Package and method for manufacturing the same

Abstract

To provide a package and a manufacturing method thereof that can prevent an unnecessarily large amount of brazing material from flowing out to a side surface while ensuring an electrical connection between a top surface and a bottom surface.SOLUTION: A metallizing unit 200 includes: a seal metallizing layer 210 on a sealing surface SS; a lower surface metallizing layer 220 on a lower surface P2 of a ceramic unit 100; and a side metallizing layer 230 on a side surface P3 of the ceramic unit 100. The side metallizing layer 230 includes: an upper portion 231 connected to the seal metallizing layer 210; a lower portion 232 connected to the lower surface metallizing layer 220; and an intermediate portion 233 connecting the upper portion 231 and the lower portion 232 to each other. A metal layer 300 is made of a metal material higher in wettability to the brazing material 930 than the metallizing material. The metal layer 300 covers the seal metallizing layer 210 of the metallizing portion 200, and does not cover the intermediate portion 233 of the side metallizing layer 230 of the metallizing portion 200.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a package and a method for manufacturing the same, and more particularly to a package for electronic components and a method for manufacturing the same. [Background technology]

[0002] JP 2000-312060 A (Patent Document 1) discloses an electronic component mounting substrate for mounting electronic components such as a quartz crystal unit. The electronic component mounting substrate has a lower insulating layer and an upper insulating layer. The lower insulating layer has a mounting portion for mounting an electronic component on its upper surface, and a plurality of metallized conductor layers for connecting electrodes of the electronic component to the outside are formed and deposited from the mounting portion to its lower surface. The upper insulating layer is frame-shaped and is laminated on the lower insulating layer so as to surround the mounting portion, and a sealing metallized layer for joining a lid is formed and deposited on its upper surface. A cutout portion is formed on the outer peripheral surface of the upper insulating layer, penetrating the upper insulating layer from top to bottom. A metallized conductor column for electrically connecting the metallized conductor layer and the sealing metallized layer is embedded in the cutout portion so that its upper end surface is flush with the upper surface of the upper insulating layer.

[0003] According to the above-mentioned configuration, the encapsulating metallization layer is electrically connected to the metallized conductor layer via the metallized conductor post, and therefore, by connecting the metallized conductor layer to the ground potential, the encapsulating metallization layer can also be connected to the ground potential.

[0004] The above publication also discloses that a metal having excellent wettability with a brazing material, such as gold (Au), is plated onto the exposed surfaces of the metallized conductor layer, the sealing metallized layer, and the metallized conductor via. This plating can prevent oxidation corrosion. Furthermore, this plating can strengthen the bond between the sealing metallized layer and the metal lid via the brazing material. The brazing material is, for example, made of a gold-tin (Au-Sn) alloy. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2000-312060 A Summary of the Invention [Problem to be solved by the invention]

[0006] According to the technology described in the above publication, a metal layer having excellent wettability with the brazing material is provided so as to cover the exposed surfaces of the metallized conductor layer, the sealing metallized layer, and the metallized conductor via. This makes it possible to strengthen the bonding between the sealing metallized layer and the metal lid via the brazing material, as described above. On the other hand, due to being covered with a metal layer having excellent wettability with the brazing material, a large amount of the brazing material is likely to flow out unnecessarily from the sealing metallized layer located on the upper surface to the metallized conductor via located on the side surface. In particular, the brazing material often contains a high content of expensive materials such as gold, and in this case, the flow out of a large amount of the brazing material unnecessarily leads to a significant increase in material costs.

[0007] The present invention has been made to solve the above-mentioned problems, and its object is to provide a package and a manufacturing method thereof that can prevent unnecessary large amounts of solder material from flowing out from the top surface to the sides while ensuring electrical connection between the top and bottom surfaces. [Means for solving the problem]

[0008] A package according to one embodiment is for an electronic component, and a lid is attached to the package using a brazing material. The package includes a ceramic portion, a metallization portion, and a metal layer. The ceramic portion has an outer edge in plan view. The ceramic portion has an upper surface, a lower surface opposite to the upper surface, and a side surface that is disposed on the outer edge in plan view and connects the upper surface and the lower surface to each other. The upper surface includes a sealing surface for supporting the lid, and a cavity for accommodating an electronic component is provided inside the sealing surface. The metallization portion is provided on the ceramic portion and is made of a metallization material. The metallization portion includes a seal metallization layer provided on the sealing surface, a lower surface metallization layer provided on the lower surface of the ceramic portion, and a side surface metallization layer provided on the side surface of the ceramic portion. The side surface metallization layer has an upper portion connected to the seal metallization layer, a lower portion connected to the lower surface metallization layer, and an intermediate portion that connects the upper portion and the lower portion to each other. The metal layer is made of a metal material having higher wettability with the brazing material than the metallizing material. The metal layer covers the seal metallization layer of the metallization portion, but does not cover an intermediate portion of the side metallization layer of the metallization portion.

[0009] The metal material constituting the metal layer may be either a pure metal or an alloy. The metal layer may cover an upper portion of the side metallization layer. The metal layer may have an end portion whose thickness gradually decreases. In a plan view, the outer edge of the ceramic part may have a first corner, a second corner, and one side connecting the first corner and the second corner, and the side metallization layer may be in contact with the one side away from the first corner and the second corner. A surface oxide film made of an oxide of the metallization material may be provided in the middle part of the side metallization layer. The surface of the middle part of the side metallization layer is a fractured surface. The outer edge may have a recess in which the side metallization layer is disposed. The recess may be filled with the side metallization layer in a height range in which the middle part of the side metallization layer is disposed. The recess may be filled with the side metallization layer and a filling part made of ceramic facing the ceramic part via the side metallization layer in a height range in which the middle part of the side metallization layer is disposed.

