Semiconductor optical device and method for manufacturing the same

Abstract

This semiconductor optical device comprises, e.g.: a base intersecting with a first direction; a first protruding part which protrudes in the first direction from the base and has a planar lightwave circuit provided with a core layer and a cladding layer surrounding the core layer; a second protruding part which protrudes in the first direction from the base, is arranged in a line with the first protruding part in a second direction intersecting with the first direction, and is lower in height from the base in the first direction than the first protruding part; an optical semiconductor element which is mounted on the end surface in the first direction of the second protruding part and which is optically connected with the core layer; and a marker which is made of the same material as the core layer and which is provided to the second protruding part so as to be exposed on the end surface.

Description

[Technical field]

[0001] The present invention relates to a semiconductor optical device and a method for manufacturing the semiconductor optical device. [Background technology]

[0002] Conventionally, a semiconductor optical device has been known in which a planar lightwave circuit is formed on a silicon substrate and a laser element is attached at a predetermined position on a submount including the silicon substrate and the planar lightwave circuit (Patent Document 1). In Patent Document 1, an alignment marker is formed on the submount to position the submount and the laser element. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2007-264470 A Summary of the Invention [Problem to be solved by the invention]

[0004] Conventionally, such alignment markers are often formed by forming a metal layer on the surface of the submount and then removing the metal layer so that the shape of the alignment marker remains. In this case, if the positional accuracy of the alignment marker with respect to the core layer of the planar lightwave circuit is low, the positional accuracy between the laser element and the planar lightwave circuit will also be low.

[0005] Therefore, one object of the present invention is to provide a semiconductor optical device having an improved and novel configuration that enables, for example, greater improvement in the positioning accuracy of an optical semiconductor element, and a method for manufacturing the semiconductor optical device. [Means for solving the problem]

[0006] The semiconductor optical device of the present invention includes, for example, a base intersecting a first direction, a first protrusion protruding from the base in the first direction and having a planar lightwave circuit including a core layer and a cladding layer surrounding the core layer, a second protrusion protruding from the base in the first direction, aligned with the first protrusion in a second direction intersecting the first direction and having a height from the base in the first direction lower than that of the first protrusion, an optical semiconductor element placed on an end face in the first direction of the second protrusion and optically connected to the core layer, and a marker provided on the second protrusion so as to be exposed on the end face and made of the same material as the core layer.

[0007] In the semiconductor optical device, the height in the first direction from the base of the end of the core layer opposite the first direction may be the same as the height in the first direction from the base of the end of the marker opposite the first direction.

[0008] The semiconductor optical device may include, as the marker, a first marker that is adjacent to an edge of the optical semiconductor element with a gap therebetween when viewed in a direction opposite to the first direction.

[0009] The semiconductor optical device may include two second markers as the markers, and when viewed in a direction opposite to the first direction, the optical semiconductor element may be located between the two second markers.

[0010] In the semiconductor optical device, the optical semiconductor element has a rectangular shape when viewed in the opposite direction to the first direction, and the semiconductor optical device may be provided with a third marker as the marker, the third marker being adjacent to a corner of the optical semiconductor element when viewed in the opposite direction to the first direction.

[0011] The semiconductor optical device may have two second protrusions as the second protrusion, and the optical semiconductor element may have a first electrode provided on an end face of the optical semiconductor element opposite to the first direction and positioned between the two second protrusions.

[0012] The semiconductor optical device may further include a conductor located between the two second protrusions and electrically connected to the first electrode.

[0013] In the semiconductor optical device, the conductor may be a conductive paste.

[0014] In the semiconductor optical device, a rough surface may be provided at a position on the end face of the base in the first direction between the two second protrusions, the rough surface being in contact with the conductive paste and having a surface roughness greater than other portions.

[0015] The semiconductor optical device may include a second electrode provided at a position between the two second protrusions on an end surface of the base in the first direction and electrically connected to the conductor.

[0016] The semiconductor optical device may include a third protrusion protruding in the first direction from a position between the two second protrusions of the base and having a height from the base in the first direction lower than that of the two second protrusions, and a third electrode provided on an end surface of the third protrusion in the first direction and electrically connected to the conductor.

[0017] In the semiconductor optical device, the two protrusions may be spaced apart in the second direction, and the second protrusion that is located farther from the first protrusion of the two second protrusions may be integrated with the third protrusion.

[0018] The semiconductor optical device may include a fourth protrusion protruding from the base in the first direction on the opposite side to the second protrusion which is integrated with the third protrusion, and having a height from the base in the first direction greater than the two second protrusions, and a fourth electrode electrically connected to the third electrode may be provided on an end face of the fourth protrusion in the first direction.

[0019] The semiconductor optical device may include a wiring pattern that is provided across the first direction end face of the third protrusion, the first direction end face of the second protrusion integrated with the third protrusion, and the first direction end face of the fourth protrusion, electrically connecting the third electrode and the fourth electrode.

[0020] The semiconductor optical device may have a first inclined surface between the third protrusion and the second protrusion integrated with the third protrusion, the first inclined surface extending toward the first direction as it moves in the opposite direction to the second direction, and the wiring pattern may have a portion extending along the first inclined surface.

[0021] The semiconductor optical device may have a second inclined surface between the second protrusion and the fourth protrusion, which are integrated with the third protrusion, that faces the first direction as it faces in the opposite direction to the second direction, and the wiring pattern may have a portion extending along the second inclined surface.

[0022] In the semiconductor optical device, a central axis of the core layer may be shifted in a direction opposite to the first direction with respect to a central axis of an active layer of the optical semiconductor element.

[0023] In the semiconductor optical device, an end portion of the optical semiconductor element in the second direction may be in contact with an end face of the first protrusion in a direction opposite to the second direction.

[0024] In the semiconductor optical device, the end face of the first protrusion opposite the second direction may be inclined toward the second direction as it approaches the first direction, and may abut against the end of the optical semiconductor element in the second direction.

[0025] In the semiconductor optical device, a recess may be provided between the first protruding portion and the second protruding portion, the recess being recessed in a direction opposite to the first direction.

[0026] In the semiconductor optical device, the end face of the first protrusion opposite the second direction may be shifted from the core layer in a third direction intersecting the first direction and the second direction, and may have a first surface abutting an end of the optical semiconductor element in the second direction, and a second surface adjacent to the first surface in the opposite direction to the third direction, the core layer being exposed in the opposite direction to the second direction with a gap between it and the end of the optical semiconductor element in the second direction, and inclined relative to the first surface so as to approach the second direction as it approaches the opposite direction to the third direction.

[0027] In the semiconductor optical device, a normal direction to the second surface and an optical axis direction of the core layer may intersect obliquely.

