Image Processing Device

Abstract

To provide an image processing apparatus that can reduce a possibility that mutual interference of heat, vibration, and signals between a plurality of components reduces accuracy of image processing.SOLUTION: An image processing apparatus has: a light receiving element; light emitting elements; a battery; a power supply circuit electrically connected with the battery; an operation unit; a wireless communication module; a first substrate provided with the light receiving element; a second substrate provided with the light emitting elements; a third substrate provided with the power supply circuit; a fourth substrate provided with the wireless communication module and the operation unit; and a housing accommodating the first substrate, the second substrate, the third substrate, and the fourth substrate. The second substrate is fixed to the first substrate. The first substrate is fixed to the housing.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present invention relates to an image processing device. [Background technology]

[0002] In recent years, image processing devices that are equipped with a battery and can be carried around and operated independently have become widespread. For example, Patent Document 1 describes an image processing device that includes a calibration data setting unit that sets color chart image data at a temperature that is closer to the temperature at the time of photographing the subject as calibration data, among temperatures between the temperature of the imaging device at the time of photographing the color chart before the subject and the temperature of the imaging device at the time of photographing the color chart after the subject, based on the temperature of the imaging device at the time of photographing the subject by the imaging device, the temperature of the imaging device at the time of photographing the color chart before and after the subject, and the color chart image data acquired by photographing the color chart before and after the subject, and an image correction unit that corrects the image data of the subject acquired by photographing the subject using the calibration data set in the calibration data setting unit. According to the image processing device described in Patent Document 1, even if the photographing conditions, etc. change during photographing, the image data of the subject can be accurately corrected. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2010-81057 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, in image processing devices that are equipped with batteries and can be carried around or operated standalone, due to the need to arrange various components in a small housing, depending on the arrangement of multiple components such as various circuits and parts, mutual interference such as heat, vibration, and signals may occur between the multiple components, which may reduce the accuracy of image processing, and there is still room for technical improvement. [Means for solving the problem]

[0005] One aspect of the image processing device according to the present invention is A light receiving element; A light-emitting element; Battery and a power supply circuit electrically connected to the battery; An operation unit; A wireless communication module; A first substrate on which the light receiving element is provided; A second substrate on which the light emitting element is provided; a third substrate on which the power supply circuit is provided; a fourth substrate on which the wireless communication module and the operation unit are provided; a housing for housing the first substrate, the second substrate, the third substrate, and the fourth substrate; having the second substrate is fixed to the first substrate, The first substrate is fixed to the housing. [Brief description of the drawings]

[0006] [Figure 1] 1 is a perspective view of an image processing device according to an embodiment of the present invention; [Diagram 2] FIG. 11 is a diagram illustrating an example of information displayed on a display module. [Diagram 3] FIG. 2 is a block diagram showing a functional configuration of the image processing device. [Figure 4] FIG. 2 is a diagram showing the inside of the housing of the image processing device as viewed from the positive direction of the X-axis. [Diagram 5] FIG. 2 is a diagram showing the inside of the housing of the image processing device as viewed from the positive direction of the Y axis. [Figure 6]FIG. 2 is a diagram showing the inside of the housing of the image processing device as viewed from the positive direction of the Z axis. [Figure 7] FIG. 2 is a view of the first substrate as viewed from the positive direction of the Z axis. [Figure 8] 8 is a cross-sectional view of the first substrate taken along line AA in FIG. 7. [Figure 9] 13 is a view of the sub-board as viewed from the positive direction of the Z axis. [Figure 10] FIG. 2 is a view of the spacer substrate as viewed from the positive direction of the Z axis. [Figure 11] This is a view of the main board as seen from the positive direction of the Z axis. [Figure 12] 13 is a view of the second substrate as viewed from the positive direction of the Z axis. [Figure 13] 13 is a view of the third substrate as viewed from the positive direction of the Z axis. [Figure 14] 13 is a view of the fourth substrate as viewed from the positive direction of the Z axis. [Figure 15] FIG. 2 is a diagram showing some components of the image processing device as viewed from the positive direction of the Z axis. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0007] Preferred embodiments of the present invention will be described in detail below with reference to the drawings. The drawings are used for the convenience of explanation. Note that the embodiments described below do not unduly limit the contents of the present invention described in the claims. Furthermore, not all of the configurations described below are necessarily essential components of the present invention.

[0008] In the following, in this embodiment, a color measurement device will be described as an example of an image processing device according to the present invention.

[0009] 1. Overview of image processing device FIG. 1 is a perspective view of an image processing device 1 according to the present embodiment. As shown in FIG. 1, the image processing device 1 according to the present embodiment performs color measurement processing for measuring the color of an image IMG as image processing. Specifically, when a user moves the image processing device 1 over an image IMG formed on a medium M and presses an operation unit 32 disposed on the top surface of the image processing device 1, the image processing device 1 emits light from a part of the bottom surface facing the image IMG and measures the color of the image IMG based on the wavelength of the light reflected by the image IMG. That is, the operation unit 32 functions as a measurement start button. For example, the medium M is paper or cloth, and the image IMG is a monochromatic image. As shown in FIG. 1, a color chart including a plurality of images of different colors may be formed on the medium M, and the image processing device 1 may measure the color of each image by moving the image processing device 1 over each image and pressing the operation unit 32. The image processing device 1 may also measure the color of the medium M.

[0010] The image processing device 1 may calculate a color difference, which is a difference between the colorimetric value and a target color value. The image processing device 1 displays the calculated colorimetric value and color difference on a display module 50 that is visible to the user from outside the housing 100. In the example of FIG. 1, the display module 50 is provided at a position that is visible to the user from the surface on which the operation unit 32 of the image processing device 1 is disposed. FIG. 2 is a diagram showing an example of the colorimetric value and color difference displayed on the display module 50. In the example of FIG. 2, the colorimetric values ​​L, a, b and color difference ΔE displayed on the display module 50 are values ​​in the L*a*b* color space. Note that the colorimetric value and color difference may be values ​​in various color spaces other than the L*a*b* color space, such as the RGB color space, the YCC color space, the CMYK color space, and the L*C*h color space.

[0011] 1 and 2, the image processing device 1 may have a light emitting module 33 that is visible to the user from outside the housing 100. In the example of FIG. 1 and FIG. 2, the light emitting module 33 is disposed so as to surround the operation unit 32. For example, the light emitting module 33 has a tubular light guide and an LED attached to the tip of the light guide, and the light emitted by the LED is The light is guided to the light guide. LED is an abbreviation for Light Emitting Diode. In the example of Figs. 1 and 2, the user can see the light guide of the light emitting module 33. The light emitting module 33 is a module for displaying status, and its light emitting state varies depending on the user's operation on the operation unit 32. For example, the image processing device 1 may cause the light emitting module 33 to emit light when it recognizes that the operation unit 32 has been pressed by the user.

