SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

Abstract

To prevent the contamination of a substrate caused by deformation of a brush.SOLUTION: A control unit causes a brush 27 to abut against the outer peripheral edge abutment position on the outer peripheral edge of a substrate W by the first operation. Therefore, the brush 27 abuts against a position on the substrate W having a faster circumferential speed than an axis P1. At this time, a brush body 27b deforms and releases dust, but the dust is discharged toward the outer periphery of the substrate W due to the fast circumferential speed, and the substrate W can be prevented from being contaminated by dust. The control unit causes the brush 27 to move from the outer peripheral edge abutment position toward the axis P1 by the second operation. The control unit causes the brush 27 to move from the axis P1 of the substrate W to the outer peripheral edge by the third operation. Therefore, the substrate W can be cleaned with the clean brush 27 from which the dust has been released. As a result, the substrate W can be prevented from being contaminated by the deformation of the brush 27.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present invention relates to a substrate processing method and a substrate processing apparatus which perform a cleaning process by bringing a brush into contact with substrates such as semiconductor substrates, substrates for FPDs (Flat Panel Displays) such as liquid crystal displays and organic EL (Electroluminescence) display devices, glass substrates for photomasks, and substrates for optical disks. [Background technology]

[0002] Conventionally, this type of device includes a chuck, a brush, and an arm (see, for example, Patent Document 1). The chuck abuts and supports the outer periphery of the substrate. The chuck holds the substrate with the back surface facing upward. The chuck holds the substrate and is rotated around a vertical axis. The brush is attached to the tip of the arm. The brush is rotated around the vertical axis.

[0003] The arm brings the brush into contact with the center of rotation of the substrate, the surface of which has been supplied with cleaning liquid, and moves the brush to the outer periphery. The arm then raises the brush and moves it back to the center of rotation of the substrate, before bringing the brush into contact with the center of rotation of the substrate and moving it to the outer periphery. This scanning operation is repeated a predetermined number of times. In this way, the entire back surface of the substrate is cleaned with the brush. The reason for moving the brush from the center of the substrate to the outer periphery is also to sweep away any dirt on the substrate toward the periphery. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2017-147334 A Summary of the Invention [Problem to be solved by the invention]

[0005] However, the conventional example having such a configuration has the following problems. That is, in the conventional device, the back surface of the substrate is cleaned by the dust that was attached to the back surface of the substrate being taken in or attached to the brush. The dust that was taken in or attached to the brush is removed to some extent by cleaning the brush in the waiting pot, but cannot be completely removed. Therefore, even if the brush has been cleaned in the waiting pot, it may not be possible to clean the next time another substrate is cleaned.

[0006] In other words, the brush is pushed in and deformed when it comes into contact with the substrate. Therefore, when the brush comes into contact with the center of rotation of the substrate, it deforms, and dirt remaining on the brush is released. The center of rotation of the substrate has an extremely slow peripheral speed compared to the outer periphery. Therefore, the dirt released from the brush is difficult to be discharged from the outer periphery to the surrounding area together with the processing liquid. As a result, there is a risk that the back surface of the substrate will be contaminated by the brush.

[0007] The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a contaminated substrate processing method and a substrate processing apparatus that can prevent contamination of a substrate caused by deformation of a brush. [Means for solving the problem]

[0008] In order to achieve the above object, the present invention has the following configuration. That is, the invention described in claim 1 is a substrate processing method for cleaning a substrate by contacting a brush against the substrate, the method comprising: a rotation step of rotating a rotating holder holding the substrate about a vertical axis; an outer edge abutting step of contacting a brush with an outer edge abutment position on the outer edge side of the axis while the substrate is rotated in a horizontal plane; a first movement step of moving the brush from the outer edge abutment position toward the axis while the brush is in contact with the substrate; and after the first movement step, With the brush in contact with the substrate, and a second moving step of moving the brush from the axis side to the outer circumferential edge side.

[0009] [Function and Effect] According to the invention described in claim 1, in the rotating step, the substrate is rotated around a vertical axis, and in the outer edge abutting step, the brush is abutted against the outer edge abutting position of the rotating substrate. At that time, the brush is abutted against the outer edge side of the axis. Therefore, the brush abuts against a position on the substrate that has a faster peripheral speed than the axis. At this time, the brush deforms and releases dust, but the faster peripheral speed causes the dust to be discharged toward the outer periphery of the substrate, and the substrate can be prevented from being contaminated by dust. Thereafter, in the first moving step, the brush is moved from the outer edge abutting position toward the axis, and in the second moving step, the brush is moved from the axis side to the outer edge side. Therefore, the substrate can be cleaned with the clean brush from which the dust has been released. As a result, contamination of the substrate caused by deformation of the brush can be prevented.

[0010] In the present invention, it is preferable to carry out the first moving step and the second moving step a plurality of times (claim 2).

[0011] By moving the brush over the substrate multiple times, the substrate can be cleaned to a high degree of cleanliness.

[0012] In the present invention, it is preferable that the outer peripheral edge abutment position is the outer peripheral edge of the substrate (claim 3).

[0013] The outer periphery of the substrate has the fastest peripheral speed on the substrate, and therefore dust discharged from the brush can be efficiently discharged to the periphery.

[0014] The invention described in claim 4 is a substrate processing apparatus that performs a cleaning process by abutting a brush against a substrate, the apparatus comprising: a rotating holding unit that rotatably holds the substrate around a vertical axis; a brush that abuts against the substrate being rotated by the rotating holding unit to clean it; a brush holding unit that holds the brush; a horizontal drive unit that moves the brush holding unit in a horizontal direction; a lifting drive unit that moves the brush holding unit in a vertical direction; and a control unit that operates the horizontal drive unit and the lifting drive unit to perform, in that order, a first operation of abutting the brush against the substrate being rotated by the rotating holding unit at an outer edge abutment position on the outer edge side of the substrate relative to the axis; a second operation of moving the brush from the outer edge abutment position toward the axis while the brush is abutting the substrate; and a third operation of moving the brush from the axis side of the substrate to the outer edge side while the brush is abutting the substrate.

