Power Semiconductor Components

Abstract

The cooling chamber (3) includes at least two power semiconductor modules (2) each connected to a cooling structure (4), and a cooling chamber (3) having an inlet port (11) and an outlet port (12), the cooling chamber (3) being configured to match the flow direction of a coolant material in the cooling chamber (3) from the inlet port (11) to the outlet port (12), and each of the at least two cooling structures (4) is provided in the cooling chamber (3) successively in the direction of the flow direction so that each of the at least two cooling structures (4) forms a flow resistance area (14) in the cooling chamber (3), and the cooling chamber (3) has at least one bypass area (1 7), wherein at least one bypass region (17) is connected in parallel to at least one flow resistance region (14) of the at least two flow resistance regions (14) that is closer to the inlet port (11), and the cooling chamber (3) is configured so that the flow rate of the at least one flow resistance region (14) connected in parallel to the at least one bypass region (17) closer to the inlet port (11) is smaller than the flow rate of one flow resistance region (14) of the at least two flow resistance regions (14) that is closer to the outlet port (12).

Description

[Technical field]

[0001] The present invention relates to power semiconductor components. [Background technology]

[0002] A key challenge in the power electronics business is, for example, the cooling of multiple power semiconductor modules. The cooling approach has a large impact on the current rating per chip of the power semiconductor module and therefore the number of chips required to achieve a certain power. When multiple power semiconductor modules are used, the power semiconductor modules can be cooled in a series configuration. However, in such a series configuration, the temperature of the coolant increases from the inlet port to the outlet port of the cooling chamber. Thus, the last semiconductor module closer to the outlet port is not cooled as effectively as the first power semiconductor module closer to the inlet port. Also, in such an arrangement, the power semiconductor module closer to the inlet port may be overcooled. Summary of the Invention [Problem to be solved by the invention]

[0003] It is an object of the present invention to provide a power semiconductor component with improved reliability. [Means for solving the problem]

[0004] This object is achieved by the subject matter of the independent claims. Further exemplary embodiments are evident from the dependent claims and the following description.

[0005] A first aspect of the present invention relates to a power semiconductor component. The term "power" herein and hereinafter refers to a power semiconductor component, power semiconductor module, and / or power semiconductor chip adapted to handle voltages and currents of more than 100V and / or more than 10A, such as illustratively voltages up to 1200V and currents of several hundred amperes.

[0006] The power semiconductor component, for example, has a main extension plane, the horizontal direction being aligned parallel to the main extension plane and the vertical direction being aligned perpendicular to the main extension plane.

[0007] According to an embodiment of the present invention, the power semiconductor component comprises at least two power semiconductor modules, each power semiconductor module being connected to a cooling structure, e.g., each power semiconductor module comprises a bottom surface on which the cooling structure is arranged.

[0008] Each power semiconductor module is, for example, in direct contact with the cooling structure. Alternatively, a bonding layer is disposed between each power semiconductor module and the cooling structure. The cooling structure is, for example, configured to increase the area of ​​a bottom surface of the power semiconductor module. The cooling structure is, for example, configured to cool the power semiconductor module during operation. The cooling structure includes, for example, copper or is made of copper.

[0009] Exemplarily, the cooling structures are formed of pin fins, e.g., the pin fins face away from the power semiconductor module, and each pin fin is formed of a vertically extending column, e.g., all the pin fins have a common extension direction parallel to the vertical direction.

[0010] Alternatively, the cooling structure is formed from thin plates, each of which extends vertically with a leading end facing away from the power semiconductor module, and each of the thin plates of one power semiconductor module extends horizontally across the width or length of the power semiconductor module.

[0011] According to an embodiment, the power semiconductor component comprises a cooling chamber having an inlet port and an outlet port. For example, the cooling chamber comprises a cover forming a cooling cavity, at least two side walls, a front part, a rear part, and a bottom part. The at least two side walls are horizontally connected, for example, by the front part and the rear part. The cover and the bottom part are vertically connected, for example, by the at least two side walls, the front part, and the rear part.