[0010] The manufacturing method of the package of one embodiment described above includes: (a) a step of forming a green laminate having a ceramic green portion including a portion that will become the ceramic portion; and a metallized green portion including a portion that will become the metallized portion, each of the ceramic green portion and the metallized green portion straddling an imaginary line that will be at least a part of the outer edge of the ceramic portion; and further includes: (b) a step of forming a trench in the green laminate along the imaginary line; (c) a step of forming a sintered body including the ceramic portion and the metallized portion by sintering the green laminate; (d) a step of plating the metallized portion of the sintered body to form a metal layer; and (e) a step of forming a surface of an intermediate portion of the side metallization layer of the metallized portion while breaking the ceramic portion by generating cracks in the sintered body starting from the trench after the step of plating the metallized portion. Effect of the Invention

[0011] According to the package of the above embodiment, first, the metallization portion includes a seal metallization layer provided on the seal surface, a lower metallization layer provided on the lower surface of the ceramic portion, and a side metallization layer provided on the side surface of the ceramic portion. This makes it possible to ensure electrical connection between the upper surface on which the seal metallization layer is arranged and the lower surface on which the lower metallization layer is arranged. Second, a metal layer made of a metal material having high wettability to the brazing material in a molten state covers the seal metallization layer of the metallization portion, but does not cover the middle portion of the side metallization layer of the metallization portion. This makes it possible to prevent the brazing material from flowing out unnecessarily in large amounts from the upper surface to the side surface. From the above, it is possible to prevent the brazing material from flowing out unnecessarily in large amounts from the upper surface to the side surface while ensuring electrical connection between the upper surface and the lower surface.

[0012] The objects, features, aspects and advantages of the present invention will become more apparent from the following detailed description and the accompanying drawings. [Brief description of the drawings]

[0013] [Figure 1] 1 is a plan view illustrating a schematic configuration of an electronic device according to a first embodiment. [Diagram 2] FIG. 2 is a schematic partial cross-sectional view taken along line II-II in FIG. [Diagram 3] FIG. 2 is a plan view illustrating a schematic configuration of a package in the first embodiment. [Figure 4] FIG. 4 is a schematic partial cross-sectional view taken along line IV-IV in FIG. [Diagram 5] FIG. 4 is a schematic partial cross-sectional view taken along line VV in FIG. [Figure 6] 3 is a partial plan view illustrating a first step of a method for manufacturing a package in accordance with the first embodiment. FIG. [Figure 7] FIG. 7 is a schematic partial cross-sectional view taken along line VII-VII in FIG. 6. [Figure 8] 4 is a partial plan view roughly showing a second step of the method for manufacturing the package in the first embodiment. FIG. [Figure 9] FIG. 9 is a schematic partial cross-sectional view taken along line IX-IX in FIG. 8. [Figure 10] 10 is a partial plan view roughly showing a third step of the method for manufacturing the package in the first embodiment. FIG. [Figure 11] FIG. 11 is a schematic partial cross-sectional view taken along line XI-XI in FIG. [Figure 12] 11 is a partial plan view roughly showing a fourth step of the method for manufacturing the package in the first embodiment. FIG. [Figure 13] FIG. 13 is a schematic partial cross-sectional view taken along line XIII-XIII in FIG. 12. [Figure 14] 11 is a partial plan view roughly showing a fifth step of the method for manufacturing the package in the first embodiment. FIG. [Figure 15] FIG. 15 is a schematic partial cross-sectional view taken along line XV-XV in FIG. [Figure 16] 13 is a partial plan view roughly showing a sixth step of the method for manufacturing the package in the first embodiment. FIG. [Figure 17] FIG. 17 is a schematic partial cross-sectional view taken along line XVII-XVII in FIG. 16. [Figure 18] 13 is a partial cross-sectional view illustrating a seventh step of the method for manufacturing the package in the first embodiment. FIG. [Figure 19] FIG. 11 is a partial cross-sectional view illustrating a schematic configuration of an electronic device in a comparative example. [Figure 20] FIG. 11 is a plan view illustrating a schematic configuration of a package in a second embodiment. [Figure 21] FIG. 21 is a schematic partial cross-sectional view taken along line XXI-XXI in FIG. 20. [Figure 22] 13 is a partial plan view roughly showing a third step of the method for manufacturing the package in the second embodiment. FIG. [Figure 23] FIG. 23 is a schematic partial cross-sectional view taken along line XXIII-XXIII in FIG. 22. [Figure 24] 13 is a partial plan view roughly showing a fourth step of the method for manufacturing the package in the second embodiment. FIG. [Diagram 25] FIG. 25 is a schematic partial cross-sectional view taken along line XXV-XXV in FIG. 24. [Figure 26] 13 is a partial plan view roughly showing a fifth step of the method for manufacturing the package in the second embodiment. FIG. [Figure 27] FIG. 27 is a schematic partial cross-sectional view taken along line XXVII-XXVII in FIG. 26. [Figure 28] 13 is a partial plan view roughly showing a sixth step of the method for manufacturing the package in the second embodiment. FIG. [Figure 29] FIG. 29 is a schematic partial cross-sectional view taken along line XXIX-XXIX in FIG. 28. [Diagram 30] 13 is a partial plan view roughly showing a seventh step of the method for manufacturing the package in the second embodiment. FIG. [Diagram 31] FIG. 31 is a schematic partial cross-sectional view taken along line XXXI-XXXI in FIG. 30. [Diagram 32] 13 is a partial plan view roughly illustrating an eighth step of the method for manufacturing the package in the second embodiment. FIG. [Diagram 33] FIG. 33 is a schematic partial cross-sectional view taken along line XXXIII-XXXIII in FIG. 32. [Diagram 34]13 is a partial cross-sectional view illustrating a ninth step of a method for manufacturing a package in accordance with the second embodiment. FIG. [Diagram 35] 29 is a partial cross-sectional view roughly illustrating a modification of the sixth step (FIG. 29) of the method for manufacturing a package in the second embodiment. FIG. [Diagram 36] FIG. 11 is a partial cross-sectional view illustrating a schematic configuration of a package according to a third embodiment. [Figure 37] FIG. 13 is a plan view illustrating a schematic configuration of a package according to a fourth embodiment. [Figure 38] 11 is a partial cross-sectional view illustrating the configuration of an electronic device in accordance with a fifth embodiment, in a field of view corresponding to that of FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] Hereinafter, an embodiment will be described with reference to the drawings.

