Substrate processing apparatus and method for cleaning detachable piping parts

By setting up cleaning units in the upstream and downstream connection parts of the pipeline, and cleaning solutions are used to clean the removable parts, the particle diffusion problem caused by a large amount of cleaning liquid in the prior art is solved, and efficient cleaning effect is achieved.

JP7628450B2Active Publication Date: 2025-02-10SCREEN HOLDINGS CO LTD
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Patent Information

Application Number
JP2021049769
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2021-03-24
Publication Date
2025-02-10
Estimated Expiration
2041-03-24

AI Technical Summary

Technical Problem

The prior art After replacing the filter, a large amount of pure water and chemical solution are required to clean the pipe, resulting in the problem of particle diffusion.

Method used

By setting up cleaning units in the upstream and downstream connection parts of the pipeline, the removable parts are cleaned using chemical solutions and cleaning solutions to reduce the amount and time of cleaning liquid.

Benefits of technology

It effectively suppresses the diffusion of particles after replacing the removable parts of the pipeline, and reduces the amount and time of cleaning liquid.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

To efficiently inhibit diffusion of particles after replacing a pipeline attachment / detachment part that is attachable / detachable to / from a pipeline.SOLUTION: A substrate processing apparatus (100) comprises: a substrate processing unit (10) for processing a substrate (W); a pipeline (32) for pouring processing liquid into the substrate processing unit (10); a pipeline attachment / detachment part (140)that is attachable / detachable to / from the pipeline (32); an upstream side connection portion (152) and a downstream side connection portion (154) that are provided on the upstream and downstream sides of the pipeline attachment / detachment part (140) in the pipeline (32), respectively; and a cleaning unit (160) connectable to the upstream side connection portion (152) and the downstream side connection portion (154). The cleaning unit (160) supplies drug liquid from the upstream side connection portion (152) to the pipeline attachment / detachment part(140) and collects the drug liquid from the downstream side connection portion (154). The cleaning unit (160) supplies cleaning liquid from the upstream side connection portion (152) to the pipeline attachment / detachment part and collects the cleaning liquid from the downstream side connection portion (154).SELECTED DRAWING: Figure 5
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Description

[Technical field]

[0001] The present invention relates to a substrate processing apparatus and a method for cleaning detachable piping parts. [Background technology]

[0002] 2. Description of the Related Art Substrate processing apparatuses for processing substrates are known. Substrate processing apparatuses are preferably used in the manufacture of semiconductor substrates. Typically, substrate processing apparatuses process substrates using a processing liquid such as a chemical liquid.

[0003] The processing liquid flows through a pipe equipped with a filter, a valve, a flow meter, and the like to process the substrate. The filter is replaced periodically. When replacing the filter, flushing is known to be performed after the filter is replaced in order to prevent particles from diffusing throughout the entire apparatus from the newly installed filter (Patent Document 1). Patent Document 1 describes that after replacing the filter, pure water flushing is performed several times to fill and discharge pure water into a tank connected to the filter and the circulation line, and then chemical liquid flushing is performed to fill and discharge a chemical liquid. In the filter cleaning method of Patent Document 1, after replacing the filter, the liquid positions of the tanks that store the processing liquid connected to the filter are raised, so that the liquid can be filled up to the height of the top of the filter, and the particles in the filter are prevented from diffusing throughout the entire liquid processing apparatus. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2015-103662 A Summary of the Invention [Problem to be solved by the invention]

[0005] However, in the filter cleaning method of Patent Document 1, after replacing the filter, the pure water and the chemical solution are filled into a tank connected to the filter and the circulation line, which requires a large amount of pure water and the chemical solution.

[0006] The present invention has been made in consideration of the above-mentioned problems, and an object of the present invention is to provide a substrate processing apparatus and a method for cleaning detachable piping parts that can efficiently suppress the diffusion of particles after replacing detachable piping parts that are attached to piping. [Means for solving the problem]

[0007] According to one aspect of the present invention, a substrate processing apparatus includes a substrate processing unit for processing a substrate, a pipe for circulating a processing liquid to the substrate processing unit, a piping part detachable from the pipe, an upstream connection part provided on the pipe upstream of the piping part, a downstream connection part provided on the pipe downstream of the piping part, and a cleaning unit connectable to the upstream connection part and the downstream connection part. The cleaning unit supplies a chemical liquid to the piping part from one of the upstream connection part and the downstream connection part, recovers the chemical liquid from the other of the upstream connection part and the downstream connection part, supplies a cleaning liquid to the piping part from one of the upstream connection part and the downstream connection part, and recovers the cleaning liquid from the other of the upstream connection part and the downstream connection part.

[0008] In one embodiment, the piping detachable parts include at least one of a filter and a valve.

[0009] In an embodiment, the upstream connection and the downstream connection comprise three-way valves or toggle valves.

[0010] In one embodiment, the cleaning unit supplies the chemical liquid to the detachable piping part from the upstream connection part and recovers the chemical liquid from the downstream connection part, supplies the cleaning liquid to the detachable piping part from the upstream connection part, and recovers the cleaning liquid from the downstream connection part.

[0011] In one embodiment, the cleaning unit supplies a first chemical liquid to the detachable piping part from one of the upstream connection part and the downstream connection part, collects the first chemical liquid from the other of the upstream connection part and the downstream connection part, supplies a second chemical liquid to the detachable piping part from one of the upstream connection part and the downstream connection part, and collects the second chemical liquid from the other of the upstream connection part and the downstream connection part.

[0012] In one embodiment, the cleaning unit includes additional piping connecting the upstream connection and the downstream connection.

[0013] In one embodiment, the cleaning unit further includes a chemical liquid supplying section that supplies the chemical liquid to the additional pipe, a cleaning liquid supplying section that supplies the cleaning liquid to the additional pipe, and a pump provided in the additional pipe.

[0014] In one embodiment, the cleaning unit further includes a tank capable of storing the chemical solution and the cleaning liquid.

[0015] In an embodiment, the cleaning unit is detachable from the upstream connection and the downstream connection.

[0016] In one embodiment, the processing liquid flows through the additional pipe.

[0017] In one embodiment, the piping includes a chemical solution piping through which a chemical solution flows and a cleaning solution piping through which a cleaning solution flows, the upstream connection portion is provided upstream of the cleaning solution piping, the downstream connection portion is provided downstream of the cleaning solution piping, and the additional piping has a piping that connects the chemical solution piping to one of the upstream connection portion and the downstream connection portion.

[0018] In one embodiment, the substrate processing apparatus further includes a storage unit that stores a recipe for controlling cleaning of the detachable piping parts with the cleaning liquid and the chemical liquid in the cleaning unit.

[0019] In one embodiment, the storage unit stores different recipes depending on the piping detachable parts.

[0020] According to another aspect of the present invention, a method for cleaning detachable piping parts includes the steps of replacing a detachable piping part that is attachable to a piping through which a treatment liquid flows; after replacing the detachable piping part, supplying a chemical liquid to the detachable piping part from one of an upstream connection part provided upstream of the detachable piping part and a downstream connection part provided downstream of the detachable piping part, and recovering the chemical liquid from the other of the upstream connection part and the downstream connection part; and after replacing the detachable piping part, supplying a cleaning liquid to the detachable piping part from one of the upstream connection part and the downstream connection part, and recovering the cleaning liquid from the other of the upstream connection part and the downstream connection part. The piping may be connected to a storage tank. The upstream connection part may be provided between the storage tank and the piping detachable part.

[0021] In one embodiment, the method for cleaning the detachable piping parts further includes the step of supplying a cleaning liquid from one of the upstream connection part and the downstream connection part and recovering the cleaning liquid from the other of the upstream connection part and the downstream connection part before replacing the detachable piping part. Effect of the Invention

[0022] According to the present invention, it is possible to efficiently suppress the diffusion of particles after replacing a part that is detachable from a pipe. [Brief description of the drawings]

[0023] [Figure 1] 1 is a schematic diagram of a substrate processing apparatus according to an embodiment of the present invention; [Diagram 2] 2 is a schematic diagram of a substrate processing unit in the substrate processing apparatus of the present embodiment. FIG. [Diagram 3] FIG. 2 is a schematic diagram for explaining a piping configuration in the substrate processing apparatus of the present embodiment. [Figure 4] 1 is a block diagram of a substrate processing apparatus according to an embodiment of the present invention; [Diagram 5]1A to 1C are schematic diagrams illustrating a method for cleaning the detachable piping parts of the present embodiment. [Figure 6] 1A to 1C are schematic diagrams illustrating a method for cleaning the detachable piping parts of the present embodiment. [Figure 7] FIG. 4 is a flow diagram of a cleaning method for detachable piping parts according to the present embodiment. [Figure 8] 1A to 1C are schematic diagrams illustrating a method for cleaning the detachable piping parts of the present embodiment. [Figure 9] FIG. 4 is a flow diagram of a cleaning method for detachable piping parts according to the present embodiment. [Figure 10] 1(a) to 1(c) are schematic diagrams illustrating a piping configuration in a substrate processing apparatus according to the present embodiment. [Figure 11] FIG. 4 is a flow diagram of a cleaning method for detachable piping parts according to the present embodiment. [Figure 12] 2 is a schematic diagram of a cleaning unit in the substrate processing apparatus of the present embodiment. FIG. [Figure 13] FIG. 4 is a flow diagram of a cleaning method for detachable piping parts according to the present embodiment. [Figure 14] FIG. 2 is a schematic diagram for explaining a piping configuration in the substrate processing apparatus of the present embodiment. [Figure 15] 1A and 1B are schematic diagrams illustrating a piping configuration in the substrate processing apparatus of the present embodiment. [Figure 16] FIG. 2 is a schematic diagram for explaining a piping configuration in the substrate processing apparatus of the present embodiment. [Figure 17] 1A and 1B are schematic diagrams illustrating a piping configuration in the substrate processing apparatus of the present embodiment. [Figure 18] FIG. 2 is a schematic diagram for explaining a piping configuration in the substrate processing apparatus of the present embodiment. [Figure 19] FIG. 2 is a schematic diagram for explaining a piping configuration in the substrate processing apparatus of the present embodiment. [Figure 20] 1A and 1B are schematic diagrams illustrating a piping configuration in the substrate processing apparatus of the present embodiment. [Figure 21]FIG. 2 is a schematic diagram for explaining a piping configuration in the substrate processing apparatus of the present embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0024] Hereinafter, an embodiment of a substrate processing apparatus and a cleaning method for detachable piping parts according to the present invention will be described with reference to the drawings. In the drawings, the same or corresponding parts are denoted by the same reference symbols and will not be described repeatedly. In this specification, to facilitate understanding of the invention, an X-axis, a Y-axis, and a Z-axis that are orthogonal to each other may be described. Typically, the X-axis and the Y-axis are parallel to the horizontal direction, and the Z-axis is parallel to the vertical direction.

[0025] First, an embodiment of a substrate processing apparatus 100 according to the present invention will be described with reference to Fig. 1. Fig. 1 is a schematic plan view of the substrate processing apparatus 100 of the present embodiment.

[0026] The substrate processing apparatus 100 processes a substrate W. The substrate processing apparatus 100 processes the substrate W by performing at least one of etching, surface treatment, property imparting, treatment film formation, removal of at least a portion of a film, and cleaning on the substrate W.

