Electronic devices

Abstract

This electronic device comprises: a first electronic component including a first main part; a second electronic component including a second main part; a mounting substrate having a mounting surface; and a heat dissipation member having an attachment surface. The mounting surface and the attachment surface face each other in a z direction. The first main part and the second main part are disposed between the mounting substrate and the heat dissipation member in the z direction and are aligned in an x direction. The first main part has: a first main surface that faces the attachment surface; and a first rear surface that faces the mounting surface. The second main part has: a second main surface that faces the attachment surface; and a second rear surface that faces the mounting surface. The size of the second main part is smaller in the z direction than the size of the first main part in the z direction, the first main surface and the second main surface overlap in the x direction, and a gap is present between the second rear surface and the mounting surface.

Description

[Technical field]

[0001] The present disclosure relates to electronic devices. [Background technology]

[0002] Conventionally, electronic components called IPMs (Intelligent Power Modules) have been known. Patent Document 1 discloses an example of a conventional IPM. The IPM described in Patent Document 1 includes a plurality of semiconductor elements, a control element, a sealing material, and a plurality of terminals. Each of the plurality of semiconductor elements is a power semiconductor chip such as an IGBT (Insulated Gate Bipolar Transistor) or a MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor). The control element is an LSI chip such as a control IC, and controls the driving of the plurality of semiconductor elements. The sealing material covers the plurality of semiconductor elements, the control element, and the plurality of terminals. The sealing material is made of an insulating resin material such as epoxy resin. Each of the plurality of terminals is partially exposed from the sealing material and supported by the sealing material. Each of the plurality of terminals is conductive to either the plurality of semiconductor elements or the control element inside the sealing material.

[0003] When the IPM is energized, each semiconductor element generates heat. This heat can cause the operation of the semiconductor elements to become unstable, so there is a demand for improving the heat dissipation properties of the semiconductor elements. This is a problem that is not limited to IPMs, but is common to a variety of electronic components. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2014-90006 A Summary of the Invention [Problem to be solved by the invention]

[0005] The present disclosure has been made in consideration of the above circumstances, and an object of the present disclosure is to provide an electronic device in which the heat dissipation properties of electronic components are improved. [Means for solving the problem]

[0006] The electronic device provided by the present disclosure includes a first electronic component including a first body portion and a plurality of first terminals exposed from the first body portion, a second electronic component including a second body portion and a plurality of second terminals exposed from the second body portion, a mounting board having a mounting surface on which the first electronic component and the second electronic component are arranged, and a heat dissipation member having an attachment surface on which the first electronic component and the second electronic component are attached. The mounting surface and the attachment surface face each other in the thickness direction, and the first body portion and the second body portion are disposed between the mounting board and the heat dissipation member in the thickness direction, and are aligned in a first direction perpendicular to the thickness direction. The first body portion has a first main surface facing the attachment surface and a first back surface facing the mounting surface. The second body portion has a second main surface facing the attachment surface and a second back surface facing the mounting surface. The dimension of the second body portion in the thickness direction is smaller than the dimension of the first body portion in the thickness direction. The first main surface and the second main surface overlap when viewed in the first direction. There is a gap between the second back surface and the mounting surface. Effect of the Invention

[0007] According to the electronic device of the present disclosure, it is possible to improve the heat dissipation properties of the electronic components (the first electronic component and the second electronic component). [Brief description of the drawings]

[0008] [Figure 1] FIG. 1 is a plan view showing an electronic device according to a first embodiment. [Diagram 2] FIG. 1 is a front view showing an electronic device according to a first embodiment. [Diagram 3] FIG. 2 is a rear view showing the electronic device according to the first embodiment. [Figure 4] 1 is a side view (right side) showing an electronic device according to a first embodiment. [Diagram 5] FIG. 2 is a diagram illustrating an example of a circuit configuration of a first electronic component. [Figure 6] FIG. 4 is a diagram showing an example of a circuit configuration of a second electronic component. [Figure 7] FIG. 11 is a plan view showing an electronic device according to a second embodiment. [Figure 8] FIG. 11 is a front view showing an electronic device according to a second embodiment. [Figure 9] FIG. 11 is a rear view showing the electronic device according to the second embodiment. [Figure 10] 13 is a side view (right side) showing an electronic device according to a second embodiment. FIG. [Figure 11] FIG. 13 is a plan view showing an electronic device according to a third embodiment. [Figure 12] FIG. 11 is a front view showing an electronic device according to a third embodiment. [Figure 13] FIG. 11 is a rear view showing the electronic device according to the third embodiment. [Figure 14] 13 is a side view (right side) showing an electronic device according to a third embodiment. FIG. [Figure 15] 13 is a side view (right side) showing an electronic device according to a fourth embodiment. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] Preferred embodiments of the electronic device of the present disclosure will be described below with reference to the drawings.

[0010] First Embodiment 1 to 6 show an electronic device A1 according to a first embodiment. The electronic device A1 includes a first electronic component 1, a second electronic component 2, a mounting substrate 3, a heat dissipation member 4, and a plurality of conductive bonding materials 5.

[0011] FIG. 1 is a plan view showing the electronic device A1. In FIG. 1, the heat dissipation member 4 is indicated by an imaginary line (two-dot chain line). FIG. 2 is a front view showing the electronic device A1. FIG. 3 is a rear view showing the electronic device A1. FIG. 4 is a side view (right side view) showing the electronic device A1. FIG. 5 is an example of a circuit diagram of the first electronic component 1. FIG. 6 is an example of a circuit diagram of the second electronic component 2.

[0012] For ease of explanation, three mutually orthogonal directions are defined as the x-direction, y-direction, and z-direction. The z-direction is the thickness direction of the electronic device A1. The x-direction is the left-right direction in the plan view of the electronic device A1 (see FIG. 1). The y-direction is the up-down direction in the plan view of the electronic device A1 (see FIG. 1). In the following explanation, one side of the z-direction (upward in FIG. 4) may be referred to as the top, and the other side of the z-direction (downward in FIG. 4) may be referred to as the bottom. In the following explanation, "plan view" refers to the view in the z-direction. The z-direction is an example of the "thickness direction," and the x-direction is an example of the "first direction."

[0013] The first electronic component 1 and the second electronic component 2 are each, for example, an IPM. IPM is an abbreviation for intelligent power module, in which a power semiconductor element and a control element for controlling the power semiconductor element are incorporated in one package. The first electronic component 1 and the second electronic component 2 are used for applications such as power supply control for inverter devices and motor control devices. The first electronic component 1 and the second electronic component 2 are mounted on a mounting board 3. The first electronic component 1 and the second electronic component 2 are not limited to IPMs, and may be discrete components or power modules without a control element incorporated.

[0014] The first electronic component 1 includes a plurality of first semiconductor elements Q1, a first control element M1, and a plurality of first terminals T11, T12, as shown in Fig. 5. Note that the circuit diagram shown in Fig. 5 is an example and can be appropriately changed depending on the first electronic component 1 to be used.

