De-icing system

Abstract

To provide a system for heating an exterior surface of a bulk medium.SOLUTION: A system includes two or more coupling strips spaced apart from one another and attached to a bulk medium. Each of the coupling strips has a multi-layer structure extending along a surface of the bulk medium that forms, in combination with the bulk medium, an electrical transmission line. The multi-layer structure includes a first dielectric layer over the bulk medium, a conductive layer over the first dielectric layer, a second dielectric layer over the conductive layer, and a conductive shielding layer over the second dielectric layer. A power control system is coupled to the conductive layer of each of the coupling strips and to the bulk medium. The power control system is configured to heat the bulk medium by providing current to the coupling strips.SELECTED DRAWING: Figure 19

Description

[Technical field]

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS This application is a continuation of U.S. patent application Ser. No. 62 / 723,270, filed Aug. 27, 2018. No. 6,396,633, filed on Oct. 23, 2003, the contents of which are incorporated herein by reference in their entirety.

[0002] The present invention relates to a system for heating an electrically conductive material. [Background technology]

[0003] Many conductive surfaces, such as those in cars, aircraft, and satellites, encounter cold or icy conditions during daily use. The accumulation of ice or water on the conductive surfaces of these structures can lead to inefficient or even dangerous operating conditions. For example, ice buildup on an aircraft's wings can reduce lift and cause resistance. The force may increase.

[0004] Many of these structures either lack heating systems or are fitted with bulky electronics and other equipment. The use of such bulky devices is prohibited in the industry. This is becoming a challenge for Summary of the Invention

[0005] The present invention discloses techniques for heating conductive surfaces. These techniques are generally A high-frequency alternating current ("AC") signal (e.g., 1 kHz or greater) is used to transmit a signal through a conductive bulk medium ( Shape the current density in a target area of ​​a conductive material (e.g., conductive material) to induce Joule heating in the medium .

[0006] Joule heating, also known as ohmic heating or resistive heating, is the generation of heat by passing an electric current through a conductor. The amount of heat generated by a conductive medium is a function of the amount of current passing through it. Heating is based on the amount of heat and the electrical resistance of the medium. As a result, heating can occur either by current, voltage, resistance, or a combination of these. It can be controlled (e.g., increased or decreased) by adjusting the combination.

[0007] The resistance of a given conductor limits the volume within the conductor through which current can flow, increasing the length over which the current can flow. The embodiment of the present invention can be used to increase the light transmission efficiency by, for example, reducing the skin effect. Use contact effects to shape (e.g., shape) current in a conductive medium (e.g., bulk medium, conductor) By operating a mechanism (e.g., contraction, expansion, etc.) to generate heat in the bulk medium Both effects are achieved by the introduction of high frequency AC currents into the conductive medium to be heated. The skin effect occurs when the current density increases near the surface of a conductor and The current is distributed in a conductor so that it decreases with depth. The proximity effect causes another AC current to flow near an existing current through a conductor. By placing a path, the current flowing through the conductor can be further suppressed. also has the function of lengthening the current path.

[0008] For example, embodiments of the present invention may provide a method for suppressing current flow along a current path, thereby: The bulk medium is configured to increase the resistance of the bulk medium along a current path through the bulk medium. As a result, the present embodiment provides increased heating performance for the conductive medium while simultaneously generating heat. This reduces the current required to achieve a certain current path. By increasing the effective resistance of a conductive medium, the current required to generate Joule heat within the medium is increased. Less current is required than would otherwise be required.

[0009] Generally, in a first aspect, a system for heating a bulk medium comprises spaced apart and two or more electrodes arranged in a manner such that the electrodes are coupled to the bulk medium, and a power control system coupled to the electrodes. A power control system shapes the density of the current in the bulk medium to This aspect is configured to create an effective resistance in the bulk medium along the current path between the electrodes. In this case, the power control system regulates the current by adjusting the skin depth of the current along the current path. By shaping the density of the current within the depth of the medium and adjusting the proximity effect of the current, Shape the current density across the path.

[0010] A second general embodiment involves two or more spaced apart electrodes coupled to a bulk medium. and a power control system coupled to the electrode. A power control system may be provided to regulate the current density along a current path between the electrodes. This shapes the current path in the bulk medium, thereby distributing the direct current (DC) of the bulk medium. to heat the bulk medium by creating an effective resistance greater than the resistance to In this embodiment, the power control system adjusts the skin depth of the current. This allows shaping the density of the current within the depth of the bulk medium as well as adjusting the proximity effect of the current. This shapes the current density across the current path.

[0011] A third general aspect is a method for detecting a magnetic field by a magnetic field generator, comprising: two or more electrodes configured to be coupled to a bulk medium; and a power control system coupled to the electrode. The control system shapes the density of the current along the current path through the bulk medium between the electrodes, Creates an effective resistance along the current path that is greater than the resistance of the bulk medium to DC current In this embodiment, the power control system is configured to heat the bulk medium by , shaping the density of current within the depth of the bulk medium by adjusting the skin depth of the current Both of these techniques aim to reduce the current density across a portion of the current path by adjusting the proximity effect of the current. The product is molded.

[0012] A fourth general embodiment involves two or more spaced apart electrodes coupled to a bulk medium. The present invention may be embodied in a system including the above electrode and a power control system coupled to the electrode. The power control system controls the inter-electrode power at frequencies greater than 1 kHz and less than 300 GHz. Generates an AC current signal along a current path through the bulk medium and at the surface of the bulk medium to generate a second current path located adjacent to and along the current path through the bulk medium. It is composed of.

[0013] A fifth general embodiment includes two or more spaced apart electrodes coupled to a bulk medium. and an electrode coupled to the electrode to generate an AC current signal along a current path through the bulk medium. a power control system configured to heat the bulk medium by a heating control system and an electrode is coupled between the heating control system and the impedance of the bulk medium. an impedance tuning network (IAN) configured to correspondingly tune; The present invention is embodied in a heating system including:

[0014] A sixth general aspect is a method for detecting a magnetic field comprising: The present invention can be embodied in a heating system including a heating element, wherein each of the two or more electrodes includes at least one The electrodes contain a material that is as conductive as the bulk medium, reducing the contact resistance between the electrodes and the bulk medium. A power control system coupled to the bulk medium in a manner and configured to couple to the electrodes Shape the current density along the current path between the poles, thereby This creates an effective resistance to direct current (DC) that is greater than the resistance of the bulk medium. The heating system of this embodiment is configured to heat the bulk medium by heating the bulk medium along the current path. This adjusts the skin depth of the current, thereby shaping the current density.

[0015] The seventh general aspect is two spaced apart, attached to a portion of the aircraft. The present invention can be embodied in an aircraft de-icing system including the above electrodes. , by shaping the density of the current along the current path through the bulk medium between the electrodes 1 MHz along a current path through a portion of the aircraft between the electrodes, configured to heat the medium Generates an AC current signal with a frequency of ~50MHz, which determines the current flow along the current path. By adjusting the skin depth of the current, the current density is shaped in a first direction, 10 cm of the surface of the part of the aircraft along at least part of the current path through the part of the aircraft providing a second current path located within close proximity of the second current path to a surface of a portion of the aircraft; The proximity of the current reduces the current flow by adjusting the proximity effect along part of the current path. The density is caused to mold in a second, different direction.

[0016] An eighth general aspect is embodied in a system for heating an exterior surface of a bulk medium. The system is comprised of spaced apart, bulk media-mounted Two or more bonding strips, each of which extends along a surface of the bulk medium. The multilayer structure is made up of a bulk medium and a multilayered structure that is combined with the bulk medium to form a transmission line. a first dielectric layer, a conductive layer on the first dielectric layer, a second dielectric layer on the conductive layer, and a second The power control system includes a conductive shield layer on the dielectric layer of each of the coupling strips. The coupling strip is coupled to the layer and to the bulk medium. A power control system provides current to the coupling strip. The bulk medium is configured to heat the surface of the bulk medium by supplying heat to the surface of the bulk medium. In form, bulk media may be used in the skin of an aircraft, the blades of a wind turbine, the roof of a building, or It can be a railroad track.

[0017] A ninth general aspect is a system for heating an exterior surface of a structure made from a non-conductive material. The structure may be embodied in a bulk conductive material embedded therein. The system includes two or more spaced apart, structure-mounted Each bonding strip has a multi-layer structure extending along the structure, This is combined with bulk conductive material embedded within the structure to form the transmission line. a conductive layer covering the bulk conductive material, and a first dielectric layer between the bulk conductive material and the first conductive layer. A power control system is coupled to the conductive layer and to the structure of each of the coupling strips. The power control system controls the surface of the structure by supplying current to the coupling strips. In various embodiments, the structure is configured to heat an aircraft skin, a wind turbine, or the like. It can be the blade of a bin, the roof of a building, or a railroad track.

[0018] A tenth general aspect may be embodied in a method of installing a bulk media heating system. The method includes obtaining bonded strips, each bonded strip comprising: a first dielectric layer, a conductive layer covering the first dielectric layer, a conductive shield layer covering the conductive layer, and and a second dielectric layer between the conductive layer and the conductive shielding layer. The method comprises attaching each bonding strip to the surface of the bulk medium at intervals, and The method includes positioning a first dielectric layer of the chip between the bulk medium and the conductive layer. The method further comprises: connecting the conductive layer of each bonding strip to the bonding strip, the conductive layer being configured to supply a current to the bonding strip. In various embodiments, the bulk medium includes a power supply. includes the skin of an aircraft, the blades of a wind turbine, the roof of a building, or a railway track.

[0019] The subject matter described herein is intended to achieve one or more of the following advantages: It can be implemented in a much more economical way, using lighter and smaller electrical systems to heat the conductors. Additionally, heating can be localized to a target area, and the heating system circuitry The heating system may be, for example, a heating element attached to the bulk medium or Direct heat generation in the bulk medium (e.g., an aircraft wing) itself, rather than generating heat in a heating layer or a By generating heat, the system can be more efficient. In some embodiments, lower current and voltage may be required, improving safety and reliability. This system is easier to install or retrofit. This system can be cheaper and requires less maintenance. The system is non-invasive and can be retrofitted to existing systems. The system allows for faster de-icing.

[0020] The details of one or more embodiments of the subject matter herein are set forth in the accompanying drawings and the description below. Other features, aspects, and advantages of the subject matter are set forth in the description, drawings, and claims. This becomes clear from the scope of the demand. [Brief description of the drawings]

[0021] [Figure 1] 1 is a schematic diagram of an exemplary configuration for heating a bulk medium. [Diagram 2] 2A-2B are schematic diagrams illustrating an exemplary configuration for utilizing the skin effect to concentrate current density in a first direction in a bulk conductor to heat a bulk medium. [Diagram 3] 1 is a plot showing the increase in current density crowding due to the skin effect as a function of applied AC current. [Figure 4] 4A-D are schematic diagrams illustrating an exemplary configuration for using the proximity effect to concentrate current density in a second direction in the bulk conductor to heat the bulk medium. [Diagram 5] 5A-B are simulation diagrams illustrating the increase in current density crowding in a bulk conductor adjacent to a second conductor as a function of distance between the conductors due to the proximity effect. [Figure 6] Figure 6A is a schematic diagram of an exemplary configuration for heating a bulk medium using an array of electrodes, and Figures 6B-6D are schematic diagrams of exemplary configurations for heating a bulk medium using various electrode configurations. [Figure 7] 1 is a schematic diagram of an exemplary signal conversion unit ("STU") including standard power conversion ("TSP") and AC generation ("ACG") main subunits. [Figure 8] FIG. 1 is a schematic diagram of an exemplary STU including a TSP, an ACG, and a control main subunit. [Figure 9]FIG. 9A is a schematic diagram of an example TSP subunit including a flyback converter and a common mode choke, and FIG. 9B is a schematic diagram of an example flyback converter. [Figure 10] FIG 10A is a schematic diagram of an exemplary ACG subunit including a class D amplifier with dual MOSFET transistors, a temperature controlled crystal oscillator ("TCXO"), and a gate driver. FIG 10B is a schematic diagram of an exemplary class D switch mode amplifier. FIG 10C is a schematic diagram of an exemplary ACG subunit including a class D amplifier with dual MOSFET transistors, a TCXO, a gate driver, and a low power conversion stage ("LPC"). [Figure 11] FIG. 2 is a schematic diagram of an exemplary control subunit including a microcontroller and an LPC. [Figure 12] FIG. 2 is a diagram of an impedance matching network between a power source and a load. [Figure 13] 13A-D are schematic diagrams of building blocks of an exemplary impedance matching network. [Figure 14] FIG. 2 is a schematic diagram of an exemplary coordination network unit including a passive coordination subunit. [Figure 15] 15A and 15B are schematic diagrams of an example coordination network unit including an active coordination subunit and a control subunit, respectively, and FIG. 15B is a schematic diagram of an example coordination network unit including an active coordination subunit, an LPC, and a control subunit. [Figure 16] FIG. 2 is a schematic diagram of a cable stage in an exemplary heating system. [Figure 17] FIG. 2 is a schematic diagram of an exemplary electrode for a heating system. [Figure 18A] 1 is a schematic diagram of an exemplary brazed joint between an electrode and a bulk medium. [Figure 18B] 1 is a schematic diagram of an exemplary rivet fastener attachment between an electrode and a bulk media. [Figure 18C] 1 is a schematic diagram of an exemplary air seal tape attachment between an electrode and a bulk medium. FIG. [Figure 18D] 1 is a schematic diagram of an exemplary interdigitation attachment between an electrode and a bulk medium. FIG. [Figure 19] 1 is a cross-sectional view of an exemplary coupling strip for providing a radio frequency heating signal to a bulk medium in accordance with an implementation of the present disclosure. [Figure 20] 20 illustrates an example layout of the joining strip of FIG. 19 positioned on an aircraft wing. [Figure 21] 1A-1C show top views of several example bonding strips to illustrate various configurations of conductive layers within the bonding strips. [Figure 22A] 4 shows plots of simulated current density generated at an aircraft skin by an exemplary coupling strip and electric field density between the coupling strip and the aircraft skin. [Figure 22B] 22B shows a plot of simulated current density generated in the skin of the aircraft shown in FIG. 22A. [Figure 23] Layout diagrams of several example conductive layer arrangements within a bonding strip are shown. [Figure 24A] 24 shows a cross-sectional view of a coupling strip according to layout A of FIG. 23 taken along line AA. [Figure 24B] 24 shows a cross-sectional view of a coupling strip according to layout B of FIG. 23 taken along line BB. [Figure 24C] 24 shows a cross-sectional view of a coupling strip taken along line CC in accordance with layout C of FIG. 23. [Figure 25A] 1 illustrates a cross-sectional view of an exemplary configuration for attaching a bonding strip to a bulk media. [Figure 25B] 13 illustrates a cross-sectional view of another exemplary configuration for attaching a bonding strip to a bulk media. [Figure 26A] FIG. 2 is a cross-sectional view of a bonding strip with a double-sided adhesive bottom layer prior to placement on bulk media. [Figure 26B] FIG. 26B is a cross-sectional view of the coupling strip of FIG. 26A placed on a bulk medium. [Figure 27] 27A-27F show cross-sectional views of various embodiments of embedded bonding strips. [Figure 28]1 illustrates an embodiment of a combining strip connector. [Figure 29] 13A-13C show another embodiment of a combining strip connector. [Diagram 30] FIG. 1 is a block diagram of a first exemplary bulk media heating system utilizing coupling strips in accordance with an implementation of the present disclosure. [Diagram 31] FIG. 2 is a block diagram of a second exemplary bulk media heating system utilizing coupling strips according to an embodiment of the present disclosure. [Diagram 32] 1 is a block diagram of a third exemplary bulk media heating system utilizing coupling strips in accordance with an implementation of the present disclosure.Like reference numbers and designations in the various figures refer to like elements. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0022] The heating system of the present invention uses AC current to heat conductive materials (e.g., aluminum, carbon It increases the effective electrical resistance of materials (fiber composites) making them more easily heated. Additionally, the heat generated by the conductive material can be used to melt ice that has formed on the surface of the conductive material. This heat is used to keep the conductive material hot and to prevent vapor build-up on the surface, and to prevent water from freezing on surfaces and to prevent freezing precipitation (e.g., snow, freezing rain, fog, freezing rain) ) can be used to prevent ice formation on surfaces, e.g. on conductive materials. Heat can be conducted (e.g., spread) throughout the conductive material. This induces convection across the interface between the conductive material and the liquid on its surface, e.g. by heating the liquid. This can prevent freezing.

[0023] Alternating current is used to induce several electromagnetic effects that increase the effective resistance of conductive materials. This allows the Joule heat of the conductive material to be utilized to promote heat generation. Such effects include the skin effect, proximity effect, induction, eddy currents, hysteresis losses, and If the frequency of the current in the conductor is set high enough, The skin effect occurs when most of the current flows through a conductive material that is significantly thinner than the geometric thickness of the conductive material. In addition, certain device geometries are used to create proximity effects in the conductive material. This effect further restricts the range of current densities, thereby This further increases the effective resistance along the current path in the material. These two effects taken together are can be used to increase the electrical resistance of a conductive material and generate Joule heating. do.

[0024] For example, Joule heating generally refers to the heat produced by passing an electric current through a conductor. The heat generated in a particular current carrying conductor is the root mean square product of the resistance of the material and the square of the amplitude of the current:

number

[0025] Heat output from a heating element is generally increased by increasing the current passing through a conductor, and However, the present disclosure provides a method for increasing the heating efficiency by using a relatively high resistance heating element. The morphology exploits certain electromagnetic phenomena (e.g., skin effect and proximity effect) to create a This current density causes the local current density to shrink, generating Joule heat. The contraction of the material increases the effective resistance along the current path in the bulk medium. For a particular length along the current path through the bulk medium, which may vary with material and geometry, The effective resistance can generally be expressed as:

number

[0026] Some embodiments of the present disclosure use these electromagnetic phenomena to induce current flow through a bulk medium. The length of the path can be increased, for example as described below with reference to FIG. Using the techniques described herein, the potential between two electrodes attached to a bulk medium can be measured. The flow path can be "steered" along a non-direct path (e.g., a tortuous path). A path is created by a current passing between two electrodes in the absence of electromagnetic effects, e.g., the proximity effect. Generally, the effective length (l eff ) to generate a current path Thus, the system described herein can adjust the current path length l to the The various systems and conductor arrangements described in the literature have longer effective lengths than the direct paths that currents would take in the absence of Effective length (l eff ) can be increased to 10 ... The effective cross-sectional area (A eff ) and the current flows through the bulk medium. Effective length (l eff ) by both increasing the effective resistance (R eff ) This allows the effective resistance of the bulk medium to be increased by the In such an embodiment, the effective resistance can be increased beyond In general, it can be expressed as follows:

number

[0027] As used herein, skin effect generally refers to the effect that alternating current is distributed unevenly within a conductor, causing the current Density is greater near the surface of the conductor and decreases as the distance to the surface of the conductor increases The strength of the skin effect increases with the frequency of the current and the conductivity of the material carrying the current. Some embodiments of the present disclosure are directed to a method for treating a conductor having a high AC frequency that is electrically connected to the outer surface of the conductor (e.g., The skin effect can be adjusted to allow more flow through the filter (the "skin depth").