[0028] The semiconductor optical device comprises a plurality of optical semiconductor elements as the optical semiconductor elements, each having a bottom surface to be placed on the second protrusion and an end surface in the second direction at which an active layer is exposed, and each having a different distance between the bottom surface and the active layer in the first direction; a plurality of second protrusions as the second protrusion, each having a different height from the base in the first direction and each mounting a different optical semiconductor element; and a plurality of core layers as the core layer to which light output from each of the different optical semiconductor elements is coupled, wherein the distances from the base to the active layer in the first direction of the plurality of core layers are the same, and for a plurality of combinations of the second protrusion and the optical semiconductor element mounted on the second protrusion, the distance from the base to the active layer in the first direction is the same, and light output by each of the optical semiconductor elements is coupled to the core layer aligned with the optical semiconductor element in the second direction.

[0029] A method for manufacturing a semiconductor optical device of the present invention includes, for example, the steps of forming a first layer on a base intersecting a first direction, the first layer including a portion that will become a part of a cladding layer of a planar lightwave circuit, forming a second layer on the first layer, the second layer including a portion that will become a core layer of the planar lightwave circuit, forming the core layer and a marker by selectively removing the laminate of the second layer, forming a third layer that will become a part of the cladding layer on the laminate in which the core layer and the marker are formed on the first layer, and selectively removing the laminate of the first layer, the core layer, the marker, and the third layer to form a first protruding portion that includes at least the planar lightwave circuit and protrudes from the base in the first direction, and a second protruding portion that protrudes from the base in the first direction at a height lower than the first protruding portion and has the marker exposed at an end face in the first direction, and placing an optical semiconductor element positioned with respect to the marker on the second protruding portion. Effect of the Invention

[0030] According to the present invention, for example, it is possible to obtain a semiconductor optical device having an improved and novel configuration and a method for manufacturing the semiconductor optical device. [Brief description of the drawings]

[0031] [Figure 1] FIG. 1 is an illustrative schematic perspective view of a semiconductor optical device according to the first embodiment. [Diagram 2] FIG. 2 is an illustrative schematic side view of the semiconductor optical device of the first embodiment. [Diagram 3] FIG. 3 is an illustrative schematic plan view of the semiconductor optical device of the first embodiment. [Figure 4] FIG. 4 is an enlarged view of a portion of FIG. [Diagram 5] FIG. 5 is an illustrative schematic plan view of a portion of the semiconductor optical device of the first embodiment excluding the light emitting element. [Figure 6] FIG. 6 is a flowchart showing an example of a method for manufacturing the semiconductor optical device of the first embodiment. [Figure 7] FIG. 7 is an illustrative schematic side view of a portion of the semiconductor optical device according to the second embodiment equivalent to that in FIG. [Figure 8] FIG. 8 is an exemplary schematic side view of a portion of the semiconductor optical device of the third embodiment. [Figure 9] FIG. 9 is an illustrative schematic side view of the semiconductor optical device according to the fourth embodiment. [Figure 10] FIG. 10 is an exemplary schematic side view of a portion of the semiconductor optical device of the fifth embodiment. [Figure 11] FIG. 11 is an illustrative schematic plan view of the semiconductor optical device according to the sixth embodiment. [Figure 12] FIG. 12 is an illustrative schematic plan view of the semiconductor optical device according to the seventh embodiment. [Figure 13] FIG. 13 is a cross-sectional view taken along line XIII-XIII of FIG. [Figure 14] FIG. 14 is an illustrative schematic plan view of a portion of the semiconductor optical device according to the eighth embodiment. [Figure 15] FIG. 15 is an illustrative schematic plan view of a portion of the semiconductor optical device of the ninth embodiment. [Figure 16] FIG. 16 is a cross-sectional view taken along line XVI-XVI of FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0032] Exemplary embodiments of the present invention are disclosed below. The configurations of the embodiments shown below, and the actions and results (effects) brought about by the configurations are merely examples. The present invention can be realized by configurations other than those disclosed in the following embodiments. Furthermore, according to the present invention, it is possible to obtain at least one of the various effects (including derivative effects) obtained by the configurations.

[0033] The following embodiments have similar configurations. Therefore, according to the configurations of the respective embodiments, similar actions and effects based on the similar configurations can be obtained. In the following, the similar configurations are given the same reference numerals, and duplicated descriptions may be omitted.

[0034] In this specification, ordinal numbers are given for the sake of convenience to distinguish parts, directions, and the like, and do not indicate priority or order.

[0035] In each drawing, the X direction is represented by an arrow X, the Y direction is represented by an arrow Y, and the Z direction is represented by an arrow Z. The X direction, Y direction, and Z direction intersect with each other and are perpendicular to each other.

[0036] [First embodiment] FIG. 1 is a perspective view of a semiconductor optical device 100A according to the first embodiment, FIG. 2 is a side view of the semiconductor optical device 100A, and FIG. 3 is a plan view of the semiconductor optical device 100A.

[0037] The semiconductor optical device 100A includes a base 10, a first protruding portion 11, two second protruding portions 12 (12-1, 12-2), a third protruding portion 13, a fourth protruding portion 14, and a light-emitting element 20.

[0038] The base 10 is made of a silicon substrate. The base 10 extends in the X and Y directions, intersecting and perpendicular to the Z direction. The base 10 has a front surface 10a and a back surface 10b. The front surface 10a is an end face in the Z direction. The front surface 10a faces the Z direction, intersects and is perpendicular to the Z direction, and extends in the X and Y directions. The back surface 10b is located on the opposite side of the front surface 10a in the Z direction, and is an end face in the opposite direction to the Z direction. The back surface 10b faces the opposite direction to the Z direction, intersects and is perpendicular to the Z direction, and extends in the X and Y directions. The Z direction is an example of a first direction.

[0039] The first protrusion 11 protrudes in the Z direction from the surface 10a of the base 10. As shown in FIGS. 1 and 2, the first protrusion 11 constitutes a planar lightwave circuit (PLC) in which a first cladding layer 11a, a core layer 11b, and a second cladding layer 11c are laminated in this order in the Z direction. The core layer 11b extends in the X direction with a substantially constant height in the Z direction and a substantially constant width in the Y direction. The cross section of the core layer 11b intersecting with the X direction has a rectangular shape. The core layer 11b may also be referred to as a waveguide layer. The first cladding layer 11a fills both sides of the core layer 11b in the Y direction and the opposite direction, and surrounds the core layer 11b as a cladding layer together with the second cladding layer 11c.