[0015] <Embodiment 1> Fig. 1 is a plan view illustrating a schematic configuration of an electronic device 900 in the present embodiment 1. Fig. 2 is a schematic partial cross-sectional view taken along line II-II in Fig. 1. The electronic device 900 has a package 801, an electronic component 910, a brazing material 930, and a lid 920.

[0016] FIG. 3 is a plan view that shows a schematic configuration of a package 801. FIG. 4 and FIG. 5 are schematic partial cross-sectional views taken along lines IV-IV and VV in FIG. 3, respectively. The package 801 is for an electronic component 910, and in this embodiment, has an electrode pad 400 to which the electronic component 910 is to be bonded. As shown in FIG. 1 and FIG. 2, a lid 920 is attached to the package 801 using a brazing material 930. The lid 920 is preferably made of a metal having a thermal expansion coefficient similar to that of ceramic, and more specifically, is preferably made of an alloy containing Fe (iron) and Ni (nickel) as main components, for example, an Fe-Ni-Co (cobalt)-based alloy or an Fe-Ni-based alloy. The brazing material 930 is preferably made of Au as a main component, more preferably an Au alloy, and typically an Au-Sn alloy. Note that the material of the brazing material 930 is not limited to these, and may be, for example, an Ag (silver)-Cu (copper) alloy, a Pb (lead)-Sn solder, or a Pb-free solder. The shape of the lid body may be a flat plate.

[0017] The package 801 has a ceramic part 100, a metallized part 200 provided on the ceramic part 100, and a plating layer 300 (metal layer). The metallized part 200 includes a seal metallized layer 210, a lower surface metallized layer 220, and a side surface metallized layer 230. The plating layer 300 has an upper plating layer 310 and a lower plating layer 320. The upper plating layer 310 and the lower plating layer 320 are separated from each other.

[0018] The ceramic part 100 is made of ceramic, for example, alumina or aluminum nitride. In the case of ceramic made of alumina, zirconia may be added in an amount of 10 to 20 wt % to enhance mechanical strength. As shown in FIG. 3, the ceramic part 100 has an outer edge EO in a plan view. As shown in FIG. 4, the ceramic part 100 has an upper surface P1, a lower surface P2 opposite to the upper surface P1, and a side surface P3 connecting the upper surface P1 and the lower surface P2. The side surface P3 is disposed at the outer edge EO (FIG. 3) in a plan view. The outer edge EO has a recess CC. In this embodiment, the recess CC has an approximately semicircular shape. The upper surface P1 includes a seal surface SS for supporting the lid body 920 (FIG. 2) via the metallized part 200 and the upper plating layer 310. In addition, a cavity CV for accommodating the electronic component 910 is provided on the upper surface P1 inside the seal surface SS. The ceramic part 100 has a frame surrounding the cavity CV in plan view (FIG. 3). The ceramic part 100 is provided with internal wiring (not shown) that connects the inside and outside of the cavity CV. The internal wiring, for example, connects the electrode pad 400 provided in the cavity CV and an electrode pad (not shown) provided on the lower surface P2 to each other.

[0019] The metallization portion 200 is made of a metallization material. The main component of the metallization material is preferably a high melting point metal, for example, W (tungsten), Mo (molybdenum), or a mixture of these. Alternatively, the main component of the metallization material may be an alloy made of W and Mo. The seal metallization layer 210 is provided on the seal surface SS. The lower surface metallization layer 220 is provided on the lower surface P2 of the ceramic portion 100. The side surface metallization layer 230 is provided on the side surface P3 of the ceramic portion 100. Specifically, the side surface metallization layer 230 is disposed in a recess CC of the outer edge EO. In this embodiment, the recess CC is filled with the side surface metallization layer 230 (FIG. 4) in the height range in which the middle portion 233 of the side surface metallization layer 230 is disposed. Here, the direction referred to in the above "height range" is the thickness direction of the package 801 (the vertical direction in FIG. 4). The side metallization layer 230 has an upper portion 231 connected to the seal metallization layer 210, a lower portion 232 connected to the lower surface metallization layer 220, and an intermediate portion 233 connecting the upper portion 231 and the lower portion 232 to each other. The surface of the intermediate portion 233 of the side metallization layer 230 is not an as-fired surface, but a fracture surface SF (FIG. 18) formed by a breaking process described later.

[0020] In a plan view (FIG. 3), the outer edge EO of the ceramic part 100 has a rectangular shape having four sides and four corners. A square is a type of rectangle. Specifically, the outer edge EO has a first corner N1 (the upper right corner in the figure), a second corner N2 (the lower right corner in the figure), and one side (the right side in the figure) connecting the first corner N1 and the second corner N2 to each other. The side metallization layer 230 is in contact with the one side away from the first corner N1 and the second corner N2. Correspondingly, the recess CC is in contact with the one side away from the first corner N1 and the second corner N2. In this embodiment, the further side metallization layer 230 (and the recess CC in which it is arranged) is in contact with the side opposite to the one side, that is, the left side in the figure. The number of side metallization layers (and the number of recesses CC) that one package has is arbitrary.