[0015] [Action and Effect] According to the invention described in claim 4, the control unit causes the brush to abut against the outer peripheral edge abutment position on the outer peripheral edge side of the substrate by the first operation. Therefore, the brush abuts against a position on the substrate where the circumferential speed is faster than the axis. At this time, the brush deforms and releases dust, but the dust is discharged toward the outer periphery of the substrate due to the circumferential speed, and the substrate can be prevented from being contaminated by dust. The control unit causes the brush to move from the outer peripheral edge abutment position toward the axis side by the second operation. The control unit causes the brush to move from the axis side of the substrate to the outer peripheral edge side by the third operation. Therefore, the substrate can be cleaned with the clean brush from which the dust has been released. As a result, contamination of the substrate caused by deformation of the brush can be prevented.

[0016] The invention described in claim 7 is a substrate processing method in which a brush is brought into contact with a substrate to perform a cleaning process, the method comprising the steps of: a rotation step of rotating a rotating holding part holding a substrate around a vertical axis; a deformation step of deforming the brush by pressing the cleaning surface of the brush against a pressed member before bringing the brush into contact with a cleaning start position of the substrate; a deformed brush abutment step of abutting the brush with the cleaning start position of the substrate while the substrate is rotating in a horizontal plane until the brush returns to its original shape; and a cleaning step of moving the brush over the substrate to clean the substrate, in that order.

[0017] [Function and Effect] According to the invention described in claim 7, in the rotation step, the substrate is rotated around a vertical axis, and in the deformation step, the brush is deformed. As a result, the brush is deformed and dust is released. Thereafter, in the deformed brush abutment step, the brush is abutted against the cleaning start position of the rotating substrate before the deformation of the brush returns to its original state. Therefore, the amount of deformation of the brush is small when the brush abuts against the cleaning start position. Therefore, even if dust is not released from the brush in the deformation step, the release of dust from the brush is suppressed in the deformed brush abutment step. Then, in the cleaning step, the brush is moved over the substrate to clean the substrate. As a result, contamination of the substrate caused by the deformation of the brush can be prevented.

[0018] In the present invention, it is preferable that the deformation step presses the brush against the pressed member with a pressing pressure equal to or greater than a pressing pressure during processing at which the brush is pressed against the substrate in the cleaning step (claim 8).

[0019] Since the brush is pressed against the pressed member with a pressure equal to or greater than the pressure during processing in the cleaning process, the amount of deformation of the brush can be the same as that during processing of the substrate. Therefore, the dust discharged in the deformed brush abutment process can be discharged before the brush is abutted against the substrate and a pressing force is applied. Furthermore, by pressing the brush against the pressed member with a pressure equal to or greater than the pressure during processing in the cleaning process, the brush can be significantly deformed. Therefore, the time until the brush returns to its original shape can be extended. Therefore, it is possible to reliably prevent the brush from being deformed to its original shape at the time when the brush abuts against the substrate in the deformed brush abutment process. As a result, it is possible to reliably prevent dust from being discharged from the brush in the deformed brush abutment process.

[0020] The invention described in claim 9 is a substrate processing apparatus that performs a cleaning process by contacting a brush against a substrate, the apparatus comprising: a rotating holding unit that holds the substrate rotatably around a vertical axis; a brush that contacts the substrate being rotated by the rotating holding unit to clean the substrate; a waiting pot that is provided outside the outer periphery of the substrate held by the rotating holding unit and for waiting the brush; a pressed member against which the cleaning surface of the brush is pressed; a brush holding unit that holds the brush; a horizontal drive unit that moves the brush holding unit in a horizontal direction; a lifting drive unit that moves the brush holding unit in a vertical direction; and a control unit that operates the horizontal drive unit and the lifting drive unit so that the brush is deformed by pressing the cleaning surface of the brush against the pressed member before the brush is brought into contact with a cleaning start position of the substrate, and then moves the brush to the cleaning start position of the substrate and cleans the substrate with the brush until the shape of the brush returns to its original state.

[0021] [Function and Effect] According to the invention described in claim 9, the control unit deforms the brush by pressing the cleaning surface of the brush against the pressed member before the brush is brought into contact with the cleaning start position of the substrate. After that, the control unit operates the horizontal drive unit and the lift drive unit to move the brush to the cleaning start position of the substrate and clean the substrate with the brush until the brush returns to its original shape. Therefore, since the amount of deformation of the brush when it comes into contact is small, even if there is dust that is not released from the brush by pressing the brush against the pressed member, the release of dust from the brush at the cleaning start position is suppressed. After that, the brush is moved over the substrate to clean the substrate. As a result, contamination of the substrate caused by the deformation of the brush can be prevented. Effect of the Invention

[0022] According to the substrate processing method of the present invention, the substrate is rotated around a vertical axis in the rotation step, and the brush is abutted against the abutment position of the rotating substrate in the outer periphery abutment step. At that time, the brush is abutted on the outer periphery side of the axis. Therefore, the brush abuts against a position on the substrate that has a faster peripheral speed than the axis. At this time, the brush deforms and releases dust, but the dust is discharged toward the outer periphery of the substrate due to the peripheral speed, and the substrate can be prevented from being contaminated by dust. Thereafter, the brush is moved from the abutment position to the axis side in the first movement step, and the brush is moved from the axis side to the outer periphery side in the second movement step. Therefore, the substrate can be cleaned with the clean brush from which the dust has been released. As a result, contamination of the substrate caused by the deformation of the brush can be prevented. [Brief description of the drawings]

