Molded film and method for producing same

Abstract

One object of the present invention is to provide a formed film and a method for manufacturing the formed film. According to one embodiment, a method for manufacturing the formed film includes providing a formable film having a conductive pattern on a first side thereof. The method further includes printing a deformation prevention element on the formable film and forming at least one portion of the formable film at a forming temperature. The modulus of elasticity of the deformation prevention element at the forming temperature may be greater than the modulus of elasticity of the formable film at the forming temperature. A method, a formed film, and an electronic device are provided.

Description

[Technical field]

[0001] The present disclosure relates to formed films, and more particularly to methods of making formed films, formed films, and electronic devices. [Background technology]

[0002] In-mold electronics has the potential to enable structural electronics, where the electronics are part of the structure itself. A printed circuit board (PCB), for example, can be replaced with a film that contains conductive traces and electronic components that are pre-placed on the PCB. The film can then be molded into the shape desired for the device. Summary of the Invention

[0003] This Summary is provided to introduce a selection of concepts in a simplified form that are further described below in the Detailed Description. This Summary is not intended to identify key features or important features of the claimed subject matter, nor is it intended to limit the scope of the claimed subject matter.

[0004] One object is to provide a shaped film and a method for producing the shaped film. These and other objects are achieved by the features of the independent claims. Further embodiments are evident from the dependent claims, the description and the drawings.

[0005] A method of manufacturing a formed film according to a first aspect includes providing a formable film having a conductive pattern on a first side, printing a deformation-preventing element on the formable film, and forming at least a portion of the formable film at a forming temperature, where the elastic modulus of the deformation-preventing element at the forming temperature is greater than the elastic modulus of the formable film at the forming temperature. This method can reduce deformation of the formable film, for example, in areas proximate to and / or covered by the deformation-preventing element.

[0006] In an implementation of the first aspect, forming at least one portion of the formable film at a forming temperature includes thermoforming at least one portion of the formable film at a forming temperature and / or injection molding a structure onto the formable film. In this manner, for example, while achieving a thermoformed and / or injection molded portion of the formable film, the deformation prevention element can prevent / reduce deformation of the film in critical areas.

[0007] In a further implementation of the first aspect, when at least one portion of the formable film is thermoformed at a forming temperature, the forming temperature is in the range of 130 to 200° C. In this manner, for example, the film can be efficiently thermoformed.

[0008] In a further implementation of the first aspect, the forming temperature is greater than the glass transition temperature of the formable film. In this manner, for example, the film can be efficiently thermoformed.

[0009] In a further implementation of the first aspect, printing the anti-deformation element onto the formable film comprises printing a nano-powder ink onto the formable film and sintering the nano-powder, or printing a curable ink onto the formable film and curing the curable ink. This method allows the anti-deformation element to be printed with a reduced thickness, for example, without the need for a separate adhesive between the anti-deformation element and the formable film.

[0010] In a further implementation of the first aspect, the nanopowder comprises a material selected from silver, gold, silicon, tungsten, titanium oxide, copper, platinum, palladium, aluminum, aluminum oxide, iron oxide, silica, silicon carbide, silicon dioxide, boron nitride, bismuth oxide, bismuth cobalt zinc oxide, nickel, carbon, and any combination thereof. By this method, for example, suitable deformation prevention elements for various applications can be printed.

[0011] In a further implementation of the first aspect, the curable ink comprises a material selected from an ultraviolet crosslinkable polymer ink, a thermal crosslinkable polymer ink, and a thermally curable ink. In this way, for example, the deformation prevention element can be effectively cured.

[0012] In a further implementation of the first aspect, the deformation prevention element is printed on a second side of the formable film opposite the first side of the formable film. In this manner, for example, the deformation prevention element can be printed using a conductive material.

[0013] In a further implementation of the first aspect, the formable film comprises a material selected from polyethylene terephthalate, polycarbonate, polymethyl methacrylate, cyclic olefin copolymer, triacetate, cyclic olefin copolymer, poly(vinyl chloride), poly(ethylene 2,6-naphthalate), polyimide, polypropylene, polyethylene, and any combination thereof. In this manner, for example, the film can be efficiently formed.

[0014] It should be understood that the above-described modes of implementation of the first aspect can be used in combination with each other. Some modes of implementation may be combined together to form further modes of implementation.

[0015] According to a second aspect, there is provided a formed film obtained by the method according to the first aspect.

[0016] An electronic device according to a third aspect includes the formed film according to the second aspect.