[0012] The image processing device 1 is portable because it has a shape close to a rectangular parallelepiped and is sized so that the user can hold and operate it with one hand. The image processing device 1 also has a built-in battery 70 (described later) and operates when the user presses the operation unit 32, so it can operate independently without receiving instructions from other devices. Therefore, the image processing device 1 is highly convenient for the user.

[0013] As shown in FIGS. 1 and 2, the directions along the three intersecting sides of the housing 100 of the image processing device 1 are defined as the X-axis, Y-axis, and Z-axis, and hereafter, except for FIG. 3, the relationship between the orientation of the image processing device 1 and the X-axis, Y-axis, and Z-axis is the same as in FIGS. 1 and 2.

[0014] 2. Functional configuration of image processing device Fig. 3 is a block diagram showing a functional configuration of the image processing device 1. As shown in Fig. 3, the image processing device 1 includes a plurality of light-emitting elements 10 and a light-emitting element drive circuit 11. The image processing device 1 also includes a wavelength-variable filter 20, a light-receiving element 21, a photoelectric conversion circuit 22, an amplifier circuit 23, a C / V conversion circuit 24, an amplifier circuit 25, and a boost conversion circuit 26. The image processing device 1 also includes a first processor 30, a wireless communication module 31, an operation unit 32, a light-emitting module 33, a buzzer 34, and a display module 50. The image processing device 1 also includes a second processor 40, a power supply circuit 41, a switch circuit 42, a charging circuit 43, a connector 60, and a battery 70.

[0015] The multiple light-emitting elements 10 are each disposed on the bottom surface of the image processing device 1, and are turned on or off based on a drive signal output from a light-emitting element drive circuit 11. When each light-emitting element 10 is turned on, light is emitted from the bottom surface of the image processing device 1. Each light-emitting element 10 is, for example, an LED. For example, among the multiple light-emitting elements 10, some of the light-emitting elements may emit white light, and the other light-emitting elements may emit ultraviolet light.

[0016] The light-emitting element drive circuit 11 outputs a plurality of drive signals for driving the plurality of light-emitting elements 10, respectively, based on a control signal from the first processor 30.

[0017] The tunable filter 20 transmits light having a predetermined range of wavelengths among the light incident from the bottom surface of the image processing device 1. The tunable filter 20 includes an electrostatic actuator (not shown), and a voltage output from an amplifier circuit 25 is applied to the electrostatic actuator. The capacitance value of the electrostatic actuator changes according to the applied voltage, and the wavelength of light transmitted by the tunable filter 20 changes according to the capacitance value of the electrostatic actuator. Therefore, the wavelength of light transmitted by the tunable filter 20 changes according to the voltage output from the amplifier circuit 25. For example, the tunable filter 20 may be an etalon element.

[0018] The amplifier circuit 25 outputs a voltage of several tens of volts for driving the tunable filter 20. The output voltage of the amplifier circuit 25 changes based on a control signal from the first processor 30.

[0019] The boost conversion circuit 26 boosts the voltage V1 of several volts output from the power supply circuit 41 to a voltage V4 of several tens of volts and outputs it to the amplifier circuit 25. The voltage V4 boosted by the boost conversion circuit 26 becomes the power supply voltage of the amplifier circuit 25. The boost conversion circuit 26 may be, for example, a boost type DC-DC converter.

[0020] The C / V conversion circuit 24 converts the charge accumulated in the electrostatic actuator into a voltage and outputs it to the first processor 30. The first processor 30 controls the output voltage of the amplifier circuit 25 based on a digital value obtained by A / D converting the output voltage of the C / V conversion circuit 24 so that the tunable filter 20 transmits light of a desired wavelength. In other words, the wavelength of light transmitted by the tunable filter 20 is controlled by the first processor 30.

[0021] The light receiving element 21 receives the light transmitted through the tunable filter 20 and outputs a charge having a magnitude according to the amount of light. For example, the light receiving element 21 may be a photodiode.

[0022] The photoelectric conversion circuit 22 converts the amount of light received by the light receiving element 21 into an electrical signal, and outputs it to the amplifier circuit 23. For example, the photoelectric conversion circuit 22 may be a C / V conversion circuit that converts the charge output from the light receiving element 21 into a voltage.

[0023] The amplifier circuit 23 amplifies the voltage output from the photoelectric conversion circuit 22 and outputs it to the first processor 30 .

[0024] The first processor 30 is a processor that performs image processing, and generates a digital value indicating the amount of light received by the light receiving element 21 by A / D converting the output voltage of the photoelectric conversion circuit 22, and stores the amount of light in association with the wavelength of the light. The first processor 30 may be, for example, an MCU or MPU. MCU stands for Micro Control Unit, and MPU stands for Micro-processing unit. The first processor 30 sweeps the wavelength of light transmitted by the wavelength-variable filter 20, and stores the amount of light received by the light receiving element 21 in association with each wavelength. Then, the first processor 30 calculates a colorimetric value based on the amount of light associated with each wavelength. When the target color value is known in advance, the first processor 30 calculates a color difference that is the difference between the colorimetric value and the target color value.

[0025] The wireless communication module 31 has a wireless communication circuit and an antenna, not shown. The wireless communication circuit acquires a wireless signal received from an external device via the antenna, demodulates the data, and transmits the data to the first processor 30. The wireless communication circuit also acquires data from the first processor 30, modulates a high-frequency signal, and transmits the wireless signal to the external device via the antenna. For example, the wireless communication module 31 may acquire colorimetric values ​​and color differences calculated by the first processor 30, and transmit the colorimetric values ​​to the external device. The wireless communication circuit may have a temperature sensor, not shown, and may have a function of temperature compensating the colorimetric values ​​based on a signal output from the temperature sensor. The wireless communication module 31 may be a module that transmits and receives wireless signals compatible with wireless communication standards, such as Bluetooth (registered trademark) and Wi-Fi.

[0026] The operation unit 32 outputs an operation signal based on a user's operation to the first processor 30. In this embodiment, the operation unit 32 functions as a measurement start button, and when the user presses the operation unit 32, an operation signal indicating that the operation unit 32 has been pressed is output to the first processor 30. The first processor 30 starts processing for color measurement based on the operation signal from the operation unit 32.

[0027] The light-emitting module 33 is a module for displaying status, and emits light based on a control signal from the first processor 30. For example, when the first processor 30 detects that the user has pressed the operation unit 32, it outputs a control signal for causing the light-emitting module 33 to emit light.

