Cooling device

Abstract

To accurately cool a plurality of objects to be cooled, in a cooler that performs heat transfer due to phase change between a gas phase and a liquid phase of a refrigerant in a container.SOLUTION: A cooler 42 has a container 44 in which a refrigerant is sealed. Inside the container 44, provided are: a plurality of evaporators 62 that evaporate a liquid-phase refrigerant by heat receiving; a condensation unit 72 that is provided in each of the evaporators 62, and condenses a vapor-phase refrigerant inside the container 44 by heat radiation; and a transport unit 70 that transports the refrigerant from the condensation unit 72 to the evaporation unit 62 by surface tension. The plurality of condensation units 72 are communicated so that the refrigerant can move by a moving unit 100.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The technology disclosed in this application relates to a cooling device. [Background technology]

[0002] There is a cooling device that includes a condenser that condenses the gas refrigerant guided from the evaporator, and a liquid return pipe that extends downward from the condenser to the evaporator and returns the liquid refrigerant condensed in the condenser to the evaporator. In this cooling device, the open end of the liquid return pipe in the evaporator is shaped into an obliquely inclined end face so that the opening faces upward, and the open end is located below the end of the heat dissipation fin.

[0003] In addition, there is a flattened heat pipe in which a flattened container is formed by pressing and deforming a grooved tube with a groove on the entire surface of the inner wall. In this structure, a wick material is disposed between opposing upper and lower plates of the container and deformed to fit the container. The outer surface of the wick material contacts the convex portion that forms the groove on the inner wall, and a passage for fluid movement is provided inside the wick material. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 6-177296 [Patent Document 2] JP 2004-198096 A Summary of the Invention [Problem to be solved by the invention]

[0005] In order to cool a plurality of heat generating members as cooling targets, for example, it is conceivable to provide an independent cooling device for each of the cooling targets.

[0006] In this case, in order to accurately cool each of the cooling targets, the cooling capacity of each cooling device is set corresponding to the cooling target. However, if each cooling device is set to have a sufficient cooling capacity for the corresponding cooling target, it may lead to an increase in the size of the cooling device and a decrease in the mounting density of various components including the cooling target. In other words, there is room for improvement in accurately cooling multiple cooling targets.

[0007] One aspect of the technology disclosed in this application is to accurately cool a plurality of cooling targets in a cooling device that transfers heat by changing the phase of a refrigerant between a gas phase and a liquid phase in a container. [Means for solving the problem]

[0008] The technology disclosed in the present application includes a plurality of evaporation sections that evaporate the liquid-phase refrigerant by receiving heat inside the container, a plurality of condensation sections that are provided in each of the plurality of evaporation sections and condense the refrigerant by releasing heat, and a transport section that transports the liquid-phase refrigerant from the condensation sections to the evaporation sections by surface tension.Furthermore, the container includes a transport section that communicates between the plurality of condensation sections to allow the liquid-phase refrigerant to move. Effect of the Invention

[0009] The technology disclosed in the present application makes it possible to accurately cool a plurality of cooling targets in a cooling device that transfers heat by changing the phase of a refrigerant between a gas phase and a liquid phase within a container. [Brief description of the drawings]

[0010] [Figure 1] FIG. 1 is a perspective view showing a cooling device according to a first embodiment. [Diagram 2] FIG. 2 is an exploded perspective view showing the cooling device of the first embodiment. [Diagram 3] FIG. 3 is a partial plan view showing an electronic device equipped with the cooling device of the first embodiment together with the internal structure of the cooling device. [Figure 4] FIG. 4 is a plan view showing the internal structure of the cooling device of the first embodiment. [Diagram 5]FIG. 5 is a cross-sectional view taken along line 5-5 in FIG. 4, showing the cooling device of the first embodiment in a non-inclined state. [Figure 6] FIG. 6 is a cross-sectional view showing the cooling device of the first embodiment in an inclined state. [Figure 7] FIG. 7 is a plan view showing one end portion of a transport pipe in the cooling device of the first embodiment together with a part of the evaporator. [Figure 8A] FIG. 8A is a cross-sectional view showing a side wall portion of a container in the cooling device of the first embodiment at a position where a transport pipe is located. [Figure 8B] FIG. 8B is a cross-sectional view showing a side wall portion of the container in the cooling device of the first embodiment in a position where a transport pipe is not present. [Figure 9] FIG. 9 is a side view showing one end portion of a transport pipe in the cooling device of the first embodiment together with a part of the evaporator. [Figure 10] FIG. 10 is a graph showing the relationship between the inner diameter of the transportation pipe and the height of the water column rising inside the transportation pipe. [Figure 11] FIG. 11 is a cross-sectional view showing a state in which the refrigerant evaporates in the cooling device of the first embodiment. [Figure 12] FIG. 12 is a cross-sectional view showing a state in which the refrigerant is condensed in the cooling device of the first embodiment. [Figure 13] FIG. 13 is a cross-sectional view taken along line 13-13 in FIG. 4, showing the cooling device of the first embodiment. [Figure 14] FIG. 14 is a plan view showing the internal structure of the cooling device of the present disclosure together with the injection hole and injection pipe. [Figure 15] FIG. 15 is a cross-sectional view taken along line 15-15 in FIG. 14, showing the internal structure of the cooling device of the present disclosure. [Figure 16] FIG. 16 is a cross-sectional view of the injection pipe of the cooling device of the present disclosure in an unsealed state. [Figure 17] FIG. 17 is a cross-sectional view of the injection pipe of the cooling device of the present disclosure in a compressed and sealed state. [Figure 18] FIG. 18 is a cross-sectional view showing the injection hole of the cooling device of the present disclosure sealed with a plug at the end of the injection pipe. [Figure 19]FIG. 19 is a plan view showing the internal structure of the cooling device of the second embodiment. [Figure 20] FIG. 20 is a plan view showing the internal structure of the cooling device of the third embodiment. [Figure 21] FIG. 21 is a cross-sectional view showing a structure of a side wall portion of a container according to the technology of the present disclosure, which is different from that shown in FIG. 8A, at a position where a transport pipe is located. [Figure 22] FIG. 22 is an enlarged perspective view showing a mesh member and its vicinity in a cooling device according to a first modified example of the technique of the present disclosure. [Figure 23] FIG. 23 is a cross-sectional plan view partially showing a second modified example of the cooling device of the technique of the present disclosure. [Figure 24] FIG. 24 is a cross-sectional view taken along line 24-24 of FIG. 23 partially showing a second modified example of the cooling device of the technology of the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] The cooling device 42 of the first embodiment will be described in detail with reference to the drawings.

[0012] 1 and 2 show a cooling device 42 of a first embodiment. Also, Fig. 3 shows an electronic device 32 equipped with the cooling device 42. The electronic device 32 may be, but is not limited to, an information and communication device such as a server.

[0013] The electronic device 32 has a substrate 34 that is rigid and insulating. A plurality of elements 36P, 36Q, and 38 are mounted on the substrate 34. The types of the elements 36P, 36Q, and 38 are not particularly limited, but in the example shown in FIG. 3, the elements 36P and 36Q are processor chips, and the element 38 is a memory module. In this case, the elements 36P and 36Q are an example of a heat generating body. In order to cool the elements 36P and 36Q, a cooling device 42 is disposed in contact with the elements 36P and 36Q.

[0014] In the following, when there is no need to distinguish between element 36P and element 36Q, they will be described as element 36. Similarly, when there is no need to distinguish between various components marked with the letter "P" or "Q," the components will be marked with the numerals only, without the letters "P" and "Q."

