Airtight Connector

Abstract

[Problem] To realize, with high product yield and at a low cost, an airtight connector structure that reliably prevents leaks. [Solution] A hole is provided in a separation wall of an insulator connector base part, and a conductive part is provided formed as an integral member covering the hole and adhering to the surface of the separation wall.

Description

[Technical Field]

[0001] The present invention relates to an airtight connector that establishes an electrical connection via a conductive terminal while maintaining airtightness. [Background technology]

[0002] Traditionally, small electronic components have been sealed in a vacuum or with an inert gas to prevent corrosion of the internal circuitry due to humidity and malfunction due to changes in gas viscosity, as their performance is greatly affected by humidity and the viscosity of the gas they are filled with. Furthermore, airtight containers are used to operate electronic components in vacuum, pressure, liquid, or gas environments, and hermetic connectors are used to introduce power without compromising the airtightness of the container and to extract internal sensor signals, etc.

[0003] Conventional airtight connectors, as described in Patent Documents 1 and 2, include those in which a through hole is provided in an insulating substrate such as a ceramic plate or glass epoxy plate to isolate the internal atmosphere from the external atmosphere, or in a metal plate, and a metal pin for electrical connection is inserted into the through hole, and the gap is sealed and joined by glass sealing, silver brazing, soldering, etc. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2006-40766 [Patent Document 2] Japanese Patent Application Laid-Open No. 2013-89313 Summary of the Invention [Problem to be solved by the invention]

[0005] For hermetic connectors for small electronic components, 1 x 10 -15 Pa·m 3 Ultra-fine leak test at the level of 1 x 10 / s(He) -9 Pa·m 3Their airtightness is tested using fine leak tests at a level of 1 / s (He). The airtight connectors using the aforementioned conventional technologies have problems with ensuring a good seal due to poor bonding during manufacturing using brazing or soldering, and cracks that occur over time. Another alternative to brazing or soldering is to fill the gap between the insulating substrate and the metal pin with glass, which is then heated to a high temperature to melt and bond the components. However, this requires bonding three materials with different linear expansion coefficients: the substrate, the metal pin, and the glass. Furthermore, because there is an interface in the through-hole direction, gaps are likely to form between the substrate and the glass, and between the glass and the metal pin, making it difficult to reliably prevent leaks. This results in low product yields and increases the cost of this type of airtight connector. [Means for solving the problem]

[0006] The airtight connector according to claim 1 of the present invention maintains airtightness between a first space in which a small electronic component is sealed together with an inert gas and a second space outside the first space, and electrically connects a first conductor in the first space with a second conductor in the second space. The airtight connector includes an insulating connector base having a hole connecting the first space to the second space and a partition wall separating the two spaces by a portion other than the hole, and a first conductive portion formed as an integral member that adheres to the surface of the partition wall and covers the hole. Covering the hole with the conductive portion in this manner closes the hole connecting the first space to the second space, reliably preventing leakage. The first conductive portion is formed as an integral member with the covering portion, which differs from covering a hole by joining multiple conductive members together. Using multiple conductive members raises concerns about leakage from the joints. When the conductive portion is formed by plating the covering portion multiple times, the conductive portion is formed as an integral or single member, which can effectively prevent leakage.

[0007] In the airtight connector according to claim 2 of the present invention, the first conductive part is in close contact with the surface of the partition wall and integrally covers the hole and its periphery. This configuration increases the contact area between the partition wall and the conductive part, making the conductive part less likely to peel off from the partition wall and improving the breaking strength of the airtight connector. Here, the first conductive portion is characterized by integrally covering the hole and its surrounding area. In this case, too, the portion to be covered is covered with a single member, which differs from covering the hole by joining multiple conductive members. This is because using multiple conductive members raises concerns about leakage from the joints. Note that even when the conductive portion is formed by, for example, plating the portion to be covered multiple times with different metals, the portion is still integrally covered with a single member. In this case, too, leakage can be effectively prevented.