[0027] The substrate W is used as a semiconductor substrate. The substrate W includes a semiconductor wafer. For example, the substrate W has a substantially circular plate shape. Here, the substrate processing apparatus 100 processes the substrates W one by one.

[0028] 1, the substrate processing apparatus 100 includes a plurality of substrate processing units 10, a processing liquid cabinet 110, a processing liquid box 120, a plurality of load ports LP, an indexer robot IR, a center robot CR, and a controller 101. The controller 101 controls the load port LP, the indexer robot IR, and the center robot CR. The controller 101 includes a control unit 102 and a memory unit 104.

[0029] Each of the load ports LP accommodates a plurality of stacked substrates W. The indexer robot IR transports the substrates W between the load port LP and the center robot CR. The center robot CR transports the substrates W between the indexer robot IR and the substrate processing units 10. Each of the substrate processing units 10 discharges a processing liquid onto the substrate W to process the substrate W. The processing liquid includes a chemical liquid, a cleaning liquid, a removing liquid and / or a water repellent. The processing liquid cabinet 110 accommodates the processing liquid. The processing liquid cabinet 110 may accommodate a gas.

[0030] Specifically, the substrate processing units 10 form a plurality of towers TW (four towers TW in FIG. 1) arranged to surround a center robot CR in a plan view. Each tower TW includes a plurality of substrate processing units 10 (three substrate processing units 10 in FIG. 1) stacked vertically. The processing liquid boxes 120 correspond to the plurality of towers TW, respectively. The liquid in the processing liquid cabinet 110 is supplied to all the substrate processing units 10 included in the tower TW corresponding to the processing liquid box 120 through any one of the processing liquid boxes 120. Also, the gas in the processing liquid cabinet 110 is supplied to all the substrate processing units 10 included in the tower TW corresponding to the processing liquid box 120 through any one of the processing liquid boxes 120.

[0031] In the substrate processing apparatus 100, a boundary wall BW is disposed between an area where the center robot CR and the substrate processing units 10 are installed, and an area where the processing liquid cabinet 110 is installed. The processing liquid cabinet 110 defines a part of the space of the area of ​​the substrate processing apparatus 100 outside the boundary wall BW.

[0032] Typically, the processing liquid cabinet 110 has a preparation tank (tank) for preparing the processing liquid. The processing liquid cabinet 110 may have a preparation tank for one type of processing liquid, or may have preparation tanks for multiple types of processing liquid. The processing liquid cabinet 110 also has a pump, a nozzle, and / or a filter for distributing the processing liquid.

[0033] Here, the processing liquid cabinet 110 includes a first processing liquid cabinet 110A and a second processing liquid cabinet 110B. The first processing liquid cabinet 110A and the second processing liquid cabinet 110B are disposed opposite to each other.

[0034] The control device 101 controls various operations of the substrate processing apparatus 100 .

[0035] The control device 101 includes a control unit 102 and a storage unit 104. The control unit 102 has a processor. The control unit 102 has, for example, a central processing unit (CPU). Alternatively, the control unit 102 may have a general-purpose computer.

[0036] The storage unit 104 stores data and computer programs. The data includes recipe data. The recipe data includes information indicating a plurality of recipes. Each of the plurality of recipes defines the processing content and processing procedure for the substrate W.

[0037] The storage unit 104 includes a main storage device and an auxiliary storage device. The main storage device is, for example, a semiconductor memory. The auxiliary storage device is, for example, a semiconductor memory and / or a hard disk drive. The storage unit 104 may include a removable medium. The control unit 102 executes a computer program stored in the storage unit 104 to perform a substrate processing operation.

[0038] Next, the substrate processing unit 10 in the substrate processing apparatus 100 of this embodiment will be described with reference to Fig. 2. Fig. 2 is a schematic diagram of the substrate processing unit 10 in the substrate processing apparatus 100.

[0039] The substrate processing unit 10 includes a chamber 11, a substrate holding part 20, and a processing liquid supply part 30. The chamber 11 accommodates a substrate W. The substrate holding part 20 holds the substrate W.

[0040] The chamber 11 is substantially box-shaped with an internal space. The chamber 11 accommodates the substrate W. Here, the substrate processing apparatus 100 is a single-wafer type that processes the substrate W one by one, and the chamber 11 accommodates the substrate W one by one. The substrate W is accommodated in the chamber 11 and is processed in the chamber 11. The chamber 11 accommodates at least a part of each of the substrate holder 20 and the processing liquid supply unit 30.

[0041] The substrate holding unit 20 holds the substrate W. The substrate holding unit 20 holds the substrate W horizontally so that the top surface (front surface) Wa of the substrate W faces upward and the back surface (bottom surface) Wb of the substrate W faces vertically downward. The substrate holding unit 20 also rotates the substrate W while holding it. For example, the top surface Wa of the substrate W has a laminated structure in which a recess is formed. The substrate holding unit 20 rotates the substrate W while holding it.

[0042] For example, the substrate holding unit 20 may be of a clamping type that clamps an end of the substrate W. Alternatively, the substrate holding unit 20 may have any mechanism that holds the substrate W from its back surface Wb. For example, the substrate holding unit 20 may be of a vacuum type. In this case, the substrate holding unit 20 holds the substrate W horizontally by adsorbing the center of the back surface Wb of the substrate W, which is the non-device forming surface, to its upper surface. Alternatively, the substrate holding unit 20 may combine a clamping type that brings multiple chuck pins into contact with the peripheral end surface of the substrate W with a vacuum type.

[0043] For example, the substrate holding unit 20 includes a spin base 21, a chuck member 22, a shaft 23, an electric motor 24, and a housing 25. The chuck member 22 is provided on the spin base 21. The chuck member 22 chucks the substrate W. Typically, the spin base 21 is provided with a plurality of chuck members 22.

[0044] The shaft 23 is a hollow shaft. The shaft 23 extends vertically along the rotation axis Ax. The spin base 21 is coupled to the upper end of the shaft 23. The substrate W is placed above the spin base 21.

[0045] The spin base 21 is disk-shaped and supports the substrate W horizontally. The shaft 23 extends downward from the center of the spin base 21. The electric motor 24 applies a rotational force to the shaft 23. The electric motor 24 rotates the shaft 23 in a rotational direction, thereby rotating the substrate W and the spin base 21 about the rotation axis Ax. The housing 25 surrounds the shaft 23 and the electric motor 24.

[0046] The processing liquid supply unit 30 supplies the processing liquid to the substrate W. Typically, the processing liquid supply unit 30 supplies the processing liquid to the upper surface Wa of the substrate W. At least a part of the processing liquid supply unit 30 is accommodated in the chamber 11.

[0047] The processing liquid supply unit 30 supplies a processing liquid to the upper surface Wa of the substrate W. The processing liquid may include a so-called chemical liquid. The chemical liquid includes hydrofluoric acid. For example, the hydrofluoric acid may be heated to 40° C. or more and 70° C. or less, or 50° C. or more and 60° C. or less. However, the hydrofluoric acid does not have to be heated. The chemical liquid may also include water or phosphoric acid.

[0048] The chemical solution may further include hydrogen peroxide. The chemical solution may also include SC1 (ammonia hydrogen peroxide mixture), SC2 (hydrochloric acid hydrogen peroxide mixture), or aqua regia (a mixture of concentrated hydrochloric acid and concentrated nitric acid).

[0049] Alternatively, the processing liquid may include a so-called cleaning liquid (rinsing liquid). For example, the cleaning liquid may include any of deionized water (DIW), carbonated water, electrolytic ionized water, ozone water, ammonia water, hydrochloric acid water with a dilute concentration (for example, about 10 ppm to 100 ppm), and reduced water (hydrogen water).

[0050] The processing liquid supply unit 30 includes a pipe 32, a nozzle 34, and a valve 36. The nozzle 34 ejects the processing liquid onto the upper surface Wa of the substrate W. The nozzle 34 is connected to the pipe 32. The processing liquid is supplied to the pipe 32 from a supply source. The valve 36 opens and closes a flow path in the pipe 32. The nozzle 34 is preferably configured to be movable relative to the substrate W.

[0051] The valve 36 opens and closes the flow path in the pipe 32. The valve 36 adjusts the opening of the pipe 32 to adjust the flow rate of the processing liquid supplied to the pipe 32. Specifically, the valve 36 includes a valve body (not shown) having a valve seat therein, a valve element that opens and closes the valve seat, and an actuator (not shown) that moves the valve element between an open position and a closed position.

[0052] The nozzle 34 may be movable. The nozzle 34 can move horizontally and / or vertically according to a movement mechanism controlled by the control unit 102. Note that in this specification, the movement mechanism is omitted to avoid overly complicating the drawings.

[0053] The substrate processing unit 10 further includes a cup 80. The cup 80 collects the processing liquid scattered from the substrate W. The cup 80 moves up and down. For example, the cup 80 moves up vertically to the side of the substrate W during the period in which the processing liquid supply unit 30 supplies the processing liquid to the substrate W. In this case, the cup 80 collects the processing liquid scattered from the substrate W due to the rotation of the substrate W. Furthermore, when the period in which the processing liquid supply unit 30 supplies the processing liquid to the substrate W ends, the cup 80 moves down vertically from the side of the substrate W.

[0054] As described above, the control device 101 includes the control unit 102 and the memory unit 104. The control unit 102 controls the substrate holder 20, the processing liquid supply unit 30, and / or the cup 80. In one example, the control unit 102 controls the electric motor 24, the valve 36, and / or the cup 80.

[0055] The substrate processing apparatus 100 of this embodiment is suitable for use in the manufacture of a semiconductor device having a semiconductor. Typically, in a semiconductor device, a conductive layer and an insulating layer are laminated on a base material. The substrate processing apparatus 100 is suitable for use in cleaning and / or processing (e.g., etching, changing characteristics, etc.) the conductive layer and / or insulating layer during the manufacture of the semiconductor device.

[0056] In the substrate processing unit 10 shown in FIG. 2, the processing liquid supply unit 30 can supply one type of processing liquid. However, this embodiment is not limited to this. The processing liquid supply unit 30 may supply multiple types of processing liquid. For example, the processing liquid supply unit 30 may be capable of sequentially supplying multiple types of processing liquids with different uses to the substrate W. Alternatively, the processing liquid supply unit 30 may be capable of simultaneously supplying multiple types of processing liquids with different uses to the substrate W.

[0057] Next, a piping configuration of the substrate processing apparatus 100 of this embodiment will be described with reference to Figures 1 to 3. Figure 3 is a schematic diagram for explaining the piping configuration in the substrate processing apparatus 100 of this embodiment. As can be seen from Figures 1 and 2, the substrate processing apparatus 100 preferably has a plurality of substrate processing units 10, and a substrate W can be processed with a plurality of types of processing liquid. However, in order to avoid overly complicated explanation, a mode in which one type of processing liquid is supplied to one substrate processing unit 10 will be described here.

[0058] As shown in FIG. 3, the substrate processing apparatus 100 includes a preparation tank (Storage tank) The system includes a piping attachment / detachment part 140 , an upstream connection part 152 , a downstream connection part 154 , and a cleaning unit 160 .

