Circuit Module

Abstract

To reduce the size of a circuit module.SOLUTION: A circuit board includes a substrate main body having a positive main surface and a negative main surface that are arranged in this order to a negative direction of a Z-axis. The negative main surface of the substrate main body is covered with an insulating member. An electronic component includes an electronic component main body, and a first electronic component external electrode and a second electronic component external electrode that are provided on a surface of the electronic component main body. The electronic component is fixed to a surface of the insulating member. A first wire and a second wire extend along the surface of the insulating member. The first electronic component external electrode is electrically connected to the first wire. The second electronic component external electrode is electrically connected to the second wire. The first wire and the second wire are electrically connected to the circuit board.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a circuit module. [Background technology]

[0002] A known example of a conventional circuit module is the power supply module described in Patent Document 1. This power supply module includes a substrate, an inductor, an IC, and a plurality of capacitors. The inductor, the IC, and the plurality of capacitors are mounted on the substrate. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2017 / 183385 Summary of the Invention [Problem to be solved by the invention]

[0004] Incidentally, in the power supply module described in Patent Document 1, there is a demand for miniaturizing the power supply module.

[0005] SUMMARY OF THE PRESENT EMBODIMENT An object of the present invention is to reduce the size of a circuit module. [Means for solving the problem]

[0006] A circuit module according to one aspect of the present invention includes: the circuit module includes a circuit board, an insulating member, an electronic component, a first wire, and a second wire; The X-axis, Y-axis, and Z-axis are mutually perpendicular. the circuit board includes a board body having a positive main surface and a negative main surface arranged in this order in the negative direction of the Z axis, the insulating member covers the negative principal surface of the substrate body, the electronic component has an electronic component body, and a first electronic component external electrode and a second electronic component external electrode provided on a surface of the electronic component body, the electronic component is fixed to a surface of the insulating member, the first wire and the second wire extend along the surface of the insulating member, the first electronic component external electrode is electrically connected to the first wire; the second electronic component external electrode is electrically connected to the second wire; The first wire and the second wire are electrically connected to the circuit board. Effect of the Invention

[0007] According to the present invention, the circuit module can be made smaller. [Brief description of the drawings]

[0008] [Figure 1] FIG. 1 is a perspective view of a circuit module 10. As shown in FIG. [Diagram 2] FIG. 2 is a perspective view of the circuit module 10. As shown in FIG. [Diagram 3] FIG. 3 is a cross-sectional view of the circuit module 10. [Figure 4] FIG. 4 is a diagram showing the main surface S1 of the circuit board 12. As shown in FIG. [Diagram 5] FIG. 5 is an equivalent circuit diagram of the circuit module 10. As shown in FIG. [Figure 6] FIG. 6 is an equivalent circuit diagram of the electronic components 20a and 22a, the first wire 16a, and the second wire 18a. [Figure 7] FIG. 7 is a perspective view of the circuit module 10a. [Figure 8] FIG. 8 is a cross-sectional view of the circuit module 10a. [Figure 9] FIG. 9 is a cross-sectional view of the circuit module 10b. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] (Embodiment) [Structure of circuit module 10] The structure of a circuit module 10 according to one embodiment of the present invention will be described below with reference to the drawings. Fig. 1 and Fig. 2 are perspective views of the circuit module 10. Fig. 3 is a cross-sectional view of the circuit module 10. Fig. 4 is a diagram showing the main surface S1 of the circuit board 12. Fig. 5 is an equivalent circuit diagram of the circuit module 10.

[0010] Hereinafter, the direction from the positive principal surface S1 to the negative principal surface S2 of circuit board 12 is defined as the negative direction of the Z axis. When viewed in the negative direction of the Z axis, circuit board 12 has a square shape. When viewed in the negative direction of the Z axis, two sides of circuit board 12 extend along the X axis. When viewed in the negative direction of the Z axis, the remaining two sides of circuit board 12 extend along the Y axis. The X axis, Y axis, and Z axis are perpendicular to each other.

[0011] The circuit module 10 is, for example, a power supply module. Therefore, the circuit module 10 includes a circuit that converts a power supply voltage into an appropriate voltage and outputs the voltage to a load. In this embodiment, the circuit module 10 is a DC-DC converter. As shown in Figs. 1 to 3, the circuit module 10 includes a circuit board 12, an insulating member 14, electronic components 20a, 20b, 22a, 22b, 24a, 24b, 26a, and 26b, first wires 16a and 16b, second wires 18a and 18b, third wires 30a to 30f, fourth wires 32a to 32f, an inductor element 60, and a semiconductor integrated circuit 61.