[0017] An electronic device according to a fourth aspect includes a formable film having a conductive pattern on a first side thereof and a printed anti-deformation element on the formable film, the anti-deformation element having a modulus of elasticity at a forming temperature greater than the modulus of elasticity of the formable film at the forming temperature. In such a configuration, the electronic device can include a formed portion, for example, without the forming adversely affecting the conductive pattern.

[0018] In an implementation of the fourth aspect, the forming temperature is greater than the glass transition temperature of the formable film. In such a configuration, the electronic device may, for example, be formed at the forming temperature.

[0019] In a further implementation of the fourth aspect, the deformation prevention element comprises a material selected from silver, gold, silicon, tungsten, titanium oxide, copper, platinum, palladium, aluminum, aluminum oxide, iron oxide, silica, silicon carbide, silicon dioxide, boron nitride, bismuth oxide, bismuth cobalt zinc oxide, nickel, carbon, and any combination thereof. In such a configuration, the deformation prevention element can be used for a variety of applications, for example.

[0020] In a further implementation of the fourth aspect, the formable film comprises a material selected from polyethylene terephthalate, polycarbonate, polymethyl methacrylate, cyclic olefin copolymer, triacetate, cyclic olefin copolymer, poly(vinyl chloride), poly(ethylene 2,6-naphthalate), polyimide, polypropylene, polyethylene, and any combination thereof. In such a configuration, the formable film may be compatible with a variety of manufacturing processes, for example.

[0021] In a further implementation of the fourth aspect, the thickness of the anti-deformation element in a direction perpendicular to the formable film is less than 50 micrometers. In such a configuration, the anti-deformation element may have a reduced thickness, for example, due to printing.

[0022] In a further implementation of the fourth aspect, the anti-deformation element is printed on a second side of the formable film opposite the first side of the formable film. In such a configuration, the anti-deformation element can include, for example, a conductive material without affecting the conductive pattern.

[0023] In a further implementation of the fourth aspect, the anti-deformation element is arranged to at least partially overlap the conductive pattern. In such a configuration, the anti-deformation element can, for example, reduce deformation of the conductive pattern.

[0024] In a further implementation of the fourth aspect, the distance between the conductive pattern and the deformation prevention element is less than 10 millimeters. In such a configuration, the deformation prevention element can, for example, reduce deformation of the conductive pattern.

[0025] In a further implementation of the fourth aspect, the conductive pattern includes at least one set of conductive traces. In such a configuration, the conductive pattern can, for example, carry signals for various electronic components.

[0026] In a further implementation of the fourth aspect, the formable film further includes an electronic, optical, and / or optoelectronic component attached to the first side of the formable film and electrically coupled to the conductive pattern. In such a configuration, the deformation prevention element can, for example, prevent the component from becoming dislodged during manufacturing.

[0027] In a further implementation of the fourth aspect, the deformation prevention element is arranged to at least partially overlap the electronic, optical and / or optoelectronic components, In such a configuration, the deformation prevention element can effectively prevent the components from being dislodged, for example, during manufacturing.

[0028] In a further implementation of the fourth aspect, the formable film is transparent. In such a configuration, the formable film can be suitable for optical and / or photonic applications, for example.

[0029] It should be understood that the above-described modes of implementation of the fourth aspect can be used in combination with each other. Some modes of implementation may be combined together to form further modes of implementation.

[0030] Many of the attendant features will be more readily appreciated as the same becomes better understood by reference to the following detailed description considered in connection with the accompanying drawings, in which:

[0031] Exemplary embodiments will now be described in more detail with reference to the accompanying drawings. [Brief description of the drawings]

[0032] [Figure 1] 1 shows a flow chart of a method for making a formed film according to one embodiment. [Diagram 2] FIG. 1 shows a schematic diagram of a formable film according to one embodiment. [Diagram 3] FIG. 2 shows a schematic diagram of a conductive pattern including one set of conductive traces according to one embodiment. [Figure 4] FIG. 1 illustrates a cross-sectional view of a formable film according to one embodiment. [Diagram 5] 1 illustrates a cross-sectional view of a formable film according to another embodiment. [Figure 6] 1 shows a schematic diagram of a touch sensitive-area on a formable film according to one embodiment. [Figure 7] FIG. 1 shows a schematic diagram of a formed film according to one embodiment. [Figure 8] FIG. 1 illustrates a schematic diagram of a part on a formable film according to one embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0033] Hereinafter, like reference numbers will be used to denote like parts in the accompanying drawings.

