flat Panel Displays). Substrates also include those on which a film or the like has been formed in a previous process on a semiconductor wafer or the like.

[0010] As shown in FIG. 1, the substrate processing system 1 includes a coating / developing apparatus 2 and an exposure apparatus 3. The exposure apparatus 3 performs an exposure process on a resist film (photosensitive coating) formed on a substrate W. The substrate W is, for example, circular, and has a position indicator (for example, a notch) on its periphery that serves as a reference for its position in the circumferential direction. Specifically, the exposure apparatus 3 irradiates an energy beam onto an exposure target portion of the resist film by a method such as immersion exposure. The coating / developing apparatus 2 performs a process of forming a resist film on the surface of the substrate W before the exposure process by the exposure apparatus 3, and performs a development process on the resist film after the exposure process.

[0011] [Substrate Processing Apparatus] The following describes the configuration of the coating and developing apparatus 2 as an example of the substrate processing apparatus. The coating and developing apparatus 2 includes a carrier block 4, a processing block 5, an interface block 6, and a control unit 100.

[0012] The carrier block 4 introduces the substrate W into the coating and developing apparatus 2 and removes the substrate W from the coating and developing apparatus 2. For example, the carrier block 4 can support a plurality of carriers C (accommodation sections) for the substrates W and has a built-in transfer arm A1. The carrier C accommodates, for example, a plurality of circular substrates W. The transfer arm A1 removes the substrate W from the carrier C and transfers it to the processing block 5, and receives the substrate W from the processing block 5 and returns it into the carrier C.

[0013] The processing block 5 has a plurality of processing modules 11, 12, 13, and 14. The processing module 11 incorporates a plurality of coating units U1, a plurality of thermal processing units U2, and a transport arm A3 for transporting substrates W to these units.

[0014] The processing module 11 forms an underlayer film on the surface of the substrate W using a coating unit U1 and a thermal processing unit U2. The coating unit U1 applies a processing liquid for forming an underlayer film onto the substrate W. The thermal processing unit U2 performs various thermal processes associated with the formation of the underlayer film. The thermal processing unit U2 has, for example, a built-in hot plate and a cooling plate, and performs thermal processing by heating the substrate W with the hot plate and cooling the heated substrate W with the cooling plate.

[0015] The processing module 12 (film forming processing section) incorporates a plurality of coating units U1, a plurality of heat treatment units U2, a plurality of inspection units U3, and a transport arm A3 that transports the substrate W to these units. The processing module 12 forms a resist film on the underlayer film using the coating unit U1 and the heat treatment unit U2. The coating unit U1 forms a coating on the surface of the substrate W by applying a processing liquid for forming a resist film onto the underlayer film. Hereinafter, this coating is referred to as a "pre-baked resist film." The heat treatment unit U2 performs various heat treatments associated with the formation of the resist film. As a result, the pre-baked resist film becomes a resist film.

[0016] The coating unit U1 may be configured to remove at least a portion of the resist film. Removing at least a portion of the resist film includes removing a portion of the pre-baked resist film prior to the heat treatment by the heat treatment unit U2. For example, the coating unit U1 forms a pre-baked resist film on the surface of the substrate W, and then supplies a removing liquid to the peripheral portion of the substrate W to remove the peripheral portion of the pre-baked resist film.

[0017] The inspection unit U3 performs processing to inspect the state of the front surface Wa of the substrate W. For example, the inspection unit U3 acquires information indicating the state of the front surface Wa of the substrate W. The information indicating the state of the front surface Wa includes information on the width of the portion of the substrate W from which the resist film has been removed (for example, the width in the radial direction of the substrate W).

[0018] The processing module 13 incorporates a plurality of coating units U1, a plurality of thermal processing units U2, and a transport arm A3 for transporting the substrate W to these units. The processing module 13 forms an upper layer film on the resist film using the coating units U1 and the thermal processing units U2. The coating units U1 of the processing module 13 apply a liquid for forming an upper layer film onto the resist film. The thermal processing unit U2 of the processing module 13 performs various thermal processes associated with the formation of the upper layer film.

[0019] The processing module 14 incorporates a plurality of developing units U4, a plurality of thermal processing units U5, and a transport arm A3 for transporting the substrate W to these units. The processing module 14 performs development processing of the resist film after exposure using the developing unit U4 and the thermal processing unit U5. The developing unit U4 performs development processing of the resist film by applying a developer onto the surface of the exposed substrate W and then rinsing it off with a rinsing liquid. The thermal processing unit U5 performs various types of thermal processing associated with the development processing. Specific examples of thermal processing include a heating process before the development processing (PEB: Post Exposure Bake), a heating process after the development processing (PB: Post Bake), etc.

[0020] A shelf unit U10 is provided on the carrier block 4 side in the processing block 5. The shelf unit U10 is divided into a plurality of cells arranged in the vertical direction. A lift arm A7 is provided near the shelf unit U10. The lift arm A7 raises and lowers the substrate W between the cells of the shelf unit U10.

[0021] A shelf unit U11 is provided on the interface block 6 side in the processing block 5. The shelf unit U11 is partitioned into a plurality of cells arranged in the vertical direction.

[0022] The interface block 6 transfers the substrate W to and from the exposure apparatus 3. For example, the interface block 6 has a built-in transfer arm A8, and is connected to the exposure apparatus 3. The transfer arm A8 transfers the substrate W placed on the shelf unit U11 to the exposure apparatus 3, receives the substrate W from the exposure apparatus 3, and returns it to the shelf unit U11.

[0023] The control unit 100 controls each element included in the coating and developing apparatus 2. Below, an example is given of a series of control procedures executed by the control unit 100 for one substrate W. For example, the control unit 100 first controls the transfer arm A1 to transport the substrate W in the carrier C to the shelf unit U10, and then controls the lift arm A7 to place the substrate W in a cell for the processing module 11.