[0059] The preparation tank 112 stores a processing liquid. The processing liquid is supplied to the substrate processing unit 10 to process the substrate W. Typically, the processing liquid is a chemical liquid. However, the processing liquid may be a cleaning liquid. The processing liquid is prepared in the preparation tank 112. Typically, the preparation tank 112 is disposed in the processing liquid cabinet 110.

[0060] The piping 32 connects the preparation tank 112 and the substrate processing unit 10. The piping 32 is equipped with a valve 113, a pump 114, a piping attachment / detachment part 140, an upstream connection part 152, a downstream connection part 154, and a valve .

[0061] The processing liquid cabinet 110 has a housing 111. Typically, the housing 111 accommodates a preparation tank 112, a valve 113, a pump 114, a piping attachment / detachment part 140, an upstream connection part 152, and a downstream connection part 154.

[0062] The processing liquid box 120 has a housing 121. Typically, the valve 36 is housed in the housing 121.

[0063] The piping 32 extends from the processing liquid cabinet 110 through the processing liquid box 120 to the substrate processing unit 10. The processing liquid is prepared in the preparation tank 112 and then flows from the preparation tank 112 through the piping 32 to the substrate processing unit 10. For example, the piping 32 is made of resin.

[0064] The piping detachable part 140 is attached to the piping 32. The piping detachable part 140 is detachable from the piping 32. When the piping detachable part 140 is attached to the piping 32, the processing liquid flows through the piping detachable part 140. On the other hand, the piping detachable part 140 can be detached from the piping 32. Therefore, when the piping detachable part 140 deteriorates, the piping detachable part 140 is replaced.

[0065] The piping detachable part 140 is formed from resin. Typically, the piping detachable part 140 is formed by resin molding. In one example, the piping detachable part 140 is produced by cutting a resin molded product with a metal processing tool. Note that the piping detachable part 140 may be formed from metal.

[0066] The piping detachable part 140 may be a valve. The valve may be a single valve or a multiple valve. In this case, the piping detachable part 140 can open and close the flow path in the piping 32. The piping detachable part 140 adjusts the opening degree of the piping 32 to adjust the flow rate of the processing liquid supplied to the piping 32. Specifically, the valve 36 includes a valve body (not shown) having a valve seat provided therein, a valve element that opens and closes the valve seat, and an actuator (not shown) that moves the valve element between an open position and a closed position.

[0067] The piping detachment part 140 may be a filter. In this case, the piping detachment part 140 filters the processing liquid flowing through the piping 32.

[0068] The upstream connection 152 is located upstream of the piping 32 with respect to the piping attachment / detachment part 140. The upstream connection 152 has three openings. For example, the upstream connection 152 includes a three-way valve or a toggle valve. Alternatively, the upstream connection 152 may include a three-way pipe and a valve.

[0069] The upstream connection 152 can switch the flow of liquid through two of the three openings. For example, the upstream connection 152 may switch the flow of liquid through two of the three openings to the flow of liquid through another two openings. Alternatively, the upstream connection 152 may block the flow of liquid through the two openings.

[0070] Typically, in the piping 32, no other parts are attached between the upstream connection part 152 and the piping detachable part 140. For example, the distance between the upstream connection part 152 and the piping detachable part 140 may be 1 cm or more and 100 cm or less, or 5 cm or more and 50 cm or less.

[0071] The two openings of the upstream connection part 152 connect to the pipe 32. One of the two openings of the upstream connection part 152 is located upstream of the pipe 32, and the other of the two openings is located downstream of the pipe 32. The remaining opening of the upstream connection part 152 is located at a location away from the pipe 32. The remaining opening of the upstream connection part 152 can be connected to a pipe other than the pipe 32.

[0072] The downstream connection part 154 is located on the downstream side of the pipe 32 with respect to the pipe attachment / detachment part 140. The downstream connection part 154 has three openings. Typically, the downstream connection part 154 has a similar configuration to the upstream connection part 152.

[0073] Typically, in the piping 32, no other parts are attached between the piping detachable part 140 and the downstream connection part 154. For example, the distance between the piping detachable part 140 and the downstream connection part 154 may be 1 cm or more and 100 cm or less, or may be 5 cm or more and 50 cm or less.

[0074] The two openings of the downstream connection part 154 are connected to the pipe 32. One of the two openings of the downstream connection part 154 is located on the upstream side of the pipe 32, and the other of the two openings is located on the downstream side of the pipe 32. The remaining opening of the downstream connection part 154 is located at a location away from the pipe 32. The remaining opening of the downstream connection part 154 can be connected to a pipe other than the pipe 32.

[0075] The substrate processing apparatus 100 of this embodiment includes a cleaning unit 160. The cleaning unit 160 cleans the piping detachable part 140. The cleaning unit 160 is connected to the upstream connection part 152 and the downstream connection part 154 to clean the piping detachable part 140. In the substrate processing apparatus 100, the cleaning unit 160 may be movably disposed. Alternatively, the cleaning unit 160 may be installed within the substrate processing apparatus 100. For example, the cleaning unit 160 may be installed within the processing liquid cabinet 110 and / or the processing liquid box 120.

[0076] The cleaning unit 160 includes a chemical liquid supply part 162a, a cleaning liquid supply part 162b, an additional pipe 164, a valve 166a, and a pump 166b.

[0077] The chemical liquid supplying part 162a supplies a chemical liquid. The chemical liquid supplied from the chemical liquid supplying part 162a may be the same as the processing liquid supplied to the substrate W in the substrate processing unit 10, or may be different.

[0078] The chemical liquid supplied from the chemical liquid supply unit 162a removes particles adhering to the piping detachable part 140. For example, the chemical liquid preferably removes the resin component of the piping detachable part 140.

[0079] In this case, an alkaline or organic chemical is preferably used as the chemical for removing the resin particles. For example, ammonia, isopropyl alcohol (IPA), hydrogen peroxide, or ozone water may be used as the chemical for removing the resin particles.

[0080] The chemical liquid supplied from the chemical liquid supply unit 162a may remove particles of metal components from the piping detachable part 140. For example, the chemical liquid preferably removes particles of metal components attached to the piping detachable part 140 from a processing tool used when the piping detachable part 140 is produced.

[0081] In this case, an acidic chemical is preferably used as the chemical for removing the metal components. For example, hydrochloric acid or hydrofluoric acid may be used as the chemical for removing the metal components.

[0082] The cleaning liquid supply unit 162b supplies a cleaning liquid. The cleaning liquid supplied from the cleaning liquid supply unit 162b may be the same as or different from the processing liquid supplied to the substrate W in the substrate processing unit 10. The cleaning liquid supply unit 162b includes deionized water (DIW).

[0083] The additional pipe 164 includes a first pipe 164a and a second pipe 164b. One end of the first pipe 164a can be connected to either the chemical liquid supply unit 162a or the cleaning liquid supply unit 162b. The other end of the first pipe 164a can be connected to one of the upstream connection unit 152 and the downstream connection unit 154. One end of the second pipe 164b can be connected to the other of the upstream connection unit 152 and the downstream connection unit 154. The other end of the second pipe 164b is connected to a drain pipe.

[0084] The valve 166a is attached to the additional pipe 164. Specifically, the valve 166a is attached to at least one of the first pipe 164a and the second pipe 164b. The valve 166a opens and closes a flow path in the additional pipe 164. The valve 166a adjusts the opening degree of the additional pipe 164 to adjust the flow rate of the processing liquid supplied to the additional pipe 164. Specifically, the valve 166a includes a valve body (not shown) having a valve seat provided therein, a valve element that opens and closes the valve seat, and an actuator (not shown) that moves the valve element between an open position and a closed position.

[0085] The pump 166b is attached to the additional pipe 164. Specifically, the pump 166b is attached to at least one of the first pipe 164a and the second pipe 164b. The pump 166b may be disposed upstream or downstream of the valve 166a. The pump 166b pumps the processing liquid in the additional pipe 164.

[0086] Next, a substrate processing apparatus 100 according to the present embodiment will be described with reference to Figures 1 to 4. Figure 4 is a block diagram of the substrate processing apparatus 100.

[0087] 4, the control device 101 controls various operations of the substrate processing apparatus 100. The control device 101 controls the indexer robot IR, the center robot CR, the substrate holding unit 20, the processing liquid supply unit 30, the piping attachment / detachment part 140, and the cleaning unit 160. Specifically, the control device 101 controls the indexer robot IR, the center robot CR, the substrate holding unit 20, the processing liquid supply unit 30, the piping attachment / detachment part 140, and the cleaning unit 160 by transmitting control signals to the indexer robot IR, the center robot CR, the substrate holding unit 20, the processing liquid supply unit 30, the piping attachment / detachment part 140, and the cleaning unit 160.

[0088] More specifically, the control unit 102 controls the indexer robot IR to transfer the substrate W by the indexer robot IR.

[0089] The control unit 102 controls the center robot CR to transfer the substrate W by the center robot CR. For example, the center robot CR receives an unprocessed substrate W and carries the substrate W into one of the plurality of substrate processing units 10. The center robot CR also receives a processed substrate W from the substrate processing unit 10 and carries the substrate W out.

[0090] The control unit 102 controls the substrate holding unit 20 to start rotation of the substrate W, change the rotation speed, and stop rotation of the substrate W. For example, the control unit 102 can control the substrate holding unit 20 to change the number of rotations of the substrate holding unit 20. Specifically, the control unit 102 can change the number of rotations of the substrate W by changing the number of rotations of the electric motor 24 of the substrate holding unit 20.

[0091] When the piping detachable part 140 is operable, the control unit 102 controls the operation of the piping detachable part 140. For example, the piping detachable part 140 can switch the operation of the piping detachable part 140 by controlling the piping detachable part 140. Specifically, when the piping detachable part 140 is a valve that can be driven, the control unit 102 controls the piping detachable part 140 to open the piping detachable part 140, thereby allowing the liquid to pass through the piping detachable part 140. Furthermore, the control unit 102 can stop the flow of the liquid in the piping detachable part 140 by controlling the piping detachable part 140 to close the piping detachable part 140.

[0092] Furthermore, the control unit 102 can control the valve 166a to switch the state of the valve 166a between an open state and a closed state. The control unit 102 can control the pump 166b to send liquid to the additional pipe 142. Specifically, the control unit 102 can control the valve 166a and the pump 166b to open the valve 166a and drive the pump 166b to pass the chemical liquid or cleaning liquid flowing through the additional pipe 164 toward the detachable pipe part 140. The control unit 102 can also control the valve 166a and the pump 166b to close the valve 166a and stop the pump 166b to stop the flow of the chemical liquid or cleaning liquid through the additional pipe 164 toward the detachable pipe part 140.

[0093] Furthermore, the control unit 102 preferably controls the flow of liquid passing through the upstream connection portion 152 and the downstream connection portion 154. In particular, the control unit 102 preferably switches which openings of the upstream connection portion 152 and the downstream connection portion 154 are connected.

[0094] As described above, a plurality of recipe data may be stored in the storage unit 104. The plurality of recipes may define the contents and procedures of the cleaning process for the piping detachable parts 140.

