Solid-state battery packaging

Abstract

Provided is a solid battery package comprising a substrate and a solid battery provided to the substrate. The solid battery is formed by including: a battery element comprising a positive electrode layer, a negative electrode layer, and a solid electrolyte interposed between solid battery electrode layers of the positive electrode layer and the negative electrode layer; and an end face electrode that is provided to an end face of the battery element and that is connected to the solid battery electrode layers. The substrate is formed by having, on a primary surface thereof on the side opposing the solid battery, at least one of a positive electrode-side substrate electrode layer and a negative electrode-side substrate electrode layer disposed separated from and opposing the positive electrode-side substrate electrode layer, the substrate electrode layer(s) being capable of electrically connecting to the solid battery. On the basis of a case in which at least one side surface of the substrate electrode layer is on approximately the same line as an end face of the end face electrode in a cross-section view, the distance between the one side surface of the substrate electrode layer and the other side surface is equal to or greater than a minimum distance at which the distance between the end face of the end face electrode on the same electrode side and a side surface of the solid battery electrode layer on the opposing electrode side which is separated from and opposes the end face is a minimum.

Description

[Technical field]

[0001] The present invention relates to solid-state battery packages, and more particularly to solid-state batteries packaged in a manner conducive to substrate mounting. [Background technology]

[0002] 2. Description of the Related Art Secondary batteries that can be repeatedly charged and discharged have been used for various purposes. For example, secondary batteries are used as power sources for electronic devices such as smartphones and laptop computers.

[0003] In secondary batteries, liquid electrolytes are generally used as a medium for ion migration that contributes to charging and discharging. In other words, so-called electrolytic solutions are used in secondary batteries. However, in such secondary batteries, safety is generally required in terms of preventing leakage of the electrolytic solution. In addition, organic solvents and the like used in the electrolytic solution are flammable substances, so safety is also required in that respect.

[0004] Therefore, research is being conducted on solid-state batteries that use solid electrolytes instead of liquid electrolytes. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2015-220107 A [Patent Document 2] JP 2007-5279 A Summary of the Invention [Problem to be solved by the invention]

[0006] It is expected that solid-state batteries will be mounted on printed circuit boards together with other electronic components, and in such cases a structure suitable for mounting is required. For example, a package in which a solid-state battery is mounted on a substrate will be useful for mounting by making the substrate responsible for electrical connection to the outside.

[0007] A solid-state battery includes a battery element including a positive electrode layer, a negative electrode layer, and a solid electrolyte interposed between the positive electrode layer and the negative electrode layer, and end electrodes provided on the battery element. In addition, the electrode layers (positive electrode layer / negative electrode layer) of the solid-state battery may expand and contract during charging and discharging. Here, the inventors of the present application realized that there are still problems to be overcome in the solid-state batteries proposed in the past, and found the need to take measures to address these problems.

[0008] Specifically, the battery element expands and contracts due to the expansion and contraction of the electrode layer. On the other hand, the end electrode provided on the battery element itself does not expand and contract easily. Due to the difference in the degree of expansion and contraction, stress may act from the solid-state battery side to the substrate side. In particular, this stress may increase from the central region side of the battery element toward the interface region side between the electrode layer and the end electrode. That is, among the stresses acting from the solid-state battery side to the substrate side, the stress along the interface region between the electrode layer and the end electrode is relatively the largest. Therefore, this largest stress acts on a predetermined portion of the main surface of the substrate located below the end electrode, which may cause cracks in the substrate. As a result, such cracks in the substrate may cause moisture to enter from the external environment, which may cause deterioration of the battery characteristics.

[0009] The present invention has been made in view of the above problems. That is, a main object of the present invention is to provide a solid-state battery package capable of suitably suppressing cracking of a substrate. [Means for solving the problem]

[0010] In order to achieve the above object, in one embodiment of the present invention, A substrate and a solid-state battery provided on the substrate, the solid-state battery includes a battery element including a positive electrode layer, a negative electrode layer, and a solid electrolyte interposed between the positive electrode layer and the negative electrode layer, and an end electrode provided on an end surface of the battery element and connected to the solid-state battery electrode layer; the substrate has, on a main surface facing the solid-state battery, at least one of a positive-electrode-side substrate electrode layer capable of being electrically connected to the solid-state battery and a negative-electrode-side substrate electrode layer disposed opposite and spaced from the positive-electrode-side substrate electrode layer; The present invention provides a solid-state battery package in which, when viewed in cross section, a distance between one side surface of the substrate electrode layer and the other side surface of the end electrode is equal to or greater than a minimum distance at which a distance between the end surface of the end electrode on the same pole side and a side surface of the solid-state battery electrode layer on the opposite pole side and spaced apart from the end surface is minimum, based on a case in which the one side surface of the substrate electrode layer and the end surface of the end electrode are approximately on the same line. Effect of the Invention

[0011] According to the solid-state battery package according to one embodiment of the present invention, cracking of the substrate can be suitably suppressed. [Brief description of the drawings]

[0012] [Figure 1] FIG. 1 is a cross-sectional view that illustrates a schematic internal configuration of a solid-state battery. [Diagram 2] FIG. 2 is a cross-sectional view showing a schematic configuration of a packaged solid-state battery according to one embodiment of the present invention. [Diagram 3] FIG. 3 is a cross-sectional view that illustrates a schematic configuration of a packaged solid-state battery according to another embodiment of the present invention. [Figure 4] FIG. 4 is a cross-sectional view that illustrates a schematic configuration of a packaged solid-state battery according to another embodiment of the present invention. [Diagram 5] FIG. 5 is a cross-sectional view that illustrates a schematic configuration of a packaged solid-state battery according to another embodiment of the present invention. [Figure 6] FIG. 6 is a cross-sectional view that illustrates a schematic configuration of a packaged solid-state battery according to another embodiment of the present invention. [Figure 7] FIG. 7 is a cross-sectional view showing a schematic configuration of a packaged solid-state battery according to another embodiment of the present invention. [Figure 8]FIG. 8 is a cross-sectional view that illustrates a schematic configuration of a packaged solid-state battery according to another embodiment of the present invention. [Figure 9] FIG. 9 is a cross-sectional view that illustrates a schematic configuration of a packaged solid-state battery according to another embodiment of the present invention. [Figure 10] FIG. 10 is a cross-sectional view that illustrates a schematic configuration of a packaged solid-state battery according to another embodiment of the present invention. [Figure 11] FIG. 11 is a cross-sectional view that illustrates a schematic configuration of a packaged solid-state battery according to another embodiment of the present invention. [Figure 12] FIG. 12 is a cross-sectional view showing a schematic diagram of a solid-state battery package, particularly showing an example of a substrate configuration. [Figure 13A] FIG. 13A is a process cross-sectional view that typically illustrates a manufacturing process for a solid-state battery package according to one embodiment of the present invention. [Figure 13B] FIG. 13B is a process cross-sectional view that typically illustrates a manufacturing process for a solid-state battery package according to one embodiment of the present invention. [Figure 13C] FIG. 13C is a process cross-sectional view that typically illustrates a manufacturing process for a solid-state battery package according to one embodiment of the present invention. [Figure 13D] FIG. 13D is a process cross-sectional view that typically illustrates a manufacturing process for a solid-state battery package according to one embodiment of the present invention. [Figure 13E] FIG. 13E is a process cross-sectional view that typically illustrates a manufacturing process for a solid-state battery package according to one embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] The solid-state battery package of the present invention will be described in detail below. Although the description will be made with reference to the drawings as necessary, the contents shown in the drawings are merely schematic and illustrative for understanding the present invention, and the appearance and dimensional ratios may differ from the actual product.

[0014] In this specification, the term "solid-state battery package" refers, in a broad sense, to a solid-state battery device (or solid-state battery product) configured to protect a solid-state battery from the external environment, and, in a narrow sense, to a solid-state battery product that is provided with a substrate useful for mounting and in which a solid-state battery is protected from the external environment.

[0015] In this specification, the term "cross-sectional view" refers to the shape of the solid-state battery when viewed from a direction substantially perpendicular to the stacking direction in the stacked structure (in other words, the shape when cut along a plane parallel to the thickness direction of the layers). In addition, the term "planar view" or "planar shape" used in this specification refers to a sketch of the object when viewed from above or below along the thickness direction of the layers (i.e., the stacking direction).

[0016] The "upper and lower directions" and "left and right directions" used directly or indirectly in this specification correspond to the upper and lower directions and left and right directions in the drawings, respectively. Unless otherwise specified, the same reference numerals or symbols indicate the same members or parts or the same meanings. In a preferred embodiment, the vertical downward direction (i.e., the direction in which gravity acts) can be considered to correspond to the "lower direction" / "bottom side", and the opposite direction can be considered to correspond to the "upper direction" / "top side".

[0017] In the present invention, the term "solid-state battery" refers to a battery whose components are made of solids in a broad sense, and to an all-solid-state battery whose components (particularly preferably all components) are made of solids in a narrow sense. In a preferred embodiment, the solid-state battery of the present invention is a laminated solid-state battery in which each layer constituting a battery unit is laminated on top of each other, and preferably each such layer is made of a fired body. The term "solid-state battery" includes not only so-called "secondary batteries" capable of repeated charging and discharging, but also "primary batteries" capable of only discharging. According to a preferred embodiment of the present invention, the "solid-state battery" is a secondary battery. The term "secondary battery" is not limited to being overly concerned with the name, and may include, for example, a power storage device. In the present invention, a solid-state battery included in a package may also be referred to as a "solid-state battery element."

[0018] In the following, first, a basic configuration of the solid-state battery of the present invention will be described. The configuration of the solid-state battery described here is merely an example for understanding the invention, and does not limit the invention.

[0019] [Basic structure of solid-state batteries] A solid-state battery includes at least positive and negative electrode layers and a solid electrolyte. Specifically, as shown in Fig. 1, a solid-state battery 100 includes a solid-state battery laminate including battery constituent units including a positive electrode layer 110, a negative electrode layer 120, and at least a solid electrolyte 130 interposed therebetween.