[0012] Exemplarily, the inlet port is provided at the front and the outlet port is provided at the rear, or the inlet and outlet ports are provided at the bottom, e.g., the inlet port is provided at the bottom in the region closer to the front and the outlet port is provided at the bottom in the region closer to the rear.

[0013] According to an embodiment of the power semiconductor component, the cooling chamber is configured for a flow direction of the coolant material within the cooling chamber from the inlet port to the outlet port, e.g., the cooling chamber, e.g., the cooling cavity, is configured to allow the coolant material to flow through the cooling chamber from the inlet port to the outlet port.

[0014] The flow direction of the coolant material is, for example, parallel to the main extension of the cooling chamber, i.e. along the main extension of the side walls, the cover and the bottom.

[0015] Illustratively, the cooling material is sent from the inlet port through the cooling cavity to the outlet port. The cooling material is, for example, a liquid coolant or a gas coolant. Illustratively, heat generated during the operation of the power semiconductor module can be effectively dissipated through the cooling material.

[0016] According to an embodiment of the power semiconductor component, each of the at least two cooling structures is formed in the cooling chamber successively in the direction of the flow direction such that each of the at least two cooling structures forms a flow resistance area in the cooling chamber. Each cooling structure is exemplarily configured to form a flow resistance for a cooling substance flowing from an inlet port to an outlet port. That is to say, each cooling structure combined with one power semiconductor module forms one flow resistance area. Exemplarily, the flow resistance of the flow resistance area is larger than the flow resistance between two successive flow resistance areas.

[0017] According to an embodiment of the power semiconductor component, the cooling chamber comprises at least one bypass region, for example the bypass region does not have a cooling structure, and illustratively the flow resistance of the bypass region is smaller than the flow resistance of the flow resistance region.

[0018] According to an embodiment of the power semiconductor component, the at least one bypass region is connected in parallel to at least one flow resistance region of the at least two flow resistance regions that is closer to the inlet port, for example, the bypass region is connected in parallel to the flow resistance region closest to the inlet port.

[0019] Illustratively, a bypass region connected in parallel to a flow resistance region is arranged in direct contact with the flow resistance region, i.e., no further elements are arranged between the bypass region and the flow resistance region.

[0020] According to an embodiment of the power semiconductor component, the cooling chamber is configured such that the flow rate of at least one flow resistance area connected in parallel to at least one bypass area closer to the inlet port is smaller than the flow rate of one of the at least two flow resistance areas closer to the outlet port.

[0021] In summary, such a power semiconductor component with a bypass region can provide, inter alia, the following advantages: it is possible to effectively cool, for example, power semiconductor modules arranged along the flow direction; it is further possible to avoid, for example, overcooling of power semiconductor modules close to the inlet port; and in addition, the temperature distribution across all power semiconductor modules is more uniform than in the absence of a bypass.

[0022] Furthermore, such a bypass area reduces the flow resistance across the power semiconductor component and, for example, changes the operating point of the coolant material pump, i.e. allows a higher flow rate through the cooling chamber. Thus, a higher current rating of the power semiconductor module can be achieved without changing the design of the power semiconductor module. This, for example, leads to a longer service life and thus a higher reliability of the power semiconductor component without being more expensive.

[0023] It is further conceivable to arrange at least two power semiconductor components adjacent to one another with parallel flow directions, in which the inlet port is a common inlet port and the outlet port is a common outlet port of the two power semiconductor components.

[0024] According to at least one embodiment of the power semiconductor component, at least one bypass region connected to at least one of the at least two flow resistance regions is interconnected by at least one intermediate region to one of the at least two flow resistance regions closer to the outlet port. For example, the intermediate region does not include additional structures, e.g. cooling structures, in the cooling cavity. For example, the intermediate region is configured such that the velocity through a cross section of the intermediate region perpendicular to the flow direction is substantially constant at any point of the cross section. Substantially constant here means that the deviation of the velocity from the average value is at most 10%.

[0025] The coolant material exiting the bypass region and the associated flow resistance region may, for example, be mixed with one another in the intermediate region, which illustratively results in a temperature reduction of the coolant material exiting the flow resistance region associated with the bypass.

