Plating apparatus, plating apparatus control method, and non-volatile storage medium storing a program

Abstract

To provide a plating apparatus which can determine the acceleration in the time of the inappropriate deceleration of a conveyance device that may cause contact between a substrate holder and a processing tank, a control method of the plating apparatus, and a storage medium storing a program.SOLUTION: A plating apparatus comprises: a conveyance device which has an imaging device; a processing tank which has an opening; a reference mark; and a control device. The control device is configured to execute a test at the test acceleration. The test includes: the control device causing the imaging device to capture a reference image when the conveyance device is located at a determination position immediately above the processing tank; the control device moving the conveyance device from the reference position to the determination position; the control device causing the imaging device to capture a comparison image after the stop of the conveyance device; and the control device determining whether a lower end of the substrate holder protrudes to the outside from a region extending in the vertical direction from the opening on the basis of the reference image and the comparison image, and determining that the test acceleration is an inappropriate value when the lower end protrudes from the region.SELECTED DRAWING: Figure 9-1

Description

[Technical field]

[0001] The present invention relates to a plating apparatus, a control method for a plating apparatus, and a non-volatile storage medium storing a program. [Background technology]

[0002] A plating apparatus is used to form a metal thin film on the surface of a substrate. An example of such a plating apparatus is disclosed in Patent Document 1. As shown in FIG. 1, the plating apparatus disclosed in Patent Document 1 includes a plurality of processing tanks and a conveying machine. The conveying machine conveys a substrate holder in a vertical direction and a conveying direction perpendicular to the vertical direction. That is, the conveying machine performs an operation of lifting the substrate holder from one processing tank, an operation of moving the substrate holder from the upper part of one processing tank to the upper part of another processing tank, and an operation of storing the substrate holder in another processing tank. In this way, the conveying machine conveys the substrate holder from one processing tank to another processing tank.

[0003] Furthermore, as shown in paragraph

[0021] of the patent document 1, the plating apparatus is provided with a storage medium that stores a transfer scheduler, which is scheduling software for calculating a transfer schedule. The transfer scheduler executes a standard transfer schedule for all substrates. This standard transfer schedule creates a standard transfer schedule for performing transfer control that results in maximum throughput, based on preset values ​​such as the operation time of each transfer machine (the time required for the transfer machine to transfer a substrate), the processing conditions (process recipe) of the substrate to be processed, and the number of substrates to be processed. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2019-133998 A Summary of the Invention [Problem to be solved by the invention]

[0005] In the plating apparatus of Patent Document 1, as described above, the conveyor moves the substrate holder from the upper part of one processing tank to the upper part of another processing tank when conveying the substrate holder. That is, the conveyor holding the substrate holder moves in the conveying direction and stops at the upper part of another processing tank. At this time, the substrate holder held by the conveyor may vibrate in the conveying direction due to inertial force and swing like a pendulum. The swing of the substrate holder is related to the acceleration of the conveyor when it decelerates, and the greater the magnitude of the acceleration, the greater the swing of the substrate holder. Then, when the conveyor tries to store the substrate holder that is vibrating greatly in the processing tank, the substrate holder cannot pass through the opening of the processing tank, and there is a risk that the substrate holder will come into contact with the processing tank (the edge of the opening).

[0006] Furthermore, the acceleration during deceleration of the transport machine may be one of the set values ​​for creating the transport schedule described above. If a transport schedule is created based on an inappropriate set value for the acceleration during deceleration of the transport machine and normal operation is performed according to this transport schedule, there is a risk that the substrate holder will come into contact with the processing tank. For this reason, it is important to determine whether the acceleration during deceleration of the transport machine is an inappropriate value that may cause contact between the substrate holder and the processing tank.

[0007] Therefore, one of the objectives of the present disclosure is to provide a plating apparatus, a control method for the plating apparatus, and a storage medium storing a program that can determine inappropriate acceleration during deceleration of a conveying device (conveyor) that may cause contact between a substrate holder and a processing tank. [Means for solving the problem]

[0008] A plating apparatus according to one embodiment includes a transport device for transporting a substrate holder in a vertical direction and a transport direction perpendicular to the vertical direction, the transport device having an imaging device, a processing tank having an opening for inserting the substrate holder, a reference mark, and a control device for controlling the transport device and the imaging device, and in a first mode, the control device is configured to be able to perform a test at a test acceleration, and the test includes the steps of: when the transport device is located at a determination position directly above the processing tank, causing the imaging device to capture a reference image so that the opening and the reference mark are captured; the control device causes the imaging device to capture a comparison image after the conveying device has stopped so that the reference mark and the lower end of the substrate holder are captured; and the control device determines, based on the reference image and the comparison image, whether the lower end of the substrate holder protrudes outside of a region obtained by extending the opening in the vertical direction after the conveying device has stopped, and determines that the test acceleration is an inappropriate value if the lower end protrudes outside of the region.

[0009] A control method for a plating apparatus in one embodiment includes the steps of: when a conveying device is positioned at a judgment position directly above a processing tank, causing an imaging device to capture a reference image so that the opening of the processing tank and a reference mark are captured; moving the conveying device from the reference position to a judgment position so that the conveying device holding a substrate holder decelerates at a test acceleration and stops at the judgment position; after the conveying device stops, causing the imaging device to capture a comparison image so that the reference mark and a lower end of the substrate holder are captured; and based on the reference image and the comparison image, determining whether the lower end of the substrate holder extends outside of an area extending vertically from the opening after the conveying device stops, and determining that the test acceleration is an inappropriate value if the lower end extends outside of the area.

[0010] A non-volatile storage medium according to one embodiment is a non-volatile storage medium storing a program for causing a computer to execute a method for controlling a plating apparatus, and stores a program for causing a computer to execute the following: when a transport device is positioned at a determination position directly above a processing tank, cause an imaging device to capture a reference image so that the opening of the processing tank and a reference mark are captured; when the transport device is positioned at a determination position directly above the processing tank, the transport device is moved from the reference position to a determination position so that the transport device holding a substrate holder decelerates at a test acceleration and stops at the determination position; when the transport device stops, cause the imaging device to capture a comparison image so that the reference mark and the lower end of the substrate holder are captured; and when the transport device stops, based on the reference image and the comparison image, determine whether the lower end of the substrate holder extends outside of an area extending vertically from the opening, and determine that the test acceleration is an inappropriate value if the lower end extends outside of the area. [Brief description of the drawings]

[0011] [Figure 1] FIG. 1 is a plan view of a plating apparatus according to an embodiment of the present disclosure. [Diagram 2] 2 is a side view of the transport device and the treatment tank shown in FIG. 1. [Diagram 3] FIG. 3 is a view taken along the line AA in FIG. 2. [Figure 4] FIG. 4 is a view taken along the arrow BB in FIG. [Diagram 5] FIG. 2 is a system configuration diagram of the plating apparatus shown in FIG. [Figure 6] 2A to 2C are diagrams illustrating a transport operation of the transport device illustrated in FIG. [Figure 7-1] FIG. 13 is a side view showing the deflection of the substrate holder. [Figure 7-2] FIG. 13 is a side view showing contact between the substrate holder and the processing bath. [Figure 8] FIG. 2 is a diagram showing a first reference image. [Figure 9-1] FIG. 13 is a side view of the substrate holder when the bottom end of the substrate holder does not protrude from the region. [Figure 9-2] 9-2 is a diagram showing a first comparison image captured by the first camera in FIG. 9-1. [Figure 10-1] 13 is a side view of the substrate holder when the bottom end of the substrate holder protrudes from the region. FIG. [Figure 10-2] 10-2 is a diagram showing a first comparative image captured by a first camera in FIG. 10-1; [Figure 11-1] FIG. [Figure 11-2] FIG. 11A is a diagram showing a first comparative image captured in the state shown in FIG. 11-1. [Figure 12-1] FIG. [Figure 12-2] FIG. 12 shows a first comparative image captured in the state shown in FIG. 12-1. [Figure 13-1] FIG. [Figure 13-2] FIG. 13B is a diagram showing a first comparative image captured in the state shown in FIG. 13-1. [Figure 14-1] FIG. [Figure 14-2] FIG. 14 shows a first comparative image captured in the state shown in FIG. 14-1. [Figure 15-1] FIG. [Figure 15-2] FIG. 15B is a diagram showing a first comparative image captured in the state shown in FIG. 15-1. [Figure 16] 2 is a flowchart showing one procedure of a control process during operation of the plating apparatus shown in FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In the drawings described below, the same or corresponding components are designated by the same reference numerals, and duplicated description will be omitted.

[0013] FIG. 1 is a plan view of a plating apparatus 100 according to an embodiment of the present disclosure. Referring to FIG. 1, the plating apparatus 100 has a load / unload area 101A and a processing area 101B. The load / unload area 101A is an area for loading a substrate W (see FIG. 3) onto a substrate holder 200 (see FIG. 3) or for unloading the substrate W from the substrate holder 200. The processing area 101B is an area for processing the substrate W. The plating apparatus 100 is, for example, a wet vertical electrolytic plating apparatus. The plating apparatus 100 may process substrates of any shape, such as circular, rectangular, or any other shape. The substrate W processed by the plating apparatus 100 includes semiconductor wafers, glass substrates, liquid crystal substrates, printed circuit boards, and other objects to be processed. The size of the substrate W is not particularly limited, but may be 300 mm×300 mm. In addition, in the present application, the substrate holder 200 means a holder for holding the substrate W.