[0024] Next, the control unit 100 controls the transport arm A3 to transport the substrate W from the shelf unit U10 to the coating unit U1 and heat treatment unit U2 in the processing module 11. The control unit 100 also controls the coating unit U1 and heat treatment unit U2 to form an underlayer film on the surface of the substrate W. Thereafter, the control unit 100 controls the transport arm A3 to return the substrate W with the underlayer film formed thereon to the shelf unit U10, and controls the lift arm A7 to place the substrate W in a cell for the processing module 12.

[0025] Next, the control unit 100 controls the transport arm A3 to transport the substrate W from the shelf unit U10 to the coating unit U1 and heat treatment unit U2 in the processing module 12. The control unit 100 also controls the coating unit U1 and heat treatment unit U2 to form a resist film on the underlying film of the substrate W. For example, the control unit 100 controls the coating unit U1 to form the pre-baked resist film on the underlying film of the substrate W and to remove a peripheral portion of the pre-baked resist film, and controls the heat treatment unit U2 to subject the substrate W to a heat treatment to turn the pre-baked resist film into a resist film.

[0026] Furthermore, the control unit 100 controls the transport arm A3 to transport the substrate W to the inspection unit U3, and obtains from the inspection unit U3 information indicating the surface condition of the substrate W. Thereafter, the control unit 100 controls the transport arm A3 to return the substrate W to the shelf unit U10, and controls the lift arm A7 to place the substrate W in a cell for the processing module 13.

[0027] Next, the control unit 100 controls the transport arm A3 to transport the substrate W from the shelf unit U10 to each unit in the processing module 13, and controls the coating unit U1 and the heat treatment unit U2 to form an upper layer film on the resist film on the substrate W. Thereafter, the control unit 100 controls the transport arm A3 to transport the substrate W to the shelf unit U11.

[0028] Next, the control unit 100 controls the delivery arm A8 to send the substrate W in the shelf unit U11 to the exposure apparatus 3. Thereafter, the control unit 100 controls the delivery arm A8 to receive the substrate W that has been subjected to the exposure process from the exposure apparatus 3 and place it in a cell for the processing module 14 in the shelf unit U11.

[0029] Next, the control unit 100 controls the transport arm A3 to transport the substrate W from the shelf unit U11 to the developing unit U4 and heat-treating unit U5 in the processing module 14, and controls the developing unit U4 and heat-treating unit U5 to perform development processing on the resist film on the substrate W. Thereafter, the control unit 100 controls the transport arm A3 to return the substrate W to the shelf unit U10, and controls the lifting arm A7 and delivery arm A1 to return the substrate W into the carrier C. This completes a series of control procedures for one substrate W.

[0030] [Coating unit] Next, a detailed description will be given of an example of the configuration of the coating unit U1 in the processing module 12. As described above, the coating unit U1 supplies a processing liquid for forming a resist film to the front surface Wa of the substrate W to form the pre-baked resist film. In addition, the coating unit U1 (periphery removal unit) forms the pre-baked resist film on the front surface Wa of the substrate W, and then supplies a removal liquid to the peripheral portion of the substrate W to remove the peripheral portion of the pre-baked resist film.

[0031] As shown in Fig. 2, the coating unit U1 has a spin holder 20, a processing liquid supply unit 30, and a removal liquid supply unit 40. The spin holder 20 holds and rotates the substrate W. For example, the spin holder 20 has a holder 21 and a rotation drive unit 22. The holder 21 supports the substrate W arranged horizontally with its front surface Wa facing upward, and holds the substrate W by suction (for example, vacuum suction). The rotation drive unit 22 uses, for example, an electric motor as a power source to rotate the holder 21 around a vertical center of rotation CL. This causes the substrate W to rotate.

[0032] The processing liquid supply unit 30 supplies a processing liquid for forming a resist film to the front surface Wa of the substrate W. For example, the processing liquid supply unit 30 has a nozzle 31, a liquid source 32, a liquid delivery unit 33, and a nozzle movement unit 34. The nozzle 31 ejects the processing liquid toward the front surface Wa of the substrate W. The liquid source 32 contains the processing liquid and pressure-feeds the processing liquid to the nozzle 31. The liquid delivery unit 33 guides the processing liquid from the liquid source 32 to the nozzle 31. For example, the liquid delivery unit 33 has a liquid delivery line L1 and a valve V1. The liquid delivery line L1 connects the liquid source 32 and the nozzle 31. The valve V1 is, for example, an air-operated valve, and opens and closes a flow path in the liquid delivery line L1. The nozzle movement unit 34 moves the nozzle 31 between the rotation center CL and an area outside the substrate W by a power source such as an electric motor.

[0033] The removing liquid supply unit 40 supplies a removing liquid to the surface Wa of the substrate W. The removing liquid is a solvent that can remove (dissolve) the pre-baked resist film formed by the processing liquid supplied from the processing liquid supply unit 30. A specific example of the removing liquid is an organic solvent such as thinner. For example, the removing liquid supply unit 40 has a nozzle 41, a liquid source 42, a liquid delivery unit 43, a flow rate sensor 45, and a nozzle movement unit 44.

[0034] The nozzle 41 ejects the removing liquid toward the peripheral portion of the substrate W held and rotated by the spin holder 20. The nozzle 41 ejects the removing liquid toward the front surface Wa of the substrate W rotated by the spin holder 20. The liquid source 42 stores the removing liquid and pumps the removing liquid toward the nozzle 41. The liquid delivery unit 43 guides the removing liquid from the liquid source 42 to the nozzle 41. For example, the liquid delivery unit 43 has a liquid delivery line L2 and a valve V2. The liquid delivery line L2 connects the liquid source 42 and the nozzle 41. The valve V2 is, for example, an air operation valve, and opens and closes a flow path in the liquid delivery line L2. The flow sensor 45 detects the flow rate (flow rate per unit time) of the removing liquid in the liquid delivery line L2. The nozzle moving unit 44 moves the nozzle 41 between the peripheral portion of the substrate W and an area outside the substrate W by a power source such as an electric motor.