[0034] In the following description, reference is made to the accompanying drawings which form a part of this disclosure, and in which are shown by way of illustration specific aspects in which the present disclosure may be arranged. It is understood that other aspects may be utilized and structural or logical changes may be made without departing from the scope of the present disclosure. Therefore, the following detailed description should not be taken in a limiting sense, as the scope of the present disclosure is defined as the appended claims.

[0035] For example, it is understood that disclosure related to a described method may also apply to a corresponding apparatus or system configured to perform the method, and vice versa. For example, when a particular method step is described, the corresponding apparatus may include units for performing the described method step, even if such units are not explicitly described or shown in the drawings. Conversely, for example, when a particular apparatus is described based on functional units, the corresponding method may include steps for performing the described function, even if such steps are not explicitly described or shown in the drawings. Furthermore, it is understood that features of various exemplary aspects described herein can be combined with each other, unless otherwise specified.

[0036] FIG. 1 shows a flow chart of a method 100 for producing a formed film.

[0037] According to one embodiment, method 100 includes step 101 providing a formable film having a conductive pattern on a first side.

[0038] A formable film may also be referred to as a formable layer. In this specification, the terms "film" and "layer" should be understood to refer to a structure whose lateral dimensions are substantially greater than its thickness, unless otherwise specified. In this sense, a film is considered to be a "thin" structure. A formable film may refer to a film whose shape can be manipulated using, for example, pressure and / or temperature.

[0039] The method 100 may further include the step 102 of printing anti-deformation elements onto the formable film.

[0040] The deformation prevention elements may be referred to as deformation reduction elements or the like. The deformation prevention elements may not prevent all deformation of the film, but rather may reduce deformation of the film in areas proximate to the deformation prevention elements. The amount of deformation may be reduced, for example, to a level that is acceptable for a particular application.

[0041] The method 100 may further include the step 103 of forming at least one portion of the formable film at a forming temperature.

[0042] As used herein, forming can refer to changing the shape of a formable film, for example, using temperature and / or pressure and / or by attaching additional structures to the formable film. Forming may include, for example, thermoforming of the formable film and / or injection molding of structures onto the formable film.

[0043] The modulus of elasticity of the deformation preventing element at the forming temperature may be greater than the modulus of elasticity of the formable film at the forming temperature.

[0044] Because the anti-deformation element and the formable film are considered to be substantially planar structures, the modulus of elasticity may refer to the modulus of elasticity in that plane. For example, the modulus of elasticity of the anti-deformation element in the plane of the anti-deformation element at the forming temperature may be greater than the modulus of elasticity of the formable film in the plane of the formable film at the forming temperature.

[0045] As used herein, elastic modulus may refer to, for example, Young's modulus, shear modulus, and / or bulk modulus of the material.

[0046] For example, the Young's modulus of the deformation prevention element at molding temperatures may be greater than 100 megapascals (MPa), greater than 200 MPa, greater than 500 MPa, or greater than 1 gigapascal (GPa).

[0047] The ratio of the elastic modulus of the deformation prevention element at the forming temperature to the elastic modulus of the formable film at the forming temperature is, for example, greater than 5, greater than 10, greater than 50, greater than 10 2 Greater than 10 3 Greater than or equal to 10 4 The elastic modulus may for example be measured according to standard ISO 527 or standard JIS K 7161.

[0048] The high modulus of elasticity of the anti-deformation elements can reduce and / or prevent deformation, such as stretching and / or bulging, of the deformable film in areas proximate the anti-deformation elements, and thus can help preserve material dimensions of the formable film in critical non-forming areas, such as behind sensor or heater locations.

[0049] The tensile strength of the deformation preventing element at the forming temperature may be greater than the tensile strength of the formable film at the forming temperature.

[0050] According to one embodiment, forming 103 at least one portion of the formable film at a forming temperature includes thermoforming at least one portion of the formable film at a forming temperature and / or injection molding a structure onto the formable film.

[0051] According to one embodiment, when at least a portion of the formable film is thermoformed at a forming temperature, the forming temperature is in the range of 130-200° C. Alternatively or additionally, the forming temperature may be any subrange of this range, such as 130-180° C., 150-200° C., or 130-170° C.

[0052] According to one embodiment, the forming temperature is greater than the glass transition temperature of the formable film.