[0028] The buzzer 34 notifies the user of various information by generating a predetermined sound based on a control signal from the first processor 30. For example, if the optical axis of the light receiving element 21 is significantly misaligned or shaken when the user presses the operation unit 32 to start measurement, the color measurement may be performed normally. Therefore, if a user makes a malfunction in operating the operation unit 32, the first processor 30 outputs a predetermined control signal to the buzzer 34, which then emits a sound.

[0029] The display module 50 displays various information based on a display signal output from the first processor 30. In this embodiment, the light-emitting module 33 includes a display panel shown in FIG. 2 and a display driver (not shown). The display panel may be, for example, a liquid crystal panel. The display driver generates a drive signal according to the display signal output from the first processor 30 and outputs the drive signal to the display panel. For example, as shown in FIG. 2, color measurement values, color differences, etc. are displayed on the display panel.

[0030] The battery 70 is, for example, a secondary battery such as a lithium ion battery, a lithium polymer battery, etc. When the user presses a power button (not shown), the battery 70 outputs a voltage VB according to the remaining charge.

[0031] The power supply circuit 41 generates and outputs voltages V1 and V2 based on the output voltage VB of the battery 70. The power supply circuit 41 includes a step-up DCDC converter and a step-down DCDC converter (not shown), and the step-up DCDC converter may step-up the output voltage VB of the battery 70 to generate the voltage V1, and the step-down DCDC converter may step-down the voltage V1 to generate the voltage V2. The voltage V1 is supplied to the step-up conversion circuit 26, and the voltage V2 is supplied to the second processor 40 as a power supply voltage. The voltage V2 is also input to the switch circuit 42.

[0032] The switch circuit 42 is turned on or off in accordance with a control signal from the second processor 40. When the switch circuit 42 is turned on, it outputs a voltage V3 that is approximately equal to the voltage V2. The voltage V3 is supplied as a power supply voltage to each circuit enclosed by a dashed line in FIG. 3. When the switch circuit 42 is turned off, the voltage V3 is not supplied to each circuit. In other words, the second processor 40 is a processor for power supply control.

[0033] The connector 60 is a connector to which a cable is connected, and may be, for example, a USB connector. USB is an abbreviation for Universal Serial Bus. For example, the connector 60 is electrically connected to an external device such as a personal computer via a USB cable. The second processor 40 can perform data communication with the external device via the connector 60.

[0034] The charging circuit 43 charges the battery 70 with a power supply voltage VC that is supplied when the connector 60 is electrically connected to an external device.

[0035] Furthermore, the second processor 40 performs data communication with the first processor 30. The second processor 40 may be activated by being supplied with voltage V2 from the power supply circuit 41, and may notify the first processor 30 of the activation. Furthermore, the first processor 30 may notify the second processor 40 of transitioning to a sleep mode after completing the color measurement process, and the second processor 40 may receive the notification and set the switch circuit 42 to a non-conductive state to stop the supply of voltage V3 to the first processor 30.

[0036] 3. Structure of image processing device Next, the internal structure of the image processing device 1 will be described in detail with reference to Fig. 4 to Fig. 15. Fig. 4 is a diagram showing the inside of the housing 100 of the image processing device 1 as viewed from the positive direction of the X-axis. Fig. 5 is a diagram showing the inside of the housing 100 of the image processing device 1 as viewed from the positive direction of the Y-axis. Fig. 6 is a diagram showing the inside of the housing 100 of the image processing device 1 as viewed from the positive direction of the Z-axis.

[0037] As shown in FIGS. 4 and 5, the image processing device 1 includes a rectangular parallelepiped housing 100 and a first board. 101, a second board 102, a third board 103, and a fourth board 104, and the housing 100 houses the first board 101, the second board 102, the third board 103, and the fourth board 104. The first board 101, the third board 103, and the fourth board 104 are each fixed to the housing 100 by screws or the like. Of the first board 101, the second board 102, the third board 103, and the fourth board 104, the second board 102 is provided at a position closest to the bottom surface of the housing 100. The first board 101 is located between the second board 102 and the third board 103, and the third board 103 is located between the first board 101 and the fourth board 104. The fourth board 104 is provided at a position closest to the top surface of the housing 100.

[0038] The tunable filter 20, the light receiving element 21, the photoelectric conversion circuit 22, the amplifier circuit 23, the C / V conversion circuit 24, the amplifier circuit 25, the boost conversion circuit 26, and the first processor 30 shown in Fig. 3 are provided on a first substrate 101. The plurality of light emitting elements 10 and the light emitting element drive circuit 11 shown in Fig. 3 are provided on a second substrate 102. The second processor 40, the power supply circuit 41, the switch circuit 42, the charging circuit 43, and the connector 60 shown in Fig. 3 are provided on a third substrate 103. The wireless communication module 31, the operation unit 32, the light emitting module 33, and the buzzer 34 shown in Fig. 3 are provided on a fourth substrate 104.

[0039] 4, 5, and 6, the display module 50 shown in FIG. 3 is located between the fourth substrate 104 and the upper surface of the housing 100, and is visible from the upper surface of the housing 100. One end of a cable 51 connected to a display driver (not shown) built into the display module 50 is connected to a connector 86 provided on the fourth substrate 104.

[0040] 4 and 5, both ends of the flexible flat cable 91 are connected to a connector 81 provided on the first board 101 and a connector 87 provided on the fourth board 104, respectively. Signals input / output between the first processor 30 provided on the first board 101 and the wireless communication module 31, the operation unit 32, the light-emitting module 33, and the buzzer 34 provided on the fourth board 104 are propagated through the flexible flat cable 91.

[0041] Furthermore, a display signal output from the first processor 30 provided on the first substrate 101 propagates through the flexible flat cable 91 to reach the fourth substrate 104, and then propagates through the cable 51 to reach the display module 50. Therefore, the fourth substrate 104 functions as a relay substrate that relays the display signal to the display module 50.

[0042] Both ends of the flexible flat cable 92 are connected to the connector 84 provided on the first board 101 and the connector 85 provided on the third board 103, respectively. The first processor 30 provided on the first board 101 and the second processor 40 provided on the third board 103 perform data communication via the flexible flat cable 92. Furthermore, the voltage V3 based on the voltage V2 generated by the power supply circuit 41 provided on the third board 103 propagates through the flexible flat cable 92 to reach the first board 101, and then further propagates through the flexible flat cable 91 to reach the fourth board 104. That is, the wiring path from the third board 103 to the first board 101 is shorter than the wiring path from the third board 103 to the fourth board 104. Therefore, the amount of drop in the voltage V3 supplied from the power supply circuit 41 to the first board 101 is reduced, and a stable voltage is supplied to the light receiving element 21 arranged on the first board 101.

