Illumination module and illumination device including same

JP7638293B2Active Publication Date: 2025-03-03LG INNOTEK CO LTD
View PDF 1 Cites 0 Cited by

Patent Information

Application Number
JP2022554244
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Priority Date
2020-03-09
Filing Date
2021-03-08
Publication Date
2025-03-03
Estimated Expiration
2041-03-08

AI Technical Summary

Benefits of technology

【0008】 発明の実施例によれば、照明モジュールにおいて同じ発光領域で異なるカラーの光を提供することができる。発明の実施例によれば、発光部と非発光部を備え、発光部および非発光部から放出された光を発光部の表面を通じて放出することができる。発明の実施例は、照明モジュールの光効率および配光特性を改善することができる。発明の実施例は、照明モジュールの樹脂層の外観イメージと発光イメージの色度差を減らすことができる。発明の実施例は、点灯または未点灯に応じたランプの色を改善することができる。発明の実施例に係る照明モジュールおよびこれを有する照明装置または車両ランプの光学的信頼性を改善することができる。発明の実施例は、照明モジュールを有するライトユニット、各種表示装置、面光源照明装置または車両用ランプに適用することができる。

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure 0007638293000001
    Figure 0007638293000001
  • Figure 0007638293000002
    Figure 0007638293000002
  • Figure 0007638293000003
    Figure 0007638293000003
Patent Text Reader

Abstract

The lighting module disclosed in the examples includes a circuit board, a plurality of first light-emitting elements arranged on a first region of the circuit board, a plurality of second light-emitting elements arranged on a second region of the circuit board, a resin layer including a first resin portion that seals the plurality of first light-emitting elements and a second resin portion that seals the plurality of second light-emitting elements, a phosphor portion arranged between the first resin portion and the second resin portion, a diffusion layer arranged on top of the first resin portion, and a reflective layer arranged on the upper surface and outer surface of the second resin portion, wherein each of the plurality of first light-emitting elements and the plurality of second light-emitting elements has at least one row in a first direction and is arranged in a second direction perpendicular to the first direction, and the width of the second resin portion in the first direction may be smaller than the width of the first resin portion.
Need to check novelty before this filing date? Find Prior Art

Description

[Technical field]

[0001] An embodiment of the invention relates to a lighting module that provides different colors of light.

[0002] An embodiment of the invention relates to a lighting device, a light unit or a vehicle lamp having a lighting module. [Background technology]

[0003] Light-emitting diodes (LEDs) have advantages such as low power consumption, semi-permanent lifespan, fast response speed, safety, and environmental friendliness compared to existing light sources such as fluorescent lamps and incandescent lamps. Such light-emitting devices are applied to various lighting devices such as various display devices and interior and exterior lights. Recently, lamps employing light-emitting devices have been proposed as light sources for vehicles. Compared to incandescent lamps, light-emitting devices have the advantage of low power consumption. Furthermore, light-emitting diodes are small in size, allowing greater freedom in lamp design, and are economical due to their semi-permanent lifespan. Summary of the Invention [Problem to be solved by the invention]

[0004] An embodiment of the invention can provide a lighting module that provides multiple color lights.

[0005] An embodiment of the invention may provide a lighting module that can selectively emit light from a first light-emitting element that vertically overlaps with a light-emitting region and a second light-emitting element that does not vertically overlap with the light-emitting region.An embodiment of the invention may provide a lighting module that can emit light of at least three colors using at least two light sources.An embodiment of the invention may provide a lighting module that irradiates surface light of different colors, and a lighting device, a light unit, a liquid crystal display device, or a vehicle lamp having the lighting module. [Means for solving the problem]

[0006] A lighting module according to an embodiment of the invention includes a circuit board, a plurality of first light-emitting elements arranged on a first region of the circuit board, a plurality of second light-emitting elements arranged on a second region of the circuit board, a resin layer including a first resin portion that seals the plurality of first light-emitting elements and a second resin portion that seals the plurality of second light-emitting elements, a phosphor portion arranged between the first resin portion and the second resin portion, a diffusion layer arranged on an upper portion of the first resin portion, and a reflective layer arranged on an upper surface and an outer surface of the second resin portion, wherein each of the plurality of first light-emitting elements and the plurality of second light-emitting elements has at least one row in a first direction and is arranged in a second direction perpendicular to the first direction, and a width of the second resin portion in the first direction may be smaller than a width of the first resin portion.

[0007] According to an embodiment of the invention, the first light emitting element includes a first light emitting chip that emits blue light and a wavelength conversion layer disposed on a surface of the first light emitting chip, and the first light emitting element can emit white light. According to an embodiment of the invention, the second light emitting element emits blue light, and the phosphor part covers the space between the first resin part and the second resin part, and can emit red or yellow light. A lighting module according to another embodiment of the present invention includes a circuit board, a plurality of first light-emitting elements arranged on a first region of the circuit board, a plurality of second light-emitting elements arranged on a second region of the circuit board, a resin layer including a first resin portion sealing the plurality of first light-emitting elements and a second resin portion sealing the plurality of second light-emitting elements, a phosphor layer arranged on the first resin portion, an ink layer arranged on the phosphor layer, and a reflective layer arranged on an upper surface and an outer surface of the second resin portion, each of the plurality of first light-emitting elements and the plurality of second light-emitting elements may have at least one row in a first direction and be arranged in a second direction perpendicular to the first direction, and a width of the second resin portion in the first direction may be smaller than a width of the first resin portion. According to an embodiment of the present invention, the first light-emitting element may emit blue light, and the second light-emitting element may include a second light-emitting chip that emits blue light and a wavelength conversion layer arranged on a surface of the second light-emitting chip, and the second light-emitting element may emit white light. According to an embodiment of the present invention, the phosphor layer may include a red phosphor, and the ink layer may include red ink particles. The width of the first resin portion in the first direction may be at least twice the width of the second resin portion in the first direction or may be in the range of 5 mm to 15 mm. According to another embodiment of the invention, the display device includes a light-emitting region on the first resin portion from which light is emitted and a non-light-emitting region on the second resin portion from which light is reflected, the non-light-emitting regions being disposed on both sides of the light-emitting region. According to another embodiment of the invention, the display device includes a light-emitting region on the first resin portion from which light is emitted and a non-light-emitting region on the second resin portion from which light is reflected, the light-emitting regions being disposed on both sides of the non-light-emitting region. According to another embodiment of the invention, the display device includes a reflective member between the resin layer and the circuit board, the reflective member may be in contact with the reflective layer. Effect of the Invention