[0012] The circuit board 12 is, for example, a glass epoxy board. As shown in Fig. 4, the circuit board 12 includes a board body 39, first circuit board external electrodes 40a-40f, 46a-46f, second circuit board external electrodes 42a-42f, 44a-44f, third circuit board external electrodes 50a-50f, and fourth circuit board external electrodes 52-52f. The board body 39 has a positive main surface S1 and a negative main surface S2 arranged in this order toward the negative direction of the Z axis. The board body 39 has a square shape when viewed in the negative direction of the Z axis. The board body 39 has a structure in which a plurality of insulating layers are laminated. An electric circuit including a conductor layer and an interlayer connection conductor is provided inside the board body 39.

[0013] The first circuit board external electrodes 40a-40f, 46a-46f, the second circuit board external electrodes 42a-42f, 44a-44f, the third circuit board external electrodes 50a-50f, and the fourth circuit board external electrodes 52-52f are located on the front main surface S1 as shown in Fig. 4. The first circuit board external electrodes 40a-40f, 46a-46f, the second circuit board external electrodes 42a-42f, 44a-44f, the third circuit board external electrodes 50a-50f, and the fourth circuit board external electrodes 52-52f are arranged in a matrix.

[0014] More specifically, the first circuit board external electrodes 40a-40f are lined up in a line in the positive direction of the X-axis. The first circuit board external electrodes 46a-46f are lined up in a line in the positive direction of the X-axis. The second circuit board external electrodes 42a-42f are lined up in a line in the positive direction of the X-axis. The second circuit board external electrodes 44a-44f are lined up in a line in the positive direction of the X-axis. The third circuit board external electrodes 50a-50f are lined up in a line in the positive direction of the X-axis. The fourth circuit board external electrodes 52a-52f are lined up in a line in the positive direction of the X-axis. The row of third circuit board external electrodes 50a-50f, the row of first circuit board external electrodes 40a-40f, the row of second circuit board external electrodes 42a-42f, the row of second circuit board external electrodes 44a-44f, the row of first circuit board external electrodes 46a-46f, and the fourth circuit board external electrodes 52a-52f are arranged in the negative direction of the Y axis, in this order.

[0015] The first circuit board external electrodes 40a-40f and the first circuit board external electrodes 46a-46f are connected to a ground potential. The second circuit board external electrodes 42a-42f and the second circuit board external electrodes 44a-44f are connected to a power supply potential. Signals are input to and output from the third circuit board external electrodes 50a-50f and the fourth circuit board external electrodes 52-52f.

[0016] The inductor element 60 and the semiconductor integrated circuit 61 are mounted on the negative principal surface S2 of the substrate body 39 as shown in FIG.

[0017] The insulating member 14 covers the negative principal surface S2 of the substrate body 39 as shown in Fig. 1 and Fig. 2. As a result, the inductor element 60 and the semiconductor integrated circuit 61 are located within the insulating member 14 as shown in Fig. 3. The surface of the insulating member 14 includes an X-front surface SX1 and an X-negative surface SX2 arranged in this order toward the negative direction of the X-axis, a Y-front surface SY1 and a Y-negative surface SY2 arranged in this order toward the negative direction of the Y-axis, and a Z-negative surface SZ1 located on the negative side of the Z-axis with respect to the circuit board 12. The insulating member 14 and the circuit board 12 have a rectangular parallelepiped shape. The material of such an insulating member 14 is, for example, a resin. The resin is, for example, an epoxy resin.

[0018] The first wires 16a, 16b and the second wires 18a, 18b are linear conductors made of a metal such as copper. As shown in FIG. 1 and FIG. 2, the first wires 16a, 16b and the second wires 18a, 18b extend along the surface of the insulating member 14. More specifically, the first wires 16a, 16b and the second wires 18a, 18b extend along the Z axis on the X front surface SX1, extend along the X axis on the positive main surface S1 of the circuit board 12, and extend along the Z axis on the X negative surface SX2. In addition, both ends of the first wires 16a, 16b and both ends of the second wires 18a, 18b protrude from the insulating member 14 in the negative direction of the Z axis. The first wire 16a, the second wire 18a, the second wire 18b, and the first wire 16b are arranged in this order toward the negative direction of the Y axis.

