microphone

Abstract

The present specification discloses a microphone including a housing structure, a vibration pickup unit that vibrates in response to vibrations of the housing structure, and at least two acoustoelectric transducer elements configured to generate electrical signals in response to vibrations of the vibration pickup unit, wherein the at least two acoustoelectric transducer elements have different frequency responses to vibrations of the vibration pickup unit.

Description

[Technical field]

[0001] The present application relates to the technical field of microphone devices, and in particular to microphones. [Background technology]

[0002] A microphone (e.g., a bone conduction microphone or an air conduction microphone) outputs a full-band signal based on an external audio signal, and performing sub-band division (also referred to as sub-band decomposition) on the full-band signal output from the microphone can better perform subsequent signal processing operations such as voice recognition, noise reduction, and signal enhancement. Sub-band division technology can be widely applied to fields such as electroacoustics, communications, image coding, echo cancellation, and radar signal selection. Current sub-band division technology generally uses hardware circuits (e.g., electronic components) and software algorithms (e.g., digital technology) to perform sub-band division on a full-band signal, but electronic components are affected by their own characteristics, and the higher the performance of the filter, the more complex the circuit design becomes. Meanwhile, using software algorithms to perform sub-band division on a full-band signal requires high computational resources, and may cause problems such as distortion of the audio signal and noise contamination in the processing process, affecting the sound quality.

[0003] Therefore, it is desirable to provide a microphone that can simplify the process of performing subband division on a full-band signal, realize subband division on the element side, reduce its dependency on complex hardware circuits and software algorithms, and improve the quality of the final generated audio signal. Summary of the Invention

[0004] A microphone according to an embodiment of the present application includes a housing structure, a vibration pickup section that vibrates in response to vibration of the housing structure, and at least two acoustoelectrical transducer elements each configured to receive the vibration of the vibration pickup section and generate an electrical signal, the at least two acoustoelectrical transducer elements having different frequency responses to the vibration of the vibration pickup section.

[0005] In some embodiments, the frequency response corresponding to each acoustoelectric transducer element includes at least one resonant frequency, and at least two of the multiple resonant frequencies corresponding to the at least two acoustoelectric transducer elements are in the range of 20 Hz to 16000 Hz.

[0006] In some embodiments, the number of subbands corresponding to the at least two acoustic-electrical transducer elements is five or more.

[0007] In some embodiments, the vibration pickup unit and the housing structure define at least one acoustic cavity, the at least one acoustic cavity includes a first acoustic cavity, the housing structure includes at least one hole, the at least one hole is located in the first acoustic cavity, the at least one hole introduces the external audio signal into the first acoustic cavity, the vibration pickup unit vibrates in response to the audio signal in the first acoustic cavity, and the at least two acoustic-electrical conversion elements each generate an electrical signal in response to vibration of the vibration pickup unit.

[0008] In some embodiments, the vibration pickup unit is connected by its periphery to the housing structure, and at least a portion of the structure of the vibration pickup unit vibrates in response to the external audio signal.

[0009] In some embodiments, the vibration pickup section includes a first vibration pickup section, and the at least two acoustoelectric transducer elements are directly or indirectly connected to the first vibration pickup section.

[0010] In some embodiments, the vibration pickup unit includes a first vibration pickup unit and a second vibration pickup unit arranged in order from top to bottom, the first vibration pickup unit and the second vibration pickup unit are connected to the housing structure by their peripheral sides, and at least a portion of the structure of the first vibration pickup unit and the second vibration pickup unit vibrates in response to the external audio signal.

[0011] In some embodiments, a vibration transmission part having a tubular structure is disposed between the first vibration pickup part and the second vibration pickup part, and a cavity is defined between the vibration transmission part, the first vibration pickup part and the second vibration pickup part.

[0012] In some embodiments, the vibration pickup unit includes a first vibration pickup unit, a second vibration pickup unit, and a third vibration pickup unit, the first vibration pickup unit and the second vibration pickup unit are arranged opposite each other above and below, a vibration transmission unit having a tubular structure is arranged between the first vibration pickup unit and the second vibration pickup unit, a cavity is defined between the vibration transmission unit, the first vibration pickup unit, and the second vibration pickup unit, the third vibration pickup unit is connected between the vibration transmission unit and an inner wall of the housing structure, and the third vibration pickup unit vibrates in response to the external audio signal.

[0013] In some embodiments, each of the acoustic-electrical conversion elements includes a cantilever structure, one end of the cantilever structure is connected to an inner wall of the vibration transmission section and the other end of the cantilever structure is suspended within the cavity, and the cantilever structure deforms based on the vibration signal, thereby converting the vibration signal into an electrical signal.

[0014] In some embodiments, the different cantilever structures are distributed at intervals on the inner wall of the vibration transmission part.

[0015] In some embodiments, the cantilever structures corresponding to the at least two acoustoelectric transducer elements respectively have different dimensions or materials.

[0016] In some embodiments, the at least two acoustoelectric transducer elements include a first cantilever structure and a second cantilever structure, wherein a length of the first cantilever perpendicular to its vibration direction is greater than a length of the second cantilever perpendicular to its vibration direction, and a resonant frequency corresponding to the first cantilever is lower than a resonant frequency corresponding to the second cantilever.

[0017] In some embodiments, the cantilever structure includes a first electrode layer, a piezoelectric layer, a second electrode layer, an elastic layer, and a base layer, the first electrode layer, the piezoelectric layer, and the second electrode layer being arranged in order from top to bottom, the elastic layer being located on an upper surface of the first electrode layer or a lower surface of the second electrode layer, and the base layer being located on an upper surface or a lower surface of the elastic layer.

[0018] In some embodiments, the cantilever beam structure includes at least one elastic layer, an electrode layer, and a piezoelectric layer, the at least one elastic layer being located on a surface of the electrode layer, the electrode layer including a first electrode and a second electrode, the first electrode being folded into a first comb-like structure, the second electrode being folded into a second comb-like structure, the first comb-like structure interdigitating with the second comb-like structure to form the electrode layer, the electrode layer being located on an upper or lower surface of the piezoelectric layer, and the first comb-like structure and the second comb-like structure extending along a longitudinal direction of the cantilever beam structure.

[0019] In some embodiments, each of the acoustic-electrical conversion elements includes a first cantilever structure and a second cantilever structure, the first cantilever structure and the second cantilever structure are disposed opposite each other and have a first distance between them, and the first distance between the first cantilever structure and the second cantilever structure changes based on the vibration signal, thereby converting the vibration signal into an electrical signal.

[0020] In some embodiments, the first cantilever structures and the second cantilever structures corresponding to each acoustoelectric transducer are distributed at intervals on the inner wall on the circumferential side of the vibration transmitting part.

[0021] In some embodiments, the stiffness of the first cantilever structure differs from the stiffness of the second cantilever structure.

[0022] In some embodiments, the microphone comprises at least one membrane structure, the at least one membrane structure being located on an upper and / or lower surface of the acoustic-electrical transducer element.

[0023] In some embodiments, the at least one membrane structure fully or partially covers an upper surface and / or a lower surface of the acoustoelectric transducer element.

[0024] In some embodiments, the microphone includes at least one support structure, one end of the at least one support structure is connected to a first vibration pickup unit among the vibration pickup units and the other end of the support structure is connected to a second vibration pickup unit among the vibration pickup units, and the free ends of the at least two acoustic-electrical conversion elements and the support structure have a second spacing.

[0025] In some embodiments, the microphone further includes at least one sampling module configured to convert the electrical signals output from the different acoustic-electrical conversion elements into digital signals, the sampling module sampling the electrical signals output from the different acoustic-electrical conversion elements using different sampling frequencies. [Brief description of the drawings]

[0026] The present application will be further illustrated by exemplary embodiments, which are described in detail with reference to the drawings, in which the same reference numerals represent the same structures, and in which the exemplary embodiments are not limiting, and in which:

[0027] [Figure 1] 1 is an exemplary flow chart of a subband division process according to some embodiments of the present application. [Diagram 2] 1 is an exemplary flow chart of a subband division process according to some embodiments of the present application. [Diagram 3] FIG. 2 is a schematic diagram of a spring-mass-damper system of an acoustoelectric transducer element according to some embodiments of the present application. [Figure 4] FIG. 13 is a schematic diagram of an exemplary normalization of a displacement resonance curve of a spring-mass-damper system in accordance with some embodiments of the present application. [Diagram 5] FIG. 1 is a schematic diagram of a microphone according to some embodiments of the present application. [Figure 6A] 6 is a schematic cross-sectional view of the microphone taken along the line AA in FIG. 5. [Figure 6B] 6 is a schematic cross-sectional view of the microphone in FIG. 5 taken along a direction perpendicular to the AA direction. [Figure 7A] FIG. 2 is a schematic distribution diagram of a cantilever structure according to some embodiments of the present application. [Figure 7B] FIG. 2 is a schematic distribution diagram of a cantilever structure according to some embodiments of the present application. [Figure 8] FIG. 1 is a schematic diagram of a microphone according to some embodiments of the present application. [Figure 9] FIG. 2 is a schematic diagram of a frequency response curve of a microphone according to some embodiments of the present application. [Figure 10] FIG. 1 is a schematic diagram of a microphone according to some embodiments of the present application. [Figure 11] FIG. 1 is a schematic diagram of a microphone according to some embodiments of the present application. [Figure 12] FIG. 1 is a schematic diagram of a microphone according to some embodiments of the present application. [Figure 13] FIG. 1 is a schematic diagram of a microphone according to some embodiments of the present application. [Figure 14] FIG. 1 is a schematic diagram of a microphone according to some embodiments of the present application. [Figure 15] FIG. 1 is a schematic diagram of a microphone according to some embodiments of the present application. [Figure 16A] 1 is a schematic cross-sectional view of a microphone according to some embodiments of the present application; [Figure 16B] 1 is a schematic cross-sectional view of a microphone according to some embodiments of the present application; [Figure 17A] 1 is a schematic cross-sectional view of a microphone according to some embodiments of the present application; [Figure 17B] 1 is a schematic cross-sectional view of a microphone according to some embodiments of the present application; [Figure 18] FIG. 1 is a schematic diagram of a microphone according to some embodiments of the present application. [Figure 19] FIG. 1 is a schematic diagram of a microphone according to some embodiments of the present application. [Figure 20] FIG. 1 is a schematic diagram of a microphone according to some embodiments of the present application. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0028] In order to more clearly describe the technical solutions of the embodiments of the present application, the drawings necessary for the description of the embodiments are briefly described below. Obviously, the drawings described below are merely examples or parts of the embodiments of the present application, and those skilled in the art can apply the present application to other similar scenarios based on these drawings without creative efforts. Unless otherwise clear from the language environment or specified, the same symbols in the drawings represent the same structures or operations.

[0029] It will be understood that the terms "system," "apparatus," "unit," and / or "module" used herein are ways to distinguish between different levels of assemblies, elements, parts, portions, or assemblies, however, other terms may be used in place of the above terms if they achieve the same purpose.

[0030] As used herein and in the claims, unless the context clearly dictates otherwise, terms such as "a," "one," "one kind," and / or "the" do not specifically refer to the singular but may include the plural. In general, the terms "comprise" and "contain" are intended to include only the specifically identified steps and elements, and these steps and elements are not intended to be an exclusive listing, and the method or apparatus may include other steps or elements.

[0031] In the present application, flowcharts are used to describe operations performed by the system according to the embodiments of the present application. It will be understood that the preceding and subsequent operations are not necessarily performed in exact order. Instead, various steps may be processed in reverse order or simultaneously. Also, other operations may be added to these processes, or one or more operations may be removed from these processes.

[0032] This specification describes a microphone. A microphone is a transducer that converts a sound signal into an electric signal. In some embodiments, the microphone may be a moving coil microphone, a ribbon microphone, a condenser microphone, a piezoelectric microphone, an electret microphone, an electromagnetic microphone, a carbon microphone, or the like, or any combination thereof. In some embodiments, the microphone may include a bone conduction microphone and an air conduction microphone, distinguished by the sound collection method. A microphone according to the embodiments of this specification may include a housing structure, a vibration pickup unit, and at least two acoustoelectric conversion elements. The housing structure may be configured to mount the vibration pickup unit and the at least two acoustoelectric conversion elements. In some embodiments, the housing structure may be a rectangular parallelepiped, a cylindrical body, or other irregular structure. In some embodiments, the housing structure may be a structure with a hollow interior. The housing structure may independently form an acoustic cavity, and the vibration pickup unit and the at least two acoustoelectric conversion elements may be located in the acoustic cavity of the housing structure. In some embodiments, the vibration pickup unit may be connected to a side wall of the housing structure, and the vibration pickup unit may vibrate in response to an external audio signal transmitted to the housing structure. In some embodiments, at least two acoustic-electrical transducer elements may be directly or indirectly connected to the vibration pickup unit to receive vibrations of the vibration pickup unit and convert the received vibration signal into an electrical signal for output.

