Method and apparatus for peeling off stamp

Abstract

To facilitate release of a stamp from a substrate.SOLUTION: The present invention relates to a method for releasing a stamp (17) from a substrate (12), in particular from a master stamp (12) and / or from a product, in which the stamp (17) is deformed towards the substrate (12) in order to release the stamp (17) from the substrate (12).SELECTED DRAWING: Figure 3d

Description

[Technical field]

[0001] The present invention describes a method and apparatus for peeling a stamp.

[0002] The prior art includes various devices and methods for producing stamps and for using stamps. Stamps are roughly differentiated into hard and / or soft stamps. One special form of soft stamps is the film stamp, which consists of a relatively thin film, on which the embossing pattern is formed. In this case, the film and the embossing pattern form the soft stamp. In the prior art, the use of soft stamps is particularly preferred. Soft stamps can be copied very quickly, although they do wear out faster than hard stamps. A precisely manufactured, very expensive hard stamp is used as a master stamp, from which the soft stamp is produced as a negative mold. This soft stamp is therefore a so-called working stamp. The product embossing material, which is to emboss the actual product, is therefore processed only by the soft stamp, while the hard stamp is safely stored and protected. However, a problem that frequently arises in the prior art remains the release of the soft stamp from the master stamp or from the product embossing material.

[0003] Hard stamps have a very long service life, but have the disadvantage that it is relatively difficult to perform the demolding without the risk of at least partial destruction of the pattern in the nanometer and / or micrometer range. In contrast, soft stamps wear out very quickly. Easy demolding is possible, among other things, as a result of their elasticity and very little bending resistance. Both properties allow the soft stamp to be pulled off or at least bent to such an extent that it can be pulled off continuously, i.e. stepwise, from the embossed material. Soft stamps, of course, have a very low hardness value and are therefore relatively prone to wear. Soft stamps must therefore be continually molded anew from the master stamp.

[0004] The object of the present invention is therefore to overcome the disadvantages of the prior art and in particular to facilitate the release of a stamp (= soft stamp), also referred to below as working stamp, from a master stamp (= hard stamp) and / or from an embossing material. This object is achieved by the subject matter of the parallel independent claims. All combinations of at least two of the features described in the description, the claims and / or the drawings are also within the scope of the invention. In the stated numerical ranges, the values ​​lying within the ranges are to be considered as disclosed as limit values ​​and are to be claimed in any combination.

[0005] The stamp according to the invention (=soft stamp) has in particular the following properties or comprises the following materials:

[0006] Polydimethylsiloxane (PDMS) Perfluoropolyether (PFPE) Polyhedral oligomeric silsesquioxanes (POSS) Polydimethylsiloxane (PDMS) Tetraethyl orthosilicate (TEOS) Poly(organo)siloxane (silicone) The stamp according to the invention (=soft stamp) can essentially come from one of the following material classes: ·Thermoplastics Elastomer Duroplast The master stamp, the embossing material, and the product are also referred to below as substrates.

[0007] The present invention relates to a method for releasing a stamp from a substrate, in particular from a master stamp, from an embossing material and / or from a product, in which the stamp is deformed towards the substrate in order to release the stamp from the substrate.

[0008] The present invention furthermore relates in particular and as an independent subject of the present invention to a method for producing a stamp on a support, comprising the following steps, in particular the following sequence: - applying an embossing material onto the master stamp; - contacting the embossing material with a support; - hardening the embossed material; - in particular a step of peeling the master stamp from the hardened embossing material by a method according to the above-mentioned embodiment, whereby the generated stamp remains on the support, and in order to peel the master stamp from the support, the support is deformed in the direction of the master stamp.

[0009] The present invention further relates, and in particular and as an exclusive subject of the present invention, to a method for manufacturing a product from an embossed material, comprising the following steps, and in particular the following sequence: - contacting the embossing material with the stamp; - hardening the embossed material; - peeling the stamp from the embossing material, in particular by a method according to the embodiments of the preceding claims, in which the stamp is deformed towards the product in order to peel it from the product.

[0010] The present invention further relates, in particular and as an exclusive subject of the present invention, to an apparatus for peeling a stamp from a substrate, in particular from a master stamp, from an embossing material and / or from a product, in which the stamp is deformable in the direction of the substrate in order to peel the stamp from the substrate.

[0011] The invention furthermore relates in particular as an exclusive subject matter to an apparatus for producing a stamp on a support, in particular by a method according to the features of the claims below, comprising: - application means for applying an embossing material onto the master stamp; contact means for contacting the embossing material with the support; - a hardening means for peeling the master stamp from the hardened embossing material, whereby the produced stamp remains on the support, and the support is deformable in the direction of the master stamp in order to peel the master stamp from the stamp.

