Semiconductor Device

Abstract

To provide a semiconductor device in which reliability is improved.SOLUTION: A semiconductor device according to an embodiment of the present invention, includes: a circumference circuit region provided on a first substrate, and including a circuit element; a memory cell region containing a gate electrode provided on a second substrate arranged on a top part of the first substrate and laminated so as to be separated along a first direction each other, and a channel structure including a channel layer; and a penetration wiring region. The penetration wiring region contains: a penetration contact plug penetrating the memory cell region to electrically couple the memory cell region and the circuit element; an insulation region that surrounds the penetration contact plug, and includes a first insulation layer arranged side by side with the second substrate, and second and third insulation layers alternately laminated on the first insulation layer; and dummy channel structures that penetrate the second and third insulation layers, contain the channel layer, are arranged so as to form a row and column so that at least one of them is positioned between the adjacent penetration contact plugs.SELECTED DRAWING: Figure 5b

Description

[Technical field]

[0001] The present invention relates to a semiconductor device. [Background technology]

[0002] While the volume of semiconductor devices is gradually decreasing, they are required to process large amounts of data. Therefore, it is necessary to increase the integration density of the semiconductor elements that constitute such semiconductor devices. As a method for increasing the integration density of semiconductor devices, a semiconductor device having a vertical transistor structure instead of the conventional planar transistor structure has been proposed. Summary of the Invention [Problem to be solved by the invention]

[0003] One of the technical problems that the technical concept of the present invention aims to solve is to provide a semiconductor device with improved reliability. [Means for solving the problem]

[0004] According to an exemplary embodiment, a semiconductor device includes a peripheral circuit region provided on a first substrate and including circuit elements; a memory cell region provided on a second substrate disposed on an upper portion of the first substrate, including gate electrodes stacked at a distance from each other along a first direction perpendicular to an upper surface of the second substrate, and a channel structure penetrating the gate electrodes and extending vertically onto the second substrate, the channel structure including a channel layer; and a through wiring region electrically connecting the gate electrodes and the circuit elements, the through wiring region including a through contact plug extending in the first direction through the memory cell region and electrically connecting the memory cell region and the circuit elements, an insulating region including a first insulating layer surrounding the through contact plug and arranged in parallel with the second substrate, and second and third insulating layers alternately stacked on the first insulating layer, and dummy channel structures including the channel layer, penetrating the second and third insulating layers, and arranged in rows and columns such that at least one is located between adjacent through contact plugs.

[0005] According to an exemplary embodiment, a semiconductor device includes a peripheral circuit region provided on a first substrate and including circuit elements; a memory cell region provided on a second substrate disposed on top of the first substrate, including gate electrodes stacked at a distance from each other and a channel structure extending vertically onto the second substrate and including a channel layer, the gate electrodes penetrating the gate electrodes; and a through wiring region including through contact plugs extending vertically and electrically connecting the memory cell region and the peripheral circuit region, and an insulating region surrounding the through contact plugs, the through wiring region being regularly arranged throughout the through wiring region and further including dummy channel structures including the channel layer.

[0006] According to an exemplary embodiment, a semiconductor device may include a first substrate, a circuit element disposed on the first substrate, a second substrate on the circuit element, gate electrodes stacked at a distance from each other along a first direction, a channel structure penetrating the gate electrode and extending vertically on the second substrate and including a channel layer, isolation regions penetrating the gate electrode and extending along a second direction perpendicular to the first direction and arranged parallel to each other, and a through wiring region including dummy channel structures arranged in the same number as or greater than the number of the through contact plugs, the through contact plugs being positioned between adjacent isolation regions and spaced apart from the isolation regions, the through contact plugs electrically connecting the circuit element and the gate electrode, an insulating region surrounding the through contact plugs, and the channel layer. Effect of the Invention

[0007] By regularly arranging the dummy channel structures also in the through-wiring region, a semiconductor device with improved reliability can be provided.

[0008] The various yet significant advantages and effects of the present invention are not limited to the above, but can be more easily understood in the course of describing specific embodiments of the present invention. [Brief description of the drawings]

[0009] [Figure 1] 1 is a schematic block diagram of a semiconductor device according to an exemplary embodiment; [Diagram 2] 1 is an equivalent circuit diagram of a cell array of a semiconductor device according to an exemplary embodiment; [Diagram 3] 1 is a schematic layout diagram for explaining an arrangement of a semiconductor device according to an exemplary embodiment; [Figure 4] 1 is a schematic plan view of a semiconductor device according to an exemplary embodiment; [Figure 5a] 1 is a schematic cross-sectional view of a semiconductor device according to an exemplary embodiment; [Figure 5b] 1 is a schematic cross-sectional view of a semiconductor device according to an exemplary embodiment; [Figure 6] 1 is a schematic enlarged partial view of a semiconductor device according to an exemplary embodiment; [Figure 7a] 1 is a schematic enlarged partial view of a semiconductor device according to an exemplary embodiment; [Figure 7b] 1 is a schematic enlarged partial view of a semiconductor device according to an exemplary embodiment; [Figure 7c] 1 is a schematic enlarged partial view of a semiconductor device according to an exemplary embodiment; [Figure 8] 1 is a schematic plan view of a semiconductor device according to an exemplary embodiment; [Figure 9] 1 is a schematic cross-sectional view of a semiconductor device according to an exemplary embodiment; [Figure 10a] 1 is a schematic enlarged partial view of a semiconductor device according to an exemplary embodiment; [Figure 10b] 1 is a schematic enlarged partial view of a semiconductor device according to an exemplary embodiment; [Figure 11] 1 is a schematic cross-sectional view of a semiconductor device according to an exemplary embodiment; [Figure 12a] 1 is a schematic cross-sectional view of a semiconductor device according to an exemplary embodiment; [Figure 12b] 1 is a schematic cross-sectional view of a semiconductor device according to an exemplary embodiment; [Figure 12c]1 is a schematic cross-sectional view of a semiconductor device according to an exemplary embodiment; [Figure 13a] 1A to 1C are schematic cross-sectional views for explaining a method for manufacturing a semiconductor device according to an exemplary embodiment. [Figure 13b] 1A to 1C are schematic cross-sectional views for explaining a method for manufacturing a semiconductor device according to an exemplary embodiment. [Figure 13c] 1A to 1C are schematic cross-sectional views for explaining a method for manufacturing a semiconductor device according to an exemplary embodiment. [Figure 13d] 1A to 1C are schematic cross-sectional views for explaining a method for manufacturing a semiconductor device according to an exemplary embodiment. [Figure 13e] 1A to 1C are schematic cross-sectional views for explaining a method for manufacturing a semiconductor device according to an exemplary embodiment. [Figure 14a] 1A to 1C are schematic cross-sectional views for explaining a method for manufacturing a semiconductor device according to an exemplary embodiment. [Figure 14b] 1A to 1C are schematic cross-sectional views for explaining a method for manufacturing a semiconductor device according to an exemplary embodiment. [Figure 14c] 1A to 1C are schematic cross-sectional views for explaining a method for manufacturing a semiconductor device according to an exemplary embodiment. [Figure 14d] 1A to 1C are schematic cross-sectional views for explaining a method for manufacturing a semiconductor device according to an exemplary embodiment. [Figure 14e] 1A to 1C are schematic cross-sectional views for explaining a method for manufacturing a semiconductor device according to an exemplary embodiment. [Figure 14f] 1A to 1C are schematic cross-sectional views for explaining a method for manufacturing a semiconductor device according to an exemplary embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

[0011] FIG. 1 is a schematic block diagram of a semiconductor device according to an exemplary embodiment.

[0012] 1, a semiconductor device 10 may include a memory cell array 20 and a peripheral circuit 30. The peripheral circuit 30 may include a row decoder 32, a page buffer 34, an input / output buffer 35, a control logic 36, and a voltage generator 37.

[0013] The memory cell array 20 includes a plurality of memory blocks, each of which may include a plurality of memory cells. The memory cells may be connected to a row decoder 32 via a string selection line SSL, a word line WL, and a ground selection line GSL, and may be connected to a page buffer 34 via a bit line BL. In an exemplary embodiment, the memory cells may be arranged in rows and columns. In an embodiment of the present invention, memory cells arranged along the same row may be connected to the same word line WL, and memory cells arranged along the same column may be connected to the same bit line BL.

[0014] The row decoder 32 receives an address ADDR input from the control logic 36, and generates and transmits a driving signal for the word line WL by decoding the input address ADDR. The row decoder 32 provides a word line voltage generated by a voltage generator 37 to each of the selected word line WL and the unselected word line WL in response to the control of the control logic 36.

