High Bay Light Fixture Thermal Management

By using multiple aluminum radiator and air convection channels in Gaowan lamps, the problem of low heat dissipation efficiency of Gaowan lamps is solved, and efficient heat dissipation and cost control are achieved.

JP7629095B2Active Publication Date: 2025-02-12SIGNIFY HOLDING BV
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Patent Information

Application Number
JP2023526309
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Priority Date
2020-11-10
Filing Date
2021-10-29
Publication Date
2025-02-12
Estimated Expiration
2041-10-29

AI Technical Summary

Technical Problem

Existing high bay lamps are costly and inefficient in cooling, and lack effective heat dissipation solutions.

Method used

A lamp design with multiple heat dissipation structures, including an electronics housing and a plurality of heat sinks mounted thereon, each heat sink having a bottom wall and a side wall extending upward from the bottom wall, efficient heat dissipation using aluminum material and air convection channels, and covering the channels through an aluminum cover to promote air flow.

Benefits of technology

It achieves efficient heat dissipation, reduces manufacturing costs, and improves the service life and reliability of lamps.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

The high bay light fixture includes an electronics housing, a plurality of heat sink structures attached to the electronics housing, and a light source attached to the plurality of heat sink structures. Each heat sink structure includes a bottom wall and a side wall extending upwardly from the bottom wall. Each light source is attached to the bottom wall of a respective one of the plurality of heat sink structures on a surface of the bottom wall facing away from the electronics housing. Each heat sink structure is spaced apart from other heat sink structures of the plurality of heat sink structures adjacent to it.
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Description

[Technical field]

[0001] FIELD OF THE DISCLOSURE The present disclosure relates generally to light fixtures, and more particularly to light fixtures having thermal management structures. [Background technology]

[0002] A conventional high bay light fixture includes an electronics housing that encases a light source and associated structure, as well as one or more components that control the light source. Dissipation of heat generated by the light source is important for the proper operation and lifespan of the high bay light fixture. In some cases, minimizing the cost of achieving efficient dissipation of heat is critical to the overall cost of the high bay light fixture. Thus, a cost-effective solution that facilitates efficient dissipation of heat generated by the light source of the high bay light fixture is desired.

[0003] GB 2 574 138 A relates to a luminaire including an electrical housing assembly and a light module assembly. The light module assembly is connected to the electrical housing assembly such that an air gap is defined between the light module assembly and the electrical housing assembly. The electrical housing assembly has a variable length such that the length of the electrical housing is proportional to the number of light module assemblies connected to the electrical housing assembly. The light module assembly and the electrical housing assembly are connected by at least one module mounting arm.

[0004] US 2013 / 301275 A1 relates to a light emitting diode bulb including a socket base configured for insertion into a light fixture, a plurality of separate heat sinks attached to the socket base, a light emitting diode element mounted on the plurality of separate heat sinks, and an optical element covering one of the light emitting diode elements.

[0005] US 2018 / 149349 A1 relates to an apparatus for deployment of an LED system with high heat dissipation power relative to the system weight by including an open area. The open area improves airflow while reducing the weight of the optics. Related optics are described for efficiently and evenly distributing light from the LEDs by tailoring the optical distribution. Furthermore, circuits and methods are described for enabling the LED system to operate with existing power sources such as ballasts or offline AC voltage sources or both.

[0006] US 2020 / 200378 A1 relates to a high bay lighting fixture including an electronics housing and a light module including a light source that emits light. The high bay lighting fixture further includes a tubular connector. The electronics housing is attached to the tubular connector at a first end of the tubular connector, and the light module is attached to the tubular connector at a second end of the tubular connector and spaced apart from the electronics housing by the tubular connector. The tubular connector provides a wireway for routing electrical wires between the electronics housing and the light module. Summary of the Invention [Problem to be solved by the invention]

[0007] A cost-effective solution that facilitates efficient dissipation of heat generated by the light sources in a high bay light fixture is desired. [Means for solving the problem]

[0008] The present disclosure relates generally to light fixtures, and more particularly to light fixtures having auxiliary device mounting structures. In an exemplary embodiment, the high bay light fixture includes an electronics housing, a plurality of heat sink structures mounted to the electronics housing, and a light source mounted to the plurality of heat sink structures. Each heat sink structure includes a bottom wall and a side wall extending upwardly from the bottom wall. Each light source is mounted to the bottom wall of a respective one of the plurality of heat sink structures on a surface of the bottom wall facing away from the electronics housing. Each heat sink structure is spaced apart from other heat sink structures of the plurality of heat sink structures adjacent to it.

[0009] These and other aspects, objects, features and embodiments will become apparent from the following description and the appended claims. [Brief description of the drawings]

[0010] [Figure 1] FIG. 1A illustrates a bottom perspective view of a high bay light fixture according to an exemplary embodiment, and FIG. 1B illustrates a bottom perspective view of the high bay light fixture of FIG. 1A with the lens removed according to an exemplary embodiment. [Diagram 2] 2A-2C show different views of a heat sink structure corresponding to the heat sink structure of the light fixture of FIG. 1A according to an example embodiment. [Diagram 3] FIG. 3 illustrates a side perspective view of the high bay light fixture of FIG. 1A according to an exemplary embodiment. [Figure 4] FIG. 4 illustrates a perspective view of the high bay light fixture of FIG. 1A according to an exemplary embodiment. [Diagram 5] FIG. 5 illustrates a side perspective view of the high bay light fixture of FIG. 1A showing the driver of the light fixture according to an exemplary embodiment. [Figure 6]FIG. 6 illustrates an assembly of a heat sink structure for the high bay light fixture of FIG. 1A according to an exemplary embodiment. [Figure 7] FIG. 7 illustrates an assembly of a retaining structure and a heat sink structure of the high bay light fixture of FIG. 1A according to an exemplary embodiment. [Figure 8] FIG. 8 illustrates a bottom perspective view of a container unit of the electronics housing of the high bay light fixture of FIG. 1A according to an exemplary embodiment. [Figure 9] FIG. 9A shows a top perspective view of a holding structure of the light fixture of FIG. 1A according to another exemplary embodiment, and FIG. 9B shows a bottom perspective view of the holding structure of the light fixture of FIG. 1A according to another exemplary embodiment. [Figure 10] 10A and 10B show different views of a high bay light fixture according to another example embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] The drawings depict only exemplary embodiments and therefore should not be considered limiting of the scope. The elements and features shown in the drawings are not necessarily to scale, emphasis instead being placed on clearly illustrating the principles of the exemplary embodiments. Moreover, certain dimensions or configurations may be exaggerated to help visually convey such principles. In the drawings, like reference numerals used in different figures indicate similar or corresponding, but not necessarily identical, elements.

