Current Detector

Abstract

To reduce a mounting area of an electronic component and a resistor for a current detection.SOLUTION: A resistor for a current detection, detecting a current (a vertical type shunt resistor 11), includes: a plate-like resistive body 13; and a first electrode 15a and a second electrode 15b opposite to the first electrode, which are stacked in the thickness direction of the resistive body and arranged such that the resistive body 13 is sandwiched therebetween. The first electrode 15a includes a groove part 43. In the groove part 43, a depth t2 is 1 / 2 or less of a thickness t1 of the first electrode 15a. In the first electrode 15a, a front surface processing film 41b containing a Ni material is formed.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present invention relates to a current sensing resistor and a current sensing device. [Background technology]

[0002] In recent years, the current used in electronic devices has become larger. Therefore, there has been active development of modules called power modules that convert and control power by switching power semiconductors. Power semiconductors require current detection elements such as shunt resistors to detect the current. In addition, in order to accommodate higher power while minimizing the volume of power modules, which tend to be large, active research and development is being conducted to increase power and density. In this way, the demand to minimize the mounting area of ​​components is increasing year by year.

[0003] Due to these circumstances, there is a demand for shunt resistors for power modules to have a smaller mounting area. For example, Patent Document 1 proposes an example in which a resistor is directly mounted on the upper surface of a transistor. Semiconductors such as IGBT insulated gate bipolar transistors used in power modules have a complex structure due to the fact that the electrodes arranged on the upper surface are separated by an insulating film (insulating protective film), etc. Therefore, it is difficult to mount such a vertical shunt resistor structure on the upper surface of the power semiconductor (for example, see FIG. 8 of Patent Document 1). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2018-170478 A Summary of the Invention [Problem to be solved by the invention]

[0005] FIG. 6 is a perspective view showing an example of a conventional substrate mounting structure X of a resistor and a power module. 6, in a semiconductor (e.g., an IGBT element or the like) 121 used in a power module, an emitter electrode 127 having a conductor in a comb-like shape by forming divided portions 127a is formed on a first surface (upper surface) opposite to a second surface (lower surface) mounted on a substrate 101. The emitter electrode 127 may be configured such that at least a portion is separated.

[0006] The IGBT element is an element in which the input section has a MOSFET structure and the output section has a bipolar structure. It is a bipolar type element that uses two types of carriers, electrons and holes, but is a transistor that combines a low saturation voltage (corresponding to the low on-resistance of a power MOSFET) with relatively fast switching characteristics. The semiconductor layer 131 is, for example, + -p + -n - -p + The structure is a series connection. The IGBT element 121 shown in FIG. 6 has, on its first surface, an electrode (a first conductive type semiconductor (n + Each divided electrode 127 is exposed from an insulating region formed of an insulating film 133. On the first surface, a gate electrode 131a is formed in a region different from the emitter electrode 127 and exposed from the insulating film 133. A collector electrode (not shown) is formed on the second surface.

[0007] In the IGBT element 121, a current is controlled by a voltage signal to the gate electrode 131a, and flows from the collector electrode arranged on the second surface of the IGBT element to the emitter electrode 127 arranged on the first surface. An IGBT element 121 is connected to a shunt resistor 111 provided adjacent to the IGBT element 121 on the mounting board 101. The shunt resistor 111 is formed by a structure in which a first electrode 115a and a second electrode 115b are provided on both sides of a resistor 113, for example, both end faces of the resistor 113 are butted against one end faces of the first electrode 115a and the second electrode 115b. The emitter current of the IGBT element 121 can be detected by measuring the voltage between the first electrode 115a and the second electrode 115b with a voltmeter 117 via a bonding wire 118. The reference numerals 116, 119, and 125 denote metal pads provided on the substrate 101.

[0008] 6, for example, a current path is constructed by connecting an emitter electrode 127 and a pad on which a shunt resistor 111 is mounted with a bonding wire 141. At this time, by providing a plurality of bonding wires 141 equal to the number of emitter electrodes 127, the electrical resistance of the bonding wire 141 is reduced, making it possible to handle the application of a large current. However, a conventional shunt resistor 111 as shown in FIG. 6 is mounted around a semiconductor element such as an IGBT element 121, which causes a problem of increasing the area occupied by the module (mounting structure) accordingly. An object of the present invention is to reduce the mounting area of ​​electronic components such as semiconductor elements and resistors for current detection. [Means for solving the problem]

[0009] According to one aspect of the present invention, there is provided a current detection resistor for detecting a current, the current detection resistor comprising a plate-shaped resistor, a first electrode stacked in the thickness direction of the resistor and arranged to sandwich the resistor, and a second electrode on the opposite side, the first electrode having a groove. This makes it possible to reduce the mounting area of ​​the integrated circuit when integrating the current detection resistor in the thickness (vertical) direction with electronic components such as semiconductor elements. Also, it is possible to ensure a sufficient volume for the adhesive that bonds the electronic component, such as the semiconductor element, and the resistor for detecting current.

