Chip Varistor

Abstract

A chip varistor and a differential transmission transceiver device that can achieve high signal accuracy are provided. [Solution] The chip varistor 1 includes two functional layers (i.e., a first functional layer 42 and a second functional layer 44) in the element body 10, and the two functional layers 42, 44 have substantially the same capacitance. In the chip varistor 1, the alkali metal-containing portion 12 increases the resistance of the element body 10 from its outer surfaces 10a to 10f, but the alkali metal-containing portion 12 does not reach the first functional layer 42 or the second functional layer 44. Therefore, the alkali metal-containing portion 12 suppresses the parasitic capacitance of the chip varistor 1 without affecting the capacitance of the first functional layer 42 and the second functional layer 44. Therefore, the chip varistor 1 includes two functional layers 42, 44 in which capacitance variation is suppressed.

Description

[Technical field]

[0001] The present invention relates to a chip varistor. [Background technology]

[0002] A known chip varistor is a multilayer chip varistor that includes a varistor element body having a functional layer (varistor layer) and internal electrodes arranged in contact with the functional layer so as to sandwich the functional layer, and terminal electrodes arranged to be connected to the internal electrodes corresponding to the ends of the varistor element body (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2002-184608 A Summary of the Invention [Problem to be solved by the invention]

[0004] The inventors conducted extensive research into technology for applying chip varistors to differential transmission transceivers, for example those used in automobiles, in order to protect the transceivers from surge voltages such as ESD (Electrostatic Discharge). As a result, they discovered that capacitance variations between the chip varistors attached to each of the two channels can cause communication errors.

[0005] As a result of extensive research, the inventors have discovered a new technique capable of reducing signal errors by suppressing the above-mentioned capacitance variations.

[0006] An object of the present invention is to provide a chip varistor and a differential transmission transmitting / receiving device that can achieve high signal accuracy. [Means for solving the problem]

[0007] A chip varistor according to one embodiment of the present invention has a laminated structure having a first surface and a second surface opposed to each other, a first conductor extending in a predetermined layer of the element body along the opposing direction of the first surface and the second surface, a second conductor extending in a layer different from the first conductor of the element body along the opposing direction of the first surface and the second surface and forming an overlapping portion overlapping with the first conductor in the stacking direction of the element body, and a functional portion extending in a layer intermediate the first conductor and second conductor of the element body along a direction intersecting the first conductor and the second conductor and overlapping with the overlapping portion in the stacking direction of the element body, and a first functional layer between the functional portion and the first conductor. a third conductor that is formed on the first surface of the element body and forms a second functional layer between the functional part and the second conductor, a first electrode that is provided on the first surface of the element body and connected to the first conductor, a second electrode that is provided on the second surface of the element body and connected to the second conductor, a third electrode that is provided on the surface of the element body and connected to the third conductor, and a part of the element body whose electrical resistance is increased by containing an alkali metal, which constitutes the surface of the element body and comprises an alkali metal-containing portion that extends inward from the surface of the element body along the interfaces between the first conductor, the second conductor and the element body, and the alkali metal-containing portion does not reach the first functional layer or the second functional layer.

[0008] The chip varistor includes two functional layers (i.e., a first functional layer and a second functional layer) in the element body. The first functional layer and the second functional layer are formed by overlapping the functional part of the third conductor with the first conductor and the second conductor, respectively, at the overlapping part where the first conductor and the second conductor overlap. Therefore, the facing area between the functional part of the third conductor and the first conductor and the facing area between the functional part of the third conductor and the second conductor are made the same. Furthermore, in the chip varistor, the alkali metal-containing part increases the resistance of a part of the element body except for the first functional layer and the second functional layer. Therefore, the parasitic capacitance generated between any two of the first conductor, the second conductor, the third conductor, the first electrode, the second electrode, and the third electrode is suppressed. Therefore, the chip varistor includes two functional layers with suppressed capacitance variation, and by applying these functional layers to a differential transmission transmitting / receiving device, high signal accuracy can be achieved.

[0009] In another embodiment of a chip varistor, the distance from the position where the alkali metal-containing portion reaches along the interface between the first conductor and the element body to the overlap portion, and the distance from the position where the alkali metal-containing portion reaches along the interface between the second conductor and the element body to the overlap portion are longer than the distance from the position where the alkali metal-containing portion reaches along the interface between the third conductor and the element body to the overlap portion.