[0012] The invention further relates, and in particular and as an exclusive subject of the invention, to an apparatus for producing products from an embossed material, comprising: - contact means for contacting the embossing material with the stamp; - hardening means for hardening the embossing material; - peeling means for peeling the stamp from the embossing material, and deformation means are provided for deforming the stamp towards the product in order to peel the stamp from the product.

[0013] Preferably, it is envisaged that the stamp and / or the support is deformed or deformable by positive pressure.

[0014] Furthermore, it is preferred that the greatest deformation occurs in the centre of the stamp and / or support, in particular that this deformation occurs symmetrically with respect to the centre of the stamp and / or support.

[0015] Furthermore, the deformation of the stamp and / or the support is preferably carried out from the inside out, in particular from the centre of the stamp and / or the support towards the edge of the stamp and / or the support.

[0016] Furthermore, for peeling, it is preferred to move the substrate and the stamp and / or support away from each other, especially simultaneously with deformation of the stamp and / or support.

[0017] Furthermore, it is preferred that the stamp is peeled off from the outside to the inside, in particular from the edge of the stamp towards the center of the stamp.

[0018] Furthermore, it is preferred that the deformation results in the stamp and / or the support being convexly shaped and / or rounded.

[0019] Furthermore, for peeling, it is preferred to move the master stamp and the support away from each other, especially simultaneously with deformation of the support.

[0020] It is further preferred that the support is a film and / or that the stamp is a film stamp.

[0021] In another embodiment, it is envisaged that the support is a very thin and flexible glass plate, in particular thinner than 20 mm, preferably thinner than 10 mm, more preferably thinner than 5 mm, even more preferably thinner than 2 mm and most preferably thinner than 1 mm.

[0022] Furthermore, the device has at least one support deformation element for deforming the support and / or at least one stretching element for stretching the support, the support being preferably tensioned in particular by the support deformation element.

[0023] Furthermore, the support-deforming element preferably has at least one support-deforming element ridge, which lifts the support from the support-deforming element and / or stretches the support.

[0024] Furthermore, the support deformation element has at least one fixing element which serves, in particular for dynamic fixing, of the support, and preferably the at least one fixing element is switchable so that gas and / or gas mixtures can be supplied to the intermediate chamber between the support deformation element and the support via the at least one fixing element.

[0025] Furthermore, it is preferred that at least one tensioning element is a fluid element, via which gas and / or a gas mixture can be supplied in order to generate a positive pressure between the support deformation element and the support.

[0026] In another exemplary embodiment, it is provided that instead of the support deformation element being located specifically behind the support, the support is held by a frame, whereby even if a frame is used, the tension element is located in the usual way behind the support.

[0027] The core of the invention is the fixation of the stamp, which allows in particular the release of the stamp (=soft stamp) from the master stamp and / or from the embossing material and / or from the product, taking place in the direction from the edge towards the centre.

[0028] In a particular embodiment, this fixing is designed so that an endless film can be used, on the one hand, on which a number of stamps can be formed, which can be fixed in such a way that no significant distortion of the embossed pattern occurs, and on the other hand, the release of the embossed pattern or stamp can take place successively from the outside to the inside.

[0029] The demolding is particularly controllable from the outside in. The embodiment including the endless film makes it possible to provide an embossing apparatus that can automatically produce soft stamps with only one master stamp.

[0030] A particular advantage of the embodiment and process according to the invention is that the release of the stamp is independent of the size of the substrate, in particular of its thickness: during the deformation process, the substrate can remain perfectly flat and fixed, while the stamp is released from the substrate by the deformation according to the invention, in particular by the generated convex curvature, and in particular continuously from the outside to the inside, from the substrate, thereby preventing damage to the substrate.

[0031] A further advantage is the absence of an exclusion zone: the pattern can be embossed up to the outermost edge of the substrate, since for separation there is no need to introduce objects such as blades that could destroy the components and the pattern at the edge of the substrate.

[0032] Embodiments according to the present invention can essentially be embossed into substrates of any size and shape, provided that the substrate is appropriately configured.

[0033] A further advantage according to the invention is in particular the reusability of the support of the stamp: if the pattern on the support becomes destroyed or worn away after multiple applications, the support can be replaced or moved further to produce a new, defect-free working stamp.

[0034] A further advantage according to the invention is, in particular, that the stamp can reach the entire surface of the wafer to be embossed and can even emboss the exclusion zone, which is due, inter alia, to the fact that all forming and deforming components are located behind the stamp or its carrier and therefore the stamp is not limited laterally by any components.