[0028] In general, the skin effect of a conductor can be expressed by the following formula:

number

number

[0029] For an infinitely long and wide rectangular plate carrying a surface current, the skin effect is expressed as It is possible.

number

[0030] For example, the diagram shown in FIG. 3 and described in detail below illustrates the effect of the skin effect. 1 shows an example of current density contraction within a depth of a material (e.g., skin depth) that occurs when

[0031] As used herein, the proximity effect generally refers to the effect of a current flowing through a first current path (e.g., a conductor) Refers to the effect of an AC current on the current density of a nearby AC current flowing through a second current path. For example, as shown in FIGS. 5A-5B and described in detail below, the AC current of the first current path The current flow causes the AC current density of the second current path to be "concentrated" or constricted around the first current path. In an embodiment of the present disclosure, for example, the density of the current passing through the bulk medium is When a conductor carrying AC current is placed near a current passing through a medium, the other conductor carrying AC current The current density is "pulled" toward the conductor. The degree and direction of the AC current flow (e.g., concentration) can vary with several variables, e.g., the number of AC current paths the distance between the current paths, the relative direction of current flow through each current path, and the frequency of the AC current in the current paths. The magnitude of each current in the current path depends on the number of

[0032] For clarity, the heating system of the present disclosure is a de-icing and anti-icing system for the exterior surfaces of an airplane. However, the heating system of the present disclosure may be used in other other aircraft, drones, wind turbines, cryogenically operated equipment, heat pumps, rolling stock, radio towers, railroad track surfaces, manned or unmanned military vehicles, roofs, or ice or water surfaces. It can be used to heat other conductive surfaces that would benefit from the suppression of formation, but The heating system may be used for de-icing or anti-icing purposes. In some embodiments, the heating system may include, for example, a conductive material on or within a non-conductive material. It can be used to heat low-conductivity materials by adding layers. Embodiments may include, but are not limited to, roads (such as driveways), building materials, roofs, floors, or other low or non-conductive materials. It can be used to heat the surface of food.

[0033] As used herein, de-icing generally refers to the removal of snow, ice, or frost (collectively referred to as "ice") from a surface. In some embodiments, the heating system refers to the removal of existing It is enough to melt a part of the ice. Then the ice (for example, the melting process begins and the ice When the bond between the surface and the material is broken, it is removed from the surface (by sliding off the surface).

[0034] As used herein, anti-icing generally refers to the formation of snow, ice, or frost (collectively "ice"). or prevention of adhesion to a surface. In some embodiments, the heating system is (e.g. Prevents ice from forming on surfaces (from freezing precipitation such as snow, frost, freezing rain, and ice accumulations) and Maintain a surface temperature high enough to prevent buildup or formation.

[0035] FIG. 1 illustrates a block diagram of an exemplary heating system 100 for heating a bulk medium. The heating system 100 includes a power control system 104 coupled to the electrodes 116 and 118. The electrodes 116 and 118 are disposed in a target area of ​​the bulk medium 102 (e.g., a wing of an aircraft). The power control system 104 is coupled to a wire (or path or cable). ) 106, the bulk medium 102, and finally via a wire (or return path) 108. It generates an alternating current (AC current) (for example, a frequency of 1 kHz or more) across a closed or open circuit. The direction of current 112 through the wire is indicated by the dashed arrow.

[0036] In some embodiments, the heating system 100 includes a power control system 104 and an electrode 1 16 and 118, and dedicated cables (e.g., wires 108 and 106). In some embodiments, the heating system can include, but is not limited to, the electrode 1. 16 and 118. In some embodiments, the heating system The stem is configured to be coupled to a special cable (e.g., 108 or 116). In some embodiments, the power control system 104 controls the signal generating unit, the power supply , a signal conversion unit, an impedance matching network, a control unit, and a sensor The present invention may include, but is not limited to, specific configurations described in detail below. As described in more detail below, in some embodiments, the impedance tuning network It is an impedance matching network.

[0037] In some embodiments, electrodes 116 and 118 are contact electrodes. 16 and 118 are physically connected to the bulk medium 102 to receive power from the power control system 104 In some embodiments, the electrodes 116 and 118 conduct a current of It can be coupled to the bulk medium 102 but electrically isolated from the bulk medium 102. For example, in such an embodiment, the electrodes 116 and 118 may be A current is applied to the bulk medium 102 as an input and an output of an induction coil disposed adjacent to the bulk medium 102. It can be emotionally induced.

[0038] The power control system 104 adjusts the power between the electrodes 116 and 118 by adjusting the skin effect. A current of sufficient frequency (e.g., 1 kHz or higher) to constrict the current flow in the z-direction between the The power control system 10 may be configured to supply a high resistance to the bulk medium 102. 4 can provide AC current with frequencies from 1kHz to 300GHz. In some embodiments, the current frequency is between 100 kHz and 450 MHz. In some embodiments, the current frequency is between 1 MHz and 50 MHz, between 100 MHz and 15 0MHz, 200MHz~300MHz, 400MHz~ 500MHz, or 800 The range is from MHz to 1GHz.

[0039] In some embodiments, the return path 108 is adjacent to the surface of the bulk medium 102. The proximity of the return path 108 to the surface of the bulk medium is achieved by the electrodes 116 and 118, thereby adjusting the proximity effect of the current flowing between the This can further inhibit the flow and increase heating in the bulk medium. To shape the current flowing between the electrodes 116 and 118, a current source is provided from the heating system circuit itself. It is not necessary to use the return current path 108 of the first embodiment. A line 122 (e.g., from a different circuit) is placed close to the bulk medium 102 (e.g., at a distance of 12 For example, the current path 108 or 122 from the bulk medium 102 can be If the distance 120 or 120a between the electrodes is small enough, the proximity effect can be used to transmit the electromagnetic wave through the bulk medium. This can further suppress the current flowing through the capacitor.

[0040] For example, the distance 120 (or 120 ) between the bulk medium and the path 108 (or 122) a) is less than 1m, or less than 50cm, or less than 10cm to produce the proximity effect. If closer distances are possible, taking into account the design constraints, (For example, an airplane wing is the bulk medium, in this case the ribs or spars of the airplane. 108 / 122), distance 120 (or 120a) is It can be less than 25cm or less than 10cm.

[0041] The bulk media 102 may be aluminum, metal alloys, carbon fiber composites, copper, silver, titanium, or For example, the bulk medium may include materials such as a fuselage or steel. Any part of an aircraft's fuselage, such as the wings, undercarriage, or tail (e.g., the "skin" of the plane) Also known as the outermost shell or surface of an aircraft.

[0042] The electrodes (116 and 118) may be made of aluminum, silver, copper, alloys thereof, or other conductive material. In some embodiments, the electrode material may include, but is not limited to, an electrically conductive material. The conductive layer is at least as conductive as the bulk medium 102. The poles 116 and 118 can be arranged in an array of electrodes. The electrodes are in contact with the bulk medium. In various ways, for example, by bonding to the top or bottom surface of the medium or by embedding within the medium can be done.

[0043] The heating system 100 reduces the heat generated by the bulk medium by shaping the density of the current passing through the medium. 102. In other words, in an aircraft application, The existing fuselage of the aircraft is used as part of the electrical circuit of the heating system. Heating System 10 0 can be achieved by adjusting the skin effect, the proximity effect, or a combination of both to reduce the current density. , which shapes the effective resistance of the bulk medium 102 along the current path between the electrodes 116 and 118. In some cases, the proximity effect can be exploited to increase the , the current path can be directed to heat a desired section of the bulk medium. The desired heating section may be referred to as the "target heating location" or "target location."

[0044] In some embodiments, an alternating current with a frequency of 1 kHz or more is applied directly to the aircraft fuselage. As a result, Joule heating occurs in the parts of the aircraft near the surface where the current flows. Additionally, heat generated by the current spreads throughout the bulk medium 102 by conduction.

[0045] 2A-2B, the heating system 100 utilizes the skin effect to heat a target area of ​​a medium. As in FIG. 1, an AC current (direction 212) shapes the current density through the bulk The medium 102 is delivered through the target area between the electrodes 116 and 118. In the absence of effect (e.g., for current frequencies below 1 kHz), the target of the bulk medium 102 FIG. 2 is a schematic diagram showing a profile (e.g., side view) of current density 202 through a region. flows in the y direction (212), with most of the current flowing within the volume of the medium 102 indicated by the arrows. For example, the current may have a depth 206 of about 2 mm, e.g., approximately the entire thickness of the bulk medium. Thus, FIG. 2A shows a system with little or no current density shaping due to the skin effect. 1 shows the operation of the system 100.

[0046] FIG. 2B shows the results of applying a high frequency AC current (e.g., 1 kHz or higher) between the electrodes. FIG. 2B is a schematic diagram of the profile of the current density 202 caused by the skin effect. The operation of the system 100 for shaping the heat of a semiconductor device is shown. For example, the heating system 100 may be operated at high frequency. Due to the skin effect caused by the operation, the current density 2 The depth of the bulk medium 102 is contracted in the z-direction to a narrow region near the surface of the bulk medium 102. , the effective resistance of the current flow region of the bulk medium 102 increases sufficiently to cause a joule The remaining circuit (e.g., wires, power supplies, inverters, regulation nets, etc.) can then be heated. The effective resistance of the bulk medium to the AC current in the target area is The resistance can be made larger than the resistance of the bulk medium to DC current. For example, The resistance can be two or more orders of magnitude greater than the resistance of the bulk medium to DC current.

[0047] Figure 3 shows the depth of material due to the skin effect (x-axis, normalized to 1) as a function of applied AC current. 4 is a plot showing the concentration of current density (y-axis, normalized to 1) at The current density decays exponentially along the thickness of the medium (z direction). As the frequency increases from 10 MHz to 10 MHz, the current density becomes more concentrated near the surface of the bulk medium. Therefore, the higher the frequency, the more pronounced the attenuation. In other words, the skin effect occurs when the current It shrinks the current density as it passes through a thin layer near the surface of the bulk medium. Heat is generated in this layer.

[0048] FIG. 4A illustrates a side view of a system 400 for utilizing the proximity effect to further shrink the current density. 1, electrodes 116 and 118 are disposed in the bulk medium 102 (e.g., the fuselage). A target area on the target surface is mounted on the target surface and an AC signal (e.g., 1 kHz or higher) is passed through the target surface. The return path 108 generates a current density (or path) 410 in a direction 412 through It is located within a distance 120 from the current path (or density) 410 in the medium and is in a direction 412 In some embodiments, the return path 108 is in a direction different from the bulk medium. The path 108 is electrically isolated from the body 102. The path 108 is within a distance 120 from the bulk medium 102. The return path 108 may be a wire or cable disposed in the system 400. There may be wires or cables completing the circuit.

[0049] If the return path 108 is close enough to the current path 410 (e.g., less than 50 cm), The AC current in the turn path 108 causes the current in the current path 410 to flow In other words, the return path 108 is sufficiently contracted to the current path 410. The closer placement reduces the cross-sectional area of ​​current flow in the current path 410. For example, referring to FIGS. 4A-4C, current flows between electrodes 116 and 118 in two directions (e.g., For example, the film is shrunk in the x and z directions as shown in FIG. As can be seen, the proximity effect can occur in either the x or y direction, depending on the direction of current flow. For example, if a current flows in the x direction, the proximity effect shrinks the current density 410 in the y direction. For example, the proximity effect primarily shrinks the current transversely to the direction of current flow. While the skin effect shrinks the current density primarily within the depth of the bulk medium (e.g., Figures 2A and 2B), In some cases, the proximity effect is reduced by shrinking the bulk medium 10 This can also be added to the shrinkage of the current density with depth (e.g., in the z direction), e.g., due to the skin effect and In embodiments that utilize both the proximity effect and the skin effect, some In one embodiment, the proximity effect is used to determine the direction of current flow (e.g., It is also possible to define a path that the flow takes through the bulk medium 102.

[0050] 4B-C are exemplary schematic diagrams of the system 400 from above. 118 is attached to the target area 102 of the bulk medium and is adapted to receive an AC signal (e.g., 1 kHz or higher). (top) to generate a current density (or current path) 410 in a direction 412 through the medium. The return path 108 is distinct from the current path (or density) 410 in the bulk medium 102. In some embodiments, the return path 108 is disposed in an xy plane (dotted line). The current is in a direction 112 different from the direction 412. For example, in some embodiments, The direction of current flow 112 in the turn path 108 is opposite to the direction of current flow 412 in the current path 410. If the distance between the current path 412 and the return path 108 is sufficiently small (for example, 50 cm 4C), the current flowing in the bulk medium 102 between the electrodes 116 and 118 is Due to the proximity effect, the return path wires are crowded together (e.g., y and z The greater the distance of the return path 108 from the bulk medium 102, the As shown in FIG. 4B, fewer current paths 412 are constricted within the bulk medium 102. This will be the case.

[0051] FIG. 4D is an exemplary schematic diagram of another embodiment of the system 450 as viewed from above. Similar to stem 100, electrodes 116 and 118 are attached to a target area of ​​bulk medium 102. The return path 108 is adjacent to the bulk medium 102. 2 is disposed in a different xy plane than the current path 410 in the How to shape the return path 108 (also For example, a second current path (e.g., a resistor) may be used. A current carrying wire or cable (such as a line path 108) is placed adjacent to the bulk medium 102. By doing so, the proximity effect is utilized to shrink the width of the current density across the direction of current flow. and shaping the current paths 410 in the bulk medium 102. FIG. 4D also shows that the proximity effect reduces the current density along the current path 410 by For example, in FIG. 4D, current path 4 The current density along 10 is substantially in the direction of current flow in each segment of the path 410. 102, the current path 410 in the bulk medium 102 is contracted in a direction perpendicular to the return path 108. More specifically, in section A of the current path 410, The current is guided to flow along the x direction, and the current density is constricted in the y and z directions. In section B of the current path 410, the current is guided to flow along the y direction. , the current density is contracted in the x and z directions.

[0052] The ability to shape the current path into more complex shapes due to the proximity effect, as shown in Figure 4D. This provides several advantages. First, this configuration increases the effective current path length l. As mentioned above, the longer the path length, the higher the resistance. Second, the current path shape is such that the current is Third, the shape of such a current path can be configured to direct the current to a strategic location. to generate areas of increased heating (e.g., hot spots) at sharp corners in the current path. It is possible.

[0053] The combination of the proximity effect and the skin effect reduces the sensitivity of the bulk medium to the AC current in the target area. The effective resistance can be made larger than the resistance of the bulk medium to DC current. For example, , the effective resistance can be more than two orders of magnitude larger than the resistance of the bulk medium to DC current. do.

[0054] 5A-B show the effect of the proximity effect on the second conductor / path 1 as a function of the distance 120 between the conductors. A simulation showing increased current density concentration in the bulk conductor target region 102 near 08. The current in the bulk conductor and the second path is affected by the proximity effect as the distance 120 decreases. (e.g., above 1 kHz or 10 MHz). For example, distance When 120 is 20 cm, the current density 410 is As shown in FIG. 5B, when the distance 120 is reduced to 2 cm, Then, the current 410 becomes “crowded” around the return path 108 in the xz plane due to the proximity effect. "or "constriction" occurs because most of the current 410 flows through a narrow strip along the bulk conductor. The second conductor (108) is arranged to have a path (e.g., a return path or other current path) that is densely packed into the lip. In other words, the current 410 flows through the bulk medium. Instead of spreading themselves evenly throughout the body, they follow the path of least inductance.

[0055] In some embodiments, a relay may be used to induce proximity effects, similar to path 122 in FIG. Use a wire other than turn path 108. In that case, the current oscillation in that wire will be 06 and 108 are driven by the same system (e.g., power control system 104). In that case, the proximity effect of the wire 122 is the current in the bulk conductor. It depends on the distance from the path 412 to the wire 112. As with the return path 108, The yard 122 must be close enough to the path 412 (e.g., less than 50 cm).

[0056] In general, the power control system 104 controls the electrodes (e.g., 116 and 118) and the dedicated The current is provided to the bulk medium 102 via a conductor (e.g., a dedicated wire or cable). These three components are further explained below. will explain in detail.

[0057] In some embodiments, the electrodes 116 and 118 are connected to the input The electrode system 600 includes an array of electrodes and an output electrode. Three input electrodes 116(1)-(3) and three output electrodes forming an electrode array 118. 118(1)-(3), which provide adjacent current paths 410 within the bulk medium. As detailed above, the proximity effect due to the current 112 in the return wire 108 increases the current in the bulk medium. Contract the current density 410.

[0058] Generally, various electrical currents are used to achieve the desired heating in the target area of ​​the bulk medium 102. Polar geometries can be used. For example, as shown in FIG. 6B, a system 610 Two electrode arrangements 116 and 117 are used to deliver electrical current to the target area 102 of the bulk medium. Electrode arrangement 11 and 118 are shown (with input / output wires 106 and 108). 6 and 118 may be an array of one or more electrodes as shown in FIG. 〜D shows another electrode configuration 620 for heating a target area 120, for example, on an aircraft wing, and Electrodes designated by 116, 118, and 640 are schematic diagrams of each of the electrodes 116, 118, and 630. The arrangement may be a single electrode, as shown in FIG. 6A, or an array of one or more electrodes. The electrode geometry and design details are as follows:

[0059] In some embodiments, the bulk medium is the skin of an aircraft and the target area for heating is , wings, fuselage, vertical stabilizer, horizontal stabilizer, windows, winglets, windshield, control surfaces (flaps, arms, etc.) irradiance, rudder, elevator, air brakes, etc.), nose / nose cone, landing gear A, landing gear brakes, landing gear doors, engines and engine nacelles, AC inlets and outlets, fuel tank vents, pitot heads, static ports, and other antennas. , sensors, exterior lights, fuel tank vents, service panels, etc. In other words, the proposed technique may be implemented in any of the configurations shown in Figures 6A-6D. In one or more of the configurations described, the electrodes may be disposed inside the fuselage. In some embodiments, the heating system 100 generates Joule heat in a portion of the target area. Conduction within the material can then provide further thermal diffusion.

[0060] In general, the power control system 104 generates a high-frequency (e.g., 1 kHz or higher) AC electrical signal. (AC) and directing it through the above-mentioned target area 102 of the bulk medium. The signal generation system includes a 3-D signal generator that is optimized for low impedance in the target area (in some cases less than 1 Ω). In some embodiments, the signal generating system generates Joule heat at the target area. Optionally, the device is configured to generate and maintain a desired current level to generate is the impedance of the rest of the system (such as the conductors or wires carrying the signal) is zero. Therefore, the high currents flowing through these areas can cause unwanted joules outside the target area. Therefore, in some embodiments, the signal generating system is configured to generate high current in the target area. It is designed to be delivered only near the

[0061] In some embodiments, some or all of the elements / units of the signal generating system, such as and the conductive elements / cables connecting them carry high current and high frequency electromagnetic signals. It is designed to reduce as much as possible the unwanted power losses that normally occur from time to time.

[0062] In some embodiments, the signal generating system may be powered by an existing power source (e.g., an existing power source on an aircraft). In some embodiments, the system may receive power from a power bus (such as an electrical bus). Use a dedicated battery or a dedicated power source that is part of the system. For example, The power sources for the grid include fuel-based generators, solar power-based generators, and wind power-based generators. These may include, but are not limited to, generators, gas-powered based generators, etc. The system is based on a power source (e.g., existing electric buses, dedicated batteries, dedicated power sources) and a target area. The circuit may be disposed between the first and second electrodes.

[0063] Furthermore, in some embodiments, the signal generating system exists as an independent unit. and / or embedded within a combination of other units that are part of the signal generation system. The control circuitry and devices may be integrated into the circuitry.

[0064] In some embodiments, the heating system 100 is configured to heat several separate target areas. In such cases, each element or unit of the heating system (e.g. , signal conversion units, impedance matching networks, etc.) are centralized throughout the system or distributed as one or more separate units for each target area or group of target areas. The centralized or distributed architecture depends on, among other criteria, system functionality, Used to improve energy efficiency, cost, regulatory compliance, weight, size, and complexity. For example, in some embodiments, the signal transformation unit may be centralized. However, the impedance tuning network is distributed across one or more units per target area. In some embodiments, the signal conversion unit may be a centralized TSP ("conversion to standard power"). It is only partially centralized as an ACG ("AC Generation") subunit, Units are distributed as one or more subunits per target area or group of target areas. In some embodiments, the signal transformation unit is fully distributed and each of its sub-units The cluster is distributed into one or more subunits for each target area or group of target areas. .

[0065] In some embodiments, the power control system 104 may be configured to automatically start the power supply when the heating / de-icing / anti-icing operation is complete. In some embodiments, the system continuously delivers power to the target area 102 until Improved / efficient heat generation and distribution in the conductive material 102 to achieve desired heat generation and distribution can be switched on and off in an automatic manner (e.g. using a control unit) For example, when the system is on, heat is generated at a specific location in the target area and distributed throughout the entire target area. The generated energy is conducted to the body and "diffuses" to the rest of the target area while the system is off. The heat continues to be conducted within the target area.