[0010] In another embodiment of the chip varistor, the ratio of the length of the first conductor and the length of the second conductor to the length of the element body is in the range of 0.1 to 0.6 in the direction perpendicular to the stacking direction and the opposing direction of the first surface and the second surface. In this case, the chip varistor has high ESD resistance and high reliability.

[0011] In the chip varistor according to another embodiment, the ratio of the length of the third conductor to the length of the third electrode in the opposing direction between the first and second surfaces is in the range of 0.2 to 0.6, in which case the chip varistor has high ESD resistance and high reliability.

[0012] In a chip varistor according to another embodiment, the length of the functional portion of the third conductor is shorter than the length of the overlapping portion in the opposing direction between the first surface and the second surface.

[0013] A differential transmission transceiver according to one embodiment of the present invention includes the above chip varistor, in which a first electrode of the chip varistor is connected to one channel, a second electrode of the chip varistor is connected to the other channel, and a third electrode of the chip varistor is grounded. In the differential transmission transceiver, a chip varistor including two functional layers with reduced capacitance variation is used, thereby achieving high signal accuracy. Effect of the Invention

[0014] According to the present invention, it is possible to provide a chip varistor and a differential transmission transmitting / receiving device that can achieve high signal accuracy. [Brief description of the drawings]

[0015] [Figure 1]1 is a schematic perspective view showing a chip varistor according to an embodiment; [Diagram 2] 2 is a diagram showing each conductor and each terminal electrode of the chip varistor shown in FIG. 1. [Diagram 3] 3 is a cross-sectional view taken along line III-III of the chip varistor shown in FIG. 1. [Figure 4] 4 is a cross-sectional view of the chip varistor shown in FIG. 1 taken along line IV-IV. [Diagram 5] 1 is a diagram illustrating a differential transmission transceiver device according to an embodiment. [Figure 6] FIG. 1 is a diagram showing a differential transmission transceiver device according to a conventional technique. [Figure 7] 13 is a table showing the measurement results and evaluation results of an experiment using a number of samples with first conductors and second conductors having different widths. [Figure 8] 13 is a table showing the measurement results and evaluation results of an experiment using a plurality of samples with different widths of third conductors. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0016] Hereinafter, an embodiment of the present invention will be described in detail with reference to the accompanying drawings. In the description, the same elements or elements having the same functions will be denoted by the same reference numerals, and duplicated description will be omitted.

[0017] First, the configuration of a chip varistor 1 according to the embodiment will be described with reference to FIGS.

[0018] The chip varistor 1 is a three-terminal type laminated chip varistor, and is configured to include an element body 10 and terminal electrodes 20. The chip varistor 1 has a substantially rectangular parallelepiped outer shape, and is a so-called 2012 size (longitudinal length: 2.0 mm, lateral length: 1.25 mm, height: 0.5 mm).

[0019] The element body 10 is a laminated structure having a substantially rectangular parallelepiped outer shape. The element body 10 has square end faces 10a, 10b facing each other in the longitudinal direction, and four rectangular side faces 10c to 10f perpendicular to the end faces 10a, 10b. The four side faces 10c to 10f extend to connect the end faces 10a, 10b.

[0020] The element body 10 is made of a sintered body (semiconductor ceramic) that exhibits varistor characteristics. The element body 10 is a laminated structure made of multiple layers made of sintered bodies that exhibit varistor characteristics. In the actual element body 10, the constituent layers are integrated to such an extent that the boundaries between them are not visible. The element body 10 contains ZnO (zinc oxide) as a main component, and also contains, as secondary components, simple metals such as Co, rare earth metal elements, IIIb group elements (B, Al, Ga, In), Si, Cr, Mo, alkali metal elements (K, Rb, Cs), and alkaline earth metal elements (Mg, Ca, Sr, Ba), or oxides thereof. In this embodiment, the element body 10 contains Co, Pr, Cr, Ca, K, and Al as secondary components. The content of ZnO in the element body 10 is not particularly limited, but is usually 99.8 to 69.0 mass% when the entire material that constitutes the element body 10 is taken as 100 mass%. The rare earth metal element (for example, Pr) acts as a substance that exhibits varistor characteristics. The content of the rare earth metal element in element body 10 is set to, for example, about 0.01 to 10 atomic %.

