Photosensitive resin composition, photosensitive material containing the same, black matrix containing the same, and electronic device containing the same

Abstract

The present invention relates to a photosensitive resin composition, a photosensitive material containing the same, a black matrix containing the same, and an electronic device containing the same.

Description

[Technical field]

[0001] This invention claims the benefit of the filing date of Korean Patent No. 10-2020-0148439, filed with the Korean Intellectual Property Office on November 9, 2020, the entire contents of which are incorporated herein by reference.

[0002] The present invention relates to a photosensitive resin composition, a photosensitive material containing the same, a black matrix containing the same, and an electronic device containing the same. [Background technology]

[0003] A grid-like black pattern called a black matrix is ​​generally arranged between color pixels of a color filter in order to improve contrast. In conventional black matrices, a pattern is formed by depositing and etching chromium (Cr) as a pigment on the entire glass substrate, but this process requires high costs, and there are problems such as the high reflectance of chromium and environmental pollution caused by chromium waste liquid. For these reasons, research on black matrices using a pigment dispersion method that allows for fine processing has been actively conducted, and research on producing black compositions using color pigments other than carbon black has also been conducted. However, since color pigments other than carbon black have poor light-shielding properties, the amount of the pigments must be increased to an extremely large amount, which results in an increase in the viscosity of the composition, making it difficult to handle, or a significant decrease in the strength of the formed coating or adhesion to the substrate.

[0004] Therefore, research into photosensitive resin compositions that are excellent in pattern adhesion, process characteristics, and the like is required.

[0005] In addition, the interlayer insulating film or surface protective film of a semiconductor device is required to have excellent mechanical properties and high heat resistance, and polyimide-based binder resins with excellent properties are used. In the case of negative-type photosensitive polyimides, although they have relatively excellent mechanical properties, it is difficult to achieve high resolution. In the case of positive-type photosensitive polyimides, although it is possible to achieve relatively high resolution, it is difficult to satisfy the mechanical properties.

[0006] Therefore, there is a need to develop a photosensitive material that simultaneously satisfies both high resolution and mechanical properties. [Prior art documents] [Patent documents]

[0007] [Patent Document 1] Korean Patent Publication No. 10-2014-0096423 Summary of the Invention [Problem to be solved by the invention]

[0008] An object of the present invention is to provide a photosensitive resin composition, a photosensitive material containing the same, a black matrix containing the same, and an electronic device containing the same. [Means for solving the problem]

[0009] One embodiment of the present invention provides a photosensitive resin composition comprising an alkali-soluble polyimide resin containing repeating units represented by the following chemical formulas 1 to 3 and a solvent. [Chemical formula 1] [ka] [Chemical formula 2] [ka] [Chemical formula 3] [ka] In the above Chemical Formulas 1 to 3, X1 to X3 are the same or different and each independently represents a tetravalent organic group; Y1 to Y3 are the same or different and each independently represents a divalent organic group; Y2 includes a group represented by the following chemical formula A: [Chemical formula A] [ka] In the above chemical formula A, R7 is hydrogen; deuterium; a hydroxy group; a halogen group; a nitro group; a nitrile group; a substituted or unsubstituted alkyl group; a substituted or unsubstituted alkenyl group; a substituted or unsubstituted alkynyl group; a substituted or unsubstituted alkoxy group; a substituted or unsubstituted aryloxy group; a substituted or unsubstituted cycloalkyl group; a substituted or unsubstituted aryl group; a substituted or unsubstituted heterocyclic group; or a photopolymerizable unsaturated group; [ka] means a site for binding to Y2 in Chemical Formula 2; m to p each independently represent an integer of 1 to 500.

[0010] One embodiment of the present invention provides a photosensitive resin composition, in which, for m to p in the above chemical formulas 1 to 3, p / (m+n+p) is 0.03 to 0.15.

[0011] One embodiment of the present invention provides a black matrix comprising the above-described photosensitive resin composition.

[0012] One embodiment of the present invention provides an electronic device comprising a black matrix as described above. Effect of the Invention

[0013] The photosensitive resin composition according to one embodiment of the present invention and the black matrix containing the same have improved heat resistance.

[0014] The photosensitive resin composition and the black matrix including the same according to an embodiment of the present invention reduce the amount of out-gas generated during processes such as development.

[0015] According to one embodiment of the present invention, it is possible to provide an electronic device including a black matrix which has excellent heat resistance or generates a small amount of outgas during a process such as development. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0016] The present invention will be described in detail below.

[0017] One embodiment of the present invention provides a photosensitive resin composition comprising an alkali-soluble polyimide resin containing repeating units represented by the following chemical formulas 1 to 3 and a solvent. [Chemical formula 1] [ka] [Chemical formula 2] [ka] [Chemical formula 3] [ka] In the above Chemical Formulas 1 to 3, X1 to X3 are the same or different and each independently represents a tetravalent organic group; Y1 to Y3 are the same or different and each independently represents a divalent organic group; Y2 includes a group represented by the following chemical formula A: [Chemical formula A] [ka] In the above chemical formula A, R7 is hydrogen; deuterium; a hydroxy group; a halogen group; a nitro group; a nitrile group; a substituted or unsubstituted alkyl group; a substituted or unsubstituted alkenyl group; a substituted or unsubstituted alkynyl group; a substituted or unsubstituted alkoxy group; a substituted or unsubstituted aryloxy group; a substituted or unsubstituted cycloalkyl group; a substituted or unsubstituted aryl group; a substituted or unsubstituted heterocyclic group; or a photopolymerizable unsaturated group; [ka] means a site for binding to Y2 in Chemical Formula 2; m to p each independently represent an integer of 1 to 500.

[0018] A photosensitive resin composition containing an alkali-soluble polyimide resin according to one embodiment of the present invention has excellent adhesion and bonding properties to substrates used in display devices such as organic light-emitting devices.

[0019] In addition, the photosensitive resin composition including the alkali-soluble polyimide resin according to one embodiment of the present invention has excellent mechanical properties such as heat resistance and chemical resistance, thereby reducing side reactions occurring during the process and reducing the amount of out-gas generated during the process such as development.

[0020] According to one embodiment of the present invention, a photosensitive resin composition including an alkali-soluble polyimide resin having a specific ratio of a closed ring structure (imide structure) and a non-closed ring structure prevents swelling or a decrease in solubility due to ring closure of side chains during development.

[0021] In the present invention, when a member is said to be located "on" another member, this includes not only the case where the member is in contact with the other member, but also the case where another member is present between the two members.

[0022] In the present invention, when a part "comprises" a certain component, this does not mean that other components are excluded, but that other components may be further included, unless otherwise specified.

[0023] In the present invention, unless otherwise defined, all technical and scientific terms used in the present invention have the same meaning as those commonly understood by those skilled in the art to which the present invention belongs. Although methods and materials similar or equivalent to those described in the present invention may be used in the practice or testing of the embodiments of the present invention, suitable methods and materials are described below. All publications, patent applications, patents, and other references mentioned in the present invention are entirely incorporated by reference in the present invention, and in case of contradiction, the present invention including definitions will prevail unless a specific passage is mentioned. Moreover, the materials, methods, and examples are merely illustrative and are not intended to be limiting.

[0024] In the present invention, examples of the substituents are described below, but are not limited thereto.

[0025] In the present invention, [ka] means the site to be linked.

[0026] In the present invention, the term "substituted" means that a hydrogen atom bonded to a carbon atom of a compound is replaced with another substituent, and the position of the substitution is not limited as long as it is a position at which a hydrogen atom is substituted, i.e., a position at which a substituent can be substituted, and when two or more substituents are substituted, the two or more substituents may be the same or different from each other.

[0027] In the present invention, the term "substituted or unsubstituted" means that the group is substituted with one or more substituents selected from the group consisting of deuterium, a halogen group, a cyano group, an alkyl group, a cycloalkyl group, an alkoxy group, an aryloxy group, an aryl group, and a heterocyclic group, or that the group is substituted with a substituent in which two or more of the above-exemplified substituents are linked, or that the group does not have any substituents.

[0028] In the present invention, a halogen group includes a fluoro group (-F), a chloro group (-Cl), a bromo group (-Br), or an iodo group (-I).

[0029] In the present invention, the alkyl group may be linear or branched, and the number of carbon atoms is not particularly limited, but may be 1 to 20. According to one embodiment, the number of carbon atoms in the alkyl group is 1 to 10. Specific examples of the alkyl group include, but are not limited to, a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, a tert-butyl group, an n-pentyl group, an n-hexyl group, and an n-heptyl group.

[0030] In the present invention, the alkenyl group contains a straight or branched chain having 2 to 60 carbon atoms and may be further substituted with other substituents. The number of carbon atoms in the alkenyl group may be 2 to 60, specifically 2 to 40, more specifically 2 to 20. Specific examples include, but are not limited to, a vinyl group, a 1-propenyl group, an isopropenyl group, a 1-butenyl group, a 2-butenyl group, and a 3-butenyl group.

[0031] In the present invention, the alkynyl group contains a straight or branched chain having 2 to 60 carbon atoms and may be further substituted with other substituents. The alkynyl group may have 2 to 60 carbon atoms, specifically 2 to 40 carbon atoms, and more specifically 2 to 20 carbon atoms.

[0032] In the present invention, the cycloalkyl group includes a monocyclic or polycyclic group having 3 to 60 carbon atoms, and may be further substituted with other substituents. Here, the polycyclic group means a group in which the cycloalkyl group is directly linked or condensed with another cyclic group. Here, the other cyclic group may be a cycloalkyl group, but may also be other types of cyclic groups, such as a heterocycloalkyl group, an aryl group, or a heteroaryl group. The number of carbon atoms of the cycloalkyl group may be 3 to 60, specifically 3 to 40, and more specifically 5 to 20. Specific examples include, but are not limited to, a cyclopropyl group, a cyclobutyl group, a cyclopentyl group, and a 3-methylcyclopentyl group.