[0010] The depth of the groove is preferably equal to or less than half the thickness of the first electrode, and is preferably greater than the thickness of a connecting material applied between the current detection resistor and the electronic component to be connected. The first electrode is preferably provided with a surface-processed film containing Ni material, and the second electrode is preferably provided with a surface-processed film made of Ni, Al or Au material. It is preferable that the first electrode and the resistive body of the current detection resistor are cut away to expose the second electrode, and an exposed area is formed for wire bonding.

[0011] According to another aspect of the present invention, there is provided a current detection device comprising: an electronic component having a laminated structure arranged on a mounting board; a current detection resistor for detecting a current in the electronic component, the current detection resistor having an area smaller than an electrode region of a first surface of the electronic component on which the current detection resistor is arranged; and a current detection resistor laminated in the thickness direction of the resistor, the current detection resistor having a first electrode on a second surface side arranged to sandwich the resistor and a second electrode on a first surface side opposite the second surface side, the first electrode having a groove. The groove on the first surface of the current detection resistor is preferably provided at a position that avoids an insulating film that separates the electrode region on the first surface of the electronic component of the laminated structure into multiple regions. Effect of the Invention

[0012] According to the present invention, it is possible to reduce the mounting area of ​​electronic components such as semiconductor elements and resistors for current detection. Also, it is possible to ensure a sufficient volume for the adhesive that bonds the electronic component, such as the semiconductor element, and the resistor for detecting current. [Brief description of the drawings]

[0013] [Figure 1]1 is a perspective view showing an example of a resistor and its mounting structure according to a first embodiment of the present invention; [Diagram 2] This is a diagram showing the state before the vertical shunt resistor is mounted on the first surface of the IGBT element. [Diagram 3] This is a diagram after the vertical shunt resistor is mounted on the first surface of the IGBT element. [Figure 4] FIG. 11 is a perspective view showing an example of a resistor and its mounting structure according to a second embodiment of the present invention. [Diagram 5] 11A and 11B are diagrams showing modified examples of the grooves of the first electrode according to the present embodiment. [Figure 6] FIG. 1 is a perspective view showing an example of a conventional substrate mounting structure of a resistor and a power module. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A resistor and its mounting structure according to an embodiment of the present invention will now be described in detail with reference to the drawings.

[0015] (First embodiment) 1 is a perspective view showing an example of a resistor and its mounting structure according to a first embodiment of the present invention. As a power semiconductor element, an example will be described in which an IGBT having the same structure as that shown in FIG.

[0016] That is, the IGBT element 21 includes a collector electrode (not shown), a gate electrode 31 a, an emitter electrode 27 , a semiconductor layer 31 , and an insulating film 33 . The vertical shunt resistor 11 has a first electrode 15a, a resistor 13, and a second electrode 15b. Reference numerals 19 and 25 denote metal pads provided on the substrate. In the following, an example will be described in which the object to be measured by the current detection element is the current flowing through an IGBT element; however, the object to be measured by the current detection element may also be the current flowing through a vertical electronic component such as a transistor, capacitor, inductor, etc., and structures for detecting the current in these electronic components also fall within the scope of the present invention. Moreover, the mounting surface of mounting board 1 is referred to as a first surface, and the opposite surface is referred to as a second surface.

[0017] 1) Vertical shunt resistors A vertical shunt resistor 11 having a size that fits within an area in which a plurality of emitter electrodes 27 are arranged is disposed on a first surface of the IGBT element 21. The vertical shunt resistor 11 has a laminated structure consisting of a plate-shaped first electrode 15a, a plate-shaped resistor 13, and a plate-shaped second electrode 15b. The first electrode 15a and the second electrode 15b are formed on the first and second surfaces of the resistor 13 using a material having a smaller electrical resistance than the resistor 13. The electrode material is, for example, a conductive metal material such as Cu, etc. The resistor material is, for example, a Cu-Ni based, Cu-Mn based, Ni-Cr based, or other metal material, or a composite material of these with ceramics, etc.

