Imaging module and electronic device

Abstract

To improve the quality of an image.SOLUTION: An imaging module 300 includes an imaging module body 310 that is capable of imaging. The module body 310 has a base 550, a pixel unit 200 provided on the base 550, a ground pattern 504 provided on the base 550 and used to apply a voltage to each pixel of the pixel unit 200, a base 650, and a ground pattern 604 provided on the base 650. The module body 310 has a conductor unit 700 connected in parallel with the ground pattern 504.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present invention relates to a noise countermeasure for an imaging module. [Background technology]

[0002] Imaging devices such as digital video cameras and digital still cameras are equipped with imaging modules having image sensors. In recent years, the ISO (International Organization for Standardization) sensitivity of image sensors has improved. This allows clearer images to be generated even when shooting in low-light situations such as night scenes.

[0003] However, as the ISO sensitivity of image sensors improves, their sensitivity to weak magnetic field noise, which was not a problem in the past, also increases. As a result, image sensors are more susceptible to the effects of magnetic field noise, and image distortion is becoming a problem.

[0004] Patent Document 1 discloses that magnetic field noise is reduced by making the electrical resistance value of peripheral ground wiring corresponding to the peripheral circuits around the pixels higher than the electrical resistance value of pixel ground wiring corresponding to the pixels. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2017-55099 A Summary of the Invention [Problem to be solved by the invention]

[0006] However, if the electrical resistance of the wiring used to apply a voltage to each pixel of the image sensor increases, the voltage drop in the wiring increases, and the voltage applied to each pixel may fall below the reference voltage. If the voltage applied to each pixel falls below the reference voltage, unevenness such as smear or shading may occur in the image generated by the image sensor.

[0007] SUMMARY OF THE PRESENT EMBODIMENT An object of the present invention is to improve image quality. [Means for solving the problem]

[0008] The present disclosure No. 1 An aspect includes an image sensor having a first chip and a second chip bonded to each other, a wiring board on which the image sensor is mounted, a first connection conductor connecting the image sensor and the wiring board, and a second connection conductor connecting the image sensor and the wiring board, wherein the image sensor has a pixel unit provided on the first chip and including a plurality of pixels, a first conductor pattern provided on the first chip and used to apply a voltage to the plurality of pixels of the pixel unit, and a logic circuit provided on the second chip; Each of the plurality of pixels includes a photodiode and a transistor that controls transfer of charge generated by photoelectric conversion in the photodiode;the wiring board has a base and a second conductor pattern provided on the base, a first portion of the second conductor pattern is electrically connected to the first portion of the first conductor pattern via the first connection conductor portion, and a second portion of the second conductor pattern is electrically connected to the second portion of the first conductor pattern via the second connection conductor portion, forming a conductor loop structure including the first conductor pattern, the second conductor pattern, the first connection conductor portion, and the second connection conductor portion; the image sensor further has a third conductor pattern provided on the second chip, the first portion of the second conductor pattern is electrically connected to the first portion of the third conductor pattern via the first connection conductor portion, and the second portion of the second conductor pattern is electrically connected to the second portion of the third conductor pattern via the second connection conductor portion, and the third conductor pattern is connected in parallel with the first conductor pattern. A second aspect of the present disclosure includes an image sensor having a first chip and a second chip bonded to each other, a wiring board on which the image sensor is mounted, a first connection conductor portion connecting a first pad of the image sensor to the wiring board, and a second connection conductor portion connecting a second pad of the image sensor to the wiring board, wherein the image sensor includes a pixel portion provided on the first chip and including a plurality of pixels, a first conductor pattern provided on the first chip and used to apply a voltage to the plurality of pixels of the pixel portion, and a logic circuit provided on the second chip, wherein the wiring board includes a base and a second conductor pattern provided on the base, a first portion of the second conductor pattern is electrically connected to the first portion of the first conductor pattern via the first connection conductor portion, and a second portion of the second conductor pattern is electrically connected to the second portion of the first conductor pattern via the second connection conductor portion, and a conductor loop structure including the first conductor pattern, the second conductor pattern, the first connection conductor portion, and the second connection conductor portion is formed, and the image sensor includes the first portion of the second conductor pattern is electrically connected to the first portion of the third conductor pattern via the first connection conductor portion, the second portion of the second conductor pattern is electrically connected to the second portion of the third conductor pattern via the second connection conductor portion, the third conductor pattern is connected in parallel with the first conductor pattern, and at least a portion of the first conductor pattern overlaps the pixel portion in a direction in which the image sensor and the wiring board are arranged, and a resistance value between the first pad and the second pad in a portion of the loop structure that does not pass through the first connection conductor portion, the second connection conductor portion, and the second conductor pattern, but passes through the first conductor pattern and the third conductor pattern, is smaller than a resistance value between the first pad and the second pad in a portion of the loop structure that does not pass through the first conductor pattern and the third conductor pattern, but passes through the first connection conductor portion, the second connection conductor portion, and the second conductor pattern. Effect of the Invention

[0009] The invention improves image quality. [Brief description of the drawings]

[0010] [Figure 1] FIG. 1 is an explanatory diagram illustrating an imaging device which is an example of an electronic device according to a first embodiment. [Diagram 2] 1 is a perspective view of an imaging module according to a first embodiment. [Diagram 3] 1 is a circuit diagram showing a configuration of an image sensor according to a first embodiment. [Figure 4] 1A and 1B are cross-sectional views of an imaging module according to a first embodiment. [Diagram 5] FIG. 2 is a plan view of the imaging module according to the first embodiment. [Figure 6] FIG. 11 is a plan view of an imaging module of a comparative example. [Figure 7] FIG. 11 is an equivalent circuit diagram of an imaging module of a comparative example. [Figure 8]1 is a graph of Example 1 and Comparative Example 1. [Figure 9] 11(a) and 11(b) are cross-sectional views of an imaging module according to a second embodiment. [Figure 10] FIG. 11 is a plan view of an imaging module according to a second embodiment. [Figure 11] Graphs of Example 2 and Comparative Example 1. [Figure 12] 13(a) and 13(b) are cross-sectional views of an imaging module according to a third embodiment. [Figure 13] FIG. 11 is a plan view of an imaging module according to a third embodiment. [Figure 14] 1 is a graph of Example 3 and Comparative Example 1. [Figure 15] 13(a) and 13(b) are cross-sectional views of an imaging module according to a fourth embodiment. [Figure 16] FIG. 13 is a plan view of an imaging module according to a fourth embodiment. [Figure 17] 13(a) and 13(b) are cross-sectional views of an imaging module according to a fifth embodiment. [Figure 18] FIG. 13 is a plan view of an imaging module according to a fifth embodiment. [Figure 19] 13 is an equivalent circuit diagram of a ground line of an imaging module according to a fifth embodiment. FIG. [Figure 20] 13 is a graph showing a calculation result of an induced noise voltage according to the fourth embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings.

[0012] [First embodiment] Fig. 1 is an explanatory diagram showing an image capture device 100, which is an example of an electronic device according to a first embodiment. The image capture device 100 is a digital camera such as a digital still camera or a digital video camera, and is a digital single-lens reflex camera in the example of Fig. 1. The image capture device 100 includes a main body 101 and an interchangeable lens 102, which is a lens device that is detachable from the main body 101.

[0013] The main body 101 includes a housing 103, an imaging module 300, an image processing module 130, and an image stabilization module 120. The imaging module 300, the image processing module 130, and the image stabilization module 120 are arranged inside the housing 103. A battery (not shown) is arranged inside the housing 103, and power is supplied to the modules 300, 130, 120 and the interchangeable lens 102 from the battery.