[0053] Glass transition temperature may refer to the temperature at which an amorphous material, or amorphous regions within a semi-crystalline material, transitions from a rigid state to a more viscous or rubbery state as the temperature increases. The glass transition temperature of a material characterizes the temperature range above which the glass transition occurs. The glass transition temperature is usually lower than the melting temperature of the material in its crystalline state. The glass transition temperature is determined when the dynamic viscosity of the material increases by 10 12 It may be defined as the temperature at which Pascal seconds (Pas) is reached.

[0054] The glass transition temperature of the formable film may be, for example, in the range of 50 to 130°C or any subrange therein, such as 50 to 100°C, 60 to 120°C, or 50 to 90°C.

[0055] For example, the glass transition temperature may be defined as 70° C. for polyethylene terephthalate and 80° C. for poly(vinyl chloride).

[0056] According to one embodiment, printing the anti-deformation element onto the formable film includes printing a nano-powder ink onto the formable film and sintering the nano-powder, or printing a curable ink onto the formable film and curing the curable ink.

[0057] Nanopowder may refer to a solid powder-like material of man-made origin that contains nanomaterials, aggregates and / or agglomerates of nanomaterials, or combinations thereof. Alternatively or additionally, nanopowder may refer to a powder in which all particles are smaller than 100 nanometers. Nanopowder ink may refer to a liquid that contains nanopowder.

[0058] Sintering of the nanopowder may be carried out using, for example, spark plasma sintering, electric sintering forging, pressureless sintering, microwave sintering, liquid phase sintering, solid phase sintering, laser sintering, selective laser sintering, photonic sintering, pulsed thermal processing (PTP), intense pulsed light (IPL) sintering, electron beam melting / sintering and / or reactive sintering. The type of sintering used may vary depending on the material of the nanopowder.

[0059] Sintering may be carried out at a sintering temperature, which may be in the range of 60 to 160°C or any subrange thereof, for example, 60 to 140°C, 70 to 130°C, or 100 to 130°C.

[0060] The nanopowder may comprise a material selected from silver, gold, silicon, tungsten, titanium oxide, copper, platinum, palladium, aluminum, aluminum oxide, iron oxide, silica, silicon carbide, silicon dioxide, boron nitride, bismuth oxide, bismuth cobalt zinc oxide, nickel, carbon, and any combination thereof.

[0061] Curable ink may refer to, for example, a thermally curable ink or an ultraviolet (UV) curable ink. Curing the curable ink may include curing the UV curable ink using UV radiation.

[0062] According to one embodiment, the curable ink comprises a material selected from a UV crosslinkable polymer ink, a thermally crosslinkable polymer ink, and a thermally curable ink.

[0063] According to one embodiment, the formable film is non-conductive, which allows for the insulating of the conductive pattern.

[0064] According to one embodiment, the formable film comprises a material selected from polyethylene terephthalate, polycarbonate, polymethyl methacrylate, cyclic olefin copolymer, triacetate, cyclic olefin copolymer, poly(vinyl chloride), poly(ethylene 2,6-naphthalate), polyimide, polypropylene, polyethylene, and any combination thereof.

[0065] According to one embodiment, the formable film is transparent. In this specification, the term "transparent" should be understood to refer to the optical transparency of the formable film or its parts and materials in the relevant wavelength range in question, unless otherwise specified. A transparent material or structure may refer to a material or structure that can transmit light or electromagnetic radiation in general of such relevant wavelength. The relevant wavelength range may depend on the application in which the transparent formable film is used. In one embodiment, the relevant wavelength range is the visible wavelength range of about 390 to about 700 nanometers. In one embodiment, the relevant wavelength range is 850 to 1550 nanometers.

[0066] Furthermore, the transparency of the formable film or part thereof primarily refers to the transparency of the formable film or part thereof in the thickness direction, so that a sufficient portion of the light energy incident on the formable film or part thereof propagates through the formable film or part thereof in the thickness direction to be "transparent". This portion may depend on the application in which the base film is used. In one embodiment, the transmittance of the formable film or part thereof is 20-99.99% of the light energy incident perpendicularly to the laminate film at the location where the transparent conductive material is present. In one embodiment, the transmittance is 20% or more, or 30% or more, or 40% or more, or 50% or more, or 60% or more, or 70% or more, or 80% or more, 90% or more. The transmittance may be measured according to standards JIS-K7361, ASTM D1003.

[0067] According to one embodiment, the conductive pattern comprises a network of conductive high aspect ratio molecular structures (HARM-structures).

