Method for integrally bonding a glass element to a support element and optical device - Patents.com

Abstract

The present invention relates to a method (100) for integrally bonding a glass element to a support element, the method (100) comprising a step (105) of inserting at least one contact element into a contact recess in a surface of the support element. In addition, the method (100) comprises a step (110) of placing the glass element on a portion of the contact element that protrudes beyond the surface, and a step (115) of locally heating the contact element to connect the glass element to the support element via the contact element. The method (100) also comprises a step (210) of covering at least a portion of the contact recess (310) with a separation layer (315) prior to the inserting step (105).

Description

[Technical field]

[0001] The present approach relates to a method and optical device for integrally bonding a glass element to a carrier element. [Background technology]

[0002] DE 10 2016 213 561 (A1) describes a method in which materials with similar expansion coefficients are connected by bonding, soldering or welding.

[0003] Application Publication No. 2005300976(A) discloses a method for connecting an optical component to a carrier element. The drawback is that the process stability of this method is not guaranteed for a particular material combination.

[0004] WO 2006 / 034775 A1 discloses a composite structure made of zero expansion material and a method for manufacturing such a structure, a drawback of which is the use of adhesive layers, which can lead to failure of parts due to aging.

[0005] Disclosure of the Invention With this in mind, the present approach presents a method for integrally bonding a glass element to a carrier element and an optical device according to the main claims. Advantageous embodiments result from the respective dependent claims and the following description.

[0006] For objects such as positioning devices or high-precision length or angle measuring devices, a flat glass surface firmly connected to a ceramic carrier is required. At the same time, the parts may be exposed to temperature fluctuations during their processing, manufacturing and transportation. The approach presented here allows for a robust, adhesive-free connection between glass and ceramic to be achieved, which can have a flat surface even after heating associated with the process or transportation during operation at room temperature or another predefined operating temperature.

[0007] A method for integrally bonding a glass element to a carrier element is presented, which comprises inserting at least one contact element into a contact recess on the surface of the carrier element. In addition, the method comprises arranging the glass element on a portion of the contact element protruding above the surface and locally heating the contact element to connect the glass element to the carrier element via the contact element. For example, the glass element can be a titanium-doped quartz glass, which can have a TiO2 content of, for example, about 20% by weight or less. In addition, the average coefficient of linear thermal expansion (CTE) of the glass element can be, for example, 0±30 ppb / °C (ppb parts per billion) from 5°C to 35°C with a 95% confidence level. This is the case, for example, for ultra-low expansion glasses. The carrier element can be a ceramic carrier, for example made of silicon carbide (SiC), or a metal carrier. Other materials of the carrier element are, for example, silicon (Si), germanium, monocrystalline or polycrystalline solids such as sapphire, diamond or quartz glass, or mixtures of silicon and silicon carbide (Si / SiC), in particular reaction-bonded silicon. Penetration Silicon carbide materials, or boron carbide B4C or silicon PenetrationThe glass element may be boron carbide (SiB4C) or AlN or Al2O3. When connecting the glass element to the carrier element, for example by gluing or soldering, any organic adhesive can bring its typical shrinkage and thermal expansion properties to the rigid and low-expansion structure of silicon carbide and glass. In particular, direct welding of glass with a very low thermal expansion coefficient (for example ultra-low expansion glass) with Si / SiC ceramics can be problematic or even impossible due to the formation of carbon monoxide and additionally or alternatively carbon dioxide. The insertion step presented in this method therefore first introduces a contact element, which may for example be designed from glass and therefore also be called a glass dowel, into a contact recess in the carrier element. For example, the contact element can be made from the same material as the glass element or from a material with a lower melting temperature than the glass element. For example, the contact element can also be designed as a molded piece of glass solder, i.e. glass solder, advantageously a low-melting solder glass, and a stable glass solder can be advantageously used. In contrast to a crystallized glass solder, a stable glass solder can behave like a conventional glass. If the solder joint is reheated, its softening may show the same temperature dependence as in the previous soldering process. Advantageously, the contact elements may have a lower softening temperature than the glass element. In the method presented here, such contact elements or similar contact elements are used to make the connection between the carrier element and the glass element. For this purpose, the glass element is placed on the part of the contact element(s) that protrudes above the surface of the carrier element, leaving a gap between the surface of the carrier element and the glass element. Thus, in a step of localized heating, the glass element can be connected to the carrier element by material bonding only via the contact elements or, if several contact elements are provided, via these contact elements. Advantageously, this allows for the formation of a strong, materially bonded and at the same time adhesive-free connection, for example between glass and ceramic. In a step of localized heating, the molten material from the contact elements can wet the glass element and form a connection in the sense of a soldering process.It is also possible for the molten material of the contact element to combine with the locally molten material of the glass element to create a connection in the sense of a welding process. If several contact elements are provided, the local heating step can be carried out for each of the contact elements in turn. Alternatively, it is possible to locally heat several contact elements simultaneously, for example using several laser beams. During the local heating step, the carrier element and the glass element can have room temperature, except at the locally heated locations. Alternatively, in the local heating step, the carrier element and the glass element can have a predetermined temperature, except at the locally heated locations, which may correspond to the intended operating temperature of the finished arrangement.