[0014] FIG. 2 is a perspective view of the imaging module 300 according to the first embodiment. As shown in FIG. 1 and FIG. 2, the imaging module 300 has a module body 310 capable of capturing an image of a subject. The module body 310 includes an image sensor 301 and a printed wiring board 302 on which the image sensor 301 is mounted. The printed wiring board 302 includes wiring such as a power supply wiring, a ground wiring, and a signal wiring. The printed wiring board 302 is a rigid wiring board. In this embodiment, the image sensor 301 and the printed wiring board 302 are connected by wire bonding. That is, the module body 310 includes a plurality of wires 303 that electrically connect the image sensor 301 and the printed wiring board 302. Each of the wires 303 is made of a metal such as gold. These wires 303 are also called bonding wires. The module body 310 includes a ground line 350. Note that FIG. 2 illustrates wires 351 and 352, which are part of the ground line 350, among the plurality of wires 303.

[0015] Here, the longitudinal direction of imaging module 300 is defined as the X-axis direction. The lateral direction of imaging module 300 is defined as the Y-axis direction. The direction perpendicular to the sensor surface (light receiving surface) of image sensor 301 is defined as the Z-axis direction. The X-axis direction, Y-axis direction, and Z-axis direction are mutually orthogonal. The X-axis direction is the first direction, the Y-axis direction is the second direction, and the Z-axis direction is the third direction. Wire 351 is disposed on one end side of image sensor 301 in the Y-axis direction. Wire 352 is disposed on the other end side of image sensor 301 in the Y-axis direction.

[0016] The imaging module 300 also has a frame 311 provided on the printed wiring board 302 so as to surround the image sensor 301, and a cover glass 312 disposed on the light receiving surface side of the image sensor 301 and supported by the frame 311. The cover glass 312 is a transparent body. The frame 311 is formed of an electrically insulating material, such as a resin, and is fixed to the printed wiring board 302, for example, with an adhesive. The cover glass 312 is fixed to the frame 311, for example, with an adhesive. The image sensor 301 on the printed wiring board 302 is sealed by the frame 311 and the cover glass 312.

[0017] 1 includes a printed wiring board, and an image processing LSI and electronic circuit components mounted on the printed wiring board. The imaging module 300 and the image processing module 130 are electrically connected by a flexible substrate 140.

[0018] The image stabilization module 120 has a plurality of coils 121. Each coil 121 is a wound coil and an inductor. When an alternating current flows through each coil 121, each coil 121 generates a magnetic field 150.

[0019] The interchangeable lens 102 includes a housing 104 that is detachable from a housing 103, a lens 141 disposed inside the housing 104, and a motor 142 disposed inside the housing 104 for driving the lens 141. A coil 143, which is an inductor, is included in a drive circuit that drives the motor 142. When an alternating current flows through the coil 143, the coil 143 generates a magnetic field 151. A magnetic field is formed around the imaging module 300 by the magnetic field 150 generated by each coil 121 and the magnetic field 151 generated by the coil 143.

[0020] The coils 121 and 143 are operated by being supplied with an AC current having a frequency in the kHz band. When an AC current is supplied to the coils 121 and 143, the coils 121 and 143 generate magnetic fields 150 and 151 around them. The magnetic fields 150 and 151 can become magnetic field noise for the image sensor 301. Note that although the magnetic fields 150 and 151 are indicated by dashed arrows in FIG. 1, because they are AC magnetic fields caused by AC current, the direction of the dashed arrows alternates between the direction of the dashed arrows and the opposite direction.

[0021] The image sensor 301 is, for example, a complementary metal oxide semiconductor (CMOS) image sensor or a charge-coupled device (CCD) image sensor. The image sensor 301 is preferably a CMOS image sensor, and the following description will be given of the case where the image sensor 301 is a CMOS image sensor.

[0022] 3 is a circuit diagram showing a configuration of an image sensor 301 according to the first embodiment. The image sensor 301 has a plurality of pixels 201. Each pixel 201 includes a photodiode 211, which is an example of a light receiving unit that performs photoelectric conversion, a floating diffusion (FD) capacitance element 212 that stores charge, and a transistor 213 that controls charge transfer. The plurality of pixels 201 are arranged in a matrix in the X-axis direction and the Y-axis direction. A pixel unit 200 is formed by including the plurality of pixels 201.

[0023] The image sensor 301 also has a plurality of drivers 202 and a plurality of peripheral circuit units 205. Each driver 202 is a driver for selecting a pixel from which an electric charge is to be extracted. Each pixel 201 is connected to a corresponding driver 202 via a row selection line 203. The peripheral circuit unit 205 has a plurality of drivers 204. Each driver 204 is a driver for reading and amplifying the electric charge resulting from photoelectric conversion. Each pixel 201 is connected to a corresponding driver 204 via a vertical signal line 206.

[0024] In the image sensor 301, one of the row selection lines 203 is selected, and the charge of the pixel 201 connected to the selected row selection line 203 is transferred to the peripheral circuit section 205. In order to apply a reference voltage (DC voltage) required to drive each pixel 201 to each pixel 201, each pixel 201 is connected to a power supply wiring section 400 that is a part of a power supply line (not shown), and a ground wiring section 500 that is a part of a ground line 350 (FIG. 2). The power supply wiring section 400, the ground wiring section 500, and a signal wiring section (not shown) are connected to corresponding wiring of the printed wiring board 302 shown in FIG. 1 by wires 303.

[0025] 4(a) and 4(b) are cross-sectional views of the imaging module 300 according to the first embodiment. FIG. 5 is a plan view of the imaging module 300 according to the first embodiment. FIG. 4(a) shows a schematic cross-sectional view of the imaging module 300 along the XZ plane. FIG. 4(b) shows a schematic cross-sectional view of the imaging module 300 along the YZ plane. FIG. 5 shows a schematic plan view of the imaging module 300 viewed in a direction perpendicular to the XY plane. Note that the cover glass 312 is omitted from FIG. 5.

[0026] The module body 310 of the imaging module 300 has a ground line 350 that is connected to the negative terminal of a battery, which is a DC power source.

[0027] In the first embodiment, the image sensor 301 is a front-illuminated image sensor. The image sensor 301 has a base 550, which is an example of a first base, and the pixel section 200 and ground wiring section 500 described above. In this embodiment, the base 550 is a semiconductor substrate, for example, a silicon substrate. The pixel section 200 and the ground wiring section 500 are provided on the base 550. The ground wiring section 500 is included in the ground line 350. The ground wiring section 500 is formed of a metal such as copper, aluminum, or tungsten.

[0028] The ground wiring unit 500 is used to apply a voltage to each pixel 201 (FIG. 3) of the pixel unit 200. Specifically, the ground wiring unit 500 is used to apply the ground potential, of the power supply potential and the ground potential, to each pixel 201.

[0029] The ground wiring section 500 has a ground pattern 504 which is an example of a first conductor pattern. The ground pattern 504 is rectangular when viewed in the Z-axis direction. When the module body 310 is viewed in the Z-axis direction, a region surrounding the ground pattern 504 is defined as R504. When the module body 310 is viewed in the Z-axis direction, a region surrounding the pixel section 200 is defined as R200. When the module body 310 is viewed in the Z-axis direction, the region R504 overlaps with a part or the whole of the region R200. In this embodiment, when the module body 310 is viewed in the Z-axis direction, the region R504 overlaps with the whole of the region R200. In other words, when the module body 310 is viewed in the Z-axis direction, the region R504 includes the region R200.

[0030] In this embodiment, when the module body 310 is viewed in the Z-axis direction, the region R504 is a rectangular region with the smallest area among the regions surrounding the ground pattern 504. In other words, when the module body 310 is viewed in the Z-axis direction, the region R504 is a region surrounded by the outline of the ground pattern 504. Also, in this embodiment, when the module body 310 is viewed in the Z-axis direction, the region R200 is a rectangular region with the smallest area among the regions surrounding the pixel unit 200. In other words, when the module body 310 is viewed in the Z-axis direction, the region R200 is a region surrounded by the outline of the pixel unit 200.