[0033] In some embodiments, different acoustoelectric transducer elements (e.g., cantilever structures) may have different frequency responses to the vibration of the vibration pickup unit. For example, each acoustoelectric transducer element has its own resonant frequency, and each acoustoelectric transducer element has a high response to sound components in the vicinity of its own resonant frequency. In some embodiments, the response of each acoustoelectric transducer element to a sound signal or a vibration signal can be described by its corresponding frequency response curve (e.g., frequency response curve 920 and frequency response curve 930 shown in FIG. 9). In some embodiments, by respectively setting the structure, dimensions, material, etc. of each acoustoelectric transducer element (e.g., cantilever structures), it can be realized that each different acoustoelectric transducer element has a frequency response with a different frequency range and a different resonant frequency. For example, by installing cantilever structures with different lengths, the resonance frequencies of the cantilever structures with different lengths can be within frequency ranges such as 300Hz to 500Hz, 500Hz to 700Hz, 700Hz to 1000Hz, 2200Hz to 3000Hz, 4700Hz to 5700Hz, and 7000Hz to 12000Hz. In some embodiments, each acoustoelectric transducer element has high sensitivity only in the vicinity of its resonance peak, that is, the sensitivity of the acoustoelectric transducer element at its resonance peak is much greater than the sensitivity in other regions (particularly regions far from the resonance peak position), so that subband division of the audio signal can be realized by performing acoustoelectric conversion on the audio signal in the vicinity of each of the resonance peaks using multiple acoustoelectric transducer members. In some embodiments, the difference in the resonance frequencies of at least two of the different acoustoelectric transducer elements is greater than 5000Hz. In some embodiments, the difference in the resonance frequencies of at least two of the different acoustoelectric transducer elements is greater than 3000Hz. In some embodiments, the difference in resonant frequency between at least two of the different acoustoelectric transducer elements is greater than 2000 Hz. In some embodiments, the difference in resonant frequency between at least two of the different acoustoelectric transducer elements is greater than 1000 Hz.In some embodiments, the difference in resonance frequency between at least two of the different acoustic-electric transducer elements is greater than 500 Hz. In some embodiments, the difference in resonance frequency between at least two of the different acoustic-electric transducer elements is greater than 200 Hz. In some embodiments, the difference in resonance frequency between at least two of the different acoustic-electric transducer elements is greater than 100 Hz. To facilitate the description of the content, merely as an exemplary description, within 20 Hz to 15000 Hz, the microphone may include 100 sub-bands, the bandwidth of each sub-band is about 150 Hz, the frequency band range in which the minimum resonance frequency is located is 20 Hz to 170 Hz, the frequency band range in which the maximum resonance frequency is located is 14850 Hz to 15000 Hz, and the difference between the maximum resonance frequency (e.g., about 14920 Hz) and the minimum resonance frequency (e.g., about 95 Hz) is about 14825 Hz. Also, for example, within 20Hz to 10000Hz, the microphone may include 40 subbands, each subband has a bandwidth of 250Hz, the frequency band range in which the minimum resonance frequency is located is 20Hz to 270Hz, the frequency band range in which the maximum resonance frequency is located is 9750Hz to 10000Hz, and the difference between the maximum resonance frequency (for example, about 9875Hz) and the minimum resonance frequency (for example, about 145Hz) is about 9730Hz. Furthermore, for example, within 20Hz to 10000Hz, the microphone may include 10 subbands, each subband has a bandwidth of 1000Hz, the frequency band range in which the minimum resonance frequency is located is 20Hz to 1020Hz, the frequency band range in which the maximum resonance frequency is located is 9000Hz to 10000Hz, and the difference between the maximum resonance frequency (for example, about 9500Hz) and the minimum resonance frequency (for example, about 510Hz) is about 8090Hz. It should be noted that the above is merely an illustrative description, and the specific values ​​of the selected frequency band range, the number of subbands, the bandwidth, etc. can be adaptively adjusted according to various application scenes (e.g., indoor call scenes, outdoor noise scenes, etc.), and are not further limited here.The frequency response of the microphone may be regarded as a flatter frequency response curve with a high signal-to-noise ratio formed by the fusion of the frequency responses of different acoustoelectric transducer elements (e.g., frequency response curve 910 shown in FIG. 9). The microphone according to the embodiment of the present specification realizes subband division processing for a full-band signal by its own structure without using a hardware circuit (e.g., a filter circuit) or a software algorithm, and can avoid the problems of the complex design of the hardware circuit, the large occupation of computing resources by the software algorithm, signal distortion, and noise contamination, and can further reduce the complexity and manufacturing cost of the microphone. Meanwhile, the microphone according to the embodiment of the present specification can output a flatter frequency response curve with a high signal-to-noise ratio and improve the signal quality of the microphone. In addition, by installing different acoustoelectric transducer elements (e.g., a cantilever structure), it is possible to add resonance peaks of different frequency ranges in the microphone system, improve the sensitivity in the vicinity of multiple resonance peaks of the microphone, and further improve the sensitivity of the microphone over the entire wide band.

[0034] 1 is an exemplary flowchart of a subband division process according to some embodiments of the present application. As shown in FIG. 1, in some embodiments, a microphone 100 may include an acoustic-electrical transducer element 110, a sampling module 120, a subband division module 130, and a signal processing module 140.

[0035] The microphone 100 is a transducer that converts a sound signal into an electrical signal. In some embodiments, the microphone 100 may be a moving coil microphone, a ribbon microphone, a condenser microphone, a piezoelectric microphone, an electret microphone, an electromagnetic microphone, a carbon microphone, etc., or any combination thereof. In some embodiments, distinguished by the sound collection method, the microphone 100 may include a bone conduction microphone and an air conduction microphone.

[0036] The acoustic-electrical transducer element 110 is configured to receive vibrations and generate an electric signal. Taking a bone conduction microphone as an example, in some embodiments, the microphone 100 may further include a housing structure and a vibration pickup unit housed in the housing structure and vibrating in response to an external sound signal transmitted to the housing structure. Taking an air conduction microphone as an example, in some embodiments, the vibration pickup unit and the housing structure define at least one acoustic cavity, the at least one acoustic cavity includes a first acoustic cavity, the housing structure includes one or more holes, the one or more holes are located in the first acoustic cavity, the one or more holes can introduce an external sound signal into the first acoustic cavity, the vibration pickup unit vibrates in response to the sound signal transmitted to the housing structure and further into the first acoustic cavity, and the acoustic-electrical transducer element 110 generates an electric signal in response to the vibrations of the vibration pickup unit.

[0037] In some embodiments, the acoustic-electrical transducer 110 can convert an audio signal into an electric signal. In some embodiments, the acoustic-electrical transducer 110 can include a capacitive acoustic-electrical transducer or a piezoelectric transducer. In some embodiments, the piezoelectric transducer can be an element that converts a change in a non-electrical quantity to be measured (e.g., pressure, displacement, etc.) into a change in voltage. For example, the piezoelectric transducer can include one cantilever structure, which can be deformed by the vibration of the vibration pickup unit, and the inverse piezoelectric effect of the deformed cantilever structure can generate an electric signal. In some embodiments, the capacitive acoustic-electrical transducer can be an element that converts a change in a non-electrical quantity to be measured (e.g., displacement, pressure, light intensity, acceleration, etc.) into a change in capacitance. For example, the capacitive transducer can include a first cantilever structure and a second cantilever structure, which can change the spacing between the first cantilever structure and the second cantilever structure by generating different degrees of deformation by the vibration of the vibration pickup unit. For a specific structure of the acoustic-electrical transducer 110, reference can be made to FIG. 5, FIG. 8 and the related descriptions in the specification of the present application.

[0038] The sampling module 120 can realize converting the electrical signal into a digital signal by sampling (and holding), quantizing and encoding the electrical signal based on a sampling frequency. In some embodiments, the sampling module 120 may include a sampling circuit, an analog-to-digital converter, etc. Specifically, the sampling circuit can perform a discretization process on the continuous electrical signal input to the sampling module 120, i.e., sample the continuous electrical signal based on a sampling frequency to obtain a series of discrete sampling values ​​(i.e., a sampling signal).

[0039] The sub-band division module 130 may decompose the digital signal into a plurality of sub-band divided signals. In some embodiments, the sub-band division module 130 may include electronic components (e.g., a filter, a divider, etc.). In some embodiments, the filter may select electrical signals in a certain frequency range based on its own frequency characteristics and attenuate electrical signals in other frequency ranges. The frequency characteristics of the filter may be realized by adjusting parameters of elements such as resistors, capacitors, and inductances in the filter circuit. In some embodiments, the sub-band division module 130 may include a plurality of filters having different frequency characteristics, and the filters having different frequency characteristics may resonate in their own resonant frequency ranges, and respectively select electrical signals in the corresponding resonant frequency ranges, thereby decomposing the electrical signal of a wide frequency band into a plurality of sub-band divided signals. In some embodiments, the signal may further be subjected to sub-band division processing by a back-end algorithm. In some embodiments, the back-end algorithm may include, but is not limited to, one or more of linear predictive analysis (LPC), linear predictive cepstral coefficients (LPCC), Mel-frequency cepstral coefficients (MFCC), and the like.

[0040] The signal processing module 140 can process the sub-band divided signal. In some embodiments, the signal processing module 140 may include one or more of an equalizer, a dynamic range controller, a phase processor, and the like. In some embodiments, the equalizer may be configured to provide a gain and / or an attenuation to the sub-band divided signal output from the sub-band division module 130 according to a specific frequency band (e.g., a frequency band corresponding to the sub-band divided signal). Providing a gain to the sub-band divided signal means increasing the amount of signal amplification, and providing an attenuation to the sub-band divided signal means decreasing the amount of signal amplification. In some embodiments, the dynamic range controller may be configured to compress and / or amplify the sub-band divided signal. Compressing and / or amplifying the sub-band divided electrical signal means decreasing and / or increasing the ratio between the signal input and the signal output in the microphone 100. In some embodiments, the phase processor may be configured to adjust the phase of the sub-band divided signal. In some embodiments, the signal processing module 140 may be located inside the microphone 100. For example, the signal processing module 140 may be located within an acoustic cavity formed independently by the housing structure of the microphone 100. In some embodiments, the signal processing module 140 may be located in one or any combination of other electronic devices, such as earphones, mobile devices, tablet computers, laptops, etc. In some embodiments, the mobile devices include, but are not limited to, mobile phones, smart home devices, smart mobile devices, etc., or any combination thereof. In some embodiments, the smart home devices may include smart appliance controls, smart monitoring devices, smart televisions, smart cameras, etc., or any combination thereof. In some embodiments, the smart mobile devices may include smartphones, personal digital assistants (PDAs), gaming devices, navigation devices, POS devices, etc., or any combination thereof.

[0041] In the operation process of the above microphone 100, when the subband division module 130 is an electronic component, it is affected by the characteristics of the electronic component, and the filter circuit of the subband division module 130 is generally complicated in design to achieve a higher division filter effect. On the other hand, when the subband division module 130 realizes subband division by a back-end algorithm, the back-end algorithm has high requirements for calculation resources, and the amount of data to be processed is large, so the calculation time is too long, and the realization of subband division by a back-end algorithm may cause problems of distortion of the audio signal and noise contamination in the processing process, which may affect the sound quality. Therefore, in response to the problems existing in the above subband division method, this specification provides a microphone that solves the problems of the complicated design of the filter circuit in the microphone and the large amount of calculation of the back-end algorithm, while improving the Q value and sensitivity of the microphone. For the contents of the microphone, please refer to Figures 2 to 20 of the specification of this application and their related descriptions.

[0042] The components of the microphone 100 are not limited to the acoustoelectric conversion element 110, the sampling module 120, the subband division module 130, and the signal processing module 140 shown in Fig. 1, and may include other modules. The acoustoelectric conversion element 110, the sampling module 120, the subband division module 130, and the signal processing module 140 may be one system, and the microphone 100 may include only the acoustoelectric conversion element 110 as a part of the system. The sampling module 120, the subband division module 130, and the signal processing module 140 may be installed outside the microphone 100, and the electrical signal output from the acoustoelectric conversion element 110 may be transmitted to the corresponding module in a wired or wireless manner for subsequent processing.

[0043] FIG. 2 is an exemplary flow chart of a subband division process according to some embodiments of the present application. As shown in FIG. 2, in some embodiments, a microphone 200 may include at least two acoustic-electrical transducer elements 210, a sampling module 220, and a signal processing module 230. The microphone 200 picks up an external audio signal and transmits the audio signal to the acoustic-electrical transducer element 210, which can convert the audio signal (e.g., vibration) into an electric signal. In some embodiments, each acoustic-electrical transducer element (e.g., a first acoustic-electrical transducer element, a second acoustic-electrical transducer element, ... an nth acoustic-electrical transducer element, etc.) of the at least two acoustic-electrical transducer elements 210 has a different frequency response to the audio signal, so that the electric signals mainly output from each acoustic-electrical transducer element correspond to different frequency ranges and frequency bandwidths (i.e., subband divided electric signal 1, ... subband divided electric signal n, etc.). For example, the acoustoelectric transducer element may include a first acoustoelectric transducer element, a second acoustoelectric transducer element, a third acoustoelectric transducer element, and a fourth acoustoelectric transducer element, each having a first frequency response, a second frequency response, a third frequency response, and a fourth frequency response. In some embodiments, the frequency ranges corresponding to the first frequency response, the second frequency response, the third frequency response, and the fourth frequency response may be different. Alternatively, the frequency ranges corresponding to the first frequency response, the second frequency response, and the third frequency response may be different from each other, and the frequency range of the fourth frequency response may be the same as the frequency range of the third frequency response. In some embodiments, the frequency bandwidths corresponding to the first frequency response, the second frequency response, the third frequency response, and the fourth frequency response may be the same or different. For example, the frequency bandwidth of the second frequency response is larger than the frequency bandwidth of the first frequency response, and the frequency bandwidth of the third frequency response is larger than the frequency bandwidth of the second frequency response. Also, for example, a frequency bandwidth corresponding to the fourth frequency response is equal to a frequency bandwidth corresponding to the third frequency response. In some embodiments, the frequency ranges corresponding to different acoustoelectric transducer elements may or may not overlap with each other.For example, the first frequency response and the second frequency response each correspond to one of two adjacent subbands, the frequency range of the second frequency response includes at least a portion of the frequency range of the first frequency response, and the frequency range of the second frequency response and the frequency range of the first frequency response have an overlapping portion. Also, for example, the first frequency response and the fourth frequency response each correspond to one of two non-adjacent subbands, and the frequency range of the fourth frequency response and the frequency range of the first frequency response do not have the same frequency or frequency range, in which case the fourth frequency response and the first frequency response do not overlap. In some embodiments, the resonant frequencies corresponding to different acoustoelectric transducer elements may be different. For example, the resonant frequencies corresponding to the first frequency response, the second frequency response, the third frequency response, and the fourth frequency response each increase gradually. In some embodiments, the second frequency response and the first frequency response may intersect at a position close to or located at a half-power point. For example, the resonant frequency of the second frequency response is greater than the resonant frequency of the first frequency response, and the half-power point of the second frequency response intersects with the half-power point of the first frequency response. In some embodiments, the second frequency response and the first frequency response may intersect at a location that is not close to the half-power point.