[0026] According to at least one embodiment of the power semiconductor component, the cooling chamber comprises at least one opening.

[0027] According to at least one embodiment of the power semiconductor component, one of the at least two cooling structures protrudes into the cooling chamber through at least one opening, and another of the at least two cooling structures is integrally formed with the cooling chamber.

[0028] According to at least one embodiment of the power semiconductor component, the cooling chamber comprises at least two openings, for example openings, illustratively each opening being provided in a cover of the cooling chamber, illustratively each opening penetrating completely through the cover of the cooling chamber.

[0029] According to at least one embodiment of the power semiconductor component, at least two openings are arranged in the cooling chamber successively in the direction of the flow direction, for example the openings are located horizontally spaced apart from one another, for example along the flow direction.

[0030] According to at least one embodiment of the power semiconductor component, each of the at least two cooling structures protrudes into the cooling chamber through one of the at least two openings, each of the cooling structures protruding into the cooling chamber through an opening forming one of the flow resistance areas.

[0031] For example, one power semiconductor module is disposed in one of the openings such that the cooling structure passes through the opening of the cooling chamber, For example, each power semiconductor module has a horizontal dimension that is at least 5% greater than a horizontal dimension of the opening in which the power semiconductor module is disposed.

[0032] According to at least one embodiment of the power semiconductor component, each of the at least two cooling structures is formed integrally with the cooling chamber. The cooling structures are therefore part of the cooling chamber. In this case, each semiconductor module is arranged directly on the cooling chamber, exclusively in the area of ​​one of the cooling structures. In this embodiment, the cooling chamber is exemplarily formed as a closed cooler.

[0033] According to at least one embodiment of the power semiconductor component, at least one bypass region connected to one of the at least two flow resistance regions is arranged on at least one side of the flow resistance region, the side facing, for example, one side wall of the cooling chamber. In this embodiment, the bypass region is exemplarily arranged horizontally adjacent to the flow resistance region.

[0034] For example, the bypass regions connected to one of the at least two flow resistance regions are arranged on at least two sides of the flow resistance region, where the bypass regions are arranged symmetrically around the flow resistance region in the horizontal direction along the flow direction.

[0035] According to at least one embodiment of the power semiconductor component, at least one bypass region connected to one of the at least two flow resistance regions is arranged on a bottom side of the flow resistance region, the bottom side of the flow resistance region facing, for example, the bottom of the cooling chamber. In this embodiment, the bypass region is exemplarily arranged below the flow resistance region in the vertical direction.

[0036] According to at least one embodiment of the power semiconductor component, at least one bypass region connected to one of the at least two flow resistance regions is arranged on at least one side and a bottom surface of the flow resistance region.

[0037] According to at least one embodiment of the power semiconductor component, the at least one bypass area arranged on the bottom surface of the flow resistance area comprises a recess in the bottom of the cooling chamber, in this embodiment the bypass area arranged on the bottom surface of the flow resistance area is exemplarily formed between a main surface of a recess defined by the bottom of the cooling chamber and the bottom surface of the flow resistance area.

[0038] According to at least one embodiment of the power semiconductor component, the at least one bypass region arranged on a lateral side of the flow resistance region comprises a recess in a side wall of the cooling chamber, in which embodiment the bypass region arranged on a lateral side of the flow resistance region is formed between a main surface of a recess defined by the side wall of the cooling chamber and a lateral side of the flow resistance region.

[0039] For example, due to manufacturing tolerances, gaps exist between the cooling structure and the bottom of the cooling chamber. Furthermore, due to manufacturing tolerances, gaps exist between the cooling structure and the sidewalls of the cooling chamber. However, these gaps cannot be identified in the bypass unless the bottom and / or sidewalls include a recess. For example, the flow rate of the coolant through one of the gaps is an order of magnitude or more lower than the flow rate of the coolant through the bypass region.