[0008] Advantageously, several such contact elements can be provided, particularly advantageously at least three contact elements, which are arranged at a distance from one another. It is particularly advantageous to provide ten or more contact elements.

[0009] According to an embodiment, the method may comprise a step of forming the contact recesses prior to the inserting step. For example, the contact recesses can be inserted in the form of pits, for example through bores, in a molding step. Alternatively, corresponding recesses can be formed during the manufacturing process in a carrier element, for example designed from ceramic. The advantage of a forming step is that the contact recesses can be optimally adapted to the contact elements to be inserted in a subsequent insertion step.

[0010] The method includes a step of covering at least a part of the contact recess with an isolation layer prior to the insertion step. For example, the entire surface of the contact recess into which the contact element is inserted during the insertion step can be covered with an isolation layer. The isolation layer, which can also be called a barrier layer, is made of, for example, silicon (Si) or germanium (Ge) or a high melting point metal and additionally or alternatively, the aforementioned fluorine-containing metals, in order to advantageously keep the carrier element, for example designed from silicon carbide, chemically isolated from the glass of the contact element. materialand additionally or alternatively a refractory metal silicide. A separation layer may be provided to improve adhesion and additionally or alternatively to prevent chemical reactions between the glass solder and the carrier element, which may result in, for example, foaming of the glass solder when it melts.

[0011] According to a further embodiment, the method may comprise a step of heating the contact elements to connect them to the carrier element, the heating step may be performed after the inserting step. For example, the contact elements may be used similarly to glass solders, which can form a material connection with the carrier element when the temperature is increased. For example, the contact elements may be heated above the melting temperature of the contact elements, which may also be called the glass temperature, transformation temperature or softening temperature, and the softened glass can wet the carrier element or the barrier layer covering the carrier element. Advantageously, the carrier element and the contact elements or all the provided contact elements can be heated together. The heating step can be performed, for example, as a furnace process using a normal melting furnace, such as an industrial furnace with air or an inert gas, or a vacuum furnace, or with a laser beam. The carrier element with the provided contact elements, or several carrier elements with contact elements, can be inserted together in an oven. Alternatively, the heating step of the contact elements to connect them to the carrier element can be performed by localized heating, the carrier element remaining otherwise at room temperature. Advantageously, the heating step described in this section can produce a time-saving and cost-effective connection between the carrier element and the contact elements. Advantageously, the carrier element with the connected contact elements can be cooled to room temperature after this step. A step of reducing the thickness of the part and additionally or alternatively a step of placing the glass element at room temperature can then be performed.