[0015] The page buffer 34 is connected to the memory cell array 20 through the bit lines BL and can read information stored in the memory cells. The page buffer 34 can temporarily store data to be stored in the memory cells or sense data stored in the memory cells according to an operation mode. The page buffer 34 can include a column decoder and a sense amplifier. The column decoder can selectively activate the bit lines BL of the memory cell array 20 in response to a signal received from the control logic 36. In addition, the sense amplifier can read data stored in a selected memory cell by sensing a voltage of the bit line BL selected by the column decoder during a read operation.

[0016] The input / output circuit 35 can receive data DATA during a program operation and transmit it to the page buffer 34, and can output data DATA transmitted from the page buffer 34 to the outside during a read operation. The input / output circuit 35 can transmit an input address or command to the control logic 36.

[0017] The control logic 36 can control the operation of the row decoder 32 and the page buffer 34. The control logic 36 can receive control signals and external voltages transmitted from sources external to the semiconductor device 10 and operate based on the received control signals. The control logic 36 can control read, write, and / or erase operations of the semiconductor device 10 in response to the control signals.

[0018] The voltage generator 37 can generate voltages required for internal operations, such as a program voltage, a read voltage, and an erase voltage, by using an external voltage. The voltages generated by the voltage generator 37 can be transmitted to the memory cell array 20 via the row decoder 32, etc.

[0019] FIG. 2 is an equivalent circuit diagram of a cell array of a semiconductor device according to an exemplary embodiment.

[0020] 2, the memory cell array 20 may include a plurality of memory cell strings S, each including memory cells MC connected in series to each other, ground selection transistors GST connected in series to both ends of the memory cells MC, and string selection transistors SST1, SST2. The plurality of memory cell strings S may be connected in parallel to bit lines BL0 to BL2, respectively. The plurality of memory cell strings S may be commonly connected to a common source line CSL. That is, the plurality of memory cell strings S may be arranged between the plurality of bit lines BL0 to BL2 and one common source line CSL. In an exemplary embodiment, a plurality of common source lines CSL may be arranged two-dimensionally.

[0021] The memory cells MC connected in series to each other may be controlled by word lines WL0 to WLn for selecting the memory cells MC. Each of the memory cells MC may include a data storage element. The gate electrodes of the memory cells MC arranged at substantially the same distance from the common source line CSL may be commonly connected to one of the word lines WL0 to WLn and be in an equipotential state. Alternatively, even if the gate electrodes of the memory cells MC are arranged at substantially the same distance from the common source line CSL, the gate electrodes arranged in different rows or columns may be independently controlled.

[0022] The ground selection transistor GST may be controlled by a ground selection line GSL and connected to a common source line CSL. The string selection transistors SST1 and SST2 may be controlled by string selection lines SSL1_1, SSL1_2, SSL1_3, SSL2_1, SSL2_2, and SSL2_3 and connected to bit lines BL0 to BL2. Although FIG. 2 shows a structure in which one ground selection transistor GST and two string selection transistors SST1 and SST2 are connected to each of a plurality of memory cells MC connected in series, each of the memory cells MC may be connected to one string selection transistor SST1 and SST2 or to a plurality of ground selection transistors GST. One or more dummy lines DWL or buffer lines may be further disposed between the top word line WLn of the word lines WL0 to WLn and the string selection lines SSL1_1, SSL1_2, SSL1_3, SSL2_1, SSL2_2, and SSL2_3. In an exemplary embodiment, a number of dummy lines DWL may also be disposed between the lowest word line WL0 and the ground selection line GSL.

[0023] When signals are applied to the string selection transistors SST1 and SST2 via string selection lines SSL1_1, SSL1_2, SSL1_3, SSL2_1, SSL2_2, and SSL2_3, signals applied via bit lines BL0 to BL2 are transferred to the memory cells MC connected in series to each other, thereby performing data read and write operations. Also, an erase operation for erasing data recorded in the memory cells MC may be performed by applying a predetermined erase voltage via the substrate. In an exemplary embodiment, the memory cell array 20 may include at least one dummy memory cell string electrically isolated from the bit lines BL0 to BL2.

[0024] FIG. 3 is a schematic layout diagram for explaining the arrangement of a semiconductor device according to an exemplary embodiment.

[0025] 3, the semiconductor device 10A may include first and second regions R1 and R2 stacked vertically. The first region R1 may constitute the peripheral circuit 30 of FIG. 1, and the second region R2 may constitute the memory cell array 20.

[0026] The first region R1 may include a row decoder DEC, a page buffer PB, and other peripheral circuits PERI. The second region R2 may include memory cell arrays MCA1 and MCA2, and first and second through-wiring regions TB1 and TB2.

[0027] In the first region R1, the row decoder DEC may correspond to the row decoder 32 described above with reference to FIG. 1, and the page buffer PB may correspond to the page buffer 34. In addition, the other peripheral circuit PERI may be a region including the control logic 36 and the voltage generator 37 of FIG. 1, and may include, for example, a latch circuit, a cache circuit, and / or a sense amplifier. The first region R1 may further include another pad region. In this case, the pad region may be a region including the input / output buffer 35 of FIG. 1, and may include an ESD (Electrostatic Discharge) element or a data input / output circuit.

[0028] In the first region R1, at least some of the various circuit regions (DEC, PB, PERI) may be arranged below the memory cell arrays MCA1, MCA2 in the second region R2. For example, the page buffer PB may be arranged below the memory cell arrays MCA1, MCA2 to overlap with the memory cell arrays MCA1, MCA2. However, depending on the embodiment, the circuits included in the first region R1 and their arrangement may be variously changed, and therefore the circuits arranged to overlap with the memory cell arrays MCA1, MCA2 may also be variously changed.

[0029] In the second region R2, the memory cell arrays MCA1 and MCA2 may be arranged side by side and spaced apart from each other. However, depending on the embodiment, the number and arrangement of the memory cell arrays MCA1 and MCA2 arranged in the second region R2 may be variously changed. For example, the memory cell arrays MCA1 and MCA2 of the present embodiment may be arranged in a continuous and repeated manner.

[0030] The first and second through wiring regions TB1 and TB2 may be regions including wiring structures that penetrate the second region R2 and are connected to the first region R1. The first through wiring region TB1 may be disposed on at least one side of the memory cell arrays MCA1 and MCA2, and may include wiring structures such as contact plugs that are electrically connected to the row decoder DEC of the first region R1. The second through wiring region TB2 may be disposed at regular intervals in the memory cell arrays MCA1 and MCA2, and may include wiring structures that are electrically connected to the page buffer PB of the first region R1. The number of the first through wiring regions TB1 may be greater than the number of the second through wiring regions TB2, but the shapes, numbers, and positions of the first and second through wiring regions TB1 and TB2 may be variously changed according to the embodiment.

[0031] FIG. 4 is a schematic plan view of a semiconductor device according to an exemplary embodiment.

[0032] 5a and 5b are schematic cross-sectional views of a semiconductor device according to an exemplary embodiment, where Fig. 5a and Fig. 5b are views showing cross sections along section lines II' and II-II' in Fig. 4, respectively.

[0033] 6 is a schematic partial enlarged view of a semiconductor device according to an exemplary embodiment, where FIG. 6 is an enlarged view of region "C" in FIG.

[0034] 4 to 6, the semiconductor device 100 may include a memory cell region CELL and a peripheral circuit region PERI. The memory cell region CELL may be disposed at an upper end of the peripheral circuit region PERI. In an exemplary embodiment, the memory cell region CELL may be disposed at a lower end of the peripheral circuit region PERI.

[0035] The memory cell region CELL includes a substrate 101 having a first region A and a second region B, a gate electrode 130 stacked on the substrate 101, first and second isolation regions MS1, MS2 extending through a stacked structure GS of the gate electrode 130, an upper isolation region SS penetrating a part of the stacked structure GS, a channel structure CH disposed to penetrate the stacked structure GS, and first and second through wiring regions TB1, TB2 connected to the peripheral circuit region PERI by penetrating the stacked structure GS and the substrate 101. The memory cell region CELL may further include an interlayer insulating layer 120, a wiring line 175, and a cell region insulating layer 190 alternately stacked with the gate electrode 130 on the substrate 101.

[0036] The first region A of the substrate 101 is a region where the gate electrodes 130 are stacked vertically and where the channel structures CH are arranged, and may correspond to the memory cell array 20 of Fig. 1 and the memory cell arrays MCA1 and MCA2 of Fig. 3, and the second region B is a region where the gate electrodes 130 extend to different lengths and may correspond to a region for electrically connecting the memory cell array 20 of Fig. 1 and the peripheral circuit 30. The second region B may be arranged at least at one end of the first region A in at least one direction, for example, the X direction.