[0020] The layers constituting the solid-state battery may be formed by firing, and the positive electrode layer, the negative electrode layer, the solid electrolyte, etc. may form fired layers. Preferably, the positive electrode layer, the negative electrode layer, and the solid electrolyte are each fired together, and therefore the solid-state battery laminate forms an integrally fired body.

[0021] The positive electrode layer 110 is an electrode layer comprising at least a positive electrode active material. The positive electrode layer may further comprise a solid electrolyte. In a preferred embodiment, the positive electrode layer is made of a sintered body comprising at least positive electrode active material particles and solid electrolyte particles. On the other hand, the negative electrode layer is an electrode layer comprising at least a negative electrode active material. The negative electrode layer may further comprise a solid electrolyte. In a preferred embodiment, the negative electrode layer is made of a sintered body comprising at least negative electrode active material particles and solid electrolyte particles.

[0022] The positive electrode active material and the negative electrode active material are materials involved in the transfer of electrons in a solid-state battery. Ions move (conduct) between the positive electrode layer and the negative electrode layer via the solid electrolyte, transferring electrons to charge and discharge the battery. Each electrode layer of the positive electrode layer and the negative electrode layer is preferably a layer capable of absorbing and releasing lithium ions or sodium ions in particular. In other words, the solid-state battery is preferably an all-solid-state secondary battery in which lithium ions or sodium ions move between the positive electrode layer and the negative electrode layer via the solid electrolyte to charge and discharge the battery.

[0023] (Cathode active material) The positive electrode active material contained in the positive electrode layer 110 may be, for example, at least one selected from the group consisting of a lithium-containing phosphate compound having a Nasicon structure, a lithium-containing phosphate compound having an olivine structure, a lithium-containing layered oxide, and a lithium-containing oxide having a spinel structure. An example of a lithium-containing phosphate compound having a Nasicon structure is Li 3 V 2 (PO 4 ) 3 An example of a lithium-containing phosphate compound having an olivine structure is Li 3 Fe 2 (PO 4 ) 3 , LiFePO 4 , and / or LiMnPO 4 An example of a lithium-containing layered oxide is LiCoO 2 , and / or LiCo 1 / 3 Ni 1 / 3 Mn 1 / 3 O 2 An example of a lithium-containing oxide having a spinel structure is LiMn 2 O 4 , and / or LiNi 0.5 Mn 1.5 O 4 The lithium compound may be, for example, a lithium transition metal composite oxide or a lithium transition metal phosphate compound. The lithium transition metal composite oxide is a general term for oxides containing lithium and one or more transition metal elements as constituent elements, and the lithium transition metal phosphate compound is a general term for phosphate compounds containing lithium and one or more transition metal elements as constituent elements. The transition metal element may be, for example, cobalt (Co), nickel (Ni), manganese (Mn), and iron (Fe), for example, but is not limited to.

[0024] In addition, the positive electrode active material capable of absorbing and releasing sodium ions may be at least one selected from the group consisting of sodium-containing phosphate compounds having a Nasicon structure, sodium-containing phosphate compounds having an olivine structure, sodium-containing layered oxides, and sodium-containing oxides having a spinel structure. For example, in the case of sodium-containing phosphate compounds, Na 3 V 2 (PO 4 ) 3 , NaCoFe 2 (PO 4 ) 3 , Na 2 Ni 2 Fe(PO 4 ) 3 , Na 3 Fe 2 (PO 4 ) 3 , Na 2 FeP 2 O 7 , Na 4 Fe 3 (PO 4 ) 2 (P 2 O 7 ), and NaFeO as a sodium-containing layered oxide 2 At least one selected from the group consisting of:

[0025] In addition, the positive electrode active material may be, for example, an oxide, a disulfide, a chalcogenide, or a conductive polymer. The oxide may be, for example, titanium oxide, vanadium oxide, or manganese dioxide. The disulfide may be, for example, titanium disulfide or molybdenum sulfide. The chalcogenide may be, for example, niobium selenide. The conductive polymer may be, for example, disulfide, polypyrrole, polyaniline, polythiophene, polyparastyrene, polyacetylene, or polyacene.

[0026] (Negative electrode active material) The negative electrode active material contained in the negative electrode layer 120 may be, for example, at least one selected from the group consisting of an oxide containing at least one element selected from the group consisting of titanium (Ti), silicon (Si), tin (Sn), chromium (Cr), iron (Fe), niobium (Nb) and molybdenum (Mo), a carbon material such as graphite, a graphite-lithium compound, a lithium alloy, a lithium-containing phosphate compound having a Nasicon structure, a lithium-containing phosphate compound having an olivine structure, and a lithium-containing oxide having a spinel structure. An example of a lithium alloy is Li-Al. An example of a lithium-containing phosphate compound having a Nasicon structure is Li. 3 V 2 (PO 4 ) 3 , and / or LiTi 2 (PO 4 ) 3 An example of a lithium-containing phosphate compound having an olivine structure is Li 3 Fe 2 (PO 4 ) 3 , and / or LiCuPO 4 An example of a lithium-containing oxide having a spinel structure is Li 4 Ti 5 O 12 etc.

[0027] In addition, examples of negative electrode active materials capable of absorbing and releasing sodium ions include at least one selected from the group consisting of sodium-containing phosphate compounds having a Nasicon structure, sodium-containing phosphate compounds having an olivine structure, and sodium-containing oxides having a spinel structure.

[0028] In addition, in the solid-state battery, the positive electrode layer and the negative electrode layer may be made of the same material.

[0029] The positive electrode layer and / or the negative electrode layer may contain a conductive material. The conductive material contained in the positive electrode layer and the negative electrode layer may include at least one of metal materials such as silver, palladium, gold, platinum, aluminum, copper, and nickel, and carbon.

[0030] Furthermore, the positive electrode layer and / or the negative electrode layer may contain a sintering aid, which may be at least one selected from the group consisting of lithium oxide, sodium oxide, potassium oxide, boron oxide, silicon oxide, bismuth oxide, and phosphorus oxide.

[0031] The thickness of the positive electrode layer and the negative electrode layer is not particularly limited, but may be, for example, each independently from 2 μm to 50 μm, particularly from 5 μm to 30 μm.

[0032] (Positive electrode current collecting layer / Negative electrode current collecting layer) Although not essential elements of the electrode layer, the positive electrode layer 110 and the negative electrode layer 120 may each have a positive electrode current collecting layer and a negative electrode current collecting layer. The positive electrode current collecting layer and the negative electrode current collecting layer may each have the form of a foil. However, if more importance is placed on the viewpoints of improving electronic conductivity by co-firing, reducing the manufacturing cost of the solid battery, and / or reducing the internal resistance of the solid battery, the positive electrode current collecting layer and the negative electrode current collecting layer may each have the form of a sintered body. As the positive electrode current collecting layer and the negative electrode current collecting layer, it is preferable to use a material with high electrical conductivity, and for example, silver, palladium, gold, platinum, aluminum, copper, and / or nickel may be used. The positive electrode current collecting layer and the negative electrode current collecting layer may each have an electrical connection part for electrically connecting to the outside, and may be configured to be electrically connectable to the end surface electrode. When the positive electrode current collecting layer and the negative electrode current collecting layer have the form of a sintered body, they may be configured of a sintered body containing a conductive material and a sintering aid. The conductive material contained in the positive electrode current collecting layer and the negative electrode current collecting layer may be selected from, for example, the same materials as the conductive materials that may be contained in the positive electrode layer and the negative electrode layer. The sintering aid contained in the positive electrode current collecting layer and the negative electrode current collecting layer may be selected from, for example, the same materials as the sintering aid that may be contained in the positive electrode layer and the negative electrode layer. As described above, the positive electrode current collecting layer and the negative electrode current collecting layer are not essential in the solid-state battery, and a solid-state battery that does not have such a positive electrode current collecting layer and a negative electrode current collecting layer is also conceivable. In other words, the solid-state battery included in the package of the present invention may be a solid-state battery without a current collecting layer.

[0033] (solid electrolyte) The solid electrolyte is a material capable of conducting lithium ions or sodium ions. In particular, the solid electrolyte 130 constituting a battery unit in a solid-state battery may be a layer capable of conducting lithium ions between the positive electrode layer 110 and the negative electrode layer 120. The solid electrolyte may be provided at least between the positive electrode layer and the negative electrode layer. In other words, the solid electrolyte may be present around the positive electrode layer and / or the negative electrode layer so as to protrude from between the positive electrode layer and the negative electrode layer. Specific examples of the solid electrolyte include one or more of a crystalline solid electrolyte, a glass-based solid electrolyte, and a glass ceramic-based solid electrolyte.

[0034] The crystalline solid electrolyte is, for example, an oxide-based crystalline material and a sulfide-based crystalline material. Examples of the oxide-based crystalline material include a lithium-containing phosphate compound having a Nasicon structure, an oxide having a perovskite structure, an oxide having a garnet type or a garnet-like structure, and an oxide glass ceramic-based lithium ion conductor. Examples of the lithium-containing phosphate compound having a Nasicon structure include Li x M y (PO 4 ) 3 (1≦x≦2, 1≦y≦2, M is at least one selected from the group consisting of titanium (Ti), germanium (Ge), aluminum (Al), gallium (Ga) and zirconium (Zr). An example of a lithium-containing phosphate compound having a Nasicon structure is Li 1.2 Al 0.2 Ti 1.8 (PO 4 ) 3 An example of an oxide having a perovskite structure is La 0.55 Li 0.35 TiO 3 An example of an oxide having a garnet-type or garnet-like structure is Li 7 La 3 Zr 2 O 12 Examples of sulfide crystal materials include thio-LISICON, for example Li 3.25 Ge0.25 P 0.75 S4 and Li 10 GeP 2 S 12 The crystalline solid electrolyte may include a polymer material (eg, polyethylene oxide (PEO)).