[0019] Moreover, the first wires 16a, 16b and the second wires 18a, 18b are electrically connected to the circuit board 12. More specifically, the first wire 16a overlaps with the first circuit board external electrodes 40a-40f when viewed in the negative direction of the Z axis. The first wire 16a is fixed to the first circuit board external electrodes 40a-40f by soldering. As a result, the first wire 16a is electrically connected to the first circuit board external electrodes 40a-40f. As a result, the first wire 16a is connected to the ground potential.

[0020] When viewed in the negative direction of the Z axis, the first wire 16b overlaps with the first circuit board external electrodes 46a-46f. The first wire 16b is fixed to the first circuit board external electrodes 46a-46f by soldering. As a result, the first wire 16b is electrically connected to the first circuit board external electrodes 46a-46f. As a result, the first wire 16b is connected to the ground potential.

[0021] The second wire 18a overlaps with the second circuit board external electrodes 42a-42f when viewed in the negative direction of the Z axis. The second wire 18a is fixed to the second circuit board external electrodes 42a-42f by soldering. This electrically connects the second wire 18a to the second circuit board external electrodes 42a-42f. This connects the second wire 18a to the power supply potential.

[0022] The second wire 18b overlaps with the second circuit board external electrodes 44a-44f when viewed in the negative direction of the Z axis. The second wire 18b is fixed to the second circuit board external electrodes 44a-44f by soldering. This electrically connects the second wire 18b to the second circuit board external electrodes 44a-44f. This connects the second wire 18b to the power supply potential.

[0023] The third wires 30a-30f are linear conductors made of a metal such as copper. As shown in Fig. 1, the third wires 30a-30f extend along the Z-axis on the Y-front surface SY1 and also extend along the Y-axis on the front main surface S1 of the circuit board 12. The negative ends of the third wires 30a-30f in the Z-axis direction protrude from the insulating member 14 in the negative direction of the Z-axis. The third wires 30a-30f are lined up in this order in the positive direction of the X-axis. The third wires 30a-30f are electrically connected to the third circuit board external electrodes 50a-50f, respectively.

[0024] The fourth wires 32a-32f are linear conductors made of a metal such as copper. As shown in Fig. 2, the fourth wires 32a-32f extend along the Z-axis on the Y negative surface SY2 and also extend along the Y-axis on the positive principal surface S1 of the circuit board 12. The negative ends of the fourth wires 32a-32f in the Z-axis direction protrude from the insulating member 14 in the negative direction of the Z-axis. The fourth wires 32a-32f are lined up in this order in the positive direction of the X-axis. The fourth wires 32a-32f are electrically connected to the fourth circuit board external electrodes 52a-52f, respectively.

[0025] The electronic components 20a, 20b, 22a, 22b, 24a, 24b, 26a, and 26b are capacitor elements. The electronic component 20a includes an electronic component body 200, a first electronic component external electrode 204, and a second electronic component external electrode 206. The electronic component body 200 has a rectangular parallelepiped shape. The first electronic component external electrode 204 and the second electronic component external electrode 206 are provided on the surface of the electronic component body 200. The first electronic component external electrode 204 and the second electronic component external electrode 206 are aligned along the Y-axis. The structures of the electronic components 20b, 22a, 22b, 24a, 24b, 26a, and 26b are the same as the structure of the electronic component 20a, so a description thereof will be omitted.

[0026] The electronic components 20a, 20b, 22a, 22b, 24a, 24b, 26a, and 26b as described above are fixed to the surface of the insulating member 14. In this embodiment, the electronic components 20a, 20b, 22a, and 22b are fixed to the X-front surface SX1. The electronic component 20a is located on the positive side of the Z-axis of the electronic component 22a. The electronic component 20b is located on the negative side of the Y-axis of the electronic component 20a. The electronic component 22b is located on the negative side of the Y-axis of the electronic component 22a.

