Optical device and method for manufacturing the same

Abstract

An optical device according to the present invention is provided with, for example: a case (10); a sleeve (21) which is attached to the case (10), is provided with a first through-hole (21a) that passes between the inside and outside of the case, and has an inclined surface (21c) that is inclined relative to the through direction of the first through-hole and in which the first through-hole is open; a first optical fiber (30) which has a core line (31) including a core and cladding, and a covering (32) that surrounds the core line, and in which an exposed section (30b) of the core line that is not surrounded by the covering passes through the first through-hole; and a first joining material (51), in the first through-hole, which is interposed between and thus seals the outer peripheral surface of the exposed section and the inner peripheral surface of the first through-hole .

Description

[Technical field]

[0001] The present invention relates to an optical device and a method for manufacturing an optical device. [Background technology]

[0002] 2. Description of the Related Art Conventionally, optical devices have been known in which an optical fiber is joined to a case with a joining material such as solder at a portion where the optical fiber passes through the case (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2003-255148 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, in this type of optical device, when the through hole opens into a plane perpendicular to the direction in which the optical fiber extends, depending on the specifications of the through hole and the bonding material, it may be difficult for the bonding material in a fluid state to enter the through hole through the opening.

[0005] Therefore, one object of the present invention is to provide an optical device and a method for manufacturing an optical device in which, for example, a bonding material in a fluid state can more easily enter a through hole through which an optical fiber passes. [Means for solving the problem]

[0006] The optical device of the present invention includes, for example, a case, a sleeve attached to the case, having a first through hole penetrating between the inside and outside of the case, and having an inclined surface inclined with respect to the penetrating direction of the first through hole and through which the first through hole opens, a first optical fiber having a core wire including a core and a cladding and a coating surrounding the core wire, with an exposed portion of the core wire not surrounded by the coating passing through the first through hole, and a first bonding material interposed between the outer surface of the exposed portion and the inner surface of the first through hole within the first through hole to provide a seal.

[0007] In the optical device, for example, the sleeve has a support portion that supports the first optical fiber.

[0008] The optical device further includes, for example, a second bonding material that bonds the support portion and an outer portion of the first optical fiber that is located outside the first through hole.

[0009] In the optical device, for example, the first bonding material and the second bonding material are adjacent to each other or are integrated with each other.

[0010] In the optical device, for example, the support portion is provided with a groove that at least partially accommodates the first optical fiber.

[0011] In the optical device, for example, the groove is curved and the first optical fiber is bent along the groove.

[0012] In the optical device, for example, the support portion is provided with a second through hole through which the first optical fiber passes.

[0013] In the optical device, for example, the inclined surface extends on a side opposite to the support portion with respect to an opening end of the first through hole.

[0014] In the optical device, for example, the support portion is provided inside the case.

[0015] In the optical device, for example, the support portion is provided outside the case.

[0016] In the optical device, for example, the sleeve has a connector portion that constitutes a connector that connects the first optical fiber to a second optical fiber that is different from the first optical fiber.

[0017] The optical device may further include a support member that is housed in the case and supports the first optical fiber at a position spaced apart from the sleeve.

[0018] In the optical device, for example, the first bonding material is solder.

[0019] In the optical device, for example, the first bonding material is solder, and the second bonding material is a bonding material made of a different material from the solder.

[0020] In the optical device, for example, the first bonding material and the second bonding material are solder.

[0021] The optical apparatus may include, for example, an optical device that is housed in the case and outputs light input to the first optical fiber or receives light output from the first optical fiber.

[0022] A manufacturing method for an optical device of the present invention is, for example, a manufacturing method for an optical device including a case, a sleeve attached to the case, having a first through hole penetrating between the inside and outside of the case, and having an inclined surface inclined with respect to the penetrating direction of the first through hole and through which the first through hole opens, a first optical fiber having a core wire including a core and a cladding and a coating surrounding the core wire, wherein an exposed portion of the core wire not surrounded by the coating passes through the first through hole, and a first bonding material interposed between the outer peripheral surface of the exposed portion and the inner peripheral surface of the first through hole to provide a seal, and includes a first step of injecting the first bonding material in a fluid state between the outer peripheral surface of the exposed portion and the inner peripheral surface of the first through hole, and a second step of solidifying the first bonding material.

[0023] In the method for manufacturing the optical device, for example, the first bonding material is solder, and an ultrasonic soldering apparatus is used in the first step.

[0024] In the method for manufacturing the optical device, for example, in the first step, ultrasonic vibration is transmitted from the ultrasonic soldering apparatus to the sleeve. Effect of the Invention

[0025] According to the present invention, since the first through hole in the sleeve opens on an inclined surface inclined with respect to the penetration direction of the first through hole, the opening area of ​​the first through hole can be made larger, and therefore the bonding material in a flowable state can more easily enter the first through hole from the opening provided on the inclined surface. [Brief description of the drawings]

[0026] [Figure 1] FIG. 1 is an illustrative and schematic cross-sectional view (partial side view) of an optical device according to a first embodiment. [Diagram 2] FIG. 2 is an exemplary schematic perspective view of the sleeve of the first embodiment. [Diagram 3] FIG. 3 is an illustrative schematic cross-sectional view showing a state in which an optical fiber is soldered onto a sleeve by an ultrasonic soldering apparatus in the manufacturing method of the optical device according to the first embodiment. [Figure 4] FIG. 4 is a cross-sectional view (partially a side view) of a sleeve and an optical fiber of the first modified example. [Diagram 5] FIG. 5 is a cross-sectional view (partially a side view) of a sleeve and an optical fiber according to the second embodiment. [Figure 6] FIG. 6 is an illustrative schematic cross-sectional view showing a state in which an optical fiber is soldered onto a sleeve by an ultrasonic soldering device in the manufacturing method of the optical device according to the second embodiment. [Figure 7] FIG. 7 is a cross-sectional view (partially a side view) of a sleeve and an optical fiber according to the third embodiment. [Figure 8] FIG. 8 is an illustrative schematic cross-sectional view showing a state in which an optical fiber is soldered onto a sleeve by an ultrasonic soldering device in the manufacturing method of the optical device according to the third embodiment. [Figure 9] FIG. 9 is a cross-sectional view (partially a side view) of a sleeve and an optical fiber of the second modified example. [Figure 10] FIG. 10 is an illustrative schematic cross-sectional view (partial side view) of the optical device according to the fourth embodiment. [Figure 11] FIG. 11 is an illustrative schematic cross-sectional view (partial plan view) of an optical device according to a third modified example. [Figure 12] FIG. 12 is an illustrative schematic cross-sectional view (partial side view) of an optical device according to a fourth modified example. [Figure 13] FIG. 13 is an illustrative schematic cross-sectional view (partial side view) of the optical device according to the fifth embodiment. [Figure 14] FIG. 14 is an illustrative schematic plan view of the inside of the optical device according to the sixth embodiment. [Figure 15] FIG. 15 is an exemplary schematic side view of the inside of the optical device according to the sixth embodiment. [Figure 16] FIG. 16 is an illustrative schematic perspective view of a sleeve of the fifth modified example. [Figure 17] FIG. 17 is an illustrative schematic perspective view of a sleeve of a sixth modified example. [Figure 18] FIG. 18 is an illustrative schematic perspective view of an optical device according to the seventh modified example. [Figure 19] FIG. 19 is an illustrative schematic perspective view of an optical device according to an eighth modified example. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0027] Exemplary embodiments and modifications of the present invention are disclosed below. The configurations of the embodiments and modifications shown below, as well as the actions and results (effects) brought about by the configurations, are merely examples. The present invention can be realized by configurations other than those disclosed in the following embodiments and modifications. Furthermore, according to the present invention, it is possible to obtain at least one of the various effects (including derivative effects) obtained by the configurations.