[0008] According to the embodiment of the invention, it is possible to provide lights of different colors in the same light-emitting area in a lighting module. According to the embodiment of the invention, a light-emitting part and a non-light-emitting part are provided, and light emitted from the light-emitting part and the non-light-emitting part can be emitted through the surface of the light-emitting part. The embodiment of the invention can improve the light efficiency and light distribution characteristics of the lighting module. The embodiment of the invention can reduce the chromaticity difference between the appearance image and the light-emitting image of the resin layer of the lighting module. The embodiment of the invention can improve the color of the lamp depending on whether it is turned on or off. It is possible to improve the optical reliability of the lighting module according to the embodiment of the invention and the lighting device or vehicle lamp having the same. The embodiment of the invention can be applied to a light unit having a lighting module, various display devices, a surface light source lighting device, or a vehicle lamp. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a plan view showing a lighting module according to a first embodiment of the invention. [Diagram 2] FIG. 2 is a side cross-sectional view of the lighting module of FIG. 1 taken along line AA. [Diagram 3] FIG. 3 shows a first variant of the lighting module of FIG. [Figure 4] 4 is a side cross-sectional view of the lighting module of FIG. 1 taken along line BB. [Diagram 5] 5 is a side cross-sectional view of the lighting module of FIG. 1 taken along line CC. [Figure 6] FIG. 6 shows a second variant of the lighting module of FIG. [Figure 7] FIG. 7 shows a third variant of the lighting module of FIG. [Figure 8] FIG. 8 is a side cross-sectional view of a lighting module according to a second embodiment of the invention. [Figure 9] FIG. 9 shows a first modification of the lighting module of FIG. [Figure 10] FIG. 10 shows a second modification of the lighting module of FIG. [Figure 11]FIG. 11 shows a third modification of the lighting module of FIG. [Figure 12] FIG. 12 is a plan view showing an example of a lighting module having a plurality of light-emitting units according to a modified example of the first embodiment of the invention. [Figure 13] FIG. 13 is a plan view showing an example of a lighting module having a plurality of reflecting portions according to a modified example of the first embodiment of the invention. [Figure 14] FIG. 14 is a plan view showing an example of a lighting module having a plurality of light-emitting units according to a modified example of the second embodiment of the invention. [Figure 15] FIG. 15 is a plan view showing an example of a lighting module according to a modified example of the second embodiment of the invention, which has a plurality of reflecting portions. [Figure 16] FIG. 16 shows another example of the invention, which is a modified example of the light emitting portion and the reflecting portion in the lighting module according to the first and second embodiments. [Figure 17] FIG. 17 shows another example of the invention, which is a modified example of the phosphor portion in the lighting module according to the first and second embodiments. [Figure 18] FIG. 18 shows another example of the invention, which is a modified example of the first light emitting element in the lighting modules according to the first and second embodiments. [Figure 19] FIG. 19 is an example of a side cross-sectional view having the first light emitting element of FIG. [Figure 20] FIG. 20 is a plan view of a vehicle to which a lamp having a lighting module according to an embodiment of the invention is applied. [Figure 21] FIG. 21 is an example of a vehicle front lighting device according to an embodiment of the invention. [Figure 22] FIG. 22 is a diagram showing an example of a vehicle rear lighting device according to an embodiment of the invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the technical idea of ​​the present invention is not limited to some of the embodiments described, and may be embodied in various different forms, and one or more of the components of the embodiments may be selectively combined or substituted within the scope of the technical idea of ​​the present invention. Furthermore, terms (including technical and scientific terms) used in the embodiments of the present invention are interpreted as meanings that are generally understandable to those having ordinary knowledge in the technical field to which the present invention belongs, unless otherwise specified, and commonly used terms such as terms defined in dictionaries may be interpreted in consideration of the contextual meaning of the relevant technology. Furthermore, terms used in the embodiments of the present invention are intended to describe the embodiments, and are not intended to limit the present invention. In this specification, the singular form may include the plural form unless otherwise specified, and when it is described as "at least one (or more) of A and B and C," it may include one or more of all combinations that can be combined with A, B, and C. Furthermore, in describing the components of the embodiments of the present invention, terms such as first, second, A, B, (a), and (b) may be used. Such terms are used to distinguish the component from other components, and do not limit the nature or order of the components. When a component is described as being "linked," "coupled," or "connected" to another component, it includes both cases where the component is directly linked or connected to the other component, and cases where another component is "linked," "coupled," or "connected" between the components. When a component is described as being formed or disposed "above or below" another component, "above or below" includes not only cases where the two components are in direct contact with each other, but also cases where one or more other components are formed or disposed between the two components. When a term is used as "above or below," it can include not only the upper direction but also the lower direction based on one component.

[0011] The lighting device according to the present invention can be applied to various lamp devices requiring illumination, such as lamps for vehicles, home lighting devices, or industrial lighting devices. For example, vehicle lamps can be applied to headlamps, width lamps, side mirror lamps, fog lamps, tail lamps, brake lights, daytime running lights, vehicle interior lighting, door scuffs, rear combination lamps, backup lamps, etc. The lighting device according to the present invention can also be applied to indoor and outdoor advertising devices, display devices, and various train fields, and can be applied to all lighting-related fields and advertising-related fields that are currently developed and commercialized or that can be realized through future technological development.

[0012] <First Example> FIG. 1 is a plan view showing a lighting module according to a first embodiment of the invention, FIG. 2 is a cross-sectional side view of the lighting module of FIG. 1 taken along line AA, FIG. 3 is a first modified example of the lighting module of FIG. 2, FIG. 4 is a cross-sectional side view of the lighting module of FIG. 1 taken along line BB, FIG. 5 is a cross-sectional side view of the lighting module of FIG. 1 taken along line CC, FIG. 6 is a second modified example of the lighting module of FIG. 2, and FIG. 7 is a third modified example of the lighting module of FIG. 2.

[0013] 1 to 5, the lighting module 100 may include a circuit board 11, light emitting elements 21 and 31 arranged on the circuit board 11, resin layers 41 and 43 sealing the light emitting elements 21 and 31 on the circuit board 11, a diffusion layer 51 on a first region of the resin layers 41 and 43, a reflective layer 61 on a second region of the resin layers 41 and 43, and a phosphor part 45 between the first resin part 41 and the second resin part 43 of the resin layers 41 and 43. An upper part of the first region may be a light emitting region 70, and an upper part of the second region may be a non-light emitting region 72. The light emitting elements 21 and 31 may include first light emitting elements 21 arranged in at least one row and second light emitting elements 31 arranged in at least one row. The resin layers 41 and 43 may include a first resin part 41 covering the first light emitting elements 21 and a second resin part 43 covering the second light emitting elements 31. The phosphor part 45 is arranged between the first resin part 41 and the second resin part 43.