[0027] The first electronic component external electrode 204 of the electronic components 20a and 22a overlaps with the first wire 16a when viewed in the negative direction of the X-axis. The second electronic component external electrode 206 of the electronic components 20a and 22a overlaps with the second wire 18a when viewed in the negative direction of the X-axis. The first electronic component external electrode 204 of the electronic components 20a and 22a is fixed to the first wire 16a by soldering. The second electronic component external electrode 206 of the electronic components 20a and 22a is fixed to the second wire 18a by soldering. As a result, the first electronic component external electrode 204 of the electronic components 20a and 22a is electrically connected to the first wire 16a. The second electronic component external electrode 206 of the electronic components 20a and 22a is electrically connected to the second wire 18a. The structures of the electronic components 22a, 22b, 24a, 24b, 26a, and 26b are the same as those of the electronic components 20a and 20b, and therefore will not be described.

[0028] The circuit module 10 as described above is mounted on a circuit board (not shown). Specifically, the circuit board is provided with a plurality of electrodes with through holes. The ends of the first wires 16a, 16b, the second wires 18a, 18b, the third wires 30a to 30f, and the fourth wires 32a to 32f on the negative side of the Z axis are inserted into the plurality of through holes and fixed to the electrodes by soldering.

[0029] The circuit module 10 has an equivalent circuit shown in Fig. 5. The equivalent circuit diagram in Fig. 5 includes the circuit module 10, a load 100, and a power supply 102. The circuit module 10 is, for example, a power supply module. Therefore, the circuit module 10 includes a buck converter that steps down the power supply voltage of the power supply 102 to an appropriate voltage and outputs the voltage to the load 100. The semiconductor integrated circuit 61, the inductor element 60, and the electronic components 20a, 20b, 22a, 22b, 24a, 24b, 26a, and 26b are part of the power supply circuit.

[0030] The semiconductor integrated circuit 61 includes a controller 62 and switches 63 and 64. The third wires 30a to 30f and the fourth wires 32a to 32f are connected to the controller 62. The controller 62 switches the switches 63 and 64 on and off in response to signals transmitted from the third wires 30a to 30f and the fourth wires 32a to 32f.

[0031] Specifically, when the switch 64 is controlled to be on and the switch 63 is controlled to be off, a current flows through the inductor element 60 and the electronic components 22a, 22b, 26a, and 26b. This causes energy to be stored in the inductor element 60. When the switch 64 is controlled to be on and the switch 63 is controlled to be off, a current flows through the inductor element 60 and the electronic components 22a, 22b, 26a, and 26b due to the energy stored in the inductor element 60. This operation is repeated, and a stepped-down voltage is applied to the load 100.

[0032] [effect] According to the circuit module 10, it is possible to reduce the size of the circuit module 10. More specifically, in the power supply module described in Patent Document 1, the inductor, IC, and multiple capacitors are mounted on a substrate. Therefore, the multiple capacitors are arranged around the inductor and IC. As a result, the power supply module tends to become larger.

[0033] On the other hand, the electronic components 20a, 20b, 22a, 22b, 24a, 24b, 26a, and 26b are fixed to the surface of the insulating member 14. Therefore, the electronic components 20a, 20b, 22a, 22b, 24a, 24b, 26a, and 26b are not mounted on the circuit board. As a result, the area that the circuit module 10 occupies on the circuit board is reduced. In other words, according to the circuit module 10, the circuit module 10 can be made smaller.

[0034] According to the circuit module 10, the influence of noise can be suppressed. More specifically, the electronic components 20a, 20b, 22a, 22b, 24a, 24b, 26a, and 26b are capacitor elements. The first wires 16a and 16b are connected to the ground potential. The second wires 18a and 18b are connected to the power supply potential. As a result, the electronic components 20a, 20b, 22a, 22b, 24a, 24b, 26a, and 26b, which are capacitors, are connected between the power supply potential and the ground potential. As a result, the electronic components 20a, 20b, 22a, 22b, 24a, 24b, 26a, and 26b suppress the intrusion of noise into the circuit module 10. The electronic components 20a, 20b, 22a, 22b, 24a, 24b, 26a, and 26b suppress the output of noise from the circuit module 10. Therefore, the circuit module 10 can suppress the effects of noise.

[0035] The circuit module 10 can reduce the resistance value of the circuit module 10. More specifically, the negative ends of the Z-axis of the first wires 16a, 16b, the second wires 18a, 18b, the third wires 30a to 30f, and the fourth wires 32a to 32f are inserted into a plurality of through holes and fixed to the electrodes by soldering. The first wires 16a, 16b and the second wires 18a, 18b have a large cross-sectional area and therefore a small resistance value. Therefore, the circuit module 10 can reduce the resistance value of the circuit module 10.