[0040] The first cladding layer 11a and the second cladding layer 11c are made of, for example, a silica-based glass material. The core layer 11b is made of, for example, a silica-based glass material having a refractive index higher than that of the first cladding layer 11a and the second cladding layer 11c. The core layer 11b may be made of, for example, silica glass containing germania (GeO2) or zirconia (ZrO2) as a dopant for increasing the refractive index. The relative refractive index difference between the core layer 11b and the first cladding layer 11a and the second cladding layer 11c can be appropriately set within a range of 0.1 to 10%. The width of the core layer 11b in the Y direction can be set to 0.5 to 5 μm, and the height of the core layer 11b in the Z direction can be set to 0.5 to 5 μm. As an example, when the relative refractive index difference is set to 0.45% the size of the cross section of the core layer 11b in the Y direction and the Z direction is preferably 3 μm×3 μm.

[0041] The two second protrusions 12 (12-1, 12-2) each protrude in the Z direction from the surface 10a of the base 10. The heights of the two second protrusions 12 from the surface 10a of the base 10 in the Z direction are the same and are lower than the protrusion height of the first protrusion 11 in the Z direction.

[0042] The two second protrusions 12-1 and 12-2 are spaced apart from each other in the X direction. The second protrusion 12-1 is positioned on the opposite side of the second protrusion 12-2 from the first protrusion 11. In addition, the two second protrusions 12-1 and 12-2 are aligned with the first protrusion 11 in the X direction.

[0043] The second protrusion 12 functions as a base for placing the light-emitting element 20. An end face 12a of the second protrusion 12 on the opposite side to the Z direction faces the Z direction, intersects with and is perpendicular to the Z direction, and extends in the X direction and the Y direction. The second protrusion 12 is an example of a support portion, and may also be referred to as a placement portion. The end face 12a may also be referred to as a support surface or placement surface for the light-emitting element 20.

[0044] The two second protrusions 12-1, 12-2 support both the front and rear sides in the X direction with respect to the center of the light emitting element 20 in the X direction. The second protrusion 12-1 supports the end of the light emitting element 20 on the opposite side in the X direction, and the second protrusion 12-2 supports the end of the light emitting element 20 in the X direction.

[0045] The second protrusions 12-1 and 12-2 each extend in the Y direction and support both the front and rear sides in the Y direction with respect to the center of the light emitting element 20 in the Y direction. However, this is not limited thereto, and the second protrusions 12 may be separated in the Y direction, and the second protrusions 12 separated in the Y direction may support the light emitting element 20.

[0046] In addition, a recess 11e recessed in the opposite direction to the Z direction is provided between the first protruding portion 11 and a second protruding portion 12-2, which is closer to the first protruding portion 11 out of the two second protruding portions 12. The bottom surface of the recess 11e may be away from the surface 10a of the base 10 in the Z direction or may be on the surface 10a of the base 10.

[0047] The third protruding portion 13 protrudes in the Z direction from the surface 10a of the base 10. The height of the third protruding portion 13 from the surface 10a of the base 10 in the Z direction is smaller than the height of the second protruding portion 12.

[0048] The third protrusion 13 is positioned between the two second protrusions 12-1, 12-2, and is aligned in the X direction with the first protrusion 11 and the two second protrusions 12-1, 12-2. The third protrusion 13 is adjacent in the X direction to the second protrusion 12-1, which is located farther from the first protrusion 11 out of the two second protrusions 12, and is integrated with the second protrusion 12-1. The third protrusion 13 and the second protrusion 12-1 form a step whose height in the Z direction decreases toward the X direction.

[0049] The Z-direction end face 13a of the third protrusion 13 faces the Z direction, intersects with and is perpendicular to the Z direction, and extends in the X and Y directions. A thin film-like electrode 10d is provided on the end face 13a. The electrode 10d is made of a highly conductive material such as gold. The electrode 10d is an example of a third electrode.

[0050] The fourth protrusion 14 protrudes in the Z direction from the surface 10a of the base 10. The height of the fourth protrusion 14 from the surface 10a of the base 10 is greater than the heights of the two second protrusions 12 and the third protrusion 13, and is approximately equal to the height of the first protrusion 11.

[0051] The fourth protrusion 14 is aligned with the first protrusion 11, the two second protrusions 12, and the third protrusion 13 in the X direction. The fourth protrusion 14 is positioned on the opposite side of the third protrusion 13 to the second protrusion 12-1, and is positioned on the opposite side of the first protrusion 11 to the light-emitting element 20. In other words, the light-emitting element 20 is positioned between the first protrusion 11 and the fourth protrusion 14 in the X direction.

[0052] The fourth protrusion 14 is adjacent to the second protrusion 12-1 in the opposite direction to the X direction and is integrated with the second protrusion 12-1. The fourth protrusion 14, together with the second protrusion 12-1 and the third protrusion 13, constitutes a step whose height in the Z direction decreases toward the X direction.

[0053] The Z-direction end face 14a of the fourth protrusion 14 faces the Z direction, intersects with and is perpendicular to the Z direction, and extends in the X and Y directions. Thin film-like electrodes 10e, 10f are provided on the end face 14a. The electrodes 10e, 10f are made of a highly conductive material such as gold. The electrodes 10e, 10f are, for example, portions electrically connected to external wiring (not shown), and in this case, the electrodes 10e, 10f may also be referred to as external electrodes. The electrode 10f is an example of a fourth electrode.

[0054] The two second protrusions 12, the third protrusion 13, and the fourth protrusion 14 are made of the same material as the first cladding layer 11a and the second cladding layer 11c.

[0055] A thin film-like electrode 10c is provided on the surface 10a of the base 10 at a position between the two second protrusions 12, between the second protrusion 12-2 and the third protrusion 13. The electrode 10c is made of a highly conductive material such as gold. The electrode 10c is an example of a second electrode.

[0056] The light emitting element 20 is, for example, a laser diode. The light emitting element 20 has a substantially rectangular parallelepiped shape. That is, the light emitting element 20 has a substantially rectangular shape when viewed in the opposite direction to the Z direction.

[0057] The light-emitting element 20 is an example of an optical semiconductor element optically connected to the core layer 11b. The optical semiconductor element optically connected to the core layer 11b is not limited to the light-emitting element 20, and may be a light-receiving element or an optical modulation element. An optical modulation element changes some characteristic of light, such as spatially modulating light, phase modulating light, or intensity modulating light. The optical semiconductor element may also be an integrated element of two or more elements selected from a light-emitting element, a light-receiving element, and an optical modulation element.

[0058] The light emitting element 20 has an end face 20a in the Z direction, an end face 20b in the opposite direction to the Z direction, an end face 20c in the X direction, and an end face 20d in the opposite direction to the X direction. The end faces 20a and 20b intersect with and are perpendicular to the Z direction, and extend in the X and Y directions. The end faces 20c and 20d intersect with and are perpendicular to the X direction, and extend in the Y and Z directions.