[0015] Each of the multiple first semiconductor elements Q1 is a power semiconductor chip such as an IGBT, a MOSFET, or a diode. In the example shown in FIG. 5, the first electronic component 1 includes four first semiconductor elements Q1, and each of the four first semiconductor elements Q1 is configured as an n-channel MOSFET. Two of the four first semiconductor elements Q1 are connected in series to form one leg, and the remaining two are connected in series to form another leg. In this manner, the first electronic component 1 includes two legs. The connection of the four first semiconductor elements Q1 is not limited to the example shown in FIG. 5, and for example, the four first semiconductor elements Q1 may be fully bridge-connected, or the four first semiconductor elements Q1 may not be connected to each other. The number of the first semiconductor elements Q1 is not limited to the above example. For example, the first electronic component 1 may include one first semiconductor element Q1, or may include six first semiconductor elements Q1 connected in a three-phase bridge.

[0016] The first control element M1 is, for example, an LSI chip such as a control IC. The first control element M1 controls the driving of a plurality of first semiconductor elements Q1. Specifically, the first control element M1 controls the driving (switching operation) of each first semiconductor element Q1 by inputting a driving signal (for example, a gate voltage) to each first semiconductor element Q1. The first control element M1 includes a drive circuit. In the example shown in FIG. 5, one first control element M1 controls the driving of four first semiconductor elements Q1, but this is not limited thereto. For example, a first control element M1 may be provided for every two legs, or a first control element M1 may be provided for every four first semiconductor elements Q1.

[0017] The first terminals T11 and T12 are external terminals in the first electronic component 1. As shown in FIG. 5, the first terminals T11 are connected to the first semiconductor elements Q1. The first terminals T11 include a pair of input terminals T11a and T11b, an output terminal T11c, and a detection terminal T11d for the two first semiconductor elements Q1 connected in series. A power supply voltage is applied to the pair of input terminals T11a and T11b. The input terminal T11a is a P terminal, and the input terminal T11b is an N terminal. The output terminal T11c outputs a voltage input from the pair of input terminals T11a and T11b and converted by the switching operations of the two first semiconductor elements Q1 in each leg. The output terminal T11c is connected to a connection point of the two first semiconductor elements Q1 in each leg. The detection terminal T11d is for detecting the output voltage and is connected to the connection point of the two first semiconductor elements Q1 in each leg via, for example, a shunt resistor R1. The shunt resistor R1 may be disposed outside the first electronic component 1 without being built into the first electronic component 1. As shown in Fig. 5, the multiple first terminals T12 are each connected to the first control element M1. The multiple first terminals T12 include one to which various control signals for controlling the first electronic component 1 are input or output and one to which the operating voltage of the first control element M1 is input.

[0018] The first electronic component 1 has a module configuration including a first main body portion 10 and a plurality of first terminals 15, as shown in FIGS.

[0019] The first body portion 10 includes a plurality of first semiconductor elements Q1, a first control element M1, a first sealing material 11 and a first support substrate 12.

[0020] The first sealing material 11 is a package that covers the first semiconductor elements Q1 and the first control element M1 and protects them from light, heat, moisture, dust, physical impact, and the like. The first sealing material 11 is made of, for example, an insulating resin material. An example of this resin material is epoxy resin. As shown in FIG. 1, the first sealing material 11 is, for example, rectangular in plan view.

[0021] As shown in FIGS. 1 to 4, the first sealing material 11 has a main surface 111, a back surface 112, and multiple side surfaces 113 and 114. The main surface 111 and the back surface 112 are spaced apart in the z direction and face opposite sides to each other in the z direction. In the z direction, the main surface 111 faces the heat dissipation member 4, and the back surface 112 faces the mounting board 3. The main surface 111 and the back surface 112 are both flat. The multiple side surfaces 113 and 114 are sandwiched between the main surface 111 and the back surface 112 in the z direction and connected to the main surface 111 and the back surface 112. The two side surfaces 113 are spaced apart in the x direction and face opposite sides to each other in the x direction. The two side surfaces 114 are spaced apart in the y direction and face opposite sides to each other in the y direction. The main surface 111 is an example of a "first sealing surface."

[0022] The first support substrate 12 supports at least the first semiconductor elements Q1 inside the first sealing material 11. At least a portion of the first support substrate 12 is covered by the first sealing material 11. The first support substrate 12 is provided to quickly release heat generated in the first semiconductor elements Q1 to the outside of the first electronic component 1. The first support substrate 12 is made of a material having excellent thermal conductivity (for example, ceramic), but is not limited thereto. However, the higher the thermal conductivity of the material constituting the first support substrate 12, the better. However, if the thermal expansion coefficient of the material differs greatly from that of the first sealing material 11, there is a risk of problems such as peeling between the first support substrate 12 and the first sealing material 11. Therefore, it is preferable that the material constituting the first support substrate 12 has a thermal conductivity higher than that of the material constituting the first sealing material 11 and a thermal expansion coefficient close to that of the first sealing material 11. The first main body portion 10 does not need to include the first support substrate 12.

[0023] As shown in FIGS. 2 to 4, the first support substrate 12 has a first exposed surface 121 and a first support surface 122 spaced apart in the z direction. The first exposed surface 121 and the first support surface 122 are each flat. The first exposed surface 121 faces the z direction (upward) and faces the heat dissipation member 4 (an attachment surface 41 described later). The first exposed surface 121 is exposed from the main surface 111 of the first sealing material 11. As shown in FIG. 1, the main surface 111 has a frame shape surrounding the first exposed surface 121 in a plan view. In the example shown in FIGS. 2 to 4, the first exposed surface 121 is flush with the main surface 111 (or approximately flush with the main surface 111; the same applies below), but may be disposed above the main surface 111. The first support substrate 12 may not have the first exposed surface 121. That is, the first support substrate 12 may be completely covered by the first sealing material 11. The first support surface 122 faces the z direction (downward) and faces the mounting board 3 (a mounting surface 31 described below). On the first support surface 122, a plurality of first semiconductor elements Q1 are mounted.

[0024] The first main body 10 has a first main surface and a first back surface. The first main surface is located at the uppermost position in the first main body 10 and faces the heat dissipation member 4 (the mounting surface 41 described later). In this embodiment, the first main surface is composed of the main surface 111 (the first sealing material 11) and the first exposed surface 121 (the first support substrate 12). In a configuration different from this embodiment, in which the first support substrate 12 is not exposed from the first sealing material 11, or in which the first main body 10 does not include the first support substrate 12, the first main surface is composed of the main surface 111 (the first sealing material 11). In addition, in a case in which the first exposed surface 121 is located above the main surface 111, the first main surface is composed of the first exposed surface 121. The first back surface is located at the lowermost position in the first main body 10 and faces the mounting substrate 3 (the mounting surface 31 described later). In this embodiment, the first back surface is formed by back surface 112 (first sealing material 11).

[0025] Each of the multiple first terminals 15 is partially covered by the first sealing material 11 and partially exposed from the first sealing material 11. Each of the multiple first terminals 15 is electrically connected to the multiple first semiconductor elements Q1 or the first control element M1 inside the first sealing material 11. The multiple first terminals 15 correspond to the multiple first terminals T11, T12 in the circuit configuration of the first electronic component 1 (see FIG. 5).