[0033] In the present invention, the alkoxy group may be linear or branched. The number of carbon atoms in the alkoxy group is not particularly limited, but may be 1 to 20. Specific examples of the alkoxy group include, but are not limited to, a methoxy group, an ethoxy group, an n-propoxy group, an n-butoxy group, a tert-butoxy group, an n-pentyloxy group, an n-hexyloxy group, an n-octyloxy group, an n-nonyloxy group, and an n-decyloxy group.

[0034] In the present invention, the aryloxy group means -ORaryloxy, and the Raryloxy means an aryl group.

[0035] In the present invention, the aryl group is not particularly limited, and may have 6 to 60 carbon atoms, and may be a monocyclic aryl group or a polycyclic aryl group. According to one embodiment, the aryl group has 6 to 30 carbon atoms. According to one embodiment, the aryl group has 6 to 20 carbon atoms. As the monocyclic aryl group, there are exemplified, but not limited to, a phenyl group, a biphenyl group, and a terphenyl group. As the polycyclic aryl group, there are exemplified, but not limited to, a naphthyl group, an anthracenyl group, a phenanthrenyl group, a pyrenyl group, a perylenyl group, a triphenylenyl group, a chrysenyl group, and a fluorenyl group.

[0036] In the present invention, the fluorenyl group may be substituted, and two substituents may be bonded to each other to form a spiro structure. When the fluorenyl group is substituted, [ka] However, it is not limited to these.

[0037] In the present invention, the heteroaryl group is an aromatic ring group containing one or more heteroatoms selected from N, O, P, S, Si, and Se, and the number of carbon atoms is not particularly limited, but may be 2 to 60. According to one embodiment, the number of carbon atoms of the heteroaryl group is 2 to 30. Examples of the heteroaryl group include, but are not limited to, a pyridine group, a pyrrole group, a pyrimidine group, a pyridazine group, a furan group, a thiophene group, a benzothiophene group, a benzofuran group, a dibenzothiophene group, and a dibenzofuran group.

[0038] In the present invention, the term "monomer" refers to a unit compound that can be converted into a polymeric compound by polymerization reaction, and can be a repeating unit in a polymer or copolymer. Specifically, this refers to a state in which the compound is polymerized and bonded to a polymer, and two or more substituents in the structure of the compound are all or partly removed, and a radical for bonding to other units of the polymer is located at that position. In this case, the compound may be included in a state in which it is polymerized in any order and bonded to the polymer.

[0039] In the present invention, when a molecular weight is mentioned, it means a weight average molecular weight, unless otherwise specified.

[0040] The weight average molecular weight is one of the average molecular weights in which the molecular weight is not uniform and the molecular weight of a certain polymeric substance is used as a standard, and is a value obtained by averaging the molecular weights of component molecular species of a polymeric compound having a molecular weight distribution by weight fraction.

[0041] The weight average molecular weight can be measured by a gel permeation chromatography (GPC) method. In the process of measuring the weight average molecular weight by the GPC method, a commonly known analyzer, a detector such as a refractive index detector, and an analytical column can be used, and commonly applied temperature conditions, solvents, solvent rates, etc. can be applied. Specific examples of the measurement conditions include a Polymer Laboratories PLgel MIX-B 300 mm long column, a Waters PL-GPC220 instrument, an evaluation temperature of 160° C., 1,2,4-trichlorobenzene as a solvent, a flow rate of 1 mL / min, a sample prepared to a concentration of 10 mg / 10 mL, and then supplied in an amount of 200 μL, and a calibration curve formed using polystyrene standards can be used to determine the Mw value. Nine types of polystyrene standards with molecular weights of 2,000 / 10,000 / 30,000 / 70,000 / 200,000 / 700,000 / 2,000,000 / 4,000,000 / 10,000,000 were used.

[0042] In the present invention, the acryloyl group is not particularly limited, but preferably has 3 to 40 carbon atoms, and the above description of the acryloyl group can be applied to the acrylate group. Examples of the acryloyl group or the acrylate group include, but are not limited to, methyl acrylate, ethyl acrylate, methacrylate, and 3-(acryloyloxy)propyl methacrylate.

[0043] In the present invention, the unsaturated group in the photopolymerizable unsaturated group means a functional group, a substituent, or an organic group containing an unsaturated bond, and the unsaturated bond means a state in which another element can be further bonded to carbon, specifically, it can mean a double or triple bond. Specific examples of the functional group, the substituent, or the organic group having an unsaturated bond include an unsaturated double bond functional group or an unsaturated triple bond functional group such as propargyl, among which conjugated vinyl groups, acryloyl groups, methacryloyl groups, etc. In addition, the number of functional groups contained may be 1 to 4 in terms of stability, and may be the same or different. In addition, the photopolymerization in the photopolymerizable unsaturated group means the property of being polymerized by the action of a photopolymerization initiator or light.

[0044] In the present invention, alkali-soluble means a property of being dissociated by an acid to increase the solubility in an alkaline substance (such as a developer). For example, an alkali-soluble resin and an alkali-soluble group respectively mean a resin and a substituent that are dissociated by an acid to increase the solubility in an alkaline developer. The alkali-soluble group includes an alkali-soluble hydroxy group. Such an alkali-soluble hydroxy group includes, but is not limited to, a phenolic hydroxy group.

[0045] In the present invention, the content of A1 relative to A may be expressed as "the content of A1 relative to A is 1 part by weight to 10 parts by weight," "A1 is contained in an amount of 1 part by weight to 10 parts by weight relative to A," etc., but is not limited to these expressions.

[0046] According to one embodiment of the present invention, the photosensitive resin composition includes at least one of a binder resin and a colorant.

[0047] According to one embodiment of the present invention, the photosensitive resin composition contains a binder resin.

[0048] According to one embodiment of the present invention, the photosensitive resin composition contains a colorant.

[0049] According to one embodiment of the present invention, at least one of the binder resin and the colorant contains the alkali-soluble polyimide resin.

[0050] According to one embodiment of the present invention, the binder resin includes the alkali-soluble polyimide resin.

[0051] According to one embodiment of the present invention, the binder resin is an alkali-soluble polyimide resin according to one embodiment of the present invention.

[0052] According to one embodiment of the present invention, the binder resin may be contained in an amount of 15 to 50 parts by weight, or 20 to 45 parts by weight, based on 100 parts by weight of the solid content of the photosensitive resin composition (solid content excluding the solvent from the photosensitive resin composition). As a preferred example, the binder resin may be contained in an amount of 35 to 45 parts by weight, based on 100 parts by weight of the solid content of the photosensitive resin composition (solid content excluding the solvent from the photosensitive resin composition), but is not limited to the above example.

[0053] In the present invention, the binder resin may further include a binder resin generally used in the art in addition to the alkali-soluble polyimide resin containing the repeating units represented by Chemical Formulas 1 to 3.

[0054] According to one embodiment of the present invention, the colorant contains the alkali-soluble polyimide resin.

[0055] According to one embodiment of the present invention, the colorant is an alkali-soluble polyimide resin according to one embodiment of the present invention.

[0056] According to one embodiment of the present invention, the colorant may be contained in an amount of 14 parts by weight to 50 parts by weight, or 20 parts by weight to 45 parts by weight, based on 100 parts by weight of the solid content of the photosensitive resin composition (solid content excluding the solvent from the photosensitive resin composition). As a preferred example, the colorant may be contained in an amount of 25 parts by weight to 35 parts by weight, based on 100 parts by weight of the solid content of the photosensitive resin composition (solid content excluding the solvent from the photosensitive resin composition), but is not limited to the above example.

[0057] According to one embodiment of the present invention, the content of the binder resin is 15 parts by weight to 50 parts by weight and the content of the colorant is 14 parts by weight to 50 parts by weight, relative to 100 parts by weight of the solid content of the photosensitive resin composition (the solid content excluding the solvent from the photosensitive resin composition).

[0058] According to one embodiment of the present invention, the content of the binder resin is 35 to 45 parts by weight, and the content of the colorant is 25 to 35 parts by weight, relative to 100 parts by weight of the solid content of the photosensitive resin composition (the solid content excluding the solvent from the photosensitive resin composition).

[0059] According to one embodiment of the present invention, the photosensitive resin composition includes at least one of a binder resin and a colorant, and at least one of the binder resin and the colorant includes the alkali-soluble polyimide resin.

[0060] According to one embodiment of the present invention, the photosensitive resin composition contains a binder resin and a colorant, and the binder resin and the colorant contain the alkali-soluble polyimide resin.

[0061] According to one embodiment of the present invention, the photosensitive resin composition contains a binder resin and a colorant, and the binder resin and the colorant are the alkali-soluble polyimide resin according to one embodiment of the present invention.

[0062] The heat resistance of the photosensitive resin composition according to one embodiment of the present invention can be significantly increased by including an alkali-soluble polyimide resin having a repeating unit represented by Chemical Formulae 1 to 3 in both the binder resin and the colorant. Specifically, the heat resistance related to the adhesive strength with the substrate is increased by including a polyimide resin, which is a highly heat-resistant resin having insoluble and infusible properties, in the binder resin, and the polyimide resin included in the colorant increases the heat resistance of the deposition material itself remaining after development and etching.

[0063] According to one embodiment of the present invention, the colorant comprises a pigment; and at least one of a dispersant and a dispersing binder.

[0064] According to one embodiment of the present invention, the colorant comprises a pigment and a dispersant.

[0065] According to one embodiment of the present invention, the colorant comprises a pigment and a dispersing binder.

[0066] According to one embodiment of the present invention, the colorant includes a pigment, a dispersant, and a dispersing binder.