[0012] According to a further embodiment, in the heating step, the part of the contact element protruding above the surface may be widened as a collar or may additionally or alternatively be formed as a rounded cap protruding in the normal direction of the glass pane. For example, after the inserting step, three quarters of the contact element can be inserted into the carrier element and one quarter can protrude from the surface of the carrier element. In the heating step, the contact element can be heated, in particular in the part protruding above the surface, whereby the part can expand to form a collar and, as a result, have a radius that can be larger than the radius of the contact recess. Advantageously, this allows a material connection to be formed between the contact element and the surface of the carrier element. Additionally or alternatively, this part can be formed into a rounded cap during heating. Advantageously, the expansion of the radius of the contact element beyond the edge of the contact recess can be avoided or limited, and if necessary, the connection between the carrier element and the glass element can be locally limited to a minimum.

[0013] According to a further embodiment, the method may comprise a step of reducing the thickness of the part before the mounting step. For example, the part of the contact element protruding above the surface of the carrier element may be at least partially melted by a previous heating step, so that the contact surface of the part may have irregularities. For this reason, in the reduction step, the contact surface of the part can be flattened. Advantageously, such irregularities can be flattened during the reduction step, for example by grinding. For example, a protrusion of one or more contact elements on the surface of the carrier element of 10 μm to 200 μm can be advantageously achieved. This allows a gap of a predetermined thickness to be formed between the carrier element and the glass element. Residual deformations of the surface of the contact element in the region of up to a few micrometers, for example up to 0.1 μm, can be removed, for example by grinding and polishing processes. Advantageously, the contact element can be machined in the reduction step so that in the subsequent placement step the glass element can be placed on a flat surface. Furthermore, if several contact elements are provided, these contact elements can be leveled so that their flat surfaces are in a common plane. This allows the glass element to lie flat on the contact element or, if several contact elements are provided, on these contact elements, which makes it possible to optimize the connection process and, additionally or alternatively, the strength of the subsequent connection between the carrier element and the glass element. The flatness of both the flattened surface of each contact element and the deviation from a common plane can advantageously be less than 1 μm.

[0014] According to a further embodiment, the contact elements can be inserted in the insertion step using a reactive welding process, for example, reactive welding can be performed as an alternative to an additional heating step to advantageously save time and costs.

[0015] According to a further embodiment, the contact element can be heated using a laser beam in the step of local heating. For example, spot thermal connection processes such as spot laser welding can be used in the step of local heating, in which case a glass dowel (contact element) can be irradiated locally with a laser beam, for example through the glass element, in order to melt and connect the contact element to the glass element. Advantageously, the contact element can be heated above its melting temperature, and the softened glass of the glass dowel can wet the glass element. During the connection of the glass element to the contact element, the temperature of the carrier element can advantageously remain at room temperature using a laser beam, in order to avoid bending during the subsequent cooling to room temperature. For example, the connection between the glass element and the contact element can be made by short pulses. This has the advantage that the heating is only performed very locally, avoiding heating of the entire part as in welding or soldering or adhesive tempering. The use of laser welding is therefore particularly advantageous, since this method allows a local sufficient temperature increase for the welding process by short laser pulses, while keeping the temperature of the carrier element approximately constant. Alternatively, a reactive bonding process can be initiated, for example with a laser.

[0016] According to a further embodiment, in the insertion step, the contact element may be cylindrical or spherical or partially spherical or elliptical or toroidal in shape. For example, the contact element may be molded as a glass cylinder which may be inserted into the contact recess of the carrier element and firmly connected to the carrier element. Advantageously, such a cylinder or one of the aforementioned moulds can be produced and stored cost-effectively.

[0017] According to further embodiments, the glass element and the carrier element can be connected in a process of local heating to produce an optical device. For example, the optical device can be used as part of a positioning device, e.g. as an encoder for an xy table (xy stage) or as an angle encoder for a goniometer, and the material connection between the carrier element and the glass element can advantageously extend the range of use of the optical device and increase its load-bearing capacity.