[0031] The ground pattern 504 is disposed on the light incident side of the pixel unit 200, that is, on the incident side of the light L0 with respect to the photodiode 211 (FIG. 3) of each pixel 201 of the pixel unit 200. The ground pattern 504 is formed in a mesh shape so that the light L0 passes through the photodiode 211 of each pixel 201. As a result, the light L0 passes through the mesh of the ground pattern 504 and is incident on the photodiode 211 of each pixel 201 of the pixel unit 200. Since the ground pattern 504 is in a mesh shape, warping of the image sensor 301 due to temperature changes in the imaging module 300 can be suppressed.

[0032] Printed wiring board 302 has a base 650 which is an example of a second base, and a ground wiring section 600 provided on base 650. Base 650 is an insulating substrate made of an insulating material such as glass epoxy resin or ceramics. Ground wiring section 600 is included in ground line 350. Ground wiring section 600 is made of a metal such as copper, aluminum, or tungsten.

[0033] The ground wiring section 600 has a ground pattern 604, which is an example of a second conductor pattern. The ground pattern 604 is disposed on an inner layer of a base 650 of the printed wiring board 302, for example.

[0034] The ground pattern 504 and the ground pattern 604 are electrically connected by at least one first connection conductor and at least one second connection conductor. In this embodiment, the at least one first connection conductor is a plurality of (for example, nine) connection conductors 391 as shown in FIG. 5. In this embodiment, the at least one second connection conductor is a plurality of (for example, nine) connection conductors 392 as shown in FIG. 5. Each connection conductor 391 and each connection conductor 392 are included in the ground line 350. The multiple connection conductors 391 are arranged on one end side of the ground pattern 504 in the Y-axis direction and are spaced apart in the X-axis direction. The multiple connection conductors 392 are arranged on the other end side of the ground pattern 504 in the Y-axis direction and are spaced apart in the X-axis direction.

[0035] 5, each connection conductor 391 includes a pad 551, a connection line 561, a wire 351, a pad 651, and a via conductor 671. The pad 551 and the connection line 561 are included in the image sensor 301. The pad 551 and the connection line 561 are arranged in the same layer as the ground pattern 504 in the base 550. The pad 551 and the ground pattern 504 are connected by the connection line 561.

[0036] The pad 651 and the via conductor 671 are included in the printed wiring board 302. The pad 651 is arranged on the outer layer of the base 650. The pad 651 arranged on the outer layer and the ground pattern 604 arranged on the inner layer are connected by the via conductor 671. The pad 551 and the pad 651 are connected by the wire 351.

[0037] 5, each connection conductor 392 includes a pad 552, a connection line 562, a wire 352, a pad 652, and a via conductor 672. The pad 552 and the connection line 562 are included in the image sensor 301. The pad 552 and the connection line 562 are arranged in the same layer as the ground pattern 504 in the base 550. The pad 552 and the ground pattern 504 are connected by the connection line 562.

[0038] The pad 652 and the via conductor 672 are included in the printed wiring board 302. The pad 652 is arranged on the outer layer of the base 650. The pad 652 arranged on the outer layer and the ground pattern 604 arranged on the inner layer are connected by the via conductor 672. The pad 552 and the pad 652 are connected by the wire 352.

[0039] As a result, ground pattern 504 of image sensor 301 and ground pattern 604 of printed wiring board 302 are electrically connected via connecting conductors 391 and 392, respectively.

[0040] As shown in FIG. 4(b), when the module body 310 is viewed from the side in the X-axis direction, a loop structure L1 made of a conductor is formed in a part of the ground line 350. The loop structure L1 includes the ground pattern 504, the ground pattern 604, the connection conductor portion 391, and the connection conductor portion 392. The magnetic fields 150 and 151 shown in FIG. 1 are linked to the loop structure L1. Therefore, an induced current is generated in the loop structure L1. This induced current generates a noise voltage in the pixel 201 (FIG. 3) of the pixel unit 200. Hereinafter, this noise voltage is also referred to as an induced noise voltage.

[0041] In the first embodiment, the ground line 350 of the module body 310 has at least one conductor part connected in parallel to the ground pattern 504, in addition to the ground pattern 604. The at least one conductor part is two conductor parts 700 in the first embodiment.

[0042] Here, an imaging module of a comparative example without the conductor section 700 will be described. FIG. 6 is a plan view of an imaging module 300X of a comparative example. In FIG. 6, the same components as those in the first embodiment are given the same reference numerals. The imaging module 300X of the comparative example has a configuration in which only the conductor section 700 is omitted from the imaging module 300 of the first embodiment. That is, the imaging module 300X has a module body 310X. The module body 310X has an image sensor 301X and a printed wiring board 302. The image sensor 301X has a ground pattern 504. The ground pattern 504 of the image sensor 301X and the ground pattern 604 of the printed wiring board 302 (FIGS. 4(a) and 4(b)) are electrically connected by a plurality of connection conductor sections 391 and a plurality of connection conductor sections 392, respectively.

[0043] 7 is an equivalent circuit diagram of an imaging module 300X of the comparative example. In the imaging module 300X of the comparative example, a loop structure L1X is formed that includes a ground pattern 504 of an image sensor 301X, a ground pattern 604 of a printed wiring board 302, a plurality of connecting conductors 391, and a plurality of connecting conductors 392. A noise voltage induced in the ground pattern 504 of the loop structure L1X is denoted by V. cmos The noise voltage V cmos is expressed by equation (1).

number

[0044] where α is the propagation coefficient within the sensor. R cmos is the electrical resistance of the ground pattern 504. R wb is the combined electrical resistance of the multiple connecting conductors 391 and the multiple connecting conductors 392. R pcb is the electrical resistance of the ground pattern 604 on the printed wiring board 302. S0 is the area inside the loop structure L1X when the module body 310X is viewed from the side in the X-axis direction. dt is an infinitesimal time, ds is an infinitesimal area, B in bold is a magnetic field vector, and n in bold is a unit vector perpendicular to ds.

[0045] It is assumed that the frequency of the magnetic fields 150 and 151 interlinked with the loop structure L1X and the area S0 of the loop structure L1X do not change. In this case, the noise voltage V cmos is the resistance ratio (R cmos / (R pcb +R wb +R cmos )) is induced depending on

[0046] Therefore, in the first embodiment, the conductor section 700 is connected in parallel to the ground pattern 504 as shown by the dashed line in Fig. 7. This forms a parallel circuit between the ground pattern 504 and the conductor section 700. The parallel circuit between the ground pattern 504 and the conductor section 700 reduces the resistance ratio in equation (1). The reduced resistance ratio reduces the induced noise voltage V cmos This reduces noise superimposed on the generated image, thereby improving the quality of the image generated by the image sensor 301.

[0047] Furthermore, it is possible to reduce the voltage drop in the ground pattern 504, and prevent the DC voltage applied to each pixel 201 from falling below the reference voltage. This makes it possible to prevent unevenness such as smear or shading from occurring in the image generated by the image sensor 301. Therefore, it is possible to improve the quality of the image generated by the image sensor 301.

[0048] 5, in the first embodiment, the conductor section 700 is provided on the base 550 of the image sensor 301. That is, the conductor section 700 is included in the image sensor 301. Each conductor section 700 includes a conductor pattern 710 which is an example of a third conductor pattern. The conductor pattern 710 is formed to extend in the Y-axis direction along a side of the ground pattern 504 extending in the Y-axis direction.

