On-board chargers and inverters
By using filler materials to conduct thermal connection between the second and third surfaces of the thermal amplification mechanism, combined with the design of aluminum blocks and circuit boards, the problem that when the thermal amplification mechanism is cast as a whole, it is difficult to effectively dissipate heat and fix the electronic components when only one side is opened, achieving efficient heat dissipation and effective control of the equipment.
Patent Information
- Application Number
- JP2024041229
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2024-03-15
- Publication Date
- 2025-03-21
- Estimated Expiration
- 2035-12-10
AI Technical Summary
When the heat amplification mechanism is cast as a box, it is difficult to effectively dissipate heat and fix the electronic components when only one side is opened, resulting in an increase in the volume of the equipment.
By using filler materials between the second and third surfaces of the thermal amplification mechanism, thermally connects the thermal generation electronic components, reactor parts and the thermal amplification mechanism, and uses the combination of aluminum blocks and circuit boards to achieve effective heat transfer and heat dissipation.
It realizes effective heat dissipation and fixed heat generation electronic components while keeping the overall size of the equipment unchanged, avoiding the increase in the equipment volume.
Smart Images
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Abstract
Description
[Technical field]
[0001] The present invention relates to an on-board charger and an inverter. [Background technology]
[0002] Conventionally, it is known that a circuit board or electronic components are stored in a roughly rectangular parallelepiped housing formed of a heat dissipation member, and heat generated from the electronic components is dissipated through the housing. There are two known manufacturing methods for the structure of such a roughly rectangular parallelepiped housing: a method in which a housing whose top and side surfaces are integrally molded into a box shape and whose bottom surface is open is placed over the top, and a method in which a housing whose bottom surface (bottom surface) and side surfaces are integrally molded into a box shape and whose top surface is open is placed over the top with a lid member (top surface).
[0003] When using a method in which a housing with an open bottom and top and top surfaces molded as a single unit into a box shape is placed over the housing from above, there are no sides when attaching boards or electronic components to the bottom surface, so it is possible to screw the electronic components in place from the side. However, this places restrictions on the placement of terminals (connectors) for electrically connecting electronic components stored inside the housing to electronic components outside the housing.
[0004] Generally, when providing a connector on a side surface, it is preferable to use a method in which a housing having an open top surface and an integrally molded bottom surface and side surfaces in a box shape is covered with a lid member (top surface).
[0005] However, in the method of covering a housing whose bottom and sides are integrally molded into a box shape and whose top is open with a lid member (top), since the bottom and sides are integrally molded into a box shape, it is not possible to screw the electronic components in place from the side, and it is necessary to screw them in from the open top.
[0006] One method for screwing the electronic component into place from the open top surface could be to bend the lead wires of the heat-generating electronic component so that the heat dissipation surface of the heat-generating electronic component is placed in direct contact with the bottom surface, and then screw an elastic member, as disclosed in Patent Document 1, from above so that it presses down on the surface opposite the heat dissipation surface. [Prior art documents] [Patent documents]
[0007] [Patent Document 1] JP 2002-217343 A Summary of the Invention [Problem to be solved by the invention]
[0008] However, in the above-mentioned method of placing heat-generating electronic components on the bottom surface of the heat dissipation mechanism, in order to ensure the heat dissipation effect, an area is required on the bottom surface of the heat dissipation mechanism where the heat dissipation surface of the heat-generating electronic components comes into contact and an area is required on the part where the elastic member is installed, which may result in an increase in the bottom area and ultimately in the size of the entire device.