[0014] As shown in FIG. 1, the plating apparatus 100 includes a plurality of cassette tables 102, an aligner 104, a load / unload station 105, a spin rinse dryer 106, and a transport robot 103 in a load / unload area 101A. First, these components of the plating apparatus 100 will be described. The cassette table 102 has a function of mounting a cassette containing a substrate W. The aligner 104 has a function of aligning the position of an orientation flat, a notch, etc. of the substrate W to a predetermined direction. The load / unload station 105 includes one or more substrate mounting / removal devices 105a configured to mount and remove the substrate W from the substrate holder 200. The spin rinse dryer 106 has a function of cleaning the substrate W after plating and drying it by rotating it at high speed. The transport robot 103 has a function of transporting the substrate W between the cassette table 102, the aligner 104, the load / unload station 105, and the spin rinse dryer 106.

[0015] The plating apparatus 100 further includes a stocker 107, a pre-wet module 108, a pre-soak module 109, and a first rinse module 110a in the processing area 101B. The stocker 107 includes a blow module 111, a second rinse module 110b, and a plating module 112. The stocker 107 has a function of storing the substrate holder 200. In the pre-wet module 108, the substrate W is immersed in pure water. In the pre-soak module 109, an oxide film on the surface of a conductive layer such as a seed layer formed on the surface of the substrate W is etched away. In the first rinse module 110a, the substrate W after pre-soaking is washed with a cleaning liquid (such as pure water) together with the substrate holder 200. In the blow module 111, the substrate W after washing is drained. In the second rinse module 110b, the substrate W after plating is washed with a cleaning liquid together with the substrate holder 200. The plating module 112 has a plurality of plating tanks 112a equipped with an overflow tank. Each plating tank 112a stores one substrate W therein, and the substrate W is immersed in the plating liquid held therein to perform plating such as copper plating on the surface of the substrate W. Here, the type of plating solution is not particularly limited, and various plating solutions are used depending on the application. When a plurality of different plating processes are performed on one substrate W, the plating module 112 has a plurality of plating tanks 112a that store different types of plating solutions. In addition, the stocker 107, the pre-wet module 108, the pre-soak module 109, the first rinse module 110a, the blow module 111, the second rinse module 110b, and the plating module 112 each have a processing tank 400 for storing the substrate holder 200 in order to perform the above-mentioned processing on the substrate W or the substrate holder 200. In the present disclosure, a tank that can store the substrate holder is called a processing tank. The plating tank 112a is an example of the processing tank 400.

[0016] Referring again to FIG. 1, the plating apparatus 100 further includes a substrate holder transport device 113 for transporting the substrate holder 200, for example, using a linear motor system. The substrate holder transport device 113 includes a rail 116, a first transport device 300a, and a second transport device 300b. The first transport device 300a and the second transport device 300b can be simply called the transport device 300. The first transport device 300a and the second transport device 300b run on the rail 116. The first transport device 300a and the second transport device 300b have a function of transporting the substrate holder 200 in a vertical direction and a transport direction perpendicular to the vertical direction. The transport direction coincides with the direction in which the rail 116 extends. The first transfer device 300a has a function of transferring the substrate holder 200 between the load / unload station 105, the stocker 107, the pre-wet module 108, the pre-soak module 109, the first rinse module 110a, and the blow module 111. On the other hand, the second transfer device 300b has a function of transferring the substrate holder 200 between the first rinse module 110a, the blow module 111, the second rinse module 110b, and the plating module 112. Note that the plating apparatus 100 may be provided with only the first transfer device 300a without the second transfer device 300b, and the first transfer device 300a may transfer the substrate holder 200 between the above-mentioned sections.

[0017] The plating apparatus 100 also includes a control device 120 for controlling various operating devices. The detailed configuration of the control device 120 will be described later.

[0018] Next, an example of the operation of the plating apparatus 100 will be described. In the plating apparatus 100, the transfer robot 103 takes out an unprocessed substrate W from a cassette placed on the cassette table 102, places it on the aligner 104, and the aligner 104 positions the substrate W based on an orientation flat or a notch. Next, the transfer robot 103 transfers the substrate W to the load / unload station 105, where the substrate W is attached to the substrate holder 200 taken out from the stocker 107. Here, the substrate W is attached to each of the substrate holders 200 at the two load / unload stations 105, and the two substrate holders 200 are transported as a set. The substrate W attached to the substrate holder 200 is transferred by the first transfer device 300a to the pre-wet module 108, where it is pre-rinsed with water, then transferred to the pre-soak module 109, where it is pre-treated, and then transferred to the first rinse module 110a. It is transported and washed with water.

[0019] The substrate W rinsed in the first rinse module 110a is transferred by the second transfer device 300b to one of the plating tanks 112a of the plating module 112 and immersed in the plating solution. Here, plating is performed to form a metal film on the substrate W. When multiple types of plating are performed, the substrate W is sequentially transferred to multiple plating tanks 112a and plated. After plating, the substrate W is transferred by the second transfer device 300b to the second rinse module 110b, rinsed with water, and then transferred to the blow module 111 where it is roughly dried. Thereafter, the substrate W is transferred by the first transfer device 300a to the load / unload station 105, where it is removed from the substrate holder 200. The substrate W removed from the substrate holder 200 is transferred by the transfer robot 103 to the spin rinse dryer 106, where it is washed and dried, and then stored in a cassette on the cassette table 102. The above-described configuration of the plating apparatus 100 is merely an example, and other configurations may be adopted.

[0020] Next, referring to FIG. 2 to FIG. 4, the configuration of the conveying device 300 and the processing tank 400 will be described in more detail. FIG. 2 is a side view of the conveying device 300 and the processing tank 400. FIG. 3 is a view taken along the line AA in FIG. 2, and FIG. 4 is a view taken along the line BB in FIG. 3. Referring to FIG. 2 and FIG. 3, the conveying device 300 includes a main body 302, a hand 304, and an imaging device 310. Referring to FIG. 4, the processing tank 400 has an opening 410 for inserting the substrate holder 200, and is provided with a reference mark 402. The opening 410 is, for example, rectangular, and is formed so that the opening 410 opens in the vertical direction. The opening 410 also has a first end 412 and a second end 414. The first end 412 extends on a first straight line 420 perpendicular to the transport direction and the vertical direction, and the second end 414 extends on a second straight line 422 parallel to the first straight line 420. As an example, the reference mark 402 is a linear mark extending parallel to the first straight line 420 and the second straight line 422, and is located between the first straight line 420 and the second straight line 422. More specifically, the reference mark 402 is located in the middle between the first straight line 420 and the second straight line 422. The imaging device 310 also has a first camera 312 and a second camera 314 (see FIG. 2). The first camera 312 is attached to the main body 302 so as to capture an image in the downward direction. Furthermore, the first camera 312 is configured to capture an image of the lower end 202, the first end 412, and the reference mark 402 of the substrate holder 200 when the transport device 300 is located directly above the processing bath 400. On the other hand, the second camera 314 is attached to the main body 302 so as to capture an image in the downward direction. Furthermore, the second camera 314 is configured to capture an image of the lower end 202, the second end 414, and the reference mark 402 of the substrate holder 200 when the transport device 300 is located directly above the processing tank 400. The hand 304 is attached to the lower part of the main body 302 and configured to be able to grip the substrate holder 200. Note that, in another embodiment according to the present disclosure, the reference mark 402 may be any part of the plating apparatus 100 that can be identified as a mark whose positional relationship with the opening 410 does not change. The reference mark 402 may be, for example, an end of the opening 410, a bolt, a deliberately provided protrusion or dent, or the like.

[0021] Next, the system configuration of the plating apparatus 100 will be described with reference to FIG. 5. FIG. 5 is a system configuration diagram of the plating apparatus 100. Referring to FIG. 5, the control device 120 includes, as an example, a computer 122, a transport device controller 130, and an imaging device controller 132. As shown in FIG. 5, the computer 122, the transport device controller 130, and the imaging device controller 132 are connected to each other via a wired or wireless network, cable, or the like. The transport device controller 130 is configured, for example, by a sequencer, and is connected to the transport device 300 via a predetermined interface. The transport device controller 130 has a function of controlling the transport device 300. The imaging device controller 132 is configured, for example, by a sequencer, and is connected to the imaging device 310 via a predetermined interface. The imaging device controller 132 has a function of controlling the imaging device 310. The computer 122, the transport device controller The controller 130 and the imaging device controller 132 are configured to cooperate to control the transport device 300 and the imaging device 310 .