[0035] [Inspection unit] Next, an example of the configuration of the inspection unit U3 will be described in detail. The inspection unit U3 acquires image data as surface information indicating the state of the surface Wa by capturing an image of the surface Wa of the substrate W. As shown in FIG. 3, the inspection unit U3 has a holder 51, a rotation drive unit 52, a position index detection unit 53, and an imaging unit 57.

[0036] The holder 51 supports the substrate W arranged horizontally with its front surface Wa facing upward, and holds the substrate W by suction (e.g., vacuum suction). The rotation drive unit 52 rotates the holder 51 around a vertical center of rotation by a power source such as an electric motor. This causes the substrate W to rotate.

[0037] The position index detection unit 53 detects the notch of the substrate W. For example, the position index detection unit 53 has a light-projecting unit 55 and a light-receiving unit 56. The light-projecting unit 55 emits light toward the peripheral edge of the rotating substrate W. For example, the light-projecting unit 55 is disposed above the peripheral edge of the substrate W and emits light downward. The light-receiving unit 56 receives the light emitted by the light-projecting unit 55. For example, the light-receiving unit 56 is disposed below the peripheral edge of the substrate W so as to face the light-projecting unit 55.

[0038] The imaging unit 57 is a camera that images at least the peripheral portion of the front surface Wa of the substrate W. For example, the imaging unit 57 images the peripheral portion of the front surface Wa of the substrate W where no resist film is formed (where the pre-baked resist film has been removed). For example, the imaging unit 57 is disposed above the peripheral portion of the substrate W held by the holding unit 51 and faces downward.

[0039] [Control Unit] The coating unit U1 and inspection unit U3 described above are controlled by the controller 100. The control procedure for the coating unit U1 and the inspection unit U3 by the controller 100 includes causing the coating unit U1 to remove a peripheral portion of the resist film formed on the front surface Wa of the substrate W, acquiring from the inspection unit U3 a removal width profile that indicates the relationship between the position in the circumferential direction of the substrate W and the width of the portion of the substrate W from which the resist film has been removed (hereinafter referred to as the "removal width"), and outputting factor information that indicates the cause of an error in the removal width based on the removal width profile. The error means a deviation from a predetermined target value.

[0040] Errors in the removal width can occur due to various factors, but it takes time to identify which factor caused the error based only on the error evaluation results. In contrast, a removal width profile that indicates the relationship between the circumferential position of the substrate W and the removal width tends to show different characteristics depending on the error factor. For this reason, accurate factor information can be output based on the removal width profile.

[0041] Hereinafter, a specific example of the configuration of the control unit 100 for controlling the coating unit U1 and the inspection unit U3 will be described with reference to Fig. 4. As shown in Fig. 4, the control unit 100 has, as functional components (hereinafter referred to as "functional blocks"), a transport control unit 111, a film formation control unit 112, an edge removal control unit 113, a program storage unit 114, a profile acquisition unit 115, a feature amount calculation unit 116, a factor candidate storage unit 123, an apparatus status acquisition unit 117, a record generation unit 118, and a data accumulation unit 119.

[0042] The transport control unit 111 controls the transport arm A3 to transport the substrate W based on an operation program stored in the program storage unit 114. The operation program of the transport arm A3 includes time-series instructions defined by at least one control parameter. Specific examples of the at least one control parameter include a transport target position of the substrate W and a moving speed to the transport target position.

[0043] The film formation control unit 112 controls the coating unit U1 based on the operation program stored in the program storage unit 114 to form a pre-baked resist film on the surface of the substrate W. The edge removal control unit 113 controls the coating unit U1 based on the operation program stored in the program storage unit 114 to remove a peripheral portion of the pre-baked resist film.

[0044] The operation program of the coating unit U1 includes a time-series command defined by at least one control parameter. Specific examples of the at least one control parameter include the amount of treatment liquid discharged from the nozzle 31 to form a resist film (amount discharged per unit time), the position of the nozzle 41 when discharging the removal liquid (e.g., the distance from the rotation center CL to the center of the nozzle 41), the amount of removal liquid discharged from the nozzle 41 (amount discharged per unit time), etc. Instead of the amount of treatment liquid discharged from the nozzle 31, the opening of the valve V1 may be determined, and instead of the amount of removal liquid discharged from the nozzle 41, the opening of the valve V2 may be determined.

[0045] The profile acquisition unit 115 acquires the removal width profile, which indicates the relationship between the circumferential position of the substrate W and the width of the portion of the substrate W from which the resist film has been removed (the removal width), from the inspection unit U3. The circumferential position of the substrate W is a position based on the position index detected by the position index detection unit 53, and is expressed, for example, as an angle about the center of the substrate W. The width of the portion from which the resist film has been removed is, for example, the width in the radial direction of the substrate W. The removal width profile may be point sequence data which discretely indicates the relationship between the circumferential position of the substrate W and the removal width, or may be function data which continuously indicates the relationship between the circumferential position of the substrate W and the removal width.

[0046] The feature amount calculation unit 116 calculates a plurality of types of feature amounts associated with at least one error factor based on the removal width profile. The plurality of types of feature amounts include an evaluation value of the removal width, an evaluation value of the eccentricity of the edge of the resist film relative to the edge of the substrate W, an evaluation value of the circularity of the edge of the resist film, and an evaluation value of the roughness of the edge of the resist film. The evaluation value of the removal width is, for example, a value that represents an overall tendency of the removal width profile. Specific examples of such evaluation values ​​include an average value, a median value, and the like.