[0036] According to the circuit module 10, heat generated by the inductor element 60 is radiated to the outside of the circuit module 10 by the first wires 16a, 16b, the second wires 18a, 18b, the third wires 30a to 30f, and the fourth wires 32a to 32f.

[0037] According to the circuit module 10, both of the electronic components 20a and 22a tend to function as noise filters. Fig. 6 is an equivalent circuit diagram of the electronic components 20a and 22a, the first wire 16a, and the second wire 18a.

[0038] The first electronic component external electrodes 204 of the electronic components 20a, 22a are electrically connected to the first wire 16a. The second electronic component external electrodes 206 of the electronic components 20a, 22a are electrically connected to the second wire 18a. As a result, as shown in Fig. 6, both of the electronic components 20a, 22a are directly connected to the first wire 16a and the second wire 18a. Therefore, both of the electronic components 20a, 22a can easily function as noise filters.

[0039] (First Modification) A circuit module 10a according to a first modified example will be described below with reference to the drawings. Fig. 7 is a perspective view of the circuit module 10a. Fig. 8 is a cross-sectional view of the circuit module 10a.

[0040] The circuit module 10a differs from the circuit module 10 in that the circuit module 10a further includes first conductor members 70a, 70b, second conductor members 72a, 72b, third conductor members 80a, 80b, fourth conductor members 82a, 82b, fifth wires 116a, 116b, and sixth wires 118a, 118b. Note that Fig. 8 only illustrates the first conductor member 70b, the second conductor member 72b, the third conductor member 80b, and the fourth conductor member 82b.

[0041] 7, the first wires 16a, 16b and the second wires 18a, 18b extend along the Z axis in the X front surface SX1 and extend along the X axis in the Z negative surface SZ1. The fifth wires 116a, 116b and the sixth wires 118a, 118b extend along the Z axis in the X negative surface SX2 and extend along the X axis in the Z negative surface SZ1.

[0042] As shown in FIG. 8, the first conductor members 70a, 70b, the second conductor members 72a, 72b, the third conductor members 80a, 80b, and the fourth conductor members 82a, 82b penetrate the insulating member 14 along the Z axis. The end of the first conductor member 70a on the positive side of the Z axis is electrically connected to the first wire 16a. The end of the first conductor member 70b on the positive side of the Z axis is electrically connected to the first wire 16b. The end of the second conductor member 72a on the positive side of the Z axis is electrically connected to the second wire 18a. The end of the second conductor member 72b on the positive side of the Z axis is electrically connected to the second wire 18b. The end of the third conductor member 80a on the positive side of the Z axis is electrically connected to the fifth wire 116a. The end of the third conductor member 80b on the positive side of the Z axis is electrically connected to the fifth wire 116b. The end of the fourth conductor member 82a on the positive side in the Z axis direction is electrically connected to the sixth wire 118a. The end of the fourth conductor member 82b on the positive side in the Z axis direction is electrically connected to the sixth wire 118b.

[0043] The negative end of the first conductor member 70a on the Z axis, the negative end of the first conductor member 70b on the Z axis, the negative end of the second conductor member 72a on the Z axis, the negative end of the second conductor member 72b on the Z axis, the negative end of the third conductor member 80a on the Z axis, the negative end of the third conductor member 80b on the Z axis, the negative end of the fourth conductor member 82a, and the negative end of the fourth conductor member 82b on the Z axis are electrically connected to the circuit board 12.

[0044] Furthermore, circuit board 12 does not include first circuit board external electrodes 40a-40f, 46a-46f, second circuit board external electrodes 42a-42f, 44a-44f, third circuit board external electrodes 50a-50f, and fourth circuit board external electrodes 52-52f. The rest of the structure of circuit module 10a is the same as that of circuit module 10, so a description thereof will be omitted. Circuit module 10a can achieve the same effects as circuit module 10.

[0045] (Second Modification) A circuit module 10b according to the second modified example will be described below with reference to the drawings. Fig. 9 is a cross-sectional view of the circuit module 10b.

[0046] Circuit module 10b differs from circuit module 10a in that circuit board 12 further includes first circuit board external electrodes 40a-40f, 46a-46f, second circuit board external electrodes 42a-42f, 44a-44f, third circuit board external electrodes 50a-50f, and fourth circuit board external electrodes 52-52f. However, first circuit board external electrodes 40a-40f, 46a-46f, second circuit board external electrodes 42a-42f, 44a-44f, third circuit board external electrodes 50a-50f, and fourth circuit board external electrodes 52-52f are not in contact with first wires 16a, 16b, second wires 18a, 18b, third wires 30a-30f, fourth wires 32a-32f, fifth wires 116a, 116b, and sixth wires 118a, 118b.