[0008] The airtight connector according to the invention of claim 3 of the present invention is characterized in that, in the invention of claim 1, it has a second conductive part on the surface of the partition part that is insulated from the first conductive part, the first conductive part has a shape suitable for connecting to a signal line, and the second conductive part has a shape suitable for providing electrostatic shielding for the first conductive part, and functions as a coaxial connector.

[0009] The airtight connector according to the invention of claim 4 of the present invention is characterized in that, in the invention of claim 3, the insulator portion between the first conductive portion and the second conductive portion has a thin portion, and the size of the gap can be changed to adjust the characteristic impedance.

[0010] The airtight connector according to claim 5 of the present invention is characterized in that, in the invention according to claim 1, 2, 3 or 4, the connector base is a molded product of synthetic resin, the conductive part is a metal-plated part, and the first conductive part in the hole part provides airtightness and conductivity between the first space and the second space. [Effects of the Invention]

[0011] According to the present invention, an airtight connector structure that reliably prevents leaks can be realized at low cost with a high product yield. [Brief explanation of the drawings]

[0012] [Figure 1] 1A is a schematic cross-sectional view showing the configuration of an airtight connector according to a first embodiment of the present invention, and FIG. 1B is a modified example of the embodiment shown in FIG. [Figure 2] 2A to 2C are schematic cross-sectional views illustrating a first step in the manufacturing process of the hermetic connector according to the embodiment of FIG. 1. [Figure 3] 2 is a schematic cross-sectional view illustrating a second step in the manufacturing process of the hermetic connector according to the embodiment of FIG. 1. [Figure 4] 2 is a schematic cross-sectional view illustrating a third step in the manufacturing process of the hermetic connector according to the embodiment of FIG. 1. [Figure 5] FIG. 4 is a schematic cross-sectional view showing the configuration of an airtight connector according to a second embodiment of the present invention. [Figure 6] FIG. 10 is a schematic cross-sectional view showing the configuration of an airtight connector according to a third embodiment of the present invention. [Figure 7] 7A-7C are schematic cross-sectional views illustrating a first step in the manufacturing process of the hermetic connector according to the embodiment of FIG. 6. [Figure 8] 7 is a schematic cross-sectional view illustrating a second step in the manufacturing process of the hermetic connector according to the embodiment of FIG. 6. [Figure 9] FIG. 10 is a schematic cross-sectional view showing the configuration of an airtight connector according to a fourth embodiment of the present invention. [Figure 10] 10 is a schematic cross-sectional view showing a plating portion forming step in the manufacturing process of the hermetic connector according to the embodiment of FIG. 9. [Figure 11] FIG. 10 is a schematic cross-sectional view showing the configuration of an airtight coaxial connector according to a fifth embodiment of the present invention. [Figure 12] 12A to 12C are schematic cross-sectional views showing the formation of a plated portion in the manufacturing process of the hermetic coaxial connector according to the embodiment of FIG. [Figure 13]12 is a schematic cross-sectional view for explaining the characteristic impedance adjustment in the hermetic coaxial connector according to the embodiment of FIG. 11. FIG. DETAILED DESCRIPTION OF THE INVENTION

[0013] An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic cross-sectional view showing an airtight connector according to an embodiment of the present invention. In FIG. 1(A), an insulating connector base 1 is molded from, for example, a polyester-based liquid crystal polymer (LCP), and has a partition wall 4 that separates a first space 2 from a second space 3. When molding the connector base 1, an appropriate filler can be added to improve the mechanical properties of the liquid crystal polymer (LCP). One space is, for example, a vacuum, pressure, liquid, or gas environment, and the other space contains electronic components.

[0014] Airtight connectors are used in many industrial fields, including aviation, space, defense, and security, as well as air conditioner compressors, gas sensors, flow sensors, and medical sensors. The outer shape of the connector base 1 may be roughly cylindrical, roughly rectangular, or other shapes depending on the application of the airtight connector. A hole 5 is provided in the partition wall 4, and a conductive plating portion 6 made of copper or the like with a thickness of approximately 25 μm is formed to cover the hole 5 and its surrounding area. In this example, the plating portion 6 is formed over almost the entire surface of the partition wall 4.