[0028] The embodiments and modifications shown below have similar configurations. Therefore, according to the configurations of the embodiments and modifications, similar actions and effects based on the similar configurations can be obtained. In the following, the similar configurations are given the same reference numerals, and duplicated descriptions may be omitted.

[0029] In this specification, ordinal numbers are given for the sake of convenience to distinguish between parts, portions, etc., and do not indicate a priority order or sequence.

[0030] In each drawing, the X direction is represented by an arrow X, the Y direction is represented by an arrow Y, and the Z direction is represented by an arrow Z. The X direction, Y direction, and Z direction intersect with each other and are perpendicular to each other.

[0031] [First embodiment] 1 is a cross-sectional view (partial side view) of an optical device 1A according to a first embodiment taken along a cross section perpendicular to the Y direction. The optical device 1A includes a case 10, a sleeve 20A, an optical fiber 30, a light source unit 41, and a lens .

[0032] The optical fiber 30 is attached to the case 10 in a state where it penetrates the sleeve 20A. The end 30a of the optical fiber 30 is located inside the case 10. The light source unit 41 and the lens 42 are housed inside the case 10. The light emitted from the light source unit 41 is input to the end 30a of the optical fiber 30 via the lens 42. That is, the light source unit 41 outputs the light input to the optical fiber 30. The optical fiber 30 is an example of a first optical fiber, and the light source unit 41 is an example of an optical device. The end 30a may also be referred to as an input section.

[0033] The case 10 has walls including a bottom wall 11, a side wall 12, and a top wall (not shown). The case 10 has, for example, a rectangular parallelepiped box shape.

[0034] The bottom wall 11 is made of, for example, copper tungsten (CuW), copper molybdenum (CuMo), aluminum oxide (Al 2 O 3 The side wall 12 and the top wall can be made of a material having high thermal conductivity, such as Fe-Ni-Co alloy, aluminum oxide (Al 2 O 3 The substrate may be made of a material with a low coefficient of thermal expansion, such as tungsten carbide.

[0035] The case 10 is hermetically sealed, which prevents air and water from acting on optical components housed in the case 10, such as the light source unit 41, the lens 42, and the optical fiber 30. The optical device 1A is configured so that an inert gas, such as nitrogen gas, filled in the case 10 during manufacture does not leak out of the case 10.

[0036] The bottom wall 11 extends in a direction intersecting with the Z direction. In this embodiment, the bottom wall 11 extends in the X direction and the Y direction and is perpendicular to the Z direction. In the accommodation chamber R of the case 10, a light source unit 41 and a lens 42 are attached on the bottom wall 11. The bottom wall 11 may also be referred to as a support portion or a base.

[0037] The sidewall 12 shown in Fig. 1 extends in a direction intersecting with the X direction. In this embodiment, the sidewall 12 extends in the Y direction and the Z direction and is perpendicular to the X direction. Although not shown in Fig. 1, the case 10 also has a sidewall 12 that extends in a direction intersecting with the Y direction (see Figs. 14 and 15). In this embodiment, the sidewall 12 that extends in a direction intersecting with the Y direction extends in the X direction and the Z direction and is perpendicular to the Y direction.

[0038] An opening 12a is provided in the side wall 12. The opening 12a is, for example, a through hole, but may also be a notch or the like whose open end is covered by, for example, the top wall, the bottom wall 11, another member (not shown), or the like.

[0039] The sleeve 20A is attached to the side wall 12 in a state in which it covers or blocks the opening 12a. In the present embodiment, as an example, the sleeve 20A penetrates the opening 12a in the X direction and blocks the opening 12a. The opening 12a is a circular hole, and the portion of the sleeve 20A that penetrates the opening 12a has an outer circumferential surface that is cylindrical.

[0040] The gap between the outer peripheral surface of the sleeve 20A and the periphery of the opening 12a is sealed. The sleeve 20A is joined to the side wall 12 in a manner capable of sealing the gap, such as by soldering, brazing, or welding.

[0041] The sleeve 20A is made of, for example, an Fe-Ni-Co alloy or aluminum oxide (Al 2 O 3 The substrate may be made of a material with a low coefficient of thermal expansion, such as tungsten carbide.

[0042] 2 is a perspective view of the sleeve 20A. As shown in FIGS. 1 and 2, the sleeve 20A has a cylindrical portion 21 and a semi-cylindrical portion 22. The outer circumferential surfaces of the cylindrical portion 21 and the semi-cylindrical portion 22 are concentric cylindrical surfaces and extend in the X direction. The semi-cylindrical portion 22 is adjacent to the cylindrical portion 21 in the opposite direction of the X direction. In other words, the semi-cylindrical portion 22 protrudes in the opposite direction of the X direction from the end of the cylindrical portion 21 in the opposite direction of the X direction and the opposite direction of the Z direction. The cylindrical portion 21 may also be referred to as a body or a sleeve base, and the semi-cylindrical portion 22 may also be referred to as a protruding portion.

[0043] The semi-cylinder portion 22 has a top surface 22a that intersects with the Z direction. The top surface 22a is, for example, a flat surface facing the Z direction, extends in the X direction and the Y direction, and is perpendicular to the Z direction.

[0044] The end face 21c of the cylindrical portion 21 on the opposite side to the X direction is inclined with respect to the X direction and the Z direction. In other words, the end face 21c is not perpendicular to and not parallel to the X direction and the Z direction. In the present embodiment, as an example, the end face 21c is a cylindrical inner concave curved surface having a generatrix along the Y direction, and is recessed toward the M1 direction between the X direction and the opposite direction to the Z direction. The top surface 22a and the end face 21c are smoothly connected without any steps. The end face 21c is an example of an inclined surface.

[0045] A through hole 21a extending in the X direction is provided in the cylindrical portion 21. As shown in Fig. 1, the optical fiber 30 passes through the through hole 21a in the X direction.

[0046] An opening end 21b2 in the X direction of through hole 21a is located inside case 10. On the other hand, through hole 21a opens to end face 21c at opening end 21b1 in the opposite direction to the X direction. End face 21c is exposed to the outside of case 10. That is, opening end 21b1 is located outside case 10. That is, through hole 21a penetrates between the inside and outside of case 10. Through hole 21a is an example of a first through hole, and the X direction is an example of a penetration direction.