[0021] The upper plating layer 310 of the plating layer 300 covers the seal metallization layer 210 of the metallization portion 200. On the other hand, the plating layer 300 does not cover the middle portion 233 of the side surface metallization layer 230 of the metallization portion 200. In this embodiment, the upper plating layer 310 covers the upper portion 231 of the side surface metallization layer 230. The interface between the upper portion 231 and the upper plating layer 310 may include an inclined surface with respect to the thickness direction (vertical direction in FIG. 4). The interface may be composed only of the inclined surface. The lower plating layer 320 of the plating layer 300 covers the lower surface metallization layer 220 of the metallization portion 200. The lower plating layer 320 of the plating layer 300 covers the lower portion 232 of the side surface metallization layer 230 of the metallization portion 200.

[0022] The upper plating layer 310 of the plating layer 300 has an end portion (the right end portion in FIG. 4) where the thickness gradually decreases. Similarly, the lower plating layer 320 of the plating layer 300 has an end portion (the right end portion in FIG. 4) where the thickness gradually decreases.

[0023] The plating layer 300 is made of a metal material having a higher wettability with respect to the brazing material 930 in a molten state than the metallizing material. In other words, the wettability of the metal material of the plating layer 300 is higher than that of the metallizing material. The metal material of the plating layer 300 is preferably mainly composed of Au, for example, is substantially Au.

[0024] In order to make the plating layer 300 less likely to peel off, it is preferable that a base layer (not shown) made of a conductive material different from the above-mentioned metal material is formed between the plating layer 300 and the metallized portion 200. The base layer may be a plating layer. The material of the base layer may be mainly composed of Ni, for example, Ni or a Ni-Co alloy.

[0025] FIG. 5 is a partial cross-sectional view of a portion where the recess CC is not provided.

[0026] Next, a method for manufacturing a plurality of packages 801 at once will be described below with reference to Figs. 6 to 18. Figs. 6, 8, 10, 12, 14, and 16 are partial plan views each showing the first to sixth steps. Figs. 7, 9, 11, 13, 15, and 17 are partial cross-sectional views each showing the lines VII-VII (Fig. 6), IX-IX (Fig. 8), XI-XI (Fig. 10), XIII-XIII (Fig. 12), XV-XV (Fig. 14), and XVII-XVII (Fig. 16). Fig. 18 is a partial cross-sectional view each showing the seventh step.

[0027] 6 and 7, a plurality of green sheets are laminated to form a ceramic green part 100G. The ceramic green part 100G includes a portion that will become the ceramic part 100 (FIG. 4) through a firing process described later. Although not shown, the ceramic green part 100G may be provided with a portion that will become the internal wiring (not shown) of the ceramic part 100.

[0028] 8 and 9, a through hole HL is formed in the ceramic green part 100G, extending along the thickness direction. The through hole HL spans an imaginary line LV that is at least a part of the outer edge EO of the ceramic part 100. The through hole HL includes a portion that will become the recess CC (FIG. 3). The through hole HL is formed by machining using a mold. As a modified example, the through hole HL may be formed by machining using laser light.

[0029] 10 and 11, a metallized green part 200G including a seal metallized green layer 210G, a lower surface metallized green layer 220G, and a side surface metallized green layer 230G is formed on the ceramic green part 100G by printing a metal paste. The metallized green part 200G includes a portion that will become the metallized part 200 by a firing process described later. Specifically, the seal metallized green layer 210G, the lower surface metallized green layer 220G, and the side surface metallized green layer 230G each include a portion that will become the seal metallized layer 210, the lower surface metallized layer 220, and the side surface metallized layer 230 by a firing process described later. As a result, a green laminate 500G is formed having the ceramic green part 100 including a portion that will become the ceramic part 100 and the metallized green part 200 including a portion that will become the metallized part 200.

[0030] Each of the ceramic green part 100G and the side metallized green layer 230G of the metallized green part 200G straddles an imaginary line LV (FIG. 10) that is at least a part of the outer edge EO of the ceramic part 100. Specifically, the ceramic green part 100G straddles the imaginary line LV outside the through hole HL. Also, the side metallized green layer 230G of the metallized green part 200G straddles the imaginary line LV inside the through hole HL.

[0031] 12 and 13, a trench TR is formed in the green laminate 500G along the imaginary line LV (FIG. 10). The step of forming the trench TR is performed by pressing a blade tip against the green laminate 500G along the imaginary line LV. As a modified example, the step of forming the trench TR may be performed by irradiating the green laminate 500G with a laser beam along the imaginary line LV.

[0032] Next, the green laminate 500G (FIGS. 12 and 13) is fired. With reference to FIG. 14 and FIG. 15, a fired body 500 including a ceramic portion 100 and a metallized portion 200 is formed by this firing. With reference to FIG. 16 and FIG. 17, the metallized portion 200 of the fired body 500 is plated. As a result, a plating layer 300 is formed.

[0033] 18, after the plating process, cracks are generated in the sintered body 500 starting from the trenches TR. As a result, the ceramic portion 100 is broken, and a surface (fracture surface SF) of the middle portion 233 of the side surface metallization layer 230 of the metallization portion 200 is formed. In this manner, a plurality of packages 801 are obtained.

[0034] 19 is a partial cross-sectional view showing a schematic configuration of an electronic device 990 in a comparative example. In this comparative example, unlike the electronic device 900 in the embodiment (FIG. 2), a plating layer 390 is provided on the entire side surface of the side metallization layer 230. As a result, when the lid 920 is attached using the brazing material 930, the brazing material 930 tends to flow out unnecessarily in large quantities from the top surface to the side surface, as shown by the arrows in the figure. If a member for stopping the flow of the brazing material 930, as shown by the arrows in the figure, were to be added, the configuration and manufacturing method would become complicated.