[0015] Pin 7 is brazed to one surface of the plated portion 6 covering hole 5, and pin 8 is brazed to the other surface. Pins 7 and 8 are electrical connection components made of a base material, such as pure copper, brass, or phosphor bronze, plated with gold or tin. Brazing is performed using soldering, silver brazing, or gold-tin (AuSn) bonding using high-frequency induction heating (IH). If the LCP material leaks, sealing portions 9 and 10 impregnated with epoxy resin, epoxy, or acrylic resin may be provided. Thus, the airtight connector of this embodiment is structured such that the plated portion 6 maintains airtightness and ensures electrical connection. In particular, because the plated portion 6 is formed to cover hole 5 and its surroundings, the contact area between the bulkhead portion 4 and the plated portion 6 is increased. This makes the plated portion 6 less likely to peel off from the bulkhead portion 4 when force is applied to the pins 7 and 8, improving the fracture strength of the airtight connector. The plated portion 6 is in close contact with the partition wall portion 4 and is an integral or single member with respect to the entire portion covering the hole 5. Note that even when the plated portion is formed with an increased thickness by overlapping electroless plating and electroplating, it still remains an integral or single member.

[0016] FIG. 1(B) shows a modified example of the airtight connector shown in FIG. 1(A). In this example, a plated portion 16 is provided in the recess 14 of the partition wall 4, covering the hole 5. The plated portion 16 is in close contact with the recess 14 and is an integral or single member with the entire portion covering the hole 5. Note that even when the plated portion is formed with an increased thickness by multiple electroless plating and electroplating processes, it remains an integral or single member. By covering the hole 5 with the plated portion 16, the hole 5 communicating between the first space 2 and the second space 3 can be blocked, reliably preventing leaks.

[0017] Next, a method for manufacturing the airtight connector shown in Fig. 1(A) will be described with reference to Figs. 2 to 4. In the first step, a connector base 1 having a hole 5 is formed by molding a synthetic resin such as LCP (liquid crystal polymer), PPA, PA, thermosetting resin, or ceramic. The connector base 1 can be made of a base material made of a synthetic resin such as a thermoplastic resin or a thermosetting resin, or an inorganic material such as ceramic or glass. Preferred are aromatic liquid crystal polymers, polysulfones, polyether polysulfones, polyarylsulfones, polyetherimides, polyesters, acrylonitrile-butadiene-styrene copolymer resins, polyamides, modified polyphenylene oxide resins, norbornene resins, phenolic resins, epoxy resins, polyphenylene sulfide (PPS) resins, polybutylene terephthalate (PBT) resins, etc. More preferred are polyester liquid crystal polymers that have heat resistance and thermal expansion coefficients close to those of metals over a wide range of temperature conditions, elasticity equivalent to that of metal films, and excellent properties equivalent to those of metal films in thermal cycle tests. Fillers such as glass fiber, calcium pyrophosphate, wollastonite, calcium carbonate, barium titanate, carbon fiber, quartz fiber, and barium sulfate may also be added.

[0018] First, the exposed surface of the partition wall 4 made of liquid crystal polymer (LCP) is roughened by etching. Next, as shown in FIG. 2, a molded body 20 is formed using acrylonitrile butadiene styrene (ABS) resin, biodegradable resin, or the like to seal the hole 5. Here, a material that is not easily dissolved in the organic solvent used to dissolve the molded body 20 is selected as the material for the connector base 1. Furthermore, after degreasing the exposed surface 21 of the partition wall 4 and the exposed surface 22 of the molded body 20, the exposed surfaces 21 and 22 are roughened using chromic acid or a potassium hydroxide (KOH) solution, or the like.