[0009] An object of the present invention is to provide an on-board charger and inverter that can dissipate heat from heat-generating electronic components while preventing the charger and inverter from becoming too large when using a heat dissipation mechanism that is integrally molded into a box shape with an opening on only one side. [Means for solving the problem]
[0010] An on-board charger according to one aspect of the present invention includes a circuit board, a heat-generating electronic component that generates heat by itself when current is applied and has a lead wire connected to the circuit board, a heat transfer body in which the heat-generating electronic component is disposed, the heat transfer body having an accommodation section with a space for accommodating a reactor component, the reactor component being thermally connected to a heat dissipation component, and a potting material having heat dissipation properties is filled between the reactor component and the accommodation section, so that the reactor component and the heat transfer body are thermally connected by the potting material, the heat transfer body having a second surface and a third surface, the heat transfer body being thermally connected to the heat-generating electronic component via the second surface, and the heat transfer body being thermally connected to the reactor component by the potting material via the third surface. The heat generating electronic component is fixed to the heat transfer body with its longitudinal direction parallel to a first direction perpendicular to a first surface of the heat dissipation component. . a circuit board, a heat-generating electronic component that generates heat when current is passed through it and has leads connected to the circuit board, a heat transfer body in which the heat-generating electronic component is arranged, the heat transfer body having an accommodation section with a space for accommodating a reactor component, the reactor component being thermally connected to a heat-dissipating component, a potting material having heat dissipation properties is filled between the reactor component and the accommodation section, so that the reactor component and the heat transfer body are thermally connected by the potting material, the heat transfer body having a second surface and a third surface, the heat transfer body being thermally connected to the heat-generating electronic component via the second surface, and the heat transfer body being thermally connected to the reactor component via the third surface by the potting material, and a heat dissipation member being arranged between the heat transfer body and the circuit board. a heat-generating electronic component that self-heats when current is passed through it and has leads connected to the circuit board; a heat transfer body in which the heat-generating electronic component is arranged; the heat transfer body having an accommodation section with a space for accommodating a reactor component, the reactor component thermally connected to a heat dissipation component; a potting material having heat dissipation properties is filled between the reactor component and the accommodation section, such that the reactor component and the heat transfer body are thermally connected by the potting material; the heat transfer body has a second surface and a third surface, the heat transfer body is thermally connected to the heat-generating electronic component via the second surface, and the heat transfer body is thermally connected to the reactor component via the third surface by the potting material; an insulating and heat-dissipating member is arranged between the heat transfer body and the circuit board; and a pattern is formed on the circuit board at a location corresponding to the insulating and heat-dissipating member.
[0011] An inverter according to one aspect of the present invention includes a circuit board, a heat-generating electronic component that generates heat by itself when current is passed through it and has leads connected to the circuit board, a heat transfer body in which the heat-generating electronic component is disposed, the heat transfer body having an accommodation section with a space for accommodating a reactor component, the reactor component being thermally connected to a heat-dissipating component, and a potting material having heat dissipation properties is filled between the reactor component and the accommodation section, so that the reactor component and the heat transfer body are thermally connected by the potting material, the heat transfer body having a second surface and a third surface, the heat transfer body being thermally connected to the heat-generating electronic component via the second surface, and the heat transfer body being thermally connected to the reactor component by the potting material via the third surface. The heat generating electronic component is fixed to the heat transfer body with its longitudinal direction parallel to a first direction perpendicular to a first surface of the heat dissipation component. . a circuit board, a heat-generating electronic component that self-heats when current is passed through it and has leads connected to the circuit board, a heat transfer body in which the heat-generating electronic component is arranged, the heat transfer body having an accommodation section with a space for accommodating a reactor component, the reactor component being thermally connected to a heat-dissipating component, a potting material having heat dissipation properties is filled between the reactor component and the accommodation section, so that the reactor component and the heat transfer body are thermally connected by the potting material, the heat transfer body having a second surface and a third surface, the heat transfer body being thermally connected to the heat-generating electronic component via the second surface and the heat transfer body being thermally connected to the reactor component via the third surface by the potting material, and the heat-generating electronic component being fixed to the heat transfer body with its longitudinal direction parallel to a first direction perpendicular to a first surface of the heat-dissipating component. a heat-generating electronic component that self-heats