[0043] A connector 82 is provided on the first substrate 101, and a connector 83 is provided on the second substrate 102. Then, by mating the connector 82 and the connector 83, the second substrate 102 is fixed to the first substrate 101, and the first substrate 101 and the second substrate 102 are electrically connected. In other words, the first substrate 101 and the second substrate 102 are not connected by a cable, but are connected BtoB by the connector 82 and the connector 83. "BtoB" is an abbreviation for "Board to Board." A control signal output from the first processor 30 provided on the first substrate 101 reaches the second substrate 102 via the connector 82 and the connector 83, and is input to the light-emitting element drive circuit 11 provided on the second substrate 102. The connector 82 is an example of the "first connector," and the connector 83 is an example of the "second connector."

[0044] In this manner, in this embodiment, the second substrate 102 on which the light emitting element 10 is provided and the first substrate 101 on which the light receiving element 21 is provided are not fixed separately to the housing 100, but the second substrate 102 is fixed to the first substrate 101, and the first substrate 101 is fixed to the housing 100. Therefore, even if a large force is applied when the user operates the operation unit 32, the relative positions of the light receiving element 21 and the light emitting element 10 are unlikely to shift, so that the risk of a decrease in the accuracy of image processing is reduced. In particular, the first substrate 101 and the second substrate 102 are firmly fixed by the engagement of the connector 82 and the connector 83, so that the relative positions of the light receiving element 21 and the light emitting element 10 are unlikely to shift. Furthermore, the distance between the first substrate 101 and the second substrate 102 is shortened by the engagement of the connector 82 and the connector 83, so that the housing 100 can be made smaller in size. The second substrate 102 may be fixed to the first substrate 101 by means other than the BtoB connection, for example, by screwing. In this case, the first substrate 101 and the second substrate 102 may be electrically connected by a cable.

[0045] As shown in FIG. 4 and FIG. 5, the battery 70 shown in FIG. 3 is located between the first substrate 101, the second substrate 102, the third substrate 103, and the fourth substrate 104. More specifically, the battery 70 is provided between the third substrate 103 and the fourth substrate 104. The third substrate 103 is provided between the battery 70 and the first substrate 101. The battery 70 overlaps with the third substrate 103 in the Z-axis direction perpendicular to the surface 101F of the first substrate 101. Therefore, in a plan view seen from the positive direction of the Z-axis, the first substrate 101, the second substrate 102, the third substrate 103, the fourth substrate 104, and the battery 70 overlap, and the space in which the first substrate 101, the second substrate 102, and the third substrate 103 are arranged is separated from the space in which the fourth substrate 104 is arranged by the battery 70.

[0046] As shown in FIG. 4, the battery 70 has a rectangular shape in plan view from the positive direction of the X-axis. On the other hand, as shown in FIG. 5, in plan view from the positive direction of the Y-axis, the part of the battery 70 facing the fourth board 104 has a semicircular shape, and the part of the battery 70 facing the first board 101, the second board 102, and the third board 103 has a trapezoidal shape with the upper base longer than the lower base. Therefore, the cross-sectional area of ​​the part of the battery 70 facing the first board 101, the second board 102, and the third board 103 is smaller as it is closer to the first board 101, the second board 102, and the third board 103. Therefore, a gap is generated in the X-axis direction between the battery 70 and the third board 103, and the connectors 71 and 72 are provided on the third board 103 by utilizing this gap. The connectors 71 and 72 are connected to the battery 70 by wiring (not shown). The power supply circuit 41 and the charging circuit 43 shown in FIG. 3 are electrically connected to the battery 70 via the connectors 71 and 72.

[0047] Fig. 7 is a view of first substrate 101 viewed from the positive direction of the Z axis, and Fig. 8 is a cross-sectional view of first substrate 101 cut along line AA in Fig. 7. As shown in Fig. 7, in a plan view viewed from the positive direction of the Z axis, first substrate 101 has a rectangular shape having side 101a, side 101b longer than side 101a, side 101c opposing side 101a, and side 101d opposing side 101b.

[0048] 7 and 8, the first substrate 101 has a surface 101F facing in the positive direction of the Z axis and a surface 101R facing in the negative direction of the Z axis. The first substrate 101 is provided between the third substrate 103 and the second substrate 102 in the Z axis direction. The light receiving element 21 is disposed on the first substrate 101F. It is provided on surface 101R of 101.

[0049] As shown in FIG. 7, the first substrate 101 is constructed by fixing a main substrate 111 and a sub-substrate 113 to a spacer substrate 112 with screws 131 and 132.

[0050] Fig. 9 is a view of the sub-substrate 113 as viewed from the positive direction of the Z axis. Fig. 10 is a view of the spacer substrate 112 as viewed from the positive direction of the Z axis. Fig. 11 is a view of the main substrate 111 as viewed from the positive direction of the Z axis. In Figs. 9, 10, and 11, the solid lines indicate components provided on the surface of each substrate facing in the positive direction of the Z axis, and the dashed lines indicate components provided on the surface of each substrate facing in the negative direction of the Z axis.

[0051] As shown in Figures 7, 9, 10 and 11, screws 131 are inserted through screw holes 121 provided in main board 111, screw holes 123 provided in spacer board 112 and screw holes 124 provided in sub-board 113, and screws 132 are inserted through screw holes 122 provided in main board 111 and screw holes 125 provided in sub-board 113.

[0052] As shown in Fig. 9, the sub-substrate 113 has a surface 113F facing in the positive direction of the Z axis and a surface 113R facing in the negative direction of the Z axis. The surfaces 101F and 101R of the first substrate 101 are surfaces 113F and 113R, respectively, of the sub-substrate 113. As shown in Figs. 8 and 9, the light receiving element 21 and the amplifier circuit 23 are provided on the surface 113R of the sub-substrate 113.

[0053] As shown in Figures 7 and 11, in a planar view from the positive direction of the Z axis, the outline of first substrate 101 matches the outline of main substrate 111, and sides 101a, 101b, 101c and 101d of first substrate 101 are sides 111a, 111b, 111c and 111d of main substrate 111, respectively.

[0054] As shown in Fig. 11, the main substrate 111 has a surface 111F facing the positive direction of the Z axis and a surface 111R facing the negative direction of the Z axis. The surface 111F of the main substrate 111 is provided with the photoelectric conversion circuit 22, the amplifier circuit 25, the boost conversion circuit 26, the first processor 30, and a connector 84. The surface 111R of the main substrate 111 is provided with the tunable filter 20, the C / V conversion circuit 24, the connector 81, and the connector 82. As shown in Figs. 8 and 11, the main substrate 111 has a rectangular opening 120, and the tunable filter 20 and the opening 120 overlap in a plan view seen from the positive direction of the Z axis.

[0055] In this embodiment, first substrate 101 is made up of three substrates: main substrate 111, spacer substrate 112, and sub-substrate 113, but may be made up of one or two substrates.

