Consumable member, plasma processing apparatus, and method for manufacturing consumable member

Abstract

To provide a technique for inexpensively manufacturing a consumable member used in a plasma processing apparatus.SOLUTION: A consumable member used in a plasma processing apparatus made of either quartz or ceramics includes a core portion formed of a material of the first purity, and a protective portion provided at a part of the plasma processing apparatus around the core portion that is worn away by plasma and formed of the material having a second purity higher than the first purity.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present disclosure relates to a consumable part, a plasma processing apparatus, and a method for manufacturing a consumable part. [Background technology]

[0002] 2. Description of the Related Art In plasma processing apparatuses such as dry etching apparatuses, consumable members that are consumed by exposure to plasma are used. As the consumable members, members made of quartz are used (for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2019-220500 A Summary of the Invention [Problem to be solved by the invention]

[0004] The present disclosure provides a technique for inexpensively manufacturing consumable parts for use in plasma processing apparatuses. [Means for solving the problem]

[0005] The present disclosure relates to a consumable member for use in a plasma processing apparatus, the consumable member being formed from either quartz or ceramic material, the consumable member having a core portion formed from the material of a first purity, and a protective portion provided around the core portion in a portion that is subject to wear by plasma in the plasma processing apparatus, the protective portion being formed from the material of a second purity higher than the first purity. Effect of the Invention

[0006] According to the present disclosure, consumable members for use in plasma processing apparatuses can be manufactured inexpensively. [Brief description of the drawings]

[0007] [Figure 1]FIG. 1 is a diagram illustrating an example of a plasma processing system according to an embodiment. [Diagram 2] FIG. 2 is a top view of an example of a consumable member used in the plasma processing apparatus of this embodiment. [Diagram 3] FIG. 3 is a cross-sectional view of an example of a consumable member used in the plasma processing apparatus of this embodiment. [Figure 4] FIG. 4 is a flowchart illustrating the method for manufacturing the consumable part according to the first embodiment. [Diagram 5] FIG. 5 is a diagram illustrating a method for manufacturing a consumable part according to the first embodiment. [Figure 6] FIG. 6 is a diagram illustrating a method for manufacturing a consumable component according to the first embodiment. [Figure 7] FIG. 7 is a diagram illustrating a method for manufacturing a consumable part according to the first embodiment. [Figure 8] FIG. 8 is a diagram illustrating a method for manufacturing a consumable part according to the first embodiment. [Figure 9] FIG. 9 is a diagram illustrating a method for manufacturing a consumable part according to the first embodiment. [Figure 10] FIG. 10 is a diagram illustrating a method for manufacturing a consumable part according to the first embodiment. [Figure 11] FIG. 11 is a diagram illustrating a method for manufacturing a consumable part according to the first embodiment. [Figure 12] FIG. 12 is a diagram illustrating a method for manufacturing a consumable part according to the first embodiment. [Figure 13] FIG. 13 is a flowchart illustrating a method for manufacturing a consumable part according to the second embodiment. [Figure 14] FIG. 14 is a diagram illustrating a method for manufacturing a consumable part according to the second embodiment. [Figure 15] FIG. 15 is a diagram illustrating a method for manufacturing a consumable part according to the second embodiment. [Figure 16] FIG. 16 is a diagram illustrating a method for manufacturing a consumable component according to the second embodiment. [Figure 17] FIG. 17 is a diagram illustrating a method for manufacturing a consumable part according to the second embodiment. [Figure 18]FIG. 18 is a diagram illustrating a method for manufacturing a consumable part according to the second embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] Hereinafter, non-limiting exemplary embodiments of the present disclosure will be described with reference to the accompanying drawings. In all of the accompanying drawings, the same or corresponding members or parts are designated by the same or corresponding reference numerals, and duplicated descriptions will be omitted.

[0009] [Plasma Processing Apparatus] An example of the configuration of a plasma processing system will be described below.

