Composed of a power semiconductor module and a cooler

Abstract

The present invention relates to a method of providing a cooler (12) for a power semiconductor module (10), in which a cooling structure (32) is welded to a planar surface of a substrate (14) or base plate (15). The present invention further relates to the construction of a power semiconductor module (10) formed according to such a method.

Description

[Technical field]

[0001] Technical Field The present invention relates to an arrangement consisting of a power semiconductor module and a cooler. The present invention particularly relates to a power semiconductor module having an improved connection to a cooler and an improved arrangement of the cooler. The present invention further relates to a method for forming the same. [Background technology]

[0002] Background technology Power semiconductor modules are well known in the art for a variety of applications. As an example, it is known to position an electrical circuit soldered onto a substrate within a housing and encapsulate the electrical circuit within a resin filled within the housing.

[0003] However, transfer molded and especially sintered power modules are becoming an interesting alternative to traditional approaches due to the improved cycling reliability of the power modules. Nevertheless, this introduces more complexities in the incorporation of electrical circuits, such as including three phases on a common base plate or cooler. Although the boards can be fully assembled with wire bonds when proceeding to the subsequent board soldering, the sintering approach requires strong pressure on the board, so that boards for sintering cannot or hardly can be wire bonded and tested before sintering. The pressure is typically applied mechanically with a rubber stamp, which destroys the wire bonds.

[0004] For this reason, sintering, for example, a six-pack module in one step is economically very risky. It may be preferable to go for a six-pack configuration, which is done by three different transfer molded and sintered half-bridge modules.

[0005] However, there are various issues to consider when using transfer molded modules.

[0006] For example, the integration by using O-rings leaves room for improvement for reliability reasons due to the aging of the O-rings, etc. The use of screws requires storage and part numbers for the assembly line, and furthermore, this solution requires space for the O-ring cavity and the screws due to the amount of screws, such as four screws for a half-bridge module.

[0007] It is important that the method or technique used to incorporate the electrical circuitry must not damage the power module. In particular, it may be preferable for temperatures not to exceed 225°C, in order not to damage the moulding compound. Furthermore, mechanical stresses should be avoided.

[0008] Assembly by welding techniques should furthermore avoid the creation of small cracks and pores which could cause leakage.

[0009] Apart from that, the fluid enclosure of a fluid-based cooler needs to be robust and leak-free, while at the same time the design should be space-saving and inexpensive.

[0010] EP 3 276 657 A1 describes a power semiconductor module arrangement with a cooler, the cooler having a cooler body, a cavity formed in the cooler body, and a bonding wire. The bonding wire is disposed within the cavity and is directly bonded to a first surface of the cooler body. The bonding wire comprises at least 95% by weight aluminum, at least 0.25% by weight silicon, and at least one of at least 0.05% by weight magnesium and at least 0.05% by weight manganese.

[0011] US Patent Application Publication No. 2014 / 0327127 describes a power module comprising a semiconductor chip, a bonding substrate comprising a conductive sheet and an electrical insulator sheet attached directly to the conductive sheet and thermally coupled to the semiconductor chip, and an array of cooling structures attached directly to the conductive sheet and configured to remove heat from the semiconductor chip when interacting with a cooling fluid.

[0012] US Patent Application Publication No. 2013 / 0285234 describes a power module including a substrate having an electrically insulating member with opposing first and second metallized surfaces, and one or more semiconductor dies attached to the first metallized surface of the substrate. A plurality of thermally conductive structures are laterally spaced apart from one another and individually attached directly to the second metallized surface of the substrate such that the plurality of thermally conductive structures extend outwardly from the second metallized surface.

[0013] US Patent Application Publication No. 2017 / 0304922 describes a semiconductor module including a substrate having a metallized first surface and a metallized second surface opposite the metallized first surface. A semiconductor die is attached to the metallized first surface of the substrate. A plurality of cooling structures are welded to the metallized second surface of the substrate. Each of the cooling structures includes a plurality of separate weld beads arranged in a stacked configuration extending outwardly from the substrate. The substrate can be conductive or insulating. Corresponding methods of manufacturing such a semiconductor module and a substrate having such welded cooling structures are also provided.

[0014] China Utility Model Registration No. 207165550 provides a module with liquid cooling.

[0015] China Utility Model Registration No. 203722992 discloses an embedded multi-channel heat dissipation module component.

[0016] US Patent No. 9,578,789 describes a power semiconductor module including a substrate and a two-component cooling system arranged below the substrate. The cooling system has an upper piece and a lower piece. The upper piece forms a flow path for a cooling liquid together with the substrate. The upper piece has a first inlet through which the cooling liquid can be introduced into the flow path and an outlet through which the cooling liquid can be removed from the flow path. The upper piece also has at least one second inlet spaced longitudinally from the first inlet. The lower piece has an inlet and an outlet, the outlet being connected to the outlet and the inlet being connected to the first inlet. The lower piece also has channels branching from the inlet, the channels including at least one bypass channel connected to the second inlet, so that a portion of the cooling liquid enters the flow path through the bypass channel.

[0017] WO 2015 / 176914 discloses a welding process method for a radiator, in which a heating element, an aluminum-based PCB substrate and a radiator are provided in order from top to bottom, and the heating element and the aluminum-based PCB substrate are welded together via a tin solder medium, and the whole is fixed together with the radiator by welding. The heat dissipation effect is enhanced by welding, which changes the way the combination of the heating element and the aluminum-based substrate is combined with the radiator.

[0018] U.S. Patent Application Publication No. 2009 / 249624 describes a method of making a heat sink that includes the steps of providing a base and a plurality of individual fins, and sequentially welding the fins to the base by an ultrasonic welding method.

[0019] However, providing a power semiconductor module, such as a three-phase transfer molded module, with a cooler remains a challenge, and the prior art therefore leaves room for improvement in this regard. Summary of the Invention [Problem to be solved by the invention]

[0020] Summary of the Invention It is therefore an object of the present invention to provide a solution for at least partially overcoming at least one of the drawbacks of the prior art, in particular for a reliable connection of a power semiconductor module to an effective cooler in a simple and reliable manner. [Means for solving the problem]

[0021] These objects are at least partly solved by a method having the features of independent claim 1. These objects are further at least partly solved by an arrangement consisting of a power semiconductor module and a cooler having the features of independent claim 13. Advantageous embodiments are described in the dependent claims, the further description and the drawings, which described embodiments may provide the features of the invention alone or in any combination with the respective embodiments, unless expressly excluded.