[0044] In some embodiments, by adjusting the dimensions (e.g., length, width, thickness, etc.) and materials of the cantilever structures, different cantilever structures can be made to resonate within desired frequency ranges, and frequency responses corresponding to different resonant frequency ranges can be obtained. For example, assuming that the cantilever is a rectangular parallelepiped structure, in some embodiments, the resonant frequency of the acoustoelectric transducer element 250 is negatively correlated with the length of the cantilever structure. For example, the acoustoelectric transducer element 250 may include a first acoustoelectric transducer element and a second acoustoelectric transducer element, the first acoustoelectric transducer element may include a first cantilever structure, the second acoustoelectric transducer element may include a second cantilever structure, the length of the first cantilever structure is greater than the length of the second cantilever structure, and the resonant frequency corresponding to the first acoustoelectric transducer element is lower than the resonant frequency corresponding to the second cantilever structure. Note that here, the first cantilever structure and the second cantilever structure have the same parameters (e.g., width, thickness, material) except for the different lengths. In some other embodiments, the length, width, thickness, and material of the different cantilever structures may all be adjusted to tune the resonant frequency of the different cantilever structures.

[0045] In some embodiments, the sub-band divided electric signals may be transmitted through different parallel circuits, respectively. In some embodiments, the sub-band divided electric signals may share one circuit and be output in a specific format according to a specific protocol rule. In some embodiments, the specific protocol rule includes, but is not limited to, one or more of direct transmission, amplitude modulation, frequency modulation, and the like. In some embodiments, the circuit medium includes, but is not limited to, one or more of a coaxial cable, a communication cable, a flexible cable, a spiral cable, a non-metallic sheathed cable, a metallic sheathed cable, a multi-core cable, a twisted pair cable, a flat cable, a shielded cable, an electric communication cable, a twinax cable, a parallel twin-core cable, a twisted pair wire, an optical fiber, an infrared ray, an electromagnetic wave, an acoustic wave, and the like. In some embodiments, the specific format includes, but is not limited to, one or more of a CD, a WAVE, an AIFF, MPEG-1, MPEG-2, MPEG-3, MPEG-4, MIDI, WMA, Real Audio, VQF, AMR, APE, FLAC, AAC, and the like. In some embodiments, the transmission protocol includes, but is not limited to, one or more of AES3, EBU, ADAT, I2S, TDM, MIDI, CobraNet, Ethernet AVB, Dante, ITU-T G.728, ITU-T G.711, ITU-T G.722, ITU-T G.722.1, ITU-T G.722.1 Annex C, AAC-LD, and the like.

[0046] In some embodiments, each acoustoelectric transducer element (e.g., the first acoustoelectric transducer element, ... the nth acoustoelectric transducer element) in the acoustoelectric transducer element 210 outputs a corresponding subband divided electric signal (e.g., subband divided electric signal 1, ... subband divided electric signal n), which is then transmitted to a corresponding sampling module 220 (e.g., the first sampling module 1, ... the nth sampling module, etc.) for sampling, thereby converting the subband divided electric signal (e.g., subband divided electric signal 1, ... subband divided electric signal n, etc.) into a corresponding digital signal (e.g., digital signal 1, ... digital signal n, etc.). For example, the first sampling module can convert the subband divided electric signal 1 into a digital signal 1 by sampling the subband divided electric signal 1. Note that the subband divided electric signal may be abbreviated as subband. In some embodiments, the number of sampling modules 220 may be different from the number of the acoustoelectric transducer elements 210. For example, the sub-band divided electric signals output from a plurality of acoustic-electrical transducer elements may be sampled at the same sampling frequency by the same sampling module. In some embodiments, the frequency ranges of the sub-band divided electric signals output from two or more adjacent acoustic-electrical transducer elements are relatively close, and in order to improve the conversion efficiency of the sub-band divided electric signals, the same sampling module may sample the sub-band divided electric signals output from two or more adjacent acoustic-electrical transducer elements. In order to reduce the sampling frequency, the amount of data for sampling, and the difficulty of sampling, in some embodiments, the sampling frequency of the sampling module 220 may be determined based on the frequency ranges of the different sub-band divided electric signals. This may be understood as the different sub-band divided electric signals have different frequency ranges, and the sampling module may process the different sub-band divided electric signals based on different sampling frequencies. For example, a low sampling frequency is used for the sub-band divided electric signals in the low frequency range, thereby ensuring a low cut-off frequency.Also, for example, a high sampling frequency is used for the sub-band divided electrical signal in the medium-high frequency range to ensure a relatively high cut-off frequency. The sampling module processes different sub-band divided electrical signals according to different sampling frequencies, thereby reducing the amount of data to be sampled and reducing the difficulty and cost of sampling. Also, the sub-band signals are processed with different sampling frequencies to avoid problems such as signal distortion and noise contamination in the process of sub-band division and sampling. In some embodiments, the sampling cut-off frequency of the sampling module corresponding to each sub-band divided electrical signal may be a specific value higher than the maximum frequency in the resonant frequency range (hereinafter abbreviated as "bandwidth") corresponding to the sub-band divided electrical signal. Here, the resonant frequency range corresponding to the sub-band divided electrical signal refers to the 3 dB bandwidth of the sub-band divided electrical signal, and may be understood as the frequency range defined when the amplitude of the response drops to 1 / 2 of the resonant peak. In some embodiments, the specific value range may be greater than 500 Hz. In some embodiments, the specific value range may be greater than 600 Hz. In some embodiments, the range of the specific value may be greater than 800 Hz. To further improve the conversion quality of the sub-band divided electrical signal, in some embodiments, the sampling frequency may be greater than or equal to twice the highest frequency of the bandwidth of the sub-band divided electrical signal. In some embodiments, the sampling frequency may be greater than or equal to three times the highest frequency of the bandwidth of the sub-band divided electrical signal. In some embodiments, the sampling frequency may be greater than or equal to twice the highest frequency of the bandwidth of the sub-band divided electrical signal and less than or equal to four times the highest frequency of the bandwidth of the sub-band divided electrical signal.

[0047] In some embodiments, the digital signals (e.g., digital signal 1, ... digital signal n, etc.) output from each sampling module of the sampling modules 220 may be further transmitted to the signal processing module 230 for signal processing. In some embodiments, the multiple digital signals may be respectively transmitted to the signal processing module 230 through different parallel circuits. In some embodiments, the multiple digital signals may share one circuit and be transmitted to the signal processing module 230 in a specific format according to a specific protocol rule.

[0048] In some embodiments, by installing an acoustoelectric transducer element (e.g., a cantilever structure) with different frequency response characteristics in the microphone, the acoustoelectric transducer element can directly perform subband decomposition on the wideband audio signal, thereby avoiding the problems of using a hardware circuit or a software algorithm, such as the complex design of the hardware circuit, the large occupation of computing resources by the software algorithm, signal distortion, and noise contamination, and further reducing the complexity and manufacturing costs of the microphone.

[0049] The components of microphone 200 are not limited to acoustoelectric conversion element 210, sampling module 220, and signal processing module 230 shown in Fig. 2, but may include other modules, such as a vibration pickup unit, a vibration transmission unit, a circuit module, or any combination thereof. It will be understood that n (e.g., nth acoustoelectric conversion element, nth sampling module, etc.) described in Fig. 2 may be an integer of 2 or more, and the specific value of n can be adaptively adjusted according to the actual application scene.

[0050] To facilitate understanding of the acoustoelectric transducer element, in some embodiments, the acoustoelectric transducer element of a microphone may be roughly equivalent to a spring-mass-damper system. When the microphone is in operation, the spring-mass-damper system may vibrate under the action of an excitation source (e.g., vibration of a vibration pickup unit). Figure 3 is a schematic diagram of a spring-mass-damper system of an acoustoelectric transducer element according to some embodiments of the present application. As shown in Figure 3, the spring-mass-damper system may move according to differential equation (1).

number

[0051] The differential equation (1) can be solved to obtain the displacement at steady state (2).

number

number

[0052] The normalization of the displacement amplitude ratio A may be expressed as equation (3).

number

number

number

number

number

[0053] FIG. 4 is a schematic diagram of an exemplary normalization of the displacement resonance curve of a spring-mass-damper system according to some embodiments of the present application. The horizontal axis can represent the ratio of the actual vibration frequency in the spring-mass-damper system to its natural frequency, and the vertical axis can represent the normalized displacement of the spring-mass-damper system. It can be understood that each curve in FIG. 4 can represent the displacement resonance curve of a spring-mass-damper system having different parameters. In some embodiments, the microphone may generate an electric signal due to the relative displacement between the acoustoelectric transducer element and the housing structure. For example, an electret microphone can generate an electric signal based on the change in the distance between the deforming diaphragm and the substrate. As another example, a cantilever-type bone conduction microphone can generate an electric signal based on the inverse piezoelectric effect due to the deforming cantilever structure, or the change in capacitance due to the change in the distance between the cantilevers. In some embodiments, the larger the displacement due to the deformation of the cantilever structure, the larger the electric signal output from the microphone. As shown in Figure 4, when the actual vibration frequency of the spring-mass-damper system and its natural frequency are the same or nearly the same (i.e., the ratio of the actual vibration frequency of the spring-mass-damper system to its natural frequency, ω / ω 0is equal to or approximately equal to 1), the normalized displacement of the spring-mass-damper system becomes larger and the 3 dB bandwidth (which may be understood as the resonant frequency range) of the resonance peak in the displacement resonance curve becomes narrower. As can be seen from equation (3) above, the larger the normalized displacement of the spring-mass-damper system, the higher the Q factor of the microphone.

[0054] FIG. 5 is a schematic diagram of a microphone according to some embodiments of the present application. As shown in FIG. 5, the microphone 500 may include a housing structure 510, at least two acoustoelectric transducer elements 520, and a vibration pickup unit 522. The housing structure 510 may be configured to mount the vibration pickup unit 522 and the acoustoelectric transducer element 520. In some embodiments, the housing structure 510 may be a regular structure such as a rectangular parallelepiped, a cylindrical body, a truncated cone, or other irregular structure. In some embodiments, the housing structure 510 is a hollow structure, and the housing structure 510 may independently form an acoustic cavity, and the vibration pickup unit 522 and the at least two acoustoelectric transducer elements 520 may be located in the acoustic cavity. In some embodiments, the material of the housing structure 510 includes, but is not limited to, one or more of metals, alloy materials, polymer materials (e.g., acrylonitrile-butadiene-styrene copolymers, polyvinyl chloride, polycarbonate, polypropylene, etc.), etc. In some embodiments, the vibration pickup portion 522 may be connected to a sidewall of the housing structure 510 to partition the acoustic cavity formed in the housing structure 510 into multiple cavities, including a first acoustic cavity 530 and a second acoustic cavity 540.

[0055] In some embodiments, one or more holes 511 may be opened in a side wall of the housing structure 510 corresponding to the first acoustic cavity 530, and the one or more holes 511 may be located in the first acoustic cavity 530 and introduce an external sound signal into the first acoustic cavity 530. In some embodiments, the external sound signal may enter the first acoustic cavity 530 of the microphone 500 through the holes 511 and vibrate the air in the first acoustic cavity 530. The vibration pickup unit 522 may pick up the vibration signal of the air and transmit the vibration signal to the acoustic-electrical conversion element 520, and the acoustic-electrical conversion element 520 receives the vibration signal and converts the vibration signal into an electrical signal for output.

[0056] In some embodiments, the vibration pickup section 522 may include a first vibration pickup section 5221 and a second vibration pickup section 5222 that are installed in order from top to bottom. The first vibration pickup section 5221 and the second vibration pickup section 5222 may be connected to the housing structure 510 by their peripheries, and at least a part of the structure of the first vibration pickup section 5221 and the second vibration pickup section 5222 may vibrate in response to an audio signal that enters the microphone 500 through the hole section 511. In some embodiments, the material of the vibration pickup section 522 includes, but is not limited to, one or more of a semiconductor material, a metal material, a metal alloy, an organic material, and the like. In some embodiments, the semiconductor material includes, but is not limited to, silicon, silicon dioxide, silicon nitride, silicon carbide, and the like. In some embodiments, the metal material includes, but is not limited to, copper, aluminum, chromium, titanium, gold, and the like. In some embodiments, the metal alloy includes, but is not limited to, a copper-aluminum alloy, a copper-gold alloy, a titanium alloy, an aluminum alloy, and the like. In some embodiments, the organic material includes, but is not limited to, polyimide, parylene, PDMS, silicon gel, silica gel, etc. In some embodiments, the structure of the vibration pickup unit 522 may be a plate-like structure, a column-like structure, etc.

[0057] In some embodiments, different regions of the vibration pickup section 522 may be made of different materials. For example, the material of the portion of the vibration pickup section 522 that contacts the vibration transmission section 523 and the portion of the vibration pickup section 522 that corresponds to the cavity 550 may be a rigid material, and its rigidity is greater than that of other regions of the vibration pickup section 522, such as edge regions that move relative to the housing structure 510 mainly in response to air vibration. In some embodiments, the partial structure of the vibration pickup section 522 made of a rigid material is hardly deformed by the action of air vibration in the first acoustic cavity 530, so that the volume of the cavity 550 can be kept essentially constant, the effect of the volume change of the cavity 550 on the acoustoelectric transducer element 1320 can be avoided, and further, it can be ensured that the acoustoelectric transducer element 520 can convert the vibration signal received by the vibration pickup section 522 into an electric signal within a desired frequency band range. In some embodiments, the cavity 550 may be a vacuum cavity. The acoustoelectric transducer element 520 is located in the vacuum cavity, which avoids the acoustoelectric transducer element 520 from contacting with the air in the acoustic cavity, and further solves the impact of the air vibration in the acoustic cavity on the acoustoelectric transducer element 520 in the acoustoelectric transducer operation process, i.e., solves the problem of the large noise floor of the microphone. Meanwhile, the acoustoelectric transducer element 520 is located in the vacuum cavity, which avoids the acoustoelectric transducer element 520 from rubbing with the gas in vibration, which can reduce the air damper inside the vacuum cavity of the microphone 500, and improve the Q value of the microphone 500. In some embodiments, the vacuum degree of the cavity 550 can be less than 100 Pa. In some embodiments, the vacuum degree of the cavity 550 can be less than 10 Pa. -6 In some embodiments, the vacuum level of the cavity 550 may be 10 Pa to 100 Pa. -3 The vacuum level of the cavity 550 may be between 1 Pa and 100 Pa. In some embodiments, the vacuum level of the cavity 550 may be between 1 Pa and 100 Pa.

