Integral metal heat sink and heat sink device

Abstract

The present invention provides an integrally molded metal heat sink plate including a substrate and a plurality of heat sink fins arranged along a longitudinal direction. The substrate includes a first surface and a second surface corresponding to each other. Each of the heat sink fins includes two connection ends connected to the first surface, at least two corrugations disposed between the two connection ends, and a plurality of concave-convex tooth portions formed on at least one side of at least one of the corrugations. The substrate is provided with notched grooves corresponding to the at least two corrugations of each heat sink fin, and the notched grooves penetrate the first surface and the second surface.

Description

[Technical field]

[0001] The present invention provides a heat dissipation structure, in particular an integrally molded metal heat dissipation plate and a heat dissipation device thereof, which improves the heat dissipation effect by enabling more corrugations to be formed in the same unit area. [Background technology]

[0002] In conventional heat dissipation structures, in order to quickly dissipate heat generated from a heat dissipation source, devices such as water-cooled heat dissipation units, heat pipes, fans, and fins are added, but if the effect of connecting the above-mentioned multiple media to each other is poor, it will have a negative effect on the contrary. Therefore, a heat dissipation device is commercially available that is integrally formed with a heat dissipation plate and multiple heat dissipation fins, the heat dissipation plate is made of a metal material, and after each heat dissipation fin is cut at the heat dissipation plate, the heat dissipation fins are pressed to protrude toward one side of the heat dissipation plate, thereby reducing costs and achieving the effect of improving the heat dissipation area of ​​the heat dissipation plate.

[0003] However, the conventional one-piece heat dissipation device has some shortcomings, the main reasons being: first, when the heat dissipation fins are pressed, the pressing stress is concentrated at the connection point between the heat sink plate and the heat sink fins, which makes the connection point too thin and easy to break, making the heat sink fins prone to damage, and the tensile elongation of the heat sink fins is limited, making it difficult to significantly improve the heat dissipation area; second, because each heat sink fin is spaced apart on the heat sink plate in a high and low manner, this structural design is not easy to mass-produce, and after pressing, the pressing stress is not uniform, which causes the heat sink plate to deform and warp, so the conventional heat dissipation structure cannot meet the market demand and has insufficient heat dissipation performance.

[0004] In view of this, the present inventors have intensively studied the above-mentioned prior art, and, in line with the application of theory, have tried their best to solve the above-mentioned problems, which has become the goal of the present inventors to improve. Summary of the Invention [Problem to be solved by the invention]

[0005] The object of the present invention is to provide an integrally molded metal heat sink and heat dissipation device that has a low overall height, can be installed in a small space (compared to an unrestricted usage environment), and has an increased surface heat dissipation area by using heat dissipation fins with multiple corrugations for the same unit area, making mass production easier and improving heat dissipation performance. [Means for solving the problem]

[0006] The present invention provides an integrally molded metal heat sink plate including a substrate and a plurality of heat sink fins arranged along a longitudinal direction. The substrate includes a first surface and a second surface corresponding to each other. Each of the heat sink fins includes two connection ends connected to the first surface, at least two corrugations between the two connection ends, and a plurality of concave-convex teeth formed on at least one side of at least one of the corrugations. The substrate is provided with a notch groove corresponding to the at least two corrugations of each of the heat sink fins, and the notch groove penetrates the first surface and the second surface.

[0007] In one embodiment, each of the waves has at least one peak and at least one valley connected to the peak, each peak having a triangular or arcuate shape, and each valley having a triangular, arcuate or plane parallel to the first surface.

[0008] In one embodiment, in each heat dissipation fin, a wave height is defined between the highest peak and the lowest valley of each of the at least two waves, the wave height gradually increases along the longitudinal direction, the amplitude of each wave also gradually increases along the longitudinal direction, and there is a height difference between the lowest valley of each wave and the first surface.

[0009] In one embodiment, in each heat dissipation fin, a wave height is defined between the highest peak and the lowest valley of each of the at least two waves, the wave heights are equal along the longitudinal direction, the amplitude of each wave is also equal along the longitudinal direction, and there is a height difference between the lowest valley of each wave and the first surface.