[0035] A further advantage of the present invention over the prior art is in particular that not only the substrate that is not to be embossed is released from the stamp, but preferably the stamp is released from the substrate. The release of the stamp from the substrate is indeed assisted by the translational movement of the substrate away from the stamp, but the main release is based on the curvature of the support or the curvature of the stamp according to the invention. This makes it possible according to the present invention to emboss very thin substrates, since the substrate can be fixed all over and there is no need to curve the substrate itself, and the stamp can then be released without destroying the substrate.

[0036] A further advantage of the invention is, inter alia, that in the embossing process the stamp or the support is in a rigid state and in the demolding process the stamp or the support is in a flexible state, in which the stamp is stabilized by the support and / or by a component located behind the support, so that the stamp can be subjected to a pressure load and in the demolding process the stamp and the support can be deformed.

[0037] The release behavior of the stamp is highly sensitive and can be adjusted by the thickness of the support, which is in particular thinner than 5 mm, preferably thinner than 1 mm, more preferably thinner than 0.1 mm, even more preferably thinner than 0.01 mm, most preferably thinner than 0.001 mm.

[0038] The embodiment according to the invention can be utilized on the one hand for the manufacture of a stamp and on the other hand for the use of the stamp for an embossing process, so that, unlike the prior art, two separate embodiments are no longer necessary.

[0039] In the prior art, a back plane is very often used, which must be coated before the stamp is produced, in particular to ensure adhesion to the working stamp embossing material. The back plane preferably used according to the present invention can already have a corresponding coating when delivered, so that the coating process at the stamp manufacturer is omitted, which saves costs and time.

[0040] An embodiment according to the invention particularly relates to an apparatus capable of producing a stamp on a support.

[0041] The device according to the invention in particular has at least one support deformation element, by means of which the support can be tensioned, which preferably has at least one support deformation element ridge, which raises the support stamp side of the tensioned support from the rest of the support deformation element.

[0042] The support deformation element has in particular at least one fastening element, which serves in particular for a dynamic fastening of the support. The fastening element of the support deformation element can in particular be switched on and off. The fastening element serves in particular for a as stress-free holding of the support as possible.

[0043] The fixing element or elements may include: Vacuum fixing devices, in particular -Individually controllable vacuum tracks · Interconnected vacuum tracks The vacuum fixing element has Mechanical fixing devices, especially Clamps Electrical fixing devices, especially Electrostatic Fixation Device Magnetic fastening device Adhesive fixing parts, especially -Gel pack fixing part Fixtures with adhesive, particularly actuable, surfaces It is.

[0044] At least one of the fastening elements is controllably operable, in particular electronically. A vacuum fastening device is a preferred form of fastening element. The vacuum fastening device preferably comprises a plurality of vacuum tracks which run out from the surface of the support deformation element. The vacuum tracks are preferably individually controllably operable.

[0045] In a preferred application, several vacuum tracks are joined together to form vacuum track segments which can be individually controlled and therefore evacuated or fluid-passed. Of course, each vacuum segment is independent of the other vacuum segments. This allows for individually controllable vacuum segments to be formed. The vacuum segments are preferably configured in the shape of a ring. This allows for a radially symmetrical fastening of the substrate and / or a release of the substrate from the probe holder, in particular from the inside to the outside, in an expedient manner. Another preferred shape of the vacuum segments is a rectangle.

[0046] The support deformation element in particular has at least one element for lifting the support from the support deformation element. Lifting of the support is also called stretching in the following; the element or elements which cause the stretching are also called stretching elements. Preferably, the at least one stretching element is a fluid element through which gas and / or gas mixtures can flow in order to generate a positive pressure between the support deformation element and the support.

[0047] In a very particular embodiment according to the invention, at least one vacuum segment already mentioned above, which functions as a fixing device, can be switched so that gas and / or gas mixtures can be pumped via this vacuum segment into the intermediate space between the support deformation element and the support. Thus, at least one fixing element can be used at the same time as a tensioning element. If other fixing elements are to be used, the tensioning elements are provided separately and independently of the fixing elements.

[0048] At least one support deformation element preferably has rounded edges which deflect the support in as gentle a manner as possible, the radius of the rounded edges being greater than 0.1 mm, preferably greater than 1 mm, more preferably greater than 5 mm, even more preferably greater than 10 mm, most preferably greater than 30 mm.

[0049] The support body is preferably fixed on at least two sides, in particular on opposite sides, by externally engaging, in particular mechanical, fastening units which are independent of the support body deformation element.

[0050] In order to measure and monitor the force with which the support is fixed to the support deformation element, the fixing unit in particular incorporates a load cell, in particular the support should not and cannot be damaged by the fixing unit.