[0058] In some embodiments, the microphone 500 may include a vibration transmission unit 523. The vibration transmission unit 523 may be located between the first vibration pickup unit 5221 and the second vibration pickup unit 5222. The upper surface of the vibration transmission unit 523 is connected to the lower surface of the first vibration pickup unit 5221, and the lower surface of the vibration transmission unit 523 is connected to the upper surface of the second vibration pickup unit 5222. In some embodiments, a cavity 550 may be formed between the vibration transmission unit 523, the first vibration pickup unit 5221, and the second vibration pickup unit 5222, and the acoustic-electrical transducer 520 may be located in the cavity 550. Specifically, one end of the acoustic-electrical transducer 520 may be connected to an inner wall of the vibration transmission unit 523, and the other end of the acoustic-electrical transducer 520 may be suspended in the cavity 550. In some embodiments, the vibration pickup unit 522 (e.g., the first vibration pickup unit 5221, the second vibration pickup unit 5222) can transmit the vibration signal to the acoustic-electrical conversion element 520 through the vibration transmission unit 523. In some embodiments, the material of the vibration transmission unit 523 includes, but is not limited to, one or more of a semiconductor material, a metal material, a metal alloy, an organic material, and the like. In some embodiments, the material of the vibration transmission unit 523 and the material of the vibration pickup unit 522 may be the same or different. In some embodiments, the vibration transmission unit 523 and the vibration pickup unit 522 may be an integrally molded structure. In some embodiments, the vibration transmission unit 523 and the vibration pickup unit 522 may be structures independent of each other. In some embodiments, the vibration transmission unit 523 may be a tubular structure, a ring structure, a regular and / or irregular polygonal structure such as a square, a pentagon, and the like.

[0059] In addition, in an alternative embodiment, the vibration pickup section 522 may include only the first vibration pickup section 5221, the first vibration pickup section 5221 is connected to the housing structure 510 by its periphery, and one or more acoustoelectric transducer elements 520 may be directly or indirectly connected to the first vibration pickup section 5221. For example, the acoustoelectric transducer element 520 may be located on the upper or lower surface of the first vibration pickup section 5221, and when the number of the acoustoelectric transducer elements 520 is plural, the plural acoustoelectric transducer elements 520 are distributed at intervals on the upper or lower surface of the first vibration pickup section 5221, and the plural acoustoelectric transducer elements 520 do not contact each other. Also, for example, the acoustoelectric transducer element 520 may be connected to the first vibration pickup section 5221 by another structure (for example, the vibration transmission section 523). The first vibration pickup portion 5221 may vibrate in response to an audio signal that enters the microphone 500 through the hole portion 511, and the acoustic-electrical conversion element 520 may convert the vibration of the first vibration pickup portion 5221 or the vibration transmission portion 523 into an electrical signal.

[0060] In some embodiments, the acoustoelectric transducer elements 520 may be distributed at intervals on the inner wall of the vibration transmitting section 523. Here, the term "distributed at intervals" may refer to a horizontal direction (perpendicular to the AA direction shown in FIG. 5) or a vertical direction (AA direction shown in FIG. 5). For example, when the vibration transmitting section 523 has an annular tubular structure, the acoustoelectric transducer elements 520 may be distributed at intervals from top to bottom in the vertical direction. FIG. 6A is a schematic cross-sectional view along the AA direction of the microphone in FIG. 5. As shown in FIG. 6A, the acoustoelectric transducer elements 520 may be distributed at intervals on the inner wall of the vibration transmitting section 523 in the vertical direction, and the acoustoelectric transducer elements 520 distributed at intervals are on the same plane or substantially parallel to each other. FIG. 6B is a schematic cross-sectional view along a direction perpendicular to the AA direction of the microphone in FIG. 5. As shown in FIG. 6B, in the horizontal direction, the fixed ends of the acoustoelectric transducers 520 and the vibration transmitting part 530 may be distributed at intervals on the annular inner wall of the vibration transmitting part 523, and the fixed ends of the acoustoelectric transducers 520 and the vibration transmitting part 523 may be substantially perpendicular, and the other ends (also referred to as free ends) of the acoustoelectric transducers 520 extend toward the center of the vibration transmitting part 523 and are suspended in the cavity 550, so that the acoustoelectric transducers 520 are distributed annularly in the horizontal direction. In some embodiments, when the vibration transmitting part 523 is a polygonal tubular structure (e.g., triangular, pentagonal, hexagonal, etc.), the fixed ends of the multiple acoustoelectric transducers 520 may be distributed at intervals along each side wall of the vibration transmitting part 523 in the horizontal direction. FIG. 7A is a schematic diagram of the horizontal distribution of acoustoelectric transducers according to some embodiments of the present application. As shown in Fig. 7A, the vibration transmitting part 523 has a quadrangular structure, and the multiple acoustoelectric transducer elements 520 may be alternately distributed on the four side walls of the vibration transmitting part 523. Fig. 7B is a schematic diagram of the distribution of acoustoelectric transducer elements according to some embodiments of the present application. As shown in Fig. 7B, the vibration transmitting part 523 has a hexagonal structure, and the cantilever structures 521 with different lengths may be alternately distributed on the six side walls of the vibration transmitting part 523.A plurality of acoustoelectric transducer elements 520 are distributed at intervals on the inner wall of vibration transmitting portion 523, thereby improving the space utilization rate of cavity 550 and reducing the overall volume of microphone 500.

[0061] In addition, in the horizontal or vertical direction, the multiple acoustoelectric conversion elements 520 are not limited to being distributed at intervals on all inner walls of the vibration transmitting section 523, and the multiple acoustoelectric conversion elements 520 may be installed on one side wall or some side walls of the vibration transmitting section 523, and the multiple acoustoelectric conversion elements 520 may be located on the same horizontal plane. For example, the vibration transmitting section 523 may have a rectangular parallelepiped structure, and the multiple acoustoelectric conversion elements 520 may be installed simultaneously on one side wall, two opposing or adjacent side walls, or any three side walls of the rectangular parallelepiped structure. The distribution method of the multiple acoustoelectric conversion elements 520 can be adaptively adjusted according to the number or the size of the cavity 550, and is not further limited here.

[0062] In some embodiments, each acoustic-electrical conversion element 520 may include a cantilever structure, one end of which may be connected to an inner wall of the vibration transmission portion 523 and the other end of which may be suspended within the cavity 550.

[0063] In some embodiments, the cantilever structure may include a first electrode layer, a piezoelectric layer, a second electrode layer, an elastic layer, and a base layer. The first electrode layer, the piezoelectric layer, and the second electrode layer may be installed in order from top to bottom, the elastic layer may be located on the upper surface of the first electrode layer or the lower surface of the second electrode layer, and the base layer may be located on the upper surface or the lower surface of the elastic layer. In some embodiments, an external sound signal can enter the first acoustic cavity 530 of the microphone 500 through the hole 511 and vibrate the air in the first acoustic cavity 530. The vibration pickup unit 522 can pick up the vibration signal of the air and transmit the vibration signal to the acoustic-electrical conversion element 520 (e.g., a cantilever structure) by the vibration transmission unit 523, and the elastic layer in the cantilever structure can be deformed by the action of the vibration signal. In some embodiments, the piezoelectric layer can generate an electric signal based on the deformation of the elastic layer, and the first electrode layer and the second electrode layer can collect the electric signal. In some embodiments, the piezoelectric layer can generate a voltage (potential difference) in response to the deformation stress of the elastic layer based on the piezoelectric effect, and the first electrode layer and the second electrode layer can derive the voltage (electrical signal).

[0064] In some embodiments, the elastic layer may be a film-like structure or a block-like structure supported by one or more semiconductor materials. In some embodiments, the semiconductor materials include, but are not limited to, silicon, silicon dioxide, silicon nitride, gallium nitride, zinc oxide, silicon carbide, and the like. In some embodiments, the material of the piezoelectric layer may include piezoelectric crystal materials and piezoelectric ceramic materials. The piezoelectric crystal materials are piezoelectric single crystals. In some embodiments, the piezoelectric crystal materials are quartz, zinc blende, boron, tourmaline, zincite, GaAs, barium titanate and its derivative crystals, KH 2 PO 4 , NaKC 4 H 4 O 6 4H 2O (Rochelle salt), etc., or any combination thereof. Piezoelectric ceramic materials are piezoelectric polycrystals with randomly assembled fine grains obtained by solid-state reaction and sintering between powders of different materials. In some embodiments, the piezoelectric ceramic material may include barium titanate (BT), lead zirconate titanate (PZT), lead barium lithium niobate (PBLN), modified lead titanate (PT), aluminum nitride (AIN), zinc oxide (ZnO), etc., or any combination thereof. In some embodiments, the material of the piezoelectric layer may be a piezoelectric polymer material, such as polyvinylidene fluoride (PVDF), etc. In some embodiments, the first electrode layer and the second electrode layer may be a structure of conductive materials. Exemplary conductive materials may include metals, alloy materials, metal oxide materials, graphene, etc., or any combination thereof. In some embodiments, the metals and alloy materials may include nickel, iron, lead, platinum, titanium, copper, molybdenum, zinc, or any combination thereof. In some embodiments, the metal alloy material may include copper zinc alloy, copper tin alloy, copper nickel silicon alloy, copper chromium alloy, copper silver alloy, etc., or any combination thereof. In some embodiments, the metal oxide material may include RuO 2 , MnO 2 , PbO 2 , NiO, etc., or any combination thereof.

[0065] In some embodiments, the cantilever beam structure may include a bonding wire electrode layer (PAD layer), which may be located on the first electrode layer and the second electrode layer, and the first electrode layer and the second electrode layer are connected to an external circuit in the manner of an external bonding wire (e.g., gold wire, aluminum wire, etc.), thereby outputting a voltage signal between the first electrode layer and the second electrode layer to a back-end processing circuit. In some embodiments, the material of the bonding wire electrode layer may include copper foil, titanium, copper, etc. In some embodiments, the material of the bonding wire electrode layer and the first electrode layer (or the second electrode layer) may be the same. In some embodiments, the material of the bonding wire electrode layer and the first electrode layer (or the second electrode layer) may be different.

[0066] In some other embodiments, the cantilever structure may include at least one elastic layer, an electrode layer, and a piezoelectric layer, the elastic layer may be located on a surface of the electrode layer, and the electrode layer may be located on an upper or lower surface of the piezoelectric layer. In some embodiments, the electrode layer may include a first electrode and a second electrode. The first electrode and the second electrode may be folded into a first comb-like structure, and the first comb-like structure and the second comb-like structure may include a plurality of comb-like structures, with a certain spacing between adjacent comb-like structures of the first comb-like structure and adjacent comb-like structures of the second comb-like structure, which may be the same or different. The first comb-like structure may be interdigitated with the second comb-like structure to form an electrode layer, and the first comb-like structure may be interdigitated with the second comb-like structure to form an electrode layer. The first comb-like structure and the second comb-like structure may be interdigitated with each other to form an electrode layer. The first comb-like structure and the second comb-like structure may be interdigitated with each other to form a compact arrangement of the first electrode and the second electrode, but they do not intersect. In some embodiments, the first comb-like structure and the second comb-like structure extend along the longitudinal direction of the cantilever (e.g., from the fixed end to the free end). For further description of the elastic layer and the piezoelectric layer, please refer to FIG. 5 and its related description. In some embodiments, each cantilever structure in the different acoustoelectric transducer elements 520 may constitute a cantilever resonant system, and the resonant frequency of the system may be expressed by Equation (4).

number

[0067] In some embodiments, when the cantilever structure is a rectangular parallelepiped structure, equation (4) for calculating the resonant frequency of the cantilever resonant system can be further expressed as equation (5).