[0018] According to a further embodiment, the method may comprise the steps of providing a carrier element in the form of a ceramic element, additionally or alternatively providing a glass element in the form of an ultra-low expansion glass, and additionally or alternatively providing a contact element in the form of a borosilicate glass element. For example, the carrier element can be designed from silicon carbide (SiC) or silicon-carbonitride silicon (Si / SiC), as a result of which it can advantageously have a particularly high hardness and high temperature resistance. As a so-called ultra-low expansion glass, the glass element can advantageously have a very low coefficient of thermal expansion and can therefore be used in various devices, for example as a carrier for large telescope mirrors in reflecting telescopes. As a contact element for connecting the carrier element to the glass element, for example borosilicate glass can be used. The borosilicate glass can form a material connection with both the carrier element and the glass element, for example similar to glass solder. The contact elements may have a higher coefficient of thermal expansion than the carrier element, which may lead to mechanical stresses in the event of temperature changes, for example when the contact elements cool after being connected to the carrier element, which may lead for example to peeling off of the contact elements from the carrier element. Using contact elements with small dimensions, the mechanical stresses can be minimized to an insignificant level. For example, the maximum linear dimension of each contact element may be less than 1 mm. To ensure the required strength of the connection between the glass element and the carrier element, a corresponding number of contact elements can be provided. Advantageously, the contact elements may have a lower coefficient of thermal expansion than the carrier element. In particular, if cylindrical contact elements and cylindrical recesses in the carrier element are provided, a clamping effect of the contact elements in the carrier element can be achieved in addition to the material connection. Alternatively, the contact elements may have a similar coefficient of thermal expansion to the carrier element, whereby the contact elements may experience similar stress changes to the carrier element when the temperature changes, for example during a welding process or during heating of the contact elements to connect the contact elements to the carrier element. The contact element and the carrier element may remain free of mechanical stress when cooled together to room temperature, for example 20°C.Advantageously, when using borosilicate glass, a separating layer can be dispensed with for both the carrier element and the contact element. For the purposes of this paragraph, the thermal expansion coefficient can be considered as the average value between the softening temperature of the contact element and room temperature.

[0019] According to another embodiment, in the inserting step, a number of contact elements can be inserted into a number of contact recesses on the surface of the carrier element. In this case, the contact recesses can be arranged in a row. For example, the contact recesses can be arranged along a closed curve, such as a circle, or along a rectangular shape in the form of a seam line. Advantageously, the use of a number of contact elements can increase the stability of the connection.

[0020] According to a further embodiment, pressure can be applied at least temporarily to the glass element during the step of localized heating in order to press the glass element against the contact element. For example, mechanical pressure can be applied locally or over the entire surface of the glass element. Advantageously, this can accelerate the connection of the glass element to the contact element. It can also ensure that the glass element is in contact with the contact element. This ensures that the material molten on the contact element during the step of localized heating can wet the glass element. After wetting the glass element with the locally molten material of the contact element, the contact pressure can be reduced or removed in order to avoid mechanical tensions.

[0021] Furthermore, an optical device is presented with a carrier element with contact recesses and a glass element, the carrier element and the glass element being connected to each other by contact elements inserted in the contact recesses. The optical device may be manufactured, for example, using the variants of the above-mentioned method. Advantageously, such an optical device can be used in a light engine or a sensor module, such as an optical encoder or other high-precision optical module. Such a component unit may be required there to ensure the required properties without bending or thermal drift.

[0022] According to an embodiment, the optical device may comprise an optical sensor arrangement for detecting the length and additionally or alternatively the geometrical position. For example, the glass element for this purpose may comprise geometrical measuring embodiments such as position marks or scale markers. Advantageously, the optical device can therefore be used as a sensing system or as part of such a system, for example as part of an encoder in an xy stage or as an angle encoder for a goniometer.

[0023] Exemplary embodiments of the approach presented herein are illustrated in the drawings and explained in more detail in the following description. [Brief description of the drawings]

[0024] The following is shown: [Figure 1] 1 illustrates an exemplary embodiment of a method for integrally bonding a glass element to a carrier element. [Diagram 2] 1 illustrates an exemplary embodiment of a method for integrally bonding a glass element to a carrier element. [Diagram 3] 1 shows a schematic diagram of an exemplary embodiment of a carrier element with inserted contact elements; [Figure 4A] 1 shows a schematic diagram of an exemplary embodiment of a carrier element with inserted contact elements; [Figure 4B] 1 shows a schematic diagram of an exemplary embodiment of a carrier element with inserted contact elements; [Diagram 5] 1 shows a schematic diagram of an exemplary embodiment of a carrier element with inserted contact elements; [Figure 6] 1 shows a schematic diagram of an exemplary embodiment of a carrier element with an attached glass element. [Figure 7] 1 shows a schematic diagram of an exemplary embodiment of a carrier element with an attached glass element. [Figure 8] 1 shows a schematic diagram of an exemplary embodiment of an optical device; [Figure 9]1 shows a schematic top view of an exemplary embodiment of a carrier element having an arrangement of multiple contact recesses.