[0051] The fixing unit is particularly useful for roughly fixing the support. The force that can be applied to the support by the fixing unit is preferably adjustable. The force used is 0.001N to 1000N, preferably 0.01N to 500N, more preferably 0.1N to 100N, even more preferably 1N to 50N, and most preferably 1N to 25N.

[0052] It is appropriate to specify the pressure that may be applied to the support so that no damage to the support occurs. The above-mentioned force values ​​are expressed on a per square meter basis to obtain corresponding pressure values. The pressure is 0.001 MPa to 1000 MPa, preferably 0.01 MPa to 500 MPa, more preferably 0.1 MPa to 100 MPa, even more preferably 1 MPa to 50 MPa, and most preferably 1 MPa to 25 MPa.

[0053] Microcracks occurring in the support are preferably completely closed by the working stamp embossing material during the manufacturing process of the working stamp.

[0054] Embossing Material In this document, a distinction is made in particular between work stamp embossing materials and product embossing materials: work stamp embossing materials are embossing materials from which the work stamp (=stamp, soft stamp) is produced; product embossing materials are embossing materials that are embossed by the work stamp to produce the desired product.

[0055] The stamp embossing material and the product embossing material may be different. Preferably, the difference between the working stamp embossing material and the product embossing material is the hydrophobicity or hydrophilicity of these materials. The measure of hydrophobicity or hydrophilicity is the contact angle formed between a test drop, especially water, and the surface to be measured. A hydrophilic surface flattens the drop because the adhesive forces between the liquid and the surface dominate over the cohesive forces of the liquid, thus forming a small contact angle. A hydrophobic surface causes the drop to have a more spherical shape because the cohesive forces of the liquid dominate over the adhesive forces between the liquid and the surface.

[0056] A common method for determining hydrophobicity or hydrophilicity is the contact angle method. The contact angle method is used in conjunction with Young's law to obtain information about the surface energy of a solid with a test liquid. This method allows the surface energy of a surface to be evaluated with a given test liquid, mainly water. Corresponding measurement and evaluation methods are known to those skilled in the art. The contact angle determined by the contact angle method is expressed in N / m or J / m 2 This can be converted to a surface energy in units of 1000 nm. For relative comparisons of different surfaces in the same test liquid, the contact angle information is of course already sufficient to obtain a relative estimate of the adhesive strength of the surfaces. Thus, by using water as the test liquid, it can be said that a wetted surface which makes a contact angle of about 30° with a water drop has a higher adhesiveness than a surface which makes a contact angle of about 120° with a water drop.

[0057] In a preferred embodiment of the present invention, the adhesion of the working stamp material by surface energy is less than 0.1 J / m 2 Less than 0.01 J / m 2 Less than 0.001 J / m 2 Less than 0.0001 J / m 2 Less than 0.00001 J / m 2 It is expected that the standard will be set at less than 100%.

[0058] Alternatively or additionally, according to an advantageous embodiment of the invention, it is envisaged that the adhesion of the contact surface is defined by a contact angle of more than 20°, in particular more than 50°, preferably more than 90°, more preferably more than 150°. The adhesion of a surface to other materials can be determined using the contact angle method described above. In this case, a drop of a known liquid, preferably a drop of water (value according to the invention for water), (alternatively glycerin or hexadecane) is dropped onto the surface to be measured. Using a microscope, the angle is precisely measured from the side, i.e. between the tangent of the drop and the surface.

[0059] The embossing material used according to the present invention preferably has a viscosity of 1 cp to 25000 cp, preferably 10 cp to 25000 cp, more preferably 100 cp to 25000 cp, even more preferably 1000 cp to 25000 cp, and most preferably 10000 cp to 25000 cp.

[0060] Device In a first preferred embodiment of the invention, the support is placed on the support deformation element. The support is preferably a film. The film is first pre-fixed by a dynamic support clamping device, preferably a vacuum element. Lateral clamping is then performed by a static support clamping device. This embodiment is designed to accommodate cut films or finite rigid supports. In particular, the size of the support is designed so that the static support clamping device can clamp the support. This embodiment has at least one stretching element that can stretch the support. Preferably, the dynamic clamping device simultaneously functions as a stretching element.

[0061] In another preferred embodiment according to the invention, a stamp support device is disclosed that uses an endless film along which a plurality of stamps can be produced. The endless film is preferably delivered as a roll and is attached to a first shaft. A second shaft allows the protective film to be wound and removed from the endless film. The endless film can be guided through further elements and is guided between a first static support clamping device and a support deformation element. The endless film passes through a static support clamping device and a second static support clamping device and is finally wound up on a third shaft.