[0023] [Figure 1] 1 is a diagram showing an overall configuration of a substrate processing apparatus according to a first embodiment. [Diagram 2] 11 is a graph comparing the degree of cleanliness after cleaning treatment in the conventional example. [Diagram 3] 1A and 1B are diagrams for explaining deformation of a brush in a conventional example, in which (a) shows the initial state, (b) shows the state at the first scan, (c) shows the state immediately before the second scan, and (d) shows the state at the second scan. [Figure 4] 1A and 1B are diagrams illustrating deformation of the brush in Example 1, where (a) shows the initial state and (b) shows the state at the first scan. [Diagram 5] 4(a) to 4(d) are diagrams illustrating the cleaning treatment in the first embodiment. [Figure 6] 1 is a graph comparing the cleanliness of Example 1 and the conventional example. [Figure 7] FIG. 11 is a diagram showing an overall configuration of a substrate processing apparatus according to a second embodiment. [Figure 8] 11A and 11B are diagrams illustrating deformation of the brush in Example 2. (a) shows the initial state, (b) shows the state immediately before the first scan, (c) shows the state at the first scan (second scan), and (d) shows the state immediately before the second scan. [Figure 9] 6(a) to 6(d) are diagrams illustrating the cleaning treatment in Example 2. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0024] An embodiment of the present invention will now be described. EXAMPLES

[0025] A first embodiment of the present invention will be described below with reference to the drawings. Fig. 1 is a diagram showing an overall configuration of a substrate processing apparatus according to the first embodiment.

[0026] The substrate processing apparatus 1 is an apparatus for processing substrates W. The substrate processing apparatus 1 is a so-called single-wafer type apparatus that processes substrates one by one. The substrate W has, for example, a circular shape in a plan view. The substrate processing apparatus 1 performs processing, for example, on the rear surface of the substrate W facing upward. For example, the processing may be a cleaning process for removing contaminants such as particles adhering to the substrate W.

[0027] <1. Overall composition>

[0028] The substrate processing apparatus 1 includes a base unit 3, a chuck unit 5, a guard 7, a brush cleaning unit 9, a nozzle 11, and a control unit 13.

[0029] <2. Base unit>

[0030] The base unit 3 includes a chuck unit 5. The base unit 3 rotates the chuck unit 5. The chuck unit 5 rotates the substrate W within a horizontal plane while holding the substrate W in a horizontal position.

[0031] The base unit 3 includes an electric motor 15. The electric motor 15 includes a rotating shaft 17. The rotating shaft 17 extends in the vertical direction. The rotating shaft 17 is rotated by the electric motor 15 around an axis P1 in the vertical direction. The chuck unit 5 is attached to the upper end of the rotating shaft 17.

[0032] <3.Chuck unit>

[0033] The chuck unit 5 has a circular shape in a plan view. The chuck unit 5 includes a plate 5a and a plurality of support pins 5b. The plate 5a has a diameter slightly larger than the diameter of the substrate W. The plurality of support pins 5b are erected on the upper surface of the outer periphery side of the plate 5a. The plurality of support pins 5b abut and support the outer periphery of the substrate W with the lower surface of the substrate W spaced from the upper surface of the plate 5a.

[0034] The above-mentioned chuck unit 5 corresponds to the "rotation holding portion" in the present invention.

[0035] <4. Guard>

[0036] The guard 7 is disposed on the side of the electric motor 15. The guard 7 surrounds the side of the electric motor 15. The guard 7 prevents the processing liquid supplied from the nozzle 11 to the substrate W from splashing around during cleaning processing by the brush cleaning unit 9. The guard 7 is raised and lowered between a processing height indicated by a solid line in FIG. 1 and a transfer height indicated by a two-dot chain line in FIG. 1 (two-dot chain line in FIG. 1). The transfer height is located below the processing height. At the processing height, the guard 7 guides downward the processing liquid that has splashed around from the outer periphery of the substrate W.

[0037] <5. Brush cleaning unit>

[0038] The brush cleaning unit 9 includes a rotary lift mechanism 19, an arm 21, and a brush head 23. The rotary lift mechanism 19 drives the arm 21 to move up and down in the vertical direction. The rotary lift mechanism 19 drives the arm 21 to rotate around a vertical axis P2. The rotary lift mechanism 19 includes, for example, a rotation mechanism made of an electric motor with a vertical rotation shaft, and a lift mechanism that moves the electric motor up and down in the vertical direction. The arm 21 has a base end connected to the rotary lift mechanism 19. The arm 21 has a brush head 23 attached to its tip end. The brush head 23 is driven to swing in a horizontal plane by the rotary lift mechanism 19.

[0039] In addition, instead of the rotary lifting mechanism 19, a linear movement lifting mechanism may be used that uses a horizontally arranged ball screw or the like to simultaneously move the base end and tip end of the arm 21 linearly in the horizontal direction.

[0040] The brush head 23 includes a head body 25 and a brush 27. The head body 25 is attached to the tip of the arm 21. The head body 25 incorporates an electric motor 29. The electric motor 29 includes a rotating shaft 29a. The rotating shaft 29a extends in the vertical direction. The electric motor 29 drives the rotating shaft 29a to rotate around a vertical axis P3. The electric motor 29 rotates the brush 27 around the axis P3. The brush 27 is disposed at the bottom of the head body 25. The brush 27 is attached to the lower end of the rotating shaft 29. The brush 27 is rotated around the axis P3 by the electric motor 29. The brush 27 is detachable from the rotating shaft 29a.