[0012] In the following paragraphs, certain embodiments are described in more detail, by way of example, with reference to the figures. In the description, well-known components, methods, and / or processing techniques are omitted or briefly described. Furthermore, references to various features of the embodiments do not imply that all embodiments must include the referenced features.

[0013] FIG. 1A illustrates a bottom perspective view of a high bay light fixture 100 according to an exemplary embodiment, and FIG. 1B illustrates a bottom perspective view of the high bay light fixture 100 of FIG. 1A with a lens removed according to an exemplary embodiment. In some exemplary embodiments, the light fixture 100 includes heat sink structures 102, 104, 106, 108. The heat sink structures 102, 104, 106, 108 may be arranged in a configuration such that an assembly of the heat sink structures 102, 104, 106, 108 has a circular perimeter, as shown in FIGS. 1A and 1B. The light fixture 100 may further include an electronics housing 110 that includes components such as a driver. The light fixture 100 may also include light sources 132, 134, 136, and 138 that are attached to the heat sinks 102, 104, 106, and 108, respectively. For example, each of the light sources 132, 134, 136, 138 may include a light emitting diode (LED) disposed on a circuit board. By way of example, the light source 136 may include an LED, such as LED 130, that is mounted on a circuit board in a desired configuration, as can be readily understood by one of ordinary skill in the art given the benefit of the scope of this disclosure.

[0014] In some exemplary embodiments, each light source 132, 134, 136, 138 may be attached to a respective heat sink structure 102, 104, 106, 108 using thermal tape, as would be readily understood by one of ordinary skill in the art with the benefit of the scope of this disclosure. Heat generated by the light sources 132, 134, 136, 138 is transferred to the heat sink structure 102, 104, 106, 108 for dissipation away from the light sources 132, 134, 136, 138. Illustratively, heat generated by the light source 132 is transferred to the heat sink structure 102, heat generated by the light source 134 is transferred to the heat sink structure 104, heat generated by the light source 136 is transferred to the heat sink structure 106, and heat generated by the light source 138 is transferred to the heat sink structure 108.

[0015] In some exemplary embodiments, the light fixture 100 includes lenses 112, 114, 116, 118 that are attached to the heat sink structures 102, 104, 106, 108, respectively. Illustratively, lens 112 is attached to the heat sink structure 102 and covers the light source 132, lens 114 is attached to the heat sink structure 104 and covers the light source 134, lens 116 is attached to the heat sink structure 106 and covers the light source 136, and lens 118 is attached to the heat sink structure 108 and covers the light source 138. For example, the lenses 112, 114, 116, 118 may extend through respective holes in the heat sink structure 104 and be attached to the heat sink structures 102, 104, 106, 108 using fasteners, such as fastener 148 used to attach the lens 114 to the heat sink structure 104. Because the light sources 132, 134, 136, 138 are positioned between the lenses 112, 114, 116, 118 and the heat sink structures 102, 104, 106, 108, attachment of the lenses 112, 114, 116, 118 to the heat sink structures 102, 104, 106, 108 using the fasteners 148 may also hold the light sources 132, 134, 136, 138 attached to the heat sink structures 102, 104, 106, 108.

[0016] In some exemplary embodiments, each heat sink structure 102, 104, 106, 108 is spaced from one another by respective convection channels on two sides of the heat sink structure 102, 104, 106, 108. For example, the heat sink structure 102 is spaced from the heat sink structure 104 by the convection channel 140 and from the heat sink structure 108 by the convection channel 146. The heat sink structure 104 is spaced from the heat sink structure 102 by the convection channel 140 and from the heat sink structure 106 by the convection channel 142. The heat sink structure 106 is spaced from the heat sink structure 104 by the convection channel 142 and from the heat sink structure 108 by the convection channel 144. The heat sink structure 108 is spaced from the heat sink structure 106 by the convection channel 144 and from the heat sink structure 102 by the convection channel 146.

[0017] In some exemplary embodiments, the light fixture 100 includes a cap 120 and gap cover pieces 122, 124, 126, 128. The cap 120 may be a space cover in the center of the assembly of the heat sink structures 102, 104, 106, 108. The gap cover pieces 122, 124, 126, 128 may cover the convection channels 140, 142, 144, 146 at the periphery of the heat sink structures 102, 104, 106, 108. The convection channels 140, 142, 144, 146 allow for an upward flow of air between adjacent ones of the heat sink structures 102, 104, 106, 108. For example, an upward flow of air through the convection channels 140 , 142 , 144 , 146 can carry heat generated by the light sources 132 , 134 , 136 , 138 away from the heat sink structures 102 , 104 , 106 , 108 .

[0018] In some exemplary embodiments, the heat sink structures 102, 104, 106, 108 are made from aluminum sheet metal using methods such as stamping, as can be readily understood by one of ordinary skill in the art with the benefit of the scope of this disclosure. In some exemplary embodiments, the gap cover pieces 122, 124, 126, 128 may be made from plastic and may, for example, be snapped onto the heat sink structures 102, 104, 106, 108. In some exemplary embodiments, the electronics housing 110 may be made from aluminum using methods such as die casting.