[0040] Exemplarily, a bypass region located on the bottom surface of a flow resistance region is formed by a recess in the bottom and a gap between the recess in the bottom and the bottom surface of the flow resistance region. Alternatively or additionally, a bypass region located on a side of a flow resistance region is formed by a recess in the sidewall and a gap between the recess in the sidewall and the side of the flow resistance region.

[0041] According to at least one embodiment of the power semiconductor component, the recess in the base does not protrude beyond the flow resistance region in the flow direction. For example, the recess in the base completely overlaps the flow resistance region in the horizontal direction. Furthermore, the cross section of the recess in the base in the horizontal direction is smaller than the cross section of the flow resistance region in the horizontal direction.

[0042] According to at least one embodiment of the power semiconductor component, the main surface of the recess in the bottom is inclined relative to the main extension plane of the power semiconductor component, for example the distance between the main surface of the recess in the bottom and the bottom surface of the flow resistance region decreases in size in the flow direction, for example this distance decreases in size linearly or non-linearly.

[0043] According to at least one embodiment, the power semiconductor component comprises at least three power semiconductor modules, each connected to a cooling structure, and the cooling chamber comprises at least two bypass regions.

[0044] According to at least one embodiment of the power semiconductor component, each of the at least two flow resistance areas closer to the outlet port is connected in parallel to one of the at least two bypass areas.

[0045] According to at least one embodiment of the power semiconductor component, the flow rate of one of the at least two bypass regions closer to the inlet port is greater than the flow rate of one of the at least two bypass regions closer to the outlet port.

[0046] According to at least one embodiment of the power semiconductor component, the volume of the recess in the bottom closer to the inlet port is larger than the volume of the recess in the bottom closer to the outlet port. Exemplarily, the volume of the bypass region arranged on the bottom surface of the flow resistance region closer to the inlet port is larger than the volume of the bypass region arranged on the bottom surface of the flow resistance region closer to the outlet port.

[0047] According to at least one embodiment of the power semiconductor component, each recess in the bottom comprises a length parallel to the flow direction, the length of successive recesses in the bottom decreasing in the flow direction, e.g., the length of a recess in the bottom is the minimum extent of the recess in the bottom of the cooling chamber in a horizontal direction parallel to the flow direction.

[0048] According to at least one embodiment of the power semiconductor component, each recess in the bottom comprises a width perpendicular to the flow direction, the width of each recess in the bottom decreasing in the flow direction, e.g., the width of the recess in the bottom is the minimum extent of the recess in the bottom of the cooling chamber in a horizontal direction perpendicular to the flow direction.

[0049] Illustratively, the volume of the recess in the base depends on at least one of the length and width of the recess in the base. Furthermore, the volume of the bypass region disposed on the bottom surface of the flow resistance region depends on at least one of the length and width of the recess in the base.

[0050] According to at least one embodiment of the power semiconductor component, the volume of the recess in the side wall closer to the inlet port is larger than the volume of the recess in the side wall closer to the outlet port. Exemplarily, the volume of the bypass region arranged on a side of the flow resistance region closer to the inlet port is larger than the volume of the bypass region arranged on a side of the flow resistance region closer to the outlet port.

[0051] According to at least one embodiment of the power semiconductor component, each recess in the sidewall comprises a width perpendicular to the flow direction, and the width of each successive recess in the sidewall decreases in the flow direction, e.g., the width of the recess in the sidewall is the minimum extent between a side of the flow resistance region and the recess in the sidewall of the cooling chamber in a horizontal direction perpendicular to the flow direction.

[0052] According to at least one embodiment of the power semiconductor component, each recess in the sidewall includes a length parallel to the flow direction, and the length of each successive recess in the sidewall decreases in the flow direction, e.g., the length of the recess in the sidewall is the minimum extent of the recess in the sidewall of the cooling chamber in a horizontal direction along the flow direction.

[0053] Illustratively, the volume of the recess in the sidewall depends on at least one of the length and width of the recess in the sidewall.

[0054] It is further possible that the width of one of the recesses in the side wall decreases in the flow direction, for example the distance between the main surface of the recess in the side wall and the side of the flow resistance area decreases in size in the flow direction, for example this distance decreases in size linearly or non-linearly.