[0026] The material of each of the first terminals 15 is not particularly limited, but may be, for example, copper (Cu), aluminum, iron (Fe), oxygen-free copper, or an alloy thereof (for example, a Cu-Sn alloy, a Cu-Zr alloy, a Cu-Fe alloy, etc.). Each of the first terminals 15 may be plated with nickel (Ni).

[0027] As shown in Figs. 1 to 3, each of the multiple first terminals 15 protrudes from one of the two side surfaces 114. Alternatively, each of the multiple first terminals 15 may protrude from one of the two side surfaces 113. Also, each of the multiple first terminals 15 may protrude from the rear surface 112. The multiple first terminals 15 are configured as an insertion mounting type. Each of the first terminals 15 is partially bent and includes a portion extending from one of the two side surfaces 114 along the y direction and a portion extending along the z direction.

[0028] The multiple first terminals 15 include multiple first power terminals 151 and multiple first control terminals 152. The multiple first power terminals 151 are electrically connected to the multiple first semiconductor elements Q1 inside the first encapsulant 11. The multiple first power terminals 151 correspond to the multiple first terminals T11 in the circuit configuration of the first electronic component 1 (see FIG. 5). The multiple first control terminals 152 are electrically connected to the first control element M1 inside the first encapsulant 11. The multiple first control terminals 152 correspond to the multiple first terminals T12 in the circuit configuration of the first electronic component 1 (see FIG. 5).

[0029] The second electronic component 2 includes a plurality of second semiconductor elements Q2, a second control element M2, and a plurality of second terminals T21, T22, as shown in Fig. 6. Note that the circuit diagram shown in Fig. 6 is an example and can be appropriately changed depending on the second electronic component 2 to be used.

[0030] Each of the second semiconductor elements Q2 is a power semiconductor chip such as an IGBT, a MOSFET, or a diode. The number of the second semiconductor elements Q2 is smaller than the number of the first semiconductor elements Q1. In the example shown in FIG. 6, the second electronic component 2 includes two second semiconductor elements Q2, and each of the two second semiconductor elements Q2 is configured as an n-channel MOSFET. The two second semiconductor elements Q2 are connected in series to form a leg. The connection of the two second semiconductor elements Q2 is not limited to the example shown in FIG. 6, and for example, the two second semiconductor elements Q2 may not be connected to each other. The number of the second semiconductor elements Q2 is not limited to the above example. For example, the second electronic component 2 may be configured to include one second semiconductor element Q2, four second semiconductor elements Q2 connected in a full bridge, or six second semiconductor elements Q2 connected in a three-phase bridge.

[0031] The second control element M2 is, for example, an LSI chip such as a control IC. The second control element M2 controls the driving of the multiple second semiconductor elements Q2. Specifically, the second control element M2 controls the driving (switching operation) of each second semiconductor element Q2 by inputting a driving signal (for example, a gate voltage) to each second semiconductor element Q2. The second control element M2 includes a drive circuit. In the example shown in FIG. 6, one second control element M2 controls the driving of two second semiconductor elements Q2, but this is not limited thereto, and a second control element M2 may be provided for each two second semiconductor elements Q2.

[0032] The second terminals T21 and T22 are external terminals in the second electronic component 2. As shown in FIG. 6, the second terminals T21 are connected to the second semiconductor elements Q2. The second terminals T21 include a pair of input terminals T21a and T21b, an output terminal T21c, and a detection terminal T21d. A power supply voltage is applied to the pair of input terminals T21a and T21b. The input terminal T21a is a P terminal, and the input terminal T21b is an N terminal. The output terminal T21c outputs a voltage input from the pair of input terminals T21a and T21b and converted by the switching operation of each second semiconductor element Q2. The output terminal T21c is connected to a connection point between the two second semiconductor elements Q2. The detection terminal T21d is for detecting the output voltage, and is connected to a connection point between the two second semiconductor elements Q2 via, for example, a shunt resistor R2. The shunt resistor R2 may be disposed outside the second electronic component 2 without being built into the second electronic component 2. As shown in Fig. 6, each of the second terminals T22 is connected to the second control element M2. The second terminals T22 include those to which various control signals for controlling the second electronic component 2 are input or output, and those to which the operating voltage of the second control element M2 is input.

[0033] The second electronic component 2 has a module configuration including a second main body portion 20 and a plurality of second terminals 25, as shown in FIGS.

[0034] The second body portion 20 includes a plurality of second semiconductor elements Q2, a second control element M2, a second sealing material 21, and a second support substrate 22.

[0035] The second sealing material 21 is a package that covers the second semiconductor elements Q2 and the second control element M2 and protects them from light, heat, moisture, dust, physical impact, and the like. The second sealing material 21 is made of, for example, an insulating resin material. One example of this resin material is epoxy resin. The second sealing material 21 is, for example, rectangular in plan view, as shown in FIG. 1.

[0036] As shown in FIGS. 1 to 4, the second sealing material 21 has a main surface 211, a back surface 212, and multiple side surfaces 213 and 214. The main surface 211 and the back surface 212 are spaced apart in the z direction and face opposite directions to each other in the z direction. In the z direction, the main surface 211 faces the heat dissipation member 4, and the back surface 212 faces the mounting board 3. The main surface 211 and the back surface 212 are both flat. The main surface 211 and the main surface 111 (first sealing material 11) are on the same xy plane (plane perpendicular to the z direction). The multiple side surfaces 213 and 214 are sandwiched between the main surface 211 and the back surface 212 in the z direction and are connected to the main surface 211 and the back surface 212. The two side surfaces 213 are spaced apart in the x direction and face opposite directions to each other in the x direction. The two side surfaces 214 are spaced apart in the y direction and face opposite each other in the y direction. The main surface 211 is an example of a "second sealing surface."

[0037] The second support substrate 22 supports at least the second semiconductor elements Q2 inside the second sealing material 21. At least a portion of the second support substrate 22 is covered by the second sealing material 21. The second support substrate 22 is provided to quickly release heat generated in the second semiconductor elements Q2 to the outside of the second electronic component 2. The second support substrate 22 is made of a material having excellent thermal conductivity (for example, ceramic), but is not limited thereto. However, the higher the thermal conductivity of the material constituting the second support substrate 22, the better. However, if the thermal expansion coefficient of the material differs greatly from that of the second sealing material 21, there is a risk of problems such as the second support substrate 22 and the second sealing material 21 peeling off from each other. Therefore, it is preferable that the material constituting the second support substrate 22 has a thermal conductivity higher than that of the material constituting the second sealing material 21 and a thermal expansion coefficient close to that of the second sealing material 21. The second main body portion 20 does not need to include the second support substrate 22.