[0035] As another comparative example (not shown), a through hole is formed in the frame of the ceramic part 100 away from both the outer edge EO and the cavity CV in a plan view similar to that of FIG. 3, and a conductive member is formed in the through hole for electrically connecting the upper surface P1 and the lower surface P2. In this case, the size of the through hole needs to be sufficiently small compared to the width of the frame. Therefore, when the width of the frame is small, the process of forming the through hole is difficult. For example, in the case of machining using a mold having a micro pin, the micro pin corresponding to the micro through hole is easily broken. When a laser beam is used instead of a mold, the productivity is considerably reduced. Furthermore, even if a micro through hole can be formed, the process of filling the micro through hole with a conductive member is difficult.

[0036] According to the package 801 of this embodiment, firstly, the metallized portion 200 (FIG. 4) includes the seal metallized layer 210 provided on the seal surface SS, the lower surface metallized layer 220 provided on the lower surface P2 of the ceramic portion 100, and the side surface metallized layer 230 provided on the side surface P3 of the ceramic portion 100. This ensures electrical connection between the upper surface P1 on which the seal metallized layer 210 is arranged and the lower surface P2 on which the lower surface metallized layer 220 is arranged. Secondly, the plating layer 300 made of a metal material having high wettability to the brazing material 930 (FIG. 2) in a molten state covers the seal metallized layer 210 of the metallized portion 200, but does not cover the middle portion 233 of the side surface metallized layer 230 of the metallized portion 200. This prevents the brazing material 930 from flowing out unnecessarily in large amounts from the upper surface to the side surface, unlike the comparative example (FIG. 19). From the above, it is possible to prevent an unnecessarily large amount of the brazing material 930 from flowing out from the upper surface to the side surfaces while ensuring electrical connection between the upper surface P1 and the lower surface P2.

[0037] The upper plating layer 310 (FIG. 4) covers the upper portion 231 of the side metallization layer 230. As a result, the range in which the brazing material 930 (FIG. 2) easily flows out from the edge of the seal metallization layer 210 is limited to the range of the upper portion 231 of the side metallization layer 230. Therefore, by making the size of the upper portion 231 of the side metallization layer 230 sufficiently small, the amount of the brazing material 930 that flows out can be suppressed. Furthermore, the brazing material 930 spreads slightly from the edge of the seal metallization layer 210, so that the brazing material 930 is more firmly bonded to the plating layer 300. Note that, when the surface of the middle portion 233 of the side metallization layer 230 is formed by the breaking step (FIG. 18) after the firing step, and the trench TR (FIG. 12) that specifies the position of the breaking step is formed in advance before the firing step, it is efficient to form the plating layer 300 by the plating step (FIG. 17) after the firing step and before the breaking step. In this case, the portion of the plating layer 300 formed in the trench TR corresponds to the portion covering the upper portion 231 of the side surface metallization layer 230. Therefore, by allowing the plating layer 300 to cover the upper portion 231 of the side surface metallization layer 230, the plating layer 300 in this embodiment can be efficiently formed.

[0038] The upper plating layer 310 has an end portion (the right end portion in FIG. 4) whose thickness gradually decreases. This can suppress peeling of the plating layer 300 at the end portion. Furthermore, when the plating layer 300 is made of expensive Au, the raw material cost can be reduced. When the surface of the middle portion 233 of the side metallization layer 230 is formed by the breaking step (FIG. 18) after the firing step, and the trench TR (FIG. 12) that defines the position of the breaking step is formed in advance before the firing step, it is efficient to form the plating layer 300 by the plating step (FIG. 17) after the firing step and before the breaking step. In this case, the part that becomes the end portion of the plating layer 300 of the completed package 801 is located at the bottom of the trench TR at the time of the plating step. Since plating is difficult to proceed at the bottom of the trench TR, the plating layer 300 has an end portion whose thickness gradually decreases. Therefore, by allowing the plating layer 300 to have an end portion whose thickness gradually decreases, the plating layer 300 in this embodiment can be efficiently formed.

[0039] The side metallization layer 230 is in contact with one side of the outer edge EO (FIG. 3) of the ceramic part 100, away from the first corner N1 and the second corner N2. Peeling of the side metallization layer 230 is likely to occur at the corners of the outer edge EO, but this configuration can suppress this. In particular, damage to the side metallization layer 230 caused by the breaking process (FIG. 18) for forming the outer edge EO of the ceramic part 100 can be suppressed compared to when the side metallization layer 230 is located at the corners of the outer edge EO. However, when this effect is not particularly required, that is, when the adhesive strength between the side metallization layer 230 and the ceramic part 100 is sufficiently high, the arrangement of the side metallization layer 230 is not limited to this, and the side metallization layer 230 may be arranged at the corners.

[0040] The surface of the intermediate portion 233 of the side metallization layer 230 is a fracture surface SF (FIG. 18). This allows the surface to be formed by a breaking process.

[0041] The side surface metallization layer 230 is disposed in the recessed portion CC of the outer edge EO (FIG. 3), thereby preventing the side surface metallization layer 230 from protruding from the outer edge EO of the ceramic part 100.