[0041] The brush 27 includes a bracket 27a and a brush body 27b. The brush 27 is detachably attached to the rotating shaft 29a by the bracket 27a. The brush body 27b is made of, for example, a synthetic resin. Specifically, the brush body 27b is made of PVA (polyvinyl alcohol). PVA is highly hydrophilic and has fine pores circulating vertically and horizontally. Therefore, the brush body 27b exhibits high water absorption and water retention due to the occurrence of capillary action. In addition, the brush body 27b takes in moisture together with dirt and firmly retains it. Furthermore, PVA has flexibility and elasticity. Therefore, the brush body 27b does not damage the substrate W that is the target of the cleaning process.

[0042] The rotary lifting mechanism 19 moves the brush 27 between a contact position and a separated position. The contact position is a position where the brush 27 acts on the upper surface of the substrate W. The contact position includes a height position where the lower surface of the brush body 27b directly contacts the upper surface of the substrate W, and a height position where the lower surface of the brush body 27b indirectly acts on the upper surface of the substrate W with the processing liquid interposed therebetween. The separated position is a position where the brush 27 is away from the outer periphery of the substrate W. The separated position is a position where the brush 27 does not act on the substrate W.

[0043] The above-mentioned brush head 23 corresponds to the "brush holding portion" in the present invention, and the above-mentioned rotating and lifting mechanism 19 corresponds to the "horizontal driving portion" and the "lifting driving portion" in the present invention.

[0044] The brush head 23 moves the brush body 27b downward from a state in which the lower surface of the brush body 27b is in contact with the upper surface of the substrate W. At this time, the pressing force of the brush body 27b pressed against the substrate W is determined by the pressing pressure and the pressing amount detected by the brush head 23. This pressing force is the pressing pressure during processing when the substrate W is subjected to a cleaning process.

[0045] A standby pot 31 is disposed on the side of the base unit 3. The standby pot 31 is disposed on the side of the guard 7. The standby pot 31 is disposed on the side of the rotation lifting mechanism 19. The standby pot 31 keeps the brush 27 on standby. The standby pot 31 is capable of housing the brush 27 therein. The standby pot 31 removes dirt such as particles adhering to the brush 27. The standby pot 31 has the function of spraying a cleaning liquid onto the brush 27 to clean the brush 27 and make the brush 27 clean. The position of the standby pot 31 is the separated position described above.

[0046] The nozzle 11 supplies the processing liquid to the upper surface of the substrate W while the substrate W is rotating around the axis P1. The nozzle 11 supplies the processing liquid to the substrate W beyond the upper edge of the guard 7. The nozzle 11 in this embodiment is not movable. That is, the position of the nozzle 11 in this embodiment is fixed. However, the nozzle 11 may be movable so that it moves to the position shown in FIG. 1 only during processing. The processing liquid supplied from the nozzle 11 may be, for example, pure water or a chemical solution. The chemical solution may be, for example, a chemical solution containing at least one of sulfuric acid, nitric acid, acetic acid, hydrochloric acid, hydrofluoric acid, ammonia water, and hydrogen peroxide water. A more specific example of the chemical solution may be SC-1, which is a mixture of ammonia water and hydrogen peroxide water.

[0047] <6. Control unit>

[0048] The control unit 13 controls the above-mentioned units in an integrated manner and includes a CPU and a memory.

[0049] The control unit 13 controls the raising and lowering operation of the guard 7, the supplying operation of the treatment liquid from the nozzle 11, the rotation operation of the electric motor 15, the rotation and raising and lowering operation of the rotary lifting mechanism 19, the rotation operation of the electric motor 29, and the pushing operation of the brush 27 by the brush head 23.

[0050] The control unit 13 mainly operates the rotary lift mechanism 19 to perform the following first, second, and third operations. The control unit 13 causes the rotary lift mechanism 19 to perform the first, second, and third operations in that order.

[0051] <First Action> The control unit 13 operates the electric motor 15 to rotate the substrate W at a processing speed. The control unit 13 operates the nozzle 11 to supply the processing liquid to the vicinity of the axis P1 on the upper surface of the substrate W. The control unit 13 rotates the brush 27 and causes the brush 27 to abut against an outer periphery abutment position that is closer to the outer periphery of the substrate W than the axis P1. Specifically, the outer periphery abutment position is preferably the outer periphery that is the outermost periphery of the substrate W. Note that the outer periphery is the outermost position in the radial direction of the substrate W where the entire cleaning surface of the brush body 27b of the brush 27 abuts against the substrate W when the brush body 27b of the brush 27 is abutted against the substrate W.

[0052] <Second Action> The control unit 13 operates the rotary lifting mechanism 19 to move the brush 27 from the outer circumferential edge abutting position toward the axis P1 while the brush 27 is in contact with the upper surface of the substrate W. Specifically, the brush 27 is moved horizontally to a position where the axis P1 and the axis P3 substantially coincide with each other in a plan view.

[0053] <Third Action> With the brush 27 in contact with the upper surface of the substrate W, the control section 13 moves the brush 27 from the axis P1 side to the above-mentioned contact position.

[0054] <7. Mechanism of decrease in cleanliness>

[0055] Here, reference is made to Figs. 2 and 3. Fig. 2 is a graph comparing the degree of cleanliness after cleaning processing in the conventional example. Fig. 3 is a diagram explaining the deformation of the brush in the conventional example. In Fig. 3, (a) shows the initial state, (b) shows the state at the first scan, (c) shows the state immediately before the second scan, and (d) shows the state at the second scan. Note that Fig. 2 shows data from three samples after each scan.