[0014] The lighting module 100 can emit the light emitted from the light emitting elements 21 and 31 as surface light. The lighting module 100 can emit the first light emitted from the first light emitting element 21. The lighting module 100 can convert the wavelength of the second light emitted from the second light emitting element 23 and emit it as a third light. The lighting module 100 can emit a fourth light by mixing the first and second lights emitted from the first and second light emitting elements 21 and 31. The first to third lights may be lights of different colors, for example, the first light may be white light, the second light may be blue light, the third light may be red or yellow light, and the fourth light may be yellow (amber) light. The thickness of the lighting module 100 may be 5.5 mm or less from the bottom of the circuit board 11, or may have a range of 4.5 mm to 5.5 mm, or a range of 4.5 mm to 5 mm. The thickness of the lighting module 100 may be a linear distance between the lower surface and the uppermost surface of the circuit board 11. The lighting module 100 is provided with a thickness of 5.5 mm or less, and can be provided as a flexible and slim surface light source module. If the thickness of the lighting module 100 is thinner than the above range, the light diffusion space may be reduced and hot spots may occur, and if the thickness is greater than the above range, the increased thickness of the module reduces spatial installation constraints and design freedom. In the embodiment, the lighting module 100 is provided with a thickness of 5.5 mm or less or 5 mm or less, and is provided as a module capable of a curved structure, thereby reducing design freedom and spatial constraints. The circuit board 11 includes a connector (not shown) at a part thereof to supply power to the light emitting elements 21 and 31. The lighting module 100 can be applied to various lamp devices requiring illumination, for example, forward illumination or interior illumination in a vehicle lamp or vehicle lamp. For example, the lighting module 100 can be applied to a daytime running lamp, a headlamp, a fog lamp, or a turn signal lamp.

[0015] In the lighting module 100, the circuit board 11 may function as a base member or a support member located under the light emitting elements 21, 31 and the resin layers 41, 43. The circuit board 11 includes a printed circuit board (PCB). The circuit board 11 may include at least one of a resin-based printed circuit board (PCB), a metal core PCB, a flexible PCB, a ceramic PCB, or an FR-4 board. The circuit board 11 may include a flexible PCB or a rigid PCB. The upper surface of the circuit board 11 has an X-axis-Y-axis plane, and the thickness of the circuit board 11 may be a height in a Z direction perpendicular to the X direction and the Y direction. Here, the X direction may be a first direction, the Y direction may be a second direction perpendicular to the X direction, and the Z direction may be a third direction perpendicular to the X direction and the Y direction. The circuit board 11 includes a wiring layer (not shown) on an upper portion thereof, and the wiring layer is electrically connected to the light emitting elements 21 and 31. A reflective member or a protective layer disposed on the upper portion of the circuit board 11 may protect the wiring layer. Each of the first and second light emitting elements 21 and 31 may be connected in series, in parallel, or in series-parallel by the wiring layer of the circuit board 11. Each of the first and second light emitting elements 21 and 31 may be connected in series or in parallel in groups having two or more elements, or the groups may be connected in series or in parallel. The protective layer may include a member having a solder resist material, and the solder resist material may be a white material and may reflect incident light. The thickness of the circuit board 11 may be 0.5 mm or less, for example, in the range of 0.3 mm to 0.5 mm. Since the thickness of the circuit board 11 is provided thin, the thickness of the lighting module is not increased. Since the circuit board 11 is provided with a thickness of 0.5 mm or less, it is possible to support a flexible module.

[0016] As shown in FIG. 3 and FIG. 6, the lighting module 100 may include a reflective member 15 disposed on the upper surface of the circuit board 11. The reflective member 15 may reflect light traveling to the upper surface of the circuit board 11. The reflective member 15 may be attached to the upper surface of the circuit board 11 or disposed between the circuit board 11 and the resin layers 41 and 43. An adhesive layer, such as a UV adhesive, silicone, or epoxy, is formed between the reflective member 15 and the circuit board 11. The reflective member 15 may be provided as a film made of any one of a resin material, transparent PET, white PET (white polyethylene terephthalate), and Ag sheet. Reflective dots may be disposed on the reflective member 15 to reflect incident light. The reflective dots may include ink, and may be printed with any one of a material including TiO2, CaCO3, BaSO4, Al2O3, silicon, and PS. Here, the reflective member 15 has an open area, and the first and second light emitting elements 21 and 31 are disposed through the open area. The reflective member 15 may be formed on the entire upper surface of the circuit board 11, or may be disposed under the first resin portion 41 or the second resin portion 43 of the circuit board 11. As another example, the circuit board 11 may include a transparent material. When the circuit board 11 is made of a transparent material, the light emitted from the light emitting elements 21 and 31 is emitted in the upper and lower directions of the circuit board 11.

[0017] The light emitting elements 21, 31 may be arranged in a plurality of rows and / or columns on the circuit board 11. The first light emitting elements 21 may be arranged in one or more rows on the circuit board 11. A plurality of the first light emitting elements 21 are arranged in the second direction Y, and at least one is arranged in the first direction X. The second light emitting elements 31 may be arranged in one or more rows on the circuit board 11. A plurality of the second light emitting elements 31 are arranged in the second direction Y, and at least one is arranged in the first direction X. The first and second light emitting elements 21, 31 arranged in the second direction may be arranged to face each other in the first direction or arranged in a zigzag shape.

[0018] The first light emitting element 21 may be vertically overlapped with the first resin part 41 and the diffusion layer 51. The second light emitting element 31 may be vertically overlapped with the second resin part 43 and the reflective layer 61. The first light emitting element 21 may be disposed in the first resin part 41 or sealed in the first resin part 41. The second light emitting element 31 may be disposed in the second resin part 43 or sealed in the second resin part 43. The first light emitting element 21 may include a first light emitting chip 23 and a wavelength conversion layer 24 covering the first light emitting chip 23. The first light emitting chip 23 may have a plurality of pads exposed at a lower part and may emit light through an upper surface and a side surface. The wavelength conversion layer 24 converts the wavelength of a portion of light emitted from the first light emitting chip 23. The wavelength conversion layer 24 is disposed on an upper surface and / or a plurality of side surfaces of the first light emitting chip 23. As a result, the first light emitting element 21 emits a first light in which the light emitted from the first light emitting chip 23 and the light wavelength-converted by the wavelength conversion layer 24 are mixed. The first light emitting chip 23 may be provided as a blue LED chip. The first light emitting chip 23 may be provided in a flip chip form, or as a vertical or horizontal chip. The wavelength conversion layer 24 may include at least one or more of red, yellow, and green phosphors. The wavelength conversion layer 24 may have a thickness of 200 μm or less, for example, in a range of 100 to 200 μm. The first light emitting chip 23 may have a thickness of 0.3 mm or less. The second light emitting element 31 may include a second light emitting chip. The second light emitting chip may emit at least one light of blue, green, or red. The second light emitting chip may emit, for example, blue light. The second light emitting element 31 is provided in a structure in which a wavelength conversion layer is not formed on a surface of the second light emitting chip. The second light emitting chip may be provided in a flip chip form, or may be provided as a vertical chip or a horizontal chip. The first light emitting device 21 may emit white light, and the second light emitting device 31 may emit blue light.