[0066] In some embodiments, the system has different power levels for the on state and is improved. The off state can be cycled through different power levels in an improved manner. In this embodiment, the power is increased or decreased smoothly rather than in one step increment or decrement. The pattern of such a pulsed power system is The pattern can be fully predefined when the system is built or it can be determined by the system's control unit. It can be dynamically improved by changing based on the feedback loops that it forms part of. do.

[0067] In some embodiments where the heating system includes multiple target areas, the pulsed power patterns described above may be used. The same timeline can be used asynchronously across all goal areas, so all goal areas can be for a desired amount of time while maintaining both the overall average and the overall instantaneous power levels below the set thresholds. For example, aircraft models that heat the wings, fuselage, and horizontal and vertical stabilizers. For an aircraft de-icing system, such a stepped power pattern allows the system to focus on one target at a time. The illuminating light source 14 can be designed to be turned on only for the target area. So, the power pattern is to power the system in the order of left wing, fuselage, right wing, vertical stabilizer, and horizontal stabilizer. Power on.

[0068] In some embodiments, the desired thermal, average power, instantaneous power levels, as well as the allowable Improved timing can be used at each stage to achieve the desired heat distribution. In some embodiments, similar to the patterns above, any subset of the target area may be selected at a particular time. Heating can be performed in between.

[0069] In some embodiments, one or more of the features mentioned as part of the design of the heating system may be used. A number of units or elements have an enclosure. Such an enclosure may include The device may be designed for a single unit or any combination of units. In an embodiment, the enclosure is designed to comply with environmental certification standards. The jar has mounting and construction that provides fire resistance, protection from precipitation, and protection from external shock and vibration. and construction, electrical insulation, protection from external electromagnetic interference ("EMI"), and prevention of EMI radiation of enclosed circuits. It can be designed to comply with standards such as shielding and thermal relief.

[0070] In some embodiments, some enclosures may be configured to accommodate a heated object (e.g., A structure made of a thermally conductive material can be designed to be used as a heat sink. For example, one or more units of a heating system may be It can be housed within a metal or conductive structure that is attached to it to have high thermal conductivity. One possible advantage of this installation is that it can heat the bulk medium and at the same time provide a thermal barrier to the electronics. Another possible advantage of this design is that it distributes losses. This eliminates the need for a separate heat sink for the heating system (or device). In some embodiments, the target area is heated by a heating system. It can be used as part of the heat sink of the heating unit. The stem circuit inevitably generates heat losses that can be conducted to the target areas and heat them up. This can increase the efficiency of the heating system.

[0071] In some embodiments, a plurality of adhesives are used to attach the enclosure to the bulk media. For example, the casing can be secured in place by a To hold the plate in place, adhesives that are primarily used for mechanical stiffness can be used. and provides a low thermal impedance path for the enclosure heat sink function. Adhesives (or interface agents) such as those listed above may also be used.

[0072] In some embodiments, one or more units of the heating system may be One or more measurements taken on a tract, surrounding cables, other units, or target area, e.g. It can be configured to detect a variety of voltages, currents, temperatures, forward power, and reflected power. In some embodiments, such measurements can be used, but are not limited to, It is used to monitor the operating status of the units and to improve their operation, e.g. by changing the switch and adjustable section on / off switching, output level, and in-circuit control Dynamic control (using feedback mechanisms) (See below for details on switching and controlling the tunable parts in the regulation network) The parameters to be controlled include power to the load and / or current to the load, regulation network The signal sources include the voltage control of the input / output circuits, and other related signals.

[0073] In some embodiments, the measurements used as part of the feedback loop described above The system may also include specific ice sensors that may be placed at or near the target area. Such sensors may, for example, notify the heating system and / or the user of the de-icing completion status. can be used to adjust the power levels during the de-icing and anti-icing phases of operation. In some embodiments, the ice sensor can be used as a fault detection force in the system. It can also be used to determine the identity and service requests.

[0074] In some embodiments, the heating system is controlled by a user (in the case of an aircraft de-icing system, It receives inputs from the pilot or co-pilot) and / or the system's sensors. A protocol converter control unit that receives and outputs control signals to all other units. A control unit (or a control subunit) may be included. In some embodiments, the input from the user includes an on / off state, a de-icing / anti-icing / off state, These may include, but are not limited to, a target temperature for the target area, and a target power for the target area. In some embodiments, the input from the sensors includes voltage, current, temperature, forward power, and reflected power, impedance, and ice sensors, squat switches, and various navigation This includes data from the aircraft logic unit, information from avionics devices, and other information. In some embodiments, the protocol converter unit In some embodiments, the target area or target region One protocol converter control unit is distributed for each group.

[0075] In some embodiments, the user input is wired (e.g., ARINC 429, etc. data transfer standard) or wirelessly (e.g. Bluetooth low energy or Wi-Fi connection) to the control unit. In an embodiment, the user input device is integrated into the heated system (e.g., an aviation Integrate into the cockpit's on-screen controls for the aircraft's de-icing system, or use touch A screen tablet (for example, a separate tablet mounted in the cockpit, or In the case of aircraft de-icing systems, the system is installed on the pilot's touch screen tablet. It may be a separate device such as a dedicated application.

[0076] In some embodiments, the power control system 104 generates a current in the bulk medium. To do this, the existing electric bus or a dedicated battery or any other power source for the heating system must be used. A signal transformation unit ("STU") or circuit that converts these signals into the desired high frequency AC waveform For example, in an aircraft application, the signal conversion unit It can take the DC power available from the source and convert it into the desired high frequency AC signal. In another aircraft example, the signal conversion unit converts the power available from the aircraft's electrical bus into AC The input signal can be received as a high-frequency AC signal and converted to a desired high-frequency AC signal. In this state, the signal conversion unit can be powered by a dedicated battery or any dedicated power source (e.g., heating It takes the available DC power from the power supply (which forms part of the system) and converts it into the desired high frequency AC signal. In some embodiments, a dedicated battery or power source can be used for signal conversion. The device may be housed within the same enclosure and / or circuit board as the conversion unit.

[0077] FIG. 7 illustrates an example signal transforming unit ("STU") 7 for the power control system 104. 00 schematic diagram showing conversion to standard power ("TSP") 710 and AC generation ("ACG " 720 main subunits, which form the remainder of the device 100 The power control system 104 is preceded by other circuitry 730, as shown in FIG. It can draw power from an existing power source.

[0078] FIG. 8 illustrates an example signal transforming unit ("STU") 8 for the power control system 104. 8 is a schematic diagram of the .00, including a TSP 810, an ACG 820, and a control subunit 830. nothing.

[0079] In some embodiments, the TSP can be powered by an existing power source or battery in the heating system. To improve the operation of the ACG and the power transmission efficiency of the signal conversion unit, To do this, the power is converted to a standard input such as 250VDC.

[0080] In some embodiments, an existing electrical bus transmits power in the form of a 400 Hz, 115 VAC signal. When supplying power to the TSP, the TSP must have a filter such as a common mode choke on the output side. It includes a flyback converter with a 100mV supply to prevent electromagnetic interference from reaching or damaging the ACG. FIG. 9A shows a flyback converter 910 and a common mode choke 920. FIG. 9B is a schematic diagram of an example TSP subunit 900 including an example flyback FIG. 9 is a schematic diagram of a clock converter 910.

[0081] In some embodiments, the TSP converts AC power from an existing power source to any DC voltage. In some embodiments, the TSP is a bridge rectifier that converts the It draws DC power from a common power source (for example, the typical 28VDC found in aircraft) and transmits it to different For example, DC-DC conversion is used to control the heating system. It is useful for powering control units and elements, in which case the possible voltage levels Possible input voltages include ±3.3V, ±5V, and / or ±12V. In some embodiments, depending on the power source, a power factor correction ("PFC") stage may be included in the TSP design. In some embodiments, the PFC can be used to compensate for non-linear loads of the power supply that may be required. Both active and passive PFC stages are available. be.

[0082] In some embodiments, the ACG uses the input power from the TSP and converts it to a desired high In some embodiments, the ACG converts the power of the signal conversion unit into a high-frequency AC signal. In some embodiments, the ACG is designed to improve power transfer efficiency. The present invention includes a amplifier or an AC or RF generator or oscillator.

[0083] In some embodiments, the main power amplification stage of the power amplifier may be a "linear" or "switched" amplifier. The relevant trade-offs between these two architectures are efficiency These may include ratio, power handling, and linearity. Examples of linear amplifiers include Class A, Class B, and Class C. Examples of switching amplifiers include Class-D, Class In some embodiments, the linear amplifier includes a switch, a filter, a filter for filtering, and a filter for filtering. Compared to switching amplifiers, they have high linearity and low efficiency. The lower efficiency makes it difficult to manage heat. This can lead to problems such as difficulty in installation and the need for high-standard components. Poor linearity leads to increased harmonic content, which can lead to regulatory compliance, reduced efficiency, and physical and electrical Problems such as difficulties in layout design may occur.

[0084] In some embodiments, the ACG includes a full-bridge class D amplifier. The design of the device consists of dual MOSFET transistors powered by gate drivers and a desired frequency response. A temperature compensated crystal oscillator ("TCXO") is used to generate the frequency. MOSFET transistors, a Temperature Controlled Crystal Oscillator ("TCXO") 1020, and a gate An exemplary ACG subunit includes a class D amplifier 1010 with a hand driver 1030. FIG. 10B is a schematic diagram of an exemplary clamp using dual MOSFETs. FIG. 1 is a theoretical schematic diagram of a power-coupled amplifier. In some embodiments, a full-bridge architecture is used. Compared to half-bridge architectures, the MOSFET provides differential (balanced) drive capability. It can also provide four times the power output for a given bus voltage level under a given load. Differential drive is ideal for reducing exhaust emissions under balanced load conditions provided by the forward wing structure. In addition, in some embodiments, Class D Ar The architecture may have higher switch utilization than other switching architectures.

[0085] In some embodiments, in a Class-D architecture, a single frequency driver Many input parameters can be changed to improve the output parameters under An example of an input parameter is dead time. An example of an output parameter is effective These include rate, peak component stress, etc.

[0086] In some embodiments, the Class D architecture has high switch utilization and Complete the implementation of recon-based components and make them suitable for potential ASIC development. In such a development, all control components and power elements The chip will be mounted on either the same die or on a multi-chip package (MCP). SoC (System on Chip) implementations are possible. In some embodiments, Class D The architecture is comprised of SoCs and PLCs distributed in various locations across a given function of the aircraft. The system has a distributed module that houses the signal processing circuitry and support circuitry.

[0087] In other embodiments, a single switch architecture, e.g., Class E or Class F Other switch mode designs, such as The architecture allows for higher switching frequency implementations and In some embodiments, Cla at high frequencies can be difficult or impractical. Due to potential limitations of SS-D implementations, Class-D implementations are becoming more common as frequencies increase. Instead, a single switch architecture can be used.

[0088] In some embodiments, the harmonic reduction and elimination techniques are combined with switch mode amplifiers. Used together, they mitigate the adverse effects of nonlinear distortion inherent in some switching architectures. For example, changing the duty cycle of the base waveform, Harmonics can be removed during signal generation using frequency ranking and other techniques. do.

[0089] In some embodiments, the ACG includes transistors such as silicon MOSFETs. In some embodiments, the transistor is a gallium nitride (GaN) MOSFET. In a particular embodiment, the GaN transistor is characterized by its on-resistance, turn-on gate charge, reverse recovery In some embodiments, GaN is suitable for higher frequencies. is doing.

[0090] In some embodiments, the TSP draws power from an existing power source to drive the ACG. to convert it into a power input signal suitable for elements such as gate drivers or crystal oscillators. It further includes a low power conversion ("LPC") stage, such as a linear regulator. 1 is a schematic diagram of a typical ACG subunit 1050, which uses dual MOSFET transistors. A Class D amplifier 1010 having a temperature controlled crystal oscillator ("TCXO") 1020, a gate The LPC 1050 includes a driver 1030 and an LPC 1050 .

[0091] In some embodiments, the AC generating subunit is located near the target region. A possible advantage of the design is that it transmits the AC from the AC generating subunits through a regulation network to the target area. The aim of this is to limit the losses and emissions that occur when passing AC current through a In an embodiment, the TSP subunits are located near the AC generating unit or near an existing power source or The TSP can be placed close to the dedicated battery. If the TSP is close to the ACG, the ACG and This allows for integration, potentially reducing the number of modules in a system and their complexity. If the TSP is close to an existing power source or dedicated battery, the power source or battery can It can be designed to improve power transfer to G (improving efficiency and reducing EMI). For example, if the existing power source provides power in the form of 400Hz, 115VAC voltage, TS P includes an AC-DC converter to convert the power supply voltage to 250VDC and convert it into AC current. This reduces the EMI caused by the Efficiency can be increased by reducing the current.

[0092] In some embodiments, the control subunit is configured to control the device (heating system) The status of the signal conversion unit, based on the input of relevant data available for the application Controlling the on / off mode, power output, frequency, and other parameters and outputs control signals to other signal conversion subunits such as the TSP and ACG drivers. In the example of an aircraft de-icing and anti-icing heating system, in some embodiments, data input These include manual pilot input from cockpit switches, temperature from temperature sensors inside and outside the aircraft, degree, wheel-on-weight status from squat switch, various aircraft logic units information from the avionics and feedback information from the device itself (heating system) and other data. In some embodiments, the control subunit A microcontroller supply that is powered by a low-power conversion (LPC) stage such as a It includes a supervisor that draws power from an existing power source and converts it into a suitable power input signal. 11, the microcontroller 1110 and the ACG 1120 output control signals to the TSP and the ACG. FIG. 11 is a schematic diagram of an exemplary control subunit 1100 including a low power conversion stage (LPC) 1120. This is a schematic diagram.

[0093] In some embodiments, for example, in the case of a de-icing heating system retrofitted to an aircraft, The signal conversion units can be installed in a central location near available electric buses. This reduces installation complexity, labor time, and unit cost. In an embodiment, the signal transformation units are distributed and placed near the target area. This reduces the length that the AC signal must travel between the signal conversion unit and the target area. and electromagnetic interference ("EMI") shielding of the signals and the use of AC Costs associated with cabling requirements can be reduced.

[0094] In some embodiments, the heating system may be configured to adjust the output impedance of the heating system to a desired level. an impedance tuning network ("IAN") configured to adjust the For example, IAN is the output impedance of the heating system relative to the bulk medium being heated. For example, the input impedance of I AN is the impedance between the output of the heating system and the input of the bulk medium relative to each other as desired In some embodiments, the impedance can be adjusted to within a range. The impedance tuning network adjusts the output impedance of the heating system to the impedance of the bulk medium. In other words, the matching network is configured to tune the ,The output impedance of the STU ("source") is adjusted to within a reasonable engineering tolerance, In some embodiments, the solenoid is configured to match the impedance of the load. Matching the source and load impedances of a heating system This involves adjusting the impedance of the bulk medium to be the complex conjugate of the impedance of the bulk medium. In some embodiments, the impedance matching network adjusts the output of the heating system. The impedance is within 10 to 30% of the impedance of the bulk medium being heated It is adjusted as follows.

[0095] FIG. 12 is a conceptual diagram of a regulation network 1200 between a source 1210 and a load 1220. Figure 12 shows the output of the STU through an impedance-controlled input port. Receives input power from a source and adjusts impedance to correspond to the target area FIG. 1 shows a regulating network that outputs power to a target area ("load") through a set of output ports. vinegar.

[0096] In general, for AC signals, the output impedance of the source corresponds to the impedance of the load. If this is not the case, some of the signal sent from the source to the load will be routed to the load rather than passing through the load. In some embodiments, the impedance matching network includes: Suppressing signal reflections and the build-up of voltage standing waves provides several advantages, such as: -Reduced terminal voltage and risk of arcing in heating systems -Improved efficiency of heating systems Reduction in the total output power required from the STU, thus reducing the size, weight, and cost of the STU Reduction of Reduced stress on system components -Improved reliability Reduced temperature gradients in cables and bulk media etc. can be achieved.

[0097] In some embodiments, the output impedance of the STU is greater than the impedance of the target area. In that case, the regulating network will be The electrical current power is converted to a relatively low voltage, high current power that is delivered to the target area. In these embodiments, this is because the large currents are directed after the conditioning network and therefore near the target area. This means that only the joule losses in the rest of the SGU are reduced, and the heating system Improve the overall efficiency of the

[0098] In various embodiments, the regulatory network may be centralized or distributed throughout a target area. By distributing the adjustment network, the cable can function as a filter. While still allowing for peak voltage, peak current and / or temperature for a particular component, Distributed deployment adds modularity to the system design. This allows for improved maintenance / replacement of parts. The location allows the system to be located away from hazardous areas such as sensitive equipment and fuel tanks. Cut.

[0099] Additionally, in some embodiments, additional capacitive components may be included to provide symmetrical spacing within the network. The tuning network can be balanced by grounding the center point. When driven by a source, this network operates in a balanced manner, providing high common-mode rejection and excellent In some embodiments, such a balance is not achieved and adjustments are made. The return path of the matching network terminates at circuit ground.

[0100] Generally, in some embodiments, a regulatory network is a set of specific building blocks. These building blocks may include passive electronic components arranged in a Locking configurations include transformers, L networks, π networks, T networks, and others. 13A-D show exemplary impedance tuning network building blocks. FIG. 2 is a schematic diagram of a shaping block.

[0101] In some embodiments, the conditioning network of the heating system includes a passive conditioning subunit. FIG. 14 illustrates an exemplary coordination network unit including a passive coordination subunit 1410. FIG. 14 is a schematic diagram of a passive tuning subunit 1400. In some embodiments, the passive tuning subunit One or more building block configurations, as well as other configurations, may be included together In some embodiments, the passive electronic components of the passive conditioning subunits include, for example, To improve the efficiency of the network, one with a high quality factor is selected.

[0102] In some embodiments, the heating system's regulation network comprises a high quality factor They can be designed to have either a high-Q or low-Q quality factor. The network can be used to remove harmonic signal components. Filters are used in switching amplifier designs because the input impedance can be higher than that of a conventional amplifier. However, high-Q networks can be more sensitive to component tolerances, external conditions, and may be more sensitive to operational variations, assembly variations, and other variations in the system. Therefore, high-Q systems can pose practical problems during system implementation. For example, in the case of an aircraft wing de-icing system, if the system is High-Q, The impedance matching network can be easily adjusted to accommodate small perturbations (such as flap movement). This can cause the device to go out of sync, creating a risk of failure. For regulatory certification, this is also subject to practical design concerns, e.g., the inclusion of stray signals in the design. and excessive stress on components (peak or time-average ratings), control al In some cases, dynamic adjustment elements can be beneficial for Its use can reduce or even eliminate these sensitivity concerns.

[0103] In some embodiments, the design of the regulation network of the heating system is based on the regulation concept of the power line. For example, the cabling at the input and / or output of the regulation network can be The cable connections can be considered part of a regulation network. By selecting the appropriate cable material, form factor, dimensions, and length, Therefore, appropriate impedance adjustment can be achieved.

[0104] In some embodiments, the regulation network of the heating system includes an active regulation subunit. Figure 15A shows a dynamic regulatory network that includes active and control subunits. An exemplary coordination network including a coordination subunit 1510 and a control subunit 1520. FIG. 15 is a schematic diagram of a call unit 1500. In some embodiments, the active adjustment subunit The unit comprises one or more coordination network configurations controlled by a control subunit. In some embodiments, the passive electronics of the active regulatory network subunits Components are selected with a high quality factor, for example to improve the efficiency of the network. In some embodiments, the control subunit is selected to transmit to and receive from the target area. It receives input data (forward power, reflected power, voltage standing wave ratio, etc.) from the signal Dynamically control the tuning network subunits to adjust impedance in real time For example, such control can be achieved by configuring the active regulation network subunits. This can be achieved through an adjustment element included in the design. For example, a dynamic adjustment element is an adjustable The adjustable components may include adjustable capacitors and / or adjustable inductors. Examples of elements include PIN diodes, BST capacitors, and DTCs (discrete regulation capacitors). sensors), varactor diodes, MEMS, ferroelectric varactors, ferromagnetic components, Y IG adjustment filters, etc. Evaluations that can be taken into account while evaluating such devices Examples of criteria include operating frequency range, DC voltage regulation, control signal linearity regulation, control complexity, etc. length, capacitance / inductance adjustment ratio, adjustment speed, quality factor (Q), switching life, power Packaging cost, power handling, power consumption, breakdown voltage, linearity, 3rd order interferometer Cept (IP3), integration functions, etc.