[0019] The use of aluminum sheet metal to make the heat sink structures 102, 104, 106, 108 may result in efficient transfer and dissipation of heat generated by the light sources 132, 134, 136, 138. Additionally, in some cases, the use of aluminum sheet metal may result in reduced costs to make the light fixture 100 as compared to heat sink structures that may be manufactured using die casting. For example, the sheet metal may have a thickness that is less than the typical minimum thickness of a die cast heat sink structure, which may result in reduced material costs.

[0020] In some alternative embodiments, the light fixture 100 may include more or less heat sink structures than shown in FIGS. 1A and 1B without departing from the scope of the present disclosure. In some alternative embodiments, the convection channels may be wider or narrower than shown without departing from the scope of the present disclosure. In some alternative embodiments, the lenses and light sources of the light fixture 100 may have different configurations and / or shapes than shown without departing from the scope of the present disclosure. In some alternative embodiments, the heat sink structures may have different shapes than shown without departing from the scope of the present disclosure. For example, the heat sink structures may form a non-circular shape without departing from the scope of the present disclosure.

[0021] 2A-2C show different views of a heat sink structure 200 corresponding to the heat sink structures 102, 104, 106, 108 of the light fixture 100 of FIG. 1A according to an exemplary embodiment. The following references to the heat sink structure 200 and elements of the heat sink structure 200 are applicable to the heat sink structures 102, 104, 106, 108. With reference to FIGS. 1A-2C, in some exemplary embodiments, the heat sink structure 200 includes a bottom wall 202 and side walls 204, 206, 208, 210 extending upwardly from the bottom wall 202. For example, the side walls 204, 206, 208, 210 may extend upwardly at the periphery of the bottom wall 202. The bottom wall 202 may be wider at the side wall 208 than at the side wall 210 such that the side walls 204 and 206 are closer together at the side wall 210 than at the side wall 208.

[0022] In some exemplary embodiments, the side walls 204, 206 may extend upward at a 90 degree angle relative to the bottom wall 202. Alternatively, the side walls 204, 206 may be slanted relative to the bottom wall 202. For example, each side wall 204, 206 may be slanted outwardly (i.e., away from each other) at an angle in the range of about 91-95 degrees (e.g., 91 degrees, 92 degrees, etc.) relative to the bottom wall 202. In some exemplary embodiments, the side walls 208, 210 may also extend vertically upward from the bottom wall 202 or may be slanted.

[0023] In some exemplary embodiments, the sidewall 210 may be longer than the other sidewalls 204, 206, 208. For example, the heat sink structure 200 may include a flange 212 extending outwardly from the sidewall 210. The flange 212 may include an attachment hole 216 through which a fastener (e.g., a screw) may extend to attach the flange 212 to the electronics housing 110 of the light fixture 100. Attachment of the flange 212 to the electronics housing 110 effectively attaches the heat sink structure 200 to the electronics housing 110. Attachment of the flange 212 to the electronics housing 110 also results in the bottom wall 202 of the heat sink structure 200 being spaced apart from the electronics housing 110 by at least the height H of the sidewall 210. For example, the flange 212 may extend outwardly from the sidewall 210 in a horizontal or diagonal upward direction.

[0024] In some exemplary embodiments, the side wall 210 includes a routing hole 218 and the flange 212 includes a routing slot 214. An electrical cable may be routed between the electronics housing 110 and the light source through the routing slot 214 and the routing hole 218. For example, the light source may be attached to a surface 242 of the bottom wall 202 of the heat sink structure 200. To illustrate, the heat sink structure 200 may correspond to the heat sink structure 102 shown in FIGS. 1A and 1B , and the light source 132 may be attached to a surface of the bottom wall of the heat sink structure 102.

[0025] In some exemplary embodiments, the heat sink structure 200 has holes formed in the bottom wall 202. For example, the hole 220 in the bottom wall 202 may be used to extend an electrical cable routed through the wiring hole 218 to a light source. Holes in the bottom wall 202 proximate the side walls 204, 206, such as holes 238, 240, may be used to attach a lens, such as the lens 112, to the bottom wall 202 of the heat sink structure 200 using a fastener 222 (e.g., a screw). For example, the fastener 222 may correspond to the fastener 148 shown in FIG. 1A. The heat sink structure 200 may also include holes 228, 230, 232, 234, 236 that may be used in securely attaching a retaining structure (e.g., the retaining structure 402 shown in FIG. 4) to the bottom wall 202 of the heat sink structure 200. Fastener 224 extending up through hole 236 may be one of multiple fasteners or structures that may be used to securely attach the retention structure to heat sink structure 200. Mounting structures of the retention structure may also be inserted into holes 228, 230, 232, 234. Fastener 222 may also be inserted into corresponding holes in the retention structure to securely attach the retention structure to heat sink structure 200. Alternatively or additionally, respective threaded nuts may be attached to each fastener 222.

[0026] In some exemplary embodiments, sidewall 208 may be curved to extend between sidewall 204 and sidewall 206. Sidewall 208 may be curved such that sidewall 208 is a segment of a circular perimeter formed by the assembly of multiple heat sink structures of heat sink structure 200. By way of example, the sidewall of each heat sink structure 102, 104, 106, 108 of light fixture 100 corresponding to sidewall 208 of heat sink structure 200 may be a segment of a circular perimeter formed by the assembly of heat sink structures 102, 104, 106, 108 as shown in FIG. 1A.

[0027] In some exemplary embodiments, sidewall 208 and sidewall 204 may be spaced apart by a gap at one end of sidewall 208, and sidewall 208 and sidewall 206 may be spaced apart by another gap at another end of sidewall 208. Also, sidewall 204 may be spaced apart from sidewall 210 by a gap 244 at an end opposite sidewall 208, and sidewall 206 may be spaced apart from sidewall 210 by a gap 246 at an end opposite sidewall 208. Gaps 244, 246 may allow a retention structure, such as retention structure 402 shown in FIG. 4, to be placed on bottom wall 202 and around wide wall 210, similar to that shown in FIGS. 4 and 7 for heat sink structures 102, 104, 106, 108.