[0037] The substrate 101 may have a top surface extending in the X-direction and the Y-direction. The substrate 101 may include a semiconductor material, such as a Group IV semiconductor, a III-V, or a II-VI compound semiconductor. For example, the Group IV semiconductor may include silicon, germanium, or silicon-germanium. The substrate 101 may also be provided as a bulk wafer or an epitaxial layer.

[0038] The gate electrodes 130 may be stacked on the substrate 101 at intervals in the vertical direction to form a stacked structure GS. The gate electrodes 130 may include a lower gate electrode 130G forming the gate of the ground selection transistor GST of FIG. 2, a memory gate electrode 130M forming a plurality of memory cells MC, and an upper gate electrode 130S forming the gate of the string selection transistors SST1 and SST2. The number of memory gate electrodes 130M forming the memory cells MC may be determined according to the capacity of the semiconductor device 100. Depending on the embodiment, the upper and lower gate electrodes 130S and 130G of the string selection transistors SST1 and SST2 and the ground selection transistor GST may each be one or more, and may have the same structure as or different from the gate electrode 130 of the memory cell MC. Some of the gate electrodes 130, for example, the memory gate electrode 130M adjacent to the upper gate electrode 130S or the lower gate electrode 130G, may be dummy gate electrodes.

[0039] The gate electrodes 130 are stacked in the first region A in a vertical direction and spaced apart from each other, and may extend to different lengths from the first region A to the second region B to form a stepped structure. The gate electrodes 130 may be arranged to form a step in the X direction like the sacrificial insulating layer 180 shown in FIG. 5a, and may also be arranged to form a step in the Y direction. Due to the step, the lower gate electrode 130 may extend longer than the upper gate electrode 130, providing an exposed pad region at the upper portion. The gate electrode 130 may be connected to another contact plug in the pad region and connected to the upper wiring line 175. At least a part of the memory gate electrode 130M, excluding the upper and lower gate electrodes 130S and 130G, may be stacked in a certain number, for example, four, to form one stack, and a step may be formed between the stacks. The four memory gate electrodes 130M constituting one stacked body can be arranged to have a step between them in the Y direction.

[0040] 4, the gate electrodes 130 may be arranged separated in the Y direction via a first isolation region MS1 ​​extending in the X direction. The gate electrodes 130 between a pair of first isolation regions MS1 may form one memory block, but the scope of the memory block is not limited thereto. A part of the gate electrodes 130, for example, the memory gate electrode 130M, may form one layer in one memory block.

[0041] The gate electrode 130 may include a metal material, such as tungsten (W). Depending on the embodiment, the gate electrode 130 may include polysilicon or a metal silicide material. In an exemplary embodiment, the gate electrode 130 may further include a diffusion barrier. The diffusion barrier may include, for example, tungsten nitride (WN), tantalum nitride (TaN), titanium nitride (TiN), or a combination thereof.

[0042] The interlayer insulating layers 120 may be disposed between the gate electrodes 130. Similar to the gate electrodes 130, the interlayer insulating layers 120 may be disposed to be spaced apart from each other in a direction perpendicular to the upper surface of the substrate 101 and extend in the X direction. The interlayer insulating layers 120 may include an insulating material such as silicon oxide or silicon nitride.

[0043] The first and second isolation regions MS1, MS2 may be disposed in the first region A and the second region B to extend along the X direction through the gate electrode 130. The first and second isolation regions MS1, MS2 may be disposed parallel to each other. The first and second isolation regions MS1, MS2 may be connected to the substrate 101 by penetrating the entire gate electrode 130 stacked on the substrate 101. The first isolation region MS1 ​​may be extended along the first region A and the second region B, and the second isolation region MS2 may be extended intermittently or may be disposed only in a part of the region. In addition, the first and second isolation regions MS1, MS2 may not be disposed overlapping the first and second through wiring regions TB1, TB2, but may be disposed apart from the first and second through wiring regions TB1, TB2. However, depending on the embodiment, the arrangement order and the number of the first and second isolation regions MS1, MS2 are not limited to those shown in FIG. 4.

[0044] 5a, an isolation insulating layer 107 and a conductive layer 110 connected to the gate electrode 130 via the isolation insulating layer 107 may be disposed in at least a portion of the first and second isolation regions MS1 and MS2. The conductive layer 110 may have a shape whose width decreases toward the substrate 101 due to a high aspect ratio, but is not limited thereto, and may have a side surface perpendicular to the upper surface of the substrate 101. In an exemplary embodiment, an impurity region may be disposed in the substrate 101 in contact with the conductive layer 110.

[0045] In an exemplary embodiment, a conductive layer 110 may be disposed in both the first and second isolation regions MS1 and MS2. In this case, the conductive layer 110 in the first isolation region MS1 ​​may correspond to the common source line CSL described with reference to FIG. 2, and the conductive layer 110 in the second isolation region MS2 may correspond to a dummy common source line. Thus, the conductive layer 110 forming the second isolation region MS2 may be in a floating state in which it is not connected to an element that drives the semiconductor device 100 or to which no electrical signal is applied. Depending on the embodiment, the conductive layer 110 may be omitted. In this case, the common source line CSL may be formed of a doped layer in the substrate 101 or a conductive layer on the substrate 101, and the first and second isolation regions MS1 and MS2 may be filled with only an insulating material.

[0046] The upper isolation region SS may extend in the X direction between the first isolation region MS1 ​​and the second isolation region MS2. In a region where the first and second through wiring regions TB1 and TB2 are not arranged, the upper isolation region SS may be arranged in parallel with a part of the second isolation region MS2. The upper isolation region SS may be arranged in a part of the second region B and the first region A so as to penetrate a part of the gate electrode 130 including the uppermost gate electrode 130S among the gate electrodes 130. The upper isolation region SS may separate a total of three gate electrodes 130 including the upper gate electrode 130S from each other in the Y direction. However, the number of gate electrodes 130 separated by the upper isolation region SS may be changed in various ways according to the embodiment. The upper gate electrodes 130S separated by the upper isolation region SS may form different string selection lines SSL1_1, SSL1_2, SSL1_3, SSL2_1, SSL2_2, and SSL2_3 (see FIG. 2). The upper isolation region SS may include an insulating layer.

[0047] In an exemplary embodiment, the semiconductor device 100 may further include an insulating layer that separates the lower gate electrodes 130G of the gate electrodes 130. For example, the insulating layer may be arranged to separate the lower gate electrodes 130G between the second isolation regions MS2 in a region where the second isolation regions MS2 are arranged in a straight line along the X direction.

[0048] The channel structures CH may be arranged in rows and columns on the first region A to form one memory cell string S (see FIG. 2) and spaced apart from each other. The channel structures CH may be arranged to form a lattice pattern or may be arranged in a zigzag pattern in one direction. The channel structures CH may have a columnar shape and may have an inclined surface that becomes narrower closer to the substrate 101 according to the aspect ratio. In an exemplary embodiment, the channel structures CH at the end of the first region A adjacent to the second region B and the channel structures CH adjacent to the first and second through-wiring regions TB1 and TB2 may be dummy channels that do not substantially form memory cell strings. In addition, a pad channel structure DCH' having the same structure as the channel structure CH may be arranged in the pad region of the gate electrode 130. The pad channel structure DCH' may be the same as the channel structure CH or may have a larger size. For example, the pad channel structure DCH' may be arranged in a number of four per pad region, but is not limited thereto.

[0049] A channel layer 140 may be disposed in the channel structure CH. In the channel structure CH, the channel layer 140 may be formed in an annular shape surrounding the channel insulating layer 150 therein, but may have a columnar shape such as a cylinder or a rectangular column without the channel insulating layer 150 according to an embodiment. The channel layer 140 may be connected to the epitaxial layer 105 at a lower portion. The channel layer 140 may include a semiconductor material such as polycrystalline silicon or single crystal silicon. The semiconductor material may be an undoped material or a material containing p-type or n-type impurities. The channel structures CH disposed on a straight line along the Y direction between the first or second isolation region MS1, MS2 and the upper isolation region SS may be connected to different bit lines BL0 to BL2 (see FIG. 2) according to the arrangement of an upper wiring structure connected to the channel pad 155.

[0050] In the channel structure CH, a channel pad 155 may be disposed on the channel layer 140. The channel pad 155 may be disposed to cover an upper surface of the channel insulating layer 150 and to be electrically connected to the channel layer 140. The channel pad 155 may include, for example, doped polycrystalline silicon.