[0022] 1. A method of providing a cooler for a power semiconductor module, comprising: a) providing a power semiconductor module comprising a substrate having a first substrate side for carrying at least one electrical circuit and a second substrate side opposite the first substrate side; The power semiconductor module includes one of features a1) and a2), According to feature a1), the second substrate side has a flat surface and is adapted to be in contact with a cooler, a cooling area is arranged on the second substrate side, the cooling area being surrounded by a connection area, According to feature a2), the power semiconductor module comprises a base plate with a first base plate side and a second base plate side located opposite the first base plate side, the second substrate side being connected to the first base plate side, the second base plate side having a flat surface and adapted for contacting a cooler, and a cooling area surrounded by a connection area being arranged on the second base plate side, If feature a1) is realized, the method comprises: b1) connecting a first casing component of the cooler to the second substrate surface at a connection area, the first casing component optionally comprising at least one opening for receiving the cooling area; c1) connecting the second casing component to the first casing component such that a cooling channel is provided between the first casing component and the second casing component for supplying a cooling fluid to the cooling region; d1) welding a cooling structure to a cooling region on a second substrate surface; Including, Or, if feature a2) is realized, the method further comprises: b2) connecting a first casing component of the cooler to the second base plate surface in a connection region, the first casing component optionally comprising at least one opening for receiving the cooling region; c2) connecting the second casing component to the first casing component such that a cooling channel is provided between the first casing component and the second casing component for supplying a cooling fluid to the cooling region; d2) welding a cooling structure to the cooling region on the second base plate surface; A method is described that includes:

[0023] Such a method may provide significant advantages over the cited prior art, particularly with respect to providing cooling for power semiconductor modules. In particular, the described method may be useful in forming inverters.

[0024] It should further be noted that the steps described above do not necessarily have to be performed in the strictly stated order, in particular it may be preferred that step d1) is performed before or in parallel with step c1) and step d2) is performed before or in parallel with step c1).

[0025] According to a first method step a), a power semiconductor module is provided, comprising a substrate and, optionally, a base plate. The substrate may in particular be a ceramic substrate carrying a power semiconductor device on a substrate metallization. The power semiconductor device can thus be fixed to the substrate metallization, for example, and can form an electric circuit together with other components, such as terminals and respective interconnects.

[0026] Depending on whether the power semiconductor module has a base plate or not, the power semiconductor comprises one of features a1) and a2), which are explained in detail below.

[0027] According to feature a1), the second substrate side has a flat surface. This means in particular that the second substrate side, such as the bottom metallization, has a surface that is not provided with specific cooling structures but is formed, for example, by the ceramic body of the substrate and the respective metallization. The second substrate side, and thus the respective surface, can therefore extend parallel to the plane of the substrate or its body, respectively.

[0028] The second substrate side is adapted to be in contact with the cooler. In this regard, the second substrate side is provided with a cooling area surrounded by a connection area. The cooling area is therefore the part which is effective in terms of cooling and which therefore should be cooled by the cooler and which should in particular be in contact with the cooling fluid guided through the cooler. However, the connection area is provided for connecting the substrate to the cooler and therefore it is not necessary or desirable for this area, for example at least completely, to be in contact with the cooling fluid.

[0029] According to feature a2), therefore, if a base plate is present, it is connected to the substrate in order to provide a particularly efficient cooling effect for the power semiconductor device.

[0030] Thus, the first base plate surface is connected to the substrate, in particular to the second substrate surface, whereas the second base plate surface is adapted to be connected to the cooler. In this regard, the second base plate surface is provided with a cooling area surrounded by a connection area. The cooling area is thus an active part of the base plate, which should therefore be cooled by the cooler and in particular should be in contact with the cooling fluid guided through the cooler. However, the connection area is provided in order to connect the base plate to the cooler, and therefore it is not necessary or desirable for this area, for example at least completely, to be in contact with the cooling fluid.

[0031] It is furthermore possible for the second base plate surface to have a flat surface. This in particular means that the second base plate surface has a surface on which no specific cooling structures are provided, but which is formed, for example, by the surface of the body of the base plate itself. Thus, for example, the second base plate surface, and thus the respective surface, can extend parallel to the plane of the body of the base plate and further, for example, parallel to the substrate.

[0032] For providing a cooler for a power semiconductor module, different options may arise, depending in particular on whether feature a1) or feature a2) is realized. In general, however, the method for providing the cooler is carried out depending on the two mentioned options, namely with or without a base plate.

[0033] More specifically, if feature a1) is realized, the method comprises the following steps: According to method step b1), the first casing component of the cooler is connected to the second substrate surface in a connection region and thus fixed. This is preferably done by welding as described below. The first casing component may be formed, for example, from a flat plate or from a plate with ridges that allow easy handling. Furthermore, it may be preferred that at least the connection region of the second substrate surface may be realized in the substrate metallization in order to reliably fix the second substrate surface with the first casing component, for example by welding.

[0034] The first casing component may comprise at least one opening for receiving the cooling area. In other words, when the first casing component is attached to the substrate, the cooling area may still be exposed, so that it can be cooled by a cooling fluid flowing through the cooler. The cooling area is therefore received by the opening. However, the provision of the opening may in particular depend on whether the cooling structure is provided independently from the casing, in particular from the first casing component, or connected to it, as will be explained in more detail below. Furthermore, when the first casing component is fixed to the connection area, the cooling area is enclosed by the edge of the first casing component, in particular the opening.

[0035] Furthermore, according to method step c1), a second casing component is allowed to be connected and thus fixed to the first casing component, and a cooling channel for supplying a cooling fluid to the cooling region is allowed to be formed between the first and second casing components. The cooling channel may be a free volume present between the first and second casing components, or it may have a structure that guides the cooling fluid through a defined path.

[0036] According to method step d1), it is furthermore enabled that the cooling structures are welded to the cooling areas on the second substrate side. The cooling structures are not particularly limited and may include, inter alia, turbulators, cooling pins, etc. For example, if the cooling structures are formed from turbulators, they may be formed into corrugations with rounded or sloping edges. The wave crests and / or wave troughs may be flat, rounded or sloping. The dimensions may be selected according to the desired requirements. For example, the distance of the wave crests may be in the range of 2,5 mm to 5 mm, and the height from the wave trough to the wave crest may be in the range of 2 mm to 12 mm, although these values ​​are by no means limiting. Apart from that, it may be enabled that the cooling structures are formed from aluminum.

[0037] According to this embodiment, the cooling efficiency of the cooler can be further improved compared to a flat cooling area, which can be mainly due to the fact that the surface of the base plate that can be cooled by the influence of the cooling fluid can be significantly increased.

[0038] The cooling structure may be formed by using cooling pins, as a further example. The first casing component may be allowed to have an opening adapted to receive the cooling structure. Furthermore, the distance between the first casing component and the second casing component should be selected so that there is sufficient space to place the cooling structure. If the distance is greater than the length of the cooling structure, there may be a fluid bypass in the gap between the tip of the cooling structure and the second casing component, resulting in reduced thermal performance.

[0039] However, as an alternative to the above, if a base plate is present and thus feature a2) is realised, the method comprises the following steps which essentially correspond to steps b1) to d1) above.