[0047] Furthermore, top surface 22a of semi-cylinder portion 22 and bottom portion 21a2, which is the end portion of through-hole 21a in the opposite direction in the Z direction, are smoothly connected together without any steps along the X direction.

[0048] The optical fiber 30 has a core 31 and a coating 32 surrounding the core 31. The core 31 has a core (not shown) and a cladding (not shown) surrounding the core. The optical fiber 30 is an example of a first optical fiber.

[0049] The core wire 31 may be made of, for example, glass, and the covering 32 may be made of, for example, a synthetic resin material. Note that the covering 32 may be partially coated with a highly heat-resistant coating.

[0050] At the end 30a in the X direction of the optical fiber 30 and its vicinity, the coating 32 is removed to expose the core wire 31. The optical fiber 30 has an exposed portion 30b where the core wire 31 is exposed without being surrounded by the coating 32, and a coated portion 30c where the core wire 31 is surrounded by the coating 32.

[0051] The exposed portion 30b passes through the through hole 21a of the cylindrical portion 21. In the through hole 21a, a bonding material 50 is interposed between the outer peripheral surface 31a of the core wire 31 (exposed portion 30b) and the inner peripheral surface 21a1 of the through hole 21a. The bonding material 50 bonds the outer peripheral surface 31a and the inner peripheral surface 21a1, and further bonds the sleeve 20A and the optical fiber 30. The bonding material 50 is, for example, a solder, for example, a solder containing zinc. The portion of the bonding material 50 located in the through hole 21a is an example of a first bonding material 51. Note that in the optical fiber 30, the exposed portion 30b may be provided at a position that passes through at least the through hole 21a.

[0052] In addition, in through hole 21a, bonding material 50 seals the gap between outer peripheral surface 31a and inner peripheral surface 21a1, preventing the passage of gas and liquid through the gap. That is, bonding material 50 prevents leakage of the fill gas from inside case 10 to outside case 10 through the gap, and prevents air and liquid from entering case 10 from outside case 10 through the gap.

[0053] The bonding material 50 also extends from the open end 21b1 in the opposite direction to the X-direction, and is located on the top surface 22a. On the top surface 22a, the bonding material 50 surrounds the periphery of the core wire 31 (optical fiber 30) and bonds the outer circumferential surface 31a to the top surface 22a, and further bonds the sleeve 20A to the optical fiber 30. The portion of the bonding material 50 located on the top surface 22a is an example of a second bonding material 52.

[0054] On the top surface 22a, the exposed portion 30b is supported by the semi-cylinder portion 22 via the bonding material 50. In this embodiment, the covered portion 30c is also supported by the semi-cylinder portion 22. The semi-cylinder portion 22 is an example of a support portion. Also, the portion of the optical fiber 30 located outside the through hole 21a is an example of an outer portion 30d.

[0055] In this embodiment, as an example, the portion of the bonding material 50 located within the through hole 21a (first bonding material 51) and the portion located on the top surface 22a (second bonding material 52) are integrated, but they may be adjacent to each other without being integrated, or may be spaced apart from each other in the X direction.

[0056] 3 is a cross-sectional view perpendicular to the X-direction, showing a state in which exposed portion 30b is soldered onto top surface 22a by soldering iron 90A of an ultrasonic soldering device. Soldering iron 90A can heat the solder (joint material 50) that it comes into contact with. The solder is heated by soldering iron 90A and becomes fluid. In addition, soldering iron 90A can apply ultrasonic vibrations to the solder or the object to be joined that it comes into contact with.

[0057] The robot or worker places the solder (bonding material 50) on the top surface 22a in a fluid state and causes it to enter the gap between the outer peripheral surface 31a and the inner peripheral surface 21a1 (first step). In this first step, the robot or worker moves the solder and the soldering iron 90A in the direction opposite to the M1 direction or the Z direction in FIGS. 1 and 3 to approach the sleeve 20A and move in the X direction while in close proximity to or in contact with the top surface 22a. The solder is heated by the soldering iron 90A and becomes fluid. The fluid solder is placed on the top surface 22a. The fluid solder also enters the through hole 21a from the opening end 21b1 due to the surface tension of the solder, the adhesive force between the outer peripheral surface 31a and the inner peripheral surface 21a1, gravity, the pressing force from the soldering iron 90A, and the like, and fills the gap between the outer peripheral surface 31a and the inner peripheral surface 21a1.

[0058] Here, as shown in FIG. 1, the through hole 21a opens to the end face 21c. As described above, the end face 21c is inclined with respect to the X direction. Therefore, in this embodiment, the opening area of ​​the through hole 21a at the opening end 21b1 is larger than that of a configuration in which the through hole 21a extending in the X direction opens to a surface perpendicular to the X direction. Therefore, the solder (bonding material 50) having fluidity can easily enter the through hole 21a from the opening end 21b1. Also, in this embodiment, the part of the end face 21c where the opening end 21b1 is provided faces the M2 direction between the opposite direction of the X direction and the Z direction. Therefore, the solder that flows toward the M1 direction or the Z direction, which is the opposite direction to the M2 direction, due to the pressure of the soldering iron 90A or the weight of the solder, can easily enter the through hole 21a.

[0059] 3, the soldering iron 90A has, for example, a planar end surface 90a, and the soldering iron 90A has a groove 90b that opens at the end surface 90a. The end surface 90a and the groove 90b are formed in such a shape that when the end surface 90a is in contact with the top surface 22a, the fluid solder (second bonding material 52, bonding material 50) can surround the exposed portion 30b spaced apart from the top surface 22a in the Z direction and be interposed between the top surface 22a and the concave surface of the groove 90b. With this configuration, in the first step, the soldering iron 90A is heated while being ultrasonically vibrated, so that heat and ultrasonic vibration (vibration) are transmitted from the end surface 90a to the top surface 22a, i.e., the sleeve 20A. Therefore, the heat and ultrasonic vibration are transmitted directly from the soldering iron 90A to the solder, and indirectly via the sleeve 20A.

[0060] After the first step, the solder (bonding material 50) is cooled by natural cooling or forced cooling to solidify (second step). In the second step, the gap between the outer peripheral surface 31a and the inner peripheral surface 21a1 in the through hole 21a is filled and sealed with the bonding material 50, and the sleeve 20A and the optical fiber 30 are bonded together via the bonding material 50.

[0061] As described above, in the optical device 1A of this embodiment, the sleeve 20A attached to the case 10 is provided with a through hole 21a (first through hole) penetrating between the inside and outside of the case 10. The sleeve 20A has an end surface 21c (inclined surface) that is inclined with respect to the penetrating direction (X direction) of the through hole 21a and where the through hole 21a is opened. The optical fiber 30 (first optical fiber) has a core wire 31 including a core and a clad, and a coating 32 that surrounds the core wire 31. The exposed portion 30b of the core wire 31 that is not surrounded by the coating 32 passes through the through hole 21a. The bonding material 50 (first bonding material 51) is interposed between the outer peripheral surface 31a of the exposed portion 30b and the inner peripheral surface 21a1 of the through hole 21a in the through hole 21a to seal it.