[0056] Fig. 12 is a view of second substrate 102 as viewed from the positive direction of the Z axis. In Fig. 12, solid lines indicate components provided on surface 102F of second substrate 102 facing the positive direction of the Z axis, and dashed lines indicate components provided on surface 102R of second substrate 102 facing the negative direction of the Z axis.

[0057] 12, in a plan view seen from the positive direction of the Z axis, second substrate 102 has a rectangular shape having side 102a, side 102b longer than side 102a, side 102c facing side 102a, and side 102d facing side 102b. A connector 83 is provided on surface 102F of second substrate 102. Surface 102F of second substrate 102 faces surface 101R of first substrate 101.

[0058] A plurality of light emitting elements 10 and a light emitting element driving circuit 11 are provided on a surface 102R of the second substrate 102. The second substrate 102 has a circular opening 140, and in a plan view seen from the positive direction of the Z axis, the multiple light emitting elements 10 are provided on a surface 102R of the second substrate 102 so as to surround the opening 140. The surface 102R of the second substrate 102 faces the inner wall surface of the housing 100.

[0059] Fig. 13 is a view of third substrate 103 viewed from the positive direction of the Z axis. In Fig. 13, solid lines indicate components provided on surface 103F of third substrate 103 facing the positive direction of the Z axis, and dashed lines indicate components provided on surface 103R of third substrate 103 facing the negative direction of the Z axis.

[0060] 13, in a plan view seen from the positive direction of the Z axis, the third substrate 103 has a rectangular shape having a side 103a, a side 103b longer than the side 103a, a side 103c facing the side 103a, and a side 103d facing the side 103b. The second processor 40, the power supply circuit 41, the switch circuit 42, the charging circuit 43, the connector 60, the connector 71, and the connector 72 are provided on a surface 103F of the third substrate 103. The surface 103F of the third substrate 103 faces the battery 70.

[0061] A connector 85 is provided on a surface 103R of the third substrate 103. The surface 103R of the third substrate 103 faces a surface 101F of the first substrate 101.

[0062] Fig. 14 is a view of fourth substrate 104 viewed from the positive direction of the Z axis. In Fig. 14, solid lines indicate components provided on surface 104F of fourth substrate 104 facing the positive direction of the Z axis, and dashed lines indicate components provided on surface 104R of fourth substrate 104 facing the negative direction of the Z axis.

[0063] As shown in Figure 14, in a plan view from the positive direction of the Z axis, the fourth substrate 104 has a rectangular shape having a side 104a, a side 104b that is longer than side 104a, a side 104c opposite side 104a, and a side 104d opposite side 104b.

[0064] An operation unit 32, a light emitting module 33, a buzzer 34, and a connector 86 are provided on a surface 104F of the fourth substrate 104. The operation unit 32 is provided on the surface 104F of the fourth substrate 104 at a position overlapping with a virtual line VL equidistant from the sides 104b and 104d. That is, the operation unit 32 is disposed in the center of the fourth substrate 104 in the short side direction. The operation unit 32 is, for example, a button that is physically displaced when pressed by a user. The operation unit 32 may also be a capacitive button.

[0065] The surface 104F of the fourth substrate 104 faces the inner wall surface of the housing 100 and the display module 50.

[0066] A wireless communication module 31 and a connector 87 are provided on the surface 104R of the fourth substrate 104. The wireless communication module 31 is provided in an end region of the surface 104R of the fourth substrate 104. When the entire area of ​​the surface 104R of the fourth substrate 104 is divided into three regions of equal area by two line segments parallel to the side 104a, the end region is the region closest to the side 104a. The surface 104R of the fourth substrate 104 faces the battery 70.

[0067] Figure 15 is a view of multiple light-emitting elements 10, wavelength-tunable filter 20, light-receiving element 21, opening 140, first processor 30, wireless communication module 31, operation unit 32, power supply circuit 41, display module 50 and fourth substrate 104 viewed from the positive direction of the Z axis.

[0068] As shown in FIG. 15, in the Z-axis direction, the opening 140 of the second substrate 102, the wavelength tunable frame The tunable filter 20 and the light receiving element 21 overlap, and the multiple light emitting elements 10 are positioned to surround the opening 140. That is, the opening 140 and the tunable filter 20 overlap on the optical axis of the light receiving element 21, and the multiple light emitting elements 10 are positioned to surround the optical axis of the light receiving element 21. Therefore, light emitted from the multiple light emitting elements 10 is reflected by the image IMG, and the reflected light passes through the opening 140 and enters the tunable filter 20. Then, light of a predetermined wavelength that has passed through the tunable filter 20 enters the light receiving element 21. In this way, by arranging the components of the optical system overlapping in the Z-axis direction, the space required for the optical system is reduced, and the housing 100 can be made smaller.

[0069] 15, the operation unit 32 and the area A1 in which the multiple light-emitting elements 10 are arranged are provided at positions overlapping on the optical axis of the light-receiving element 21. Therefore, when a user operates the operation unit 32, a force is applied straight to the optical axis of the light-receiving element 21, so that the optical axis of the light-receiving element 21 is less likely to blur or shift relative to the image IMG. In this embodiment, the multiple light-emitting elements 10 are provided on the surface 102R of the second substrate 102 so as to surround the opening 140, and therefore the area A1 is the area of ​​the smallest circle that includes the arrangement areas of the multiple light-emitting elements 10.

[0070] 15, the display module 50 and the wireless communication module 31 do not overlap in the Z-axis direction perpendicular to the surface 101R of the fourth substrate 104 on which the wireless communication module 31 is provided. This reduces the risk that the reception sensitivity of the wireless communication module 31 will be reduced by the display module 50.

[0071] 15, in the Z-axis direction, the first processor 30 and the light receiving element 21 do not overlap with the power supply circuit 41. This reduces the risk that the characteristics of the light receiving element 21 will change due to heat generated by the power supply circuit 41, and improves the heat dissipation of the power supply circuit 41, the first processor 30, and the light receiving element 21, which are heat sources.

[0072] 4. Effects The image processing device 1 of this embodiment is equipped with a battery 70, and various measures have been taken regarding the arrangement of each component in order to solve at least one of the various problems that arise due to the fact that the image processing device 1 is portable and can operate independently.

[0073] One of the issues is to reduce the risk of malfunctions caused by heat generated in the narrow space inside the small housing 100. In the image processing device 1 of this embodiment, the light receiving element 21 and the first processor 30, which can operate during the image processing period and become heat sources, are arranged on the first board 101. In addition, the multiple light emitting elements 10 and the light emitting element drive circuit 11, which can operate during the image processing period and become heat sources, are arranged on the second board 102. In addition, the power supply circuit 41 and the second processor 40, which can operate during the image processing period and become heat sources, are arranged on the third board 103. In this way, in the image processing device 1 of this embodiment, each component that can become a heat source is distributed and provided on the first board 101, the second board 102, and the third board 103, so that the mutual thermal influence can be reduced and the operation can be stabilized.