[0056] In the conventional example, the brush 27 is moved by operating the rotary lift mechanism 19 as follows. That is, the control unit 13 brings the brush 27 into contact with the upper surface of the substrate W at the axis P1, and moves the brush 27 horizontally to the outer periphery of the substrate W while pressing the brush 27 against the substrate W with the pressing force during processing. Here, the operation from the axis P1 to the outer periphery is referred to as one scan. The control unit 13 raises the brush 27 from the upper surface of the substrate W and performs the next scan. At this time, the cleanliness of the substrate W was measured after one scan, two scans, and four scans. The cleanliness was lowest after the first scan, and increased after the second scan and the fourth scan.

[0057] The reason for this result is considered as follows. That is, in the initial state before the brush 27 contacts the substrate W as shown in FIG. 3(a), the length of the brush body 27b in the vertical direction is L0. In the state in which the brush 27 contacts the substrate W at the axis P1 with the pressing pressure during processing (first scan), the length of the brush body 27b in the vertical direction is L1 as shown in FIG. 3(b). The length L1 is shorter than the length L0. Next, after the brush 27 moves to the outer periphery of the substrate, it is raised and in the state immediately before the brush 27 contacts the substrate W at the axis P1 with the pressing pressure during processing again (immediately before the second scan), the length of the brush body 27b in the vertical direction is L2 as shown in FIG. 3(c). The length L2 is shorter than the length L0 and longer than the length L1. In the state in which the brush 27 is subjected to the pressing pressure during processing at the axis P1 (second scan), the length of the brush body 27b in the vertical direction is L1 as shown in FIG. 3(d).

[0058] In this way, the brush body 27b expands and contracts in the vertical direction from L0 to L1, and L2 to L1. The vertical length of the brush body 27b contracts the most when the length changes from L0 to L1. Dust has been taken into the brush body 27b during the cleaning process of the previously processed substrate W, or has adhered to the surface of the brush body 27b. Therefore, when the brush body 27b contracts significantly, a certain amount of dust is discharged from the brush body 27b to the outside. The discharged dust is discharged to the outside of the substrate W together with the processing liquid by the centrifugal force of the substrate W, but the circumferential speed of the axis P1 is slow because it is the center of rotation. Therefore, dust is not easily discharged from the outer periphery of the substrate W to the surroundings. This phenomenon reduces the cleanliness after one scan.

[0059] Here, reference is made to Fig. 4. Fig. 4 is a diagram for explaining the deformation of the brush in Example 1. (a) shows the initial state, and (b) shows the state at the first scan.

[0060] In order to deal with the above-mentioned phenomenon, the control unit 13 performs the above-mentioned first operation, second operation, and third operation in that order. That is, as shown in FIG. 4(a), the brush 27 is disposed on the outer periphery side of the substrate W. Preferably, the brush 27 is disposed on the outer periphery of the substrate W. As shown in FIG. 4(b), when the brush 27 is brought into contact, the brush body 27b contracts the most and a certain amount of dust is discharged, but the peripheral speed on the outer periphery side is much faster than that on the axis P1 side. Therefore, the dust discharged from the brush body 27b is discharged from the outer periphery of the substrate W together with the processing liquid to the surroundings. Thereafter, the brush 27 is moved to the axis P1 side, and further, the brush 27 is moved from the axis P1 side to the outer periphery of the substrate W. By controlling the movement of the brush 27 in this manner, contamination of the substrate W caused by deformation of the brush 27 is prevented.

[0061] <8. Cleaning treatment>

[0062] The cleaning process will now be described with reference to Fig. 5. Figs. 5(a) to (d) are diagrams for explaining the cleaning process in Example 1. Note that in the cleaning process, a processing liquid is supplied from a nozzle 11, but is not shown in the figure.

[0063] The control unit 13 rotates the substrate W at a processing rotation speed. This step corresponds to the "rotation step" of the present invention. When the rotation speed of the substrate W reaches the processing rotation speed, the control unit 13 operates the rotary lift mechanism 19 to move the brush 27 to the outer periphery of the substrate W (FIG. 5(a)).

[0064] The control unit 13 operates the rotary lift mechanism 19 to bring the brush 27 into contact with the outer periphery of the substrate W. This process corresponds to the "outer periphery contact process" in the present invention. The outer periphery corresponds to the "outer periphery contact position" in the present invention. Furthermore, the control unit 13 operates the brush head 23 to apply a pressing pressure to the brush 27 during processing (FIG. 5(b)). At this time, the brush body 27b significantly contracts in the vertical direction. Naturally, a certain amount of dust is released from the brush body 27b at this time, but the high peripheral speed at the outer periphery causes the dust to be discharged from the outer periphery of the substrate W to the surroundings. Therefore, the substrate W is less likely to be contaminated by dust released from the brush 27.

[0065] The control unit 13 moves the brush 27 from the outer periphery of the substrate W toward the axis P1, which is the center of rotation of the substrate W (FIG. 5(c)). This constitutes one scan. This step corresponds to the "first moving step" in the present invention.

[0066] The control unit 13 moves the brush 27 from the axis P1 side toward the outer periphery of the substrate W (FIG. 5(d)). This is the second scan. This step corresponds to the "second moving step" in this invention.

[0067] The control unit 13 performs the cleaning process by repeating the scan multiple times as necessary. By moving the brush 27 in the horizontal direction multiple times, the substrate W can be cleaned to a high degree of cleanliness.

