Radiation detector

Abstract

To reduce the weight of a radiation detector including a substrate and a semiconductor element formed on a surface of the substrate, while maintaining the resistance to damage of the substrate when subjected to load or impact.SOLUTION: A radiation detector 100 includes: a radiation detection unit 3 which has a flexible substrate 312a and a semiconductor element 312b formed on an imaging surface 312g of the substrate 312a; a support member 4 which is formed of foam and supports the radiation detection unit 3; and a housing 110 which includes a front surface portion 11 facing the imaging surface 312g and a rear surface portion 21 facing the front surface portion 11 across the radiation detection unit 3, and accommodates the radiation detection unit 3. The support member 4 is provided between the radiation detection unit 3 and the rear surface portion 21.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to a radiation detector. [Background technology]

[0002] 2. Description of the Related Art A radiation detector including a substrate and a semiconductor element formed on an imaging surface of the substrate is conventionally known. Conventional radiation detectors have a substrate mainly made of glass. For this reason, for example, when a radiation detector is placed under a subject lying on a bed and the subject is irradiated with radiation from above to take an image, the weight of the subject on the radiation detector can cause the radiation detector to bend and the substrate inside to crack. Furthermore, if the radiation detector is accidentally bumped or dropped while being carried around, the radiation detector may be subjected to a shock, which may cause the circuit board to crack. Therefore, conventionally, efforts have been made to improve the support structure of the substrate so that the substrate is less likely to be damaged when subjected to a load or impact.

[0003] For example, Patent Document 1 describes a radiographic imaging device that includes a sensor panel, a support that supports the sensor panel, and a housing that houses the sensor panel and the support, where the support has a gap and supports the underside of the sensor panel without gaps in the thickness direction and planar direction. Furthermore, Patent Document 2 describes a radiographic imaging device in which an inner surface of a bottom member of a housing on the side facing the radiation detection panel includes a support surface that supports the radiation detection panel, and a recess is formed on the side of the bottom member opposite the radiation detection panel, the recess being defined by a part of the outer surface of the bottom member that is exposed to the outside of the housing, and electrical components are disposed in the recess. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2019-196944 A [Patent Document 2] JP 2015-200606 A Summary of the Invention [Problem to be solved by the invention]

[0005] However, in conventional radiation detectors such as those described in Patent Documents 1 and 2, in order to support the glass substrate so as not to damage it when subjected to a load or impact, the support member that supports the substrate needs to have a certain level of rigidity. In order to ensure the rigidity of the support member, for example, it is necessary to form the support member thick, or to use a highly rigid material (for example, fiber-reinforced resin or metal) for at least a portion (for example, a surface layer) of the support member. However, when trying to ensure the rigidity of the support member in this way, there is a problem that the weight of the support member increases, making the radiation detector heavy. Furthermore, the glass from which the substrate is made is also a relatively heavy material, which is one of the factors that makes the radiation detector heavy.

[0006] The present invention has been made in consideration of the above-mentioned problems, and has an object to reduce the weight of a radiation detector including a substrate and a semiconductor element formed on its surface, while maintaining resistance to damage to the substrate when subjected to a load or impact. [Means for solving the problem]

[0007] In order to solve the above problems, the radiation detector according to the present invention comprises: a radiation detection unit having a substrate and a semiconductor element formed on an imaging surface of the substrate; a support member formed of a foam and supporting the radiation detection unit; an electrical circuit; The support member is provided with a mounting portion for mounting the electric circuit. 、 a mounting member for mounting the electric circuit to the mounting portion; The mounting member has a protrusion and a plate portion, the protrusion of the mounting member has a female thread portion for screwing the electric circuit, The mounting member further has a protrusion in a direction perpendicular to the rotational torque generated by the screw fastening. . Moreover, the radiation detector according to the present invention comprises: a radiation detection unit having a substrate and a semiconductor element formed on an imaging surface of the substrate; a support member formed of a foam and supporting the radiation detection unit; an electrical circuit; The support member is formed with a mounting portion for mounting the electric circuit, a mounting member for mounting the electric circuit to the mounting portion; The mounting member has a protrusion and a plate portion, The plate portion of the mounting member is joined at the same time as the support member is formed. Effect of the Invention

[0008] According to the present invention, it is possible to reduce the weight of a substrate while maintaining its resistance to damage when subjected to a load or impact. [Brief description of the drawings]

[0009] [Figure 1] 1 is a perspective view of a radiation detector according to first and second embodiments of the present invention; [Diagram 2] 2 is a cross-sectional view taken along line AA of the radiation detector of FIG. 1 (first embodiment). [Diagram 3] FIG. 3 is a partial cross-sectional view of FIG. 2. [Figure 4] 2 is a plan view showing an example of a part (photoelectric conversion section) of the radiation detector in FIG. 1. [Diagram 5] 2 is a side view showing an example of a support member included in the radiation detector of FIG. 1. [Figure 6] 2 is a side view showing a state during the manufacture of the radiation detector in FIG. 1. [Figure 7] 2 is a perspective view showing a state during the manufacture of the radiation detector of FIG. 1. FIG. [Figure 8] FIG. 2A is a perspective view showing an example of a mounting member, and FIG. 2B is a cross-sectional view showing the mounting member of FIG. 2A in a state fixed to a support member. [Figure 9] FIG. 2A is a perspective view showing an example of a mounting member, and FIG. 2B is a cross-sectional view showing the mounting member of FIG. 2A in a state fixed to a support member. [Figure 10]FIG. 1A is a perspective view showing an example of a mounting member, and FIGS. 1B to 1D are cross-sectional views showing the mounting member of FIG. 1A in a state fixed to a support member. [Figure 11] FIG. 4 is a perspective view showing an example of a mounting member. [Figure 12] 2 is a cross-sectional view taken along line AA of the radiation detector of FIG. 1 (second embodiment); FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. However, the present invention is not limited to the embodiment shown in the drawings.

[0011] First Embodiment First, a first embodiment of the present invention will be described.

