Semiconductor device with built-in electrical components on a circuit board

Abstract

To avoid enlargement of a semiconductor device with built-in electrical components in a circuit board, while suppressing temperature rise of the electrical components.SOLUTION: A semiconductor device 10 has a substrate body 12 having a first side 12a and a second side 12b, electrical components 21, 22 disposed within the substrate body, a first internal conductor pattern 64 in a circuit layer L2 located between the first side and the electrical components, and at least one heat absorbing member 90 located within the substrate body and thermally connected with the first internal conductor pattern.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The technology disclosed in this specification relates to a semiconductor device having electric components built into a circuit board.

[0002] Patent Document 1 discloses a semiconductor device. This semiconductor device includes a substrate body, an electric component disposed within the substrate body, and a conductor pattern located on the upper surface of the substrate body. The conductor pattern is thermally connected to the electronic component through a plurality of vias. With this configuration, heat generated by the electronic component is transferred to the conductor pattern through the plurality of vias, and dissipated from the conductor pattern to the outside of the substrate body. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2001-85804 A Summary of the Invention [Problem to be solved by the invention]

[0004] In the above-mentioned structure, the larger the area of ​​the conductor pattern, the greater the heat dissipation effect of the conductor pattern. However, when the area of ​​the conductor pattern is increased, most of the surface of the substrate body is occupied by the conductor pattern. In this case, it becomes difficult to provide other necessary configurations on the remaining surface of the substrate body, and it may become necessary to increase the size of the substrate body. In the conventional structure, in order to avoid the temperature rise of the electrical components, it is necessary to allow the semiconductor device to be large, and in order to avoid the temperature rise of the semiconductor device, it is necessary to allow the temperature rise of the electrical components.

[0005] In view of the above, the present specification provides a technique for preventing an increase in the size of a semiconductor device having electric components built into a circuit board while suppressing a rise in temperature of the electric components. [Means for solving the problem]

[0006] The semiconductor device (10) disclosed in this specification comprises a substrate body (12) having a first surface (12a) and a second surface (12b), electrical components (21, 22, 31, 32) arranged within the substrate body, a first internal conductor pattern (64) provided on a circuit layer (L2) located between the first surface and the electrical components, and at least one heat absorption member (90) arranged inside the substrate body and thermally connected to the first internal conductor pattern.

[0007] According to the above-mentioned configuration, the heat generated by the electrical components is transferred to the heat absorbing member also in the board body through the first internal conductor pattern in the board body. This allows most of the heat generated by the electrical components to be diffused within the board body, suppressing the temperature rise of the electrical components. Furthermore, since the first internal conductor pattern and the heat absorbing member are provided within the board body, other required configurations can be freely provided on the first and second surfaces of the board body. This also makes it possible to avoid an increase in the size of the semiconductor device. [Brief description of the drawings]

[0008] [Figure 1] 1 is a plan view showing a semiconductor device 10 according to a first embodiment. [Diagram 2] 1 is a circuit diagram showing a circuit structure of a semiconductor device 10 according to a first embodiment. [Diagram 3] A cross-sectional view taken along line III-III in Fig. 1. For clarity, hatching of the substrate body 12 has been omitted. Also, some overlapping configurations are intentionally shown at different positions. [Figure 4] 3 shows variations in the arrangement pattern of the second conductor patterns 62 relative to the surface electrical components 52. [Diagram 5] FIG. 11 is a cross-sectional view showing the configuration of a semiconductor device 110 according to a second embodiment. [Figure 6] FIG. 11 is a cross-sectional view showing the configuration of a semiconductor device 210 according to a third embodiment. [Figure 7] FIG. 11 is a cross-sectional view showing the configuration of a semiconductor device 310 according to a fourth embodiment. [Figure 8]FIG. 13 is a cross-sectional view showing the configuration of a semiconductor device 410 according to a fifth embodiment. [Figure 9] FIG. 13 is a cross-sectional view showing the configuration of a semiconductor device 510 according to a sixth embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] In one embodiment of the present technology, the semiconductor device may further include a first surface conductor pattern (62) provided in a circuit layer (L1) located on the first surface and thermally connected to the first internal conductor pattern. With this configuration, heat generated on the first surface of the substrate body can also be transferred to the heat absorption member through the first surface conductor pattern and the first internal conductor pattern. This makes it possible to suppress a temperature rise of a heat source located on the first surface, such as an electrical component provided on the first surface of the substrate body.