[0019] As a method for roughening the surface, for example, a known etching method can be applied. Etching methods include wet and dry methods, and an appropriate etching method can be adopted depending on the type of material used for the substrate. Dry methods can be carried out, for example, by irradiating plasma or using gas.

[0020] The wet method can be carried out by using, for example, an aqueous solution of an alkali metal hydroxide such as NaOH or KOH, an aqueous solution of an alkali metal alcoholate such as alcoholic sodium or alcoholic potassium, or an organic solvent such as dimethylformamide, and applying these etching solutions to the surface of the substrate or immersing the substrate in these solutions to bring them into contact with each other. Of these, the method using an aqueous solution of NaOH, KOH, etc. is preferably carried out under conditions of a concentration of about 35 to 45 wt % and a temperature of about 70 to 95°C.

[0021] In addition, methods using an aqueous solution of an alkali metal alcoholate or an organic solvent such as dimethylformamide are suitable for roughening the surface after coating with a water-soluble or hydrolyzable polymer material. However, when an organic solvent is used, the substrate may only swell without being roughened. In this case, an acid or alkali treatment may be carried out after the treatment with the organic solvent. Next, a masking molding step for patterning is performed. A mask layer 23 made of polylactic acid (PLA) resin or the like is formed on the surfaces of the connector base 1 and the molded body 20 except for the area where the plated portion 6 is to be formed, as shown in FIG.

[0022] In the second step, a plating catalyst such as Pd or Pt is applied to the exposed surfaces 21 of the partition portions 4 and the exposed surfaces 22 of the compact 20 by immersion in an accelerator liquid such as sulfuric acid, hydrochloric acid, sodium hydroxide, or ammonium.

[0023] Known plating catalysts can be used, and among these, those containing Pd or Pt are preferred, which are used as inorganic salts such as chlorides. The plating catalyst is applied by attaching the inorganic salt to a substrate and then precipitating the catalytic metal by accelerator treatment. The inorganic salt can be attached to the substrate by contacting the substrate with a solution of the inorganic salt, for example, by immersing the substrate in the solution of the inorganic salt or by coating the substrate with this aqueous solution.

[0024] The specific conditions vary depending on the substrate material, plating material, plating catalyst material, method of applying the inorganic salt, etc., and cannot be generally determined. However, taking the example of using palladium chloride as the plating catalyst salt and adopting the immersion method, the following can be cited as an example:

[0025] Catalyst salt solution composition PdCl2·2H2O: 0.1–0.3 g / dm3 SnCl2·2H2O: 10-20g / dm3 HCl: 150-250cm3 / dm3 Soaking conditions Temperature: 20~45℃ Time: 1 to 10 minutes

[0026] In addition to the hydrochloric acid, organic solvents such as methanol, ethanol, and isopropyl alcohol that do not completely dissolve the coating material made of the water-soluble or hydrolyzable polymer material (although some of the coating material may be dissolved) can also be used as the solvent for the plating catalyst salt solution.

[0027] The PLA resin mask layer 23 is dissolved in the accelerator process. Next, electroless plating of copper (Cu) is performed on the exposed surfaces 21 and 22 to form plated portion 6 as shown in Fig. 3. Electroplating of Cu, Au, etc. may also be performed.

[0028] The plating method can be a known metallizing method (electroless plating method or electroplating method). Examples of plating metals include copper, nickel, gold, and various other metals. The plating process can be carried out in multiple steps. A preliminary plating process can also be carried out after the catalyst application process. The preliminary plating can also be carried out by a known metallizing method, preferably an electroless plating method, and the plating metal can be the same as the metal used in the so-called main plating process described above.

[0029] By providing this preliminary plating step, the plating quality in the main plating step can be further improved. A post-plating step can also be provided. The post-plating step can also be performed by a known metallizing method, preferably electroless plating, and the plated metal may be the same as or different from the metal in the main plating step. In this embodiment, electroless plating is followed by electroplating to form a thick plated portion 6.