[0021] The chip varistor 1 includes a first conductor 32, a second conductor 34, and a third conductor 36 in an element body 10. The first conductor 32, the second conductor 34, and the third conductor 36 contain a conductive material. The conductive material contained in each of the conductors 32, 34, and 36 is not particularly limited, but is preferably made of Pd or an Ag-Pd alloy. The thickness (length in the lamination direction) of each of the conductors 32, 34, and 36 is, for example, about 0.1 to 10 μm.

[0022] The first conductors 32 have a band-like shape with a uniform width, and extend along the opposing direction of the end faces 10a, 10b within a layer constituting the element body 10. One end 32a of the first conductors 32 is exposed at the end face 10a (first surface) and the other end 32b is located within the element body 10. The width of the first conductors 32 is, for example, 0.4 mm.

[0023] The second conductors 34 have a band-like shape with a uniform width, and extend in the opposing direction of the end faces 10a, 10b in a layer different from the layer in which the first conductors 32 are formed. One end 34a of the second conductors 34 is exposed to the end face 10b (second surface), and the other end 34b is located within the element body 10. The width of the second conductors 34 is designed to be the same as the width of the first conductors 32, and is, for example, 0.4 mm.

[0024] 2, the first conductors 32 and the second conductors 34 are aligned with each other when viewed from the stacking direction of the element body 10 (the opposing direction of the side surfaces 10c and 10d), and the ends 32b, 34b located within the element body 10 completely overlap in the stacking direction. The overlapping portion 40 formed by the overlapping end portions 32b of the first conductors 32 and 34b of the second conductors 34 has a rectangular shape whose long side direction is parallel to the opposing direction of the end faces 10a, 10b when viewed from the stacking direction.

[0025] The third conductor 36 has a band-like shape with a uniform width and extends in a layer located between the first conductor 32 and the second conductor 34. Therefore, in the stacking direction of the element body 10, the distance between the third conductor 36 and the first conductor 32 is substantially the same as the distance between the third conductor 36 and the second conductor 34. The third conductor 36 also extends along the opposing direction of the side surfaces 10e and 10f, and crosses the first conductor 32 and the second conductor 34 (orthogonal in this embodiment) when viewed from the stacking direction of the element body 10. One end 36a of the third conductor 36 is exposed to the side surface 10e, and the other end 36b of the third conductor 36 is exposed to the side surface 10f. The width of the third conductor 36 is narrower than the long side length of the overlapping portion 40, and is, for example, 0.12 mm.

[0026] Furthermore, the third conductors 36 have functional portions 36c that overlap with the overlapping portions 40 in the stacking direction of the element body. The third conductors 36 overlap with the first conductors 32 only at the overlapping portions 40, and also overlap with the second conductors 34 only at the overlapping portions 40. Therefore, the area of ​​the functional portions 36c matches the overlapping area between the third conductors 36 and the first conductors 32, and also matches the overlapping area between the third conductors 36 and the second conductors 34.

[0027] The functional portion 36c forms a first functional layer 42 between itself and the end 32b of the first conductor 32. The first functional layer 42 is an element part sandwiched between the functional portion 36c and the end 32b of the first conductor 32. The first functional layer 42 has a capacitance of, for example, about 20 to 50 pF. The functional portion 36c forms a second functional layer 44 between itself and the end 34b of the second conductor 34. That is, the second functional layer 44 is an element part sandwiched between the functional portion 36c and the end 34b of the second conductor 34. As described above, the third conductor 36 is spaced apart from the first conductor 32 and the second conductor 34 by substantially the same distance, and has substantially the same overlapping area as the first conductor 32 and the second conductor 34. Therefore, the second functional layer 44 has a capacitance substantially the same as that of the first functional layer 42.

[0028] The first electrode 20A of the terminal electrode 20 is disposed on the end face 10a side of the element body 10. The first electrode 20A is formed so as to cover the end face 10a and portions of the four side faces 10c to 10f close to the end face 10a. The first electrode 20A is also formed so as to cover one end 32a of the first conductor 32 exposed at the end face 10a of the element body 10, and the first electrode 20A is directly connected to the first conductor 32.

[0029] The second electrode 20B of the terminal electrode 20 is disposed on the end face 10b side of the element body 10. The second electrode 20B is formed so as to cover the end face 10b and portions of the four side faces 10c to 10f close to the end face 10b. The second electrode 20B is also formed so as to cover one end 34a of the second conductor 34 exposed at the end face 10b of the element body 10, and the second electrode 20B is directly connected to the second conductor 34.