[0019] As shown in Fig. 2, the distance D1 between the first and second light emitting elements 21, 31 may be 3 mm or more, for example, in the range of 3 mm to 5 mm. If the distance D1 between the first and second light emitting elements 21, 31 is smaller than this range, the heat dissipation efficiency decreases, and if it is larger than this range, the module size increases. As shown in Fig. 4, the distance D3 between the first light emitting element 21 may be the same as or narrower than the distance between the second light emitting element 31. The distance D3 between the first and second light emitting elements 21, 31 can be varied according to the required light amount.

[0020] At least one or two layers of a resin material are disposed on the upper part of the circuit board 11. At least one or two layers of a resin material are formed on the upper part of the first light emitting element 21. At least one or two layers of a resin material are formed on the upper part of the second light emitting element 31. The resin layers 41 and 43 may include a first resin part 41 on the first light emitting element 21 and a second resin part 43 on the second light emitting element 31. The first resin part 41 may be a transparent resin material, for example, a resin material such as UV (Ultra violet) resin, silicone, or epoxy. The first resin part 41 may be a layer containing a diffusing agent or may not be a layer containing a diffusing agent. The second resin part 43 may be a transparent resin material, for example, a resin material such as UV (Ultra violet) resin, silicone, or epoxy. The second resin part 43 may be a layer containing a diffusing agent or may not be a layer containing a diffusing agent.

[0021] The first and second resin parts 41, 43 may each have a length in the second direction Y greater than the widths W1, W2 in the first direction X. The length in the second direction Y may be three times or more the widths W1, W2 in the first direction X. The first and second resin parts 41, 43 may each have the same length in the second direction Y. The first and second resin parts 41, 43 may each have a different width W1, W2 in the first direction X. For example, the width W1 of the first resin part 41 may be greater than the width W2 of the second resin part 43. For example, the width W1 of the first resin part 41 may be twice or more the width W2 of the second resin part 43. The width W2 of the second resin part 43 may be 1 / 2 or less the width W1 of the first resin part 41. The first resin part 41 is provided as a light emitting region, and its width W1 is 5 mm or more, for example, in the range of 5 mm to 15 mm or 5 mm to 10 mm. When the width W1 of the first resin part 41 is smaller than the range, the lighting function is degraded. The width W2 of the second resin part 43 may be formed to be 3 mm or less, for example, in the range of 1.5 mm to 3 mm or 1.5 mm to 2.5 mm. When the width W2 of the second resin part 43 is smaller than the range, the wavelength conversion efficiency of the light emitted from the second light emitting element 31 is degraded. The first light emitting element 21 is disposed in the first resin part 41 with a width smaller than the width W1 of the first resin part 41, and the second light emitting element 31 is disposed in the second resin part 43 with a width smaller than the width W2 of the second resin part 43. The distance D2 between the first side surface S1 of the first resin part 41 and the first light emitting element 21 may be 2.5 mm or more, for example, in the range of 2.5 mm to 3.5 mm. When the distance D2 between the first side surface S1 of the first resin part 41 and the first light emitting element 21 is smaller than the range, the loss of light through the first side surface S1 is large. The distance K1 between the first light-emitting element 21 and the inner surface S11 of the first resin part 41 may be 3.5 mm or less, for example, in the range of 2.5 mm to 3.5 mm. If it is smaller than this range, the heat dissipation efficiency decreases or the wavelength conversion efficiency of the first light can be increased.

[0022] The second resin part 43 may be provided without a phosphor. That is, since the second resin part 43 is provided with a small width W2, if a phosphor is added therein, the wavelength conversion efficiency of the second light is reduced or the light extraction efficiency is reduced. Therefore, the second resin part 43 is provided without a phosphor.

[0023] The first resin portion 41 and the second resin portion 43 may have the same thickness T1. The thickness T1 of the first resin portion 41 may be the same as the maximum thickness of the second resin portion 43. As shown in FIG. 7, the thickness T1 of the first resin portion 41 may be thicker than the minimum thickness of the second resin portion 43. The thickness T1 of the first and second resin portions 41, 43 may be 4 mm or less, for example, in the range of 1.8 mm to 4 mm or in the range of 1.8 mm to 3.5 mm. Since the thickness T1 of the first and second resin portions 41, 43 is provided within the above range, a flexible module can be provided, and light extraction efficiency and light distribution can be improved. The top surface area of ​​the first resin portion 41 may be larger than the top surface area of ​​the second resin portion 43. The top surface area of ​​the first resin portion 41 may be more than twice the top surface area of ​​the second resin portion 43. The top surface of the first resin portion 41 is provided as a surface from which light is emitted. The width of the lower surface of the first resin part 41 may be the same as the width (e.g., W1) of the upper surface. The upper surface of the first resin part 41 may be a flat plane or may include a concave or convex curved surface. The upper surface of the first resin part 41 may include, but is not limited to, an uneven pattern. In the lighting module 100, a first side surface S1 is an outer surface of the first resin part 41, from which light is emitted. The area of ​​the first side surface S1 may be an area blocked by a housing or a bracket.

[0024] The phosphor part 45 is disposed in the resin layers 41 and 43. The phosphor part 45 is disposed between the first resin part 41 and the second resin part 43. The phosphor part 45 may include a red phosphor and / or a yellow phosphor. The phosphor part 45 is a transparent resin to which a phosphor is added, and the resin may be a UV resin, a silicone, or an epoxy material. The resin of the phosphor part 45 may be the same material as the resin of the first and second resin parts 41 and 43. The phosphor content of the phosphor part 45 may be 20 wt% or more, for example, in the range of 20 wt% to 98 wt% or in the range of 50 wt% to 98 wt%. The phosphor part 45 may have a phosphor content such that the second light emitting element 31 is not visible or a hot spot is not generated when viewed from above the diffusion layer 51. The phosphor part 45 converts the wavelength of the second light emitted from the second light emitting element 31 and emits it as a third light. The third light is emitted as a wavelength-converted third light rather than a mixture of the second light and light wavelength-converted by the phosphor. That is, the phosphor part 45 has a higher extraction efficiency of the wavelength-converted light than the mixture of light. As another example, the phosphor part 45 may be formed by attaching a phosphor to an inner surface of the first resin part 41 or an inner surface of the second resin part 43 in a dot shape.

[0025] The height of the phosphor part 45 may be equal to the thickness T1 of the first resin part 41 or / and the second resin part 43 in the vertical direction. The width of the phosphor part 45 may be equal to or less than 500 μm, for example, in the range of 200 to 500 μm or 200 to 350 μm, as the thickness in the first direction X. The width of the phosphor part 45 may be variable depending on the diameter of the phosphor. The area of ​​the vertical surface of the phosphor part 45 may be equal to the area of ​​the inner surface of the first resin part 41 or / and the area of ​​the inner surface of the second resin part 43. The phosphor part 45 is disposed along between the inner surface of the first resin part 41 and the inner surface of the second resin part 43, and can block the inner surfaces of the first resin part 41 and the second resin part 43 from contacting each other. As another example, a phosphor layer is further formed between at least one of the first reflection part 61A and the second reflection part 61B of the reflective layer 61 and the second resin part 43. The color conversion efficiency of the light traveling to the first resin portion 41 can be improved by using such a layer containing a phosphor.