[0068] A conductive "HARM structure" may refer to a conductive "nanostructure", i.e., a structure with one or more characteristic dimensions on the nanometer scale, e.g., about 100 nanometers or less. A "high aspect ratio" may refer to two perpendicular dimensions of a conductive structure having significantly different orders of magnitude. For example, a nanostructure may have a length that is tens or hundreds of times greater than its thickness and / or width. In a network of HARM structures, a large number of such nanostructures are interconnected with each other to form a network of electrically interconnected molecules. Considered on a macroscopic scale, a HARMS network forms a solid monolithic material in which the individual molecular structures are unoriented or unoriented, i.e., substantially randomly oriented or oriented. Various types of HARMS networks can be created in the form of thin transparent layers with suitable resistivities.

[0069] In one embodiment, the conductive HARM structure includes metal nanowires, such as silver nanowires or copper nanowires.

[0070] In one embodiment, the conductive HARM structure network comprises carbon nanostructures. In one embodiment, the carbon nanostructures comprise carbon nanotubes, carbon nanobuds, carbon nanoribbons, carbon nanofibers, or any combination thereof. In one embodiment, the carbon nanostructures comprise carbon nanobuds, i.e., carbon nanobud molecules. Carbon nanobuds or carbon nanobud molecules have fullerene or fullerene-like molecules covalently bonded to the sides of tubular carbon molecules. Carbon nanostructures, especially carbon nanobuds, may be advantageous from electrical, optical (transparency) and mechanical (robustness combined with flexibility and / or deformability) aspects.

[0071] According to one embodiment, the conductive pattern includes at least one set of conductive traces. The conductive traces can be used in a variety of layered electronic devices.

[0072] FIG. 2 shows a schematic diagram of a formable film 200 according to one embodiment.

[0073] According to one embodiment, electronic device 210 includes a formable film 200 having a conductive pattern 201 on a first side thereof and a printed anti-deformation element 204 on formable film 200 .

[0074] The electronics 210 are also called in-mold electronics.

[0075] The printed deformation prevention elements 204 may be referred to as deformation prevention elements, deformation reduction elements, or the like. The printed deformation prevention elements 204 may be in at least partial contact with the formable film 200 and / or the printed deformation prevention elements 204 may be in at least partial contact with the conductive pattern 201. The printed deformation prevention elements 204 may be attached to the formable film by printing.

[0076] Because the anti-deformation elements 204 are printed, no additional adhesive may be required between the anti-deformation elements 204 and the formable film 200. Additionally, the thickness of the anti-deformation elements 204 may be reduced compared to other methods.

[0077] Formable film 200 may be referred to as a formed film. This may indicate that at least one portion of the formable film has been formed. However, even if some portion of the formable film has been formed, some other portion of the formable film / formed film 200 may be formed at a later time.

[0078] The elastic modulus of anti-deformation element 204 at the forming temperature may be greater than the elastic modulus of formable film 200 at the forming temperature.

[0079] The molding temperature may be higher than the operating temperature of electronic device 210. The operating temperature may refer to the temperature at which electronic device 210 normally operates and / or is designed to operate. The operating temperature may be in the range of -50 to 50°C, for example.

[0080] Anti-deformation elements 204 may be configured to prevent / reduce deformation of formable film 200 at and / or near the location of anti-deformation elements 204 .

[0081] According to one embodiment, the conductive pattern 201 includes at least one set of conductive traces 202. In the embodiment of Figure 2, for example, the conductive pattern 201 includes two traces 202. The embodiment of Figure 2 is merely exemplary, and one set of conductive traces 202 may include any number of conductive traces 202.

[0082] Formable film 200 may further include at least one portion 203 that is formed. At least one portion 203 may be formed using, for example, thermoforming and / or injection molding. The shape of at least one portion 203 may vary, and the embodiments described herein are merely exemplary. Once forming is complete, at least one portion 203 may be referred to as at least one formed portion.

[0083] When at least one portion 203 is molded, the area outside of the portion 203 may also deform. Due to the deformation, the distance between the conductive traces 202 of the conductive pattern 201 may change in areas close to the molded portion 203. This may be problematic, for example, when a connector is attached to the conductive traces 202, as the pins of the connector may not be aligned with the conductive traces 202.

[0084] The formable film 200 may include printed anti-deformation elements 204. The anti-deformation elements 204 may prevent or reduce deformation of the deformable film 200 in areas proximate the anti-deformation elements 204. Thus, in areas of the formable film 200 proximate the anti-deformation elements 204, the distance between the conductive traces 202 of the conductive pattern 201 may not change significantly.