[0062] According to this configuration, since the through hole 21a extending in the X direction is open to the end surface 21c inclined with respect to the X direction, the bonding material 50 having fluidity can easily enter the through hole 21a from the opening end 21b1. Therefore, according to this configuration, the bonding material 50 having fluidity can more reliably enter the through hole 21a, for example, and more reliably bond the outer circumferential surface 31a and the inner circumferential surface 21a1, and further the sleeve 20A and the optical fiber 30. Also, the bonding material 50 can more reliably seal the gap between the outer circumferential surface 31a and the inner circumferential surface 21a1, for example.

[0063] In this embodiment, the sleeve 20A has a semi-cylindrical portion 22 (support portion) that supports the optical fiber 30.

[0064] According to such a configuration, for example, the optical fiber 30 can be more stably supported by the semi-cylinder portion 22. Furthermore, for example, in a configuration in which the sleeve 20A and the optical fiber 30 are joined by the second joining material 52, the attitude of the optical fiber 30 with respect to the sleeve 20A can be more stabilized in the first step.

[0065] In this embodiment, the bonding material 50 (second bonding material 52) bonds the semi-cylinder portion 22 and the outer portion 30d of the optical fiber 30 that is located outside the through hole 21a.

[0066] According to such a configuration, for example, it is possible to more firmly join the sleeve 20A and the optical fiber 30. This also makes it difficult for the end 30a of the optical fiber 30 to vibrate, and the optical coupling between the optical fiber 30 and an optical device such as the light source unit 41 becomes more stable, in other words, there is an advantage that the vibration resistance of the optical coupling is improved.

[0067] In this embodiment, the bonding material 50 inside the through hole 21a (first bonding material 51) and the bonding material 50 outside the through hole 21a (second bonding material 52) are adjacent to each other or are integrated with each other.

[0068] According to such a configuration, for example, the first bonding material 51 and the second bonding material 52 can be formed in a continuous working process, so that the effort and cost for manufacturing the optical device 1A can be further reduced.

[0069] In the present embodiment, the first bonding material 51 is, for example, solder.

[0070] The configuration of this embodiment can be applied to an optical device 1A in which a sleeve 20A and an optical fiber 30 are solder-joined within a through-hole 21a.

[0071] In the present embodiment, the first bonding material 51 and the second bonding material 52 are, for example, solder.

[0072] According to such a configuration, for example, the first bonding material 51 and the second bonding material 52 can be formed in a continuous working process, so that the effort and cost for manufacturing the optical device 1A can be further reduced.

[0073] In this embodiment, the semi-cylindrical portion 22 is provided outside the case 10 .

[0074] According to such a configuration, for example, compared to a case in which the semi-cylindrical portion 22 is provided inside the case 10, an advantage is obtained in that the degree of freedom in the layout of the components inside the case 10 is increased.

[0075] In this embodiment, the optical device 1A includes a light source unit 41 (optical device) housed in the case .

[0076] The configuration of this embodiment can be applied to an optical device 1A in which a light source unit 41 is housed in a case .

[0077] In addition, the manufacturing method of the optical device 1A of this embodiment includes a first step of injecting a fluid bonding material 50 between the outer peripheral surface 31a and the inner peripheral surface 21a1 of the through hole 21a opening into the inclined end face 21c, and a second step of solidifying the bonding material 50.

[0078] According to such a method, for example, in the first step, the bonding material 50 having fluidity can easily enter the gap between the outer peripheral surface 31a and the inner peripheral surface 21a1 from the opening end 21b1 of the end face 21c inclined with respect to the X direction, so that the bonding material 50 can more reliably enter the through hole 21a and more reliably bond the sleeve 20A and the optical fiber 30. Also, the bonding material 50 can more reliably seal the gap between the outer peripheral surface 31a and the inner peripheral surface 21a1. Another advantage is that the effort and cost of manufacturing the optical device 1A can be further reduced.

[0079] In this embodiment, a soldering iron 90A (ultrasonic soldering device) is used in the first step.

[0080] According to such a method, for example, an oxide film on the material surface is removed by ultrasonic waves, so that a stronger bond can be obtained between the sleeve 20A and the optical fiber 30. In addition, since a better or stronger bond can be easily obtained by using an ultrasonic soldering device, there are also other advantages, such as no need for flux in the first step and no need for pretreatment such as metal coating for the exposed portion 30b to be bonded.

[0081] In this embodiment, in the first step, vibration is transmitted from the soldering iron 90A to the sleeve 20A.

[0082] According to such a method, for example, ultrasonic vibration can be transmitted from the soldering iron 90A via the sleeve 20A to the solder (the fluid bonding material 50), which tends to further increase the effect of ultrasonic soldering.

[0083] [First Modification] Fig. 4 is a cross-sectional view (partial side view) of a sleeve 20B and an optical fiber 30 of a first modified example as a modified example of the first embodiment, taken at a cross section perpendicular to the Y direction. As shown in Fig. 4, in this modified example, an end face 21c of the sleeve 20B is a flat surface inclined with respect to the X direction and the Z direction. The end face 21c faces the M2 direction between the opposite direction to the X direction and the Z direction. The sleeve 20B of this modified example can be incorporated into the optical device 1A of the first embodiment in place of the sleeve 20A.

[0084] Even with this configuration, since the through hole 21a opens to the end face 21c inclined with respect to the X direction, the bonding material 50 (first bonding material 51) having fluidity can easily enter the gap between the outer peripheral surface 31a and the inner peripheral surface 21a1 from the opening end 21b1 of the end face 21c inclined with respect to the X direction. Therefore, the bonding material 50 can more reliably enter the through hole 21a, more reliably bonding the sleeve 20B and the optical fiber 30, and more reliably sealing the gap between the outer peripheral surface 31a and the inner peripheral surface 21a1.

[0085] In this modification, end surface 21c (inclined surface) inclined with respect to the X direction extends on the opposite side to outer portion 30d with respect to opening end 21b1.

[0086] With this configuration, for example, in the first step, the solder or soldering iron 90A is prevented from interfering with the end surface 21c on the side opposite the outer portion 30d with respect to the opening end 21b1. Therefore, with this configuration, the first step can be performed more smoothly, and thus the manufacturing effort and cost of the optical device 1A can be further reduced.

[0087] [Second embodiment] Fig. 5 is a cross-sectional view (partial side view) of the sleeve 20C and the optical fiber 30 of the second embodiment, taken along a cross section perpendicular to the Y direction. Fig. 6 is a cross-sectional view of the sleeve 20C and the optical fiber 30 being soldered together with a soldering iron 90C of an ultrasonic soldering device, taken along a cross section perpendicular to the X direction. The sleeve 20C of this embodiment can be incorporated into the optical device 1A of the first embodiment in place of the sleeve 20A.