[0035] The glass-based solid electrolyte may be, for example, an oxide-based glass material or a sulfide-based glass material. The oxide-based glass material may be, for example, 50Li 4 SiO 4 50Li 3 BO 3 In addition, sulfide glass materials include, for example, 30Li 2 S·26B 2 S 3 44LiI, 63Li 2 S·36SiS 2 1Li 3 PO 4 , 57Li 2 S·38SiS 2 5Li 4 SiO 4 , 70Li 2 S·30P 2 S 5 and 50Li 2 S·50GeS 2 etc.

[0036] The glass ceramics-based solid electrolyte may be, for example, an oxide-based glass ceramics material or a sulfide-based glass ceramics material. As the oxide-based glass ceramics material, for example, a phosphate compound containing lithium, aluminum, and titanium as constituent elements (LATP) or a phosphate compound containing lithium, aluminum, and germanium as constituent elements (LAGP) may be used. LATP is, for example, Li 1.07 Al 0.69 Ti 1.46 (PO 4 ) 3 For example, LAGP is 1.5 Al 0.5 Ge 1.5 (PO 4) and the like. Examples of sulfide-based glass ceramic materials include Li 7 P 3 S 11 and Li 3.25 P 0.95 S 4 etc.

[0037] Examples of the solid electrolyte capable of conducting sodium ions include sodium-containing phosphate compounds having a Nasicon structure, oxides having a perovskite structure, and oxides having a garnet type or garnet-like structure. Examples of the sodium-containing phosphate compounds having a Nasicon structure include Na x M y (PO 4 ) 3 (1≦x≦2, 1≦y≦2, M is at least one selected from the group consisting of Ti, Ge, Al, Ga and Zr).

[0038] The solid electrolyte may contain a sintering aid. The sintering aid contained in the solid electrolyte may be selected from the same materials as the sintering aids that may be contained in the positive electrode layer and the negative electrode layer, for example.

[0039] The thickness of the solid electrolyte is not particularly limited. The thickness of the solid electrolyte layer located between the positive electrode layer and the negative electrode layer may be, for example, 1 μm or more and 15 μm or less, and particularly 1 μm or more and 5 μm or less.

[0040] (end face electrode) A solid-state battery is generally provided with an end electrode 140. In particular, the end electrode is provided on the side surface of the solid-state battery. More specifically, a positive end electrode 140A connected to the positive electrode layer 110 and a negative end electrode 140B connected to the negative electrode layer 120 are provided (see FIG. 1). Such an end electrode is preferably made of a material having high electrical conductivity. Specific examples of the material of the end electrode include, but are not limited to, at least one selected from the group consisting of silver, gold, platinum, aluminum, copper, tin, and nickel.

[0041] [Characteristics of the solid-state battery package of the present invention] The present invention relates to a packaged solid-state battery, that is, a solid-state battery package having a substrate conducive to mounting and configured to protect the solid-state battery from the external environment.

[0042] Fig. 2 is a cross-sectional view showing a schematic configuration of a packaged solid-state battery according to one embodiment of the present invention. As shown in Fig. 2, a solid-state battery package 1000 according to one embodiment of the present invention includes a substrate 200 for supporting a solid-state battery 100. Specifically, the solid-state battery package 1000 includes the substrate 200 for mounting, and the solid-state battery 100 provided on the substrate 200 and protected from the external environment.

[0043] The inventors of the present application have conducted extensive research into a solution for suitably preventing cracking of the substrate 200 in the above-mentioned solid-state battery package 1000, and as a result have devised the present invention having the following technical concept.

[0044] Specifically, the present invention is based on the technical idea of ​​"deliberately providing a member that makes it difficult for stress to act on the substrate 200 from the solid-state battery 100 side to the substrate 200 side, which may occur during charging and discharging of the solid-state battery 100 as discovered by the present inventors."

[0045] In order to realize the above technical idea, the present invention has the following technical features (see FIG. 2). Specifically, the substrate 200 has at least one of a positive-side substrate electrode layer 210A and a negative-side substrate electrode layer 210B arranged opposite and spaced apart from the positive-side substrate electrode layer 210A, both of which can be electrically connected to the solid-state battery 100, on one main surface 230 facing the solid-state battery 100.

[0046] On the other hand, the substrate 200 is provided with a substrate electrode layer 220 for mounting the solid-state battery package 1000 on an external substrate on the other main surface 240, specifically a substrate electrode layer 220A on the positive electrode side and a substrate electrode layer 220B on the negative electrode side arranged to face and separate from the substrate electrode layer 220A on the positive electrode side. The substrate electrode layer 210 on the solid-state battery installation side and the substrate electrode layer 220 on the mounting side are configured to be electrically connectable via a metal member provided inside the substrate 220. The metal member may be made of at least one metal material selected from the group consisting of, for example, copper, aluminum, stainless steel, nickel, silver, gold, and tin.

[0047] In order to enable electrical connection between the solid-state battery 100 and the substrate electrode layer 210 of the substrate 200, the end surface electrode 140 of the solid-state battery 100 and the substrate electrode layer 210 of the substrate 200 can be connected via a bonding member 600. This bonding member 600 at least serves to electrically connect the end surface electrode 140 of the solid-state battery 100 and the substrate 200, and may include, for example, a conductive adhesive. As an example, the bonding member 600 may be made of an epoxy-based conductive adhesive containing a metal filler such as Ag.

[0048] In addition, when there is no particular distinction between the positive substrate electrode layer 210A and the negative substrate electrode layer 210B, the substrate electrode layer is designated by the reference numeral 210. When there is no particular distinction between the positive electrode layer 110 and the negative electrode layer 120, they are referred to as solid electrode layers, and the reference numeral 115 is used for the solid electrode layer. When there is no particular distinction between the positive end electrode 140A and the negative end electrode 140B, the reference numeral 140 is used for the end electrode.

[0049] Assuming the above configuration, as shown in FIG. 2, the distance L1 between the one side surface 211 and the other side surface 212 of the substrate electrode layer 210 is equal to or greater than the minimum distance L2 at which the distance between the end surface 141 of the end surface electrode 140 on the same polarity side and the side surface 115a of the solid-state battery electrode layer 115 on the opposite polarity side facing the end surface 141 is minimum. In this specification, the term "solid-state battery electrode layer" refers to an electrode layer that is a component of a solid-state battery, and may also be referred to as an electrode layer on the solid-state battery side. In this specification, the term "substrate electrode layer" refers to an electrode layer that is a component of a substrate, and may also be referred to as an electrode layer on the substrate side. Specifically, the term "substrate electrode layer" refers to an electrode layer that is arranged on the main surface (which may also be referred to as the upper main surface) facing the solid-state battery opposite the main surface on which the external substrate is mounted, among the two main surfaces of the substrates that face each other. "One side surface of the substrate electrode layer and the end surface of the edge electrode are substantially on the same line" refers to a positional relationship in which the end surface of the edge electrode and one side surface of the substrate electrode layer are substantially in series, either directly or via a bonding member, and the one side surface of the substrate electrode layer here refers not only to the actual one side surface of the substrate electrode layer, but also to an apparent one side surface that may be arranged in series with the end surface of the edge electrode. Note that each of the end surface of the edge electrode and one side surface of the substrate electrode layer may be linear or curved.

[0050] As found by the inventors of the present application, among the stresses acting from the solid-state battery 100 side to the substrate 200 side, the stress along the interface region 180 between the solid-state battery electrode layer 115 and the end electrode 140 is relatively the largest, and therefore the stress can act on a predetermined location of the substrate 200 located below the end electrode 140. In the present specification, the term "interface region" broadly refers to the boundary portion where the solid-state battery electrode layer 115 and the end electrode 140 are in contact with each other and the vicinity of the boundary portion. In the present specification, the term "interface region" narrowly refers to a portion that is 0% or more and less than 5% of the width of the region between the interface region and the central region of the battery element, based on the interface region.

[0051] In this regard, according to the above technical feature, in a cross-sectional view, the distance L1 (corresponding to the width dimension of the substrate electrode layer 210) between one side surface 211 and the other side surface 212 of the substrate electrode layer 210 is equal to or greater than the minimum distance L2 between the end surface 141 of the end surface electrode 140 on the same polarity side and the side surface 115a of the solid battery electrode layer 115 on the counter polarity side. In other words, in a cross-sectional view, the other side surface 212 of the substrate electrode layer 210 and the side surface 115a of the solid battery electrode layer 115 on the counter polarity side can be positioned on approximately the same line. In this specification, the "minimum distance" refers to the minimum linear horizontal distance connecting a predetermined point on the end surface of the end surface electrode and a predetermined point on the side surface of the solid battery electrode layer on the counter polarity side facing the end surface.

[0052] As a result, in a cross-sectional view, the other side surface 212 of the substrate electrode layer 210 is located inside the interface region 180 between the same-polarity solid battery electrode layer 115 and the end electrode 140. Therefore, the largest stress that can act on the substrate 200 side along the interface region 180 between the same-polarity solid battery electrode layer 115 and the end electrode 140 is received by the substrate electrode layer 210 not at a "point" but at a "surface." That is, the substrate electrode layer 210 can function as a "stress receiving layer," specifically, as a "'surface' receiving layer of stress."

[0053] Furthermore, since the substrate electrode layer 210 itself can be electrically connected to the solid-state battery 100, it can be made of a metal layer with relatively high strength. This metal layer can be made of, for example, copper (Cu) plated with gold (Au) (Cu-Au), or copper (Cu) plated with nickel (Ni) and gold (Au) (Cu-Ni-Au), etc. Although not particularly limited, the thickness of the substrate electrode layer 210 can be 2 to 50 μm, for example 30 μm.