[0040] According to method step b2), the first casing component of the cooler is connected to the second base plate surface in a connection region and thus fixed. This is preferably done by welding as described below. The first casing component may be formed, for example, from a flat plate or from a plate with ridges that allow easy handling. Furthermore, in order to reliably fix the second base plate surface with the first casing component, for example by welding, it may be preferred that at least the connection region of the second base plate surface may be formed from a metal or a metal alloy.

[0041] The first casing component may comprise at least one opening for receiving the cooling area. In other words, when the first casing component is attached to the base plate, the cooling area may still be exposed, so that it can be cooled by a cooling fluid flowing through the cooler. Again, the provision of the opening may depend in particular on whether the cooling structure is provided independently from the casing, in particular from the first casing component, or connected thereto, as will be explained in more detail below.

[0042] Furthermore, according to method step c2), a second casing component is allowed to be connected and thus fixed to the first casing component, and a cooling channel is allowed to be provided between the first and second casing components for supplying a cooling fluid to the cooling region. The cooling channel may be a free volume present between the first and second casing components or it may have a structure that guides the cooling fluid through a defined path.

[0043] According to method step d2), it is further provided that a cooling structure is welded to the cooling area on the second base plate surface. The cooling structure is not particularly limited and may include, inter alia, turbulators, cooling pins, etc. According to this embodiment, the cooling efficiency of the cooler can be further improved. This can be mainly due to the fact that the surface of the base plate that can be cooled by the influence of the cooling fluid can be significantly increased.

[0044] The cooling structure can be formed, for example, by using cooling pins or by further structures as described above with regard to feature d1).

[0045] Again, the first casing component may be enabled to have an opening adapted to receive the cooling structure. Additionally, the distance between the first casing component and the second casing component may be selected so that there is sufficient space to place the cooling structure. If the distance is greater than the length of the cooling structure, there may be a fluid bypass in the gap between the tip of the cooling structure and the second casing component, resulting in reduced thermal performance.

[0046] The above-described method therefore makes it possible in a very effective manner to provide a cooler for the power semiconductor module, optionally with a base plate and therefore with the power semiconductor module, which exhibits a reliable and efficient cooling behavior for the substrate. This is due to the fact that by providing a cooler based on the cooling fluid used, the power semiconductor module has an efficient cooling behavior such that it is cooled very effectively.

[0047] Apart from that, due to the welding step a reliable connection of the cooling structure to the substrate or base plate can be achieved, thereby ensuring a long-term reliable construction.

[0048] With regard to the casing forming the cooler, and therefore the first and second casing components, it may be possible for the casing components to be made from copper or aluminum alloys. These alloys may have aluminum-coated areas that can be in contact with the cooling fluid. Even when the casing is in contact with the cooling fluid, no further surface treatment is required to achieve a long-term stable configuration.

[0049] Generally, the casing components may be allowed to be formed from the same material to allow for improved welding conditions.

[0050] In general, the first casing component may function as a base plate and the second casing component may function as a cap or lid, respectively, to close the cooling channels.

[0051] These advantages may be preferable, for example, for sintered substrates or, respectively, for substrates on which power semiconductor devices are sintered: indeed, substrates for sintering cannot be wire-bonded and tested prior to sintering, since sintering techniques require strong pressure on the substrate, typically applied mechanically with a rubber stamp, which would destroy the wire bonds.

[0052] The welding process does not affect the functionality of the power module and allows for reliable connections to be made without the use of O-rings and screws, resulting in a compact solution with high reliability and high temperature ratings.

[0053] It may be possible that feature a1) is realised and thus a base plate of the power semiconductor module may be omitted, thus enabling the method to include steps b1), c1) and d1).

[0054] This embodiment therefore allows the power semiconductor module, and thus the arrangement consisting of the power semiconductor module and the cooler, to be formed without a base plate. This embodiment therefore allows a particularly easy and cost-saving manufacturing process of the power module and the corresponding arrangement. Apart from that, weight can be saved, which can be a particularly important advantage for mobile applications such as electric drives.

[0055] Alternatively, feature a2) may be realised, in which a base plate of a power semiconductor module is provided and thus enabled to be fixed to a substrate and thus to its second side, i.e. to the second substrate side, thus enabling the method to comprise steps b2), c2) and d2).

[0056] This embodiment makes it possible to provide a particularly effective and reliable cooling effect, since the base plate can provide the cooling effect in addition to the cooler.

[0057] It may further be enabled that the cooling structure is welded to the first or second casing component. According to this embodiment, a particularly reliable arrangement may be provided, since the cooling structure is not only welded and thus fixed to the substrate or base plate, but can also be fixed to the first or second casing component, which may result in increased mechanical stability.

[0058] Alternatively, it can be provided that the cooling structures extending into the cooling channels have larger spatial dimensions compared to the openings, so that a particularly effective cooling effect can be achieved.

[0059] Apart from that, the design and configuration of the cooling structure can be realized very adaptively since it is possible to use different cooling structures, each according to respective requirements independently of the size and geometry of the openings in the first casing component.

[0060] The cooling structure may therefore be the part that is first separated from the first casing component, in particular, and the first casing component may therefore be provided with an opening for receiving the cooling area and for receiving the cooling structure.

[0061] Alternatively, the cooling structure may be designed integrally with the first or second casing component and thus be part of the first or second casing component. This embodiment allows a particularly simple forming process, since the step of connecting the cooling structure can be carried out in one step together with connecting the first or second casing component. Thus, a process step can be omitted, which may allow significant advantages. Apart from that, here too, it may be realized that the cooling structure extending into the cooling channel has a larger spatial dimension compared to the opening, so that a particularly effective cooling can be realized.

[0062] With regard to the openings of the first casing component, if the cooling structure is designed integrally with the second casing component, it may be possible for the first casing component to receive the cooling area and to have an opening for receiving the cooling structure, and if the cooling structure is designed integrally with the first casing component, it may be possible for the respective openings of the first casing component to be omitted.

[0063] In view of the above, the cooling structure and at least one of the first and second casing components may form a continuous structural element. This may be achieved by using either a one-piece or one-piece component comprising the cooling structure and at least one of the first and second casing components, respectively. Alternatively, the continuous structural element may be formed by a two-piece component connected, for example, by welding, where the cooling structure is connected, for example, by welding, to the first or second casing component.

[0064] It may further be preferred that the first casing component is connected to the second substrate side or the second base plate side by welding. This feature allows a particularly safe configuration, since a configuration with high mechanical stability can be achieved. Apart from that, it can be realized that by welding, temperature effects on the module, and thus in particular on the power semiconductor devices, are kept below suitable limits, so that the risk of damaging the power semiconductor devices can be minimized or completely eliminated.

[0065] For the same reason, it may be preferable for the second casing component to be connected to the first casing component by welding, even though the temperature effects on the power module may be lower compared to fixing the first casing component.

[0066] With regard to the welding steps, it may be particularly preferred that at least one of the welding of the cooling structure, the welding of the first casing component or the welding of the second casing component is performed by laser welding. In particular, by laser welding, the temperature effects on the parts to be welded and thus on the power semiconductor module can be significantly reduced. This may be due to the fact that the temperatures occurring when using laser welding can be kept in the range well below 250°C. Thus, damage to the parts of the power semiconductor module, such as damage to the power semiconductor devices, can be prevented or at least reduced, so that a module as described above can be reliably realized.