[0067] According to one embodiment of the present invention, at least one of the dispersant and the dispersion binder contains the alkali-soluble polyimide resin.

[0068] According to one embodiment of the present invention, the dispersant contains the alkali-soluble polyimide resin.

[0069] According to one embodiment of the present invention, the dispersant is an alkali-soluble polyimide resin according to one embodiment of the present invention.

[0070] According to one embodiment of the present invention, the dispersion binder contains the alkali-soluble polyimide resin.

[0071] According to one embodiment of the present invention, the dispersion binder is an alkali-soluble polyimide resin according to one embodiment of the present invention.

[0072] According to one embodiment of the present invention, the colorant includes a dispersant containing an alkali-soluble polyimide resin containing repeating units represented by the chemical formulas 1 to 3, and a dispersing binder containing an alkali-soluble polyimide resin containing repeating units represented by the chemical formulas 1 to 3.

[0073] According to a preferred embodiment of the present invention, the colorant comprises a pigment; a dispersant containing an alkali-soluble polyimide resin containing repeating units represented by the chemical formulas 1 to 3; and a dispersing binder containing an alkali-soluble polyimide resin containing repeating units represented by the chemical formulas 1 to 3.

[0074] According to one embodiment of the present invention, the content of the pigment is 10 parts by weight to 50 parts by weight, or 15 parts by weight to 40 parts by weight, based on 100 parts by weight of the solid content of the photosensitive resin composition. As a preferred example, the content of the pigment is 20 parts by weight to 30 parts by weight, based on 100 parts by weight of the solid content of the photosensitive resin composition.

[0075] According to one embodiment of the present invention, the content of the dispersant is 2 parts by weight to 15 parts by weight, or 2 parts by weight to 10 parts by weight, based on 100 parts by weight of the solid content of the photosensitive resin composition. As a preferred example, the content of the dispersant is 3 parts by weight to 6 parts by weight, based on 100 parts by weight of the solid content of the photosensitive resin composition.

[0076] According to one embodiment of the present invention, the content of the dispersion binder is 2 parts by weight to 15 parts by weight, or 2 parts by weight to 10 parts by weight, based on 100 parts by weight of the solid content of the photosensitive resin composition. As a preferred example, the content of the dispersion binder is 3 parts by weight to 6 parts by weight, based on 100 parts by weight of the solid content of the photosensitive resin composition.

[0077] According to one embodiment of the present invention, the content of the pigment is 10 to 50 parts by weight, the content of the dispersant is 2 to 15 parts by weight, and the content of the dispersion binder is 2 to 15 parts by weight, relative to 100 parts by weight of the colorant. As a preferred example, the pigment, dispersant, and dispersion binder may be included in amounts of 24 parts by weight, 4.8 parts by weight, and 4.8 parts by weight, respectively, relative to 100 parts by weight of the solid content of the photosensitive resin composition, but are not limited thereto.

[0078] As described above, when the pigment is contained within the above range, high color reproduction is possible and brightness can be increased. When the dispersant and the dispersion binder are contained within the above range, the developability is excellent, or the crosslinking property is improved, and the surface smoothness can be improved.

[0079] The pigment exhibits visibility or hiding power, and red, blue, green, yellow, black pigments, etc. may be used as the pigment. Specific examples of such pigments include Carmine 6B (CI 12490), Phthalocyanine Green (CI 74260), Phthalocyanine Blue (CI 74160), Mitsubishi Carbon Black MA 100, Perylene Black (BASF K0084.K0086), Cyanine Black, Lionol Yellow (CI 21090), Lionol Yellow GRO (CI 21090), Benzidine Yellow 4T-564D, Mitsubishi Carbon Black MA-40, Victoria Pure Blue (CI 42595), CIPIGMENT RED 97, 122, 149, 168, 177, 180, 192, 215, CIPIGMENT GREEN 7, 36, CIPIGMENT 15:1, 15:4, 15:6, 22, 60, 64, CIPIGMENT 83, 139, CIPIGMENT VIOLET23 and the like, and in addition, white pigments, fluorescent pigments and the like may also be used, but are not limited to these.

[0080] According to one embodiment of the present invention, the pigment comprises carbon black alone or a mixture of carbon black and two or more color pigments. Specific examples of the carbon black include SEA-ST 5HIISAF-HS, SEA-ST KH, SEA-ST 3HHAF-HS, SEA-ST NH, SEA-ST 3M, SEA-ST 300HAF-LS, SEA-ST 116HMMAF-HS, SEA-ST 116MAF, SEA-ST FMFEF-HS, SEA-ST SOFEF, SEA-ST VGPF, SEA-ST SVHSRF-HS, and SEA-ST SSRF manufactured by Tokai Carbon Co., Ltd.; Diagram Black II, Diagram Black N339, Diagram Black SH, Diagram Black H, Diagram LH, Diagram HA, Diagram SF, Diagram N550M, Diagram M, Diagram E, Diagram G, Diagram R, Diagram N760M, Diagram LR, #2700, #2600, and #24 manufactured by Mitsubishi Chemical Corporation. 00, #2350, #2300, #2200, #1000, #980, #900, MCF88, #52, #50, #47, #45, #45L, #25, #CF9, #95, #3030, #3050, MA7, MA77, MA8, MA11, OIL7B, OIL9B, OIL11B, OIL30B, and OIL31B; Degussa PRINTEX-U, PRINTEXV, PRI NTEX-140U, PRINTEX-140V, PRINTEX-95, PRINTEX-85, PRINTEX-75, PRINTEX-55, PRINTEX-45, PRINTEX300, PRINTEX-35, PRINTEX-25, PRINTEX-200, PRINTEX-40, PRINTEX-30, PRINTEX-3, PRINTEX-A, SPECIAL BLACK550, SPECIAL BLACK-350, SPECIAL BLACK-250, SPECIAL BLACK-100, and LAMP BLACK-101;Columbia Carbon RAVEN-1100ULTRA, RAVEN-1080ULTRA, RAVEN-1060ULTRA, RAVEN-1040, RAVEN-1035, RAVEN-1020, RAVEN-1000, RAVEN-890H, RAVEN-890, RAVEN-880ULTRA, RAVEN-860ULTRA, RAVEN-850, RAVEN-820, RAVEN-790ULTRA, RAVEN780ULTRA, RAVEN Examples of suitable fluoropolymers include, but are not limited to, EN-760ULTRA, RAVEN-520, RAVEN-500, RAVEN-460, RAVEN-450, RAVEN-430ULTRA, RAVEN-420, RAVEN-410, RAVEN-2500ULTRA, RAVEN-2000, RAVEN-1500, RAVEN-1255, RAVEN-1250, RAVEN-1200, RAVEN1190ULTRA, and RAVEN-1170.

[0081] According to another embodiment of the present invention, the dispersant may be further or substituted with one or more selected from the group consisting of BYK LP N-22956, BYK LP N-22822, BYK LP N-23490, BYK LP N-22329, BYK LP N-23597, BYK LP N-23499, BYK LP N-22956, BYK LP N-22101, BYK LP N-23532, BYK LP N-23554, BYK LP N-22329, BYK LP N-23499, and the like.

[0082] According to another embodiment of the present invention, the dispersion binder may further be or may be replaced with one or more selected from the group consisting of BYK LP N-22956, BYK LP N-22822, BYK LP N-23490, BYK LP N-22329, BYK LP N-23597, BYK LP N-23499, BYK LP N-22956, BYK LP N-22101, BYK LP N-23532, BYK LP N-23554, BYK LP N-22329, BYK LP N-23499, and the like.

[0083] According to one embodiment of the present invention, the alkali-soluble polyimide resin containing the repeating units represented by the chemical formulas 1 to 3 may be included in an amount of 15 to 65 parts by weight, or 25 to 60 parts by weight, based on 100 parts by weight of the solid content of the photosensitive resin composition. As a preferred example, the alkali-soluble polyimide resin containing the repeating units represented by the chemical formulas 1 to 3 may be included in an amount of 45 to 55 parts by weight, based on 100 parts by weight of the solid content of the photosensitive resin composition, but is not limited thereto.

[0084] The alkali-soluble polyimide resin according to one embodiment of the present invention includes repeating units represented by the above-mentioned chemical formulas 1 to 3. The alkali-soluble polyimide resin may include a state in which the chemical formulas 1 to 3 are repeatedly bonded in any order. In other words, the repeating units in parentheses m to p for the chemical formulas 1 to 3 in the alkali-soluble polyimide resin according to one embodiment of the present invention may be continuously bonded, or may not be continuously bonded. For example, when m is 3, the alkali-soluble polyimide resin according to one embodiment of the present invention may include a form polymerized in the form of "-[chemical formula 1]-[chemical formula 1]-[chemical formula 1]-[chemical formula 2]n-[chemical formula 3]p-", or may include a form polymerized in the form of "-[chemical formula 3]-[chemical formula 1]-[chemical formula 2]-[chemical formula 1]n-[chemical formula 1]p-", and may be included in a state of being polymerized in any order and bonded in the polymer, without being limited to the order described above.

[0085] According to one embodiment of the present invention, X1 to X3 are the same or different and each independently represents a tetravalent organic group.

[0086] According to one embodiment of the present invention, X1 to X3 are each independently a tetravalent organic group derived from an acid anhydride or a derivative thereof.

[0087] According to one embodiment of the present invention, X1 to X3 are each independently a tetravalent organic group derived from an acid dianhydride or a derivative thereof.

[0088] The tetravalent organic group for X1 to X3 in Chemical Formula 1 may be, for example, a tetravalent aromatic organic group, a tetravalent aliphatic organic group, or a tetravalent organic group in which an aromatic group and an aliphatic group are linked to each other, and at least one carbon may be replaced with C(=O), SO2, NRx, S, or O, and Rx is an aryl group or an alkyl group.