[0055] According to at least one embodiment of the power semiconductor component, the cross section perpendicular to the flow direction of successive bypass regions decreases in the flow direction by at least 20%.

[0056] According to at least one embodiment of the power semiconductor component, the cross section perpendicular to the flow direction of each bypass region is at least 5% and at most 50% of the total cross section perpendicular to the flow direction including the bypass regions and the flow resistance regions.

[0057] According to at least one embodiment of the power semiconductor component, each power semiconductor module comprises at least one power semiconductor chip.

[0058] For example, each power semiconductor module comprises a plurality of power semiconductor chips, the power semiconductor chips being horizontally spaced apart from one another, for example arranged at lattice points of a regular or irregular grid, for example arranged along rows and columns.

[0059] If the power semiconductor module comprises several power semiconductor chips, the bypass region arranged on the bottom side of the flow resistance region is, for example, inclined with respect to the main extension plane of the power semiconductor component. With such an arrangement, the flow rate in the flow resistance region can be predetermined by the distance between the main surface of the recess in the bottom of the cooling chamber and the bottom side of the flow resistance region. If the distance decreases in the flow direction, the flow rate in the flow resistance region increases as the outlet port is approached. Thus, the power semiconductor chips included in one of the power semiconductor modules and arranged close to the outlet port can also be effectively cooled.

[0060] For example, the recess in the bottom extends horizontally along the flow direction to the center of the power semiconductor chip closer to the outlet port. Illustratively, the recess in the bottom ends at least 1 mm to at least 5 mm before the center of the power semiconductor chip closer to the outlet port in the horizontal direction along the flow direction.

[0061] The subject matter of the invention will be explained in more detail below with reference to exemplary embodiments that are illustrated in the accompanying drawings. [Brief description of the drawings]

[0062] [Figure 1] 1 illustrates a cross-sectional view of a power semiconductor component according to an exemplary embodiment of the present invention. [Diagram 2] 2A and 2B show schematic cross-sectional and top views of a power semiconductor component according to an exemplary embodiment of the present invention; [Diagram 3] 1 illustrates a schematic top view of a power semiconductor component according to an exemplary embodiment of the present invention; [Figure 4] 1 illustrates a schematic top view of a power semiconductor component according to an exemplary embodiment of the present invention; [Diagram 5] 1 illustrates a schematic top view of a power semiconductor component according to an exemplary embodiment of the present invention; [Figure 6] 1 illustrates a schematic top view of a power semiconductor component according to an exemplary embodiment of the present invention; DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0063] The reference signs used in the drawings and their meanings are summarised in the list of reference signs: as a rule, identical parts are given the same reference signs in the figures.

[0064] The power semiconductor component 1 according to the exemplary embodiment of Fig. 1 comprises a cooling chamber 3. The cooling chamber 3 is formed from a cover 6, two side walls 8, a front part 9, a rear part 10 and a bottom part 7. These elements form a cooling cavity 18 through which a coolant substance can flow. At the bottom part 7 of the cooling chamber 3 an inlet port 11 and an outlet port 12 are provided. The inlet port 11 is arranged at the bottom part 7 in an area close to the front part 9 and the outlet port 12 is arranged at the area close to the rear part 10.

[0065] The cooling chamber 3 is configured to allow a coolant material to flow through the cooling chamber 3 from an inlet port 11 to an outlet port 12. The coolant material, for example a liquid coolant, is delivered from the inlet port 11 through the cooling cavity 18 to the outlet port 12. That is, the flow direction of the coolant material is from the inlet port 11 to the outlet port 12.

[0066] Furthermore, the cooling chamber 3 comprises three openings 5 ​​arranged successively along the flow direction, where the openings 5 ​​are provided in the cover 6 of the cooling chamber 3 such that the openings 5 ​​pass completely through the cover 6.

[0067] One power semiconductor module 2 is arranged in each opening 5. For better representation, only one power semiconductor module 2 is shown in Fig. 1. For example, each power semiconductor module 2 has a horizontal dimension that is larger than the horizontal dimension of the associated opening 5.