[0105] In some embodiments, a control with feedback between the target region and the regulatory network is implemented. The control unit allows you to adjust the impedance of the target area or the STU output impedance. External changes that may affect, e.g., the target area, the location of the heating system, the system and changes in temperature, geometry, and other parameters of the environment surrounding the target area. In some embodiments, the adjustment network can be The switch draws power from an existing power source and converts it into a suitable power input signal for the control subunit. FIG. 15B further includes a low power conversion ("LPC") stage, such as a linear regulator. , an active conditioning subunit 1510, a low power conversion stage (“LPC”) 1560, and 1 is a schematic diagram of an exemplary coordination network unit 1550 including a control subunit 1520. It is.

[0106] In some embodiments, the spectrum of possible conditions during use of the heating system is covered. Perform specific impedance measurements on the target area for every configuration and environmental condition you test. These measurements allow for proper impedance matching in the full spectrum of situations described above. Dynamic tuning network that matches the narrowest impedance range to allow impedance adjustment In some embodiments, such a design may be performed using an algorithm. By using rhythm optimization or computer simulation, the adjustment network Improve system efficiency while reducing network weight, complexity, and cost It is possible.

[0107] In some embodiments, a dedicated cable can be used in the heating system, and the cable The bulls use specially designed antennas at each stage to improve efficiency and shield the power signal being carried to the target area. FIG. 16 shows the cable in an exemplary heating system. FIG. 2 is a schematic diagram of a cable stage of a heating system. In various embodiments, the cable stage of the heating system is For example, the cable between the power supply 1620 and the STU1610 (cable 1) Cable in STU between 1630, TSP1640 and ACG1650 subunits cable (cable stage 2) 1660, the cable between the STU 1610 and the adjustment network 1670 (cable stage 3) 1680, and the coordination network 1670 and target area 1690 A cable (cable stage 4) 1695 between the first and second conductors 1691 and 1692 may be included.

[0108] In general, there are many design considerations involved in designing a dedicated cable for an entire heating system. In some embodiments, thermal considerations may be relevant. For example, In some embodiments, the regulatory network is connected to the target area (or near the target area). (through the cable and possibly back to the conditioning network) from the cable to the target area. The heat flow in the cable can be fixed to increase as the current flows through it. A portion of the heat generated during the process is recovered (and would otherwise be lost) for the purpose of generating heat. This is advantageous when the signal is delivered to a targeted area that is closer to the target area, thereby increasing the efficiency of the system.

[0109] In some embodiments, a fastener may be used to route the cable near the target area. In such cases, a thermally conductive material with good thermal conductivity should be used to improve the thermal contact. can be used to fill the air gap between the cable-fastener-target area interface.

[0110] In some embodiments, the cable is attached directly to the target area. To improve thermal contact, use a thermally conductive adhesive to attach the cable to the contact area. In addition, a thermal interface material with high thermal conductivity is used to ensure that the cables and Some or all of the remaining air gaps between the target areas may be filled.

[0111] In some embodiments, the cable may be connected to a unit, a target area, or a power source. Therefore, different shaped cross sections and different cable form factors can be used. In some embodiments, the cable is provided with a protective jacket (electrical insulation and / or corrosion, Contains only the main conductor, with or without environmental protection (such as humidity, extreme temperature, friction, etc.). The configuration is advantageous for the portion of the system that carries the DC signal or transmits the signal to the target area. could be.

[0112] In some embodiments, the cable is a coaxial cable. This includes a 10-GHz 10 ... This provides protection from EMI around the system.

[0113] In some embodiments, the cable is a triaxial cable. This design allows for the transmission of any signal At the time of delivery, more specifically, the average of the output of a balanced embodiment of the conditioning network unit, for example When carrying balanced signals, this can be beneficial for EMI protection and isolation.

[0114] In some embodiments, the cable is a biaxial cable. This design is similar to a triaxial cable. This may have advantages similar to those provided by

[0115] In some embodiments, the cable may be connected to a unit, a target area, or a power source. Therefore, different cable cross-sectional shapes can be used.

[0116] In some embodiments, the cross section of the conductor of the cable has a circular shape. Coaxial / triaxial / two-axis form factors have relatively low manufacturing costs (non-repetitive engineers The advantage of this is low ring cost.

[0117] In some embodiments, the cable has a flat and / or rectangular cross section. For example, this cross section is advantageous for the final stage of the system where the cable delivers current to the target area. In the final stage, the rectangular shape is Reduces the effects of proximity and skin effects on system performance, reducing losses and improving system efficiency. In addition, this shape reduces the total amount of conductive material required in the cable, The weight of the system may be reduced, which is a consideration in the case of aircraft de-icing systems. This is an important matter to be addressed.

[0118] In some embodiments, the specific input and output currents and signals carried by the cable Depending on the cross-sectional shape and other factors, the size of the cross-section may vary depending on the operating temperature. range (e.g., for compliance and for materials used in cable manufacturing) To limit the number of vehicles (determined by the vehicle's weight and size) and to reduce the size of the vehicle, This can be done.

[0119] In some embodiments, the cable may be connected to a unit, a target area, or a power source. Depending on the application, different cable shield types (and cross-sectional shapes) are used.

[0120] In some embodiments, the cable does not include a shield. This is because the DC current is carried stages that are connected to the power supply (and therefore have lower EMI suppression requirements), and those that need to carry the return current. stage (e.g., the target area carries a return current and a nearby cable This is likely to be advantageous in a downstream part of the system in embodiments that provide current.

[0121] In some embodiments, a single shield is used. In some cases, one shielding layer may be sufficient to make the device compliant with EMI / EMC and other environmental requirements. This is advantageous when

[0122] In some embodiments, dual shielding is used, which adds another layer of shielding. This, for example, can further reduce EMI emissions and also reduce the EMI susceptibility of cables. It can be lowered.

[0123] In some embodiments, three or more shields are used, for similar reasons as above. Therefore, an extra layer of shielding is added.

[0124] In some embodiments, for a particular target area, a cable that delivers current to this area is The rule may take different possible paths.

[0125] In some embodiments, the cable extends from one side of the target area to the other approximately They only follow linear paths. In some cases, these paths may be parallel. In some embodiments, the cable passes diagonally through the target area and is aligned at different points in the target area. This may, for example, produce more uniform heat across the surface of the target area. This helps to create relatively hot spots at desired locations where the cables cross.

[0126] In some embodiments, the cable may be routed in a zigzag type path, a serpentine path, or The design follows a path that can be modeled with a 2D spline curve or a 2D spline curve. Increasing the effectiveness of the system by lengthening the path the current must follow, and therefore the effective resistance This can be achieved, for example, by higher efficiency, lower current, and This may help achieve a more stable impedance regulation by the system.

[0127] In some embodiments, the cable path design may include these and other options. The approach is based on a combination of

[0128] In some embodiments, depending on the design, stage, and purpose of the cable, Different materials can be used for the manufacture of the.

[0129] Depending on local voltage, current, temperature, power, bend radius, durability requirements, and other criteria ,Improvements to the cable conductor material in terms of efficiency, conductivity, weight, cost, size and thermal aspects can be selected to be

[0130] In some embodiments, the conductive material is copper, silver, aluminum, carbon fiber composite, titanium. In some embodiments, the conductor is made of any of the aforementioned materials. It is made of a material called a conductor, and coated with other materials such as a silver coating to improve the electrical conductivity of the conductor's outer skin. will be displayed.

[0131] In some embodiments, the conductors may be of solid material or may be stranded. For example, in some embodiments, by using an insulating coating such as enamel, For example, Litz wire can be used to insulate the strands from each other. The effects of skin and proximity effects within the cable can be reduced.

[0132] In some embodiments (e.g., for coaxial / triaxial / twinaxial cables), local voltages, currents, Depending on temperature, power, bend radius, durability requirements and other criteria, the cable dielectric Materials should be selected based on efficiency (e.g., by reducing dielectric losses), weight, cost, flexibility, maximum voltage carrying capacity, etc. difference, maximum power tolerance, temperature rating (high temperature tolerance and / or high heat capacity of the cable and / or low dielectric loss and / or good thermal conductivity. It is possible.

[0133] In some embodiments, when transmission line conditioning is used in the conditioning network unit, In this case, the associated cable has a dielectric constant selected to reach the desired impedance level. Exemplary materials include polyethylene and Teflon-based materials. materials, as well as other materials.

[0134] In some embodiments, local voltage, current, temperature, power, bend radius, durability requirements, and Depending on the requirements and other criteria, the cable jacket material may be chosen based on weight, cost, flexibility, maximum Voltage tolerances, temperature ratings, and nearby heat sinks (for example, The thermal conductivity of the target area is selected to improve certain parameters such as thermal conduction to the target region.

[0135] In some embodiments, when transmission line tuning is used as part of a tuning network, In this case, in addition to the dielectric, an impedance The length of the cable used for conditioning can be controlled. For example, to deliver a current to the target area. The cables we supply are used as part of a transmission line conditioning system and are impedance-adjusted. Extra length is added for a smaller space and coiled locally Get wrapped up.

[0136] In some embodiments, certain fastening techniques are used to secure the cables along the structure of the system. Such technology reduces installation costs and time, and the weight of the system. (by reducing the length of wire required and the weight of the fastener) and proximity to the target area. The thickness of the conductive layer may be selected to improve the desired electromagnetic effect and heat transfer of the cable.

[0137] In some embodiments, the fastener comprises a cable for supplying power to the target area and a fastener for connecting the target area and the This design may produce a stronger proximity effect. In some embodiments, a conventional cable tie-down may be used to reduce the cable-to-target area distance. The fastener design can be selected.

[0138] In some embodiments, the fasteners are configured to enhance heat transfer from the cable to the target area. is also used.

[0139] In some embodiments, fastener materials are selected to reduce the weight and cost of the system. This can be achieved, for example, by using composite materials. In some embodiments, the material has a high thermal conductivity and is also used for heat transfer to the target area. A material that can be used to form the heat sink (eg, a metallic material that typically has a relatively high thermal conductivity) is selected.

[0140] In some embodiments, the adhesive used to secure the fasteners to their adhesive regions. The agent is selected to enhance bond strength to the target area and ensure long-term bonding. The strength of the bond is effective when the bond area is relatively small and the bond area is subject to relatively strong mechanical constraints. Additionally, some fasteners are used for heat transfer from the cable to the target area. In some embodiments, the adhesive is also selected for increased thermal conductivity.

[0141] Finally, there are some implementations in which fasteners are used for heat transfer from the cable to the target area. The configuration involves the use of cables, fasteners and eyes to improve heat flow from the cable to the target area. The gap in the area between the target areas is filled with a sufficiently thermally conductive thermal interface material.

[0142] In some embodiments, the cable is attached directly to the surrounding structure, such as a bulk medium, with an adhesive. It is mounted on a heat exchanger to allow better heat transfer from the cable to the structure to which it is attached. The adhesive is selected based on criteria similar to those used for the fasteners.

[0143] In some embodiments, the cable assembly design includes two or more predefined cable paths. This involves splitting the network into a set of separate branches on the same network. This is useful in embodiments where the network delivers current to a set of multiple target regions. In this configuration, one cable can be the only output of the tuning network, and that cable The cable is then connected to each target area to supply current so that the bull can reach multiple target areas. In some embodiments, such a division can be , splitting a given conductor strand into several smaller strands, or splitting a cable into strands If it has conductors, send a subset of the strands to each of the separate branches, or This can be achieved by using a power splitter. It is useful for controlling the amount of current, voltage, and power that flows in each of the branches that are divided into It is useful.

[0144] Similarly, in some embodiments, two or more cables may be fused together into a smaller number of cables. The signals from all the cables that are merged can be accumulated. Fusing conductor strands to other strands or combining different subsets of strands into a new multi-strand cable regroup them into a single module or use a power combiner (for example, the same device as the power divider) This can be achieved by using a power combiner (which is a power converter but used in the opposite direction). The inverter controls the amount of current, voltage, and power that flows through each branch where the cables are joined. It is useful.

[0145] In some embodiments, each cable stage of the heating system may include its own cable design considerations. There are some considerations.

[0146] In some embodiments, it allows for efficient power transfer from the power source to the TSP subunits. In some implementations where the power supply outputs a DC current, cable stage 1 is selected. In this embodiment, cable stage 1 includes stranded copper wires insulated with a compliant material and is connected to the TSP subunit. It has a total equivalent gauge suitable for the power, voltage, and current supplied. If the power supply is 400Hz, In some embodiments that output a 115 VAC signal, cable stage 1 is insulated with a compatible material. Total equivalent gauge suitable for the power, voltage, and current provided to the TSP subunits. The copper wire includes a copper strand having a

[0147] Some embodiments allow efficient power transfer from the TSP to the ACG subunits. Cable stage 2 is selected to provide a 250VDC signal to the TSP. In some embodiments, the cable stage 2 is insulated with a compliant material and includes a TSP sub- Use stranded copper wire having a total equivalent gauge appropriate for the power, voltage, and current supplied to the unit. include.

[0148] Some embodiments may include a step of routing a high frequency AC power signal from the output of the STU to a regulation network. The cable stage 3 is selected and customized to enable efficient power transfer. For example, the cable reduces resistance and electromagnetic losses caused by high frequencies in the signal. Reduce interference from surrounding equipment and materials, and shield against external interference that may alter the signal integrity. It can be designed to prevent signal leakage from cables that may affect In some embodiments, the cable stage 3 is in the form of a customized coaxial cable. In some embodiments, the coaxial cable is a high power, high frequency transmission line. A core conductor that carries the input signal of the network and is suitable for carrying power with low resistive losses. A core conductor consisting of stranded copper wires of sufficient outer diameter and a The dielectric surrounding the core is selected to maintain the temperature range and to carry power with low ohmic losses. The signal relay to the ACG is made of twisted and braided copper with a similar gauge large enough to Shielded conductors provide a turn path and are selected to sustain high voltage and temperature ranges. A first casing that insulates the conductive shield and an outer shield similar to the conductive shield. However, it does not directly carry current and is used to protect the cable from external interference and to prevent leakage. and finally, a second casing similar to the first casing that insulates the outer shield. It is made with

[0149] In some embodiments, high frequency, high current AC power is delivered from the conditioning network to the target area. The cable stage 4 is selected and customized to allow efficient transmission of signals. In some embodiments, the cable reduces the impedance between the tuning network and the target area. Adjust the dance, reduce the resistive loss and electromagnetic loss caused by the high frequency of the signal, and improve the reliability. Shielding from external interference that may alter the integrity of the signal and affect surrounding equipment and materials The design is intended to prevent signal leakage from cables that may be in contact with the In this embodiment, cable stage 4 is a high power, high frequency and and high current transmission lines, and to improve high current performance and further reduce resistive losses, Except for using a larger conductor gauge and diameter and an additional silver coating on the same conductor. In some embodiments, the cable stage 3 is similar to the embodiment of the cable stage 3 described above. Stage 4 is further customized based on the Litz wire design. The purpose of such a design is , individually insulated (e.g., with an enamel coating) and completely symmetrically twisted together. By manufacturing a conductor with a thickness less than the skin from a wire or braided brand, This is to reduce losses due to the proximity of the antenna and the skin effect.

[0150] Generally, electrodes include a material that conducts electrical current and directs electrical current into or out of a target area of ​​the bulk medium. In some embodiments, connectors are used to connect the electrodes to the bulk medium. A connector refers to a fitting that connects an electrode to a bulk medium. In the ,electrodes and connectors are designed to reduce the contact resistance between the electrodes and the bulk medium. In other words, the electrodes are projected across the target area for a given return path. The contact resistance is designed to smooth out the potential difference that occurs between the two electrodes. If the resistance of the target area is higher than the contact area, more heat will be generated at the contact points than along the target area. All things being equal, the heating system becomes less efficient at heating. For the same reason, the electrodes and connectors must be connected to the wires (or cables) of the electrodes and heating system. In some embodiments, the electrodes and the contacts are designed to reduce the contact resistance between the electrodes and the contacts. The connector is also designed to reduce electromagnetic losses (eg, electromagnetic radiation).

[0151] In some embodiments, electrode design considerations to achieve one or more of the above goals include: As the above, (1) it is necessary to select an electrode material having high electrical conductivity, and (2) it is necessary to select a material having high electrical conductivity between the electrode and the bulk. This includes increasing the "real" contact area with the media and between the electrodes and the wire. The "real" contact area is the tiny metal-to-metal or material contact where current flows from one material to another. This refers to the contact point, often referred to as the "a-spot." In some embodiments, the connector are also designed to achieve these goals.

[0152] In some embodiments, the electrode material is silver, copper, aluminum, carbon fiber composite, titanium, or the like. The alloy may include titanium, tungsten, or alloys thereof.

[0153] In some embodiments, the electrodes are cables used to transmit electrical current to the bulk medium. It is part of the bull.

[0154] In some embodiments, the shape of the electrodes can be adjusted to fit a particular target area and / or or to reduce the contact resistance between the electrodes and the bulk medium, and / or to reduce electromagnetic losses. The ion exchange coefficient is designed to reduce

[0155] In some embodiments, the electrodes are circular.

[0156] In some embodiments, the electrodes are cables used to transmit electrical current to the bulk medium. The shape of the end of the bull.

[0157] In some embodiments, a line electrode (e.g., a rectangular electrode whose length is greater than its width) is used.

[0158] In some embodiments, the thickness of a 2D spline curve with a small thickness (third spatial dimension) is Electrodes of the shape are used.

[0159] In some embodiments, the cable conductor is sandwiched between the connector plate and the target area. For example, a connector plate that contacts the target area can be used to connect the target area. A portion of the side of the cable may be milled. The conductor of the cable is placed in this milled portion. The cable conductors can be connected to the target area by placing them in the This allows the electrode connector plate to be clamped or glued under the cable conductor, There is no need to bend the connection to ensure proper bonding with the target area.

[0160] Generally, various implementations and design considerations of electrodes and connectors are discussed.

[0161] FIG. 17 is a photograph of an exemplary circular stud electrode 1700 for the heating system 100. The electrode is a circular electrode bonded to a disk 1710 made of a conductive material (e.g., aluminum). 17. The connector 170 includes a ground stud 1720 having a threaded conductive portion 1720 (e.g., aluminum) thereon. It is installed.

[0162] In some embodiments, the conductor of a cable connected to the target area via the electrode 1700 The wire is wrapped around the threaded conductive portion 1720 and laid flat to allow the wire to mate with the threaded conductive portion. In some embodiments, the nuts and wires are coated with a sizing agent to cover a substantial portion of the surface area of ​​both the nuts and wires. A shear is used on the threaded conductor 1720 to press the conductor against the disk 1710 for a tighter fit. This can ensure a higher contact area and a lower contact resistance.

[0163] In some embodiments, the air between the washer, the cable, and the disk 1710 The gap is filled with an electrically and / or thermally conductive thermal interface material to remove the studs from the cables. This ensures improved thermal and / or electrical conductivity to the substrate 1700.

[0164] In some embodiments, the circular stud electrode 1700 transmits heat and and a specially selected adhesive that is electrically and thermally conductive enough to conduct electrical signals. In some embodiments, the adhesive also attaches to the nut and It is also strong enough to withstand the torque exerted by the washers.

[0165] In some embodiments, the connector provides significant compressive strength between the electrode and the bulk medium. As provided, a U-shaped fixture attached to the bulk medium and electrodes.

[0166] In some embodiments, the materials of the electrodes and connectors are selected to reduce their weight. In some embodiments, the material of the electrode can be selected to reduce its weight. In addition, the material is selected to improve electrical and / or thermal conductivity through the material. The conductivity achieved is due to the electrode design (e.g., Circular studs, one-plate designs) can be advantageous.