[0015] 1 to 5, the cooling device 42 includes a container 44. A refrigerant RF (see FIG. 5) is sealed inside the container 44. The cooling device 42 includes heat receiving portions 46P, 46Q, heat radiating portions 48P, 48Q, and connecting portions 50P, 50Q corresponding to the elements 36P, 36Q, respectively.

[0016] The type of refrigerant RF is not limited as long as it can transfer heat by circulating while undergoing a phase transition between liquid and gas phases in the container 44, and water, for example, can be used. In addition to water, oil or alcohol can also be used, but water is easy to obtain and easy to handle, and is therefore used in this embodiment.

[0017] 3, the heat receiving portions 46P, 46Q are disposed in contact with the corresponding elements 36P, 36Q and receive heat from the elements 36P, 36Q. The heat receiving portions 46P, 46Q are respectively provided with evaporation portions 62P, 62Q that vaporize the liquid-phase refrigerant RF by the heat.

[0018] Heat radiating portions 48P, 48Q are disposed apart from corresponding heat receiving portions 46P, 46Q, and are portions that radiate to the outside heat of the refrigerant RF sealed in container 44. Heat radiating portions 48P, 48Q are provided with condensing portions 72P, 72Q that liquefy the gas phase refrigerant RF by radiating heat.

[0019] The connection portion 50P is a portion that connects the heat receiving portion 46P and the heat dissipation portion 48P, and is also a movement region 74P (see FIG. 4) where the refrigerant RF moves between the evaporation portion 62P and the condensation portion 72P. The connection portion 50Q is a portion that connects the heat receiving portion 46Q and the heat dissipation portion 48Q, and is also a movement region 74Q (see FIG. 4) where the refrigerant RF moves between the evaporation portion 62Q and the condensation portion 72Q.

[0020] Part of the heat of the refrigerant RF in a gas phase state is also discharged to the outside at the connection parts 50P, 50Q, and the refrigerant RF is liquefied.

[0021] In the drawings, the width, depth, and height directions of the container 44 are indicated by arrows W, D, and H, respectively. In this embodiment, the heat dissipation portion 48P is wider in the width direction and shorter in the depth direction than the heat receiving portion 46P. The connection portion 50P is narrower in the width direction than the heat receiving portion 46P, and has a depth for connecting the heat receiving portion 46P and the heat dissipation portion 48P.

[0022] Similarly, the heat dissipation portion 48Q is wider than the heat receiving portion 46Q and shorter than the heat receiving portion 46Q in the width direction. The connection portion 50Q is narrower than the heat receiving portion 46Q in the width direction and has a depth for connecting the heat receiving portion 46Q and the heat dissipation portion 48.

[0023] As shown in FIG. 2, the container 44 has a structure in which two plate members, a bottom plate 52 and a top plate 54, are fixed together in a stacked state in the thickness direction (height direction).

[0024] A plurality of support columns 56 stand upright from the bottom plate 52. The tips (upper ends) of the support columns 56 are in contact with the top plate 54, and the top plate 54 is supported by the support columns 56. The inside of the container 44 is maintained at a low pressure, but even in this low pressure state, the support columns 56 maintain the distance between the top plate 54 and the bottom plate 52 and ensure the internal volume of the container 44.

[0025] 2 and 4, in this embodiment, a plurality of support pillars 56 are arranged at intervals in the width direction of the container 44 in the heat dissipation portions 48P, 48Q, and further, a plurality of support pillars 56 are arranged at intervals in the depth direction of the container 44 in the connection portions 50P, 50Q. In addition, one support pillar 56 is also provided in the heat receiving portions 46P, 46Q on the opposite side of the connection portion 50 with the evaporation portion 62 therebetween.

[0026] 2, openings 58 are formed in the bottom plate 52 at the heat receiving portions 46P and 46Q. A heat receiving plate 60 is fitted into the openings 58, whereby a sealed structure for the container 44 is realized by the bottom plate 52, the top plate 54, and the heat receiving plate 60.

[0027] A plurality of pillar members 64 are erected on the heat receiving plate 60 facing the top plate 54. As shown in detail in Figs. 5 to 7, the plurality of pillar members 64 are arranged at regular intervals in the width direction and the depth direction, and a lattice-shaped groove portion 66 is formed between the pillar members 64. A groove width W1 of the groove portion 66 is narrower than an inner diameter N1 of a transport pipe 78 described later.

[0028] 11, in the groove portion 66, the heat from the heat receiving portions 46P, 46Q promotes the vaporization of the liquid phase refrigerant RF. This "vaporization" includes not only "evaporation" in which the refrigerant RF vaporizes from the surface as shown by the arrow GF, but also "boiling" in which the refrigerant RF vaporizes from the inside as shown by the bubbles GB, but hereinafter, these are all referred to as "evaporation." The portions provided with the pillar members 64 are the portions where the liquid phase refrigerant RF evaporates in this way, and are the evaporation portions 62P, 62Q.

[0029] The tips of the pillar members 64 are in contact with the top plate 54. This also maintains the gap between the top plate 54 and the bottom plate 52 in a low-pressure state inside the vessel 44, and ensures the internal volume of the vessel 44.

[0030] 4, around the column member 64, diffusion regions 68P, 68Q are formed between the top plate 54 and the bottom plate 52. The gas-phase refrigerant RF evaporated in the evaporation sections 62P, 62Q diffuses into the corresponding diffusion regions 68P, 68Q. A portion of the gas-phase refrigerant RF diffused into the diffusion regions 68P, 68Q is condensed and liquefied in the evaporation sections 62P, 62Q by dissipating heat from the top plate 54 into the air via fins 90 described later, and becomes the liquid-phase refrigerant RF.

[0031] Furthermore, between the top plate 54 and the bottom plate 52, a transfer region 74P is formed between the heat receiving portion 46P and the heat dissipation portion 48P, and a transfer region 74Q is formed between the heat receiving portion 46Q and the heat dissipation portion 48Q. The gas-phase refrigerant RF evaporated in the evaporation portions 62P, 62Q transfers to the heat dissipation portions 48P, 48Q through the corresponding transfer regions 74P, 74Q. During this transfer, the heat of the refrigerant RF is discharged to the outside of the container 44, so that the gas-phase refrigerant RF is condensed and liquefied. That is, the connection portions 50P, 50Q and the heat dissipation portions 48P, 48Q are also the portions where the gas-phase refrigerant RF is condensed.

[0032] As shown in Fig. 12, a plurality of protrusions 76 are formed on the top plate 54 toward the bottom of the bottom plate 52 (see Fig. 5). Each of the protrusions 76 is tapered toward the tip. By providing such protrusions 76, the surface area of ​​the top face of the condensation section 72 is increased compared to a structure without the protrusions 76.

[0033] 4 to 6, inside the container 44, a transport section 70P is disposed between the evaporator 62P and the condenser 72P, and a transport section 70Q is disposed between the evaporator 62Q and the condenser 72Q. That is, the evaporator 62P and the transport section 70P are disposed as a pair corresponding to the condenser 72P, and the evaporator 62Q and the transport section 70Q are disposed as a pair corresponding to the condenser 72Q.

[0034] Both of the transport sections 70P and 70Q have transport pipes 78 extending in the depth direction. Although each of the transport sections 70P and 70Q may have one transport pipe 78, in this embodiment, a plurality of transport pipes are arranged in both of the transport sections 70P and 70Q. Specifically, in the example shown in FIG. 13, in each of the transport sections 70P and 70Q, two sets of eight transport pipes 78 arranged adjacent to each other in the width direction are arranged with a support 56 between them, and a total of 16 transport pipes 78 are arranged. The longitudinal direction of the transport pipes 78 coincides with the depth direction (the direction of the arrow D) of the container 44.