[0088] As shown in FIG. 5, in this embodiment, in addition to the through hole 21a provided in the cylindrical portion 21, the semi-cylindrical portion 22 is provided with a through hole 22b through which the optical fiber 30 passes. The through hole 22b is spaced apart from the through hole 21a. The top surface 22a is located between the through hole 22b and the through hole 21a. The through hole 22b is concentric with the through hole 21a and extends in the X direction. In this embodiment, as an example, the through hole 22b accommodates a boundary portion between the exposed portion 30b and the covered portion 30c. In other words, the through hole 22b accommodates a part of the exposed portion 30b and a part of the covered portion 30c. The through hole 22b is an example of a second through hole.

[0089] The bonding material 50 (second bonding material 52) is located inside the through hole 22b, and bonds the outer circumferential surface 31a of the exposed portion 30b (core wire 31) and the inner circumferential surface 22b1 of the through hole 22b inside the through hole 22b.

[0090] A top surface 22c is provided at the end in the Z direction of the portion of the semi-cylindrical portion 22 where the through hole 22b is provided. The top surface 22c has a planar shape facing the Z direction. As shown in Fig. 6, a soldering iron 90C of the ultrasonic soldering device has, for example, a planar end surface 90a. In the first step, the soldering iron 90C is heated while being ultrasonically vibrated with the end surface 90a in contact with the top surface 22c, whereby heat and ultrasonic vibration are indirectly transmitted from the soldering iron 90C to the bonding material 50 in the through hole 22b via the semi-cylindrical portion 22.

[0091] As described above, in this embodiment, the semi-cylinder portion 22 (support portion) is provided with the through hole 22b (second through hole) through which the optical fiber 30 (first optical fiber) passes.

[0092] According to such a configuration, for example, the sleeve 20C can more reliably support the optical fiber 30. In addition, the through hole 22b can position the optical fiber 30. In addition, by bonding the outer circumferential surface 31a and the inner circumferential surface 22b1 with the bonding material 50, for example, the sleeve 20C and the optical fiber 30 can be bonded more firmly.

[0093] [Third embodiment] Fig. 7 is a cross-sectional view (partial side view) of a sleeve 20D and an optical fiber 30 of the third embodiment, taken along a cross section perpendicular to the Y direction. Fig. 8 is a cross-sectional view of a cross section perpendicular to the X direction, showing a state in which the sleeve 20D and the optical fiber 30 are soldered together by a soldering iron 90D of an ultrasonic soldering device. The sleeve 20D of this embodiment can be incorporated into the optical device 1A of the first embodiment in place of the sleeve 20A.

[0094] As shown in Figs. 7 and 8, in this embodiment, the semi-cylindrical portion 22 is provided with a groove 22d for accommodating the optical fiber 30. The groove 22d is provided on the top surface 22a, recessed in the opposite direction to the Z direction, and extends in the X direction. The groove 22d smoothly connects to the through hole 21a provided in the cylindrical portion 21 in the opposite direction to the X direction. That is, the concave surface 22d1 of the groove 22d and the semi-cylindrical surface of the inner circumferential surface 21a1 of the through hole 21a on the opposite side in the Z direction are smoothly connected without any steps. In this embodiment, the optical fiber 30 is accommodated in the groove 22d by approximately half, but this is not limited thereto, and it is sufficient that at least a part of the optical fiber 30 is accommodated in the groove 22d.

[0095] 8, the soldering iron 90D has, for example, a planar end surface 90a, and the soldering iron 90D is provided with a groove 90b that opens at the end surface 90a. The end surface 90a and the groove 90b are formed in such a shape that the fluid bonding material 50 (second bonding material 52) can be interposed between the concave surface of the groove 22d and the concave surface of the groove 90b when the end surface 90a is in contact with the top surface 22a. With this configuration, in the first step, the soldering iron 90D is heated while being ultrasonically vibrated, so that heat and ultrasonic vibration are transmitted from the end surface 90a to the top surface 22a, i.e., the sleeve 20D. As a result, heat and ultrasonic vibration are transmitted directly from the soldering iron 90D to the bonding material 50, and indirectly via the sleeve 20D.

[0096] As described above, in this embodiment, the semi-cylinder portion 22 (support portion) is provided with the groove 22d that accommodates the optical fiber 30 at least partially.

[0097] According to such a configuration, for example, the optical fiber 30 can be advantageously positioned at a predetermined position by the groove 22d. In addition, for example, in a configuration in which the sleeve 20D and the optical fiber 30 are joined by the joining material 50 in the groove 22d, the volume of the joining material 50 surrounding the optical fiber 30 can be made smaller than the case where the joining material 50 spreads over the top surface 22a because the joining material 50 can be held in the groove 22d.

[0098] [Second modified example] FIG. 9 is a cross-sectional view (partial side view) of the sleeve 20E and the optical fiber 30 of the second modified example as a modified example of the third embodiment, taken along a cross section perpendicular to the Y direction. As shown in FIG. 9, in this modified example, the bonding material 50 (the second bonding material 52) is separated into a plurality of locations. That is, the bonding material 50 includes the first bonding material 51 in the through hole 21a, and also includes the second bonding material 52 at two locations separated in the X direction on the top surface 22a. In this modified example, the first bonding material 51 and the second bonding material 52 are made of the same material, e.g., solder. With this configuration, the same effect as in the above embodiment can be obtained. In addition, since the bonding material 50 is separated, the force acting on the optical fiber 30 from the bonding material 50 based on, for example, a temperature change can be further reduced. The number of separated portions of the bonding material 50 is not limited to two, and may be three or more.

[0099] [Fourth embodiment] 10 is a cross-sectional view (partial side view) of an optical device 1F of the fourth embodiment taken along a cross section perpendicular to the Y direction. As shown in FIG. 10, in a sleeve 20F of this embodiment, a semi-cylindrical portion 22 is located inside the case 10.

[0100] Further, the cylindrical portion 21 is provided with a through hole 21d separate from the through hole 21a, and a bonding material 60 separate from the bonding material 50 is interposed in a gap between an inner peripheral surface 21d1 of the through hole 21d and an outer peripheral surface 30c1 of the coated portion 30c of the optical fiber 30. The material of the bonding material 60 is different from that of the bonding material 50, and is, for example, an adhesive. The bonding material 60 bonds the sleeve 20F and the optical fiber 30. In this embodiment, the coated portion 30c of the optical fiber 30 penetrates the through hole 21d, but this is not limited thereto, and the exposed portion 30b may penetrate the through hole 21d, or the boundary portion between the exposed portion 30b and the coated portion 30c may be accommodated in the through hole 21d.

[0101] As described above, in this embodiment, the semi-cylindrical portion 22 (support portion) is provided inside the case 10.

[0102] According to such a configuration, for example, the joint portion between the sleeve 20F and the optical fiber 30 by the joint material 50 can be housed within the case 10 and protected by the case 10.

[0103] In this embodiment, the bonding material 60 is a bonding material made of a different material from the bonding material 50 .

[0104] According to such a configuration, for example, by using a cheaper bonding material 60, the optical device 1F can be configured at a lower cost, and the sealing performance and bonding strength can be improved.