[0167] In some embodiments, a specific enclosure is provided as part of the connector and electrode design. For example, such enclosures may be thermally mitigated and / or insulated, electrically insulating, Edge, EMI shielding, corrosion protection, vibration and shock resistance, durability, protection from external contamination and sediment The selection may be made for environmental conditions, including criteria such as protection from

[0168] In general, various adhesive configurations (and so forth) between the electrodes and / or connectors and the bulk medium are used. In some embodiments, these configurations include electrodes Reduce the contact resistance between the dielectric and the bulk medium and / or reduce electromagnetic losses.

[0169] In some embodiments, the electrodes are connected to the bulk medium using a braze joint. FIG. 18A illustrates an electrode 1802 and a bulk media target that is part of a larger bulk media 1806. FIG. 18 is a schematic diagram of an exemplary braze joint attachment 1800 between region 102. A brazing material is used to create the portion 1804. For example, a low temperature brazing filler metal ( Brazing the electrode to the target area using, for example, AL802, to create a low resistance contact In some embodiments, oxidation (of the aluminum oxide layer at the brazing site) can be used. To reduce the formation of pitting, the filler metal is coated with flux. It is a material that dissolves oxides at high temperatures and prevents the surface from reoxidizing until the filler metal wets the surface.

[0170] In some embodiments, the electrode and the target area are covered together under pressure and heat. For example, in some embodiments, a compressive force is applied between the electrode and the target area. If no constraint is desired, the compressive force can be calculated between the electrode and the bulk medium according to the following formula: This can reduce the contact resistance.

number

[0171] In some embodiments, a mechanical fastening connector is used to apply a compressive force to the electrode and bulk. FIG. 18B shows the connection between the electrode 1802 and the large bulk medium 1806. FIG. 18 is a schematic diagram of an exemplary attachment configuration 1820 between a target area 102 of which the solid link is a part. The bed 1822 is used to apply a compressive force to connect the electrodes to the target area.

[0172] In some embodiments, vacuum tape or the like may be used to seal the area between the electrode and the target area. The connection can be pressure sealed. FIG. 18C shows the electrode 1802 and the large bulk medium 180 6 is a schematic diagram of an exemplary attachment configuration 1840 between the target area 102 and the Air seal tape 1842 is used to connect the poles to the target area. After the procedure is complete, a suction device is used to create a vacuum between the electrode and the target area, thereby separating the two. Can be crimped together.

[0173] In some embodiments, the compressive force is applied by a clamp, such as a C-clamp, that clamps the electrode and the target area. A pressure can be applied to increase the pressure at their interface.

[0174] In some embodiments, the compressive force can be applied using a magnet or a magnetized surface. In some embodiments, either the surface of the electrode or the surface of the target area is magnetized, and a magnet and the electrodes and / or contact areas to provide the desired compressive force. In some embodiments, two or more magnets are used, and the electrodes and target area are aligned with each other. The magnets are sandwiched between the magnets, allowing the attractive forces between them to produce the desired compressive force. In this configuration, both the surface of the electrode and the surface of the target area are magnetized, allowing for an attractive force between the electrode and the target area. This allows for the desired compression force to be achieved.

[0175] In some embodiments, the compressive force is applied to an external surface that adheres to a surface on or near the target area. Or it is applied by an internal compression fastening connector, converting the adhesive strength into the desired compression force. In some embodiments, an adhesive (e.g., a curable adhesive) is combined with the fixture connector. It can be used in combination.

[0176] In some embodiments, the electrodes are partially The nanoparticles may be embedded in or entirely within a bulk medium.

[0177] In some embodiments, a conductive material (e.g., graphene) is placed between the electrode and the target area. will be placed.

[0178] In some embodiments, the connector material used to connect the electrodes to the target area may be , an adhesive selected for strength and ensuring long-term bond to the target area. The strength of the adhesive is such that the bond area is relatively small and the mechanical constraints imposed on the bond area are relatively strong. In one embodiment, the electrodes are connected to the If the electrode needs to be kept in a fixed position to allow the adhesive to cure after application, Use internal or external / disposable fixation devices that use adhesives and mechanical forces to keep the It is possible.

[0179] In some embodiments, the connector material used to connect the electrodes to the target area also Higher thermal conductivity and better heat transfer from the cable to the target area and / or electrical conductivity are selected. For example, a higher conductivity means that the adhesive The electrodes used are attached so that they are located on the path of the current flowing from the electrodes to the target area. This may be a consideration in some cases (e.g., when the electrodes used are circular stud electrodes and one-plate electrodes). For this purpose, in some embodiments, nanomaterials (e.g., C NT) is disposed between the electrode and the bulk medium. In some embodiments, the surface of the electrode and The portion of the surface of the bulk medium that is in contact with the electrode (e.g., the target area) is called the “real The contact area between the substrate and the substrate can be increased.

[0180] In some embodiments, in combination with the above and other embodiments, The transducer, electrodes, and portions of the target area are covered with a material that reduces or eliminates electromagnetic losses.

[0181] In some embodiments, any combination of the above methods may be used with any of the electrodes and connectors. For example, FIG. 18D illustrates a cross-sectional view of an electrode 1802 and a bulk medium 180. FIG. 18 is a schematic diagram of an exemplary mating attachment 1860 between the six target areas 102. The attachment includes a brazed joint 1804 and a solid rivet 1822 .

[0182] In some embodiments, no physical contact is required to generate the desired current. Therefore, the system may not require any connectors / cables. In some embodiments, the return path for the signal includes an additional section of wire returning to the conditioning network. It can be minutes.

[0183] The heating system embodiments described herein are directed to applying high frequency radiation to targeted areas of the aircraft skin / fuselage. By supplying AC current (e.g., by generating Joule heating) from the surface of the aircraft It can be used as a de-icing / anti-icing device to melt ice generated in the target area of ​​the aircraft. The heat is conducted to the surface of the aircraft and then convected across the aircraft-ice interface into the ice. In some embodiments, the ice melts completely. In some embodiments, some of the ice (in direct contact with the aircraft) melts. The layer of ice that comes into contact with the aircraft melts, forming a layer of water between the ice and the aircraft, causing the ice to slide off or slide off the aircraft. In some embodiments, heating occurs before ice is present, and ice formation may be mechanically removed. Prevent.

[0184] In some embodiments, as the ice melts, high frequency AC current continues to be supplied to the vehicle interior. The generation of Joule heat is maintained at the surface, and the heat is generated / remains on the surface by conduction and convection. The vibration is transmitted to the water.

[0185] 19-32 show a method for conveying and delivering electromagnetic energy for a bulk media heating system. Examples of assemblies (referred to herein as "bonding strips") are provided. ) function similarly to a transmission line in conjunction with the bulk conductive medium to which they are attached. For example, in some embodiments, the bonding strips may be designed to: The bulk medium itself conducts current in the same way as current flows through a transmission line. The AC signal from the line can be electromagnetically coupled into the bulk medium, thereby This generates a corresponding current signal in the body. Thus, in effect, the design of the coupling strip is Some also operate the bulk medium as a transmission line (in combination with coupling strips). Alternatively, the bulk medium and the coupling strips may combine to form a system that behaves like a transmission line. It can be said that the

[0186] For example, as described above, embodiments of the present disclosure may include a conductive medium (e.g., a bulk medium, a conductor ) to shape (e.g., contract, extend, etc.) the electrical currents in the epidermis. Configured to generate heat in a bulk medium by operating using the magnetron effect and the proximity effect Both effects can be achieved by passing a high frequency AC current through the conductive medium to be heated. The skin effect is due to the fact that alternating current ("AC") has a maximum current density near the surface of the conductor. The current is distributed in a conductor so that it decreases with increasing depth. The proximity effect occurs when an AC current path is placed near an existing current in a conductor. By placing a resistor, it can be used to further suppress the current flowing in the conductor. The contact effect can also act to lengthen the current path. and processes that can be used to generate and control such effects. For example, the coupling strips can be used with the various power control systems listed above. Cut.

[0187] FIG. 19 is a cross-sectional view of an exemplary bonding strip 1900. The present invention relates to a bulk medium, such as an aircraft skin 1902, and a method for applying a high frequency current signal to the bulk medium to heat the bulk medium. The bonding strip 1900 can be used to heat the bulk medium 1902. A first dielectric layer 1908, a conductive layer 1904 on the first dielectric layer 1908, and a conductive layer 190 a second dielectric layer 1908 on the first dielectric layer 1904, and a conductive shield layer 1906 on the second dielectric layer 1908. It has a multi-layer structure including 906.

[0188] The first dielectric layer 1908 has a thickness D1. The conductive layer 1904 has a thickness D2. The second dielectric layer 1908 has a thickness D3. The conductive shield layer 1906 has a thickness D The bonding strip 1900 has a total thickness D5. The conductive layer 1904 is made of copper. , copper alloys (e.g. brass or bronze), silver, silver alloys, aluminum, aluminum alloys Gold, titanium, titanium alloys, chromium, nickel, nickel alloys, cobalt alloys, corrosion-resistant steel, Made from conductive materials including, but not limited to, graphite, or combinations thereof. The conductive shield layer 1906 may be made of copper, a copper alloy (e.g., brass or blue). Copper), silver, silver alloys, aluminum, aluminum alloys, titanium, titanium alloys, chromium, Nickel, nickel alloys, cobalt-based alloys, corrosion-resistant steels, graphite, or combinations thereof. The electrodes may be made from any conductive material, including but not limited to conductive metals. In one embodiment, the conductive shield layer 1906 is a metal foil (e.g., copper foil or aluminum foil) or a knit. The dielectric layer 1908 can be formed as a composite metal layer. Ethylene terephthalate (PET), polytetrafluoroethylene (PTFE), rubber, or combinations thereof. do.

[0189] In some implementations, the bonding strip 1900 may include a protective layer over a conductive shielding layer. For example, the protective layer may be a polyurethane, a polyfluoride, a paint, a paint replacement film, The adhesive may include one or more layers of a sealant, a coating material, or a combination thereof. The present invention is not limited to these.

[0190] As shown in FIG. 20, the joining strip 1900 is attached to the skin 2000 of the aircraft (e.g. , wings) on the surface of the bulk medium, supplying current to the bulk medium and The flow of heat can be generated and shaped to heat the bulk medium. 0 extend along the surface of the aircraft skin 2000 and are spaced apart from one another. In some implementations, one or more of the bonding strips 1900 may be a bonding strip ( For example, a short circuit conductively couples at least a portion of the conductive layer 1904 to the bulk medium 1902. For example, the coupling strip 1900 may be terminated with an electrode as described above. 19. The conductive layer 1904 and the bulk medium 1902 are connected to each other via a short circuit (e.g., a short circuit). The end of the coupling strip 1900 can be the end opposite to the end to which current is supplied (e.g. , opposite the power input end of the strip. In some implementations, one or The plurality of coupling strips 1900 terminate in an open circuit. 900 is left open circuit and the bulk media 1902 or the coupling strip 1900 This means that the device is not electrically connected to ground through any of the conductive shield layers. In some implementations, one or more of the bonding strips 1900 may be bonded to a bonding strip 19 1902 and the bulk medium 1902. For example, the coupling strip 1900 may terminate in a capacitive, resistive, or can be terminated with an inductive termination, e.g., a capacitor, inductor, or resistor. The circuit elements, such as the conductive layer 1904 and the bulk medium 1902 of the coupling strip 1900, It is possible to connect in between.

[0191] 19 and 20, a power control system (for example, the power control system described above) A resistor 104 is connected to one end of each of the coupling strips to supply current to each of the coupling strips. For example, the power lines from the power control system are connected to each carrier strip 190. 0, and the bulk medium 1902 (e.g., the aircraft skin 2000) One or both of the may be coupled to electrical ground.

[0192] A power control system supplies AC current to each carrier strip 1900. For example, The power control system can supply AC current with frequencies from 1kHz to 450MHz. In some embodiments, the frequency is between 1 MHz and 450 MHz. In the form, the frequency is 1kHz to 1MHz. The power control system is Can be configured to provide AC currents from 0.1 amp to 200 amps at 1900 For example, the electrical layout of the power supply and coupling strip 1900 of the power control system may be , a desired amount of current (e.g., 0.1 amps to 200 amps) is applied to each bonding strip 1900. A common example is a coupling strip. When the coupling strips 1900 are coupled to the power control system in series with each other, each coupling strip 1900 A 100 amp power supply can be used to provide 100 amps of current to If ten coupling strips 1900 are coupled to the power control system in parallel with each other, A 100 amp power supply is used to provide 10 amps of current to each Bonding Strip 1900. This example assumes that the impedance of each coupling strip is the same. Note that, as explained below, the impedance of the coupling strip 1900 is The current distribution between the bonding strips can be controlled as desired or required for a particular heating application. In order to achieve this, the

[0193] AC current for heating the aircraft skin 1902 is provided through the conductive layer 1904. The AC current provided through the conductive layer 1904 is, as shown in FIGS. , which induces a corresponding current in the aircraft skin 1902 (e.g., by electromagnetic capacitive and inductive coupling). 22A-22B show an exemplary Output of an electromagnetic finite element analysis (FEA) program simulating the operation of the Coupling Strip 1900 A bulk medium 1902 (e.g., simulated as the skin of an aircraft) is shown. ), conductive layer 1904, and conductive shield layer 1906 are shown in FIG. In FIG. 22B, the individual components of the bonding strip 1900 are not shown. 1900 (generally depicted) and bulk media 1902 The area indicated by 2206 in both plots is the background environment (atmosphere, etc.). Both plots show the ion beam induced in the bulk medium 1902 and indicated by the shaded area 2204. Normalized current density (A / m 2 The current density of the bulk medium 1902 is The maximum is in a small region near the surface of 9202. Furthermore, the plot in FIG. Normalized electric field intensity in the dielectric layer of trip 1900 (light grey scale region 2202 In particular, the conductive shield layer 1906 is protected from the current passing through the conductive layer 1904. Shielding the surrounding environment 2206 from the generated electric fields, e.g., reducing or eliminating electromagnetic radiation; The bulk medium 1902 protects the coupling strip 1900 from external electromagnetic interference. It also acts as a shielding layer by minimizing or blocking the electric field. Therefore, a conductive shield The layer 1906 and the bulk medium 1902 may be coupled to one another in an embodiment of the coupling strip 1900. Within the coupling strip 1900 (e.g., the conductive shield layer 1906 and the bulk medium 1902 This effect can be useful in containing the heat from the heating system and other nearby electrical components. The coupling strip in combination with the bulk medium 1902 reduces or prevents electromagnetic interference between the The embodiment of the chip 1900 achieves performance comparable to that of a stripline type transmission line. It can be achieved.

[0194] Referring again to FIG. 19, the effect of heating the carrier strip 1900 on the bulk media, and And the impedance of each coupling strip 1900 depends on the characteristics of the carrier strip, e.g. , the thicknesses of the various layers 1904, 1906, and 1908, the widths of the conductive layers, the layout of the conductive layers, By changing the thickness, the materials of each layer (including their dielectric constant and conductivity properties), etc. or by including impedance adjusting elements (capacitors, inductors, resistors, etc.) Furthermore, the heating effect of the current generated in the bulk medium 1902 can be adjusted by , as described above, by adjusting the proximity effect and path of the heating current through the bulk medium 1902. The composition can also be modified by varying these properties which also serve to

[0195] For example, each of layers 1904, 1906, and 1908 may typically have a thickness of 0.1 mil to 1 inch. or in some embodiments, between 0.5 mils and 10 mils, respectively. In some implementations, the bonding strip may be formed with a thickness (D1 to D4). The substrate 1900 is configured to transfer the conductive layer 1904 from the bulk medium 1902 and to transfer the conductive layer 1904 to the conductive medium 1902. The conductive layer 1906 may be formed at different distances from the conductive shield layer 1906. In this embodiment, these distances are related by a ratio. For example, the coupling strip 1900 is The relative thicknesses D1 and D3 of the dielectric layers 1908 are formed to be proportionally related. For example, in some embodiments, the ratio of D1:D3 can be between 1:1 and 1:5. The ratio D1:D3 can be, for example, in the range of the desired current density and and / or impedance values ​​in other embodiments in the range of 1:1 to 5:1. In one exemplary embodiment, D1 is 3 mils and D2 is 1 mil. , D3 is 3 mils, and D4 is 1 mil. In another exemplary embodiment, D1 is 7.2 mils. D1 is 1.4 mils, D2 is 1.4 mils, D3 is 2.4 mils, and D4 is 1.4 mils. In an embodiment, D1 is 1000 mils, D2 is 50 mils, D3 is 500 mils, and D4 is 5 In yet another exemplary embodiment, D1 is 10 mils, D2 is 2.5 mils, In yet another example, D3 is 50 mils and D4 is 2.5 mils. In yet another example, D1 is 2.4 mils. , D2 is 1.4 mils, D3 is 7.2 mils, and D4 is 1.4 mils. D1 is 17.6 mils, D2 is 9.8 mils, D3 is 24.5 mils, and D4 is 9.8 mils. In yet another example, D1 is 100 mils, D2 is 20 mils, D3 is 250 mils, and In yet another example, D1 is 5.5 mils, D2 is 2.5 mils, and D4 is 20 mils. In yet another example, D1 is 1.5 in., D3 is 9.0 mils, and D4 is 2.5 mils. D1 is 0.25 inches, D2 is 0.25 inches, D3 is 2.2 inches, and D4 is 0.25 inches. In yet another example, D1 is 3.8 mils, D2 is 2 mils, D3 is 3.8 mils, and D4 is In yet another example, D1 is 2.9 mils, D2 is 1.5 mils, and D3 is 5.8 In yet another example, D1 is 5 mils, D2 is 2.5 mils, and D4 is 2.5 mils. In yet another example, D1 is 1 mil, D3 is 25 mil, and D4 is 1.5 inches. D1 is 1 mil, D2 is 3 mil, D3 is 5.5 mil, and D4 is 3 mil. D1 is 21 mils, D2 is 1.5 mils, D3 is 7 mils, and D4 is 2.5 mils. In yet another example, D1 is 10 mils, D2 is 2.5 mils, D3 is 2 mils, and D4 is In yet another example, D1 is 4.5 inches, D2 is 0.25 inches, D3 is 1.5 inches, and D4 is 0.25 inches. In another example, D1 is 3 mils, D D2 is 1 mil, D3 is 3 mils, and D4 is 1 mil. In yet another example, D1 is 10.2 mils. , D2 is 3.5 mils, D3 is 40.8 mils, and D4 is 2.5 mils. In the example, D1 is 4.8 mils, D2 is 0.5 mils, D3 is 14.4 mils, and D4 is 0. In yet another example, D1 is 15 mils, D2 is 1.4 mils, D3 is 3 mils, and D4 is 1.4 mils. In yet another example, D1 is 113 mils, D2 is 10 mils, and D3 is 28.25 mils. , and D4 is 10 mils. In yet another example, D1 is 127 mils, D2 is 5 mils, In yet another example, D1 is 53 mils, D2 is 254 mils, and D3 is 10 mils. D2 is 12 mils, D3 is 159 mils, and D4 is 12 mils. D1 is 13 mils, D2 is 1.4 mils, D3 is 2.6 mils, and D4 is 1.4 mils. So, D1 is 23 mils, D2 is 4 mils, D3 is 46 mils, and D4 is 4 mils. In yet another example, D1 is 11.5 mils, D2 is 2.8 mils, D3 is 57.5 mils, and D4 is 2.8 mils. In yet another example, D1 is 10 mils, D2 is 1.4 mils, and D3 is 2.8 mils. is 2.5 mils and D4 is 1.4 mils.

[0196] Additionally, the width of the conductive layer 1904 is typically in the range of a few inches or mils across the layer. FIG. 21 illustrates various configurations of the conductive layer 1904 in the bonding strip 1900. In order to clarify the results, the top view of some exemplary bonding strips (Examples 1-9) is shown. The interdigitating strip 1900 is, for purposes of illustration, a layer (e.g., a second dielectric layer) above the conductive layer 1904. 19. The cross section of conductive layer 1904 is shown with the conductive layers 1904 (body layer and conductive shield layer) removed. The product can vary along its length. For example, the width of the conductive layer 1904 can vary along its length. Adjust the impedance of the strip 1900 and, in some cases, the bulk medium and the conductive To adjust the current density of the layer, it can be varied along its length. 9 illustrates some exemplary width variation patterns of the conductive layer 1904 of the bonding strip 1900. For example, the width of the conductive layer 1904 across the coupling strip 1900 may have a maximum width and a minimum width. In some embodiments, the maximum width is no more than 1.5 times the minimum width. In other embodiments, the maximum width is as much as 100 times the minimum width. The width of the conductive layer 1904 at its widest point (e.g., at its top) is 1.5 inches. In another example, the conductive material shown in Example 1 may be 1 inch at its narrowest point (e.g., at the bottom). The width of layer 1904 is 1 inch at its widest point (e.g., at the top) and 1 inch at its narrowest point (e.g., at the top). For example, it may be 10 mils at the lower end.