[0054] From the above, the largest stress that may act on the substrate 200 side along the interface region 180 between the solid battery electrode layer 115 on the same polarity side and the end electrode 140 can be received by the relatively strong "plane"-shaped substrate electrode layer 210. Such stress reception by the substrate electrode layer 210 can suppress the same stress from acting on a predetermined location on the main surface 230 of the substrate 200 along the interface region 180 between the solid battery electrode layer 115 and the end electrode 140. As a result, according to one embodiment of the present invention, cracking of the substrate 200 can be suitably suppressed. Such suppression of cracking of the substrate can suppress the intrusion of moisture from the external environment into the solid battery 100 through the substrate 200. Therefore, according to one embodiment of the present invention, the battery characteristics can be improved.

[0055] In the above, the contents related to the suppression of cracking of the substrate 200 due to the stress reception of the substrate electrode layer 210 according to the main characteristic part of the present invention have been described. In addition, the solid-state battery package 1000 according to one embodiment of the present invention may also have the property of preventing water vapor transmission as described below. Therefore, the contents related to the prevention of water vapor transmission will be described below. Note that, in this specification, "water vapor" is not limited to water in a gaseous state, but also includes water in a liquid state. In other words, the term "water vapor" is used to broadly include matters related to water, regardless of the physical state. Therefore, "water vapor" can also be referred to as moisture, and in particular, liquid water can include condensed water formed by condensing water in a gaseous state.

[0056] As described above, the substrate 200 is configured to support the solid-state battery 100. Therefore, the substrate 200 is provided so as to shield the main surface of the solid-state battery 100 from the external environment. The presence of the substrate 200 can also suppress the intrusion of water vapor into the solid-state battery 100.

[0057] Also, as shown in FIG. 2, the substrate 200 has a main surface larger than that of, for example, a solid-state battery. The substrate 200 may be a resin substrate. Alternatively, the substrate 200 may be a ceramic substrate. In short, the substrate 200 may be a substrate that falls within the category of a printed wiring board, a flexible substrate, an LTCC substrate, or an HTCC substrate. When the substrate 200 is a resin substrate, the substrate 200 may be a substrate that is configured to include a resin as a base material, for example, a substrate that includes a resin layer in its laminate structure. The resin material of such a resin layer may be any thermoplastic resin and / or any thermosetting resin. Also, the resin layer may be, for example, a substrate that is configured by impregnating a glass fiber cloth with a resin material such as an epoxy resin.

[0058] The substrate is preferably a member for an external terminal of the packaged solid-state battery. In other words, it can be said that the substrate is a terminal substrate for the external terminal of the solid-state battery. A solid-state battery package including such a substrate can mount the solid-state battery on another external substrate (i.e., a secondary substrate) such as a printed wiring board with the substrate interposed therebetween. For example, the solid-state battery can be surface-mounted via a support substrate through solder reflow or the like. For this reason, the solid-state battery package of the present invention is preferably an SMD (Surface Mount Device) type battery package.

[0059] Furthermore, in one embodiment of the present invention, not only the substrate 200 but also the solid-state battery package 1000 itself can be configured to prevent water vapor permeation as a whole. For example, the solid-state battery package 1000 according to one embodiment of the present invention can be covered with a covering material 150 so that the solid-state battery 100 provided on the substrate 200 is entirely surrounded. Specifically, the solid-state battery 100 on the substrate 200 can be packaged so that the main surface 100A and the side surface 100B are surrounded by the covering material 150. With this configuration, all the surfaces constituting the solid-state battery 100 are not exposed to the outside, and water vapor permeation can be more suitably prevented.

[0060] For example, as shown in FIG. 2, the covering material 150 may be composed of a covering insulating layer and a covering inorganic layer, and the solid-state battery 100 may have a form in which at least the covering insulating layer 160 and the covering inorganic layer 170 are covered as the covering material 150 .

[0061] The covering insulating layer 160 is a layer provided so as to cover the main surface 100A and the side surface 100B of the solid-state battery 100. The covering insulating layer 160 largely envelops the solid-state battery 100 on the substrate 200 as a whole. The material of the covering insulating layer may be any type as long as it exhibits insulating properties. For example, the covering insulating layer 160 may contain a resin, and the resin may be either a thermosetting resin or a thermoplastic resin. The covering insulating layer 160 may contain an inorganic filler. As merely one example, the covering insulating layer 160 may be made of an epoxy-based resin containing an inorganic filler such as SiC.

[0062] The coating inorganic layer 170 is provided so as to cover the coating insulating layer 160. As shown in FIG. 2, the coating inorganic layer 170 is positioned on the coating insulating layer 160, and thus has a form that, together with the coating insulating layer 160, largely envelops the solid-state battery 100 on the substrate 200 as a whole. This coating inorganic layer may have, for example, a film form. Furthermore, the coating inorganic layer 170 can take a form that covers the side surface 250 of the substrate 200 as well. The coating insulating layer 160 cooperates with the coating inorganic layer 170 to form a suitable water vapor barrier, and the coating inorganic layer 170 cooperates with the coating insulating layer 160 to form a suitable water vapor barrier. The material of the coating inorganic layer 170 is not particularly limited, and may be metal, glass, oxide ceramics, or a mixture thereof. The coating inorganic layer 170 may be equivalent to an inorganic layer having a thin film form, and in this case, it is preferable that it is, for example, a metal film. As merely one example, the coating inorganic layer 170 may be made of a Cu-based and / or Ni-based material plated to a thickness of 2 μm or more and 50 μm or less.

[0063] Preferred embodiments of the present invention will now be described.

[0064] In a preferred embodiment, the other side surface 212 of the substrate electrode layer 210 is located inside the side surface 115a of the counter solid battery electrode layer 115 in a cross-sectional view (see FIG. 3).

[0065] Fig. 3 is a cross-sectional view showing a schematic configuration of a packaged solid-state battery according to another embodiment of the present invention. As described above, the basic embodiment of the present invention shown in Fig. 2 is based on the case where the other side surface 212 of the substrate electrode layer 210 and the side surface 115a of the counter-electrode solid-state battery electrode layer 115 can be positioned on substantially the same line in cross-sectional view. In contrast, the embodiment shown in Fig. 3 is characterized in that the other side surface 212 of the substrate electrode layer 210 is positioned more inward than the side surface 115a of the counter-electrode solid-state battery electrode layer 115, as compared with the embodiment shown in Fig. 2.

[0066] As found by the inventors of the present application, the stress acting from the solid-state battery 100 side to the substrate 200 side may increase toward the interface region 180 between the electrode layer 115 and the end electrode 140. For this reason, the stress along the interface region 180 may be the largest, and the stress may gradually decrease from the interface region 180 toward the central region of the battery element 100X. Note that the term "battery element" in this specification refers to an element including the positive electrode layer 110, the negative electrode layer 120, and the solid electrolyte 130, excluding the end electrodes.

[0067] In consideration of this, the other side surface 212 of the substrate electrode layer 210 is positioned inside the side surface 115a of the counter solid-state battery electrode layer 115. That is, the substrate electrode layer 210 is extended to a position where it can face the counter solid-state battery electrode layer 115 in a cross-sectional view. This makes it possible to expand the area of ​​the substrate electrode layer 210 that can function as a planar stress reception layer, compared to the basic embodiment shown in FIG.

[0068] As a result, among the stresses that may act on the substrate 200 side, the stress along the region between the interface region 180 and the central region 100X1 of the battery element 100X can also be received by the relatively strong "planar" substrate electrode layer 210. As a result, it is also possible to suppress the stress along the region between the interface region 180 and the central region 100X1 of the battery element 100X from acting on a predetermined location on the main surface 230 of the substrate 200.

[0069] As an example, in a cross-sectional view, it is preferable that the distance L1 (corresponding to the width dimension) between one side 211 and the other side 212 of the substrate electrode layer 210 is 1.5 times or more the above-mentioned minimum distance L2 (see FIG. 4).

[0070] FIG. 4 is a cross-sectional view showing a schematic configuration of a packaged solid-state battery according to another embodiment of the present invention. As described above, the stress that can act on the substrate 200 side has the property of gradually decreasing from the interface region 180 toward the central region of the battery element 100X. Therefore, the stress along the region between the interface region 180 and the central region 100X1 of the battery element 100X that is close to the interface region 180 is only slightly smaller than the stress along the interface region 180. Therefore, the stress along this range of region also affects the substrate 200 side. In this specification, the "region close to the interface region" refers to a portion that is greater than 5% and less than 20% of the width of the region between the interface region 180 and the central region 100X1 of the battery element 100X, based on the interface region 180.

[0071] In consideration of this, the width dimension of the substrate electrode layer 210 is set to 1.5 times or more the above-mentioned minimum distance L2. This makes it possible to expand the area of ​​the substrate electrode layer 210 that can function as a planar stress-receiving layer, compared to the basic embodiment of the present invention shown in Fig. 2. As a result, the stress along the area close to the interface region 180 can also be suitably received by the relatively strong "planar" substrate electrode layer 210.

[0072] From a similar viewpoint, it is preferable that the distance L1 (corresponding to the width dimension) between one side surface 211 and the other side surface 212 of the substrate electrode layer 210 is equal to or greater than the maximum distance L3 at which the distance between the end surface 141 of the end surface electrode 140 on the same polarity side and the side surface 115a of the solid battery electrode layer 115 on the opposite polarity side facing the end surface 141 is maximized (see FIG. 5).

[0073] FIG. 5 is a cross-sectional view showing a schematic configuration of a packaged solid-state battery according to another embodiment of the present invention. As found by the present inventors, the stress acting on the substrate 200 side has a property of gradually increasing toward the interface region 180 between the electrode layer 115 and the end electrode 140. In view of this, in order to be able to accept a relatively large stress along the interface region 180 and the region adjacent thereto, it is preferable that the width dimension of the substrate electrode layer 210 is secured larger than that of the basic embodiment shown in FIG. 2. Specifically, it is preferable that the width dimension of the substrate electrode layer 210 is set to be equal to or larger than the maximum distance L3. This allows the region of the substrate electrode layer 210 that can function as a planar stress acceptance layer to be expanded compared to the basic embodiment shown in FIG. 2.