[0042] The recess CC (FIG. 3) is filled with the side metallization layer 230 in the height range where the middle portion 233 (FIG. 4) of the side metallization layer 230 is disposed. This eliminates the need to form a member other than the side metallization layer 230 as a member for filling the recess CC. Note that, by filling the recess CC, it is possible to prevent the region where the lid 920 is bonded from becoming smaller due to the recess CC, which would cause a sealing failure. Furthermore, since the rigidity is increased, it is possible to prevent the breakage of the frame surrounding the cavity CV, which starts from the recess CC. This is effective when the width dimension of the frame surrounding the cavity CV of the ceramic part 100 is only 100 μm or less even at a location away from the recess CC. Note that making the width dimension of the frame 100 μm or less is often required in the design of an ultra-small package having an outer edge EO small enough to be included in an area of ​​1 mm square. Such a microminiature package is typically desired where electronic component 910 (FIG. 1) is a microminiature quartz blank (electroded).

[0043] According to the manufacturing method of the package 801 of the present embodiment, the package 801 can be manufactured by a simple method. Specifically, the fractured surface SF (FIG. 18) formed in the breaking step is used as a surface for suppressing further flow of the brazing material 930. Therefore, it is not necessary to form a special member for suppressing the flow of the brazing material 930. Furthermore, the through hole HL (FIGS. 8 and 9) becomes a recess CC (FIG. 3) for a castellation electrode by being divided. Therefore, the diameter of the through hole HL can be set relatively large compared to the case where a through hole away from both the outer edge EO and the cavity CV is formed for a through hole electrode in the frame part of the ceramic part 100, unlike the present embodiment. Therefore, the diameter of the pin of the mold for forming the through hole HL can also be set large. Therefore, the through hole HL can be easily formed by machining using a mold. This allows productivity to be increased compared to the case where laser processing is used.

[0044] According to the manufacturing method of the electronic device 900 of the present embodiment, first, the package 801 is manufactured as described above. Next, the electronic component 910 is joined to the electrode pad 400 of the package 801. Next, the lid 920 is attached to the package 801 by brazing using the brazing material 930. In this way, the electronic device 900 is obtained. The brazing may be performed by a known method, and in this case, an Au alloy, particularly an Au-Sn alloy, is typically used as the brazing material 930. However, the brazing method is not limited to this, and may be performed, for example, as follows. First, a brazing material layer made of an Ag-Cu alloy is formed on one surface of the lid 920. Next, the lid 920 provided with the brazing material layer is placed on the seal metallization layer 210 so that the brazing material layer is in contact with the seal metallization layer 210. Next, the brazing material is melted by electrical heating. In this way, the electronic device 900 is obtained.

[0045] As described above, the electronic device 900 (FIG. 2) is mounted on an external substrate (not shown) using electrode pads (not shown) provided on the lower surface P2. In this mounting, the electrode pads are joined to the external substrate using solder. If the solder unnecessarily flows out from the lower surface to the side surface in this soldering, the joining between the electrode pads and the external substrate is likely to be defective. According to this embodiment, the plating layer 300 made of a metal material having high wettability to the molten solder covers the lower surface metallization layer 220 of the metallization portion 200, but does not cover the middle portion 233 of the side surface metallization layer 230 of the metallization portion 200. This makes it possible to prevent the molten solder from unnecessarily flowing out from the lower surface to the side surface.

[0046] <Embodiment 2> FIG. 20 is a plan view that shows a schematic configuration of the package 802 in the second embodiment. FIG. 21 is a schematic partial cross-sectional view taken along the line XXI-XXI in FIG. 20. In the present embodiment, the recess CC is filled with the side metallization layer 230 and the filling portion 150 in the height range where the intermediate portion 233 of the side metallization layer 230 is disposed. The filling portion 150 faces the ceramic portion 100 via the side metallization layer 230 and is made of ceramic. The main component of the material of the filling portion 150 is preferably the same as the main component of the material of the ceramic portion 100. For example, the filling portion 150 and the ceramic portion 100 may both be made of alumina, or the filling portion 150 and the ceramic portion 100 may both be made of aluminum nitride. The surface of the filling portion 150 is not a fired surface but a fracture surface SG. It should be noted that the cross section shown in FIG. 21 is taken along line XXI-XXI (FIG. 20), whereas a partial cross section (not shown) taken along line AA (FIG. 20) is approximately similar to FIG. 4 (embodiment 1).

[0047] Next, a method for manufacturing a plurality of packages 802 at once will be described below. The first and second steps (FIGS. 6 to 9) in the first embodiment described above are also performed in the present embodiment, and therefore the description thereof will be omitted. Each of FIG. 22, FIG. 24, FIG. 26, FIG. 28, FIG. 30, and FIG. 32 is a partial plan view that shows the third to eighth steps. Each of FIG. 23, FIG. 25, FIG. 27, FIG. 29, FIG. 31, and FIG. 33 is a partial cross-sectional view that shows the third to eighth steps along line XXIII-XXIII (FIG. 22), line XXV-XXV (FIG. 24), line XXVII-XXVII (FIG. 26), line XXIX-XXIX (FIG. 28), line XXXI-XXXI (FIG. 30), and line XXXIII-XXXIII (FIG. 32). Also, FIG. 34 is a partial cross-sectional view that shows the ninth step.

[0048] With reference to Figs. 22 and 23, a side metallized green layer 230G is formed on the inner surface of the through hole HL of the ceramic green part 100G by printing a metal paste so as to fill the through hole HL only partially. With reference to Figs. 24 and 25, next, a filling green part 150G is filled in the through hole HL via the side metallized green layer 230G by printing a ceramic paste so as to completely fill the through hole HL. With reference to Figs. 26 and 27, a seal metallized green layer 210G and a lower metallized green layer 220G are formed on the ceramic green part 100G by printing a metal paste. As described above, a metallized green part 200G including a part that becomes the metallized part 200 is formed on the ceramic green part 100G by the steps of Figs. 22 to 27. As a result, a green laminate 500G is formed having a ceramic green portion 100G including a portion that will become the ceramic portion 100, a metallized green portion 200G including a portion that will become the metallized portion 200, and a filled green portion 150G including a portion that will become the filled portion 150.