[0022] 5, the computer 122 includes, for example, a CPU 124, a storage medium 126, and an input / output interface 128. The storage medium 126 stores a program for executing the control described below. The storage medium 126 may include any volatile storage medium and / or any non-volatile storage medium. The storage medium 126 may include one or more of any storage media, such as a ROM, a RAM, a hard disk, a CD-ROM, a DVD-ROM, or a flexible disk. The CPU 124 is configured to execute the program stored in the storage medium 126. The input / output interface 128 may include an output device such as a display, and an input device including a keyboard, a mouse, or the like.

[0023] As described above, in the plating apparatus 100, the transport device 300 transports the substrate holder 200 to each processing tank 400. An example of the operation at this time is shown in FIG. 6. FIG. 6 is a diagram showing the transport operation of the transport device 300. Referring to FIG. 6, first, the transport device 300 grips the substrate holder 200 stored in a certain processing tank 400a (see FIG. 6(a)). Next, the transport device 300 moves vertically upward, removes the substrate holder 200 from the certain processing tank 400a, and then stops (see FIG. 6(b)). Next, the transport device 300 moves in the transport direction and stops directly above another processing tank 400b (see FIG. 6(c)). Next, the transport device 300 moves vertically downward, and stores the substrate holder 200 in another processing tank 400b (see FIG. 6(d)). In this manner, the transfer device 300 transfers the substrate holder 200 from one processing bath 400a to another processing bath 400b.

[0024] As can be seen from the above description, the transport operation of the transport device 300 includes a process in which the transport device 300 gripping the substrate holder 200 moves in the transport direction and stops above another processing bath 400b. During this process, the substrate holder 200 gripped by the transport device 300 may vibrate in the transport direction due to inertial force and swing like a pendulum (see FIG. 7-1). When the transport device 300 attempts to store the substrate holder 200 that is vibrating significantly in the processing bath 400b, the substrate holder 200 may not be able to pass through the opening 410 of the processing bath 400b, and the substrate holder 200 may come into contact with the processing bath 400b (the edge of the opening 410) (see FIG. 7-2). The magnitude of the swing of the substrate holder 200 is affected by the moving distance of the transport device 300 in the transport direction, the acceleration of the transport device 300 when it decelerates in the transport direction, and the like. The smaller the magnitude of acceleration when the transport device 300 decelerates (the slower the transport device 300 stops), the smaller the vibration of the substrate holder 200. Therefore, in order to prevent contact between the substrate holder 200 and the processing bath 400b, it is only necessary to reduce the magnitude of acceleration when the transport device 300 decelerates. In the present disclosure, the "magnitude of acceleration" means the absolute value of the acceleration.

[0025] However, if it is not possible to determine the inappropriate acceleration during deceleration that may cause contact between the substrate holder 200 and the processing tank 400b, the operator cannot determine what value of the acceleration during deceleration of the transport device 300 should be. In other words, the operator cannot determine the acceleration during deceleration of the transport device 300 during normal operation. For this reason, it is required to be able to determine the inappropriate acceleration during deceleration that may cause contact between the substrate holder 200 and the processing tank 400b when the substrate holder 200 is transported from one processing tank 400a to another processing tank b.

[0026] In response to this, the plating apparatus 100 is configured to perform the following test in the first mode. In this way, the plating apparatus 100 determines whether or not a certain test acceleration is an inappropriate acceleration during deceleration. In the test described below, the reference position is, for example, a position where the transfer device 300 moves upward to remove the substrate holder 200 from a certain processing tank 400a. The reference position is the position of the transport device 300 when the transport device 300 moves in the transport direction and stops immediately above another processing tank 400b. In another embodiment of the present disclosure, however, the reference position and the determination position may be any position where the transport device 300 can stop. For example, the reference position and the determination position may be positions directly above the load / unload station 105, the stocker 107, the pre-wet module 108, the pre-soak module 109, the first rinse module 110a, the second rinse module 110b, the blow module 111, and the plating tank 112a. In the test described below, the test acceleration is constant from the start of deceleration to the stop, and is a uniform acceleration. However, in another embodiment of the present disclosure, the test acceleration does not have to be a uniform acceleration. Furthermore, when the conveying device 300 stops at the judgment position, the center O of the first camera 312 and the center O of the second camera 314 are configured to be located directly above the opening 410, i.e., within the area 416 extending vertically from the opening 410 (see Figure 9-1).

[0027] In the test, first, when the transport device 300 is located at the determination position, the control device 120 causes the first camera 312 to capture a first reference image (an example of a reference image) so that the first end 412 and the reference mark 402 are captured. Furthermore, when the transport device 300 is located at the determination position, the control device 120 causes the second camera 314 to capture a second reference image (an example of a reference image) so that the second end 414 and the reference mark 402 are captured. The first reference image is captured as an image as shown in FIG.

[0028] Next, the control device 120 determines a first threshold value (an example of a threshold value) from a length l1 between the reference mark 402 and the first end 412 in the conveying direction based on the first reference image (see FIG. 8). At this time, the control device 120 sets the number of pixels from the reference mark 402 to the first end 412 in the conveying direction in the first reference image as the first threshold value. Note that, in another embodiment, the length l1 between the reference mark 402 and the first end 412 in the conveying direction of the first reference image displayed on the screen may be measured, and the length l1 may be set as the first threshold value. In addition, the control device 120 determines a second threshold value (an example of a threshold value) from a length between the reference mark 402 and the second end 414 in the conveying direction based on the second reference image. At this time, the control device 120 sets the number of pixels from the reference mark 402 to the second end 414 in the conveying direction in the second reference image as the second threshold value. In another embodiment, the length between the reference mark 402 and the second end 414 in the transport direction of the second reference image displayed on the screen may be measured, and this length may be used as the second threshold value.

[0029] Next, the control device 120 moves the transport device 300 from the reference position to the determination position so that the transport device 300 gripping the substrate holder 200 decelerates at the test acceleration and stops at the determination position. Note that the transport device 300 moves at 1300 mm / s before decelerating, as an example. However, in another embodiment according to the present disclosure, the transport device 300 may move at a speed other than 1300 mm / s before decelerating.

[0030] Next, the control device 120 causes the first camera 312 to capture a first comparison image (one example of a comparison image) so that the reference mark 402 and the lower end 202 of the substrate holder 200 are captured after the transport device 300 stops. More specifically, the control device 120 causes the first camera 312 to capture the first comparison image until a predetermined time has elapsed since the transport device 300 stopped. Note that Figs. 9-1 and 10-1 are side views of the substrate holder 200 after the transport device 300 has stopped, and the amplitudes A are different from each other. Fig. 9-2 is a diagram showing the first comparison image captured by the first camera 312 at the time of Fig. 9-1, and Fig. 10-2 is a diagram showing the first comparison image captured by the first camera 312 at the time of Fig. 10-1. Note that in Figs. 9-2 and 10-2, the parts other than the lower end 202 of the substrate holder 200 are omitted in order to show the lower end 202 of the substrate holder 200. When the deflection of the substrate holder 200 is small, the substrate holder 200 deflects as shown in FIG. 10-1. In addition, after the transport device 300 stops, the control device 120 causes the second camera 314 to capture a second comparison image (an example of a comparison image) so that the reference mark 402 and the lower end 202 of the substrate holder 200 are captured. More specifically, the control device 120 causes the second camera 314 to capture the second comparison image until a predetermined time has elapsed since the transport device 300 stopped. In this disclosure, the comparison image is composed of one or more still images.

[0031] Next, the control device 120 sequentially determines a first variation comparison value (one example of a variation comparison value) from the length l2 between the reference mark 402 and the lower end 202 of the substrate holder 200 in the transport direction based on the first comparison image (see FIG. 9-2 and FIG. 10-2). At this time, the control device 120 sets the number of pixels from the reference mark 402 in the transport direction to the lower end 202 of the substrate holder 200 in each still image constituting the first comparison image as the first variation comparison value. Note that, in another embodiment, the length l2 between the reference mark 402 and the lower end 202 of the substrate holder 200 in the transport direction of each still image constituting the first comparison image displayed on the screen may be measured, and the length l2 may be set as the first variation comparison value. In addition, the control device 120 sequentially determines a second variation comparison value (one example of a variation comparison value) from the length between the reference mark 402 and the lower end 202 of the substrate holder 200 in the transport direction based on the second comparison image. At this time, the control device 120 sets the number of pixels from the reference mark 402 in the transport direction to the bottom end 202 of the substrate holder 200 in each still image constituting the second comparison image as the second variation comparison value. Note that in another embodiment, the length between the reference mark 402 in the transport direction and the bottom end 202 of the substrate holder 200 in each still image constituting the second comparison image displayed on the screen may be measured, and the length may be set as the second variation comparison value.

[0032] Next, the control device 120 determines, based on the first reference image, the first comparative image, the second reference image, and the second comparative image, whether or not there is a risk that the lower end 202 of the substrate holder 200 may protrude outside of a region 416 obtained by vertically extending the opening 410 after the transport device 300 has stopped, using a method described below (see FIGS. 9-1 and 10-1). Then, the control device 120 determines that the test acceleration is an inappropriate value when there is a risk that the lower end 202 of the substrate holder 200 may protrude outside of the region 416. The plating apparatus 100 performs the test as described above.