[0089] According to one embodiment of the present invention, X1 to X3 are each independently a tetravalent organic group derived from a tetracarboxylic acid anhydride or a derivative thereof.

[0090] According to one embodiment of the present invention, X1 to X3 are each independently a tetravalent organic group derived from a tetracarboxylic dianhydride or a derivative thereof.

[0091] According to one embodiment of the present invention, X1 to X3 are each independently a tetravalent organic group derived from oxydiphthalic anhydride or a derivative thereof.

[0092] According to one embodiment of the present invention, X1 to X3 are each independently a tetravalent organic group derived from oxydiphthalic dianhydride or a derivative thereof.

[0093] According to one embodiment of the present invention, X1 to X3 are any one selected from the following chemical formulas X-1 to X-5. [Chemical formula X-1] [ka] [Chemical formula X-2] [ka] [Chemical formula X-3] [ka] [Chemical formula X-4] [ka] [Chemical formula X-5] [ka] In the chemical formulas X-1 to X-5, C1 to C3 rings are the same or different and each independently represents an aromatic hydrocarbon ring; the C4 ring to the C6 ring are the same or different and each independently represents an aliphatic hydrocarbon ring; Lcx is a single bond, -O-, -CO-, -COO-, -S-, -SO-, -SO2-, -CRC1RC2-, -(CH2) CZ -, -O(CH2) CZ O-, -COO(CH2) CZ OCO-, -O(C6H6) CZ O CZ is any one selected from the group consisting of -, -CONH-, and a phenylene group; R and R are the same or different and each independently represents an alkyl group having 1 to 10 carbon atoms or a haloalkyl group having 1 to 10 carbon atoms; cz is an integer from 1 to 10.

[0094] According to one embodiment of the present invention, the C1 to C6 rings may be substituted with a halogen group or an alkyl group having 1 to 10 carbon atoms.

[0095] According to one embodiment of the present invention, the C1 to C3 rings are the same or different and each independently is an aromatic hydrocarbon ring having 6 to 18 carbon atoms.

[0096] According to one embodiment of the present invention, the C4 ring to C6 ring are the same or different and each independently is an aliphatic hydrocarbon ring having 4 to 18 carbon atoms.

[0097] According to one embodiment of the present invention, the formula X-1 is any one selected from the following structures: [ka] In the above structure, * denotes a linking site.

[0098] According to one embodiment of the present invention, the formula X-2 is any one selected from the following structures: [ka] In the above structure, * denotes a linking site.

[0099] According to one embodiment of the present invention, the formula X-3 is any one selected from the following structures: [ka] In the above structure, * denotes a linking site.

[0100] According to one embodiment of the present invention, the formula X-4 is any one selected from the following structures: [ka] In the above structure, * denotes a linking site.

[0101] According to one embodiment of the present invention, X1 to X3 are any one selected from the following structures: [ka]

[0102] According to a preferred embodiment of the present invention, X1 to X3 are any one selected from the following structures: [ka]

[0103] According to one embodiment of the present invention, Y1 to Y3 are the same or different and each independently represents a divalent organic group.

[0104] According to one embodiment of the present invention, Y1 to Y3 are the same or different and each independently represents an organic group derived from a diamine or a derivative thereof.

[0105] According to one embodiment of the present invention, Y1 to Y3 are the same or different and each independently represents a divalent organic group derived from a diamine or a derivative thereof.

[0106] According to one embodiment of the present invention, Y1 to Y3 are the same or different and each independently represent a divalent organic group containing a hydroxy group; a phenolic hydroxy group; or a substituted or unsubstituted haloalkyl group.

[0107] According to one embodiment of the present invention, Y1 to Y3 are the same or different and each independently represent a divalent organic group containing a hydroxy group; a phenolic hydroxy group; or a substituted or unsubstituted haloalkyl group having 1 to 10 carbon atoms.

[0108] According to one embodiment of the present invention, Y1 to Y3 are the same or different and each independently represents a divalent organic group containing a hydroxy group; a phenolic hydroxy group; or a haloalkyl group.

[0109] According to one embodiment of the present invention, Y1 to Y3 are the same or different and each independently represents a divalent organic group containing a hydroxy group; a phenolic hydroxy group; or a haloalkyl group having 1 to 10 carbon atoms.

[0110] According to one embodiment of the present invention, Y1 to Y3 are the same or different and each independently represents a divalent organic group containing a hydroxy group, a phenolic hydroxy group, or a trifluoromethyl group.

[0111] According to one embodiment of the present invention, Y1 to Y3 are the same or different and each independently represent a divalent organic group containing a hydroxy group; a phenolic hydroxy group; or a trifluoromethyl group and derived from a diamine or a derivative thereof.

[0112] The divalent organic group may be a divalent aliphatic organic group, a divalent aromatic organic group, or a divalent organic group in which an aliphatic group and an aromatic group are linked to each other, and at least one carbon may be replaced with C(=O), SO2, NRx, S, or O, and Rx is an aryl group or an alkyl group, and may be substituted with a halogen group, a hydroxyl group, a carboxyl group, a thiol group, a sulfonic acid group, or an alkyl group.

[0113] According to one embodiment of the present invention, Y1 to Y3 are any one selected from the following chemical formulae Y-1 to Y-4. [Chemical formula Y-1] [ka] [Chemical formula Y-2] [ka] [Chemical formula Y-3] [ka] [Chemical formula Y-4] [ka] In the chemical formulas Y-1 to Y-4, Lcy is any one selected from the group consisting of a single bond, -O-, -CO-, -COO-, -S-, -SO-, -SO2-, -CRC1RC2-, -C(C6H6)-, -C(C6H6)-, and -NRC3-; RC3 is an aryl group; The definitions of rings C1 to C6, RC1, and RC2 are the same as those in chemical formulas X-1 to X-5.

[0114] According to one embodiment of the invention, R C3 is a phenyl group.

[0115] According to one embodiment of the present invention, the C1 to C6 rings and Lcy may each independently be substituted with a substituent containing a hydroxy group.

[0116] According to one embodiment of the present invention, the C1 to C6 rings and Lcy may each independently be substituted with a hydroxyl group or a carboxyl group.

[0117] According to one embodiment of the present invention, the formula Y-1 is any one selected from the following structures: [ka] In the above structure, * denotes a linking site.

[0118] According to one embodiment of the present invention, the formula Y-2 is any one selected from the following structures: [ka] In the above structure, * denotes a linking site.

[0119] According to one embodiment of the present invention, the formula Y-3 is any one selected from the following structures: [ka] In the above structure, * denotes a linking site.

[0120] According to one embodiment of the present invention, Y1 to Y3 are any one selected from the following structural formulas. [ka]

[0121] According to one embodiment of the present invention, R7 is hydrogen; deuterium; a hydroxy group; a halogen group; a nitro group; a nitrile group; a substituted or unsubstituted alkyl group; a substituted or unsubstituted alkenyl group; a substituted or unsubstituted alkynyl group; a substituted or unsubstituted alkoxy group; a substituted or unsubstituted aryloxy group; a substituted or unsubstituted cycloalkyl group; a substituted or unsubstituted aryl group; a substituted or unsubstituted heterocyclic group; or a photopolymerizable unsaturated group.

[0122] The photosensitive resin composition according to an embodiment of the present invention can increase adhesion to a substrate used in a display device such as an organic light emitting device due to the binding force of the photopolymerizable unsaturated group.

[0123] According to one embodiment of the present invention, R7 is hydrogen; deuterium; a hydroxy group; a halogen group; a nitro group; a nitrile group; a substituted or unsubstituted alkyl group having 1 to 30 carbon atoms; a substituted or unsubstituted alkenyl group having 1 to 30 carbon atoms; a substituted or unsubstituted alkynyl group having 1 to 30 carbon atoms; a substituted or unsubstituted alkoxy group having 1 to 30 carbon atoms; a substituted or unsubstituted aryloxy group having 6 to 30 carbon atoms; a substituted or unsubstituted cycloalkyl group having 3 to 30 carbon atoms; a substituted or unsubstituted aryl group having 6 to 30 carbon atoms; a substituted or unsubstituted heterocyclic group having 2 to 30 carbon atoms; or a photopolymerizable unsaturated group.

[0124] According to one embodiment of the present invention, R7 is hydrogen; deuterium; a hydroxy group; a halogen group; a substituted or unsubstituted alkenyl group; a substituted or unsubstituted alkynyl group; a substituted or unsubstituted alkoxy group; a substituted or unsubstituted aryloxy group; or a photopolymerizable unsaturated group.

[0125] According to one embodiment of the present invention, R7 is hydrogen; deuterium; a hydroxy group; a halogen group; a substituted or unsubstituted alkenyl group having 1 to 30 carbon atoms; a substituted or unsubstituted alkynyl group having 1 to 30 carbon atoms; a substituted or unsubstituted alkoxy group having 1 to 30 carbon atoms; a substituted or unsubstituted aryloxy group having 6 to 30 carbon atoms; or a photopolymerizable unsaturated group.

[0126] According to one embodiment of the present invention, R7 is a photopolymerizable unsaturated group.

[0127] According to one embodiment of the present invention, the photopolymerizable unsaturated group may be a substituted or unsubstituted acryloyl group; or a substituted or unsubstituted acrylate group, etc. Specifically, the (meth)acrylate group may be one or a mixture of two or more selected from the group consisting of propyl acrylate, propylene glycol methacrylate, dipentaerythritol hexaacrylate, dipentaerythritol acrylate, neopentyl glycol diacrylate, 6-hexanediol diacrylate, 1,6-hexanediol acrylate tetraethylene glycol methacrylate, bisphenoxyethyl alcohol diacrylate, trishydroxyethyl isocyanurate trimethacrylate, trimethylpropane trimethacrylate, diphenyl pentaerythritol hexaacrylate, pentaerythritol trimethacrylate, pentaerythritol tetramethacrylate, and dipentaerythritol hexamethacrylate, but is not limited thereto.