[0049] Moreover, each conductor section 700 includes a plurality of connection conductors that electrically connect the ground pattern 504 and the conductor pattern 710. The plurality of connection conductors are arranged at intervals from each other in the Y-axis direction. In the first embodiment, the plurality of connection conductors are two connection conductors 711, 712. Each of the connection conductors 711, 712 is a conductor pattern. The positions of the conductor pattern 710 and the connection conductors 711, 712 in the Z-axis direction are the same as the positions of the ground pattern 504 in the Z-axis direction. That is, the components of each conductor section 700 are arranged in the same layer as the ground pattern 504 in the base 550. As a result, when the module main body 310 is viewed from the side in the X-axis direction, no conductor loop is formed between the ground pattern 504 and the conductor section 700. Even when viewed in the Y-axis direction, no conductor loop is formed between the ground pattern 504 and the conductor section 700. That is, no conductor loop is formed between ground pattern 504 and conductor portion 700 when module body 310 is viewed from the side in any direction perpendicular to the Z-axis direction. This makes it possible to effectively improve the quality of the image generated by image sensor 301.

[0050] Moreover, when the module body 310 is viewed in the Z-axis direction, the conductor section 700 is disposed outside the region R200 surrounding the pixel section 200. This eliminates the need to widen the wiring width forming the mesh of the ground pattern 504, i.e., to narrow the opening through which light passes, and therefore reduces the effect on optical characteristics such as the amount of light passing through the ground pattern 504 and reaching each pixel 201 and light reflection. This effectively improves the quality of the image generated by the image sensor 301.

[0051] The ground pattern 504 has a plurality of wirings 511 extending in the Y-axis direction and spaced apart in the X-axis direction, and a plurality of wirings 512 extending in the X-axis direction and spaced apart in the Y-axis direction. The plurality of wirings 511 and the plurality of wirings 512 are arranged to cross each other to form a mesh. The width of each of the wirings 511 and 512 forming the mesh is defined as D0. The width of the conductor pattern 710 is defined as D1. The widths of the connection conductors 711 and 712 are defined as D2 and D3, respectively. In this embodiment, the widths D1, D2, and D3 are wider than the width D0. That is, the conductor portion 700 can reduce the voltage drop in the ground pattern 504 without widening the width D0 of the wirings 511 and 512.

[0052] When viewed in the Z-axis direction, the connecting conductors 711 and 712 of the two conductor portions 700 are preferably connected to the vicinity of the four corners of the ground pattern 504. Moreover, it is preferable that each of the connecting conductors 711 and 712 is as short as possible.

[0053] It is also possible to omit the connecting conductors 711 and 712 and directly connect each conductor pattern 710 to each side of the ground pattern 504 .

[0054] Further, although the case where the module body 310 has two conductor parts 700 has been described, the present invention is not limited to this. For example, the module body 310 may have one conductor part connected in parallel to the ground pattern 504. Furthermore, the module body 310 may have three or more conductor parts connected in parallel to the ground pattern 504. In this case, any of the three or more conductor parts may be disposed on a layer different from the ground pattern 504.

[0055] Also, although the image sensor 301 is a front-illuminated image sensor, the present invention is not limited to this. For example, the image sensor 301 may be a back-illuminated image sensor. Even in this case, the ground pattern 504 is preferably formed in a mesh shape, which can prevent the image sensor 301 from warping due to temperature changes in the imaging module 300.

[0056] Example 1 Hereinafter, a description will be given of Example 1 corresponding to the first embodiment. Note that, hereinafter, electrical resistance may also be simply referred to as resistance.

[0057] The noise voltage generated at both ends of the ground pattern 504 in the Y-axis direction was evaluated using the resistance ratio of the resistance values, which are the coefficients of formula (1). The following formula (2) was used to calculate the resistance value of the conductor.

number

[0058] In equation (2), ρ is the resistivity of the conductor [Ωm], l is the length of the conductor [m], and S1 is the area of ​​the conductor [m 2 ].

[0059] Hereinafter, the resistance value of the ground pattern 504 is R1, the combined resistance value of the two conductor patterns 710 is R2, and the resistance value of the ground pattern 604 is R3. Furthermore, the combined resistance value of the two connecting conductors 711 is R4, and the combined resistance value of the two connecting conductors 712 is R5. The combined resistance value of the nine connecting conductor parts 391 is R6, and the combined resistance value of the nine connecting conductor parts 392 is R7.

[0060] Furthermore, the resistance values ​​of the pads 551 and 651 were ignored for each of the nine connection conductors 391. The combined resistance value of the nine connection lines 561 was set to R6a, the combined resistance value of the nine wires 351 to R6b, and the combined resistance value of the nine via conductors 671 to R6c. That is, R6=R6a+R6b+R6c.

[0061] Furthermore, the resistance values ​​of the pads 552 and 652 were ignored for each of the nine connection conductors 392. The combined resistance value of the nine connection lines 562 was set to R7a, the combined resistance value of the nine wires 352 to R7b, and the combined resistance value of the nine via conductors 672 to R7c. That is, R7=R7a+R7b+R7c.

[0062] Substituting the above conditions into equation (1), the voltage (induced noise voltage) at both ends of the ground pattern 504 in the Y-axis direction is V noise Then, equation (1) can be transformed into equation (3).

number

[0063] Here, S0 is the area inside the loop structure L1 when the module body 310 is viewed from the side in the X-axis direction. If the combined resistance value of the ground pattern 504 of the image sensor 301 and the two conductor parts 700 is A, the resistance value A is given by the following formula (4).

number

[0064] Furthermore, if the combined resistance value of ground pattern 604 of printed wiring board 302, nine connecting conductors 391, and nine connecting conductors 392 is B, resistance value B is given by the following formula (5).

number

[0065] First, the resistance values ​​calculated in Example 1 will be described. The width D0 of each of the wirings 511 and 512 in the ground pattern 504 was set to 0.7 [μm], the thickness to 0.6 [μm], and the length to 20 [mm]. The material of the ground pattern 504 was aluminum (Al), and the resistivity was 2.82×10 -8 The number of wires 512 was set to 6000. This resulted in a resistance value R1 of 0.224 [Ω].

[0066] The two conductor parts 700 are symmetrical as shown in Fig. 5. In each conductor part 700, the width D1 of the conductor pattern 710 is 1000 [μm], the thickness is 0.6 [μm], and the length is 20 [mm]. The material of the conductor pattern 710 is aluminum (Al), and the resistivity is 2.82 × 10 -8 [Ωm]. This resulted in a resistance value of R2 of 0.47 [Ω].

[0067] The width D2 of the connecting conductor 711 was set to 500 [μm], the thickness was set to 0.6 [μm], and the length was set to 100 [μm]. The material of the connecting conductor 711 was set to aluminum (Al), and the resistivity was set to 2.82×10 -8 [Ωm]. This resulted in a resistance value of R4 of 0.0047 [Ω].

[0068] The width D3 of the connecting conductor 712 was set to 500 [μm], the thickness was set to 0.6 [μm], and the length was set to 100 [μm]. The material of the connecting conductor 712 was set to aluminum (Al), and the resistivity was set to 2.82×10 -8 [Ωm]. This resulted in a resistance value of R5 of 0.0047 [Ω].

[0069] The nine connection conductors 391 had the same shape and size. Each connection line 561 had a width of 20 μm, a thickness of 0.6 μm, and a length of 2 mm. The material of each connection line 561 was aluminum (Al), and the resistivity was 2.82×10 -8 [Ωm]. This resulted in a resistance value of R6a of 0.522 [Ω].

[0070] The nine connection conductors 392 were of the same shape and size. Each connection line 562 had a width of 20 μm, a thickness of 0.6 μm, and a length of 2 mm. The material of each connection line 562 was aluminum (Al), and the resistivity was 2.82×10 -8 [Ωm]. This resulted in a resistance value of R7a of 0.522 [Ω].