[0095] The substrate processing apparatus 100 of this embodiment is preferably used for forming semiconductor elements. For example, the substrate processing apparatus 100 is preferably used for processing a substrate W used as a semiconductor element having a stacked structure. The semiconductor element is a so-called 3D structure memory (storage device). As an example, the substrate W is preferably used as a NAND type flash memory.

[0096] Next, a method for cleaning piping detachable parts 140 of this embodiment will be described with reference to Figures 1 to 6. Figures 5(a) to 6(c) are schematic diagrams for explaining a method for cleaning piping detachable parts 140 of this embodiment. Here, a method for cleaning piping detachable parts 140 when removing an old piping detachable part 140a from a pipe 32 and attaching a new piping detachable part 140 to the pipe 32 will be described.

[0097] 5(a), a piping detachable part 140a is attached to the piping 32. For example, the piping detachable part 140a is a valve or a filter.

[0098] The upstream connection part 152 is located upstream of the piping detachable part 140a in the piping 32, and the downstream connection part 154 is located downstream of the piping detachable part 140a in the piping 32. Note that the processing liquid flows through the piping 32 with the piping detachable part 140a attached until the piping detachable part 140a is replaced. Therefore, the substrate processing unit 10 can process the substrate W with the processing liquid that has flowed through the piping 32. On the other hand, before replacing the piping detachable part 140a, the valve 113 is closed to stop the flow of the processing liquid.

[0099] As shown in FIG. 5( b ), the piping detachment part 140 a is removed from the piping 32 , and a new piping detachment part 140 is attached to the piping 32 .

[0100] 5(c), a first pipe 164a of the cleaning unit 160 is connected to the upstream connector 152. Here, one end of the first pipe 164a is connected to a chemical liquid supply unit 162a, and the other end of the first pipe 164a is connected to the upstream connector 152. A valve 166a and a pump 166b are attached to the first pipe 164a. The upstream connector 152 is switched to connect the first pipe 164a to the detachable pipe part 140.

[0101] Further, the second pipe 164b of the cleaning unit 160 is connected to the downstream side connection part 154. One end of the second pipe 164b is connected to the downstream side connection part 154. The other end of the second pipe 164b is connected to a drainage pipe. The downstream side connection part 154 is switched to communicate between the piping detachable part 140 and the second pipe 164b.

[0102] 6(a), the chemical liquid is supplied from the chemical liquid supply unit 162a to the detachable piping part 140 by opening the valve 166a and driving the pump 166b. The chemical liquid supplied from the chemical liquid supply unit 162a flows to the drain pipe via the first pipe 164a, the pipe 32, the detachable piping part 140, the pipe 32, and the second pipe 164b. This allows the detachable piping part 140 to be washed with the chemical liquid by using the portion of the pipe 32 between the upstream connector 152 and the downstream connector 154. Thereafter, the valve 166a is closed to stop driving the pump 166b, thereby stopping the flow of the chemical liquid.

[0103] As shown in FIG. 6(b), the connection destination of one end of the first pipe 164a is changed from the chemical liquid supply part 162a to a cleaning liquid supply part 162b.

[0104] 6(c), by opening the valve 166a and driving the pump 166b, the cleaning liquid flows from the cleaning liquid supply unit 162b through the first pipe 164a, the pipe 32, the detachable pipe part 140, the pipe 32, and the second pipe 164b to the drain pipe. This allows the cleaning liquid to be used to clean the detachable pipe part 140 using the part of the pipe 32 between the upstream connector 152 and the downstream connector 154. Thereafter, the valve 166a is closed to stop driving the pump 166b, thereby stopping the flow of the cleaning liquid.

[0105] In this manner, the piping detachable parts 140 can be efficiently flushed. Typically, after flushing the piping detachable parts 140, the upstream connection part 152 is switched to connect the preparation tank 112 and the piping detachable parts 140, and the downstream connection part 154 is switched to connect the piping detachable parts 140 and the valve 36. This causes the processing liquid from the preparation tank 112 to pass through the piping detachable parts 140, flow through the piping 32, and flow to the substrate processing unit 10. In the substrate processing unit 10, the substrate W is processed with the processing liquid.

[0106] According to the cleaning method for piping detachable parts 140 of this embodiment, the upstream connection part 152 and the downstream connection part 154 around the piping detachable parts 140 are connected to the cleaning unit 160, and the piping detachable parts 140 are cleaned with a chemical liquid and a cleaning liquid. Therefore, even when the piping detachable parts 140 are replaced, the amount of the chemical liquid and the cleaning liquid used for flushing the piping detachable parts 140 can be reduced, and the flushing time can be shortened. Furthermore, according to this embodiment, the piping detachable parts 140 can be cleaned with a liquid different from the processing liquid flowing in the piping 32 to which the piping detachable parts 140 are attached.

[0107] In FIG. 6(a), the first pipe 164a is connected to the upstream side connection part 152 provided upstream of the piping detachable part 140, and the second pipe 164b is connected to the downstream side connection part 154 provided downstream of the piping detachable part 140, but this embodiment is not limited to this. The first pipe 164a may be connected to the downstream side connection part 154, and the second pipe 164b may be connected to the upstream side connection part 152. In this case, the chemical liquid supplied from the chemical liquid supply part 162a flows in the order of the first pipe 164a, the downstream side connection part 154, the pipe 32 including the piping detachable part 140, the upstream side connection part 152, and the second pipe 164b. Similarly, the chemical liquid supplied from the cleaning liquid supply part 162b flows in the order of the first pipe 164a, the downstream side connection part 154, the pipe 32 including the piping detachable part 140, the upstream side connection part 152, and the second pipe 164b.

[0108] In this way, the cleaning unit 160 may supply the chemical liquid from the chemical liquid supply unit 162a to one of the upstream connection unit 152 provided upstream of the piping detachable part 140 and the downstream connection unit provided downstream of the piping detachable part 140, and collect the chemical liquid from the other of the upstream connection unit 152 and the downstream connection unit 154. Similarly, the cleaning unit 160 may supply the cleaning liquid from the cleaning liquid supply unit 162b to one of the upstream connection unit 152 provided upstream of the piping detachable part 140 and the downstream connection unit provided downstream of the piping detachable part 140, and collect the cleaning liquid from the other of the upstream connection unit 152 and the downstream connection unit 154.

[0109] However, when the piping detachable parts 140 are filters of a specific structure, the piping detachable parts 140 may allow liquid to flow from one direction while not allowing liquid to flow from the opposite direction. Also, even if the piping detachable parts 140 are washed with liquid flowing in the opposite direction to the flow direction of the processing liquid, particles on the piping detachable parts 140 may not be sufficiently removed. For this reason, it is preferable that the flow direction of the liquid when washing the piping detachable parts 140 with the washing unit 160 is the same as the direction when the processing liquid from the preparation tank 112 flows through the piping detachable parts 140.

[0110] Next, a method for cleaning the detachable pipe parts 140 of this embodiment will be described with reference to Figures 1 to 7 (mainly Figures 5 to 7). Figure 7 is a flow diagram of the method for cleaning the detachable pipe parts 140 of this embodiment.

[0111] 7, in step Se, the pipe detachment part 140 attached to the pipe 32 is replaced. In detail, the pipe detachment part 140a attached to the pipe 32 is removed from the pipe 32, and a new pipe detachment part 140 is attached to the pipe 32.

[0112] In step Sa, the cleaning unit 160 is attached to the piping 32. In detail, a first pipe 164a of the cleaning unit 160 is connected to the upstream connection part 152. Here, one end of the first pipe 164a is connected to the chemical liquid supply part 162a, and the other end of the first pipe 164a is connected to the upstream connection part 152. In addition, a second pipe 164b of the cleaning unit 160 is connected to the downstream connection part 154. Here, one end of the second pipe 164b is connected to the downstream connection part 154, and the other end of the second pipe 164b is connected to a drain pipe.

[0113] In step Sc, the chemical liquid is supplied to the piping detachable part 140. The cleaning unit 160 supplies the chemical liquid to the upstream connection part 152 provided upstream of the piping detachable part 140, so that the chemical liquid passes through the piping detachable part 140, and the cleaning unit 160 collects the chemical liquid from the downstream connection part 154.

[0114] In step Sr, a cleaning liquid is supplied to the piping detachable part 140. The cleaning unit 160 supplies the cleaning liquid to the upstream connection part 152 provided upstream of the piping detachable part 140, so that the cleaning liquid passes through the piping detachable part 140, and the cleaning unit 160 collects the cleaning liquid from the downstream connection part 154.

[0115] In this manner, cleaning of detachable piping parts 140 is completed. According to this embodiment, cleaning unit 160 supplies the chemical liquid and cleaning liquid to detachable piping parts 140 via upstream connection part 152 and downstream connection part 154, and can collect the chemical liquid and cleaning liquid that have passed through detachable piping parts 140. Therefore, detachable piping parts 140 can be effectively cleaned.

[0116] When the substrate W is processed in the substrate processing apparatus 100, the processing liquid from the preparation tank 112 flows through the piping detachable parts 140. For this reason, it is preferable that the piping detachable parts 140 be washed with a cleaning liquid before the piping detachable parts 140 are removed from the piping 32. For example, before the piping detachable parts 140 are removed from the piping 32, the cleaning unit 160 may wash the piping detachable parts 140 with a cleaning liquid.

[0117] Next, a method for cleaning the piping detachable part 140a detached from the substrate processing apparatus 100 of this embodiment will be described with reference to Fig. 8. Fig. 8(a) and Fig. 8(b) are schematic views for explaining a method for cleaning the piping detachable part 140a detached from the substrate processing apparatus 100 of this embodiment.

[0118] 8(a), a pre-replacement piping detachment part 140a is attached to the piping 32. The upstream connection part 152 is located on the upstream side of the piping 32 with respect to the piping detachment part 140a, and the downstream connection part 154 is located on the downstream side of the piping 32 with respect to the piping detachment part 140a.

[0119] 8(b), a first pipe 164a of the cleaning unit 160 is connected to an upstream connection part 152 located on the upstream side of the piping detachable part 140a, and a second pipe 164b of the cleaning unit 160 is connected to a downstream connection part 154 located on the downstream side of the piping detachable part 140a. Here, a cleaning liquid supply part 162b is connected to one end of the first pipe 164a, and the upstream connection part 152 is connected to the other end of the first pipe 164a.

[0120] Thereafter, the valve 166a is opened and the pump 166b is driven to flow the cleaning liquid through the first pipe 164a, the piping detachable part 140a, and the second pipe 164b in that order. Typically, the cleaning liquid is DIW. In this manner, the piping detachable part 140a can be cleaned with the cleaning liquid of the cleaning unit 160.

[0121] As shown in FIG. 8( c ), the piping detachment part 140 a is removed from the piping 32 , and a new piping detachment part 140 is attached to the piping 32 .

[0122] In this embodiment, before the piping detachable parts 140a are removed, the piping detachable parts 140a are washed by the washing unit 160. Therefore, the piping detachable parts 140a can be easily replaced.

[0123] 1 to 9 (mainly FIGS. 8 and 9), a method for cleaning the piping detachable parts 140 in the substrate processing apparatus 100 of the present embodiment will be described. Fig. 9 is a flow chart of the method for cleaning the piping detachable parts 140 of the present embodiment.