[0085] According to one embodiment, the thickness of the anti-deformation element 204 in a direction perpendicular to the formable film is less than 50 micrometers (μm). Alternatively or additionally, the thickness of the anti-deformation element 204 may be less than 20 μm, less than 10 μm, less than 5 μm, less than 1 μm, and / or less than 0.5 μm.

[0086] In some embodiments, the anti-deformation element 204 may overlap the conductive pattern 201, although this may not generally be the case. The anti-deformation element 204 may be disposed near the conductive pattern 201.

[0087] According to one embodiment, the distance between the conductive pattern 201 and the deformation prevention element 204 is less than 10 millimeters (mm). Alternatively or additionally, the distance may be less than 5 mm, less than 2 mm, less than 1 mm, less than 500 μm, less than 100 μm and / or less than 10 μm.

[0088] According to one embodiment, the anti-deformation element 204 is positioned to at least partially overlap the conductive pattern 201. In this specification, "overlapping" may mean that the projection of the conductive pattern onto the plane of the formable film 200 overlaps with the projection of the conductive pattern 201 onto the plane of the formable film 200, i.e., the projections have at least some common portion in the plane. Thus, the anti-deformation element 204 can overlap the conductive pattern 201 even if the anti-deformation element 204 and the conductive pattern are positioned on opposite sides of the formable film 200.

[0089] The electronics 210 and / or the formable film 200 may be embodied in, for example, a touch sensor, a vehicle user interface, a heating element, a solar panel, a sensor, a chemical sensor, a medical device, a display, and / or a lighting fixture.

[0090] FIG. 3 shows a schematic diagram of a conductive pattern 201 according to one embodiment.

[0091] The conductive pattern 201 may include at least one set 301 of conductive traces 202. A set of conductive traces may include multiple conductive traces 202. The conductive traces 202 may be substantially parallel.

[0092] When the formable film 200 is formed, the pitch between the conductive traces 202 may change. This may be problematic, for example, when a connector is attached to the set 301 of conductive traces 202, as the pins of the connector may not be aligned with the conductive traces 202. This problem may be more severe if the number of traces 202 is large and / or the pitch between the traces 202 is small.

[0093] The anti-deformation elements 204 can maintain a substantially constant pitch between the conductive traces 202 by reducing deformation of the formable film 200 in areas proximate the anti-deformation elements 204 .

[0094] 4 illustrates a cross-sectional view of a formable film 200 according to one embodiment. Formable film 200 may include a first side 401 and a second side 402. Second side 402 may be opposite first side 401.

[0095] The conductive pattern 201 may be disposed on a first side 401 of the formable film 200 .

[0096] According to one embodiment, the deformation prevention element 204 is disposed on a second side 402 of the formable film 200 opposite the first side 401 of the formable film 200. For example, the deformation prevention element 204 may be printed on the second side 402 of the formable film 200.

[0097] FIG. 5 illustrates a cross-sectional view of a formable film 200 according to another embodiment.

[0098] In some embodiments, the conductive pattern 201 and the anti-deformation element 204 may be disposed on the first side 401 of the formable film 200. For example, the anti-deformation element 204 may be printed on the first side 401 of the formable film 200.

[0099] The conductive pattern 201 and the anti-deformation element 204 may be disposed on the same side of the formable film 200. This may be the case, for example, if the anti-deformation element 204 is non-conductive and does not affect the signals carried by the traces 202 of the conductive pattern 201. Alternatively or additionally, an additional non-conductive layer / coating may be disposed between the conductive pattern 201 and the anti-deformation element 204.

[0100] The cross-sectional shapes and / or dimensions presented in the embodiments of Figures 4 and 5 are merely illustrative and may not reflect the actual shapes and / or dimensions of the parts presented.

[0101] 6 shows a schematic diagram of a touch sensitive area 601 on a formable film 200 according to one embodiment. The conductive pattern in the embodiment of FIG. 6 includes two sets 301 of conductive traces 202. The conductive traces 202 can carry signals from the touch sensitive area 601. The touch sensitive area 601 may include, for example, a capacitive touch interface. The conductive traces 202 may be electrically coupled to a connector 602. The connector 602 can be used to provide signals from the conductive traces 202 to other devices and / or components.

[0102] The at least one molded portion 203 may include a touch-sensitive area 601. In this manner, the touch-sensitive area 601 may be molded into a variety of shapes for different user interface applications.