[0071] The diameter of each wire 351 was 20 [μm] and the length was 1.6 [mm]. The material of each wire 351 was gold (Au), and the resistivity was 2.44×10 -8 [Ωm]. This resulted in a resistance value of R6b of 0.014 [Ω].

[0072] The diameter of each wire 352 was 20 [μm] and the length was 1.6 [mm]. The material of each wire 352 was gold (Au), and the resistivity was 2.44×10 -8 [Ωm]. This resulted in a resistance value of R7b of 0.014 [Ω].

[0073] The diameter of each via conductor 671 is 100 [μm] and the length is 80 [μm]. The material of each via conductor 671 is copper (Cu), and the resistivity is 1.68×10 -8 [Ωm]. This resulted in a resistance value of R6c of 1.90×10 -5 It became [Ω].

[0074] The diameter of each via conductor 672 is 100 [μm] and the length is 80 [μm]. The material of each via conductor 672 is copper (Cu), and the resistivity is 1.68×10 -8 [Ωm]. This resulted in a resistance value of R7c of 1.90×10 -5 It became [Ω].

[0075] The ground pattern 604 was rectangular when viewed in the Z-axis direction. The ground pattern 604 had a width of 36 mm, a thickness of 15 μm, and a length of 26 mm. The material of the ground pattern 604 was copper (Cu), and the resistivity was 1.68×10 -8 [Ωm]. This resulted in a resistance value of R3 of 0.0008 [Ω].

[0076] Therefore, in Example 1, the resistance value A was 0.152 [Ω], and the resistance value B was 1.073 [Ω]. Therefore, in Example 1, B>A. Also, in Example 1, the resistance ratio A / (A+B) was 0.124. Here, the resistance ratio A / (A+B) corresponds to the resistance ratio in formulas (1) and (3).

[0077] In addition, in Example 1, R1=0.224[Ω], R2=0.47[Ω], R4=0.0047[Ω], and R5=0.0047[Ω]. <R2+R4+R5であった。

[0078] Comparative Example 1 Next, Comparative Example 1 corresponding to the comparative example will be described. In the module body 310X of Comparative Example 1, the two conductor parts 700 are omitted from the module body 310 of Example 1. In the module body 310X of Comparative Example 1, the size and material properties of the other components are the same as those of the module body 310 of Example 1. Therefore, in Comparative Example 1, the resistance value R1 is 0.224 [Ω] as in Example 1. Also, in Comparative Example 1, the resistance value R6a is 0.522 [Ω] and the resistance value R7a is 0.522 [Ω] as in Example 1. Also, in Comparative Example 1, the resistance value R6b is 0.014 [Ω] and the resistance value R7b is 0.014 [Ω] as in Example 1. Also, in Comparative Example 1, the resistance value R6c is 1.90×10 -5 [Ω], resistance value R7c is 1.90×10 -5 In Comparative Example 1, similar to Example 1, the resistance value R3 was 0.0008 [Ω].

[0079] Therefore, in Comparative Example 1, the resistance value A was the resistance value R1, which was 0.224 [Ω]. Also, in Comparative Example 1, the resistance value B was 1.073 [Ω], similar to Example 1. In Comparative Example 1, the resistance ratio A / (A+B) was 0.173.

[0080] 8 is a graph of the resistance ratio A / (A+B) of Example 1 and Comparative Example 1. The resistance ratio A / (A+B) is a function of the induced noise voltage V noise Since it is proportional to noise The resistance ratio in Comparative Example 1 was 0.173, and the resistance ratio in Example 1 was 0.124, so the induced noise voltage V noise The reduction in the induced noise voltage Vnoise was found to be reduced.

[0081] [Second embodiment] Next, an imaging module according to a second embodiment will be described. Fig. 9(a) and Fig. 9(b) are cross-sectional views of an imaging module 300A according to the second embodiment. Fig. 10 is a plan view of the imaging module 300A according to the second embodiment. In the second embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and detailed descriptions thereof will be omitted. The imaging device of the second embodiment includes an imaging module 300A instead of the imaging module 300 in Fig. 1.

[0082] Fig. 9(a) shows a schematic cross-sectional view of the imaging module 300A along the XZ plane. Fig. 9(b) shows a schematic cross-sectional view of the imaging module 300A along the YZ plane. Fig. 10 shows a schematic plan view of the imaging module 300A viewed in a direction perpendicular to the XY plane.

[0083] The imaging module 300A has a module body 310A and a cover glass 312. Note that the cover glass 312 is not shown in Fig. 10. The module body 310A includes an image sensor 301A and a printed wiring board 302A on which the image sensor 301A is mounted.

[0084] The printed wiring board 302A has wiring such as a power supply wiring, a ground wiring, and a signal wiring. The printed wiring board 302A is a rigid wiring board. In this embodiment, the image sensor 301A and the printed wiring board 302A are connected by wire bonding. That is, as shown in FIG. 10, the module body 310A includes a plurality of wires 303A that electrically connect the image sensor 301A and the printed wiring board 302A. Each wire 303A is made of a metal such as gold. These wires 303A are also called bonding wires.

[0085] The module body 310A includes a ground line 350A. Of the multiple wires 303A, wires 351, 352, and 723A that are part of the ground line 350A are illustrated in Fig. 10. The ground line 350A is connected to the negative terminal of a battery that is a DC power source.

[0086] The image sensor 301A is a CCD image sensor or a CMOS image sensor, and in this embodiment, a case where the image sensor is a CMOS image sensor will be described. The image sensor 301A is a front-illuminated image sensor. The image sensor 301A has a base 550, which is an example of a first base, as in the first embodiment, and a pixel section 200 and a ground wiring section 500A as in the first embodiment. The pixel section 200 and the ground wiring section 500A are provided on the base 550. The ground wiring section 500A is included in the ground line 350A. The ground wiring section 500A is formed of a metal such as copper, aluminum, or tungsten.

[0087] The ground wiring section 500A is used to apply a voltage to each pixel 201 (FIG. 3) of the pixel section 200. Specifically, the ground wiring section 500A is used to apply the ground potential, of the power supply potential and the ground potential, to each pixel 201.

[0088] The ground wiring section 500A has a ground pattern 504, which is an example of a first conductor pattern, as in the first embodiment. When the module body 310A is viewed in the Z-axis direction, a region surrounding the ground pattern 504 is defined as R504 as in the first embodiment. When the module body 310A is viewed in the Z-axis direction, a region surrounding the pixel section 200 is defined as R200 as in the first embodiment. When the module body 310A is viewed in the Z-axis direction, the region R504 overlaps with a part or the whole of the region R200. In this embodiment, when the module body 310A is viewed in the Z-axis direction, the region R504 overlaps with the whole of the region R200. In other words, when the module body 310A is viewed in the Z-axis direction, the region R504 includes the region R200.

[0089] The ground pattern 504 is disposed on the light incident side of the pixel unit 200, that is, on the incident side of the light L0 with respect to the photodiode 211 (FIG. 3) of each pixel 201 of the pixel unit 200, as in the first embodiment. Also, the ground pattern 504 is formed in a mesh shape so that the light L0 passes through the photodiode 211 of each pixel 201, as in the first embodiment. That is, the ground pattern 504 has a plurality of wirings 511 extending in the Y-axis direction and arranged at intervals in the X-axis direction, and a plurality of wirings 512 extending in the X-axis direction and arranged at intervals in the Y-axis direction. The plurality of wirings 511 and the plurality of wirings 512 are arranged to cross each other to form a mesh. The light L0 passes through the mesh of the ground pattern 504 and is incident on the photodiode 211 of each pixel 201 of the pixel unit 200. Also, since the ground pattern 504 is mesh-shaped, it is possible to suppress warping of the image sensor 301A due to temperature changes in the imaging module 300A.