[0010] In the above-described embodiment, the semiconductor device may further include a surface electrical component (52) provided in the circuit layer located on the first surface and controlling the operation of the electrical component. In this case, the first surface conductor pattern may be located close to the surface electrical component. With this configuration, it is possible to suppress temperature rise not only in the electrical components in the substrate body, but also in the surface electrical component that controls the operation of the electrical component.

[0011] In an embodiment of the present technology, the at least one heat absorbing member may include a plurality of heat absorbing members. With such a configuration, the plurality of heat absorbing members can absorb and disperse a larger amount of heat, thereby further suppressing a temperature rise of the electrical component.

[0012] In one embodiment of the present technology, the semiconductor device may further include a second internal conductor layer (74) provided in a circuit layer (L5) located between the second surface and the electrical component. In this case, the at least one heat absorption member may also be thermally connected to the second internal conductor pattern. With this configuration, heat generated in the electrical component is further transferred to the heat absorption member through the second internal conductor pattern. By disposing the electrical component between the first internal conductor pattern and the second internal conductor pattern, heat generated in the electrical component can be effectively diffused from both sides of the electrical component.

[0013] In one embodiment of the present technology, the semiconductor device may further include a second surface conductor pattern (69) provided in a circuit layer (L6) located on the second surface and thermally connected to the second internal conductor pattern. With this configuration, heat generated in the electrical component can be transferred to the second surface conductor pattern through the second internal conductor pattern and dissipated to the outside from the second surface conductor pattern. This can further suppress the temperature rise of the electrical component.

[0014] In one embodiment of the present technology, the at least one heat absorbing member may be made of metal or graphite. However, the heat absorbing member is not limited to metal or graphite, and may be made of a material or structure having a higher thermal conductivity than the substrate body.

[0015] In one embodiment of the present technology, the at least one heat absorbing member may be a heat pipe or a heat spreader, and may have a fluid 91 sealed therein. With this configuration, the heat transfer efficiency in the heat absorbing member is improved, and the heat absorbing ability of the heat absorbing member can be effectively improved.

[0016] In one embodiment of the present technology, the semiconductor device may further include a heat transfer via (79) extending from the first internal conductor pattern to at least one heat absorbing member. In this case, the material constituting the heat transfer via may have higher thermal conductivity than the material constituting the substrate body. With this configuration, even if the first internal conductor pattern and the heat absorbing member are located on different layers, it is possible to effectively increase heat transfer from the first internal conductor pattern to the heat absorbing member.

[0017] In one embodiment of the present technology, the semiconductor device may further include a ground wiring (63) provided on the first surface or the second surface of the substrate body. In this case, the first internal conductor pattern may be electrically connected to the ground wiring within the substrate body. With this configuration, the potential of the first internal conductor pattern is stabilized, and the first internal conductor pattern facing the electrical component can also function as a shielding layer that blocks electromagnetic noise radiated from the electrical component.

[0018] In the above-described embodiment, the material constituting the heat transfer vias may be the same as the material constituting the first inner conductor pattern, which can simplify the manufacturing process of the semiconductor device. EXAMPLES

[0019] (Example 1) A semiconductor device 10 of Example 1 will be described with reference to the drawings. The semiconductor device 10 of this example can be adopted, for example, in a power control unit of an electric vehicle, and can constitute a part of a power conversion circuit for converting power between a power source and a driving motor. The electric vehicle referred to here broadly means a vehicle having a driving motor for driving wheels, and includes, for example, an electric car that is charged by external power, a hybrid car that has an engine in addition to a driving motor, and a fuel cell car that uses a fuel cell as a power source. However, the use of the semiconductor device 10 of this example is not limited to electric vehicles, and can be adopted in various electric devices.

[0020] As shown in FIGS. 1 to 3, the semiconductor device 10 includes a substrate body 12, two semiconductor elements 21 and 22, and two heat sink plates 31 and 32. The substrate body 12 has a plate-like shape and includes an upper surface 12a and a lower surface 12b located opposite to the upper surface 12a. The substrate body 12 is made of an insulator such as epoxy resin. The substrate body 12 includes an upper layer 14, an intermediate layer 16, and a lower layer 18 from the upper surface 12a to the lower surface 12b. The upper layer 14 is a layer that includes the upper surface 12a of the substrate body 12. The lower layer 18 is a layer that includes the lower surface 12b of the substrate body 12. The intermediate layer 16 is a layer that is located between the upper layer 14 and the lower layer 18.