[0197] In some implementations, the thickness of the conductive layer 1904 can vary along its length. For example, the width of the conductive layer 1904 may be adjusted to adjust the impedance of the coupling strip 1900. In some implementations, the thickness and Both the width and the material may vary along its length.

[0198] In some implementations, the impedance of the coupled line 1900 is determined by the impedance of the conductive layer 1904. Impedance adjustment components (e.g., The impedance can be adjusted by including a number of resistors (capacitors, inductors, and resistors). For example, the conductive layer can be divided into segments along its length and the segments can be joined together to form a or multiple impedance matching components. For example, Referring to the fourth embodiment of the bonding strip, the conductive layer 1904 is divided into two sections in the region 2102. The impedance adjustment components (e.g., capacitors) can be divided into Each segment is electrically connected to a Alternatively, or in addition, the impedance adjusting component can be formed on the conductive layer 1. 904 and either the bulk medium 1902 or the conductive shield layer 1906. The conductive layer can be connected to the conductive layer as a conductive element.

[0199] In some implementations, the width, thickness, or both of the conductive shield layer 1906 can be adjusted to accommodate The dielectric constant may vary along the length of the strip 1900. The width, thickness, or both of the layer 1908 varies along the length of the bonding strip 1900. For example, in some embodiments, a conductive layer 1904, a dielectric layer 1908, and varying the cross-sectional area of ​​the conductive shield layer 1906 along the length of the strip 1900. It is possible.

[0200] FIG. 23 shows a diagram of some exemplary arrangements of conductive layers 1904 within a bonding strip 1900. First, in the linear arrangement (shown in FIG. 21), The conductive layer 1904 extends linearly along the length of the coupling strip. Layout AE is 19, the conductive layer 1904 is arranged to extend along a non-linear pattern or path. 23 shows a lip 1900. Specifically, the example shown in FIG. 19. The serpentine pattern shown is a conductive layer 1904 disposed on the conductive layer 1904. The segments are positioned alongside one another across the width of the connecting strip 1900. The arrangement shortens the overall length of the coupling strips 1900 while maintaining the desired overall length of the conductive layer 1904. In some applications, the conductive layers of the different bonding strips 1900 may be Maintaining a relatively uniform length for 1904 allows for bonding strips of different lengths 19 00. For example, Layout A and In each of B, the conductive layer 1904 can be formed to the same overall length. However, the overall length of the joining strip 1900 in layout B is (for example, as shown in FIG. 21) The length of the coupling strip 1900 having the linear conductive layers can be shortened to half. Similarly, the total length of the coupling strip 1900 in layout C can be determined by linearly disposing the conductive layers. The length of the connecting strip 1900 can be shortened to one third of that of the connecting strip 1900. The length of the joining strip 1900 can be placed in space-constrained locations on the aircraft body. For example, a coupling strip having conductive layers arranged according to layouts A to E can be formed. 1900, a bonding strip with a straight conductive layer arrangement 1900 would be too long to fit. They can be located in narrow areas of the wing (eg, the wing tips).

[0201] Each of the layouts A to E is arranged along a non-linear path from the input terminal 2302 to the terminal terminal 2304. Layout A shows a bonding strip 1900 having a conductive layer 1904 disposed thereon. 19 shows a bonding strip 1900 having a conductive layer 1904 in a layout A. 1904 are arranged side by side in a U-shaped path from the input terminal 2302 to the terminal terminal 2304, for example. FIG. 24A shows a combined strip according to layout A. 1900 shows a cross-sectional view taken along line AA′.

[0202] Layout B shows a bonding strip 1900 with a triple-arrangement of conductive layers 1904. The conductive layer 1904 of layout B is, for example, from the input end 2302 to the termination end 2304. FIG. 24B shows a layered view of the three segments arranged side by side in an S-shaped path. 19 shows a cross-sectional view of a coupling strip 1900 taken along line BB' using Outer B.

[0203] Layouts C and D show a coupling strip 1904 with four different conductive layers 1904. 900. The conductive layers 1904 of each of layouts C and D are aligned next to each other. In layout C, the segments of conductive layer 1904 are arranged in a For example, from the input terminal 2302 to the terminal 2304, an M-shaped path (or a W-shaped path) In layout D, the segments of conductive layer 1904 are arranged, for example, in a double-layered configuration. The same technique was used to create a triple-layered conductive layer 1904. It can also be applied to layout C, which can then be folded and arranged side by side. 19 shows a cross-sectional view of a coupling strip 1900 taken along line CC' in accordance with layout D.

[0204] Layout E shows a more typical arrangement of conductive layer 1904. For example, layout FIG. 19E is an example of a conductive layer 1904 having multiple segments of different widths arranged next to each other. Further, in some embodiments, the conductive layer 1904 may be 23. Including interconnects 2306 between the segments at various locations between the segments so that In some embodiments, the coupling strip 1900 also includes a plurality of signal input terminals. 2302.

[0205] FIG. 25A illustrates an exemplary method for attaching a bonding strip 1900 to a bulk media 1902. FIG. 25A shows a bottom mounted configuration. In the bottom mounted configuration, , the bottom surface (e.g., bottom dielectric layer) of the coupling strip 1900 and the surface of the bulk medium 1902 An adhesive 2502 is disposed between the adhesive 2502 and the substrate 2502. For example, the adhesive may be a layer of double-sided adhesive (e.g., The adhesive may be, but is not limited to, a adhesive tape, resin, or epoxy.

[0206] FIG. 25B illustrates an alternative method for attaching the bonding strip 1900 to the bulk media 1902. FIG. 25B shows a top-mounted configuration. In the construction, an adhesive layer 2504 is applied over the bonding strip 1900 to form the bonding strip. 1900 is attached to the skin 1902 of an aircraft. The adhesive layer 2504 may be, for example, an adhesive coating. It may be a membrane, an adhesive film, or a tape.

[0207] FIG. 26A shows a bonding strip with a double-sided adhesive bottom layer prior to placement in bulk media 1902. FIG. 26B is a cross-sectional view of the substrate 1900 of FIG. 26A placed on a bulk medium 1902. FIG. 19 is a cross-sectional view of a coupling strip 1900. In some embodiments, such as a bottom-mounted configuration, The bonding strip 1900 includes an adhesive bottom layer 2608. The adhesive bottom layer may be a double-sided adhesive material (e.g. For example, the double-sided adhesive may be formed from a double-sided tape. , which can function as a lower dielectric layer (e.g., lower dielectric layer 1908 in FIG. 19). In some implementations, the bottom adhesive layer 2608 may be, for example, a bottom layer of the lower dielectric layer 1908. Prior to installation, the adhesive bottom layer 2608 may be an adhesive coating or film applied to the surface. The bonding strip 1900 having the above structure may include a liner 2610 on an adhesive bottom layer 2608. The liner 2610 can be, for example, a release layer. Upon installation, the liner 2610 may protect the adhesive bottom layer 2608 prior to installation. 8 to expose its adhesive surface, and attach the bonding strip 1900 to the bulk media 1902. Can be surface mounted.

[0208] In some implementations, a dielectric layer 1908 is attached to the conductive layer 1904, and and / or conductive shield layer 1906 to attach to dielectric layer 1908. may include multiple adhesive layers 2604 and 2606. In some embodiments, , the coupling strip 1900 includes a protective layer 2602 over a conductive shielding layer 1906 . For example, the protective layer 2602 may be made of polyurethane, polyfluoride, paint, paint replacement film, The adhesive may include one or more layers of a sealant, a coating material, or a combination thereof. The present invention is not limited to these.

[0209] In some applications, it may be necessary to heat a non-conductive bulk medium. In such cases, the heating system and bonding strips described herein may be non-conductive. The buried layer can be modified to heat the conductive bulk medium. It can be used in conjunction with a lip heating system to heat non-conductive bulk media.

[0210] 27A-27F show cross-sectional views of various embodiments of embedded bonding strips. 7A shows a bonding strip 2700 similar to bonding strip 1900 of FIG. Similar to strip 1900, combined strip 2700 is a first a first dielectric layer 1908, a conductive layer 1904 on the first dielectric layer 1908, and a conductive layer 1904 on the conductive layer 1904. a second dielectric layer 1908, and a conductive shield layer 1906 on the second dielectric layer 198; and an optional multi-layer structure including a protective layer 2706 on a conductive shielding layer 1906. The protective layer 2706 is similar to the protective layer 2602 described above. The bonding strip 2700 is , attached to the surface of the non-conductive bulk medium 2702, which 27. The bonding strip 1900 includes a bulk conductive material 2704 embedded within the bonding strip 1900. For example, the bulk conductive material 2704 may be provided as a metal foil, a metal tape, or a non-metallic material. It may be formed as a metal layer embedded within the conductive bulk medium 2702. For example, , the non-conductive bulk medium 2702 is a bulk material disposed between layers of the non-conductive bulk medium 2702. A layered material (e.g., carbon fiber composite, fiberglass composite, or or Kevlar composite). The bulk conductive material 2704 can be copper, a copper alloy (e.g., brass, or bronze), silver, silver alloys, aluminum, aluminum alloys, titanium, titanium alloys, Chromium, nickel, nickel alloys, cobalt-based alloys, corrosion-resistant steel, graphite, or The conductive layer may be made of, but is not limited to, any of a combination of these.

[0211] In each of the examples shown in FIGS. 27A-27F, the conductive layer of the bonding strip 2700 The AC current passing through 1904 is directed to the bulk conductive material 2702 rather than the non-conductive bulk medium 2702. 704. The heat generated in the bulk conductive material 2704 is then For example, by thermal conduction, the heat is conducted into the non-conductive bulk medium 2702. If the conductive bulk medium exhibits some conductive behavior, a non-conductive layer may be added in addition to the bulk conductive material layer. Heat is also generated in some areas.

[0212] FIG. 27B shows a result including only the protective layer 2706, the conductive layer 1904, and the dielectric layer 1908. 27 shows an embodiment of a bonding strip 2700. The bonding strip 2700 is a A protective layer 2706 is disposed on the top of the conductive layer 1904, and a dielectric layer 1908 is disposed on the conductive layer 1904. The dielectric layer 1908 separates the non-conductive bulk medium 2704 from the embedded bulk conductive material 2704. It is separated by part of 702.

[0213] FIG. 27C illustrates a bond including a conductive layer 1904 embedded within a non-conductive bulk medium 2702. 27C shows an embodiment of a strip 2700. The bonded strip 2700 in FIG. 706 , a conductive shielding layer 1906 , a dielectric layer 1908 , and a conductive layer 1904 . The bonding strip 2700 includes a protective layer 2706, a conductive shield layer 1906, and a dielectric A layer 1908 is disposed on the conductive layer 1904. The conductive layer 1904 is a non-conductive bulk A conductive bulk medium 2702 is embedded in the medium 2702 and is connected to the conductive bulk medium 2702 by a portion of the non-conductive bulk medium 2702. For example, the conductive layer 1904 and the bulk conductive material 2704 are spaced apart from each other. , each may be disposed between different layers of the non-conductive bulk medium 2702.

[0214] FIG. 27D illustrates a variation of the bonding strip 2700 shown in FIG. 27C, but without a protective layer 2 706, conductive shield layer 1906, and dielectric layer 1908 are not present.

[0215] FIG. 27E illustrates a variation of the bonding strip 2700 shown in FIG. 27D, in which the conductive layer 19 The geometric arrangement of the conductive material 2704 and the bulk conductive material 2704 is reversed. In the illustrated arrangement of bonding strips 2700, bulk conductive material 2704 is disposed on conductive layer 190. 4 is disposed closer to the surface of the non-conductive bulk medium 2702.

[0216] FIG. 27F illustrates a conductive layer 1904 embedded within a non-conductive bulk medium 2702 and a conductive 27F shows an embodiment of a bonding strip 2700 including a conductive shield layer 1906. In the coupling strip 2700, a portion of the non-conductive bulk medium 2702 (e.g., The conductive layer 1904 is connected to the conductive shield layer 1906 and the bulk medium 2702. The non-conductive bulk medium 2702 is shown in FIG. It serves a similar purpose as the dielectric layer 1908 in the coupling strip 1900 .

[0217] FIG. 28 shows a diagram of one embodiment of a coupling strip connector 2802. 2 is a circuit diagram of a connector 2802. The connector 2802 includes an integrated impedance matching network. The impedance matching network 2804 adjusts the impedance of the input signal 2806 and the coupling strip 1900. For example, The input signal interface 2806 may be a coaxial cable connection. An input terminal 2810 of the interface 2806 (e.g., the center wire of a coaxial cable connection) is The input signal I is coupled to the conductive layer 1904 of the coupling strip 1900 by a line 2808. The ground terminal 2814 of the interface 2806 (e.g., the shield of a coaxial cable connection) , one or more wires 2812 may be connected to the bulk medium 1902 or the coupling strip 1 900 is coupled to one or both of the conductive shielding layers 1906 .

[0218] The impedance matching network 2804 adjusts the input impedance of the coupling strip 1900. to adjust the input signal to a desired level as measured at the input signal interface 2806. The impedance tuning network 2804 is configured as a fixed or variable impedance. For example, the impedance matching network 2804 may be 12-15B. In diagram 2850, impedance matching network 2804 may be coupled to ground. The conductive shield layer 1906 of the composite strip 1900 and the bulk medium 1902 (or Bulk conductive material 2704) when implemented for a conductive bulk medium or It is implemented as a parallel capacitor C1 connected between both.

[0219] FIG. 29 shows a diagram of another embodiment of a coupling strip connector 2902. 02, for example, two connecting strips 1900 for chaining together The connector 2905 includes input signal interfaces 2906A and 2906B. 2902. The connector 2902 is a circuit diagram of the integrated impedance matching network 2 904. The impedance matching network 2904 is an input signal interface 2906A, 2906B and the coupling strip 1900. and parallel impedance adjustment elements 2904A, 2904B and 2904C. , the input signal interfaces 2906A and 2906B may be coaxial cable connections. The input terminals 22910 of the input signal interfaces 2906A and 2906B are are coupled to the conductive layer 1904 of the coupling strip 1900 and are connected to each other by wires 2808 The ground terminals 2 of the input signal interfaces 2906A and 2906B are connected to each other. 914 is a bulk medium of the coupling strip 1900 by one or more wires 2912 19. The conductive shield layer 1906 may be coupled to either or both of the body 1902 or the conductive shield layer 1906 .

[0220] In FIG. 2950, ​​the impedance matching network 2804 is connected to the ground and the coupling strip. The conductive shield layer 1906 and the bulk medium 1902 (or non-conductive bulk medium) of the cup 1900 are 2704) or both of the bulk conductive materials when implemented for use in a bulk medium. A series capacitor C1 and two shunt capacitors C2 and C3 are connected between the It is implemented as follows.

[0221] FIG. 30 illustrates a first exemplary ballast using a bonding strip 1900 according to an embodiment of the present disclosure. FIG. 3 is a block diagram of a gas medium heating system 3000. A plurality of spaced apart and attached to a bulk medium 1902 (e.g., an aircraft wing). Each of the coupling strips 1900 includes a power control system 30 02. The power control system 3002 is the same as the power control system 104 described above. The power control system 3002 may be implemented as any one of the embodiments. The lip is supplied with AC current.

[0222] One end of each coupling strip 1900 (referred to herein as the "input end") is 3004 to the power control system 3002. In the illustrated example, The opposite end of the loop 1900 (herein, the "end") may be an open circuit end 3006 or a closed circuit end 3007. The joining strip 1900 has either one of the ends 3008. 1900 are arranged in an alternating pattern with each pair having a different type of termination. One coupling strip 1900 of an adjacent pair has an open circuit termination 3006 at its end, and the other The coupling strip 1900 has a closed termination 3008 at its end. The ends of the bonding strip 1900 are left open circuited and the bulk medium 1902 or bonding 1900 is electrically connected to ground via one of the conductive shielding layers of the In some embodiments, the closed termination 3008 is shown to be 0 and the conductive shielding layer of the bulk medium 1902 or bonding strip 1900. In some embodiments, a closed circuit termination is a short circuit between either one or both of the terminals. 3008 is a capacitive termination, a capacitor electrically connected to the conductive layer of the coupling strip 1900. For example, a capacitor may be connected between the conductive layer of the coupling strip 1900 and between either the conductive shielding layer of the coupling strip 1900 or the In some implementations, the closed termination 3008 is an inductive termination, is connected between the conductive layer of the coupling strip 1900 and electrical ground. The conductive layer of the bonding strip 1900 and the bulk medium 1902 or bonding strip 190 0 conductive shield layer. In some implementations, End 3008 is a resistive termination, with a resistor connecting the conductive layer of bonding strip 1900 to electrical ground. For example, a resistor may be connected between the conductive layer of the coupling strip 1900 and the bulk medium. 1902 or the conductive shield layer of the coupling strip 1900. do.

[0223] To provide a desired input impedance to the power control system 3002, the bulk medium 1 To provide a desired heating distribution across 902, or a combination thereof. Complementary termination types can then be applied to adjacent bonding strips 1900. For example, coupling strip 1900 may be configured with adjacent coupling strips having complementary termination types. 1900 on the bulk medium 1902. The ends of the coupling strip 1900 are an open end 3006 and a short end (e.g., implemented as a short circuit). In another example, adjacent closed terminations 3008 may be alternated. The terminations of the mating strip 1900 are a closed circuit termination 3008 implemented as a capacitive termination and an inductive 3008 implemented as a termination.

[0224] FIG. 31 illustrates a second exemplary ballast using a bonding strip 1900 according to an embodiment of the present disclosure. FIG. 31 is a block diagram of a heating medium system 3100. Similar to system 3000, but with a flexible A control system 3102 is added that is configured to drive the variable termination 3106. The variable termination 3106 includes a switchable termination. 06 is configured to switch between short circuit and open circuit termination. End 3106 is a controllable electrode coupled between the conductive layer of coupling strip 1900 and electrical ground. A controllable switch includes an electronic switch (e.g., a transistor, a power diodes, thyristors, silicon controlled rectifiers, etc.) or mechanical switches (e.g. , relays). For example, the controllable switch may be implemented as a coupling strip 1900 conductive layer and bulk medium 1902 or conductive shield of bonding strip 1900 The output of the control system is connected to the control terminal of the controllable switch. is combined with

[0225] The ends of each coupling strip 1900 can be connected by opening or closing a controllable switch. or by turning an electronic switch off and on) between an open circuit and a short circuit. For example, the control system 3102 may control the variable termination of the bonding strip 1900. 3106 and the coupling strip by operating the controllable switch. The end type of 1900 is changed as required to heat the bulk medium 1902. 3102 can independently control the variable termination 3106 of each coupling strip. In some embodiments, the control system 3102 controls the variable termination 3106 of the coupling strip. Groups (e.g. pairs or larger groups) can be controlled in sync with each other. In some embodiments, the control system 3102 may control one or more of the coupling strips 1 The variable termination 3106 of 900 is switched at regular intervals, for example, at regular operation cycles. The operating cycle for switching the variable termination 3106 is 0.01H. z to 100 Hz.

[0226] In some implementations, the control system 3102 may be configured to control the variable termination 3106 between an open circuit termination and a closed circuit termination. The variable termination 3106 is controlled by switching it back and forth between the For example, the control system 3102 may set half of the variable termination 3106 to 0 during the first half of the operating cycle. Switch the variable termination 3106 to a short circuit termination and switch half of the variable termination 3106 to an open circuit termination. During the second half of the loop, the control system 3102 changes the variable termination 3106 to a termination that was previously an open circuit termination. The variable termination 3106 is controlled so that it can be switched to a closed termination and vice versa. The operating cycle for the pulse width modulation may range from 0.01 Hz to 100 Hz.