[0074] As an example, it is more preferable that the distance L1 (corresponding to the width dimension) between one side 211 and the other side 212 of the substrate electrode layer 210 in a cross-sectional view is 2.0 times or more the above-mentioned minimum distance L2 (see FIG. 6).

[0075] 6 is a cross-sectional view showing a schematic configuration of a packaged solid-state battery according to another embodiment of the present invention. As described above, the stress that can act on the substrate 200 side has a property of gradually decreasing from the interface region 180 toward the central region of the battery element 100X. Therefore, the stress along the region between the interface region 180 and the central region 100X1 of the battery element 100X that is greater than 20% and less than 50% of the width is only slightly smaller than the stress along the region close to the interface region 180. Therefore, the stress along this region also affects the substrate 200 side.

[0076] In consideration of this, the width dimension of the substrate electrode layer 210 is set to 2.0 times or more the above-mentioned minimum distance L2. This makes it possible to further expand the area of ​​the substrate electrode layer 210 that can function as a planar stress-receiving layer, compared to the embodiment shown in Fig. 4. As a result, stress along an area that is 50% or less of the width of the area between the interface region 180 and the central region 100X1 of the battery element 100X can also be suitably received by the relatively strong "planar" substrate electrode layer 210.

[0077] As an example, it is more preferable that the substrate electrode layer 210 extends along the main surface 230 of the substrate 200 facing the solid-state battery 100 to such an extent that it does not come into contact with the substrate electrode layer 210 on the counter electrode side (see FIG. 7).

[0078] FIG. 7 is a cross-sectional view showing a schematic configuration of a packaged solid-state battery according to another embodiment of the present invention. As found by the present inventors, the stress acting on the substrate 200 side has a property of gradually increasing from the central region 100X1 of the battery element 100X toward the interface region 180 between the electrode layer 115 and the end electrode 140. In this regard, even if there is a difference in the magnitude of the stress, the stress can act from the solid-state battery 100 side to the substrate 200 side along the entire region from the interface region 180 to the central region 100X1 side of the battery element 100X. For this reason, as shown in FIG. 7, it is more preferable that the substrate electrode layer 210 extends along the main surface 230 of the substrate 200 to such an extent that it does not contact the substrate electrode layer 210 on the counter electrode side. This allows the substrate electrode layer 210 to receive stress that may act on the substrate 200 side along the entire region from the interface region 180 to the central region 100X1 side of the battery element 100X.

[0079] In particular, when both the positive electrode side substrate electrode layer 210A and the negative electrode side substrate electrode layer 210B have the above configuration, the total width of both substrate electrode layers 210A and 210B can be made close to the overall width of the solid-state battery 100 in a cross-sectional view. Therefore, both substrate electrode layers 210A and 210B can absorb almost all of the stress that can act on the substrate 200. As a result, it is possible to more suitably suppress cracking of the substrate 200.

[0080] In a preferred embodiment, in cross-sectional view, one side 211 of the substrate electrode layer 210 is located outside the end face 141 of the end electrode 140 and inside the end 231 of the main surface 230 of the substrate 200 (see FIG. 8).

[0081] 8 is a cross-sectional view showing a schematic configuration of a packaged solid-state battery according to another embodiment of the present invention. According to the configuration of this embodiment, the substrate electrode layer 210 can be positioned not only inside but also outside the end face 141 of the end electrode 140. Specifically, the substrate electrode layer 210 can extend outside the end face 141 of the end electrode 140 along the main surface 230 of the substrate 200 by a distance L4 between one side surface 211 of the substrate electrode layer 210 and the end face 141 of the end electrode 140.

[0082] In this case, the inner portion 210α of the substrate electrode layer 210 located on the inside with respect to the end face 141 of the end electrode 140 functions as a planar stress receiving layer as described above. On the other hand, the outer portion 210β of the substrate electrode layer 210 located on the outside with respect to the end face 141 of the end electrode 140 can be a portion through which water vapor is relatively difficult to permeate because the substrate electrode layer 210 itself is a metal layer. This makes it possible to prevent water vapor from penetrating from the external environment through the substrate 200 into the solid-state battery 100.

[0083] As described above, the coated inorganic layer 170 also covers the side surface 250 of the substrate 200, and may be, for example, a metal film. Therefore, from the viewpoint of ensuring electrical insulation between the substrate electrode layer 210 and the coated inorganic layer 170 without them coming into contact with each other, it is preferable that one side surface 211 of the substrate electrode layer 210 is located inside the side surface of the substrate 200, that is, inside the end portion 231 of the main surface 230 of the substrate 200.

[0084] In a preferred embodiment, the substrate 200 further includes a dummy substrate electrode layer 210C disposed on a main surface 230 of the substrate 200 facing the solid-state battery 100, the dummy substrate electrode layer 210C being spaced apart from and facing the substrate electrode layer 210 and not electrically connected to the solid-state battery 100 (see FIG. 9).

[0085] FIG. 9 is a cross-sectional view showing a schematic configuration of a packaged solid-state battery according to another embodiment of the present invention. According to the configuration of this embodiment, on one main surface 230 of the substrate 200, there is a substrate electrode layer 210 that can function as at least a planar stress receiving layer, and a dummy substrate electrode layer 210C that is spaced apart from the substrate electrode layer 210. On the other hand, on the other main surface 240 of the substrate 200, at least the mounting side substrate electrode layer 220 is provided at a predetermined interval. In this respect, the presence of the dummy substrate electrode layer 210C has the following advantages compared to the absence of the dummy substrate electrode layer 210C. Specifically, the arrangement patterns of the electrode layers arranged on the two opposing main surfaces 230 and 240 of the substrate 200 can be made similar. Therefore, the warping of the substrate 200 can be suppressed, and as a result, the rigidity of the substrate 200 itself can be increased. In addition, since the dummy substrate electrode layer 210C itself is a metal layer, it can be a portion that is relatively difficult for water vapor to permeate. This makes it possible to prevent water vapor from entering the solid-state battery 100 side from the external environment through the substrate 200.

[0086] 10, the dummy substrate electrode layer 210C can be further disposed between the positive substrate electrode layer 210A and the negative substrate electrode layer 210B at a distance such that the dummy substrate electrode layer 210C does not contact the positive substrate electrode layer 210A and the negative substrate electrode layer 210B. This arrangement can further improve the rigidity and water vapor barrier properties of the substrate 200 itself. Furthermore, since the dummy substrate electrode layer 210C in this case is located on the inside with respect to the end surface 141 of the end surface electrode 140, it can also function as a planar stress receiving layer.

[0087] In a preferred embodiment, it is preferable to provide a water vapor barrier layer 300 between the substrate 200 and the solid-state battery 100 (see FIG. 11).

[0088] FIG. 11 is a cross-sectional view showing a schematic configuration of a packaged solid-state battery according to another embodiment of the present invention. As described above, the solid-state battery package 1000 includes the substrate 200 and the solid-state battery 100 mounted on the substrate 200. The substrate 200 is provided so as to shield the main surface of the solid-state battery 100 from the external environment. Therefore, it is generally considered that the presence of the substrate can prevent water vapor from penetrating into the solid-state battery. In this regard, there may be cases where the substrate 200 alone is not sufficient to prevent water vapor from passing through. This is because the substrate 200 may have permeability to water vapor in the external environment due to the material and / or configuration of the substrate 200.

[0089] For this reason, it is preferable to provide a water vapor barrier layer 300 between the solid-state battery 100 and the substrate 200. This water vapor barrier layer may have, for example, a film form. By providing such a water vapor barrier layer 300, it is possible to effectively suppress water vapor permeation to the solid-state battery 100 side through the substrate 200. This makes it possible to suppress, for example, a decrease in the ionic conductivity of the solid electrolyte 130 caused by a reaction between the solid electrolyte 130 and water vapor (moisture) that has infiltrated from the substrate 200.

[0090] The water vapor barrier layer 300 may be provided so as to be in contact with the covering insulating layer 160. In other words, the covering insulating layer 160 is preferably provided so as to cover not only the side surface of the solid-state battery 100 but also the bottom surface of the solid-state battery, and the water vapor barrier layer 300 may be provided so as to be in contact with such a covering insulating layer 160. This means that the water vapor barrier layer is provided between the sealing resin surrounding the periphery of the solid-state battery and the substrate. When the resist layer 400 is provided on the substrate 200, the water vapor barrier layer 300 may be disposed between the covering insulating layer 160 and the resist layer 400.

[0091] The thickness of the water vapor barrier layer and each layer of the solid-state battery and the substrate may be based on an electron microscope image. For example, the thickness of the water vapor barrier layer and the thickness of the layers constituting the substrate and the solid-state battery may be based on an image obtained by cutting a cross section using an ion milling device (model number IM4000PLUS, manufactured by Hitachi High-Technologies Corporation) and using a scanning electron microscope (SEM) (model number SU-8040, manufactured by Hitachi High-Technologies Corporation). In other words, the thickness dimension in this specification may refer to a value calculated from the dimension measured from the image obtained by such a method.

[0092] In this specification, the term "barrier" means that the substrate has a water vapor permeability preventing property to such an extent that water vapor from the external environment does not pass through the substrate and cause unfavorable characteristic deterioration of the solid-state battery. In the narrow sense, the water vapor permeability is 5×10 -3 g / (m 2 ·Day). In short, the water vapor barrier layer is preferably 0 g / (m 2 Day) or more 5×10 -3 g / (m 2 Water vapor transmission rate (e.g., 0.5×10 ·Day) less than -3 g / (m 2 Day) or more 5×10 -3 g / (m 2 In this specification, the term "water vapor transmission rate" refers to the transmission rate obtained by the MA method using a gas transmission rate measuring device (Model WG-15S) manufactured by MORESCO Corporation under the measurement conditions of 85°C, 85% RH.