[0090] The printed wiring board 302A has a base 650A, which is an example of a second base, and a ground wiring section 600A provided on the base 650A. The base 650A is an insulating substrate formed of an insulating material such as glass epoxy resin or ceramics. In the first embodiment, as shown in Figs. 4(a) and 4(b), the frame 311 is sandwiched between the cover glass 312 and the base 650, but in the second embodiment, there is no frame. As shown in Figs. 9(a) and 9(b), the base 650A of the second embodiment has a convex portion 651A surrounding the image sensor 301A, which corresponds to the frame. The cover glass 312 is fixed to the upper surface of the convex portion 651A of the base 650A with an adhesive or the like. In this way, the base 650A is a cavity substrate, and the surface of the base 650A on which the image sensor 301A is arranged is formed in a concave shape. The cavity substrate is a countersunk substrate or a laminated substrate.

[0091] The ground wiring section 600A is included in the ground line 350A. The ground wiring section 600A is formed of a metal such as copper, aluminum, or tungsten. As in the first embodiment, the ground wiring section 600A has a ground pattern 604 which is an example of a second conductor pattern. The ground pattern 604 is disposed, for example, on an inner layer of a base 650A of the printed wiring board 302A.

[0092] The ground pattern 504 and the ground pattern 604 are electrically connected to each other by a plurality of (for example, nine) connection conductors 391 and a plurality of (for example, nine) connection conductors 392, similarly to the first embodiment.

[0093] 10, each connection conductor 391, like the first embodiment, includes a pad 551, a connection line 561, a wire 351, a pad 651, and a via conductor 671. Also, each connection conductor 392, like the first embodiment, includes a pad 552, a connection line 562, a wire 352, a pad 652, and a via conductor 672.

[0094] As shown in Fig. 9(b), when the module main body 310A is viewed from the side in the X-axis direction, a loop structure L2 made of a conductor is formed in a part of the ground line 350A. The loop structure L2 includes the ground pattern 504, the ground pattern 604, the connecting conductor portion 391, and the connecting conductor portion 392. The magnetic fields 150 and 151 shown in Fig. 1 are linked to the loop structure L2. For this reason, an induced current is generated in the loop structure L2. This induced current generates a noise voltage in the pixel 201 (Fig. 3) of the pixel unit 200.

[0095] In the second embodiment, the ground line 350A of the module body 310A has at least one conductor portion connected in parallel to the ground pattern 504, in addition to the ground pattern 604. In the second embodiment, the at least one conductor portion is two conductor portions 700A.

[0096] In the second embodiment, each conductor portion 700A is formed across the image sensor 301A and the printed wiring board 302A. The specific configuration of each conductor portion 700A will be described below.

[0097] Each conductor section 700A includes two conductor patterns 710A1 and 710A2 as an example of at least one fourth conductor pattern provided on the base 650A. Each conductor pattern 710A1 and 710A2 is disposed on an inner layer of the base 650A. The conductor patterns 710A1 and 710A2 are formed to extend in the Y-axis direction along the side of the ground pattern 504 extending in the Y-axis direction. Note that in FIG. 10, for the sake of explanation, the conductor patterns 710A1 and 710A2 hidden by the base 650A are illustrated by solid lines. The conductor patterns 710A1 and 710A2 are disposed on the convex portion 651A of the base 650A so as to approach the ground pattern 504 in the Z-axis direction. This makes it possible to make a loop structure (not shown) other than the loop structure L2, including the conductor section 700A and the ground pattern 504, as small as possible when the module main body 310A is viewed from the side in the X-axis direction.

[0098] Each conductor portion 700A has a plurality of connection conductors that electrically connect the ground pattern 504 and the conductor patterns 710A1 and 710A2. The plurality of connection conductors are arranged at intervals in the Y-axis direction. In the second embodiment, the plurality of connection conductors are two connection conductors 711A and 712A, as shown in FIG. 10. In the second embodiment, the connection conductor 711A and the connection conductor 712A have the same configuration, and the connection conductor 711A will be specifically described below. The connection conductor 711A includes a pad 721A, a connection line 722A, a wire 723A, a pad 724A, a via conductor 725A, and a via conductor 726A.

[0099] The pad 721A and the connection line 722A are included in the ground wiring part 500A of the image sensor 301A. That is, the pad 721A and the connection line 722A are provided on the base 550. The pad 721A and the ground pattern 504 are connected by the connection line 722A.

[0100] The pad 724A, the via conductor 725A, and the via conductor 726A are included in the ground wiring portion 600A of the printed wiring board 302A. That is, the pad 724A, the via conductor 725A, and the via conductor 726A are provided on the base 650A. In the printed wiring board 302A, the pad 724A and the conductor pattern 710A1 are connected by the via conductor 725A, and the conductor pattern 710A1 and the conductor pattern 710A2 are connected by the via conductor 726A.

[0101] Pad 721A of image sensor 301A and pad 724A of printed wiring board 302A are connected by wire 723A. With the above configuration, a parallel circuit is formed between ground pattern 504 and conductor portion 700A.

[0102] The parallel circuit between the ground pattern 504 and the conductor portion 700A reduces the resistance ratio in equation (1). The reduced resistance ratio reduces the induced noise voltage V cmos This reduces noise superimposed on the generated image, thereby improving the quality of the image generated by image sensor 301A.

[0103] In addition, the voltage drop in the ground pattern 504 can be reduced, and the DC voltage applied to each pixel 201 can be prevented from falling below the reference voltage. This makes it possible to prevent unevenness such as smear or shading from occurring in the image generated by the image sensor 301A. Therefore, the quality of the image generated by the image sensor 301A can be improved.

[0104] Furthermore, since the conductor patterns 710A1 and 710A2 are disposed on the base 650A of the printed wiring board 302A, their thickness can be made thicker than if they were disposed on the image sensor 301A. This can further reduce the electrical resistance value of the conductor portion 700A, and more effectively reduce the voltage drop in the ground pattern 504. This can further improve the quality of the image generated by the image sensor 301A.

[0105] Although the at least one fourth conductor pattern arranged on the base 650A is the two conductor patterns 710A1 and 710A2, the present invention is not limited to this. The at least one fourth conductor pattern may be one, or three or more conductor patterns.

[0106] Also, although the case where the module body 310A has two conductor parts 700A has been described, the present invention is not limited to this. For example, the module body 310A may have one conductor part connected in parallel to the ground pattern 504. Also, the module body 310A may have three or more conductor parts connected in parallel to the ground pattern 504.

[0107] In addition, although the image sensor 301A is a front-illuminated image sensor, the present invention is not limited to this. For example, the image sensor 301A may be a back-illuminated image sensor. Even in this case, the ground pattern 504 is preferably formed in a mesh shape, which can prevent the image sensor 301A from warping due to temperature changes in the imaging module 300A.

[0108] Example 2 Hereinafter, a description will be given of Example 2 corresponding to the second embodiment. As in Example 1, the noise voltage generated at both ends of the ground pattern 504 in the Y-axis direction was evaluated using the resistance ratio of equation (3) related to equation (1).

[0109] Hereinafter, the resistance value of the ground pattern 504 is R1, the combined resistance value of the two conductor patterns 710A1 and the two conductor patterns 710A2 is R2, and the resistance value of the ground pattern 604 is R3. Furthermore, the combined resistance value of the two connecting conductors 711A is R4, and the combined resistance value of the two connecting conductors 712A is R5. The combined resistance value of the nine connecting conductor parts 391 is R6, and the combined resistance value of the nine connecting conductor parts 392 is R7.

