Light-emitting device, light-emitting device array, and display device

Abstract

[Problem] To provide a light-emitting element, a light-emitting element array, and a display device, which have high reliability and high light extraction efficiency. [Solution] A light-emitting element according to the present invention is provided with: a base material; a fluorescent body layer; a first sealing film; a second sealing film; and an excitation light source. The base material has a first main surface and a second main surface opposite to the first main surface, and a through-hole is provided between the first main surface and the second main surface. The fluorescent body layer contains a fluorescent body and is housed in the through-hole. The first sealing film has a gas barrier property, and is provided to the first main surface side of the fluorescent body layer. The second sealing film has a gas barrier property, and is provided to the second main surface side of the fluorescent body layer. The excitation light source is joined to the first main surface side of the base material, and causes excitation light to enter the fluorescent body layer.

Description

[Technical Field]

[0001] The present technology relates to a light-emitting element, a light-emitting element array, and a display device that include an excitation light source and a phosphor. [Background technology]

[0002] Light-emitting elements that include an excitation light source such as an LED (Light Emitting Diode) and a phosphor are used in display devices, etc. In recent years, quantum dots (QDs) have been attracting attention as phosphors, but because QDs are susceptible to deterioration due to oxygen and water, how they are sealed is important.

[0003] For example, Patent Documents 1 and 2 disclose a QD sheet used in a liquid crystal display device in which a QD layer is sandwiched between barrier films, and Patent Document 3 discloses a configuration in which the QD layer is sealed with glass frit for each LED.

[0004] Furthermore, Patent Documents 4 and 5 disclose a configuration in which an LED is embedded in a reflector together with a QD layer. Patent Document 6 discloses a configuration in which individual QD particles or multiple QD particles are encapsulated in a sealing film such as SiO2. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Publication No. 2018-13724 [Patent Document 2] Japanese Patent Application Laid-Open No. 2017-121745 [Patent Document 3] Special Publication No. 2018-532256 [Patent Document 4] Japanese Patent Application Publication No. 2018-186232 [Patent Document 5] Japanese Patent Application Laid-Open No. 2015-220330 [Patent Document 6] Special Publication No. 2013-505347 Summary of the Invention [Problem to be solved by the invention]

[0006] However, as described in Patent Documents 1 and 2, when a QD sheet with a QD layer sandwiched between barrier films is used in a pixel-by-pixel driving system, crosstalk (mixing of light between adjacent light-emitting elements) occurs because the QD sheet is not separated for each pixel. Furthermore, as described in Patent Document 3, sealing the QD layer for each LED with glass frit requires a glass thickness of 100 μm or more, making miniaturization difficult. Furthermore, since a mirror structure cannot be formed on the sidewall of the QD layer, crosstalk between each light-emitting element cannot be suppressed, and light extraction efficiency is low.

[0007] Furthermore, in the configuration in which an LED is embedded in a reflector together with a QD layer, as described in Patent Documents 4 and 5, the size of the light-emitting element becomes larger than that of the LED, and is not suitable for display devices that independently drive an excitation light source for each subpixel. Also, in the configuration in which QDs are sealed particle by particle, as described in Patent Document 6, the volume density of the sealing film becomes larger than that of a method in which the entire QD layer is sealed, and the volume density of the QDs becomes smaller, making it unsuitable for miniaturizing the device.

[0008] As such, no QD encapsulation method has been proposed that achieves both miniaturization of light-emitting elements and high light extraction efficiency, making it suitable for displays that drive excitation light sources independently for each subpixel.In addition, many phosphors other than QDs also require encapsulation to prevent degradation, and appropriate encapsulation methods for phosphors are needed.

[0009] In view of the above circumstances, an object of the present technology is to provide a light-emitting element, a light-emitting element array, and a display device that are highly reliable and have high light extraction efficiency. [Means for solving the problem]

[0010] In order to achieve the above object, a light-emitting element according to an embodiment of the present technology includes a base material, a phosphor layer, a first sealing film, a second sealing film, and an excitation light source. The substrate has a first main surface and a second main surface opposite to the first main surface, and a through hole is provided between the first main surface and the second main surface. The phosphor layer is accommodated in the through-hole and contains a phosphor. The first sealing film has gas barrier properties and is provided on the first main surface side of the phosphor layer. The second sealing film has gas barrier properties and is provided on the second main surface side of the phosphor layer. The excitation light source is bonded to the first main surface side of the base material, and emits excitation light to the phosphor layer.

[0011] According to this configuration, the phosphor layer is sealed by the first sealing film and the second sealing film, which can prevent the phosphor from being deteriorated by oxygen or moisture. Furthermore, the excitation light source can be disposed close to the phosphor layer, which can improve the light extraction efficiency. Furthermore, the phosphor layer is housed in a through-hole provided in the substrate, which can prevent crosstalk with adjacent light-emitting elements.

[0012] The first sealing film may be further provided on an inner circumferential surface of the through-hole, and together with the second sealing film, may cover the entire periphery of the phosphor layer.

[0013] The light emitting element may further include a light reflecting film provided between the inner circumferential surface and the first sealing film.

[0014] The light emitting element may further include a light reflecting film having gas barrier properties, provided on the inner circumferential surface, and covering the entire periphery of the phosphor layer together with the first sealing film and the second sealing film.

[0015] The base material may have gas barrier properties and may cover the entire periphery of the phosphor layer together with the first sealing film and the second sealing film.

[0016] The surface of the base material that forms the inner circumferential surface may be light reflective.

[0017] The through hole may have a shape in which the distance between the inner circumferential surfaces gradually increases from the first main surface toward the second main surface.

[0018] The phosphor may be a quantum dot.

[0019] The phosphor layer may be configured by dispersing the phosphor and a scattering material in a light-transmitting resin.

[0020] The light-emitting device may further include an etching stop layer provided between the substrate and the light-reflecting film.

[0021] the first sealing film has a thickness that allows the excitation light to pass through and the fluorescence to be reflected; The second sealing film may have a thickness that allows the fluorescence to pass through and reflects the excitation light.

[0022] The light emitting device may further include a lens bonded to the second main surface side of the substrate.

[0023] A light-emitting element array according to one embodiment of the present technology includes an array of light-emitting elements, each light-emitting element including: a base having a first main surface and a second main surface opposite to the first main surface, with a through hole provided between the first main surface and the second main surface; a phosphor layer contained in the through hole and containing a phosphor; a first sealing film having gas barrier properties and provided on the first main surface side of the phosphor layer; a second sealing film having gas barrier properties and provided on the second main surface side of the phosphor layer; and an excitation light source bonded to the first main surface side of the base and causing excitation light to be incident on the phosphor layer.