[0128] According to one embodiment of the present invention, R7 is a substituted or unsubstituted acryloyl group; or a substituted or unsubstituted acrylate group.

[0129] According to one embodiment of the present invention, R7 is a substituted or unsubstituted propyl acrylate.

[0130] According to one embodiment of the present invention, R7 is represented by the following chemical formula B. [Chemical formula B] [ka] Rb is hydrogen or an alkyl group having 1 to 4 carbon atoms; b is an integer from 1 to 10; In the above chemical formula B, [ka] means the site of binding to N in the above chemical formula A.

[0131] According to a preferred embodiment of the present invention, Rb in formula B is hydrogen.

[0132] According to one embodiment of the present invention, b is an integer equal to 1. According to another embodiment of the present invention, b is an integer equal to 2. According to yet another embodiment of the present invention, b is an integer equal to 3. According to yet another embodiment of the present invention, b is an integer equal to 4. According to yet another embodiment of the present invention, b is an integer equal to 5. According to yet another embodiment of the present invention, b is an integer equal to 6. According to yet another embodiment of the present invention, b is an integer equal to 7. According to yet another embodiment of the present invention, b is an integer equal to 8. According to yet another embodiment of the present invention, b is an integer equal to 9. According to yet another embodiment of the present invention, b is an integer equal to 10.

[0133] According to one embodiment of the present invention, p / (m+n+p) may be 0.03 to 0.15 for m to p in the chemical formulas 1 to 3. According to another embodiment, p / (m+n+p) may be 0.08 to 0.15 or less for m to p in the chemical formulas 1 to 3. According to still another embodiment, p / (m+n+p) may be 0.1 to 0.15 or less for m to p in the chemical formulas 1 to 3.

[0134] For m to p in the above chemical formulas 1 to 3, the ratios of m, n, and p to the sum of m+n+p mean the ratio of rings that are closed or not closed. Specifically, the structure in parentheses for m or n is imidized and ring-closed. Thus, the sum of the ratios of m and n to the sum of m+n+p means the ring-closure rate of the alkali-soluble polyimide resin. In contrast, the structure in parentheses for p is not imidized and is not ring-closed. Thus, the ratio of p to the sum of m+n+p means the ratio of rings that are not closed in the alkali-soluble polyimide resin.

[0135] The ring closure rate of the photosensitive resin composition according to one embodiment of the present invention may be 85% to 97%. According to another embodiment, the ring closure rate of the photosensitive resin composition may be 85% to 95%. According to still another embodiment, the ring closure rate of the photosensitive resin composition may be 85% to 90%. According to yet another embodiment, the ring closure rate of the photosensitive resin composition may be 90% to 95%. However, the range of the ring closure rate of the photosensitive resin composition is not limited to the specific numerical range described above.

[0136] As described above, according to one embodiment of the present invention, a photosensitive resin composition including an alkali-soluble polyimide resin having a ring closure rate of 85% to 95% prevents swelling or a decrease in solubility due to ring closure of side chains during development. Specifically, the ring closure rate increases due to imidization during a process such as development, preventing a decrease in solubility or swelling.

[0137] According to one embodiment of the present invention, the weight average molecular weight of the alkali-soluble polyimide resin in the photosensitive resin composition is 1,000 g / mol to 35,000 g / mol, 2,000 g / mol to 33,000 g / mol, or 2,500 g / mol to 33,000 g / mol. When the weight average molecular weight is within the above range, the photosensitive resin composition containing the alkali-soluble polyimide resin has excellent physical and chemical properties, suitable viscosity, and excellent adhesion to a substrate.

[0138] According to one embodiment of the present invention, the colorant may be used as a dispersion together with the pigment, the dispersant, and the dispersant. The solvent for producing the dispersion may be the same as the solvent for producing the photosensitive resin composition according to one embodiment of the present invention described later.

[0139] According to one embodiment of the present invention, the solvent may be any compound known in the art to which the present invention pertains that enables the formation of a photosensitive resin composition, without any particular limitation. For example, the solvent may be one or more compounds selected from the group consisting of esters, ethers, ketones, aromatic hydrocarbons, and sulfoxides.

[0140] The ester solvent may be ethyl acetate, n-butyl acetate, isobutyl acetate, amyl formate, isoamyl acetate, isobutyl acetate, butyl propionate, isopropyl butyrate, ethyl butyrate, butyl butyrate, methyl lactate, ethyl lactate, γ-butyrolactone, ε-caprolactone, δ-valerolactone, alkyl oxyacetate (e.g., methyl oxyacetate, ethyl oxyacetate, butyl oxyacetate (e.g., methyl methoxyacetate, ethyl methoxyacetate, butyl methoxyacetate, methyl ethoxyacetate, ethyl ethoxyacetate, etc.)), alkyl 3-oxypropionate (e.g., methyl 3-oxypropionate, ethyl 3-oxypropionate, etc. (e.g., methyl 3-methoxypropionate, ethyl 3-methoxypropionate, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, etc.), ethyl 2-oxypropionate, etc.), 2-oxypropionic acid alkyl esters (for example, methyl 2-oxypropionate, ethyl 2-oxypropionate, propyl 2-oxypropionate, etc. (for example, methyl 2-methoxypropionate, ethyl 2-methoxypropionate, propyl 2-methoxypropionate, methyl 2-ethoxypropionate, ethyl 2-ethoxypropionate)), methyl 2-oxy-2-methylpropionate and ethyl 2-oxy-2-methylpropionate (for example, methyl 2-methoxy-2-methylpropionate, ethyl 2-ethoxy-2-methylpropionate, etc.), methyl pyruvate, ethyl pyruvate, propyl pyruvate, methyl acetoacetate, ethyl acetoacetate, methyl 2-oxobutanoate, ethyl 2-oxobutanoate, etc.

[0141] The ether solvent may be diethylene glycol dimethyl ether, tetrahydrofuran, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, methyl cellosolve acetate, ethyl cellosolve acetate, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, propylene glycol monopropyl ether acetate, and the like.

[0142] The ketone solvent may be methyl ethyl ketone, cyclohexanone, cyclopentanone, 2-heptanone, 3-heptanone, N-methyl-2-pyrrolidone, or the like.

[0143] The aromatic hydrocarbon solvent may be toluene, xylene, anisole, limonene, and the like.

[0144] The sulfoxide solvent may be dimethyl sulfoxide or the like. In one embodiment of the present invention, the solvent may be propylene glycol monomethyl ether acetate.

[0145] In one embodiment of the present invention, the solvent may preferably be a mixture of propylene glycol monomethyl ether acetate, diethylene glycol methyl ethyl ether, and γ-butyrolactone.

[0146] The solvent may contain propylene glycol monomethyl ether acetate, diethylene glycol methyl ethyl ether, and γ-butyrolactone in a weight ratio of 50:20:2 to 70:50:10. The solvent may contain propylene glycol monomethyl ether acetate, diethylene glycol methyl ethyl ether, and γ-butyrolactone in a weight ratio of preferably 60:35:5.

[0147] According to an embodiment of the present invention, the content of the solvent may be 10 parts by weight to 85 parts by weight; or 15 parts by weight to 80 parts by weight, based on 100 parts by weight of the photosensitive resin composition.

[0148] When the content of the solvent is within the above range, or when a mixed solution is used as the solvent, the mixing ratio is within the above range, the photosensitive resin composition may have excellent coatability or a coating film with excellent flatness may be obtained.

[0149] According to one embodiment of the present invention, the photosensitive resin composition may further include additives required by those skilled in the art.

[0150] Examples of the additives include, but are not limited to, polyfunctional monomers, crosslinking agents, photopolymerization initiators, surfactants, and silane coupling agents.

[0151] According to an embodiment of the present invention, the photosensitive resin composition further includes at least one of a multifunctional monomer, a crosslinking agent, a photopolymerization initiator, a surfactant, and a silane coupling agent.

[0152] According to one embodiment of the present invention, the photosensitive resin composition further comprises a polyfunctional monomer, a crosslinking agent, a photopolymerization initiator, a surfactant, and a silane coupling agent.

[0153] According to one embodiment of the present invention, the multifunctional monomer may be one or more of unsaturated carboxylic acid esters; aromatic vinyls; unsaturated ethers; unsaturated imides; and acid anhydrides, and may further include other multifunctional monomers known in the art.

[0154] The polyfunctional monomer may be included in an amount of 1 part by weight to 40 parts by weight, or 15 parts by weight to 35 parts by weight, based on 100 parts by weight of the solid content of the photosensitive resin composition. As a preferred example, the polyfunctional monomer may be included in an amount of 20 parts by weight to 30 parts by weight, based on 100 parts by weight of the solid content of the photosensitive resin composition, but is not limited thereto.

[0155] Specific examples of the unsaturated carboxylate esters include benzyl (meth)acrylate, methyl (meth)acrylate, ethyl (meth)acrylate, butyl (meth)acrylate, dimethylaminoethyl (meth)acrylate, isobutyl (meth)acrylate, t-butyl (meth)acrylate, cyclohexyl (meth)acrylate, isobornyl (meth)acrylate, ethylhexyl (meth)acrylate, 2-phenoxyethyl (meth)acrylate, tetrahydrofurfuryl (meth)acrylate, hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 2-hydroxy-3-chloropropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, acyloctyloxy-2-hydroxypropyl (meth)acrylate, glycerol (meth)acrylate, 2-methoxyethyl (meth)acrylate, 3-methoxybutyl (meth)acrylate, ethoxydiethylene glycol (meth)acrylate, acrylate, methoxytriethylene glycol (meth)acrylate, methoxytripropylene glycol (meth)acrylate, poly(ethylene glycol) methyl ether (meth)acrylate, phenoxydiethylene glycol (meth)acrylate, p-nonylphenoxypolyethylene glycol (meth)acrylate, p-nonylphenoxypolypropylene glycol (meth)acrylate, glycidyl (meth)acrylate, tetrafluoropropyl (meth)acrylate, 1,1,1,3,3,3-hexafluoroisopropyl (meth)acrylate, octafluoropentyl (meth)acrylate, heptadecafluorodecyl (meth)acrylate, tribromophenyl (meth)acrylate, methyl alpha-hydroxymethyl acrylate, ethyl alpha-hydroxymethyl acrylate, propyl alpha-hydroxymethyl acrylate, and butyl alpha-hydroxymethyl acrylate.