[0010] The plasma processing system includes a capacitively coupled plasma processing apparatus 1 and a controller 2. The capacitively coupled plasma processing apparatus 1 includes a plasma processing chamber 10, a gas supply 20, a power supply 30, and an exhaust system 40. The plasma processing apparatus 1 also includes a substrate support 11 and a gas inlet. The gas inlet is configured to introduce at least one processing gas into the plasma processing chamber 10. The gas inlet includes a showerhead 13. The substrate support 11 is disposed in the plasma processing chamber 10. The showerhead 13 is disposed above the substrate support 11. In one embodiment, the showerhead 13 forms at least a part of a ceiling of the plasma processing chamber 10. The plasma processing chamber 10 has a plasma processing space 10s defined by the showerhead 13, a sidewall 10a of the plasma processing chamber 10, and the substrate support 11. The plasma processing chamber 10 has at least one gas inlet for supplying at least one processing gas to the plasma processing space 10s and at least one gas outlet for exhausting gas from the plasma processing space. The sidewall 10a is grounded. The showerhead 13 and the substrate support 11 are electrically isolated from the plasma processing chamber 10 housing.

[0011] The substrate support 11 includes a main body 111 and a ring assembly 112. The main body 111 has a central region (substrate support surface) 111a for supporting a substrate (wafer) W, and an annular region (ring support surface) 111b for supporting the ring assembly 112. The annular region 111b of the main body 111 surrounds the central region 111a of the main body 111 in a plan view. The substrate W is disposed on the central region 111a of the main body 111, and the ring assembly 112 is disposed on the annular region 111b of the main body 111 so as to surround the substrate W on the central region 111a of the main body 111. In one embodiment, the main body 111 includes a base and an electrostatic chuck. The base includes a conductive member. The conductive member of the base functions as a lower electrode. The electrostatic chuck is disposed on the base. The upper surface of the electrostatic chuck has a substrate support surface 111a. The ring assembly 112 includes one or more annular members. At least one of the one or more annular members is an edge ring. Although not shown, the substrate support 11 may include a temperature adjustment module configured to adjust at least one of the electrostatic chuck, the ring assembly 112, and the substrate to a target temperature. The temperature adjustment module may include a heater, a heat transfer medium, a flow path, or a combination thereof. A heat transfer fluid such as brine or gas flows through the flow path. The substrate support 11 may also include a heat transfer gas supply unit configured to supply a heat transfer gas between the back surface of the substrate W and the substrate support surface 111a.

[0012] The shower head 13 is configured to introduce at least one processing gas from the gas supply unit 20 into the plasma processing space 10s. The shower head 13 has at least one gas supply port 13a, at least one gas diffusion chamber 13b, and multiple gas inlets 13c. The processing gas supplied to the gas supply port 13a passes through the gas diffusion chamber 13b and is introduced into the plasma processing space 10s from the multiple gas inlets 13c. The shower head 13 also includes a conductive member. The conductive member of the shower head 13 functions as an upper electrode. In addition to the shower head 13, the gas introduction unit may include one or more side gas injectors (SGIs) attached to one or more openings formed in the side wall 10a.

[0013] The gas supply 20 may include at least one gas source 21 and at least one flow controller 22. In one embodiment, the gas supply 20 is configured to supply at least one process gas from a respective gas source 21 through a respective flow controller 22 to the showerhead 13. Each flow controller 22 may include, for example, a mass flow controller or a pressure-controlled flow controller. Additionally, the gas supply 20 may include one or more flow modulation devices to modulate or pulse a flow rate of the at least one process gas.

[0014] The power source 30 includes an RF power source 31 coupled to the plasma processing chamber 10 via at least one impedance matching circuit. The RF power source 31 is configured to supply at least one RF signal (RF power), such as a source RF signal and a bias RF signal, to a conductive member of the substrate support 11 and / or a conductive member of the showerhead 13. This causes a plasma to be formed from at least one processing gas supplied to the plasma processing space 10s. Thus, the RF power source 31 can function as at least a part of a plasma generating unit configured to generate a plasma from one or more processing gases in the plasma processing chamber 10. In addition, by supplying a bias RF signal to the conductive member of the substrate support 11, a bias potential is generated on the substrate W, and ion components in the formed plasma can be attracted to the substrate W.