[0028] In some alternative embodiments, the heat sink structure 200 may have a different shape than shown without departing from the scope of the present disclosure. For example, each of the walls of the heat sink structure 200 may have a different shape than shown. In some alternative embodiments, one or more of the holes in the bottom wall 202, the holes in the side wall 210, and / or the holes in the flange 212 may be in a different location than shown without departing from the scope of the present disclosure. In some alternative embodiments, one or more of the holes in the bottom wall 202, the holes in the side wall 210, and / or the holes in the flange 212 may be omitted without departing from the scope of the present disclosure. In some alternative embodiments, the flange 212 may be omitted and the side wall 210 may be attached to the electronics housing 110 using other means, as can be readily understood by those of ordinary skill in the art with the benefit of the scope of the present disclosure.

[0029] 3 illustrates a side perspective view of the high bay light fixture 100 of FIG. 1A according to an exemplary embodiment. With reference to FIGS. 1A-3, in some exemplary embodiments, the heat sink structure 102 includes a sidewall 302 corresponding to the sidewall 210 of the heat sink structure 200 shown in FIG. 2, the heat sink structure 104 includes a sidewall 304 corresponding to the sidewall 210 of the heat sink structure 200 shown in FIG. 2, the heat sink structure 106 includes a sidewall 306 corresponding to the sidewall 210 of the heat sink structure 200 shown in FIG. 2, and the heat sink structure 108 includes a sidewall 308 corresponding to the sidewall 210 of the heat sink structure 200 shown in FIG. 2.

[0030] In some exemplary embodiments, a flange on each sidewall of the heat sink structures 102, 104, 106, 108 that corresponds to the flange 212 of the heat sink structure 200 may be attached to the electronics housing 110 using a fastener, such as fastener 312 shown in Figure 3. A bottom wall of each heat sink structure 102, 104, 106, 108 that corresponds to the bottom wall 202 of the heat sink structure 200 may be spaced apart from the electronics housing 110 by the height of the corresponding sidewall 302, 304, 306, 308. Because the sidewalls 302, 304, 306, 308 of the heat sink structures 102, 104, 106, 108 are longer than the other sidewalls of the heat sink structures 102, 104, 106, 108, the impact of heat dissipated from the surfaces of the other sidewalls of the heat sink structures 102, 104, 106, 108 on the components within the electronics housing 110 is reduced.

[0031] FIG. 4 illustrates a top perspective view of the high bay light fixture 100 of FIG. 1A according to an exemplary embodiment. With reference to FIGS. 1A-4, in some exemplary embodiments, the heat sink structure 102 includes a retention structure 402 positioned on a bottom wall of each heat sink structure 102, 104, 106, 108 corresponding to the bottom wall 202 of the heat sink structure 200 of FIG. 2. The retention structure 402 is also positioned around the side walls 302, 304, 306, 308 of the heat sink structures 102, 104, 106, 108. For example, the retention structure 402 may serve to reduce movement of the individual heat sink structures 102, 104, 106, 108 to minimize changes in the relative positions of the heat sink structures 102, 104, 106, 108 with respect to one another. The retention structure 402 may be made from aluminum and / or another suitable material using methods such as die casting, as can be readily understood by one of ordinary skill in the art having the benefit of the scope of this disclosure.

[0032] In some exemplary embodiments, the retaining structure 402 may include holes for routing electrical cables between the electronics housing 110 and the light sources of the respective heat sink structures 102, 104, 106, 108. For example, the electrical cables 404 may be routed through a hole in the retaining structure 402 between the electronics housing 110 and the light sources 132 attached to a bottom wall of the heat sink structure 102 corresponding to the bottom wall of the heat sink structure 200 of FIG. 2. As shown in FIG. 1B, the light sources 132 are attached to a surface of the bottom wall of the heat sink structure 102 facing away from the electronics housing 110. As another example, the electrical cables 406 may be routed through another hole in the retaining structure 402 between the electronics housing 110 and the light sources 134 attached to a bottom wall of the heat sink structure 104. As shown in FIG. 1B, the light sources 134 are attached to a surface of the bottom wall of the heat sink structure 104 facing away from the electronics housing 110. As another example, electrical cable 408 may be routed through another hole in retention structure 402 between electronics housing 110 and light source 138 attached to the bottom wall of heat sink structure 108. As shown in FIG. 1B , light source 138 is attached to a surface of the bottom wall of heat sink structure 108 that faces away from electronics housing 110. Another electrical cable may similarly be routed through another hole in retention structure 402 between electronics housing 110 and light source 136 attached to the bottom wall of heat sink structure 106.

[0033] In some exemplary embodiments, the light fixture 100 may be suspended from a ceiling structure, for example. For example, one or more cables (not shown) that may be used to suspend the light fixture 100 from a ceiling structure may be attached to an attachment structure 410 of the electronics housing 110. One or more electrical wires may also be routed into a cavity of the electronics housing 110 through a passage in the attachment structure, as can be readily understood by one of ordinary skill in the art with the benefit of the scope of this disclosure.

[0034] In some alternative embodiments, electrical cables may be routed between the electronics housing 110 and the light sources of the heat sink structures 102, 104, 106, 108 in a manner different from that shown without departing from the scope of the present disclosure. In some alternative embodiments, the retention structure 402 may be omitted or replaced with one or more other structures without departing from the scope of the present disclosure. In some exemplary embodiments, the electronics housing 110 may have different shapes and / or components / features than shown without departing from the scope of the present disclosure.

[0035] FIG. 5 illustrates a side perspective view of the high bay light fixture of FIG. 1A, showing a driver 502 of the light fixture according to an exemplary embodiment. With reference to FIGS. 1A-5, in some exemplary embodiments, the driver 502 of the light fixture 100 is positioned in a cavity 504 of the electronics housing 110. The driver 502 provides power to the light sources 132, 134, 136, 138 that are attached to the heat sink structures 102, 104, 106, 108. For example, the driver 502 may provide power to the light source 132 via the electrical cable 404. As another example, the driver 502 may provide power to the light source 134 via the electrical cable 406.