when current is passed through it and has leads connected to the circuit board; a heat transfer body on which the heat-generating electronic component is arranged; the heat transfer body having an accommodation section with a space for accommodating a reactor component, the reactor component thermally connected to a heat dissipation component; a potting material having heat dissipation properties is filled between the reactor component and the accommodation section, thereby thermally connecting the reactor component and the heat transfer body by the potting material; the heat transfer body having a second surface and a third surface, the heat transfer body thermally connected to the heat-generating electronic component via the second surface, the heat transfer body thermally connected to the reactor component via the third surface by the potting material; an insulating and heat-dissipating member is arranged between the heat transfer body and the circuit board; and a pattern is formed on the circuit board at a location corresponding to the insulating and heat-dissipating member. Effect of the Invention
[0012] According to the present invention, when a heat dissipation mechanism that is integrally molded into a box shape and has an opening on only one side is used, it is possible to suppress an increase in size and still accommodate the dissipation of heat from heat-generating electronic components. [Brief description of the drawings]
[0013] [Figure 1] FIG. 1 is a perspective view showing an example of a heat dissipation structure for a heat-generating electronic component according to an embodiment of the present invention; [Diagram 2] FIG. 1 is a front view showing an example of a heat dissipation structure for a heat-generating electronic component according to an embodiment of the present invention; [Diagram 3] FIG. 1 is a side view showing an example of a heat dissipation structure for a heat-generating electronic component according to an embodiment of the present invention; [Figure 4] FIG. 1 is a top perspective view showing an example of a heat dissipation structure for a heat-generating electronic component according to an embodiment of the present invention; [Diagram 5] FIG. 1 is a top perspective view showing a configuration example of a heat dissipation structure for a heat-generating electronic component according to a first modified example of the present invention; [Figure 6] FIG. 11 is a top perspective view showing a configuration example of a heat dissipation structure for a heat-generating electronic component according to a second modified example of the present invention; DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0014] (Embodiment) Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
[0015] First, a configuration example of a heat dissipation structure 1 for a heat-generating electronic component according to the present embodiment will be described with reference to Figs. 1 to 4. Fig. 1 is a perspective view showing an example of the heat dissipation structure 1 for a heat-generating electronic component. Fig. 2 is a front view showing an example of the heat dissipation structure 1 for a heat-generating electronic component. Fig. 3 is a side view showing an example of the heat dissipation structure 1 for a heat-generating electronic component. Fig. 4 is a top perspective view showing an example of the heat dissipation structure 1 for a heat-generating electronic component. Note that the front portion of the heat sink 2 is omitted in Figs. 1 and 2, and the side portion of the heat sink 2 is omitted in Fig. 3. Also, the circuit board 9 shown in Figs. 1 to 3 is omitted in Fig. 4.
[0016] The heat dissipation structure 1 for a heat-generating electronic component is used, for example, in a charger, an inverter, etc. mounted on a vehicle. The heat dissipation structure 1 for a heat-generating electronic component includes a heat sink 2, an aluminum block 3, electronic components 5a and 5b, and a circuit board 9.
[0017] The heat sink 2 (an example of a heat dissipation mechanism) is integrally molded in a box shape, with an opening on only one side. F1 is the opening side (an example of a second side), and F2 is the bottom side (an example of a first side) opposite to the opening side F1.
[0018] Supports 2a, 2b, 2c, and 2d are provided along a vertical direction D (hereinafter simply referred to as the "vertical direction") relative to the bottom surface F2 at the four corners of the bottom surface F2 of the heat sink 2. Screw holes (not shown) are formed in each of the supports 2a to 2d, and a circuit board 9 (described later) is screwed into the support.
[0019] The aluminum block 3 (an example of a heat transfer body) is a substantially rectangular parallelepiped member made of aluminum. The aluminum block 3 is disposed inside the heat sink 2 so that the longitudinal direction of the aluminum block 3 is aligned with the vertical direction D.
[0020] The aluminum block 3 has a substantially rectangular parallelepiped fastening portion 3a at its bottom. The fastening portion 3a is fastened to the bottom surface F2 by screws 4a and 4b (an example of a fastening member). As a result, the aluminum block 3 is fixed in contact with the bottom surface F2.
[0021] The electronic components 5a and 5b (examples of heat-generating electronic components) are electronic components that generate heat by themselves when current is applied, such as discrete components, FETs (Field Effect Transistors), etc. The electronic components 5a and 5b have lead wires 6a and 6b, respectively.
[0022] The electronic components 5a and 5b are attached to the aluminum block 3 so that their heat dissipation surfaces contact the side surfaces of the aluminum block 3. For example, the electronic components 5a and 5b are pressed down from the surfaces facing the heat dissipation surfaces by springs 7a and 7b (an example of a holding member), respectively, and are fixed and held on the side surfaces of the aluminum block 3. The springs 7a and 7b are fastened to the side surfaces of the aluminum block 3 by screws 8a and 8b, respectively.
[0023] The electronic components 5a and 5b fixed to the aluminum block 3 are in an upright state along the vertical direction D. Moreover, the electronic components 5a and 5b fixed to the aluminum block 3 do not contact the heat sink 2.