[0093] In a preferred embodiment, the water vapor barrier layer 300 is disposed so as to extend along the extending direction of the main surface 230 of the substrate 200 (see FIG. 11).

[0094] According to such an arrangement of the water vapor barrier layer 300, as shown in FIG. 11, the water vapor barrier layer 300 may extend in the width direction of the solid-state battery package 1000, and may extend across the solid-state battery package 1000. This means that the water vapor barrier layer 300 extends in a direction perpendicular to the stacking direction of the solid-state battery. The water vapor barrier layer 300 thus extending widely along the direction of the main surface 230 of the substrate 300 can more suitably block water vapor that penetrates from the external environment via the substrate 200. In other words, the water vapor barrier layer 300 can more suitably act to prevent water vapor from the outside of the package from finally reaching the solid-state battery 100, resulting in a suitable solid-state battery package 1000 in which deterioration of the solid-state battery characteristics is suppressed in the long term.

[0095] The water vapor barrier layer 300 thus extending in the direction along the principal surface direction of the substrate 200 is preferably provided widely up to the region outside the solid-state battery 100. In other words, it is preferable that the water vapor barrier layer 300 is provided widely so as to extend beyond the solid-state battery 100. For example, the water vapor barrier layer 300 may extend up to the covering material covering the solid-state battery 100.

[0096] For example, the water vapor barrier layer 300 may extend to the outer surface of the covering insulating layer 160 covering the solid-state battery 100 on the substrate 200. In other words, when the solid-state battery package 1000 has the covering insulating layer 160 provided so as to cover at least the main surface 100A and the side surface 100B of the solid-state battery 100 on the substrate 200, it is preferable that the water vapor barrier layer 300 extends to the outer surface 160A of the covering insulating layer 160 covering the side surface 100B of the solid-state battery (see FIG. 11). This makes it possible to more suitably prevent water vapor from penetrating from the external environment via the substrate 200. In other words, the water vapor barrier layer 300 can more reliably act to prevent external water vapor penetrating via the substrate 200 from reaching the solid-state battery 100.

[0097] In a preferred embodiment, the water vapor barrier layer 300 is an insulating layer having electrical insulation properties. That is, the water vapor barrier layer 300 may be a film containing a material having high electrical insulation properties. This is because it is easier to suppress undesirable events such as short circuits. That is, while preventing water vapor permeation, it is possible to suppress undesirable electrical effects caused by water vapor permeation. Such a water vapor barrier layer 300 is not particularly limited as long as it is made of a material exhibiting insulation properties, and specific examples of the material include inorganic insulators such as glass and alumina, and organic insulators such as resin, and the like. These may be used alone or in combination of two or more kinds.

[0098] As an example, the water vapor barrier layer 300 may have a single layer form as shown in Fig. 11. Alternatively, the water vapor barrier layer 300 may have a form consisting of multiple layers (i.e., a multi-layer form described below). There are no particular limitations thereon as long as the desired water vapor transmission prevention properties are obtained.

[0099] In a preferred embodiment, the water vapor barrier layer 300 is an insulating multi-layer film. By forming a multi-layer film, the water vapor barrier property of the water vapor barrier layer 300 can be improved. Such an insulating multi-layer film may be formed by forming the same film multiple times, or may be formed by forming different films. In the case of different films, an organic insulating barrier layer may be formed on an inorganic insulating barrier layer.

[0100] In a preferred embodiment, the water vapor barrier layer 300 is provided so as to occupy a substantially large area in a plan view of the solid-state battery package 1000. Specifically, the water vapor barrier layer 300 may be provided so large as to occupy the entire area except for the connection area between the end surface electrode 140 of the solid-state battery 100 and the substrate electrode layer 210. The water vapor barrier layer 300 having such a large area in a plan view can more reliably prevent water vapor from penetrating from the external environment through the substrate 200.

[0101] The water vapor barrier layer is preferably a layer containing silicon. This is because it is likely to be a suitable layer in terms of electrical insulation. The water vapor barrier layer containing silicon may be a layer composed of a molecular structure containing not only silicon atoms but also nitrogen atoms and oxygen atoms. This is because it is likely to be a suitable layer in terms of electrical insulation and thinning. For example, the water vapor barrier layer has both Si-O bonds and Si-N bonds. That is, both Si-O bonds and Si-N bonds may exist in the molecular structure constituting the material of the water vapor barrier layer. If the molecular structure of the layer contains both Si-O bonds and Si-N bonds, it is likely to be a dense layer even though it is a thin layer, and it is likely to be a water vapor barrier layer that can also exhibit better water vapor permeation prevention properties.

[0102] The water vapor barrier layer containing silicon and the water vapor barrier layer having both Si-O bonds and Si-N bonds are not based on siloxane. In other words, the water vapor barrier layer according to the present invention has a molecular structure that contains silicon and Si-O bonds but does not contain a siloxane skeleton.

[0103] The "Si-O bond" and "Si-N bond" in this specification refer to those that can be confirmed based on, for example, Fourier transform infrared spectroscopy (FT-IR). That is, in the water vapor barrier layer according to this embodiment, the Si-O bond and the Si-N bond can be confirmed by measuring the absorption of light in the infrared region. In this specification, FT-IR refers to those measured by a microscopic ATR method using, for example, Spotlight 150 manufactured by PerkinElmer.

[0104] In addition, the water vapor barrier layer having Si-O bonds and Si-N bonds can be a layer with relatively high toughness. This means that the water vapor barrier layer acts favorably during charging and discharging of the solid-state battery. During charging and discharging of the solid-state battery, the solid-state battery may expand and contract due to the movement of ions between the positive and negative electrode layers via the solid electrolyte layer, but even if it is subjected to the stress of such expansion and contraction, the water vapor barrier layer with high toughness is unlikely to crack or crack. Usually, a layer with high water vapor barrier properties is dense and hard and may tend to crack or crack due to stress, while a layer that is relatively flexible and does not crack or crack may tend to have low water vapor barrier properties. In this regard, the water vapor barrier layer having Si-O bonds and Si-N bonds is unlikely to crack or crack even if it is subjected to the stress of expansion and contraction of the solid-state battery, and even so, it is a layer with high water vapor permeability, so it is highly reliable as a solid-state battery package.

[0105] Preferably, the water vapor barrier layer having Si-O bonds and Si-N bonds is formed from a liquid raw material. Specifically, it is preferable to form a water vapor barrier layer having both Si-O bonds and Si-N bonds by applying a liquid raw material to a substrate and irradiating the substrate with light. This allows the water vapor barrier layer to be formed without subjecting the substrate to a higher temperature, and the adverse thermal effects on the substrate to be suppressed. In addition, while a vacuum deposition method or the like requires an expensive deposition device, the formation using such a liquid raw material does not require such an expensive device, and the cost can be relatively reduced. Furthermore, while a layer produced by a vacuum deposition method or the like may cause warping of the substrate due to stress acting on the layer, as described above, a layer produced from a liquid raw material has little or no such stress. Therefore, the risk of warping of the substrate is reduced or prevented when producing a water vapor barrier layer from a liquid raw material.

[0106] In addition, in one embodiment of the present invention, a resist layer 400 can be disposed between the substrate 200 and the solid-state battery 100 (see FIG. 2, etc.). In particular, the resist layer 400 may be provided between the substrate 200 and the solid-state battery 100 due to the resist provided on the substrate 200.

[0107] The resist layer 400 is particularly provided on the main surface of the substrate 200. The resist layer 400 is a layer that at least partially covers the substrate surface to prevent physical processing or chemical reaction. Therefore, the resist layer may be an insulating layer including a resin material provided on the main surface of the substrate 200. Such a resist layer may be considered to correspond to a heat-resistant coating provided on the main surface of the substrate 200. For example, it may be a resist that maintains insulation when the solid-state battery and the substrate are connected and serves to protect conductor parts such as the substrate electrode layer. Such a resist layer 400 provided on the main surface of the substrate 200 may be, for example, a solder resist layer.

[0108] As an example, the resist layer 400 may be provided on the main surface of the substrate 200. In this case, the water vapor barrier layer 300 may be disposed at least on the resist layer 400. The water vapor barrier layer 300 is disposed so as to be in direct contact with the resist layer 400 so that the water vapor barrier layer 300 and the resist layer 400 are stacked on each other. When the water vapor barrier layer is provided on the resist layer in this manner, water vapor penetrating from the external environment via the substrate 200 and the resist layer 400 thereon can be more effectively prevented.

[0109] [Method of manufacturing solid-state battery package] The subject matter of the present invention can be obtained by preparing a solid-state battery including a battery building block having a positive electrode layer, a negative electrode layer, and a solid electrolyte between the electrodes, and then undergoing a process of packaging the solid-state battery.

[0110] The production of the solid-state battery of the present invention can be broadly divided into the production of the solid-state battery itself (hereinafter also referred to as a "pre-packaged battery"), which corresponds to a stage prior to packaging, the preparation of the substrate, and packaging.

[0111] <Manufacturing method of unpackaged batteries> The prepackaged battery can be manufactured by a printing method such as a screen printing method, a green sheet method using a green sheet, or a combination of these methods. In other words, the prepackaged battery itself may be manufactured in accordance with a conventional method for manufacturing solid-state batteries (therefore, raw materials such as the solid electrolyte, organic binder, solvent, optional additives, positive electrode active material, and negative electrode active material described below may be those used in the manufacture of known solid-state batteries).

[0112] In the following, in order to better understand the present invention, one manufacturing method will be described as an example, but the present invention is not limited to this method. In addition, the chronological matters such as the order of description below are merely for the convenience of explanation, and are not necessarily bound by them.