[0105] [Third Modification] 11 is a cross-sectional view (partial plan view) of an optical device 1G of a third modified example as a modified example of the fourth embodiment, taken along a cross section perpendicular to the Z direction. As shown in FIG. 11, in this modified example, a groove 22d is provided on the top surface 22a of the semi-cylindrical portion 22 of the sleeve 20G, which is continuous with the through hole 21a. The groove 22d accommodates a portion of the exposed portion 30b that is closer to the inside of the case 10 than the through hole 21a. The groove 22d is curved in an S-shape along the top surface 22a. The exposed portion 30b is curved along the groove 22d, so that the portion of the exposed portion 30b in the through hole 21a and the end portion 30a are offset in the Y direction. In this manner, the optical fiber 30 is curved along the curved groove 22d.

[0106] In this modification, the groove 22d is curved, and the exposed portion 30b (outer portion 30d) of the optical fiber 30 is bent along the groove 22d.

[0107] According to such a configuration, for example, the curved shape of the groove 22d of the sleeve 20G allows the optical fiber 30 to be arranged in a desired position. cable A route can be determined.

[0108] [Fourth Variation] FIG. 12 is a cross-sectional view (partial side view) of an optical device 1H of a fourth modified example as another modified example of the fourth embodiment, taken along a cross section perpendicular to the Y direction. As shown in FIG. 11, in this modified example, the optical device 1H includes a support member 13. The support member 13 is attached to the bottom wall 11 in a state where it protrudes above the bottom wall 11. The support member 13 supports the exposed portion 30b, that is, a portion of the optical fiber 30 between a portion supported by the sleeve 20F and the end portion 30a. That is, the support member 13 supports a position of the exposed portion 30b that is spaced apart from the sleeve 20F. In this embodiment, the support member 13 supports a portion of the exposed portion 30b close to the end portion 30a. The support member 13 may support the end portion 30a.

[0109] Further, the support member 13 is provided with a groove 13a. The exposed portion 30b is accommodated in the groove 13a. In a state where the exposed portion 30b is accommodated in the groove 13a, the exposed portion 30b and the support member 13 are joined by a bonding material 70. The material of the bonding material 70 may be the same as that of the bonding material 50, or may be the same as that of the bonding material 60. In this modification, the support member 13 supports a position of the exposed portion 30b away from the end portion 30a, but is not limited thereto. For example, the support member 13 may support the end portion 30a, the covered portion 30c, or the boundary portion between the exposed portion 30b and the covered portion 30c.

[0110] As described above, in this embodiment, the support member 13 is housed in the case 10 and supports the optical fiber 30 at a position spaced apart from the sleeve 20F.

[0111] With such a configuration, for example, the optical fiber 30 can be more stably supported within the case 10. This also makes it difficult for the end 30a of the optical fiber 30 to vibrate, and the optical coupling between the optical fiber 30 and an optical device such as the light source unit 41 becomes more stable; in other words, the vibration resistance of the optical coupling is improved. Furthermore, depending on the relative arrangement of the sleeve 20F and the support member 13, the optical fiber 30 can be arranged in a bent state between the sleeve 20F and the support member 13. cable This also has the advantage that it is possible to

[0112] [Fifth embodiment] 13 is a cross-sectional view (partial side view) of an optical device 1I according to a fifth embodiment taken along a cross section perpendicular to the Y direction. As shown in FIG. 13, in this embodiment, the semi-cylinder portion 22 is positioned inside the case 10, similar to the fourth embodiment and its modified example.

[0113] In this modification, the through hole 21a provided in the cylindrical portion 21 of the sleeve 20I has a first portion 21a3 and a second portion 21a4. The second portion 21a4 is located on the opposite side of the first portion 21a3 to the end portion 30a of the optical fiber 30.

[0114] The first portion 21a3 accommodates the exposed portion 30b with a gap therebetween. The bonding material 50 (first bonding material 51) is interposed between the inner circumferential surface 21a1 of the first portion 21a3 and the outer circumferential surface 31a of the exposed portion 30b, and bonds the sleeve 20I to the optical fiber 30. The first portion 21a3 opens to an end surface 21c inclined with respect to the X direction. The boundary between the first portion 21a3 and the second portion 21a4 is connected to the outside of the sleeve 20I (inside the case 10) via an air vent hole 21a5.

[0115] The inner diameter of the second portion 21a4 is approximately equal to the outer diameter of the exposed portion 30b. That is, the end portion 20a of the sleeve 20I on the opposite side in the X direction functions as a first ferrule 80a of a connector 80 that connects the optical fiber 30 and the optical fiber 30A. The first ferrule 80a is an example of a connector portion.

[0116] The connector 80 includes a first ferrule 80a, a second ferrule 80b provided at the end of the optical fiber 30A, and a connector sleeve 80c. The first ferrule 80a and the second ferrule 80b have, for example, a cylindrical shape with the same outer diameter. The inner diameter of the cylindrical connector sleeve 80c is slightly larger than the outer diameters of the first ferrule 80a and the second ferrule 80b.

[0117] The end face 20a1 of the first ferrule 80a has a circular, planar end face 20a1 perpendicular to the X-direction. An end face 30e of the optical fiber 30 is exposed at the center of the end face 20a1.

[0118] An end face 80b1 of the second ferrule 80b has a circular shape and a planar shape perpendicular to the X-direction. An end face 30e of the optical fiber 30A is exposed at the center of the end face 80b1.

[0119] The connector 80 is configured by a first ferrule 80a, a second ferrule 80b, and a connector sleeve 80c, with the end face 20a1 and the end face 80b1 being butted against each other within the connector sleeve 80c. and Second ferrule 80 b When the end face 20a1 and the end face 80b1 are butted against each other, the end face 30e of the optical fiber 30 and the end face 30e of the optical fiber 30A are in contact with each other, whereby the optical fiber 30 and the optical fiber 30A are optically coupled to each other.

[0120] As described above, in this embodiment, the sleeve 20I has the first ferrule 80a (connector portion). The first ferrule 80a configures the connector 80 that connects the optical fiber 30 to an optical fiber 30A (second optical fiber) that is separate from the optical fiber 30.

[0121] According to such a configuration, for example, by integrating the sleeve 20I and the first ferrule 80a of the connector 80, advantages are obtained such as a simpler device configuration and a reduced number of parts compared to a configuration in which these are separate parts.

[0122] [Sixth embodiment] Fig. 14 is a plan view of the interior (inside case 10) of optical device 1J of the sixth embodiment as viewed in the opposite direction to the Z direction, and Fig. 15 is a side view of the interior of optical device 1J as viewed in the Y direction. Fig. 14 shows a state in which top wall 14 of case 10 has been removed, and Fig. 15 shows a state in which part of side wall 12 of case 10 has been removed.

[0123] The optical device 1J includes a modulator 100, an optical fiber 30I, and an optical fiber 30O. The modulator 100 receives light output from the optical fiber 30I and outputs light input to the optical fiber 30O. The modulator 100 is an example of an optical device, and the optical fibers 30I and 30O are examples of first optical fibers.