[0156] Other examples of the polyfunctional monomer include, but are not limited to, one or more of pentaerythritol tetra(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol penta(meth)acrylate, and dipentaerythritol hexa(meth)acrylate.

[0157] According to one embodiment of the present invention, the content of the alkali-soluble hydroxy group is 30 parts by weight or more based on 100 parts by weight of the polyfunctional monomer.

[0158] According to one embodiment of the present invention, the content of the alkali-soluble hydroxyl group is 30 to 85 parts by weight based on 100 parts by weight of the polyfunctional monomer. Thus, an alkali-soluble polyimide resin containing 30 parts by weight or more of the alkali-soluble hydroxyl group based on 100 parts by weight of the polyfunctional monomer can have excellent developability. The content of the alkali-soluble hydroxyl group can be derived from the ratio of the weight part of the hydroxyl group to 100 parts by weight of the compound containing the alkali-soluble hydroxyl group. For example, in the case of a phenol monomolecule, the content of one hydroxyl group present in the phenol monomolecule can be calculated from the ratio of the weight part of one hydroxyl group present in the phenol monomolecule to 100 parts by weight of phenol. Specifically, the molecular weight of phenol is 94 g / mol, and one hydroxyl group present in phenol is 17 g / mol, and is contained at a ratio of about 18.09 parts by weight to 100 parts by weight of phenol.

[0159] According to one embodiment of the present invention, the content of the alkali-soluble hydroxy group is 50 parts by weight or more based on 100 parts by weight of the polyfunctional monomer.

[0160] According to one embodiment of the present invention, the content of the alkali-soluble hydroxy group is 50 parts by weight to 70 parts by weight based on 100 parts by weight of the polyfunctional monomer.

[0161] According to one embodiment of the present invention, when the content of the alkali-soluble hydroxy group is 50 parts by weight to 70 parts by weight per 100 parts by weight of the polyfunctional monomer, the alkali-soluble polyimide resin can have excellent developability even when the weight average molecular weight is in the range of 1,000 g / mol to 20,000 g / mol.

[0162] According to another embodiment of the present invention, the content of the alkali-soluble hydroxy group is 70 parts by weight or more based on 100 parts by weight of the polyfunctional monomer.

[0163] According to another embodiment of the present invention, the content of the alkali-soluble hydroxy group is 70 to 85 parts by weight based on 100 parts by weight of the polyfunctional monomer.

[0164] According to another embodiment of the present invention, when the content of the alkali-soluble hydroxy group is 70 parts by weight to 85 parts by weight per 100 parts by weight of the polyfunctional monomer, the alkali-soluble polyimide resin can have excellent developability even when the weight average molecular weight is in the range of 20,000 g / mol or more.

[0165] When the weight average molecular weight of the alkali-soluble polyimide resin satisfies the above-mentioned range and the content of the alkali-soluble hydroxyl group based on 100 parts by weight of the polyfunctional monomer satisfies the above-mentioned range, it is possible to obtain an effect of increasing the developability in a developer, improving the sensitivity, or increasing the mechanical properties.

[0166] The crosslinking agent induces a crosslinking reaction between the alkali-soluble polyimide resin or other added components, and can increase the heat resistance and chemical resistance of the resulting film. In this case, the crosslinking agent may be a compound containing a functional group such as an acrylic group. In addition, an example of the crosslinking agent is a thermal crosslinking agent, and such a thermal crosslinking agent may be a compound containing a thermally reactive functional group such as a methylol group or an epoxy group. Specific examples include crosslinkers commonly used in the art, such as DML-PC, DML-PEP, DML-OC, DML-OEP, DML-34X, DML-PTBP, DML-PCHP, DML-OCHP, DML-PFP, DML-PSBP, DML-POP, DML-MBOC, DML-MBPC, DML-MTrisPC, DML-BisOC-Z, DML-BisOCHP-Z, DML-BPC, DML-BisOC-P, DMOM-PC, DMOM-PTBP, DMOM-MBPC, TriML-P, TriML-35XL, TML-HQ, TML-BP, TML-pp-BPF, TML-BPE, TML-BPA, and TML-B PAF, TML-BPAP, TMOM-BP, TMOM-BPE, TMOM-BPA, TMOM-BPAF, TMOM-BPAP, HML-TPPHBA, HML-TPHAP, HMOM-TPPHBA, HMOM-TPHAP (all trade names, manufactured by Honshu Chemical Industry Co., Ltd.), "NIKALAC" (registered trademark) MX-290, "NIKALAC" (registered trademark) MX-280, "NIKALAC" (registered trademark) MX-270, "NIKALAC" (registered trademark) MX-279, "NIKALAC" (registered trademark) MW-100LM, "NIKALAC" (registered trademark) MX-750LM (all trade names, manufactured by Sanwa Chemical Co., Ltd.), and the like may also be used.

[0167] According to one embodiment of the present invention, the crosslinking agent may be included in an amount of 0.1 to 40 parts by weight based on 100 parts by weight of the solid content of the photosensitive resin composition. As a preferred example, the crosslinking agent may be included in an amount of 20 to 25 parts by weight based on 100 parts by weight of the solid content of the photosensitive resin composition, but is not limited thereto.

[0168] The photopolymerization initiator is a material that generates radicals by light to trigger crosslinking, and is preferably a mixture of one or more compounds selected from the group consisting of acetophenone-based compounds, biimidazole-based compounds, triazine-based compounds, and octyl compounds.

[0169] According to one embodiment of the present invention, the photopolymerization initiator may be included in an amount of 0.1 to 10 parts by weight based on 100 parts by weight of the solid content of the photosensitive resin composition. As a preferred example, the photopolymerization initiator may be included in an amount of 4 to 5 parts by weight based on 100 parts by weight of the solid content of the photosensitive resin composition, but is not limited thereto.

[0170] The surfactant is a silicone surfactant or a fluorine surfactant. Specific examples of the silicone surfactant include BYK-077, BYK-085, BYK-300, BYK-301, BYK-302, BYK-306, BYK-307, BYK-310, BYK-320, BYK-322, BYK-323, BYK-325, and BYK-330 manufactured by BYK-Chemie. , BYK-331, BYK-333, BYK-335, BYK-341v344, BYK-345v346, BYK-348, BYK-354, BYK-355, BYK-356, BYK-358, BYK-361, BYK-370, BYK-371, BYK-375, BYK-380, BYK-390, etc. may also be used. As the fluorine-based surfactant, DIC (DaiNippon Ink & F-114, F-177, F-410, F-411, F-450, F-493, F-494, F-443, F-444, F-445, F-446, F-470, F-471, F-472SF, F-474, F-475, F-477, F-478, F-479, F-480SF, F-482, F-483, F-484, F-486, F-487, F-489, F-490, F-491, F-492SF, F-474, F-475, F-477, F-478, F-479, F-480SF, F-482, F-483, F-484, F-486, F-487, F-488, F-489, F-489, F-480SF ... TF-487, F-172D, MCF-350SF, TF-1025SF, TF-1117SF, TF-1026SF, TF-1128, TF-1127, TF-1129, TF-1126, TF-1130, TF-1116SF, TF-1131, TF1132, TF1027SF, TF-1441, TF-1442, etc. may be used, but are not limited thereto. For example, BYK-307 may be used.

[0171] According to one embodiment of the present invention, the surfactant may be included in an amount of 0.1 to 5 parts by weight based on 100 parts by weight of the solid content of the photosensitive resin composition. As another example, the surfactant may be included in an amount of 0.2 to 0.4 parts by weight based on 100 parts by weight of the solid content of the photosensitive resin composition. As a preferred example, the surfactant may be included in an amount of 0.25 to 0.35 parts by weight based on 100 parts by weight of the solid content of the photosensitive resin composition, but is not limited thereto.

[0172] In the case of the silane coupling agent, it may be used to improve the dispersibility of a thermally conductive filler such as alumina, and various known in the art may be used without limitation as long as it can exhibit the above-mentioned action. The silane coupling agent means a compound containing a hydrolyzable silyl group or silanol group. In addition, the silane coupling agent can increase the mutual adhesion between a specific surface of a film formed by curing and a substrate, and increase heat resistance and chemical resistance. Examples of the silane coupling agent may be one or more selected from octyltrimethoxysilane, dodecyltrimethoxysilane, octadecyltrimethoxysilane, etc., but are not limited thereto.

[0173] According to one embodiment of the present invention, the content of the silane coupling agent may be 0.1 to 2 parts by weight based on 100 parts by weight of the solid content of the photosensitive resin composition. As a preferred example, the content of the silane coupling agent may be 0.2 to 1 part by weight based on 100 parts by weight of the solid content of the photosensitive resin composition, but is not limited thereto.

[0174] According to an embodiment of the present invention, the photosensitive resin composition may further include an additional additive, such as, but not limited to, an antioxidant and a thermal polymerization inhibitor.