[0051] The gate dielectric layer 145 may be disposed between the gate electrode 130 and the channel layer 140. Although not specifically illustrated, the gate dielectric layer 145 may include a tunneling layer, a charge storage layer, and a blocking layer, which are stacked in this order from the channel layer 140. The tunneling layer may tunnel charges to the charge storage layer, and may be, for example, silicon oxide (SiO 2 ), silicon nitride (Si 3 N 4 ), silicon oxynitride (SiON), or a combination thereof. The charge storage layer can be a charge trapping layer or a floating gate conductive layer. The blocking layer can be silicon oxide (SiO 2 ), silicon nitride (Si 3N 4 ), silicon oxynitride (SiON), a high-k dielectric material, or a combination thereof. Depending on the example embodiment, at least a portion of the gate dielectric layer 145 can extend horizontally along the gate electrode 130.

[0052] The epitaxial layer 105 may be disposed on the substrate 101 at the bottom of the channel structure CH and on the side of at least one gate electrode 130. The epitaxial layer 105 may be disposed in a recessed region of the substrate 101. The height of the top surface of the epitaxial layer 105 may be higher than the top surface of the bottom gate electrode 130 and lower than the bottom surface of the top gate electrode 130, but is not limited to the illustrated example. Depending on the exemplary embodiment, the epitaxial layer 105 may be omitted. In this case, the channel layer 140 may be directly connected to the substrate 101 or connected to another conductive layer on the substrate 101.

[0053] The first and second through wiring regions TB1 and TB2 may include wiring structures for electrically connecting the memory cell region CELL and the peripheral circuit region PERI to each other. The first and second through wiring regions TB1 and TB2 may include a through contact plug 170 extending in the Z direction through the stack structure GS of the gate electrode 130 and the substrate 101, an insulating region IR surrounding the through contact plug 170, and a dummy channel structure DCH arranged to penetrate a part of the insulating region IR. The first through wiring region TB1 may be disposed in the second region B, for example, one for each of one or more memory blocks. The second through wiring region TB2 may be disposed in the first region A, and one for each of a plurality of memory blocks. However, the number, size, arrangement, and shape of the first and second through wiring regions TB1 and TB2 shown in FIG. 4 may be variously changed according to the embodiment.

[0054] The first and second through wiring regions TB1, TB2 may be disposed apart from the first and second isolation regions MS1, MS2. For example, the first and second through wiring regions TB1, TB2 may be disposed at the center of the first and second isolation regions MS1, MS2 adjacent to each other along the Y direction and apart from the first and second isolation regions MS1, MS2 adjacent to each other. With this arrangement, an insulating region IR of the first and second through wiring regions TB1, TB2 may be formed. This will be described in more detail with reference to FIG. 13c.

[0055] The insulating region IR may be a region made of an insulating material in which the gate electrode 130 does not extend or is not disposed. The insulating region IR may include a substrate insulating layer 160, which is a first insulating layer disposed alongside the substrate 101 at the same level as the substrate 101, an interlayer insulating layer 120, which is a second and third insulating layer alternately stacked on the upper surface of the substrate 101, and a sacrificial insulating layer 180.

[0056] The substrate insulating layer 160 may be disposed in a region where a part of the substrate 101 is removed, and may be disposed so as to be surrounded by the substrate 101. The substrate insulating layer 160 may have an upper surface that is substantially coplanar with the upper surface of the substrate 101, and a lower surface may be coplanar with the lower surface of the substrate 101 or may be located at a lower level than the lower surface of the substrate 101. The interlayer insulating layer 120 may form a stacked structure GS with the gate electrode 130, and may form insulating regions IR in the first and second through-hole wiring regions TB1 and TB2. The sacrificial insulating layer 180 may be disposed at the same level as the gate electrode 130, and may be disposed so as to contact the gate electrode 130 at a side surface at the boundary between the first and second through-hole wiring regions TB1 and TB2.

[0057] The substrate insulating layer 160, the interlayer insulating layer 120, and the sacrificial insulating layer 180 forming the insulating region IR may be made of insulating materials. For example, the substrate insulating layer 160, the interlayer insulating layer 120, and the sacrificial insulating layer 180 may each include silicon oxide, silicon nitride, or silicon oxynitride. For example, even if some of the substrate insulating layer 160, the interlayer insulating layer 120, and the sacrificial insulating layer 180 are made of the same material, the physical properties may be different depending on the formation process, composition, etc. As a result, the boundaries may be separated from each other. The substrate insulating layer 160 and the sacrificial insulating layer 180 may have the same or different widths.

[0058] The through contact plug 170 may extend vertically through the insulating region IR to the upper surface of the substrate 101 and electrically connect the memory cell region CELL and the circuit element 220 of the peripheral circuit region PERI. For example, the through contact plug 170 may electrically connect the gate electrode 130 and the channel structure CH of the memory cell region CELL to the circuit element 220 of the peripheral circuit region PERI. However, the wiring structure electrically connecting the memory cell region CELL and the circuit element 220 of the peripheral circuit region PERI is not limited to the through contact plug 170 in the first and second through wiring regions TB1 and TB2, and for example, an additional wiring structure may be disposed in an outer region of the second region B. The through contact plug 170 may be connected to the wiring line 175 at an upper portion thereof, or may be connected to another contact plug according to an embodiment. The through contact plug 170 may be connected to the circuit wiring line 280 at a lower portion thereof.

[0059] The through contact plug 170 may penetrate the interlayer insulating layer 120 and the sacrificial insulating layer 180 of the insulating region IR, and may penetrate the substrate insulating layer 160 at the bottom. The number, form, and shape of the through contact plugs 170 disposed through one insulating region IR may be variously changed according to the embodiment. Depending on the embodiment, the through contact plug 170 may have a shape in which a plurality of layers are connected. Also, depending on the embodiment, a wiring structure having a wiring line shape may be further disposed in the insulating region IR in addition to the through contact plug 170. The through contact plug 170 may include a conductive material, for example, tungsten (W), copper (Cu), aluminum (Al), etc.

[0060] The dummy channel structures DCH may be regularly arranged between the through contact plugs 170 in the first and second through wiring regions TB1 and TB2. The dummy channel structures DCH are not limited to a specific region in the first and second through wiring regions TB1 and TB2, respectively, and may be regularly and evenly arranged throughout the entire regions. As shown in FIG. 4, the dummy channel structures DCH may be arranged in rows and columns such that at least one dummy channel structure DCH is located between two adjacent through contact plugs 170. Specifically, the dummy channel structures DCH may be arranged in the center of two adjacent through contact plugs 170 along the X and Y directions. In this case, the dummy channel structures DCH may be arranged without degrading the electrical function of the through contact plugs 170.

[0061] As in the present embodiment, the dummy channel structures DCH may be arranged in substantially the same pattern as the through contact plugs 170. Also, the dummy channel structures DCH may be the same as the through contact plugs 170 or may be arranged at the same density, i.e., the same number per unit area. For example, when the size of the dummy channel structures DCH is relatively small, the dummy channel structures DCH may be arranged at a higher density than the through contact plugs 170. The dummy channel structures DCH may be arranged in a different pattern from the channel structures CH and may be arranged at a relatively low density. Alternatively, depending on the embodiment, the dummy channel structures DCH may be arranged at the same pattern and density as the channel structures CH. In this case, the dummy channel structures DCH may be arranged in a continuous pattern from the channel structures CH. The dummy channel structures DCH may not be electrically connected to an upper wiring structure or may not form a memory cell string S (see FIG. 2) unlike the channel structures CH in the semiconductor device 100.

[0062] As shown in the enlarged view of FIG. 6, the through contact plug 170 may have a first maximum diameter D1, and the dummy channel structure DCH may have a second maximum diameter D2 smaller than the first maximum diameter D1. The first maximum diameter D1 may be in the range of about 250 nm to about 350 nm, and the second maximum diameter D2 may be in the range of about 70 nm to about 130 nm. The second maximum diameter D2 may be the same as or smaller than the maximum diameter of the channel structure CH, but is not limited thereto. When the dummy channel structure DCH has a diameter smaller than the maximum diameter of the channel structure CH, the dummy channel structure DCH may be stably spaced apart from the through contact plug 170. In addition, the through contact plug 170 may be arranged at a first pitch P1, and the dummy channel structure DCH may be arranged at a second pitch P2. In this embodiment, the second pitch P2 may be the same as the first pitch P1, but is not limited thereto. As used herein, "pitch" means the center-to-center length or end-to-end length of a structure.

[0063] The dummy channel structure DCH may have a structure at least partially corresponding to the channel structure CH. That is, the dummy channel structure DCH may include the same configuration as the channel structure CH at a corresponding position. The channel layer 140 may be disposed in the dummy channel structure DCH, and the dummy channel structure DCH may include a gate dielectric layer 145, a channel insulating layer 150, and a channel pad 155 in addition to the channel layer 140. However, the epitaxial layer 105 may not be disposed in the dummy channel structure DCH. In an exemplary embodiment, when the channel structure CH has a structure that does not include the epitaxial layer 105, the dummy channel structure DCH may have the same structure as the channel structure CH.