[0024] As described above, heat generated from the electronic components 5a, 5b fixed to the aluminum block 3 is transferred to the heat sink 2 via the aluminum block 3. This allows the heat from the electronic components 5a, 5b to be dissipated.
[0025] 1 to 4, two electronic components are fixed to the aluminum block 3 as an example, but the number may be one, or three or more. Furthermore, multiple electronic components may be fixed to multiple surfaces of the aluminum block 3, not just one surface.
[0026] The circuit board 9 is a printed circuit board on which a pattern is formed and on which a predetermined semiconductor element (not shown) is mounted. The circuit board 9 is placed on the above-mentioned supports 2a to 2d. The circuit board 9 is then screwed to the supports 2a to 2d by screws 10a, 10b, 10c, and 10d. In this way, the circuit board 9 is fixed to the supports 2a to 2d.
[0027] Furthermore, the circuit board 9 is connected to the lead wires 6a and 6b of the electronic components 5a and 5b by, for example, soldering.
[0028] The aluminum block 3 and the circuit board 9 are arranged in the vertical direction D in the order of the aluminum block 3 and the circuit board 9 from the bottom face F2.
[0029] Furthermore, the aluminum block 3 and the circuit board 9 are bonded and fixed to each other with bonds 11a and 11b (an example of an adhesive member). This increases the number of fixing points on the circuit board 9, making it possible to prevent the lead wires 6a and 6b from breaking. This is particularly effective when the supports 2a to 2d are high and there is a lot of vibration.
[0030] Moreover, it is preferable that the bonds 11a and 11b have at least one of insulating properties and heat dissipation properties. If the bonds 11a and 11b have insulating properties, patterns can be formed or semiconductor elements can be mounted on the circuit board 9 at the locations corresponding to the bonds 11a and 11b. If the bonds 11a and 11b have heat dissipation properties, heat generated in the circuit board 9 can be transferred to the aluminum block 3 via the bonds 11a and 11b.
[0031] Although not shown in FIGS. 1 to 4, a cover for closing the opening F1 may be provided above the circuit board 9.
[0032] As described above, in the heat dissipation structure 1 for a heat-generating electronic component of this embodiment, the heat dissipation surfaces of the electronic components 5a, 5b are arranged in contact with the aluminum block 3 which is arranged in contact with the heat sink 2, and therefore, compared to the case where the heat dissipation surfaces of the electronic components 5a, 5b are arranged in contact with the bottom surface F2 of the heat sink 2, it is possible to accommodate heat dissipation from the electronic components while suppressing enlargement.
[0033] The above describes an example of the configuration of the heat dissipation structure 1 for a heat-generating electronic component.
[0034] Next, a method for manufacturing heat dissipation structure 1 for a heat-generating electronic component will be described with reference to FIGS.
[0035] First, the electronic components 5a and 5b are fixed and bonded to the aluminum block 3 using the springs 7a and 7b and the screws 8a and 8b. At this time, the heat dissipation surfaces of the electronic components 5a and 5b are brought into contact with the aluminum block 3. If the electronic components 5a and 5b are of a type that requires insulation, it is preferable to provide a heat dissipation insulation sheet (not shown) between the heat dissipation surfaces of the electronic components 5a and 5b and the aluminum block 3.
[0036] Next, the aluminum block 3 with the electronic components 5a and 5b fixed thereto is placed inside the heat sink 2 through the opening face F1 of the heat sink 2, and the aluminum block 3 is placed on the bottom face F2. Then, the fastening portion 3a is screwed to the bottom face F2 using the screws 4a and 4b.
[0037] Next, the circuit board 9 is housed inside the heat sink 2 through the opening surface of the heat sink 2 and placed on the pillars 2a to 2d. At this time, the lead wires 6a, 6b are soldered to the circuit board 9. Then, the circuit board 9 is screwed to the pillars 2a to 2d using the screws 10a to 10d.
[0038] By the above manufacturing method, the heat dissipation structure 1 for a heat-generating electronic component shown in FIGS. 1 to 4 is manufactured.
[0039] After the circuit board 9 is fixed with the screws, a cover (not shown) may be provided above the circuit board 9 to close the opening F1.