[0067] If all of steps a1), b1), c1) and d1) are realized, it may be further preferred that the first casing component is welded to the connection area of ​​the second substrate surface continuously along a weld path that completely surrounds the opening. According to this embodiment, a very reliable connection can be provided due to the fact that a very stable connection path, such as a weld path, is realized. Apart from that, if the weld path surrounds the entire opening, the substrate is sealed to the first casing component, so that no further sealing is required. Thus, the provision of an O-ring with the screw can be avoided, which may result in increased reliability and also space savings, since no groove is required for the O-ring and through-hole of the screw.

[0068] Correspondingly, if all of steps a2), b2), c2) and d2) are realized, it may be further preferred that the first casing component is welded to the connection area of ​​the second base plate surface continuously along a weld path that completely surrounds the opening. According to this embodiment, again, a very reliable connection can be provided due to the fact that a very stable connection path, such as a weld path, is realized. Apart from that, if the weld path surrounds the entire opening, the base plate is sealed to the first casing component, so that no further sealing is required. Thus, the provision of an O-ring with the screw can be avoided, which may result in increased reliability and also space savings, since no groove is required for the O-ring and through-hole of the screw.

[0069] It may further be preferred that step d1 is performed before step c1), and thus in particular after or in parallel with step b1), or that step d2) is performed before step c2), and thus in particular after or in parallel with step b2). This embodiment allows for a very adaptive formation of the cooling structure, so that the cooling capacity can be adjusted to the desired requirements. Apart from that, the step of connecting the cooling structure, such as welding the cooling structure, can be performed particularly easily.

[0070] However, it may also be allowed that step d1) is performed in parallel with step c1) and thus simultaneously compared to step c1), or that step d2) is performed in parallel with step c2) and thus simultaneously compared to step c2). This may be done, for example, to increase the stability of the cooler or to improve the flow of the cooling medium. Furthermore, again, this embodiment allows for a very adaptive formation of the cooling structure, so that the cooling capacity can be adjusted to the desired requirements. Apart from that, the step of connecting the cooling structure, such as welding the cooling structure, can be performed particularly easily.

[0071] It may further be preferred that at least one of the first and second casing components comprises at least one of the fluid inlet and the fluid outlet. This embodiment therefore allows a very efficient and simple use of the arrangement consisting of the first and second casing components as a fluid-based cooler. In this regard, it may be realized that the inlet and the outlet are both provided in the first or the second casing component, or that one of the inlet and the outlet is provided in the first casing component and a further part of the inlet and the outlet is provided in a further part of the inlet and the outlet. However, for space reasons, it may be preferred that both the inlet and the outlet are provided in the second casing component, which can also be considered as a kind of cap.

[0072] As can be seen in detail above, the proposed invention in a specific embodiment allows three single half-bridge modules with flat substrate surfaces or flat base plates to be integrated into a common metal frame as a first casing component by welding techniques, while simultaneously enhancing the heat transfer area on the cooling medium side. In a second step, a cover as a second casing component is welded to it, for example to form a fluid bath. The welding process does not affect the functionality of the power modules and allows the formation of a leak-free container without the use of O-rings and screws. This results in a compact solution with high reliability and high temperature rating.

[0073] Apart from that, temperature effects can be reduced, which reduces the risk of adversely affecting, for example, power semiconductor devices of the module.

[0074] In summary, when carrying out the described method the following advantages may arise: Firstly, the method allows for cost reduction. In this regard, the elimination of the pin-fin base plate, or even the entire base plate and the substrate-base plate joint from the bill of materials and manufacturing costs by replacing it with a much cheaper flat base plate or an insulated metal substrate allows for a low-cost concept, which is particularly attractive for mass-market automotive applications. The cooling structure, such as the turbulator structure, may be provided as a separate part at very low cost or can be manufactured with little extra cost into the cooler frame, i.e. the first casing component. Laser welding of the cooling structure can be realized in this concept with negligible additional cost, since it can be performed in one step with laser welding of the cooler frame, which would only extend the process by a few seconds per module.

[0075] Additionally, improved manufacturability may result, for example, due to the fact that the flat module bottom surface during the half-bridge assembly process simplifies manufacturing through easier testing, such as by scanning acoustic microscopy, and simplified handling of the parts.

[0076] Alternatively, having a cooler structure separate from, for example, a half-bridge module may provide increased flexibility by allowing changes to the cooler structure to be implemented without requiring costly modifications in the assembly line of the half-bridge module, such as by adapting the geometry of the fixtures or carriers, if, for example, the layout of the chip locations is changed.

[0077] For further advantages and technical features of the method, please refer to the structure, drawings and further description.

[0078] A configuration consisting of a power semiconductor module and a cooler is further described, the power semiconductor module comprising a substrate having a first substrate side carrying at least one electrical circuit and having a second substrate side located opposite the first substrate side, the power semiconductor module including one of features a10) and a20); According to feature a10), the second substrate side has a flat surface, a cooling area surrounded by a connection area is arranged on the second substrate side, the second substrate side is in contact with the cooler such that a first casing component of the cooler is connected to the second substrate side in the connection area, the first casing component optionally comprises at least one opening for receiving the cooling area, the second casing component is connected to the first casing component such that a cooling channel for a cooling fluid is provided between the first casing component and the second casing component, the cooling structure is welded to the cooling area on the second substrate side, and the cooling structure and at least one of the first casing component and the second casing component form a continuous structural element, According to feature a20), the power semiconductor module comprises a base plate, the base plate comprising a first base plate side and a second base plate side located opposite the first base plate side, the first base plate side being connected to the second substrate side, the second base plate side having a flat surface, a cooling area surrounded by a connection area being arranged on the second base plate side, the second base plate side being in contact with the cooler such that a first casing component of the cooler is connected to the second base plate side in the connection area, the first casing component optionally comprising at least one opening for receiving the cooling area, the second casing component being connected to the first casing component such that a cooling channel for a cooling fluid is provided between the first casing component and the second casing component, the cooling structure being welded to the cooling area at the second base plate side, and the cooling structure and at least one of the first casing component and the second casing component form a continuous structural element.

[0079] Such an arrangement can provide significant advantages over prior art solutions. Furthermore, the described arrangements can include or be formed with an inverter and / or can be formed according to the methods described above.

[0080] The feature that the cooling structure and at least one of the first and second casing components form a continuous structural element can be realized either by a one-piece or one-part component comprising the cooling structure and at least one of the first and second casing components, respectively. Alternatively, the continuous structural element may be formed by a two-piece component connected, for example by welding, where the cooling structure is connected, for example by welding, to the first or second casing component. The continuous structural element may therefore be understood as a common structural part.