[0068] Each power semiconductor module 2 is provided with a cooling structure 4. In this embodiment, the cooling structure 4 is formed of vertically extending pin fins. Each cooling structure 4 of each power semiconductor module 2 protrudes through an opening 5 in which the power semiconductor module 2 is arranged. The cooling structure 4 further protrudes into a cooling cavity 18 of the cooling chamber 3.

[0069] During operation of the power semiconductor component 1, the coolant material is forced in a flow direction through the cooling chamber 3. Thereby, each cooling structure 4 impedes the undisturbed flow of the coolant material and thus each cooling structure 4 forms a flow resistance area 14 for the coolant material. In such a flow resistance area 14, the coolant material experiences a greater flow resistance compared to areas where no cooling structure 4 is present.

[0070] Furthermore, according to this embodiment, the cooling chamber 3 comprises two bypass regions 17, where each of the bypass regions 17 is connected in parallel to two flow resistance regions 14 close to the inlet port 11.

[0071] In this embodiment, the bypass regions 17 connected to the flow resistance regions 14 close to the inlet port 11 are arranged on a bottom surface 20 of the flow resistance regions 14. The bottom surfaces 20 of the flow resistance regions 14 are displayed with respect to Figure 2. Each of the bottom surfaces 20 of the flow resistance regions 14 faces the bottom 7 of the cooling chamber 3. Each bypass region 17 arranged on the bottom surface 20 of the flow resistance regions 14 comprises a recess in the bottom 7 of the cooling chamber 3.

[0072] In this embodiment, two recesses 13 are arranged in the bottom 7 of the cooling chamber 3. Each recess 13 is arranged in the bottom 7 below one of the two openings 5 ​​close to the inlet port 11. Below the opening 5 close to the outlet port 12, no recess 13 is arranged in the bottom 7.

[0073] The volume of the recess in the bottom 15 close to the inlet port 11 is larger than the volume of the recess in the bottom 15 close to the outlet port 12. Therefore, the recess in the bottom 15 close to the inlet port 11 has a larger flow rate than the recess in the bottom 15 close to the outlet port 12. Furthermore, the flow rate of the flow resistance region 14 connected in parallel to the bypass region 17 close to the inlet port 11 is smaller than the flow rate of the flow resistance region 14 connected in parallel to the bypass region 17 close to the outlet port 12. In addition, the flow rate of the flow resistance region 14 connected in parallel to the bypass region 17 close to the outlet port 12 is smaller than the flow rate of the flow resistance region 14 without a bypass close to the outlet port 12.

[0074] With reference to Figure 2, a cross-section is shown along the flow direction which is also shown in Figure 1. Here, three power semiconductor modules 2 are explicitly shown.

[0075] Each recess in the bottom 15 does not protrude beyond the flow resistance area 14 in the flow direction and in the horizontal direction. Here, each recess in the bottom 15 completely overlaps the flow resistance area 14 in the horizontal direction. Furthermore, the length of each recess in the bottom 15 in the flow direction is smaller than the length of each flow resistance area 14 in the flow direction. The volume of each bypass area 17 depends in this embodiment on the length of each recess in the bottom 15.

[0076] In relation to Fig. 3, as in Fig. 1, the two power semiconductor modules 2 close to the inlet port 11 are not shown. The recesses in the bottom 15 close to the inlet port 11 have a width perpendicular to the flow direction. Here, the width of each recess in the bottom 15 decreases in the flow direction, i.e. the width of the recess in the bottom 15 close to the inlet port 11 decreases in the flow direction and the width of the recess in the bottom 15 close to the outlet port 12 decreases in the flow direction.

[0077] The cooling chamber 3 of the power semiconductor component 1 according to Fig. 4 comprises two bypass regions 17, each connected in parallel to one of the flow resistance regions 14. Each bypass region 17 is arranged on two side surfaces 21 of the associated flow resistance region 14 close to the inlet port 11. Each of the side surfaces 21 of the flow resistance region 14 faces one side wall of the cooling chamber 3. In this embodiment, each bypass region 17 is arranged symmetrically around the associated flow resistance region 14 in the horizontal direction along the flow direction.