[0012] First, a schematic configuration of a radiation detector according to this embodiment (hereinafter, a detector 100) will be described. FIG. 1 is a perspective view of the detector 100, FIG. 2 is a cross-sectional view of the detector 100 taken along the line AA, FIG. 3 is a cross-sectional view of a portion of FIG. 2 (a region indicated by III in FIG. 2), and FIG. 4 is a part of the detector 100 (a photoelectric conversion section). FIG. 5 is a side view showing an example of a support member 4 provided on detector 100; FIG. 6 is a side view showing detector 100 in the middle of its manufacture; FIG. 7 is an oblique view showing detector 100 in the middle of its manufacture; FIGS. 8 to 10(a) are oblique views showing an example of an attachment member; FIGS. 8 to 10(b), 10(c), and 10(d) are cross-sectional views showing the attachment member of (a) fixed to the support member; and FIG. 11 is an oblique view showing an example of an attachment member. The reference symbols in parentheses in the drawing refer to those of the second embodiment described later.

[0013] The detector 100 is for generating a radiation image in response to received radiation. The detector 100 includes a housing 110 and an internal module 120, as shown in FIG. The detector 100 according to this embodiment includes various switches S (power switch, operation switch, etc.), an indicator I, and the like.

[0014] [1. Housing] The housing 110 houses an internal module 120 . As shown in FIG. 2, the housing 110 includes a box body 1 and a cover body 2. The box body 1 and cover body 2 are made of a plastic. The housing 110 according to this embodiment has a rectangular panel shape.

[0015] [1-1, box body] The box 1 has a front surface 11 . The box 1 according to this embodiment further includes a side surface portion 12. The front portion 11 and the side portion 12 according to this embodiment are integrally formed. The front surface portion 11 and the side surface portion 12 may be separate members.

[0016] (1-1-1.Front part) The front surface part 11 faces an imaging surface 312g, which will be described later, provided in the internal module 120, and extends in parallel to the imaging surface 312g. Moreover, the outer surface of the front surface portion 11 becomes a radiation incident surface 11a (front surface) of the detector 100 (housing 110). The front surface portion 11 according to this embodiment is formed in a rectangular plate shape. On the radiation incident surface 11a according to this embodiment, the range of the effective image area of ​​the sensor panel 31 (the area in which a plurality of semiconductor elements 312b are arranged) is indicated by a frame (not shown).

[0017] The front surface 11 is formed from a material that does not impede the transmission of radiation. The material of the housing 110 according to this embodiment is carbon fiber reinforced plastic (CFRP), glass fiber reinforced plastic (GFRP), light metal, or alloy containing light metal. The material of the housing 110 may be carbon fiber reinforced thermoplastics (CFRTP). Furthermore, when the material of the housing 110 is carbon fiber reinforced (thermoplastic) resin or glass fiber reinforced resin, it may be formed using SMC (Sheet Molding Compound), which is a material that contains shorter fibers than prepreg. Light metals include metals with relatively low specific gravity such as aluminum and magnesium. This allows the weight of the housing 110 to be reduced while maintaining the rigidity of the housing 110. In particular, carbon fiber reinforced resin has a high radiation transmittance, so that the radiation that has passed through the subject reaches the internal module 120 without being attenuated on the way. Therefore, the image quality of the radiographic image can be made higher than when the housing 110 is made of other materials.

[0018] (1-1-2. Side part) The side surface portion 12 extends from the peripheral edge of the front surface portion 11 in a direction perpendicular to the radiation entrance surface 11a and in a direction toward the rear surface portion 21. Moreover, the outer surface of the side portion 12 becomes the side of the detector 100 (housing 110).

[0019] [1-2. Lid] The cover 2 has a rear surface portion 21 . The cover 2 according to this embodiment has a rear surface portion 21 as a whole. The rear surface portion 21 faces the front surface portion 11 of the box body 1 with the internal module 120 interposed therebetween, and extends in parallel with the front surface portion 11 . Moreover, the outer surface of the back surface portion 21 becomes the back surface of the detector 100 (housing 110). Moreover, the rear surface portion 21 according to this embodiment is formed in a rectangular shape that is substantially the same as that of the front surface portion 11. The material of the back surface portion 21 according to the present embodiment is carbon fiber reinforced resin, glass fiber reinforced resin, light metal, etc. It is an alloy containing metals or light metals. The material of the back surface portion 21 may be the same as that of the box 1, or may be different.

[0020] The cover 2 (rear portion 21) thus configured is in contact with the side surface portion 12 of the box 1 and is attached to the side surface portion 12. As a result, the side surface portion 12 connects the front surface portion 11 and the rear surface portion 21. The lid 2 according to this embodiment is fixed to the box 1 with screws. Therefore, when repairing or maintaining the detector 100, the rear part 21 can be separated from the front part 11 and the side part 12 simply by loosening and removing the screws. In other words, a person performing maintenance on the detector 100 can easily access the internal module 120 housed in the front part 11 and the side part 12. Also, a waterproof structure can be achieved by inserting a packing between the lid 2 and the box 1 and screwing or gluing it in place. By preventing moisture from entering, it is possible to prevent the foam from absorbing water and affecting the sensor panel and electrical components.

[0021] [1-3.Other] Although FIG. 1 illustrates an example of a housing 110 (box body 1) in which the side portion 12 is integrally formed with the front portion 11, the housing 110 may be one in which the side portion 12 is integral with the rear portion 21, or the front portion 11, the side portion 12, and the rear portion 21 may each be separate components. Additionally, both the front portion 11 and the rear portion 21 may have side portions. In addition, while FIG. 1 illustrates an example of a housing 110 having a box body 1 and a lid body 2, the housing may also include a cylindrical body having a front portion 11, a rear portion 21, and a pair of side portions 12 respectively connecting both ends of the front portion 11 and both ends of the rear portion 21, and a lid body that closes the opening of the cylindrical body.

[0022] Furthermore, the housing 110 may be provided with a recess on the periphery of the back surface portion 21. In this way, the recess can be hooked with fingers, improving the grip of the detector 100 and making it less likely for a person carrying the detector 100 to drop it. Additionally, the housing 110 may be treated with an antibacterial coating, either on the entire surface or incorporated into the material itself. Furthermore, the housing 110 may be provided with a protective member at the corners (at least one of the four corners of the front surface 11 and the four corners of the rear surface 21). The material of the protective member may be metal, but since the detector 100 according to this embodiment is lightweight and is less susceptible to impact upon collision, it may be elastic (resin, rubber, elastomer, etc.). At least one of the protective members may be different from the other protective members in at least one of the color and the shape. In this way, the orientation of the detector 100 can be easily identified based on the position of the protective member that is different from the other protective members in at least one of the color and the shape.