[0026] The diffusion layer 51 is disposed on the first resin part 41. The diffusion layer 51 may be bonded or attached to an upper surface of the first resin part 41. The diffusion layer 51 may be provided with the same area as the upper surface of the first resin part 41 or may be provided with an area larger than the upper surface area of ​​the first resin part 41. On the first side surface S1 of the lighting module 100, a side surface of the diffusion layer 51 and a side surface of the first resin part 41 may be disposed on the same plane. On the third and fourth side surfaces S3 and S4 of the lighting module 100, both side surfaces of the diffusion layer 51 and both side surfaces of the first resin part 41 may be disposed on the same plane. As another example, a part of the diffusion layer 51 may protrude in the direction of at least one or two side surfaces of the side surfaces S1, S3, and S4 of the first resin part 41. The diffusion layer 51 may include a diffusion agent in a transparent resin material. The diffusion layer 51 may diffuse incident light. The diffusion agent may include at least one of PMMA (Poly Methyl Meth Acrylate), TiO2, SiO2, Al2O3, and silicone. An upper surface of the diffusion layer 51 may be a light emitting surface S0. That is, the light emitting surface S0 may be provided as a light emitting region 70.

[0027] The reflective layer 61 is formed of a reflective member made of a metal or a non-metallic material. The metal material is made of a material such as aluminum or silver, and the non-metallic material is at least one of a resin material, a transparent PET, and a white PET (white polyethylene terephthalate) material. The reflective layer 61 may include at least one of TiO2, CaCO3, BaSO4, Al2O3, silicon, and PS inside the resin. The reflective layer 61 may reflect incident light. The reflective layer 61 is formed on the upper surface and the outer surface of the second resin part 43. The reflective layer 61 may include a first reflective part 61A disposed on the upper surface of the second resin part 43 and a second reflective part 61B disposed on the outer surface of the second resin part 43. The second reflective part 61B extends vertically from the first reflective part 61A. The reflective layer 61 is disposed on the outer side of the second light emitting element 31, and may block leakage of light emitted from the second light emitting element 31. The side surface S2 of the second reflecting portion 61B may face the first side surface S1. The reflecting layer 61 may overlap the phosphor portion 45 in a vertical direction. The reflecting layer 61 may contact the upper surface of the second resin portion 43. The reflecting layer 61 may contact the upper surface of the second resin portion 43 and the upper end of the phosphor portion 45. If the upper end of the phosphor portion 45 contacts the diffusion layer 51, a problem may occur in which light that has not been wavelength-converted leaks through the diffusion layer 51. Thus, the upper end of the phosphor portion 45 is disposed at a position in contact with the lower surface of the reflecting layer 61. The reflecting layer 61 may contact the diffusion layer 51. The interface between the reflecting layer 61 and the diffusion layer 51 extends from one surface of the phosphor portion 45. One surface of the phosphor portion 45 may be a surface in contact with an inner surface of the first resin portion 41.

[0028] In the lighting module 100, the light-emitting region 70 as a first region may be an upper portion of the first resin part 41, and the non-light-emitting region 72 as a second region may be an upper portion of the second resin part 43. The light-emitting region may be a region from which light is emitted. The non-light-emitting region may be a region where light is blocked or reflected and not emitted to the outside. That is, the lighting module 100 may emit at least two colors of light or three or more colors of light through the light-emitting region 70, and the second light-emitting element 31 is provided in a structure that is not exposed from the outside.

[0029] The lighting module 100 according to the first embodiment may be provided in a front module of a moving body. For example, the front module may be a headlamp, a fog lamp, or a turn signal lamp as a forward lighting of a vehicle lamp. In the lighting module, in the first lighting mode, the first light-emitting element 21 is driven to emit the first light to the diffusion layer 51 or the light-emitting area, and at this time, the second light-emitting element 31 may be in an off state. In the second lighting mode, the second light-emitting element 31 is driven, the first light-emitting element 21 is turned off, and the second light emitted from the second light-emitting element 31 is wavelength-converted into a third light by the phosphor unit 45 and emitted to the light-emitting area. The first light may be white light, and the second light may be red or yellow light. That is, white light or red light (or yellow light) can be illuminated according to the first and second front modes. In addition, in the third lighting mode, the first light-emitting element 21 and the second light-emitting element 31 are turned on, and the first and third lights are mixed to emit yellow light.

[0030] 3, the reflective member 15 may be in contact with the first resin part 41 and the second resin part 43. The reflective member 15 may reflect light incident on the lower parts of the first resin part 41 and the second resin part 43. A portion of the reflective member 15 is disposed between the second light emitting element 31 and the reflective layer 61. A portion of the reflective member 15 extends from the first resin part 41 through the lower end of the phosphor part 45 to the lower part of the second resin part 43.

[0031] As shown in FIG. 6, the outer portion 15A of the reflective member 15 may be exposed to the outside of the lower end of the reflective layer 61. In this case, the reflective layer 61 is made of a resin or metal material and is bonded to the outer portion 15A of the reflective member 15. As shown in FIG. 7, the upper surface of the second resin part 43 may include a concave curved portion R1 or a convex curved portion, or may include a light reflecting pattern. This allows the incident light to be reflected in another direction, improving the light extraction efficiency to the light emitting area. The curved portion R1 provides the first reflective portion 61A of the reflective layer 61 with a curved surface, improving the reflection efficiency. The curved portion R1 may be provided with a height that gradually decreases at the upper end of the phosphor part 45 adjacent to the first resin part 41.

[0032] A lighting module according to the second embodiment will be described with reference to Figs. 8 to 11. The lighting module according to the second embodiment may include the configuration and description of the first embodiment, with reference to the first embodiment for the same configuration as the first embodiment. The lighting module according to the second embodiment may be applied to at least one of rear lamps of a moving body or vehicle, for example, an auxiliary brake light, a tail light, a brake light, a backup lamp, and a tail light.

[0033] Referring to FIG. 8, the lighting module 100A may include a circuit board 11, a plurality of light-emitting elements including a first light-emitting element 21A and a second light-emitting element 31A, a resin layer including a first resin portion 41 and a second resin portion 43, a phosphor layer 52, an ink layer 55, and a reflective layer 61. The first light-emitting element 21A may be an LED chip that emits blue light, and the second light-emitting element 31A may be an element that emits white light. The second light-emitting element 31A may include a second light-emitting chip 33 that emits blue light and a wavelength conversion layer 34 therearound. The second light-emitting element 31A emits white light by mixing blue light with light wavelength-converted by the wavelength conversion layer 34. A distance D1 between the first light-emitting element 21A and the second light-emitting element 31A may be greater than a distance D2 between the first light-emitting element 21A and the first side surface S1 of the first resin portion 41. The interval K1 between the first light emitting element 21A and the second resin part 43 may be 3.5 mm or less, for example, in the range of 2.0 mm to 3.5 mm, and may be smaller than the interval K1 in the first embodiment. The first light emitting element 21A is disposed under the first resin part 41, and the second light emitting element 31A is disposed under the second resin part 43. For the width, length and thickness of the first resin part 41 and the second resin part 43, refer to the description of FIG. 1 and FIG. 2. The first and second resin parts 41, 43 may be in contact with each other. The interface S11 between the first resin part 41 and the second resin part 43 may be disposed at the interface between the reflective layer 61 and the phosphor layer 52, or may be disposed under the reflective layer 61.