[0033] It should be noted that even under the same operating conditions, the swing width A of the substrate holder 200 may not necessarily be the same. For this reason, the control device 120 may move the transport device 300 from the reference position to the determination position several times so that the transport device 300 decelerates at the test acceleration and stops at the determination position, and may determine that the test acceleration is an inappropriate value if there is a risk that the lower end 202 may protrude outside the region 416 even once. In this case, the control device 120 may be configured so that the number of times that the control device 120 moves the transport device 300 from the reference position to the determination position can be changed by the operator. This number may also be two or three times.

[0034] As can be seen from the above description, the control device 120 determines that the test acceleration is an inappropriate value when there is a risk that the lower end 202 may protrude from the region 416 after the transport device 300 stops (see FIG. 10-1). The reason for this will be described with reference to FIG. 9-1 and FIG. 10-1. In FIG. 9-1, the lower end 202 of the substrate holder 200 does not protrude from the region 416. In this state, when the transport device 300 moves downward in the vertical direction, the lower end 202 of the substrate holder 200 can clearly pass through the opening 410 of the processing bath 400. On the other hand, in FIG. 10-1, the lower end 202 of the substrate holder 200 protrudes from the region 416. And, the plate surface 418 of the processing bath 400 is located directly below the lower end 202 of the substrate holder 200. Therefore, if the transport device 300 moves vertically downward in this state, the lower end 202 of the substrate holder 200 cannot pass through the opening 410 of the processing bath 400 and comes into contact with the processing bath 400. Therefore, the determination condition of the control device 120 is valid, and the plating apparatus The apparatus 100 can determine an inappropriate acceleration during deceleration that may cause contact between the substrate holder 200 and the processing bath 400 .

[0035] Also, an operator can visually check the vibration of the substrate holder 200 to determine whether the lower end 202 of the substrate holder 200 protrudes outside the region 416 that is a vertical extension of the opening 410 of the processing tank 400. However, when such a determination is made by an operator's visual check, it takes time for the operator to make the determination, which may extend the work time. In contrast, the plating apparatus 100 does not require the operator to make a visual check for the determination. In other words, the plating apparatus 100 can reduce the time required for the work to determine the acceleration during inappropriate deceleration compared to the case where the work is performed by an operator through visual check.

[0036] Furthermore, in an embodiment according to the present disclosure, in the above test, the control device 120 compares the first threshold value with the first fluctuation comparison value, and when the first fluctuation comparison value exceeds the first threshold value, it determines that the bottom end 202 of the substrate holder 200 protrudes outside the region 416. This allows the control device 120 to reliably determine that the bottom end 202 has protruded outside the region 416 when the bottom end 202 of the substrate holder 200 protrudes outside the region 416 from the side of the first end 412 (see FIG. 10-1). The reason for this will be described with reference to FIGS. 11-1 to 15-2.

[0037] 11-1, 12-1, and 13-1 are side views of the substrate holder 200, showing different states of the substrate holder 200 being shaken. FIG. 11-2, 12-2, and 13-2 are diagrams showing a first comparative image captured in the states of FIG. 11-1, FIG. 12-1, and FIG. 13-1, respectively. Note that in FIG. 11-1, FIG. 12-1, and FIG. 13-1, the center O of the first camera 312 is located directly above the first end 412. Also, in FIG. 11-2, FIG. 12-2, and FIG. 13-2, in order to show the lower end 202 of the substrate holder 200, the parts other than the lower end 202 of the substrate holder 200 are omitted.

[0038] FIG. 11-1 shows a state where the lower end 202 of the substrate holder 200 is located directly above the first end 412. Referring to FIG. 11-1, a straight line m1 connecting the center O of the first camera 312 and the lower end 202 of the substrate holder 200 passes through the first end 412. Therefore, in the first comparison image captured in FIG. 11-1, the lower end 202 overlaps with the first end 412 (see FIG. 11-2). Therefore, in the state shown in FIG. 11-1, the length k1 from the reference mark 402 to the lower end 202 in the transport direction is equal to the length l1 from the reference mark 402 to the first end 412 (see FIG. 8). That is, the first fluctuation comparison value is equal to the first threshold value.

[0039] FIG. 12-1 shows a state where the bottom end 202 of the substrate holder 200 does not protrude from the region 416. Referring to FIG. 12-1, a straight line m2 connecting the center O of the first camera 312 and the bottom end 202 of the substrate holder 200 passes through the opening 410. Therefore, in the first comparison image captured in FIG. 12-1, the bottom end 202 overlaps with the opening 410 (see FIG. 12-2). Therefore, in the state shown in FIG. 12-1, the length k2 from the reference mark 402 to the bottom end 202 in the transport direction is shorter than the length l1 from the reference mark 402 to the first end 412 (see FIG. 8). That is, the first fluctuation comparison value is smaller than the first threshold value.

[0040] FIG. 13-1 shows a state in which the bottom end 202 of the substrate holder 200 protrudes to the outside from the region 416. Referring to FIG. 13-1, a straight line m3 connecting the center O of the first camera 312 and the bottom end 202 of the substrate holder 200 passes through the plate surface 418. Therefore, in the first comparative image captured in FIG. 13-1, the bottom end 202 overlaps with the plate surface 418 (see FIG. 13-2). Therefore, in the state shown in FIG. 13-1, The length k3 from the reference mark 402 to the lower end 202 is longer than the length l1 (see FIG. 8) from the reference mark 402 to the first end 412. In other words, the first fluctuation comparison value is greater than the first threshold value.

[0041] From the above, it can be seen that if the center O of the first camera 312 is located directly above the first end 412, when the first fluctuation comparison value exceeds the first threshold value, the lower end 202 of the substrate holder 200 protrudes outside the region 416.

[0042] Next, reference is made to Fig. 14-1 to Fig. 15-2. Fig. 14-1 and Fig. 15-1 are side views of the substrate holder 200, showing states in which the positions of the center O of the first camera 312 are different from each other. Fig. 14-2 and Fig. 15-2 are diagrams showing a first comparative image captured in the states of Fig. 14-1 and Fig. 15-1, respectively. Note that in Fig. 14-1 and Fig. 15-1, the lower end portion 202 of the substrate holder 200 is located directly above the first end portion 412. In Fig. 14-2 and Fig. 15-2, in order to show the lower end portion 202 of the substrate holder 200, the portions other than the lower end portion 202 of the substrate holder 200 are omitted.

[0043] In FIG. 14-1, the center O of the first camera 312 is located directly above the opening 410. That is, the center O of the first camera 312 is located inside the region R1 on the side where the second end 414 is located, of the two regions R1 and R2 divided by the vertical plane S passing through the first end 412. Referring to FIG. 14-1, a straight line n1 connecting the center O of the first camera 312 and the lower end 202 of the substrate holder 200 passes through the plate surface 418 of the processing bath 400. Therefore, in the first comparison image captured in FIG. 14-1, the lower end 202 overlaps with the plate surface 418 (see FIG. 14-2). Therefore, in the state shown in FIG. 14-1, the length k4 from the reference mark 402 to the lower end 202 in the transport direction is longer than the length l1 from the reference mark 402 to the first end 412 (see FIG. 8). That is, the first fluctuation comparison value is greater than the first threshold value. When the bottom end 202 of the substrate holder 200 protrudes outside the region 416, the first fluctuation comparison value becomes even larger.

[0044] In this way, when the center O of the first camera 312 is not located directly above the first end 412 but is located inside the region R1, even when the first fluctuation comparison value is greater than the first threshold, the bottom end 202 of the substrate holder 200 may not protrude outside the region 416. However, when the first fluctuation comparison value is smaller than the first threshold, the bottom end 202 of the substrate holder 200 certainly does not protrude outside the region 416 from the first end 412 side.

[0045] As described above, in the plating apparatus 100, the center O of the first camera 312 is located directly above the opening 410. That is, the center O is located inside the region R1. Then, when the first fluctuation comparison value exceeds the first threshold, the control device 120 considers that the lower end 202 of the substrate holder 200 protrudes from the region 416 to the outside. From this, although the control device 120 may determine that the lower end 202 does not protrude from the region 416 from the first end 412 side as protruding, it can reliably determine that the lower end 202 protrudes from the region 416. Then, when there is a risk that the lower end 202 of the substrate holder 200 protrudes from the region 416 to the outside, the plating apparatus 100 determines that the test acceleration is an inappropriate value. In other words, the plating apparatus 100 can determine an inappropriate acceleration during deceleration of the transfer device 300 that may cause contact between the substrate holder 200 and the processing bath 400.

[0046] On the other hand, in FIG. 15-1, the center O of the first camera 312 is located inside the region R2. Referring to FIG. 15-1, the straight line n2 connecting the center O of the first camera 312 and the bottom end 202 of the substrate holder 200 passes through the opening 410. Therefore, in the first comparative image captured in FIG. 15-1, the bottom end 202 overlaps with the opening 410 (see FIG. 15-2). 15-1, the length k2 from the reference mark 402 to the lower end 202 in the feed direction is shorter than the length l1 (see FIG. 8) from the reference mark 402 to the first end 412. In other words, the first fluctuation comparison value is smaller than the first threshold value.