[0074] Furthermore, since the power supply circuit 41 does not overlap with the light receiving element 21 in the Z-axis direction, the risk of the characteristics of the light receiving element 21 changing due to heat generated by the power supply circuit 41 is reduced, and the heat dissipation properties of each of the power supply circuit 41 and the light receiving element 21 are improved. Therefore, according to the image processing device 1, the risk of a decrease in the accuracy of image processing performed based on the amount of light received by the light receiving element 21 is reduced, and the device can operate continuously for a long period of time while maintaining a constant quality.

[0075] In addition, according to the image processing device 1, the first processor 30, which may be a heat source, does not overlap with the power supply circuit 41 in the Z-axis direction. This improves the heat dissipation of each.

[0076] Furthermore, in the image processing device 1, the wireless communication module 31 is provided on a fourth board 104 separate from the first board 101, the second board 102, and the third board 103 on which the light receiving element 21, the plurality of light emitting elements 10, and the power supply circuit 41, which may be heat sources, are provided, respectively. Therefore, according to the image processing device 1, the wireless communication module 31, which requires stable operation, is less likely to malfunction due to the influence of heat.

[0077] Furthermore, in the image processing device 1, the battery 70 located between the first board 101, the second board 102, the third board 103 and the fourth board 104 acts as a thermal barrier, making it difficult for heat generated by the first board 101, the second board 102 and the third board 103 to be transmitted to the fourth board 104. Therefore, according to the image processing device 1, the wireless communication module 31 provided on the fourth board 104 is less susceptible to the effects of a sudden rise in temperature of the first board 101, the second board 102 and the third board 103 that accompanies image processing, and stable communication quality can be ensured.

[0078] 5, in the image processing device 1, the cross-sectional area of ​​the battery 70 facing the first substrate 101, the second substrate 102, and the third substrate 103 is small, and therefore the gap between the battery 70 and the first substrate 101, the second substrate 102, and the third substrate 103 is large compared to the case where a rectangular parallelepiped battery is arranged. Therefore, according to the image processing device 1, heat from the first substrate 101, the second substrate 102, and the third substrate 103 on which the light receiving element 21, the plurality of light emitting elements 10, and the power supply circuit 41, which may be heat sources, are provided, is easily diffused, and heat dissipation is improved.

[0079] In addition, the fourth board 104 is provided with the wireless communication module 31 and the light emitting module 33, which generate little heat because they operate only for a short period of time when necessary, and the operation unit 32 and the buzzer 34, which generate almost no heat. Therefore, although the fourth board 104 generates heat to relay a display signal to the display module 50 during the image processing period, at least one of the first board 101, the second board 102, and the third board 103 generates more heat than the fourth board 104. In reality, unless a special situation occurs, such as frequent wireless communication, the first board 101, the second board 102, and the third board 103 all generate more heat than the fourth board 104. In this way, in the image processing device 1, the components that generate a relatively large amount of heat are arranged on the first board 101, the second board 102, and the third board 103, which have high heat dissipation properties, and the components that generate a relatively small amount of heat are arranged on the fourth board 104, which is less susceptible to the effects of heat. Therefore, according to the image processing device 1, it is possible to improve heat dissipation while ensuring the capacity of the battery 70, and therefore it is possible to operate continuously for a long time while ensuring a certain quality.

[0080] Furthermore, according to the image processing device 1, the first processor 30, which can be a heat source, is provided on the first board 101, which has good heat dissipation properties, so that the image processing device 1 can operate continuously for a long period of time while maintaining a certain level of quality.

[0081] Furthermore, according to the image processing device 1, the second processor 40, which can be a heat source, is provided on the third board 103, which has good heat dissipation properties, so that the image processing device 1 can operate continuously for a long period of time while maintaining a certain level of quality.

[0082] One of the challenges is to achieve good noise resistance and responsiveness. In the image processing device 1 of this embodiment, the first processor 30 that performs image processing is provided on the first board 101 on which the light receiving element 21 is provided, so that the signal output from the light receiving element 21 propagates to the first processor 30 without passing through the second board 102, the third board 103, and the fourth board 104. Therefore, the image processing device 1 can achieve good noise resistance and responsiveness.

[0083] In addition, in the image processing device 1, the second processor 40 that controls the power supply is provided on the third board 103 on which the power supply circuit 41 is provided, so that the signal output from the second processor 40 is transmitted to the power supply circuit 41 without passing through another board. Therefore, the image processing device 1 can achieve good noise resistance and responsiveness.

[0084] Furthermore, according to the image processing device 1, the wireless communication module 31 is arranged in the end region of the long side of the fourth substrate 104, where the distance to the inner wall surface of the housing 100 is small, and therefore the communication sensitivity can be improved without being affected by noise.

[0085] Furthermore, according to the image processing device 1, the light receiving element 21, the multiple light emitting elements 10, the power supply circuit 41, the wireless communication module 31, and the operation unit 32 are provided on different boards, so that mutual interference of heat, vibration, signals, etc. is reduced, and operation can be stabilized. Therefore, according to the image processing device 1, the risk of deterioration in image processing accuracy due to mutual interference of heat, vibration, signals, etc. between the multiple components is reduced, and it is possible to operate continuously for a long time while ensuring a certain quality.

[0086] Furthermore, in the image processing device 1, the wiring path from the third board 103 to the first board 101 is short, so that the amount of drop in the voltage V3 supplied from the power supply circuit 41 arranged on the third board 103 to the first board 101 is small. Therefore, according to the image processing device 1, a stable voltage is supplied to the light receiving element 21 arranged on the first board 101, so that the risk of a decrease in the accuracy of image processing is reduced.

[0087] Furthermore, according to the image processing device 1, the wiring path between the light receiving element 21 and the photoelectric conversion circuit 22 is shortened, and the effect of noise on minute signals is reduced, reducing the risk of a decrease in the accuracy of image processing.

[0088] Furthermore, according to the image processing device 1, the wireless communication module 31 does not overlap the display module 50 in the direction perpendicular to the fourth substrate 104, so that the risk of the reception sensitivity being reduced by the display module 50 is reduced.