[0034] The reflective layer 61 is disposed on the upper surface and the outer surface of the second resin portion 43 .

[0035] The phosphor layer 52 is disposed on an upper surface of the first resin part 41. An ink layer 55 is disposed on the phosphor layer 52. The phosphor layer 52 may be defined as a resin layer having phosphor. The ink layer 55 may be defined as a resin layer having ink particles. The first resin part 41, the phosphor layer 52, and the ink layer 55 may be stacked in a vertical direction. The upper surface area of ​​the first resin part 41 may be the same as the lower surface area of ​​the phosphor layer 52. The upper surface area of ​​the phosphor layer 52 may be the same as the lower surface area of ​​the ink layer 55. Thus, the light traveling through the first resin part 41 is wavelength-converted by the phosphor layer 52 and emitted through the ink layer 55.

[0036] The phosphor layer 52 may include at least one of a red phosphor or a yellow phosphor. As another example, the phosphor layer 52 may include at least one of a red phosphor, a green phosphor, a yellow phosphor, and a blue phosphor. When the first light emitted from the first light emitting element 21A is incident on the phosphor layer 52, the phosphor layer 52 may convert the wavelength and emit red light, and when the light emitted from the second light emitting element 31A is incident on the phosphor layer 52, the phosphor layer 52 may convert the wavelength and emit yellow light. As another example, a single resin layer having a phosphor and ink particles may be formed on the first resin portion 41. As another example, a single resin layer having a diffusing agent, a phosphor, and ink particles may be formed on the first resin portion 41.

[0037] The ink layer 55 and the phosphor layer 52 may be in contact with the reflective layer 61. At least one or both of the ink layer 55 and the phosphor layer 52 may be arranged to overlap the reflective layer 61 in a vertical direction. This allows the ink layer 55 and the phosphor layer 52 to strengthen the adhesive force between the reflective layer 61. The upper surface of the ink layer 55 may be a light-emitting surface S0. That is, the light-emitting surface S0 may be provided as a light-emitting region 70, which is a first region. The phosphor layer 52 may have a phosphor content of 50 wt% or less, for example, in a range of 10 wt% to 50 wt% or 10 wt% to 30 wt%. The phosphor layer 52 may have a phosphor content such that the first and second light-emitting elements 21A and 31A are not visible or hot spots are not generated when viewed from above the ink layer 55. Here, the phosphor content of the phosphor layer 52 may be added small according to the first embodiment because the light transmittance may be reduced by the ink layer 55 on the surface. The ink particles added to the ink layer 55 may include at least one of a metal ink, a UV ink, and a hardening ink. The size of the ink particles may be smaller than the size of the phosphor. The surface color of the ink particles may be any one of green, red, yellow, and blue. The type of ink may be selected from PVC (Poly vinyl chloride) ink, PC (Polycarbonate) ink, ABS (acrylonitrile butadiene styrene copolymer) ink, UV resin ink, epoxy ink, silicone ink, PP (polypropylene) ink, water-based ink, plastic ink, PMMA (poly methyl methacrylate) ink, and PS (Polystyrene) ink. Here, the width or diameter of the ink particles may be 5 μm or less, for example, in the range of 0.05 μm to 1 μm. At least one of the ink particles may be smaller than the wavelength of light. The color of the ink particles may include at least one of red, green, yellow, and blue. For example, the phosphor may emit a red wavelength, and the ink particles may include a red color.For example, the red color of the ink particles may be darker than the color of the phosphor or the wavelength of light. The ink particles may be a color different from the color of the light emitted from the light emitting elements 21A and 31A. The ink particles may have an effect of blocking or blocking incident light. The ink particles added to the ink layer 55 may be added in an amount of 12 wt% or less, for example, in a range of 4 wt% to 12 wt%. The content of the phosphor can prevent a decrease in wavelength conversion efficiency, and the content of the ink particles can reduce the color difference of the surface color and reduce hot spots. The content of the phosphor may be 3 wt% or more than the content of the ink particles, or may be added in a range of 3 wt% to 13 wt% higher. The color of the surface of the ink layer 55 may be provided by the color of the ink particles. The light transmission can be suppressed by such ink particles, and hot spots can be reduced.

[0038] The lighting module 100A according to the second embodiment is provided with a red surface in a non-light-emitting mode, and in a first lighting mode, the first light-emitting element 21A is driven and the second light-emitting element 31A is turned off to emit red light through the ink layer 55. In a second lighting mode, the first light-emitting element 21A is turned off and the second light-emitting element 31A is turned on to emit yellow light through the ink layer 55.

[0039] As shown in FIG. 9, a reflective member 15 is disposed between the upper surface of the circuit board 11 and the first resin portion 41 and between the upper surface of the circuit board 11 and the second resin portion 43. The reflective member 15 may be in contact with the first and second resin portions 41 and 43. The reflective member 15 may be in contact with or spaced apart from the wavelength conversion layer 34. As shown in FIG. 10, an outer portion 15A of the reflective member 15 may protrude or be exposed to the outside through the reflective layer 61. The reflective member 15 may be in contact with the lower surface of the reflective layer 61. As shown in FIG. 11, the upper surface of the second resin portion 43 may include a concave curved portion R1 or a convex curved portion, or may include a light reflecting pattern. This may improve the light extraction efficiency to the light emitting region by reflecting the incident light in another direction. The curved portion R1 may provide the first reflective portion 61A of the reflective layer 61 with a curved surface to improve the reflection efficiency. The curved surface portion R1 may be provided at an upper end of the phosphor layer 52 adjacent to the first resin portion 41 with a height that gradually decreases.

[0040] 12 and 13 are modified examples of the first embodiment. Referring to FIG. 12 and FIG. 2, the first and second light-emitting regions 70, 70A are arranged as light-emitting surfaces S01, S02 on both sides of the non-light-emitting region 72. That is, the non-light-emitting region 72 is arranged between the first light-emitting region 70 and the second light-emitting region 70A. The first light-emitting element 21, 22, the first resin part 41, and the diffusion layer 51, 51A disclosed in the first embodiment are provided in the first light-emitting region 70 and the second light-emitting region 70A, respectively. The second light-emitting element 31, the second resin part 43, the phosphor parts 45, 45A, and the reflective layer 61 are arranged in the non-light-emitting region 72. Here, the phosphor parts 45, 45A are arranged at the boundary part between the first light-emitting region 70 and the first resin part 41, and at the boundary part between the second light-emitting region 70A and the first resin part 41, respectively.