[0021] Here, the X direction and the Y direction in the drawing are parallel to the upper surface 12a and the lower surface 12b of the substrate body 12 and are perpendicular to each other. The Z direction is perpendicular to the upper surface 12a and the lower surface 12b of the substrate body 12 and is perpendicular to both the X direction and the Y direction. That is, the above-mentioned upper layer 14, the intermediate layer 16, and the lower layer 18 are laminated along the Z direction.

[0022] The semiconductor elements 21, 22 and the heat sink plates 31, 32 are electric components that constitute a part of an electric circuit in the semiconductor device 10. The two semiconductor elements 21, 22 are disposed on the intermediate layer 16 of the substrate body 12 together with the two heat sink plates 31, 32. Each of the semiconductor elements 21, 22 is a power semiconductor element, and in particular, a switching element. This switching element may be, for example, an IGBT (Insulated Gate Bipolar Transistor) or a MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor). Each of the semiconductor elements 21, 22 has an upper electrode 21a, 22a and a lower electrode 21b, 22b, and can electrically connect or disconnect the upper electrode 21a, 22a and the lower electrode 21b, 21b.

[0023] As an example, the two semiconductor elements 21, 22 include a first semiconductor element 21 and a second semiconductor element 22. The first semiconductor element 21 and the second semiconductor element 22 are electrically connected in series inside the substrate body 12. As described above, the two semiconductor elements 21, 22 are switching elements such as IGBTs or MOSFETs. The semiconductor device 10 of this embodiment can constitute, for example, a part of an inverter circuit or a DC-DC converter circuit. The number of the semiconductor elements 21, 22 is not limited to two. The semiconductor device 10 is not limited to the semiconductor elements 21, 22 and the heat sink plates 31, 32, and may include at least one electrical component.

[0024] The two heat sink plates 31, 32 each have a plate-like shape and are arranged parallel to the substrate body 12. Each of the heat sink plates 31, 32 is made of a conductor such as copper or other metal. As an example, the two heat sink plates 31, 32 are arranged along the X direction. The two heat sink plates 31, 32 include a first heat sink plate 31 and a second heat sink plate 32. The first semiconductor element 21 is arranged on the first heat sink plate 31, and the lower surface electrodes 21b of the first semiconductor element 21 are electrically connected to the first heat sink plate 31. The first semiconductor element 21 and the first heat sink plate 31 are integrally joined and can be interpreted as one electrical component. Similarly, the second semiconductor element 22 is arranged on the second heat sink plate 32, and the lower surface electrodes 21b, 22b of the second semiconductor element 22 are electrically connected to the second heat sink plate 32. The second semiconductor element 22 and the second heat sink plate 32 are also integrally joined together and can be interpreted as one electrical component.

[0025] The semiconductor device 10 includes a plurality of terminals 40, 42, 44. These terminals 40, 42, 44 are external connection terminals for connecting to an external circuit. The plurality of terminals 40, 42, 44 are made of a conductor such as copper or other metal. As an example, the plurality of terminals 40, 42, 44 include a P terminal 40, an N terminal 42, and an O terminal 44. The plurality of terminals 40, 42, 44 are located on the lower surface 12b of the substrate body 12. However, some or all of the plurality of terminals 40, 42, 44 may be located on the upper surface 12a of the substrate body 12. As a result, when the first semiconductor element 21 is turned on, the P terminal 40 and the O terminal 44 are electrically connected to each other. On the other hand, when the second semiconductor element 22 is turned on, the N terminal 42 and the O terminal 44 are electrically connected to each other.

[0026] The P terminal 40 is electrically connected to the first heat sink plate 31 inside the substrate body 12, and is electrically connected to the lower surface electrode 21b of the first semiconductor element 21 via the first heat sink plate 31. The N terminal 42 is electrically connected to the upper surface electrode 22a of the second semiconductor element 22 inside the substrate body 12. The O terminal 44 is electrically connected to the upper surface electrode 21a of the first semiconductor element 21 and the second heat sink plate 32 inside the substrate body 12. That is, the O terminal 44 is electrically connected to each of the upper surface electrode 21a of the first semiconductor element 21 and the lower surface electrode 22b of the second semiconductor element 22.