[0081] The described configurations may provide improved productivity. Apart from that, the configurations may function with efficient cooling and high reliability.

[0082] In this regard, a power semiconductor module comprises a plurality of power semiconductor devices. Such power semiconductor devices may generally be formed as known in the art and may each include, among other things, transistors or switches, such as MOSFETs and / or IGBTs, and / or the plurality of power semiconductor devices may include, without limitation, diodes. The power semiconductor devices may each be interconnected and thus in electrical contact, such as in galvanic contact, with respective regions of a lead frame, such as by soldering or sintering the power semiconductor devices thereon.

[0083] To allow for mild operating conditions of the power semiconductor modules, in particular the power semiconductor devices, the power semiconductor modules are connected and thermally coupled to a cooler either directly via the substrate or by an additional base plate. The cooler thus serves to dissipate heat from the substrate and thus from the power semiconductor devices.

[0084] Therefore, a long-term stable and reliable configuration of the cooler that enables secure operational behavior can be provided, which can be attributed to the fact that the fluid-based cooler has an effective cooling capacity.

[0085] The power semiconductor module may further be enabled to be a transfer molding module.According to this embodiment, significant beneficial effects can be obtained.

[0086] In this regard, transfer molding power semiconductor modules have become an interesting alternative to conventional gel or resin encapsulation methods due to advantages in terms of cost since no housing is required, due to cycle reliability since it is possible to provide a hard mold and low CTE encapsulation of the power semiconductor devices and the respective connections, due to environmental protection since low moisture absorption and vapor diffusivity is achieved, and also due to vibration, shock and handling properties, as well as reduced warpage. Transfer molding modules therefore have significant advantages over prior art solutions.

[0087] It may further be enabled that the power semiconductor module is a three-phase module, again this embodiment being able to exhibit the advantages as described particularly effectively, since in particular for three-phase modules the connection of the substrate to the cooler was a problem according to the prior art.

[0088] Regarding three-phase modules, please note the following: In a two-level traction inverter driving a three-phase machine, six functional semiconductor switches are required. Looking at traction inverters for electric vehicles, for example, the current state of the art often includes six-pack modules that integrate three individual phases onto a common base plate or cooler. A typical module of this design is based on a three-phase pin-fin base plate, a plastic frame bonded to the base plate.

[0089] It is preferable to realize a three-phase molded module based on three individual molded modules, thus one half-bridge module per phase. As a result, the molded modules need to be mounted in the cooler system after molding.

[0090] Nevertheless, according to the prior art, the one-step sintering approach of the transfer molded six-pack module is economically very risky. The preferred solution is to aim for a six-pack configuration made by three different transfer molded sintered half-bridge modules, i.e. a three-phase module. However, there are significant challenges.

[0091] The integration by using O-rings offers some potential improvements, mainly for reliability reasons due to the aging of the O-rings, and for the use of screws which require assembly line storage and part numbers. Furthermore, this solution requires space for the screws, since for example each half-bridge module requires four screws.

[0092] Furthermore, the methods or techniques used for the integration must not damage the power module: in particular, temperatures must not exceed 225°C and mechanical stresses should be avoided, so as not to damage the moulding compound.

[0093] The fluid enclosure needs to be robust and leak-free, and at the same time, the design must be space-saving and inexpensive, apart from which, for example, the half-bridge module and its mechanical integration must be a low-cost process. For this reason, it is preferable to omit the base plate or to use a flat base plate without a cooling fin structure.

[0094] These problems are solved very effectively by the present invention. If a base plate is present, it shall be made possible that the base plate material is suitable for the chosen welding technique and has a surface finish that does not require a coating such as nickel for galvanic corrosion protection when installed in the cooling circuit. Examples of such materials could be a copper / aluminum base plate, with the aluminum part in contact with the cooling medium, or / and an AlSiC base plate, for example enriched with aluminum only in the welded area, or a copper / aluminum clad base plate. If the base plate is omitted, this may apply to the respective material of the substrate, and a metal or alloy may be formed as a bottom metallization on the ceramic substrate main layer.

[0095] The first and second casing components should be made from the same type of material, such as different aluminum alloys, but the welding techniques used can be different. For example, laser welding, which has low pressure, is very fast and does not result in high welding temperatures, can perform the welding of the power module to the first casing component, sometimes also commonly called the frame, and the welding of the cooling structure. Instead, friction stir welding, laser welding, cold metal transfer can perform the joining of the second casing component to the first casing component, since the requirements regarding maximum temperatures and mechanical stresses are less challenging. However, laser welding is preferred in order to use one process for all welding steps.

[0096] Regarding the choice of material and technology of the substrate or base plate, various options are possible, but what is common is that the opposite side of the power semiconductor device, and therefore the chip, i.e. its second side, is flat, preferably made of aluminum and has a layer that electrically insulates the metallization layer on the top side carrying the semiconductor chip from the cooling medium on the opposite side. The following examples are possible, but not limiting:

[0097] Ceramic substrates having Cu or Al metallization bonded to or integral with an aluminum / AlSiC or copper / aluminum clad base plate; A ceramic substrate with a thick metallization layer (preferably aluminum metallization on the bottom side for laser welding) and no base plate; An insulated metal substrate with an organic insulating layer and a thick metal layer (preferably aluminum) on the bottom surface, but no base plate.

[0098] For further advantages and technical features of this arrangement, please refer to the methods, drawings and further description.

[0099] BRIEF DESCRIPTION OF THE DRAWINGS These and other aspects of the invention will be appreciated and elucidated with reference to the embodiments described hereinafter. Individual features disclosed in the embodiments may be taken alone or in combination to constitute aspects of the invention. Features of different embodiments may be carried over from one embodiment to another. [Brief description of the drawings]

[0100] [Figure 1] FIG. 1 illustrates an embodiment of a power semiconductor module. [Diagram 2] FIG. 2 illustrates one embodiment of a first casing component. [Diagram 3] FIG. 2 shows the arrangement of a first casing component fixed to a power semiconductor module after a welding step. [Figure 4] FIG. 13 is a diagram showing the configuration of a first casing component fixed to a power semiconductor module after a cooling structure is fixed to a substrate of the power semiconductor module. [Diagram 5] FIG. 2 is a diagram showing the configuration of a power semiconductor module according to a first embodiment, the power semiconductor module having a first casing component and a second casing component to be fixed to the power semiconductor module, and a cooling structure fixed to a base plate. [Figure 6]FIG. 13 shows an arrangement of a power semiconductor module having a first casing component and a second casing component to be fixed to the power semiconductor module and a cooling structure fixed to a base plate according to a further embodiment. [Figure 7] FIG. 1 illustrates one embodiment of a second casing component. [Figure 8] FIG. 13 illustrates the configuration of a second casing component secured to a first casing component after a welding step. [Figure 9] FIG. 2 shows a further embodiment of a power semiconductor module. [Figure 10] FIG. 2 shows a further embodiment of a power semiconductor module. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0101] Description of the embodiments FIG. 1 shows a power semiconductor module 10 which is to be provided with a cooler 12 by using the method according to the invention as will be explained in more detail below.