[0068] According to this embodiment, the control unit 13 causes the brush 27 to abut against the outer peripheral edge abutment position on the outer peripheral edge of the substrate W by the first operation. Therefore, the brush 27 abuts against the substrate W at a position where the circumferential speed is faster than the axis P1. At this time, the brush body 27b deforms and releases dust, but the dust is discharged toward the outer periphery of the substrate W due to the fast circumferential speed, and the substrate W can be prevented from being contaminated by dust. The control unit 13 causes the brush 27 to move from the outer peripheral edge abutment position toward the axis P1 by the second operation. The control unit 13 causes the brush 27 to move from the axis P1 of the substrate W to the outer peripheral edge by the third operation. Therefore, the substrate W can be cleaned with the clean brush 27 from which the dust has been released. As a result, the substrate W can be prevented from being contaminated by the deformation of the brush 27.

[0069] Here, the degree of cleanliness by the cleaning process in Example 1 and the conventional example will be compared as described above. Fig. 6 is a graph comparing the degree of cleanliness between Example 1 and the conventional example. Note that CE in Fig. 6 refers to the operation of moving brush 27 from axis P1 of substrate W to the outer periphery, and EC refers to the operation of moving brush 27 from the outer periphery of substrate W to axis P1.

[0070] The conventional example shows the degree of cleanliness after a cleaning process in which a scan from the axis P1 to the outer periphery was performed twice. Example 1 shows the degree of cleanliness after a cleaning process in which two scans were performed, one from the outer periphery to the axis P1 and the other from the axis P1 to the outer periphery.

[0071] As is clear from this graph, it is understood that the cleanliness level can be increased in Example 1 compared to the conventional example. Therefore, it is possible to improve the yield of devices manufactured using the substrate W. As a result, it is possible to reduce the number of discarded devices, thereby reducing the environmental load. EXAMPLES

[0072] Next, a second embodiment of the present invention will be described with reference to the drawings. FIG. 7 is a diagram showing an overall configuration of a substrate processing apparatus according to the second embodiment.

[0073] The same components as those in the first embodiment are denoted by the same reference numerals and detailed description thereof will be omitted.

[0074] A substrate processing apparatus 1A in the second embodiment is different from the substrate processing apparatus 1 in the first embodiment in the configuration of a waiting pot 31A.

[0075] The waiting pot 31A is equipped with a pressed member 41. The cleaning surface of the brush body 27b is pressed against the pressed member 41. The lower surface of the brush body 27b is pressed against the pressed member 41. It is preferable that the upper surface of the pressed member 41 is larger than the lower surface of the brush body 27b. The pressed member 41 is made of a material harder than the brush body 27b. The pressed member 41 is made of, for example, fluororesin.

[0076] The control unit 13 sprays the cleaning liquid onto the brush 27 accommodated in the standby pot 31A via a nozzle (not shown). Prior to starting the cleaning process on the substrate W, the control unit 13 presses the brush 27 against the pressed member 41. At this time, some of the dirt that was taken in or attached to the brush 27 when the previous substrate W was cleaned is discharged and washed away with the cleaning liquid. However, the brush 27 cannot be completely cleaned. Note that it is preferable for the control unit 13 to press the brush 27 against the pressed member 41 with a pressure equal to or greater than the pressing pressure during processing.

[0077] Since the brush body 27b is pressed against the pressed member 41 with a pressure equal to the pressure during the cleaning process, the brush body 27b can be deformed to the same extent as when the substrate W is processed. Therefore, dust that is released when the brush body 27b is brought into contact with the substrate W and a pressure is applied can be released in advance. In addition, the brush body 27b is pressed against the pressed member 41 with a pressure greater than the pressure during the cleaning process, so that the brush body 27b is largely deformed. Therefore, the time until the shape of the brush body 27b is restored can be extended. Therefore, the deformation of the brush body 27b can be reliably prevented from returning to its original state when the brush body 27b comes into contact with the substrate W. As a result, the release of dust from the brush body 27b can be reliably prevented when the brush body 27b comes into contact with the substrate W.

[0078] It is noted that the time required for brush body 27b to return to its original shape from the state in which it is pressed against pressed member 41 and deformed is about 5 seconds, for example. The time required for brush 27 to move from standby pot 31A to the cleaning start position on substrate W is about 3 seconds, for example. Therefore, brush body 27b can be brought into contact with substrate W before it returns to its original shape. It is noted that these times vary depending on the material of brush body 27b and the force with which it is pressed against pressed member 41.

[0079] The control unit 13, for example, moves the brush 27 in the same manner as in the conventional example. That is, the control unit 13 abuts the brush 27 at a cleaning start position corresponding to the position of the axis P1 on the substrate W, and moves the brush 27 horizontally to the outer periphery of the substrate W while applying a pressing pressure during processing. Thereafter, the control unit 13 raises the brush 27 and moves it above the axis P1, and then abuts the brush 27 again at a position corresponding to the position of the axis P1 on the substrate W, and moves the brush 27 horizontally to the outer periphery while applying a pressing pressure during processing.

[0080] However, before the control unit 13 brings the brush body 27b into contact with the cleaning start position on the substrate W, it presses the lower surface of the brush body 27b against the pressed member 41 to deform it (FIG. 8(a)). In the initial state, the length in the vertical direction of the brush body 27b before deformation is L0. The length in the vertical direction of the brush body 27b when deformed is L10. The length L10 is shorter than the length L0.

[0081] The control unit 13 moves the brush body 27b to a cleaning start position for the substrate W before the length of the deformed brush body 27b returns to the length L0 of the initial state before deformation due to its own elastic force. The cleaning start position here is, for example, a position on the substrate W corresponding to the axis P1. At this time, in a state immediately before the first scan in which the brush body 27b abuts against the substrate W, the vertical length of the brush body 27b is L11. This length L11 is shorter than the length L0 and longer than the length L10.