[0015] In one embodiment, the RF power supply 31 includes a first RF generating unit 31a and a second RF generating unit 31b. The first RF generating unit 31a is coupled to the conductive member of the substrate support 11 and / or the conductive member of the shower head 13 via at least one impedance matching circuit, and is configured to generate a source RF signal (source RF power) for plasma generation. In one embodiment, the source RF signal has a frequency in the range of 13 MHz to 150 MHz. In one embodiment, the first RF generating unit 31a may be configured to generate a plurality of source RF signals having different frequencies. The generated one or more source RF signals are supplied to the conductive member of the substrate support 11 and / or the conductive member of the shower head 13. The second RF generating unit 31b is coupled to the conductive member of the substrate support 11 via at least one impedance matching circuit, and is configured to generate a bias RF signal (bias RF power). In one embodiment, the bias RF signal has a lower frequency than the source RF signal. In one embodiment, the bias RF signal has a frequency in the range of 400 kHz to 13.56 MHz. In one embodiment, the second RF generator 31b may be configured to generate multiple bias RF signals having different frequencies. The generated bias RF signal or signals are provided to the conductive members of the substrate support 11. Also, in various embodiments, at least one of the source RF signal and the bias RF signal may be pulsed.

[0016] The power supply 30 may also include a DC power supply 32 coupled to the plasma processing chamber 10. The DC power supply 32 includes a first DC generator 32a and a second DC generator 32b. In one embodiment, the first DC generator 32a is connected to a conductive member of the substrate support 11 and configured to generate a first DC signal. The generated first bias DC signal is applied to the conductive member of the substrate support 11. In one embodiment, the first DC signal may be applied to another electrode, such as an electrode in an electrostatic chuck. In one embodiment, the second DC generator 32b is connected to a conductive member of the showerhead 13 and configured to generate a second DC signal. The generated second DC signal is applied to the conductive member of the showerhead 13. In various embodiments, at least one of the first and second DC signals may be pulsed. The first and second DC generating units 32a, 32b may be provided in addition to the RF power supply 31, or the first DC generating unit 32a may be provided in place of the second RF generating unit 31b.

[0017] The exhaust system 40 may be connected to, for example, a gas exhaust port 10e provided at the bottom of the plasma processing chamber 10. The exhaust system 40 may include a pressure regulating valve and a vacuum pump. The pressure in the plasma processing space 10s is adjusted by the pressure regulating valve. The vacuum pump may include a turbomolecular pump, a dry pump, or a combination thereof.

[0018] The control unit 2 processes computer-executable instructions that cause the plasma processing apparatus 1 to perform various steps described in the present disclosure. The control unit 2 may be configured to control each element of the plasma processing apparatus 1 to perform various steps described herein. In one embodiment, a part or all of the control unit 2 may be included in the plasma processing apparatus 1. The control unit 2 may include, for example, a computer 2a. The computer 2a may include, for example, a processing unit (CPU: Central Processing Unit) 2a1, a storage unit 2a2, and a communication interface 2a3. The processing unit 2a1 may be configured to perform various control operations based on a program stored in the storage unit 2a2. The storage unit 2a2 may include a random access memory (RAM), a read only memory (ROM), a hard disk drive (HDD), a solid state drive (SSD), or a combination thereof. The communication interface 2a3 may communicate with the plasma processing apparatus 1 via a communication line such as a local area network (LAN).

[0019] <Consumables used in plasma processing equipment> Members used in the plasma processing chamber 10 of the plasma processing apparatus 1 such as a dry etching apparatus are exposed to plasma. Members used in the plasma processing chamber 10 of the plasma processing apparatus 1 such as a dry etching apparatus and that are exposed to plasma and worn out are replaced periodically as consumable members.