[0023] [2. Internal Module] The internal module 120 is fixed to at least one of the inner surfaces of the front portion 11 , the rear portion 21 and the side portion 12 of the housing 110 . The internal module 120 according to this embodiment is fixed to the inner surface of the front portion 11, as shown in FIG. Methods for fixing the internal module 120 to the housing 110 include bonding with an adhesive, adhesion with an adhesive tape, fitting into a recess or protrusion formed on the inner surface, engaging with an engaging portion formed on the inner surface, etc. This makes it possible to prevent the internal module 120 from moving when an impact is applied from a direction substantially perpendicular to the side surface of the detector 100.

[0024] The internal module 120 may be fixed to the inner surface of the rear portion 21 or the inner surface of the side portion. In addition, the internal module 120 may be fixed to the inner surface of the front portion 11 and the inner surface of the rear portion 21, the inner surface of the front portion 11 and the inner surface of the side portion 12, and the inner surface of the side portion 12 and the inner surface of the rear portion 21, respectively. Furthermore, the internal module 120 may be fixed to the inner surface of the front portion 11, the inner surface of the side portion 12, and the inner surface of the rear portion 21, respectively.

[0025] In addition, the internal module 120 according to this embodiment is spaced from the inner surface of the side portion 12 by a predetermined distance d1. In other words, the width between the internal module 120 and the side surface portion 12 is d1 or more. There is a void. This makes it possible to prevent the internal module 120 from colliding with the side surface portion 12 and being damaged when the detector 100 receives an impact from a direction substantially perpendicular to the side surface of the detector 100.

[0026] The internal module 120 includes a radiation detection unit 3 and a support member 4 . Moreover, the internal module 120 according to this embodiment further includes an electric component 5.

[0027] [2-1. Radiation detection section] The radiation detection unit 3 is provided between the front surface 11 of the housing and the support member 4. The radiation detection unit 3 according to this embodiment is provided between the front surface portion 11 and the support member 4 via an adhesive layer 6. The radiation detection unit 3 includes a sensor panel 31, as shown in FIG. Moreover, the radiation detection unit 3 according to this embodiment further includes a radiation shielding layer 32, an electromagnetic field shielding layer 33, and a buffer material .

[0028] (2-1-1. Sensor panel) The sensor panel 31 according to this embodiment is provided between a radiation shielding layer 32 and an electromagnetic field shielding layer 33 . The sensor panel 31 according to this embodiment also includes a wavelength conversion section 311 and a photoelectric conversion section 312.

[0029] The wavelength conversion section 311 is for converting radiation into visible light or the like. The wavelength conversion section 311 according to this embodiment is provided between the electromagnetic field shield layer 33 and the photoelectric conversion section 312 . Moreover, the wavelength conversion section 311 according to this embodiment is disposed so as to extend in parallel with the radiation incident surface 11a of the housing 110. Moreover, the wavelength converting portion 311 according to this embodiment has a support layer and a phosphor layer, which are not shown.

[0030] The support layer is made of a flexible material and has a film shape (thin plate shape). Examples of the flexible material include polyethylene naphthalate, polyethylene terephthalate (PET), polycarbonate, polyimide, polyamide, polyetherimide, aramid, polysulfone, polyethersulfone, fluororesin, polytetrafluoroethylene (PTFE), or a composite material made by mixing at least two or more of these. Of the above materials, polyimide, polyamide, polyetherimide, PTFE, or a composite material thereof is particularly preferred from the viewpoint of improving heat resistance. Moreover, the support layer according to this embodiment is formed in a rectangular shape.

[0031] The phosphor layer is formed of a phosphor on the surface of the support layer. A phosphor is a substance that emits light by exciting atoms when irradiated with ionizing radiation such as alpha rays, gamma rays, or X-rays. In other words, phosphors convert radiation into ultraviolet light or visible light. The phosphor may be, for example, a columnar crystal of cesium iodide (CsI).

[0032] The phosphor layer according to this embodiment is formed over the entire surface of the support layer that faces the photoelectric conversion section 312 . In other words, the wavelength converting portion 311 is formed in a rectangular shape. Moreover, the phosphor layer according to this embodiment has a thickness that allows it to bend (elastically deform) together with the support layer when the support layer is bent.

[0033] The wavelength converting section 311 thus configured has a flexible plate shape, and the area exposed to radiation emits light with an intensity according to the dose of the radiation received.

[0034] The photoelectric conversion section 312 serves to convert light into an electrical signal. The photoelectric conversion section 312 according to this embodiment is provided between the wavelength conversion section 311 and the radiation shielding layer 32 . Moreover, the photoelectric conversion section 312 according to this embodiment is disposed so as to extend in parallel with the wavelength conversion section 311 . The photoelectric conversion section 312 is bonded to the wavelength conversion section 311 . As shown in FIG. 4, the photoelectric conversion section 312 includes a substrate 312a and a plurality of semiconductor elements 312b. Moreover, the photoelectric conversion unit 312 according to this embodiment includes a plurality of scanning lines 312c, a plurality of signal lines 312d, a plurality of switching elements 312e, and a plurality of bias lines 312f.

[0035] The substrate 312a is made of a flexible material and has a film shape (thin plate shape). The shape of the substrate 312a in this embodiment when viewed from the front is substantially the same as that of the wavelength converting section 311, that is, a rectangle. The substrate 312 a according to this embodiment is made of the same material as the support layer of the wavelength converting section 311 described above. That is, the substrate 312a according to this embodiment is flexible, and its coefficient of thermal expansion and coefficient of thermal contraction are equal to those of the support layer. Therefore, when the photoelectric conversion section 312 thermally expands, the wavelength conversion section 311 also thermally expands, making it difficult for the laminate of the photoelectric conversion section 312 and the wavelength conversion section 311 to warp. As a result, there is no misalignment between the light emitting position of the wavelength conversion section 311 and the opposing semiconductor element 312b, and it is possible to prevent deterioration in the quality of the radiation image. The substrate 312a may be formed from a material that has the same thermal expansion coefficient and thermal contraction coefficient as the support layer, but is different from the support layer.