[0038] As shown in FIGS. 2 to 4, the second support substrate 22 has a second exposed surface 221 and a second support surface 222 spaced apart in the z direction. The second exposed surface 221 and the second support surface 222 are each flat. The second exposed surface 221 faces upward in the z direction and faces the heat dissipation member 4 (the mounting surface 41 described later). The second exposed surface 221 is exposed from the main surface 211 of the second sealing material 21. Therefore, as shown in FIG. 1, the main surface 211 has a frame shape surrounding the second exposed surface 221 in a plan view. In the example shown in FIGS. 2 to 4, the second exposed surface 221 is flush with the main surface 211, but may be disposed above the main surface 211. The second support substrate 22 may not have the second exposed surface 221. In other words, the second support substrate 22 may be completely covered by the second sealing material 21. The second support surface 222 faces downward and faces the mounting board 3 (a mounting surface 31 described below). On the second support surface 222, a plurality of second semiconductor elements Q2 are mounted.

[0039] The second main body 20 has a second main surface and a second back surface. The second main surface is located at the uppermost position in the second main body 20 and faces the heat dissipation member 4 (the mounting surface 41 described later). In this embodiment, the second main surface is composed of the main surface 211 (the second sealing material 21) and the second exposed surface 221 (the second support substrate 22). In a configuration different from this embodiment, in which the second support substrate 22 is not exposed from the second sealing material 21, or in which the second main body 20 does not include the second support substrate 22, the second main surface is composed of the main surface 211 (the second sealing material 21). In addition, in a case in which the second exposed surface 221 is located above the main surface 211, the second main surface is composed of the second exposed surface 221. The second back surface is located at the lowermost position in the second main body 20 and faces the mounting substrate 3 (the mounting surface 31 described later). In this embodiment, the second back surface is formed by the back surface 212 (the second sealing material 21).

[0040] Each of the multiple second terminals 25 is partially covered by the second sealing material 21 and partially exposed from the second sealing material 21. Each of the multiple second terminals 25 is electrically connected to the multiple second semiconductor elements Q2 or the second control element M2 inside the second sealing material 21. The multiple second terminals 25 correspond to the multiple second terminals T21, T22 in the circuit configuration (see FIG. 6).

[0041] The constituent material of the second terminals 25 is not particularly limited, but may be, for example, copper (Cu), aluminum, iron (Fe), oxygen-free copper, or an alloy thereof (for example, a Cu-Sn alloy, a Cu-Zr alloy, a Cu-Fe alloy, etc.). Each second terminal 25 may be plated with nickel (Ni).

[0042] As shown in Figs. 1 to 3, each of the multiple second terminals 25 protrudes from one of the two side surfaces 214. Alternatively, the multiple second terminals 25 may protrude from one of the two side surfaces 213. Also, each of the multiple second terminals 25 may protrude from the rear surface 212. The multiple second terminals 25 are configured as an insertion mounting type. Each second terminal 25 is partially bent and includes a portion extending from one of the two side surfaces 214 along the y direction and a portion extending along the z direction.

[0043] The multiple second terminals 25 include multiple second power terminals 251 and multiple second control terminals 252. The multiple second power terminals 251 are electrically connected to the multiple second semiconductor elements Q2 inside the second sealing material 21. The multiple second power terminals 251 correspond to the multiple second terminals T21 in the circuit configuration of the second electronic component 2 (see FIG. 6). The multiple second control terminals 252 are electrically connected to the second control element M2 inside the second sealing material 21. The multiple second control terminals 252 correspond to the multiple second terminals T22 in the circuit configuration of the second electronic component 2 (see FIG. 6).

[0044] As shown in FIG. 1 to FIG. 3, the second protrusion 253 is formed on the second terminals 25 arranged near the four corners in plan view among the second terminals 25. The second protrusion 253 is a portion protruding in the x direction in each second terminal 25 as shown in FIG. 1 to FIG. 3. The second protrusion 253 is not limited to protruding in the x direction, but may protrude in a direction perpendicular to the z direction. As shown in FIG. 2 and FIG. 3, the second protrusion 253 is disposed between the rear surface 212 and the mounting board 3 (the mounting surface 31 described later). The second protrusion 253 may be formed on at least one of the second terminals 25, and may be formed on all of the second terminals 25, for example. The second protrusion 253 may not be formed on any of the second terminals 25. However, in order to stabilize the posture of the second electronic component 2, it is desirable to provide the second protrusion 253 on at least the second terminals 25 arranged near the four corners in plan view among the second terminals 25.

[0045] The first electronic component 1 and the second electronic component 2 are mounted on the mounting board 3. The mounting board 3 is a circuit board for an electronic device or the like. The mounting board 3 is made of an insulating material, for example a PCB board. A wiring pattern (not shown) is formed on the mounting board 3. The multiple first terminals 15 of the first electronic component 1 and the multiple second terminals 25 of the second electronic component 2 are electrically connected to the wiring pattern formed on the mounting board 3.

[0046] The mounting board 3 has a mounting surface 31 facing one side (upward) in the z direction. The mounting surface 31 is flat. The mounting surface 31 faces the first electronic component 1 and the second electronic component 2, and the first electronic component 1 and the second electronic component 2 are arranged on the mounting surface 31. As shown in FIG. 2 to FIG. 4, the back surface 112 of the first sealing material 11 is in contact with the mounting surface 31, but the back surface 212 of the second sealing material 21 is spaced apart from the mounting surface 31. In the illustrated example, the first electronic component 1 and the second electronic component 2 are arranged in the x direction on the mounting surface 31, but the present disclosure is not limited thereto. For example, the first electronic component 1 and the second electronic component 2 may be arranged along a direction different from the x direction on the mounting surface 31.

[0047] As shown in Figs. 1 to 4, a plurality of through holes 33 are formed in the mounting board 3. Each through hole 33 penetrates the mounting board 3 in the z-direction. Each first terminal 15 of the first electronic component 1 or each second terminal 25 of the second electronic component 2 is inserted into each through hole 33. In Fig. 2, the through holes 33 into which the first power terminal 151 of each first terminal 15 and the second power terminal 251 of each second terminal 25 are inserted are shown by hidden lines (dashed lines). In Fig. 3, the through holes 33 into which the first control terminal 152 of each first terminal 15 and the second control terminal 252 of each second terminal 25 are inserted are shown by hidden lines (dashed lines).

[0048] 2 and 3, when the second terminals 25 are inserted into the through holes 33, the lower edge of each second protrusion 253 abuts against the mounting surface 31. In other words, when each second protrusion 253 is caught on the mounting board 3, the second electronic component 2 is mounted on the mounting board 3 with a gap formed between the rear surface 212 of the second sealing material 21 and the mounting surface 31.

[0049] The heat dissipation member 4 is made of a material having a relatively large thermal conductivity, for example, a metal such as aluminum. The heat dissipation member 4 is attached to the first electronic component 1 and the second electronic component 2. For example, the heat dissipation member 4 is bonded to the first main surface of the first body portion 10 (the main surface 111 of the first sealing material 11 and the first exposed surface 121 of the first support substrate 12) and the second main surface of the second body portion 20 (the main surface 211 of the second sealing material 21 and the second exposed surface 221 of the second support substrate 22) by an adhesive material not shown. The heat dissipation member 4 may be fixed to the mounting substrate 3 by a fixing tool not shown. In this case, the heat dissipation member 4 may be configured to be in direct contact with the first main surface of the first body portion 10 and the second main surface of the second body portion 20 without being bonded to them.