[0124] As shown in FIG. 9, in step Sa, the cleaning unit 160 is attached to the piping 32 to which the piping attachment / detachment part 140a is attached. In detail, the first piping 164a of the cleaning unit 160 is connected to the upstream connection part 152. Here, one end of the first piping 164a is connected to the chemical liquid supply part 162a, and the other end of the first piping 164a is connected to the upstream connection part 152. A valve 166a and a pump 166b are attached to the first piping 164a. In addition, the second piping 164b of the cleaning unit 160 is connected to the downstream connection part 154. Here, one end of the second piping 164b is connected to the downstream connection part 154.

[0125] In step Sw, the cleaning liquid is supplied to the piping detachable part 140a. The cleaning unit 160 supplies the cleaning liquid from the cleaning liquid supply part 162b to the upstream connector 152 provided upstream of the piping detachable part 140a, and collects the cleaning liquid from the downstream connector 154.

[0126] In step Se, the pipe detachment part 140 of the pipe 32 is replaced. In detail, the pipe detachment part 140a attached to the pipe 32 is removed from the pipe 32, and a new pipe detachment part 140 is attached to the pipe 32.

[0127] In step Sc, the chemical liquid is supplied to the piping detachable part 140. The cleaning unit 160 supplies the chemical liquid from the chemical liquid supply part 162a to the upstream connector 152 provided upstream of the piping detachable part 140, and collects the chemical liquid from the downstream connector 154.

[0128] In step Sr, a cleaning liquid is supplied to the piping detachable part 140. The cleaning unit 160 supplies the cleaning liquid from a cleaning liquid supply part 162b to an upstream connector 152 provided upstream of the piping detachable part 140, and collects the cleaning liquid from a downstream connector 154.

[0129] According to this embodiment, before the piping detachment parts 140a are detached from the piping 32, the piping detachment parts 140a are washed with a washing liquid by the washing unit 160. Therefore, when the piping detachment parts 140a are detached from the piping 32, the piping detachment parts 140a can be easily handled.

[0130] Before attaching a new piping detachment part 140 to the piping 32 , the piping detachment part 140 may be cleaned in a cleaning unit 160 .

[0131] Next, a method for cleaning the detachable piping parts 140 attached to the substrate processing apparatus 100 of the present embodiment will be described with reference to Fig. 10. Fig. 10(a) to Fig. 10(c) are schematic views for explaining a method for cleaning the detachable piping parts 140 attached to the substrate processing apparatus 100 of the present embodiment.

[0132] 10(a), before attaching the piping detachment part 140 to the piping 32, the piping detachment part 140 is attached to the cleaning unit 160. In detail, a first pipe 164a and a second pipe 164b of the cleaning unit 160 are connected to the piping detachment part 140. Here, one end of the first pipe 164a is connected to the chemical liquid supply unit 162a, and the other end of the first pipe 164a is connected to one end of the piping detachment part 140. Also, one end of the second pipe 164b is connected to the other end of the piping detachment part 140. The other end of the second pipe 164b is connected to a drainage pipe.

[0133] 10(b), by opening valve 166a and driving pump 166b, the chemical liquid flows from chemical liquid supply unit 162a through first pipe 164a, piping detachable part 140, and second pipe 164b to the drain pipe. This cleans piping detachable part 140 with the chemical liquid. Thereafter, valve 166a is closed to stop driving pump 166b, thereby stopping the flow of the chemical liquid.

[0134] As shown in Fig. 10(c), the connection destination of one end of the first pipe 164a is changed from the chemical liquid supply unit 162a to the cleaning liquid supply unit 162b. Thereafter, the valve 166a is opened and the pump 166b is driven, so that the cleaning liquid flows from the cleaning liquid supply unit 162b through the first pipe 164a, the piping detachable part 140, and the second pipe 164b to the drain pipe. As a result, the piping detachable part 140 is washed with the cleaning liquid. Thereafter, the valve 166a is closed and the driving of the pump 166b is stopped to stop the flow of the cleaning liquid.

[0135] According to this embodiment, the cleaning unit 160 can clean the piping detachable parts 140 before they are attached to the piping 32. Therefore, the flushing time after the piping detachable parts 140 are attached to the piping 32 can be shortened.

[0136] It is preferable that the direction in which the chemical solution and / or the processing solution flows through the piping detachable part 140 when the piping detachable part 140 is attached to the cleaning unit 160 is the same as the direction in which the processing solution from the preparation tank 112 flows through the piping detachable part 140 when the piping detachable part 140 is attached to the piping 32. This allows the piping detachable part 140 to be effectively cleaned.

[0137] 1 to 11 (mainly Fig. 10 and Fig. 11), a method for cleaning the detachable pipe parts 140 of this embodiment will be described. Fig. 11 is a flow diagram of the method for cleaning the detachable pipe parts 140 of this embodiment.

[0138] 11, in step Sba, the piping detachment part 140 before being attached to the piping 32 is mounted on the cleaning unit 160. In detail, the first pipe 164a and the second pipe 164b of the cleaning unit 160 are connected to the piping detachment part 140. Here, one end of the first pipe 164a is connected to the chemical liquid supply unit 162a, and the other end of the first pipe 164a is connected to one end of the piping detachment part 140. In addition, one end of the second pipe 164b is connected to the other end of the piping detachment part 140. The other end of the second pipe 164b is connected to a drainage pipe.

[0139] In step Sbc, the valve 166a is opened and the pump 166b is driven to supply the chemical liquid to the piping detachable part 140. This allows the chemical liquid to clean the piping detachable part 140. Thereafter, the valve 166a is closed to stop driving the pump 166b, thereby stopping the supply of the chemical liquid.

[0140] In step Sbr, the connection destination of one end of the first pipe 164a is changed from the chemical liquid supply unit 162a to the cleaning liquid supply unit 162b. Then, the valve 166a is opened and the pump 166b is driven to supply the cleaning liquid to the detachable piping part 140. This makes it possible to clean the detachable piping part 140 with the cleaning liquid. Then, the valve 166a is closed and the driving of the pump 166b is stopped to stop the supply of the cleaning liquid.

[0141] In this manner, the piping detachable parts 140 may be washed before being attached to the piping 32. This makes it possible to shorten the flushing time after the piping detachable parts 140 are attached to the piping 32.

[0142] As described above, the memory unit 104 may store recipe data for cleaning the piping detachable parts 140 before attachment to the piping 32. This allows the control unit 102 to clean the piping detachable parts 140 with a chemical solution and a cleaning solution after mounting the piping detachable parts 140 in the cleaning unit 160.

[0143] In the above description with reference to Figs. 3 to 11, the cleaning unit 160 supplies the chemical liquid and the cleaning liquid once each to the piping detachable part 140, but this embodiment is not limited to this. The cleaning unit 160 may supply the chemical liquid and the cleaning liquid multiple times each to the piping detachable part 140. In this case, it is preferable that the cleaning unit 160 alternately supplies the chemical liquid and the cleaning liquid to the piping detachable part 140. Furthermore, it is preferable to use different types of chemical liquids as the chemical liquids.

[0144] Next, the cleaning unit 160 in the substrate processing apparatus 100 of this embodiment will be described with reference to Fig. 12. Fig. 12 is a schematic diagram of the cleaning unit 160 in the substrate processing apparatus 100 of this embodiment. The cleaning unit 160 shown in Fig. 12 has a similar configuration to the cleaning unit 160 shown in Fig. 3 except that the chemical liquid supply unit 162a includes a first chemical liquid supply unit 162a1 and a second chemical liquid supply unit 162a2, and therefore, a duplicated description will be omitted to avoid redundancy.

[0145] 12, chemical liquid supply unit 162a includes a first chemical liquid supply unit 162a1 and a second chemical liquid supply unit 162a2. First chemical liquid supply unit 162a1 is used to remove metal components from piping detachable part 140. Second chemical liquid supply unit 162a2 is used to remove resin components from piping detachable part 140.

[0146] The chemical liquid supplied from the first chemical liquid supply unit 162a1 exhibits acidity. For example, the chemical liquid supplied from the first chemical liquid supply unit 162a1 is hydrochloric acid or hydrofluoric acid. In this specification, the chemical liquid supplied from the first chemical liquid supply unit 162a1 may be referred to as the first chemical liquid.

[0147] The chemical liquid supplied from the second chemical liquid supply unit 162a2 exhibits alkaline properties. Alternatively, the chemical liquid supplied from the second chemical liquid supply unit 162a2 is organic. For example, the chemical liquid supplied from the second chemical liquid supply unit 162a2 is ammonia, isopropyl alcohol (IPA), hydrogen peroxide solution, or ozone water. In this specification, the chemical liquid supplied from the second chemical liquid supply unit 162a2 may be referred to as the second chemical liquid.

[0148] Next, a method for cleaning detachable piping parts 140 of this embodiment will be described with reference to Figs. 1 to 13 (mainly Figs. 12 and 13). Fig. 13 is a flow diagram of a method for cleaning detachable piping parts 140 of this embodiment. The flow diagram shown in Fig. 13 is similar to the flow diagram shown in Fig. 9 except that a chemical liquid and a cleaning liquid are alternately supplied twice to detachable piping parts 140, and therefore, duplicated explanations will be omitted to avoid redundancy.

[0149] As shown in FIG. 13, in step Sa, the cleaning unit 160 is attached to the piping 32 to which the piping detachable part 140a is attached.

[0150] In step Sw, the cleaning liquid is supplied to the piping detachable part 140a. The cleaning unit 160 supplies the cleaning liquid from the cleaning liquid supply part 162b to the upstream connector 152 provided upstream of the piping detachable part 140a, and collects the cleaning liquid from the downstream connector 154.

[0151] In step Se, the pipe detachment part 140 attached to the pipe 32 is replaced. In detail, the pipe detachment part 140a attached to the pipe 32 is removed from the pipe 32, and a new pipe detachment part 140 is attached to the pipe 32.

[0152] In step Sc1, a chemical liquid is supplied to the piping detachable part 140. Here, an acidic first chemical liquid is supplied from the first chemical liquid supply unit 162a1 to the piping detachable part 140 via the additional piping 164. This makes it possible to remove metal components from the piping detachable part 140. For example, the first chemical liquid supply unit 162a1 supplies hydrochloric acid or hydrofluoric acid as the first chemical liquid. The cleaning unit 160 supplies the first chemical liquid to the upstream connection unit 152 provided upstream of the piping detachable part 140, and collects the first chemical liquid from the downstream connection unit 154.

[0153] In step Sr1, a cleaning liquid is supplied to the piping detachable part 140. For example, the cleaning unit 160 supplies the cleaning liquid to an upstream connection part 152 provided upstream of the piping detachable part 140, and collects the cleaning liquid from a downstream connection part 154.

[0154] In step Sc2, a chemical liquid is supplied to the piping detachable part 140. Here, an alkaline or organic second chemical liquid is supplied from the second chemical liquid supply unit 162a2 to the piping detachable part 140 via the additional piping 164. This makes it possible to remove the resin component of the piping detachable part 140. For example, the second chemical liquid supply unit 162a2 supplies ammonia, isopropyl alcohol (IPA), hydrogen peroxide solution, or ozone water as the alkaline or organic second chemical liquid. For example, the cleaning unit 160 supplies the second chemical liquid to the upstream side connection unit 152 provided upstream of the piping detachable part 140, and collects the second chemical liquid from the downstream side connection unit 154.