[0024] The light-emitting elements may include a first light-emitting element in which the phosphor layer includes a first phosphor that emits fluorescence of a first color, and a second light-emitting element in which the phosphor layer includes a second phosphor that emits fluorescence of a second color different from the first color.

[0025] the light-emitting element, wherein the phosphor layer includes a first phosphor that emits fluorescence of a first color and a second phosphor that emits fluorescence of a second color different from the first color; The light-emitting element array may further include a first color filter bonded to the second main surface side of the substrate and transmitting light of the first color, and a second color filter bonded to the second main surface side of the substrate and transmitting light of the second color.

[0026] A display device according to an embodiment of the present technology includes a light-emitting element array and a drive circuit. The light-emitting element array is an array of light-emitting elements, each of which includes a base having a first main surface and a second main surface opposite to the first main surface, with a through hole provided between the first main surface and the second main surface, a phosphor layer contained in the through hole and containing a phosphor, a first sealing film having gas barrier properties and provided on the first main surface side of the phosphor layer, a second sealing film having gas barrier properties and provided on the second main surface side of the phosphor layer, and an excitation light source bonded to the first main surface side of the base and irradiating excitation light onto the phosphor layer. The drive circuit drives the excitation light source. [Brief explanation of the drawings]

[0027] [Figure 1] 1 is a cross-sectional view of a light-emitting device according to an embodiment of the present technology. [Figure 2] FIG. 2 is a top view of the light-emitting element. [Figure 3] FIG. 2 is a bottom view of the light-emitting element. [Figure 4] 3 is a cross-sectional view of a light-emitting portion included in the light-emitting element. FIG. [Figure 5] FIG. 3 is a cross-sectional view of a base material included in the light-emitting section. [Figure 6] 3A to 3C are schematic diagrams illustrating the operation of the light-emitting element. [Figure 7] 3A to 3C are schematic diagrams illustrating the operation of the light-emitting element. [Figure 8] 3A to 3C are schematic diagrams illustrating the operation of the light-emitting element. [Figure 9] 3A to 3C are schematic diagrams illustrating a method for manufacturing the light-emitting element. [Figure 10] 3A to 3C are schematic diagrams illustrating a method for manufacturing the light-emitting element. [Figure 11] 3A to 3C are schematic diagrams illustrating a method for manufacturing the light-emitting element. [Figure 12] 3A to 3C are schematic diagrams illustrating a method for manufacturing the light-emitting element. [Figure 13] 4 is a plan view showing the shape of a through hole provided in the light emitting element. FIG. [Figure 14] 4 is a plan view showing the shape of a through hole provided in the light emitting element. FIG. [Figure 15] 10 is a cross-sectional view of a light-emitting device having another configuration according to an embodiment of the present technology. [Figure 16] 10 is a cross-sectional view of a light-emitting device having another configuration according to an embodiment of the present technology. [Figure 17] 10 is a cross-sectional view of a light-emitting device having another configuration according to an embodiment of the present technology. [Figure 18] 10 is a cross-sectional view of a light-emitting device having another configuration according to an embodiment of the present technology. [Figure 19] 3A to 3C are schematic diagrams illustrating a method for manufacturing the light-emitting element. [Figure 20] 10 is a cross-sectional view of a light-emitting device having another configuration according to an embodiment of the present technology. [Figure 21] 1 is a cross-sectional view of a light-emitting element array according to an embodiment of the present technology. [Figure 22] FIG. 10 is a cross-sectional view of a light-emitting element array according to a comparative example of the present technology. [Figure 23] 10 is a cross-sectional view of a light-emitting element array having another configuration according to an embodiment of the present technology. [Figure 24] 1 is a cross-sectional view of a display device according to an embodiment of the present technology. DETAILED DESCRIPTION OF THE INVENTION

[0028] A light-emitting device according to an embodiment of the present technology will be described.

[0029] [Light-emitting element structure] Fig. 1 is a cross-sectional view of a light-emitting device 100 according to this embodiment, Fig. 2 is a top view of the light-emitting device 100, and Fig. 3 is a bottom view of the light-emitting device 100. Fig. 1 is a cross-sectional view taken along line AA in Figs. 2 and 3.

[0030] As shown in these figures, the light-emitting element 100 includes a light-emitting section 110 and an excitation light source 130. The excitation light source 130 is bonded to the light-emitting section 110 by an adhesive layer 140. FIG. 4 is a cross-sectional view showing the light-emitting section 110. As shown in the figure, the light-emitting section 110 includes a base material 111, a phosphor layer 112, a first sealing film 114, a second sealing film 115, and a light-reflecting film 113.

[0031] The substrate 111 is a film-like or plate-like member that houses the phosphor layer 112. The substrate 111 can be made of a resin film made of a resin such as polyimide, a metal foil, a glass plate, or a semiconductor substrate such as a silicon substrate. FIG. 5 is a cross-sectional view showing the substrate 111. In the following description, the thickness direction of the substrate 111 is referred to as the Z direction, and two directions perpendicular to the Z direction are referred to as the X direction and the Z direction.

[0032] As shown in the figure, the base material 111 has a first main surface 111a and a second main surface 111b. The first main surface 111a and the second main surface 111b are main surfaces on opposite sides of the base material 111, and can both be surfaces parallel to the XY plane. The base material 111 is provided with a through-hole 111c that is formed between the first main surface 111a and the second main surface 111b and communicates with the first main surface 111a and the second main surface 111b.

[0033] As shown in Fig. 5, the circumferential surface of the through hole 111c is defined as an inner circumferential surface 111d. The inner circumferential surface 111d is a surface that is inclined with respect to the thickness direction (Z direction) of the substrate 111, and the through hole 111c can have a shape in which the opening gradually becomes larger from the first main surface 111a toward the second main surface 111b. As shown in Fig. 5, the distance D between the inner circumferential surfaces 111d can be gradually larger from the first main surface 111a toward the second main surface 111b. Note that the shape of the through hole 111c can be various shapes, which will be described later, in addition to those shown here.

[0034] 4, the phosphor layer 112 is housed in the through-hole 111c, and is a layer that generates fluorescence when stimulated by excitation light incident from the excitation light source 130. Specifically, the phosphor layer 112 is a layer made of phosphor 121, scatterer 122, and filler 123, and can have a structure in which particulate phosphor 121 and scatterer 122 are dispersed in filler 123.