[0047] In this way, when the center O of the first camera 312 is located in the region R2, the first variation comparison value may not exceed the first threshold value when the lower end 202 protrudes. For this reason, when making a judgment using the first comparison value and the first threshold value, it is preferable that the first camera 312 is located in the region R1.

[0048] Furthermore, in the above test, the control device 120 compares the second threshold value with the second fluctuation comparison value, and when the second fluctuation comparison value exceeds the second threshold value, it is determined that the bottom end 202 of the substrate holder 200 protrudes outside the region 416. This allows the control device 120 to reliably determine that the bottom end 202 of the substrate holder 200 protrudes outside the region 416 from the second end 414 side. Note that the reason for this is the same as the reason for the control device 120 to reliably determine that the bottom end 202 protrudes outside the region 416 from the first end 412 side, and therefore the explanation of this reason will be omitted.

[0049] In addition, the vibration of the substrate holder 200 is related to the acceleration during deceleration of the transport device 300, and when the magnitude of the acceleration decreases, the magnitude of the vibration of the substrate holder 200 also decreases. Therefore, if the magnitude of the test acceleration decreases in the above test, the test acceleration is less likely to be determined as an acceleration during inappropriate deceleration. However, if the magnitude of the acceleration during deceleration of the transport device 300 during normal operation decreases, the time until the transport device 300 stops increases. As a result, a longer time is required to transport the substrate holder 200, and there is a risk that the processing amount of the substrate W of the plating apparatus 100 will decrease. Therefore, in order to prevent a decrease in the processing amount, it is required not to make the magnitude of the acceleration during deceleration of the transport device 300 smaller than necessary. In this disclosure, normal operation means a time when the plating apparatus 100 is operating to perform plating processing on the substrate W.

[0050] In contrast, in an embodiment according to the present disclosure, the control device 120 is configured to execute the above test at a plurality of test accelerations and find an acceleration having a larger magnitude that is not determined to be an acceleration during inappropriate deceleration. Specifically, the control device 120 is configured to repeatedly execute the above test at a plurality of accelerations in descending order of acceleration magnitude until a test acceleration that is not determined to be an inappropriate value is found. The control device 120 is then configured to output or store the first test acceleration that is not determined to be an inappropriate value found as a result of the repetition as the maximum allowable acceleration.

[0051] The maximum allowable acceleration is the maximum acceleration that is not determined to be an inappropriate value among the accelerations tested by the plating apparatus 100. Therefore, if the maximum allowable acceleration is set as the set value of the acceleration during deceleration applied to the transport device 300 and the plating apparatus 100 performs normal operation, the processing amount will not be unnecessarily reduced. In other words, the plating apparatus 100 can obtain an optimal set value of the acceleration during deceleration that can prevent contact between the substrate holder 200 and the processing tank 400 and prevent an unnecessary reduction in the processing amount.

[0052] During normal operation, the transport device 300 transports the substrate holder 200 through multiple routes, such as from the load / unload station 105 to the pre-wet module 108, and from the pre-wet module 108 to the pre-soak module 109. For this reason, in order to perform normal operation, a set value of the acceleration during deceleration for each route needs to be input to the control device 120 of the plating apparatus 100. In other words, not only a set value of the optimal acceleration during deceleration for one route (a route from one reference position to one judgment position) but also optimal acceleration during deceleration for multiple routes is required.

[0053] In response to this, plating apparatus 100 operates according to the control flow shown in Fig. 16, and can obtain optimal acceleration during deceleration in a plurality of paths (paths from a plurality of reference positions to a plurality of determination positions). An example of the operation of plating apparatus 100 will be described with reference to Fig. 16.

[0054] 16, first, in step S100, when the computer 122 receives a conveyance device adjustment command, the computer 122 starts operating. Note that route information for a test (information on the reference position to the conveyance position for which a test is to be performed) is input in advance to the computer 122. The computer 122 may be configured so that an operator can input this information to the computer 122.

[0055] Next, in step S110, it is determined whether or not there is an untested judgment position. If there is an untested judgment position, the process proceeds to step S120. On the other hand, if there is no untested judgment position, the process proceeds to step S260.

[0056] When the process proceeds to step S120, the transport device controller 130 moves the transport device 300 to the set determination position. Next, in step S130, the transport device 300 arrives at the set determination position and the movement is completed.

[0057] Next, in step S140, the imaging device controller 132 causes the imaging device 310 to capture a reference image. Then, the computer 122 sets a threshold value based on the reference image.

[0058] Next, in step S150, the transport device controller 130 moves the transport device 300 to the set reference position. Next, in step S160, the transport device 300 arrives at the set reference position and the movement is completed.

[0059] Next, in step S170, the transport device controller 130 moves the transport device 300 from the set reference position to the set judgment position so that the transport device 300 gripping the substrate holder 200 decelerates at the set test acceleration and stops at the judgment position. Next, in step S180, the transport device 300 arrives at the set reference position and the movement is completed.

[0060] Then, in step S190, imaging device controller 132 causes imaging device 310 to capture a comparison image. Then, in step S200, imaging device 310 completes imaging.

[0061] Next, in step S210, the computer 122 determines a fluctuation comparison value based on the comparison video. Then, the value at which the fluctuation comparison value is at its maximum is compared with a threshold value. As a result, if the value at which the fluctuation comparison value is at its maximum is equal to or less than the threshold value, the process proceeds to step S230. On the other hand, if the value at which the fluctuation comparison value is at its maximum is greater than the threshold value, the process proceeds to step S220.

[0062] When the process proceeds to step S220, the magnitude of the set test acceleration is decreased by a predetermined amount. After that, the process proceeds to step S150, and the processes from step S220 to step S210 are repeated according to the flow of FIG. 16 until the value at the time when the fluctuation comparison value becomes maximum becomes equal to or less than the threshold value.

[0063] When the maximum fluctuation comparison value is equal to or less than the threshold value, the process proceeds from step S210 to step S230, where it is determined whether or not there is an untested reference position. If there is no untested reference position, the process proceeds to step S250. On the other hand, if there is an untested reference position, the process proceeds to step S240.

[0064] When the process proceeds to step S240, the computer 122 changes the setting of the reference position to a position not being tested. Then, the process proceeds to step S150, and the processes from step S240 to step S230 are repeated according to the flow of FIG. 16 until there are no more reference positions not being tested.

[0065] When there are no more untested reference positions, the process proceeds from step S230 to step S250, and the computer 122 changes the setting of the judgment position to a position that is not being tested. Thereafter, the process proceeds to step S110, and the processes from step S120 to step S110 are repeated according to the flow of FIG. 16 until there are no more untested judgment positions.

[0066] When there are no more untested determination positions, the process proceeds from step S110 to step S260. In step S260, the computer 122 notifies the end of the conveying device adjustment.

[0067] The plating apparatus 100 operates as described above. In this manner, the plating apparatus 100 can automatically obtain optimal acceleration during deceleration in a plurality of paths (paths from a plurality of reference positions to a plurality of determination positions).

[0068] As described above, the plating apparatus 100 can determine the acceleration during inappropriate deceleration that may cause contact between the substrate holder 200 and the processing tank 400. Therefore, if the transport device 300 decelerates at an acceleration smaller than the acceleration during inappropriate deceleration during normal operation, contact between the substrate holder 200 and the processing tank 400 can be prevented. However, even if the transport device 300 decelerates at an acceleration smaller than the acceleration during inappropriate deceleration, the vibration amplitude of the substrate holder 200 may vary even under the same operating conditions, so that contact between the substrate holder 200 and the processing tank 400 cannot be completely prevented. The state of the plating apparatus 100 may change due to deterioration of the hand, main body, and substrate holder 200 of the transport device 300, or poor calibration and adjustment after parts replacement. In such a case, the vibration of the substrate holder 200 when the transport device 300 is stopped may change. As a result, even if the transport device 300 is decelerated and stopped at an acceleration smaller than the acceleration during inappropriate deceleration, there is a risk of contact between the substrate holder 200 and the processing tank 400. The plating apparatus 100 has a second mode, and is set to the second mode during normal operation to prevent such contact. An example of the operation of the plating apparatus 100 in the second mode will be described below.

[0069] During normal operation, the transport device 300 needs to transport the substrate holder 200 from one processing tank 400 to another processing tank 400. Therefore, in the second mode, the control device 120 moves the transport device 300 holding the substrate holder 200 from one processing tank 400 to another processing tank 400. That is, the control device 120 moves the transport device 300 holding the substrate holder 200 from the reference position to the determination position, and stops the transport device 300 at the reference position, as in the first mode. Note that the reference position and the determination position in the second mode are the same as the reference position and the determination position in the test in the first mode, respectively. Then, after the transport device 300 stops, the control device 120 causes the first camera 312 to capture the third comparison image so that the reference mark 402 and the lower end 202 of the substrate holder 200 are captured. In addition, the control device 120 adjusts the first camera 314 so that the reference mark 402 and the lower end 202 of the substrate holder 200 are captured by the second camera 314. 4. Take comparison footage.