[0155] In step Sr2, a cleaning liquid is supplied to the piping detachable part 140. For example, the cleaning unit 160 supplies the cleaning liquid to an upstream connector 152 provided upstream of the piping detachable part 140, and collects the cleaning liquid from a downstream connector 154.

[0156] In this manner, cleaning of piping detachable part 140 is completed. According to this embodiment, cleaning unit 160 can supply two types of chemical liquids and cleaning liquid to piping detachable part 140 via upstream connection part 152 and downstream connection part 154, and recover the chemical liquids and cleaning liquid from piping detachable part 140. Therefore, even if particles of both metal components and resin components are generated from piping detachable part 140, piping detachable part 140 can be effectively cleaned.

[0157] Next, a piping configuration in the substrate processing apparatus 100 of this embodiment will be described with reference to Fig. 14. Fig. 14 is a schematic diagram for explaining the piping configuration in the substrate processing apparatus 100 of this embodiment.

[0158] 14, the processing liquid in the preparation tank 112 flows through a pipe 32a. The pipe 32a extends from the preparation tank 112 to a common pipe 32s. The cleaning liquid flows through a pipe 32b. The pipe 32b extends to a common pipe 32s. The common pipe 32s connects the pipes 32a, 32b, and 32. The pipe 32 extends from the common pipe 32s to the substrate processing unit 10.

[0159] Therefore, the processing liquid in the preparation tank 112 passes from the pipe 32a through the common pipe 32s, then passes through the pipe 32, and is supplied from the nozzle 34 to the substrate W. In addition, the cleaning liquid passes from the pipe 32b through the common pipe 32s, then passes through the pipe 32, and is supplied from the nozzle 34 to the substrate W.

[0160] The processing liquid cabinet 110 includes a housing 111, a preparation tank 112, a valve 113, a pump 114, a temperature adjustment device 115, an electric valve 116, a flowmeter 117, a filter 142a, an upstream connector 152a, and a downstream connector 154a. The valve 113, the pump 114, the temperature adjustment device 115, the upstream connector 152a, the filter 142a, and the downstream connector 154 are arranged in this order on the pipe 32a.

[0161] The valve 113 opens and closes a flow path in the pipe 32a. The valve 113 adjusts the opening of the pipe 32a to adjust the flow rate of the processing liquid supplied to the pipe 32a. Specifically, the valve 113 includes a valve body (not shown) having a valve seat therein, a valve element that opens and closes the valve seat, and an actuator (not shown) that moves the valve element between an open position and a closed position.

[0162] The pump 114 sends the processing liquid to the pipe 32a. The temperature regulator 115 heats the processing liquid flowing through the pipe 32a. The temperature regulator 115 can regulate the temperature of the processing liquid.

[0163] The filter 142a filters the treatment liquid flowing through the pipe 32a. The filter 142a is an example of a detachable pipe part 140.

[0164] In the pipe 32a, an upstream connector 152a is attached to the upstream side of the filter 142a, and a downstream connector 154a is attached to the downstream side of the filter 142a.

[0165] The pipe 32a extends from the preparation tank 112 of the processing liquid cabinet 110 to a common pipe 32s of the processing liquid box 120. The pipe 32a is connected to a pipe 32c between the processing liquid cabinet 110 and the processing liquid box 120. Although not shown here, the pipe 32a branches off to another tower TW or another substrate processing unit 10 between the processing liquid cabinet 110 and the processing liquid box 120. The pipe 32c extends to the preparation tank 112 in the processing liquid cabinet 110. The motor valve 116 and the flow meter 117 are attached to the pipe 32c. The pipe 32c serves as a circulation path for the processing liquid.

[0166] For example, when the processing liquid in the preparation tank 112 is heated to a constant temperature using the temperature regulator 115, it is preferable that the processing liquid flowing from the preparation tank 112 to the pipe 32a is circulated so as to return to the preparation tank 112 through the pipe 32c.

[0167] The processing liquid box 120 includes a common pipe 32s, a valve 36, a housing 121, a valve 122a, a valve 122b, an electric valve 123a, an electric valve 123b, a flowmeter 124a, a flowmeter 124b, a valve 129, an upstream connector 152b, an upstream connector 152c, and a downstream connector 154b. The valve 36, the valve 122a, the valve 122b, the electric valve 123a, the electric valve 123b, the flowmeter 124a, the flowmeter 124b, the valve 129, the upstream connector 152b, the upstream connector 152c, and the downstream connector 154b are accommodated in the housing 121. The valve 122a, the electric valve 123a, the flowmeter 124a, and the upstream connector 152b are attached to the pipe 32a.

[0168] The cleaning liquid flows through the pipe 32b. In the pipe 32b, an upstream connector 152r, a filter 142r, a downstream connector 154r, a flowmeter 124b, an electric valve 123b, an upstream connector 152c, and a valve 122b are arranged in this order. The filter 142r is an example of a piping detachable part 140.

[0169] The processing liquid and the cleaning liquid flow through the pipe 32. The pipe 32 is equipped with a valve 36 and a downstream connection part 154b.

[0170] The common pipe 32s is connected to a drain pipe via a valve 129. Therefore, by opening the valve 129, the processing liquid or cleaning liquid flowing through the common pipe 32s can be discarded.

[0171] Here, a cleaning unit 160 is attached to the filter 142r. The cleaning unit 160 further includes a filter 166c and a tank 168 in addition to a chemical liquid supply unit 162a, a cleaning liquid supply unit 162b, an additional pipe 164, a valve 166a, and a pump 166b.

[0172] In detail, a first pipe 164a of the cleaning unit 160 is connected to an upstream connector 152r located upstream of the filter 142r, and a second pipe 164b of the cleaning unit 160 is connected to a downstream connector 154r located downstream of the filter 142r. A filter 166c is attached to the first pipe 164a in addition to a valve 166a and a pump 166b.

[0173] Chemical liquid supply unit 162a includes a first chemical liquid supply unit 162a1, a second chemical liquid supply unit 162a2, and a third chemical liquid supply unit 162a3. The chemical liquids supplied from first chemical liquid supply unit 162a1 to third chemical liquid supply unit 162a3 are different from one another.

[0174] First chemical liquid supply unit 162a1 supplies the chemical liquid to tank 168. In detail, first chemical liquid supply unit 162a1 supplies the chemical liquid to tank 168 via common pipe 164m and third pipe 164c. Valve 167a1 is attached between first chemical liquid supply unit 162a1 and common pipe 164m. Valve 167c is attached to third pipe 164c.

[0175] Second chemical liquid supply unit 162a2 and third chemical liquid supply unit 162a3 have the same configuration as first chemical liquid supply unit 162a1.

[0176] The cleaning liquid supply unit 162b supplies the cleaning liquid to the tank 168. In detail, the cleaning liquid supply unit 162b supplies the cleaning liquid to the tank 168 via a common pipe 164m and a third pipe 164c. A valve 167b is attached between the cleaning liquid supply unit 162b and the common pipe 164m.

[0177] The tank 168 stores the chemical liquid or the cleaning liquid. One end of the first pipe 164a is located in the tank 168, and the other end of the first pipe 164a is located in the upstream connection part 152r. One end of the second pipe 164b is located in the downstream connection part 154r, and the other end of the second pipe 164b is located in the tank 168. Therefore, the filter 142r can be washed with the chemical liquid or the cleaning liquid stored in the tank 168. The tank 168 can circulate the chemical liquid and the cleaning liquid to the filter 142a. Therefore, the consumption of the chemical liquid and the cleaning liquid when cleaning the filter 142r can be reduced.

[0178] Tank 168 is connected to a drain pipe. Valve 169a is attached to the pipe between tank 168 and drain pipe. By closing valve 169a, the chemical liquid or cleaning liquid can be stored in tank 168. In addition, by opening valve 169a, the chemical liquid or cleaning liquid stored in tank 168 can be discarded.

[0179] A particle counter 170 may be attached to the additional pipe 164. Here, the particle counter 170 is attached to a sampling pipe branched off from the second pipe 164b. The particle counter 170 can measure the number of particles in the chemical liquid and / or cleaning liquid flowing through the additional pipe 164.

[0180] When the number of particles in the chemical liquid and the cleaning liquid can be measured, the control unit 102 may switch the liquid to be supplied to the detachable piping part 140 based on the measurement result of the particle counter 170. For example, the control unit 102 may switch between opening and closing the valves 167a1 to 167c based on the measurement result of the particle counter 170. Furthermore, the multiple recipes stored in the storage unit 104 may define the cleaning process content and processing procedure for the detachable piping part 140 using the measurement result of the particle counter 170 as a parameter.

[0181] 14, the cleaning unit 160 is attached to the filter 142r, but the cleaning unit 160 may be attached to the filter 142a. The cleaning unit 160 can clean the filter 142a by connecting to the upstream connector 152a and the downstream connector 154a.

[0182] Furthermore, the cleaning unit 160 may be attached to the valve 122a and the valve 36. The cleaning unit 160 can clean the valve 122a and the valve 36 by connecting to the upstream connecting part 152b and the downstream connecting part 154b. The valve 122a and the valve 36 are examples of the piping detachable part 140.

[0183] Similarly, the cleaning unit 160 may be attached to the valve 122b and the valve 36. The cleaning unit 160 can clean the valve 122b and the valve 36 by connecting to the upstream connection part 152c and the downstream connection part 154b. The valve 122b and the valve 36 are examples of the piping detachable part 140.

[0184] As described above, the storage unit 104 may store recipe data for cleaning the piping detachable parts 140. It is preferable that the storage unit 104 stores different recipes according to the piping detachable parts 140. For example, it is preferable that the storage unit 104 stores a recipe for cleaning the filter 142a and a recipe for cleaning the filter 142r as separate recipes. This allows the control unit 102 to effectively clean the piping detachable parts 140 according to the type of the piping detachable parts 140.

[0185] As described above, the pipe 32a is connected to the pipe 32c, and the processing liquid can circulate through the preparation tank 112, the pipe 32a, and the pipe 32c so as to maintain a predetermined temperature. In such a substrate processing apparatus 100, when the filter 142a is replaced with a new one, particles adhering to the filter 142a circulate through the preparation tank 112, the pipe 32a, and the pipe 32c together with the processing liquid, which may deteriorate the characteristics of the substrate W when the substrate W is processed. However, according to the present embodiment, the newly replaced filter 142a can be efficiently cleaned by the cleaning unit 160, so that defects caused by particles can be suppressed.

[0186] Furthermore, only the cleaning liquid flows through the pipe 32b when the substrate W is processed. Therefore, even if the filter 142r attached to the pipe 32b is flushed with only the cleaning liquid, particles cannot be sufficiently removed, and the flushing time may become long. In contrast, according to the present embodiment, the cleaning unit 160 can supply a chemical liquid to the filter 142r attached to the pipe 32b, so that the filter 142r can be suitably cleaned.