[0124] As shown in Fig. 15, within the case 10, a substrate 102 is attached via a thermo module 101 onto the bottom wall 11 of the case 10. As shown in Figs. 14 and 15, in addition to the two support members 13 and the modulator 100, a lens 103, a prism 104, a lens 105, a lens 106, a polarization combiner 107, a lens 108, and a lens 109 are attached onto the substrate 102. The lens 103, the prism 104, the lens 105, the lens 106, the polarization combiner 107, the lens 108, and the lens 109 may also be referred to as optical components.

[0125] The optical fibers 30I, 30O pass through a sleeve 20J attached to the side wall 12 of the case 10. The ends 30a of the optical fibers 30I, 30O are located within the case 10.

[0126] As shown in FIG. 14, light (input light Li) exiting an optical fiber 30I is input to a modulator 100 via a lens 103, a prism 104, and a lens 105.

[0127] The modulator 100 is, for example, a MZ (Mach-Zehnder) type phase modulator using InP (indium phosphide) as a constituent material, and is a known optical device that is driven by a modulator driver 110 and functions as an IQ modulator. The modulator 100 may have a configuration similar to that disclosed in, for example, International Publication No. 2016 / 021163.

[0128] The modulator 100 modulates the input light Li and outputs modulated light Lo1, Lo2 whose polarization planes are orthogonal to each other. Both modulated light Lo1, Lo2 are linearly polarized light and are IQ modulated. The modulator driver 110 that operates the modulator 100 is configured to include, for example, an IC. The operation of the modulator driver 110 is controlled by a controller (not shown).

[0129] The lens 106 collimates the modulated light Lo1 and inputs it to the polarization combining unit 107. The lens 108 collimates the modulated light Lo2 and inputs it to the polarization combining unit 107. The polarization combining unit 107 polarization combines the modulated light Lo1, Lo2 and outputs an output signal light Lo including the modulated light Lo1, Lo2. The output signal light Lo output from the polarization combining unit 107 is input to the end 30a of the optical fiber 30O via the lens 109.

[0130] The sleeve 20J has a first sleeve portion 20J1 through which the optical fiber 30I passes, and a second sleeve portion 20J2 through which the optical fiber 30O passes. The first sleeve portion 20J1 and the second sleeve portion 20J2 each have a configuration similar to that of the sleeve 20F of the fourth embodiment. However, the sleeve 20F has a rectangular parallelepiped support portion 22J having a top surface 22a instead of the semi-cylindrical portion 22.

[0131] In this embodiment, the optical device 1J includes the sleeve 20J in which the first sleeve portion 20J1 and the second sleeve portion 20J2 are integrated, but the present invention is not limited to this, and the optical device 1J may include a sleeve that supports the optical fiber 30I and a sleeve that supports the optical fiber 30O separately. The first sleeve portion 20J1 and the second sleeve portion 20J2 may have a configuration similar to that of the sleeves 20A to 20E and 20G to 20I of an embodiment or modified example other than the sleeve 20F, or may have another configuration equivalent or similar thereto.

[0132] Further, the optical fibers 30I and 30O are each supported by a support member 13 spaced apart from the sleeve 20J. The support member 13 is attached to the bottom wall 11 of the case 10 via a thermo module 101 and a substrate 102.

[0133] With such an optical device 1J having a modulator 100, the same effects as those of the optical devices 1A, 1F to 1I having the sleeves 20A to 20I can be obtained.

[0134] [Fifth Modification] FIG. 16 is a perspective view of a sleeve 20K of the fifth modified example. As shown in FIG. 16, the sleeve 20K has walls 22e at both ends in the Y direction of the top surface 22a. The walls 22e protrude from the top surface 22a in the Z direction and extend in the X direction at a substantially constant height in the Z direction. With this configuration, the walls 22e can prevent the solder (bonding material 50) placed on the top surface 22a in a fluid state from flowing out of the top surface 22a. The sleeve 20K of this modified example can be applied to the optical devices 1A, 1F to 1J of the other embodiments and modified examples.

[0135] [Sixth Modification] FIG. 17 is a perspective view of a sleeve 20L of the sixth modified example. As shown in FIG. 17, the sleeve 20L has a groove 22d that is wider and deeper than the through hole 21a. The inner peripheral surface of the groove 22d has a cylindrical surface shape (cylindrical inner surface shape), and the diameter of the inner peripheral surface is equal to or larger than the diameter of the inner peripheral surface 21a1 of the through hole 21a. With this configuration, for example, the solder (joint material 50) in a fluid state that flows in from the opening in the top surface 22a of the groove 22d is more likely to flow around to the opposite side of the core wire 31 from the opening, making it easier to obtain a stronger joint state between the sleeve 20L and the optical fiber 30. Also, in this modified example, the inner peripheral surface of the groove 22d and the inner peripheral surface 22b1 of the through hole 22b are smoothly connected without any steps. Therefore, the groove 22d and the through hole 22b can be formed in one process, which has the advantage of further reducing the labor and cost of manufacturing the sleeve 20L. The sleeve 20 of this modified example LThe above can be applied to the optical devices 1A, 1F to 1J according to the other embodiments and modifications.

[0136] [Seventh Variation] Fig. 18 is a perspective view of an optical device 1M of a seventh modified example. As shown in Fig. 18, a plurality of (two) sleeves 20B may be provided in the case 10. The number of sleeves 20B may be three or more. Moreover, instead of the sleeve 20B, the sleeves 20A, 20C to 20L of other embodiments or modified examples may be provided, or different sleeves 20A to 20L may be provided.

[0137] [Eighth Modification] FIG. 19 is a perspective view of an optical device 1N of an eighth modified example. A plurality of optical fibers 30 (30I, 30O) may pass through one sleeve 20N in the form shown in FIG. 19. According to the configuration of this modified example, the process of placing solder (bonding material 50) in a fluid state on the sleeve 20N can be performed outside the case 10. In addition, since a plurality of optical fibers 30 pass through one sleeve 20N, the bonding process between each of the optical fibers 30 and the sleeve 20N can be performed more quickly in a relatively close location. In FIG. 19, the bonding materials 50 that bond the optical fibers 30 and the sleeve 20N are separated from each other, but this is not limited thereto. For example, the bonding material 50 that bonds the plurality of optical fibers 30 and the sleeve 20N may be integrated by placing solder (bonding material 50) in a fluid state between two optical fibers 30 and utilizing the spreading of the solder. In this case, a configuration in which a plurality of optical fibers 30 and one sleeve 20N are bonded by one bonding material 50 is obtained. The sleeve 20N of this modified example can be applied to the optical devices 1A, 1F to 1J, and 1M of the other embodiments and modified examples.

[0138] Although the embodiment and the modified examples of the present invention have been illustrated above, the above-mentioned embodiment and the modified examples are merely examples and are not intended to limit the scope of the invention. The above-mentioned embodiment and the modified examples can be implemented in various other forms, and various omissions, substitutions, combinations, and modifications can be made without departing from the gist of the invention. In addition, the specifications of each configuration, shape, and the like (structure, type, direction, model, size, length, width, thickness, height, number, arrangement, position, material, etc.) can be appropriately changed and implemented.