[0070] Next, the control device 120 sequentially determines a third variation comparison value from the length between the reference mark 402 and the lower end 202 of the substrate holder 200 in the transport direction based on the third comparison image. Also, the control device 120 sequentially determines a fourth variation comparison value from the length between the reference mark 402 and the lower end 202 of the substrate holder 200 in the transport direction based on the fourth comparison image. Next, when the third variation comparison value exceeds the first threshold value or when the fourth variation comparison value exceeds the second threshold value, the control device 120 stops the transport device 300 and sounds an alarm. Note that the first threshold value and the second threshold value in the second mode are the first threshold value and the second threshold value determined in the first mode.

[0071] As can be seen from the above description, in the second mode, when the third fluctuation comparison value exceeds the first threshold value or when the fourth fluctuation comparison value exceeds the second threshold value, the control device 120 stops the transport device 300 and does not move the transport device 300 downward from the determination position. In other words, when the lower end 202 of the substrate holder 200 protrudes from the region 416, the control device 120 does not move the transport device 300 downward from the determination position. This allows the plating apparatus 100 to prevent contact between the substrate holder 200 and the processing tank 400 even if the state of the plating apparatus 100 changes.

[0072] Also, the opening 410 of the processing tank 400 may be blocked by a lid. If the opening 410 of the processing tank 400 is blocked when the transport device 300 stores the substrate holder 200 in the processing tank 400, the substrate holder 200 comes into contact with the lid. In such a case, the substrate holder 200, the processing tank 400, the lid, etc. may be damaged. The plating apparatus 100 has a third mode to prevent such damage. The control device 120 is configured to perform the following control in the third mode.

[0073] In the third mode, first, the control device 120 causes the imaging device 310 to capture a first reference still image, which is an image of the opening 410 of the processing tank 400, when the substrate holder 200 is able to enter the inside of the processing tank 400 through the opening 410.

[0074] Next, the control device 120 causes the imaging device 310 to capture a first comparison still image, which is an image of the opening 410 of the processing tank 400, from the position where the first reference still image was captured, before the transport device 300 transports the substrate holder 200 into the processing tank 400. Next, the control device 120 compares the first reference still image with the first comparison still image, and stops the transport device 300 when the matching rate between the first reference still image and the first comparison still image becomes equal to or less than a predetermined value. Note that the matching rate is the percentage of matching pixels among all pixels, which is obtained by comparing each pixel constituting the first reference still image with each pixel constituting the first comparison still image. The predetermined value may be 97%, 95%, 90%, 80%, 70%, or the like.

[0075] When the matching rate between the first reference still image and the first comparison still image is low, it is highly likely that a foreign object such as a lid is placed on the opening 410 and the opening 410 is blocked. In the third mode, as described above, when the matching rate between the first reference still image and the first comparison still image is equal to or lower than a predetermined value, the transport device 300 stops. Therefore, in the plating apparatus 100, when it is highly likely that the opening 410 is blocked, the transport device 300 does not transport the substrate holder 200 into the processing tank 400. In other words, the plating apparatus 100 can prevent the substrate holder 200 from coming into contact with the foreign object.

[0076] The plating apparatus 100 also has a fourth mode. The control device 120 is configured to perform the following controls in the fourth mode.

[0077] In the fourth mode, first, the control device 120 detects that the substrate holder 200 is stored in the stocker 107. When the substrate holder 200 is in the stocker 107, the control device 120 causes the imaging device 310 to capture a second reference still image, which is an image of the stocker 107. When it is desired to obtain the inventory information of the substrate holder 200 in the stocker 107, the control device 120 causes the imaging device 310 to capture a second comparison still image, which is an image of the stocker 107, from the position where the second reference still image was captured. Then, the control device 120 determines that the substrate holder 200 is stored in the stocker 107 when the matching rate between the second reference still image and the second comparison still image is equal to or greater than a predetermined value. On the other hand, the control device 120 determines that the substrate holder 200 is not stored in the stocker 107 when the matching rate between the second reference still image and the second comparison still image is less than a predetermined value. Thereafter, the control device 120 outputs or stores the inventory information of the substrate holder 200 in the stocker 107. In this way, the plating apparatus 100 can obtain the inventory information of the substrate holder 200 in the stocker 107. The matching rate is the percentage of matching pixels among all pixels when each pixel constituting the second reference still image is compared with each pixel constituting the second comparison still image. The predetermined value used in the fourth mode may be 97%, 95%, 90%, 80%, 70%, etc.

[0078] [Note] A part or all of the above-described embodiments can be described as, but is not limited to, the following supplementary notes.

[0079] (Appendix 1) The plating apparatus according to Supplementary Note 1 includes a transport device for transporting a substrate holder in a vertical direction and a transport direction perpendicular to the vertical direction, the transport device having an imaging device, a treatment tank having an opening into which the substrate holder is inserted, a reference mark, and a control device for controlling the transport device and the imaging device, wherein in a first mode, the control device is configured to be able to perform a test at a test acceleration, and the test includes the steps of: when the transport device is located at a judgment position directly above the treatment tank, causing the imaging device to capture a reference image so that the opening and the reference mark are captured; The method includes moving the conveying device from a reference position to a determination position so that the conveying device holding a holder decelerates at the test acceleration and stops at the determination position; the control device causes the imaging device to capture a comparison image after the conveying device stops so that the reference mark and the lower end of the substrate holder are captured; and the control device determines, based on the reference image and the comparison image, whether the lower end of the substrate holder extends outside the area extended vertically from the opening after the conveying device stops, and determines that the test acceleration is an inappropriate value if the lower end extends outside the area.

[0080] The plating apparatus according to Supplementary Note 1 judges whether the lower end of the substrate holder protrudes outside the region obtained by vertically extending the opening after the transport device stops at the judgment position, and judges the test acceleration to be an inappropriate value if the lower end protrudes outside the region. In other words, this plating apparatus can judge the acceleration during inappropriate deceleration that may cause contact between the substrate holder and the processing tank.

[0081] An operator can also visually check the vibration of the substrate holder to determine whether the lower end of the substrate holder protrudes outside the area vertically extending from the opening of the processing tank, but if such a determination is made by the operator's visual check, it may take time for the operator to make the determination, which may extend the work time.

[0082] In contrast, the plating apparatus according to Supplementary Note 1 does not require visual confirmation by an operator. As a result, the plating apparatus according to Supplementary Note 1 can reduce the time required for the task of determining the acceleration during inappropriate deceleration compared to the case where the task is performed by an operator through visual confirmation.

[0083] (Appendix 2) According to the plating apparatus of Supplementary Note 2, in the plating apparatus described in Supplementary Note 1, the test acceleration is constant from the start of deceleration to the stop.

[0084] (Appendix 3) According to the plating apparatus of Appendix 3, in the plating apparatus described in Appendix 2, the control device is configured to be able to perform the test at a plurality of the test accelerations, and the control device repeatedly performs the test at the test accelerations in descending order of magnitude until a test acceleration that is not determined to be an inappropriate value is found, and the control device outputs or stores the first test acceleration that is not determined to be an inappropriate value found as a result of the repetition as the maximum allowable acceleration.

[0085] According to the plating apparatus of Supplementary Note 3, it is possible to find the maximum allowable acceleration among the test accelerations that are not determined to be inappropriate values ​​from among a plurality of different acceleration values. In other words, since this maximum allowable acceleration is the maximum among the test accelerations that are not determined to be inappropriate values, it is possible to prevent the throughput from being reduced more than necessary.

[0086] (Appendix 4) According to the plating apparatus of Supplementary Note 4, in the plating apparatus according to any one of Supplementary Notes 1 to 3, the opening has a first end extending on a first straight line perpendicular to the transport direction and the vertical direction, and a second end extending on a second straight line parallel to the first straight line, the imaging device has a first camera for imaging the lower end, the first end, and the reference mark of the substrate holder, the control device controls the first camera, the reference mark is located between the first straight line and the second straight line in the transport direction, a center of the first camera is located directly above the opening when the transport device is located at the determination position, and in the test, the control device controls the first camera so that the first end and the reference mark are captured by the first camera at the determination position. The method includes: capturing a first reference image; the control device determining a first threshold value from the length between the reference mark and the first end in the transport direction based on the first reference image; the control device capturing a first comparison image after the transport device is stopped so that the reference mark and the lower end of the substrate holder are captured by the first camera; the control device sequentially determining a first variation comparison value from the length between the reference mark and the lower end of the substrate holder in the transport direction based on the first comparison image; and the control device comparing the first threshold value with the first variation comparison value, and determining that the lower end of the substrate holder is protruding outside the area when the first variation comparison value exceeds the first threshold value.

[0087] When the first fluctuation comparison value is equal to or less than the first threshold, the length in the transport direction from the reference mark to the lower end of the substrate holder is equal to or less than the length in the transport direction from the reference mark to the first end. In other words, when the first fluctuation comparison value is equal to or less than the first threshold, the lower end of the substrate holder certainly does not protrude from the first end side to the outside of the region. On the other hand, when the first fluctuation comparison value exceeds the first threshold, the length in the transport direction from the reference mark to the lower end of the substrate holder may exceed the length in the transport direction from the reference mark to the first end, and the lower end of the substrate holder may protrude from the first end side to the outside of the region.