[0035] The phosphor 121 is a fine particle made of a fluorescent material. The phosphor 121 can be a QD (Quantum Dot), and the material can be InP, CdSe, CdSeS, CdS, ZnSe, ZnS, GaAs, GaN, or perovskite. Furthermore, the phosphor 121 is not limited to a QD, and can also be an organic phosphor or an inorganic phosphor.

[0036] The scatterer 122 scatters the fluorescence emitted from the phosphor 121 and changes the orientation pattern of the fluorescence to a Lambertian pattern. The scatterer 122 can be fine particles made of SiO2, Al2O3, TiO2, or Ta2O3. The filler 123 is filled around the phosphor 121 and the scatterer 122. The filler 123 is a light-transmitting resin, and can be a UV (ultraviolet) curable resin or a thermosetting resin.

[0037] In addition, the filler 123 may be an acrylic resin, polypropylene, polyethylene, polystyrene, AS (Styrene AcryloNitrile copolymer) resin, ABS (Acrylonitrile Butadiene Styrene) resin, methacrylic resin, polyvinyl chloride, polyacetal, polyamide, polycarbonate, modified polyphenylene ether, polybutylene terephthalate, polyethylene terephthalate, polysulfone, polyethersulfone, polyphenylene sulfide, polyamideimide, polymethylpentene, liquid crystal polymer, epoxy resin, phenolic resin, urea resin, melamine resin, diallyl phthalate resin, unsaturated polyester resin, polyimide, polyurethane, silicone resin, or a mixture of these.

[0038] The phosphor layer 112 is not limited to one consisting of the phosphor 121, the scatterer 122, and the filler 123, but may be one that includes at least the phosphor 121. That is, the phosphor layer 112 may not include the scatterer 122 and may be made up of only the phosphor 121 and the filler 123. The phosphor layer 112 may not include the filler 123 and may be one in which the fine particles of the phosphor 121 and the filler 123 are present in a freely movable state. The phosphor layer 112 may be one in which only the phosphor 121 is present in a freely movable state.

[0039] Light-reflecting film 113 is formed between inner circumferential surface 111d and first sealing film 114 and between second main surface 111b and first sealing film 114, and reflects light emitted from phosphor layer 112 toward second main surface 111b. Light-reflecting film 113 may be a metal film such as Al, Au, or Ag, and may have a thickness of, for example, 100 nm. Light-reflecting film 113 may also be a dielectric multilayer film.

[0040] First sealing film 114 and second sealing film 115 seal phosphor layer 112. As shown in Fig. 4, first sealing film 114 is provided on inner circumferential surface 111d of through-hole 111c with light reflecting film 113 interposed therebetween and on first main surface 111a of phosphor layer 112. Furthermore, first sealing film 114 is provided on second main surface 111b of through-hole 111c with light reflecting film 113 interposed therebetween.

[0041] Second sealing film 115 is provided on the second main surface 111b side of phosphor layer 112 inside through hole 111c, and is provided on the opposite side of first sealing film 114 across phosphor layer 112. Second sealing film 115 is provided on second main surface 111b outside through hole 111c, with light reflecting film 113 and first sealing film 114 interposed between them. As a result, phosphor layer 112 is entirely covered and sealed by first sealing film 114 and second sealing film 115.

[0042] First sealing film 114 and second sealing film 115 are films that are optically transparent and have gas barrier properties, and can be made of, for example, SiO2, SiN, AlN, ZrO2, Ta2O3, or ZnO. First sealing film 114 and second sealing film 115 can be made of the same material or different materials. First sealing film 114 and second sealing film 115 can have a thickness of, for example, 100 nm. Light-emitting unit 110 has the above-mentioned configuration.

[0043] The excitation light source 130 is bonded to the first main surface 111a side of the base material 111, and emits excitation light to the phosphor layer 112. The excitation light source 130 may be an LED (Light Emitting Diode), and may include an n-type layer 131, a p-type layer 132, an active layer 133, an n-electrode 134, and a p-electrode 135, as shown in Fig. 1. Note that the n-type and p-type may be reversed in the excitation light source 130.

[0044] The n-type layer 131, p-type layer 132, and active layer 133 may be made of semiconductor materials such as GaN, AlGaInN, AlGaInAs, AlGaInP, ZnSe, or ZnO doped with a dopant. The n-electrode 134 and p-electrode 135 are made of conductive materials such as AuGe / Ni / Au, Ti / Pt / Au, Pd, Ni / Au, or ITO (Indium Tin Oxide).

[0045] The excitation light source 130 is a light source capable of emitting monochromatic excitation light, and the emission wavelength may be blue light or ultraviolet light. Furthermore, the excitation light source 130 may be any light source capable of emitting excitation light, and may be an OLED (Organic Light Emitting Diode), a laser diode, a VCSEL (Vertical Cavity Surface Emitting Laser), or the like, in addition to an LED.

[0046] The adhesive layer 140 bonds the excitation light source 130 to the light-emitting section 110. There are no particular limitations on the adhesive layer 140 as long as it is optically transparent to the emission wavelength of the excitation light source 130. Furthermore, instead of bonding the excitation light source 130 with the adhesive layer 140, the excitation light source 130 may be joined to the light-emitting section 110 by other methods.

[0047] [Light-emitting element operation] 6 to 8 are schematic diagrams showing the operation of the light-emitting element 100. When power is supplied to the excitation light source 130, light is emitted in the active layer 133, as indicated by the arrows in Fig. 6. This light (hereinafter, excitation light) passes from the excitation light source 130 through the adhesive layer 140 and the first sealing film 114 and enters the phosphor layer 112.

[0048] When excitation light is incident on phosphor 121, fluorescence is generated in phosphor 121, as shown by the arrow in Fig. 7. The fluorescence is scattered by scatterer 122, passes through second sealing film 115, and is emitted forward of light-emitting element 100 (the opposite side to excitation light source 130). Furthermore, as shown in Fig. 8, part of the fluorescence that travels toward inner circumferential surface 111d of through-hole 111c is reflected by light reflecting film 113, passes through second sealing film 115, and is emitted forward of light-emitting element 100.

[0049] [Effects of light-emitting elements] 4, in light-emitting element 100, phosphor layer 112 is entirely covered with first sealing film 114 and second sealing film 115, and each light-emitting element 100 is sealed. First sealing film 114 and second sealing film 115 have gas barrier properties, and prevent oxygen and moisture from reaching phosphor layer 112. This makes it possible to prevent deterioration of phosphor 121 due to oxygen and moisture, and to maintain the reliability of light-emitting element 100.