[0059] 2, the light-emitting element 20 has a cladding layer 21 and an active layer 22. An end of the active layer 22 in the X direction faces the core layer 11b of the first protrusion 11. Light output from the active layer 22 in the X direction is coupled to the core layer 11b. The X direction is an example of the second direction.

[0060] As shown in Fig. 3, the active layer 22 extends in the X direction with a constant width in the Y direction at the center position in the Y direction. In addition, as shown in Fig. 2, in this embodiment, the active layer 22 is positioned closer to the end face 20b than to the end face 20a. However, this is just one example, and the position of the active layer 22 in the Z direction can be changed as appropriate. The position of the active layer 22 in the Z direction is set so that the active layer 22 faces the core layer 11b in the X direction and the light output from the active layer 22 is coupled with the core layer 11b.

[0061] A thin film-like electrode 23 is provided on an end face 20b of the light-emitting element 20 on the opposite side in the Z direction. On the other hand, a thin film-like electrode 24 is provided on an end face 20a of the light-emitting element 20 in the Z direction. Both of the electrodes 23, 24 are made of a highly conductive material such as gold. As an example, the electrode 24 is a cathode and the electrode 23 is an anode.

[0062] The electrode 24 is electrically connected to the electrode 10e on the fourth protrusion 14 via a conductive wiring such as a bonding wire (not shown).

[0063] FIG. 4 is an enlarged view of a part of FIG. 2. As shown in FIG. 4, a conductive paste 40 is interposed between the electrode 23 and the electrode 10c on the surface 10a of the base 10. The electrode 23 and the electrode 10c are electrically connected through the conductive paste 40. The conductive paste 40 is interposed between the electrode 23 and the electrode 10c, for example, in a compressed and deformed state, and is in contact with both the electrodes 23 and 10c in a tightly adhered state. The electrode 10c is electrically connected to the electrode 10f, for example, through a conductor wiring such as a bonding wire (not shown). Therefore, the electrode 23 is electrically connected to the electrode 10f on the fourth protrusion 14 through the conductive paste 40, the electrode 10c, and the conductor wiring. The configuration including such a conductive paste 40 has an advantage that, for example, the conductor wiring between the electrode 23 and the electrode 10f provided on the end surface 20b on the base 10 side of the light emitting element 20 can be relatively easily configured. The conductive paste 40 is an example of a conductor. The electrode 23 is an example of a first electrode. The electrodes 10c and 10f may be electrically connected to each other via a conductor wiring such as a bonding wire (not shown) that relays the electrode 10d. In this case, the conductor wiring can be shorter, which has the advantages of improving the workability of wiring and making the conductor wiring less susceptible to damage, for example.

[0064] The conductive paste 40 may contain a thermally conductive filler. In this case, the conductive paste 40 also functions as a heat transfer member. The thermally conductive filler is, for example, particles, powder, nanoparticles, etc. made of a metal material having electrical conductivity and high thermal conductivity, such as gold or a silver-based metal. The silver-based metal is silver or a silver alloy. The conductive paste 40 may be, for example, a silver paste containing silver particles as a thermally conductive filler. With such a configuration, for example, heat generated in the light-emitting element 20 can be released to the base 10 via the conductive paste 40, which has the advantage of making it easier to suppress excessive temperature rise of the light-emitting element 20.

[0065] 4, a rough surface 10g having a larger surface roughness than other parts of the surface 10a is provided in an area of ​​the surface 10a of the base 10 that is not adjacent to the electrode 10c, and the conductive paste 40 is also partially in contact with the rough surface 10g. Since the rough surface 10g has a larger surface area than other parts of the surface 10a, the contact area between the base 10 (rough surface 10g, surface 10a) and the conductive paste 40 can be made larger than when the conductive paste 40 is in contact with the other parts, and the amount of heat transferred from the conductive paste 40 to the base 10 can be increased accordingly. Therefore, according to this configuration, the amount of heat transferred to the base 10 via the conductive paste 40 of the heat generated in the light emitting element 20 can be increased, and an excessive temperature rise in the light emitting element 20 can be further suppressed.

[0066] 5 is a plan view of a portion of the semiconductor optical device 100A excluding the light emitting element 20. This portion may also be referred to as a submount S.

[0067] 5, four markers 30 are provided on the end faces 12a of the two second protrusions 12 so as to be at least partially exposed on the end faces 12a. When an operator or a robot places the light-emitting element 20 on the end faces 12a, the markers 30 serve as targets or references for the operator to visually confirm the placement position or for the robot to determine the placement position based on image processing of an image captured by a camera. The markers 30 are also called alignment markers.

[0068] 5, in this embodiment, a plurality of markers 30, four markers 30 as an example in this embodiment, are provided on the end face 12a, and the light emitting element 20 is positioned on the second protrusion 12 based on these four markers 30. Specifically, the light emitting element 20 is placed so that an end face 20e in the Y direction or the opposite side to the Y direction of the light emitting element 20 is adjacent to the marker 30 when viewed in the opposite direction to the Z direction. The end face 20e is an example of an edge.

[0069] In addition, in this embodiment, when viewed in the opposite direction of the Z direction, at a predetermined mounting position of the light emitting element 20, there are gaps of approximately the same distance between the two markers 30 arranged in the Y direction on the second protrusion 12-1 and the end face 20e of the light emitting element 20, and the light emitting element 20 is located in the center between these two markers 30. In addition, at the predetermined mounting position, there are gaps of approximately the same distance between the two markers 30 arranged in the Y direction on the second protrusion 12-2 and the end face 20e of the light emitting element 20, and the light emitting element 20 is located in the center between these two markers 30. That is, in this embodiment, when viewed in the opposite direction of the Z direction, the marker 30 is adjacent to the end face 20e of the light emitting element 20 with a gap therebetween. The marker 30 is an example of a first marker and also an example of a second marker.

[0070] It should be noted that, when viewed in the opposite direction of the Z direction, it is not essential that there be a gap between the marker 30 and the end face 20e at a predetermined placement position, and for example, the edge of the marker 30 may just overlap the end face 20e, or a part of the marker 30 may overlap the light-emitting element 20. Even in these cases, when viewed in the opposite direction of the Z direction, a part of the marker 30 and the end face 20e will be adjacent to each other. When the light-emitting element 20 overlaps a part of the marker 30, a mark such as a scale may be provided on the marker 30.

[0071] In this embodiment, the marker 30 is made of the same material as the core layer 11b. Next, a method for manufacturing the semiconductor optical device 100A including such a marker 30 will be described.