[0025] In the following description of advantageous exemplary embodiments of the invention, elements shown in the various figures and having similar effect will be designated by the same or similar reference numerals, and a repeated description of these elements will be omitted.

[0026] FIG. 1 is a flow chart of an exemplary embodiment of a method 100 for integrally bonding a glass element to a carrier element. By way of example only, the carrier element may be made of silicon. PenetrationThe carrier 100 is a ceramic carrier made of silicon carbide (Si / SiC) and the glass element is a glass plate made of so-called ultra-low expansion glass. Si / SiC can have, for example, a thermal expansion coefficient of only 4 ppm / K between room temperature and 1000° C. The method 100 comprises a step 105 of inserting at least one contact element into a contact recess in the surface of the carrier element. In this exemplary embodiment, the contact element is only inserted using a reactive welding process. In a variant of the exemplary embodiment, an oven process can be used. Furthermore, the method 100 comprises a step 110 of placing a glass element on a portion of the contact element that protrudes above the surface of the carrier element, and only by way of example, the glass plate is aligned parallel to the surface of the carrier element and is brought into mechanical contact with the contact element. This results in an air gap between the surface of the carrier element and the glass element. In a subsequent localized heating step 115, the contact element is heated in order to connect the glass element to the carrier element via the contact element. In this exemplary embodiment, the mechanical connection between the glass element and the contact element is realized only by spot welding with a laser beam, which indirectly creates a connection between the glass element and the carrier element. The laser beam used here is only set to short pulses, for example of 10 nanoseconds duration, in order to locally heat the contact element and the glass element. The use of short pulses allows only very local heating and not heating the entire part, as in normal welding or soldering or adhesive tempering. In this exemplary embodiment, the glass element and the carrier element are connected in a process of local heating to produce an optical device.

[0027] 2 is a flow chart of an exemplary embodiment of a method 100 for integrally bonding a glass element to a carrier element. The method 100 illustrated herein is the same as or similar to the methods described in the previous figures, except that the method 100 illustrated herein includes additional optional steps.

[0028] In one exemplary embodiment, the method 100 includes providing a carrier element in the form of a ceramic element, a glass element in the form of an ultra low expansion glass, and Borosilicate Glass The method includes providing 200 a contact element in the form of a carrier element. The contact element is made of borosilicate glass and the carrier element is made of Si / SiC ceramic. In this exemplary embodiment, the borosilicate glass has a different thermal expansion coefficient between the welding temperature and room temperature than the Si / SiC carrier element. For example, the thermal expansion coefficient of borosilicate glass is 3.25 ppm / K between room temperature and 300° C. and the thermal expansion coefficient of Si / SiC is 4.0 ppm / K. In this exemplary embodiment, the contact element has relatively small dimensions so that the thermal expansion difference does not cause the contact element to peel off from the carrier element during cooling.

[0029] In an exemplary embodiment, the providing step 200 is followed by a forming a contact recess 205. The contact recess is simply inserted in the carrier element, for example by means of a bore, and is adapted to the dimensions of the contact element.

[0030] In one exemplary embodiment, the contact recesses are then coated with an isolation layer in step 210 of the coating process. In this exemplary embodiment, the isolation layer, which may also be called a barrier layer, is designed with silicon to chemically isolate the carrier element from the contact element. In another exemplary embodiment, the isolation layer may, for example, additionally or alternatively be made of germanium (Ge) or a refractory metal or The aforementioned substances and additionally or alternatively a refractory metal silicide. In this exemplary embodiment, the step of coating 210 is followed by a step 105 of inserting a contact element into the coated contact recess of the carrier element. In one exemplary embodiment, a plurality of contact recesses can also be formed on the surface of the carrier element in the forming step, and a plurality of contact elements can be inserted into the plurality of contact recesses in the inserting step. In this case, a plurality of contact recesses can be arranged in a row. For example, a plurality of contact recesses can be arranged in the form of a seam line along a closed curve, such as a circle, or along a rectangular shape.