[0050] Furthermore, while a structure in which an excitation light source is embedded in a phosphor layer is also known in the prior art, in light-emitting element 100, phosphor layer 112 is disposed at a distance from excitation light source 130, which serves as a heat source. This prevents deterioration of phosphor 121 due to heat, and in this respect as well, it is possible to maintain the reliability of light-emitting element 100.

[0051] In this way, the light emitting device 100 can prevent deterioration of the phosphor 121 due to oxygen, moisture, and heat, and therefore can achieve high reliability even with phosphors that may deteriorate, such as QDs and organic phosphors.

[0052] Furthermore, in light-emitting element 100, the thicknesses of first sealing film 114 and second sealing film 115 can be reduced, and excitation light source 130 can be disposed close to phosphor layer 112, thereby realizing miniaturization of light-emitting element 100. Furthermore, when the distance between excitation light source 130 and phosphor layer 112 is small, light diffused and emitted from excitation light source 130 also enters phosphor layer 112, thereby improving the efficiency of light-emitting element 100.

[0053] Furthermore, in the light-emitting element 100, a light-reflecting film 113 is provided on the inner peripheral surface 111d of the through-hole 111c. This allows the light of the fluorescent light that has traveled in the direction of the inner peripheral surface 111d to be emitted forward from the light-emitting element 100, thereby improving efficiency. Furthermore, in the light-emitting element 100, the phosphor layers 112 are separated between adjacent light-emitting elements 100, making it possible to prevent light mixing (crosstalk), as will be described later.

[0054] [Method of manufacturing light-emitting element] A method for manufacturing the light-emitting device 100 will now be described. Figures 9 to 12 are schematic diagrams showing a method for manufacturing the light-emitting device 100.

[0055] As shown in FIG. 9(a), a support layer 151 is formed on the first main surface 111a of the base material 111. The support layer 151 is made of, for example, Ni, and can be formed by sputtering and plating. The thickness of the support layer 151 is, for example, about 500 μm. Furthermore, a mask layer 152 is formed on the second main surface 111b of the base material 111. The mask layer 152 is made of, for example, Cu, and can be formed by sputtering.

[0056] 9(b), the mask layer 152 is patterned. This patterning can be performed by forming a resist pattern on the mask layer 152 by photolithography, and then removing the material of the mask layer 152 by wet etching using the resist pattern.

[0057] 9(c), the base material 111 is patterned by removing the material of the base material 111 by wet etching using the mask layer 152 as a hard mask, thereby forming through-holes 111c.

[0058] In this case, by using an isotropic etchant, it is possible to form through-holes 111c having inclined inner circumferential surfaces 111d as shown in Fig. 9(c). Alternatively, through-holes 111c having inner circumferential surfaces 111d perpendicular to the XY plane may be formed by dry etching.

[0059] 10(a), the mask layer 152 is removed using an etchant that is selective to the material of the support layer 151 so that the support layer 151 is not removed.

[0060] 10(b), a light reflecting film 113 is formed on the support layer 151, the inner circumferential surface 111d, and the second main surface 111b. The light reflecting film 113 can be formed by, for example, a sputtering method. Furthermore, a first sealing film 114 is formed on the light reflecting film 113. The first sealing film 114 can be formed by, for example, a sputtering method.

[0061] 10(c), a phosphor layer 112 is formed in the through-hole 111c. The phosphor layer 112 can be formed by filling the through-hole 111c with a filler 123 in which phosphors 121 and scatterers 122 are dispersed, and then curing the filler.

[0062] 11(a), second sealing film 115 is formed on phosphor layer 112 and first sealing film 114. Second sealing film 115 can be formed by, for example, a sputtering method. In this way, phosphor layer 112 is sealed by first sealing film 114 and second sealing film 115.

[0063] 11(b), a support substrate 153 is bonded onto the second sealing film 115. The support substrate 153 is, for example, a glass substrate, and can be bonded to the second sealing film 115 with an adhesive 154.

[0064] 11(c), the support layer 151 is removed. The support layer 151 can be removed by wet etching. At this time, an etchant having selectivity for the light reflecting film 113 is used.

[0065] 12(a), the light reflecting film 113 is removed from the first main surface 111a. The light reflecting film 113 can be removed by forming a resist pattern having openings that expose only the light reflecting film 113 on the first main surface 111a by photolithography or the like, and then performing wet etching using the resist pattern.

[0066] Next, the support substrate 153 is removed as shown in Fig. 12(b), thereby forming the light-emitting section 110. Furthermore, as shown in Fig. 12(c), the excitation light source 130 is bonded to the light-emitting section 110 with an adhesive layer 140, thereby completing the light-emitting device 100.

[0067] The excitation light source 130 can be fabricated by growing crystals on a sapphire substrate using MOCVD (Metal Organic Chemical Vapor Deposition), and then peeling off the sapphire substrate using laser lift-off (LLO) after the electrode formation process. If the sapphire substrate remains, the distance between the active layer 133 of the excitation light source 130 and the phosphor layer 112 increases, which is not suitable for a display device that drives the excitation light source 130 independently for each subpixel, as the pitch between the subpixels must be small. For this reason, it is preferable to peel off the crystal growth substrate.

[0068] The light-emitting element 100 can be manufactured in the above manner. Although the manufacturing process for one light-emitting element 100 has been described here, it is actually possible to manufacture a light-emitting element array (described later) including a large number of light-emitting elements 100 at once by the above manufacturing process.

[0069] [First and second sealing films] The thickness of first sealing film 114 and second sealing film 115 can be set to a thickness close to the wavelength of light around 100 nm, and by adjusting the refractive index and thickness, it is possible to control the reflectance for each wavelength. As shown in Fig. 4, thickness T1 of first sealing film 114 is preferably a thickness that transmits excitation light and reflects fluorescence. This allows first sealing film 114 to reflect fluorescence incident on first sealing film 114, improving the light extraction efficiency.

[0070] Furthermore, thickness T2 of second sealing film 115 is preferably a thickness that reflects excitation light and transmits fluorescence. This prevents the excitation light from transmitting through phosphor layer 112 and allows the excitation light to be used to excite phosphor 121, thereby improving light extraction efficiency. Furthermore, increasing the reflectance of excitation light from second sealing film 115 suppresses excitation of phosphor layer 112 by external light, and also contributes to improving external light contrast.