[0035] As shown in FIG. 7, the inner diameter N1 of the transport pipe 78 is set to a diameter that is capable of transporting liquid phase refrigerant RF by capillary action and that allows the multiple transport pipes 78 as a whole to transport a sufficient amount of refrigerant RF to the evaporation sections 62P, 62Q.

[0036] Furthermore, the upper limit of the inner diameter N1 of the transport pipe 78 is determined so that the refrigerant RF can be transported from the other end portion 78B to the one end portion 78A by capillary action even when the cooling device 42 is inclined so that one end portion 78A is higher than the other end portion 78B (see Figure 6).

[0037] In this embodiment, as shown in FIG. 13, a space 80 between the transport pipes 78 arranged adjacent to each other in the width direction and the bottom plate 52 is also a region in which the liquid phase refrigerant RF can be transported by capillary action.

[0038] 7 and 9, one end portion 78A of the transportation pipe 78 faces the pillar member 64. In the first embodiment, a gap is provided in this one end portion 78A. More specifically, the transportation pipe 78 is cut out at one end portion to form an inclined portion 82A that is inclined with respect to the longitudinal direction of the transportation pipe 78. This inclined portion 82A is an example of the gap in the first embodiment.

[0039] In particular, in this embodiment, as shown in FIG. 9, the inclined portion 82A is V-shaped with a pair of inclined surfaces 82T that approach each other as they move away from the pillar member 64.

[0040] The portion where the inclined portion 82A is provided, that is, the region between the inclined surfaces 82T, is a gap 84A through which the liquid-phase refrigerant RF moves from the transport pipe 78 to the evaporation portions 62P, 62Q.

[0041] A plurality of inclined portions 82A are formed at regular intervals in the circumferential direction in one transportation pipe 78. In this embodiment, as shown in Fig. 7, two inclined portions 82A are formed in one transportation pipe 78 and spaced apart in the width direction (direction of arrow W) of the container 44.

[0042] 8A, the other end portion 78B of the transport pipe 78 faces the side wall 44S of the container 44. This side wall 44S is a side wall that forms the end portion on the front side in the depth direction (the condenser section 72 side).

[0043] A recess 52H for accommodating the transport pipe 78 is formed in the bottom plate 52 of the container 44. The upper surface of this recess 52H and the upper surface of a transfer groove 98 described later are at the same height in the height direction of the container 44 (the direction of the arrow H).

[0044] A second gap is provided in the other end portion 78B of the transport pipe 78. Specifically, a second inclined portion 82B is formed by inclining the other end portion 78B in one direction with respect to the longitudinal direction of the transport pipe 78, and the region between the side wall 44S and the second inclined portion 82B is a second gap 84B through which the liquid-phase refrigerant RF moves from the condensation portions 72P, 72Q into the transport pipe 78.

[0045] 13, inside the container 44, fasteners 86 are disposed at the connection portions 50P and 50Q. The fasteners 86 have fitting portions 86A that are fitted between the top plate 54 and the bottom plate 52 on both sides in the width direction (arrow W direction), and a pressing portion 86B that presses the multiple transport pipes 78 toward the bottom plate 52 in the center in the width direction. The transport pipes 78 are pressed and fixed against the bottom plate 52 by the pressing portion 86B. Since the multiple transport pipes 78 are fixed in contact with the bottom plate 52, a sufficient flow path cross-sectional area is ensured between the top plate 54 and the transport pipes 78 for the refrigerant RF in a substantially gas phase to move.

[0046] Furthermore, since the set of transport pipes 78 is located between the support pillars 56 and the side surface portions 86C of the pressing portions 86B, the set of transport pipes 78 is also supported in the width direction.

[0047] 3 and 4, in the first embodiment, the condensation sections 72P and 72Q are in communication with each other. That is, in the width direction (arrow W direction), there is no wall or the like between the condensation sections 72P and 72Q, and they are continuous with a constant cross-sectional shape. This allows the refrigerant RF to move between the evaporation section 62P and the evaporation section 62Q via the transport section 70P, the condensation section 72P, the condensation section 72Q, and the transport section 70Q.

[0048] In the condensation parts 72P, 72Q integrated in this way, a movement groove 98 is formed along the width direction (arrow W direction) as shown in FIG. 8B. The movement groove 98 is formed with a groove width G1 that allows the refrigerant RF in liquid phase to move in either direction in the width direction by the surface tension acting on the refrigerant RF in liquid phase. Furthermore, the groove width G1 is set to be wider than the inner dimension N1 of the transport pipe 78. Therefore, the surface tension acting on the refrigerant RF in liquid phase is greater in the transport pipe 78 than in the movement groove 98. In the first embodiment, the movement part in the technology of the present disclosure is structured such that the two condensation parts 72P, 72Q are connected to each other, and the communication part is provided with the movement groove 98, thereby forming the movement part 100.

[0049] 3 and 4, the condensation sections 72P and 72Q are formed in a straight line as a whole. The set of the evaporation section 62P and the transport section 70P and the set of the evaporation section 62Q and the transport section 70Q are both disposed on one side as viewed from the straight-lined condensation sections 72P and 72Q.

[0050] 1 to 4, fastening holes 88 are provided in bottom plate 52 of container 44. Fasteners such as screws are inserted into these fastening holes 88 to fasten cooling device 42 to substrate 34, thereby fixing cooling device 42 to substrate 34. Since element 36 to be cooled is mounted on substrate 34, cooling device 42 is also fixed to element 36.

[0051] The top plate 54 is shaped to avoid the fastening holes 88 when viewed in the overlapping direction with the bottom plate 52 (the direction of the arrow A1 shown in FIG. 1). Therefore, when fixing the cooling device 42 to the substrate 34, the top plate 54 does not get in the way and a fastening operation (for example, turning a screw) can be performed on the fastener.

[0052] 1 and 2, fins 90 are attached to the top plate 54. The fins 90 increase the substantial surface area of ​​the container 44, i.e., the heat dissipation area for dissipating heat to the outside (air cooling). In particular, in this embodiment, the fins 90 are provided over substantially the entire area of ​​the top plate 54, ensuring a wide heat dissipation area.

[0053] As shown in Figs. 14 and 15, the container 44 is provided with an injection hole 92 that communicates the inside and outside of the container 44. An injection pipe 96 extends from the injection hole 92 to the outside of the container 44. To inject the refrigerant RF into the container 44, the air in the container 44 is discharged using a vacuum pump or the like. Thereafter, as shown by the arrow V1 in Fig. 16, the refrigerant is injected through the injection pipe 96. Then, the refrigerant in the container 44 is heated and boiled, and the dissolved air in the refrigerant RF is discharged to the outside of the container 44. However, this operation is not necessary when using a degassed refrigerant from which the dissolved air has been removed in advance. Next, as shown by the arrow V2 in Fig. 17, the injection pipe 96 is compressed from the outside to seal it. Furthermore, as shown in Fig. 18, a plug 94 is inserted into the tip of the injection pipe 96 to seal the injection pipe 96 more firmly. That is, by providing the injection hole 92, the refrigerant RF can be injected into the inside of the container 44 through the injection hole 92. Then, after injection, injection hole 92 is sealed with plug 94, thereby sealing the refrigerant RF inside container 44. Note that injection hole 92, plug 94, and injection pipe 96 are not shown in the drawings other than Figures 17 to 21.

[0054] Next, the operation of this embodiment will be described.

[0055] When the heat receiving portion 46 receives heat from the element 36, this heat vaporizes the liquid-phase refrigerant RF in the groove portion 66 in the evaporation portion 62, as shown in Fig. 5. That is, the liquid-phase refrigerant RF becomes gaseous due to evaporation from the surface of the refrigerant RF (see arrow GF) and boiling from the inside of the refrigerant RF (see bubbles GB).