[0040] Although the embodiment of the present invention has been described above, the present invention is not limited to the above embodiment and various modifications are possible.
[0041] (Variation 1) A heat dissipation structure 1 for a heat-generating electronic component according to this modified example will be described with reference to Fig. 5. Fig. 5 is a top perspective view showing an example of a heat dissipation structure 1 for a heat-generating electronic component according to this modified example. In Fig. 5, the same components as those in Figs. 1 to 4 are given the same reference numerals, and their description will be omitted. Also, in Fig. 5, the circuit board 9 shown in Figs. 1 to 3 is not shown.
[0042] As shown in FIG. 5, this modified example differs from those shown in FIGS. 1 to 4 in that the heat sink 2 includes an aluminum block 30 and an electronic component 32. In the modified example shown in FIG.
[0043] The aluminum block 30 has a generally rectangular parallelepiped fastening portion 30a at its bottom. Although Fig. 5 only shows the fastening portion 30a between the support columns 2a and 2b, a similar fastening portion 30a also exists between the support columns 2d and 2c.
[0044] The fastening portion 30a is screwed to the bottom surface F2 by the screw 31. As a result, the aluminum block 30 is in contact with and fixed to the bottom surface F2.
[0045] The aluminum block 30 also has a housing portion 30b in which a substantially rectangular parallelepiped space is provided. An electronic component 32 (e.g., a reactor component, an example of a tall component) is housed in the space of the housing portion 30b. The bottom surface of the electronic component 32 is in contact with and fixed to the bottom surface F2 of the heat sink 2. Although not shown in the figure, a potting material is filled between the electronic component 32 and the housing portion 30b.
[0046] The electronic component 32 is disposed upright between the bottom surface F2 and the circuit board 9 (see FIGS. 1 to 3) such that the longitudinal direction of the electronic component 32 is along the vertical direction D (see FIGS. 1 to 3). The length of the electronic component 32 in the vertical direction D (the longitudinal length of the electronic component 32) is longer than the lengths of the electronic components 5a, 5b in the vertical direction D (the longitudinal lengths of the electronic components 5a, 5b).
[0047] By disposing the electronic component 32 on the bottom surface F2 in this manner, a space is provided between the circuit board 9 and the bottom surface F2, and the aluminum block 3 can be disposed in that space. Therefore, the heat dissipation structure 1 for a heat-generating electronic component does not become large in its height direction (vertical direction D).
[0048] According to this modification, in addition to the effects described in the first embodiment, it is also possible to fix (measure against vibration) the electronic component 32 arranged on the bottom surface F2 of the heat sink 2. Furthermore, if the potting material is a heat dissipating potting material, it is possible to fix (measure against vibration) the electronic component 32 and dissipate heat.
[0049] (Variation 2) A heat dissipation structure 1 for a heat-generating electronic component according to this modified example will be described with reference to Fig. 6. Fig. 6 is a top perspective view showing an example of a heat dissipation structure 1 for a heat-generating electronic component according to this modified example. In Fig. 6, the same components as those in Figs. 1 to 4 are given the same reference numerals, and their description will be omitted. Also, in Fig. 6, the circuit board 9 shown in Figs. 1 to 3 is not shown.
[0050] As shown in FIG. 6, this modified example differs from FIGS. 1 to 4 in that the heat sink 2 includes electronic components 33 and 34.
[0051] The electronic components 33 and 34 (for example, reactor components, which are an example of tall components) are fixed in contact with the bottom surface F2 of the heat sink 2, respectively.
[0052] The electronic components 33, 34 are disposed upright between the bottom surface F2 and the circuit board 9 (see FIGS. 1 to 3) such that the longitudinal directions of the electronic components 33, 34 are aligned along the vertical direction D (see FIGS. 1 to 3). The lengths of the electronic components 33, 34 in the vertical direction D (the longitudinal lengths of the electronic components 33, 34) are longer than the lengths of the electronic components 5a, 5b in the vertical direction D (the longitudinal lengths of the electronic components 5a, 5b).
[0053] By arranging the electronic components 33, 34 on the bottom surface F2 in this manner, a space is provided between the circuit board 9 and the bottom surface F2, and the aluminum block 3 can be arranged in that space. Therefore, the heat dissipation structure 1 for a heat-generating electronic component does not become large in its height direction (vertical direction D).