[0089] One of the issues is to improve the operability and convenience for the user. In the image processing device 1 of this embodiment, in the Z-axis direction, the first board 101 is provided between the third board 103 and the second board 102, the third board 103 is provided between the battery 70 and the first board 101, the battery 70 is located between the third board 103 and the fourth board 104, and the battery 70 overlaps the third board 103. Therefore, according to the image processing device 1, the second board 102, the first board 101, the third board 103, the battery 70, and the fourth board 104 are arranged overlapping in this order, so that the widths in the X-axis direction and the Y-axis direction of the housing 100 can be made smaller than the height in the Z-axis direction. Therefore, the user can easily recognize the position of the light receiving element 21, and the operability of the image processing device 1 is improved.

[0090] Furthermore, according to the image processing device 1, the opening 140 of the second substrate 102, the wavelength-variable filter 20, and the light receiving element 21 overlap in the Z-axis direction, and the multiple light-emitting elements 10 are positioned to surround the opening 140, thereby reducing the space required for arranging the optical system, and thereby making it possible to miniaturize the housing 100.

[0091] In addition, in the image processing device 1, the operation unit 32 and the buzzer 34, which hardly generate heat, and the light emitting module 33, which generates a small amount of heat, hardly affect the communication quality, so by arranging the operation unit 32, the buzzer 34, and the light emitting module 33 on the fourth board 104 on which the wireless communication module 31 is arranged, the area of ​​the fourth board 104 is effectively utilized. Since the display module 50, which generates less heat than the plate 101, the second substrate 102, and the third substrate 103, has less impact on communication quality, the fourth substrate 104 on which the wireless communication module 31 is arranged is also used as a relay substrate that relays display signals to the display module 50. Therefore, according to the image processing device 1, it is possible to reduce the size of the housing 100, and the operability for the user can be improved.

[0092] Moreover, in the image processing device 1, the second substrate 102 on which the light emitting element 10 is provided is fixed to the first substrate 101 on which the light receiving element 21 is provided, and the first substrate 101 is fixed to the housing 100. Therefore, according to the image processing device 1, even if a large force is applied when the user operates the operation unit 32, the relative positions of the light receiving element 21 and the light emitting element 10 are unlikely to shift, thereby reducing the risk of a decrease in the accuracy of image processing.

[0093] Also, according to the image processing device 1, the first substrate 101 and the second substrate 102 are firmly fixed by the engagement of the connector 82 and the connector 83, so that the relative positions of the light receiving element 21 and the light emitting element 10 are less likely to shift. Furthermore, according to the image processing device 1, the first substrate 101 and the second substrate 102 are electrically connected by the engagement of the connector 82 and the connector 83, so that the distance between the first substrate 101 and the second substrate 102 is shortened, so that the housing 100 can be made smaller, and the operability for the user can be improved.

[0094] Furthermore, in the image processing device 1, the operation unit 32 provided on the fourth substrate 104, the area A1 of the second substrate 102 in which the multiple light emitting elements 10 are arranged, and the light receiving element 21 overlap on the optical axis of the light receiving element 21, so that when a user operates the operation unit 32, a force is applied straight to the optical axis of the light receiving element 21. Therefore, according to the image processing device 1, when a user operates the operation unit 32, the optical axis of the light receiving element 21 is less likely to blur or shift relative to the image IMG to be processed, improving the probability of acquiring normal data.

[0095] For example, if the operating unit 32 is a button that physically displaces, the operating unit 32 is physically displaced by the user's operation, so that it is possible to reliably recognize that the user has performed an operation. However, although a large force is applied by the user's operation, the optical axis of the light receiving element 21 is less likely to shake or shift.

[0096] Also, for example, if the operation unit 32 is a capacitive button, the operation is detected when the user touches the operation unit 32, so the force applied by the user's operation is small and the optical axis of the light receiving element 21 is less likely to shake or shift.

[0097] Moreover, according to the image processing device 1, the operation unit 32 is disposed in the center of the short side direction of the fourth substrate 104, which makes it easier for the user to operate, improving operability. Furthermore, because of the improved operability, when the user operates the operation unit 32, blurring or deviation is less likely to occur in the optical axis of the light receiving element 21 relative to the image IMG to be processed.

[0098] Furthermore, according to the image processing device 1, the user can recognize that he or she has operated the operation unit 32 from the light-emitting state of the light-emitting module 33 without applying more force than necessary, thereby reducing the amount of blurring or deviation of the optical axis of the light-receiving element 21 and improving the probability of acquiring normal data.

[0099] Furthermore, according to the image processing device 1, the user can recognize that an operational error has occurred by the buzzer sound and quickly try again to operate the operation unit 32, thereby improving user convenience.

[0100] In addition, the image processing device 1 can operate independently without receiving instructions from other devices. Moreover, since it is portable, it is highly convenient for the user.

[0101] One of the issues is to improve maintainability. In the image processing device 1 of the present embodiment, the light receiving element 21, the plurality of light emitting elements 10, the power supply circuit 41, the wireless communication module 31, and the operation unit 32 are provided on different boards. Therefore, according to the image processing device 1 of the present embodiment, when any one of the light receiving element 21, the plurality of light emitting elements 10, the power supply circuit 41, the wireless communication module 31, and the operation unit 32 breaks down, it is only necessary to replace one board, and there is no need to replace the other three boards, so that maintainability is good.

[0102] Furthermore, according to the image processing device 1, the second substrate 102 is provided with a light-emitting element driving circuit 11 and a plurality of light-emitting elements 10. Therefore, if at least one of these fails, the second substrate 102 can be replaced with a substrate that combines another light-emitting element driving circuit and another light-emitting element and whose characteristics have been inspected, making maintenance easy.

[0103] Furthermore, according to the image processing device 1, the light receiving element 21 and the photoelectric conversion circuit 22 are provided on the sub-substrate 113 of the first substrate 101. Therefore, if at least one of these fails, the sub-substrate 113 of the first substrate 101 can be replaced with a substrate that combines another light receiving element and another photoelectric circuit light emitting element and whose characteristics have been inspected, resulting in good maintainability.

[0104] As described above, the image processing device 1 of the present embodiment is provided with the battery 70, and is capable of being carried around and operating independently, making it possible to solve at least one of the various problems that tend to arise.

[0105] The present invention is not limited to the present embodiment, and various modifications are possible within the scope of the present invention.

[0106] For example, in the above embodiment, a color measurement device is given as an example of an image processing device according to the present invention, but the present invention can be applied to various image processing devices having an image processing function other than a color measurement device. Examples of image processing devices to which the present invention can be applied include mobile terminals such as smartphones, portable printers, portable scanners, portable display devices, digital cameras, etc.

[0107] Although the present embodiment and the modified examples have been described above, the present invention is not limited to these embodiments and modified examples, and can be embodied in various forms without departing from the spirit of the present invention. For example, the above-described embodiments and modified examples can be appropriately combined.