[0050] The heat dissipation member 4 has a mounting surface 41 facing one side (downward) in the z direction. The mounting surface 41 is flat. The mounting surface 41 faces the first electronic component 1 and the second electronic component 2, and the first electronic component 1 and the second electronic component 2 are mounted on the mounting surface 41. As shown in Figs. 2 to 4, the mounting surface 41 contacts the main surface 111 of the first sealing material 11 and the main surface 211 of the second sealing material 21. An adhesive, a heat conductive sheet, or the like may be sandwiched between the mounting surface 41 and the main surface 111 and the main surface 211. The heat dissipation member 4 has pinholder-shaped and bellows-shaped fins (not shown) with plates or rods growing out of them on the upper side (the side facing the opposite side to the mounting surface 41 in the z direction) formed thereon.

[0051] 2 to 4, the multiple conductive bonding materials 5 are formed on a surface of the mounting board 3 facing the opposite side to the mounting surface 31 in the z direction. Each conductive bonding material 5 bonds the first electronic component 1 and the second electronic component 2 to the mounting board 3, and also electrically connects each first terminal 15 of the first electronic component 1 and each second terminal 25 of the second electronic component 2 to the wiring pattern of the mounting board 3. There are no particular limitations on the material of the multiple conductive bonding materials 5, but solder is used, for example.

[0052] In the electronic device A1, the z-direction dimension of the first body portion 10 (first sealing material 11) is different from the z-direction dimension of the second body portion 20 (second sealing material 21). In the electronic device A1, the number of second semiconductor elements Q2 built into the second electronic component 2 is smaller than the number of first semiconductor elements Q1 built into the first electronic component 1, so that the z-direction dimension of the second body portion 20 is smaller than the z-direction dimension of the first body portion 10. The reason for the difference between the z-direction dimension of the first body portion 10 and the z-direction dimension of the second body portion 20 is not limited to the difference between the number of the first semiconductor elements Q1 and the number of the second semiconductor elements Q2. For example, the z-direction dimension of the first body portion 10 and the z-direction dimension of the second body portion 20 may differ due to the difference in package standards adopted by the first electronic component 1 and the second electronic component 2, respectively. Furthermore, due to differences in the sizes of the first semiconductor element Q1 and the second semiconductor element Q2 used in the first electronic component 1 and the second electronic component 2, respectively, the z-direction dimension of the first body portion 10 and the z-direction dimension of the second body portion 20 may differ.

[0053] In the electronic device A1, as shown in FIG. 2 to FIG. 4, the first back surface (back surface 112 of the first sealing material 11) of the first main body portion 10 is in contact with the mounting surface 31, and there is a gap between the second back surface (back surface 212 of the second sealing material 21) of the second main body portion 20 and the mounting surface 31. Therefore, the separation distance T2 between the back surface 212 and the mounting surface 31 in the z direction is larger than the separation distance T1 between the back surface 112 and the mounting surface 31 in the z direction (T1=0 in the illustrated example). The separation distance T2 is appropriately designed according to the difference between the z direction dimension of the first sealing material 11 and the z direction dimension of the second sealing material 21. Specifically, the difference (T2-T1) between the separation distance T2 and the separation distance T1 is designed to be the difference between the z direction dimension of the first main body portion 10 and the z direction dimension of the second main body portion 20.

[0054] The functions and effects of the electronic device A1 according to the first embodiment are as follows.

[0055] The electronic device A1 includes a heat dissipation member 4 attached to the first electronic component 1 and the second electronic component 2. With this configuration, even if the first electronic component 1 and the second electronic component 2 generate heat when the electronic device A1 is energized, the heat is dissipated via the heat dissipation member 4. This enables the electronic device A1 to enhance the heat dissipation properties from the first electronic component 1 and the second electronic component 2.

[0056] In the electronic device A1, a gap is provided between the second rear surface (rear surface 212 of the second sealing material 21) of the second body portion 20 and the mounting surface 31 (mounting substrate 3). As a result, when the z-direction dimension of the second body portion 20 is smaller than the z-direction dimension of the first body portion 10, the first main surface (main surface 111 and first exposed surface 121) of the first body portion 10 and the second main surface (main surface 211 and second exposed surface 221) of the second body portion 20 can be arranged on the same xy plane. In other words, the first main surface of the first body portion 10 and the second main surface of the second body portion 20 can be overlapped when viewed in the x-direction. Unlike the illustrated example, when there is no gap between the second rear surface of the second body portion 20 and the mounting surface 31, a step occurs between the first main surface and the second main surface due to the difference between the z-direction dimension of the first body portion 10 and the z-direction dimension of the second body portion 20. In this case, it is not possible to provide a common heat dissipation member 4 for the first electronic component 1 and the second electronic component 2, and it is necessary to provide separate heat dissipation members. This makes the manufacture and management of the electronic device complicated. The electronic device A1 can be manufactured and managed simply because it is possible to attach a common heat dissipation member 4 to the first electronic component 1 and the second electronic component 2 by eliminating the step between the first main surface of the first body portion 10 and the second main surface of the second body portion 20.

[0057] In the example shown in FIGS. 1 to 4, the first body portion 10 is larger in the z-direction than the second body portion 20, and is also larger in size in plan view. Therefore, in this embodiment, the first electronic component 1 is heavier than the second electronic component 2. Therefore, in the electronic device A1, no gap is provided between the first back surface (back surface 112 of the first sealing material 11) of the first body portion 10 and the mounting surface 31 (mounting board 3), and the first back surface of the first body portion 10 and the mounting surface 31 are abutted against each other, so that the body portion of the first electronic component 1 is directly supported by the mounting board 3. This is effective in suppressing bending of the first terminal 15 of the first electronic component 1.

[0058] In the electronic device A1, some of the second terminals 25 (second electronic components 2) are each formed with a second protrusion 253. With this configuration, each second protrusion 253 is engaged with the mounting surface 31, and therefore it is possible to prevent the second body portion 20 from approaching the mounting board 3 beyond a predetermined separation distance. In other words, it is possible to reliably maintain the separation distance T2 between the second rear surface (rear surface 212 of the second sealing material 21) of the second body portion 20 and the mounting surface 31.

[0059] <Second embodiment> Fig. 7 to Fig. 10 show an electronic device A2 according to a second embodiment. Fig. 7 is a plan view showing the electronic device A2, with the heat dissipation member 4 shown by imaginary lines. Fig. 8 is a front view showing the electronic device A2. Fig. 9 is a rear view showing the electronic device A2. Fig. 10 is a side view (right side view) showing the electronic device A2.

[0060] As shown in Figures 7 to 10, electronic device A2 differs from electronic device A1 in that there is also a gap between the first rear surface (rear surface 112 of first sealing material 11) of first main body portion 10 and mounting surface 31 (mounting board 3).