[0027] The substrate body 12 is provided with a plurality of circuit layers L1-L6, forming a multi-layer substrate structure. The plurality of circuit layers L1-L6 include a first circuit layer L1, a second circuit layer L2, a third circuit layer L3, a fourth circuit layer L4, a fifth circuit layer L5, and a sixth circuit layer L6. The first circuit layer L1 is located on the upper surface 12a of the substrate body 12. The second circuit layer L2 is located in the upper layer 14 of the substrate body 12. The third circuit layer L3 is located at the boundary between the upper layer 14 and the intermediate layer 16 of the substrate body 12. The fourth circuit layer L4 is located at the boundary between the substrate body 12, the intermediate layer 16, and the lower layer 18. The fifth circuit layer L5 is located in the lower layer 18 of the substrate body 12. And the sixth circuit layer L6 is located on the lower surface 12b of the substrate body 12.

[0028] The first circuit layer L1 has a plurality of conductor patterns 61, 62, 63. Each of the conductor patterns 61, 62, 63 is made of a conductor such as copper or other metal. The plurality of conductor patterns 61, 62, 63 includes a first conductor pattern 61, a second conductor pattern 62, and a third conductor pattern 63. The first conductor pattern 61 constitutes a control circuit 50 that controls the two semiconductor elements 21, 22. For this purpose, the first conductor pattern 61 has a plurality of surface electronic components 52 mounted thereon. The plurality of surface electronic components 52 includes, for example, a gate drive circuit that controls the switching of the semiconductor elements 21, 22.

[0029] The first conductor pattern 61 here is a general term for one or more conductor patterns required to configure the control circuit 50. That is, the first conductor pattern 61 may be a single conductor pattern or a combination of multiple conductor patterns. The same applies to the second conductor pattern 62 to the ninth conductor pattern 69 described below. Each of the second conductor pattern 62 to the ninth conductor pattern 69 is a general term for one or more conductor patterns having a common function, and may be a single conductor pattern or a combination of multiple conductor patterns.

[0030] The second conductor pattern 62 is provided adjacent to the surface electric components 52. This allows heat generated in the surface electric components 52 to be transferred to the second conductor pattern 62. However, the second conductor pattern 62 is electrically insulated from the first conductor pattern 61 and the surface electric components 52 on the upper surface 12a of the substrate body 12. The third conductor pattern 63 is a part of the control circuit 50, and functions as a ground wiring connected to the ground potential.

[0031] 4(A)-(D) show some specific examples of the arrangement of the second conductor patterns 62. As shown in FIG. 4(A)-(D), the number of the second conductor patterns 62 and their positional relationship with the surface electrical components 52 are not particularly limited. The second conductor pattern 62 may be a single region or a combination of multiple regions. In addition, the second conductor pattern 62 may be located between two adjacent surface electrical components 52, or may be provided so as to surround one or multiple surface electrical components 52.

[0032] The second circuit layer L2 has a plurality of conductor patterns 64, 65, and 66. Each of the conductor patterns 64, 65, and 66 is made of a conductor such as copper or other metal. The plurality of conductor patterns 64, 65, and 66 includes a fourth conductor pattern 64, a fifth conductor pattern 65, and a sixth conductor pattern 66. Although the plurality of conductor patterns 64, 65, and 66 are actually located on the same plane, in FIG. 3, the fourth conductor pattern 64 is intentionally displaced with respect to the fifth conductor pattern 65 and the sixth conductor pattern 66 for the purpose of clarity of illustration.

[0033] The fourth conductor pattern 64 spreads over most of the second circuit layer L2 and is provided to face the multiple semiconductor elements 21 and 22. As a result, heat generated in the semiconductor elements 21 and 22 is diffused to a wide range of the board body 12 through the fourth conductor pattern 64. The fourth conductor pattern 64 also functions as a shielding layer that blocks electromagnetic noise radiated from the semiconductor elements 21 and 22. The fourth conductor pattern 64 is connected to the second conductor pattern 62 of the first circuit layer L1 through one or more first vias 71. In addition, the fourth conductor pattern 64 is also connected to the third conductor pattern 63 of the first circuit layer L1 through one or more second vias 72. The first vias 71 and the second vias 72 are made of a conductor such as copper or other metal. As a result, the fourth conductor pattern 64 is electrically and thermally connected to the second conductor pattern 62 and the third conductor pattern 63 of the first circuit layer L1.