[0056] The gas-phase refrigerant RF is diffused in the diffusion region 68 and moves to the heat dissipation section 48 through the movement region 74 (see arrow F1 in FIGS. 6 and 7). In the diffusion region 68 and the movement region 74, a part of the gas-phase refrigerant RF is condensed and liquefied by heat dissipation through the fins 90. Furthermore, the refrigerant RF that reaches the heat dissipation section 48 while maintaining its gas-phase state is also condensed and liquefied by being cooled through the fins 90 in the heat dissipation section 48. As a result of the gas-phase refrigerant RF being liquefied in this manner, the heat of condensation is released from the top plate 54 to the outside of the container 44. As a result, the heat of the element 36 is discharged into the outside air.

[0057] 4, the condenser section 72 is formed to be wider in the width direction (arrow W direction) than the evaporator section 62. Therefore, compared to a structure in which the condenser section 72 is not made wider, a larger area for dissipating heat from the gas-phase refrigerant RF can be ensured, and the condensation of the refrigerant RF can be promoted.

[0058] Inside the container 44, the liquid-phase refrigerant RF enters the inside of the transport pipe 78 from the other end portion 78B of the transport pipe 78, as shown by the arrow F2 in Fig. 8A. Furthermore, this refrigerant RF is transported by capillary action to the one end portion 78A, i.e., toward the evaporation section 62, as shown by the arrow F3 in Fig. 5 and Fig. 6. The liquid-phase refrigerant RF is also transported by capillary action to the evaporation section 62 in the space 80 (see Fig. 13) between the transport pipes 78 and the bottom plate 52.

[0059] Then, in the evaporation section 62, the liquid-phase refrigerant RF is evaporated again in the groove section 66. In this manner, inside the container 44, the refrigerant RF is circulated between the evaporation section 62 and the condensation section 72 while repeatedly undergoing phase transition between the liquid phase and the gas phase. The heat received by the heat receiving section 46 can be transferred to the heat dissipation section 48, thereby cooling the element 36 that is the object to be cooled.

[0060] As shown in FIG. 7, in this embodiment, the groove width W1 of the groove 66 of the evaporation section 62 is smaller than the inner diameter N1 of the transportation pipe 78.

[0061] 10 shows the relationship between the inner diameter N1 of the transport pipe 78 and the rising height of the liquid column rising inside the transport pipe 78 due to surface tension (capillary phenomenon) when the liquid temperature is 25° C. This graph shows an example of water used as the refrigerant RF in this embodiment.

[0062] As can be seen from this graph, the smaller the inner diameter N1 of the transport pipe 78, the higher the rising height of the liquid column. In other words, the smaller the inner diameter N1, the greater the surface tension that can cause the refrigerant RF to rise.

[0063] In the transport pipe 78, the liquid phase refrigerant RF is transported to the evaporation section 62 as shown by the arrow F3 in Figures 5 and 6. However, at one end portion 78A of the transport pipe 78, a suction force T1 may act on the refrigerant RF in a direction away from the evaporation section 62 due to the surface tension of the liquid phase refrigerant RF inside, as shown in Figure 7. In contrast, in the evaporation section 62, a suction force T2 may act on the refrigerant RF, drawing the refrigerant RF into the evaporation section 62, due to the surface tension of the liquid phase refrigerant RF in the groove section 66. The suction forces T1 and T2 are forces in opposite directions, but since the suction force T2 is larger, the refrigerant RF flows from the transport pipe 78 toward the evaporation section 62 as shown by the arrow F4.

[0064] Here, for example, as shown in Fig. 6, a case will be considered in which the cooling device 42 is used at an incline such that the one end portion 78A is higher than the other end portion 78B. As an example, a case will be assumed in which the one end portion 78A is higher than the other end portion 78B by about 25 mm. In this case, it will be understood that if the inner diameter N1 of the transport pipe 78 is set to 0.6 mm or less, the refrigerant RF can be transported inside the transport pipe 78 from the other end portion 78B to the one end portion 78A by surface tension.

[0065] In this way, from the viewpoint of increasing the surface tension acting on the refrigerant RF inside the transport pipe 78, it is sufficient to make the inner diameter N1 of the transport pipe 78 smaller. However, if the inner diameter N1 of the transport pipe 78 is made smaller, the flow path cross-sectional area of ​​the refrigerant RF also becomes smaller, and the amount of refrigerant RF that can be transported per unit time also decreases. Therefore, from the viewpoint of ensuring the transport amount of refrigerant RF per unit time, the lower limit value of the inner diameter N1 of the transport pipe 78 is determined.

[0066] 7, in this embodiment, the groove width W1 of the groove portion 66 is narrower than the inner diameter N1 of the transport pipe 78. From the relationship shown in Fig. 10, the surface tension acting on the liquid phase refrigerant RF in the evaporation section 62 is greater than the surface tension acting on the liquid phase refrigerant RF in the transport pipe 78. Therefore, due to the difference between the suction force T2 and the suction force T1, a force that moves from the transport pipe 78 to the evaporation section 62 is applied, and the refrigerant RF can be moved from the transport pipe 78 to the evaporation section 62.

[0067] Here, consider a structure in which one end portion 78A of the transport pipe 78 is formed flat without any gap. In a transport pipe having a flat end portion 78A, if the opening portion of the transport pipe faces the pillar member 64 and is in contact with the entire circumference, this opening portion may be covered by the pillar member 64. By increasing the inner diameter N1 of the transport pipe, it is possible to ensure that the opening portion of the transport pipe is not covered by the pillar member 64, but as described above, there is an upper limit to the inner diameter N1 in order to ensure that surface tension acts on the refrigerant RF.

[0068] In contrast, in this embodiment, an inclined portion 82A is provided at one end portion 78A of the transport pipe 78 as an example of a gap portion. Even if the tip portion of the one end portion 78A is in contact with the evaporation portion 62, a gap 84A is generated between the transport pipe 78 and the evaporation portion 62, where the one end portion 78A does not contact the evaporation portion 62. That is, the opening portion at the one end portion 78A of the transport pipe 78 is not completely blocked by the column member 64. Therefore, as shown by the arrow F5 in FIG. 7, the liquid phase refrigerant RF transported by the transport pipe 78 flows into the groove portion 66 of the evaporation portion 62 through the gap 84A. That is, a structure that makes it easy for the liquid phase refrigerant RF to move from the transport pipe 78 to the evaporation portion 62 is realized.

[0069] As described above, in a structure in which the groove width W1 of the groove portion 66 is narrower than the inner diameter N1 of the transport pipe 78, the pillar member 64 becomes relatively thick and covers a wide range of the opening portion of the transport pipe 78. However, even in such a structure, in this embodiment, a gap 84A is generated between the transport pipe 78 and the evaporation section 62, so that the liquid phase refrigerant RF can be reliably moved from the transport pipe 78 to the evaporation section 62.

[0070] In the first embodiment, the gap is an inclined portion 82A provided in one end portion 78A of the transportation pipe 78. When the gap is provided in the transportation pipe 78 in this manner, no other member is required to generate the gap 84A, and the structure of the cooling device 42 can be simplified.

[0071] In the above example, the gap portion is the inclined portion 82 A. That is, the gap 84 A can be generated by a simple structure in which one end portion 78 A of the transportation pipe 78 is inclined with respect to the longitudinal direction of the transportation pipe 78.