[0062] The static support clamping device consists of a movable clamping unit, which can clamp the endless film, in particular to the support deformation element, so that the endless film is prevented from sliding. In this state, parts of the endless film can be provided with a corresponding embossed pattern. This embodiment has at least one stretching element, which can stretch the support. Preferably, the dynamic clamping device simultaneously functions as the stretching element.

[0063] The film of the present invention can be preloaded with a force of 1N to 1000N, preferably 2N to 800N, more preferably 5N to 600N, even more preferably 8N to 400N, and most preferably 10N to 100N.

[0064] The device according to the invention can be present as a modular part of a cluster, which means an assembly of several interconnected modules, which are in particular all vacuum-tightly connected to one another, so that the substrate can be transported between the modules without coming into contact with the external atmosphere.

[0065] Each module can preferably be evacuated individually. The entire cluster can be evacuated. The pressure in each module and / or the entire cluster is preferably less than 1 bar, preferably less than 10 -1 mbar, more preferably less than 10 -3 mbar, and even more preferably less than 10 -5 mbar, most preferably less than 10 -7 It may be adjusted to less than mbar.

[0066] The modules and / or clusters can also be flushed, in particular with a gas and / or gas mixture. The modules and / or clusters can in particular be placed under positive pressure. In this case, the pressure is adjusted to 1 bar to 5 bar, preferably 1 bar to 4.5 bar, more preferably 1 bar to 4 bar, even more preferably 1 bar to 3.5 bar, most preferably 1 bar to 3 bar.

[0067] The modules in a cluster are in particular connected to one another by a central module in which is preferably located a robot capable of transferring substrates between storage containers (English: Foup) and / or between the modules.

[0068] method In a first preferred method of the invention, a support is fixed to the device according to the invention.

[0069] In a first process step, the working stamp embossing material is separated onto the master stamp by a separating device. Preferably, the working stamp embossing material is already distributed as evenly and completely as possible.

[0070] In a second process step, the device according to the invention is aligned relative to the master stamp. A movement of the device according to the invention and / or the master stamp is possible. However, preferably, the master stamp is moved. The alignment can be performed mechanically and / or optically. It is conceivable that the master stamp is only roughly positioned relative to the device according to the invention. However, preferably, the alignment of both objects is performed on the basis of alignment marks. The alignment marks can be located on the support deformation element and / or on the support. However, preferably, the alignment marks are located on the support.

[0071] In the third process step, contact is made between the support and the working stamp embossing material. By applying pressure, the working stamp material is flattened against the support and the master stamp pattern is negatively imprinted in the working stamp material.

[0072] The fourth process step involves hardening the working stamp embossing material, which can be hardened thermally and / or by electromagnetic radiation.

[0073] The thermal curing is carried out at a temperature of 0°C to 500°C, preferably 50°C to 450°C, more preferably 100°C to 400°C, even more preferably 150°C to 350°C, and most preferably 200°C to 300°C.

[0074] The electromagnetic radiation preferably has a wavelength in the range of 10 nm to 2000 nm, preferably 50 nm to 1500 nm, more preferably 100 nm to 1000 nm, even more preferably 150 nm to 500 nm, and most preferably 200 nm to 370 nm.

[0075] In a fifth process step, the support with the hardened working stamp embossing material is peeled off from the master stamp by stretching the support with a stretching element. Preferably, a gas or a gas mixture is flowed between the support deformation element and the support via a dynamic support clamping device consisting of a vacuum element, which generates a support that is convexly curved as viewed from the outside. The support is thus peeled off from the outside towards the inside.

[0076] In a sixth process step, the support is clamped again via a dynamic support clamping device.

[0077] In a second preferred method of the invention, an endless film as support is fixed in the device according to the invention.

[0078] The first six process steps of the second method are substantially the same as the first six process steps of the first method.

[0079] In a seventh process step, the endless film is released by retracting the static support clamping device of the clamping unit to release the endless film, which is then or simultaneously wound up on a third roll, thereby separating the produced working stamp embossing material from the support deformation element and providing new areas of the endless film for embossing.

[0080] This makes it extremely easy to produce multiple working stamps on one endless film.

[0081] In a third preferred method according to the present invention, a working stamp produced by one of the above-mentioned methods is used for embossing a product embossing material. From the product embossing material, the product to be actually produced is produced. Preferably, the product embossing material is applied onto a substrate, and the substrate is aligned relative to the working stamp. Then, an embossing step, a curing step, and a demolding step are performed.