[0078] The bypass region 17 closer to the inlet port 11 has a width perpendicular to the flow direction that is greater than the width perpendicular to the flow direction of the bypass region 17 closer to the outlet port 12 .

[0079] The flow resistance area 14 close to the outlet port 12 is not provided with a bypass area. Directly adjacent flow resistance regions 14 as well as directly adjacent bypass regions 17 are interconnected with one another by intermediate regions 22 .

[0080] According to figure 5, each bypass region 17 arranged on a side 21 of a flow resistance region 14 comprises a recess in a side wall of the cooling chamber 3. The respective width of each bypass region 17 decreases in the flow direction.

[0081] Each of the power semiconductor modules 2 according to Fig. 6 comprises 20 power semiconductor chips 19. The power semiconductor chips 19 are arranged in the power semiconductor module along rows and columns.

[0082] Due to the shape of the bypass area 17 arranged on the surface of the bottom 7 of the flow resistance area 14, it is possible to cool the power semiconductor chips 19 close to the outlet port 12 of a power semiconductor module 2 as effectively as the power semiconductor chips 19 close to the inlet port 11 of the same power semiconductor module 2. [Explanation of symbols]

[0083] List of References 1. Power Semiconductor Components 2. Power Semiconductor Module 3 Cooling room 4 Cooling structure 5 Opening 6 Cover 7 Bottom 8 side wall 9 front 10 Rear 11 Inlet Port 12 Exit Port 13 Recess 14 Flow Resistance Area 15 Recess in bottom 16 Recess in side wall 17 Bypass Area 18 Cooling cavity 19 Power semiconductor chips 20 Bottom 21 Side 22 Intermediate area C Flow direction

Claims

1. at least two power semiconductor modules (2), each connected to a cooling structure (4); a cooling chamber (3) having two side walls (8), an inlet port (11) and an outlet port (12); Equipped with - the cooling chamber (3) is configured for a flow direction of coolant material within the cooling chamber (3) from the inlet port (11) to the outlet port (12); at least two of the cooling structures (4) are arranged in the cooling chamber (3) successively in the direction of the flow direction such that each of the at least two of the cooling structures (4) forms a flow resistance area (14) in the cooling chamber (3); said cooling chamber (3) comprises at least one bypass area (17); at least one of the bypass areas (17) is connected in parallel to at least one of the at least two flow resistance areas (14) that is closer to the inlet port (11); at least one of the bypass regions (17) has a width perpendicular to the flow direction, the width being defined as the distance between the two side walls (8), the width decreasing in the flow direction; the cooling chamber (3) is configured such that the flow rate of at least one of the flow resistance areas (14) connected in parallel to at least one of the bypass areas (17) closer to the inlet port (11) is smaller than the flow rate of one of the at least two flow resistance areas (14) closer to the outlet port (12); At least one of the bypass regions (17) connected to one of the at least two flow resistance regions (14) is interconnected to one of the at least two flow resistance regions (14) that is closer to the outlet port (12) by at least one intermediate region (22).

2. the cooling chamber (3) comprises at least one opening (5); one of the at least two cooling structures (4) protrudes into the cooling chamber (3) through the at least one opening (5); The other cooling structure (4) of the at least two cooling structures (4) is integrally formed with the cooling chamber; A power semiconductor component (1) according to claim 1.

3. 3. The power semiconductor component (1) according to claim 1 or 2, wherein at least one of the bypass areas (17) connected to one of the at least two flow resistance areas (14) is arranged on at least one side (21) of the flow resistance area (14).

4. 3. The power semiconductor component (1) according to claim 1 or 2, wherein at least one of the bypass areas (17) connected to one of the at least two flow resistance areas (14) is arranged on a bottom side (20) of the flow resistance area (14).

5. 3. The power semiconductor component (1) according to claim 1 or 2, wherein at least one of the bypass regions (17) connected to one of the at least two flow resistance regions (14) is arranged on at least one side (21) and on a bottom (20) of the flow resistance region (14).