[0010] In one embodiment, copper or a copper alloy is provided on the first surface and on each of the heat sink fins, and the copper or copper alloy is also disposed on each wave portion having the toothed portion and is provided on a surface opposite the toothed portion.

[0011] In one embodiment, the material of the substrate and each heat sink fin comprises aluminum or an aluminum alloy, and each of the concave and convex teeth is either a triangular, rectangular or arcuate shape or a combination thereof.

[0012] The present invention further provides a heat dissipation device, including at least an integrally molded metal heat sink and an electronic device attached to one side of the metal heat sink. The heat dissipation device includes a base and a plurality of heat dissipation fins. The base includes a plurality of substrates, each of which has a first surface and a second surface corresponding to the substrate. Each of the heat dissipation fins includes two connection ends connected to the first surface, at least two corrugations disposed between the two connection ends, and a plurality of concave-convex tooth portions formed on at least one side of each of the at least two corrugations, and the substrate is provided with notched grooves corresponding to the at least two corrugations, and the notched grooves penetrate the first surface and the second surface.

[0013] In one embodiment, the base further includes a connecting plate connected to the substrates, the connecting plate and the outermost two substrates together forming a horseshoe shape.

[0014] In one embodiment, the wave portion has at least one peak and at least one valley, the peak having a triangular or arcuate shape, and each valley having a triangular, arcuate or plane shape parallel to the first surface.

[0015] In one embodiment, in each heat dissipation fin, a wave height is defined between the highest peak and the lowest valley of each of the at least two waves, and as the wave height gradually increases along the longitudinal direction, the amplitude of each wave also gradually increases along the longitudinal direction.

[0016] In one embodiment, in each heat dissipation fin, a wave height is defined between the highest peak and the lowest valley of each of the at least two waves, the wave heights being equal along the longitudinal direction, and the amplitude of each wave portion being equal along the longitudinal direction.

[0017] In one embodiment, copper or a copper alloy is provided on the first surface and on each of the heat sink fins, the copper or copper alloy being disposed on each wave portion having the toothed portion and on a surface facing the toothed portion.

[0018] In one embodiment, the base and each heat sink fin are made of aluminum or aluminum alloy, and each of the toothed portions is either triangular, rectangular or arcuate, or a combination thereof. Effect of the Invention

[0019] The integrally molded metal heat sink and heat sink device of the present invention has a plurality of low-height and high-density corrugations and each concave-convex tooth portion, which makes the overall corrugations low in height and easy to manufacture, and realizes the function of improving the surface heat sink area with the same unit area, thereby effectively improving the surface heat sink area and heat sink effect. Therefore, in this embodiment, the concave-convex tooth portion is used to distribute the press stress originally concentrated at the two connecting ends of the heat sink to the entire heat sink, so that each corrugation of the heat sink fin can be easily stretched and deformed, and the press stress is not concentrated at the two connecting ends of the heat sink to cause deformation and warping, and the stress generated by pressing can be released from the long notch groove. In addition, the provision of each concave-convex tooth portion improves the ductility of each corrugation of the heat sink fin, reducing the likelihood of the heat sink fin breaking during processing. Therefore, the heat sink of this embodiment does not generate any waste, is inexpensive, and utilizes an integrally molded metal heat sink having multiple wave portions and multiple concave-convex tooth portions, which can significantly increase the surface heat dissipation area, can be mass-produced, and has the effect of improving heat dissipation. [Brief description of the drawings]

[0020] In order to make the above-mentioned contents of the present invention more clearly understandable, the following preferred embodiments will be described in detail with reference to the accompanying drawings. [Figure 1A] FIG. 1A is a schematic diagram of a first embodiment of an integrally molded metallic heat sink according to the present invention. [Figure 1B] FIG. 1B is a schematic diagram of a second embodiment of the integrally molded metallic heat sink of the present invention. [Diagram 2] FIG. 2 is a schematic perspective view of the heat dissipation device of the present invention. [Figure 3A] FIG. 3A is a side view of the heat dissipation device of the present invention. [Figure 3B] FIG. 3B is a diagram of an alternative embodiment of FIG. 3A. [Figure 4] FIG. 4 is another side view of the heat dissipation device of the present invention. [Diagram 5] FIG. 5 is a schematic diagram showing an electronic device attached to the connection board of the present invention. [Figure 6] FIG. 6 is a schematic diagram of a third embodiment of an integrally molded metallic heat sink according to the present invention. [Figure 7] FIG. 7 is a side view of FIG. [Figure 8] FIG. 8 is another side view of FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0021] With reference to the above drawings, in which like element numbers indicate like or similar elements, it is to be understood that the principles of the present disclosure may be practiced in suitable environments. The following description is based on specific embodiments of the present disclosure as illustrated, and should not be construed as limiting other specific embodiments of the present disclosure not described in detail herein.