[0082] Further advantages, features and details of the present invention will become apparent from the following description of preferred embodiments and the drawings. [Brief description of the drawings]

[0083] [Figure 1a] FIG. 1 is a side view showing a first embodiment of the present invention. [Figure 1b] FIG. 1 is a bottom view of a first embodiment of the present invention. [Figure 2a] FIG. 2 shows a first process step of a first method according to the invention. [Figure 2b] FIG. 2 shows a second process step of the first method according to the invention. [Figure 2c] FIG. 2 shows a third process step of the first method according to the invention. [Figure 2d] FIG. 4 illustrates a fourth process step of the first method according to the present invention. [Figure 2e] FIG. 2 shows a fifth process step of the first method according to the present invention. [Figure 2f] FIG. 10 shows a sixth process step of the first method according to the present invention. [Figure 3a] FIG. 2 shows a second process step of a second method according to the invention. [Figure 3b] FIG. 4 shows a third process step of the second method according to the invention. [Figure 3c] FIG. 4 shows a fourth process step of the second method according to the invention. [Figure 3d] FIG. 4 shows a fifth process step of the second method according to the present invention. [Figure 3e] FIG. 10 shows a sixth process step of the first method according to the present invention. [Figure 3f] FIG. 7 illustrates the seventh process step of the second method according to the invention.

[0084] In the drawings, identical or functionally identical components are marked with the same reference numbers.

[0085] FIG. 1a shows a side view of a first stamp device 1 according to the invention, which is manual, and which is provided with at least two fastening units 4, by means of which the support 3 can be fastened, in particular on two opposite sides. Both fastening units 4 are preferably connected to the support deformation element 2. The support deformation element 2 preferably has a support deformation element ridge 2e, via which the support 3 can be tensioned. The fastening unit 4 consists, for example, of a static support fastening device 5, a spacer part 7 and an upper part 8. These components 5, 7 and 8 can be removably fastened to one another by fastening elements 9, in particular screws. The support deformation element 2 is preferably transparent for the wavelength range of the electromagnetic radiation used for hardening the working stamp embossing material. The support deformation element 2 has dynamic fastening elements 6 (hereinafter also called dynamic support fastening devices) which can be switched on and off. The fastening elements 6 can be distributed arbitrarily over the support deformation element surface 2o. The number of fastening elements 6 used is in particular more than 2, preferably more than 5, more preferably still more than 10, very preferably more than 50, most preferably more than 100. In a very particularly preferred embodiment according to the invention, the fastening elements 6 are individually controllable. The fastening elements 6 can preferably be controlled in such a way that a convex deformation of the support body 3, as viewed from the outside, can be produced. This is particularly easily possible by forming the fastening elements 6 as channels which not only serve to evacuate the intermediate region between the support body 3 and the support body deformation element 2, but can also be used to generate positive pressure. The fastening elements 6 are therefore preferably channels which can generate a vacuum or a positive pressure. A further use according to the invention of the fastening elements 6 consists in that a distortion-free fastening of the support body 3 can be carried out by means of them before a relatively distortion-prone fastening via the static support body fastening device 5 of the fastening unit 4 takes place.This ensures that the support 3 is not or only very slightly distorted in the areas that are to be stamped in the subsequent embossing process. The support 3 is clamped on the left and right sides between the outer parts of the support deformation element 2 and a static support fastening device 5. Furthermore, alignment marks 14 are arranged on the surface of the support deformation element.

[0086] Fig. 1b shows a bottom view of the first device 1 according to the invention, which is manual. The fastening elements 9, in particular the screws, which serve for a removable screw fastening of the components 5, 7 and 8 are visible. The dynamic support fastening device 6 is shown as a single vacuum channel with a rectangular shape all around. The circular area 16 indicates the stamp area 16 which is subsequently embossed by a stamp. The stamp areas can of course each have any size and shape, but are shown circular in relation to the circular standard wafer shape in the semiconductor industry.

[0087] FIG. 2a shows a first process step according to the present invention of a first method according to the present invention, in which a working stamp embossing material 11 is applied via a separating device 10 onto a master stamp surface 12o of a master stamp 12 having a plurality of master stamp patterns 13.

[0088] 2b shows a second process step according to the invention of the first method according to the invention, in which the manual first stamping device 1 according to the invention is aligned relative to the master stamp 12 with the aid of alignment marks 14. The alignment marks 14 of the master stamp 12 and the alignment marks 14 of the stamping device 1 are in this case aligned with one another by means of preferably optical alignment elements 15. It is also conceivable to roughly align the stamping device 1 relative to the master stamp 12 purely mechanically, in particular without the aid of alignment elements 15 and alignment marks 14.

[0089] 2c shows a third process step according to the invention of the first method according to the invention, in which contact is made over the support stamp side 3s between the support 3 and the working stamp embossing material 11. By such contact the working stamp embossing material 11 is flattened.