[0072] 9, the inclined portion 82A has a pair of inclined surfaces 82T. The inclined surfaces 82T are surfaces that approach each other as they move away from the evaporation portion 62. By forming the inclined portion 82A with such inclined surfaces 82T, it is possible to realize a structure in which the gap 84A is generated without excessively increasing the cutting depth of the inclined portion 82A (the length of the portion cut from the evaporation portion 62 side).

[0073] Note that one end portion 78A of the transportation pipe 78 may be provided with an inclined portion inclined in one direction, similar to the second inclined portion 82B of the other end portion 78B.

[0074] Moreover, the inclined portions 82A, which are an example of a gap portion, are provided at a plurality of locations (two locations in this embodiment) in the circumferential direction of one transport pipe 78. By providing a plurality of gap portions, a plurality of gaps 84A are generated, and therefore, compared to a structure in which a gap portion is provided at only one location in one transport pipe 78, a larger cross-sectional area can be ensured for the portion through which the refrigerant RF flows from the transport pipe 78 to the evaporation section 62.

[0075] 8A, the other end portion 78B of the transport pipe 78 is provided with a second inclined portion 82B as an example of a second gap portion, and a second gap 84B is generated between the other end portion 78B and the side wall 44S of the container 44. That is, the opening portion of the other end portion 78B of the transport pipe 78 is not blocked by the side wall 44S. Therefore, a structure is realized in which the liquid phase refrigerant RF in the container 44 can easily flow into the inside of the transport pipe 78 through the second gap 84B.

[0076] In the first embodiment, the transport unit 70 has a plurality of transport pipes 78. As the transport unit 70, for example, a plate-like member or the like having holes formed therein that serve as flow paths for the liquid phase refrigerant RF can be used instead of or in combination with the transport pipes 78. By including the transport pipes 78 in the transport unit 70, the transport unit 70 can be formed with a simple structure.

[0077] A plurality of transport pipes 78 are arranged in parallel. As described above, in terms of increasing the surface tension acting on the liquid-phase refrigerant RF flowing through the transport pipe 78, there is an upper limit to the inner diameter N1 of the transport pipe 78, and therefore it is difficult to ensure a sufficient flow rate with only one transport pipe 78. In contrast, by arranging a plurality of transport pipes 78 in parallel, the transport pipes 78 can ensure a larger flow rate as a whole.

[0078] Since the transport pipe 78 is fixed to the container 44 by the fasteners 86, the transport pipe 78 can be prevented from shifting out of position or falling off.

[0079] The multiple transport pipes 78 are arranged so that a flow path for the liquid-phase refrigerant RF is also formed between two adjacent transport pipes 78 and the bottom plate 52. Not only the inside of the transport pipes 78 but also the outside of the transport pipes 78 is used as a region through which the liquid-phase refrigerant RF flows, so that a larger flow rate of the refrigerant RF can be ensured compared to a structure in which such a flow path is not formed.

[0080] The cooling device 42 of the first embodiment is a device capable of cooling a plurality of elements, two elements 36P and 36Q in the example shown in FIG.

[0081] However, when the two elements 36P and 36Q generate heat, there is often a difference in the amount of heat generated, rather than when the amount of heat generated by both the elements 36P and 36Q reaches the upper limit at the same time. For example, when the element 36P generates more heat than the element 36Q, the evaporator 62P, which is acted upon by the heat of the element 36P, evaporates more refrigerant RF than the evaporator 62Q, which is acted upon by the heat of the element 36Q. Conversely, when the element 36Q generates more heat than the element 36P, the evaporator 62Q evaporates more refrigerant RF than the evaporator 62P.

[0082] Here, a cooling device in which condensation portions 72P and 72Q are not in communication with each other as in this embodiment and refrigerant RF cannot move between condensation portions 72P and 72Q will be considered as a comparative example.

[0083] In the cooling device of the comparative example, a structure is adopted on the element 36P side that can reliably cool the element 36P when the amount of heat generated by the element 36P reaches a maximum, and a structure is also adopted on the element 36Q side that can reliably cool the element 36Q when the amount of heat generated by the element 36P reaches a maximum. Specifically, as each fin 90, a fin that is enlarged in advance is used so that the element 36P can be cooled when it reaches its maximum amount of heat generated. Also, in a structure in which cooling air is blown from a fan onto the fins 90, the blowing capacity of the fan is increased in advance, etc.

[0084] In this way, a structure in which the fins 90 are enlarged or the fan's blowing capacity is increased may result in the cooling device itself becoming larger, making it difficult to densely mount various components, elements, etc. as an electronic device.

[0085] In contrast, in the cooling device 42 of the first embodiment, the condensation sections 72P and 72Q are in communication with each other, so that the liquid-phase refrigerant RF moves between them. As a result, a larger amount of refrigerant RF is supplied to the evaporation section 62 corresponding to one of the elements 36P and 36Q that generates a relatively large amount of heat, enabling efficient cooling.

[0086] For example, assume that the amount of heat generated by the element 36P is relatively greater than the amount of heat generated by the element 36Q. In this case, the evaporation of the refrigerant RF is promoted more in the evaporator 62P than in the evaporator 62Q. Therefore, the amount of liquid-phase refrigerant RF transported from the condenser 72P to the evaporator 62P is greater than the amount of liquid-phase refrigerant RF transported from the condenser 72Q to the evaporator 62Q. The phase transition of the refrigerant RF between the evaporator 62P and the condenser 72P is more advanced than the phase transition of the refrigerant RF between the evaporator 62Q and the condenser 72Q, and the liquid-phase refrigerant RF moves from the condenser 72Q to the condenser 72P. That is, a larger amount of refrigerant RF is supplied to the evaporator 62P where the amount of evaporation of the refrigerant RF is relatively greater.

[0087] In the first embodiment, in this manner, depending on the difference in heat generation between elements 36P, 36Q, liquid phase refrigerant RF can be circulated and appropriately distributed between condensation sections 72P, 72Q so as to more effectively cool element 36P, which has a larger heat generation amount.

[0088] Moreover, in order to appropriately distribute the RF refrigerant between the liquid-phase RF refrigerant condensation parts 72P, 72Q in this manner, devices such as a sensor for detecting the amount of the RF refrigerant and a pump for transporting the RF refrigerant are not required. Without providing and controlling these devices, the RF refrigerant can be appropriately distributed between the liquid-phase RF refrigerant condensation parts 72P, 72Q at low cost and easily.

[0089] Then, the elements 36 can be cooled according to the maximum heat generation amount of each of the multiple elements 36, without increasing the size of the evaporator 62, the condenser 72, and the fins 90. By suppressing the increase in size of the evaporator 62, the condenser 72, and the fins 90, it is possible to contribute to improving the mounting density of various parts including the elements 36, 38 on the substrate 34.

[0090] Additionally, in an electronic device 32 having a plurality of elements 36, it is possible to reduce the temperature difference between the plurality of elements 36. Reducing the effect of the temperature difference on the transmission and reception of signals between the plurality of elements 36 can also contribute to improving the performance of the electronic device 32.

[0091] In addition, in the cooling device of the comparative example, in order to increase the cooling capacity for one of the multiple elements 36, the amount of air sent from the fan sending air to the fins 90 on the side of the high-temperature element 36 may be increased, but increasing the amount of air sent increases power consumption. Moreover, if the amount of air sent from some of the multiple fans is increased, the balance of the air volume and air direction in the entire cooling device may be lost, and air may not be sent efficiently, so it is necessary to increase the amount of air sent from all fans. Increasing the amount of air sent from all fans in this way leads to a further increase in power consumption for the entire cooling device.