[0071] Because adhesive layer 140 has a refractive index of, for example, about 1.5, first sealing film 114 is preferably made of a material with a large refractive index difference therebetween, and can be made of a high-refractive index material such as TiO2. Furthermore, first sealing film 114 and second sealing film 115 can also be multilayer films in which low-refractive index layers and high-refractive index layers are alternately stacked, thereby improving the light extraction efficiency of phosphor layer 112. The low-refractive index layers can be made of, for example, SiO2, and the high-refractive index layers can be made of, for example, TiO2.

[0072] [About the shape of the through hole] The through holes 111c provided in the base material 111 preferably have a configuration in which the inner circumferential surfaces 111d are inclined so that the distance D between the inner circumferential surfaces 111d gradually increases from the first main surface 111a side toward the second main surface 111b side, as shown in Fig. 5. Since the light reflecting film 113 is provided on the inner circumferential surfaces 111d as described above, by inclining the inner circumferential surfaces 111d, incident light is reflected toward the front of the element (see Fig. 8), and light utilization efficiency can be improved.

[0073] 5, the inner circumferential surface 111d may be curved so that the distance D gradually increases from the first main surface 111a toward the second main surface 111b. The inner circumferential surface 111d may be a plane parallel to the thickness direction (Z direction) of the base material 111, and the distance D may be constant from the first main surface 111a toward the second main surface 111b.

[0074] Furthermore, the shapes of the upper and lower surfaces of the through-hole 111c are not limited to squares as shown in Figures 2 and 3. Figures 13 and 14 are schematic diagrams showing other shapes of the through-hole 111c, where Figures 13(a) and 14(a) are plan views of the light-emitting element 100 seen from above, and Figures 13(b) and 14(b) are plan views of the light-emitting element 100 seen from below.

[0075] As shown in FIGS. 13(a) and 13(b), the through-hole 111c may be circular on the first main surface 111a and the second main surface 111b. Also, as shown in FIGS. 14(a) and 14(b), the through-hole 111c may be hexagonal on the first main surface 111a and the second main surface 111b. The through-hole 111c may also have various other shapes, such as rectangular, elliptical, or polygonal, on the first main surface 111a and the second main surface 111b. The through-hole 111c may have different shapes on the first main surface 111a and the second main surface 111b, such as a square on the first main surface 111a and a circle on the second main surface 111b.

[0076] [Other configurations of light-emitting elements] The configuration of the light emitting device 100 is not limited to the above, and the following configurations are also possible: Figures 15 to 20 are schematic diagrams of light emitting device 100 having other configurations.

[0077] 15 , first sealing film 114 may not be provided on inner circumferential surface 111d of through hole 111c, but may be provided on the phosphor layer 112 and first main surface 111a side of base material 111. In this case, by making light-reflecting film 113 a film having gas barrier properties, it becomes possible to use light-reflecting film 113 to seal phosphor layer 112. That is, the entire periphery of phosphor layer 112 is covered with light-reflecting film 113, first sealing film 114, and second sealing film 115, and phosphor layer 112 can be sealed.

[0078] 16, light-emitting element 100 may not have light-reflecting film 113. First sealing film 114 may be provided on phosphor layer 112 and first main surface 111a of base material 111, rather than on inner circumferential surface 111d of through-hole 111c. In this case, base material 111 may have gas barrier properties, thereby enabling base material 111 to be used to seal phosphor layer 112. That is, the entire periphery of phosphor layer 112 is covered with base material 111, first sealing film 114, and second sealing film 115, thereby sealing phosphor layer 112.

[0079] Furthermore, in this configuration, by making the surface of the base material 111 that forms the inner circumferential surface 111d light-reflective, it is possible to reflect light that enters the inner circumferential surface 111d forward of the light-emitting element 100, thereby achieving a function equivalent to that of the light-reflecting film 113.

[0080] 17, the light-emitting element 100 may have a light-shielding portion 141. The light-shielding portion 141 can be formed by removing the first sealing film 114 and the second sealing film 115 around the through-hole 111c on the second main surface 111b and arranging a material that does not have optical transparency. By providing the light-shielding portion 141, it is possible to suppress external light reflection in the region between the light-emitting elements 100 and improve the external light contrast ratio of a display device in which the light-emitting elements 100 are pixels.

[0081] Furthermore, by removing the first sealing film 114 and the second sealing film 115 and providing the light-shielding portion 141, it is possible to prevent light from propagating between adjacent light-emitting elements 100 via the first sealing film 114 and the second sealing film 115, that is, it is possible to suppress crosstalk. Note that the light-shielding portion 141 can also be disposed on the second sealing film 115 without removing the first sealing film 114 and the second sealing film 115.

[0082] 18, the light-emitting element 100 may have an etching stop layer 142. The etching stop layer 142 is made of a material having etching selectivity with the material of the support layer 151 (see FIG. 11(b)), and is provided between the substrate 111 and the light-reflecting film 113. The etching stop layer 142 may be, for example, a dielectric film such as SiO2, AlN, SiN, TiO2, Al2O3, ZnO, or Ta2O3, or a metal film such as Ti, Cr, Au, or Ag.

[0083] 19 is a schematic diagram showing a part of the manufacturing process of the light-emitting element 100 including the etching stop layer 142, and is a schematic diagram showing the step of removing the support layer 151 (see FIGS. 11(b) and (c)). As shown in FIGS. 19(a) and (b), in the step of removing the support layer 151, the light-reflecting film 113 is covered with the etching stop layer 142 and is protected from etching.

[0084] 11(b) and 11(c), if the etching stop layer 142 is not provided, the light reflecting film 113 needs to be made of a material having different etching selectivity from the support layer 151 so that the light reflecting film 113 is not removed when the support layer 151 is removed. However, the light reflecting film 113 needs to have high reflectance for excitation light and fluorescent light, which limits the materials that can be used.

[0085] 19, when the etching stop layer 142 is provided, the light reflecting film 113 is protected from etching, and therefore it is possible to select a material for the support layer 151 without considering the etching selectivity with respect to the light reflecting film 113. Note that the etching stop layer 142 may be provided between the base material 111 and the light reflecting film 113 even when the first sealing film 114 is not provided on the inner circumferential surface 111 as shown in FIG.