[0064] The arrangement of the dummy channel structures DCH and the through contact plugs 170 may be the same or different in the first through wiring region TB1 and the second through wiring region TB2. For example, as shown in FIG. 4, the dummy channel structures DCH and the through contact plugs 170 may be arranged in different patterns and densities in the first through wiring region TB1 and the second through wiring region TB2. Since the dummy channel structures DCH are arranged in the first and second through wiring regions TB1 and TB2, the continuity of the arrangement of the channel structures CH may be ensured in the first region A, and the continuity of the arrangement of the pad channel structures DCH' may be ensured in the second region B. Thus, the channel structures CH and the pad channel structures DCH' may be formed to have uniform sizes and shapes even in the regions adjacent to the first and second through wiring regions TB1 and TB2.

[0065] The wiring line 175 may constitute a wiring structure electrically connected to a memory cell in the memory cell region CELL. The wiring line 175 may be electrically connected to, for example, the gate electrode 130 or the channel structure CH. The number of contact plugs and wiring lines constituting the wiring structure may be variously changed according to the embodiment. The wiring line 175 may include a metal, and the metal may include, for example, tungsten (W), copper (Cu), aluminum (Al), etc.

[0066] The cell region insulating layer 190 may be disposed to cover the substrate 101, the gate electrode 130 on the substrate 101, and the peripheral region insulating layer 290. The cell region insulating layer 190 may be made of an insulating material.

[0067] The peripheral circuit region PERI may include a base substrate 201 , circuit elements 220 disposed on the base substrate 201 , circuit contact plugs 270 , and wiring lines 280 .

[0068] The base wafer 201 may have a top surface extending in the X-direction and the Y-direction. In the base wafer 201, another element isolation layer may be formed to define an active region. A source / drain region 205 containing an impurity may be disposed in a part of the active region. The base wafer 201 may include a semiconductor material, for example, a group IV semiconductor, a group III-V, or a group II-VI compound semiconductor.

[0069] The circuit elements 220 may include planar transistors. Each of the circuit elements 220 may include a circuit gate dielectric layer 222, a spacer layer 224, and a circuit gate electrode 225. Source / drain regions 205 may be disposed in the base substrate 201 on either side of the circuit gate electrode 225.

[0070] A peripheral region insulating layer 290 may be disposed on the circuit element 220 of the base substrate 201. Circuit contact plugs 270 may penetrate the peripheral region insulating layer 290 and be connected to the source / drain regions 205. An electrical signal may be applied to the circuit element 220 through the circuit contact plugs 270. In a region not shown, the circuit contact plugs 270 may also be connected to the circuit gate electrodes 225. The circuit wiring lines 280 may be connected to the circuit contact plugs 270 and may be disposed in multiple layers.

[0071] 7a to 7c are schematic partial enlarged views of a semiconductor device according to an exemplary embodiment, where Fig. 7a and Fig. 7b are enlarged views of a region corresponding to region "C" in Fig. 4, and Fig. 7c is an enlarged view of a region corresponding to "TB1" in Fig. 4.

[0072] 7a, in the second through wiring region TB2, the through contact plugs 170 and the dummy channel structures DCH may be arranged in a pattern different from that of the embodiments of FIGS. 4 and 6. For example, the dummy channel structures DCH may not be arranged in the center of two adjacent through contact plugs 170 in the X and Y directions, but may be arranged on one side in the Y direction of each through contact plug 170. As such, the pattern in which the dummy channel structures DCH are arranged may be variously changed depending on the embodiment.

[0073] 7b, in the second through wiring region TB2, the dummy channel structures DCH may include dummy channel structures DCH having different distances from the through contact plug 170 in one direction, unlike the embodiments of FIGS. 4 and 6. Specifically, the second through wiring region TB2 may include a dummy channel structure DCH having a first length L1 as a distance from the through contact plug 170, and a dummy channel structure DCH having a second length L2 as a distance from the through contact plug 170 that is smaller than the first length L1. Also, at least one dummy channel structure DCH may be disposed overlapping the through contact plug 170. In this case, the through contact plug 170 may be formed after the dummy channel structure DCH is formed, so that the through contact plug 170 may be disposed penetrating the dummy channel structure DCH. Such a structure may be formed when misalignment occurs in the semiconductor device 100 due to a difference in pattern density, a process error, or the like. However, even in this case, the dummy channel structure DCH and the through contact plug 170 are disposed surrounded by the insulating region IR, so that degradation of electrical characteristics does not occur.

[0074] 7c, in the first through wiring region TB1, the number of dummy channel structures DCH may be greater than that of the embodiment of FIG 4. For example, the dummy channel structures DCH may be arranged in rows not only between two adjacent through contact plugs 170 in the X direction, but also outside the contact plugs 170 in the Y direction and between the contact plugs 170 in the Y direction. The additionally arranged dummy channel structures DCH may be arranged in a zigzag shape with the contact plugs 170.

[0075] 7c shows that three rows of the dummy channel structures DCH are further arranged along the X direction, the number of additional rows of the dummy channel structures DCH is not limited to that shown. For example, in some embodiments, the rows of the dummy channel structures DCH arranged between the contact plugs 170 along the Y direction may be omitted. Thus, in the embodiments, the shape and pattern of the dummy channel structures DCH arranged in the first through-hole region TB1 may be variously changed.

[0076] Fig. 8 is a schematic plan view of a semiconductor device according to an exemplary embodiment, and Fig. 9 is a schematic cross-sectional view of the semiconductor device according to an exemplary embodiment, where Fig. 9 is a view showing a cross section taken along line III-III' in Fig. 8.

[0077] 8 and 9, in the semiconductor device 100a, unlike the embodiment of FIGS. 4 to 6, the dummy channel structures DCHa in the first and second through wiring regions TB1a and TB2a may be arranged to overlap with the through contact plugs 170, respectively. As a result, as shown in FIG. 9, the dummy channel structure DCHa may be arranged in the through contact plug 170. In this case, it is possible to prevent a defect in which the dummy channel structure DCHa contacts two adjacent through contact plugs 170 and an electrical short circuit occurs between the through contact plugs 170. However, in the case of this embodiment, as in the embodiment of FIG. 7b, a part of the dummy channel structure DCHa may not be completely arranged in the through contact plug 170, but may be arranged to overlap with it.

[0078] In the through contact plug 170, the dummy channel structure DCHa may have a structure corresponding to the channel structure CH. For example, the dummy channel structure DCHa may have the same structure as the channel structure CH except for the epitaxial layer 105. However, depending on the embodiment, the lower end of the dummy channel structure DCHa may be lower or higher than the lower end of the channel structure CH.

[0079] 10a and 10b are partial enlarged views of a semiconductor device according to an exemplary embodiment, where Fig. 10a and Fig. 10b are enlarged views of a region corresponding to region "D" in Fig. 9.

[0080] 10a, in the semiconductor device 100b, the dummy channel structure DCHb in the through contact plug 170 may not include some components, for example, the gate dielectric layer 145. As a result, the dummy channel structure DCHb may include only the channel layer 140, the channel insulating layer 150, and the channel pad 155. Such a structure may be formed by removing the material of the gate dielectric layer 145 together when forming a contact hole for forming the through contact plug 170.

[0081] 10b, in the semiconductor device 100c, the dummy channel structure DCHc in the through contact plug 170 may not include some components, for example, the channel insulating layer 150 and the channel pad 155. Thus, the dummy channel structure DCHb may include only the channel layer 140 and the gate dielectric layer 145. This structure may be formed by removing the channel pad 155 and the lower channel insulating layer 150 when forming a contact hole for forming the through contact plug 170. Depending on the embodiment, the dummy channel structure DCHc may include only the channel layer 140. This may be changed depending on the etchant and etching conditions of the contact hole.

[0082] 11 is a schematic cross-sectional view of a semiconductor device according to an exemplary embodiment, where FIG 11 shows a cross-section corresponding to FIG 5b.

[0083] 11, the semiconductor device 100d may include first and second stack structures GS in which stack structures of the gate electrodes 130 are stacked vertically, and the channel structure CHd and the dummy channel structure DCHd may include first and second channel structures CH1, CH2 and first and second dummy channel structures DCH1, DCH2 stacked vertically, respectively. Such structures of the channel structure CHd and the dummy channel structure DCHd may be introduced to stably form the channel structure CHd when the number of stacked gate electrodes 130 is relatively large.