[0036] In some alternative embodiments, the gap cover pieces 122, 124, 126, 128 shown in Figure 1A may be omitted as shown in Figure 5. In some alternative embodiments, other electronics components may be positioned in cavity 504 of electronics housing 110. In some alternative embodiments, driver 502 may have a different shape or be in a different location than shown without departing from the scope of the present disclosure.

[0037] FIG. 6 illustrates an assembly of heat sink structures 102, 104, 106, 108 of the high bay light fixture of FIG. 1A according to an exemplary embodiment. As mentioned above, each heat sink structure 102, 104, 106, 108 may correspond to the heat sink structure 200 shown in FIG. 2. Referring to FIGS. 1A-6, in some exemplary embodiments, the heat sink structure 102 includes a bottom wall 602 and side walls 604, 606, 608, 302 extending upwardly from the bottom wall 602. The heat sink structure 104 may include a bottom wall 610 and side walls 612, 614, 616, 304 extending upwardly from the bottom wall 610. The heat sink structure 106 may include a bottom wall 618 and side walls 620, 622, 624, 306 extending upwardly from the bottom wall 618. The heat sink structure 108 may include a bottom wall 628 and side walls 630 , 632 , 634 , 308 extending upwardly from the bottom wall 628 .

[0038] In some exemplary embodiments, the sidewall 606 is adjacent to the sidewall 612 and is separated from the sidewall 612 by a convection channel 140 that provides a path for air to flow upward between the sidewall 606 and the sidewall 612. For example, the sidewall 606 may be at 90 degrees to the bottom wall 602 and the sidewall 612 may be at 90 degrees to the bottom wall 610. Alternatively, the sidewall 606 and the sidewall 612 may be angled toward each other, which may result in a Bernoulli effect and thus enhance heat dissipation from the heat sink structures 102, 104. For example, the sidewall 606 and the sidewall 612 may extend upward at an angle in the range of 91 degrees to 95 degrees or more relative to the bottom walls 602 and 610, respectively. The convection channel 140 may extend the entire length of the sidewalls 606, 612.

[0039] In some exemplary embodiments, the sidewall 614 is adjacent to the sidewall 620 and is separated from the sidewall 620 by a convection channel 142 that provides a path for air to flow upward between the sidewall 614 and the sidewall 620. For example, the sidewall 614 may be at a 90 degree angle to the bottom wall 610 and the sidewall 620 may be at a 90 degree angle to the bottom wall 618. Alternatively, the sidewall 614 and the sidewall 620 may be angled toward each other, which may result in a Bernoulli effect and thus promote heat dissipation from the heat sink structures 104, 106. For example, the sidewall 614 and the sidewall 620 may extend upward at an angle in the range of 91 degrees to 95 degrees or more relative to the bottom walls 610 and 618, respectively. The convection channel 142 may extend the entire length of the sidewalls 618, 620.

[0040] In some exemplary embodiments, the sidewall 622 is adjacent to the sidewall 632 and is spaced from the sidewall 632 by a convection channel 144 that provides a path for air to flow upward between the sidewall 622 and the sidewall 632. For example, the sidewall 622 may be at a 90 degree angle to the bottom wall 618 and the sidewall 632 may be at a 90 degree angle to the bottom wall 628. Alternatively, the sidewall 622 and the sidewall 632 may be angled toward each other, which may result in a Bernoulli effect and thus promote heat dissipation from the heat sink structures 106, 108. For example, the sidewall 622 and the sidewall 632 may extend upward at an angle in the range of 91 degrees to 95 degrees or more to the bottom wall 618 and the bottom wall 628, respectively. The convection channel 144 may extend the entire length of the sidewalls 622, 632.

[0041] In some exemplary embodiments, the sidewall 630 is adjacent to the sidewall 604 and is separated from the sidewall 604 by a convection channel 146 that provides a path for air to flow upward between the sidewall 630 and the sidewall 604. For example, the sidewall 630 may be at a 90 degree angle relative to the bottom wall 628 and the sidewall 604 may be at a 90 degree angle relative to the bottom wall 602. Alternatively, the sidewall 630 and the sidewall 604 may be angled toward one another, which may result in a Bernoulli effect and thus promote heat dissipation from the heat sink structures 108, 102. For example, the sidewall 630 and the sidewall 604 may extend upward at an angle in the range of 91 degrees to 95 degrees or more relative to the bottom wall 628 and the bottom wall 602, respectively. The convection channel 146 may extend the entire length of the sidewalls 630, 604.

[0042] In some exemplary embodiments, sidewalls 608, 616, 624, 634, which correspond to sidewall 208 of heat sink structure 200, may be curved such that sidewalls 608, 616, 624, 634 are segments of a circular perimeter formed by the assembly of multiple heat sink structures of heat sink structure 200. In general, heat sink structures 102, 104, 106, 108 may be arranged in a circular configuration, as shown in FIG.

[0043] FIG. 7 illustrates an assembly of a retaining structure and a heat sink structure of the high bay light fixture of FIG. 1A according to an exemplary embodiment. With reference to FIGS. 1A-7, in some exemplary embodiments, the retaining structure 402 is positioned on a bottom wall of the heat sink structure 102, 104, 106, 108. To illustrate, a section 706 of the retaining structure 402 may be positioned on a portion of the bottom wall 610 of the heat sink structure 104, as shown in FIG. 7. For example, the section 706 may include protruding structures 702 and 704 proximate the side walls 612 and 614, respectively, of the heat sink structure 104. For example, the protruding structures 702, 704 may each provide structural support for the respective side walls 612, 614. Also, section 706 of retention structure 402 may include holes 708 that can be used to route electrical cables 406 (shown in FIGS. 4 and 5 ) from section 706 to light sources 134 mounted to bottom wall 610 on the opposite side of bottom wall 610. Other sections of retention structure 402 may similarly be positioned on the bottom walls of the other heat sink structures 102, 106, 108. Other protruding structures of retention structure 402 similar to protruding structures 702, 704 may be positioned on the bottom walls of the respective heat sink structures of the other heat sink structures 102, 106, 108 and may similarly provide structural support for the side walls of the heat sink structures 102, 106, 108.