[0072] [Manufacturing process of semiconductor optical devices] Fig. 6 is a flowchart showing a method for manufacturing the semiconductor optical device 100A. As shown in Fig. 6, first, silica-based glass particles are deposited in the Z direction on the base 10 by, for example, a flame hydrolysis deposition (FHD) method, and then heated to turn the glass particles into transparent glass, thereby forming a first layer including a portion that becomes the first cladding layer 11a (S1).

[0073] Next, a silica-based glass particle layer is deposited in the Z direction on the first layer, for example, by sputtering, to form a second layer including the core layer 11b and the portion that will become the marker 30 (S2). In this S2, for example, ZrO2 is added to SiO2 so that the refractive index of the core layer 11b is higher than the refractive index of the first cladding layer 11a and the relative refractive index difference is 0.45[%].

[0074] Next, an etching mask including a pattern of the core layer 11b and a pattern of the marker 30 is formed on the second layer by photolithography, and the second layer on which the etching mask is formed is dry-etched using an etching gas such as a fluorine-based gas (S3). In this S3, the area exposed from the etching mask is removed, and the core layer 11b and the marker 30 are formed as the part of the second layer that is covered by the etching mask and not removed. Therefore, the core layer 11b and the marker 30 are made of the same material that constitutes the second layer. In addition, the end of the core layer 11b in the opposite direction in the Z direction and the end of the marker 30 in the opposite direction in the Z direction are both boundaries between the first layer and the second layer, and are located at the same height from the surface 10a of the base 10 in the Z direction, as shown by the dashed line L in FIG. 2. Therefore, the marker 30 is provided so as to be exposed on the end face 12a and to have a predetermined length (depth) from the end face 12a in the opposite direction to the Z direction.

[0075] Next, silica-based glass particles are deposited, for example by the FHD method, on the laminate in which the core layer 11b and the marker 30 are formed on the first layer, and the glass particles are converted into transparent glass by heating, thereby forming a third layer including a portion that will become the second cladding layer 11c (S4).

[0076] Next, the laminate including the first layer, the core layer 11b, the marker 30, and the third layer is selectively removed by, for example, forming an etching mask and dry etching to form a submount S including the first protruding portion 11, the second protruding portion 12, the third protruding portion 13, the fourth protruding portion 14, and the recess 11e (S5). In this S5, the marker 30 is left in the second protruding portion 12.

[0077] Next, the electrodes 10c, 10d, 10e, and 10f are formed on the submount S by, for example, sputtering and photolithography (S6).

[0078] Next, while visually observing or photographing the marker 30 in the opposite direction to the Z direction, the light-emitting element 20 is placed at a predetermined position on the second protrusion 12 corresponding to the marker 30 using the marker 30 as a reference, and is mounted on the submount S, for example, by adhesion or the like (S7). When using a conductive paste 40, the conductive paste 40 is placed in advance on the submount S at a position to be covered by the light-emitting element 20 before placing the light-emitting element 20.

[0079] As described above, according to this embodiment, the marker 30 is provided on the second protruding portion 12, is exposed on the end face 12a, and is made of the same material as the core layer 11b.

[0080] When the marker is made of a metal layer by photolithography as in the conventional method, the position of the core layer 11b and the position of the marker are determined by different mask patterns, respectively, and therefore the positional accuracy between the core layer 11b and the marker is reduced. In this respect, according to the present embodiment, the core layer 11b and the marker 30 are made of the same material, and therefore the relative positional relationship between the core layer 11b and the marker 30 can be determined by one mask pattern. Therefore, according to the present embodiment, the positional accuracy between the core layer 11b and the marker 30 can be improved, and thus the positional accuracy between the core layer 11b and the light-emitting element 20 can be improved.

[0081] Furthermore, in this embodiment, the height in the Z direction (first direction) of the end of the core layer 11b opposite the Z direction from the surface 10a of the base 10 is the same as the height in the Z direction of the end of the marker 30 opposite the Z direction from the surface 10a of the base 10.

[0082] Such a feature is evidence that the core layer 11b and the marker 30 are made from the same second layer formed on the first layer as in the above-mentioned steps S2 and S3. Furthermore, according to the present embodiment, for example, compared to a case where the marker is made of a metal layer, individual differences in the position and thickness of the marker 30 in the Z direction can be reduced, so that the marker 30 can be more reliably left in the etching step.

[0083] Furthermore, as in this embodiment, when viewed in the opposite direction of the Z direction, the marker 30 (first marker) and the end face 20e (edge) of the light-emitting element 20 may be adjacent to each other with a gap between them, or the light-emitting element 20 may be positioned between two markers 30 (second markers).

[0084] According to this configuration, the marker 30 can be realized with a relatively simple structure.

[0085] [Second embodiment] FIG. 7 is a side view of a portion of a semiconductor optical device 100B according to the second embodiment, which is equivalent to that shown in FIG.

[0086] As shown in FIG. 7, in this embodiment, the conductive paste 40 is interposed between the rough surface 10g on the surface 10a of the base 10, the electrode 10c on the surface 10a, the electrode 10d on the end surface 13a of the third protrusion 13, and the electrode 23 on the end surface 20b of the light emitting element 20. In this way, the conductive paste 40 may electrically connect the electrode 23 to both the electrodes 10c and 10d. It is possible to appropriately select whether to adopt the form as in the first embodiment (FIG. 4) or the form as in this embodiment. In addition, in the configuration shown in FIG. 7, the electrode 10d and the electrode 10f may be electrically connected via a conductor wiring such as a bonding wire (not shown). In this case, the conductor wiring is shorter and fewer, so that, for example, advantages such as further improvement in wiring workability and further reduction in the damage of the conductor wiring are obtained.

[0087] [Third embodiment] 8 is a side view of a part of the semiconductor optical device 100C of the third embodiment. As shown in FIG. 8, in this embodiment, the side surface 15a facing the X direction between the fourth protrusion 14 and the second protrusion 12-1, the side surface 15b facing the X direction between the second protrusion 12-1 and the third protrusion 13, and the side surface 15c facing the X direction between the third protrusion 13 and the base 10 are all configured as inclined surfaces that face the Z direction as they move in the opposite direction to the X direction. Such a step structure including the side surfaces 15a to 15c is provided at a position shifted in the Y direction with respect to the marker 30, and is provided at a position shifted on the opposite side of the light emitting element 20 with respect to the marker 30 in the Y direction or in the opposite direction to the Y direction when viewed in the opposite direction to the Z direction. The side surface 15b is an example of a first inclined surface, and the side surface 15a is an example of a second inclined surface.

[0088] A wiring pattern 16 is provided extending along end face 14a, side face 15a, end face 12a, side face 15b, end face 13a, side face 15c, and surface 10a with a substantially constant width in the Y direction. Electrode 10f, electrode 10d, and electrode 10c are electrically connected by wiring pattern 16. Wiring pattern 16 is made of a highly conductive material such as gold, similar to electrodes 10c, 10d, and 10f.