[0047] The feature calculation unit 116 calculates an approximation function of the outline of the resist film with the center of the substrate W as the origin based on the removal width profile, and calculates the evaluation value of the eccentricity, the evaluation value of the circularity, and the evaluation value of the roughness based on the function.

[0048] Each of the multiple types of feature amounts calculated by the feature amount calculation unit 116 is associated with at least one error factor in the factor candidate storage unit 123. The multiple types of feature amounts may include a composite feature amount associated with multiple types of error factors.

[0049] As an example, in the cause candidate storage unit 123, the evaluation value of the width is associated with at least the positional deviation of the nozzle 41 and the change in the discharge amount of the removal liquid from the nozzle 41. The change here means a long-term change that occurs over a period longer than the processing period for one substrate W.

[0050] The evaluation value of eccentricity is associated in the cause candidate storage unit 123 with at least the positional deviation of the substrate W on the spin holder 20, the evaluation value of circularity is associated with at least the distortion of the substrate W and the distortion of the spin holder 20, and the evaluation value of roughness is associated with at least the splashing of the removing liquid and the fluctuation in the discharge amount of the removing liquid from the nozzle 41. The fluctuation here means the fluctuation within the processing period for one substrate W. The evaluation value of width, the evaluation value of circularity, and the evaluation value of roughness associated with at least two error causes correspond to the above-mentioned composite feature.

[0051] The equipment status acquisition unit 117 acquires information indicating the operating status of at least the equipment involved in forming the resist film, such as the transport arm A3, the coating unit U1, etc. For example, the equipment status acquisition unit 117 acquires the position of the substrate W in the coating unit U1 by the transport arm A3 (the position of the substrate W in the spin holder 20), the position of the nozzle 41 when removing the pre-baked resist film, the amount of removal liquid discharged from the nozzle 41 when removing the pre-baked resist film (for example, the flow rate detected by the flow rate sensor 45), etc.

[0052] The record generation unit 118 generates a record including the calculation result of one feature amount and the state of the coating unit U1 corresponding to the feature amount, and accumulates the record in the data accumulation unit 119. Here, "corresponding" means "corresponding to the same substrate W." The state of the coating unit U1 corresponding to the feature amount means the state of the coating unit U1 in the middle of performing a process of removing the pre-bake resist liquid on the substrate W for which the feature amount is to be calculated.

[0053] The state of the coating unit U1 includes at least the position of the substrate W on the spin holder 20 (the position of the center of the substrate W relative to the rotation center CL of the holder 21), the position of the nozzle 41 when discharging the removing liquid, the amount of the removing liquid discharged from the nozzle 41, and the fluctuation range of the amount of the removing liquid discharged from the nozzle 41. The fluctuation range here means the fluctuation range within a processing period for one substrate W. The data storage unit 119 stores the records generated by the record generation unit 118.

[0054] The control unit 100 further includes an evaluation unit 121, a contribution evaluation unit 122, and a factor estimation unit 124. The evaluation unit 121 evaluates the removal width based on the removal width profile. The evaluation result of the removal width by the evaluation unit 121 may include a plurality of types of evaluation values. For example, the evaluation result of the removal width by the evaluation unit 121 may include the maximum and minimum values ​​of the removal width in the removal width profile, or may include the maximum, average, and minimum values ​​of the removal width in the removal width profile.

[0055] The contribution evaluation unit 122 evaluates the contribution of the plurality of types of feature quantities to the error based on the calculation results of the plurality of types of feature quantities. The contribution is a value indicating the degree of influence on the error. The contribution is calculated by a known statistical calculation method.

[0056] The factor estimation unit 124 outputs factor information indicating factors of the removal width error based on the removal width profile. The output includes displaying on a display device 196 described below, transmitting the factor information to other devices, etc. The output also includes outputting the factor information to a function block that executes further processing based on the factor information, such as a parameter adjustment unit 125 described below.

[0057] The factor estimation unit 124 may output factor information based on the calculation results of multiple types of feature quantities. The factor estimation unit 124 may output factor information based on the contribution of multiple types of feature quantities to the error. The factor estimation unit 124 may output factor information based on at least one error factor associated with at least the feature quantity with the highest contribution among multiple types of error factors. For example, the factor estimation unit 124 outputs factor information indicating at least the error factor associated with the feature quantity with the highest contribution.

[0058] The factor estimation unit 124 may output factor information indicating the contribution and at least one corresponding error factor for each of a plurality of types of feature quantities. This factor information can indicate the error factor associated with the feature quantity having the highest contribution, as well as the degree to which the contribution of that error factor is higher than the contributions of other error factors.

[0059] The factor estimation unit 124 may output factor information indicating which of the multiple types of feature quantities has the highest contribution. If the user knows which error factor each of the multiple types of feature quantities corresponds to, the error factor can also be indicated by indicating which of the multiple types of feature quantities has the highest contribution.

[0060] The factor estimation unit 124 may output factor information indicating the contribution of each of a plurality of types of feature quantities. This factor information can indicate the feature quantity with the highest contribution, as well as how high the contribution of that feature quantity is compared to the contributions of other feature quantities.

[0061] When the feature amount having the highest contribution is a complex feature amount, the factor estimation unit 124 may output factor information based on a plurality of types of error factors associated with the complex feature amount and the state of the coating unit U1. The state of the coating unit U1 here is the state of the coating unit U1 corresponding to the complex feature amount. Corresponding means corresponding to the same substrate W. The state of the coating unit U1 corresponding to the complex feature amount means the state of the coating unit U1 in the middle of performing a process of removing pre-bake resist liquid from the substrate W for which the complex feature amount is to be calculated.