6. At least two power semiconductor modules (2), each connected to a cooling structure (4); a cooling chamber (3) having two side walls (8), an inlet port (11) and an outlet port (12); Equipped with - the cooling chamber (3) is configured for a flow direction of coolant material within the cooling chamber (3) from the inlet port (11) to the outlet port (12); at least two of the cooling structures (4) are arranged in the cooling chamber (3) successively in the direction of the flow direction such that each of the at least two of the cooling structures (4) forms a flow resistance area (14) in the cooling chamber (3); said cooling chamber (3) comprises at least one bypass area (17); at least one of the bypass areas (17) is connected in parallel to at least one of the at least two flow resistance areas (14) that is closer to the inlet port (11); at least one of the bypass regions (17) has a width perpendicular to the flow direction, the width being defined as the distance between the two side walls (8), the width decreasing in the flow direction; the cooling chamber (3) is configured such that the flow rate of at least one of the flow resistance areas (14) connected in parallel to at least one of the bypass areas (17) closer to the inlet port (11) is smaller than the flow rate of one of the at least two flow resistance areas (14) closer to the outlet port (12); At least one of the at least two flow resistance regions (14) connected to one of the flow resistance regions (14) is arranged on at least one side surface (21) and a bottom surface (20) of the flow resistance region (14), at least one of the bypass areas (17) arranged on the bottom surface (20) of the flow resistance area (14) comprises a recess in the bottom (6) of the cooling chamber (3); the recess (15) in the bottom does not protrude beyond the flow resistance area (14) in the flow direction; Power semiconductor components (1).

7. 7. Power semiconductor component (1) according to claim 6, wherein a main surface of the recess (15) in the bottom is inclined with respect to a main extension plane of the power semiconductor component (1).

8. At least three power semiconductor modules (2), each connected to a cooling structure (4); Equipped with said cooling chamber (3) comprises at least two bypass areas (17); each of at least two of the flow resistance areas (14) closer to the outlet port (12) is connected in parallel to one of at least two of the bypass areas (17); - A power semiconductor component (1) according to any one of claims 1 to 7, wherein the flow rate of one of the at least two bypass regions (17) that is closer to the inlet port (11) is greater than the flow rate of one of the at least two bypass regions (17) that is closer to the outlet port (12).

9. 7. The power semiconductor component (1) according to claim 6, wherein a volume of the recess (15) in the bottom closer to the inlet port (11) is larger than a volume of the recess (15) in the bottom closer to the outlet port (12).

10. each recess (15) in the base has a length parallel to the flow direction, the length of successive recesses (15) in the base decreasing in the flow direction; and each recess (15) in the bottom has a width perpendicular to the flow direction, said width of each recess (15) in the bottom decreasing in the flow direction; 10. The power semiconductor component (1) according to claim 6 or 9, wherein said power semiconductor component (1) is at least one of

11. at least one of the bypass areas (17) arranged on the side (21) of the flow resistance area (14) is formed as a recess in a side wall of the cooling chamber (3); the volume of the recess in the side wall closer to the inlet port (11) is greater than the volume of the recess in the side wall closer to the outlet port (12); A power semiconductor component (1) according to claim 9 or 10.

12. each recess in the sidewall has a width perpendicular to the flow direction, the width of each successive recess in the sidewall decreasing in the flow direction; and Each recess in the side wall has a length parallel to the flow direction, and the length of each successive recess in the side wall decreases in the flow direction; 12. The power semiconductor component (1) according to claim 11, wherein said at least one of said first and second terminals is a first terminal.

13. the cross section perpendicular to the flow direction of the continuous bypass region (17) is reduced in the flow direction by at least 20%; and the cross section perpendicular to the flow direction of each bypass region (17) is at least 5% and at most 50% of the total cross section perpendicular to the flow direction including the bypass region (17) and the flow resistance region (14); The power semiconductor component (1) according to any one of claims 8 to 12, wherein said power semiconductor component (1) is at least one of the following:

14. The power semiconductor component (1) according to any one of the preceding claims, wherein each power semiconductor module (2) comprises at least one power semiconductor chip (19).

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