[0110] Furthermore, the resistance values ​​of the pads 551 and 651 were ignored for each of the nine connection conductors 391. The combined resistance value of the nine connection lines 561 was set to R6a, the combined resistance value of the nine wires 351 to R6b, and the combined resistance value of the nine via conductors 671 to R6c. That is, R6=R6a+R6b+R6c.

[0111] Furthermore, the resistance values ​​of the pads 552 and 652 were ignored for each of the nine connection conductors 392. The combined resistance value of the nine connection lines 562 was set to R7a, the combined resistance value of the nine wires 352 to R7b, and the combined resistance value of the nine via conductors 672 to R7c. That is, R7=R7a+R7b+R7c.

[0112] In addition, the resistance values ​​of the pads 721A and 724A in each of the two connection conductors 711A were ignored. The combined resistance value of the two connection lines 722A in the two connection conductors 711A was set to R4a. The combined resistance value of the two wires 723A in the two connection conductors 711A was set to R4b. The combined resistance value of the two via conductors 725A and the two via conductors 726A in the two connection conductors 711A was set to R4c. In other words, R4=R4a+R4b+R4c.

[0113] In addition, the resistance values ​​of the pads 721A and 724A in each of the two connection conductors 712A were ignored. The combined resistance value of the two connection lines 722A in the two connection conductors 712A was set to R5a. The combined resistance value of the two wires 723A in the two connection conductors 712A was set to R5b. The combined resistance value of the two via conductors 725A and the two via conductors 726A in the two connection conductors 712A was set to R5c. In other words, R5=R5a+R5b+R5c.

[0114] The resistance values ​​calculated in Example 2 will be described. The width D0 of each of the wirings 511 and 512 in the ground pattern 504 was set to 0.7 [μm], the thickness to 0.6 [μm], and the length to 20 [mm]. The material of the ground pattern 504 was aluminum (Al), and the resistivity was 2.82×10 -8 The number of wires 512 was set to 6000. This resulted in a resistance value R1 of 0.224 [Ω].

[0115] The two conductor parts 700A have a symmetrical shape as shown in Fig. 10. In each conductor part 700A, the width of each conductor pattern 710A1, 710A2 is 3 [mm], the thickness is 15 [μm], and the length is 20 [mm]. The material of each conductor pattern 710A1, 710A2 is copper (Cu) and the resistivity is 1.68 × 10 -8 [Ωm]. This resulted in a resistance value of R2 of 0.0019 [Ω].

[0116] The two connection conductors 711A and the two connection conductors 712A have the same configuration. The connection line 722A has a width of 500 [μm], a thickness of 0.6 [μm], and a length of 2 [mm]. The material of the connection line 722A is aluminum (Al), and the resistivity is 2.82×10 -8 As a result, the resistance value of R4a was 0.0094[Ω] and the resistance value of R5a was 0.0094[Ω].

[0117] The diameter of the wire 723A was 20 [μm] and the length was 1.0 [mm]. The material of the wire 723A was gold (Au), and the resistivity was 2.44 × 10-8 As a result, the resistance value of R4b was 0.039 [Ω], and the resistance value of R5b was 0.039 [Ω].

[0118] The via conductors 725A and 726A have the same configuration. The diameter of each of the via conductors 725A and 726A is 100 [μm] and the length is 80 [μm]. The material of the via conductors 725A and 726A is copper (Cu), and the resistivity is 1.68×10 -8 [Ωm]. This resulted in a resistance value of R4c of 4.28×10 -5 [Ω], resistance R5c is 4.28×10 -5 It became [Ω].

[0119] The nine connection conductors 391 had the same shape and size. Each connection line 561 had a width of 20 μm, a thickness of 0.6 μm, and a length of 2 mm. The material of each connection line 561 was aluminum (Al), and the resistivity was 2.82×10 -8 [Ωm]. This resulted in a resistance value of R6a of 0.522 [Ω].

[0120] The nine connection conductors 392 were of the same shape and size. Each connection line 562 had a width of 20 μm, a thickness of 0.6 μm, and a length of 2 mm. The material of each connection line 562 was aluminum (Al), and the resistivity was 2.82×10 -8 [Ωm]. This resulted in a resistance value of R7a of 0.522 [Ω].

[0121] The diameter of each wire 351 was 20 [μm] and the length was 1.6 [mm]. The material of each wire 351 was gold (Au), and the resistivity was 2.44×10 -8 [Ωm]. This resulted in a resistance value of R6b of 0.014 [Ω].

[0122] The diameter of each wire 352 was 20 [μm] and the length was 1.6 [mm]. The material of each wire 352 was gold (Au), and the resistivity was 2.44×10 -8[Ωm]. This resulted in a resistance value of R7b of 0.014 [Ω].

[0123] The diameter of each via conductor 671 is 100 [μm] and the length is 80 [μm]. The material of each via conductor 671 is copper (Cu), and the resistivity is 1.68×10 -8 [Ωm]. This resulted in a resistance value of R6c of 1.90×10 -5 It became [Ω].

[0124] The diameter of each via conductor 672 is 100 [μm] and the length is 80 [μm]. The material of each via conductor 672 is copper (Cu), and the resistivity is 1.68×10 -8 [Ωm]. This resulted in a resistance value of R7c of 1.90×10 -5 It became [Ω].

[0125] The ground pattern 604 was rectangular when viewed in the Z-axis direction. The ground pattern 604 had a width of 36 mm, a thickness of 15 μm, and a length of 26 mm. The material of the ground pattern 604 was copper (Cu), and the resistivity was 1.68×10 -8 [Ωm]. This resulted in a resistance value of R3 of 0.0008 [Ω].

[0126] Therefore, in Example 2, the resistance value A was 0.068 [Ω], and the resistance value B was 1.073 [Ω]. Therefore, in Example 2, B>A. Also, in Example 2, the resistance ratio A / (A+B) was 0.059. Here, the resistance ratio A / (A+B) corresponds to the resistance ratio in formulas (1) and (3).

[0127] In Comparative Example 1, the resistance value A was R1, which was 0.224 [Ω]. In Comparative Example 1, the resistance value B was 1.073 [Ω], similar to Example 2. In Comparative Example 1, the resistance ratio A / (A+B) was 0.173.

[0128] In Example 2, R1 = 0.224 [Ω], R2 = 0.0019 [Ω], and R4 = 0.094 + 0.039 + 4.28 × 10 -5[Ω], R5=0.094+0.039+4.28×10 -5 [Ω]. Therefore, in Example 2, R1 <R2+R4+R5であった。

[0129] FIG. 11 is a graph of the resistance ratio A / (A+B) of Example 2 and Comparative Example 1. The resistance ratio A / (A+B) is a function of the induced noise voltage V noise Since it is proportional to noise The resistance ratio in Comparative Example 1 was 0.173, and the resistance ratio in Example 2 was 0.059. Therefore, the induced noise voltage V noise The reduction in the induced noise voltage V noise was found to be reduced.

[0130] [Third embodiment] Next, an imaging module according to a third embodiment will be described. Fig. 12(a) and Fig. 12(b) are cross-sectional views of an imaging module 300B according to the third embodiment. Fig. 13 is a plan view of the imaging module 300B according to the third embodiment. In the third embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and detailed descriptions thereof will be omitted. The imaging device of the third embodiment includes an imaging module 300B instead of the imaging module 300 in Fig. 1.

[0131] Fig. 12(a) shows a schematic cross-sectional view of the imaging module 300B along the XZ plane. Fig. 12(b) shows a schematic cross-sectional view of the imaging module 300B along the YZ plane. Fig. 13 shows a schematic plan view of the imaging module 300B as viewed in a direction perpendicular to the XY plane.

[0132] The imaging module 300B has a module body 310B, a frame 311, and a cover glass 312. Note that the cover glass 312 is not shown in Fig. 13. The module body 310B includes an image sensor 301B and a printed wiring board 302B on which the image sensor 301B is mounted.