[0092] In contrast, in the cooling device 42 of the first embodiment, even if there is a difference in the amount of heat generated by the elements 36P, 36Q, the liquid-phase refrigerant RF moves between the condensation portions 72P, 72Q, so that the required cooling capacity can be obtained by ensuring the amount of air received by the entire fins 90. By arranging the fins 90 of the heat dissipation portions 48P, 48Q at positions where they receive the cooling air from the fan with high efficiency, it is possible to further increase the cooling capacity of the cooling device 42 while miniaturizing the heat dissipation portions 48P, 48Q. Moreover, by miniaturizing the heat dissipation portions 48P, 48Q, the cooling device 42 can also be miniaturized, and it is also possible to improve the mounting density of various components including the elements 36, 38, etc.

[0093] In addition, in the cooling device 42 of the first embodiment, the heat dissipation sections 48 are shared by the multiple heat receiving sections 46. Therefore, as long as the total amount of heat cooled by the multiple heat receiving sections 46 is within the range of the total amount of heat dissipation by the multiple heat dissipation sections 48, the multiple elements 36 can be reliably cooled. Even if the total amount of heat cooled by the multiple heat receiving sections 46 exceeds the total amount of heat dissipation by the multiple heat dissipation sections 48, the cooling capacity of the cooling device 42 as a whole can be efficiently increased by, for example, increasing the airflow rate of the fan, because the multiple heat dissipation sections 48 are shared.

[0094] In the cooling device 42 of the first embodiment, the two condensation portions 72P, 72Q are in communication with each other, and a transfer groove 98 is formed to connect the condensation portions 72P, 72Q. The groove width G1 (see FIG. 8B) of the transfer groove 98 is set so that the liquid phase refrigerant RF can be moved in the width direction by surface tension. Therefore, compared to a structure in which the transfer groove 98 is not formed, the liquid phase refrigerant RF can be moved more efficiently between the two condensation portions 72P, 72Q.

[0095] Moreover, the groove width G1 of the movement groove 98 is larger than the inner dimension N1 of the transport pipe 78. According to the relationship shown in Fig. 10, the surface tension acting on the liquid phase refrigerant RF in the transport pipe 78 is larger than the surface tension acting on the liquid phase refrigerant RF in the movement groove 98. Therefore, the surface tension prevents the refrigerant RF from flowing from the transport pipe 78 to the movement groove 98, and a flow of the refrigerant RF from the movement groove 98 toward the transport pipe 78 is reliably generated.

[0096] In each of the above embodiments, the evaporation parts 62P, 62Q and the transport parts 70P, 70Q are arranged on the same side of the linear condensation parts 72P, 72Q. This arrangement allows the heat receiving parts 46P and 46Q to be positioned in correspondence with the elements 36P and 36Q, respectively, in an electronic device in which the elements 36P and 36Q are mounted in close proximity to each other, thereby ensuring reliable heat reception.

[0097] In contrast, the set of evaporator 62P and transporter 70P and the set of evaporator 62Q and transporter 70Q may be disposed on the opposite side of the linear condenser 72P, 72Q. For example, when elements 36P, 36Q are mounted at positions apart due to mounting space on substrate 34, the set of evaporator 62P and transporter 70P and the set of evaporator 62Q and transporter 70Q may be disposed on the opposite side of the linear condenser 72P, 72Q.

[0098] Furthermore, a structure may be provided with three or more pairs of evaporators 62 and transporters 70 in correspondence with an electronic device having three or more elements 36. In this case, all pairs of evaporators 62 and transporters 70 may be on the same side of the linear condensers 72, or some pairs may be on the opposite side.

[0099] Furthermore, the multiple condensation portions 72 do not have to be formed linearly as a whole. For example, the two condensation portions 72P, 72Q may be bent or curved at the boundary portion to be integrated. Forming the multiple condensation portions 72 linearly is advantageous for smooth movement of the refrigerant RF, since there are no points where the flow resistance increases when the refrigerant RF moves between the condensation portions 72.

[0100] In each of the above embodiments, a support 56 is disposed between the top plate 54 and the bottom plate 52 inside the container 44. The support 56 can maintain the gap between the top plate 54 and the bottom plate 52, so that a volume can be secured inside the container 44 for circulating the refrigerant RF while causing a phase transition between the liquid phase and the gas phase. In particular, the inside of the container 44 is maintained at a lower pressure than the atmospheric pressure in order to promote the vaporization of the liquid phase refrigerant RF. In this case, a force acts on the top plate 54 and the bottom plate 52 in the approaching direction due to the pressure difference between the pressure inside the container 44 (vapor pressure of the gas phase refrigerant RF) and the atmospheric pressure. Even when such a force acts, the gap between the top plate 54 and the bottom plate 52 can be maintained.

[0101] In addition, the support pillar 56 may be attached to the top plate 54 and have its lower end in contact with the bottom plate 52, or it may be separate from both the top plate 54 and the bottom plate 52 and have its upper end in contact with the top plate 54 and its lower end in contact with the bottom plate 52.

[0102] The transport pipe 78 is fixed to the container 44 by a fastener 86. The transport pipe 78 is not fixed to the container by so-called brazing or bonding, and no wax or adhesive is required. Since no wax or adhesive is used, the wax or adhesive will not melt due to temperature changes (high temperatures) during the manufacture of the cooling device 42, etc.

[0103] In addition, by fixing the multiple transport pipes 78 in contact with the bottom plate 52 using the fixing devices 86, a sufficient flow path cross-sectional area can be secured between the top plate 54 and the transport pipes 78 for the refrigerant RF in the gas phase to move substantially.

[0104] The top plate 54 is provided with protrusions 76. The gas-phase refrigerant RF that flows while in contact with the top plate 54 is condensed and liquefied by dissipating heat to the outside of the container 44 through the top plate 54. At this time, as shown in FIG. 12, the protrusions 76 increase the substantial contact area of ​​the refrigerant RF in contact with the top plate 54 compared to a structure without the protrusions 76. This makes it easier for the gas-phase refrigerant RF to be liquefied as droplets RD, and the liquefaction of the refrigerant RF can be promoted. The liquefied refrigerant RF is efficiently dripped along the protrusions 76, so that a thin liquid film can be maintained in the portions of the top plate 54 where the protrusions 76 are not formed. By maintaining a thin liquid film, heat is efficiently transferred from the gas-phase refrigerant RF to the top plate 54, and a structure that maintains a high condensation and liquefaction capacity of the refrigerant RF can be realized.

[0105] The container 44 is provided with fastening holes 88. By inserting fasteners into these fastening holes 88, a structure in which the cooling device 42 is fixed to the substrate 34 and further to the element 36 to be cooled can be easily realized.

[0106] The cooling device 42 has fins 90. The fins 90 increase the area over which the cooling device 42 radiates heat to the outside, so that the gas-phase refrigerant RF can be condensed and liquefied more efficiently inside the container 44, compared to a structure without the fins 90.

[0107] Container 44 has an injection hole 92. This injection hole 92 allows refrigerant RF to be easily injected into the interior of container 44 through an injection pipe 96. Then, by inserting a plug 94 into injection pipe 96, injection hole 92 is sealed with plug 94, thereby achieving a structure in which refrigerant RF is hermetically sealed inside container 44.

[0108] Next, a second embodiment will be described. In the second embodiment, the same elements, members, etc. as those in the first embodiment are denoted by the same reference numerals, and detailed description will be omitted. In addition, the overall structure of the cooling device 242 of the second embodiment is similar to that of the cooling device 42 of the first embodiment, and therefore will not be illustrated.

[0109] In a cooling device 242 of the second embodiment, different types of elements are used for element 36P and element 36Q, as shown in Fig. 19. In the example shown in Fig. 19, element 36P is larger than element 36Q and has a larger maximum heat generation amount.