[0139] For example, the bonding material is not limited to solder.

[0140] The present invention is also applicable to cases where no ultrasonic soldering device is used.

[0141] Furthermore, the sleeve does not need to be a separate member from the case, and may be formed by machining a portion of the case. [Industrial Applicability]

[0142] The present invention can be used in an optical device and a method for manufacturing an optical device. [Explanation of symbols]

[0143] 1A,1F~1J,1M,1N…Optical device 10…Case 11...Bottom wall 12…Side wall 12a…Aperture 13...Support member 13a...Groove 14…Top wall 20A~20L, 20N…Sleeve 20J1…First sleeve part 20J2…Second sleeve part 20a...End 20a1...end face 21...Cylindrical part 21a...Through hole (first through hole) 21a1…Inner peripheral surface 21a2…Bottom 21a3…first part 21a4…Second part 21a5…Air vent hole 21b1...Open end 21b2...Open end 21c...End face (slanted face) 21d...Through hole 21d1…Inner peripheral surface 22...Semi-cylindrical part (support part) 22J…Support part 22a…Top surface 22b...Through hole (second through hole) 22b1…Inner peripheral surface 22c…Top surface 22d…Groove 22d1…concave 22e…Wall part 30...Optical fiber (First Optical Fiber) 30A...Optical fiber (second optical fiber) 30I…Optical fiber (first optical fiber) 30O…Optical fiber (First Optical Fiber) 30a...end 30b…Exposed area 30c…Covered area 30c1…Outer surface 30d…Outer part 30e…end face 31…Core wire 31a...Outer surface 32…Covering 41...Light source unit (optical device) 42...Lens 50...Joining material 51...First bonding material 52…Second bonding material 60...Joining material 70...Joining material 80…Connector 80a…First ferrule (connector part) 80b…Second ferrule 80b1…End face 80c…connector sleeve 90A, 90C, 90D...Soldering iron 90a...end face 90b…Groove 100...Modulator (optical device) 101…Thermo module 102...Substrate 103...Lens 104…Prism 105…Lens 106…Lens 107...Polarization synthesis section 108…Lens 109…Lens 110...Modulator driver Li…Input light Lo1, Lo2...modulated light Lo: Output signal light M1…direction M2…direction R…Containment room X…direction Y...Direction Z…direction

Claims

1. Case and a sleeve attached to the case, the sleeve having a cylindrical portion having a first through hole penetrating between an inside and an outside of the case, and a semi-cylindrical portion serving as a support portion protruding from the cylindrical portion; a first optical fiber having a core wire including a core and a clad and a coating surrounding the core wire, the exposed portion of the core wire not surrounded by the coating passing through the first through hole; A bonding material; Equipped with the cylindrical portion has an inclined surface that is inclined with respect to a penetration direction of the first through hole and through which the first through hole is opened, the semi-cylindrical portion has a flat top surface along a penetration direction of the first through hole, and the inclined surface and the top surface are smoothly connected without any step, The bonding material includes a first bonding material and a second bonding material which are made of the same material and are integrated together, the first bonding material directly surrounds an outer circumferential surface of the exposed portion within the first through hole without being interposed between another member or a coating on the exposed portion, and is interposed between the outer circumferential surface and an inner circumferential surface of the first through hole to form a seal; the second bonding material is provided on the top surface and directly surrounds an outer peripheral surface of the exposed portion without being interposed between another member or a coating on the exposed portion, thereby bonding the outer peripheral surface and the top surface; the bonding material as a whole bonds the sleeve and the first optical fiber, An optical device, wherein the exposed portion is supported on the top surface by the semi-cylinder portion via the second bonding material.

2. The optical device of claim 1 , wherein the support is provided with a groove that at least partially receives the first optical fiber.

3. The optical device of claim 2 , wherein the groove is curved and the first optical fiber is bent along the groove.

4. 4. The optical device according to claim 1, wherein the support portion is provided with a second through hole through which the first optical fiber passes.

5. 5. The optical device according to claim 1, wherein the inclined surface extends on a side opposite to the support portion with respect to an opening end of the first through hole.

6. 6. The optical device according to claim 1, wherein the support portion is provided inside the case.

7. 7. The optical device according to claim 1, wherein the support portion is provided outside the case.

8. 8. The optical device according to claim 1, wherein the sleeve has a connector portion that constitutes a connector for connecting the first optical fiber to a second optical fiber separate from the first optical fiber.

9. 9. The optical device according to claim 1, further comprising a support member housed in the case and supporting the first optical fiber at a position spaced apart from the sleeve.

10. 10. The optical device according to claim 1, wherein the first bonding material and the second bonding material are solder.

11. An optical device according to any one of claims 1 to 10, comprising an optical device housed in the case and configured to output light input to the first optical fiber or receive light output from the first optical fiber.

12. Case and a sleeve attached to the case, the sleeve having a cylindrical portion having a first through hole penetrating between an inside and an outside of the case, and a semi-cylindrical portion serving as a support portion protruding from the cylindrical portion; a first optical fiber having a core wire including a core and a clad and a coating surrounding the core wire, the exposed portion of the core wire not surrounded by the coating passing through the first through hole; A bonding material; Equipped with the cylindrical portion has an inclined surface that is inclined with respect to a penetration direction of the first through hole and through which the first through hole is opened, the semi-cylindrical portion has a flat top surface along a penetration direction of the first through hole, and the inclined surface and the top surface are smoothly connected without any step, The bonding material includes a first bonding material and a second bonding material which are made of the same material and are integrated together, the first bonding material directly surrounds an outer circumferential surface of the exposed portion within the first through hole without being interposed between another member or a coating on the exposed portion, and is interposed between the outer circumferential surface and an inner circumferential surface of the first through hole to form a seal; the second bonding material is provided on the top surface and directly surrounds an outer peripheral surface of the exposed portion without being interposed between another member or a coating on the exposed portion, thereby bonding the outer peripheral surface and the top surface; the bonding material as a whole bonds the sleeve and the first optical fiber, a second bonding material being disposed on the top surface of the optical device, the second bonding material being disposed on the semi-cylinder portion ... a first step of allowing the first bonding material in a fluid state to flow between an outer circumferential surface of the exposed portion and an inner circumferential surface of the first through hole from a smooth portion of an opening that is smoothly connected to the top surface of the first through hole without any step, and allowing a second bonding material in a fluid state to flow between the outer circumferential surface and the top surface; a second step of solidifying the bonding material; A method for manufacturing an optical device comprising the steps of:

13. The first bonding material is solder, The method for manufacturing an optical device according to claim 12, wherein an ultrasonic soldering device is used in the first step.

14. The method for manufacturing an optical device according to claim 13 , wherein in the first step, ultrasonic vibration is transmitted from the ultrasonic soldering device to the sleeve.

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