[0049] The ceramic green portion 100G, the side metallized green layer 230G of the metallized green portion 200G, and the filling green portion 150G are each arranged along a virtual line LV (see FIG. 26Specifically, the ceramic green portion 100G straddles the imaginary line LV outside the through hole HL. Also, each of the side metallized green layer 230G and the filling green portion 150G straddles the imaginary line LV inside the through hole HL.

[0050] 28 and 29, a trench TR is formed in the green laminate 500G along the imaginary line LV (FIG. 26). The step of forming the trench TR is performed by pressing a blade against the green laminate 500G along the imaginary line LV. When the trench TR is formed using a blade, the seal metallized green layer 210G is likely to extend onto the side surface of the trench TR as shown in FIG. 29. This is because the seal metallized green layer 210G is rolled up into the blade when the trench TR is formed. As a result, in a plating step (FIGS. 32 and 33) described later, the plating layer 300 is also likely to be formed on the surface of the filling portion 150 made of ceramic.

[0051] Next, the green laminate 500G (FIGS. 28 and 29) is fired. With reference to FIGS. 30 and 31, a fired body 500 including the ceramic portion 100 and the metallized portion 200 is formed by this firing.

[0052] 32 and 33, metallized portion 200 of fired body 500 is plated. As a result, plated layer 300 is formed.

[0053] 34, after the plating, cracks are generated in the sintered body 500 starting from the trenches TR. As a result, the ceramic portion 100 and the filling portion 150 are broken (snapped), and the surface (fracture surface SF in FIG. 20) of the middle portion 233 of the side surface metallization layer 230 of the metallization portion 200 is formed. In this manner, a plurality of packages 802 are obtained.

[0054] Since other than the above, the present embodiment is substantially the same as the first embodiment described above, the same or corresponding elements are given the same reference numerals and the description thereof will not be repeated.

[0055] According to the package 802 of this embodiment, the recess CC (FIG. 20) is filled with the side surface metallization layer 230 and the filling part 150 made of ceramic and facing the ceramic part 100 via the side surface metallization layer 230 in the height range where the intermediate part 233 (FIG. 21) of the side surface metallization layer 230 is arranged. This makes it possible to protect the side surface metallization layer 230 by the filling part 150. Also, since the filling part 150 made of ceramic (FIG. 33) is formed in the through hole HL including the part that becomes the recess CC, the proportion of the material constituting the frame part that is ceramic increases and the homogeneity is improved, so that cracks can be more stably generated in the recess CC in the breaking process (FIG. 34).

[0056] According to the manufacturing method of the package 802 of this embodiment, the trench TR (FIG. 29) is formed using a cutting edge. This makes it easier for the seal metallization green layer 210G to extend onto the side surface of the trench TR, as described above. As a result of the seal metallization green layer 210G extending onto the side surface of the trench TR, the seal metallization layer 210 of the package 802 also extends onto the side surface of the trench TR. This makes it possible to obtain an upper plating layer 310 (FIG. 21) having an end portion whose thickness gradually decreases on the side surface of the trench TR, similar to the case of FIG. 4 (embodiment 1).

[0057] <Modification of the second embodiment> Fig. 35 is a partial cross-sectional view showing a schematic modification of the process of Fig. 29. In the process of Fig. 29, the trench TR is formed using a cutting edge, but in this modification, the trench TR is formed by laser processing (i.e., irradiation with laser light). In this case, unlike the case of Fig. 29, the seal metallized green layer 210G is unlikely to extend onto the side surface of the trench TR. According to this modification, a fine trench TR can be formed by using laser light instead of a cutting edge.

[0058] <Embodiment 3> 36 is a partial cross-sectional view showing a schematic configuration of a package 801M in the third embodiment. In the present embodiment, a surface oxide film 233X made of an oxide of a metallization material is provided on the intermediate portion 233 of the side metallization layer 230. The surface oxide film 233X may be a natural oxide film of the intermediate portion 233. Note that the rest of the configuration is substantially the same as that of the first embodiment (FIG. 4), and therefore the same or corresponding elements are denoted by the same reference numerals and description thereof will not be repeated.

[0059] This embodiment also provides substantially the same effects as those of embodiment 1. Furthermore, according to this embodiment, the wettability of the intermediate portion 233 to the brazing material 930 can be further reduced by the surface oxide film 233X. In particular, when the surface oxide film 233X is a natural oxide film of the intermediate portion 233, the surface oxide film 233X can be easily formed.

[0060] <Fourth embodiment> 37 is a plan view showing a schematic configuration of a package 802M in the fourth embodiment. In the present embodiment, a surface oxide film 233X made of an oxide of a metallization material is provided on the intermediate portion 233 of the side metallization layer 230. The surface oxide film 233X may be a natural oxide film of the intermediate portion 233. Note that the rest of the configuration is substantially the same as that of the second embodiment described above, and therefore the same or corresponding elements are denoted by the same reference numerals and description thereof will not be repeated.

[0061] This embodiment also provides substantially the same effects as those of embodiment 2. Furthermore, this embodiment also provides the same effects as those unique to embodiment 3 described above.

[0062] <Embodiment 5> 38 is a partial cross-sectional view that illustrates the configuration of an electronic device 900M in the fifth embodiment in a field of view corresponding to FIG. 2 (electronic device 900: first embodiment). The electronic device 900M has a metal frame 940 in addition to the members that the electronic device 900 has. The shape of the metal frame 940 is substantially the same as the shape of the seal metallization layer 210 in a plan view. Thus, the metal frame 940 surrounds the cavity CV in a plan view.