[0036] Each of the semiconductor elements 312b generates an amount of charge according to the intensity of the light received. Furthermore, the semiconductor elements 312b are formed so as to be distributed two-dimensionally on the surface of the substrate 312a. Specifically, the semiconductor elements 312b are arranged in a matrix on the surface of the substrate 312a that is in contact with (bonded to) the wavelength converting portion 311. The semiconductor elements 312b according to this embodiment are arranged in a matrix in the center of the imaging surface 312g. Specifically, the semiconductor elements 312b are arranged in a matrix in the center of the imaging surface 312g. The scanning lines 312a and 312b are arranged in a plurality of rectangular regions (corresponding to each pixel of the radiation image) surrounded by a plurality of signal lines 312d (not shown) that are formed perpendicular to the scanning lines. A switch element 312e is provided in each rectangular region. The switch element 312e is formed of, for example, a TFT, and the gate of each switch element 312e is connected to the scanning line 312c, the source is connected to the signal line 312d, and the drain is connected to the semiconductor element 312b.

[0037] Hereinafter, the surface of the substrate 312a on which the semiconductor elements 312b are formed will be referred to as an imaging surface 312g. The photoelectric conversion section 312 thus configured is flexible, and is disposed so that the imaging surface 312g on which the semiconductor element 312b is formed faces the wavelength conversion section 311.

[0038] (2-1-2. Radiation shielding layer) The radiation shielding layer 32 is intended to prevent scattered radiation from reaching the electrical circuit 51 . The radiation shielding layer 32 according to this embodiment is provided between the sensor panel 31 (photoelectric conversion section 312) and the electromagnetic field shielding layer 33, as shown in FIG. Moreover, the radiation shielding layer 32 according to this embodiment fixes the sensor panel 31 by a mounting portion (not shown).

[0039] (2-1-3. Electromagnetic field shielding layer 33) The electromagnetic field shield layer 33 serves to shield against noise. The electromagnetic field shield layer 33 is provided on at least one of the imaging surface 312g of the radiation detection unit 3 and the surface opposite to the imaging surface 312g. The electromagnetic field shield layer 33 according to this embodiment is provided on both the imaging surface 312g side and the opposite surface side. The electromagnetic field shield layer 33 on the surface opposite to the imaging surface 312g may be attached to the support member 4.

[0040] The electromagnetic field shield layer 33 is a layered member that partially contains a conductive material. The electromagnetic field shield layer 33 according to this embodiment includes a resin film having a metal layer formed on the surface thereof, a film made of a transparent conductive material (eg, indium tin oxide (ITO) etc.), and the like. Metals include, for example, aluminum and copper. Methods for forming the metal layer include, for example, a method of attaching a metal foil, a method of depositing a metal, and the like. For the electromagnetic field shield layer 33, a film such as Alpet (registered trademark, Panac Corporation) is suitable. At least one electromagnetic field shield layer 33 is provided on one surface.

[0041] If the electromagnetic field shield layer 33 is provided on the imaging surface 312g side, it is possible to shield external noise entering from the front side. On the other hand, if the electromagnetic field shield layer 33 is provided on the side opposite to the imaging surface 312g, noise generated by the electric circuit 51 can be shielded.

[0042] The electromagnetic shield layer 33 may be connected to, for example, the ground (GND), which keeps the potential of the electromagnetic shield layer 33 constant and further improves the noise shielding effect. In this case, it is preferable to interpose a metal (eg, nickel) whose ionization tendency is small compared to that of aluminum or copper. Metals with small differences in ionization tendency are, for example, metals plated with metals with small differences in ionization tendency. The intermediate member is in the form of a conductive tape containing a metal with a small difference in ionization tendency as a conductive filler. When metals with a large difference in ionization tendency (for example, aluminum and copper) come into contact with each other, electrolytic corrosion may occur, but by doing this, electrolytic corrosion can be prevented.

[0043] (2-1-4. Cushioning material) The cushioning material 34 is for absorbing external loads and shocks. The cushioning material 34 according to this embodiment is provided between the front surface 11 of the housing 110 and the electromagnetic field shield layer 33 . This makes it possible to prevent a load or impact received from the front surface 11 side from being transmitted to the sensor panel 31.

[0044] [2-2. Supporting members] The support member 4 supports the radiation detection unit 3 . This "support" includes not only supporting the radiation detection unit 3 against the load received from the front surface portion 11 side, but also providing the radiation detection unit 3 on the support member 4. As shown in FIG. 2, the support member 4 is provided between the radiation detection unit 3 and the rear surface unit 21. In this way, the support member 4 disperses the load received by the housing 110 from the outside, making it possible to prevent the radiation detection unit 3 (sensor panel 31) from bending.

[0045] The support member 4 is made of a foam. The foam material includes polyethylene, polypropylene, polystyrene, modified polyphenylene ether, polyurethane, acrylic, epoxy, and a mixture of at least two of these resins. In general, soft resins have lower rigidity than hard resins. On the other hand, it is known that the lower the expansion ratio of a foam made of a soft resin, the higher its rigidity. Therefore, the required rigidity can be obtained by adjusting the expansion ratio when producing the foam. The expansion ratio is preferably, for example, equal to or less than 30. In this way, the support member 4 can be made lighter while still obtaining the necessary rigidity without using a material (for example, fiber-reinforced resin or metal) that is more rigid than the foam in a portion (for example, the surface layer) of the support member.

[0046] The support member 4 may be made of a resin whose thermal expansion coefficient is the same as that of the sensor panel 31 or whose difference therebetween is within a predetermined range. Furthermore, the support member 4 may be elastic. The sensor panel 31 has a larger coefficient of thermal expansion than a conventional panel equipped with a glass substrate. However, if the above-described configuration is adopted, even if the sensor panel 31 expands, the support member 4 also expands to the same extent or elastically deforms to absorb the expansion of the sensor panel 31, so that it is possible to prevent the sensor panel 31 from expanding alone and causing wrinkles in the sensor panel 31.

[0047] The support member 4 has a first portion 4a and a second portion 4b.