[0041] 13 and 2, the first and second non-light-emitting regions 72, 72A are disposed on both sides of the light-emitting region 70. That is, the light-emitting region 70 is disposed between the first non-light-emitting region 72 and the second non-light-emitting region 72A. The first light-emitting element 21, the first resin part 41, and the diffusion layer 51 disclosed in the first embodiment are provided in the light-emitting region. The second light-emitting element 31, 32, the second resin part 43, the phosphor parts 45, 45B, and the reflective layers 61-1, 61-2 are disposed in the first and second non-light-emitting regions. Here, the phosphor parts 45, 45B are disposed on the inner side of the second resin part 43 of the first non-light-emitting region 72, 72A, and on the inner side of the second resin part 43 of the second non-light-emitting region 72, 72A, respectively.

[0042] The illumination modes of the illumination module disclosed in Fig. 12 and Fig. 13 may be the same as the modes of the first embodiment. As an example of another illumination mode, as shown in Fig. 12, when the first light-emitting element 21 of the first and second light-emitting areas 70 and 70A emit light of different colors, for example, the first light-emitting element 21 of the first light-emitting area 70 emits white light, and the first light-emitting element 22 of the second light-emitting area 70A emits yellow light. As shown in Fig. 13, when the second light-emitting element 31 of the first and second non-light-emitting areas 72 and 72A emit light of different colors, for example, the second light-emitting element 31 of the first non-light-emitting area 72 emits blue light, and the second light-emitting element 32 of the second non-light-emitting area 72A emits green or yellow light. Here, the multiple phosphor parts 45, 45A, and 45B disclosed in Fig. 12 and Fig. 13 may include phosphors of the same color or phosphors of different colors. Any one of the phosphor portions 45, 45A, and 45B shown in FIG. 12 or FIG. 13 may be removed.

[0043] 14 and 15 are modified examples of the second embodiment. Referring to FIG. 14 and FIG. 8, the first and second light-emitting regions 70 and 70A are disposed on both sides of the non-light-emitting region 72. That is, the non-light-emitting region 72 is disposed between the first light-emitting region 70 and the second light-emitting region 70A. The first light-emitting element 21, 21B, the first resin portion 41, the phosphor layer 52, and the ink layer 55 disclosed in the second embodiment are provided in the first light-emitting region 70 and the second light-emitting region 70A, respectively. The second light-emitting element 31A, the second resin portion 43, and the reflective layer 61 are disposed in the non-light-emitting region 72. Here, the second resin portion 43 of the non-light-emitting region 72 may be in contact with or integrally formed with the first resin portion 41 of the first light-emitting region 70 and the first resin portion 41 of the second light-emitting region 70A.

[0044] 15 and 8, the first and second non-light-emitting regions 72, 72A are disposed on both sides of the light-emitting region 70. That is, the light-emitting region 70 is disposed between the first non-light-emitting region 72 and the second non-light-emitting region 72A. The first light-emitting element 21, the first resin part 41, the phosphor layer 52, and the ink layer 55 disclosed in the second embodiment are provided in the light-emitting region 70, respectively. The second light-emitting element 31A, 31B, the second resin part 43, and the reflective layers 61-1, 61-2 are disposed in the first and second non-light-emitting regions 72, 72A, respectively. Here, both sides of the first resin part 41 of the light-emitting region 70 may contact the inner side of the second resin part 43 of the first non-light-emitting region 72 and the inner side of the second resin part 43 of the second non-light-emitting region 72A, respectively.

[0045] The illumination modes of the illumination module disclosed in FIG. 14 and FIG. 15 may be the same as the modes of the second embodiment. As an example of another illumination mode, as shown in FIG. 14, when the first light-emitting element 21A, 21B of the first and second light-emitting regions 70, 70A emit light of different colors, for example, the first light-emitting element 21A of the first light-emitting region 70 may emit blue light, and the first light-emitting element 21B of the second light-emitting region 70A may emit green or yellow light. As shown in FIG. 15, when the second light-emitting element 31A, 31B of the first and second non-light-emitting regions 72, 72A emit light of different colors, for example, the second light-emitting element 31A of the first non-light-emitting region 72 may emit white light, and the second light-emitting element 31B of the second non-light-emitting region 72A may emit yellow light. Here, the multiple phosphor layers 52 disclosed in FIG. 14 and FIG. 15 may include phosphors of the same color or different colors. Any one of the phosphor layers 52 disclosed in FIG. 14 or FIG. 15 may be removed.

[0046] FIG. 16 shows a modification of the lighting module according to the first and second embodiments of the invention.

[0047] Referring to FIG. 16, the sub-regions A1 and A2 of the light-emitting region 70 are extended to both sides of the non-light-emitting region 72. Alternatively, the non-light-emitting region 72 is extended to both sides of the light-emitting region 70. As in the first embodiment, the phosphor part 45 arranged under the non-light-emitting region 72 is arranged along the light-emitting region 70 and its sub-regions A1 and A2, and for example, the first and second phosphor parts 45 and 45A can be further arranged in the sub-regions A1 and A2 on both sides of the light-emitting region 70. At this time, the reflective layer 61 is arranged only on the second side surface S2 of the second resin part 43. Alternatively, a layer having a phosphor is further arranged on the second side surface S2, which is the outside of the second resin part 43. As in the second embodiment, when the light-emitting region 70 has an ink layer 55 arranged on the first resin part 41, the phosphor layer 52 / ink layer 55 are laminated along the reflective layer 61 arranged on both sides of the non-light-emitting region 72. When the light emitting region 70 is formed by disposing the ink layer 55 on the first resin portion 41 , the phosphor layer 52 / ink layer 55 are laminated along the reflective layers 61 disposed on both sides of the non-light emitting region 72 .

[0048] FIG. 17 shows a modification of the lighting module according to the first and second embodiments of the invention.

[0049] Referring to FIG. 17, the light emitting region 70 may face the non-light emitting region 72. A phosphor part 45 is disposed on the inner surface of the first resin part 41, and extensions P10, P11, and P12 of the phosphor part 45 are formed along each side surface S1, S3, and S4. Alternatively, an ink layer 55 is extended on the inner surface and each side surface of the first resin part 41. For example, when the phosphor part 45 is disposed, it is disposed on the boundary between the first resin part 41 and the second resin part 43 and the outer surfaces S1, S3, and S4 of the first resin part 41, respectively. For example, when the ink layer 55 is disposed, the ink layer 55 is disposed on the upper surface and each side surface S1, S3, and S4 of the first resin part 41.

[0050] Figures 18 and 19 are another example of the invention, where Figure 18 is a modified example of the first light-emitting element in the lighting modules of the first and second embodiments, and Figure 19 is an example of a side cross-sectional view of a lighting module having the first light-emitting element of Figure 18.