[0047] The first circuit board external electrodes 40a-40f, 46a-46f, the second circuit board external electrodes 42a-42f, 44a-44f, the third circuit board external electrodes 50a-50f and the fourth circuit board external electrodes 52-52f are electrically connected to the first wires 16a, 16b, the second wires 18a, 18b, the third wires 30a-30f, the fourth wires 32a-32f, the fifth wires 116a, 116b and the sixth wires 118a, 118b via an electrical circuit within the circuit board 12. When the circuit module 10b is mounted on the circuit board, the first circuit board external electrodes 40a-40f, 46a-46f, the second circuit board external electrodes 42a-42f, 44a-44f, the third circuit board external electrodes 50a-50f and the fourth circuit board external electrodes 52-52f are fixed to the electrodes of the circuit board by soldering. The rest of the structure of the circuit module 10b is the same as that of the circuit module 10a, so a description thereof will be omitted. The circuit module 10b can achieve the same effects as the circuit module 10a.

[0048] (Other embodiments) The circuit module according to the present invention is not limited to the circuit modules 10, 10a, and 10b, and may be modified within the scope of the invention. Furthermore, the structures of the circuit modules 10, 10a, and 10b may be combined in any manner.

[0049] The circuit modules 10, 10a, and 10b do not have to be power supply modules, for example, and may be communication modules.

[0050] The electronic components 20a, 20b, 22a, 22b, 24a, 24b, 26a, and 26b do not have to be capacitor elements, and may be, for example, inductor elements.

[0051] The number of electronic components may be one or more.

[0052] The number of the first wires may be one or more.

[0053] The number of the second wires may be one or more.

[0054] The number of the third wires may be one or more.

[0055] The number of the fourth wires may be one or more.

[0056] The number of first circuit board external electrodes may be one or more.

[0057] The number of second circuit board external electrodes may be one or more.

[0058] The number of third circuit board external electrodes may be one or more.

[0059] The number of the fourth circuit board external electrodes may be one or more.

[0060] The number of the fifth circuit board external electrodes may be one or more.

[0061] The number of the sixth circuit board external electrodes may be one or more.

[0062] It should be noted that the semiconductor integrated circuit 61 and the inductor element 60 are not essential components.

[0063] The electronic components 20a, 20b, 22a, 22b, 24a, 24b, 26a, and 26b may be fixed to the Y front surface SY1 or the Y negative surface SY2 of the insulating member 14. The electronic components 20a, 20b, 22a, 22b, 24a, 24b, 26a, and 26b may be fixed to the Z negative surface SZ1 of the insulating member 14.

[0064] Incidentally, electronic components may be mounted on the main surface S1 of the circuit board 12.

[0065] The first wire may be connected to a power supply potential and the second wire may be connected to a ground potential. Furthermore, a signal may be transmitted to the first wire and the second wire.

[0066] The first conductor members 70a, 70b, the second conductor members 72a, 72b, the third conductor members 80a, 80b, and the fourth conductor members 82a, 82b may be wires. That is, the first conductor members 70a, 70b, the second conductor members 72a, 72b, the third conductor members 80a, 80b, and the fourth conductor members 82a, 82b may be connected to the first wires 16a, 16b, the second wires 18a, 18b, the fifth wires 116a, 116b, and the sixth wires 118a, 118b, respectively.

[0067] The shape of the insulating member 14 is not limited to a rectangular parallelepiped shape.

[0068] The shapes of the first circuit board external electrodes 40a to 40f, 46a to 46f, the second circuit board external electrodes 42a to 42f, 44a to 44f, the third circuit board external electrodes 50a to 50f and the fourth circuit board external electrodes 52 to 52f are not limited to quadrangular shapes.

[0069] The present invention has the following structure.