[0030] In the third step, compact 20 is removed using an organic solvent or the like, and the oxide film is then removed. The plating film is then further thickened, and pins 7 and 8 are joined with solder 40 to both sides of the plated portion 6 at the locations corresponding to holes 5, as shown in Fig. 4. Thereafter, sealing portions 9 and 10 made of epoxy resin or the like are provided as necessary, thereby producing the airtight connector shown in Fig. 1.

[0031] In the airtight connector shown in Figure 1(A) configured as described above, the exposed surface 21 of the partition wall portion 4 is roughened by etching, and then plated portion 6 is formed by, for example, electroless plating and electroplating. Therefore, plated portion 6 is securely fixed to the surface of partition wall portion 4, and the adhesive area between plated portion 6 and partition wall portion 4 is increased, so that plated portion 6 is less likely to peel off from partition wall portion 4 when force is applied to the pin, thereby improving the fracture strength of the airtight connector. 1(B) differs from the airtight connector of FIG. 1(A) in the area where the mask layer for patterning is formed and the area where the plated portion is formed, but the other steps are the same. In the airtight connector manufactured in this manner, the hole 5 that communicates with the first space 2 and the second space 3 can be blocked by covering the hole 5 with the plated portion 16, thereby reliably preventing leakage.

[0032] In the airtight connector according to the second embodiment of the present invention, as shown in FIG. 5, one of the pins 50 has a flange portion 51, and the flange portion 51 can be joined to the plated portion 6 by silver brazing, soldering, AuSn bonding, or the like to ensure adhesion to the plated portion 6 and make it strong against external forces.

[0033] In the airtight connector according to the third embodiment of the present invention, as shown in Fig. 6, the shape of the plated portion 63 is changed to a shape different from that of the plated portion 6 in Fig. 1 to match the shape of the joining portions of the joined parts 61 and 62. In this example, the center of the plated portion 63 is curved into a substantially hemispherical shape. Even with this shape, leaks in the airtight connector can be reliably prevented.

[0034] Next, a method for manufacturing the airtight connector shown in FIG. 6 will be described with reference to FIGS. 7 and 8. As a first step, a hole 72 is formed in the partition wall 71 of the connector base 70, as shown in FIG. 7. Next, a molded body 73 is formed to cover the hole 72. A roughly hemispherical depression is formed in the exposed surface of the molded body 73. The surfaces of the connector base 70 and the molded body 73, except for the area where the plated portion 63 is to be formed, are covered with a mask layer 74 made of polylactic acid (PLA) resin. A plating catalyst is then applied. During this process, the mask layer 74 is dissolved. That is, the mask layer 74 is dissolved and removed before the molded body 73 is dissolved and removed. Selected surfaces of the connector base 70 and the molded body 73 are etched and roughened. Then, electroless plating and electroplating are performed to form the plated portion 63. Next, the molded body 73 is removed, resulting in the plated portion 63 firmly bonded to the surface of the partition wall 71, as shown in FIG. 8. After the compact 73 is removed, electroplating is further performed to further increase the plating thickness. It is also possible to form the molded body 73 after etching the partition wall portion 71, but in this case, only the molded body 73 is etched. For example, if chromic acid or the like is used, only the ABS resin molded body 73 is etched. In this case, the LCP connector base 70 is not etched.

[0035] As shown in Fig. 9, the airtight connector according to the fourth embodiment of the present invention has a plated portion 90 shaped to be suitable for connecting components with a rectangular cross section. As shown in Fig. 10, a connector base 100 is formed having a hole 102 in a partition wall 101. Next, a molded body 103 with a rectangular cross section is formed near the hole 102. A mask layer 104 for patterning is formed of polylactic acid (PLA) resin or the like on the surface of connector base 100 and on the surface of molded body 103, except for the portion where plated portion 90 is to be formed. The exposed surfaces of the partition wall portion 101 and the molded body 103 are etched and roughened. A plating catalyst is applied, and a thick plated portion 90 is formed by electroless plating and electroplating. The mask layer 104 is dissolved and removed when the catalyst is applied. Next, the molded body 103 is removed to obtain the plated portion 90 that is securely adhered to the surface of the partition wall portion 101, as shown in FIG. 9. Note that an even thicker plated portion 90 can be obtained by performing electroplating again after the molded body 103 has been dissolved and removed.