[0022] As shown in Figures 1A and 1B, the present invention provides an integrally molded metal heat sink 100 including a substrate 110 and a plurality of heat sink fins 120 arranged along a longitudinal direction. The substrate 110 includes a first surface 102 and a second surface 104 corresponding to each other. Each heat sink fin 120 includes two connecting ends 106 connected to the first surface 102, at least two wave portions 126 disposed between the two connecting ends 106, and a plurality of concave-convex tooth portions 130 formed on at least one side of at least one of the at least two wave portions 126. The substrate 110 is provided with notched grooves 140 corresponding to the at least two wave portions 126 of each heat sink fin 120, and the notched grooves 140 penetrate the first surface 102 and the second surface 104.

[0023] The wave portion 126 has at least one peak 122 and at least one valley 124 connected to the peak 122. The peak 122 may have a shape of, for example, a triangle, a circular arc, or other suitable shape, and the valley 124 may have a shape of, for example, a triangle, a circular arc, or a plane parallel to the first surface 102. In the embodiment shown in FIG. 1A, the peak 122 and the valley 124 are preferably in a triangular shape, and the overall heat dissipation efficiency can be about 80%. In the embodiment shown in FIG. 1B, the valley 124 is preferably in a plane shape, and the overall heat dissipation efficiency can be about 90%. In other different embodiments, the peak 122 and the valley 124 may have a shape of, for example, a circular arc, a triangle, or a combination thereof, as required, to be adapted to different environments.

[0024] In the present embodiment shown in FIG. 1A and FIG. 1B, in each heat dissipation fin 120, the wave height 128 between the highest crest and the lowest valley of at least two waves 126 gradually increases in the longitudinal direction, in other words, the amplitude 129 also gradually increases in the longitudinal direction, effectively increasing the heat dissipation area and increasing the heat dissipation effect. However, in another embodiment, the wave height 128 of at least two waves 126 is set equal in the longitudinal direction, i.e., the amplitude 129 is also equal, and excellent heat transfer and heat dissipation effects can be achieved. Note that the wave height 128 is preferably 20 millimeters (mm) or less, and the height of the entire waves 126 is reduced and the number of waves 126 is increased to facilitate manufacturing, and the surface heat dissipation area is improved for the same unit area. There is a height difference H between the valley 124 and the first surface 102 of 1 millimeter to 10 millimeters (mm), and the height difference H may be set as a fixed value, may gradually increase in the longitudinal direction, or may be changed as necessary.

[0025] The material of the substrate 110 and each heat dissipation fin 120 includes aluminum or aluminum alloy, and each concave-convex tooth portion 130 is either one of a triangle, a rectangle, or a circular arc, or a combination thereof. The tooth shape of each concave-convex tooth portion 130 is preferably triangular, and heat is not easily accumulated at the tip, so that heat can be quickly released, and the heat dissipation effect is excellent. In other different embodiments, the tooth shape of each concave-convex tooth portion 130 may be a circular arc or other suitable shape, and is not limited thereto. In the embodiment shown in FIG. 1A and FIG. 1B, the first surface 102 and each heat dissipation fin 120 further includes copper 150 or a copper alloy disposed by coating, electrolytic plating, or other suitable method, and the heat dissipation ratio of the copper 150 is twice that of aluminum. In this embodiment, the copper 150 or a copper alloy is provided to increase the heat transfer efficiency and heat dissipation effect. Specifically, the copper 150 or copper alloy is preferably disposed on each wave 126 having teeth 130 and disposed on the surface opposite each tooth 130. However, in other different embodiments, the copper 150 or copper alloy may be disposed on the first surface 102 and the second surface 104 simultaneously, or may be varied as desired.