[0030] The third electrodes 20C and 20D of the terminal electrode 20 form a pair and are disposed on the side surface 10e side and the side surface 10f side of the element body 10, respectively. Specifically, the third electrode 20C extends in the stacking direction at the midpoint of the long side of the rectangular side surface 10e and wraps around the side surfaces 10c and 10d, and the third electrode 20D extends in the stacking direction at the midpoint of the long side of the rectangular side surface 10f and wraps around the side surfaces 10c and 10d. The third electrodes 20C and 20D are also formed so as to cover both ends 36a and 36b of the third conductor 36 exposed on the side surfaces 10e and 10f of the element body 10, respectively, and the third electrodes 20C and 20D are directly connected to the third conductor 36.

[0031] Each of the electrodes 20A-20D may have a single-layer structure or a multi-layer structure. Each of the electrodes 20A-20D is, for example, a fired electrode, and is formed by applying a conductive paste to the surface of the element body 10 and firing it. The conductive paste is made by mixing a powder made of a metal (for example, Pd, Cu, Ag, or an Ag-Pd alloy) with a glass component, an organic binder, and an organic solvent. A plating layer can also be formed on such a fired electrode. The plating layer may include a Ni plating layer and a Sn plating layer formed on the Ni plating layer.

[0032] 3 and 4, the element body 10 has an alkali metal-containing portion 12 whose electrical resistance is increased by containing an alkali metal. The alkali metal-containing portion 12 is provided along the entire outer surfaces 10a-10f and constitutes the outer surfaces 10a-10f of the element body 10. The alkali metal-containing portion 12 also extends inward from the outer surfaces 10a-10f of the element body 10 along the interfaces between the element body 10 and the first conductors 32, second conductors 34, and third conductors 36. However, the alkali metal-containing portion 12 is designed not to reach the first functional layer 42 and the second functional layer 44.

[0033] An alkali metal is present in the alkali metal-containing portion 12, and the alkali metal is present in the form of a solid solution within the crystal grains of ZnO, or is present at the crystal grain boundaries of ZnO. When the alkali metal is present in the form of a solid solution within the crystal grains of ZnO, the alkali metal reduces donors in ZnO, which exhibits properties as an n-type semiconductor, lowering the electrical conductivity and making it difficult to exhibit varistor characteristics. It is believed that the presence of the alkali metal at the crystal grain boundaries of ZnO also lowers the electrical conductivity. Therefore, the alkali metal-containing portion 12 has a lower electrical conductivity and a lower electrostatic capacitance than the portions of the element body 10 other than the alkali metal-containing portion 12.

[0034] The alkali metal-containing portion 12 can be formed as follows. As the manufacturing method of the chip varistor 1 other than the process of forming the highly resistive alkali metal-containing portion 12 can utilize known processes used in the manufacturing method of a multilayer chip varistor, detailed explanations will be omitted here.

[0035] After obtaining element body 10, an alkali metal (for example, Li, Na, etc.) is diffused from the outer surface of element body 10 (the pair of end faces 10a, 10b and the four side faces 10c to 10f).

[0036] First, an alkali metal compound is applied to the outer surface of the element body 10. A closed rotary pot can be used to apply the alkali metal compound. There are no particular limitations on the alkali metal compound, but it is a compound that allows the alkali metal to diffuse from the surface of the element body 10 by heat treatment, and examples of the alkali metal compound include oxides, hydroxides, chlorides, nitrates, borates, carbonates, and oxalates.

[0037] Then, the element 10 to which the alkali metal compound is attached is heat-treated in an electric furnace at a predetermined temperature for a predetermined time. As a result, the alkali metal from the alkali metal compound diffuses from the outer surface of the element 10 to the inside. The preferred heat treatment temperature is 700 to 1000°C, and the heat treatment atmosphere is air. The heat treatment time (holding time) is preferably 10 minutes to 4 hours.

[0038] As described above, the portion of element body 10 into which the alkali metal element has diffused, i.e., alkali metal-containing portion 12, has high resistance and low capacitance. In this embodiment, although the alkali metal element diffuses from end faces 10a, 10b and side faces 10e, 10f, each of conductors 32, 34, 36 is exposed at corresponding end faces 10a, 10b and side faces 10e, 10f, so that there is no disruption to electrical connection between each of electrodes 20A-20D and each of conductors 32, 34, 36.