number

number

[0068] Based on the above description, in some embodiments, by installing different acoustoelectric transducer elements 520 (e.g., cantilever structures with different lengths), different acoustoelectric transducer elements 520 can have different resonant frequencies and generate different frequency responses to the vibration signal of the vibration transmission part 523. In some embodiments, by setting the parameters of the cantilever structures (e.g., length, width, thickness, material, etc.), frequency responses corresponding to different resonant frequencies can be obtained. In some embodiments, the resonant frequency corresponding to the cantilever structures may be negatively correlated with the length of the cantilever structures perpendicular to its vibration direction, i.e., the longer the length of the cantilever structures perpendicular to its vibration direction, the smaller the resonant frequency corresponding to the cantilever structures. For example, the length of the first cantilever structure 5211 perpendicular to its vibration direction in FIG. 7A is greater than the length of the second cantilever structure 5212 perpendicular to its vibration direction, and the resonant frequency corresponding to the first cantilever structure 5211 is lower than the resonant frequency corresponding to the second cantilever structure 5212. In some embodiments, at least two of the multiple resonant frequencies corresponding to different cantilever structures can be in the range of 20 Hz to 16000 Hz by adjusting the length of the cantilever structure. In some embodiments, at least two of the multiple resonant frequencies corresponding to different cantilever structures can be in the range of 100 Hz to 12000 Hz by adjusting the length of the cantilever structure. Since the cantilever structure is sensitive to vibrations in the vicinity of its resonant frequency, it may be considered that the cantilever structure has a characteristic of frequency selection for vibration signals, that is, the cantilever structure mainly converts sub-band vibration signals in the vicinity of its resonant frequency into electrical signals. Therefore, in some embodiments, by setting different lengths, different cantilever structures can have different resonant frequencies and form sub-bands in the vicinity of each resonant frequency.For example, 11 subbands may be set within the frequency range of human voice by using multiple cantilever structures, and the resonant frequencies of the cantilever structures corresponding to the 11 subbands may be 500Hz to 700Hz, 700Hz to 1000Hz, 1000Hz to 1300Hz, 1300Hz to 1700Hz, 1700Hz to 2200Hz, 2200Hz to 3000Hz, 3000Hz to 3800Hz, 3800Hz to 4700Hz, 4700Hz to 5700Hz, 5700Hz to 7000Hz, and 7000Hz to 12000Hz, respectively. Also, for example, 16 subbands may be set within the frequency range of human voice by using a plurality of cantilever structures, and the resonant frequencies of the cantilever structures corresponding to the 16 subbands may be 500Hz to 640Hz, 640Hz to 780Hz, 780Hz to 930Hz, 940Hz to 1100Hz, 1100Hz to 1300Hz, 1300Hz to 1500Hz, 1500Hz to 1750Hz, 1750Hz to 1900Hz, 1900Hz to 2350Hz, 2350Hz to 2700Hz, 2700Hz to 3200Hz, 3200Hz to 3800Hz, 3800Hz to 4500Hz, 4500Hz to 5500Hz, 5500Hz to 6600Hz, and 6600Hz to 8000Hz, respectively. Furthermore, for example, 24 subbands may be set within the frequency range of human voice by using multiple cantilever structures, and the resonant frequencies of the cantilever structures corresponding to the 24 subbands are 20Hz to 120Hz, 120Hz to 210Hz, 210Hz to 320Hz, 320Hz to 410Hz, 410Hz to 500Hz, 500Hz to 640Hz, 640Hz to 780Hz, 780Hz to 930Hz, 940Hz to 1100Hz, 1100Hz to 1300Hz, It may be 1300Hz to 1500Hz, 1500Hz to 1750Hz, 1750Hz to 1900Hz, 1900Hz to 2350Hz, 2350Hz to 2700Hz, 2700Hz to 3200Hz, 3200Hz to 3800Hz, 3800Hz to 4500Hz, 4500Hz to 5500Hz, 5500Hz to 6600Hz, 6600Hz to 7900Hz, 7900Hz to 9600Hz, 9600Hz to 12100Hz, or 12100Hz to 16000Hz.For example, the cantilever structure is rectangular parallelepiped. In some embodiments, the lengths of the cantilever structures may be adjusted differently to form at least 5 subbands in the frequency range of human voice (e.g., 20Hz-16000Hz). In some embodiments, the lengths of the cantilever structures may be adjusted differently to form 5-11 subbands in the frequency range of human voice (e.g., 20Hz-16000Hz). In some embodiments, the lengths of the cantilever structures may be adjusted differently to form 5-16 subbands in the frequency range of human voice (e.g., 20Hz-16000Hz). In some embodiments, the lengths of the cantilever structures may be adjusted differently to form 6-24 subbands in the frequency range of human voice (e.g., 20Hz-16000Hz). In addition, the acoustic-electrical transducer (or cantilever structure), the number of subbands, and the frequency range of the resonant frequency corresponding to each subband are not limited to the above description, and can be adaptively adjusted according to specific circumstances such as the application scene of the microphone and the dimensions of the microphone, and are not further limited here. In addition, the cantilever structure is not limited to the above rectangular parallelepiped shape, and the cantilever structure may have other shapes, and the cross-sectional shape of the cantilever structure may be a regular or irregular shape such as a triangle, a semicircle, a rhombus, a pentagon, a hexagon, etc., and different cantilevers can have different resonant frequencies by adjusting parameters related to the mass or rigidity of the cantilever structure.

[0069] In some embodiments, the acoustic-electrical transducer 520 of the microphone 500 can be made to resonate within a desired frequency range by further adjusting parameter information such as the structure, dimensions, and inner surface roughness of the first acoustic cavity 530 and / or the hole 511. For example, the shape, cavity volume, and inner surface roughness of the first acoustic cavity 530 can be adjusted to realize subband decomposition into vibration signals, so that the sound entering the first acoustic cavity 530 can have a specific subband frequency. For details on the fact that the microphone 500 can resonate within a desired frequency range by adjusting parameter information such as the structure, dimensions, and inner surface roughness of the first acoustic cavity 530 and / or the hole 511, reference can be made to a patent application entitled "Microphone" filed on the same date as the present application, and a description thereof will be omitted here.

[0070] FIG. 8 is a schematic diagram of a microphone according to some embodiments of the present application. As shown in FIG. 8, the microphone 800 may include a housing structure 810, an acoustic-electrical transducer element 820, and a vibration pickup unit 822. The microphone 800 shown in FIG. 8 may be the same as or similar to the microphone 500 shown in FIG. 5. For example, the housing structure 810 of the microphone 800 may be the same as or similar to the housing structure 510 of the microphone 500. Also, for example, the first acoustic cavity 830, the second acoustic cavity 840, and the cavity 850 of the microphone 800 may be the same as or similar to the first acoustic cavity 530, the second acoustic cavity 540, and the cavity 550 of the microphone 500, respectively. Further, for example, the vibration pickup section 822 (e.g., the first vibration pickup section 8221, the second vibration pickup section 8222) of the microphone 800 may be the same as or similar to the vibration pickup section 522 (e.g., the first vibration pickup section 5221, the second vibration pickup section 5222) of the microphone 500. For further structures of the microphone 800 (e.g., the hole section 811, the vibration transmission section 823, etc.), reference may be made to FIG. 5 and its related description.

[0071] In some embodiments, the main difference between the microphone 800 shown in FIG. 8 and the microphone 500 shown in FIG. 5 is that each acoustic-electrical transducer element 820 of the microphone 800 may include a first cantilever structure 8211 and a second cantilever structure 8212, where the first cantilever structure 8211 and the second cantilever structure 8212 may be regarded as two electrode plates. In some embodiments, the first cantilever structure 8211 and the second cantilever structure 8212 may be placed opposite to each other, and the first cantilever structure 8211 and the second cantilever structure 8212 have an opposing area. In some embodiments, the first cantilever structure 8211 and the second cantilever structure 8212 are vertically arranged, and the opposing area may be understood to be an area where the lower surface of the first cantilever structure 8211 faces the upper surface of the second cantilever structure 8212. In some embodiments, the first cantilever structure 8211 and the second cantilever structure 8212 may have a first distance d1. When the first cantilever structure 8211 and the second cantilever structure 8212 receive a vibration signal from the vibration transmission unit 823, they can generate deformations of different degrees in the respective vibration directions (extension directions of the first distance d1) and change the first distance d1. The first cantilever structure 8211 and the second cantilever structure 8212 can convert the received vibration signal from the vibration transmission unit 823 into an electrical signal based on the change in the first distance d1.

[0072] In order to generate different degrees of deformation in the first cantilever structure 8211 and the second cantilever structure 8212 in the vibration direction, in some embodiments, the stiffness of the first cantilever structure 8211 and the stiffness of the second cantilever structure 8212 may be different. Under the action of the vibration signal of the vibration transmission part 823, the cantilever structure with a relatively small stiffness may generate a certain degree of deformation, and the cantilever structure with a relatively large stiffness may be considered to be almost undeformed or to have a smaller amount of deformation than the cantilever structure with a relatively small stiffness. In some embodiments, when the microphone 800 is in an operating state, the cantilever structure with a relatively small stiffness (e.g., the second cantilever structure 8212) may deform in response to the vibration of the vibration transmission part 823, and the cantilever structure with a relatively large stiffness (e.g., the first cantilever structure 8211) may vibrate together with the vibration transmission part 823 without deformation, thereby changing the first distance d1.

[0073] In some embodiments, the resonant frequency of the cantilever structure with a relatively small stiffness in the acoustoelectric transducer element 820 may be in a frequency range within the hearing range of the human ear (e.g., within 12000 Hz). In some embodiments, the resonant frequency of the cantilever structure with a relatively large stiffness in the acoustoelectric transducer element 820 may be in a frequency range that is difficult for the human ear to detect (e.g., greater than 12000 Hz). In some embodiments, the stiffness of the first cantilever structure 8211 (or the second cantilever structure 8212) in the acoustoelectric transducer element 820 can be achieved by adjusting the material, length, width, or thickness, etc., of the first cantilever structure 8211 (or the second cantilever structure 8212). In some embodiments, different frequency responses corresponding to different resonant frequencies are obtained by adjusting the parameters (e.g., the material, thickness, length, width, etc., of the cantilever structure) of each set of cantilever structures corresponding to different acoustoelectric transducer elements 820. In some embodiments, at least two of the multiple resonant frequencies corresponding to the different acoustoelectric transducer elements 820 may be within a range of 20 Hz to 16000 Hz by adjusting the length of each pair of cantilever structures (e.g., the first cantilever structure 8211 and the second cantilever structure 8212) corresponding to the different acoustoelectric transducer elements 820. In some embodiments, at least two of the multiple resonant frequencies corresponding to the different acoustoelectric transducer elements 820 may be within a range of 100 Hz to 1200 Hz by adjusting the length of each pair of cantilever structures (e.g., the first cantilever structure 8211 and the second cantilever structure 8212) corresponding to the different acoustoelectric transducer elements 820. Since the set of cantilever structures corresponding to the acoustoelectric conversion element 820 (e.g., the first cantilever structure 8211 and the second cantilever structure 8212) are sensitive to vibrations near their resonant frequency, the set of cantilever structures corresponding to the acoustoelectric conversion element 820 may be considered to have frequency-selective properties for vibration signals, i.e., the set of cantilever structures corresponding to the acoustoelectric conversion element 820 mainly converts sub-band vibration signals that are near their resonant frequency into electrical signals.Therefore, in some embodiments, by setting different lengths, the multiple sets of cantilever structures corresponding to different acoustoelectric transducer elements 820 have different resonance frequencies, and subbands can be formed in the vicinity of each resonance frequency. In some embodiments, at least five subbands may be set within the frequency range of human voice (e.g., 20 Hz to 16000 Hz) by the multiple sets of cantilever structures. For example, 11 subbands may be set within the frequency range of human voice by using multiple sets of cantilever structures, and the resonant frequencies of the sets of cantilever structures corresponding to the 11 subbands may be 500Hz to 700Hz, 700Hz to 1000Hz, 1000Hz to 1300Hz, 1300Hz to 1700Hz, 1700Hz to 2200Hz, 2200Hz to 3000Hz, 3000Hz to 3800Hz, 3800Hz to 4700Hz, 4700Hz to 5700Hz, 5700Hz to 7000Hz, and 7000Hz to 12000Hz, respectively. Also, for example, 16 subbands may be set within the frequency range of human voice by using multiple sets of cantilever structures, and the resonant frequencies of the sets of cantilever structures corresponding to the 16 subbands may be 500Hz to 640Hz, 640Hz to 780Hz, 780Hz to 930Hz, 940Hz to 1100Hz, 1100Hz to 1300Hz, 1300Hz to 1500Hz, 1500Hz to 1750Hz, 1750Hz to 1900Hz, 1900Hz to 2350Hz, 2350Hz to 2700Hz, 2700Hz to 3200Hz, 3200Hz to 3800Hz, 3800Hz to 4500Hz, 4500Hz to 5500Hz, 5500Hz to 6600Hz, and 6600Hz to 8000Hz, respectively.Furthermore, for example, 24 subbands may be set within the frequency range of human voice by using multiple sets of cantilever structures, and the resonant frequencies of the sets of cantilever structures corresponding to the 24 subbands are 20Hz to 120Hz, 120Hz to 210Hz, 210Hz to 320Hz, 320Hz to 410Hz, 410Hz to 500Hz, 500Hz to 640Hz, 640Hz to 780Hz, 780Hz to 930Hz, 940Hz to 1100Hz, 1100Hz to 1300Hz, respectively. z, 1300Hz to 1500Hz, 1500Hz to 1750Hz, 1750Hz to 1900Hz, 1900Hz to 2350Hz, 2350Hz to 2700Hz, 2700Hz to 3200Hz, 3200Hz to 3800Hz, 3800Hz to 4500Hz, 4500Hz to 5500Hz, 5500Hz to 6600Hz, 6600Hz to 7900Hz, 7900Hz to 9600Hz, 9600Hz to 12100Hz, 12100Hz to 16000Hz. In some embodiments, by adjusting the lengths of the multiple sets of cantilever structures differently, different acoustoelectric transducer elements 820 may form 5 to 50 subbands within the frequency range of human voice (e.g., 20Hz to 16000Hz). Preferably, the lengths of the multiple cantilever structures are set to be different, so that the multiple cantilever structures may form 6 to 24 subbands within the frequency range of human voice (eg, 20 Hz to 16000 Hz).

[0074] Fig. 9 is a schematic diagram of a frequency response curve of a microphone according to some embodiments of the present application. As shown in Fig. 9, the horizontal axis represents frequency in Hz, and the vertical axis represents frequency response of an audio signal output from the microphone in dB. Here, the microphone may be microphone 500, microphone 800, microphone 1000, microphone 1100, microphone 1300, microphone 1400, microphone 1500, microphone 1800, microphone 1900, microphone 2000, etc. Each dashed line in Fig. 9 may represent a frequency response curve corresponding to each acoustic-electrical conversion element of the microphone. As can be seen from each frequency response curve in FIG. 9, each acoustoelectric transducer element has its own resonant frequency (for example, the resonant frequency of frequency response curve 920 is about 350 Hz, and the resonant frequency of frequency response curve 930 is about 1500 Hz), and when an external audio signal is transmitted to the microphone, each acoustoelectric transducer element is more sensitive to vibration signals in the vicinity of its own resonant frequency, so that the electric signal output from each acoustoelectric transducer element mainly includes a subband signal corresponding to its resonant frequency. In some embodiments, the output at the resonant peak of each acoustoelectric transducer element is much larger than the output at its own flat region, and by selecting a frequency band close to the resonant peak in the frequency response curve of each acoustoelectric transducer member, subband division of the full-band signal corresponding to the audio signal can be realized. In some embodiments, by fusing each frequency response curve in FIG. 9, a microphone frequency response curve 910 with a higher signal-to-noise ratio and a flatter frequency response curve can be obtained. In addition, by installing different acoustic-electrical conversion elements (cantilever structures), it is possible to add resonance peaks in different frequency ranges in the microphone system, thereby improving the sensitivity in the vicinity of multiple resonance peaks of the microphone and further improving the sensitivity over the entire wide frequency band of the microphone.