[0113] (Laminated block formation) A solid electrolyte, an organic binder, a solvent, and optional additives are mixed to prepare a slurry, which is then fired to form a sheet comprising the solid electrolyte. A paste for a positive electrode is prepared by mixing a positive electrode active material, a solid electrolyte, a conductive material, an organic binder, a solvent, and any additives. Similarly, a paste for a negative electrode is prepared by mixing a negative electrode active material, a solid electrolyte, a conductive material, an organic binder, a solvent, and any additives. Print the positive electrode paste onto the sheet, and if necessary, print the current collecting layer and / or negative layer. Similarly, print the negative electrode paste onto the sheet, and if necessary, print the current collecting layer and / or negative layer. A laminate is obtained by alternately stacking sheets printed with a paste for a positive electrode and sheets printed with a paste for a negative electrode. Note that the outermost layer (the uppermost layer and / or the lowermost layer) of the laminate may be an electrolyte layer, an insulating layer, or an electrode layer.

[0114] (Battery firing formation) After the laminate is pressure-bonded and integrated, it is cut to a predetermined size. The cut laminate is degreased and fired. A fired laminate is obtained. Note that the laminate may be degreased and fired before cutting, and then cut.

[0115] (Edge electrode formation) The positive end electrode can be formed by applying a conductive paste to the positive electrode exposed side surface of the fired laminate. Similarly, the negative end electrode can be formed by applying a conductive paste to the negative electrode exposed side surface of the fired laminate. The positive and negative end electrodes may be provided so as to extend to the main surface of the fired laminate. The component of the end electrode may be at least one selected from silver, gold, platinum, aluminum, copper, tin, and nickel.

[0116] The end electrodes on the positive and negative electrodes do not necessarily have to be formed after firing of the laminate, but may be formed before firing and then subjected to simultaneous firing.

[0117] By going through the steps described above, a desired pre-packaged battery (corresponding to solid-state battery 100 shown in FIG. 13A) can finally be obtained.

[0118] <Preparation of substrate> In this step, the substrate is prepared.

[0119] Although not particularly limited, when a resin substrate is used as the substrate, the preparation may be performed by stacking a plurality of layers and heating and pressing. For example, a substrate precursor is formed using a resin sheet composed of a fiber cloth as a base material impregnated with a resin raw material. After the substrate precursor is formed, the substrate precursor is heated and pressed by a press. On the other hand, when a ceramic substrate is used as the substrate, the preparation may be performed, for example, by forming a green sheet laminate by thermocompression bonding a plurality of green sheets, and subjecting the green sheet laminate to firing to obtain a ceramic substrate. The preparation of the ceramic substrate may be performed, for example, in accordance with the preparation of an LTCC substrate. The semi-rack substrate may have vias and / or lands. In such a case, for example, holes may be formed in the green sheet by a punch press or a carbon dioxide laser, and the holes may be filled with a conductive paste material, or a precursor of a conductive portion such as a via or a land may be formed by carrying out a printing method or the like. The lands and the like may also be formed after firing the green sheet laminate.

[0120] Thereafter, the substrate electrode layer 210 is formed on the main surface 230 of the substrate 200 for electrical connection (see FIG. 13B). The substrate electrode layer may be appropriately patterned. Specifically, based on a case where one side surface of the substrate electrode layer and an end surface of an end surface electrode of the same polarity side of a solid-state battery to be mounted later are substantially on the same line in a cross-sectional view, the substrate electrode layer 210 is formed on the substrate main surface so that the distance between one side surface and the other side surface of the substrate electrode layer is equal to or greater than the minimum distance between the end surface of the end surface electrode of the same polarity side and the side surface of the solid-state battery electrode layer of the opposite polarity side facing the end surface.

[0121] After the substrate electrode layer 210 is formed, a resist layer 400 made of, for example, a solder resist may be formed on the main surface 230 of the substrate 200 excluding the substrate electrode layer (see FIG. 13C). The process of forming the resist layer 400 may be omitted. By going through the above-mentioned processes, the desired substrate can finally be obtained.

[0122] Packaging Next, the battery and the substrate obtained above are packaged.

[0123] First, the pre-packaged battery 100 is placed on the substrate 200 (see FIG. 13D). That is, an "unpackaged solid-state battery" is placed on the substrate (hereinafter, the battery used for packaging is also simply referred to as a "solid-state battery").

[0124] Specifically, the solid-state battery is placed on the substrate so that the substrate electrode layer and the end surface electrode of the solid-state battery are electrically connected to each other. For example, the solid-state battery is placed while adjusting so that the end surface of the end surface electrode of the solid-state battery placed on the substrate and one side surface of the substrate electrode layer are substantially on the same line. Note that the end surface of the end surface electrode of the solid-state battery and one side surface of the substrate electrode layer do not necessarily have to be substantially on the same line, and the one side surface of the substrate electrode layer may be placed outside the end surface of the end surface electrode of the solid-state battery in a cross-sectional view. In this case, for example, a conductive paste (e.g., Ag conductive paste) may be provided on the substrate electrode layer of the substrate before the solid-state battery is placed, thereby electrically connecting the conductive portion of the support substrate and the end surface electrode of the solid-state battery to each other. In other words, a precursor 600' of a joining member that is responsible for the electrical connection between the solid-state battery 100 and the substrate 200 may be provided in advance. Such a precursor 600' of a joining member may be provided by printing a conductive paste that does not require washing with flux or the like after formation, such as Ag conductive paste, nanopaste, alloy paste, brazing material, etc. After disposing the solid-state battery 100 on the substrate so that the end surface electrodes of the solid-state battery and the precursor 600' of the bonding member are in contact with each other, the precursor 600' is subjected to a heat treatment to form a bonding member 600 that contributes to electrical connection between the solid-state battery 100 and the substrate 200.

[0125] Next, the covering material 150 is formed. The covering material may include a covering insulating layer 160 and a covering inorganic layer 170 (see FIG. 13E).

[0126] First, the covering insulating layer 160 is formed so as to cover the solid-state battery 100 on the substrate 200. Therefore, the raw material of the covering insulating layer is provided so as to cover the entire solid-state battery on the substrate. When the covering insulating layer is made of a resin material, a resin precursor is provided on the substrate and cured to form the covering insulating layer. In a preferred embodiment, the covering insulating layer may be molded by applying pressure with a mold. As an example only, the covering insulating layer that seals the solid-state battery on the substrate may be molded through compression molding. If it is a resin material generally used in molding, the form of the raw material of the covering insulating layer may be granular, and the type may be thermoplastic. Note that such molding is not limited to mold molding, and may be performed through polishing, laser processing, and / or chemical treatment.

[0127] After the coating insulating layer 160 is formed, the coating inorganic layer 170 is formed. Specifically, the coating inorganic layer 170 is formed on the "coating precursor in which each solid-state battery 100 is covered with the coating insulating layer 160 on the substrate 200." For example, dry plating may be performed to form a dry plating film as the coating inorganic layer. More specifically, dry plating is performed to form a coating inorganic layer on exposed surfaces other than the bottom surface of the coating precursor (i.e., other than the bottom surface of the support substrate).

[0128] By going through the above-mentioned steps, a packaged product can be obtained in which the solid-state battery on the substrate is entirely covered with the insulating coating layer and the inorganic coating layer, i.e., the "solid-state battery package" according to the present invention can be finally obtained.

[0129] In the above, the covering material 150 covers the solid-state battery 100, but the present invention may have a form in which the solid-state battery 100 is largely covered by the covering material 150. For example, the covering inorganic layer 170 provided on the covering insulating layer 160 that wraps the solid-state battery 100 on the substrate 200 may extend to the lower main surface of the substrate 200 (see FIG. 2). That is, the covering inorganic layer 170 on the covering insulating layer 160 as the covering material 150 may extend to the side surface of the substrate 200 and may extend beyond the side of the substrate 200 to the lower main surface (particularly the peripheral portion) of the substrate 200. In this case, a solid-state battery package in which moisture permeation (moisture permeation from the outside to the solid-state battery stack) is more suitably prevented can be obtained. The covering inorganic layer 170 may be provided as a multi-layer structure consisting of at least two layers, as shown in FIG. 11. FIG. 11 shows a two-layer structure covering inorganic layer 170 of 170A and 170B. Such a multi-layer structure is not limited to a structure between different materials, but may be a structure between the same materials. When such a multi-layer structure of the coating inorganic layer is provided, it is easy to form a water vapor barrier for a solid-state battery more preferably.

[0130] Preferably, a water vapor barrier layer may be formed on the substrate, that is, the water vapor barrier may be formed on the substrate prior to packaging in which the substrate and the solid-state battery are combined.

[0131] There is no particular limitation on the water vapor barrier layer as long as the desired barrier layer can be formed. For example, in the case of a "water vapor barrier layer having Si-O bonds and Si-N bonds," it is preferably formed by applying a liquid source and irradiating ultraviolet rays. In other words, the water vapor barrier layer is formed under relatively low temperature conditions (for example, temperature conditions of about 100°C) without using a vapor phase deposition method such as CVD or PVD.

[0132] Specifically, a liquid source containing, for example, silazane is prepared, and the liquid source is applied to a substrate by spin coating or spray coating, etc., and dried to form a barrier precursor. Next, the barrier precursor is irradiated with UV light in an environmental atmosphere containing nitrogen, thereby obtaining a "water vapor barrier layer having Si-O bonds and Si-N bonds."

[0133] It is preferable to locally remove the water vapor barrier layer at the joint between the conductive portion of the substrate and the end electrode of the solid-state battery so that the water vapor barrier layer is not present at the joint. Alternatively, a mask may be used to prevent the water vapor barrier layer from being formed at the joint. That is, a mask may be applied to the area to be the joint, the water vapor barrier layer may be formed overall, and then the mask may be removed.