[0034] As described above, the second conductor pattern 62 of the first circuit layer L1 is disposed adjacent to the surface electric components 52. Therefore, heat generated in the surface electric components 52 is transferred from the second conductor pattern 62 of the first circuit layer L1 through the first vias 71 to the fourth conductor pattern 64. As a result, the heat generated in the surface electric components 52 is also diffused to a wide range of the board body 12 through the fourth conductor pattern 64. In addition, the fourth conductor pattern 64 is electrically connected to the third conductor pattern 63 of the first circuit layer L1, i.e., the ground wiring, thereby improving the function of the fourth conductor pattern 64 as a shielding layer.

[0035] The fifth conductor pattern 65 is connected to the O terminal 44 through the third via 73. In addition, the fifth conductor pattern 65 is connected to the upper electrode 21a of the first semiconductor element 21 and the second heat sink plate 32 through two fourth vias 74. The third via 73 and the fourth via 74 are made of a conductor such as copper or another metal. As a result, the two semiconductor elements 21, 22 are electrically connected in series by the fifth conductor pattern 65, and are also electrically connected to the O terminal 44 through the fifth conductor pattern 65.

[0036] The sixth conductor pattern 66 is connected to the upper surface electrode 22a of the second semiconductor element 22 via a fifth via 75. In addition, the sixth conductor pattern 66 is connected to the N terminal 42 via a sixth via 76. The fifth via 75 and the sixth via 76 are made of a conductor such as copper or another metal. As a result, the upper surface electrode 22a of the second semiconductor element 22 is electrically connected to the N terminal 42 via the sixth conductor pattern 66.

[0037] The semiconductor elements 21, 22 and the heat sink plates 31, 32 are arranged on the third circuit layer L3 and the fourth circuit layer L4. The heat sink plates 31, 32 have a thickness equal to the distance from the third circuit layer L3 to the fourth circuit layer L4. The semiconductor elements 21, 22 arranged on the heat sink plates 31, 32 are located on the third circuit layer L3.

[0038] The fifth circuit layer L5 has a plurality of conductor patterns 67, 68. Each of the conductor patterns 67, 68 is made of a conductor such as copper or other metal. The plurality of conductor patterns 67, 68 includes a seventh conductor pattern 67 and an eighth conductor pattern 68. Here, the plurality of conductor patterns 67, 68 are actually located on the same plane, but in FIG. 3, the seventh conductor pattern 67 is intentionally displaced with respect to the eighth conductor pattern 68 for the purpose of clarity of illustration.

[0039] The seventh conductor pattern 67 spreads over most of the fifth circuit layer L5 and is disposed so as to face the multiple semiconductor elements 21, 22. This allows heat generated in the semiconductor elements 21, 22 to be diffused over a wide area of ​​the board body 12 through the seventh conductor pattern 67. The seventh conductor pattern 67 also functions as a shielding layer that blocks electromagnetic noise radiated from the semiconductor elements 21, 22. Although not shown, the seventh conductor pattern 67 may be electrically connected to the third conductor pattern 63 of the first circuit layer L1, i.e., the ground wiring, thereby improving the function of the seventh conductor pattern 67 as a shielding layer.

[0040] The eighth conductor pattern 68 is connected to the first heat sink plate 31 through the seventh via 77. In addition, the eighth conductor pattern 68 is connected to the P terminal 40 through the eighth via 78. The seventh via 77 and the eighth via 78 are made of a conductor such as copper or another metal. As a result, the lower electrode 21b of the first semiconductor element 21 is electrically connected to the P terminal 40 through the first heat sink plate 31 and the eighth conductor pattern 68.

[0041] The sixth circuit layer L6 has a ninth conductor pattern 69. The ninth conductor pattern 69 spreads over most of the sixth circuit layer L6 and faces the seventh conductor pattern 67 of the fifth circuit layer L5. As a result, heat generated in the semiconductor elements 21, 22 is first transferred to the seventh conductor pattern 67 of the fifth circuit layer L5, and then transferred to the ninth conductor pattern 69 of the sixth circuit layer L6. As a result, the heat generated in the semiconductor elements 21, 22 is widely diffused in the board body 12 and dissipated from the ninth conductor pattern 69 to the outside of the board body 12.