[0090] 2d shows a fourth process step according to the invention of the first method according to the invention, in which the working stamp embossing material 11 is hardened. The hardening can be carried out thermally, but preferably also electromagnetically, in particular by means of UV light. The hardening is preferably carried out by the carrier deformation element 2. When using electromagnetic radiation, the carrier deformation element 2 must be sufficiently transparent in the corresponding wavelength range to cause a corresponding hardening of the working stamp embossing material 11.

[0091] FIG. 2e shows the fifth process step according to the invention of the first method according to the invention, in which the inventive detachment of the stamp 17 (hereinafter also called working stamp) generated according to the invention takes place. In this case, the support 3 is separated from the support deformation element 2. This detachment takes place in particular by means of a positive pressure of a fluid flowing through the dynamic support clamping device 6 formed as a vacuum track. It is also conceivable that elements are present that can generate a corresponding curvature of the support 3 and thus of the stamp 17 independent of the dynamic support clamping device 6. For example, additionally integrated nozzles are conceivable. It is also conceivable to electrostatically charge the support 3 and to push it away from the support deformation element 2 by means of a second potential of the same polarity through an element in the support deformation element 2. According to the invention, the hardened working stamp embossing material 11 is peeled off from the master stamp 12, in particular continuously, from the outside inwards. With this type of detachment, the hardened stamp material 11 is peeled off in a particularly gentle manner from the master stamp pattern 13 of the master stamp 12. This allows the stamp 17 generated in this way to be produced without defects.

[0092] Figure 2f shows a sixth process step according to the invention, in which the support 3, which together with the hardened embossing material 11 forms the stamp 17, is again completely fixed on the support deformation element 2. In this case, this fixing is again performed via the dynamic support clamping device 6. The stamp 17 thus generated can now be used for the embossing process of the embossing material. The release of the stamp 17 from the embossing material in the subsequent embossing process can be performed exactly the same as the release of the stamp 17 from the master stamp 12 according to Figure 2e.

[0093] FIG. 3a shows the second process step according to the invention with a second stamping device 1' according to the invention. The first process step according to the invention is similar to the process step of FIG. 2a and is therefore not shown again here. The second stamping device 1' according to the invention is a device with a roll system. On the roll 18a, the support 3' is located, which can be covered with a protective film 19. The support 3' is an "endless film" in contrast to the support 3 of the first embodiment according to the invention. The support 3' is tensioned via the support deformation element 2 and wound up on a roll 18c. The protective film 19 can be pulled off and wound up on a roll 18b. The fastening unit 4' is designed so that the support 3' can be clamped, in particular laterally. The clamping of the support 3' is preferably performed by an angled static support fastening device 5', the clamping surface 5k' of which is parallel to the opposite support deformation element clamping surface 2k. The angle α between the support deforming element clamping surface 2k and the support deforming element back surface 2r is in this case between 0° and 90°, preferably between 5° and 85°, even more preferably between 10° and 80°, even more preferably between 15° and 75° and most preferably between 20° and 70°. In an embodiment according to the invention, preferably the master stamp 12 moves below the stamping device.

[0094] Figure 3b shows a third process step according to the invention with a second stamp device 1' according to the invention. The stamp device 1' is preferably designed to be totally stationary, so that the master stamp 12 moves towards the support 3' in order to bring the working stamp embossing material 11 into contact with the support 3'.

[0095] FIG. 3c shows a fourth process step according to the invention, similar to the process step of FIG. 2d, with a second stamp device 1' according to the invention.

[0096] FIG. 3d shows a fifth process step according to the invention, similar to the process step of FIG. 2e, with a second stamp device 1' according to the invention.

[0097] FIG. 3e shows a sixth process step according to the invention with a second stamp device 1' according to the invention, similar to the process step of FIG. 2f.

[0098] 3f shows the seventh process step according to the invention with a second stamping device 1' according to the invention, in which the fixing unit 4' is opened so that the support 3 can be moved further by the rolls 18a, 18c. According to the invention, this then involves the removal of the working stamp 17 from the support deforming element 2. By winding the support 3' onto the roll 18c, a new unused section 3u of the support 3' is brought under the support deforming element 2 and can be provided with embossing material anew by process steps 3a to 3d. [Explanation of symbols]