[0020] Examples of consumable parts include the annular parts (edge ​​ring, cover ring) of the ring assembly 112, an insulating ring provided on the side of the electrostatic chuck, an upper electrode cover provided on the ceiling surface of the shower head 13, a shield ring that holds down the upper electrode cover, or a support member that supports the shower head 13.

[0021] The consumable parts are made of, for example, quartz, ceramics, etc. The worn parts of the consumable parts and the wear depth of each worn part can be predicted depending on the conditions of use, etc. It is desirable to form the worn parts using a high purity material in order to prevent contamination of the processing substrate. On the other hand, the non-consumable parts of the consumable parts occupy a large part of the volume of the part. Since the non-consumable parts do not affect the processing substrate, a material with low purity can be used.

[0022] Therefore, the consumable members used in the plasma processing apparatus according to this embodiment are manufactured with inexpensive low-purity materials in the areas that will not wear out, and the parts that will wear out are molded with a high-purity slurry material.

[0023] <Edge Ring 115> As an example of a consumable member, the edge ring 115, which is an annular member of the ring assembly 112, will be described. Note that although the edge ring 115 will be described as an example of a consumable member here, the consumable member is not limited to the edge ring. The consumable member may be, for example, a cover ring, an insulating ring provided on the side surface of the electrostatic chuck, an upper electrode cover provided on the ceiling surface of the shower head 13, a shield ring that holds down the upper electrode cover, or a support member that supports the shower head 13.

[0024] Although quartz is described here as the material for edge ring 115, ceramics may also be used as the material for the consumable member.

[0025] Fig. 2 is a top view of edge ring 115, which is an example of a consumable member according to this embodiment. Fig. 3 is a cross-sectional view of edge ring 115, which is an example of a consumable member according to this embodiment. Specifically, Fig. 3 is a cross-sectional view taken along line II in Fig. 2. Note that the cross-sectional views shown below are cross-sectional views of a cross section corresponding to the cross section in Fig. 3.

[0026] The edge ring 115 is one of the annular members of the ring assembly 112. The edge ring 115 is disposed around the substrate W. The edge ring 115 is made of quartz. The edge ring 115 has a core portion 115c and a protective portion 115s.

[0027] The core portion 115c is provided in a portion that is not worn down by plasma and is not exposed to plasma during use in the plasma processing apparatus 1. The core portion 115c is made of quartz having a lower purity than the quartz that constitutes the protective portion 115s. The core portion 115c may be formed by a slurry casting method as described below, or may be formed by solidifying molten quartz.

[0028] The protective portion 115s is provided in a portion that may be worn away by plasma during use in the plasma processing apparatus 1. The protective portion 115s is provided in at least a certain thickness in a portion of the core portion 115c that may be worn away by plasma so that the core portion 115c is not worn away by plasma during use in the plasma processing apparatus 1. The protective portion 115s is made of high-purity quartz. Since the protective portion 115s may be worn away by plasma during use in the plasma processing apparatus 1, the protective portion 115s is made of high-purity quartz so as not to contaminate the processing substrate.

[0029] It is desirable that the core portion 115c and the protective portion 115s are made of the same material with different purities. The edge ring 115 is exposed to plasma and becomes hot. If they are made of different materials, when the edge ring 115 becomes hot, the materials may crack or peel off due to the difference in thermal expansion coefficient. Since the core portion 115c and the protective portion 115s of the edge ring 115 are made of the same material, cracking and peeling can be prevented when the temperature is high.

[0030] For example, when plasma is generated for about t1 hours in the plasma processing apparatus 1, the edge ring 115 is worn down by about ΔT millimeters depending on the location. If the expected usage time is t2 hours, the thickness of the worn-out portion of the protective portion 115s is at least ΔT×t2 / t1 millimeters. The thickness of the worn-out portion of the protective portion 115s is, for example, 0.2 to 2 millimeters.