[0086] 20, the light-emitting element 100 may also include a lens 143. The lens 143 may be made of resin, glass, or the like, and may be attached to the second main surface 111b side of the substrate 111 with an adhesive 144. In the structure of FIG. 1, the fluorescence is isotropically emitted from the phosphor 121, and is refracted into the air from the second sealing film 115, and has an orientation characteristic close to that of a Lambertian when emitted. On the other hand, by providing the lens 143 as shown in FIG. 20, the emitted light from the light-emitting element 100 is concentrated at a narrow angle forward, and the light distribution characteristic can be optimized in the required direction, thereby improving the light utilization efficiency.

[0087] [About light-emitting element arrays] The light emitting elements 100 can be arranged in an array. Fig. 21 is a cross-sectional view of a light emitting element array 150 in which a plurality of light emitting elements 100 are arranged in an array. As shown in the figure, the light emitting element array 150 includes a red light emitting element 100R, a green light emitting element 100G, and a blue light emitting element 100B.

[0088] The red light emitting element 100R has the configuration of the above-described light emitting element 100, and the phosphor layer 112 contains a red phosphor 121R that emits red fluorescence. The green light emitting element 100G has the configuration of the above-described light emitting element 100, and the phosphor layer 112 contains a green phosphor 121G that emits green fluorescence. The blue light emitting element 100B has the configuration of the above-described light emitting element 100 without the phosphor 121. The red light emitting element 100R, the green light emitting element 100G, and the blue light emitting element 100B can be formed by applying different phosphor layers 112 using an inkjet method.

[0089] In each light-emitting element 100, the excitation light source 130 emits blue excitation light. In the red light-emitting element 100R, when blue excitation light is incident on the light-emitting section 110, red fluorescence is emitted from the red phosphor 121R. In the green light-emitting element 100G, when blue excitation light is incident on the light-emitting section 110, green fluorescence is emitted from the green phosphor 121G. In the blue light-emitting element 100B, when blue light is incident on the light-emitting section 110, it is scattered by the scatterer 122 and blue light is emitted.

[0090] In the light-emitting element array 150, the red light-emitting element 100R, the green light-emitting element 100G, and the blue light-emitting element 100B can emit red, green, and blue light, and a pixel can be formed with each light-emitting element 100 as a subpixel.

[0091] In the light-emitting element array 150, each excitation light source 130 emits blue excitation light, which is converted into red light and green light by the red phosphor 121R and the green phosphor 121G, but this is not limited to this. Some of the light-emitting elements 100 constituting the light-emitting element array 150 may include a first phosphor 121 that emits fluorescence of a first color, and other parts of the light-emitting elements 100 may include a second phosphor 121 that emits fluorescence of a second color.

[0092] Furthermore, the light-emitting element array 150 may further include a third phosphor that emits fluorescence of a third color. For example, the blue light-emitting element 100B may include a blue phosphor that emits blue fluorescence in the phosphor layer 112, and each excitation light source 130 may emit ultraviolet light as excitation light. Furthermore, the light emitted by the light-emitting element array 150 is not limited to three colors, and may be a single color, two colors, or four or more colors. Furthermore, the light-emitting elements 100 that constitute the light-emitting element array 150 may be light-emitting elements 100 having any of the configurations described herein.

[0093] The light emitting element array 150 can prevent crosstalk (mixing) of light. Fig. 22 is a schematic diagram of a light emitting element array 500 having a conventional structure, shown for comparison. As shown in the figure, in the light emitting element array 500, the front and back surfaces of a phosphor layer 511 are sealed with sealing films 512, and a first film 513 and a second film 514 are provided on the outside of the sealing film 512.

[0094] A red color filter 515R, a green color filter 515G, and a blue color filter 515B are provided on the first film 513. A red light source 520R, a green light source 520G, and a blue light source 520B are provided on the second film 514.

[0095] Phosphor layer 511 contains red phosphor 516R and green phosphor 516G. When blue excitation light is emitted from light source 520R, red fluorescence is emitted from red phosphor 516R, and red light is emitted from red color filter 515R. When blue excitation light is emitted from light source 520G, green fluorescence is emitted from green phosphor 516G, and red light is emitted from green color filter 515G. When blue light is emitted from light source 520B, it passes through phosphor layer 511 as is and is emitted as blue light from blue color filter 515B.

[0096] Here, if you want to generate green light, for example, light source 520G emits light (L in the figure). E ), green fluorescence (L in the figure) is emitted from the green phosphor 516G. f1 ) is emitted from the green color filter 515G, and green light L G In addition, fluorescent L f1 A part of the light excites the red phosphor 516 near the red color filter 515R. As a result, red fluorescence (L in the figure) is emitted from the red phosphor 516R. f2 ) is emitted, and a small amount of red light L is emitted from the red color filter 515R. R is released.

[0097] Therefore, even if only the light source 520G is emitting red light L R 21, the fluorescent material layers 112 of each color are separated by the base material 111, and therefore crosstalk can be suppressed.

[0098] Furthermore, in the light-emitting element array 500, light traveling in the horizontal direction (XY direction) is wasted, but in the light-emitting element array 150, light traveling in the horizontal direction is also reflected by the light-reflecting film 113 and is effectively utilized, thereby improving the light extraction efficiency.

[0099] 23 is a cross-sectional view of a light emitting element array 160 having another configuration. As shown in the drawing, the light emitting element array 160 is composed of a red light emitting element 100R, a green light emitting element 100G, and a blue light emitting element 100B.

[0100] The red light emitting element 100R has the same configuration as the light emitting element 100, and the phosphor layer 112 includes a red phosphor 121R that emits red fluorescence and a green phosphor 121G that emits green fluorescence. A red color filter 145R is bonded to the second main surface 111b side of the red light emitting element 100R.

[0101] The green light emitting element 100G has the same configuration as the light emitting element 100, and the phosphor layer 112 includes a red phosphor 121R that emits red fluorescence and a green phosphor 121G that emits green fluorescence. A green color filter 145G is bonded to the second main surface 111b side of the green light emitting element 100G.

[0102] Blue light emitting element 100B has the same configuration as light emitting element 100, and phosphor layer 112 includes red phosphor 121R that emits red fluorescence and green phosphor 121G that emits green fluorescence. A blue color filter 145B is bonded to the second main surface 111b side of blue light emitting element 100B.

[0103] In each light-emitting element 100, excitation light source 130 emits blue excitation light. In red light-emitting element 100R, when blue excitation light is incident on light-emitting section 110, red fluorescence is emitted from red phosphor 121R and green fluorescence is emitted from green phosphor 121G. The red component of the fluorescence passes through red color filter 145R, and red light is emitted from red light-emitting element 100R.