[0103] The molding of the film may also distort the areas outside of the molded at least one portion 203, so the pitch between the conductive traces 202 may change. Because of this, the pins of the connector 602 may not align with the conductive traces 202. This requires the conductive traces 202 to be run further away from the molded at least one portion 203 and the connector 602 to be positioned further away from the formed portion 203.

[0104] The anti-deformation elements 402 may be positioned near the molded portion 203. The anti-deformation elements 402 reduce deformation of the film outside the molded portion 203 so that the pitch between the conductive traces 202 is not significantly altered by molding. Thus, the connectors 402 can be positioned closer to the molded portion 203, and the total footprint of the conductive traces 202 can be reduced.

[0105] 7 shows a perspective view of a shaped film 200 according to one embodiment. The shaped portion 203 shown in the embodiment of FIG. 7 is shaped substantially hemispherically. The hemispherical shape may include, for example, a touch-sensitive interface 601 similar to that presented in the embodiment of FIG. 6. An anti-deformation element 204 may be disposed near the shaped portion 203.

[0106] FIG. 8 shows a schematic diagram of a part 801 of formable film 200 according to one embodiment.

[0107] According to one embodiment, the formable film 200 further includes electronic components (e.g., integrated circuits), optical components (e.g., light guides), flexible cables, flexible printed circuits, and / or optoelectronic components (e.g., LEDs) attached to a first side of the formable film and electrically coupled to the conductive pattern 201.

[0108] The components 801 may include, for example, electronic, optical, and / or optoelectronic components. The components 801 may be electrically coupled to the conductive pattern 201. The conductive traces 202 of the conductive pattern 201 may provide a drive signal to the components 801.

[0109] According to one embodiment, the deformation prevention element is arranged to at least partially overlap the electronic, optical and / or optoelectronic component.

[0110] Part 801 may separate from formable film 200 during forming due to deformation of formable film 200. Deformation prevention element 204 may be printed / placed near part 801 to prevent deformation of formable film 200 at the location of part 801. As shown in the embodiment of FIG. 8, deformation prevention element 204 may further overlap part 801.

[0111] Although only certain components and features of formable film 200 are disclosed in the embodiments herein, formable film 200 may include any number of components and other features. For example, formable film 200 may include a number of formable portions 203. Formable film 200 may also include a number of components 801 and a number of sets 301 of conductive traces 202, which may be interconnected in various ways depending on the application.

[0112] According to one embodiment, electronic device 210 further includes a second conductive pattern attached to a surface of a second formable film facing the first formable film, the conductive pattern attached to the surface of the first formable film facing the second formable film being the first conductive pattern. This embodiment provides a device with at least two conductive patterns attached to opposing formable films facing each other.

[0113] According to alternative embodiments, the second conductive pattern may be attached to the opposite side of the first formable film or the opposite side of the second formable film.

[0114] According to one embodiment, the first conductive pattern and the second conductive pattern are aligned such that they are separated within the plane of the parallel first and second formable films. In this embodiment, the conductive patterns are separated such that they are insulated from each other. For example, in applications such as touch sensors, the electrodes may be in different planes and not overlap.

[0115] Any ranges or instrument values ​​given herein may be expanded or modified without losing the effect sought, and any embodiment may be combined with another embodiment, unless expressly prohibited.

[0116] Although the subject matter has been described in language specific to structural features and / or acts, it is to be understood that the subject matter defined in the appended claims is not necessarily limited to such specific features or acts. Rather, the specific features and acts are disclosed as example forms of implementing the claims and other equivalent features and acts are intended to be within the scope of the claims.

[0117] It will be understood that the benefits and advantages described above may relate to one embodiment or to several embodiments. The embodiments are not limited to those that solve any or all of the stated problems or those that have any or all of the stated benefits and advantages. Further, it will be understood that references to an item with "an" may refer to one or more of those items.

[0118] The steps of the methods described herein may be performed in any suitable order, or simultaneously where appropriate. Additionally, individual blocks may be deleted from any method without departing from the spirit and scope of the subject matter described herein. Aspects of any of the above embodiments may be combined with aspects of any of the other embodiments described to form further embodiments without losing the desired effect.

[0119] As used herein, the term "comprising" means including the specified methods, blocks, or elements, but such blocks or elements are not inclusive of an exclusive list and the method or apparatus may include additional blocks or elements.