[0108] The present invention includes configurations that are substantially the same as the configurations described in the embodiments, for example, configurations that have the same functions, methods, and results, or configurations that have the same purpose and effect. The present invention also includes configurations in which non-essential parts of the configurations described in the embodiments are replaced. The present invention also includes configurations that have the same effects as the configurations described in the embodiments, or that can achieve the same purpose. The present invention also includes configurations in which publicly known technology is added to the configurations described in the embodiments.

[0109] The following can be derived from the above-described embodiment and modifications.

[0110] One aspect of the image processing device is A light receiving element; A light-emitting element; Battery and a power supply circuit electrically connected to the battery; An operation unit; A wireless communication module; A first substrate on which the light receiving element is provided; A second substrate on which the light emitting element is provided; a third substrate on which the power supply circuit is provided; a fourth substrate on which the wireless communication module and the operation unit are provided; a housing for housing the first substrate, the second substrate, the third substrate, and the fourth substrate; having the second substrate is fixed to the first substrate, The first substrate is fixed to the housing.

[0111] In this image processing device, the light receiving element, the light emitting element, the power supply circuit, the wireless communication module, and the operation unit are each provided on a different board, so that mutual interference of heat, vibration, signals, etc. is reduced, and operation can be stabilized. Therefore, with this image processing device, the risk of image processing accuracy being reduced due to mutual interference of heat, vibration, signals, etc. between multiple components is reduced, and the device can operate continuously for a long period of time while maintaining a certain level of quality. Furthermore, with this image processing device, if any one of the light receiving element, the light emitting element, the power supply circuit, the wireless communication module, and the operation unit breaks down, it is only necessary to replace one board, and there is no need to replace the other three boards, so that maintenance is easy.

[0112] In addition, according to this image processing device, the second substrate on which the light-emitting element is provided is fixed to the first substrate on which the light-receiving element is provided, so that even if a large force is applied by the user when operating the operating unit, the relative positions of the light-receiving element and the light-emitting element are unlikely to shift, thereby reducing the risk of a decrease in the accuracy of image processing.

[0113] In one aspect of the image processing device, The first board is provided with a first connector, The second board is provided with a second connector; The second substrate may be fixed to the first substrate and the first substrate may be electrically connected to the second substrate by mating the first connector and the second connector.

[0114] According to this image processing device, the first and second boards are firmly fixed by the engagement of the first and second connectors, so that the relative positions of the light receiving element and the light emitting element are less likely to shift. Furthermore, according to this image processing device, the first and second boards are electrically connected by the engagement of the first and second connectors, so that the distance between the first and second boards is shortened, which allows the housing to be made smaller and improves user operability.

[0115] In one aspect of the image processing device, A wiring path from the third substrate to the first substrate may be shorter than a wiring path from the third substrate to the fourth substrate.

[0116] In this image processing device, the wiring path from the third board to the first board is short, so the voltage drop supplied from the power supply circuit arranged on the third board to the first board is small. Therefore, according to this image processing device, a stable voltage is supplied to the light receiving element arranged on the first board, reducing the risk of a decrease in the accuracy of image processing.

[0117] One aspect of the image processing device is a light emitting element drive circuit for driving the light emitting element; The light-emitting element drive circuit may be provided on the second substrate.

[0118] According to this image processing device, the second substrate is provided with a light-emitting element driving circuit and a light-emitting element, so that if at least one of these fails, the second substrate can be replaced with a substrate that combines another light-emitting element driving circuit and another light-emitting element and whose characteristics have been inspected, making it easy to maintain.

[0119] One aspect of the image processing device is a photoelectric conversion circuit for converting the amount of light received by the light receiving element into an electrical signal; The photoelectric conversion circuit may be provided on the first substrate.

[0120] According to this image processing device, the wiring path between the light receiving element and the photoelectric conversion circuit is short, and the effect of noise on the minute signal is reduced, so that the risk of a decrease in the accuracy of image processing is reduced. Also, according to this image processing device, since the light receiving element and the photoelectric conversion circuit are provided on the first board, if at least one of them breaks down, the first board can be replaced with a board that combines another light receiving element and another photoelectric circuit light emitting element and has been inspected for its characteristics, so that the image processing device is easy to maintain. [Explanation of symbols]

[0121] 1...image processing device, 10...light emitting element, 11...light emitting element driving circuit, 20...wavelength tunable filter, 21...light receiving element, 22...photoelectric conversion circuit, 23...amplification circuit, 24...C / V conversion circuit, 25...amplification circuit, 26...boosting conversion circuit, 30...first processor, 31...wireless communication module, 32...operation unit, 33...light emitting module, 34...buzzer, 40...second processor, 41...power supply circuit, 42...switch circuit, 43...charging circuit, 50...display module, 51...cable, 60...connector, 70...battery, 71,72...connector, 81,82,83,84,85,86,87...connector, 91,92...flexible flat cable, 100...housing, 101...first board, 101a,101b,101c,101d...first board side, 101F, 101R... surface of the first substrate, 102... second substrate, 102a, 102b, 102c, 102d... side of the second substrate, 102F, 102R... surface of the second substrate, 103... third substrate, 103a, 103b, 103c, 103d... side of the third substrate, 103F, 103R... surface of the third substrate, 104... fourth substrate, 104a, 104b, 104c, 104d... side of the fourth substrate , 104F, 104R... surface of fourth board, 111... main board, 111a, 111b, 111c, 111d... sides of main board, 111F, 111R... surface of main board, 112... spacer board, 113... sub-board, 1113, 113R... surface of sub-board, 120... opening, 121, 122, 123, 124, 125... screw holes, 133, 132... screws, 140... opening

Claims

1. A light receiving element; A light-emitting element; Battery and a power supply circuit electrically connected to the battery; An operation unit; A wireless communication module; a first substrate on which the light receiving element is provided; A second substrate on which the light emitting element is provided; a third substrate on which the power supply circuit is provided; a fourth substrate on which the wireless communication module and the operation unit are provided; a housing for housing the first board, the second board, the third board, and the fourth board; having the second substrate is fixed to the first substrate in a replaceable manner; The image processing device, wherein the first substrate is fixed to the housing.

2. The first board is provided with a first connector, The second board is provided with a second connector; 2. The image processing device according to claim 1, wherein the second substrate is fixed to the first substrate and the first substrate is electrically connected to the second substrate by engaging the first connector with the second connector.

3. 3 . The image processing device according to claim 1 , wherein a wiring path from the third board to the first board is shorter than a wiring path from the third board to the fourth board. 4 .

4. a light emitting element drive circuit for driving the light emitting element; 4. The image processing device according to claim 1, wherein the light emitting element drive circuit is provided on the second substrate.

5. a photoelectric conversion circuit for converting the amount of light received by the light receiving element into an electrical signal; 5. The image processing device according to claim 1, wherein the photoelectric conversion circuit is provided on the first substrate.

Images