[0048] The first portion 4a is a portion that is provided without any gaps along the surface opposite the imaging surface 312g of the photoelectric conversion unit 312 of the sensor panel 31 (the surface of the electromagnetic field shielding layer 33 or the surface of the adhesive layer 6 on the surface opposite the imaging surface 312g of the photoelectric conversion unit 312). The first portion 4a has a predetermined thickness in a direction perpendicular to the surface opposite to the imaging surface 312g, and is in the form of a plate extending parallel to the surface. In this manner, the support member 4 further distributes the load received by the housing 110 from the outside, so that the deflection of the radiation detection unit 3 can be further suppressed.

[0049] The second portion 4b is a portion that is provided from the radiation detection unit 3 to the rear surface portion 21 without any gaps. In this manner, the support member 4 further disperses the load received by the housing 110 from the outside, so that bending of the radiation detection unit 3 can be further suppressed. Furthermore, the support member 4 has the first portion 4a and the second portion 4b described above, and therefore has a recess 4c on the surface facing the rear portion 21 of the housing 110. The width, depth and length of the recess 4c are large enough to accommodate an electric circuit 51, which will be described later. In the support member 4 according to this embodiment, a plurality of recesses 4c (at least the number of the electric circuits 51) are formed.

[0050] The support member 4 according to this embodiment is divided into a plurality of members. That is, the support member 4 according to this embodiment has a first support portion 41 and a second support portion .

[0051] (2-2-1. First support part) The first support portion 41 has one surface in contact with the radiation detection portion 3 and the other surface in contact with the electric circuit 51 . The first support portion 41 according to this embodiment corresponds to the above-mentioned first portion 4a. The surface of the first support portion 41 according to this embodiment that comes into contact with the radiation detection portion 3 is flat. Hereinafter, one surface of the first support portion 41 that contacts the radiation detection portion 3 will be referred to as a support surface 41a. The supporting surface 41a according to this embodiment is the same as or slightly larger than the sensor panel 31. Therefore, the first supporting portion 41 can support the sensor panel 31 in its entirety. The thickness of the first support portion 41 (the distance between the support surface 41a and the surface opposite thereto) is preferably within a range of 2 to 5 mm. This makes it possible to ensure the rigidity of the first support portion 41 while also ensuring a space for mounting the electric circuit 51 described below.

[0052] The first support portion 41 according to this embodiment includes two types of foam having different rigidities. The first support portion 41 according to the present embodiment has a first foam body F1 and a second foam body F2. The first foam F1 forms a surface layer that comes into contact with the radiation detection section 3 or the second support section . The second foam F2 is in contact with the surface layer in the direction in which the radiation detection unit 3 and the second support unit 42 are arranged. It forms the core of the system. That is, in the first support portion 41, the distribution of the expansion ratio changes along a direction perpendicular to the support surface 41a. The expansion ratio of the first foam F1 is smaller than that of the second foam F2. is stiffer than the second foam F2. This can improve the bending rigidity of the first support portion 41. As a result, the bending rigidity of the detector 100 can be improved.

[0053] 2 and 5(a) show an example of the first support portion 41 having a uniform thickness (width in a direction perpendicular to the support surface 41a), but the first support portion 41 may have a periphery in a direction along the support surface 41a that is thicker than the center portion. This can further increase the rigidity against loads and impacts. Moreover, the first support portion 41 may be thicker at its center than at its peripheral edge.

[0054] (2-2-2.Second support part) As shown in FIG. 2, the second support portion 42 has one surface in contact with the first support portion 41 and the other surface in contact with the back surface portion 21. That is, the second support portion 42 according to this embodiment is a separate member from the first support portion 41, as shown in FIG. The second support portion 42 according to this embodiment extends to the rear surface portion 21 from a region of the surface of the first support portion 41 opposite the support surface 41a, the region not in contact with an electric circuit 51, which will be described later. Thus, unlike the first support portion 41, the second support portion 42 is formed so as to fill a portion of the surface of the photoelectric conversion portion 312 opposite the imaging surface 312g (the surface of the electromagnetic field shielding layer 33 or the surface of the adhesive layer 6 on the surface of the photoelectric conversion portion 312 opposite the imaging surface 312g), so that a recess 4c is formed on the side of the back portion 21 (in the direction along the support surface 41a).

[0055] Similar to the first support section 41, the second support section 42 according to this embodiment includes two types of foams having different rigidities. As shown in FIG. 5(a), the second support portion 42 according to the present embodiment also includes a first foamed body F1 and and a second foam F2. The first foam F1 in the second support portion 42 extends from the first support portion 41 to the back surface portion 21. It forms the surface layer. The second foam F2 in the second support portion 42 is a surface layer in a direction along the inner surface of the back surface portion 21. It forms the core part that contacts the part. That is, in the second support portion 42, the distribution of the expansion ratio changes along the direction along the support surface 41a, and the manner of distribution is different from that of the first support portion 41. This improves the rigidity against a load applied in a direction perpendicular to the support surface 41a of the second support portion 42. As a result, the rigidity against a load applied in a direction perpendicular to the front or rear surface of the detector 100 can be improved.

[0056] (2-2-3. Supporting materials and others) In addition, as in this embodiment, when the first support portion 41 and the second support portion 42 have anisotropic strength (the arrangement directions of the first foam F1 and the second foam F2 are different), the strength against loads and impacts received in the thickness direction (direction perpendicular to the support surface 41a) may be made greater than the strength against loads and impacts received in the direction along the support surface. Moreover, only one of the first support portion 41 and the second support portion 42 may be composed of the first foamed body F1 and the second foamed body F2. In that case, the other may be formed only of the first foamed body F1 or the second foamed body F2. Moreover, both the first support portion 41 and the second support portion 42 may be formed only of the first foamed body F1 or the second foamed body F2.

[0057] As shown in FIG. 5(b), the support member 4 may be one in which the first support portion 41 and the second support portion 42 are integrally formed from a single foam body. In this case, the recess 4c may be formed by cutting the area to be the recess 4c or by partial pressing, but is preferably formed by partial pressing. The portion of the support member 4 where the recess 4c is formed is thinner (its width in the direction perpendicular to the support surface 41a is smaller) than the other portion (the second portion 4b). However, when the recess 4c is formed by partial pressing, the foaming ratio of the surface of the recess 4c decreases and the strength increases. Therefore, the rigidity of the support member 4 at the recess 4c can be made equal to that of the second portion 4b. Furthermore, the support member 4 may be produced by laminating a plurality of foam sheets.