[0018] 2 and 3 are cross-sectional views taken along line Ia-Ib in FIG. 1. FIG. 2 is a diagram showing the vertical shunt resistor 11 before it is connected to the first surface of the IGBT element 21 by soldering or the like. FIG. 3 is a diagram showing the vertical shunt resistor 11 after it is connected to the first surface of the IGBT element 21 by soldering or the like. Note that, as the connecting material, a paste such as nano silver or nano copper, or a resin silver paste, etc., may be used in addition to solder. In other words, the connecting material is not limited to solder. The above configuration 1) allows the vertical shunt resistor 11 to be mounted on the first surface of the IGBT element 21. This eliminates the need for an area on the module required for mounting the vertical shunt resistor 11 on the mounting board. In addition, bonding wires and the like required for connecting the power semiconductor element and the shunt resistor are also unnecessary.

[0019] 2) Mounting structure 2 and 3, an emitter electrode 27 having a gap region 27a that divides the electrode into a plurality of parts on a plane is formed of a comb-shaped conductor on a first surface of the IGBT element 21. The emitter electrode 27 may be configured to be at least partially divided. An insulating film 33 is exposed from the gap region 27a.

[0020] In the mounting structure, a groove 43 corresponding to the gap region 27a is formed in the first electrode 15a of the vertical shunt resistor 11. This makes it possible to increase the distance between the surface of the insulating film 33 and the surface (bottom surface) of the first surface side of the groove facing the surface of the insulating film 33.

[0021] Here, if the width of the gap region 27a is W1 and the width of the groove portion 43 is W2, then W2>W1, for example W2>2W1, is satisfied. This allows the gap region 27a to be contained within the width of the groove portion 43. When the thickness of the first electrode 15a is t1, the depth t2 of the groove 43 is preferably set to be smaller than the remaining thickness (t2<(t1-t2)). For example, t1 / 2>t2. In addition, it is preferable that the depth t2 of the groove 43 is greater than the applied thickness t3 of the bonding material between the vertical shunt resistor 11 and the IGBT element 21, for example, the solder paste 61. This allows the solder paste 61 to be contained within the groove 43. This prevents the solder paste 61 from spilling out of the element region.

[0022] It should be noted that the grooves 43 only need to have an interval equal to that of the gap regions 27a, and the width and depth of the gap regions 27a are parameters that can be changed depending on a predetermined process. Moreover, it is preferable that the second surface of the vertical shunt resistor 11 is subjected to a surface treatment before bonding to form a surface treated layer 41b for improving adhesion with the bonding material 61. As a result of 2) above, the groove 43 provided in the first electrode 15a can prevent excess solder from adhering to the first surface of the IGBT element or the side surface of the vertical shunt resistor 11 when, for example, the IGBT element 21 and the vertical shunt resistor 11 are joined by soldering, as the groove 43 serves as a solder pool (see FIG. 3).

[0023] In addition, since the insulating film 33 of the IGBT element 21 and the first electrode 15a of the vertical shunt resistor 11 do not come into contact with each other, there is also an effect of preventing the insulating film 33 from being broken. Since the resistance value of the shunt resistor is often very low, such as 1 mΩ or 50 μΩ, it is important to uniformize the potential distribution of the electrodes such as the first electrode 15a. Therefore, by making the thickness (t1-t2) of the electrode remaining part after the groove formation of the first electrode 15a larger than the depth t2 of the groove 43, the potential distribution inside the electrode can be uniformized.

[0024] The thickness t3 of the solder paste 61, which is the joining material, is generally about 50 μm. In this case, it is desirable that the depth of the groove is 50 μm or more and the thickness of the first electrode 15a is twice that thickness, that is, 100 μm or more. Since the spacing between metal terminals of the power semiconductor is approximately 0.1 mm to 0.2 mm, the width of the groove on the underside of the shunt must be larger than this spacing; in this case, it is desirable for it to be approximately 0.2 mm to 0.4 mm.

[0025] 3) Surface treatment of electrodes in vertical shunt resistors Furthermore, since the second electrode 15b of the vertical shunt resistor 11 is connected by a bonding wire 51, a lead frame, or the like, it is preferable that the surface be treated to facilitate such connection, and that a surface treatment layer 41a is formed by plating the surface with, for example, Ni or Sn to improve connectivity.