[0187] Furthermore, when flushing the filter 142r with the cleaning liquid flowing through the pipe 32b, the discarded cleaning liquid flows to the drain pipe through the common pipe 32s and the valve 129, so there is a risk of particles flowing into the common pipe 32s. In contrast, according to this embodiment, the cleaning unit 160 eliminates the need to flow the liquid used to flush the filter 142r attached to the pipe 32b into the common pipe 32s, so the common pipe 32s can be kept clean.

[0188] Furthermore, in the case where the piping configuration of the substrate processing apparatus 100 is complicated, if the particles adhering to the filter 142r are dispersed throughout the piping, it becomes difficult to sufficiently flush the piping into which the particles have been dispersed. In contrast, according to the present embodiment, the cleaning unit 160 selectively cleans the filter 142r attached to the piping 32b, so that the particles can be prevented from diffusing into the piping of the substrate processing apparatus 100.

[0189] 14, the cleaning unit 160 uses a circulated chemical or cleaning liquid. However, when the piping detachable part 140 is cleaned with the chemical or cleaning liquid, many particles may flow out from the piping detachable part 140. For this reason, the chemical or cleaning liquid may be disposable.

[0190] Next, a piping configuration in the substrate processing apparatus 100 of this embodiment will be described with reference to Fig. 15. Fig. 15(a) and Fig. 15(b) are schematic views for explaining the piping configuration of the cleaning unit 160 in the substrate processing apparatus 100 of this embodiment.

[0191] 15(a), the cleaning unit 160 does not have a tank 168, and the first pipe 164a is directly connected to a common pipe 164m. This allows the chemical liquid or cleaning liquid from the first chemical liquid supply unit 162a1 to the third chemical liquid supply unit 162a3 or the cleaning liquid supply unit 162b to be supplied to the filter 142r. In this case, even if a large number of particles flow out of the filter 142r, the chemical liquid or cleaning liquid is discarded, so that the filter 142r can be efficiently cleaned.

[0192] 15(b), even if the cleaning unit 160 has the tank 168, the second pipe 164b may be branched into a pipe connected to a drain pipe midway, and a valve 169b may be attached to this pipe. This allows the chemical solution or cleaning solution flowing through the second pipe 164b to be selectively discarded.

[0193] For example, when starting to clean the detachable piping parts 140 with a chemical or cleaning liquid, immediately after cleaning starts, many particles may flow out from the detachable piping parts 140. In this case, the chemical or cleaning liquid used immediately after cleaning starts is selectively discarded, and the chemical or cleaning liquid used after a predetermined period of time has passed is circulated and used again, thereby making it possible to clean the detachable piping parts 140 efficiently.

[0194] 3 to 15, the cleaning unit 160 cleans the piping detachable part 140 with the chemical liquid and cleaning liquid supplied from the chemical liquid supply unit 162a and the cleaning liquid supply unit 162b, respectively, but this embodiment is not limited to this. The cleaning unit 160 may clean the piping detachable part 140 with the chemical liquid and cleaning liquid that can be supplied to the substrate processing unit 10.

[0195] Next, a piping configuration in the substrate processing apparatus 100 of this embodiment will be described with reference to Figures 16 and 17. Figure 16 is a schematic diagram for explaining the piping configuration in the substrate processing apparatus of this embodiment.

[0196] As shown in FIG. 16, the processing liquid in the preparation tank 112 flows through pipe 32a. Here, the processing liquid is a chemical liquid. In this specification, pipe 32a may be referred to as a chemical liquid pipe. Pipe 32a extends from the preparation tank 112 to a common pipe 32s. The cleaning liquid flows through pipe 32b. Pipe 32b extends to a common pipe 32s. Common pipe 32s connects pipe 32a, pipe 32b, and pipe 32. Pipe 32 extends from common pipe 32s to the substrate processing unit 10.

[0197] The processing liquid cabinet 110 includes a housing 111, a preparation tank 112, a valve 113, a pump 114, an electric valve 116, a flowmeter 117, a filter 142a, an upstream connector 152a, and a downstream connector 154a. The preparation tank 112 prepares the processing liquid.

[0198] The pipe 32a connects the preparation tank 112 and the common pipe 32s. In the pipe 32a, a valve 113, a pump 114, an upstream connector 152a, a filter 142a, and a downstream connector 154a are arranged in this order.

[0199] The pipe 32a extends from the preparation tank 112 of the processing liquid cabinet 110 to a common pipe 32s of the processing liquid box 120. The pipe 32a is also connected to a pipe 32c between the processing liquid cabinet 110 and the processing liquid box 120. The pipe 32c extends to the preparation tank 112 in the processing liquid cabinet 110. An electric valve 116 and a flow meter 117 are attached to the pipe 32c. The pipe 32c serves as a circulation path for the processing liquid.

[0200] The processing liquid box 120 includes a common pipe 32s, a valve 36, a housing 121, and valves 122a and 122r. The valve 36, the valve 122a, and the valve 122r are housed in the housing 121. The valve 122a is attached to the pipe 32a.

[0201] The cleaning liquid flows through the pipe 32b. In the pipe 32b, an upstream connector 152r, a filter 142r, a downstream connector 154r, and a valve 122r are arranged in this order.

[0202] The substrate processing apparatus 100 of this embodiment includes an upstream connection part 152a, a downstream connection part 154a, an upstream connection part 152r, and a downstream connection part 154r. At least one of the upstream connection part 152a and the downstream connection part 154a attached to the pipe 32a is preferably connected to the pipe 32b. At least one of the upstream connection part 152r and the downstream connection part 154r attached to the pipe 32b is preferably connected to the pipe 32a.

[0203] Fig. 17(a) is a schematic diagram for explaining a piping configuration in the substrate processing apparatus 100 of this embodiment. As shown in Fig. 17(a), an upstream connector 152r attached to a piping 32b communicates with a piping 32a.

[0204] The substrate processing apparatus 100 includes a cleaning unit 160. Here, the cleaning unit 160 has an additional pipe 164. The additional pipe 164 includes a first pipe 164p that connects the upstream connector 152a and the upstream connector 152r, and a second pipe 164q that connects the downstream connector 154r and the preparation tank 112.

[0205] The first pipe 164p allows the treatment liquid flowing through the pipe 32a to be supplied as a chemical to the upstream connection part 152r. Also, the second pipe 164q allows the treatment liquid flowing through the filter 142r of the pipe 32b to be returned to the preparation tank 112.

[0206] In this way, the cleaning unit 160 supplies the treatment liquid as a chemical solution to the upstream connection part 152r provided upstream of the filter 142r via the first piping 164p, so that the treatment liquid passes through the filter 142r, and the cleaning unit 160 can collect the treatment liquid from the downstream connection part 154r via the second piping 164q.

[0207] Fig. 17(b) is a schematic diagram for explaining a piping configuration in the substrate processing apparatus 100 of this embodiment. As shown in Fig. 17(b), the substrate processing apparatus 100 includes a cleaning unit 160. Here, the cleaning unit 160 has an additional pipe 164. The additional pipe 164 has a first pipe 164f that connects the upstream connection part 152r and the upstream connection part 152a, and a second pipe 164g that connects the downstream connection part 154a and a drain pipe. Here, the upstream connection part 152a attached to the pipe 32a communicates with the pipe 32b.

[0208] The substrate processing apparatus 100 includes a cleaning unit 160. The cleaning unit 160 includes a first pipe 164f that connects the upstream connector 152r and the upstream connector 152a, and a second pipe 164g that connects the downstream connector 154a and a drain pipe.

[0209] The first pipe 164f allows the cleaning liquid flowing through the pipe 32b to be supplied to the upstream connector 152a, and the second pipe 164g allows the treatment liquid flowing through the filter 142a of the pipe 32a to be discharged to a drain pipe.

[0210] In this way, the cleaning unit 160 supplies cleaning liquid to the upstream connection part 152a provided upstream of the filter 142a via the first piping 164f, so that the cleaning liquid passes through the filter 142a, and the cleaning unit 160 can collect the cleaning liquid from the downstream connection part 154a via the second piping 164g.

[0211] 17(a), the chemical liquid is supplied to the filter 142r by using the upstream connector 152a located upstream of the filter 142a, and the cleaning liquid is supplied to the filter 142a by using the upstream connector 152r located upstream of the filter 142r in the substrate processing apparatus 100 shown in FIG. 17(b), but this embodiment is not limited thereto. The detachable piping part 140 may be cleaned by using a connector other than the upstream connector 152 and the downstream connector 154.

[0212] Next, a piping configuration in the substrate processing apparatus 100 of this embodiment will be described with reference to Fig. 18. Fig. 18 is a schematic diagram for explaining the piping configuration in the substrate processing apparatus 100 of this embodiment. The substrate processing apparatus 100 shown in Fig. 18 has a similar configuration to the substrate processing apparatus 100 shown in Fig. 16, except that a temperature adjustment device 115 and a connection part 156 are further attached to the piping 32a, and a first piping 164p is connected to the connection part 156. Therefore, a duplicated description will be omitted to avoid redundancy.

[0213] 18, in the substrate processing apparatus 100, in addition to the valve 113, the pump 114, the filter 142a, the upstream connection part 152a, and the downstream connection part 154a, a temperature adjustment device 115 and a connection part 156 are further attached to the pipe 32a. The connection part 156 is disposed between the pump 114 and the temperature adjustment device 115. The connection part 156 has a similar configuration to the upstream connection part 152a or the downstream connection part 154a.

[0214] Here, the washing unit 160 has a first pipe 164p that connects the connection part 156 and the upstream connection part 152r, and a second pipe 164q that connects the downstream connection part 154r and the preparation tank 112.

[0215] The first pipe 164p allows the treatment liquid flowing through the pipe 32a to be supplied to the upstream connection part 152r as a chemical liquid. Also, the second pipe 164q allows the treatment liquid flowing through the filter 142r of the pipe 32b to flow to the preparation tank 112.

[0216] In this way, the cleaning unit 160 supplies the treatment liquid as a chemical solution to the upstream connection part 152r provided upstream of the filter 142r via the first piping 164p, so that the treatment liquid passes through the filter 142r, and the cleaning unit 160 can collect the treatment liquid from the downstream connection part 154r via the second piping 164q.

[0217] Next, a piping configuration in the substrate processing apparatus 100 of this embodiment will be described with reference to Fig. 19. Fig. 19 is a schematic diagram for explaining the piping configuration in the substrate processing apparatus 100 of this embodiment. The substrate processing apparatus 100 shown in Fig. 19 has a similar configuration to the substrate processing apparatus 100 shown in Fig. 14, except that it further includes a connection portion 156 and the cleaning unit 160 is omitted, and therefore, duplicated descriptions will be omitted to avoid redundancy.

[0218] 19, the processing liquid in the preparation tank 112 flows through a pipe 32a. The pipe 32a extends from the preparation tank 112 to a common pipe 32s. The cleaning liquid flows through a pipe 32b. The pipe 32b extends to a common pipe 32s. The common pipe 32s connects the pipes 32a, 32b, and 32. The pipe 32 extends from the common pipe 32s to the substrate processing unit 10.

[0219] Therefore, the processing liquid in the preparation tank 112 passes from the pipe 32a through the common pipe 32s, then passes through the pipe 32, and is supplied from the nozzle 34 to the substrate W. In addition, the cleaning liquid passes from the pipe 32b through the common pipe 32s, then passes through the pipe 32, and is supplied from the nozzle 34 to the substrate W.