[0058] [2-3. Electrical Parts] As shown in FIG. 2, the electric component 5 includes an electric circuit 51, wiring 52, and a thermal diffusion layer (not shown). A seat and a seat are provided.

[0059] The electric circuit 51 according to this embodiment is attached to the support member 4 . That is, the radiation detection unit 3, the support member 4 and the electric circuit 51 constitute an internal module 120 that is fixed to one another.

[0060] (2-3-1. Electrical circuits) The electric circuit 51 is disposed on the surface of the support member 4 opposite to the support surface 41a. The electric circuit 51 is housed in the recess 4c of the support member 4 (between the second support portions 42). Electric circuit 51 is spaced apart from rear surface portion 21 of housing 110. This makes it possible to prevent the load received by housing 110 from the outside from being transmitted to electric circuit 51.

[0061] The electric circuit 51 includes a scanning circuit, a readout circuit, a wireless communication circuit, a control circuit, a power supply circuit, a battery, a connector, and the like. The scanning circuit is a circuit that controls each switch element. The readout circuit is a circuit that reads out the electric charge as a signal value. The wireless communication circuit is a circuit for wirelessly communicating with other devices. The control circuit is a circuit that controls each circuit to generate image data. The power supply circuit is a circuit for applying a voltage to a semiconductor element and supplying power to the above-mentioned circuits. The connector, as shown in Figure 1, allows a cable to be inserted for wired communication with other devices.

[0062] (2-3-2. Attaching the electric circuit to the support member) As shown in FIG. 6, the electric circuit 51 according to this embodiment is attached to the support member 4 via a mounting member 7. The mounting member 7 according to this embodiment has a plate portion 71 that is joined to the electric circuit 51, and a protrusion 72, as shown in FIG. Further, in the first support portion 41 of the support member 4, a fitting hole 41b having the same contour as the protrusion 72 is formed.

[0063] The protrusion 72 according to this embodiment is formed with a plurality of radial portions 72a that radiate from the center of the plate portion 71 in the radial direction of the plate portion 71. This improves the frictional force between the mounting member 7 and the support member 4 when the mounting member 7 is fitted to the support member 4, making it difficult for the mounting member 7 to come off the support member 4. Furthermore, when the electric circuit 51 is screwed to the mounting member 7, a rotational torque acts on the mounting member 7. At this time, the presence of a portion such as the radiation portion 72a that protrudes in a direction perpendicular to the rotational torque can prevent the mounting member 7 itself from rotating together with the screw. Furthermore, by engaging with the support member 4 with an area equal to or greater than a predetermined value, such as with the radial portion 72a, the pressure received by the support member 4 is reduced, and even a foam with low rigidity is not damaged, and the rotational torque when screwed can be increased, thereby preventing the screw from loosening.

[0064] The structure of the mounting member 7 is not limited to the one described above. For example, as shown in FIG. 8, the mounting member 7 may include a first member 7a and a second member 7b. The first member 7a of the mounting member 7 has a cylindrical portion 73 and a flange portion 74. The cylindrical portion 73 is adapted to be fitted into a fitting hole 41 b formed in the first support portion 41 . The flange portion 74 is adapted to come into contact with the support surface 41 a of the support member 4 . The second member 7b has a female thread portion 75 and a flange portion . The second member 7b may be made of the same foam as the support member 4. The female screw portion 75 is adapted to fit into the cylindrical portion 73 . An insert screw 75a is embedded in the center of the female screw portion 75. The female screw portion 75 may be directly threaded. The flange portion 76 is adapted to come into contact with the support surface 41a of the first support portion 41. That is, the mounting member 7 is adapted to sandwich the support member 4 between the flange portion 74 and the flange portion 76. When the second member 7b is made of a foam, it is possible to bond the second member 7b by the heat applied when the support member 4 is formed. A screw B that is passed through a screw hole 51 a of the electric circuit 51 is adapted to be screwed into the female screw portion 75 . As a result, the electric circuit 51 is fixed to the support member 4 . The ground wiring of the electric circuit 51 extends to the periphery of the screw hole 51a. Therefore, by fastening the electric circuit 51 with the screw B when mounting the electric circuit 51, the electric circuit 51 can be connected to a ground terminal provided in the vicinity of the screw hole 51a.

[0065] Also, the mounting member 7 may have a female thread portion 75A and a flange portion 76A, for example, as shown in FIG. The flange portion 76A of the mounting member 7 is adapted to come into contact with the support surface 41a of the support member 4. The female screw portion 75A is adapted to fit into a fitting hole 41b formed in the first support portion 41. The female screw portion 75A has a wavy circumferential side surface. The distance d2 between the crests of the waves is equal to or greater than the diameter of the foam particles. In this way, the foam particles of the support member 4 get into the spaces between the waves of the female thread portion 75A, so that when the electrical circuit 51 is fixed with the screw B, even if a rotational torque acts on the mounting member 7 from the screw B, the mounting member 7 can be prevented from rotating together with the screw B.

[0066] As shown in FIG. 10(a), the connector may have a female screw portion 75B and a plate portion 71A. The female screw portion 75B may be cylindrical as shown in FIG. 10, or may have a wavy side peripheral surface as shown in FIG. The plate portion 71A has a joint surface 71a that is sufficiently wide relative to the width of the female screw portion 75. A joint surface 71a of the plate portion 71A is adapted to be bonded to the first support portion 41, as shown in FIG. 10(b). As shown in FIG. 10(c), the mounting member 7 may be configured such that a surface of the plate portion 71A opposite to the surface on which the female screw portion 75B is provided is joined to the first support portion 41. Furthermore, the mounting member 7 may be joined to a radiation shielding layer 32 as shown in FIG. 10(d).

[0067] Furthermore, the mounting member 7 may have an engagement portion 77, for example, as shown in FIG. The engaging portion 77 is adapted to engage with a screw hole 51a formed in the electric circuit 51 by a snap fit method. Because the foam material that forms the support member 4 is vulnerable to rotational torque, the mounting member 7 is likely to rotate when attempting to screw in the electric circuit 51. However, by engaging the electric circuit 51 using a snap-fit ​​method in this manner, the electric circuit 51 can be easily attached.