[0227] In some implementations, the variable termination 3106 of each pair of adjacent coupling strips 1900 is controlled to maintain the opposite type of termination. In each adjacent pair, one coupling strip 1900 is configured as an open circuit at its end, and the other of the pair is configured as an open circuit at its end. The variable termination 3106 is configured such that the end of one of the coupling strips 1900 is configured as an open circuit. The termination is alternated every half of the operating cycle.

[0228] The control system 3102 includes one or more resistors configured to control the operation of the variable termination 3106. A computing device with one or more processors or microcontrollers For example, the control system 3102 may store instructions in memory (e.g., software code). The instructions, when executed by the control system 3102, include In some implementations, the power control System 3002 and control system 3102 are integrated into a common power and control system. It can be done.

[0229] In some implementations, the variable termination 3106 switches between capacitive and inductive termination. For example, the controllable switch may be configured to switch the conductive layer of the coupling strip 1900 Either couple to a capacitor connected to ground or connect the conductive layer of the coupling strip 1900 to ground. The inductor 10 can be configured to switch between coupling to the inductor 102 and coupling to the inductor 103 connected to the inductor 104. Thus, the ground is connected to the bulk medium 1902 or the conductive shield layer of the coupling strip 1900. Further, in such an embodiment, the control system 31 02 as described above to alternate variable termination 3106 between conductive and inductive termination. can be switched to.

[0230] In other implementations, the variable termination 3106 can be used to switch between different termination types, e.g., open circuit termination. between a short circuit and a capacitive termination, between a short circuit and an inductive termination, between an open circuit and an inductive termination, between open and resistive terminations, between short and resistive terminations, and can be modified to switch between these other combinations.

[0231] FIG. 32 illustrates a third exemplary bulk media using bonding strips according to an embodiment of the present disclosure. FIG. 32 is a block diagram of a heating system 3200. The heating system 3200 is The heating system 3200 is configured to alternately drive the lips 1900. 3000, but with a cutout attached to the input end of each coupling strip. A control system 3202 configured to drive the switchable connector 3204 is added. The switchable connector 3204 controls the power supply of the associated coupling strip 1900. The control system 3002 includes a controllable switch arranged to connect and disconnect the control system 3002. The controllable switch is an electronic switch (e.g., transistor, power diode, thyristor, etc.). , silicon controlled rectifiers) or mechanical switches (e.g. relays). For example, the controllable switch may be switchable with the conductive layer of the coupling strip 1900. The output of the control system is connected between the controllable switch 3204 and the input terminal of the controllable switch 3204. The control terminal of the switch is coupled to the

[0232] The control system 3202 controls the operation of the switchable connector 3204 to couple the The lip 1900 is alternately connected and disconnected from the power control system 3002 and the coupling strip 1900. For example, the control system 3202 may 3204 to alternately turn on and off the coupling strips 1900. For example, the control system 3202 may control the Thus, the operation of the switchable connector 3204 of the coupling strip 1900 is controlled to The coupling strip 1900 can be turned on and off as needed to heat the thermal media 1902. In some embodiments, the control system 3102 controls the possible The variable termination 3106 can be controlled independently. In some implementations, the control system The system 3102 is a group (e.g., pair or larger group) of coupling strips. The variable terminations 3106 can be controlled in synchronization with each other. The control system 3102 adjusts the variable termination 3106 of one or more of the coupling strips 1900 to a constant The switching can be controlled at intervals of, for example, according to a normal operating cycle. The operating cycle for switching the termination 3106 ranges from 0.01Hz to 100Hz. In some implementations, the control system 3202 may, during the first half of the operating cycle: The bonding strip 1900 with open termination 3006 is turned on and the bonding strip 1900 with close termination 3008 is turned on. Then, during the second half of the operating cycle, the control system 3202 switches the switchable connector 3204 to form a connection with an open termination 3006. The joining strip 1900 is turned off and the joining strip 1900 with the closed circuit termination 3008 is turned on. Turn it on.

[0233] The control system 3202 includes one or more resistors configured to control the operation of the variable termination 3106. A computing device with one or more processors or microcontrollers For example, the control system 3202 may store instructions in memory (e.g., software code). When executed by the control system 3202, the instructions include In some implementations, the power control The system 3002 and the control system 3202 are integrated into a common power and control system. possible.

[0234] As used herein, "vertical" or "substantially vertical" or "normal" or " The term "substantially normal" refers to two objects that form a 90 degree angle within acceptable engineering or measurement tolerances. It refers to the relationships between elements (e.g., lines, directions, axes, planes, surfaces, or components) of a system. For example, if the angle between the directions is within a tolerance of 90 degrees (for example, ±1 to 2 degrees), then the directions are mutually exclusive. can be considered to be perpendicular to the

[0235] Although the specification contains many details of specific embodiments, these are within the scope and spirit of the invention. should not be construed as a limitation on the scope of what may be claimed, but rather as being directed to specific embodiments of a particular invention. The description of specific features should be interpreted as a description of specific features. It is to be understood that the particular features described herein may also be implemented in combination in a single embodiment. Conversely, Various features that are described in the context of a single embodiment may also be used separately or optionally in multiple embodiments. In addition, various features may be implemented in specific combinations. Although described above as acting in combination and initially claimed as such, One or more features from the selected combination may be The claimed combination may be removed and the combination may be a subcombination or a subcombination of parts. This can be directed towards variations in

[0236] Similarly, although operations are shown in the figures in a particular order, this is not intended to be limiting as to how the various steps may be performed to achieve desired results. For this reason, it is not intended that such operations be performed in the particular order or sequence shown, or that they be illustrated. It should not be understood as requiring that every action described be performed. In some situations, multitasking and parallel processing may be advantageous. The separation of the various system modules and components is consistent in all embodiments. Such separation should not be understood to be required, and the program code described may be modified without departing from the spirit or scope of the invention. Components and systems generally consist of a single software and / or hardware component. Integrate into a single software product or package into multiple software and / or hardware products It should be understood that the present invention may be packaged as a single unit.

[0237] Although particular embodiments of the subject matter have been described, other embodiments are within the scope of the following claims. For example, the actions recited in the claims may be performed in a different order. By way of example, the following is shown in the accompanying drawings: The processes shown do not necessarily have to be performed in the particular order or sequence shown to achieve a desired result. In some cases, multitasking and parallel processing can be advantageous. There is.

[0238] In addition to the embodiments of the appended claims and the embodiments described above, the following numbered The embodiment described above is also innovative.

[0239] Embodiment 1 is a system for heating an exterior surface of a bulk medium, the system comprising: The bulk medium includes two or more bonding strips attached to the bulk medium at spaced intervals, each bonding strip having a A strip extends along a surface of the bulk medium and couples with the bulk medium to form a power transmission line. forming a multi-layer structure, the multi-layer structure including a first dielectric layer on the bulk medium; a conductive layer on the first dielectric layer, a second dielectric layer on the conductive layer, and a conductive layer on the second dielectric layer. a conductive shield layer and a conductive layer and a ballast of each of the coupling strips. a power control system coupled to the coupling strip, the power control system The surface of the bulk medium is heated by supplying an electric current to the .

[0240] A second embodiment is the system of the first embodiment, wherein the power control system is configured to operate at a frequency of 1 kHz to 4 It is configured to provide current to the coupling strip at an AC frequency of 50 MHz.

[0241]

[0023] Embodiment 3 is the system of embodiment 1 or 2, wherein the conductive layer is The device is positioned within 1 inch of the lukewarm medium.

[0242] A fourth embodiment is a system according to any one of the first to third embodiments, wherein the power control system is Configured to deliver 0.1 amp to 200 amps of AC current to each bonding strip It has been done.

[0243] A fifth embodiment is the system of any one of the first to fourth embodiments, wherein the coupling strip is At least one of the conductive layers is arranged in a serpentine pattern with segments of the conductive layer positioned side by side. It is placed there.

[0244] A sixth embodiment is the system of any one of the first to fifth embodiments, wherein the conductive layer is the conductive layer is spaced a first distance from the medium and the conductive shield layer is spaced a second distance from the conductive layer. The first distance and the second distance are spaced apart from each other, and the range of the first distance and the second distance is 1:1 to 1:5.

[0245] A seventh embodiment is the system of any one of the first to fifth embodiments, wherein the conductive layer is the conductive layer is spaced a first distance from the medium and the conductive shield layer is spaced a second distance from the conductive layer. The first distance and the second distance are spaced apart from each other by a distance of 5:1 to 1:5.

[0246] An eighth embodiment is the system of any one of the first to fifth embodiments, wherein the conductive layer is the conductive layer is spaced a first distance from the medium and the conductive shield layer is spaced a second distance from the conductive layer. The first distance and the second distance are spaced apart from each other, and the range of the first distance and the second distance is 1:1 to 5:1.

[0247] A ninth embodiment is the system of any one of the first to fifth embodiments, wherein the first dielectric layer is a a first dielectric layer having a thickness of 1 and said second dielectric layer having a second thickness, and a ratio of said first thickness to said second thickness is The ratio is 1:1 to 1:5.

[0248] A tenth embodiment is the system of any one of the first to fifth embodiments, wherein the first dielectric layer is a first thickness, the second dielectric layer having a second thickness, and a distance between the first thickness and the second thickness. The ratio is 1:1 to 5:1.

[0249] An eleventh embodiment is the system of any one of the first to tenth embodiments, further comprising the coupling strip At least one of the conductive layers has a lateral width that varies along the length of the conductive layer.

[0250] Embodiment 12 is the system of embodiment 11, wherein at least one of the coupling strips One of the conductive layers has a lateral width that varies along the length of the conductive layer, the lateral width being a maximum width. The width varies between the minimum and maximum widths, with the maximum width being 1.5 to 100 times the minimum width.

[0251] Embodiment 13 is the system of embodiment 11, wherein the conductive layer has a maximum width and a minimum width. The maximum width varies between 1.5 and 100 times the minimum width.

[0252] A fourteenth embodiment is the system of any one of the first to thirteenth embodiments, further comprising the coupling strip At least one of the conductive layers includes a plurality of segments, and one between each pair of segments. Or, multiple circuit elements are combined.

[0253] Example 15 is the system of example 14, wherein the one or more circuit elements are Includes capacitors.

[0254] A sixteenth embodiment is the system of any one of the first to fifteenth embodiments, further comprising the coupling strip At least one of the conductive layers has a thickness that varies along the length of the conductive layer.

[0255] A seventeenth embodiment is the system of any one of the first to sixteenth embodiments, wherein the bulk medium is a second shield layer for the power transmission line formed in conjunction with each of the coupling strips; Form.

[0256] An eighteenth embodiment is the system of any one of the first to seventeenth embodiments, further comprising: Each of the conductive shield layers is made of at least one of copper, silver, or aluminum. include.

[0257] Embodiment 19 is the system of any of embodiments 1-18, wherein the conductive layer is titanium. Includes.

[0258] A 20th embodiment is the system of any one of the first to 19th embodiments, further comprising: The layer includes at least one of copper foil, aluminum foil, or a braided shielding material.

[0259] A twenty-first embodiment is the system of any one of the first to twenty embodiments, wherein the first dielectric layer and each of the second dielectric layers is at least one of Kapton or Mylar. Includes.

[0260] A twenty-second embodiment is the system of any one of the first to twenty-first embodiments, wherein the first dielectric layer and the second dielectric layer is made of polyethylene terephthalate (PET), polytetrafluoroethylene (PTFE), (PTFE), or rubber.

[0261] Embodiment 23 is the system of any one of embodiments 1 to 22, wherein the multi-layer structure is It further includes a protective layer over the conductive shielding layer.

[0262] Embodiment 24 is the system of any of embodiments 1 to 23, wherein the first dielectric layer includes an adhesive.

[0263] Embodiment 25 is the system of any one of embodiments 1 to 24, wherein the multi-layer structure comprises A first adhesive layer between the conductive layer and the second dielectric layer, and a second adhesive layer between the second dielectric layer and the conductive layer. The insulating layer further includes a second adhesive layer between the insulating layer and the insulating shield layer.

[0264] Embodiment 26 is the system of any of embodiments 1 to 25, wherein each coupling strip is Each coupling strip includes a first end and a terminal end, the conductive layer of each coupling strip being connected to the power control at the first end. a control system, and at least one of said coupling strips is coupled to an electrical ground at said termination. The conductive path includes:

[0265] Embodiment 27 is the system of embodiment 26, wherein the electrical ground connects the bulk medium to the include.

[0266] Embodiment 28 is the system of embodiment 26, wherein the electrical ground is The conductive shield layer includes two coupling strips.

[0267] Embodiment 29 is the system of any of embodiments 1-28, wherein each coupling strip is Each coupling strip includes a first end and a terminal end, the conductive layer of each coupling strip being connected to a power control system at the first end. and at least one of the coupling strips is electrically connected to the conductive layer and the termination. This includes an open circuit between the power supply and an objective earth.

[0268] Embodiment 30 is the system of embodiment 29, wherein the electrical ground comprises a bulk medium. .

[0269] Embodiment 31 is the system of embodiment 29, wherein the electrical ground is The conductive shield layer includes two coupling strips.

[0270] Embodiment 32 is the system of any of embodiments 1 to 31, wherein each coupling strip is Each of the coupling strips includes a first end and a terminal end, the conductive layer of each of the coupling strips being electrically connected to the first end. a force control system coupled to at least one of the coupling strips, the coupling strips being coupled to the conductive layer and the and a circuit element coupled between the termination and an electrical ground, the circuit element including a capacitor, an inductor, The at least one of the following may be included: an inductor, or a resistor.

[0271] Embodiment 33 is the system of embodiment 32, wherein the electrical ground connects the bulk medium to the include.

[0272] Embodiment 34 is the system of embodiment 32, wherein the electrical ground is The conductive shield layer includes one bonding strip.

[0273] Embodiment 35 is the system of any of embodiments 1 to 34, wherein each coupling strip is Each of the coupling strips includes a first end and a terminal end, the conductive layer of each of the coupling strips being electrically connected to the first end. a first bonding strip of each adjacent pair of said bonding strips coupled to a force control system; includes alternating open circuits between the conductive layer and electrical ground of the termination, The second coupling strip of each adjacent pair of strips is electrically conductive to the electrical ground at said termination. Includes alternating paths.

[0274] Embodiment 36 is the system of embodiment 34, wherein the electrical ground connects the bulk medium to the include.

[0275] Embodiment 37 is the system of embodiment 34, wherein the electrical ground is the first and second The conductive shield layer of each of the two bonding strips.

[0276] Embodiment 38 is the system of embodiment 34, wherein the power control system comprises: providing a current to a first coupling strip of each adjacent pair of strips and The second coupling strip of each adjacent pair of strips is alternately supplied with current. It is structured as follows:

[0277] Embodiment 39 is the system of embodiment 34, wherein each coupling strip has a first end and and a termination, the conductive layer of each coupling strip being connected to the power control system at the first end. a first bonding strip of each adjacent pair of said bonding strips being bonded to said conductive layer; a coupling strip including alternating capacitors coupled between said terminations and electrical ground; The second coupling strip of each adjacent pair is coupled between the conductive layer and electrical ground of the termination. The inductors include alternating inductors.

[0278] Embodiment 40 is the system of embodiment 39, wherein the electrical ground comprises a bulk medium. .

[0279] Embodiment 41 is the system of embodiment 39, wherein the electrical ground is the first and second The conductive shield layer of each of the two bonding strips.

[0280] Embodiment 42 is the system of embodiment 39, wherein the power control system comprises: providing a current to a first coupling strip of each adjacent pair of strips and said coupling The second coupling strip of each adjacent pair of strips is alternately provided with a current. It is structured as follows:

[0281] Embodiment 43 is the system of embodiment 39, wherein each coupling strip has a first end and and a termination end, the conductive layer of each coupling strip being connected to the power control system at the first end. and each coupling strip is connected at the termination to the conductive layer and to the bulk medium or to the front surface of the substrate. a switch coupled between one or both of the conductive shield layers, the switch being in a first state; When the switch is between the conductive layer and the bulk medium or the conductive shield layer, and in a second state, the switch forms an open circuit between the conductive layer and the electrical ground. forms a closed circuit.

[0282] Embodiment 44 is the system of embodiment 43, wherein the electrical ground is a bulk medium. .

[0283] Embodiment 45 is the system of embodiment 43, wherein the electrical ground is the conductive seal. This is the upper layer.

[0284] Embodiment 46 is the system of any one of embodiments 1 to 45, wherein the two or more bonds The strips are electrically coupled to each other in parallel.

[0285] Embodiment 47 is the system of any of embodiments 1 to 45, wherein the two or more bonds The strips are electrically coupled to each other in series.

[0286] Embodiment 48 is the system of any of embodiments 1 to 47, wherein the bulk medium comprises: including bulk media, wind turbine blades, building roofs, or railroad tracks.

[0287]

[0049] Embodiment 49 is a system for heating an exterior surface of a structure, the system comprising: a structure to be heated that is fabricated from a conductive material and includes a bulk conductive material embedded therein; two or more connecting strips attached to the structure at spaced intervals, Each coupling strip, in combination with the bulk conductive material embedded within the structure, forms a transmission line. a multi-layer structure extending along said structure forming said bulk conductor; a conductive layer overlying the bulk conductive material and a first dielectric layer between the bulk conductive material and the first conductive layer. two or more bonding strips, each of said bonding strips including a conductive layer; and coupled to the structure, and applying a current to the coupling strip to heat an exterior surface of the structure. and a power control system configured to provide the

[0288] Embodiment 50 is the system according to claim 49, wherein each connecting strip is and a protective layer extending along a surface of the multi-layer structure covering the conductive layer.

[0289] Embodiment 51 is the system according to claim 49, wherein each connecting strip is and the multi-layer structure further comprises a conductive shield layer on the conductive layer; a second dielectric layer between the conductive layer and the conductive shield layer, and a second dielectric layer on the conductive shield layer; The protective layer includes:

[0290] Embodiment 52 is the system according to claim 49, wherein a portion of each coupling strip is The conductive layer extends along a surface of the structure, the conductive layer is embedded within the structure, and a portion of the structure a first dielectric layer and the multi-layer structure further comprises a conductive seal on the conductive layer. a conductive shield layer, a second dielectric layer between the conductive layer and the conductive shield layer, and The protective layer is on the bonding layer.

[0291] Embodiment 53 is the system of claim 49, wherein the conductive layer is embedded in the structure. a first portion of the structure forming the first dielectric layer, the multi-layer structure further comprising: a conductive shield layer embedded within the structure and overlapping the conductive layer; and a second portion of the structure disposed between the conductive layer and the conductive shield layer; The second dielectric layer is disposed on the first dielectric layer.

[0292] Embodiment 54 is the system of claim 49, wherein the conductive layer is embedded in the structure. A portion of the structure forms the first dielectric layer.

[0293] A fifty-fifth embodiment is the system according to any one of the forty-ninth to fifty-fourth embodiments, wherein the power control system The system is constructed to provide current to the coupling strip at AC frequencies between 1 kHz and 450 MHz. It has been made.

[0294] Embodiment 56 is the system of any of embodiments 49 to 55, wherein the conductive layer is Located within 1 inch of the bulk conductive material.

[0295] A fifty-seventh embodiment is the system of any one of the forty-ninth to fifty-sixth embodiments, wherein the power control system The system is designed to provide 0.1 amps to 200 amps of AC current to each bonding strip. It is composed of:

[0296] Embodiment 58 is the system of any of embodiments 49 to 57, wherein the coupling strip At least one of the conductive layers of the loop is a serpentine loop in which the segments of the conductive layer are positioned side by side with each other. They are arranged in a row pattern.

[0297] Embodiment 59 is the system of any of embodiments 49 to 57, wherein the conductive layer is a conductive shield layer separated from the bulk conductive material by a first distance, the conductive shield layer being a second distance from the conductive layer; The first and second distances are separated by a distance of 1:1 to 1:5.

[0298] Embodiment 60 is the system of any of embodiments 49 to 57, wherein the conductive layer is a conductive shield layer separated from the bulk conductive material by a first distance, the conductive shield layer being a second distance from the conductive layer; The first and second distances are separated by a distance of 1:1 to 5:1.