[0175] The antioxidant can prevent a chain reaction that generates radicals during the formation of the polymer film. In this case, the antioxidant may include a phenol-based antioxidant, and may be 2,2-thiobis(4-methyl-6-t-butylphenol) or 2,6-g,t-butylphenol, which are antioxidants commonly used in the art, and the UV absorber may be 2-(3-t-butyl-5-methyl-2-hydroxyphenyl)-5-chloro-benzotriazole or alkoxybenzophenone, but is not limited thereto.

[0176] According to one embodiment of the present invention, when the antioxidant is included, the content of the antioxidant may be 0.1 parts by weight to 10 parts by weight; or 0.2 parts by weight to 1 part by weight, based on 100 parts by weight of the solid content of the photosensitive resin composition.

[0177] As the thermal polymerization inhibitor, hydroquinone, p-methoxyphenol, di-t-butyl-p-cresol, pyrogallol, t-butylcatechol, benzoquinone, 4,4-thiobis(3-methyl-6-t-butylphenol), 2,2-methylenebis(4-methyl-6-t-butylphenol), 2-mercaptoimidazole, or the like may be used.

[0178] According to one embodiment of the present invention, when the thermal polymerization inhibitor is included, the content of the thermal polymerization inhibitor may be 0.1 parts by weight to 10 parts by weight; or 0.2 parts by weight to 1 part by weight, based on 100 parts by weight of the solid content of the photosensitive resin composition.

[0179] One embodiment of the present invention provides a photosensitive material comprising the photosensitive resin composition.

[0180] In one embodiment of the present invention, a photosensitive material is prepared using the photosensitive resin composition of the present invention. More specifically, the photosensitive resin composition of the present invention is applied to a substrate by a suitable method to form a thin film or a patterned photosensitive material.

[0181] The coating method is not particularly limited, and may be a spray method, a roll coating method, a spin coating method, etc., and generally, a spin coating method is widely used. After the coating film is formed, the residual solvent may be partially removed under reduced pressure, if necessary.

[0182] The photopolymerizable unsaturated group contained in the photosensitive resin composition or the photosensitive material according to one embodiment of the present invention may be cured by a light source such as a mercury vapor arc, a carbon arc, or a Xe arc that emits light having a wavelength of 250 nm to 450 nm, but is not limited thereto.

[0183] The photosensitive resin composition according to one embodiment of the present invention may be used as a pigment dispersion type photosensitive material for manufacturing a color filter of a thin film transistor liquid crystal display (TFT LCD), a photosensitive material for a black matrix of a thin film transistor liquid crystal display (TFT LCD) or an organic light emitting diode, a photosensitive material for forming an overcoat layer, a column spacer photosensitive material, a photocurable paint, a photocurable ink, a photocurable adhesive, a printing plate, a photosensitive material for a printed wiring board, a photosensitive material for a plasma display panel (PDP), and the like, and its application is not particularly limited.

[0184] One embodiment of the present invention provides a photosensitive resin composition for a color filter or a photosensitive material for a color filter.

[0185] According to one embodiment of the present invention, the color filter can be manufactured using the above-mentioned photosensitive resin composition or the above-mentioned photosensitive material. The photosensitive resin composition is applied onto a substrate to form a coating film, and the coating film is exposed to light, developed, and cured to form a color filter.

[0186] According to one embodiment of the present invention, the substrate may be a glass plate, a silicon wafer, or a plate made of a plastic material such as polyethersulfone (PES) or polycarbonate (PC), and the type of the substrate is not particularly limited.

[0187] According to an embodiment of the present invention, the color filter may include a red pattern, a green pattern, a blue pattern, or a black matrix.

[0188] According to one embodiment, the color filter may further include an overcoat layer.

[0189] A grid-like black pattern called a black matrix may be placed between the color pixels of the color filter in order to improve contrast. Chromium may be used as the material for the black matrix. In this case, a method may be used in which chromium is evaporated onto the entire glass substrate and the pattern is formed by etching. However, in consideration of the high process costs, the high reflectance of chromium, and environmental pollution caused by chromium waste liquid, a resin black matrix formed by a pigment dispersion method that allows fine processing may be used.

[0190] The black matrix according to an embodiment of the present invention may further include a black pigment or a black dye as an additional colorant other than the colorants included in the colorants described above. For example, carbon black may be used alone or may be used in combination with a color pigment. In this case, since a color pigment with insufficient light blocking properties is mixed, there is an advantage that the strength of the film or adhesion to the substrate is not reduced even if the amount of the colorant is relatively increased.

[0191] The black matrix according to an embodiment of the present invention may include a black pigment or a black dye as an additional colorant instead of the colorants included in the above-mentioned colorants.

[0192] A preferred embodiment of the present invention provides a photosensitive resin composition for a black matrix or a photosensitive material for a black matrix.

[0193] The term "for use in a black matrix" encompasses all of the meanings of uses for forming a black matrix, uses included in a black matrix, and the like.

[0194] One embodiment of the present invention provides a black matrix comprising the above-described photosensitive resin composition.

[0195] One embodiment of the present invention provides a display device comprising the color filter.

[0196] The display device may be any one of a plasma display panel (PDP), a light emitting diode (LED), an organic light emitting diode (OLED), a liquid crystal display (LCD), a thin film transistor-liquid crystal display (LCD-TFT), and a cathode ray tube (CRT).

[0197] One embodiment of the present invention provides an electronic device comprising a black matrix as described above.

[0198] The electronic device may include, but is not limited to, an interlayer insulating film of a semiconductor device, the above-mentioned color filter, the above-mentioned black matrix, an overcoat, a column spacer, a passivation film, a buffer coating film, an insulating film for a multilayer printed circuit board, a cover coat of a flexible copper-clad board, a buffer coating film, an insulating film solder resist film for a multilayer printed circuit board, an insulating film of an OLED, a protective film for a thin film transistor of a liquid crystal display device, an electrode protective film and a semiconductor protective film of an organic EL device, an OLED insulating film, an LCD insulating film, a semiconductor insulating film, the above-mentioned display device, and the like.

[0199] Hereinafter, the present invention will be described in detail with reference to examples. However, the examples according to the present invention may be modified in various different forms, and the scope of the present invention should not be construed as being limited to the following examples. The examples of the present invention are provided to more completely explain the present invention to those having ordinary skill in the art.

[0200] Manufacturing Example

[0201] <Production Example of Resin A> In a round bottom flask, 14.4g (0.31mol) of 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane (Bis-AP-AF) was added to 500g of propylene glycol monomethyl ether acetate (PGMEA) and dissolved at 60°C. 91.1g (0.29mol) of bis(3,4-dicarboxyphenyl)ether dianhydride (ODPA) was added and stirred for 2 hours, and then 7.2g (0.03mol) of phthalic anhydride was added as an end-capping agent and stirred for another 2 hours. Next, the temperature was raised to 170°C and stirred for 6 hours. Then, it was cooled to room temperature. The weight average molecular weight (Mw) of the polymerized resin A measured by gel permeation chromatography (GPC) was 15,000 g / mol, and the degree of imidization (DOI) of the polymerized resin A measured by infrared spectroscopy (IR) was 92%. The weight average molecular weight of the polymerized resin A was measured by gel permeation chromatography in a solvent of tetrahydrofuran (THF).

[0202] <Production Examples of Resins A1 and A2> The polymerized resin A solution was stirred at room temperature. 20 mol% and 60 mol% of acryloyloxyethyl isocyanate (2-Isocyanatoethyl acrylate, AOI, CAS 13641-96-8) were added based on the total equivalent of 100 mol% of 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane (Bis-AP-AF) of resin A, respectively. The temperature of the reactor was raised to 60°C and stirred for 12 hours to polymerize resins A1 and A2, respectively. The weight average molecular weights (Mw) of the polymerized resins A1 and A2 measured by gel permeation chromatography (GPC) were 9,730 g / mol and 9,840 g / mol, and the degree of imidization (DOI) of the resins A1 and A2 measured by infrared spectroscopy (IR) was 93.90% and 93.80%.

[0203] <Production of Resins B and C> Resins B and C were prepared in the same manner as in the preparation of Resin A, except that the reactants were prepared as shown in Table 1 below.

[0204] [Table 1]

[0205] In Table 1, Bis-APAF is 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane, ODPA is bis(3,4-dicarboxyphenyl)ether dianhydride, 6FDA is 4,4'-(hexafluoroisopropylidene)diphthalic anhydride, PA is phthalic anhydride, PGMEA is propylene glycol monomethyl ether acetate, TFMB is 2,2'-bis(trifluoromethyl)benzidine, Mw is weight average molecular weight, and PDI is molecular weight distribution.

[0206] <Production of Resins B1 and B2> The polymerized resin B solution was stirred at room temperature. 20 mol% and 40 mol% of acryloyloxyethyl isocyanate (2-Isocyanatoethyl acrylate, AOI, CAS 13641-96-8) were added based on the total equivalent of 100 mol% of 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane (Bis-AP-AF) in resin B. The temperature of the reactor was raised to 60°C and stirred for 12 hours to polymerize resins B1 and B2, respectively.

[0207] The weight average molecular weights (Mw) of the polymerized resins B1 and B2 measured by gel permeation chromatography (GPC) were 8,150 g / mol and 8,320 g / mol, and the degree of imidization (DOI) of the resins B1 and B2 measured by infrared spectroscopy (IR) was 94.40% and 94.30%.

[0208] <Examples 1 to 4 and Comparative Examples 1 to 3> Using the binder resins A, B, C, A1, A2, B1, and B2 produced in the above Production Examples, photosensitive resin compositions containing an alkali-soluble polyimide resin were produced as Examples 1 to 4, as shown in Table 2 below, and photosensitive resin compositions not containing an alkali-soluble polyimide resin were produced as Comparative Examples 1 to 3.