[0088] According to the plating apparatus of Supplementary Note 4, when the first fluctuation comparison value exceeds the first threshold value, the lower end of the substrate holder is deemed to be protruding from the region. This allows the plating apparatus to reliably determine that the lower end of the substrate holder has protruded from the region vertically extending from the opening of the processing tank. Then, when there is a risk that the lower end has protruded from the region, the plating apparatus determines that the test acceleration is an inappropriate value. .

[0089] (Appendix 5) According to the plating apparatus of Appendix 5, in the plating apparatus described in Appendix 4, the control device sets the number of pixels from the reference mark in the transport direction to the first end in the first reference image as the first threshold value, and sets the number of pixels from the reference mark in the transport direction to the lower end of the substrate holder in each still image constituting the first comparison image as the first variation comparison value.

[0090] (Appendix 6) According to the plating apparatus of Supplementary Note 6, in the plating apparatus described in Supplementary Note 4 or 5, the imaging device has a second camera for imaging the lower end, the second end, and the reference mark of the substrate holder, and a control device controls the second camera, and when the transport device is located at the determination position, a center of the second camera is located directly above the opening, and the test includes the steps of: the control device causes the second camera to capture a second reference image at the determination position so that the second end and the reference mark are captured in the second camera; and the control device determines a relationship between the reference mark and the second end in the transport direction based on the second reference image. the control device causes the second camera to capture a second comparison image after the transport device is stopped so that the reference mark and the bottom end of the substrate holder are captured; the control device sequentially determines a second variation comparison value from the length between the reference mark and the bottom end of the substrate holder in the transport direction based on the second comparison image; and the control device compares the second threshold value with the second variation comparison value, and when the second variation comparison value exceeds the second threshold, determines that the bottom end of the substrate holder protrudes outside the region.

[0091] When the second variation comparison value is equal to or less than the second threshold, the length in the transport direction from the reference mark to the lower end of the substrate holder is equal to or less than the length in the transport direction from the reference mark to the second end. In other words, when the second variation comparison value is equal to or less than the second threshold, the lower end of the substrate holder certainly does not protrude from the second end side to the outside of the region. On the other hand, when the second variation comparison value exceeds the second threshold, the length in the transport direction from the reference mark to the lower end of the substrate holder may exceed the length in the transport direction from the reference mark to the second end, and the lower end of the substrate holder may protrude from the first end side to the outside of the region.

[0092] According to the plating apparatus of Supplementary Note 6, when the second fluctuation comparison value exceeds the second threshold value, the lower end of the substrate holder is deemed to be protruding from the region. This allows the plating apparatus to reliably determine that the lower end of the substrate holder has protruded from the region vertically extending from the opening of the processing tank. Then, when there is a risk that the lower end has protruded from the region, the plating apparatus determines that the test acceleration is an inappropriate value.

[0093] (Appendix 7) According to the plating apparatus of Appendix 7, in the plating apparatus described in Appendix 6, the control device sets the number of pixels from the reference mark in the transport direction to the second end in the second reference image as the second threshold value, and sets the number of pixels from the reference mark in the transport direction to the lower end of the substrate holder in each still image constituting the second comparison image as the second variation comparison value.

[0094] (Appendix 8) According to the plating apparatus of Supplementary Note 8, in the plating apparatus of Supplementary Note 6 or 7, the plating apparatus can be set to a second mode during normal operation, and in the second mode In the method, the control device moves the transport device from a reference position to the determination position so that the transport device holding the substrate holder stops at the determination position, and after the transport device stops, causes the first camera to capture a third comparison image so that the reference mark and the lower end of the substrate holder are captured, and causes the second camera to capture a fourth comparison image so that the reference mark and the lower end of the substrate holder are captured, sequentially determines a third variation comparison value from the length between the reference mark and the lower end of the substrate holder in the transport direction based on the third comparison image, sequentially determines a fourth variation comparison value from the length between the reference mark and the lower end of the substrate holder in the transport direction based on the fourth comparison image, and stops the transport device when the third variation comparison value exceeds the first threshold value or when the fourth variation comparison value exceeds the second threshold value.

[0095] When the third variation comparison value exceeds the first threshold, there is a possibility that the bottom end of the substrate holder protrudes from the first end side to the outside of the region, and when the fourth variation comparison value exceeds the second threshold, there is a possibility that the bottom end of the substrate holder protrudes from the second end side to the outside of the region.

[0096] According to the plating apparatus of Appendix 8, when the third fluctuation comparison value exceeds the first threshold value or when the fourth fluctuation comparison value exceeds the second threshold value, the transport device stops. As a result, in this plating apparatus, after the transport device transports the substrate holder in the transport direction, the substrate holder is not transported in the vertical direction. In other words, this plating apparatus can prevent the substrate holder from coming into contact with the processing tank during normal operation.

[0097] (Appendix 9) According to the plating apparatus of Appendix 9, in the plating apparatus described in any one of Appendixes 1 to 8, the reference positions include a load / unload station, a stocker, a pre-wet module, a pre-soak module, a first rinse module, a second rinse module, a blow module, and a position directly above the plating tank.

[0098] (Appendix 10) According to the plating apparatus of Appendix 10, in the plating apparatus described in any one of Appendixes 1 to 9, the judgment positions include a load / unload station, a stocker, a pre-wet module, a pre-soak module, a first rinse module, a second rinse module, a blow module, and a position directly above the plating tank.

[0099] (Appendix 11) According to the plating apparatus of Appendix 11, in the plating apparatus described in any one of Appendixes 1 to 10, in a third mode, when the substrate holder is able to enter the interior of the processing tank through the opening, the control device causes the imaging device to capture a first reference still image which is an image of the opening of the processing tank, and before the transport device transports the substrate holder into the interior of the processing tank, causes the imaging device to capture a first comparison still image which is an image of the opening of the processing tank from the position where the first reference still image was captured, compares the first reference still image with the first comparison still image, and stops the transport device when the matching rate between the first reference still image and the first comparison still image becomes equal to or less than a predetermined value.

[0100] When the matching rate between the first reference still image and the first comparative still image is low, a foreign object such as a lid may be placed on the opening of the processing tank. In such a case, when the transport device attempts to place the substrate holder in the processing tank, the substrate holder comes into contact with the foreign object, which may result in damage to the substrate holder.

[0101] In contrast, according to the plating apparatus of Supplementary Note 11, when the matching rate between the first reference still image and the first comparative still image becomes equal to or less than a predetermined value, the conveying device is stopped. The plating apparatus can prevent contact between the substrate holder and foreign matter.

[0102] (Appendix 12) According to the plating apparatus of Appendix 12, in the plating apparatus described in any one of Appendixes 1 to 11, in a fourth mode, when the substrate holder is stored in a stocker, the control device causes the imaging device to capture a second reference still image which is an image of the stocker, causes the imaging device to capture a second comparison still image which is an image of the stocker from the position where the second reference still image was captured, determines that the substrate holder is stored in a stocker when a matching rate between the second reference still image and the second comparison still image is equal to or greater than a predetermined value, determines that the substrate holder is not stored in a stocker when the matching rate between the second reference still image and the second comparison still image is less than a predetermined value, and outputs or stores inventory information of the substrate holder in the stocker.

[0103] The plating apparatus according to claim 12 can output or store information on the presence of substrate holders in the stocker.

[0104] (Appendix 13) A control method for a plating apparatus according to Addendum 13 includes the steps of: when a transport device is located at a determination position directly above a treatment tank, causing an imaging device to capture a reference image so that an opening of the treatment tank and a reference mark are captured in the imaging device; moving the transport device from the reference position to a determination position so that the transport device holding a substrate holder decelerates at a test acceleration and stops at the determination position; after the transport device has stopped, causing the imaging device to capture a comparison image so that the reference mark and a lower end of the substrate holder are captured in the imaging device; and based on the reference image and the comparison image, determining whether the lower end of the substrate holder protrudes outside a region extended vertically from the opening after the transport device has stopped, and determining that the test acceleration is an inappropriate value if the lower end protrudes outside the region.

[0105] The plating apparatus control method according to Supplementary Note 13 can achieve the same effects as the plating apparatus according to Supplementary Note 1. That is, this plating apparatus control method can determine an inappropriate acceleration during deceleration that may cause contact between the substrate holder and the processing tank.

[0106] (Appendix 14) The non-volatile storage medium according to Supplementary Note 14 is a non-volatile storage medium storing a program for causing a computer to execute a method for controlling a plating apparatus, the program storing therein causing a computer to execute the following: when a transport device is located at a determination position directly above a treatment tank, causing an imaging device to capture a reference image so that an opening of the treatment tank and a reference mark are captured in the imaging device; when a transport device is located at a determination position directly above the treatment tank, the transport device is moved from the reference position to a determination position so that the transport device holding a substrate holder decelerates at a test acceleration and stops at the determination position; when the transport device is stopped, causing the imaging device to capture a comparison image so that the reference mark and a lower end of the substrate holder are captured in the imaging device; and when the transport device is stopped, based on the reference image and the comparison image, determining whether the lower end of the substrate holder protrudes outside of an area vertically extending from the opening, and when the lower end protrudes outside of the area, determining that the test acceleration is an inappropriate value.