[0082] When performing the first scan, the control unit 13 applies a processing pressure to the brush 27 by the brush head 23. Therefore, the vertical length of the brush body 27b during the first scan is length L12, which is shorter than length L11. The control unit 13 moves the brush 27 to the outer periphery of the substrate W while applying the processing pressure.

[0083] When the first scan is completed, the control unit 13 raises the brush 27 and moves it above the axis P1 of the substrate W. Then, the control unit 13 performs the second scan. In the state immediately before the second scan, for example, the vertical length of the brush body 27b is L11. This length L11 varies depending on the re-contact time from when the brush body 27b is raised from the outer periphery of the substrate W to when it is again brought into contact with the cleaning start position. The longer this re-contact time is, the longer the vertical length of the brush body 27b becomes. Therefore, the control unit 13 moves the brush 27 within the time during which the vertical length of the brush body 27b does not reach the original length L0. In the state of the second scan, for example, the vertical length of the brush body 27b becomes, for example, length L12.

[0084] As described above, the control unit 13 causes the brush body 27b to contact the cleaning start position of the substrate W before the length of the brush body 27b returns to the initial state. Therefore, the release of dust caused by the deformation of the brush body 27b is suppressed. As a result, the contamination of the substrate W caused by the deformation of the brush 27 can be prevented.

[0085] <8A. Cleaning Treatment>

[0086] Here, the cleaning process will be described with reference to Fig. 9. Fig. 9(a) to (e) are diagrams for explaining the cleaning process in Example 2. Note that in the cleaning process, a processing liquid is supplied from a nozzle 11, but is not shown in the figure.

[0087] The control unit 13 rotates the substrate W at the processing rotation speed while the brush 27 is accommodated in the waiting pot 31A. This step corresponds to the "rotation step" in this invention.

[0088] In the standby position, the control unit 13 presses the brush 27 housed in the standby pot 31A against the pressed member 41 with the brush head 23 (FIG. 9(a)). This causes the length L0 of the brush body 27b in the initial state to be compressed to a length L10. This process corresponds to the "deformation process" in this invention.

[0089] The control unit 13 moves the brush body 27b above the cleaning start position on the substrate W until the deformation of the brush body 27b returns to its original shape (FIG. 9(b)). Then, the control unit 13 abuts the brush body 27b against the cleaning start position. Specifically, the brush body 27b abuts against the axis P1 of the substrate W. At this time, the vertical length of the brush body 27b becomes length L12, including the pressing pressure during processing (FIG. 9(c)). This process corresponds to the "deformed brush abutment process" in this invention.

[0090] The control unit 13 moves the brush 27 in the horizontal direction. Specifically, the control unit 13 moves the brush 27 to the outer periphery of the substrate W (FIG. 9(d)). This step corresponds to the "cleaning step" in this invention.

[0091] The control unit 13 raises the brush 27 and moves the brush 27 to the axis P1 of the substrate W. Then, the control unit 13 moves the brush 27 again from the axis P1 toward the outer periphery of the substrate W to clean the upper surface of the substrate W.

[0092] According to the second embodiment, the control unit 13 deforms the brush body 27b by pressing the brush body 27b against the pressed member 41 before the brush body 27b contacts the substrate W. Thereafter, the control unit 13 operates the rotation lift mechanism 19 to move the brush body 27b to a cleaning start position for the substrate W and clean the substrate W with the brush body 27b until the shape of the brush body 27b returns to the original shape. Therefore, since the amount of deformation of the brush body 27b at the time of contact is small, even if there is dust that is not released from the brush body 27b by pressing the brush body 27b against the pressed member 41, the release of dust from the brush body 27b at the cleaning start position on the substrate W is suppressed. Thereafter, the brush body 27b is moved on the substrate W to clean the substrate W. As a result, contamination of the substrate W caused by the deformation of the brush body 27b can be prevented.

[0093] Furthermore, in the present embodiment 2, the control of the movement of the brush 27 over the substrate W can be made the same as in the conventional example. Therefore, changes to the control program of the control unit 13 can be minimized.

[0094] The present invention is not limited to the above-described embodiment, but can be modified as follows.

[0095] (1) In the above-described first embodiment, the position where the brush 27 is initially brought into contact is described as being the outer peripheral edge of the outermost circumference of the substrate W. However, the present invention is not limited to such a position. In other words, as long as the position has a faster peripheral speed than the axis P1, it does not have to be the outer peripheral edge of the outermost circumference. For example, the brush 27 may be brought into contact with a position slightly closer to the axis P1 than the outer peripheral edge of the outermost circumference, or at an intermediate position between the outermost circumference and the axis P1. In this case, the brush 27 may be moved horizontally from that position to the axis P1 of the substrate W, and then moved horizontally from the axis P1 to the outer peripheral edge of the outermost circumference.

[0096] (2) In each of the above-described first and second embodiments, the case where a substrate W having a circular shape in a plan view is processed has been described as an example. However, the present invention is not limited to such a shape of a substrate W. For example, the present invention can also be applied to the case where a substrate W having a rectangular shape is processed.

[0097] (3) In each of the above-mentioned first and second embodiments, the chuck unit 5 is described as a chuck (also called a mechanical chuck) that abuts and supports the outer periphery of the substrate W. However, the present invention is not limited to this configuration. For example, the present invention can be applied to a chuck (also called a suction chuck) that holds the substrate W by sucking the lower surface of the substrate W.

[0098] (4) In the above-described second embodiment, the brush 27 is pressed against the pressed member 41 with a pressure greater than the pressing pressure during processing. However, the present invention is not limited to this embodiment. In other words, the pressure with which the brush 27 is pressed against the pressed member 41 does not need to be greater than the pressing pressure during processing as long as the brush 27 is deformed.