[0054] In this modification, in addition to the effects described in the first embodiment, heat from the electronic components 33 and 34 arranged on the bottom surface F2 of the heat sink 2 can also be dissipated.
[0055] (Variation 3) In the embodiment, the case where air cooling is performed using the heat sink 2 has been described as an example, but water cooling may be applied instead of air cooling.
[0056] (Variation 4) In the embodiment, an example has been described in which screws are used to fasten the bottom surface F2 of the aluminum block 3, the springs 7a and 7b to the aluminum block 3, and the circuit board 9 to the supports 2a to 2d, but bonds may be used instead of screws. Also, in the embodiment, an example has been described in which springs are used to secure the electronic components 5a and 5b to the aluminum block 3, but screws may be used instead of springs.
[0057] (Variation 5) In addition, while the aluminum block 3 and the circuit board 9 have been described as being fixed to each other by bonding with bonds 11a and 11b (an example of an adhesive member), a non-adhesive heat dissipation member such as grease or a gap filler (an example of a heat dissipation member) may be provided between the aluminum block 3 and the circuit board 9. This allows heat generated in the circuit board 9 to be transferred to the aluminum block 3 via the grease or gap filler. Furthermore, if the grease or gap filler has insulating properties, a pattern can be formed or a semiconductor element can be mounted on the circuit board 9 at a location corresponding to the grease or gap filler. [Industrial Applicability]
[0058] The present invention is useful for on-board chargers and inverters. [Explanation of symbols]
[0059] 1. Heat dissipation structure for heat-generating electronic components 2 Heat sink 2a, 2b, 2c, 2d posts 3, 30 Aluminum block 3a, 30a fastening section 4a, 4b, 8a, 8b, 10a, 10b, 10c, 10d, 31 screws 5a, 5b Electronic components 6a, 6b lead wire 7a, 7b Springs 9 Circuit Board 30b Storage section 32, 33, 34 Electronic Components
Claims
1. A circuit board; a heat-generating electronic component that generates heat by itself when energized and has a lead wire connected to the circuit board; a heat transfer body on which the heat-generating electronic component is disposed; The heat transfer body has an accommodating portion provided with a space for accommodating a reactor component, The reactor component is thermally connected to a heat dissipation component, a potting material having a heat dissipation property is filled between the reactor part and the housing part, so that the reactor part and the heat transfer body are thermally connected to each other by the potting material; the heat transfer body has a second surface and a third surface; the heat transfer body is thermally connected to the heat-generating electronic component via the second surface; the heat transfer body is thermally connected to the reactor part by the potting material via the third surface, the heat-generating electronic component is fixed to the heat transfer body with its longitudinal direction parallel to a first direction perpendicular to a first surface of the heat dissipating component; On-board charger.
2. The heat transfer body is The circuit board is fixed to the substrate by an adhesive member. The vehicle-mounted charger according to claim 1 .
3. The adhesive member is At least one of insulating property and heat dissipation property is provided. The vehicle-mounted charger according to claim 2 .
4. A heat dissipation member is disposed between the heat transfer body and the circuit board. The on-board charger according to any one of claims 1 to 3.
5. a member having insulating properties and heat dissipation properties is disposed between the heat transfer body and the circuit board; A pattern is formed on the circuit board at a location corresponding to the member having insulating properties and heat dissipation properties. The vehicle-mounted charger according to any one of claims 1 to 4.
6. The member having insulating properties and heat dissipation properties also has adhesive properties. The vehicle-mounted charger according to claim 5 .
7. The reactor component is a high-profile component, The length of the tall component in the first direction is longer than the length of the heat-generating electronic component in the first direction. The vehicle-mounted charger according to claim 1 .
8. The reactor part is thermally connected to the heat dissipation part by the potting material having heat dissipation properties. The vehicle-mounted charger according to claim 1 .
9. The heat transfer body holds the reactor component by a housing portion having a space for housing the reactor component. The vehicle-mounted charger according to claim 1 .
10. The reactor component is thermally connected to the heat dissipation component via the accommodation portion. The vehicle-mounted charger according to claim 9.