[0084] The channel structure CHd may have a shape in which the first channel structure CH1 of the first stack structure GS1 and the second channel structure CH2 of the second stack structure GS2 are connected to each other, and may have a bent portion due to a difference in width in the connection region. The channel layer 140, the gate dielectric layer 145, and the channel insulating layer 150 may be connected to each other between the first channel structure CH1 and the second channel structure CH2. The channel pad 155 may be disposed only on the upper end of the upper second channel structure CH2. However, in an exemplary embodiment, the first channel structure CH1 and the second channel structure CH2 may each include a channel pad 155. In this case, the channel pad 155 of the first channel structure CH1 may be connected to the channel layer 140 of the second channel structure CH2. The channel structure CHd may not include the epitaxial layer 105, unlike the embodiment of FIG. 5a and FIG. 5b, but is not limited thereto.

[0085] The dummy channel structure DCHd may have substantially the same structure as the channel structure CHd. That is, the dummy channel structure DCHd may also have a shape in which the first dummy channel structure DCH1 and the second dummy channel structure DCH2 are connected. In addition, a relatively thick upper interlayer insulating layer 125 may be disposed on the top of the first stacked structure GS1. However, the shapes of the interlayer insulating layer 120 and the upper interlayer insulating layer 125 may be variously changed according to the embodiment. For other configurations, the description above with reference to FIGS. 4 to 6 may be similarly applied.

[0086] 12a to 12c are schematic cross-sectional views of a semiconductor device according to an exemplary embodiment, where Fig. 12a to Fig. 12c are views showing a cross section corresponding to Fig. 11.

[0087] 12a, in the semiconductor device 100e, at least a portion of the dummy channel structures DCHe may have a shape in which the first dummy channel structure DCH1 and the second dummy channel structure DCH2 are shifted in a horizontal direction, for example, in the Y direction. This may occur due to a process error during the process of forming the dummy channel structures DCHe. In particular, when process conditions are determined with a priority given to the formation of the channel structures CHd, such a structure may be formed in the dummy channel structures DCHe that do not actually form memory cell strings.

[0088] 12b, in the semiconductor device 100f, at least some of the dummy channel structures DCHf may have a shape in which the first dummy channel structure DCH1 and the second dummy channel structure DCH2 are spaced apart from each other in a vertical direction, for example, a Z direction. The first dummy channel structure DCH1 and the second dummy channel structure DCH2 may have a shape in which they are spaced apart by a predetermined length L3 and are not connected to each other. The length L3 may be variously changed according to the embodiment, and may be different from each other in two or more dummy channel structures DCHf.

[0089] The first dummy channel structure DCH1 at the lower portion may have a different structure from the second dummy channel structure DCH2 at the upper portion. Specifically, the first dummy channel structure DCH1 may have a structure filled with a channel sacrificial layer 185. That is, the first dummy channel structure DCH1 may have a structure formed by leaving the channel sacrificial layer 185 through the channel hole forming the second dummy channel structure DCH2 without being removed during the manufacture of the dummy channel structure DCHf.

[0090] Referring to FIG. 12c, in the semiconductor device 100g, at least some of the dummy channel structures DCHg may have different structures, with the first dummy channel structure DCH1 at the bottom and the second dummy channel structure DCH2 at the top. As in the embodiment described above with reference to FIG. 12b, at least one of the first dummy channel structures DCH1 may have a structure filled with a channel sacrificial layer 185. However, unlike the embodiment described above with reference to FIG. 12b, the first dummy channel structure DCH1 may have such a structure even when the first dummy channel structure DCH1 and the second dummy channel structure DCH2 are connected to each other. That is, when the width of the first dummy channel structure DCH1 is relatively small, the channel sacrificial layer 185 may remain through the channel hole forming the second dummy channel structure DCH2 during the manufacture of the dummy channel structure DCHg.

[0091] Figures 13a to 13e are schematic cross-sectional views illustrating a method for manufacturing a semiconductor device according to an exemplary embodiment, where Figures 13a to 13e show an area corresponding to the area shown in Figure 5a.

[0092] Referring to FIG. 13a, a peripheral circuit region PERI including a circuit element 220 and a lower wiring structure is formed on a base substrate 201, and a substrate 101 and a substrate insulating layer 160 in which a memory cell region is provided are formed on the upper portion of the peripheral circuit region PERI, and then sacrificial insulating layers 180 and interlayer insulating layers 120 can be alternately stacked.

[0093] First, the circuit gate dielectric layer 222 and the circuit gate electrode 225 may be formed in sequence on the base substrate 201. The circuit gate dielectric layer 222 and the circuit gate electrode 225 may be formed using atomic layer deposition (ALD) or chemical vapor deposition (CVD). The circuit gate dielectric layer 222 may be formed of silicon oxide, and the circuit gate electrode 225 may be formed of at least one of polysilicon or a metal silicide layer, but is not limited thereto. Next, a spacer layer 224 and a source / drain region 205 may be formed on both side walls of the circuit gate dielectric layer 222 and the circuit gate electrode 225. Depending on the embodiment, the spacer layer 224 may be composed of a plurality of layers. Next, the source / drain region 205 may be formed by performing an ion implantation process.

[0094] The circuit contact plug 270 of the lower wiring structure may be formed by forming a part of the peripheral region insulating layer 290, etching away a part of it, and filling it with a conductive material. The lower wiring line 280 may be formed, for example, by depositing a conductive material and then patterning it.

[0095] The peripheral region insulating layer 290 may be formed of a plurality of insulating layers, a portion of which is formed in each step of forming the lower wiring structure, and a portion of which is formed on the uppermost lower wiring line 280, so that the peripheral region insulating layer 290 may be finally formed to cover the circuit elements 220 and the lower wiring structure.

[0096] Next, a substrate 101 may be formed on the peripheral region insulating layer 290. The substrate 101 may be made of, for example, polycrystalline silicon and may be formed by a CVD process. The polycrystalline silicon forming the substrate 101 may contain impurities. The substrate 101 may be formed to be smaller than or the same size as the base substrate 201.

[0097] The substrate insulating layer 160 may be formed by removing a portion of the substrate 101 in the regions corresponding to the first and second through-wiring regions TB1 and TB2, and then filling the region with an insulating material. After filling the region with the insulating material, a planarization process may be further performed using a chemical mechanical polishing (CMP) process. As a result, the upper surface of the substrate insulating layer 160 may be substantially coplanar with the upper surface of the substrate 101.

[0098] The sacrificial insulating layer 180 may be a layer that partially replaces the gate electrode 130 (see FIG. 5a) through a subsequent process. The sacrificial insulating layer 180 may be made of a material different from the interlayer insulating layer 120, and may be formed of a material that can be etched with etching selectivity to the interlayer insulating layer 120 under specific etching conditions. For example, the interlayer insulating layer 120 may be made of at least one of silicon oxide and silicon nitride, and the sacrificial insulating layer 180 may be made of a material different from the interlayer insulating layer 120 selected from silicon, silicon oxide, silicon carbide, and silicon nitride. Depending on the embodiment, the thickness of the interlayer insulating layer 120 and the sacrificial insulating layer 180 may not all be the same. The thicknesses of the interlayer insulating layer 120 and the sacrificial insulating layer 180 and the number of layers constituting them may be variously changed from those shown in the drawings.

[0099] 4, a photolithography process and an etching process can be repeatedly performed on the sacrificial insulating layer 180 using a mask layer so that the upper sacrificial insulating layer 180 extends shorter than the lower sacrificial insulating layer 180. In this way, the sacrificial insulating layer 180 can be formed in a stepped shape, and a pad region can be provided.

[0100] Next, a cell region insulating layer 190 may be formed to cover the upper portion of the stacked structure of the sacrificial insulating layer 180 and the interlayer insulating layer 120 .

[0101] Referring to FIG. 13b, a channel structure CH and a dummy channel structure DCH penetrating a stack structure of the sacrificial insulating layer 180 and the interlayer insulating layer 120 may be formed.

[0102] First, a string isolation region SS (see FIG. 4) may be formed by removing a portion of the sacrificial insulating layer 180 and the interlayer insulating layer 120 in a region not shown. The string isolation region SS may be formed by exposing a region where the string isolation region SS is to be formed using another mask layer, removing a predetermined number of the sacrificial insulating layer 180 and the interlayer insulating layer 120 from the top, and then depositing an insulating material. The string isolation region SS may be extended to below the region where the upper gate electrode 130S in FIG. 4 is to be formed.

[0103] The channel structure CH and the dummy channel structure DCH may be formed by anisotropically etching the sacrificial insulating layer 180 and the interlayer insulating layer 120, and may be formed by forming a hole-shaped channel hole and then filling the hole. The channel holes for the dummy channel structure DCH as well as the channel holes for the channel structure CH are formed in the regions where the first and second through-wiring regions TB1 and TB2 are formed, so that the channel holes are not discontinuously arranged but are continuously arranged. As a result, the channel holes can be formed to have a uniform size and shape regardless of the region, and the electrical characteristics of the channel structure CH can be ensured.