[0062] For example, when the feature with the highest contribution is a composite feature, the factor estimation unit 124 may evaluate the correlation level between each of the multiple types of error factors and the composite feature based on the records accumulated in the data accumulation unit 119, and output factor information based on the evaluation result of the correlation level.

[0063] The factor estimation unit 124 may evaluate the correlation level between each of the multiple types of error factors and the complex feature, based on a series of a predetermined number of records including the latest record among the records stored in the data storage unit 119. For example, the factor estimation unit 124 outputs factor information indicating an error factor having a relatively high correlation level with respect to the complex feature.

[0064] As an example, when the feature quantity with the highest contribution is the width evaluation value, the factor estimation unit 124 evaluates the correlation level between the position of the nozzle 41 and the width evaluation value (hereinafter referred to as the "first correlation level") and the correlation level between the amount of removal liquid discharged from the nozzle 41 and the evaluation value (hereinafter referred to as the "second correlation level") based on the series of the predetermined number of records. For example, the first correlation level represents the correlation level between the positional deviation of the nozzle 41 and the width evaluation value. For example, the second correlation level represents the correlation level between the change in the amount of removal liquid discharged from the nozzle 41 and the width evaluation value.

[0065] When the first correlation level is higher than the second correlation level, the factor estimation unit 124 outputs factor information indicating that the most likely error factor is a positional shift of the nozzle 41. When the second correlation level is higher than the first correlation level, the factor estimation unit 124 outputs factor information indicating that the most likely error factor is a change in the discharge amount of the removal liquid from the nozzle 41.

[0066] When the feature quantity with the highest contribution is the roughness evaluation value, the factor estimation unit 124 evaluates the correlation level (hereinafter referred to as the "third correlation level") between the fluctuation range of the ejection amount of the removal liquid from the nozzle 41 and the roughness evaluation value based on the predetermined number of series of records. When the third correlation level exceeds a predetermined level, the factor estimation unit 124 outputs factor information indicating the fluctuation in the ejection amount of the removal liquid as the most likely error factor. When the third correlation level is less than the predetermined level, the factor estimation unit 124 outputs factor information indicating the splashing of the removal liquid as the most likely error factor.

[0067] The factor estimation unit 124 may output factor information when the evaluation result of the removal width by the evaluation unit 121 is outside a predetermined range, and may omit output of factor information when the evaluation result of the removal width by the evaluation unit 121 is within the above-mentioned predetermined range. For example, the factor estimation unit 124 may output factor information when the maximum value of the removal width exceeds the upper limit of the predetermined range or the minimum value of the removal width is below the lower limit of the predetermined range, and may omit output of factor information when both the maximum and minimum values ​​of the removal width are within the predetermined range.

[0068] Correspondingly, the contribution evaluation unit 122 may calculate the contribution degree when the evaluation result of the removal width by the evaluation unit 121 is outside a predetermined range, and may omit the calculation of the contribution degree when the evaluation result of the removal width by the evaluation unit 121 is within the above-mentioned predetermined range. For example, the contribution evaluation unit 122 may calculate the contribution degree when the maximum value of the removal width exceeds the upper limit of the predetermined range or the minimum value of the removal width is below the lower limit of the predetermined range, and may omit the calculation of the contribution degree when both the maximum value and the minimum value of the removal width are within the predetermined range.

[0069] The control unit 100 may further include a parameter adjustment unit 125. The parameter adjustment unit 125 adjusts at least one control parameter in the operation program stored in the program storage unit 114 based on the cause information. For example, the parameter adjustment unit 125 changes the at least one control parameter so as to reduce an error cause indicated by the cause information.

[0070] As an example, when a positional deviation of the nozzle 41 is indicated as the most likely error cause, the parameter adjustment unit 125 changes the position of the nozzle 41 when discharging the removing liquid. When a change in the amount of the removing liquid discharged from the nozzle 41 is indicated as the most likely error cause, the parameter adjustment unit 125 changes the amount of the removing liquid discharged from the nozzle 41. When a positional deviation of the substrate W in the spin holder 20 is indicated as the most likely error cause, the parameter adjustment unit 125 changes the position of the substrate W placed in the coating unit U1 by the transport arm A3.

[0071] FIG. 5 is a block diagram illustrating a hardware configuration of the control unit 100. The control unit 100 is configured by one or more control computers. As shown in FIG. 5, the control unit 100 has a circuit 190. The circuit 190 includes at least one processor 191, a memory 192, a storage 193, an input / output port 194, an input device 195, and a display device 196. The storage 193 has a computer-readable storage medium such as a hard disk. The storage 193 stores a program for causing the control unit 100 to perform the following operations: causing the coating unit U1 to remove the peripheral portion of the resist film formed on the front surface Wa of the substrate W; acquiring from the inspection unit U3 a removal width profile that indicates the relationship between the position in the circumferential direction of the substrate W and the removal width; and outputting factor information that indicates the cause of the removal width error based on the removal width profile. For example, the storage 193 stores a program for causing the control unit 100 to configure each of the above-mentioned functional blocks.

[0072] The memory 192 temporarily stores the program loaded from the storage medium of the storage 193 and the calculation result by the processor 191. The processor 191 configures each of the above-mentioned functional modules by executing the above-mentioned program in cooperation with the memory 192. The input / output port 194 inputs and outputs electrical signals between the transport arm A3, the coating unit U1, and the inspection unit U3 in response to a command from the processor 191. The input device 195 and the display device 196 function as a user interface of the control unit 100. The input device 195 is, for example, a keyboard, and acquires information input by a user. The display device 196 includes, for example, a liquid crystal monitor, and is used to display information to a user. The display device 196 is used, for example, to display the above-mentioned factor information. The input device 195 and the display device 196 may be integrated as a so-called touch panel.