11. A circuit board; a heat-generating electronic component that generates heat by itself when energized and has a lead wire connected to the circuit board; a heat transfer body on which the heat-generating electronic component is disposed; The heat transfer body has an accommodating portion provided with a space for accommodating a reactor component, The reactor component is thermally connected to a heat dissipation component, a potting material having a heat dissipation property is filled between the reactor part and the housing part, so that the reactor part and the heat transfer body are thermally connected to each other by the potting material; the heat transfer body has a second surface and a third surface; the heat transfer body is thermally connected to the heat-generating electronic component via the second surface; the heat transfer body is thermally connected to the reactor part by the potting material via the third surface, A heat dissipation member is disposed between the heat transfer body and the circuit board. On-board charger.
12. a member having insulating properties and heat dissipation properties is disposed between the heat transfer body and the circuit board; A pattern is formed on the circuit board at a location corresponding to the member having insulating properties and heat dissipation properties. The vehicle charger according to claim 11.
13. The member having insulating properties and heat dissipation properties also has adhesive properties. The vehicle-mounted charger according to claim 12.
14. A circuit board; a heat-generating electronic component that generates heat by itself when energized and has a lead wire connected to the circuit board; a heat transfer body on which the heat-generating electronic component is disposed; The heat transfer body has an accommodating portion provided with a space for accommodating a reactor component, The reactor component is thermally connected to a heat dissipation component, a potting material having a heat dissipation property is filled between the reactor part and the housing part, so that the reactor part and the heat transfer body are thermally connected to each other by the potting material; the heat transfer body has a second surface and a third surface; the heat transfer body is thermally connected to the heat-generating electronic component via the second surface; the heat transfer body is thermally connected to the reactor part by the potting material via the third surface, a member having insulating properties and heat dissipation properties is disposed between the heat transfer body and the circuit board; A pattern is formed on the circuit board at a location corresponding to the member having insulating properties and heat dissipation properties. On-board charger.
15. The member having insulating properties and heat dissipation properties also has adhesive properties. The vehicle charger according to claim 14.
16. A circuit board; a heat-generating electronic component that generates heat by itself when energized and has a lead wire connected to the circuit board; a heat transfer body on which the heat-generating electronic component is disposed; The heat transfer body has an accommodating portion provided with a space for accommodating a reactor component, The reactor component is thermally connected to a heat dissipation component, a potting material having a heat dissipation property is filled between the reactor part and the housing part, so that the reactor part and the heat transfer body are thermally connected to each other by the potting material; the heat transfer body has a second surface and a third surface; the heat transfer body is thermally connected to the heat-generating electronic component via the second surface; the heat transfer body is thermally connected to the reactor part by the potting material via the third surface, the heat-generating electronic component is fixed to the heat transfer body with its longitudinal direction parallel to a first direction perpendicular to a first surface of the heat dissipating component; Inverter.
17. A circuit board; a heat-generating electronic component that generates heat by itself when energized and has a lead wire connected to the circuit board; a heat transfer body on which the heat-generating electronic component is disposed; The heat transfer body has an accommodating portion provided with a space for accommodating a reactor component, The reactor component is thermally connected to a heat dissipation component, a potting material having a heat dissipation property is filled between the reactor part and the housing part, so that the reactor part and the heat transfer body are thermally connected to each other by the potting material; the heat transfer body has a second surface and a third surface; the heat transfer body is thermally connected to the heat-generating electronic component via the second surface; the heat transfer body is thermally connected to the reactor part by the potting material via the third surface, the heat-generating electronic component is fixed to the heat transfer body with its longitudinal direction parallel to a first direction perpendicular to a first surface of the heat dissipating component; Inverter.
18. A circuit board; a heat-generating electronic component that generates heat by itself when energized and has a lead wire connected to the circuit board; a heat transfer body on which the heat-generating electronic component is disposed; The heat transfer body has an accommodating portion provided with a space for accommodating a reactor component, The reactor component is thermally connected to a heat dissipation component, a potting material having a heat dissipation property is filled between the reactor part and the housing part, so that the reactor part and the heat transfer body are thermally connected to each other by the potting material; the heat transfer body has a second surface and a third surface; the heat transfer body is thermally connected to the heat-generating electronic component via the second surface; the heat transfer body is thermally connected to the reactor part by the potting material via the third surface, a member having insulating properties and heat dissipation properties is disposed between the heat transfer body and the circuit board; A pattern is formed on the circuit board at a location corresponding to the member having insulating properties and heat dissipation properties. Inverter.
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