[0104] Due to the height of the stacked structures, the sidewalls of the channel structures CH and the dummy channel structures DCH may not be perpendicular to the top surface of the substrate 101. In an exemplary embodiment, the channel structures CH and the dummy channel structures DCH may be formed to recess a portion of the substrate 101. An epitaxial layer 105 may then be formed in the channel structures CH, and at least a portion of the gate dielectric layer 145, the channel layer 140, the channel insulating layer 150, and the channel pad 155 may then be formed in the channel structures CH and the dummy channel structures DCH, in that order.

[0105] In the channel structure CH, the epitaxial layer 105 may be formed using a selective epitaxial growth (SEG) process. The epitaxial layer 105 may consist of a single layer or multiple layers. The epitaxial layer 105 may include polycrystalline silicon, single crystal silicon, polycrystalline germanium, or single crystal germanium, which may be doped or undoped with impurities. However, depending on the embodiment, the epitaxial layer 105 may be omitted.

[0106] The gate dielectric layer 145 may be formed to have a uniform thickness by using an ALD or CVD process. In this step, the gate dielectric layer 145 may be formed in whole or in part, and may be formed to extend vertically to the substrate 101 along the channel structure CH and the dummy channel structure DCH. The channel layer 140 may be formed on the gate dielectric layer 145 in the channel structure CH and the dummy channel structure DCH. The channel insulating layer 150 is formed to fill the channel structure CH and the dummy channel structure DCH, and may be an insulating material. However, depending on the embodiment, a conductive material other than the channel insulating layer 150 may be used to fill the space between the channel layer 140. The channel pad 155 may be made of a conductive material, for example, polycrystalline silicon.

[0107] Referring to FIG. 13c, an opening OP penetrating the stacked structure of the sacrificial insulating layer 180 and the interlayer insulating layer 120 may be formed, and a portion of the sacrificial insulating layer 180 may be removed through the opening OP to form a tunnel portion LT.

[0108] First, before forming the opening OP, a cell region insulating layer 190 may be further formed on the channel structure CH and the dummy channel structure DCH. The opening OP may be formed at the positions of the first and second isolation regions MS1 and MS2 in FIG. 4. The opening OP may be formed by forming a mask layer using a photolithography process and anisotropically etching the stacked structure. The opening OP may be formed in a trench shape extending in the Y direction, and the substrate 101 may be exposed at the bottom of the opening OP.

[0109] The sacrificial insulating layer 180 may be removed from the outer regions of the first and second through wiring regions TB1, TB2 except for the first and second through wiring regions TB1, TB2 (see FIG. 4), i.e., from the outside of the insulating region IR. As a result, the insulating region IR of the first and second through wiring regions TB1, TB2 including the interlayer insulating layer 120, the sacrificial insulating layer 180, and the substrate insulating layer 160 may be defined. The sacrificial layer 180 may be selectively removed with respect to the interlayer insulating layer 120 and the substrate insulating layer 160, for example, by using wet etching. As a result, a plurality of tunnel portions LT may be formed between the interlayer insulating layer 120, and a portion of a sidewall of the gate dielectric layer 145 of the channel structure CH may be exposed through the second tunnel portion LT2.

[0110] The regions in which the first and second through wiring regions TB1 and TB2 are formed may be regions that are separated from the opening OP and cannot be reached by the etchant, leaving the sacrificial insulating layer 180. As a result, the first and second through wiring regions TB1 and TB2 are formed in the center of the opening OP between adjacent openings OP. In addition, the region in which the sacrificial insulating layer 180 remains may not exactly match the region in which the substrate insulating layer 160 is disposed.

[0111] Referring to FIG. 13d, a conductive material may be filled into the tunnel portion LT from which the sacrificial insulating layer 180 has been partially removed to form the gate electrode 130, and an isolation insulating layer 107 and a conductive layer 110 may be formed in the opening OP.

[0112] The conductive material forming the gate electrode 130 may fill the tunnel portion LT. The conductive material may include metal, polycrystalline silicon, or metal silicide material. A side surface of the gate electrode 130 may contact a side surface of the sacrificial insulating layer 180 in the insulating region IR. After forming the gate electrode 130, the conductive material deposited in the opening OP may be removed through an additional process.

[0113] The isolation insulating layer 107 may be formed in the form of a spacer in the opening OP. That is, after depositing an insulating material, the insulating material formed on the substrate 101 from the lower part of the opening OP may be removed to form the isolation insulating layer 107. Next, a conductive material may be deposited on the isolation insulating layer 107 to form the conductive layer 110. For example, the isolation insulating layer 107 and the conductive layer 110 may be formed in the same process in the first and second isolation regions MS1 and MS2 and have the same structure. In this case, as described above, for example, in the first isolation region MS1, the conductive layer 110 may function as a common source line CSL, and in the second isolation region MS2, the conductive layer 110 may function as a dummy common source line. Also, depending on the embodiment, the process of forming the conductive layer 110 may be omitted.

[0114] Referring to FIG. 13e, a contact hole VH for forming a through contact plug 170 may be formed.

[0115] Before forming the contact hole VH, a cell region insulating layer 190 may be further formed to cover the isolation insulating layer 107. Next, a contact hole VH may be formed from the upper portion of the insulating region IR to penetrate the cell region insulating layer 190 and the insulating region IR. At the lower end of the contact hole VH, a circuit wiring line 280 of the peripheral circuit region PERI may be exposed.

[0116] Next, referring to Fig. 5b, the contact hole VH is filled with a conductive material to form a through contact plug 170, first and second through wiring regions TB1 and TB2 are formed, and then a wiring line 175 connected to an upper end of the through contact plug 170 is formed, thereby manufacturing the semiconductor device 100. However, the manufacturing method described above with reference to Figs. 13a to 13e is only one example for manufacturing the semiconductor device 100 of Figs. 4 to 6, and the semiconductor device 100 may be manufactured by various manufacturing methods.

[0117] Figures 14a to 14f are schematic cross-sectional views for explaining a method for manufacturing a semiconductor device according to an exemplary embodiment. Here, Figures 14a to 14f are views showing an area corresponding to the area shown in Figure 11. In the following, description overlapping with the description above with reference to Figures 13a to 13e will be omitted.

[0118] Referring to FIG. 14a, after forming a peripheral circuit region PERI and forming a substrate 101 and a substrate insulating layer 160 in which a memory cell region is provided on the upper part of the peripheral circuit region PERI, a sacrificial insulating layer 180 and an interlayer insulating layer 120 constituting a first stacked structure GS1 are alternately stacked, and a first channel hole CHH1 is formed, thereby filling the channel sacrificial layer 185.

[0119] An upper interlayer insulating layer 125 that is relatively thicker than the interlayer insulating layer 120 may be formed on the top. The channel sacrificial layer 185 may be formed of a material that has etching selectivity with respect to the sacrificial insulating layer 180 and the interlayer insulating layer 120 and can be etched. For example, the channel sacrificial layer 185 may include silicon (Si).

[0120] Referring to FIG. 14b, a second stack structure GS2 may be formed by alternately stacking sacrificial insulating layers 180 and interlayer insulating layers 120 on the first stack structure GS1.

[0121] The second laminate structure GS2, like the first laminate structure GS1, can be formed by alternately stacking sacrificial insulating layers 180 and interlayer insulating layers 120 on the upper interlayer insulating layer 125 and the channel sacrificial layer 185 to form a cell region insulating layer 190.

[0122] Referring to FIG. 14c, a second channel hole CHH2 penetrating the second stack structure GS2 may be formed, and the channel sacrificial layer 185 in the first channel hole CHH1 may be removed.

[0123] First, the second channel hole CHH2 may be formed to be aligned with the first channel hole CHH1. Specifically, a photoresist layer may be patterned on the second stacked structure GS2 to expose a portion of the second stacked structure GS2, and then the second stacked structure GS2 may be etched in the exposed area to form the second channel hole CHH2. Next, the channel sacrificial layer 185 exposed through the second channel hole CHH2 may be removed to form a channel hole CHH in which the first channel hole CHH1 and the second channel hole CHH2 are connected.

[0124] The channel holes CHH are formed not only in the region where the channel structure CHd is disposed but also in the region where the dummy channel structure DCHd is disposed, so that they can be continuously patterned and have a uniform size and shape. As a result, in the channel structure CHd formed adjacent to the first and second through-hole regions TB1 and TB2 through a subsequent process, the occurrence of defects due to patterning problems can be prevented and electrical characteristics can be ensured.

[0125] Referring to FIG. 14d, a channel structure CHd and a dummy channel structure DCHd may be formed.