[0031] In an exemplary embodiment, the step 105 of inserting is followed by a step 215 of heating the contact elements to connect them to the carrier element. For example, the contact elements and optionally also the carrier element are heated to a connection temperature that allows a material-locked connection between the contact elements and the carrier element. By way of example only, the heating step 215 is performed as a furnace process using a normal melting furnace. In another exemplary embodiment, the heating can be performed using a vacuum furnace or by a laser beam. In this exemplary embodiment, the part of the contact element that protrudes above the surface of the carrier element is expanded as a collar by heating and is melted here by way of example only. Subsequently, in this exemplary embodiment, the part is cooled in order to permanently connect the contact element to the carrier element. Since the borosilicate glass element and the Si / SiC ceramic element in this exemplary embodiment have different thermal expansion coefficients, the heating step 215, which includes cooling only to room temperature, for example 20° C., can nevertheless be performed with substantially low mechanical stress by using contact elements of small dimensions. In another exemplary embodiment, the mechanical stress or non-uniformity can be caused by soldering. During soldering, for example, the entire component can be heated to the soldering temperature. When cooled to room temperature, the joint position can be fixed at the solidification temperature of the solder, so that if the soldered parts have different expansion coefficients, cooling creates thermally induced stresses that can lead to bending of the surfaces. This effect is equivalent to bonding, and the solidification temperature of the solder can correspond to the glass transition temperature of the adhesive.

[0032] In one exemplary embodiment, in the method 100 shown here, the heating step 215 is followed by a reducing step 220. For example, only one thickness of the part of the cooled contact element that protrudes above the surface of the carrier element is ground and polished, resulting in a flat surface of the contact element. This removes any remaining deformations of the surface of the contact element. In an exemplary embodiment with multiple contact elements, the surfaces of several existing contact elements may also be leveled to a common plane. A flatness of less than 1 μm is achieved by way of example only. A glass element is placed in the next step 110 on this flat surface facing away from the carrier element.

[0033] This is followed by a step 115 of localized heating in order to connect the glass element to the carrier element via the contact element. Thereby, in this exemplary embodiment, the step 115 of localized heating is carried out using a laser beam. Here, the laser beam is guided, for example, only over the surface of the contact element in order to reliably connect the contact element to the glass element. At the same time, in this step 115 of localized heating, pressure is applied to the glass element in order to press it against the contact element. Pressure can be applied over the entire surface or only locally in the area of ​​the contact element(s), for example by placing another glass element on the glass element. In this exemplary embodiment, the glass element has a lower coefficient of thermal expansion than the carrier element, which does not result in mechanical stresses, since the point-like connection between the glass element and the carrier element is only created by localized heating.

[0034] 3 shows a schematic diagram of an exemplary embodiment of a carrier element 300 with an inserted contact element 305. By way of example only, the carrier element is an element made of Si / SiC ceramics and the contact element 305 is a cylindrical element made of borosilicate glass, which may also be called glass solder. In another exemplary embodiment, the contact element may be spherical or partially spherical or elliptical or toroidal in shape. In this exemplary embodiment, the cylindrical contact element 305 is adapted to the shape of a contact recess 310 into which the contact element 305 is inserted. In this exemplary embodiment, the contact recess 310 is coated with an isolation layer 315 in order to chemically isolate the contact element 305 from the carrier element 300. In this exemplary embodiment, the carrier element 300 also comprises a further contact recess 320, coated with a further isolation layer 325, into which a further contact element 330 is inserted. The further contact element 330 is designed to be identical to the contact element 305.