[0039] As described above, the chip varistor 1 includes two functional layers (i.e., the first functional layer 42 and the second functional layer 44) in the element body 10. The two functional layers 42, 44 have substantially the same capacitance. Furthermore, in the chip varistor 1, the alkali metal-containing portion 12 increases the resistance of the element body 10 from the outer surfaces 10a to 10f, but the alkali metal-containing portion 12 does not reach the first functional layer 42 and the second functional layer 44. Therefore, the alkali metal-containing portion 12 suppresses the parasitic capacitance of the chip varistor 1 (i.e., the capacitance other than the first functional layer 42 and the second functional layer 44 that occurs between any two of the first conductor 32, the second conductor 34, the third conductor 36, the first electrode 20A, the second electrode 20B, and the third electrodes 20C, 20D) without affecting the capacitance of the first functional layer 42 and the second functional layer 44. Therefore, the chip varistor 1 includes two functional layers 42, 44 in which the capacitance variation is suppressed.

[0040] The chip varistor 1 can be applied to a differential transmission transceiver 50 in the form shown in Fig. 5. The differential transmission transceiver 50 has two channels CH1 and CH2 between the transmitting side and the receiving side, with the first electrode 20A of the chip varistor 1 connected to one channel CH1 and the second electrode 20B connected to the other channel CH2, and both of the third electrodes 20C and 20D being grounded. In the differential transmission transceiver 50, the capacitance variation of the two functional layers 42 and 44 of the chip varistor 1 is suppressed, thereby reducing communication errors caused by the capacitance variation, and thereby achieving high signal accuracy.

[0041] 6, in a differential transmission transceiver 60 according to the prior art, different varistor elements are applied to the two channels CH1 and CH2. Therefore, capacitance variations tend to occur between the two varistor elements, making it difficult to reduce communication errors caused by the capacitance variations.

[0042] 3 and 4, in the chip varistor 1, the distance A from the position where the alkali metal-containing portion 12 reaches along the interface between the first conductor 32 and the element body 10 to the overlapping portion 40, and the distance A from the position where the alkali metal-containing portion 12 reaches along the interface between the second conductor 34 and the element body 10 to the overlapping portion 40 are longer than the distance B from the position where the alkali metal-containing portion 12 reaches along the interface between the third conductor 36 and the element body 10 to the overlapping portion 40. In the chip varistor 1, the alkali metal-containing portion 12, which is relatively difficult to transmit heat, is provided along the entire outer surfaces 10a to 10f. By designing the distance B to be shorter than the distance A, the dissipation of heat inside the element body 10 via the third conductor 36 is promoted, thereby making it possible to suppress failure and deterioration of the chip varistor 1.

[0043] Furthermore, in the chip varistor 1, the ratio (C / C') of the length of the first conductors 32 and the length of the second conductors 34 to the length C' of the element body 10 in the opposing direction of the side faces 10e, 10f is in the range of 0.1 to 0.6. Therefore, the chip varistor 1 has high ESD resistance and high reliability.

[0044] In order to optimize the C / C′ ratio, the inventors prepared a number of samples with different widths of the first conductor 32 and the second conductor 34, and measured the varistor voltage V lmA The ESD tolerance is based on the electrostatic discharge immunity test stipulated in the IEC (International Electrotechnical Commission) standard IEC61000-4-2, and is the change in the varistor voltage V when the discharge voltage (applied voltage) is changed. 1mA The experimental results are shown in the table in Figure 7.

[0045] As shown in the table of FIG. 7, eight samples were prepared in the experiment (i.e., sample 1 with a width of 0.06 mm, sample 2 with a width of 0.1 mm, sample 3 with a width of 0.2 mm, sample 4 with a width of 0.4 mm, sample 5 with a width of 0.6 mm, sample 6 with a width of 0.7 mm, sample 7 with a width of 0.8 mm, and sample 8 with a width of 0.9 mm). Varistor voltage V lmA Regarding C / C', sufficiently low values ​​were obtained in samples 1 to 6, but high values ​​were obtained in samples 7 and 8. Regarding ESD resistance, sufficiently high values ​​were obtained in samples 2 to 6, but low values ​​were obtained in samples 1, 7, and 8. These results show that high ESD resistance and high reliability can be obtained in samples 2 to 6, where the C / C' ratio is in the range of 0.1 to 0.6.