[0075] By installing multiple acoustoelectric transducer elements in a microphone and utilizing the fact that the acoustoelectric transducer elements (e.g., cantilever structure) have different resonant frequency characteristics, filtering and band decomposition of vibration signals can be realized, thereby avoiding the problems of complex filter circuits in microphones, large amounts of computing resources occupied by software algorithms, signal distortion, and noise contamination, and further reducing the complexity and manufacturing costs of the microphone.

[0076] FIG. 10 is a schematic diagram of a microphone according to some embodiments of the present application. As shown in FIG. 10, the microphone 1000 may include a housing structure 1010, an acoustic-electrical transducer element 1020, and a vibration pickup unit 1022. The microphone 1000 shown in FIG. 10 may be the same as or similar to the microphone 500 shown in FIG. 5. For example, the housing structure 1010 of the microphone 1000 may be the same as or similar to the housing structure 510 of the microphone 500. Also, for example, the first acoustic cavity 1030, the second acoustic cavity 1040, and the cavity 1050 of the microphone 1000 may be the same as or similar to the first acoustic cavity 530, the second acoustic cavity 540, and the cavity 550 of the microphone 500, respectively. Further, for example, the vibration pickup section 1022 (e.g., the first vibration pickup section 10221, the second vibration pickup section 10222) of the microphone 1000 may be the same as or similar to the vibration pickup section 522 (e.g., the first vibration pickup section 5221, the second vibration pickup section 5222) of the microphone 500. For further structures of the microphone 1000 (e.g., the hole section 1011, the vibration transmission section 1023, the acoustic-electrical conversion element 1020, etc.), reference may be made to FIG. 5 and its related description.

[0077] In some embodiments, the main difference between the microphone 1000 shown in FIG. 10 and the microphone 500 shown in FIG. 5 is that the microphone 1000 may include one or more membrane structures 1060. In some embodiments, the membrane structure 1060 may be located on the upper surface and / or the lower surface of the acoustic-electrical transducer element 1020. For example, the membrane structure 1060 may be a single-layer membrane structure located on the upper surface or the lower surface of the acoustic-electrical transducer element 1020. Also, for example, the membrane structure 1060 may be a double-layer membrane including a first membrane structure located on the upper surface of the acoustic-electrical transducer element 1020 and a second membrane structure located on the lower surface of the acoustic-electrical transducer element 1020. By placing the membrane structure 1060 on the surface of the acoustic-electrical transducer element 1020, the resonant frequency of the acoustic-electrical transducer element 1020 can be adjusted, and in some embodiments, the resonant frequency of the acoustic-electrical transducer element 1020 can be influenced by adjusting the material, dimensions (e.g., length, width), thickness, etc. of the membrane structure 1060. By adjusting the parameter information (e.g., material, dimensions, thickness, etc.) of the membrane structure 1060 and the acoustoelectric conversion element 1020 (e.g., cantilever structure), each acoustoelectric conversion element 1020 can generate resonance within a desired frequency range. Meanwhile, by installing the membrane structure 1060 on the surface of the acoustoelectric conversion element 1020, damage to the acoustoelectric conversion element 1020 due to overload of the microphone 1000 can be avoided, and the reliability of the microphone 1000 can be improved. In addition, by installing the membrane structure 1060 on the surface of the acoustoelectric conversion element 1020, the deformation amount of the microphone 1000 due to stress can be reduced, and the actual product can be more suitable for the design goal.

[0078] In some embodiments, the membrane structure 1060 may cover the entire upper surface and / or the lower surface of the acoustoelectric transducer element 1020 or may cover only a part of the upper surface and / or the lower surface of the acoustoelectric transducer element 1020. For example, the upper surface or the lower surface of each acoustoelectric transducer element 1020 is covered by the corresponding membrane structure 1060, and the membrane structure 1060 may cover the entire upper surface or the lower surface of the corresponding acoustoelectric transducer element 1020, or the membrane structure 1060 may cover only a part of the upper surface or the lower surface of the corresponding acoustoelectric transducer element 1020. Also, for example, when viewed in the horizontal direction, when a plurality of acoustoelectric transducer elements 1020 are simultaneously positioned on the same horizontal plane, one membrane structure 1060 may cover the entire upper surface or the lower surface of a plurality of acoustoelectric transducer elements 1020 simultaneously positioned on the same horizontal plane, and here, for example, the membrane structure 1060 is connected to the inner wall of the vibration transmitting part 1023 by its periphery, thereby dividing the cavity 1050 into two cavities, an upper cavity and an lower cavity, which are independent of each other. Furthermore, for example, the shape of the membrane structure 1060 may be the same as the cross-sectional shape of the vibration transmission part 1023, the membrane structure 1060 may be connected to the inner wall of the vibration transmission part 1023 at its periphery, the middle part of the membrane structure 1060 may include one hole (not shown in FIG. 10), the membrane structure 1060 may simultaneously partially cover the upper or lower surfaces of multiple acoustoelectric conversion elements 1020 on the same horizontal plane, and may divide the cavity 1050 into two cavities, an upper one and an lower one, which are connected to each other.

[0079] In some embodiments, the material of the membrane structure 1060 includes one or more of, but is not limited to, a semiconductor material, a metal material, a metal alloy, an organic material, and the like. In some embodiments, the semiconductor material includes, but is not limited to, silicon, silicon dioxide, silicon nitride, silicon carbide, and the like. In some embodiments, the metal material includes, but is not limited to, copper, aluminum, chromium, titanium, gold, and the like. In some embodiments, the metal alloy includes, but is not limited to, copper aluminum alloy, copper gold alloy, titanium alloy, aluminum alloy, and the like. In some embodiments, the organic material includes, but is not limited to, polyimide, parylene, PDMS, silicon gel, silica gel, and the like.

[0080] Fig. 11 is a schematic diagram of a microphone according to some embodiments of the present application. The microphone 1100 shown in Fig. 11 may be the same as or similar to the microphone 800 shown in Fig. 8. For example, the housing structure 1110 of the microphone 1100 may be the same as or similar to the housing structure 810 of the microphone 800. Also, for example, the first acoustic cavity 1130, the second acoustic cavity 1140, and the cavity 1150 of the microphone 1100 may be the same as or similar to the first acoustic cavity 830, the second acoustic cavity 840, and the cavity 850 of the microphone 800, respectively. Further, for example, the vibration pickup section 1122 (e.g., the first vibration pickup section 11221, the second vibration pickup section 11222) of the microphone 1100 may be the same as or similar to the vibration pickup section 822 (e.g., the first vibration pickup section 8221, the second vibration pickup section 8222) of the microphone 800. For further structures of the microphone 1100 (e.g., the hole section 1111, the vibration transmission section 1123, the acoustic-electrical conversion element 1120, etc.), reference may be made to FIG. 8 and its related description.

[0081] In some embodiments, the main difference between the microphone 1100 shown in FIG. 11 and the microphone 800 shown in FIG. 8 is that the microphone 1100 may include one or more membrane structures 1160. In some embodiments, the membrane structure 1160 may be located on the upper surface and / or the lower surface of a cantilever structure having a relatively low stiffness (e.g., the second cantilever structure 11212) of the acoustic-electrical transducer element 1120. For example, the membrane structure 1160 may be a single-layer membrane structure located on the upper surface or the lower surface of the second cantilever structure 11212. Also, for example, the membrane structure 1160 may be a double-layer membrane including a first membrane structure located on the upper surface of the second cantilever structure 11212 and a second membrane structure located on the lower surface of the second cantilever structure 11212. In some embodiments, the membrane structure 1160 may fully or partially cover the upper surface and / or the lower surface of the second cantilever structure 11212. For example, the upper or lower surface of each second cantilever structure 11212 is covered with a corresponding membrane structure 1160, which may fully cover the upper or lower surface of the corresponding second cantilever structure 11212, or the membrane structure 1160 may partially cover the upper or lower surface of the corresponding second cantilever structure 11212. For further details of the membrane structure 1160 fully or partially covering the upper and lower surfaces of the second cantilever structure 11212, reference may be made to FIG. 10 and its related description.

[0082] In some embodiments, the membrane structure 1160 may be located on the upper and / or lower surface of a cantilever structure having a relatively large stiffness (e.g., the first cantilever structure 11211) of the acoustoelectric transducer element 1120. The form in which the membrane structure 1160 is located on the upper and / or lower surface of the first cantilever structure 11211 is similar to the form in which the membrane structure 1160 is located on the upper and / or lower surface of the second cantilever structure 11212, and a description thereof will be omitted here.

[0083] In some embodiments, the membrane structure 1160 may be located on the upper surface and / or the lower surface of the cantilever structure having a relatively low stiffness (e.g., the second cantilever structure 11212) of the acoustoelectric transducer element 1120 and on the upper surface and / or the lower surface of the cantilever structure having a relatively high stiffness (e.g., the first cantilever structure 11211). For example, FIG. 12 is a schematic structural diagram of a microphone according to some embodiments of the present application, and as shown in FIG. 12, the membrane structure 1160 is located on the upper surface of the first cantilever structure 11211 and on the lower surface of the second cantilever structure 11212 at the same time. In some embodiments, by installing the membrane structure 1160 on the upper surface and / or the lower surface of the cantilever structure having a relatively high stiffness (e.g., the first cantilever structure 11211), deformation of the vibration transmission part 1123 of the cantilever structure having a relatively high stiffness can be prevented, and the sensitivity of the microphone 1100 can be improved. On the other hand, by installing a membrane structure 1060 on the surface of the second cantilever structure 11212 or the first cantilever structure 11211, the amount of deformation of the second cantilever structure 11212 or the first cantilever structure 11211 due to stress can be adjusted, and the distance between the second cantilever structure 11212 and the first cantilever structure 11211 can be accurately controlled.

[0084] FIG. 13 is a schematic diagram of a microphone according to some embodiments of the present application. As shown in FIG. 13, the microphone 1300 may include a housing structure 1310, an acoustic-electrical transducer element 1320, and a vibration pickup unit 1322. The microphone 1300 shown in FIG. 13 may be the same as or similar to the microphone 500 shown in FIG. 5. For example, the housing structure 1310 of the microphone 1300 may be the same as or similar to the housing structure 510 of the microphone 500. Also, for example, the first acoustic cavity 1330, the second acoustic cavity 1340, and the cavity 1350 of the microphone 1300 may be the same as or similar to the first acoustic cavity 530, the second acoustic cavity 540, and the cavity 550 of the microphone 500, respectively. For further structure of the microphone 1300 (eg, the hole 1311, the vibration transmitting portion 1323, the acoustic-electrical conversion element 1320, etc.), please refer to FIG. 5 and its related description.

[0085] In some embodiments, the main difference between the microphone 1300 shown in Fig. 13 and the microphone 500 shown in Fig. 5 is the vibration pickup unit 1322. In some embodiments, the vibration pickup unit 1322 may include a first vibration pickup unit 13221, a second vibration pickup unit 13222, and a third vibration pickup unit 13223. In some embodiments, the first vibration pickup unit 13221, the vibration transmission unit 1323, and the second vibration pickup unit 13222 are installed in order from top to bottom, specifically, the lower surface of the first vibration pickup unit 13221 is connected to the upper surface of the vibration transmission unit 1323, the upper surface of the second vibration pickup unit 13222 is connected to the lower surface of the vibration transmission unit 1323, and a cavity 1350 may be defined between the first vibration pickup unit 13221, the second vibration pickup unit 13222, and the vibration transmission unit 1323, and the acoustic-electrical conversion element 1320 is located in the cavity 1350. In some embodiments, the third vibration pickup unit 13223 is connected between the vibration transmission unit 1323 and the inner wall of the housing structure 1310. When the microphone 1300 is in operation, an audio signal enters the first acoustic cavity 1330 through the hole 1311 and acts on the vibration pickup section 1322, causing the third vibration pickup section 13223 to vibrate, and the third vibration pickup section 13223 transmits the vibration to the acoustic-electrical conversion element 1320 via the vibration transmission section 1323.

[0086] In some embodiments, the third vibration pickup unit 13223 may include one or more thin film structures, which are compatible with the vibration transmission unit 1323 and the housing structure 1310. For example, when the housing structure 1310 and the vibration transmission unit 1323 are both cylindrical structures, the third vibration pickup unit 13223 may be an annular thin film structure, the outer wall of the annular thin film structure is connected to the housing structure 1310, and the inner wall of the annular thin film structure is connected to the vibration transmission unit 1323. Also, for example, when the housing structure 1310 is a cylindrical structure and the vibration transmission unit 1323 is a rectangular parallelepiped structure, the third vibration pickup unit 13223 may be a circular thin film structure having a rectangular hole in the center, the outer wall of the thin film structure is connected to the housing structure 1310, and the inner wall of the thin film structure is connected to the vibration transmission unit 1323. In addition, the shape of the third vibration pickup unit 13223 is not limited to the aforementioned ring and rectangle, but may be other shapes, for example, a thin film structure of regular and / or irregular shapes such as pentagons, hexagons, etc., and the shape and structure of the third vibration pickup unit 13223 can be adaptively adjusted according to the shapes of the housing structure 1310 and the vibration transmission unit 1323.