[0036] 5 to 10, the same materials as those used to form the plated portion 6 in the first embodiment are used. Furthermore, depending on the components to be housed in the airtight connector, it is possible to form the plated portion in a desired shape other than the shapes shown in the above-described embodiments.

[0037] Next, the configuration of an airtight connector according to a fifth embodiment of the present invention will be described with reference to Fig. 11. The airtight connector according to this embodiment is an example of an airtight coaxial connector having a coaxial structure suitable for transmitting high-frequency signals. In Fig. 11, an insulator connector base 110 has an outer partition wall 111, a middle partition wall 112, and an inner partition wall 113, and a hole 114 is provided in the center.

[0038] The outer wall portion of the connector base 110 and the surface of the outer partition wall 111 are provided with a plated portion 115 for connection to the outer conductor of a coaxial cable (not shown). This plated portion 115 is grounded at any appropriate location to provide electrostatic shielding. A plated portion 116 is provided on a portion of the inner partition wall 113 around the hole 114. The plated portion 115 and the plated portion 116 are electrically insulated by the insulating intermediate partition wall 112 and the inner partition wall 113. Pins 117 and 118 are bonded to both sides of plated portion 116 covering hole 114, and one of the pins is adapted to be connected, for example, to a female contact pin or to the inner conductor of a coaxial cable that is integral with the connector base. Furthermore, the airtight connector of the present invention is not limited to this, but can also be applied to high-speed signal lines that are integrated with female contact pins or connector bases, connectors alone, and structures in which the inner center conductor of a coaxial connector is integrated with the circuit on a circuit board.

[0039] Next, the process of forming the plated portions 115 and 116 in the manufacturing method of this airtight coaxial connector will be described with reference to Figure 12. First, in Figure 12, a synthetic resin such as LCP (liquid crystal polymer), PPA, PA, or thermosetting resin, or ceramic is molded to form a connector base 110 having an outer partition wall 111, an intermediate partition wall 112, an inner partition wall 113, and a hole 114. A first molded body 120 is formed using ABS resin or the like so as to straddle the outer partition wall 111 and the intermediate partition wall 112. A second molded body 121 that closes the hole 114 is also formed using ABS resin or the like.

[0040] A mask layer 124 made of polylactic acid (PLA) resin or the like is formed on the surface of the connector base 110 and the surfaces of the first molded body 120 and second molded body 121, excluding the areas where the plated portions 115 and 116 are to be formed. Next, etching is performed and the surfaces are roughened. After that, a plating catalyst is applied, and the plated portions 115 and 116 are formed by electroless plating and electroplating. The mask layer 124 is dissolved and removed when the catalyst is applied.

[0041] Next, first molded body 120 and second molded body 121 are removed to obtain plated portions 115, 116 that are securely bonded to the outer wall of connector base 110, outer partition wall 111, part of intermediate partition wall 112, and the surface of inner partition wall 113. Note that there is an unplated portion on the surface of intermediate partition wall 112, and plated portions 115 and 116 are electrically insulated and correspond to the outer conductor and inner conductor of the coaxial connector, respectively.

[0042] In this way, the airtight coaxial connector according to the fifth embodiment shown in Fig. 11 can be manufactured by a method similar to that described for the airtight connector according to the first embodiment shown in Figs. 1 to 4. In this embodiment, too, the exposed surfaces of the outer partition wall 111, the intermediate partition wall 112, and the inner partition wall 113 are roughened by etching and then electroless plated to form the plated portions 115, 116. Therefore, the plated portions 115, 116 are reliably fixed to the surfaces of these members, and the adhesive areas between the plated portions 115, 116 and the outer partition wall 111, the intermediate partition wall 112, and the inner partition wall 113 are also large, thereby reliably preventing leakage from the hole 114 and the partition walls.