[0046] In the chip varistor 1, the ratio (D / D') of the length D of the third conductor 36 to the length D' of the third electrodes 20C, 20D in the opposing direction of the end faces 10a, 10b is in the range of 0.2 to 0.6. Therefore, the chip varistor 1 has high ESD resistance and high reliability.

[0047] In order to optimize the ratio of D / D′, the inventors prepared a number of samples with different widths of the third conductor 36 and measured the varistor voltage V lmA The experimental results are shown in the table in Figure 8.

[0048] As shown in the table of Figure 8, nine samples were prepared in the experiment (i.e., sample 1 with a width of 0.03 mm, sample 2 with a width of 0.06 mm, sample 3 with a width of 0.1 mm, sample 4 with a width of 0.12 mm, sample 5 with a width of 0.16 mm, sample 6 with a width of 0.18 mm, sample 7 with a width of 0.2 mm, sample 8 with a width of 0.24 mm, and sample 9 with a width of 0.3 mm). Varistor voltage V lmARegarding D, sufficiently low values ​​were obtained in samples 1 to 7, but low values ​​were obtained in samples 8 and 9. Regarding ESD resistance, sufficiently high values ​​were obtained in samples 3 to 9, but low values ​​were obtained in samples 1 and 2. These results show that high ESD resistance and high reliability can be obtained in samples 3 to 7, where the D / D' ratio is in the range of 0.2 to 0.6.

[0049] Although the preferred embodiments of the present invention have been described above, the present invention is not necessarily limited to the above-described embodiments, and various modifications are possible without departing from the spirit of the present invention.

[0050] For example, the outer dimensions of the chip varistor and the element body can be increased or decreased as appropriate. The dimensions of each conductor and each terminal electrode can also be increased or decreased as appropriate. Furthermore, the materials constituting the element body, each conductor, and each terminal electrode can be changed as appropriate to known materials applicable to chip varistors. [Explanation of symbols]

[0051] DESCRIPTION OF THE PREFERRED EMBODIMENTS 1...chip varistor, 10...element body, 12...alkali metal-containing portion, 20A...first electrode, 20B...second electrode, 20C, 20D...third electrode, 32...first conductor, 34...second conductor, 36...third conductor, 36c...functional portion, 40...overlapping portion, 42...first functional layer, 44...second functional layer, 50, 60...differential transmission transceiver, CH1, CH2...channel.

Claims

1. an element having a first surface and a second surface opposed to each other, and a third surface and a fourth surface opposed to each other in a direction intersecting a direction in which the first surface and the second surface oppose each other, the element having a laminated structure and including an alkali metal-containing portion; a first conductor extending along a direction in which the first surface and the second surface face each other in a predetermined layer of the element body; a second conductor extending in a layer different from the first conductor of the element body along the opposing direction between the first surface and the second surface and forming a first overlapping portion overlapping with the first conductor in the stacking direction of the element body; a third conductor that extends in a layer of the element body located between the first conductors and the second conductors in a direction intersecting the first conductors and the second conductors, crosses the first overlapping portion when viewed from the stacking direction of the element body, and overlaps with the first overlapping portion in the stacking direction of the element body to form an overlapping portion; a first electrode provided on the first surface side or the second surface side of the element body and connected to the first conductor; a second electrode provided on the first surface side or the second surface side of the element body and connected to the second conductor; a third electrode provided on either the third surface or the fourth surface of the element body and connected to the third conductor; Equipped with A chip varistor, in which the alkali metal-containing portion is not present in a first functional layer formed between the third conductor and a region of the first conductor corresponding to the folded portion, and in a second functional layer formed between the third conductor and a region of the second conductor corresponding to the folded portion.

2. 2. The chip varistor according to claim 1, wherein a length of the first conductor and a length of the second conductor in the opposing direction between the third surface and the fourth surface are shorter than a length of the first overlapping portion in the opposing direction between the first surface and the second surface.

3. The chip varistor according to claim 1 , wherein a length of the first overlapping portion in a direction in which the first surface and the second surface oppose each other is shorter than a length of the third electrode.

4. 4. The chip varistor according to claim 1, wherein the alkali metal-containing portion extends inward from the surface of the element body.

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