[0070] (1) the circuit module includes a circuit board, an insulating member, an electronic component, a first wire, and a second wire; The X-axis, Y-axis, and Z-axis are mutually perpendicular. the circuit board includes a board body having a positive main surface and a negative main surface arranged in this order in the negative direction of the Z axis, the insulating member covers the negative principal surface of the substrate body, the electronic component has an electronic component body, and a first electronic component external electrode and a second electronic component external electrode provided on a surface of the electronic component body, the electronic component is fixed to a surface of the insulating member, the first wire and the second wire extend along the surface of the insulating member, the first electronic component external electrode is electrically connected to the first wire; the second electronic component external electrode is electrically connected to the second wire; the first wire and the second wire are electrically connected to the circuit board; Circuit module.

[0071] (2) the circuit board includes one or more first circuit board external electrodes and one or more second circuit board external electrodes located on the main surface; the surface of the insulating member includes an X-front surface and an X-negative surface aligned in this order toward the negative direction of the X-axis, a Y-front surface and a Y-negative surface aligned in this order toward the negative direction of the Y-axis, and a Z-negative surface located on the negative side of the Z-axis with respect to the circuit board, the first wire and the second wire extend along the Z-axis on the X-front surface, extend along the X-axis on the positive principal surface of the circuit board, and extend along the Z-axis on the X-negative principal surface; The electronic component is fixed to the X-front surface, the first wire is electrically connected to the one or more first circuit board external electrodes; the second wire is electrically connected to the one or more second circuit board external electrodes; A circuit module as described in (1).

[0072] (3) the circuit module further includes a semiconductor integrated circuit and an inductor element; the semiconductor integrated circuit and the inductor element are mounted on the negative principal surface of the substrate body, The electronic component is a capacitor element. A circuit module according to (2).

[0073] (4) the circuit module further comprising one or more third wires; the circuit board further includes one or more third circuit board external electrodes located on the front main surface; the one or more third wires extend along the Z axis on the Y front surface and along the Y axis on the front principal surface of the circuit board; each of the one or more third wires is electrically connected to the one or more third circuit board external electrodes; A circuit module according to (3).

[0074] (5) the semiconductor integrated circuit, the inductor element, and the electronic component are part of a power supply circuit; A circuit module according to (3) or (4).

[0075] (6) the first wire is connected to a ground potential; the second wire is connected to a power supply potential; A circuit module described in any one of (1) to (5).

[0076] (7) the circuit module further comprises a first conductive member and a second conductive member; the first conductor member and the second conductor member penetrate the insulating member along the Z axis, the surface of the insulating member includes an X-front surface and an X-negative surface aligned in this order toward the negative direction of the X-axis, a Y-front surface and a Y-negative surface aligned in this order toward the negative direction of the Y-axis, and a Z-negative surface located on the negative side of the Z-axis with respect to the circuit board, The first wire and the second wire extend along the Z axis on the X front surface and extend along the X axis on the Z negative surface; The electronic component is fixed to the X-front surface, an end of the first conductor member on the positive side in the Z-axis direction electrically connected to the first wire; an end of the first conductor member on the negative side in the Z-axis direction is electrically connected to the circuit board; the end of the second conductor member on the positive side in the Z-axis direction is electrically connected to the second wire; The end of the second conductor member on the negative side of the Z axis is electrically connected to the circuit board. A circuit module as described in (1). [Explanation of symbols]

[0077] 10, 10a, 10b: circuit module 12: Circuit board 14: Insulating material 16a, 16b: first wire 18a, 18b: second wire 20a, 20b, 22a, 22b, 24a, 24b, 26a, 26b: Electronic components 30a~30f: 3rd wire 32a-32f: 4th wire 39: Board body 40a to 40f: First circuit board external electrodes 42a~42f: 2nd circuit board external electrode 44a to 44f: second circuit board external electrodes 46a~46f: 1st circuit board external electrode 50a~50f: Third circuit board external electrode 52a to 52f: Fourth circuit board external electrodes 60: Inductor element 61: Semiconductor integrated circuits 62: Controller 63,64: Switch 70a, 70b: first conductive member 72a, 72b: second conductive member 80a, 80b: third conductive member 82a, 82b: fourth conductive member 100: Load 102: Power supply 116a, 116a: fifth wire 118a, 118b: 6th wire 200: Electronic parts body 204: First electronic component external electrode 206: Second electronic component external electrode S1: Main surface S2: Negative principal surface SX1:X front SX2: Negative X SY1: Positive Y SY2: Negative Y SZ1: Negative Z