[0061] In the electronic device A2, as described above, a gap is provided between the rear surface 112 and the mounting surface 31 as shown in Figs. 8 to 10. That is, in the electronic device A2, the separation distance T1 between the rear surface 112 and the mounting surface 31 is made larger than the separation distance T1 in the first embodiment. By increasing this separation distance T1, the separation distance T2 between the rear surface 212 and the mounting surface 31 is made larger than the separation distance T2 in the first embodiment. In this embodiment as well, the separation distance T2 between the rear surface 212 and the mounting surface 31 is larger than the separation distance T1 between the rear surface 112 and the mounting surface 31.

[0062] In the electronic device A2, the first protrusions 153 are formed on the first terminals 15 arranged near the four corners in a plan view. As shown in Figs. 7 to 9, the first protrusions 153 are portions of each of the first terminals 15 that protrude in the x direction. The first protrusions 153 are not limited to those that protrude in the x direction, but may protrude in a direction perpendicular to the z direction. The first protrusions 153 have the same shape as the second protrusions 253. As shown in Figs. 7 to 9, the first protrusions 153 are arranged between the rear surface 112 and the mounting surface 31. The first protrusions 153 may be formed on one or more of the first terminals 15, and may be formed on all of the first terminals 15, for example. In addition, the first protrusions 153 may not be formed on any of the first terminals 15. However, in order to stabilize the posture of the first electronic component 1, it is preferable to provide first protrusions 153 on at least the first terminals 15 that are located near the four corners in a plan view.

[0063] 8 and 9, with each first terminal 15 inserted into each through hole 33, the lower edge in the z direction of each first protrusion 153 abuts against the mounting surface 31. In other words, with each first protrusion 153 hooked onto the mounting board 3, the first electronic component 1 is mounted on the mounting board 3 with a gap formed between the rear surface 112 of the first sealing material 11 and the mounting surface 31.

[0064] Similarly to the electronic device A1, the electronic device A2 also includes a heat dissipation member 4 attached to the first electronic component 1 and the second electronic component 2. Therefore, the electronic device A2 can improve the heat dissipation of the first electronic component 1 and the second electronic component 2. Also, in the electronic device A2, the step between the first main surface (mainly the main surface 111 of the first sealing material 11) of the first body portion 10 and the second main surface (mainly the main surface 211 of the second sealing material 21) of the second body portion 20 is eliminated, so that a common heat dissipation member 4 can be attached to the first electronic component 1 and the second electronic component 2, making manufacturing and management relatively easy.

[0065] In the electronic device A2, a first protrusion 153 is formed on some of the first terminals 15 (first electronic components 1). With this configuration, each first protrusion 153 is caught on the mounting surface 31, and the first body portion 10 does not move any closer to the mounting board 3. In other words, the separation distance T1 between the first rear surface (the rear surface 112 of the first sealing material 11) of the first body portion 10 and the mounting surface 31 can be easily ensured.

[0066] In the first and second embodiments, the shapes of the first protrusions 153 and the second protrusions 253 are not limited to the above examples, and may be any shapes that do not pass through the through holes 33, that is, that catch on the mounting surface 31. In addition, in some of the first terminals 15, the first protrusions 153 may not be formed, and the portion above the mounting surface 31 in the z direction may be relatively thick, and the portion below the mounting surface 31 in the z direction may be relatively thin. In this case, the relatively thick portion is made thicker than the hole diameter of the through hole 33. This allows the thick portion of the first terminal 15 to catch on the mounting surface 31, and the separation distance T1 can be easily ensured. In some of the second terminals 25, the second protrusions 253 may not be formed, and the portion above the mounting surface 31 in the z direction may be relatively thick, and the portion below the mounting surface 31 in the z direction may be relatively thin. In this case, the relatively thick portion is made thicker than the hole diameter of the through hole 33. This allows the thick portion of second terminal 25 to be caught on mounting surface 31, making it possible to easily ensure separation distance T2.

[0067] <Third embodiment> Figures 11 to 14 show an electronic device A3 according to a third embodiment. Figure 11 is a plan view showing the electronic device A3. Figure 12 is a front view showing the electronic device A3. Figure 13 is a rear view showing the electronic device A3. Figure 14 is a side view (right side view) showing the electronic device A3.

[0068] As shown in Figures 11 to 14, electronic device A3 differs from electronic device A1 in that the multiple first terminals 15 of the first electronic component 1 and the multiple second terminals 25 of the second electronic component 2 are configured as a surface mount type.

[0069] In the mounting board 3 of the electronic device A3, the wiring pattern (not shown) includes a plurality of land patterns 34. The plurality of land patterns 34 are electrically connected by a wiring pattern (not shown).

[0070] As described above, the first terminals 15 and the second terminals 25 are each configured as a surface mount type. The first terminals 15 and the second terminals 25 are, for example, strip-shaped in plan view.

[0071] As shown in Fig. 14, each first terminal 15 is partially bent and includes a base end portion extending from each side surface 114 along the y direction, an intermediate portion extending downward in the z direction, and a tip portion extending along the y direction. This tip portion (the side farther from each side surface 114) is joined to each land pattern 34. In the illustrated example, each first terminal 15 and each land pattern 34 are joined by a conductive bonding material 5 (for example, solder). Also, although the intermediate portion is inclined with respect to the z direction in the example shown in Fig. 14, it may be aligned along the z direction.

[0072] Similarly, as shown in Fig. 14, each second terminal 25 is partially bent and includes a base end portion extending from each side surface 214 along the y direction, an intermediate portion extending downward in the z direction, and a tip portion extending along the y direction. This tip portion (the side farther from each side surface 214) is joined to each land pattern 34. In the illustrated example, each second terminal 25 and each land pattern 34 are joined by a conductive bonding material 5 (for example, solder). Also, in the example shown in Fig. 14, the intermediate portion is inclined with respect to the z direction, but it may be aligned along the z direction.

[0073] In the electronic device A3, the z-direction dimension of each second terminal 25 is made larger than the z-direction dimension of each first terminal 15. Specifically, the z-direction dimension of an intermediate portion of each second terminal 25 is made larger than the z-direction dimension of an intermediate portion of each first terminal 15. As a result, the separation distance T2 in the z direction between the rear surface 212 and the mounting surface 31 is larger than the separation distance T1 in the z direction between the rear surface 112 and the mounting surface 31, and the main surface 111 (first sealing material 11) and the main surface 211 (second terminal 25) are located on the same xy plane.

[0074] Like the electronic devices A1 and A2, the electronic device A3 also includes a heat dissipation member 4 attached to the first electronic component 1 and the second electronic component 2. Therefore, the electronic device A3 can improve the heat dissipation properties of the first electronic component 1 and the second electronic component 2. Also, in the electronic device A3, the step between the first main surface (mainly the main surface 111 of the first sealing material 11) of the first body portion 10 and the second main surface (mainly the main surface 211 of the second sealing material 21) of the second body portion 20 is eliminated, so that a common heat dissipation member 4 can be attached to the first electronic component 1 and the second electronic component 2, making manufacturing and management relatively easy.

[0075] <Fourth embodiment> Fig. 15 shows an electronic device A4 according to the fourth embodiment. Fig. 15 is a side view (right side view) showing the electronic device A4.