[0102] The power semiconductor module 10 comprises a substrate 14 having a first substrate surface carrying at least one electrical circuit 18 and having a second substrate surface 20 opposite the first substrate surface 16, as shown in more detail below with respect to Figures 5 and 6 and Figures 9 and 10.

[0103] In a further embodiment, the second substrate surface 20 may be connected to the base plate 15, such that the following description of providing the cooler 12 on the substrate 14 can be replaced with providing the cooler 12 on the base plate 15.

[0104] The electrical circuitry 18 of the power semiconductor module 10 may be sintered to the substrate 14 if the power semiconductor module 10 is a transfer molded module, and includes power semiconductor devices 22, not shown in FIG. 1. Thus, a molding compound 24 is shown encapsulating the electrical circuitry 18. Thus, the power semiconductor module 10 is an overmolded module. However, terminals 26 for externally contacting the electrical circuitry 18 are shown extending from the molding compound 24.

[0105] As mentioned above, the substrate 14 comprises a second substrate side 20 adapted to be in contact with the cooler 12. The cooler 12 is thus connected to the second substrate side 20. With reference to FIG. 1, in particular the substrate metallization is shown, which forms the second substrate side 20.

[0106] The second substrate surface 20 is provided with a cooling region 28 surrounded by a connection region 30. The cooling region 28 is adapted for contact with a cooling fluid or cooling structure 32, and the connection region 30 is adapted for fastening to the cooler 12 as described in more detail below.

[0107] It is further shown that the second substrate surface 20 , and therefore also the cooling region 28 , has a flat surface and therefore does not have any cooling structures 32 .

[0108] Such a power semiconductor module 10 may, for example, be a half-bridge module or may, for example, be part of a three-phase module such as is often required in vehicles.

[0109] Such a power semiconductor device is also shown in FIGS. 9, a power semiconductor module 10 is shown, generally constructed as described above. It thus comprises a substrate 14 carrying a metallization 48 on a substrate insulating layer 50, the substrate 14 or its second side 20 being flat for contacting the cooler 12 and welding the cooling structure 32 thereto. The power semiconductor devices 22 of the electrical circuit 18 are connected to further areas of the metallization 48, for example by wire bond connections 54. It can further be seen that the electrical circuit 18 is encapsulated by a molding compound 24.

[0110] 10 comprises an additional base plate 15 having a first base plate surface 17 connected to a second substrate surface 20 and further having a second base plate surface 19. The second base plate surface 19 is in contact with the cooler 12 and is flat for welding a cooling structure 32 thereto.

[0111] In order to provide the cooler 12 in the power semiconductor module 10, it is provided to connect a first casing component 34 of the cooler 12 to the second substrate side 20 in the connection region 30. The first casing component 34 may be formed from aluminum. In order to enable the cooling region 28 and thus the cooling structure 32, which is to be fixed at a later stage to the second substrate side 20, to be active in the operating state of the cooler 12, in this embodiment the first casing component 34 comprises an opening 36 for receiving the cooling region 28 and thus the cooling structure 32 which is to be attached later.

[0112] Such a first casing component 34 is shown in Fig. 2. It is shown that the first casing component 34 comprises three openings 36 which may be adapted to receive three power semiconductor modules 10, such as three half-bridge modules. Holes 38 for fastening the arrangement consisting of the cooler 12 and the power semiconductor modules 10 to a support, for example, are further shown.

[0113] 3 shows a top view of the first casing component 34 fixed to the power semiconductor module 10 or its substrate 14, respectively, by a welding step. This step may for example be performed by laser welding.

[0114] More specifically, first casing component 34 is shown secured to substrate 14 by a continuous weld path 40 that extends continuously around the entire opening 36. Thus, weld path 40 provides mechanical stability as well as sealing first casing component 34 to substrate 14.

[0115] Figure 4 shows a further view of the first casing component 34 which is fixed to the power semiconductor module 10. According to Figure 4 it can be seen that a cooling structure 32 is welded to each cooling area 28 of the second substrate side 20 of the substrate 14 in order to increase the heat transfer area. The cooling structure 32 is formed in a wave shape, this configuration is not intended to limit the invention.

[0116] In FIG. 4, the types of turbulators as cooling structures 32 are the same for all three half-bridge modules, but they may also be of different geometric shapes or different types. For example, it may be possible to increase the crest points of the turbulators along the flow direction to mitigate the heat accumulation effect and achieve improved cooling area or more turbulence. One advantage of welding the cooling structures 32 is, for example, that different types of cooling structures 32 can be combined, providing high flexibility in thermal design.

[0117] The provision of a cooling structure 32 is further illustrated in FIGS. In particular, in Fig. 5 it is shown that the power semiconductor module 10 comprises a substrate 14 having a first substrate side 16 carrying at least one electrical circuit 18 and having a second substrate side 20 located opposite the first substrate side 16. The first substrate side 16 comprises a metallization 48 connected to a base metal layer 51 of the substrate 14, for example by an insulating sheet 52. The power semiconductor devices 22 of the electrical circuit 18 are connected to further areas of the metallization 48 by wire bond connections 54. It can further be seen that the electrical circuit is encapsulated by a molding compound 24.

[0118] With respect to the second substrate side 20, a first casing component 34 is shown to be connected to the substrate 12. More specifically, it can be seen that the first casing component 34 comprises a cooling structure 32 formed in one piece with the first casing component 34. Furthermore, a second casing component 42 should be connected to the first casing component 34. The arrows are intended to indicate that the first casing component 34 and the second casing component 42 including the cooling structure 32 are respectively fixed by welding, whereby the first casing component 34 is welded to the connection area 30, the cooling structure 32 is welded to the cooling area 28, and the second casing component 42 is welded to the first casing component 34 and, optionally, also to the cooling structure 32.

[0119] Providing the cooling structure 32 and the first casing component 34 in one-piece form can be achieved by directly manufacturing the cooling structure 32 in the first casing component 34 formed as a cooler frame part by any combination of stamping, machining, deformation processes, deep drawing, etc., or by pre-assembling the first casing component 34 and the cooling structure 32 as separate parts, connecting them by any joining process such as welding, brazing, adhesive bonding, etc., and then assembling them to the power semiconductor module 10.

[0120] Figure 6 shows an embodiment similar to that of Figure 5, generally to which the respective description refers. However, the embodiment according to Figure 6 differs from that of Figure 5 due to the fact that, although the cooling structure 32 is welded to the cooling area 28, the elements forming the cooling structure are also welded to the first casing component 34 and are therefore initially different parts compared to the first casing component 34.

[0121] Furthermore, with respect to the cooler 12, it is further provided that a second casing component 42 is connected to the first casing component 34 and, optionally, also to the cooling structure 32 in order to form the latter.