[0026] In the embodiment shown in FIG. 1A and FIG. 1B, the substrate is preferably a pure aluminum or aluminum alloy structure, and may be a two-layer structure in which at least one layer of pure copper 150 or copper alloy is further provided thereon. In still another embodiment, other various metals or metal alloys may be further provided on the pure copper 150 or copper alloy, and may be a two-layer or three-layer heat dissipation fin 120 structure formed by providing other two-layer composite metal material (e.g., a composite material of copper and aluminum). The thickness of each layer varies depending on the actual operation and heat dissipation conditions, and is not limited. In addition, the composite material may be a welded layer of two types of metals that are completely welded, or an intermetallic compound layer that reduces heat transfer. The three-layer structure may be a three-layer structure in which various metals or alloys thereof are combined and / or welded, and is not limited thereto. The other pure metals or alloys thereof include, but are not limited to, nickel, tin, zinc, silver, gold, iron, stainless steel, titanium, tungsten, beryllium, bismuth, etc.

[0027] The molding method of each heat dissipating fin 120 will be further described below. For example, each heat dissipating fin 120 has a plurality of concave-convex tooth portions 130 formed on each wave portion 126 by a pressing method. The concave-convex tooth portions 130 in FIG. 1A are formed on the surface of the wave portion 126 so as to be continuous or discontinuous, but the concave-convex tooth portions 130 in FIG. 1B do not have each concave-convex tooth portion 130 because it is necessary to press the valley portion 124 of each wave portion 126 into a flat shape. After forming each concave-convex tooth portion 130, each heat dissipating fin 120 is pressed, and at least two waves 126 are further formed in the heat dissipating fin 120 and extend toward any surface of the heat sink 100, for example, toward the first surface 102, thereby forming a notch groove 140 corresponding to each wave portion 126. The at least two waves 126 shown in this embodiment preferably include three peak portions 122 and two valley portions 124, but are not limited thereto.

[0028] By providing a plurality of corrugations 126 with low height and high density and each of the concave-convex tooth portions 130, the surface heat dissipation area of ​​the heat dissipation fin 120 can be improved, and the surface heat dissipation area and heat dissipation effect can be effectively improved when the unit area is the same. Therefore, in this embodiment, the press stress originally concentrated at the two connecting ends 106 of the heat dissipation plate 100 is dispersed throughout the heat dissipation fin 120 by using the concave-convex tooth portions 130, so that each of the corrugations 126 of the heat dissipation fin 120 can be easily stretched and deformed, and the press stress is not concentrated at the two connecting ends 106 of the heat dissipation plate 100 to cause deformation and warping, and the stress generated by pressing can be released from the long notch groove 140. In addition, by providing each of the concave-convex tooth portions 130, the ductility of each of the corrugations 126 of the heat dissipation fin 120 is improved, and the heat dissipation fin 120 is less likely to be easily broken during processing. Therefore, the heat sink 100 of the present embodiment does not generate any waste, is inexpensive, and utilizes the integrally molded metal heat sink 100 having a plurality of wave portions 126 and a plurality of uneven tooth portions 130, which can greatly increase the surface heat dissipation area, can be mass-produced, and has the effect of improving heat dissipation.

[0029] As shown in FIG. 2 to FIG. 5, the present invention further provides a heat dissipation device 200 including at least an integrally molded metal heat sink 100 and an electronic device 300 attached to one side of the metal heat sink 100. The electronic device 300 mentioned in this specification can be applied to any related industry such as heat transfer, heat convection, and heat radiation, for example, electronic components such as control processing units (CPUs), graphics processors (GPUs), and network processors (NPUs), or components or systems such as heat exchangers for semiconductor heat dissipation devices, solar cells, automobile batteries, and power plants, to improve heat dissipation and energy efficiency. The heat dissipation device 200 includes a base 210 and a plurality of heat dissipation fins 120 arranged along the longitudinal direction. The base 210 includes a plurality of substrates 110, and includes a first surface 102 and a second surface 104 on which each of the substrates 110 is provided. Each of the heat dissipating fins 120 includes two connecting ends 106 connected to the first surface 102, at least two wavy portions 126 between the two connecting ends 106, and a plurality of concave-convex tooth portions 130 formed on at least one side of a cross section of the at least two wavy portions 126. The substrate 110 is provided with notched grooves 140 corresponding to the at least two wavy portions 126 of each of the heat dissipating fins 120, and the notched grooves 140 penetrate the first surface 102 and the second surface 104.