Claims

1. the circuit module includes a circuit board, an insulating member, an electronic component, a first wire, and a second wire; The X-axis, the Y-axis, and the Z-axis are mutually orthogonal, the circuit board includes a board body having a positive main surface and a negative main surface arranged in this order in the negative direction of the Z axis, and one or more first circuit board external electrodes and one or more second circuit board external electrodes located on the positive main surface, the insulating member covers the negative principal surface of the substrate body, the electronic component has an electronic component body, and a first electronic component external electrode and a second electronic component external electrode provided on a surface of the electronic component body, a surface of the insulating member includes an X-front surface and an X-negative surface aligned in this order toward a negative direction of the X-axis, a Y-front surface and a Y-negative surface aligned in this order toward a negative direction of the Y-axis, and a Z-negative surface located on the negative side of the Z-axis with respect to the circuit board, The electronic component is fixed to the X-front surface, the first wire and the second wire extend along the Z-axis on the X-front surface, extend along the X-axis on the positive principal surface of the circuit board, and extend along the Z-axis on the X-negative principal surface; the first electronic component external electrode is electrically connected to the first wire; the second electronic component external electrode is electrically connected to the second wire; the first wire is electrically connected to the one or more first circuit board external electrodes; the second wire is electrically connected to the one or more second circuit board external electrodes; Circuit module.

2. the circuit module further includes a semiconductor integrated circuit and an inductor element; the semiconductor integrated circuit and the inductor element are mounted on the negative principal surface of the substrate body, The electronic component is a capacitor element. The circuit module according to claim 1 .

3. the circuit module further comprises one or more third wires; the circuit board further includes one or more third circuit board external electrodes located on the front main surface; the one or more third wires extend along the Z-axis on the Y-front surface and extend along the Y-axis on the main surface of the circuit board; each of the one or more third wires is electrically connected to the one or more third circuit board external electrodes; The circuit module according to claim 2 .

4. the semiconductor integrated circuit, the inductor element, and the electronic component are part of a power supply circuit; The circuit module according to claim 2 or 3.

5. The first wire is connected to a ground potential; The second wire is connected to a power supply potential. The circuit module according to claim 1 or 2.

6. A circuit module comprising a circuit board, an insulating member, an electronic component, a first wire, and a second wire; The X-axis, the Y-axis, and the Z-axis are mutually orthogonal, the circuit board includes a board body having a positive main surface and a negative main surface arranged in this order in the negative direction of the Z axis, the insulating member covers the negative principal surface of the substrate body, the electronic component has an electronic component body, and a first electronic component external electrode and a second electronic component external electrode provided on a surface of the electronic component body, the electronic component is fixed to a surface of the insulating member, the first wire and the second wire extend along a surface of the insulating member, the first electronic component external electrode is electrically connected to the first wire; the second electronic component external electrode is electrically connected to the second wire; the first wire and the second wire are electrically connected to the circuit board; The first wire is connected to a ground potential; The second wire is connected to a power supply potential. Circuit module.

7. A circuit module comprising a circuit board, an insulating member, an electronic component, a first wire, a second wire, a first conductor member, and a second conductor member; The X-axis, the Y-axis, and the Z-axis are mutually orthogonal, the circuit board includes a board body having a positive main surface and a negative main surface arranged in this order in the negative direction of the Z axis, the insulating member covers the negative principal surface of the substrate body, the electronic component has an electronic component body, and a first electronic component external electrode and a second electronic component external electrode provided on a surface of the electronic component body, the first conductor member and the second conductor member penetrate the insulating member along the Z axis, a surface of the insulating member includes an X-front surface and an X-negative surface aligned in this order toward a negative direction of the X-axis, a Y-front surface and a Y-negative surface aligned in this order toward a negative direction of the Y-axis, and a Z-negative surface located on the negative side of the Z-axis with respect to the circuit board, The first wire and the second wire extend along the Z axis on the X-front surface and extend along the X axis on the Z-negative surface; The electronic component is fixed to the X-front surface, the first electronic component external electrode is electrically connected to the first wire; the second electronic component external electrode is electrically connected to the second wire; the first wire and the second wire are electrically connected to the circuit board; The end of the first conductor member on the positive side in the Z-axis direction is electrically connected to the first wire, an end portion of the first conductor member on a negative side in the Z-axis direction is electrically connected to the circuit board; The end of the second conductor member on the positive side in the Z-axis direction is electrically connected to the second wire, The end of the second conductor member on the negative side of the Z axis is electrically connected to the circuit board. Circuit module.

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