[0099] 1,1' Stamping device 2. Support deformation element 2e Support deformation element protuberance 2o Support deformation element surface 2r Support deformation element back 2k Support deformation element clamping surface 3,3' support 3u Unused support classification 3s Support stamp side 4,4' Fixed Unit 5,5' static support fixture 5k' Clamping surface 6 Dynamic support fixtures / fixing elements 7 Spacer part 8 Upper part 9 Fixed elements 10 Separation device 11 Working with stamp embossing materials 12 Master Stamp 12o Master Stamp Surface 13 Master Stamp Patterns 14 Alignment Mark 15 Alignment Elements 16 Stamp Area 17 Stamps / Working Stamps 18a, 18b, 18c Roll 19 Protective film α angle

Claims

1. A method for peeling a stamp (17) from a substrate (12), comprising the steps of: Contacting the stamp (17) with an endless film; deforming the stamp (17) towards the substrate (12) to peel the stamp (17) from the substrate (12); A method according to claim 1, characterized in that the endless film is fixed in such a way that the release of the stamp (17) can be carried out continuously from the outside to the inside.

2. The method of claim 1 , wherein the stamp (17) is deformed by positive pressure.

3. Method according to claim 1 or 2, characterized in that the maximum deformation takes place in the centre of the stamp (17).

4. 4. The method according to claim 1, wherein the deformation of the stamp (17) is from the inside to the outside.

5. The method according to any one of claims 1 to 4, wherein for peeling, the substrate (12) and the stamp (17) are moved away from each other.

6. 6. The method according to claim 1, wherein the stamp (17) is peeled off from the outside to the inside.

7. A method for producing a stamp (17) on an endless film (3'), comprising the steps of: Applying an embossing material (11) onto a master stamp (12); contacting said embossing material (11) with said endless film (3'); hardening said embossing material (11); peeling the master stamp (12) from the hardened embossing material (11), whereby the generated stamp (17) remains on the endless film (3'); 1. The method of claim 1, further comprising: deforming the endless film (3') towards the master stamp (12) in order to peel the master stamp (12) from the stamp (17); A method according to claim 1, characterized in that the endless film is fixed in such a way that the release of the stamp (17) can be carried out continuously from the outside to the inside.

8. A method for producing a product from an embossed material (11), comprising the steps of: contacting said embossing material (11) with a stamp (17); hardening said embossing material (11); Peeling the stamp (17) from the embossing material (11); 1. The method of claim 1, further comprising: Contacting the stamp (17) with an endless film; Deforming the stamp (17) towards the product in order to peel the stamp (17) off the product; A method according to claim 1, characterized in that the endless film is fixed in such a way that the release of the stamp (17) can be carried out continuously from the outside to the inside.

9. An apparatus for peeling a stamp (17) from a substrate (12), comprising: contacting means for contacting said stamp (17) with an endless film; a deformation means for deforming the stamp (17) towards the substrate (12) in order to peel the stamp (17) from the substrate (12); a fixing means for fixing the endless film so that the release of the stamp (17) can be performed continuously from the outside to the inside; An apparatus comprising:

10. An apparatus for producing a stamp (17) on an endless film (3'), comprising: an application means (10) for applying an embossing material (11) onto a master stamp (12); contacting means for contacting said embossing material (11) with said endless film (3'); - a hardening means for peeling the master stamp (12) from the hardened embossing material (11), whereby the generated stamp (17) remains on the endless film (3'); a deformation means for deforming the endless film (3') towards the master stamp (12) in order to peel the master stamp (12) from the stamp (17); a fixing means for fixing the endless film so that the release of the stamp (17) can be performed continuously from the outside to the inside; An apparatus comprising:

11. An apparatus for producing a product from an embossing material (11), comprising: contacting means for bringing the embossing material (11) into contact with a stamp (17); a hardening means for hardening the embossing material (11); contacting means for contacting the embossed material (11) with an endless film; a peeling means for peeling the stamp (17) from the embossing material (11); a deformation means for deforming said stamp (17) towards the product in order to peel said stamp (17) from said product; a fixing means for fixing the endless film so that the release of the stamp (17) can be performed continuously from the outside to the inside; An apparatus comprising:

12. 12. The device according to claim 9, further comprising at least one deformation element (2) for deforming the endless film (3') and / or at least one stretching element for stretching the endless film (3'), the endless film (3') being tensioned by the deformation element (2).

13. 13. The device according to claim 12, wherein the deformation element (2) has at least one deformation element ridge (2e), which lifts the endless film (3') from the deformation element (2) and / or stretches the endless film (3').

14. 14. Apparatus according to claim 12 or 13, characterized in that the deformation element (2) comprises at least one fastening element (6) serving for fastening the endless film (3').

15. 15. Apparatus according to any one of claims 12 to 14, wherein the at least one tensioning element is a fluid element, via which a gas and / or a gas mixture can be supplied in order to generate a positive pressure between the deformation element (2) and the endless film (3').

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