[0076] As shown in FIG. 15, electronic device A4 differs from electronic device A3 in that there is a gap between the first rear surface (rear surface 112 of first sealing material 11) of first main body portion 10 and mounting surface 31 (mounting board 3).

[0077] In the electronic device A4, a gap is provided between the rear surface 112 and the mounting surface 31, similarly to the electronic device A2. That is, in the electronic device A4, the separation distance T1 between the rear surface 112 and the mounting surface 31 is made larger than the separation distance T1 in the third embodiment. By increasing this separation distance T1, the separation distance T2 between the rear surface 212 and the mounting surface 31 is made larger than the separation distance T2 in the third embodiment. In the present embodiment as well, the separation distance T2 between the rear surface 212 and the mounting surface 31 is larger than the separation distance T1 between the rear surface 112 and the mounting surface 31.

[0078] Like the electronic devices A1 to A3, the electronic device A4 also includes a heat dissipation member 4 attached to the first electronic component 1 and the second electronic component 2. Therefore, the electronic device A4 can improve the heat dissipation properties of the first electronic component 1 and the second electronic component 2. Also, in the electronic device A4, the step between the first main surface (mainly the main surface 111 of the first sealing material 11) of the first body portion 10 and the second main surface (mainly the main surface 211 of the second sealing material 21) of the second body portion 20 is eliminated, so that a common heat dissipation member 4 can be attached to the first electronic component 1 and the second electronic component 2, making manufacturing and management relatively easy.

[0079] In the first and second embodiments, the multiple first terminals 15 (first electronic component 1) and the multiple second terminals 25 (second electronic component 2) are both of an insertion mounting type structure, and in the third and fourth embodiments, the multiple first terminals 15 (first electronic component 1) and the multiple second terminals 25 (second electronic component 2) are both of a surface mounting type structure, but this is not limiting. One of the multiple first terminals 15 or the multiple second terminals 25 may be of an insertion mounting type structure and the other may be of a surface mounting type structure.

[0080] In the first to fourth embodiments, the number of first semiconductor elements Q1 built in the first electronic component 1 is greater than the number of second semiconductor elements Q2 built in the second electronic component 2, but the present invention is not limited to this, and the number of first semiconductor elements Q1 may be less than the number of second semiconductor elements Q2. For example, depending on the performance and type of elements used as the first semiconductor elements Q1 and the second semiconductor elements Q2, the first semiconductor elements Q1 may be greater than the second semiconductor elements Q2. In this case, even if the number of first semiconductor elements Q1 is less than the number of second semiconductor elements Q2, the z-direction dimension of the first sealing material 11 may be greater than the z-direction dimension of the second sealing material 21. Even in this case, by making the separation distance T2 in the z direction between the second sealing material 21 (rear surface 212) and the mounting board 3 (mounting surface 31) larger than the separation distance T1 in the z direction between the first sealing material 11 (rear surface 112) and the mounting board 3 (mounting surface 31), it is possible to eliminate the step between the first main surface (mainly main surface 111) of the first main body portion 10 and the second main surface (mainly main surface 211) of the second main body portion 20, and to attach a common heat dissipation member 4 to the first electronic component 1 and the second electronic component 2.

[0081] In the first to fourth embodiments, the electronic devices A1 to A4 are shown to include two electronic components (a first electronic component 1 and a second electronic component 2), but are not limited to this and may include three or more electronic components.

[0082] The electronic device according to the present disclosure is not limited to the above-described embodiment. The specific configuration of each part of the electronic device according to the present disclosure can be freely designed. For example, the electronic device according to the present disclosure includes the following embodiments. [Appendix 1] a first electronic component including a first body portion and a plurality of first terminals exposed from the first body portion; a second electronic component including a second body portion and a plurality of second terminals exposed from the second body portion; a mounting substrate having a mounting surface on which the first electronic component and the second electronic component are arranged; a heat dissipation member having a mounting surface on which the first electronic component and the second electronic component are mounted; Equipped with the first body portion and the second body portion are disposed between the mounting board and the heat dissipation member in a thickness direction and are aligned in a first direction perpendicular to the thickness direction; the mounting surface and the attachment surface are opposed to each other in the thickness direction, the first body portion has a first main surface facing the attachment surface and a first back surface facing the mounting surface, the second main body portion has a second main surface facing the attachment surface and a second back surface facing the mounting surface, The dimension of the second body portion in the thickness direction is smaller than the dimension of the first body portion in the thickness direction, the first main surface and the second main surface overlap when viewed in the first direction, The electronic device, wherein there is a gap between the second back surface and the mounting surface. [Appendix 2] 2. The electronic device of claim 1, wherein the first back surface and the mounting surface are in contact with each other. [Appendix 3] There is a gap between the first back surface and the mounting surface, 2. The electronic device of claim 1, wherein a distance between the second back surface and the mounting surface in the thickness direction is greater than a distance between the first back surface and the mounting surface in the thickness direction. [Appendix 4] The mounting board has a plurality of land patterns formed on the mounting surface, 4. The electronic device according to claim 1, wherein each of the first terminals and each of the second terminals are of a surface mount type, each of which is partially bent and has a tip joined to each of the land patterns. [Appendix 5] a plurality of through holes are formed in the mounting board, the through holes penetrating the mounting board in the thickness direction; 4. The electronic device according to claim 1, wherein each of the first terminals and each of the second terminals have a tip extending in the thickness direction and are of an insertion-mount type in which the tip is inserted into each of the through holes. [Appendix 6] The electronic device described in Appendix 5, wherein one or more of the multiple second terminals are arranged between the second back surface and the mounting surface and include a protrusion portion protruding in a direction perpendicular to the thickness direction. [Appendix 7] 7. The electronic device according to claim 1, wherein the first main surface and the second main surface are adhered to the mounting surface of the heat dissipation component by an adhesive. [Appendix 8] the first body portion includes a plurality of first semiconductor elements and a first sealing material that covers the plurality of first semiconductor elements; 8. The electronic device according to claim 1, wherein the first terminals include first power terminals electrically connected to the first semiconductor elements. [Appendix 9] the first body portion is covered with the first sealing material and further includes a first control element that controls driving of each of the plurality of first semiconductor elements; The electronic device described in Appendix 8, wherein the plurality of first terminals includes a first control terminal conductively connected to the first control element. [Appendix 10] 10. The electronic device of claim 9, wherein the first electronic component is a power module. [Appendix 11] the first body portion further includes a first support substrate that supports at least the first semiconductor elements; 11. The electronic device according to claim 8, wherein the first support substrate has a first support surface facing the mounting surface and on which the plurality of first semiconductor elements are mounted. [Appendix 12] the first sealing member has a first sealing surface facing the mounting surface; the first support substrate further has a first exposed surface facing the mounting surface and exposed from the first sealing surface; 12. The electronic device of claim 11, wherein the first sealing surface and the first exposed surface are flush with each other and constitute the first main surface. [Appendix 13] the second body portion includes one or more second semiconductor elements, the number of which is smaller than the plurality of first semiconductor elements, and a second sealing material covering the one or more second semiconductor elements; 13. The electronic device of claim 8, wherein the plurality of second terminals include a second power terminal electrically connected to the one or more second semiconductor elements. [Appendix 14] the second body portion is covered with the second sealing material and further includes a second control element that controls driving of each of the one or more second semiconductor elements; the second control element is covered with the second sealing material, The electronic device of claim 13, wherein the plurality of second terminals includes a second control terminal conductively connected to the second control element. [Appendix 15] 15. The electronic device of claim 14, wherein the second electronic component is a power module. [Appendix 16] the second body portion further includes a second support substrate supporting the one or more second semiconductor elements; The electronic device according to any one of Supplementary Note 13 to Supplementary Note 15, wherein the second support substrate has a second support surface facing the mounting surface and on which the one or more second semiconductor elements are mounted. [Appendix 17] the second sealing member has a second sealing surface facing the mounting surface, the second support substrate further has a second exposed surface facing the mounting surface and exposed from the second sealing surface; 17. The electronic device of claim 16, wherein the second sealing surface and the second exposed surface are flush with each other and constitute the second main surface. [Explanation of symbols]