[0044] In some exemplary embodiments, the sidewalls 302, 304, 306, 308 of the heat sink structures 102, 104, 106, 108 may extend through the openings 710 in the retention structure 402 such that the retention structure 402 is positioned about the sidewalls 302, 304, 306, 308. The retention structure 402 may act to reduce movement of the individual heat sink structures 102, 104, 106, 108.

[0045] In some exemplary embodiments, a flange extending from each sidewall 302, 304, 306, 308 may correspond to flange 212 of heat sink structure 200. For example, flange 714 extending from sidewall 304 may correspond to flange 212 of heat sink structure 200 and may be attached to electronics housing 110 using one or more fasteners (e.g., fastener 312 shown in FIG. 3). Attachment of flange 714 to electronics housing 110 (e.g., a bottom wall of electronics housing 110) effectively attaches heat sink structure 104 to electronics housing 110. The flanges of the other sidewalls 302, 306, 308 may similarly be attached to electronics housing 110 using fasteners (e.g., fastener 312 shown in FIG. 3) that extend through holes in the flanges. The heat sink structures 102 , 106 , 108 may be effectively attached to the electronics housing 110 by attaching a flange of each heat sink structure 102 , 106 , 108 to the electronics housing 110 .

[0046] In some alternative embodiments, the retaining structure 402 may be omitted without departing from the scope of the present disclosure. In some alternative embodiments, the retaining structure 402 may have a different shape than shown without departing from the scope of the present disclosure. In some alternative embodiments, one or more of the protruding structures of the retaining structure 402 may be omitted without departing from the scope of the present disclosure. In some alternative embodiments, the flanges of the heat sink structures 102, 104, 106, 108 may have a different shape than shown without departing from the scope of the present disclosure.

[0047] FIG. 8 illustrates a bottom perspective view of a container unit 810 of the electronics housing 110 of the high bay light fixture 100 of FIG. 1A according to an exemplary embodiment. With reference to FIGS. 1A-8, in some exemplary embodiments, the electronics housing 110 includes a container unit 800. The container unit 800 may include a base 810 having holes 802, 804 for attaching flanges of the heat sink structures 102, 104, 106, 108 corresponding to the flanges 212 of the heat sink structure 200 to the container unit 800. A fastener, such as the fastener 312 shown in FIG. 3, may extend through holes in the flanges of the heat sink structures 102, 104, 106, 108 corresponding to the holes 216 in the flanges 212 of the heat sink structure 200 to attach the flanges to the container unit 800 of the electronics housing 110. 7 may be aligned with holes 802, 804 in the container base 800 such that fasteners (e.g., screws) can extend through the holes to attach the flange 714 to the container unit 800 of the electronics housing 110. The flanges of the other heat sink structures 102, 106, 108 may be similarly attached to the container unit 800 using fasteners that extend through the aligned holes in the flanges and the container unit 800.

[0048] In some exemplary embodiments, the base 810 of the container unit 800 includes holes, such as hole 806, for routing electrical cables between the driver 502 in the cavity 504 of the electronics housing 110 and the light sources attached to the heat sink structures 102, 104, 106, 108. For example, the electrical cable 406 (shown in FIG. 4) that extends between the driver 502 and the light source 134 (shown in FIG. 1B) may be routed through the hole 806 (shown in FIG. 8). Other electrical cables used to provide power to the light sources of the other heat sink structures 102, 106, 108 may be routed through similar holes in the base 810 of the container unit 800.

[0049] In some alternative embodiments, the container unit 800 may have more or fewer holes than shown without departing from the scope of the present disclosure. In some alternative embodiments, the holes in the base 810 of the container unit 800 may be in different locations than shown without departing from the scope of the present disclosure. In some alternative embodiments, the container unit 800 may have a different shape than shown without departing from the scope of the present disclosure.

[0050] 9A shows a top perspective view of the retaining structure 402 of the light fixture 100 of FIG. 1A according to another exemplary embodiment, and FIG. 9B shows a bottom perspective view of the retaining structure 402 of the light fixture 100 of FIG. 1A according to another exemplary embodiment. With reference to FIGS. 1A-9B, in some exemplary embodiments, the retaining structure 402 includes a plurality of protruding structures, such as protruding structures 702, 704. As described above with respect to the protruding structures 702, 704, the protruding structures may be positioned near and provide structural support to the sidewalls of the heat sink structures 102, 104, 106, 108. As an example, the protruding structure 902 may be positioned on the bottom wall 602 of the heat sink structure 102 and may provide structural support to the sidewall 606 of the heat sink structure 102.

[0051] In some exemplary embodiments, the retention structure 402 has an opening 710 through which the sidewalls 302, 304, 306, 308 corresponding to the sidewall 210 of the heat sink structure 200 may extend, as shown in Figure 7. The retention structure 402 may also include holes 708 and holes 906, 908, 910 that are used to route electrical cables to the light sources of the heat sink structures 102, 104, 106, 108 as described with respect to the holes 708. The holes 708, 906, 908, 910 may be located in respective sections of the retention structure 402 that are positioned on the bottom walls of the heat sink structures 102, 104, 106, 108.

[0052] In some exemplary embodiments, the retaining structure 402 includes mounting structures that protrude on a side of the retaining structure 402 that faces the bottom wall of the heat sink structure 102, 104, 106, 108. For example, the retaining structure 402 may include mounting structures 914, 916, 918, 920 that protrude on a side of the retaining structure 402 that faces the bottom wall 610 of the heat sink structure 104. The mounting structures may be inserted into corresponding holes in the bottom walls of the heat sink structures 102, 104, 106, 108. Illustrating with respect to the heat sink structure 200 shown in FIG. 2, which represents the heat sink structures 102, 104, 106, 108, the mounting structures 914 and 916 may be inserted into holes 228 and 230, respectively, and the mounting structures 918 and 920 may be inserted into holes 232 and 234, respectively.