[0099] (5) In the above-mentioned second embodiment, the pressed member 41 is provided in the waiting pot 31A. However, the present invention is not limited to such a configuration. For example, the pressed member 41 may be disposed between the waiting pot 31A and the guard 7. The pressed member 41 may be the substrate W. That is, the outer peripheral edge side of the substrate W is used as the pressed member 41. The brush body 27b is pressed against the outer peripheral edge side of the substrate W to deform it, and before the shape of the brush body 27b lifted upward returns to its original shape, the brush body 27b is moved to the axis P1 of the substrate W, which is the cleaning start position, to abut against it, and then moved toward the outer peripheral edge of the substrate W. In this case, it is not necessary to provide the pressed member 41 as a separate body, and costs can be reduced. Moreover, the second embodiment can be easily applied to the conventional device by simply changing the program that controls the movement of the brush 27. [Explanation of symbols]

[0100] W … Substrate 1,1A … Substrate processing equipment 3 … Base unit 5 … Chuck unit 7. Guard 9 … Brush cleaning unit 11 ... Nozzle 13 ... Control section 15 … Electric motor 17 … Rotation axis P1,P2,P3 … Axis center 19 ... Rotating and lifting mechanism 21 ... Arm 23 … Brush head 25... Head body 27 … Brush 27a … bracket 27b … Brush body 29 … Electric motor 31,31A … Standby pot 41 ... Pressed member L0, L1~L3, L11, L12 … Length of brush body

Claims

1. A substrate processing method for cleaning a substrate by contacting a brush with the substrate, comprising: a rotating step of rotating the rotating holder holding the substrate around a vertical axis; an outer periphery abutting step of abutting a brush at an outer periphery abutting position on the outer periphery side of the substrate relative to the axis while the substrate is rotated in a horizontal plane; a first moving step of moving the brush from the contact position toward the shaft core while the brush is in contact with the substrate; a second moving step of moving the brush from the axis side to the outer periphery side while the brush is in contact with the substrate after the first moving step; A substrate processing method comprising the steps of:

2. 2. The substrate processing method according to claim 1, A substrate processing method comprising the steps of: performing the first moving step and the second moving step a plurality of times.

3. 3. The substrate processing method according to claim 1, A substrate processing method, characterized in that the outer periphery abutment position is the outer periphery of the substrate.

4. In a substrate processing apparatus for performing a cleaning process by contacting a brush with a substrate, a rotation holder that holds the substrate rotatably around a vertical axis; a brush that comes into contact with and cleans the substrate being rotated by the rotating holder; A brush holder for holding the brush; A horizontal drive unit that moves the brush holder in a horizontal direction; A lifting drive unit that moves the brush holding unit in a vertical direction; a control unit that operates the horizontal drive unit and the elevation drive unit to perform, in that order, a first operation of abutting the brush against the substrate rotated by the rotating holder unit at an outer peripheral edge abutment position that is closer to the outer peripheral edge of the substrate than the axis, a second operation of moving the brush from the outer peripheral edge abutment position toward the axis while the brush is in abutment against the substrate, and a third operation of moving the brush from the axis side to the outer peripheral edge of the substrate while the brush is in abutment against the substrate; A substrate processing apparatus comprising:

5. 5. The substrate processing apparatus according to claim 4, The substrate processing apparatus according to claim 1, wherein the control unit causes the second operation and the third operation to be performed a plurality of times.

6. 6. The substrate processing apparatus according to claim 4, The substrate processing apparatus according to claim 1, wherein the outer peripheral edge abutment position is the outer peripheral edge of the substrate.

7. A substrate processing method for performing a cleaning process by contacting a brush with a substrate, comprising: a rotating step of rotating the rotating holder holding the substrate around a vertical axis; a deformation step of deforming the brush by pressing a cleaning surface of the brush against a pressed member before the brush is brought into contact with a cleaning start position of the substrate; a deformed brush abutment process in which the brush is brought into contact with a cleaning start position of the substrate while the substrate is being rotated in a horizontal plane until the shape of the brush returns to its original shape; a cleaning step of moving the brush over the substrate to clean the substrate; A substrate processing method comprising the steps of:

8. 8. The substrate processing method according to claim 7, The substrate processing method according to the present invention, wherein the deforming step presses the brush against the pressed member with a pressure equal to or greater than a processing pressure at which the brush is pressed against the substrate in the cleaning step.

9. In a substrate processing apparatus for performing a cleaning process by contacting a brush with a substrate, a rotation holder that holds the substrate rotatably around a vertical axis; a brush that comes into contact with and cleans the substrate being rotated by the rotating holder; a waiting pot provided outside an outer periphery of the substrate held by the rotating holder, for allowing the brush to wait; a pressing member against which the cleaning surface of the brush is pressed; A brush holder for holding the brush; A horizontal drive unit that moves the brush holder in a horizontal direction; A lifting drive unit that moves the brush holding unit in a vertical direction; a control unit that operates the horizontal drive unit and the elevation drive unit so that the brush is deformed by pressing a cleaning surface of the brush against the pressed member before the brush is brought into contact with a cleaning start position of the substrate, and then moves the brush to the cleaning start position of the substrate and cleans the substrate with the brush until the brush returns to its original shape; A substrate processing apparatus comprising:

10. 10. The substrate processing apparatus according to claim 9, The substrate processing apparatus according to claim 1, wherein the pressed member is provided in the waiting pot.

11. 11. The substrate processing apparatus according to claim 9, The control unit operates the lifting drive unit to press the brush against the pressed member with a pressure equal to or greater than the processing pressure when pressing the brush against the substrate to clean it, thereby deforming the brush.

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