[0035] 4A and 4B show schematic views of an exemplary embodiment of a carrier element 300 with an inserted contact element 305. The carrier element 300 and the contact element 305 shown here correspond or are similar to the carrier element and the contact element described in the previous FIG. 3. Different possible shapes of the contact elements are shown in FIGS. 4A and 4B. In both FIGS. 4A and 4B, the carrier element 300 also comprises, in this exemplary embodiment, in addition to the contact element 305 arranged in the contact recess 310, a further contact element 330 arranged in the further contact recess 320. The contact element 305 and the further contact element 330 are shown in the depicted views after a heating step. In FIG. 4A, due to the heating in this exemplary embodiment, the part 405 of the contact element 305 that protrudes above the surface 400 of the carrier element 300 is unfolded as a collar and connected to the surface 400 by a material bond. Thus, the further part 410 of the further contact element 330 is also unfolded and connected to the surface 400 by a material bond. 4B, both the portion 405 of the contact element 305 and the further portion 410 of the further contact element 330 are shaped as round caps, in other words, in the exemplary embodiment shown here, the two dowels are fused and firmly connected to the carrier element 300.

[0036] Fig. 5 shows a schematic diagram of an exemplary embodiment of a carrier element 300 with an inserted contact element 305. The carrier element 300 and the contact element 305 shown here correspond or are similar to the carrier element and the contact element described in the previous Figs. 3 and 4, which in this exemplary embodiment also comprises a further contact element 330 in addition to the contact element 305. In the representation shown here, the contact element 305 and the further contact element 330 are shown after a reduction step as described in the previous Fig. 2. Thus, a portion 405 of the contact element 305 as well as a further portion 410 of the further contact element 330 are flattened to optimize the placement of the glass element.

[0037] FIG. 6 shows a schematic diagram of an exemplary embodiment of a carrier element 300 with a glass element 600 attached. The carrier element 300 shown here corresponds to or is similar to the carrier elements described in the previous figures 3, 4 and 5. The contact elements 305, 330 are arranged in the carrier element 300, which are melted in a previous heating step and flattened in a reduction step. In the representation shown here, the glass element 600 is arranged on the portions 405, 410 of the contact elements 305, 330 that protrude above the surface 400 of the carrier element 300. The glass element 600, which may also be called a glass chip or a glass plate, is simply an example of a so-called ultra-low expansion glass, which has a coefficient of expansion different from that of the carrier element 300. The glass element is aligned parallel to the surface 400 of the carrier element 300. The thickness of the portions 405, 410 results in an air gap 605 between the carrier element 300 and the glass element 600.

[0038] FIG. 7 shows a schematic diagram of an exemplary embodiment of a carrier element 300 with an attached glass element 600. The carrier element 300 and the glass element 600 shown here correspond or are similar to the carrier element and the glass element described in FIG. 6 above. Here, the carrier element 300, the contact elements 305, 330 and the glass element 600 are represented during a process of local heating. The portions 405, 410 serve as joining surfaces for attaching the glass element 600. A laser beam 700 is directed through the glass element 600 onto the other contact element 330 and locally heats it. Thus, the contact element 305 is heated by another laser beam or by a subsequently realigned laser beam 700. By heating the contact elements 305, 330 connected to the carrier element 300, the glass element 600 can be indirectly connected to the carrier element 300, with an air gap 605 remaining between the carrier element 300 and the glass element 600. During localized heating, the glass element 600 is pressed onto the contact elements 305, 330 according to an exemplary embodiment.

[0039] Figure 8 shows a schematic top view of an exemplary embodiment of an optical device 800. In this exemplary embodiment, the optical device 800 comprises a carrier element 300, which is the same as or similar to the carrier elements described in Figures 3, 4, 5, 6 and 7 above. The carrier element 300 of the device 800 is materially connected to the glass element 600 by a method as described in Figures 1 and 2 above. In this exemplary embodiment, a sensor device 805 is arranged on the glass element 600, which is merely an example of a position marker for determining a geometric position. By way of example only, the optical device 800 is an xy encoder.