[0053] In some exemplary embodiments, the retention structure 402 may include holes that are used to securely attach the heat sink structures 102, 104, 106, 108 to the retention structure 402 using fasteners. Illustrating with respect to the heat sink structure 200 shown in FIG. 2, the retention structure 402 may include holes 922, and the fasteners 224 extending through holes 236 in the bottom wall 202 of the heat sink structure 200 may be inserted into the holes 922 to securely attach the heat sink structure 200 to the retention structure 402. As shown in FIG. 9B, the retention structure 402 may include multiple holes located in different sections of the retention structure 402.

[0054] In some exemplary embodiments, fasteners used to attach the lens to the heat sink structure 200 may also be inserted into holes in the protruding structures of the retaining structure 402 to more securely attach the heat sink structure 200 to the retaining structure 402. For example, the fasteners 222 shown in FIG. 2 may be inserted into holes, such as holes 904, in the protruding structures 702 of the retaining structure 402.

[0055] In some alternative embodiments, the retaining structure 402 may have a different shape than shown without departing from the scope of the present disclosure. In some alternative embodiments, one or more holes in the retaining structure 402 may be omitted without departing from the scope of the present disclosure. In some alternative embodiments, some holes in the retaining structure 402 may be in different locations than shown without departing from the scope of the present disclosure. In some alternative embodiments, the opening 710 may have a different shape than shown without departing from the scope of the present disclosure.

[0056] 10A and 10B show different views of a high bay light fixture 1000 according to another exemplary embodiment. In some exemplary embodiments, the light fixture 1000 is similar to the light fixture 100 of FIG. 1A. In contrast to the light fixture 100, the light fixture 1000 includes six heat sink structures instead of four heat sink structures. By way of example, the light fixture 1000 may include heat sink structures 1002, 1004, 1006, 1008, 1010, 1012, each having a bottom wall and a side wall corresponding to the bottom wall and the side wall of the heat sink structure 200 of FIG. 2. In general, the heat sink structures 1002, 1004, 1006, 1008, 1010, 1012 are similar to the heat sink structures 102, 104, 106, 108, with the main differences being dimensionally related. For example, the heat sink structures 1002, 1004, 1006, 1008, 1010, 1012 may be sized such that the heat sink structures 1002, 1004, 1006, 1008, 1010, 1012 can be arranged in a circular configuration in a similar manner as described with respect to the heat sink structures 102, 104, 106, 108 of the light fixture 100.

[0057] The light sources are attached to the heat sink structures 1002, 1004, 1006, 1008, 1010, 1012 in a manner similar to that described with respect to the light fixture 100. Lenses, such as lens 1022, are also attached to their respective heat sink structures 1002, 1004, 1006, 1008, 1010, 1012 in a manner similar to that described with respect to the light fixture 100.

[0058] Additionally, the heat sink structures 1002, 1004, 1006, 1008, 1010, 1012 are arranged such that convection channels, such as convection channel 1020, exist between adjacent heat sink structures of the heat sink structures 1002, 1004, 1006, 1008, 1010, 1012, in a manner similar to that described with respect to the light fixture 100. Gap cover pieces, such as gap cover piece 1018, may cover the convection channels between adjacent heat sink structures, in a manner similar to that described with respect to the light fixture 100.

[0059] In some exemplary embodiments, the light fixture 1000 includes an electronics housing 1014 that may include a driver (e.g., an LED driver) similar to the driver 502 shown in Figure 5. Sidewalls of the heat sink structures 1002, 1004, 1006, 1008, 1010, 1012 that correspond to the sidewall 210 of the heat sink structure 200 of Figure 2 may be attached to the electronics housing 1014 in a manner similar to that described with respect to the heat sink structures 102, 104, 106, 108. The drivers may provide power to light sources attached to the heat sink structures 1002, 1004, 1006, 1008, 1010, 1012 in a manner similar to that described with respect to the light fixture 100. The light fixture 1000 may also include a retaining structure 1016 that is attached to the heat sink structures 1002 , 1004 , 1006 , 1008 , 1010 , 1012 in a manner similar to that described with respect to the retaining structure 402 of the light fixture 100 .

[0060] In some example embodiments, the heat sink structures 1002, 1004, 1006, 1008, 1010, 1012 may be made from sheet metal (e.g., aluminum sheet metal) using methods such as stamping, as would be readily understood by one of ordinary skill in the art with the benefit of the scope of this disclosure. The retention structure 1016 and electronics housing 1014 may be made from a metal such as aluminum using methods such as die casting, as would be readily understood by one of ordinary skill in the art with the benefit of the scope of this disclosure.

[0061] In some alternative embodiments, the light fixture 1000 may include more or less heat sink structures than shown without departing from the scope of the present disclosure. In some alternative embodiments, the heat sink structures of the light fixture 1000 may be arranged in a different configuration than shown without departing from the scope of the present disclosure. In some alternative embodiments, the light fixture 1000 may include components other than those shown without departing from the scope of the present disclosure. In some alternative embodiments, one or more components of the light fixture 1000 (e.g., the retaining structure 1016) may be omitted without departing from the scope of the present disclosure.

[0062] Although certain embodiments have been described in detail herein, the description is for illustrative purposes. The features of the embodiments described herein are representative, and alternative embodiments may add or omit certain features, elements, and / or steps. Moreover, modifications to aspects of the embodiments described herein may be made by those skilled in the art without departing from the scope of the following claims, which should be accorded the broadest interpretation so as to encompass such modifications and equivalent structures.