[0107] The non-volatile storage medium storing the program according to Supplementary Note 14 can achieve the same effects as the plating apparatus according to Supplementary Note 1. That is, by executing the program stored in the non-volatile storage medium, it is possible to determine an inappropriate acceleration during deceleration that may cause contact between the substrate holder and the processing tank. [Explanation of symbols]

[0108] 100: Plating equipment 120: Control device 126:Storage medium 200: Substrate holder 202: Bottom end 300: Transport device 310: Imaging device 312: First camera 314: Second Camera 400: Treatment tank 402: Standard mark 410:Aperture 412: First end 414:Second end 416: Region

Claims

1. In the plating apparatus, a transport device for transporting a substrate holder in a vertical direction and a transport direction perpendicular to the vertical direction, the transport device having an imaging device; a processing tank having an opening for inserting the substrate holder; A reference mark; a control device for controlling the conveying device and the imaging device, In a first mode, the controller is configured to perform a test at a test acceleration; The test includes: the control device causes the imaging device to capture a reference image so that the opening and the reference mark are captured when the transport device is located at a determination position directly above the treatment tank; the control device moves the transport device holding the substrate holder from a reference position to the determination position such that the transport device decelerates at the test acceleration and stops at the determination position; the control device causes the imaging device to capture a comparison image after the transport device is stopped, so that the reference mark and a lower end of the substrate holder are captured by the imaging device; the control device determines whether the lower end of the substrate holder protrudes outside a region obtained by extending the opening in the vertical direction after the transport device is stopped based on the reference image and the comparison image, and determines that the test acceleration is an inappropriate value when the lower end protrudes outside the region; Contains, Plating equipment.

2. 2. The plating apparatus according to claim 1, The test acceleration is constant from the start of deceleration to the end. Plating equipment.

3. 3. The plating apparatus according to claim 2, the controller is configured to perform the test at a plurality of the test accelerations; The control device repeatedly performs the test at the test accelerations in descending order of magnitude until a test acceleration that is not determined to be an inappropriate value is found; The control device outputs or stores the test acceleration that is not determined to be an inappropriate value that is found first as a result of the repetition as a maximum allowable acceleration. Plating equipment.

4. 4. The plating apparatus according to claim 1, the opening has a first end extending on a first straight line perpendicular to the transport direction and the vertical direction, and a second end extending on a second straight line parallel to the first straight line, the imaging device has a first camera for imaging the bottom end, the first end, and the reference mark of the substrate holder; The control device controls the first camera, the reference mark is located between the first straight line and the second straight line in the transport direction, When the transport device is located at the determination position, the center of the first camera is located directly above the opening, The test includes: The control device controls the first camera to detect the first end and the base at the determination position. capturing a first reference image so that the quasi-marker is captured; The control device determines a first threshold value from a length between the reference mark and the first end in the conveying direction based on the first reference image; the control device causes the first camera to capture a first comparison image after the transport device is stopped, so that the reference mark and the lower end of the substrate holder are captured in the first comparison image; the control device sequentially determines a first variation comparison value from a length between the reference mark and the lower end of the substrate holder in the transport direction based on the first comparison image; the control device compares the first threshold value with the first fluctuation comparison value, and when the first fluctuation comparison value exceeds the first threshold value, determines that the lower end of the substrate holder protrudes outside the region; Contains, Plating equipment.

5. 5. The plating apparatus according to claim 4, The control device includes: the number of pixels from the reference mark to the first end in the conveying direction in the first reference image is set as the first threshold value; The number of pixels from the reference mark in the transport direction to the lower end of the substrate holder in each still image constituting the first comparison image is set as the first fluctuation comparison value. Plating equipment.

6. 6. The plating apparatus according to claim 4, the imaging device has a second camera for imaging the bottom end, the second end, and the reference mark of the substrate holder; A control device controls the second camera. When the transport device is located at the determination position, the center of the second camera is located directly above the opening, The test includes: the control device causes the second camera to capture a second reference image at the determination position so that the second end and the reference mark are captured in the second reference image; The control device determines a second threshold value from a length between the reference mark and the second end in the conveying direction based on the second reference image; and the control device causes the second camera to capture a second comparison image after the transport device is stopped, so that the reference mark and the lower end of the substrate holder are captured in the second comparison image; the control device sequentially determines a second variation comparison value from a length between the reference mark and the lower end of the substrate holder in the transport direction based on the second comparison image; the control device compares the second threshold value with the second fluctuation comparison value, and when the second fluctuation comparison value exceeds the second threshold value, determines that the lower end of the substrate holder protrudes outside the region; Contains, Plating equipment.

7. 7. The plating apparatus according to claim 6, The control device includes: the number of pixels from the reference mark to the second end in the transport direction in the second reference image is set as the second threshold value; The number of pixels from the reference mark in the transport direction to the lower end of the substrate holder in each still image constituting the second comparison image is set as the second fluctuation comparison value. Plating equipment.

8. 8. The plating apparatus according to claim 6, The plating apparatus is capable of being set in a second mode during normal operation; In the second mode, the control device moving the transport device from a reference position to the determination position so that the transport device gripping the substrate holder stops at the determination position; After the transport device is stopped, a third comparison image is captured by the first camera so that the reference mark and the lower end of the substrate holder are captured, and a fourth comparison image is captured by the second camera so that the reference mark and the lower end of the substrate holder are captured, sequentially determining a third variation comparison value from a length between the reference mark and the lower end of the substrate holder in the transport direction based on the third comparison image; sequentially determining a fourth variation comparison value from a length between the reference mark and the lower end of the substrate holder in the transport direction based on the fourth comparison image; stopping the conveying device when the third fluctuation comparison value exceeds the first threshold value or when the fourth fluctuation comparison value exceeds the second threshold value. Plating equipment.

9. 9. The plating apparatus according to claim 1, The reference positions include positions directly above a load / unload station, a stocker, a pre-wet module, a pre-soak module, a first rinse module, a second rinse module, a blow module, and a plating tank. Plating equipment.

10. 10. The plating apparatus according to claim 1, The judgment positions include a load / unload station, a stocker, a pre-wet module, a pre-soak module, a first rinse module, a second rinse module, a blow module, and a position directly above a plating tank. Plating equipment.

11. 11. The plating apparatus according to claim 1, In a third mode, the control device when the substrate holder can enter the processing tank through the opening, the imaging device is caused to capture a first reference still image which is an image of the opening of the processing tank; before the transport device transports the substrate holder into the interior of the processing tank, the imaging device is caused to capture a first comparative still image, which is an image of the opening of the processing tank, from a position where the first reference still image is captured; comparing the first reference still image with the first comparison still image, and stopping the conveying device when a matching rate between the first reference still image and the first comparison still image becomes equal to or less than a predetermined value; Plating equipment.

12. 12. The plating apparatus according to claim 1, In a fourth mode, the control device When the substrate holder is stored in a stocker, the imaging device is caused to capture a second reference still image which is an image of the stocker; causing the imaging device to capture a second comparison still image, which is an image of the stocker, from the position where the second reference still image was captured; When a matching rate between the second reference still image and the second comparison still image is equal to or greater than a predetermined value, it is determined that the substrate holder is stored in a stocker. determining that the substrate holder is not stored in a stocker when the matching rate with a second comparative still image falls below a predetermined value, and outputting or storing information on the presence of the substrate holder in the stocker; Plating equipment.

13. A method for controlling a plating apparatus, comprising the steps of: When the transport device is located at a determination position directly above the treatment tank, an image capturing device captures a reference image so that an opening of the treatment tank and a reference mark are captured; moving the transport device holding the substrate holder from a reference position to the determination position so that the transport device is decelerated at a test acceleration and stops at the determination position; After the transport device is stopped, a comparison image is captured by the imaging device so that the reference mark and a lower end of the substrate holder are captured in the comparison image; determining whether the lower end of the substrate holder protrudes outside a region obtained by vertically extending the opening after the transport device is stopped based on the reference image and the comparison image, and determining that the test acceleration is an inappropriate value when the lower end protrudes outside the region. A method for controlling a plating apparatus.

14. A non-volatile storage medium storing a program for causing a computer to execute a method for controlling a plating apparatus, When the transport device is located at a determination position directly above the treatment tank, an image capturing device captures a reference image so that an opening of the treatment tank and a reference mark are captured in the image capturing device; moving the transport device holding the substrate holder from a reference position to the determination position so that the transport device is decelerated at a test acceleration and stopped at the determination position; After the transport device is stopped, a comparison image is captured by the imaging device so that the reference mark and a lower end portion of the substrate holder are captured in the imaging device. determining whether the lower end of the substrate holder protrudes outside a region obtained by vertically extending the opening after the transport device is stopped based on the reference image and the comparison image, and determining that the test acceleration is an inappropriate value when the lower end protrudes outside the region; A non-volatile storage medium that stores a program for causing a computer to execute the above.

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