[0299] Embodiment 61 is the system of any of embodiments 49 to 60, wherein the coupling strip At least one of the conductive layers of a substrate has a lateral width that varies along the length of the conductive layer.

[0300] Embodiment 62 is the system of embodiment 61, wherein the lateral width of the conductive layer has a maximum width and a minimum width. The maximum width varies between 1.5 and 100 times the minimum width.

[0301] Embodiment 63 is the system of any of embodiments 49 to 62, wherein the coupling strip At least one of the conductive layers of the group includes a plurality of segments, and each pair of the segments One or more circuit elements are coupled between the

[0302] Embodiment 64 is the system of embodiment 63, wherein one or more circuit elements are condensed. This includes samsa.

[0303] Embodiment 65 is the system of any of embodiments 49 to 64, wherein the coupling strip At least one of the conductive layers of the substrate has a thickness that varies along the length of the conductive layer.

[0304] Embodiment 66 is the system of any of embodiments 49 to 65, wherein the bulk conductive material The material is coupled with each of the coupling strips to form a second system for the power line. A bond layer is formed.

[0305] Embodiment 67 is the system of any of embodiments 51 to 53, further comprising the conductive layer and Each of the conductive shield layers is made of at least one of copper, silver, or aluminum. Includes.

[0306] Embodiment 68 is the system of any of embodiments 49 to 67, wherein the conductive layer is titanium. Includes

[0307] An embodiment 69 is the system of any one of embodiments 51 to 53, wherein the conductive seal The shield layer includes at least one of copper foil, aluminum foil, or braided shielding material.

[0308] Embodiment 70 is the system of any of embodiments 49 to 69, wherein each coupling strip each of the coupling strips includes a first end and a terminal end, the conductive layer of each of the coupling strips being At least one of the coupling strips is coupled to the power control system and is connected to the conductor at the termination. The conductive layer includes a conductive path coupled between the conductive layer and the bulk conductive material.

[0309] Embodiment 71 is the system of any of embodiments 49 to 70, wherein each coupling strip each of the coupling strips includes a first end and a terminal end, the conductive layer of each of the coupling strips being a power control system, wherein at least one of the coupling strips is coupled to the power control system at the termination; An open circuit between the conductive layer and the bulk conductive material is included.

[0310] Embodiment 72 is the system of any of embodiments 49 to 71, wherein each coupling strip each of the coupling strips includes a first end and a terminal end, the conductive layer of each of the coupling strips being a power control system, wherein at least one of the coupling strips is coupled to the power control system at the termination; a circuit element coupled between a conductive layer and the bulk conductive material, the circuit element comprising: The resistor may include at least one of a capacitor, an inductor, or a resistor.

[0311] Embodiment 73 is the system of any of embodiments 49 to 72, wherein each coupling strip each of the coupling strips includes a first end and a terminal end, the conductive layer of each of the coupling strips being a first coupling strip of each adjacent pair of coupling strips coupled to the power control system; , each pair of adjacent conductive layers includes alternating breaks between the conductive layer and the bulk conductive material at the terminations. a second one of the bonding strips connecting the conductive layer and the bulk conductive material at the termination; The conductive path between the material is alternating.

[0312] Embodiment 74 is the system of embodiment 73, wherein the power control system is providing a current to a first coupling strip of each adjacent pair and and configured to alternately provide current to the second coupling strip of the trip. do.

[0313] Embodiment 75 is the system of any of embodiments 49 to 74, wherein each coupling strip each of the coupling strips includes a first end and a terminal end, the conductive layer of each of the coupling strips being a first coupling strip of each adjacent pair coupled to the power control system; and at the termination, alternating with a capacitor coupled between the conductive layer and an electrical ground at the termination. The second connecting strip of each adjacent pair of connecting strips is connected to the first end of the first connecting strip. The conductive layer alternately includes an inductor coupled between the conductive layer and the bulk conductive material.

[0314] Embodiment 76 is the system of embodiment 75, wherein the power control system is supplying a current to a first coupling strip of each pair of coupling strips and and configured to alternately supply current to the second coupling strip of each pair of coupling strips. It has been made.

[0315] Embodiment 77 is the system of any of embodiments 49 to 76, wherein each coupling strip a first end and a termination, the conductive layer of each coupling strip being connected to the power supply at the first end; At least one of the coupling strips is electrically connected at the termination. Includes a conductive path to earth.

[0316] Embodiment 78 is the system of embodiment 77, wherein the electrical ground is connected to the conductive bulk. Including materials.

[0317] Embodiment 79 is the system of embodiment 77, wherein the electrical ground is The conductive shield layer includes two bonding strips.

[0318] Embodiment 80 is the system of any of embodiments 49 to 79, wherein each coupling strip each of the coupling strips includes a first end and a terminal end, the conductive layer of each of the coupling strips being a power control system, wherein at least one of the coupling strips is coupled to the power control system at the termination; This includes an open circuit between the conductive layer and the electrical ground.

[0319] Embodiment 81 is the system of embodiment 80, wherein the electrical ground is connected to the conductive valve. Contains acrylic materials.

[0320] Embodiment 82 is the system of embodiment 80, wherein the electrical ground is The conductive shield layer includes one bonding strip.

[0321] Embodiment 83 is the system of embodiments 49 to 80, wherein each coupling strip has a first end. and a termination, the conductive layer of each coupling strip being connected to the power control system at the first end. at least one of said coupling strips is electrically connected to said conductive layer at said termination; and a circuit element coupled between the power supply and an electrical ground, the circuit element including a capacitor, an inductor, , or a resistor.

[0322] Embodiment 84 is the system of embodiment 71, wherein the electrical ground is connected to the conductive bulk. Including materials.

[0323] Embodiment 85 is the system of embodiment 71, wherein the electrical ground is The conductive shield layer includes two coupling strips.

[0324] Embodiment 86 is the system of embodiments 49 to 85, wherein each coupling strip has a first end. and a termination, the conductive layer of each coupling strip being connected to the power control system at the first end. a first connecting strip of each adjacent pair of connecting strips at said end The first pair of adjacent coupling strips includes alternating breaks between the conductive layer and electrical ground. Two coupling strips are coupled between the conductive layer and the electrical ground at the terminations. Includes alternating paths.

[0325]

[0046] Embodiment 87 is the system of embodiment 87, wherein the power control system is providing a current to a first coupling strip of each pair of adjacent coupling strips; The second coupling strip of each pair of coupling strips is alternately provided with a current. It is structured as follows:

[0326] Embodiment 88 is the system of any of embodiments 49 to 87, wherein each coupling strip each of the coupling strips includes a first end and a terminal end, the conductive layer of each of the coupling strips being a first coupling strip of each adjacent pair of coupling strips coupled to the power control system; , and a capacitor coupled between the conductive layer and electrical ground at the termination, A second bonding strip of each pair of bonding strips is connected to the conductive layer at the termination. The inductor is coupled between the input and output terminals and a ground.

[0327] Embodiment 89 is the system of embodiment 88, wherein the electrical ground is connected to the conductive bulk. Including materials.

[0328] Embodiment 90 is the system of embodiment 88, wherein the electrical ground is the first and second The conductive shield layer of each of the two bonding strips.

[0329] An embodiment 91 is the system of embodiment 88, wherein the power control system is providing a current to a first coupling strip of each pair of adjacent coupling strips; The second coupling strip of each pair of coupling strips is alternately provided with a current. It is structured as follows:

[0330] Embodiment 92 is the system of any of embodiments 51 to 53, wherein each coupling strip each of the coupling strips includes a first end and a terminal end, the conductive layer of each of the coupling strips being a power control system, each coupling strip connecting the conductive layer and the valve at the termination; a switch coupled between the conductive material and one or both of the conductive shield layers; and when in a first state, the switch is coupled to the conductive layer and the bulk conductive material or the a conductive shield layer and an open circuit formed between the switch and the conductive shield layer when in a second state; and said electrical ground.

[0331] Embodiment 93 is the system of embodiment 92, wherein the electrical ground is the conductive bulk material. Fees included.

[0332] Embodiment 94 is the system of embodiment 92, wherein the electrical ground is connected to the first and The second bonding strips each include a conductive shield layer.

[0333] An embodiment 95 is the system of any one of embodiments 49 to 94, wherein the two or more results The composite strips are electrically coupled to each other in parallel.

[0334] A 96th embodiment is the system of any one of the 49th to 95th embodiments, wherein the two or more results The composite strips are electrically coupled to each other in series.

[0335] An embodiment 97 is a system according to any one of embodiments 49 to 96, wherein the structure is an aircraft. This includes the skin of an aircraft, a wind turbine blade, the roof of a building, or a railroad track.

[0336]

[00136] Embodiment 98 is a method of installing a bulk media heating system, the method comprising: a first dielectric layer, a conductive layer overlapping the first dielectric layer, and a conductive layer overlapping the conductive layer. a multi-layer structure including a shield and a second dielectric layer between the conductive layer and the conductive shield layer. obtaining a plurality of bonded strips, each of the bonded strips being bonded to a bulk medium; the first dielectric layer of each of the coupling strips being spaced apart from one another on the surface of the and mounting the conductive layer between the conductive layer and the conductive medium. The conductive layer is coupled to a power control system configured to supply electrical current to the coupling strips. and b. combining the first and second electrodes.

[0337] Example 99 is the method of example 98, wherein the first dielectric layer comprises a double-sided adhesive. The step of attaching each bonding strip to the surface of the bulk medium comprises the steps of: The liner is removed from the double-sided adhesive to expose the adhesive surface, and the adhesive surface is then exposed to a bulk medium. This involves adhering to a body surface.

[0338] Embodiment 100 is the method of any of embodiments 98 or 99, wherein each bond strip The step of attaching the strip to the surface of the bulk medium includes attaching the strip to the surface of the bulk medium for each bonding strip. Applying a top layer of adhesive onto the bonding strip, the top layer of adhesive extending across the width of the bonding strip. and wherein side edges of the adhesive top layer contact portions of the bulk media on either side of the bonding strip. This includes bonding and gluing.

[0339] Embodiment 101 is the method of any of embodiments 98-100, wherein each bonding strip The step of attaching the bonding strip to the surface of the bulk medium comprises applying an adhesive to each bonding strip. a surface of the bulk medium and bonding the first dielectric layer of the bonding strip to the adhesive. This includes wearing the

[0340] Embodiment 102 is the method of any of embodiments 98 to 101, wherein the bulk medium , the skin of an aircraft, a wind turbine blade, the roof of a building, or a railroad track.

[0341]

[0031] Embodiment 103 is a system for heating a bulk medium, comprising spaced apart heating elements. Two or more electrodes coupled to the bulk medium and a power control system coupled to the electrodes. the power control system shapes a current density along a current path between the electrodes; This creates a large resistance to DC current along the current path in the bulk medium, which is greater than the resistance of the bulk medium to DC current. a power control circuit configured to control the power supply to generate a power supply voltage for generating ... The control system regulates the current density within the bulk medium depth by adjusting the skin depth of the current. and the power control system adjusts the current path by adjusting the proximity effect of the current. Shapes the transverse current density.

[0342] Embodiment 104 is the system of embodiment 103, wherein the bulk medium is a part of an aircraft. It is.

[0343] Embodiment 105 is the system of any of embodiments 103 or 104, wherein the The vehicle is part of an aircraft wing, part of an aircraft tail, or part of an aircraft fuselage. One or more of the following:

[0344] An embodiment 106 is a system according to any one of embodiments 103 to 105, the upper electrode is a first set of two or more electrodes, and the system is a second set of two or more electrodes coupled to said power control system; is coupled to two or more electrodes of the second set and two or more electrodes of the first set and configured to alternately supply power to two or more electrodes of the second set.

[0345] Embodiment 107 is the system of any of embodiments 103 to 106, wherein the bulk the medium comprises aluminum or a carbon fiber composite, and the two or more electrodes are aluminum; Contains silver or copper.

[0346] An embodiment 108 is a system according to any one of embodiments 103 to 107, The upper electrode is in contact with the bulk medium in a manner to reduce contact resistance between the electrode and the bulk medium. are bound by law.

[0347] Embodiment 109 is the system of embodiment 108, wherein the conductive material is one of the two or more electrodes. and the bulk medium.

[0348] An embodiment 110 is a system according to any one of embodiments 103 to 190, The control system generates currents in the bulk medium at AC frequencies above 1 kHz. It is configured to adjust the skin depth of the current.

[0349] Embodiment 111 is the system of embodiment 110, wherein the AC frequency is 100 kHz to 4 It is 50MHz.

[0350] An embodiment 112 is the system of any one of embodiments 103 to 111, wherein the current The proximity effect causes a second current path to extend along a portion of the current path close to the surface of the bulk medium. The adjustment is made by placing the

[0351] Embodiment 113 is the system of embodiment 112, wherein at least one of the second current paths The most part is located within 10 cm of the surface of the bulk medium.

[0352] Embodiment 114 is the system of embodiment 112, wherein the second current path is A cable completing a closed circuit including one or more electrodes and said power control system.

[0353] An embodiment 115 is a system according to any one of embodiments 103 to 114, The power control system is configured to adjust the output impedance of the power control system. Includes the Impedance Adjustment Network (IAN).

[0354] Embodiment 116 is the system of embodiment 115, wherein the IAN is Adjust the output impedance of the power control system to match the impedance of the It is structured as follows:

[0355] An embodiment 117 is a system according to any one of embodiments 103 to 116, A power control system converts power from a power source into a suitable AC frequency for use by said power control system. The signal conversion circuit is configured to convert the signal into a number and a voltage.

[0356] An embodiment 118 is a system according to any one of embodiments 103 to 117, a control system including a controller configured to control operation of the power control system; I am.

[0357] An embodiment 119 is the system of any one of embodiments 103 to 118, A control system uses the proximity effect of the current to extend the total length of the current path between the electrodes. This forms the route of the current path between the electrodes.

[0358] An embodiment 120 is a system according to any one of embodiments 103 to 119, a control system for controlling the current flow by disposing a second current path proximate to a surface of the bulk medium; A route of a current path between the electrodes is formed, and the second current path is a route of a current path between the electrodes. are arranged according to the desired route.

[0359] The embodiment 121 includes two or more spaced apart electrodes coupled to a bulk medium. a current path through the bulk medium between the electrodes and coupled to the electrodes; A power supply configured to generate an AC current signal at a frequency greater than z and less than 300 GHz. A control system and a current path through the bulk medium adjacent to the surface of the bulk medium. and a second current path disposed in such a manner.

[0360] Embodiment 122 is an aircraft de-icing and anti-icing system, comprising: and two or more electrodes coupled to a portion of an aircraft; and a power control system coupled to the electrodes. and a power control system for controlling a current path through the portion of the aircraft between the electrodes. By generating an AC current signal at a frequency of 1MHz to 50MHz, The number of current paths is adjusted to adjust the skin depth of the current along the current path, thereby adjusting the density of the current in a first direction. and forming a current path through the portion of the aircraft along at least a portion of the current path. and providing a second current path disposed within 10 cm of the surface of the aircraft portion. Thus, the proximity of the second current path to the surface of the portion of the aircraft is such that the current path By adjusting the proximity effect of the current along a portion of the path, the density of the current is changed in a second different direction. By forming the electrodes in a shape similar to that shown in FIG. 1, a current density is created along a current path through the portion of the aircraft between the electrodes. The airfoil is configured to heat the portion of the aircraft by shaping a temperature.

Claims

1. 1. A system for heating an aircraft skin, the system comprising: two or more coupling strips attached to a skin of the aircraft in spaced relation to one another, each coupling strip of the plurality of coupling strips including an input end coupled to a respective connector, a termination end, and a multi-layer structure extending along a skin surface of the aircraft; The multilayer structure comprises: a first dielectric layer on the skin of the aircraft; a conductive layer on the first dielectric layer; and a second dielectric layer on the conductive layer; and a conductive shield layer on the second dielectric layer; and Including, at the input end of each of the plurality of coupling strips, the conductive layer is connected to a first electrical supply terminal of the respective connector, and at the termination end of the coupling strip, the conductive layer is an open circuit; and at the input end of each of the plurality of coupling strips, a second electrical supply terminal of the respective connector is connected to the skin of the aircraft. system.

2. the two or more connecting strips are oriented spanwise along a wing of the aircraft; The system of claim 1 .

3. a width of each bonding strip is less than the spacing between the bonding strips, and a length of each bonding strip is greater than the spacing between the bonding strips; The system of claim 1 .

4. the conductive layer has a lower electrical resistance than the skin of the aircraft; The system of claim 1 .

5. the conductive layer comprises copper; the aircraft skin comprises a metal having an electrical resistivity greater than copper; The system of claim 4.

6. a power source configured to supply current to the plurality of coupling strips at an AC frequency between 1 kHz and 450 MHz; Further equipped with the conductive layer in each of the two or more coupling strips is electrically connected to the power source at the input end opposite the termination end. The system of claim 1 .

7. the conductive layer of at least one of the plurality of bonding strips is folded one or more times such that segments of the conductive layer lie alongside one another; The system of claim 1 .

8. a power control system electrically connected to the conductive layer via the first electrical supply terminal at the input end of each coupling strip of the plurality of coupling strips and electrically connected to an exterior skin of the aircraft via the second electrical supply terminal at the input end of each coupling strip; Further equipped with the power control system is configured to supply AC current to the plurality of coupling strips and to the aircraft skin. The system of claim 1 .

9. during operation, the current flow at the terminations of the plurality of coupling strips is zero; The system of claim 8.

10. 1. A system for heating an aircraft skin, the system comprising: two or more bonding strips attached to a skin of the aircraft in spaced relation to one another, each bonding strip of the plurality of bonding strips including an input end, a terminal end, and a multi-layer structure extending along a skin surface of the aircraft; The multilayer structure comprises: a first dielectric layer on the skin of the aircraft; a conductive layer on the first dielectric layer; a second dielectric layer on the conductive layer; and a conductive shield layer on the second dielectric layer; and Including, At the termination of the coupling strip, the conductive layer is an open circuit; a power control system electrically connected to the conductive layer at the input end of each coupling strip of the plurality of coupling strips and electrically connected to an exterior skin of the aircraft at the input end of each coupling strip; Further equipped with the power control system is configured to supply AC current to the plurality of coupling strips and to a skin of the aircraft; the power control system is coupled to a first of the two or more coupling strips by a connector including an impedance matching element therein; system.

11. the power control system is coupled to a plurality of connectors; Each connector is a first terminal connected to the conductive layer at the input end of each of the plurality of coupling strips; a second terminal connected to the skin of the aircraft at the input end of each of the plurality of coupling strips; Equipped with At least one connector of the plurality of connectors is a first coaxial input connector electrically connected to the power control system; a second coaxial input connector adapted to be connected to another connector of the plurality of connectors; a first wiring providing electrical connections between a terminal of the first coaxial input connector, a terminal of the second coaxial input connector, and the first terminal connected to the conductive layer at the input end of each coupling strip of the plurality of coupling strips; a second wiring providing an electrical connection between the power control system and the second terminal connected to an exterior skin of the aircraft at the input end of each of the plurality of coupling strips; a resistive element connected between the first wiring and the second wiring; having The system of claim 10.

12. the power control system is coupled to a plurality of connectors; Each connector is a first terminal connected to the conductive layer at the input end of each of the plurality of coupling strips; a second terminal connected to the skin of the aircraft at the input end of each of the plurality of coupling strips; Equipped with At least one connector of the plurality of connectors is a first coaxial input connector electrically connected to the power control system; a first wiring providing an electrical connection between a terminal of the first coaxial input connector and the first terminal connected to the conductive layer at the input end of each coupling strip of the plurality of coupling strips; a second wiring providing an electrical connection between the power control system and the second terminal connected to an exterior skin of the aircraft at the input end of each of the plurality of coupling strips; a resistive element connected between the first wiring and the second wiring; having The system of claim 10.

13. Within each coupling strip, the width of the conductive shield layer is greater than the width of the conductive layer. The system of claim 1 .

14. each of the plurality of connecting strips extends from a leading end of the wing to a trailing end of the wing; The system of claim 1 .

15. the plurality of connecting strips are spaced apart along a direction from the wing root to the wing tip; The system of claim 14.

Images