Claims

1. An electronic device housing; a plurality of heat sink structures attached to the electronic device housing; a light source attached to the plurality of heat sink structures; A high bay light fixture comprising: each heat sink structure includes a bottom wall and a side wall extending upwardly from the bottom wall, each light source being attached to the bottom wall of a respective heat sink structure of the plurality of heat sink structures on a surface of the bottom wall that faces away from the electronic device housing; each heat sink structure is spaced from adjacent ones of the plurality of heat sink structures, and the bottom wall of each heat sink structure is spaced from the electronic device housing by a height of at least one of the side walls of each heat sink structure; (a) one of the side walls of each heat sink structure includes a hole for routing an electrical cable between the electronics housing and a light source attached to the heat sink structure; or (b) the plurality of heat sink structures are fabricated from aluminum sheet metal; The light fixture includes a retention structure positioned on the bottom wall of each heat sink structure, the one of the side walls of each heat sink structure extending through an opening in the retention structure.

2. An electronic device housing; a plurality of heat sink structures attached to the electronic device housing; a light source attached to the plurality of heat sink structures; A high bay light fixture comprising: each heat sink structure includes a bottom wall and a side wall extending upwardly from the bottom wall, each light source being attached to the bottom wall of a respective heat sink structure of the plurality of heat sink structures on a surface of the bottom wall that faces away from the electronic device housing; each heat sink structure is spaced from adjacent ones of the plurality of heat sink structures, and the bottom wall of each heat sink structure is spaced from the electronic device housing by a height of at least one of the side walls of each heat sink structure; (a) one of the side walls of each heat sink structure includes a hole for routing an electrical cable between the electronics housing and a light source attached to the heat sink structure; or (b) the plurality of heat sink structures are fabricated from aluminum sheet metal; a first sidewall of a first heat sink structure of the plurality of heat sink structures is spaced from a sidewall of a second heat sink structure of the plurality of heat sink structures adjacent to the first heat sink structure, and a second sidewall of the first heat sink structure of the plurality of heat sink structures is spaced from a sidewall of a third heat sink structure of the plurality of heat sink structures adjacent to the first heat sink structure.

3. An electronic device housing; a plurality of heat sink structures attached to the electronic device housing; a light source attached to the plurality of heat sink structures; A high bay light fixture comprising: each heat sink structure includes a bottom wall and a side wall extending upwardly from the bottom wall, each light source being attached to the bottom wall of a respective heat sink structure of the plurality of heat sink structures on a surface of the bottom wall that faces away from the electronic device housing; each heat sink structure is spaced from adjacent ones of the plurality of heat sink structures, and the bottom wall of each heat sink structure is spaced from the electronic device housing by a height of at least one of the side walls of each heat sink structure; (a) one of the side walls of each heat sink structure includes a hole for routing an electrical cable between the electronics housing and a light source attached to the heat sink structure; or (b) the plurality of heat sink structures are fabricated from aluminum sheet metal; a second one of the sidewalls of each heat sink structure of the plurality of heat sink structures is curved such that the second one of the sidewalls is a segment of a circular shape.

4. An electronic device housing; a plurality of heat sink structures attached to the electronic device housing; a light source attached to the plurality of heat sink structures; A high bay light fixture comprising: each heat sink structure includes a bottom wall and a side wall extending upwardly from the bottom wall, each light source being attached to the bottom wall of a respective heat sink structure of the plurality of heat sink structures on a surface of the bottom wall that faces away from the electronic device housing; each heat sink structure is spaced from adjacent ones of the plurality of heat sink structures, and the bottom wall of each heat sink structure is spaced from the electronic device housing by a height of at least one of the side walls of each heat sink structure; (a) one of the side walls of each heat sink structure includes a hole for routing an electrical cable between the electronics housing and a light source attached to the heat sink structure; or (b) the plurality of heat sink structures are fabricated from aluminum sheet metal; A flange extends outwardly from one of the side walls of each heat sink structure, away from the bottom wall, the flange being attached to the electronic device housing.

5. An electronic device housing; a plurality of heat sink structures attached to the electronic device housing; a light source attached to the plurality of heat sink structures; A high bay light fixture comprising: each heat sink structure includes a bottom wall and a side wall extending upwardly from the bottom wall, each light source being attached to the bottom wall of a respective heat sink structure of the plurality of heat sink structures on a surface of the bottom wall that faces away from the electronic device housing; each heat sink structure is spaced from adjacent ones of the plurality of heat sink structures, and the bottom wall of each heat sink structure is spaced from the electronic device housing by a height of at least one of the side walls of each heat sink structure; (a) one of the side walls of each heat sink structure includes a hole for routing an electrical cable between the electronics housing and a light source attached to the heat sink structure; or (b) the plurality of heat sink structures are fabricated from aluminum sheet metal; A light fixture, wherein each heat sink structure of the plurality of heat sink structures is adjacent to two heat sink structures of the plurality of heat sink structures.

6. 3. The light fixture of claim 2, wherein the first sidewall of the first heat sink structure of the plurality of heat sink structures is sloped toward the sidewall of the second heat sink structure of the plurality of heat sink structures and the sidewall of the second heat sink structure of the plurality of heat sink structures is sloped toward the first sidewall of the first heat sink structure of the plurality of heat sink structures.

7. 7. The light fixture of claim 6, wherein the second sidewall of the first heat sink structure of the plurality of heat sink structures is sloped toward the sidewall of the third heat sink structure of the plurality of heat sink structures.

8. 8. The light fixture of claim 1 , further comprising a lens, each lens attached to the bottom wall of a respective one of the plurality of heat sink structures and covering the light source attached to the bottom wall of the respective heat sink structure.

9. 9. The light fixture of claim 1, wherein the plurality of heat sink structures comprises at least four heat sink structures.

10. 9. The light fixture of claim 1, wherein the plurality of heat sink structures comprises at least six heat sink structures.

11. 11. The light fixture of claim 1, further comprising a driver positioned within the electronics housing and configured to provide power to the light source.

Citation Information

Patent Citations

  • Lighting apparatus

    JP2014026803A

  • Radiator, heat radiation unit for radiator and lighting device with radiator

    JP2016018617A

  • Luminaire

    JP2017041342A

  • LED lighting device

    JP2018010868A

  • Lighting device

    JP2018195459A