[0120] It will be understood that the above description is given by way of example only, and that various modifications may be made by those skilled in the art. The above specification, examples, and data provide a complete description of the structure and use of the exemplary embodiments. Although various embodiments have been described above with a degree of particularity, or with reference to one or more individual embodiments, those skilled in the art may make numerous modifications to the disclosed embodiments without departing from the spirit or scope of the present specification.

Claims

1. 1. A method for producing a formed film, comprising: providing a formable film having a conductive pattern on a first side thereof; printing a deformation prevention element on the formable film by printing a nano powder ink on the formable film and sintering the nano powder, the deformation prevention element being printed on a second side of the formable film opposite the first side of the formable film; forming at least one portion of the formable film at a forming temperature; The method, wherein the modulus of elasticity of the deformation prevention element at the forming temperature is greater than the modulus of elasticity of the formable film at the forming temperature.

2. forming the at least one portion of the formable film at the forming temperature; thermoforming said at least one portion of said formable film at said forming temperature; and / or The method of claim 1 including the step of injection molding a structure onto the formable film.

3. The method of claim 2, wherein when said at least one portion of said formable film is thermoformed at said forming temperature, said forming temperature is in the range of 130 to 200°C.

4. The method of any one of claims 1 to 3, wherein the forming temperature is greater than the glass transition temperature of the formable film.

5. 5. The method of any one of claims 1 to 4, wherein the nanopowder comprises a material selected from silver, gold, silicon, tungsten, titanium oxide, copper, platinum, palladium, aluminum, aluminum oxide, iron oxide, silica, silicon carbide, silicon dioxide, boron nitride, bismuth oxide, bismuth cobalt zinc oxide, nickel, carbon, and any combination thereof.

6. 6. The method of any one of claims 1 to 5, wherein the formable film comprises a material selected from polyethylene terephthalate, polycarbonate, polymethyl methacrylate, cyclic olefin copolymer, triacetate, cyclic olefin copolymer, poly(vinyl chloride), poly(ethylene 2,6-naphthalate), polyimide, polypropylene, polyethylene, and any combination thereof.

7. A formed film obtained by the method according to any one of claims 1 to 6.

8. 8. An electronic device comprising the molded film of claim 7.

9. a formable film having a conductive pattern on a first side; a printed anti-deformation element on the formable film produced by printing a nano-powder ink on the formable film and sintering the nano-powder; the deformation prevention element is disposed on a second side of the formable film opposite the first side of the formable film; The electronic device, wherein the elastic modulus of the deformation prevention element at a forming temperature is greater than the elastic modulus of the formable film at the forming temperature.

10. 10. The electronic device of claim 9, wherein the forming temperature is greater than a glass transition temperature of the formable film.

11. 11. The electronic device of claim 9 or 10, wherein the deformation prevention element comprises a material selected from silver, gold, silicon, tungsten, titanium oxide, copper, platinum, palladium, aluminum, aluminum oxide, iron oxide, silica, silicon carbide, silicon dioxide, boron nitride, bismuth oxide, bismuth cobalt zinc oxide, nickel, carbon, and any combination thereof.

12. 12. The electronic device of claim 9, wherein the formable film comprises a material selected from polyethylene terephthalate, polycarbonate, polymethyl methacrylate, cyclic olefin copolymer, triacetate, cyclic olefin copolymer, poly(vinyl chloride), poly(ethylene 2,6-naphthalate), polyimide, polypropylene, polyethylene, and any combination thereof.

13. The electronic device according to any one of claims 9 to 12, wherein the thickness of the deformation prevention element in a direction perpendicular to the formable film is less than 50 micrometers.

14. The electronic device according to any one of claims 9 to 13, wherein the deformation prevention element is arranged to at least partially overlap the conductive pattern.

15. The electronic device according to any one of claims 9 to 14, wherein the distance between the conductive pattern and the deformation prevention element is less than 10 millimeters.

16. The electronic device of any one of claims 9 to 15, wherein the conductive pattern comprises at least one set of conductive traces.

17. The electronic device of any one of claims 9 to 16, wherein the formable film further comprises an electronic component, an optical component, a flexible cable, a flexible printed circuit board, and / or an optoelectronic component attached to the first side of the formable film and electrically coupled to the conductive pattern.

18. The electronic device according to claim 17 , wherein the deformation prevention element is arranged to at least partially overlap the electronic component, the optical component, the flexible cable, the flexible printed circuit board, and / or the optoelectronic component.

19. 19. The electronic device of claim 17 or 18, wherein the formable film is transparent.

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