[0209] [Table 2] JPEG0007626349000036.jpg5973

[0210] In Table 2, the colorant contains a pigment, a dispersant, and a dispersion binder. The weight ratios of the pigment, dispersant, and dispersion binder contained in the colorant are 15 parts by weight, 3 parts by weight, and 3 parts by weight, respectively, relative to 100 parts by weight of the colorant. OBP-1 manufactured by BASF was used as the pigment, and propylene glycol monomethyl ether acetate (PGMEA) was used as the solvent for producing the colorant. The dispersant and dispersion binder contained in the colorant were the same resins as the binder resins used in Examples 1 to 4 and Comparative Examples 1 to 3. Specifically, the dispersant and dispersion binder in Example 1 were the binder resins used in Example 1 (polymer compounds in which resin A and resin A1 were mixed at 15.78 parts by weight:23.68 parts by weight, respectively), and were used at 4.80 parts by weight and 4.80 parts by weight, respectively, relative to 100 parts by weight of the solid content of the photosensitive resin composition. As another example, the binder resin used in Example 2 (a polymer compound in which resin B and resin A1 are mixed at 7.89 parts by weight: 31.57 parts by weight, respectively) was used as the dispersant and dispersion binder in Example 2, and was used at 4.80 parts by weight and 4.80 parts by weight, respectively, relative to 100 parts by weight of the solid content of the photosensitive resin composition. The dispersants and dispersion binders in Examples 3 and 4 were also selected and used in the same manner as in Examples 1 and 2. The dispersant and dispersion binder in Comparative Example 1 was used as the binder resin used in Comparative Example 1 (a polymer compound in which resin A and ACRYL A are mixed at 31.57 parts by weight: 7.89 parts by weight, respectively), and was used at 4.80 parts by weight and 4.80 parts by weight, respectively, relative to 100 parts by weight of the solid content of the photosensitive resin composition. As another example, the binder resin (a polymer compound in which ACRYL A and PHS A are mixed at 7.89 parts by weight and 31.57 parts by weight, respectively) used in Comparative Example 2 was used as the dispersant and dispersion binder in Comparative Example 2, and was used at 4.80 parts by weight and 4.80 parts by weight, respectively, per 100 parts by weight of the solid content of the photosensitive resin composition. The dispersant and dispersion binder in Comparative Example 3 were also selected and used in the same manner as in Comparative Examples 1 and 2.

[0211] ACRYL A in Table 2 above is an acrylic resin containing repeating units represented by the following structural formulas A-1 to A-3. [Structural formula A-1] [ka] [Structural formula A-2] [ka] [Structural formula A-3] [ka]

[0212] For the structural formulas A-1 to A-3 included in ACRYL A in Table 2, a:b:c is 0.55:0.25:0.20.

[0213] The molecular weight of the ACRYL A is 13,000 g / mol.

[0214] PHS A in Table 2 above is an acrylic resin containing repeating units represented by the following structural formulas A-4 and A-5. [Structural formula A-4] [ka] [Structural formula A-5] [ka]

[0215] For the structural formulae A-4 and A-5 included in PHS A in Table 2, d:e is 0.4:0.6.

[0216] The molecular weight of the PHS A is 8,000 g / mol.

[0217] In addition, in Table 2, DPHA is diphenylpentaerythritol hexaacrylate, BYK-331 is a dispersant (surfactant) manufactured by BYK-Chemie, OXE02 is a photopolymerization initiator manufactured by BASF, MEDG is diethylene glycol methyl ethyl ether, and GBL is γ-butyrolactone.

[0218] <Experimental Example>

[0219] Outgassing and heat resistance evaluation The outgassing and heat resistance of the photosensitive resin compositions of Examples 1 to 4 and the photosensitive resin compositions not containing an alkali-soluble polyimide resin of Comparative Examples 1 to 3 were measured by the following method, and the results are shown in Table 4 below.

[0220] -Outgassing measurement

[0221] 1. How to prepare outgassing measurement samples The composition was applied to a 100mm x 100mm x 0.5T glass substrate by spin-coating, and the RPM speed was set so that the cured film would be 1.0μm thick after the final curing step. The coated substrate was placed in a chamber (Vacuum Chamber Dryer) at a reduced pressure of 45Pa to remove the solvent. The substrate was heated on a hot plate at 100°C for 120 seconds to remove the solvent. In the case of a negative composition, the substrate was exposed to 50mJ in an exposure device. The exposed surface was exposed to a developer for 120 seconds. The substrate was cured in a convection oven at 230°C for 30 minutes.

[0222] 2. Outgassing Measurement Method The prepared sample was cut into a size of 10 mm x 70 mm, placed in a PAT tube, and heated at 230°C for 30 minutes. The generated substances were purged and trapped using a Purge & Trap sampler and analyzed by P&T GC / MS. The result was calculated as the area compared to the toluene standard solution in ng / cm2. 2Although the values ​​are expressed as absolute values, they may differ depending on the condition of the sample or the device, so a relative comparison was made. The amount of outgassing obtained by the above analysis is shown in Table 3 below.

[0223] -Heat resistance measurement The coating surface of the prepared sample was scraped off with a cutter knife and analyzed by thermogravimetric analysis (TGA). The inflection point was measured while heating from room temperature of 25°C to 450°C at a heating rate of 10°C in a nitrogen atmosphere. The measured values ​​for the inflection point are shown in Table 3 below.

[0224] [Table 3]

[0225] As shown in Table 3, the photosensitive resin composition according to one embodiment of the present invention has a lower outgassing amount than the other photosensitive resin composition. Specifically, the outgassing amount in Examples 1 to 4 is 23 ng / cm. 2 ~33ng / cm 2 The outgassing amount in Comparative Examples 1 to 3 is 94 ng / cm 2 ~221ng / cm 2 In particular, according to Example 1 and Comparative Example 3, the amount of outgassing generated from the photosensitive resin composition containing the alkali-soluble polyimide resin according to one embodiment of the present invention is reduced by up to about 89.59% compared to the amount of outgassing generated from the photosensitive resin composition not containing the alkali-soluble polyimide resin, and it can be confirmed that the amount of outgassing generated is significantly reduced.

[0226] As shown in Table 3, the photosensitive resin composition according to one embodiment of the present invention has better heat resistance than other photosensitive resin compositions. Specifically, the measured heat resistance values ​​in Examples 1 to 4 are 362°C to 368°C, which are higher than the measured heat resistance values ​​of 324°C, 296°C, and 275°C in Comparative Examples 1 to 3. In particular, according to Example 4 and Comparative Example 3, the heat resistance of the photosensitive resin composition containing the alkali-soluble polyimide resin according to one embodiment of the present invention is increased by up to about 33.82% compared to the heat resistance of the photosensitive resin composition not containing the alkali-soluble polyimide resin, and it can be confirmed that the photosensitive resin composition has excellent heat resistance.

Claims

1. Contains a binder resin, a colorant and a solvent, The binder resin includes an alkali-soluble polyimide resin including repeating units represented by the following chemical formulas 1 to 3 such that p / (m+n+p) is 0.03 to 0.15, where m to p are each a repeating unit represented by the following chemical formulas 1 to 3: In addition to the alkali-soluble polyimide resins containing the repeating units represented by Chemical Formulae 1 to 3, the present invention further includes an alkali-soluble polyimide resin containing the repeating units represented by Chemical Formulae 1 and 3. Photosensitive resin composition: [Chemical formula 1] 【Chemistry 1】 [Chemical formula 2] 【Chemistry 2】 [Chemical formula 3] 【Chemistry 3】 In the above Chemical Formulas 1 to 3, X1 to X3 are the same or different and each independently represents a tetravalent organic group; Y1 to Y3 are the same or different and each independently represents a divalent organic group; Y2 includes a group represented by the following chemical formula A: [Chemical formula A] 【Chemistry 4】 In the above chemical formula A, R7 is a photopolymerizable unsaturated group; 【Chemistry 5】 means a site for binding to Y2 in Formula 2; m to p each independently represent an integer of 1 to 500.

2. Relative to 100 parts by weight of the solid content of the photosensitive resin composition, The content of the binder resin is 15 parts by weight to 50 parts by weight, 2. The photosensitive resin composition according to claim 1, wherein the content of the colorant is 14 to 50 parts by weight.

3. The photosensitive resin composition according to claim 1 , wherein the colorant comprises a pigment and a dispersant.

4. Relative to 100 parts by weight of the solid content of the photosensitive resin composition, The content of the pigment is 10 parts by weight to 50 parts by weight, The photosensitive resin composition according to claim 3, wherein the content of the dispersant is 2 to 15 parts by weight.

5. 5. The photosensitive resin composition according to claim 1, wherein X1 to X3 are the same or different and each independently represents a tetravalent organic group derived from oxydiphthalic anhydride or a derivative thereof.

6. The photosensitive resin composition according to any one of claims 1 to 5, wherein Y1 to Y3 are the same or different and each independently represents a divalent organic group containing a hydroxy group, a phenolic hydroxy group, or a haloalkyl group.

7. 7. The photosensitive resin composition according to claim 1, wherein the weight average molecular weight of the alkali-soluble polyimide resin in the photosensitive resin composition is 1,000 g / mol to 35,000 g / mol.

8. The photosensitive resin composition according to claim 1 , further comprising a polyfunctional monomer, a crosslinking agent, a photopolymerization initiator, a surfactant, and a silane coupling agent.

9. 9. The photosensitive resin composition according to claim 8, wherein the content of the alkali-soluble hydroxy group is 30 to 85 parts by weight based on 100 parts by weight of the polyfunctional monomer.

10. A photosensitive material comprising the photosensitive resin composition according to claim 1 .

11. A black matrix comprising the photosensitive resin composition according to claim 1 .

12. An electronic device comprising the photosensitive resin composition according to claim 1 .

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