[0068] It is to be noted that the mounting member 7 does not have to be used to mount the electric circuit 51 to the support member 4. That is, the electric circuit 51 is directly fixed to the support member 4 by an adhesive or an adhesive tape. It's fine. In this case, since the wires cannot be fastened together, the terminals may be connected by wiring using, for example, conductive tape.

[0069] (2-3-3. Wiring) The wiring 52 is, for example, a flexible printed circuit board (Flexible Printed Circuits). It connects the photoelectric conversion unit 312 and various electric circuits 51 . Specifically, terminals of each scanning line (switch element) of the photoelectric conversion unit 312 are connected to a scanning circuit, terminals of each signal line (semiconductor element 312b) are connected to a readout circuit, and terminals of each bias line are connected to a power supply circuit.

[0070] (2-3-4. Thermal diffusion sheet) The thermal diffusion sheet is provided at a position facing an element that generates heat when the electric circuit 51 is in operation, among elements that constitute the electric circuit 51. The position facing the element includes, for example, the rear surface of the electric circuit 51, the support member 4, the housing 110, and the like. In this way, the heat generated by the elements can be diffused by the thermal diffusion sheet, thereby preventing the elements from becoming excessively hot and causing a decrease in their functionality. Moreover, it is possible to prevent the occurrence of heat spots in the area facing the element. The thermal diffusion sheet may be disposed opposite the element via a heat transfer member.

[0071] Second Embodiment Next, a second embodiment of the present invention will be described. In this embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and the description thereof will be omitted.

[0072] FIG. 12 is a cross-sectional view taken along line AA of the radiation detector according to this embodiment (hereinafter, detector 100A). A detector 100A according to this embodiment differs from the first embodiment in the structure of a housing 110A.

[0073] [3. Lid] The lid body 2A according to this embodiment includes a back surface portion 21A and a cap 22.

[0074] [3-1. Back part] The rear surface portion 21A has a recess 21a. The recess 21a is recessed from the outer surface of the rear surface 21A toward the inside of the housing 110A. A slit (not shown) is formed on the side surface of the recess 21a. The width, depth and length of the recess 21a are large enough to accommodate the electric circuit 51 therein. In the rear surface portion 21A according to this embodiment, a plurality of recesses 21a (the number of which corresponds to the number of electric circuits 51) are formed. The bottom surface (the surface closest to the front surface 11) of the recess 21a according to this embodiment is flat. The portion forming the inner wall of the recess 21a in the rear portion 21A (the portion between the recesses 21a) functions as a rib formed along the rear surface of the rear portion 21A. This makes it possible to prevent the housing 110A from bending or twisting even if the detector 100 receives a load.

[0075] [3-2. Cap] The cap 22 is adapted to fit into the opening of the recess 21a. When the cap 22 is fitted into the recess 21a, the electric circuit 51 housed in the recess 21a is shielded. will be done. When the cap 22 according to this embodiment is fitted into the recess 21a, its outer surface becomes flush with the outer surface of the back surface portion 21. The material and thickness of the cap 22 are preferably the same as those of the rear portion 21. In this way, the lid body 2A can eliminate the difference in rigidity between the rear portion 21A and the cap 22.

[0076] In addition, in order to eliminate the difference in rigidity between the cap 22 and the rear portion 21A, the cap 22 may be formed thinner and made of a material with higher rigidity than the rear portion 21, or may be formed thicker and made of a material with lower rigidity. This makes it possible to use carbon fiber reinforced resin or metal, which have good thermal conductivity and high rigidity, to diffuse heat from electrical circuits, or to use resins with low rigidity but which are transparent to radio waves, making the structure suitable for wireless communication. The cap 22 may be provided with a packing on its periphery, thereby preventing dust and liquid from entering the recess 21a and protecting the electric circuit 51. The cap 22 according to this embodiment is detachable from the rear portion 21. This allows easy access to the electric circuit 51 when performing maintenance on the detector 100.

[0077] [4. Supporting members] The support member 4A supports the radiation detection unit 3 on a support surface 41a, and the other opposing surface is in contact with the inner surface of the rear surface portion 21A of the housing 110A. The support member 4A according to this embodiment fills the entire area between the radiation detection unit 3 and the rear surface portion 21 within the housing 110A (except for the area ahead of the imaging surface 312g of the radiation detection unit 3 and the vicinity of the inner surface of the side surface portion 12). For this reason, the shape of the other surface of the support member 4A (the surface in contact with the rear surface portion 21) follows the shape of the rear surface portion 21. The support member 4A may be integrally formed with the rear surface portion 21A, or may be fixed to the rear surface portion 21A. Methods for fixing the support member 4A to the rear portion 21A include bonding using an adhesive, bonding using an adhesive tape, fitting its own convex portion into a concave portion of the rear portion 21A, fitting the convex portion of the rear portion 21A into its own concave portion, and the like.

[0078] [5. Electrical components] The electric circuit 51 according to this embodiment is housed in a recess 21a in the rear surface portion 21A. Moreover, the electric circuit 51 according to this embodiment is attached to the bottom surface of the recess 21a. Methods for fixing the electric circuit 51 to the rear surface portion 21A according to this embodiment include fixing using a mounting member 7, adhesion using an adhesive, adhesion using an adhesive tape, and the like. The electric circuit 51 and the cap 22 of the housing 110A are spaced apart from each other. This makes it possible to prevent the load applied to the housing 110A from being transmitted to the electric circuit 51. The wiring 52 according to this embodiment is passed through the slits in the recess 21a.

[0079] <Effects> In the detectors 100 and 100A, the sensor panel 31 has flexibility. Therefore, even if the housings 110 and 110A are subjected to a load or impact, the sensor panel 31 is less likely to be damaged. Furthermore, since flexible materials are generally lighter than glass, the sensor panel 31 is lighter than conventional panels. In addition, since the sensor panel 31 is lightweight and less susceptible to damage, the support members 4, 4A that support the sensor panel 31 do not need to be as rigid as before. Therefore, it is possible to reduce the amount of material used to form the support members 4, 4A, and it is not necessary to use high-rigidity materials (metal or fiber-reinforced resin) as in the past. As a result, the support members 4, 4A can be made lighter. Moreover, the support members 4, 4A are made of foam and are therefore even lighter. Therefore, according to the detector 100, it is possible to reduce the weight while maintaining the resistance of the substrate to damage when subjected to a load or impact.