[0087] In some embodiments, the material of the third vibration pickup unit 13223 includes, but is not limited to, one or more of a semiconductor material, a metal material, a metal alloy, an organic material, and the like. In some embodiments, the semiconductor material includes, but is not limited to, silicon, silicon dioxide, silicon nitride, silicon carbide, and the like. In some embodiments, the metal material includes, but is not limited to, copper, aluminum, chromium, titanium, gold, and the like. In some embodiments, the metal alloy includes, but is not limited to, a copper aluminum alloy, a copper gold alloy, a titanium alloy, an aluminum alloy, and the like. In some embodiments, the organic material includes, but is not limited to, a polyimide, a parylene, a PDMS, a silicon gel, a silica gel, and the like.

[0088] In some embodiments, the material of the first vibration pickup unit 13221 and / or the material of the second vibration pickup unit 13222 may be a flexible material. The material of the first vibration pickup unit 13221 and the second vibration pickup unit 13222 and the material of the third vibration pickup unit 13223 may all be flexible materials. In this case, the first vibration pickup unit 13221 and the second vibration pickup unit 13222 can be deformed by the action of air vibration in the first acoustic cavity 1330 as a part of the vibration pickup unit 1322 (i.e., the first vibration pickup unit 13221 and the second vibration pickup unit 13222 are used to pick up a vibration signal). In some embodiments, the material of the first vibration pickup unit 13221 and the material of the second vibration pickup unit 13222 may be a rigid material. In this case, the first vibration pickup unit 13221 and the second vibration pickup unit 13222 are not deformed by the action of air vibration in the first acoustic cavity 1330. In some embodiments, since the first vibration pickup unit 13221 and the second vibration pickup unit 13222 are made of a rigid material, the volume of the cavity 1350 can be kept essentially constant when the microphone 1300 is in operation, which can avoid the influence of the volume change of the cavity 1350 on the acoustoelectric transducer 1320, and further ensure that the acoustoelectric transducer 1320 generates resonance within a desired frequency range.

[0089] In some embodiments, the microphone 1300 may include at least one membrane structure (not shown), and the at least one membrane structure may be located on the upper surface and / or the lower surface of the acoustic-electrical conversion element 1320. For details of the at least one membrane structure, reference may be made to FIG. 10 and its related description, and the description will be omitted here.

[0090] FIG. 14 is a schematic diagram of a microphone according to some embodiments of the present application. As shown in FIG. 14, the microphone 1400 may include a housing structure 1410, an acoustic-electrical transducer element 1420, and a vibration pickup unit 1422. The microphone 1400 shown in FIG. 14 may be the same as or similar to the microphone 800 shown in FIG. 8. For example, the housing structure 1410 of the microphone 1400 may be the same as or similar to the housing structure 810 of the microphone 800. Also, for example, the first acoustic cavity 1430, the second acoustic cavity 1440, and the cavity 1450 of the microphone 1400 may be the same as or similar to the first acoustic cavity 830, the second acoustic cavity 840, and the cavity 850 of the microphone 800, respectively. For further structure of the microphone 1400 (eg, the hole 1411, the vibration transmitting portion 1423, the acoustic-electrical conversion element 1420, etc.), please refer to FIG. 8 and its related description.

[0091] In some embodiments, the main difference between the microphone 1400 shown in Fig. 14 and the microphone 800 shown in Fig. 8 is the vibration pickup unit 1422. In some embodiments, the vibration pickup unit 1422 may include a first vibration pickup unit 14221, a second vibration pickup unit 14222, and a third vibration pickup unit 14223. In some embodiments, the first vibration pickup unit 14221, the vibration transmission unit 1423, and the second vibration pickup unit 14222 are installed in order from top to bottom, specifically, the lower surface of the first vibration pickup unit 14221 may be connected to the upper surface of the vibration transmission unit 1423, the upper surface of the second vibration pickup unit 14222 may be connected to the lower surface of the vibration transmission unit 1423, and a cavity 1450 may be defined between the first vibration pickup unit 14221, the second vibration pickup unit 14222, and the vibration transmission unit 1423, and the acoustic-electrical transducer 1420 is located in the cavity 1450. In some embodiments, the third vibration pickup unit 14223 is connected between the vibration transmission unit 1423 and the inner wall of the housing structure 1410. When the microphone 1400 is operated, the audio signal can enter the first acoustic cavity 1430 through the hole 1411 and act on the third vibration pickup unit 14223 to vibrate it, and the third vibration pickup unit 14223 transmits the vibration to the acoustic-electrical conversion element 1420 via the vibration transmission unit 1423. For details of the third vibration pickup unit 14223, please refer to FIG. 13 and its related description, and the description will be omitted here.

[0092] In some embodiments, the microphone 1400 may include at least one membrane structure (not shown), and the at least one membrane structure may be located on the upper surface and / or the lower surface of the acoustic-electrical conversion element 1420. For details of the at least one membrane structure, reference may be made to Figures 10 to 12 and the related descriptions, and the description will be omitted here.

[0093] FIG. 15 is a schematic diagram of a microphone according to some embodiments of the present application. As shown in FIG. 15, the microphone 1500 may include a housing structure 1510, an acoustic-electrical transducer element 1520, and a vibration pickup unit 1522. The microphone 1500 shown in FIG. 15 may be the same as or similar to the microphone 1300 shown in FIG. 13. For example, the housing structure 1510 of the microphone 1500 may be the same as or similar to the housing structure 1310 of the microphone 1300. Also, for example, the first acoustic cavity 1530, the second acoustic cavity 1540, and the cavity 1550 of the microphone 1500 may be the same as or similar to the first acoustic cavity 1330, the second acoustic cavity 1340, and the cavity 1350 of the microphone 1300, respectively. Further, for example, the vibration pickup section 1522 (e.g., the first vibration pickup section 15221, the second vibration pickup section 15222, and the third vibration pickup section 15223) of the microphone 1500 may be the same as or similar to the vibration pickup section 1322 (e.g., the first vibration pickup section 13221, the second vibration pickup section 13222, and the third vibration pickup section 13223) of the microphone 1300. For further structures of the microphone 1500 (e.g., the hole section 1511, the vibration transmission section 1523, the acoustic-electrical conversion element 1520, etc.), reference may be made to FIG. 13 and its related description.

[0094] In some embodiments, the main difference between the microphone 1500 shown in Fig. 15 and the microphone 1300 shown in Fig. 13 is that the microphone 1500 may include one or more support structures 1560. In some embodiments, the support structure 1560 may be installed in the cavity 1550, and the upper surface of the support structure 1560 may be connected to the lower surface of the first vibration pickup unit 15221, and the lower surface of the support structure 1560 may be connected to the upper surface of the second vibration pickup unit 15222. By installing the support structure 1560 in the cavity and connecting the support structure 1560 to the first vibration pickup unit 15221 and the second vibration pickup unit 15222, respectively, the rigidity of the first vibration pickup unit 15221 and the second vibration pickup unit 15222 can be further improved, the first vibration pickup unit 15221 and the second vibration pickup unit 15222 can be prevented from being deformed by the influence of air vibrations in the first acoustic cavity 1530, and the vibration mode of the internal elements of the microphone 1500 (e.g., the first vibration pickup unit 15221 and the second vibration pickup unit 15222) can be reduced. Meanwhile, by connecting the support structure 1560 to the first vibration pickup unit 15221 and the second vibration pickup unit 15222, respectively, the reliability of the microphone 1500 in the case of overload can also be improved.

[0095] In some embodiments, the shape of the support structure 1560 may be a regular and / or irregular structure, such as a plate-like structure, a cylinder, a truncated cone, a rectangular parallelepiped, a truncated pyramid, a hexahedron, etc. In some embodiments, the material of the support structure 1560 includes, but is not limited to, one or more of a semiconductor material, a metal material, a metal alloy, an organic material, etc. In some embodiments, the semiconductor material includes, but is not limited to, silicon, silicon dioxide, silicon nitride, silicon carbide, etc. In some embodiments, the metal material includes, but is not limited to, copper, aluminum, chromium, titanium, gold, etc. In some embodiments, the metal alloy includes, but is not limited to, copper aluminum alloy, copper gold alloy, titanium alloy, aluminum alloy, etc. In some embodiments, the organic material includes, but is not limited to, polyimide, parylene, PDMS, silicon gel, silica gel, etc.

[0096] As shown in FIG. 15, in some embodiments, the second distance d2 between the free end of the acoustoelectric transducer element 1520 (i.e., the end suspended in the cavity 1550) and the support structure 1560 is set to 2 um or more, thereby preventing the acoustoelectric transducer element 1520 from colliding with the support structure 1560 during vibration. Also, when the second distance d2 is small (e.g., the second distance d2 is 20 um or less), the volume of the entire microphone 1500 can be effectively reduced. In some embodiments, the second distance d2 between the free end of each acoustoelectric transducer element 1520 (e.g., cantilever structures with different lengths) and the support structure 1560 may be different. In some embodiments, by designing the support structures 1560 with different shapes and dimensions and adjusting the positions of the support structures 1560, the multiple acoustoelectric transducer elements 1520 (e.g., cantilever structures) can be closely arranged in the cavity 1550, and the overall size of the microphone 1500 can be reduced. 16A and 16B are schematic cross-sectional views of a microphone according to some embodiments of the present application in different directions. As shown in FIG. 16A and FIG. 16B, when the support structure 1560 is an elliptical cylinder, the support structure 1560, the vibration transmission part, and the vibration pickup part define an annular or approximately annular cavity in the cavity 1550, and the multiple acoustoelectric transducer elements 1520 are located in the cavity and are distributed at intervals along the periphery of the support structure 1560. In some embodiments, the support structure 1560 may be located at the center position of the cavity 1550. For example, FIG. 17A is a schematic cross-sectional view of a microphone according to some embodiments of the present application. As shown in FIG. 17A, the support structure 1560 is located at the center position of the cavity 1550. Here, the center position may be the geometric center of the cavity 1550. In some embodiments, the support structure 1560 may be disposed in the cavity 1550 at a position adjacent to one end of the vibration transmitting portion 1523. For example, FIG. 17B is a schematic cross-sectional view of a microphone according to some embodiments of the present application, and as shown in FIG. 17B, the support structure 1560 is disposed in the cavity 1550 at a position adjacent to a side wall L of the vibration transmitting portion 1523.The shape, arrangement, position, material, etc. of the support structure 1560 can be adaptively adjusted according to the length, number, distribution, etc. of the acoustoelectric conversion element 1520, and are not further limited here.

[0097] In some embodiments, the microphone 1500 may include at least one membrane structure (not shown), which may be disposed on the upper surface and / or the lower surface of the acoustic-electrical transducer element 1520. In some embodiments, a hole for the support structure 1560 to pass through may be disposed at the center of the membrane structure, and the hole may be the same as or different from the cross-sectional shape of the support structure. In some embodiments, the peripheral side wall of the support structure 1560 may be partially connected to the peripheral side of the hole in the membrane structure, or may not be partially connected to the peripheral side of the hole in the membrane structure. For further description of the shape, material, structure, etc. of the membrane structure, reference may be made to FIG. 10 and its related description.

[0098] In addition, the support structure may be applied to microphones in other embodiments, such as the microphone 500 shown in Figure 5, the microphone 800 shown in Figure 8, the microphone 1000 shown in Figure 10, the microphone 1100 shown in Figure 11, and the microphone 1200 shown in Figure 12. When the support structure is applied to other microphones, the shape, position, and material of the support structure can be adaptively adjusted according to specific circumstances.

[0099] FIG. 18 is a schematic diagram of a microphone according to some embodiments of the present application. As shown in FIG. 18, the microphone 1800 may include a housing structure 1810, an acoustic-electrical transducer element 1820, and a vibration pickup unit 1822. The microphone 1800 shown in FIG. 18 may be the same as or similar to the microphone 1400 shown in FIG. 14. For example, the housing structure 1810 of the microphone 1800 may be the same as or similar to the housing structure 1410 of the microphone 1400. Also, for example, the first acoustic cavity 1830, the second acoustic cavity 1840, and the cavity 1850 of the microphone 1800 may be the same as or similar to the first acoustic cavity 1430, the second acoustic cavity 1440, and the cavity 1450 of the microphone 1400, respectively. Further, for example, the vibration pickup section 1822 (e.g., the first vibration pickup section 18221, the second vibration pickup section 18222, and the third vibration pickup section 18223) of the microphone 1800 may be the same as or similar to the vibration pickup section 1422 (e.g., the first vibration pickup section 14221, the second vibration pickup section 14222, and the third vibration pickup section 14223) of the microphone 1400. For further structures of the microphone 1800 (e.g., the hole section 1811, the vibration transmission section 1823, the acoustic-electrical conversion element 1820, etc.), reference may be made to FIG. 14 and its related description.

[0100] In some embodiments, the main difference between the microphone 1800 shown in FIG. 18 and the microphone 1400 shown in FIG. 14 is that the microphone 1800 may include a support structure 1860. In some embodiments, the upper surface of the support structure 1860 may be connected to the lower surface of the first vibration pickup unit 18221, and the lower surface of the support structure 1860 may be connected to the upper surface of the second vibration pickup unit 18222. In some embodiments, the free ends (i.e., the ends suspended in the cavity 1850) of the at least two acoustoelectric transducer elements 1820 and the support structure 1860 may have a second distance d2. For further description of the support structure 1860, reference may be made to FIG. 15 and its related description.

[0101] In some embodiments, the microphone 1800 may include at least one membrane structure (not shown), and reference may be made to Figures 11, 12, and 15 and their associated descriptions for a detailed description of the at least one membrane structure of the microphone 1800, including the support structure 1860.

[0102] It should be noted that the support structure in this embodiment is not limited to the microphone described in Figures 15 and 18, and the support structure may be applied to microphones described in other embodiments, such as the microphones in Figures 5, 8, 10, 11, and 12, and is not limited here.