[0031] First Embodiment Next, a manufacturing method will be described using the edge ring 115 as an example of a consumable member. Fig. 4 is a flowchart illustrating the manufacturing method of the consumable member according to the first embodiment.

[0032] First, the process of forming the core portion 115c will be described. The core portion 115c is formed by a slurry casting method. In order to form the core portion 115c by the slurry casting method, a first slurry 120 is prepared. The first slurry 120 is made by mixing raw material powder of quartz that constitutes the core portion 115c with a liquid such as water or alcohol. The purity of the raw material powder of the first slurry 120 is set to a standard purity.

[0033] A first slurry 120 of a first purity is supplied to the core mold 116 (step S10, a process of supplying a first slurry of a material of a first purity to the core mold). FIG. 5 is a cross-sectional view of the core mold 116. The core mold 116 includes a base 116a and a lid 116b. The base 116a has a groove 116g. The lid 116b is placed on the base 116a, and the first slurry 120 is supplied to the groove 116g from an inlet (not shown).

[0034] The dimensions of groove 116g are formed slightly larger than the dimensions of core 115c, taking into consideration the eventual shrinkage caused by firing first slurry 120. Fig. 6 is a cross-sectional view showing the state in which first slurry 120 is supplied to groove 116g of core mold 116.

[0035] The first slurry 120 is a slurry for forming quartz of standard purity. The purity of the quartz of the raw material powder is lower than that of the second slurry 125 described later. The core portion 115c is a portion that is not damaged by plasma, so it is formed using the first slurry 120 of standard purity.

[0036] Next, the first slurry 120 supplied to the core portion mold 116 is fired to form the core portion 115c (step S20, a process of firing the first slurry supplied to the core portion mold to form the core portion). Fig. 7 is a cross-sectional view showing the state in which the first slurry 120 supplied to the core portion mold 116 is fired to form the core portion 115c.

[0037] Next, the formed core portion 115c is removed from the core portion mold 116. Fig. 8 is a top view showing the core portion 115c removed from the core portion mold 116. Fig. 9 is a cross-sectional view showing the core portion 115c removed from the core portion mold 116. Note that in Figs. 8 and 9, the edge ring 115 to be finally formed is indicated by a dotted line as a virtual edge ring 115f.

[0038] Next, a process for forming the protective portion 115s will be described. The protective portion 115s is formed by a slurry casting method. In order to form the protective portion 115s by the slurry casting method, a second slurry 125 is prepared. The second slurry 125 is made by mixing raw material powder of quartz that constitutes the protective portion 115s with a liquid such as water or alcohol. The purity of the raw material powder of the second slurry 125 is set to be higher than the purity of the raw material powder of the first slurry 120.

[0039] The core portion 115c is placed on the edge ring mold 117 (step S30, a step of placing the core portion on the edge ring mold). FIG.

[0040] The edge ring mold 117 includes a base 117a and a lid 117b. When the lid 117b is placed on the base 117a, a groove 117g is formed. The dimensions of the groove 117g are slightly larger than the dimensions of the protective portion 115s, taking into consideration that the groove 117g will eventually shrink when the second slurry 125 is baked.

[0041] Before placing lid portion 117b on base portion 117a, core portion 115c is placed on base portion 117a. Then, lid portion 117b is placed on base portion 117a. When lid portion 117b is placed on base portion 117a, core portion 115c is located inside groove portion 117g.

[0042] Next, a second slurry 125 having a second purity higher than the first purity is supplied to the edge ring mold 117 on which the core portion 115c is placed (step S40, a process of supplying a second slurry of a material having a second purity higher than the first purity to the edge ring mold).

[0043] A second slurry 125 is supplied to the groove 117g from an inlet (not shown). Fig. 11 is a cross-sectional view showing a state in which the second slurry 125 has been supplied to the groove 117g of the edge ring mold 117.