[0126] The channel structure CHd and the dummy channel structure DCHd may be formed such that the first and second channel structures CH1 and CH2, and the first and second dummy channel structures DCH1 and DCH2 are connected to one another. The channel structure CHd and the dummy channel structure DCHd may be formed by sequentially forming at least a portion of the gate dielectric layer 145 in the channel hole CHH, the channel layer 140, the channel insulating layer 150, and the channel pad 155. At the bottom end of the channel hole CHH, a portion of the gate dielectric layer 145 is removed so that the channel layer 140 can directly contact the substrate 101 and the substrate insulating layer 160.

[0127] Referring to FIG. 14e, an opening (see FIG. 13c) penetrating the first and second stacked structures GS1 and GS2 can be formed in an area not shown, and a portion of the sacrificial insulating layer 180 can be removed through the opening.

[0128] First, a cell region insulating layer 190 may be further formed. The openings may be formed at the positions of the first and second isolation regions MS1 and MS2 of FIG. 4. The sacrificial insulating layer 180 may be removed from the outer regions of the first and second through wiring regions TB1 and TB2 except for the first and second through wiring regions TB1 and TB2 (see FIG. 4), i.e., from the outside of the insulating region IR. Thus, the insulating region IR of the first and second through wiring regions TB1 and TB2 including the interlayer insulating layer 120, the sacrificial insulating layer 180, and the substrate insulating layer 160 may be defined.

[0129] Referring to FIG. 14f, a conductive material may be filled in the area where the sacrificial insulating layer 180 has been removed to form the gate electrode 130, and after filling the above opening, a contact hole VH may be formed to form the through contact plug 170.

[0130] The opening may be filled with an insulating material, or an insulating material and a conductive material. Before forming the contact hole VH, a cell region insulating layer 190 may be further formed. Then, a contact hole VH may be formed from the top of the insulating region IR to penetrate the cell region insulating layer 190 and the insulating region IR. At the bottom end of the contact hole VH, a circuit wiring line 280 of the peripheral circuit region PERI may be exposed.

[0131] 11, the semiconductor device 100d can be manufactured by filling the contact holes VH with a conductive material to form the through contact plugs 170, forming first and second through wiring regions TB1 and TB2, and then forming the wiring lines 175 connected to the upper ends of the through contact plugs 170. However, the manufacturing method described above with reference to FIGS. 14a to 14f is only one example for manufacturing the semiconductor device 100d of FIG. 11, and the semiconductor device 100d can be manufactured by various manufacturing methods.

[0132] Although the embodiments of the present invention have been described in detail above, it will be apparent to those skilled in the art that the scope of the present invention is not limited thereto, and that various modifications and variations are possible within the scope of the technical idea of ​​the present invention described in the claims. [Explanation of symbols]

[0133] CH Channel structure DCH Dummy Channel Structure GS laminated structure IR Isolation Area MS1, MS2 separation area SS upper separation area TB1, TB2 through wiring area 101 Substrate 105 Epitaxial layer 107 Separation insulating layer 110 Conductive layer 120 Interlayer insulation layer 130 Gate electrode 140 Channel Layer 145 Gate Dielectric Layer 150 Channel Insulation Layer 155 Channel Pad 160 Substrate insulation layer 170 through contact plug 175 Wiring Line 180 Sacrificial insulating layer 190 Cell area insulating layer

Claims

1. a first substrate and a peripheral circuit region including circuit elements on the first substrate; a memory cell region on the peripheral circuit region, the memory cell region including a second substrate, gate electrodes stacked and spaced apart from each other along a first direction perpendicular to an upper surface of the second substrate, and a channel structure penetrating the gate electrodes and extending perpendicular to the second substrate, the channel structure being connected to an upper wiring structure; a through wiring region electrically connecting the memory cell region and the peripheral circuit region, The through wiring region is a through contact plug extending in the first direction through the memory cell region and electrically connecting the memory cell region and the circuit element; an insulating region surrounding the through contact plug, the insulating region including a first insulating layer and a second insulating layer alternately stacked; a dummy channel structure penetrating the first and second insulating layers, the dummy channel structure not being connected to the upper wiring structure; At least one of the dummy channel structures is disposed between adjacent ones of the through contact plugs. Semiconductor device.

2. The semiconductor device according to claim 1 , wherein an upper surface of said through contact plug is farther from said second substrate than an upper surface of said channel structure.

3. The semiconductor device of claim 1 , wherein a top surface of the channel structure is substantially coplanar with a top surface of the dummy channel structure.

4. The gate electrodes provide an exposed pad region facing upward, and a lower gate electrode among the gate electrodes extends longer than an upper gate electrode among the gate electrodes; the memory cell region further includes a pad channel structure that penetrates the gate electrode in the pad region and extends vertically to the second substrate, the pad channel structure being not electrically connected to the upper wiring structure; The semiconductor device according to claim 1 .

5. 5. The semiconductor device according to claim 4, wherein the dummy channel structures are arranged at a first pitch, and the pad channel structures are arranged at a second pitch different from the first pitch.

6. The semiconductor device of claim 1 , wherein each of said channel structures has a diameter equal to or smaller than a diameter of each of said dummy channel structures.

7. The semiconductor device according to claim 1 , wherein at least one of the dummy channel structures has a structure corresponding to a structure of the channel structure.

8. The semiconductor device of claim 7 , wherein each of the channel structure and the dummy channel structure includes a gate dielectric layer, a channel layer on the gate dielectric layer, and a channel insulating layer on the channel layer.

9. 2. The semiconductor device of claim 1, wherein each of the dummy channel structures has a maximum diameter between 70 nm and 130 nm, and each of the through contact plugs has a maximum diameter between 250 nm and 350 nm.

10. Each of the channel structures includes a first channel structure and a second channel structure stacked along the first direction; each of the dummy channel structures includes a first dummy channel structure and a second dummy channel structure stacked along the first direction; The semiconductor device according to claim 1 .

11. The semiconductor device according to claim 10 , wherein at least a portion of the first dummy channel structure and the second dummy channel structure are spaced apart from each other in the first direction and separated from each other.

12. The semiconductor device according to claim 10 , wherein at least a portion of the first dummy channel structure and the second dummy channel structure are shifted from each other in a second direction perpendicular to the first direction.

13. the memory cell region further includes an interlayer insulating layer alternately arranged with the gate electrodes; each first insulating layer and each interlayer insulating layer is equidistant from the second substrate; each second insulating layer and each gate electrode is equidistant from the second substrate; The semiconductor device according to claim 1 .

14. a first substrate and a peripheral circuit region including circuit elements on the first substrate; a memory cell region on the peripheral circuit region, the memory cell region including a stacked structure having a plurality of spaced apart gate electrodes on a second substrate and a plurality of channel structures extending perpendicularly to the second substrate through the plurality of gate electrodes; a through wiring region including a through contact plug extending vertically and electrically connecting the memory cell region and the peripheral circuit region to each other, an insulating region surrounding the through contact plug, and a plurality of dummy channel structures regularly arranged throughout the through wiring region; the gate electrodes extend at different lengths to provide an upwardly exposed pad region at ends of the gate electrodes; the memory cell region further includes a pad channel structure extending through the gate electrodes in the pad region and perpendicular to the second substrate; the dummy channel structures are arranged at a first pitch, and the pad channel structures are arranged at a second pitch different from the first pitch. Semiconductor device.

15. further comprising an upper wiring structure on the channel structure; the channel structure is connected to the upper wiring structure, and the dummy channel structure is not connected to the upper wiring structure; The semiconductor device according to claim 14.

16. The semiconductor device according to claim 14 , wherein an upper surface of the through contact plug is farther from the second substrate than an upper surface of the channel structure.

17. The semiconductor device according to claim 14 , wherein the portion of the dummy channel structure is between each pair of the through contact plugs adjacent to each other along at least one direction.

18. A semiconductor device as described in claim 14, wherein the dummy channel structure is arranged overlapping the through contact plug.

19. A first substrate; A circuit element on the first substrate; a second substrate on the circuit element; Gate electrodes stacked apart from each other along a first direction; a channel structure extending perpendicularly to the second substrate through the gate electrode; Isolation regions extending along a second direction perpendicular to the first direction, the isolation regions penetrating the gate electrode, and disposed parallel to and spaced apart from each other; a through wiring region located between adjacent isolation regions and spaced apart from the adjacent isolation regions, The through wiring region is a through contact plug electrically connecting the circuit element and the gate electrode to each other or electrically connecting the circuit element and the channel structure to each other; a dummy channel structure spaced apart from the gate electrode so as not to contact the conductive layer; a portion of the dummy channel structure is located between each pair of the through contact plugs adjacent to each other along at least one direction; Semiconductor device.

20. The through wiring region further includes an insulating region including a first insulating layer and a second insulating layer that are alternately stacked, The dummy channel structure penetrates the first insulating layer and the second insulating layer.

20. The semiconductor device according to claim 19.

Images