[0040] FIG. 9 shows a schematic top view of an exemplary embodiment of a carrier element 300 with an arrangement 900 of a plurality of contact recesses 310. The carrier element 300 shown here corresponds or is similar to the carrier elements described above in FIGS. 3, 4, 5, 6, 7, and 8, and has a plurality of contact recesses, all of which are similar to the contact recesses described above in FIGS. 3, 4, and 6. In this exemplary embodiment, the arrangement 900 comprises more than 20 contact recesses 310, illustratively 26 contact recesses, and is only illustratively rectangular in shape. In another exemplary embodiment, for example, more than 20 contact recesses 310 can be arranged along a plurality of rings. For example, the inner ring can have a diameter of 20 mm, the middle ring can have a diameter of 40 mm, and the outer ring can have a diameter of 60 mm.

Claims

1. A method (100) for integrally bonding a glass element (600) to a carrier element (300), said method (100) comprising the following steps (105, 110, 115): Inserting (105) at least one contact element (305) into a contact recess (310) in a surface (400) of said carrier element (300); placing (110) the glass element (600) on a portion (405) of the contact element (305) that protrudes above the surface (400); localized heating (115) of the contact element (305) for connecting the glass element (600) to the carrier element (300) via the contact element (305), The method (100), further comprising the step (210) of covering at least a portion of the contact recess (310) with a separation layer (315) prior to the inserting step (105).

2. The method (100) of claim 1, comprising the step of forming (205) the contact recess (310) prior to the step of inserting (105).

3. The method (100) according to claim 1, characterized in that said separation layer (315) is designed from silicon (Si) or germanium (Ge) or from a refractory metal or from an oxide of said substances or from a refractory metal silicide.

4. 2. The method (100) of claim 1, further comprising the step (215) of heating the contact element (305) to connect the contact element (305) to the carrier element (300), the heating step (215) being performed after the inserting step (105).

5. 5. The method (100) of claim 4, wherein in the heating step (215), the portion (405) of the contact element (305) protruding above the surface (400) is extended as a collar and / or formed as a rounded cap protruding in a normal direction of the glass sheet.

6. The method (100) of any one of claims 1 to 5, comprising, prior to the placing step (110), a step (220) of reducing a thickness of the portion (405) to flatten a contact surface of the portion (405).

7. The method (100) of any one of claims 1 to 5, wherein in the inserting step (105), the contact element (305) is inserted using a reactive welding process.

8. The method (100) according to any one of the preceding claims, wherein in the locally heating step (115), the contact element (305) is heated using a laser beam (700).

9. The method (100) according to any one of claims 1 to 5, wherein in the inserting step (105), the contact element (305) is shaped cylindrically or spherically or partially spherically or ellipsoidally or toroidally.

10. The method (100) of any one of claims 1 to 5, wherein in the step of locally heating (115), the glass element (600) and the support element (300) are bonded to produce an optical device (600).

11. The method (100) according to any one of the preceding claims, comprising the step (200) of providing the carrier element (300) in the form of a ceramic element, and / or the glass element (600) in the form of an ultra-low expansion glass, and / or the contact element (305) in the form of a borosilicate glass element.

12. The method (100) according to any one of claims 1 to 5, wherein in the inserting step (105), a plurality of contact elements (305) are inserted into a plurality of contact recesses (310) in the surface (400) of the carrier element (300), the plurality of contact recesses (310) being arranged in a line.

13. The method (100) according to any one of the preceding claims, wherein in the step of locally heating (115), a pressing force is applied to the glass element (600) to press the glass element (600) against the contact element (305).

14. A carrier element (300) made of silicon carbide (SiC) or diamond or a mixture of silicon and silicon carbide (Si / SiC) and a contact recess (310) or made of boron carbide (B ４ C) or silicon-infiltrated boron carbide (Si / B ４ 1. An optical device (800) having a contact recess (310) made of AlN or AlN and a glass element (600), wherein the carrier element (300) and the glass element (600) are firmly connected to each other by means of a contact element (305) made of glass and inserted in the contact recess (310), and the contact recess (310) is covered with a separation layer (315).

15. 15. The optical device (800) of claim 14, comprising an optical sensor arrangement (805) for detecting a length and / or a geometrical position.

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