[0134] When a resist layer is provided on the main surface of the substrate, a water vapor barrier layer may be formed on the resist layer 400. In this case, as described above, it is preferable to form the water vapor barrier layer so as to exclude the bonding region with the solid-state battery 100. In other words, it is preferable to prepare the substrate 200 on which the resist layer 400 and the water vapor barrier layer 300 are formed so that the substrate electrode layer 210 of the substrate is exposed.

[0135] Although the embodiments of the present invention have been described above, they are merely typical examples. The present invention is not limited to these, and those skilled in the art will easily understand that various modifications are possible without departing from the scope of the present invention.

[0136] For example, in the above description, the conductive portion of the substrate and the end electrode of the solid-state battery are electrically connected to each other using the conductive paste, but the conductive paste corresponding to the provided joining member 600 may finally have a form as shown in FIG. 12. When the solid-state battery 100 and the substrate 200 are electrically joined via the conductive paste, a pressing force is applied from the solid-state battery 100 to the conductive paste, so that the end electrode 140 of the solid-state battery 100 is likely to be slightly embedded in the conductive paste. That is, the conductive paste is likely to be pressed by the end electrode 140 and have a form in which it is slightly raised on the outside (part "M" in FIG. 12). In addition, when the solid-state battery 100 and the substrate 200 are electrically joined via the conductive paste, a part 600A of the conductive paste may flow so as to straddle the resist layer 400 due to the pressing force. This is related to the resist layer 400 acting as a "dam" for the conductive paste.

[0137] More specifically, the opening of the resist layer 400 that exposes the conductive portion of the substrate (particularly, the main surface electrode layer 210 of the substrate) has an edge portion that partially blocks the movement of the conductive paste, so that a part 600A of the conductive paste once provided at the opening flows onto the resist layer 400 as it is pressed, while a majority 600B of the conductive paste can remain at the opening of the resist layer 400. In other words, the resist layer (e.g., a solder resist layer) preferably acts as a dam to suppress the bleeding of the conductive paste. When the bleeding of the conductive paste is suppressed, the bonding area between the coating insulating layer 160 (particularly, the coating insulating layer 160 provided between the solid-state battery 100 and the substrate 200) and the resist layer 400 can be more easily secured. As a result, the adhesive force between the coating insulating layer 160 and the substrate 200 can be more stabilized. Note that the conductive paste is expressed on the assumption that it is used at the time of manufacture, but in the case of a solid-state battery after manufacture, the conductive paste corresponds to the bonding member 600. 12 , in the solid-state battery package 1000 according to an embodiment of the present disclosure, the bonding member 600 can be disposed so as to straddle the upper principal surface electrode layer 210 and the resist layer 400 of the substrate. That is, a portion 600A of the bonding member 600 can be disposed up to the inside of the resist layer 400. Specifically, the portion 600A of the bonding member 600 can be disposed up to the inside of a portion of the resist layer 400 that contacts the upper principal surface electrode layer 210.

[0138] Although the present invention relates to a solid-state battery package, such a package may be provided as an electronic device mounted on an external substrate separate from the substrate of the package. In other words, the substrate of the solid-state battery package can be a terminal substrate for an external terminal of the solid-state battery, and the solid-state battery package may be surface-mounted on an external substrate (i.e., a secondary substrate) such as a printed wiring board via such a terminal substrate, and the solid-state battery package may be provided as such an electronic device. [Industrial Applicability]

[0139] The solid-state battery package of the present invention can be used in various fields where battery use or power storage is envisioned. By way of example only, the solid-state battery package of the present invention can be used in the electrical, information, and communication fields in which mobile devices and the like are used (for example, the electrical and electronic equipment fields or mobile equipment fields including mobile phones, smartphones, notebook computers, digital cameras, activity meters, arm computers, electronic paper, and small electronic devices such as RFID tags, card-type electronic money, and smart watches), household and small industrial applications (for example, power tools, golf carts, household, nursing care, and industrial robots), large industrial applications (for example, forklifts, elevators, and port cranes), transportation systems (for example, hybrid cars, electric cars, buses, trains, electrically assisted bicycles, and electric motorcycles), power system applications (for example, various power generation, road conditioners, smart grids, and general household installation-type power storage systems), medical applications (medical devices such as earphone hearing aids), pharmaceutical applications (medical management systems), as well as the IoT field, and space and deep sea applications (for example, space probes, submersible research vessels, and the like). [Explanation of symbols]

[0140] 100 solid state battery Main surface of 100A solid-state battery Side view of 100B solid-state battery 100X battery element 100X1 Interface area and central area of ​​battery element 110 Positive electrode layer 115 Solid battery electrode layer 115a Side of solid-state battery electrode layer 120 Negative electrode layer 130 Solid electrolyte or solid electrolyte layer 140 End electrode 140A Positive end electrode 140B Negative end electrode 141 End surface of end electrode 150 Covering material 160 Insulating coating layer 170 Inorganic coating layer 180 Interfacial region between solid-state battery electrode layer and end electrode 200 Substrates 210 Substrate electrode layer (upper side of substrate) 210A Positive side board electrode layer 210B Negative side substrate electrode layer 211 One side of the substrate electrode layer 212 Other side of substrate electrode layer 220 Mounting side board electrode layer (bottom side of board) 220A Positive side mounting side board electrode layer 220B Negative side mounting side board electrode layer 230 One main surface of the substrate 240 Other main surface of the substrate 250 Side of the board 300 Water Vapor Barrier Layer 400 resist layer 600 Joint materials 600A Part of the joint material 600B Most of the joint parts 600' Precursor for joint components 1000 Solid-state Battery Packages L1: Distance between one side and the other side of the substrate electrode layer L2 The minimum distance between the end face of the end electrode on the same pole side and the side of the solid battery electrode layer on the opposite pole side L3 Maximum distance between the end face of the same polarity end electrode and the side of the solid battery electrode layer of the opposite polarity L4: The distance between one side of the substrate electrode layer and the edge of the edge electrode

Claims

1. A substrate, a solid-state battery provided on the substrate, and a resist layer provided between the substrate and the solid-state battery, the solid-state battery includes a battery element including a positive electrode layer, a negative electrode layer, and a solid electrolyte interposed between the positive electrode layer and the negative electrode layer, and an end electrode provided on an end surface of the battery element and connected to the solid-state battery electrode layer; the substrate has, on a main surface facing the solid-state battery, at least one of a positive-electrode-side substrate electrode layer capable of being electrically connected to the solid-state battery and a negative-electrode-side substrate electrode layer disposed opposite and spaced from the positive-electrode-side substrate electrode layer; when viewed in cross section, a distance between one side surface and the other side surface of the substrate electrode layer is equal to or greater than a minimum distance at which a distance between the end surface of the end surface electrode on the same polarity side and a side surface of the solid-state battery electrode layer on the opposite polarity side facing the end surface is minimum, at least when the one side surface and the other side surface of the substrate electrode layer are substantially on the same line as a reference; a top surface of the substrate electrode layer is recessed below a surface of the resist layer.

2. The solid-state battery package according to claim 1 , wherein the other side surface of the substrate electrode layer and the side surface of the counter-electrode solid-state battery electrode layer are substantially on the same line in a cross-sectional view.

3. 2 . The solid-state battery package according to claim 1 , wherein, in a cross-sectional view, the other side surface of the substrate electrode layer is located inside an interface region between the solid-state battery electrode layer on the same polarity side and the end electrode.

4. 10. The solid-state battery package of claim 1, wherein the substrate electrode layer is a metal layer.

5. 10. The solid-state battery package of claim 1, wherein the substrate electrode layer is a stress-receiving layer.

6. The solid-state battery package of claim 5, wherein the substrate electrode layer is a planar stress-receiving layer along an interface region between the solid-state battery electrode layer and the end electrode.

7. The solid-state battery package according to claim 1 , wherein, in a cross-sectional view, the other side surface of the substrate electrode layer is located more inward than the side surface of the solid-state battery electrode layer on the counter electrode side.

8. The solid-state battery package according to claim 1 , wherein, in a cross-sectional view, the substrate electrode layer extends to a position where it can face the solid-state battery electrode layer on the counter electrode side.

9. 2. The solid-state battery package according to claim 1, wherein in a cross-sectional view, a distance between the one side surface and the other side surface of the substrate electrode layer is 1.5 times or more the minimum distance.

10. 2. The solid-state battery package according to claim 1, wherein in a cross-sectional view, a distance between the one side surface and the other side surface of the substrate electrode layer is 2.0 times or more the minimum distance.

11. 2. The solid-state battery package according to claim 1, wherein, in a cross-sectional view, the one side surface of the substrate electrode layer is located outside the end surface of the end electrode and inside the end of the main surface of the substrate.

12. 2. The solid-state battery package according to claim 1, wherein the substrate further comprises a dummy substrate electrode layer disposed on the main surface of the substrate, the dummy substrate electrode layer being spaced apart from and facing the substrate electrode layer and not electrically connected to the solid-state battery.

13. The solid-state battery package of claim 1, wherein the substrate electrode layer is provided along an interface region between the solid-state battery electrode layer on the same polarity side and the end electrode.

14. The solid-state battery package according to claim 1 , further comprising a water vapor barrier layer provided on the resist layer between the substrate and the solid-state battery.

15. The solid-state battery package according to claim 14 , wherein the water vapor barrier layer is disposed so as to extend along an extending direction of the main surface of the substrate.

16. The solid-state battery further includes a covering insulating layer provided on the substrate so as to cover a main surface and a side surface of the solid-state battery, 15. The solid-state battery package according to claim 14, wherein the water vapor barrier layer extends to an outer surface of the covering insulating layer covering a side surface of the solid-state battery.

17. 15. The solid-state battery package according to claim 14, wherein the water vapor barrier layer is an insulating layer having electrical insulation properties.

18. 15. The solid-state battery package of claim 14, wherein the water vapor barrier layer comprises both Si-O and Si-N bonds.

19. The solid-state battery package according to claim 1 , wherein the substrate is a resin substrate.

Images