[0030] In the embodiment shown in FIG. 2 and FIG. 5, the base 210 further includes a connection plate 212 connected to the two substrates 110, and the electronic device 300 can be fixedly attached to one surface of the connection plate 212 through a screw part (e.g., a screw, not shown) and an assembly hole 214. The connection plate 212 and the two outermost substrates 110 together form a horseshoe shape (U-shape), but in other different embodiments, the base 210 may be rectangular, disk-shaped, or other suitable shapes, depending on the environment in which it is used. When the electronic device 300 operates and generates heat, the heat is quickly transferred and released through the connection plate 212 of the heat dissipation device 200 and the heat dissipation fins 120 connected to the multiple heat dissipation plates 100, thereby achieving the purpose of heat dissipation. For the specific configuration, manufacturing method, and other detailed features of each heat dissipation plate 100 of the heat dissipation device 200, please refer to the above embodiment, and the description thereof will be omitted here.

[0031] 6 to 8 are schematic perspective views and side views of a third embodiment of the integrally molded metal heat sink 100 of the present invention. The difference between this embodiment and the above-mentioned embodiments is that a support plate 160 is connected to one end of a single substrate 110, and the support plate 160 is perpendicular to the substrate 110 and fixed to the base 210 of the heat sink 200 via the support plate 160. The thickness of the substrate 110 gradually decreases in the direction away from the support plate 160, and similarly, heat is not easily accumulated at the tip, so that heat can be quickly released and the heat dissipation effect is excellent. For the specific configuration, manufacturing method, and other detailed features of the metal heat sink 100, please refer to the above-mentioned embodiments, and the description thereof will be omitted here.

[0032] The heat dissipation device 200 of this embodiment is provided with a plurality of heat dissipation plates 100, each of which has a plurality of corrugated portions 126 arranged at intervals. The heat dissipation plate 100 close to the connecting plate 212 may be provided with a single heat dissipation fin 120, which has only a single crest portion 122, according to dimensions and needs. As shown in the embodiment of FIG. 2 and FIG. 3A-FIG. 3B, it is preferable that the wave height 128 of each heat dissipation fin 120 gradually increases toward the opening (not shown) of the base 210, and the surface heat dissipation area is also gradually increased to increase the heat dissipation effect and heat dissipation efficiency. After experimental testing, the data obtained by testing a CPU (for example: Ryzen 5 3600XT) using the heat dissipation device 200 under the same conditions was 9503 points (pts), which is a 20% increase in heat dissipation effect compared to the prior art. Therefore, the heat dissipation device 200 can reliably improve the heat dissipation effect by utilizing the greatly improved surface heat dissipation area.

[0033] By providing a plurality of corrugations 126 with low height and high density and each of the concave-convex tooth portions 130, the surface heat dissipation area of ​​the heat dissipation fin 120 can be improved, and the surface heat dissipation area and heat dissipation effect can be effectively improved when the unit area is the same. Therefore, in this embodiment, the press stress originally concentrated at the two connecting ends 106 of the heat dissipation plate 100 is dispersed throughout the heat dissipation fin 120 by using the concave-convex tooth portions 130, so that each of the corrugations 126 of the heat dissipation fin 120 can be easily stretched and deformed, and the press stress is not concentrated at the two connecting ends 106 of the heat dissipation plate 100 to cause deformation and warping, and the stress generated by pressing can be released from the long notch groove 140. In addition, by providing each of the concave-convex tooth portions 130, the ductility of each of the corrugations 126 of the heat dissipation fin 120 is improved, and the heat dissipation fin 120 is less likely to be easily broken during processing. Therefore, the heat sink 100 of the present embodiment does not generate any waste, is inexpensive, and utilizes the integrally molded metal heat sink 100 having a plurality of wave portions 126 and a plurality of uneven tooth portions 130, which can greatly increase the surface heat dissipation area, can be mass-produced, and has the effect of improving heat dissipation.