[0083] A1~A4:Electronic equipment 1: First electronic component M1: First control element Q1: First semiconductor element T11, T12: First terminal T11a, T11b: Input terminals T11c: Output terminal T11d: Detection terminal 10: First main body part 11: First sealing material 111: Main surface 112: Back side 113, 114: Side 12:First support board 121: 1st exposed surface 122: 1st support surface 15: 1st terminal 151: 1st power terminal 152: First control terminal 153: 1st protrusion 2: Second electronic component M2: Second control element Q2: Second semiconductor element T21,T22: 2nd terminal T21a, T21b: Input terminal T21c: Output terminal T21d: Detection terminal 20: Second main body part 21: Second sealing material 22:Second support board 25: 2nd terminal 211: Main surface 212: Back side 213: Side 214: Side 221: 2nd exposed surface 222:Second support surface 251: 2nd power terminal 252: Second control terminal 253:Second protrusion 3: Mounting board 31: Mounting surface 33:Through hole 34: Land Pattern 4: Heat dissipation material 41: Mounting surface 5: Conductive bonding material

Claims

1. a first electronic component including a first body portion and a plurality of first terminals exposed from the first body portion; a second electronic component including a second body portion and a plurality of second terminals exposed from the second body portion; a mounting substrate having a mounting surface on which the first electronic component and the second electronic component are arranged; a heat dissipation member having a mounting surface on which the first electronic component and the second electronic component are mounted; Equipped with the first body portion and the second body portion are disposed between the mounting substrate and the heat dissipation member in a thickness direction and are aligned in a first direction perpendicular to the thickness direction, the mounting surface and the attachment surface are opposed to each other in the thickness direction, the first main body portion has a first main surface facing the attachment surface and a first back surface facing the mounting surface, the second main body portion has a second main surface facing the attachment surface and a second back surface facing the mounting surface, The dimension of the second body portion in the thickness direction is smaller than the dimension of the first body portion in the thickness direction, the first main surface and the second main surface overlap when viewed in the first direction, There is a gap between the second back surface and the mounting surface, the first body portion includes a plurality of first semiconductor elements and a first sealing material that covers the plurality of first semiconductor elements; the first terminals include a first power terminal electrically connected to the first semiconductor elements; the second body portion includes one or more second semiconductor elements that are less than the plurality of first semiconductor elements and a second sealing material that covers the one or more second semiconductor elements; the plurality of second terminals include a second power terminal electrically connected to the one or more second semiconductor elements; the first terminals protrude from a side surface of the first sealing material that faces a direction perpendicular to the thickness direction, and are joined to the mounting substrate by a conductive bonding material; The electronic device, wherein the plurality of second terminals protrude from a side surface of the second sealing material facing a direction perpendicular to the thickness direction, and are joined to the mounting substrate by a conductive bonding material.

2. The electronic device according to claim 1 , wherein the first back surface and the mounting surface are in contact with each other.

3. There is a gap between the first back surface and the mounting surface, The electronic device according to claim 1 , wherein a distance between the second back surface and the mounting surface in the thickness direction is greater than a distance between the first back surface and the mounting surface in the thickness direction.

4. The mounting board has a plurality of land patterns formed on the mounting surface, 4. The electronic device according to claim 1, wherein each of the first terminals and each of the second terminals are of a surface mount type that are partially bent and have a tip joined to each of the land patterns.

5. a plurality of through holes are formed in the mounting board, the through holes penetrating the mounting board in the thickness direction; 4. The electronic device according to claim 1, wherein each of the plurality of first terminals and each of the plurality of second terminals have a tip extending in the thickness direction and are of an insertion mounting type in which the tip is inserted into each of the plurality of through holes.

6. The electronic device according to claim 5 , wherein one or more of the plurality of second terminals are disposed between the second back surface and the mounting surface and include a protrusion protruding in a direction perpendicular to the thickness direction.

7. One or more of the plurality of first terminals are disposed between the first back surface and the mounting surface and include a first protrusion portion protruding in a direction perpendicular to the thickness direction, one or more of the plurality of second terminals is disposed between the second back surface and the mounting surface and includes a second protrusion protruding in a direction perpendicular to the thickness direction; The electronic device according to claim 5 , wherein a distance between the first protrusion and the first rear surface in the thickness direction is smaller than a distance between the second protrusion and the second rear surface in the thickness direction.

8. The electronic device according to claim 1 , wherein the first main surface and the second main surface are adhered to the attachment surface of the heat dissipation member by an adhesive.

9. the first body portion is covered with the first sealing material and further includes a first control element that controls driving of each of the plurality of first semiconductor elements; The electronic device according to claim 1 , wherein the plurality of first terminals include a first control terminal that is electrically connected to the first control element.

10. The electronic device according to claim 9 , wherein the first electronic component is a power module.

11. the first body portion further includes a first support substrate supporting at least the first semiconductor elements; The electronic device according to claim 1 , wherein the first support substrate has a first support surface that faces the mounting surface and on which the plurality of first semiconductor elements are mounted.

12. the first sealant has a first sealing surface facing the mounting surface, the first support substrate further has a first exposed surface facing the mounting surface and exposed from the first sealing surface; The electronic device according to claim 11 , wherein the first sealing surface and the first exposed surface are flush with each other and constitute the first main surface.

13. the second body portion is covered with the second sealing material and further includes a second control element that controls driving of each of the one or more second semiconductor elements; the second control element is covered with the second sealing material, The electronic device according to claim 1 , wherein the plurality of second terminals include a second control terminal that is electrically connected to the second control element.

14. The electronic device according to claim 13 , wherein the second electronic component is a power module.

15. the second body portion further includes a second support substrate supporting the one or more second semiconductor elements; The electronic device according to claim 1 , wherein the second support substrate has a second support surface facing the mounting surface and on which the one or more second semiconductor elements are mounted.

16. the second sealing member has a second sealing surface facing the mounting surface, the second support substrate further has a second exposed surface facing the mounting surface and exposed from the second sealing surface; The electronic device according to claim 15 , wherein the second sealing surface and the second exposed surface are flush with each other and constitute the second main surface.

Images