[0044] The protective portion 115s of the edge ring 115 is provided in a portion that may be damaged by plasma. Therefore, the protective portion 115s is made of high-purity quartz. In order to form the protective portion 115s from high-purity quartz, the protective portion 115s is formed using a second slurry 125 having a second purity higher than the first purity.

[0045] Next, the second slurry 125 supplied to the edge ring mold 117 is fired to form the protective portion 115s (step S50, a process of firing the second slurry supplied to the edge ring mold to form the protective portion). Fig. 12 is a cross-sectional view showing a state in which the second slurry 125 supplied to the edge ring mold 117 is fired to form the protective portion 115s.

[0046] Finally, the edge ring 115 is removed from the edge ring mold 117. Through the above-mentioned steps, the edge ring 115 shown in Figs.

[0047] [Actions and Effects] According to the method for manufacturing a consumable member in accordance with the first embodiment, the portion that is eroded by plasma can be made of high-purity quartz, and the portion that is not eroded by plasma can be made of quartz having a purity lower than that of the high-purity quartz.

[0048] By forming the portion not exposed to plasma from quartz with a lower purity than high-purity quartz, the cost of consumable parts can be reduced. Also, although high-purity quartz material has an issue with availability, by reducing the portion made of high-purity quartz material, the amount of high-purity quartz material used can be reduced.

[0049] In addition, high-purity slurry raw material powder can be obtained by purifying low-purity slurry raw material powder, so by producing consumable parts by the slurry casting method, the availability of slurry raw material powder can be improved.

[0050] In the method for manufacturing a consumable member according to this embodiment, the core portion 115c is formed by a slurry casting method, but the core portion 115c may be formed by a method other than the slurry casting method.

[0051] <Second embodiment> Next, a description will be given of a method for manufacturing a consumable part according to the second embodiment. The method for manufacturing a quartz material according to the second embodiment differs from the method for manufacturing a consumable part according to the first embodiment in that a cutting process is performed in the final step to create the final product shape.

[0052] 13 is a flowchart illustrating the method for manufacturing a consumable member according to the second embodiment. Steps S10 and S20 are the same as those in the method for manufacturing a consumable member according to the second embodiment, and therefore descriptions thereof will be omitted.

[0053] After step S20, the core portion 115c is placed on the intermediate work mold 118 (step S35, a step of placing the core portion on the intermediate work mold). Fig. 14 is a cross-sectional view showing a state in which the core portion 115c is placed on the intermediate work mold 118.

[0054] The intermediate workpiece mold 118 includes a base 118a and a lid 118b. When the lid 118b is placed on the base 118a, a groove 118g is formed. The dimensions of the groove 118g, including the cutting allowance, are larger than those of the edge ring 115. In FIG. 14, the edge ring 115 to be finally formed is indicated by a dotted line as a virtual edge ring 115f.

[0055] Before placing lid portion 118b on base portion 118a, core portion 115c is placed on base portion 118a. Then, lid portion 118b is placed on base portion 118a. When lid portion 118b is placed on base portion 118a, core portion 115c is located inside groove portion 118g.

[0056] Next, a second slurry 125 having a second purity higher than the first purity is supplied to the intermediate workpiece mold 118 on which the core portion 115c is placed (step S45, a step of supplying a second slurry having a second purity higher than the first purity to the intermediate workpiece mold).

[0057] A second slurry 125 is supplied to the groove 118g from an inlet (not shown). Fig. 15 is a cross-sectional view showing a state in which the second slurry 125 has been supplied to the groove 118g of the intermediate work mold 118.

[0058] The protective portion 115s of the edge ring 115 is provided at a portion exposed to plasma. Therefore, the protective portion 115s is made of high-purity quartz. In order to form the protective portion 115s from high-purity quartz, the protective portion 115s is formed using a second slurry 125 of a material having a second purity higher than the first purity.

[0059] Next, the second slurry 125 supplied to the intermediate workpiece mold 118 is fired to form the extended protective portion 115t (step S55, a process of firing the second slurry supplied to the intermediate workpiece mold to form the extended protective portion). Fig. 16 is a cross-sectional view showing a state in which the second slurry 125 supplied to the intermediate workpiece mold 118 is fired to form the extended protective portion 115t.