[0122] The second casing component 42 is shown in FIG. 7, where it is shown to include two openings 44 that can function as an inlet and an outlet for directing cooling fluid through the cooler 12.

[0123] More specifically, as shown in Fig. 8, the second casing component 42 is allowed to be fixed to the first casing component 34 in such a way that a cooling channel for supplying a cooling fluid to the cooling area 28 or the cooling structure 32 is provided between the first casing component 34 and the second casing component 42. This is realized in that the second casing component 42 is welded to the first casing component 34 by a welding technique along a weld path 46 that completely surrounds the cooling channel. Since the requirements regarding maximum temperature and mechanical stresses are less challenging compared to the welding step of fixing the first casing component 34 and the cooling structure 32 to the substrate 14, the welding step may be allowed to be performed by friction stir welding, laser welding and cold metal transfer.

[0124] Returning to the latter welding step of fastening the first casing component 34 to the substrate 14, the substrate material or substrate metallization may be selected as the best compromise between thermal performance, reliability, corrosion resistance and weldability. The latter point may be of great relevance. To avoid brittle intermetallic phases, the substrate 14 material at the weld interface, and thus at the connection region 30, may be formed from aluminum.

[0125] Returning to the previous figure, it can be seen that the first casing component 34 comprises ridges 35 which may form cooling channels when the first casing component 34 is secured to the second casing component 42 as shown above. In this case, the first casing component 34 may form a kind of cooling trough which is closed by the second casing component 42.

[0126] Thus, according to a preferred, non-limiting embodiment, a solution to the above-mentioned problem may be obtained by combining thus incorporating the power module 10 in a common frame with the first casing component 34 and increasing the heat transfer area of ​​the substrate or base plate in contact with the cooling medium by using welding techniques. The increase in the heat transfer area of ​​the power module 10 by the flat plate is crucial to cope with the high heat flux density generated by the die during switching operations.

[0127] To cool these efficiently, a higher heat transfer area and high turbulence are required compared to flat plates to increase the heat transfer rate of the fluid. This can be achieved efficiently and cost-competitively by welding aluminum turbulators or similar cooling structures 32 to the substrate or base plate surface in contact with the cooling medium. Aluminum turbulators, as well as state-of-the-art fins used in the automotive industry for air conditioning and oil heat exchangers, are inexpensive. They can be of different shapes and sizes. The selection is based on the cooling requirements as the cooling medium and turbulence, minimum allowable clearances, etc.

[0128] The turbulators or similar cooling structures may be inserted as separate components and welded to the substrate or base plate, or alternatively, the cooling structures may be an integral part of the cooler frame.

[0129] While the present invention has been illustrated and described in detail in the drawings and the foregoing description, such illustration and description are to be considered as illustrative or exemplary and not restrictive, and the present invention is not limited to the disclosed embodiments. Other variations to the disclosed embodiments can be understood and effected by those skilled in the art in the practice of the claimed invention, from a study of the drawings, the disclosure, and the appended claims. In the claims, the word "comprising" does not exclude other elements or steps, and the indefinite articles "a" or "an" do not exclude a plurality. The mere fact that certain measures are recited in mutually different dependent claims does not indicate that a combination of these measures cannot be used to advantage. Any reference signs in the claims should not be interpreted as limiting the scope. [Explanation of symbols]

[0130] List of References 10 Power Semiconductor Module 12 Cooler 14 Substrate 15 Base plate 16 First board surface 17 First base plate surface 18 Electrical Circuits 19 Second base plate surface 20 Second substrate surface 22 Power Semiconductor Devices 24 Molding Compound 26 Terminals 28 Cooling area 30 Connection Area 32 Cooling structure 34 first casing component 35 Ridge 36 Opening 38 holes 40 Welding Path 42 Second casing component 44 Opening 46 Welding Path 48 Metallization 50 Insulating layer 51 Base metal layer 52 Insulation sheet 54 Wirebond connection

Claims

1. A method of providing a cooler (12) for a power semiconductor module (10), comprising the steps of: a) providing the power semiconductor module (10) comprising a substrate (14) having a first substrate surface (16) for carrying at least one electrical circuit (18) and having a second substrate surface (20) located opposite the first substrate surface (16); The power semiconductor module (10) includes one of features a1) and a2), According to feature a1), the second substrate surface (20) has a flat surface and is adapted to be in contact with the cooler (12), and a cooling area (28) is arranged on the second substrate surface (20), the cooling area (28) being surrounded by a connection area (30), According to feature a2), the power semiconductor module (10) comprises a base plate (15), the base plate (15) comprises a first base plate side (17) and a second base plate side (19) located opposite the first base plate side (17), the second substrate side (20) is connected to the first base plate side (17), the second base plate side (19) has a flat surface and is adapted to be in contact with the cooler (12), and a cooling area (28) surrounded by a connection area (30) is arranged on the second base plate side (19), When feature a1) is realized, the method further comprises the steps of: b1) connecting a first casing component (34) of said cooler (12) to said second substrate surface (20) at said connection area (30), said first casing component (34) optionally comprising at least one opening (36) for receiving said cooling area (28); c1) connecting said second casing component (42) to said first casing component (34) such that a cooling channel is provided between said first casing component (34) and said second casing component (42) for supplying a cooling fluid to said cooling area (28); d1) welding a cooling structure (32) to the cooling region (28) on the second substrate surface (20); Including, Alternatively, when feature a2) is realized, the method further comprises: b2) connecting a first casing component (34) of said cooler (12) to said second base plate surface (19) at said connection area (30), said first casing component (34) optionally comprising at least one opening (36) for receiving said cooling area (28); c2) connecting said second casing component (42) to said first casing component (34) such that a cooling channel is provided between said first casing component (34) and said second casing component (42) for supplying a cooling fluid to said cooling region (28); d2) welding a cooling structure (32) to the cooling area (28) on the second base plate surface (19); Including, The method of claim 1, wherein the cooling structure (32) is welded to the first casing component (34) or the second casing component (42).

2. A method for providing a cooler (12) to a power semiconductor module (10), comprising: a) providing the power semiconductor module (10) comprising a substrate (14) having a first substrate surface (16) for carrying at least one electrical circuit (18) and having a second substrate surface (20) located opposite the first substrate surface (16); The power semiconductor module (10) includes one of features a1) and a2), According to feature a1), the second substrate surface (20) has a flat surface and is adapted to be in contact with the cooler (12), and a cooling area (28) is arranged on the second substrate surface (20), the cooling area (28) being surrounded by a connection area (30), According to feature a2), the power semiconductor module (10) comprises a base plate (15), the base plate (15) comprises a first base plate side (17) and a second base plate side (19) located opposite the first base plate side (17), the second substrate side (20) is connected to the first base plate side (17), the second base plate side (19) has a flat surface and is adapted to be in contact with the cooler (12), and a cooling area (28) surrounded by a connection area (30) is arranged on the second base plate side (19), When feature a1) is realized, the method further comprises the steps of: b1) connecting a first casing component (34) of said cooler (12) to said second substrate surface (20) at said connection area (30), said first casing component (34) optionally comprising at least one opening (36) for receiving said cooling area (28); c1) connecting said second casing component (42) to said first casing component (34) such that a cooling channel is provided between said first casing component (34) and said second casing component (42) for supplying a cooling fluid to said cooling area (28); d1) welding a cooling structure (32) to the cooling region (28) on the second substrate surface (20); Including, Alternatively, when feature a2) is realized, the method further comprises: b2) connecting a first casing component (34) of said cooler (12) to said second base plate surface (19) at said connection area (30), said first casing component (34) optionally comprising at least one opening (36) for receiving said cooling area (28); c2) connecting said second casing component (42) to said first casing component (34) such that a cooling channel is provided between said first casing component (34) and said second casing component (42) for supplying a cooling fluid to said cooling region (28); d2) welding a cooling structure (32) to the cooling area (28) on the second base plate surface (19); Including, 4. The method of claim 3, wherein said cooling structure (32) is designed in one piece with said first casing component (34) or said second casing component (42).