[0026] In the above 3), since it is necessary to connect a bonding wire 41 for securing a current path and detecting a voltage signal, it is preferable to perform electrode surface processing such as Ni plating, Au plating, or Al pad. Also, in order to detect a voltage signal as shown in Fig. 1, wire bonding is required not only on the second electrode 15b side of the vertical shunt resistor 11 but also on the emitter electrode 27 of the IGBT element 21. As described above, according to the present embodiment, it is possible to reduce the mounting area of ​​a current detection resistor in which a power module and a resistor are mounted. This vertical resistor can be mounted on other semiconductor elements such as MOSFET elements, not limited to IGBT elements. It goes without saying that the dimensions of the vertical resistor and the shape of the groove of the first electrode may need to be changed depending on the shape of the semiconductor element.

[0027] (Second embodiment) Next, a second embodiment of the present invention will be described. Fig. 4 is a perspective view showing an example of a resistor and its mounting structure according to the second embodiment of the present invention. In the mounting structure shown in FIG. 2, if the vertical shunt resistor 11 is smaller than the area of ​​the first surface of the IGBT element 21, it is possible to provide an area in the insulating film 33 on the first surface of the IGBT element 21 where the gate electrode 31a for connecting the bonding wire 53 is exposed.

[0028] However, there are cases where a sufficient area for connecting the bonding wire 53 to the emitter electrode 27 of the IGBT element 21 cannot be ensured. In such a case, as shown in FIG. 4, by cutting off a part of the corner of the vertical shunt resistor 11 to form a cut shape 11a, a part of the region 27b of the emitter electrode 27 of the IGBT element 21 is exposed, and it is possible to secure a connection point of the bonding wire 53 to the emitter electrode 27.

[0029] (Third embodiment) Next, a third embodiment of the present invention will be described. 1 Electrodes 15 a The groove may have any shape as long as it does not come into contact with the insulating film 33 of the semiconductor.

[0030] Fig. 5 is a diagram showing a modified example of the groove of the first electrode 15a according to the present embodiment. The description will also refer to Fig. 1 as appropriate. Fig. 5 is a diagram showing the inside and outside of Fig. 1, in which the first electrode 15a and the second electrode 15b are formed on the first and second surfaces of the resistor 13 using a material having a smaller electrical resistance than the resistor 13. 5, a groove 45b may be provided that extends in a direction intersecting, for example, a direction perpendicular to, a groove 45a formed in the first electrode 15a corresponding to the region where the insulating film 33 is exposed between the emitter electrodes 27 of the IGBT elements 21. Although the groove 45b is not provided at a position corresponding to the region where the insulating film 33 is exposed, by doing so, the volume of the solder pool can be determined by adding the volume of the groove 45b to the volume of the groove 45a, so that it is possible to secure the required volume by increasing the volume of the solder pool.

[0031] In the above embodiment, the configurations shown in the drawings are not limited to these, and can be appropriately changed within the scope of the effects of the present invention. In addition, the present invention can be implemented by appropriately changing it as long as it does not deviate from the scope of the object of the present invention. In addition, each component of the present invention can be selected arbitrarily, and the invention having the selected configuration is also included in the present invention. [Industrial Applicability]

[0032] The present invention can be used in a current detection resistor and a mounting structure for a current detection resistor. [Explanation of symbols]

[0033] 1 Mounting board 11 Vertical Shunt Resistor 13 Resistor 15a First electrode 15b Second electrode 21 IGBT element 27 Emitter electrode 27a Gap area 31 Semiconductor layer 31a Gate electrode 33 Insulating film 41a,41b Surface treatment layer 43,45a,45b Groove 51,53 Bonding wire 61 Bonding materials (solder paste)

Claims

[Claim 1] An electronic component having a laminated structure arranged on a mounting board; a current detection resistor for detecting a current in the electronic component, the current detection resistor comprising: a resistor having an area smaller than an electrode region on a first surface of the electronic component on which the current detection resistor is disposed; a first electrode on a second surface side and a second electrode on the first surface side opposite to the second surface side, the first electrode being laminated in a thickness direction of the resistor and disposed so as to sandwich the resistor; having The groove portion on the first surface of the current detection resistor is A current detection device provided at a position that avoids an insulating film that divides the electrode region on the first surface of the electronic component of the laminated structure into multiple parts.

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