[0060] Next, the extended protective portion 115t is machined to form the protective portion 115s (step S65: processing the extended protective portion to form the protective portion). Fig. 17 is a top view of the intermediate workpiece 115m after the extended protective portion 115t is formed in step S55 and removed from the intermediate workpiece mold 118. Fig. 18 is a cross-sectional view of the intermediate workpiece 115m after the extended protective portion 115t is formed in step S55 and removed from the intermediate workpiece mold 118. In Figs. 17 and 18, the edge ring 115 to be finally formed is indicated by a dotted line as a virtual edge ring 115f.

[0061] Intermediate workpiece 115m has an extended protective portion 115t that is larger than the final edge ring 115. In step S65, intermediate workpiece 115m is machined to form edge ring 115.

[0062] [Actions and Effects] According to the manufacturing method for consumable parts in the second embodiment, in addition to the effects of the manufacturing method for consumable parts in the first embodiment, the final consumable parts can be formed with high dimensional accuracy.

[0063] <Modification> The core portion 115c to be placed on the edge ring mold 117 or the intermediate workpiece mold 118 is not limited to the core portion 115c. For example, in order to regenerate the edge ring 115 that has been used once, a part of the protective portion 115s may remain on the core portion 115c.

[0064] It should be noted that the embodiments disclosed herein are illustrative and not restrictive in all respects. The above-described embodiments may be omitted, substituted, or modified in various forms without departing from the scope and spirit of the appended claims. [Explanation of symbols]

[0065] 1. Plasma processing equipment 2. Control section 10 Plasma Processing Chamber 11 Substrate support 13. Shower Head 111 Main body 111a Board support surface 111a Central area (board support surface) 111b Annular region (ring support surface) 112 Ring Assembly 115 Edge Ring 115c core 115s protection part 115t Extended Protection Section 116 Core part mold 117 Edge ring mold 118 Mold for intermediate workpieces 120 First Slurry 125 Second Slurry W substrate

Claims

1. A consumable member for use in a plasma processing apparatus, which is made of either quartz or ceramics, a core portion formed of the material of a first purity; a protective portion provided at a portion around the core portion that is to be worn away by plasma in the plasma processing apparatus, the protective portion being made of the material having a second purity higher than the first purity; having Consumable parts.

2. the consumable member is at least one of an edge ring, a cover ring, an insulating ring provided on a side surface of an electrostatic chuck, an upper electrode cover provided on a ceiling surface of a shower head, a shield ring for pressing the upper electrode cover, or a support member for supporting the shower head; The consumable item of claim 1 .

3. The protective portion is formed around the core portion by a slurry casting method. The consumable member according to claim 1 or 2.

4. A consumable member according to any one of claims 1 to 3, Plasma processing equipment.

5. A method for manufacturing a consumable member for use in a plasma processing apparatus, the consumable member being made of either quartz or ceramics, comprising the steps of: (a) placing a core formed from the material of a first purity in a mold; (b) providing a slurry of said material having a second purity, said second purity being higher than said first purity, into said mold; (c) firing the slurry supplied to the mold to form a protective portion; Including, A method for manufacturing consumable parts.

6. A method for manufacturing a consumable member for use in a plasma processing apparatus, the consumable member being made of either quartz or ceramics, comprising the steps of: (a) placing a core formed from the material of a first purity in a mold; (b) providing a slurry of said material having a second purity, said second purity being higher than said first purity, into said mold; (c) firing the slurry dispensed into the mold to form an extended protective portion; (d) processing the extended protective portion to form a protective portion; Including, A method for manufacturing consumable parts.

7. a step of supplying a second slurry of the material having the first purity to a core mold and firing the second slurry supplied to the core mold to form the core, prior to the step (a); Further comprising: The method for producing a consumable part according to claim 5 or 6.

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