[0089] According to this configuration, the multiple electrodes 10c, 10d, and 10f can be electrically connected by the wiring pattern 16 formed on the submount S without using wire bonding. In addition, the wiring that electrically connects the electrode 23 as the anode of the light-emitting element 20 and the electrode 10f as the external electrode can be realized with a relatively simple configuration by the wiring pattern 16 and the conductive paste 40. In addition, since the side surfaces 15a, 15b, and 15c are inclined toward the Z direction as they move in the opposite direction to the X direction, advantages such as easier formation of the wiring pattern 16 and smaller electrical resistance can be obtained compared to a configuration in which the side surfaces 15a, 15b, and 15c extend in the Z direction and are not inclined with respect to the Z direction.

[0090] [Fourth embodiment] 9 is a side view of the semiconductor optical device 100D of the fourth embodiment. As shown in FIG. 9, in this embodiment, the height of the core layer 11b in the Z direction is higher, and thus the depth of the marker 30 in the Z direction is deeper. In this case, the central axis Axc of the core layer 11b is shifted in the opposite direction to the Z direction with respect to the central axis Axl of the active layer 22 of the light emitting element 20 mounted on the end face 12a of the second protrusion 12. That is, by forming the marker 30, the second protrusion 12, and the core layer 11b so as to cause such a shift, the depth of the marker 30 from the end face 12a can be made deeper, and for example, the marker 30 can be formed more reliably, and the visibility and identifiability of the marker 30 by a camera can be improved.

[0091] [Fifth embodiment] Fig. 10 is a side view of a portion of a semiconductor optical device 100E of the fifth embodiment. As shown in Fig. 10, in this embodiment, an end face 20c in the X direction of the light emitting element 20 abuts against an end face 11f in the opposite direction to the X direction of the first protrusion 11, and the light emitting element 20 is positioned in the X direction by this abutment. With this configuration, the light emitting element 20 can be more easily positioned in the X direction.

[0092] Also, as in the first embodiment, a recess 11e recessed in the opposite direction in the Z direction is provided between the first protrusion 11 and the second protrusion 12-2. A concave curved surface (corner R shape) may be generated at the end of the end face 11f in the opposite direction in the Z direction. Such a concave curved surface is prone to individual variation, and in a configuration in which the end face 20c and the end face 11f abut, when the end face 20c and the concave curved surface abut, there is a risk that this may be a cause of individual variation in the position of the light emitting element 20 in the X direction. In this respect, in this embodiment, by providing the recess 11e, the concave curved surface generated at the end of the end face 11f in the opposite direction in the Z direction can be shifted in the opposite direction in the Z direction with respect to the light emitting element 20. Therefore, according to this embodiment, for example, an advantage is obtained in that it is possible to avoid individual variation in the position of the light emitting element 20 in the X direction due to the end face 20c abutting against the concave curved surface.

[0093] In addition, the end face 11f of the first protruding portion 11 is inclined at an angle α with respect to the Z direction so as to move toward the X direction as it moves toward the Z direction, and the end face 11f is in contact with the corner portion 20c1 located at the end of the end face 20c of the light emitting element 20 in the opposite direction to the Z direction. Since the active layer 22 of the light emitting element 20 is more fragile than the cladding layer 21, etc., in a configuration in which the light emitting element 20 and the first protruding portion 11 are in contact with each other in the X direction, it is not preferable for the active layer 22 to be in contact with the first protruding portion 11. In this respect, in this embodiment, since the end face 11f is inclined toward the X direction as it moves toward the Z direction, the end face 11f is in contact with the corner portion 20c1 of the end face 20c of the light emitting element 20 that is shifted in the opposite direction to the Z direction from the active layer 22, and a gap g is generated between the active layer 22 and the end face 11f. The distance between the active layer 22 and the end face 11f is, for example, 1 [μm] or less. Therefore, according to the present embodiment, for example, it is possible to obtain an advantage that it is possible to suppress damage to the active layer 22 due to contact with the first protrusion 11. The end surface 20c and the corner portion 20c1 of the light-emitting element 20 are an example of an end portion of the light-emitting element 20 in the X direction.

[0094] [Sixth embodiment] Fig. 11 is a plan view of a semiconductor optical device 100F of the sixth embodiment. As shown in Fig. 11, in this embodiment, as in the fifth embodiment, an end face 20c in the X direction of the light emitting element 20 and an end face 11f in the opposite X direction of the first protrusion 11 are in contact with each other, and the light emitting element 20 is positioned in the X direction by this contact.

[0095] However, in this embodiment, the end face 11f of the first protrusion 11 has a first surface 11f1 and a second surface 11f2. The first surface 11f1 is positioned offset from the core layer 11b in the Y direction and abuts against the end face 20c of the light emitting element 20. The second surface 11f2 is positioned adjacent to the first surface 11f1 in the opposite direction of the Y direction, and is inclined at an angle β with respect to the opposite direction of the Y direction so that the core layer 11b is exposed in the opposite direction of the X direction with a gap g between it and the end face 20c and approaches the X direction as it approaches the opposite direction of the Y direction. The angle β is, for example, 1 [deg] or more and 7 [deg] or less. Even with such a configuration, the gap g can be secured between the active layer 22 and the first protrusion 11. Therefore, even with this embodiment, for example, the advantage of being able to suppress damage to the active layer 22 due to abutment with the first protrusion 11 can be obtained. The Y direction is an example of a third direction.

[0096] In this embodiment, the normal N (normal direction) of the second surface 11f2 and the central axis Axc (optical axis direction) of the core layer 11b intersect obliquely at an angle γ. The angle γ is, for example, 5 degrees or more and 11 degrees or less. According to this embodiment, for example, the return light propagated to the light emitting element 20 side in the core layer 11b is reflected by the second surface 11f2 and propagates and diffuses in a direction not coupled with the core layer 11b, so that an adverse effect of the return light can be suppressed.

[0097] [Seventh embodiment] FIG. 12 is a plan view of a semiconductor optical device 100G according to the seventh embodiment, and FIG. 13 is a cross-sectional view taken along line XIII-XIII in FIG.

[0098] As shown in FIGS. 12 and 13, this embodiment includes three light emitting elements 20 that output laser beams of different wavelengths.

[0099] The three light emitting elements 20 are semiconductor laser elements, and are, for example, a red light source, a blue light source, and a green light source. The red light source outputs red visible light, for example, with a wavelength of 620 to 750 [nm]. The blue light source outputs blue visible light, for example, with a wavelength of 450 to 495 [nm]. The green light source outputs green visible light, for example, with a wavelength of 495 to 570 [nm].