[0073] [Control Procedure] Hereinafter, as an example of a substrate processing method, a control procedure of the coating and developing apparatus 2 by the control unit 100 will be illustrated. The overall procedure is as described in the section "Substrate Processing Apparatus." In addition to the overall procedure described above, the control procedure of the coating and developing apparatus 2 by the control unit 100 includes a film formation control procedure, a removal profile acquisition procedure, and a factor information output procedure.

[0074] The film formation control procedure is a control procedure in which the control unit 100 causes the coating unit U1 to form a pre-baked resist film and remove a peripheral portion of the pre-baked resist film. The removal profile acquisition procedure is a procedure in which the control unit 100 acquires a removal profile by causing the inspection unit U3 to measure the removal width at least two or more points in the circumferential direction of the substrate W. The factor information output procedure is a procedure in which the control unit 100 outputs factor information indicating the cause of the removal width error based on the removal profile. Below, the film formation control procedure, the removal profile acquisition procedure, and the factor information output procedure are each illustrated in detail.

[0075] (Film formation control procedure) As shown in Fig. 6, the control unit 100 executes steps S01, S02, S03, S04, S05, S06, and S07 in order. In step S01, based on the operation program stored in the program storage unit 114, the transport control unit 111 controls the transport arm A3 to place the substrate W in the coating unit U1. At this time, the apparatus state acquisition unit 117 acquires information on the placement position of the substrate W by the transport arm A3. In step S02, the film formation control unit 112 causes the holder 21 to hold the substrate W placed in the coating unit U1 by the transport arm A3. In step S03, the film formation control unit 112 causes the rotation drive unit 22 to start rotating the holder 21 and the substrate W.

[0076] In step S04, based on the operation program stored in the program storage unit 114, the film formation control unit 112 controls the coating unit U1 to form a pre-baked resist film on the front surface Wa of the substrate W. For example, the film formation control unit 112 controls the nozzle movement unit 34 to position the nozzle 31 on the rotation center CL of the substrate W, and controls the liquid delivery unit 33 to eject the treatment liquid from the nozzle 31 for a predetermined period. As a result, a liquid film of the treatment liquid is formed on the front surface Wa. Thereafter, the film formation control unit 112 controls the liquid delivery unit 33 to stop ejecting the treatment liquid from the nozzle 31, and causes the nozzle movement unit 34 to retract the nozzle 31 from above the substrate W. After the ejection of the treatment liquid stops, the film formation control unit 112 controls the rotation drive unit 22 to continue rotating the substrate W for a predetermined period. As a result, the liquid film is dried and a pre-baked resist film is formed.

[0077] In step S05, the edge removal control unit 113 controls the coating unit U1 to remove the edge portion of the pre-baked resist film based on the operation program stored in the program storage unit 114. For example, the edge removal control unit 113 controls the nozzle movement unit 44 to position the nozzle 41 on the edge portion of the substrate W, and controls the liquid delivery unit 43 to continue discharging the removal liquid from the nozzle 41 for a predetermined period of time. This removes the edge portion of the pre-baked resist film.

[0078] When the pre-baked resist film is removed, the apparatus status acquisition unit 117 acquires information on the arrangement position of the nozzle 41 by the nozzle movement unit 44 and the amount of removal liquid discharged from the nozzle 41 (for example, a value detected by the flow rate sensor 45). Thereafter, the edge removal control unit 113 controls the liquid delivery unit 43 to stop discharging the removal liquid from the nozzle 41, and causes the nozzle movement unit 44 to retract the nozzle 41 from above the substrate W.

[0079] In step S06, the edge removal control unit 113 stops the rotation of the holder 21 and the substrate W by the rotation drive unit 22. In step S07, the edge removal control unit 113 causes the holder 21 to release the substrate W, and the transport control unit 111 controls the transport arm A3 to transport the substrate W out of the coating unit U1. This completes the film formation control procedure.

[0080] (Procedure for obtaining removal profile) 7, the control unit 100 first executes steps S11, S12, S13, S14, S15, S16, and S17. In step S11, based on the operation program stored in the program storage unit 114, the transport control unit 111 controls the transport arm A3 to place the substrate W in the inspection unit U3. In step S12, the profile acquisition unit 115 causes the holder 51 to hold the substrate W placed in the inspection unit U3 by the transport arm A3. In step S13, the profile acquisition unit 115 causes the rotation drive unit 52 to start rotating the holder 51 and the substrate W.

[0081] In step S14, the profile acquisition unit 115 waits for detection of a position index (e.g., a notch) by the position index detection unit 53. In step S15, the profile acquisition unit 115 waits for the rotation angle after notch detection to reach a predetermined measurement angle. In step S16, the profile acquisition unit 115 causes the imaging unit 57 to capture an image of the peripheral portion of the substrate W, calculates a removal width based on the captured image, and stores the calculated removal width in association with the current measurement angle. In step S17, the profile acquisition unit 115 checks whether acquisition of the removal width over the entire circumference of the substrate W has been completed. For example, the profile acquisition unit 115 checks whether acquisition of the removal width has been completed for all predetermined measurement points along the peripheral portion of the substrate W.

[0082] When it is determined in step S17 that a portion for which acquisition of the removal width has not been completed remains on the peripheral portion of the substrate W, the control unit 100 returns the process to step S15. Thereafter, acquisition of the removal width corresponding to the predetermined measurement angle is repeated until acquisition of the removal width is completed over the entire circumference.

[0083] If it is determined in step S17 that acquisition of the removal width over the entire circumference of the substrate W has been completed, the control unit 100 executes steps S18 and S19. In step S18, the profile acquisition unit 115 causes the rotation drive unit 52 to stop the rotation of the holder 51 and the substrate W. In step S19, the profile acquisition unit 115 causes the holder 51 to release the substrate W, and the transport control unit 111 controls the transport arm A3 to transport the substrate W out of the inspection unit U3. This completes the removal profile acquisition procedure.