[0051] 18 and 19, the first resin part 41 of the light emitting region 70 has a plurality of first light emitting elements 25, 27 spaced apart from each other, and the second resin part 43 has at least one row of second light emitting elements 31 arranged therein. The first light emitting elements 25, 27 are arranged adjacent to a third side S3 and a fourth side S4 on both sides of the light emitting region 70. The first light emitting elements 25, 27 are embodied as a side-view package, and light is provided toward the inside of the first resin part 41, i.e., toward the center between the first light emitting elements 25, 27. As another example, the second light emitting elements 31 are arranged as a side-view package or a top-view package at positions spaced apart from each other. The first light emitting elements 25, 27 are bonded to the upper electrode 16 of the circuit board 11 by a bonding member 17 via a lead frame, and emit light in one direction Y0. The first light emitting element 21 may include a light emitting chip 7 in the cavity 2 of the body 3 and a molding part 8 covering the light emitting chip 7 in the cavity 2. The molding part 8 may include a phosphor. The molding part 8 may be a wavelength conversion layer disclosed in the embodiment. The above-mentioned lighting module 100, 100A may be applied to a vehicle lamp, a display device having a micro LED, or various lighting devices. Since the above-mentioned lighting module provides a surface light source, an additional inner lens may be eliminated. The lighting module 100, 100A may be provided in a flat plate shape, a convex curved shape, a concave curved shape, or a shape having irregularities when viewed from the side. The lighting module may be provided in a bar shape such as a stripe, a polygonal shape, a circular shape, an elliptical shape, a shape having a convex side, or a shape having a concave side when viewed from the top.

[0052] FIG. 20 is a plan view of a vehicle to which a lamp having a lighting module according to an embodiment is applied, FIG. 21 is a drawing showing an example of a front lamp in the vehicle of FIG. 20, and FIG. 22 is a drawing showing a tail light of the vehicle of FIG. 20.

[0053] 20 to 22, in a vehicle 900, a front lamp 850 may include one or more lighting modules 855, and the driving timing of these lighting modules 200 may be individually controlled to provide not only a normal headlamp function but also additional functions such as a welcome light or a celebration effect when a driver opens a vehicle door. The lamp may be applied to a daytime running light, a high beam, a low beam, a fog lamp, or a turn signal lamp.

[0054] The tail lamp 800 of the vehicle 900 may include a first lamp unit 812, a second lamp unit 814, a third lamp unit 816, and a housing 810. Here, the first lamp unit 812 may be a lighting module for functioning as a turn signal lamp, the second lamp unit 814 may be a lighting module for functioning as a width light, and the third lamp unit 816 may be a lighting module for functioning as a brake light, but is not limited thereto. At least one or all of the first to third lamp units 812, 814, and 816 may include the lighting module disclosed in the embodiment. The housing 810 may accommodate the first to third lamp units 812, 814, and 816 and may be made of a light-transmitting material. At this time, the housing 810 may have a bend according to the design of the vehicle body, and the first to third lamp units 812, 814, and 816 may embody a surface light source having a curved surface according to the shape of the housing 810. When the lamp unit is applied to a tail light, a brake light, or a turn signal lamp of a vehicle, the vehicle lamp can be applied to a turn signal lamp of the vehicle.

[0055] The features, structures, effects, etc. described in the above embodiments are included in at least one embodiment of the present invention, and are not necessarily limited to one embodiment. In addition, the features, structures, effects, etc. exemplified in each embodiment can be combined or modified with another embodiment by a person having ordinary skill in the field to which the embodiment belongs. Therefore, the contents related to such combinations and modifications should be interpreted as being included in the scope of the present invention. In addition, although the above description is centered on the embodiments, this is merely an example and does not limit the present invention, and various modifications and applications not exemplified above are possible within the scope of the essential characteristics of the present embodiment by a person having ordinary skill in the field to which the present invention belongs. For example, each component specifically presented in the embodiments can be modified and implemented. And, the differences related to such modifications and applications should be interpreted as being included in the scope of the present invention defined in the appended claims.

Claims

1. A circuit board; a plurality of first light emitting elements disposed on a first region of the circuit board; a plurality of second light emitting elements disposed on a second region of the circuit board; a resin layer including a first resin portion that seals the first light-emitting elements and a second resin portion that seals the second light-emitting elements; a phosphor portion disposed between the first resin portion and the second resin portion; a diffusion layer disposed on an upper portion of the first resin portion; a reflective layer disposed on an upper surface and an outer surface of the second resin portion, Each of the first light emitting elements and the second light emitting elements has at least one row in a first direction and is arranged in a second direction perpendicular to the first direction; a width of the second resin portion in the first direction is smaller than a width of the first resin portion.

2. The first light emitting element includes a first light emitting chip that emits blue light and a wavelength conversion layer disposed on a surface of the first light emitting chip, The lighting module according to claim 1 , wherein the first light-emitting element emits white light.

3. The second light emitting element emits blue light, The lighting module according to claim 2 , wherein the phosphor portion covers a space between the first resin portion and the second resin portion and emits red or yellow light.

4. A circuit board; a plurality of first light emitting elements disposed on a first region of the circuit board; a plurality of second light emitting elements disposed on a second region of the circuit board; a resin layer including a first resin portion that seals the first light-emitting elements and a second resin portion that seals the second light-emitting elements; a phosphor layer disposed on the first resin portion; an ink layer disposed on the phosphor layer; a reflective layer disposed on an upper surface and an outer surface of the second resin portion, Each of the first light emitting elements and the second light emitting elements has at least one row in a first direction and is arranged in a second direction perpendicular to the first direction; a width of the second resin portion in the first direction is smaller than a width of the first resin portion.

5. The first light emitting element emits blue light, The second light emitting element includes a second light emitting chip that emits blue light and a wavelength conversion layer disposed on a surface of the second light emitting chip, The lighting module according to claim 4 , wherein the second light-emitting element emits white light.

6. the phosphor layer includes a red phosphor; The lighting module of claim 5 , wherein the ink layer comprises red ink particles.

7. The lighting module according to claim 1 , wherein the width in the first direction of the first resin portion is at least twice the width in the first direction of the second resin portion or is in the range of 5 mm to 15 mm.

8. a light-emitting region on the first resin portion from which light is emitted and a non-light-emitting region on the second resin portion from which light is reflected, The lighting module according to claim 1 , wherein the non-light emitting areas are disposed on both sides of the light emitting area.

9. a light-emitting region on the first resin portion from which light is emitted and a non-light-emitting region on the second resin portion from which light is reflected, The lighting module according to claim 1 , wherein the light emitting areas are disposed on either side of the non-light emitting area.

10. a reflective member between the resin layer and the circuit board; The lighting module of claim 1 , wherein the reflective member is in contact with the reflective layer.

11. A vehicle lighting device comprising a lighting module according to any one of claims 1 to 10.

Citation Information

Patent Citations

  • Lighting module and lighting apparatus having the same

    JP2019061954A