[0043] Generally, in a coaxial connector, it is necessary to adjust the characteristic impedance to achieve impedance matching, but with a configuration such as that of the fifth embodiment, the impedance adjustment can be performed as follows.

[0044] 13, in this airtight coaxial connector, the characteristic impedance can be adjusted by appropriately setting the length A between the outer walls of the intermediate partition wall 112, the length B between the inner walls of the plated portion 116 formed in the hole 114, the outer diameter C of the pin 117, the length D of the pin 117, the length E of the pin 118, and the size F of the gap provided in the intermediate partition wall 112. Since the dielectric constant of a synthetic resin such as an LCP material differs greatly from that of a vacuum or air, adjusting the size F of the gap provided in the intermediate partition wall 112 is effective in adjusting the characteristic impedance. Note that the characteristic impedance can also be adjusted by changing the dimensions of parts other than those mentioned above.

[0045] Furthermore, the hermetic connectors according to the embodiments described above can be used for various purposes regardless of their dimensions. In particular, the hermetic coaxial connector shown in Fig. 11 can be suitably used for a smartphone compatible with the 5G communication standard and a high-frequency circuit board in which a coaxial connector (which serves as a central conductor circuit board) is integrated.

[0046] The hermetic connector according to one embodiment of the present invention can realize a structure that reliably prevents leakage at low cost without requiring complex adjustments. It can also realize a hermetic coaxial connector structure that allows for easy impedance adjustment, and can realize a structure in which the coaxial connector is integrated with a circuit board, eliminating the need for soldering or other connections to the coaxial connector. [Explanation of symbols]

[0047] 1 Connector base 2. First Space 3. The Second Space 4 Bulkhead 5 holes 6. Plating section 7-pin 8-pin 9 Sealing part 10 Sealing part 14 Recess 16 Plating section 20 Molded body 21 Exposed surface of bulkhead 22 Exposed surface of compact 23 Mask Layer 50 pin 51 Flange 61 parts 62 parts 63 Plating section 70 Connector base 71 Bulkhead 72 holes 73 Molded body 74 Mask Layer 90 Plated part 100 Connector base 101 Partition part 102 holes 103 Molded body 110 Connector base 111 Outer bulkhead 112 Intermediate wall section 113 Inner bulkhead 114 holes 115 Plating Department 116 Plating Department 117 pins 118 pins 120 First molded body 121 Second molded body 123 Mask Layer 124 Mask Layer

Claims

1. A hermetic connector for maintaining hermeticity between a first space and a second space and electrically connecting a first conductor in the first space and a second conductor in the second space, comprising: a connector base made of an insulator having a hole that communicates the first space with the second space and a partition wall that divides the two spaces by a portion other than the hole; a first conductive portion formed as a single, integral member that is in close contact with the surface of the partition and that forms a plating film on the inner surface and opening of the hole to seal the hole.

2. 2. The airtight connector according to claim 1, wherein the first conductive portion is in close contact with a surface of the partition wall and integrally covers the hole and its periphery.

3. 3. An airtight connector as described in claim 1 or 2, characterized in that the surface of the partition portion has a second conductive portion insulated from the first conductive portion, the first conductive portion is formed in the center, and the second conductive portion is formed surrounding the first conductive portion.

4. 4. The hermetic connector according to claim 3, wherein an insulator portion between said first conductive portion and said second conductive portion has a thinned portion surrounding an air gap.

5. 5. An airtight connector as described in any one of claims 1 to 4, characterized in that the connector base is a molded product of synthetic resin, the first conductive portion and the second conductive portion are metal-plated portions, and the first conductive portion in the hole portion provides airtightness and conductivity between the first space and the second space.

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