[0042] The semiconductor device 10 further includes a heat absorbing member 90. The heat absorbing member 90 is located inside the substrate body 12. The heat absorbing member 90 may be made of a material having excellent thermal conductivity, such as copper or other metals, or graphite. The heat absorbing member 90 is located in the intermediate layer 16 of the substrate body 12, as are the semiconductor elements 21 and 22 and the heat sink plates 31 and 32. However, the heat absorbing member 90 may be located inside the substrate body 12, and the specific position of the heat absorbing member 90 is not particularly limited. As an example, the heat absorbing member 90 in this embodiment is located between the first semiconductor element 21 and the second semiconductor element 22.

[0043] The heat absorbing member 90 is connected to the fourth conductor pattern 64 through one or more ninth vias 79. The one or more ninth vias 79, the seventh via 77, and the eighth via 78 are made of a conductor such as copper or other metal. As a result, the heat absorbing member 90 is electrically and thermally connected to the fourth conductor pattern 64 through one or more ninth vias 79. The material constituting the ninth via 79 is not particularly limited, and may have a higher thermal conductivity than the material constituting the board body 12. As an example, the material constituting the ninth via 79 may be the same as the material constituting the fourth conductor pattern 64. The heat absorbing member 90 has a relatively large volume and can absorb a relatively large amount of heat, for example, similar to the heat sink plates 31 and 32.

[0044] As described above, the semiconductor device 10 of this embodiment includes the substrate body 12, the semiconductor elements 21 and 22 arranged in the substrate body 12, the fourth conductor pattern 64 provided on the second circuit layer L2 located between the upper surface 12a of the substrate body 12 and the semiconductor elements 21 and 22, and at least one heat absorbing member 90 arranged inside the substrate body 12 and thermally connected to the fourth conductor pattern 64. With this configuration, the heat generated in the semiconductor elements 21 and 22 is transferred to the heat absorbing member 90 also in the substrate body 12 through the fourth conductor pattern 64 in the substrate body 12. As a result, most of the heat generated in the semiconductor elements 21 and 22 can be diffused in the substrate body 12, and the temperature rise of the semiconductor elements 21 and 22 can be suppressed. In addition, since the fourth conductor pattern 64 and the heat absorbing member 90 are provided in the substrate body 12, other required components such as the control circuit 50 can be freely provided on the upper surface 12a or the lower surface 12b of the substrate body 12. This can also prevent the semiconductor device 10 from becoming large in size.

[0045] The semiconductor device 10 according to the first embodiment is an example of the technology disclosed in the present specification, and does not particularly limit the contents of the technology. The substrate body 12 in the present embodiment is an example of the substrate body in the present technology. The upper surface 12a and the lower surface 12b of the substrate body 12 in the present embodiment are examples of the first surface and the second surface of the substrate body in the present technology, respectively. The combination of the first semiconductor element 21 and the first heat sink plate 31 in the present embodiment, and the combination of the second semiconductor element 22 and the second heat sink plate 32 in the present embodiment are examples of the electric component in the present technology. The fourth conductor pattern 64 in the present embodiment is an example of the first internal conductor pattern in the present technology. The heat absorbing member 90 in the present embodiment is an example of the heat absorbing member in the present technology. The ninth via in the present embodiment is an example of the heat transfer via in the present technology. The second conductor pattern 62 in the present embodiment is an example of the first surface conductor pattern in the present technology. The ninth via in the present embodiment is an example of the heat transfer via in the present technology. And the third conductor pattern 63 in the present embodiment is an example of the ground wiring in the present technology.

[0046] (Example 2) A semiconductor device 110 of Example 2 will be described with reference to Fig. 5. The semiconductor device 110 of this example includes a plurality of heat absorbing members 90, and in this respect differs from the semiconductor device 10 of Example 1. Below, differences from Example 1 will be mainly described, and components common to Example 1 will be denoted by the same reference numerals and description thereof will be omitted.

[0047] The semiconductor device 110 of this embodiment includes a plurality of heat absorbing members 90, 92, 94 inside the substrate body 12. Each of the heat absorbing members 90, 92, 94 is preferably made of a material having excellent thermal conductivity, such as copper or other metal, or graphite. The plurality of heat absorbing members 90, 92, 94 are located in the intermediate layer 16 of the substrate body 12. Each of the heat absorbing members 90, 92, 94 is connected to the fourth conductor pattern 64 through one or more ninth vias 79.