[0080] In addition, the sensor panel 31 (flexible material) has low thermal conductivity. Therefore, when a large amount of heat reaches the sensor panel 31 from the electric circuit 51, the heat does not disperse, and high temperature areas are generated locally in the sensor panel 31. If temperature differences occur in different parts of the sensor panel 31, this will appear as image unevenness in the generated radiation image. However, the detectors 100 and 100A include a support member 4 (first support portion 41) between the electric circuit 51 and the sensor panel. The foam forming the support member 4 and 4A generally has high thermal insulation properties. Therefore, by doing so, it is possible to prevent the heat generated by the electric circuit 51 from reaching the sensor panel 31. In particular, since the support members 4, 4A have a gap (recess 4c), heat generated by the electric circuit 51 can escape to the recess 4c as well, so that the heat is prevented from reaching the sensor panel 31 even more.

[0081] In addition, the sensor panel 31 (flexible material) is easily deformed. Therefore, the deformed portion approaches the electric circuit 51, and becomes easily affected by noise generated by the electric circuit 51. However, the detectors 100, 100A support the sensor panel 31 with the support members 4, 4A made of foam. Because foam is lightweight, the support member 4 can be made thick without significantly increasing the weight. If the support members 4, 4A are thick, the distance from the electric circuit 51 can be maintained even if the sensor panel 31 is deformed. Therefore, this makes it possible to suppress the sensor panel 31 from being affected by noise from the electric circuit 51.

[0082] In addition, the sensor panel 31 (flexible material) is easily affected by low-frequency vibrations, so when low-frequency vibrations reach the panel, the amplitude becomes large and noise is easily generated. However, the detectors 100 and 100A support the sensor panel 31 with support members 4 and 4A made of foam. Since foam absorbs low-frequency vibrations, this arrangement can prevent the sensor panel 31 from being affected by low-frequency vibrations. The vibration suppression effect increases as the filling rate of the support members 4, 4A within the housings 110, 110A increases. [Explanation of symbols]

[0083] 100,100A Radiation Detector 110,110A Housing 1 box body 11 Front part 11a Radiation entrance surface 12 Side part 2,2A Lid body 21,21A Back part 21a Recess 22 Cap 120 Internal Module 3. Radiation detection unit 31 Sensor Panel 311 Wavelength conversion unit 312 Photoelectric conversion unit 312a Substrate 312b Semiconductor element 312c Scan Line 312d signal line 312e Switching element 312f bias wire 312g imaging area 32 Radiation Shielding Layer 33 Electromagnetic field shielding layer 34 Cushioning material 4,4A Support member 4a first part 4b Second part 4c Recess 41 First support part 41a Support surface 41b Fitting hole 42 Second support part 5. Electrical Components 51 Electrical Circuits 51a screw hole 52 Wiring 6 Adhesive layer 7 Mounting material 7a First member 7b Second member 71,71A plate part 71a Joint surface 72 Convex 72a Radiation part 73 Cylinder part 74 Tsuba 75, 75A, 75B Female thread 75a insert screw 76,76A Tsuba 77 Engagement part B Screw F1 First Foam F2 Second Foam I indicator S Various switches d1 predetermined distance d2 distance

Claims

1. a radiation detection unit having a substrate and a semiconductor element formed on an imaging surface of the substrate; a support member formed of a foam and supporting the radiation detection unit; an electrical circuit; The support member is formed with a mounting portion for mounting the electric circuit, a mounting member for mounting the electric circuit to the mounting portion; The mounting member has a protrusion and a plate portion, the protrusion of the mounting member has a female thread portion for screwing the electric circuit, The mounting member further has a protrusion in a direction perpendicular to a rotational torque generated by screwing.

2. The radiation detector according to claim 1 , wherein the protrusions are formed in a plurality of positions radially from a center of the plate portion of the mounting member in a radial direction of the plate portion.

3. the protrusion is a wavy side surface formed on the convex portion of the mounting member, 2. The radiation detector according to claim 1, wherein a distance between crests of the side waves is equal to or greater than a diameter of a particle of the foam.

4. The radiation detector according to claim 1 , wherein the protrusion of the mounting member has an engagement portion that engages with a screw hole formed in the electric circuit.

5. The radiation detector according to claim 1 , wherein the substrate is a flexible substrate.

6. The radiation detector according to claim 5 , wherein the substrate is a flexible resin substrate.

7. a front surface portion that faces the imaging surface and into which radiation is incident, and a rear surface portion that faces the front surface portion with the radiation detection unit therebetween, and further comprising a housing that houses the radiation detection unit; The radiation detector according to claim 1 , wherein the support member is provided between the radiation detection section and the rear surface section.

8. A radiation detection unit having a substrate and a semiconductor element formed on an imaging surface of the substrate; a support member formed of a foam and supporting the radiation detection unit; an electrical circuit; The support member is formed with a mounting portion for mounting the electric circuit, a mounting member for mounting the electric circuit to the mounting portion; The mounting member has a protrusion and a plate portion, A radiation detector in which the plate portion of the mounting member is joined to the support member at the same time that the support member is formed.

9. A radiation detector as described in Claim 8, wherein the mounting member has two plate portions, and the support member is sandwiched between the two plate portions.

10. The radiation detector according to claim 8 , wherein the plate portion of the mounting member is located on a side of the support member facing the radiation detection portion.

11. The radiation detector according to claim 8 , wherein the protrusion of the mounting member has an engagement portion that engages with a screw hole formed in the electric circuit.

12. The radiation detector according to claim 8 , wherein the substrate is a flexible substrate.

13. The radiation detector according to claim 12 , wherein the substrate is a flexible resin substrate.

14. a front surface portion that faces the imaging surface and into which radiation is incident, and a rear surface portion that faces the front surface portion with the radiation detection unit therebetween, and further comprising a housing that houses the radiation detection unit; The radiation detector according to claim 8 , wherein the support member is provided between the radiation detection portion and the rear surface portion.

Images