[0063] The metal frame 940 is preferably made of a metal having a thermal expansion coefficient similar to that of ceramic, and more specifically, is preferably made of an alloy containing Fe (iron) and Ni (nickel) as main components, for example, an Fe-Ni-Co (cobalt) based alloy or an Fe-Ni based alloy.

[0064] Next, a method for manufacturing the electronic device 900M will be described. First, the package 801 described in the first embodiment is prepared. Next, the metal frame 940 is attached to the seal metallization layer 210 of the package 801 using the brazing material 930. In other words, the metal frame 940 is brazed to the seal metallization layer 210. The brazing method may be the same as the method for brazing the lid 920 to the seal metallization layer 210 in the first embodiment or its modified example. In particular, in this embodiment, the material of the brazing material 930 is preferably an Ag-Cu alloy. Next, the lid 920 is attached onto the metal frame 940. This attachment is preferably performed by welding.

[0065] In this embodiment, the lid 920 is attached to the package 801 using the brazing material 930 and a metal frame 940 brazed to the brazing material 930. In other words, the package 801 is a package to which the lid 920 is attached using the brazing material 930 and the metal frame 940 brazed to the brazing material 930. Thus, in this embodiment, the seal surface SS of the package 801 is for supporting the lid 920 via the metal frame 940.

[0066] As a modification, package 801 in electronic device 900M may be replaced with a package other than package 801 according to any one of the above-described embodiments 1 to 4 and their modifications.

[0067] The above-mentioned embodiments and modifications may be freely combined with each other. Although the present invention has been described in detail, the above description is merely illustrative in all respects, and the present invention is not limited thereto. It is understood that countless modifications not illustrated can be envisioned without departing from the scope of the present invention. [Explanation of symbols]

[0068] 100: Ceramic section 100G: Ceramic green section 150: Filling section 150G: Filling green section 200: Metallized section 200G: Metallized green section 210: Seal metallization layer 210G: Seal metallized green layer 220: Lower metallization layer 220G: Bottom metallized green layer 230: Side metallization layer 230G: Side metallized green layer 231: Upper part 232: Lower part 233: Middle part 233X: Surface oxide film 300: Plating layer (metal layer) 310: Upper plating layer 320: Lower plating layer 500: Fired body 500G: Green laminate 801, 801M, 802, 802M: Package 900,900M:Electronic equipment 910: Electronic Components 920: Lid 940: Metal frame 930: Brazing material CC: Concave CV: Cavity EO:Outer edge HL:Through hole LV: Virtual line N1, N2: First and second corners P1:Top surface P2: Bottom surface P3: Side SF: Fracture surface SG: Fractured surface SS: Sealing surface TR: Trench

Claims

1. A package for electronic components to which a lid is attached using a brazing material, A ceramic portion having an outer edge in a plan view, the ceramic portion comprising: an upper surface including a sealing surface for supporting the lid body, the upper surface having a cavity for accommodating the electronic component inside the sealing surface; a lower surface opposite to the upper surface; A side surface that is disposed on the outer edge in the plan view and connects the upper surface and the lower surface to each other; and said package further comprising: a metallized portion provided on the ceramic portion and made of a metallizing material, the metallized portion comprising: a seal metallization layer provided on the seal surface; a lower surface metallization layer provided on the lower surface of the ceramic portion; a side metallization layer disposed on the side of the ceramic portion and having an upper portion connected to the seal metallization layer, a lower portion connected to the bottom metallization layer, and an intermediate portion connecting the upper portion and the lower portion to each other, the package further comprising: A package comprising a metal layer made of a metal material having a higher wettability with the solder material than the metallization material, the metal layer covering the seal metallization layer of the metallization portion and not covering the intermediate portion of the side metallization layer of the metallization portion.

2. The package of claim 1 , wherein the metal layer covers the upper portion of the side metallization layer.

3. 3. The package of claim 1 or 2, wherein the metal layer has an end portion with a tapered thickness.

4. A package as described in any one of claims 1 to 3, wherein, in the planar view, the outer edge of the ceramic portion has a first corner, a second corner, and a side connecting the first corner and the second corner to each other, and the side metallization layer is in contact with the side away from the first corner and the second corner.

5. 5. The package according to claim 1, wherein the intermediate portion of the side metallization layer is provided with a surface oxide film made of an oxide of the metallization material.

6. The package according to claim 1 , wherein a surface of the intermediate portion of the side metallization layer is a fractured surface.

7. The package of claim 1 , wherein the outer edge has a recess in which the side metallization layer is disposed.

8. The package according to claim 7 , wherein the recess is filled with the side metallization layer in a height range in which the intermediate portion of the side metallization layer is disposed.

9. The package described in claim 7, wherein the recess is filled by the side metallization layer and a filling portion made of ceramic facing the ceramic portion via the side metallization layer in a height range in which the intermediate portion of the side metallization layer is located.

10. The package is a package to which the lid is attached using the brazing material and a metal frame brazed to the brazing material, The sealing surface is for supporting the lid body via the metal frame body. A package according to any one of claims 1 to 9.

11. A method for manufacturing a package according to any one of claims 1 to 10, comprising the steps of: (a) forming a green laminate having a ceramic green part including a portion that will become the ceramic part and a metallized green part including a portion that will become the metallized part, each of the ceramic green part and the metallized green part straddling an imaginary line that will be at least a part of the outer edge of the ceramic part, and further (b) forming a trench in the green laminate along the imaginary line; (c) firing the green laminate to form a fired body including the ceramic portion and the metallized portion; (d) plating the metallized portion of the fired body to form the metal layer; (e) after the step of plating the metallized portion, a step of forming a surface of the intermediate portion of the side metallized layer of the metallized portion while breaking the ceramic portion by generating cracks in the fired body starting from the trenches; A method for manufacturing a package comprising:

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