[0084] (Procedure for outputting cause information) As shown in Fig. 8, the control unit 100 first executes steps S21, S22, S23, S24, and S25. In step S21, the feature amount calculation unit 116 waits for the profile acquisition unit 115 to complete acquisition of the removal profile. In step S22, the feature amount calculation unit 116 calculates the above-mentioned multiple types of feature amounts based on the removal width profile. In step S23, the record generation unit 118 generates a record including the calculation results of the feature amounts and the status of the coating unit U1 corresponding to the feature amounts, and accumulates the record in the data accumulation unit 119. The record generation unit 118 acquires information indicating the status of the coating unit U1 corresponding to the feature amounts from the apparatus status acquisition unit 117.

[0085] In step S24, the evaluation unit 121 evaluates the removal width based on the removal width profile. For example, the evaluation unit 121 evaluates the maximum and minimum values ​​of the removal width in the removal width profile. In step S25, the contribution evaluation unit 122 checks whether the evaluation result of the removal width by the evaluation unit 121 is outside a predetermined range. For example, the contribution evaluation unit 122 determines that the evaluation result of the removal width is outside the predetermined range when the maximum value of the removal width exceeds the upper limit of the predetermined range, and also determines that the evaluation result of the removal width is outside the predetermined range when the minimum value of the removal width is below the lower limit of the predetermined range.

[0086] If it is determined in step S25 that the evaluation result of the removal width is outside the predetermined range, the control unit 100 executes steps S26, S27, and S28. In step S26, the contribution evaluation unit 122 evaluates the contribution of multiple types of feature amounts to the error based on the calculation results of the multiple types of feature amounts. In step S27, the factor estimation unit 124 derives an error factor associated with the feature amount with the highest contribution based on the factor candidate storage unit 123. In step S28, the factor estimation unit 124 checks whether the feature amount with the highest contribution is the composite feature amount.

[0087] If it is determined in step S28 that the feature with the highest contribution is a complex feature, the control unit 100 executes steps S31, S32, and S33. In step S31, when the feature with the highest contribution is a complex feature, the factor estimation unit 124 evaluates the correlation level between each of the multiple types of error factors and the complex feature based on the records stored in the data storage unit 119. In step S32, the factor estimation unit 124 selects an error factor with the highest correlation level with the complex feature from among the multiple error factors associated with the complex feature. In step S33, the factor estimation unit 124 outputs factor information indicating the error factor selected in step S32.

[0088] If it is determined in step S28 that the feature with the highest contribution is not a composite feature, the control unit 100 executes step S33 without executing steps S31 and S32. In this case, the factor estimation unit 124 outputs factor information indicating the error factor derived in step S27.

[0089] Next, the control unit 100 executes step S34. In step S34, the parameter adjustment unit 125 adjusts at least one control parameter in the operation program stored in the program storage unit 114 based on the cause information.

[0090] If it is determined in step S25 that the evaluation result of the removal width is within the predetermined range, the contribution evaluation unit 122 omits calculation of the contribution, the factor estimation unit 124 omits output of the factor information, and the parameter adjustment unit 125 omits adjustment of the control parameters. This completes the procedure for outputting factor information.

[0091] [Effects of this embodiment] As described above, the coating and developing apparatus 2 (substrate processing apparatus) includes a coating unit U1 (edge ​​removal section) that removes the peripheral portion of the coating formed on the surface Wa of the substrate W, a profile acquisition section 115 that acquires a removal width profile that indicates the relationship between the circumferential position of the substrate W and the width of the portion of the substrate W from which the coating has been removed, and a factor estimation section 124 that outputs factor information that indicates the cause of the width error based on the removal width profile.

[0092] Errors in the removal width can occur due to various factors, but based only on the error evaluation results, it takes time to identify which factor caused the error. In contrast, a removal width profile that indicates the relationship between the circumferential position of the substrate W and the removal width tends to show different characteristics depending on the error factor. For this reason, accurate factor information can be output based on the removal width profile. Based on accurate factor information, it becomes possible to quickly identify and adjust the error factor. Therefore, the coating and developing apparatus 2 is effective in speeding up the adjustment of the removal width.

[0093] The coating and developing apparatus 2 further includes an evaluation unit 121 that evaluates the width based on the removal width profile, and the factor estimation unit 124 may output factor information when the evaluation result of the width is outside a predetermined range. In this case, the information processing load in the coating and developing apparatus 2 can be reduced by performing output processing of the factor information only when the evaluation result of the error exceeds a predetermined level.

[0094] The coating and developing apparatus 2 may further include a feature amount calculation unit 116 that calculates a plurality of types of feature amounts associated with at least one error factor based on the removal width profile, and the factor estimation unit 124 may output factor information based on the calculation results of the plurality of types of feature amounts. In this case, the factor information can be output more easily.

[0095] The plurality of types of feature amounts may include an evaluation value of the width, an evaluation value of the eccentricity of the edge of the coating relative to the edge of the substrate, an evaluation value of the roundness of the edge of the coating, and an evaluation value of the roughness of the edge of the coating, which makes it possible to output more useful factor information.

[0096] The coating unit U1 has a spin holder 20 that holds and rotates the substrate W, and a nozzle 41 that discharges a removing liquid for removing a coating toward the peripheral portion of the substrate W held and rotated by the spin holder 20, and the evaluation value of the width may be associated with at least a positional deviation of the nozzle 41 and a change in the amount of removing liquid discharged from the nozzle 41, the evaluation value of the eccentricity may be associated with at least a positional deviation of the substrate W on the spin holder 20, the evaluation value of the roundness may be associated with at least a distortion of the substrate W and a distortion of the spin holder 20, and the evaluation value of the roughness may be associated with at least a splash of the removing liquid and a change in the amount of removing liquid discharged from the nozzle 41. In this case, more useful cause information can be output.