[0100] The three light-emitting elements 20 are arranged in the Y direction. As shown in FIG. 13, the end surface 12a of the second protrusion 12-2 has a step in the Z direction as it goes in the Y direction. That is, the end surface 12a on which the light-emitting element 20-2 is placed is shifted in the Z direction from the end surface 12a on which the light-emitting element 20-1 is placed, and the end surface 12a on which the light-emitting element 20-3 is placed is shifted in the Z direction from the end surface 12a on which the light-emitting element 20-2 is placed. Accordingly, the end surface 20b of the light-emitting element 20-2 is shifted in the Z direction from the end surface 20b of the light-emitting element 20-1, and the end surface 20b of the light-emitting element 20-3 is shifted in the Z direction from the end surface 20b of the light-emitting element 20-2. The end surface 20b is an example of a bottom surface placed on the end surface 12a.

[0101] 13, in this embodiment, the distance in the Z direction between the end face 20b and the active layer 22 of the light emitting element 20-2 is longer than the distance in the Z direction between the end face 20b and the active layer 22 of the light emitting element 20-3, and the distance in the Z direction between the end face 20b and the active layer 22 of the light emitting element 20-1 is longer than the distance in the Z direction between the end face 20b and the active layer 22 of the light emitting element 20-2. With this configuration, as shown in FIG. 13, the distances in the Z direction between the surface 10a and the active layer 22 are approximately the same for these three light emitting elements 20-1 to 20-3.

[0102] As shown in FIG. 12, the first protrusion 11 is provided with three core layers 11b corresponding to the light emitting elements 20-1 to 20-3, into which the light output from the light emitting elements 20-1 to 20-3 is coupled. Here, as described above, the semiconductor optical device 100G of this embodiment is configured so that the distances in the Z direction between the surface 10a and the active layer 22 are substantially the same for these three light emitting elements 20-1 to 20-3. Therefore, the distances between the surface 10a and the core layer 11b in the Z direction can be made the same for the multiple core layers 11b. Therefore, according to this embodiment, for example, compared to a case where multiple core layers 11b are provided with different distances between the surface 10a and the core layer 11b in the Z direction, the core layer 11b, i.e., the first protrusion 11, and thus the semiconductor optical device 100G can be advantageously reduced in the effort and cost of manufacturing the core layer 11b.

[0103] [Eighth embodiment] FIG. 14 is a plan view of a semiconductor optical device 100H of the eighth embodiment. As shown in FIG. 14, in this embodiment, the marker 30 is provided adjacent to the corner 20f of the light-emitting element 20 with a gap therebetween when viewed in the opposite direction to the Z direction. The marker 30 is formed in an L-shape and has a portion facing the end face 20d with a gap in the X direction and a portion facing the end face 20e with a gap in the Y direction. According to this embodiment, for example, there is an advantage that the marker 30 can be used for both the positioning of the light-emitting element 20 in the X direction and the positioning of the light-emitting element 20 in the Y direction. The marker 30 of this embodiment is an example of a third marker.

[0104] [Ninth embodiment] Fig. 15 is a plan view of a portion of the semiconductor optical device 100I of the ninth embodiment, and Fig. 16 is a cross-sectional view taken along the XVI-XVI line of Fig. 15. As shown in Figs. 15 and 16, in this embodiment, a groove 31 recessed with a constant width is provided along the periphery of the marker 30. As a result, a corner is formed on the periphery 30a of the marker 30. According to this embodiment, for example, by providing a corner on the periphery 30a of the marker 30, when a worker or a robot places the light-emitting element 20 on the end face 12a, it is possible to obtain advantages such as making it easier for the worker to visually recognize the marker 30 and improving the identifiability of the marker 30 in image processing of an image captured by a camera, compared to a configuration in which the groove 31 is not provided and the periphery 30a is not provided with a corner.

[0105] Although the embodiment and the modified examples of the present invention have been illustrated above, the above-mentioned embodiment and the modified examples are merely examples and are not intended to limit the scope of the invention. The above-mentioned embodiment and the modified examples can be implemented in various other forms, and various omissions, substitutions, combinations, and modifications can be made without departing from the gist of the invention. In addition, the specifications of each configuration, shape, and the like (structure, type, direction, model, size, length, width, thickness, height, number, arrangement, position, material, etc.) can be appropriately changed and implemented. [Industrial Applicability]

[0106] The present invention can be used in semiconductor optical devices and methods for manufacturing semiconductor optical devices. [Explanation of symbols]

[0107] 10. Bass 10a…Surface 10b…Back side 10c...electrode (second electrode) 10d...electrode (third electrode) 10e…electrode 10f...electrode (fourth electrode) 10g…Rough surface 11...First protrusion 11a...First cladding layer (cladding layer) 11b…Core layer 11c…Second clad layer (clad layer) 11e…Recess 11f…End face 11f1…front page 11f2…Second side 12,12-1,12-2…Second protrusion 12a...end face 13...Third protrusion 13a...end face 14...Fourth protrusion 14a...end face 15a...Side (second slope) 15b...Side surface (first inclined surface) 15c...side 16...Wiring pattern 20, 20-1, 20-2, 20-3...Light emitting element (optical semiconductor element) 20a...end face 20b…End face (bottom face) 20c...End face (end) 20c1…Corner (end) 20d...end face 20e...End face 20f…corner 21…Clad layer 22…Active layer 23...Electrode (first electrode) 24...Electrode 30...Marker (first marker, second marker, third marker) 30a…periphery 31...Groove 40...Conductive paste (conductor) 100A~100I...Semiconductor optical devices Axc: central axis (of the core layer) Axl: central axis (of the active layer) g…Gap L…Dotted chain line N...Normal S: Submount X…direction Y...Direction Z…direction (first direction) α…Angle β...Angle γ...Angle

Claims

1. a base intersecting the first direction; a first protruding portion protruding from the base in the first direction and having a planar lightwave circuit including a core layer and a clad layer surrounding the core layer; a second protruding portion protruding from the base in the first direction, aligned with the first protruding portion in a second direction intersecting the first direction, and having a height from the base in the first direction that is shorter than that of the first protruding portion; an optical semiconductor element placed on an end surface of the second protruding portion in the first direction and optically connected to the core layer; a marker provided on the second protruding portion so as to be exposed on the end surface, the marker being made of the same material as the core layer; Equipped with The second protrusion includes two second protrusions, the optical semiconductor element has a first electrode provided on an end surface of the optical semiconductor element opposite to the first direction and positioned between the two second protrusions, a conductor located between the two second projections and electrically connected to the first electrode; the conductor is a conductive paste; a rough surface is provided at a position between the two second protruding portions on the end surface of the base in the first direction, the rough surface being in contact with the conductive paste and having a surface roughness greater than that of other portions; A semiconductor optical device configured so that heat generated in the optical semiconductor element is dissipated to the base through the first electrode, the conductive paste, and the rough surface.