[0048] The multiple heat absorption members 90, 92, 94 include a first heat absorption member 90, a second heat absorption member 92, and a third heat absorption member 94. The first heat absorption member 90 is located between the first semiconductor element 21 and the second semiconductor element 22. The second heat absorption member 92 is located on the opposite side to the first heat absorption member 90 across the first semiconductor element 21. The third heat absorption member 94 is located on the opposite side to the first heat absorption member 90 across the second semiconductor element 22.

[0049] As described above, the semiconductor device 110 of this embodiment includes a plurality of heat absorbing members 90, 92, and 94. With such a configuration, the plurality of heat absorbing members 90, 92, and 94 can absorb and diffuse more heat, and the temperature rise of the semiconductor elements 21 and 22 can be further suppressed.

[0050] (Example 3) A semiconductor device 210 of Example 3 will be described with reference to Fig. 6. In the semiconductor device 210 of this example, the heat absorption member 90 is connected to the seventh conductor pattern 67 of the fifth circuit layer L5 through one or more tenth vias 80, and in this respect, the semiconductor device 210 differs from the semiconductor device 10 of Example 1. Below, the differences from Example 1 will be mainly described, and the description of the configurations common to Example 1 will be omitted by assigning the same reference numerals.

[0051] The one or more tenth vias 80 are made of a conductor such as copper or other metal. As a result, the heat absorption member 90 is electrically and thermally connected to the seventh conductor pattern 67 via the one or more tenth vias 80. The material constituting the tenth via 80 is not particularly limited, and may have higher thermal conductivity than the material constituting the board body 12. As an example, the material constituting the tenth via 80 may be the same as the material constituting the seventh conductor pattern 67.

[0052] As described above, in the semiconductor device 110 of the present embodiment, the heat absorption member 90 is also thermally connected to the seventh conductor pattern 67. With this configuration, heat generated in the semiconductor elements 21, 22 is diffused through the seventh conductor pattern 67 and transferred to the heat absorption member 90. Since the semiconductor elements 21, 22 are disposed between the fourth conductor pattern 64 and the seventh conductor pattern 67, heat generated in the semiconductor elements 21, 22 is effectively diffused from both sides of the semiconductor elements 21, 22. Here, the seventh conductor pattern 67 in the present embodiment is an example of a second internal conductor pattern in the present technology.

[0053] (Example 4) With reference to FIG. 7, a semiconductor device 310 of Example 4 will be described. The semiconductor device 310 of this example includes a plurality of heat absorbing members 90, 92, and 94, similar to the semiconductor device 110 of Example 2. Each of the heat absorbing members 90, 92, and 94 is also thermally connected to the seventh conductor pattern 67 of the fifth circuit layer L5 through one or more tenth vias 80, similar to the semiconductor device 210 of Example 3. That is, the semiconductor device 310 of this example 4 has both the features of the semiconductor device 110 of Example 2 and the features of the semiconductor device 210 of Example 3. For this example, the description of Examples 1-3 above is to be referred to, and a duplicate description will be omitted.

[0054] (Example 5) A semiconductor device 410 of Example 5 will be described with reference to Fig. 8. In the semiconductor device 410 of this example, the seventh conductor pattern 67 of the fifth circuit layer L5 is connected to the ninth conductor pattern 69 of the sixth circuit layer L6 through one or more eleventh vias 81, and in this respect, the semiconductor device 410 of this example differs from the semiconductor device 10 of Example 3. Below, the differences from Example 3 will be mainly described, and the description of the configurations common to Example 3 will be omitted by assigning the same reference numerals.

[0055] The one or more eleventh vias 81 are made of a conductor such as copper or other metal. As a result, the seventh conductor pattern 67 of the fifth circuit layer L5 is electrically and thermally connected to the ninth conductor pattern 69 of the sixth circuit layer L6 through the one or more eleventh vias 81. The material constituting the eleventh via 81 is not particularly limited, and may have a higher thermal conductivity than the material constituting the board body 12. As an example, the material constituting the eleventh via 81 may be the same as the material constituting the ninth conductor pattern 69. Although not particularly limited, the one or more eleventh vias 81 are provided along the shortest path from the heat absorbing member 90 to the lower surface 12b of the board body 12 together with the one or more tenth vias 80.