[0097] The coating / developing apparatus 2 may further include a contribution evaluation unit 122 that evaluates the contribution of the multiple types of feature amounts to the error based on the calculation results of the multiple types of feature amounts, and the factor estimation unit 124 may output factor information based on the contribution of the multiple types of feature amounts to the error. In this case, more accurate factor information can be easily output.

[0098] The factor estimation unit 124 may output factor information based on at least one error factor associated with the feature quantity having the highest contribution among the multiple types of error factors. In this case, it is possible to output more easily understandable factor information.

[0099] The multiple types of feature amounts include a composite feature amount associated with multiple types of error factors, and when the feature amount with the highest contribution is a composite feature amount, the factor estimation unit 124 may output factor information based on the multiple types of error factors associated with the composite feature amount and the state of the application unit U1. In this case, more accurate factor information can be output.

[0100] Although the embodiments have been described above, the present disclosure is not necessarily limited to the above-described embodiments, and various modifications are possible without departing from the gist of the present disclosure. [Explanation of symbols]

[0101] 2...coating / developing apparatus (substrate processing apparatus), 20...rotational holding section, 31, 41...nozzle, 115...profile acquisition section, 116...feature amount calculation section, 121...evaluation section, 122...contribution evaluation section, 124...factor estimation section, U1...coating unit (edge ​​removal section), W...substrate, Wa...surface.

Claims

1. A profile acquisition unit that acquires a removal width profile that represents the relationship between a circumferential position of a substrate on whose surface a coating has been formed and a peripheral portion of the coating has been removed by an edge removal unit, and a width of a portion of the substrate from which the coating has been removed; a feature amount calculation unit that calculates a plurality of types of feature amounts associated with at least one cause of the width error based on the removal width profile; a contribution evaluation unit that evaluates contributions of the plurality of types of feature amounts to the error based on the calculation results of the plurality of types of feature amounts; a factor estimating unit that outputs factor information indicating a factor of the error based on a contribution degree of the plurality of types of feature amounts to the error.

2. The factor estimating device according to claim 1 , wherein the factor estimating unit outputs the factor information based on at least one of a plurality of types of error factors that is associated with at least a feature quantity having a highest degree of contribution.

3. the plurality of types of feature amounts include composite feature amounts associated with the plurality of types of error factors, 2. The factor estimating device according to claim 1, wherein, when the feature having the highest contribution is the complex feature, the factor estimating unit outputs the factor information based on a state of the edge removal unit and a plurality of types of error factors associated with the complex feature.

4. The factor estimation device as described in claim 1, wherein the factor estimation unit outputs the contribution degree of each of the multiple types of features as the factor information.

5. The factor estimation device as described in claim 1, wherein an output of the factor estimation unit includes displaying the factor information on a display device.

6. A factor estimation device as described in claim 5, wherein the multiple types of features include at least two of an evaluation value of eccentricity of the coating edge relative to the substrate edge, an evaluation value of the circularity of the coating edge, and an evaluation value of roughness of the coating edge.

7. The peripheral edge removal portion is a rotation holder that holds and rotates the substrate; a nozzle that ejects a removal liquid for removing the coating toward a peripheral portion of the substrate held and rotated by the rotation holding unit; having the evaluation value of the eccentricity is associated with at least a positional deviation of the substrate on the spin holder; the evaluation value of the roundness is associated with at least one of a distortion of the substrate and a distortion of the spin holder, 7. The cause estimating device according to claim 6, wherein the roughness evaluation value is associated with at least one of splashing of the removing liquid and fluctuation in the amount of the removing liquid discharged from the nozzle.

8. Obtaining a removal width profile that represents a relationship between a circumferential position of a substrate having a coating formed on its surface at which a peripheral portion of the coating has been removed by a peripheral removal section, and a width of a portion of the substrate from which the coating has been removed; calculating a plurality of types of feature amounts associated with at least one cause of the width error based on the removal width profile; evaluating contributions of the plurality of types of feature amounts to the error based on the calculation results of the plurality of types of feature amounts; and outputting factor information indicating a factor of the error based on contributions of the plurality of types of feature amounts to the error.

9. The factor estimation method described in claim 8, wherein the factor information is output based on at least one of the multiple types of error factors that is associated with at least the feature with the highest contribution.

10. The multiple types of features include composite features corresponding to multiple types of causes of the error, 9. The factor estimating method according to claim 8, further comprising the steps of: when the feature amount having the highest contribution is the complex feature amount, outputting the factor information based on a plurality of types of error factors associated with the complex feature amount and a state of the edge removal unit.

11. The factor estimation method described in claim 8, wherein the factor information is output as a contribution degree for each of the multiple types of features.

12. The factor estimation method according to claim 8, wherein outputting the factor information includes displaying the factor information on a display device.

13. The factor estimation method described in claim 12, wherein the multiple types of features include at least two of an evaluation value of eccentricity of the coating edge relative to the substrate edge, an evaluation value of the circularity of the coating edge, and an evaluation value of roughness of the coating edge.

14. The peripheral edge removal portion is a rotation holder that holds and rotates the substrate; a nozzle that ejects a removal liquid for removing the coating toward a peripheral portion of the substrate held and rotated by the rotation holding unit; having the evaluation value of the eccentricity is associated with at least a positional deviation of the substrate on the spin holder; the evaluation value of the roundness is associated with at least one of a distortion of the substrate and a distortion of the spin holder, 14. The cause estimating method according to claim 13, wherein the roughness evaluation value is associated with at least one of splashing of the removal liquid and fluctuation in the amount of the removal liquid discharged from the nozzle.

15. A computer-readable storage medium storing a program for causing an apparatus to execute the factor estimating method according to any one of claims 8 to 14.

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