[0110] In the cooling device 242 of the second embodiment, the heat receiving section 46P and the evaporation section 62P corresponding to the element 36P are larger than the heat receiving section 46P and the evaporation section 62Q corresponding to the element 36Q. Furthermore, the transport section 70P corresponding to the element 36P has a larger number of transport pipes 78 than the transport section 70 corresponding to the element 36Q.

[0111] The cooling device 242 of the second embodiment thus constructed can also reliably cool the elements 36P, 36Q in accordance with the amounts of heat generated by the elements 36P, 36Q.

[0112] Here, for example, when cooling a plurality of elements 36 with different heat values, a structure may be adopted in which a cooling device having sufficient cooling capacity is provided for each element 36 so that each element 36 can be cooled even when it generates heat at its maximum heat value. However, a cooling device that corresponds to the maximum heat value of each element 36 leads to an increase in size of the cooling device. In particular, for example, in the example shown in FIG. 19, the element 36Q may be mounted close to the element 36P for the purpose of maintaining good communication between the element 36P and the element 36Q. When the element 36P is placed close to the element 36Q in this way, the element 36Q is more likely to receive heat from the element 36P. Furthermore, a fixture that fixes the element 36Q to the board may also hinder the flow of cooling air toward the fin 90. If the cooling device for cooling the element 36Q is enlarged in order to avoid these inconveniences, it may result in a decrease in the mounting density of various mounted components such as the elements 36P and 36Q, and instability of operation.

[0113] In contrast, in the cooling device 242 of the second embodiment, the size of the evaporation sections 62P, 62Q and the number of transport pipes 78 of the transport sections 70P, 70Q are set according to the difference in the maximum heat generation amount of the elements 36P, 36Q. The two condensation sections 72P, 72Q are shared as a cooling structure for the elements 36P, 36Q, and the refrigerant RF can move between the condensation sections 72P, 72Q. This makes it possible to realize an integrated cooling structure in which the cooling capacity for each of the elements 36P, 36Q is appropriately distributed according to the elements 36P, 36Q having different maximum heat generation amounts.

[0114] Furthermore, in the cooling device 242 of the second embodiment, by arranging the fins 90 of the heat dissipation sections 48P, 48Q in a position that receives the cooling air from the fan with high efficiency, it is possible to reduce the size of the heat dissipation sections 48P, 48Q while further enhancing the cooling capacity of the cooling device 42.

[0115] Next, a third embodiment will be described. In the third embodiment, the same elements, members, etc. as those in the first embodiment are denoted by the same reference numerals, and detailed description will be omitted. In addition, the overall structure of the cooling device 342 of the second embodiment is similar to that of the cooling device 42 of the first embodiment, and therefore will not be illustrated.

[0116] In a cooling device 342 of the third embodiment, as shown in Fig. 20, two condensation sections 72P, 72Q are formed independently. A structure is provided with a communication pipe 344 as a moving section 100 between the condensation sections 72P, 72Q. Note that, in the example shown in Fig. 20, the moving groove 98 (see Fig. 4) of the first embodiment is not formed, but the moving groove 98 may be formed in each of the condensation sections 72P, 72Q.

[0117] In the third embodiment, the inner diameter of the communication pipe 344 is set to be larger than the inner dimension N1 of the transport pipe 78 and allows the refrigerant RF to move in the width direction due to the surface tension acting on the liquid phase refrigerant RF.

[0118] In the cooling device 342 of the third embodiment having such a structure, the condensation sections 72P, 72Q are also in communication with each other through the communication pipe 344, so that the liquid-phase refrigerant RF can be moved between the condensation sections 72P, 72Q through the communication pipe 344. The liquid-phase refrigerant RF moves between the condensation sections 72P, 72Q. As a result, more refrigerant RF is supplied to the evaporation section 62 corresponding to the element that generates a relatively large amount of heat, out of the elements 36P, 36Q, thereby realizing a structure that efficiently cools.

[0119] In particular, in the cooling device 342 of the third embodiment, the two condensation sections 72P, 72Q are communicated with each other by the communication pipe 344, and thus these condensation sections 72P, 72Q are independent of each other, so that there is a high degree of freedom in the shape, size, mounting position, etc. of each condensation section.

[0120] In contrast, in a structure in which two condensation sections 72P, 72Q are integrated, such as in the cooling device 42 of the first embodiment, the top plates of the condensation sections 72P, 72Q are continuous, and by installing fins 90 also in this continuous portion, a large installation area for the fins 90 can be secured.

[0121] In addition, in the cooling device 242 that can accommodate the different amounts of heat generated by elements 36P, 36Q as in the second embodiment, it is also possible to adopt a structure in which two condensation sections 72P, 72Q are independent and these condensation sections 72P, 72Q are connected by a connecting pipe 344 as in the third embodiment.

[0122] In each of the above-described embodiments, the structure of the transport section 70 is not limited to the above. As an example, in the structure shown in Fig. 8A, the second inclined portion 82B faces obliquely upward, but the second inclined portion 82B may face obliquely downward, for example, as in the modified example shown in Fig. 21. In the second inclined portion 82B facing obliquely downward, the liquid phase refrigerant RF is easily caused to flow into the inside of the transport pipe 78.

[0123] Furthermore, in each of the above-described embodiments, the structure for providing a gap between the transport pipe 78 and the evaporator 62 is not limited to the above-described structure.

[0124] 22, a first modified example has, as an example of a gap portion, a mesh member 204 separate from the transport pipe 78 and the evaporation section 62. The mesh member 204 is disposed between the transport pipe 78 and the evaporation section 62, with one surface in contact with the transport pipe 78 and the other surface in contact with the evaporation section 62. Note that in the cooling device 42 of the second embodiment, the inclined portion 82A (see FIG. 9) of the first embodiment is not formed in one end portion 78A of the transport pipe 78, and the one end portion 78A is perpendicular to the longitudinal direction of the transport pipe 78.

[0125] The mesh member 204 is a member that allows fluid to move in the thickness direction (direction of arrow T), and this mesh member 204 creates a gap 84A between the transport pipe 78 and the evaporation section 62. Therefore, one end portion 78A of the transport pipe 78 is not blocked by the evaporation section 62, and a flow path of the refrigerant RF from this one end portion 78A to the evaporation section 62 is secured. That is, even in the structure shown in Fig. 14, a structure that makes it easy for the liquid phase refrigerant RF to move from the transport pipe 78 to the evaporation section 62 is realized.

[0126] 22 , the mesh member 204, which is an example of a gap portion, is separate from the transport pipe 78 and the evaporation section 62. Therefore, it does not affect the shapes of the transport pipe 78 or the evaporation section 62. For example, it is not necessary to process the one end portion 78A of the transport pipe 78, and the structure can be simplified.

[0127] The mesh member 204 is disposed between the transport pipe 78 and the evaporation section 62 and is in contact with both of them. This maintains the relative positions of the transport pipe 78 and the evaporation section 62, and therefore the state in which the gap 84A is generated can also be maintained.

[0128] As a structure for providing a gap between the transport pipe 78 and the evaporation section 62, a second modified example shown in Figs. 23 and 24 may be used.

[0129] In a second modified example shown in Fig. 23 and Fig. 24, a recess 304 is provided in the bottom plate 52. The recess 304 has a shape capable of accommodating the lower portions of the transport pipes 78. A wall portion 306A is provided as a part of the bottom plate 52 between the recess 304 and the evaporation section 62. A second wall portion 306B is provided as a part of the bottom plate 52 between the recess 304 and the side wall 44S of the container 44. The wall portion 306A and the second wall portion 306B are essentially portions of the bottom plate 52 where the recess 304 is not provided.