[0034] The above description is merely a preferred embodiment of the present invention, and is not intended to limit the scope of the claims of the present invention. All other equivalent modifications that apply the spirit of the patent of the present invention should be included in the scope of the claims of the present invention.

Claims

1. a substrate including corresponding first and second surfaces; an integrally molded metal heat sink plate including: a plurality of heat dissipation fins arranged along the longitudinal direction, each of the heat dissipation fins including two connection ends connected to the first surface, at least two wave portions arranged between the two connection ends, and a plurality of concave-convex tooth portions formed on at least one side of at least one of the wave portions, the substrate being provided with notched grooves corresponding to the at least two wave portions of each of the heat dissipation fins, the notched grooves penetrating the first surface and the second surface.

2. 2. The integrally molded metal heat sink plate of claim 1, wherein each of the wave portions has at least one peak and at least one valley connected to the peak, the shape of each peak being triangular or arcuate, and the shape of each valley being triangular, arcuate, or a plane parallel to the first surface.

3. 3. The integrally molded metal heat sink plate of claim 2, wherein in each heat sink fin, a wave height is defined between the highest peak and the lowest valley of each of the at least two waves, the wave height gradually increases along the longitudinal direction, the amplitude of each wave also gradually increases along the longitudinal direction, and there is a height difference between the lowest valley of each wave and the first surface.

4. 3. The integrally molded metal heat sink plate of claim 2, wherein in each heat sink fin, a wave height is defined between the highest peak and the lowest valley of each of the at least two waves, the wave heights are equal along the longitudinal direction, the amplitude of each wave is also equal along the longitudinal direction, and there is a height difference between the lowest valley of each wave and the first surface.

5. 2. The integrally molded metal heat sink plate of claim 1, wherein copper or copper alloy is provided on the first surface and each of the heat sink fins, and the copper or copper alloy is also arranged on each wave portion having the uneven tooth portion and is provided on the surface facing the uneven tooth portion.

6. 2. The integrally molded metal heat sink plate according to claim 1, wherein the material of said substrate and each heat sink fin comprises aluminum or an aluminum alloy, and each of said concave and convex tooth portions is any one of a triangular, rectangular or arcuate shape or a combination thereof.

7. A heat dissipation device including at least an integrally molded metal heat sink and an electronic device attached to one side of the metal heat sink, A base including a plurality of substrates, the base including a first surface and a second surface to which each of the substrates is provided correspondingly; a plurality of heat dissipation fins arranged along a longitudinal direction, each of the heat dissipation fins including two connection ends connected to the first surface, at least two wave portions arranged between the two connection ends, and a plurality of concave-convex tooth portions formed on at least one side of each of the at least two wave portions, the substrate being provided with notched grooves corresponding to the at least two wave portions, the notched grooves penetrating the first surface and the second surface.

8. 8. The heat dissipation device of claim 7, wherein the base further comprises a connecting plate connected to the substrates, the connecting plate and the outermost two substrates together forming a horseshoe shape.

9. The heat dissipation device according to claim 7, wherein the wave portion has at least one peak and at least one valley, the peak having a triangular or arcuate shape, and each valley having a triangular, arcuate or plane parallel to the first surface.

10. The heat dissipation device of claim 9, wherein in each heat dissipation fin, a wave height is defined between the highest peak and the lowest valley of each of the at least two waves, and as the wave height gradually increases toward the longitudinal direction, the amplitude of each wave also gradually increases toward the longitudinal direction.

11. The heat dissipation device of claim 9, wherein in each heat dissipation fin, a wave height is defined between the highest peak and the lowest valley of each of the at least two waves, the wave heights are equal along the longitudinal direction, and the amplitudes of each wave portion are also equal along the longitudinal direction.

12. The heat dissipation device according to claim 7 , wherein copper or copper alloy is provided on the first surface and each of the heat dissipation fins, and the copper or copper alloy is provided on a surface facing the corrugated tooth portion and disposed on each wave portion having the corrugated tooth portion.

13. 10. The heat dissipation device according to claim 9, wherein the material of the base and each heat dissipation fin comprises aluminum or an aluminum alloy, and each of the concave and convex tooth portions has any one of a triangular, rectangular, or arcuate shape or a combination thereof.

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