[0104] In green light emitting element 100G, when blue excitation light is incident on light emitting section 110, red fluorescence is emitted from red phosphor 121R and green fluorescence is emitted from green phosphor 121G. The green component of the fluorescence passes through green color filter 145G, and green light is emitted from green light emitting element 100G.

[0105] In blue light emitting element 100B, when blue excitation light is incident on light emitting section 110, red fluorescence is emitted from red phosphor 121R and green fluorescence is emitted from green phosphor 121G. The blue excitation light passes through blue color filter 145B, and blue light is emitted from green light emitting element 100G.

[0106] In this configuration, the phosphor layers 112 of the red light emitting element 100R, the green light emitting element 100G, and the blue light emitting element 100B have the same structure, so there is no need to paint the phosphor layers 112 differently, which reduces manufacturing costs.

[0107] In the light-emitting element array 160, each excitation light source 130 emits blue excitation light, which is converted into red light and green light by the red phosphor 121R and the green phosphor 121G, but this is not limited to this. Each light-emitting element 100 may include a first phosphor 121 that emits fluorescence of a first color and a second phosphor 121 that emits fluorescence of a second color. Furthermore, some light-emitting elements may be equipped with a color filter that transmits fluorescence of the first color, and other light-emitting elements may be equipped with a color filter that transmits fluorescence of the second color.

[0108] Furthermore, the light-emitting element array 160 may further include a third phosphor 121 that emits fluorescence of a third color, and each light-emitting element 100 may include a blue phosphor that emits blue fluorescence in the phosphor layer 112, and each excitation light source 130 may emit ultraviolet light as excitation light. Furthermore, the light emitted by the light-emitting element array 160 is not limited to three colors, and may be a single color, two colors, or four or more colors. Furthermore, the light-emitting elements 100 that constitute the light-emitting element array 160 may be light-emitting elements 100 having any of the configurations described herein.

[0109] [About the display device] A display device using the light emitting element array 150 will be described. Fig. 24 is a cross-sectional view showing a display device 170 using the light emitting element array 150. As shown in the figure, the display device 170 includes the light emitting element array 150 and a drive circuit 180.

[0110] The drive circuit 180 individually drives the light-emitting elements 100 included in the light-emitting element array 150. The drive circuit 180 is a TFT (thin-film-transistor) or a CMOS (Complementary Metal Oxide Semiconductor), and can be made of a material such as Si, GaN, or SiC. The drive circuit 180 has an n-terminal 181 and a p-terminal 182, and the n-terminal 181 is connected to the n-electrode 134 of the excitation light source 130 by a conductor 183, and the p-terminal 182 is connected to the p-electrode 135 of the excitation light source 130 by a conductor 184. The conductor 183 and the conductor are, for example, Au bumps, but may also be Cu-Cu junctions or the like.

[0111] By driving the excitation light sources 130 provided in the red light emitting element 100R, the green light emitting element 100G, and the blue light emitting element 100B using the drive circuit 180, it is possible to emit red, green, and blue light, respectively, thereby realizing a display device. Furthermore, by integrating the light emitting element array 150 and the drive circuit 180, it is possible to realize a miniaturized display device. Note that, although the display device using the light emitting element array 150 has been described above, the light emitting element array 160 and the drive circuit 180 may also be connected to form a display device.

[0112] The display device according to this embodiment can be used as a display device for a video wall, a smartphone, a television, a notebook PC, an AR (Augmented Reality) device, a VR (Virtual Reality) device, a projector, a head-up display, a wearable device, etc. The light-emitting element and the light-emitting element array according to this embodiment can also be used as a lighting device.

[0113] The present technology can also be configured as follows.

[0114] (1) a substrate having a first main surface and a second main surface opposite to the first main surface, with a through hole provided between the first main surface and the second main surface; a phosphor layer accommodated in the through hole and containing a phosphor; a first sealing film having a gas barrier property and provided on the first main surface side of the phosphor layer; a second sealing film having gas barrier properties and provided on the first main surface side of the phosphor layer; an excitation light source bonded to the first main surface side of the base material and configured to emit excitation light to the phosphor layer; A light-emitting device comprising: (2) The light-emitting element according to (1) above, The first sealing film is further provided on an inner peripheral surface of the through hole, and together with the second sealing film, covers the entire periphery of the phosphor layer. Light-emitting element. (3) The light-emitting element according to (2) above, a light-reflecting film provided between the inner circumferential surface and the first sealing film; The light-emitting element further comprises: (4) The light-emitting element according to (1) above, a light-reflecting film having gas barrier properties, provided on the inner peripheral surface, and covering the entire periphery of the phosphor layer together with the first sealing film and the second sealing film; The light-emitting element further comprises: (5) The light-emitting element according to (1) above, 10. The light-emitting device according to claim 1, The substrate has gas barrier properties and covers the entire periphery of the phosphor layer together with the first sealing film and the second sealing film. Light-emitting element. (6) The light-emitting element according to (5) above, The surface of the base material that forms the inner circumferential surface has light reflectivity. Light-emitting element. (7) The light-emitting device according to any one of (3), (4), and (6), The through hole has a shape in which the distance between the inner circumferential surfaces gradually increases from the first main surface toward the second main surface. Light-emitting element. (8) The light-emitting device according to any one of (1) to (7), The phosphor is a quantum dot Light-emitting element. (9) The light-emitting device according to any one of (1) to (8) above, The phosphor layer is made by dispersing the phosphor and scattering material in a light-transmitting resin. Light-emitting element. (10) The light-emitting device according to (3) or (4), The light-reflecting film further includes an etching stop layer provided between the substrate and the light-reflecting film. Light-emitting element. (11) The light-emitting device according to any one of (1) to (10) above, the first sealing film has a thickness that allows the excitation light to pass through and the fluorescence to be reflected; The second sealing film has a thickness that transmits the fluorescent light and reflects the excitation light. Light-emitting element. (12) The light-emitting device according to any one of (1) to (11) above, A lens bonded to the second principal surface side of the substrate The light-emitting element further comprises: (13) a substrate having a first main surface and a second main surface opposite to the first main surface and having a through hole provided between the first main surface and the second main surface; a phosphor layer accommodated in the through hole and containing a phosphor; a first sealing film having gas barrier properties and provided on the first main surface side of the phosphor layer; a second sealing film having gas barrier properties and provided on the second main surface side of the phosphor layer; and an excitation light source bonded to the first main surface side of the substrate and causing excitation light to be incident on the phosphor layer; Light-emitting element array. (14) The light-emitting element array according to (13) above, The light-emitting elements include a first light-emitting element in which the phosphor layer contains a first phosphor that emits fluorescence of a first color, and a second light-emitting element in which the phosphor layer contains a second phosphor that emits fluorescence of a second color different from the first color. Light-emitting element array. (15) The light-emitting element array according to (13) above, the light-emitting element, wherein the phosphor layer includes a first phosphor that emits fluorescence of a first color and a second phosphor that emits fluorescence of a second color different from the first color; a first color filter bonded to the second main surface side of the base material and transmitting light of the first color; a second color filter bonded to the second main surface side of the base material and transmitting light of the second color; The light-emitting element array further comprises: (16) a light-emitting element array in which a plurality of light-emitting elements are arranged, the light-emitting element including: a substrate having a first main surface and a second main surface opposite to the first main surface, and having a through hole provided between the first main surface and the second main surface; a phosphor layer accommodated in the through hole and containing a phosphor; a first sealing film having gas barrier properties and provided on the first main surface side of the phosphor layer; a second sealing film having gas barrier properties and provided on the second main surface side of the phosphor layer; and an excitation light source bonded to the first main surface side of the substrate and causing excitation light to be incident on the phosphor layer; a drive circuit for driving the pumping light source; A display device comprising: [Explanation of symbols]