[0056] As described above, in the semiconductor device 110 of this embodiment, the ninth conductor pattern 69 located on the lower surface 12b of the substrate body 12 is thermally connected to the seventh conductor pattern 67 through the eleventh via 81. With this configuration, heat generated in the semiconductor elements 21, 22 is transferred to the ninth conductor pattern 69 located on the lower surface 12b of the substrate body 12 through the seventh conductor pattern located inside the substrate body 12, and can be dissipated from the ninth conductor pattern 69 to the outside. Here, the ninth conductor pattern 69 in this embodiment is an example of the second surface conductor pattern in the present technology.

[0057] (Example 6) With reference to FIG. 9, a semiconductor device 510 of Example 6 will be described. The semiconductor device 510 of this example has a plurality of eleventh vias 81 added thereto, compared to the semiconductor device 310 of Example 4. Each of the eleventh vias 81 is made of a conductor such as copper or other metal. As a result, the seventh conductor pattern 67 of the fifth circuit layer L5 is electrically and thermally connected to the ninth conductor pattern 69 of the sixth circuit layer L6 through the plurality of eleventh vias 81. As a result, the semiconductor device 510 of this example can more effectively suppress the temperature rise of the semiconductor elements 21 and 22 than, for example, the semiconductor device 310 of Example 4.

[0058] In addition, the heat absorbing member 90 may have a fluid 91 sealed therein, for example, as a heat pipe or a heat spreader. With such a configuration, the heat transfer efficiency in the heat absorbing member 90 is improved, and the heat absorbing ability of the heat absorbing member 90 can be effectively improved. The heat absorbing member 90 having the fluid 91 sealed therein may be employed in any of the embodiments disclosed in this specification.

[0059] Specific examples of the technology disclosed in this specification have been described in detail above, but these are merely examples and do not limit the scope of the claims. The technology described in the claims includes various modifications and changes to the specific examples exemplified above. The technical elements described in this specification or the drawings exhibit technical utility alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing. The technology exemplified in this specification or the drawings can achieve multiple objectives simultaneously, and achieving one of the objectives itself has technical utility. [Explanation of symbols]

[0060] 10, 110, 210, 310, 410: Semiconductor device 12: Board body 12a:Top surface 12b: Bottom surface 21, 22: Semiconductor element 31, 32: Heat sink plate 40, 42, 44: Terminals 50: Control circuit 52: Surface electrical components 61-69: Conductor pattern 71-81: Via 90, 92, 94: heat absorbing member 91:Fluid L1-L6:Circuit layer

Claims

1. A substrate body (12) having a first surface (12a) and a second surface (12b); Electrical components (21, 22, 31, 32) disposed within the substrate body; a first internal conductor pattern (64) provided on a circuit layer (L2) located between the first surface and the electrical component and facing the electrical component; At least one heat absorbing member (90) disposed inside the substrate body and thermally connected to the first internal conductor pattern; A ground wiring (63) provided on the first surface or the second surface of the substrate body; It is equipped with the first internal conductor pattern is electrically connected to the ground wiring within the substrate body; Semiconductor device.

2. 2. The semiconductor device according to claim 1, further comprising a first surface conductor pattern (62) provided in a circuit layer (L1) located on said first surface and thermally connected to said first internal conductor pattern.

3. 3. The semiconductor device according to claim 2, further comprising a surface electrical component (52) provided in the circuit layer located on the first surface and controlling an operation of the electrical component.

4. The semiconductor device according to claim 1 , wherein the at least one heat absorbing member includes a plurality of heat absorbing members.

5. Further comprising a second internal conductor pattern (67) provided on a circuit layer (L5) located between the second surface and the electrical component, 5. The semiconductor device according to claim 1, wherein the at least one heat absorbing member is also thermally connected to the second internal conductor pattern (67).

6. 6. The semiconductor device according to claim 5, further comprising a second surface conductor pattern (69) provided in a circuit layer (L6) located on said second surface and thermally connected to said second internal conductor pattern.

7. The semiconductor device according to claim 1 , wherein the at least one heat absorbing member is made of metal or graphite.

8. 8. The semiconductor device according to claim 1, wherein the at least one heat absorbing member has a fluid sealed therein.

9. a heat transfer via (79) extending from the first internal conductor pattern to the at least one heat absorbing member; The semiconductor device according to claim 1 , wherein a material constituting the via has a higher thermal conductivity than a material constituting the substrate body.

10. A semiconductor device as described in any one of claims 1 to 9, wherein the electrical component has a power semiconductor switching element (21, 22) and a heat sink plate (31, 32) on which the switching element is arranged.

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