3. 3. The method according to claim 1 or 2, characterized in that said feature a1) is realized.

4. 3. The method according to claim 1 or 2, characterized in that said feature a2) is realized.

5. The method according to any one of claims 1 to 4, characterized in that the first casing component (34) is connected to the second substrate surface (20) or the second base plate surface (19) by welding.

6. Method according to any one of the preceding claims, characterized in that the second casing component (42) is connected to the first casing component (34) by welding.

7. The method according to any one of claims 1 to 3, characterized in that, if all of steps a1), b1), c1) and d1) are realized, the first casing component (34) is welded to the connection area (30) of the second substrate surface (20) along a weld path (40) that completely surrounds the opening (36).

8. 3. The method according to claim 1 or 2, characterized in that, if all of steps a2), b2), c2) and d2) are realized, the first casing component (34) is welded to the connection area (30) of the second base plate surface (19) along a weld path (40) that completely surrounds the opening (36).

9. The method according to any one of claims 1 to 8, characterized in that at least one of the welding of the cooling structure (32), the welding of the first casing component (34), or the welding of the second casing component (42) is performed by laser welding.

10. Method according to any one of claims 1 to 9, characterized in that step d1) is performed before step c1) or step d2) is performed before step c2).

11. Method according to any one of claims 1 to 9, characterized in that step d1) is carried out in parallel with step c1) or step d2) is carried out in parallel with step c2).

12. A configuration comprising a power semiconductor module (10) and a cooler (12), the power semiconductor module (10) comprising a substrate (14) having a first substrate surface (16) carrying at least one electrical circuit (18) and having a second substrate surface (20) located opposite the first substrate surface (16), the power semiconductor module (10) comprising one of features a10) and a20); According to feature a10), the second substrate surface (20) has a flat surface, a cooling area (28) surrounded by a connection area (30) is arranged on the second substrate surface (20), the second substrate surface (20) is in contact with the cooler (12) such that a first casing component (34) of the cooler (12) is connected to the second substrate surface (20) in the connection area (30), the first casing component (34) optionally having at least one opening (36) for receiving the cooling area (28). a second casing component (42) is connected to the first casing component (34) such that a cooling channel for a cooling fluid is provided between the first casing component (34) and the second casing component (42), a cooling structure (32) is welded to the cooling area (28) at the second substrate side (20) of the substrate (14), and the cooling structure (32) and at least one of the first casing component (34) and the second casing component (42) form a continuous structural element; According to feature a20), the power semiconductor module (10) comprises a base plate (15), the base plate (15) comprises a first base plate side (17) and a second base plate side (19) located opposite the first base plate side (17), the first base plate side (17) is connected to the second substrate side (20), the second base plate side (19) has a flat surface, a cooling area (28) surrounded by a connection area (30) is arranged on the second base plate side (19), and the second base plate side (19) is arranged such that a first casing component (34) of the cooler (12) is connected to the second base plate of the base plate (15) in the connection area (30). a first casing component (34) that is in contact with the cooler (12) so as to be connected to a rate surface (19), the first casing component (34) optionally comprising at least one opening (36) for receiving the cooling area (28), a second casing component (42) that is connected to the first casing component (34) such that a cooling channel for a cooling fluid is provided between the first casing component (34) and the second casing component (42), the cooling structure (32) being welded to the cooling area (28) at the second base plate surface (19), the cooling structure (32) and at least one of the first casing component (34) and the second casing component (42) forming a continuous structural element, A configuration, characterized in that the cooling structure (32) is welded to the first casing component (34) or the second casing component (42).

13. A configuration consisting of a power semiconductor module (10) and a cooler (12), the power semiconductor module (10) comprising a substrate (14) having a first substrate surface (16) carrying at least one electric circuit (18) and having a second substrate surface (20) located opposite the first substrate surface (16), the power semiconductor module (10) comprising one of features a10) and a20), According to feature a10), the second substrate surface (20) has a flat surface, a cooling area (28) surrounded by a connection area (30) is arranged on the second substrate surface (20), the second substrate surface (20) is in contact with the cooler (12) such that a first casing component (34) of the cooler (12) is connected to the second substrate surface (20) in the connection area (30), the first casing component (34) optionally having at least one opening (36) for receiving the cooling area (28). a second casing component (42) is connected to the first casing component (34) such that a cooling channel for a cooling fluid is provided between the first casing component (34) and the second casing component (42), a cooling structure (32) is welded to the cooling area (28) at the second substrate side (20) of the substrate (14), and the cooling structure (32) and at least one of the first casing component (34) and the second casing component (42) form a continuous structural element; According to feature a20), the power semiconductor module (10) comprises a base plate (15), the base plate (15) comprises a first base plate side (17) and a second base plate side (19) located opposite the first base plate side (17), the first base plate side (17) is connected to the second substrate side (20), the second base plate side (19) has a flat surface, a cooling area (28) surrounded by a connection area (30) is arranged on the second base plate side (19), and the second base plate side (19) is arranged such that a first casing component (34) of the cooler (12) is connected to the second base plate of the base plate (15) in the connection area (30). a first casing component (34) that is in contact with the cooler (12) so as to be connected to a rate surface (19), the first casing component (34) optionally comprising at least one opening (36) for receiving the cooling area (28), a second casing component (42) that is connected to the first casing component (34) such that a cooling channel for a cooling fluid is provided between the first casing component (34) and the second casing component (42), the cooling structure (32) being welded to the cooling area (28) at the second base plate surface (19), the cooling structure (32) and at least one of the first casing component (34) and the second casing component (42) forming a continuous structural element, A configuration, characterized in that the cooling structure (32) is designed in one piece with the first casing component (34) or with the second casing component (42).

14. 14. The arrangement according to claim 12 or 13, characterized in that the power semiconductor module (10) is a transfer molded module.

15. The arrangement according to any one of claims 12 to 14, characterized in that the power semiconductor module (10) is a three-phase module.

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