[0115] 100...Light emitting element 110...Light emitting part 111...Base material 111a...first principal surface 111b…Second main surface 111c...Through hole 111d…Inner peripheral surface 112...phosphor layer 113...Light reflective film 114...First sealing film 115...Second sealing film 121...phosphor 122...Scatterer 123...Filler 130...Excitation light source 141...Light blocking part 142...Etching stop layer 143...Lens 145R...Red color filter 145G...Green color filter 145B...Blue color filter 150, 160...Light emitting element array 160...Light emitting element array 170...display device 180...Drive circuit

Claims

1. A substrate having a first main surface and a second main surface opposite to the first main surface, the substrate having a through hole between the first main surface and the second main surface; a phosphor layer accommodated in the through hole and including a phosphor; a first sealing film having a gas barrier property and provided on the first main surface side of the phosphor layer; a second sealing film having a gas barrier property and provided on the second main surface side of the phosphor layer; an excitation light source that is located outside the through hole on the first main surface side of the base material and that causes excitation light to be incident on the phosphor layer; 、 an adhesive layer located between the first sealing film and the excitation light source and adhering the first sealing film and the excitation light source; A light emitting device comprising:

2. The light emitting device according to claim 1 , The first sealing film is further provided on an inner circumferential surface of the through hole and covers the entire periphery of the phosphor layer together with the second sealing film. Light emitting element.

3. The light-emitting device according to claim 2 , a light reflecting film provided between the inner circumferential surface and the first sealing film; The light emitting device further comprises:

4. The light emitting device according to claim 1 , a light reflecting film having a gas barrier property, provided on an inner peripheral surface of the through hole, and covering the entire periphery of the phosphor layer together with the first sealing film and the second sealing film; The light emitting device further comprises:

5. The light emitting device according to claim 1 , The base material has a gas barrier property and covers the entire periphery of the phosphor layer together with the first sealing film and the second sealing film. Light emitting element.

6. The light-emitting device according to claim 5 , The surface of the base material forming the inner circumferential surface of the through hole has light reflectivity. Light emitting element.

7. The light-emitting device according to any one of claims 3, 4 and 6, The through hole has a shape in which the distance between inner circumferential surfaces of the through hole gradually increases from the first main surface toward the second main surface. Light emitting element.

8. The light emitting device according to claim 1 , The phosphor is a quantum dot. Light emitting element.

9. The light emitting device according to claim 1 , The phosphor layer is formed by dispersing the phosphor and scattering material in a light-transmitting resin. Light emitting element.

10. The light-emitting device according to claim 3 or 4, The light-reflecting film further includes an etching stop layer provided between the substrate and the light-reflecting film. Light emitting element.

11. The light emitting device according to claim 1 , the first sealing film has a thickness that transmits the excitation light and reflects the fluorescence emitted from the phosphor; The second sealing film has a thickness that transmits the fluorescent light and reflects the excitation light. Light emitting element.

12. The light emitting device according to claim 1 , A lens bonded to the second principal surface side of the substrate The light emitting device further comprises:

13. a base having a first main surface and a second main surface opposite to the first main surface, the base having a through hole between the first main surface and the second main surface; a phosphor layer contained in the through hole and including a phosphor; a first sealing film having gas barrier properties and provided on the first main surface side of the phosphor layer; a second sealing film having gas barrier properties and provided on the second main surface side of the phosphor layer; and an excitation light source located outside the through hole on the first main surface side of the base and configured to cause excitation light to be incident on the phosphor layer. 、 A plurality of light emitting elements are arranged, the light emitting elements being positioned between the first sealing film and the excitation light source and including an adhesive layer for adhering the first sealing film and the excitation light source. Light emitting element array.

14. The light emitting element array according to claim 13, The light-emitting element includes a first light-emitting element in which the phosphor layer includes a first phosphor that emits fluorescence of a first color, and a second light-emitting element in which the phosphor layer includes a second phosphor that emits fluorescence of a second color different from the first color. Light emitting element array.

15. The light emitting element array according to claim 13, The light-emitting element includes a phosphor layer including a first phosphor that emits fluorescence of a first color and a second phosphor that emits fluorescence of a second color different from the first color; a first color filter bonded to the second main surface side of the base material and transmitting light of the first color; a first color filter bonded to the second main surface side of the base material and transmitting light of the second color; The light-emitting element array further comprises:

16. a base having a first main surface and a second main surface opposite to the first main surface, the base having a through hole between the first main surface and the second main surface; a phosphor layer contained in the through hole and including a phosphor; a first sealing film having gas barrier properties and provided on the first main surface side of the phosphor layer; a second sealing film having gas barrier properties and provided on the second main surface side of the phosphor layer; and an excitation light source located outside the through hole on the first main surface side of the base and configured to cause excitation light to be incident on the phosphor layer. 、 a light-emitting element array in which a plurality of light-emitting elements are arranged, the light-emitting elements being positioned between the first sealing film and the excitation light source and having an adhesive layer for adhering the first sealing film and the excitation light source; A drive circuit for driving the excitation light source; A display device comprising:

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