[0130] The wall portion 306A faces one end portion 78A of the transport pipe 78, but is set to a height H2 that is sufficient not to obstruct the substantial flow of the refrigerant RF in the inner circumferential portion of the transport pipe 78. The wall portion 306A creates a gap 84A between the one end portion 78A of the transport pipe 78 and the condensation portion 72.

[0131] In the second modified example, the wall portion 306A creates a gap 84A between the transport pipe 78 and the evaporation portion 62. Therefore, the one end portion 78A of the transport pipe 78 is not blocked by the evaporation portion 62, and a flow path of the refrigerant RF from the one end portion 78A to the evaporation portion 62 is secured. That is, also in the second modified example, a structure that makes it easy for the liquid phase refrigerant RF to move from the transport pipe 78 to the evaporation portion 62 is realized.

[0132] The second wall portion 306B faces the other end portion 78B of the transport pipe, but is set to a height H3 that does not substantially hinder the flow of the refrigerant RF in the inner circumferential portion of the transport pipe 78. The second wall portion 306B creates a second gap 84B between the other end portion 78B of the transport pipe 78 and the side wall 44S of the container 44. That is, in the third embodiment, the second wall portion 306B is an example of a second gap portion. Note that the height H2 of the wall portion 306A and the height H3 of the second wall portion 306B both correspond to the depth of the recess 304, and therefore the height H2 of the wall portion 306A and the height H3 of the second wall portion 306B are equal to each other.

[0133] In the second modified example, a wall portion 306A, which is an example of a gap, is provided in the container 44. Since a gap is not provided in the transportation pipe 78, there is no need to process the one end portion 78A of the transportation pipe 78, and the structure can be simplified. In addition, since there is no need to provide a new member as the gap, the number of parts does not increase.

[0134] In the second modification, a recess 304 is provided in the container 44. As a portion facing one end portion 78A of the transportation pipe 78, a structure having a gap can be realized with a simple structure.

[0135] Furthermore, since the transport pipe 78 is housed in the recess 304 of the bottom plate 52, a larger space can be secured between the transport pipe 78 and the top plate 54 compared to a structure without the recess 304.

[0136] In the above, the pillar member 64 is given as an example of a member for forming the groove portion 66 in the evaporation portion 62, but the member for forming the groove portion 66 is not limited to this pillar member. For example, a structure in which a plurality of wall members extending in the depth direction are arranged at regular intervals in the width direction may be used. In a structure having wall members, groove portions extending in the depth direction are formed between the wall members.

[0137] The above describes the embodiments of the technology disclosed in the present application. However, the technology disclosed in the present application is not limited to the above, and it goes without saying that the technology disclosed in the present application can be implemented in various modified forms without departing from the spirit and scope of the present invention.

[0138] This specification further discloses the following supplementary notes regarding the above embodiments. (Appendix 1) A container in which a refrigerant is sealed; a plurality of evaporators that evaporate the refrigerant in a liquid phase inside the container by receiving heat; a plurality of condensation sections provided in the plurality of evaporators, respectively, for condensing the refrigerant in the gas phase inside the container by dissipating heat; a transport section that transports the refrigerant in a liquid phase from the condensation section to the evaporation section by surface tension; A transfer section that transfers the refrigerant in a liquid phase between the plurality of condensation sections so that the refrigerant can be transferred therebetween; A cooling device having (Appendix 2) The moving part is 2. The cooling device according to claim 1, wherein a plurality of the condensation sections are integrated together, the integrated condensation sections are provided continuously, the liquid phase refrigerant can be moved by surface tension, and a movement groove having a flow path cross-sectional area larger than that of the transport section is provided. (Appendix 3) 2. The cooling device according to claim 1, wherein the moving section is a connecting pipe that is spanned between a plurality of the condensation sections to connect the condensation sections and has a flow path cross-sectional area larger than that of the transport section. (Appendix 4) 4. The cooling device according to claim 1, wherein a plurality of the condensation sections are arranged in a straight line. (Appendix 5) 5. The cooling device according to claim 4, wherein a plurality of the evaporators are arranged on the same side as a plurality of the condensers arranged in a straight line. (Appendix 6) The cooling device according to any one of claims 1 to 5, further comprising a gap portion between the transport portion and the evaporation portion, the gap portion generating a gap through which the refrigerant in a liquid phase moves from the transport portion to the evaporation portion. (Appendix 7) The transport unit is 7. The cooling device according to any one of claims 1 to 6, further comprising a transport pipe that transports the refrigerant in a liquid phase to the evaporation section by capillary action. (Appendix 8) The cooling device according to claim 7, wherein a plurality of the transport pipes are arranged in parallel. (Appendix 9) The cooling device according to any one of claims 1 to 8, further comprising a support pillar disposed between a top plate and a bottom plate of the container to maintain a distance between the top plate and the bottom plate. (Appendix 10) 10. The cooling device according to any one of claims 1 to 9, further comprising a fastener for fastening the transport unit to the container. (Appendix 11) 11. The cooling device according to any one of claims 1 to 10, wherein the condensation portion has a protrusion protruding from a top plate of the container toward an inside of the container. (Appendix 12) 12. The cooling device according to any one of claims 1 to 11, further comprising a fastening hole provided in the container, through which a fastener for fixing the container to an object to be cooled is inserted. (Appendix 13) 13. The cooling device according to any one of claims 1 to 12, further comprising fins in contact with the container for dissipating heat from the container to the outside. (Appendix 14) an injection hole provided in the container for injecting the refrigerant into the container; A plug for sealing the injection hole; The cooling device according to any one of claims 1 to 13, comprising: [Explanation of symbols]

[0139] 32 Electronic equipment 34 Substrate 36, 36P, 36Q elements (examples of heat generating components and cooling targets) 38 elements 42 Cooling device 44 Container 44S side wall 46, 46P, 46Q heat receiving part 48, 48P, 48Q heat dissipation section 50, 50P, 50Q Connections 52 Bottom plate 52H recess 54 Tabletop 56 Pillar 62, 62P, 62Q Evaporation section 64 Column members 70, 70P, 70Q Transportation Department 72, 72P, 72Q Condenser 74, 74P, 74Q moving area 76 Protrusion 78 Transport Pipe 78A One end part 78B Other end 82A Inclined section 82B Second slope part 84A Gap 84B Second gap 86 Fixtures 88 Fastening hole 90 Fin 92 Injection hole 94 Stopper 96 Injection pipe 98 Moving groove 100 Moving Part 204 Net components 242 Cooling device 304 Recess 306A Wall section 306B Second wall section 342 Cooling device 344 Connecting pipe (an example of a moving part)

Claims

1. A container in which a refrigerant is sealed; a plurality of evaporators that evaporate the refrigerant in a liquid phase inside the container by receiving heat; a plurality of condensation sections provided in the plurality of evaporators inside the container, respectively, for condensing the refrigerant in a gas phase inside the container by dissipating heat; a transport section that transports the refrigerant in a liquid phase from the condensation section to the evaporation section by surface tension; A transfer section that transfers the refrigerant in a liquid phase between the plurality of condensation sections so that the refrigerant can be transferred therebetween; having The moving part is A cooling device comprising: a plurality of condensation sections integrated together; a movement groove that is provided continuously in the integrated condensation sections and that allows the liquid phase refrigerant to move by surface tension; and a flow path cross-sectional area that is larger than that of the transport section.

2. The cooling device according to claim 1 , wherein a plurality of the condensation sections are arranged in a straight line.

3. The cooling device according to claim 2 , wherein a plurality of said evaporators are arranged on the same side as a plurality of said condensers arranged in a line.

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