[0103] 19 is a schematic diagram of a microphone according to some embodiments of the present application. In some embodiments, the microphone may be a bone conduction microphone, and as shown in FIG. 19, the bone conduction microphone 1900 may include a housing structure 1910, an acoustic-electrical transducer 1920, and a vibration pickup unit 1922. The components of the bone conduction microphone 1900 shown in FIG. 19, such as the acoustic-electrical transducer 1920, the first acoustic cavity 1930, the second acoustic cavity 1940, the cavity 1950, the vibration transmission unit 1923, the support structure 1960, etc., may be the same as or similar to the components of the microphone 1500 shown in FIG. 15.

[0104] In some embodiments, the difference between the bone conduction microphone 1900 and the microphone 1500 shown in FIG. 15 is that the vibration pickup method is different, in which the vibration pickup unit 1522 (e.g., the first vibration pickup unit 15221, the second vibration pickup unit 15222, the third vibration pickup unit 15223) of the microphone 1500 picks up the air vibration signal transmitted into the first acoustic cavity 1530 through the hole 1511, while the housing structure 1910 of the bone conduction microphone 1900 does not include a hole, and the bone conduction microphone 1900 generates a vibration signal in response to the vibration of the housing structure 1910 by the vibration pickup unit 1922 (e.g., the third vibration pickup unit 19223). Specifically, the housing structure 1910 can vibrate based on an external audio signal, and the third vibration pickup unit 19223 can generate a vibration signal in response to the vibration of the housing structure 1910 and transmit the vibration signal to the acoustoelectric conversion element 1920 via the vibration transmission unit 1923, and the acoustoelectric conversion element 1920 converts the vibration signal into an electrical signal and outputs it.

[0105] 20 is a schematic diagram of a microphone according to some embodiments of the present application. As shown in FIG. 20, a bone conduction microphone 2000 may include a housing structure 2010, an acoustoelectric transducer 2020, and a vibration pickup unit 2022. The components of the bone conduction microphone 2000 shown in FIG. 20, such as the acoustoelectric transducer 2020, the first acoustic cavity 2030, the second acoustic cavity 2040, the cavity 2050, the vibration transmission unit 2023, the support structure 2060, etc., may be the same as or similar to the components of the microphone 1800 shown in FIG. 18.

[0106] In some embodiments, the difference between the bone conduction microphone 2000 and the microphone 1800 shown in FIG. 18 is that the vibration pickup method is different: the vibration pickup unit 1822 (e.g., the first vibration pickup unit 18221, the second vibration pickup unit 18222, the third vibration pickup unit 18223) of the microphone 1800 picks up the air vibration signal transmitted into the first acoustic cavity 1830 through the hole 1811, while the housing structure 2010 of the bone conduction microphone 2000 does not include a hole, and the bone conduction microphone 2000 generates a vibration signal in response to the vibration of the housing structure 2010 by the vibration pickup unit 2022 (e.g., the third vibration pickup unit 20223). In some embodiments, the housing structure 2010 can vibrate based on an external audio signal, and the third vibration pickup unit 20223 can generate a vibration signal in response to the vibration of the housing structure 2010 and transmit the vibration signal to the acoustic-electrical conversion element 2020 via the vibration transmission unit 2023, and the acoustic-electrical conversion element 2020 converts the vibration signal into an electrical signal and outputs it.

[0107] Note that the microphone 500 shown in Fig. 5, the microphone 800 shown in Fig. 8, the microphone 1000 shown in Fig. 10, the microphone 1100 shown in Fig. 11, and the microphone 1200 shown in Fig. 12 may be used as bone conduction microphones. For example, the microphone may not have a hole, the housing structure vibrates based on an external audio signal, the first vibration pickup unit or the second vibration pickup unit generates a vibration signal in response to the vibration of the housing structure, and transmits the vibration to the acoustoelectric conversion element by the vibration transmission unit, and the acoustoelectric conversion element converts the vibration signal into an electric signal and outputs it.

[0108] Although the basic concept has been described above, it is clear to those skilled in the art that the detailed disclosure above is merely presented as an example and is not intended to limit the present application. Although not expressly described herein, those skilled in the art may make various changes, improvements and modifications to the present application. These changes, improvements and modifications are intended to be suggested by the present application and therefore are within the spirit and scope of the exemplary embodiments of the present application.

[0109] Furthermore, certain terms are used herein to describe embodiments of the present application. For example, "one embodiment," "an embodiment," and / or "some embodiments" refer to a particular feature, structure, or characteristic associated with at least one embodiment of the present application. Thus, it is emphasized and understood that references to two or more of "one embodiment" or "one embodiment" or "one alternative embodiment" in various parts of this specification do not necessarily all refer to the same embodiment. Also, certain features, structures, or characteristics in one or more embodiments of the present application may be combined as appropriate.

[0110] Moreover, as will be appreciated by those skilled in the art, aspects of the present application may be illustrated and described in several patentable classes or contexts, including any new and useful process, machine, manufacture, or combination of matter, or any new and useful improvement thereto. Thus, aspects of the present application may be implemented entirely in hardware, entirely in software (including firmware, resident software, microcode, etc.), or a combination of hardware and software. Any of the above hardware or software may be referred to as a "data block," "module," "engine," "unit," "assembly," or "system." Moreover, aspects of the present application may take the form of a computer program product embodied in one or more computer-readable medium(s) containing computer-readable program code.

[0111] The computer storage medium may include a propagated data signal containing the computer program code, for example on baseband or as part of a carrier wave. The propagated signal may be in various forms, such as electromagnetic, optical, or other suitable combinations. The computer storage medium may be any computer readable medium other than a computer readable storage medium, which may be coupled to an instruction execution system, device, or facility to achieve communication, propagation, or transmission of the program used. The program code on the computer storage medium may be propagated via any suitable medium, including wireless, cable, fiber optic cable, RF, or similar media, or any combination of the above media.

[0112] The computer program code necessary for the operation of each part of this application can be written in any one or more programming languages, including object-oriented programming languages ​​such as Java, Scala, Smalltalk, Eiffel, JADE, Emerald, C++, C#, VB.NET, Python, etc., general procedural programming languages ​​such as C, Visual Basic, Fortran 2003, Perl, COBOL 2002, PHP, ABAP, dynamic programming languages ​​such as Python, Ruby and Groovy, or other programming languages. The program code may be executed entirely on the user's computer, on the user's computer as a separate software package, partly on the user's computer and partly on a remote computer, or entirely on a remote computer or server. In the latter case, the remote computer may be connected to the user's computer by any form of network, such as a local area network (LAN) or wide area network (WAN), or may be connected to an external computer (e.g., via the Internet), or may be used as a service, such as in a cloud computing environment or Software as a Service (SaaS).

[0113] Furthermore, unless expressly stated in the claims, the order of processing elements or sequences described herein, the use of alphanumeric characters, or the use of other designations, are not intended to limit the order of procedures and methods of the present application. While the above disclosure describes through various examples what are presently believed to be various useful embodiments of the invention, it will be understood that such details are for the sake of simplicity and that the appended claims are not limited to the disclosed embodiments, but on the contrary are intended to cover all modifications and equivalent combinations that are within the spirit and scope of the embodiments of the present application. For example, the system assembly described above may be implemented by a hardware device, but may also be implemented as a software-only solution, for example, by installing the described system on an existing server or mobile device.

[0114] Similarly, in the foregoing description of embodiments of the present application, it will be understood that various features may be grouped together in a single embodiment, figure, or description for the purpose of simplifying the disclosure and facilitating an understanding of one or more embodiments of the invention. However, this method of disclosure should not be interpreted as reflecting an intention that the claimed subject matter requires more features than are recited in each claim. Rather, claimed subject matter may include less than all features of a single foregoing disclosed embodiment.

[0115] In some embodiments, numbers are used to describe the number of components and attributes, and the numbers describing such embodiments should be understood to be modified in some embodiments by the modifiers "about," "approximately," or "substantially." Unless otherwise specified, "about," "approximately," or "substantially" indicate that the value described by the number is allowed to vary by ±20%. Thus, in some embodiments, all numerical parameters used in the specification and claims are approximations that may vary depending on the characteristics required for a particular embodiment. In some embodiments, the numerical parameters should be applied with the stated number of significant digits and ordinary rounding techniques. Notwithstanding that the numerical ranges and parameters for determining the ranges in some embodiments of the present application are approximations, in certain embodiments, such numerical values ​​are set as precisely as possible.

[0116] All patents, patent applications, published patent applications, and other materials such as articles, books, specifications, publications, documents, etc. referenced in this application are incorporated herein by reference in their entirety, except for prosecution history documents that are inconsistent or inconsistent with the content of this application, and documents that may have a limiting effect on the broadest scope of the claims of this application (now or later related to this application). In addition, if the explanations, definitions, and / or use of terms in the accompanying documents of this application are inconsistent or inconsistent with the content set forth in this application, the explanations, definitions, and / or use of terms in this application shall control.

[0117] Finally, it is to be understood that the embodiments described herein are merely illustrative of the principles of the embodiments of the present application. Other variations may be within the scope of the present application. Thus, by way of example, and not of limitation, alternative configurations of the embodiments of the present application may be considered consistent with the teachings of the present application. Thus, the embodiments of the present application are not limited to the embodiments expressly introduced and described herein. [Explanation of symbols]

[0118] 100, 200, 500, 800, 1000, 1100, 1200, 1300, 1400, 1500, 1800, 1900, 2000 Microphones 110, 210, 520, 820, 1020, 1120, 1320, 1420, 1520, 1820, 1920, 2020 Acoustoelectric conversion element 120, 220 Sampling Module 130 Sub-band division module 140, 230 Signal Processing Module 510, 810, 1010, 1110, 1310, 1410, 1510, 1810, 1910, 2010 Housing structure 522, 822, 1022, 1122, 1322, 1422, 1522, 1822, 1922, 2022 Vibration pickup part 511, 811, 1011, 1111, 1311, 1411, 1511, 1811 Hole 523, 823, 1023, 1123, 1323, 1423, 1523, 1823, 1923, 2023 Vibration transmission part

Claims

1. a housing structure configured to generate vibrations; a vibration pickup unit accommodated in the housing structure, the vibration pickup unit vibrating via vibration of the housing structure, the vibration pickup unit being connected to the housing structure by its peripheral side, and at least a portion of the structure of the vibration pickup unit vibrating in response to an external audio signal, the vibration pickup unit including a first vibration pickup unit and a second vibration pickup unit installed in order from top to bottom, the first vibration pickup unit and the second vibration pickup unit being connected to the housing structure by their peripheral sides, and at least a portion of the structure of the first vibration pickup unit and the second vibration pickup unit vibrating in response to the external audio signal; At least two acoustoelectric transducer elements each configured to receive vibrations from the vibration pickup unit and generate an electrical signal; In a microphone including the at least two acoustoelectric transducers have different frequency responses to vibrations of the vibration pickup unit; A microphone characterized in that each of the acoustic-electrical conversion elements includes a first cantilever structure and a second cantilever structure, the first cantilever structure and the second cantilever structure are arranged opposite each other and have a first distance, and the first distance between the first cantilever structure and the second cantilever structure changes based on a vibration signal, thereby converting the vibration signal into an electrical signal.

2. A microphone as described in claim 1, characterized in that the frequency response corresponding to each of the acoustic-electrical transducer elements includes at least one resonant frequency, and at least two of the multiple resonant frequencies corresponding to the at least two acoustic-electrical transducer elements are in the range of 20 Hz to 16,000 Hz.

3. 3. The microphone according to claim 1, wherein the number of subbands corresponding to the at least two acoustic-electrical transducer elements is five or more.

4. 2. The microphone of claim 1, wherein the vibration pickup section includes a first vibration pickup section, and the at least two acoustoelectric transducer elements are directly or indirectly connected to the first vibration pickup section.

5. 2. The microphone of claim 1, wherein a vibration transmission section having a tubular structure is disposed between the first vibration pickup section and the second vibration pickup section, and a cavity is defined between the vibration transmission section, the first vibration pickup section and the second vibration pickup section.

6. the vibration pickup unit includes a first vibration pickup unit, a second vibration pickup unit, and a third vibration pickup unit, the first vibration pickup unit and the second vibration pickup unit are arranged facing each other vertically, a vibration transmission unit having a tubular structure is arranged between the first vibration pickup unit and the second vibration pickup unit, and a cavity is defined between the vibration transmission unit, the first vibration pickup unit, and the second vibration pickup unit; the third vibration pickup unit is connected between the vibration transmission unit and an inner wall of the housing structure; 2. The microphone of claim 1, wherein the third vibration pickup portion vibrates in response to the external audio signal.

7. A vibration transmission part having a tubular structure is provided between the first vibration pickup part and the second vibration pickup part, and a cavity is defined between the vibration transmission part, the first vibration pickup part, and the second vibration pickup part; A microphone as described in claim 5 or claim 6, characterized in that each of the acoustic-electrical conversion elements includes a cantilever structure, one end of the cantilever structure is connected to the inner wall of the vibration transmission section and the other end of the cantilever structure is suspended within the cavity, and the cantilever structure deforms based on a vibration signal to convert the vibration signal into an electrical signal.

8. The microphone according to claim 7 , wherein the different cantilever structures are distributed at intervals on the inner wall of the vibration transmitting portion.

9. 9. The microphone according to claim 7 or 8, wherein the cantilever structures corresponding to the at least two acoustoelectric transducer elements respectively have different dimensions or materials.

10. At least one membrane structure located on an upper surface and / or a lower surface of the acoustoelectric transducer; at least one support structure, one end of the at least one support structure being connected to a first one of the vibration pickup sections and the other end of the support structure being connected to a second one of the vibration pickup sections, and the free ends of the at least two acoustoelectric transducers and the support structure having a second distance; at least one sampling module configured to convert the electrical signals output from the different acoustic-electrical transducer elements into digital signals, the at least one sampling module sampling the electrical signals output from the different acoustic-electrical transducer elements using different sampling frequencies; 10. The microphone according to claim 1, further comprising:

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