[0220] In the pipe 32a, a valve 113, a pump 114, a connection part 156, a temperature adjustment device 115, an upstream connection part 152a, a filter 142a, and a downstream connection part 154 are arranged in this order.

[0221] The cleaning liquid flows through the pipe 32b. In the pipe 32b, an upstream connector 152r, a filter 142r, a downstream connector 154r, a flowmeter 124b, an electric valve 123b, an upstream connector 152c, and a valve 122r are arranged in this order.

[0222] When the treatment liquid is supplied as a chemical liquid to the piping detachable part 140 via the cleaning unit 160 and the piping detachable part 140 is cleaned with the treatment liquid, it is preferable to circulate the treatment liquid to the preparation tank 112. However, when the cleaning of the piping detachable part 140 with the treatment liquid starts, the amount of particles in the treatment liquid may increase. In this case, it is preferable that the treatment liquid can be circulated to the preparation tank 112 and can be partially discarded.

[0223] Next, a piping configuration in the substrate processing apparatus 100 of this embodiment will be described with reference to Fig. 20. Fig. 20(a) and Fig. 20(b) are schematic views for explaining the piping configuration in the substrate processing apparatus of this embodiment.

[0224] 20(a), the substrate processing apparatus 100 includes a cleaning unit 160. Here, the cleaning unit 160 includes a first pipe 164p that connects the connection part 156 and the upstream connection part 152r, and a second pipe 164q that connects the downstream connection part 154r and the preparation tank 112.

[0225] The first pipe 164p allows the treatment liquid flowing through the pipe 32a to be supplied to the upstream connection part 152r as a chemical liquid. Also, the second pipe 164q allows the treatment liquid flowing through the filter 142r of the pipe 32b to flow to the preparation tank 112.

[0226] In this way, the cleaning unit 160 supplies the treatment liquid as a chemical solution to the upstream connection part 152r provided upstream of the filter 142r via the first piping 164p, so that the treatment liquid passes through the filter 142r, and the cleaning unit 160 can collect the treatment liquid from the downstream connection part 154r via the second piping 164q.

[0227] Further, here, a valve 166d is attached to the second pipe 164q, and a valve 166e is attached to a pipe branched from the second pipe 164q and connected to a drain pipe. Therefore, the processing liquid returning to the preparation tank 112 through the second pipe 164q can be selectively discarded by the valve 166e.

[0228] As shown in FIG. 20(b), the cleaning unit 160 has a first pipe 164p that connects the connection part 156 and the upstream connection part 152r, and a second pipe 164q that connects the downstream connection part 154r and the preparation tank 112. In FIG. 20(b), unlike FIG. 20(a), the connection part 156 is located between the temperature control device 115 and the upstream connection part 152a. Therefore, the first pipe 164p can heat the treatment liquid flowing through the pipe 32a to a relatively high temperature and supply it to the upstream connection part 152r. In addition, the second pipe 164q can cause the treatment liquid flowing through the filter 142r part of the pipe 32b to flow into the preparation tank 112.

[0229] Next, a piping configuration in the substrate processing apparatus 100 of this embodiment will be described with reference to Fig. 21. Fig. 21 is a schematic diagram for explaining the piping configuration in the substrate processing apparatus 100 of this embodiment.

[0230] 21, the additional pipe 164 of the cleaning unit 160 has a branched structure in the substrate processing apparatus 100. In detail, the additional pipe 164 has a pipe 164s, a pipe 164t, a pipe 164u, a pipe 164v, a pipe 164w, and a pipe 164x.

[0231] The pipe 164s is connected to the connection portion 156. One end of the pipe 164s is connected to the connection portion 156, and the other end of the pipe 164s is connected to one ends of the pipes 164t and 164u. Therefore, the pipe 164s branches into the pipes 164t and 164u at a branch point 162y.

[0232] The other end of the pipe 164t is connected to the upstream connector 152a, and the other end of the pipe 164u is connected to the upstream connector 152r.

[0233] One end of the pipe 164v is connected to the downstream connection portion 154a.

[0234] One end of the pipe 164w is connected to the downstream connector 154r. The other end of the pipe 164w is connected to the other end of the pipe 164v and one end of the pipe 164x. The other end of the pipe 164x is connected to the preparation tank 112.

[0235] Therefore, the processing liquid flowing from the preparation tank 112 passes through the pipe 32a, the valve 113, the pump 114, and the temperature control device 115, and then leaves the pipe 32a at the connection part 156 and flows through the pipe 164s. When the processing liquid flowing through the pipe 164s advances to the pipe 164t at the branch point 162y, it flows through the upstream connection part 152a, the filter 142a, the downstream connection part 154a, and the pipe 164v in this order, and returns to the preparation tank 112 through the pipe 164x. When the processing liquid flowing through the pipe 164s advances to the pipe 164u at the branch point 162y, it flows through the upstream connection part 152r, the filter 142r, the downstream connection part 154r, and the pipe 164w in this order, and returns to the preparation tank 112 through the pipe 164x.

[0236] As described above, since the additional pipe 164 has a branched structure, the filters 142a and 142r can be washed simultaneously.

[0237] Further, here, a valve 166e is attached to a pipe that branches off from the pipe 164x and connects to a drain pipe, so that the processing liquid returning to the preparation tank 112 through the pipe 164x can be selectively discarded by the valve 166e.

[0238] The embodiments of the present invention have been described above with reference to the drawings. However, the present invention is not limited to the above embodiments, and can be implemented in various aspects without departing from the gist of the present invention. In addition, various inventions can be formed by appropriately combining multiple components disclosed in the above embodiments. For example, some components may be deleted from all components shown in the embodiments. Furthermore, components across different embodiments may be appropriately combined. The drawings are mainly shown schematically for ease of understanding, and the thickness, length, number, spacing, etc. of each component shown in the drawings may differ from the actual ones due to the convenience of drawing. In addition, the material, shape, dimensions, etc. of each component shown in the above embodiments are examples and are not particularly limited, and various changes are possible within a range that does not substantially deviate from the effects of the present invention. [Industrial Applicability]

[0239] The present invention can be suitably used in a substrate processing apparatus and a cleaning method for detachable piping parts. [Explanation of symbols]

[0240] 10 Substrate Processing Unit 12 Chambers 20 Board holding part 30 Processing liquid supply unit 100 Substrate processing apparatus 110 Processing liquid cabinet 120 Processing liquid box W substrate

Claims

1. a substrate processing unit for processing a substrate; A pipe for circulating a processing liquid to the substrate processing unit; A piping detachable part that is detachable from the piping; An upstream connection portion provided in the piping upstream of the piping detachable part; A downstream connection portion provided in the piping downstream of the piping detachable part; a cleaning unit connectable to the upstream connection portion and the downstream connection portion; Equipped with The cleaning unit comprises: supplying a chemical solution to the detachable piping part from one of the upstream connection part and the downstream connection part, and recovering the chemical solution from the other of the upstream connection part and the downstream connection part; A substrate processing apparatus that supplies a cleaning liquid to the detachable piping part from one of the upstream connection part and the downstream connection part, and collects the cleaning liquid from the other of the upstream connection part and the downstream connection part.

2. The substrate processing apparatus according to claim 1 , wherein the detachable piping parts include at least one of a filter and a valve.

3. The substrate processing apparatus according to claim 1 , wherein the upstream connection portion and the downstream connection portion include a three-way valve or a toggle valve.

4. The cleaning unit comprises: The chemical liquid is supplied to the detachable piping part from the upstream connection part, and the chemical liquid is collected from the downstream connection part; The substrate processing apparatus according to claim 1 , wherein the cleaning liquid is supplied to the detachable piping part from the upstream connection part and the cleaning liquid is collected from the downstream connection part.

5. The cleaning unit comprises: A first chemical liquid is supplied to the detachable piping part from one of the upstream connection part and the downstream connection part, and the first chemical liquid is collected from the other of the upstream connection part and the downstream connection part; 5. The substrate processing apparatus of claim 1, wherein a second chemical liquid is supplied to the detachable piping part from one of the upstream connection portion and the downstream connection portion, and the second chemical liquid is recovered from the other of the upstream connection portion and the downstream connection portion.

6. The substrate processing apparatus according to claim 1 , wherein the cleaning unit includes an additional pipe connected to the upstream connection portion and the downstream connection portion.

7. The cleaning unit comprises: A chemical supply unit that supplies the chemical to the additional pipe; a cleaning liquid supply unit for supplying the cleaning liquid to the additional pipe; A pump provided in the additional piping; The substrate processing apparatus of claim 6 , further comprising:

8. The substrate processing apparatus according to claim 7 , wherein the cleaning unit further includes a tank capable of storing the chemical liquid and the cleaning liquid.

9. The substrate processing apparatus according to claim 1 , wherein the cleaning unit is detachable from the upstream connection part and the downstream connection part.

10. The substrate processing apparatus according to claim 6 , wherein the processing liquid flows through the additional pipe.

11. The piping includes: A chemical liquid pipe through which the chemical liquid flows; A cleaning solution pipe through which the cleaning solution flows. Including, the upstream connection portion is provided upstream of the cleaning liquid pipe, the downstream connection portion is provided downstream of the cleaning liquid pipe, The substrate processing apparatus according to claim 10 , wherein the additional piping includes a piping that connects the chemical liquid piping to one of the upstream side connection part and the downstream side connection part.

12. The substrate processing apparatus according to claim 1 , further comprising a storage unit configured to store a recipe for controlling cleaning of the detachable piping parts with the cleaning liquid and the chemical liquid in the cleaning unit.

13. The substrate processing apparatus according to claim 12 , wherein the storage unit stores different recipes depending on the detachable pipe parts.

14. replacing a piping detachable part that is detachable from a piping connected to a storage tank that stores the processing liquid and through which the processing liquid flows; After replacing the piping detachable part, supplying a chemical solution to the piping detachable part from one of an upstream connection part provided between the storage tank and the piping detachable part and an upstream connection part provided downstream of the piping detachable part, and recovering the chemical solution from the other of the upstream connection part and the downstream connection part; supplying a cleaning liquid to the detachable piping part from one of the upstream connection part and the downstream connection part after replacing the detachable piping part, and recovering the cleaning liquid from the other of the upstream connection part and the downstream connection part; The cleaning method for detachable piping parts includes the steps of:

15. A step of replacing a piping detachable part that is detachable from a piping through which a processing liquid flows; After replacing the detachable piping parts, supplying a chemical solution to the detachable piping parts from one of an upstream connection part provided upstream of the detachable piping parts and a downstream connection part provided downstream of the detachable piping parts, and recovering the chemical solution from the other of the upstream connection part and the downstream connection part; after replacing the detachable piping part, supplying a cleaning liquid to the detachable piping part from one of the upstream connection part and the downstream connection part, and recovering the cleaning liquid from the other of the upstream connection part and the downstream connection part, The cleaning method for detachable piping parts further includes the step of supplying a cleaning liquid from one of the upstream connection part and the downstream connection part and recovering the cleaning liquid from the other of the upstream connection part and the downstream connection part before replacing the detachable piping part.

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