2. 2. The semiconductor optical device of claim 1, wherein a height in the first direction from the base of an end of the core layer opposite the first direction and a height in the first direction from the base of an end of the marker opposite the first direction are the same.

3. The semiconductor optical device according to claim 1 , further comprising, as the marker, a first marker adjacent to an edge of the optical semiconductor element with a gap therebetween when viewed in a direction opposite to the first direction.

4. The marker includes two second markers; 4. The semiconductor optical device according to claim 1, wherein the optical semiconductor element is positioned between the two second markers when viewed in a direction opposite to the first direction.

5. the optical semiconductor element has a quadrangular shape when viewed in a direction opposite to the first direction, 5. The semiconductor optical device according to claim 1, further comprising, as the marker, a third marker adjacent to a corner of the optical semiconductor element when viewed in a direction opposite to the first direction.

6. A semiconductor optical device as described in any one of claims 1 to 5, further comprising a second electrode provided at a position between the two second protrusions on the end surface of the base in the first direction and electrically connected to the conductor.

7. a third protruding portion protruding in the first direction from a position between the two second protruding portions of the base and having a height from the base in the first direction that is shorter than the height of the two second protruding portions; a third electrode provided on an end surface of the third protrusion in the first direction and electrically connected to the conductor; 7. The semiconductor optical device according to claim 1, comprising:

8. The two second protrusions are spaced apart in the second direction, The semiconductor optical device according to claim 7 , wherein the second protrusion located farther from the first protrusion out of the two second protrusions is integrated with the third protrusion.

9. a fourth protruding portion protruding from the base in the first direction on a side opposite to the third protruding portion with respect to the second protruding portion integrated with the third protruding portion, and having a height from the base in the first direction greater than the heights of the two second protruding portions; The semiconductor optical device according to claim 7 , wherein a fourth electrode is provided on an end face of the fourth protrusion in the first direction, the fourth electrode being electrically connected to the third electrode.

10. 10. The semiconductor optical device of claim 9, further comprising a wiring pattern extending across an end face in the first direction of the third protrusion, an end face in the first direction of the second protrusion integrated with the third protrusion, and an end face in the first direction of the fourth protrusion, electrically connecting the third electrode and the fourth electrode.

11. a first inclined surface extending toward the first direction as it extends in a direction opposite to the second direction, between the third protruding portion and the second protruding portion integrated with the third protruding portion; The semiconductor optical device according to claim 10 , wherein the wiring pattern has a portion extending along the first inclined surface.

12. a second inclined surface extending toward the first direction as it extends in a direction opposite to the second direction, between the second protruding portion and the fourth protruding portion which are integrated with the third protruding portion; The semiconductor optical device according to claim 10 or 11, wherein the wiring pattern has a portion extending along the second inclined surface.

13. 13. The semiconductor optical device according to claim 1, wherein a central axis of the core layer is shifted in a direction opposite to the first direction with respect to a central axis of an active layer of the optical semiconductor element.

14. 14. The semiconductor optical device according to claim 1, wherein an end of the optical semiconductor element in the second direction and an end face of the first protrusion in the opposite direction to the second direction are in contact with each other.

15. The semiconductor optical device of claim 14 , wherein an end face of the first protrusion opposite the second direction is inclined toward the second direction as it approaches the first direction, and abuts against an end of the optical semiconductor element in the second direction.

16. The semiconductor optical device according to claim 14 or 15, wherein a recess recessed in a direction opposite to the first direction is provided between the first protruding portion and the second protruding portion.

17. The end surface of the first protrusion in the opposite direction to the second direction is a first surface that is shifted from the core layer in a third direction intersecting the first direction and the second direction and that abuts against an end of the optical semiconductor element in the second direction; a second surface adjacent to the first surface in a direction opposite to the third direction, the core layer being exposed in the direction opposite to the second direction with a gap between the core layer and an end of the optical semiconductor element in the second direction, and the second surface being inclined with respect to the first surface so as to approach the second direction as it approaches the direction opposite to the third direction; 15. The semiconductor optical device of claim 14, comprising:

18. The semiconductor optical device according to claim 17 , wherein a normal direction to the second surface and an optical axis direction of the core layer intersect obliquely.

19. a plurality of optical semiconductor elements as the optical semiconductor element, each of which has a bottom surface placed on the second protruding portion and an end surface in the second direction at which an active layer is exposed, and each of which has a different distance between the bottom surface and the active layer in the first direction; a plurality of second protruding portions as the second protruding portion, each of which has a different height from the base in the first direction and on which a different optical semiconductor element is mounted; a plurality of core layers as the core layers into which light output from different optical semiconductor elements is coupled; Equipped with the distances of the core layers from the base in the first direction are the same, 19. The semiconductor optical device according to claim 1, wherein for a plurality of combinations of the second protrusion and the optical semiconductor element placed on the second protrusion, the distance from the base to the active layer in the first direction is the same, and light output from each of the optical semiconductor elements is coupled to the core layer aligned with the optical semiconductor element in the second direction.

20. forming a first layer on a base intersecting a first direction, the first layer being laminated in the first direction and including a portion that will become a part of a cladding layer of a planar lightwave circuit; forming a second layer on the first layer in the first direction, the second layer including a portion that will become a core layer of the planar lightwave circuit; selectively removing the second layer stack to form the core layer and markers; forming a third layer which will become a part of the clad layer on a laminate in which the core layer and the marker are formed on the first layer; a step of selectively removing a laminate of the first layer, the core layer, the marker, and the third layer to form a first protruding portion including at least the planar lightwave circuit and protruding from the base in the first direction, and two second protruding portions protruding from the base in the first direction at a height lower than that of the first protruding portion and having the marker exposed at an end face in the first direction; providing a conductor between the two second protrusions on the base; placing an optical semiconductor element positioned with respect to the marker on the two second protrusions with the conductor provided; Equipped with the optical semiconductor element has a first electrode provided on an end surface of the optical semiconductor element opposite to the first direction and positioned between the two second protrusions, the conductor is a conductive paste electrically connected to the first electrode; a rough surface is provided at a position between the two second protruding portions of an end surface of the base in the first direction, the rough surface being in contact with the conductive paste and having a surface roughness greater than that of other portions; A method for manufacturing a semiconductor optical device, comprising: forming a semiconductor optical element on a substrate; and forming a semiconductor optical element on the substrate;

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