[0133] The printed wiring board 302B has wiring such as a power supply wiring, a ground wiring, and a signal wiring. The printed wiring board 302B is a rigid wiring board. In this embodiment, the image sensor 301B and the printed wiring board 302B are connected by wire bonding. That is, as shown in FIG. 13, the module body 310B includes a plurality of wires 303 that electrically connect the image sensor 301B and the printed wiring board 302B. Each wire 303 is made of a metal such as gold. These wires 303 are also called bonding wires.

[0134] The module body 310B includes a ground line 350B. Fig. 13 illustrates a wire 351 and a wire 352 that are part of the ground line 350B among the multiple wires 303. The ground line 350B is connected to the negative terminal of a battery, which is a DC power source.

[0135] The image sensor 301B is a CCD image sensor or a CMOS image sensor, and in this embodiment, a case where the image sensor is a CMOS image sensor will be described. The image sensor 301B is a back-illuminated image sensor. The image sensor 301B is a stacked image sensor. The image sensor 301B has a pixel chip 321B, which is a first chip, and a logic circuit chip 322B, which is a second chip. For convenience of explanation, the pixel chip 321B is not shown in FIG. 13. The pixel chip 321B generates an electric signal by imaging, and the logic circuit chip 322B processes the electric signal generated in the pixel chip 321B. The pixel chip 321B and the logic circuit chip 322B are bonded together. The pixel chip 321B and the logic circuit chip 322B are electrically connected to each other by direct bonding of Cu-Cu (copper-copper), through silicon vias (TSV: Through Silicon Via), or the like.

[0136] The pixel chip 321B has a substrate 571B which is an example of a first substrate, and a pixel section 200 which is provided on the substrate 571B and has a configuration similar to that of the first embodiment. In this embodiment, the substrate 571B is a semiconductor substrate, for example, a silicon substrate.

[0137] The logic circuit chip 322B has a substrate 572B which is an example of a second substrate, and a logic circuit (processing circuit) (not shown) provided on the substrate 572B. In this embodiment, the substrate 572B is a semiconductor substrate, for example, a silicon substrate.

[0138] The substrate 571B and the substrate 572B constitute a substrate 550B, which is an example of a first substrate. The image sensor 301B has a ground wiring section 500B arranged across the two substrates 571B and 572B. The ground wiring section 500B is included in the ground line 350B. The ground wiring section 500B is made of a metal such as copper, aluminum, or tungsten.

[0139] The ground wiring unit 500B is used to apply a voltage to each pixel 201 (FIG. 3) of the pixel unit 200. Specifically, the ground wiring unit 500B is used to apply the ground potential, of the power supply potential and the ground potential, to each pixel 201.

[0140] The ground wiring unit 500B has a ground pattern 504, which is an example of a first conductor pattern, as in the first embodiment. The ground pattern 504 is disposed on a substrate 571B. The positional relationship between the ground pattern 504 and the pixel unit 200 is the opposite to that in the first embodiment. That is, the ground pattern 504 is disposed on the opposite side of the pixel unit 200 from the light incident side.

[0141] The printed wiring board 302B has a base 650B, which is an example of a second base, and a ground wiring section 600B provided on the base 650B. The base 650B is an insulating substrate formed of an insulating material such as glass epoxy resin or ceramics. In the third embodiment, as shown in FIG. 12(a) and FIG. 12(b), a frame 311 is sandwiched between a cover glass 312 and the base 650B. The frame 311 is disposed so as to surround the image sensor 301B. The frame 311 is formed of resin. The frame 311 is fixed to the base 650B with an adhesive or the like. The cover glass 312 is fixed to the upper surface of the frame 311 with an adhesive or the like.

[0142] The ground wiring section 600B is included in the ground line 350B. The ground wiring section 600B is formed of a metal such as copper, aluminum, or tungsten. As in the first embodiment, the ground wiring section 600B has a ground pattern 604 which is an example of a second conductor pattern. The ground pattern 604 is disposed, for example, on an inner layer of a base 650B of the printed wiring board 302B.

[0143] The ground pattern 504 and the ground pattern 604 are electrically connected to each other by a plurality of (for example, nine) connection conductors 391 and a plurality of (for example, nine) connection conductors 392, similarly to the first embodiment.

[0144] 13, each connection conductor 391 includes a pad 551, a connection line 561, a wire 351, a pad 651, and a via conductor 671, similar to the first embodiment. Moreover, each connection conductor 392 includes a pad 552, a connection line 562, a wire 352, a pad 652, and a via conductor 672, similar to the first embodiment.

[0145] In this embodiment, the pad 551 and the connection line 561 are disposed on the substrate 572B of the image sensor 301B, and the pad 651 and the via conductor 671 are disposed on the base 650B of the printed wiring board 302B. Similarly, in this embodiment, the pad 552 and the connection line 562 are disposed on the substrate 572B of the image sensor 301B, and the pad 652 and the via conductor 672 are disposed on the base 650B of the printed wiring board 302B.

[0146] As shown in Fig. 12(b), when the module main body 310B is viewed from the side in the X-axis direction, a loop structure L3 made of a conductor is formed in a part of the ground line 350B. The loop structure L3 includes the ground pattern 504, the ground pattern 604, the connecting conductor portion 391, and the connecting conductor portion 392. The magnetic fields 150 and 151 shown in Fig. 1 are linked to the loop structure L3. Therefore, an induced current is generated in the loop structure L3. This induced current generates a noise voltage in the pixel 201 (Fig. 3) of the pixel unit 200.

[0147] In the third embodiment, the ground line 350B of the module body 310B has at least one conductor portion connected in parallel to the ground pattern 504, in addition to the ground pattern 604. In the third embodiment, the at least one conductor portion is a conductor portion 700B.

[0148] In the third embodiment, conductor section 700B is included in image sensor 301B, and is disposed on base body 550B. Conductor section 700B is disposed across substrate 571B and substrate 572B. The specific configuration of conductor section 700B will be described.

[0149] The conductor section 700B includes a conductor pattern 710B as an example of at least one third conductor pattern. The conductor pattern 710B is disposed on the substrate 572B.

[0150] The pads 551 and connection lines 561 of each connection conductor 391 are arranged on the same layer as the conductor pattern 710B on the substrate 572B. Moreover, the pads 552 and connection lines 562 of each connection conductor 392 are arranged on the same layer as the conductor pattern 710B on the substrate 572B. The pads 551 are connected to the conductor pattern 710B by the connection lines 561. Similarly, the pads 552 are connected to the conductor pattern 710B by the connection lines 562. The pads 551 and connection lines 561 are arranged on one end side of the conductor pattern 710B in the Y-axis direction, and the pads 552 and connection lines 562 are arranged on the other end side of the conductor pattern 710B in the Y-axis direction.

[0151] Although the case where the pads 551 and the connection lines 561 of the respective connection conductors 391 are arranged on the board 572B has been described, this is not limiting and the pads 551 and the connection lines 561 may be arranged on the board 571B. In this case, the pads 551 and the connection lines 561 are arranged on the same layer as the ground pattern 504 on the board 571B, and the pads 551 are connected to the ground pattern 504 by the connection lines 561.

[0152] Similarly, the case where the pads 552 and the connection lines 562 of the respective connection conductors 392 are arranged on the board 572B has been described, but this is not limiting and the pads 552 and the connection lines 562 may be arranged on the board 571B. In this case, the pads 552 and the connection lines 562 are arranged on the same layer as the ground pattern 504 on the board 571B, and the pads 552 are connected to the ground pattern 504 by the connection lines 562.

[0153] When the module body 310B is viewed in the Z-axis direction, the region surrounding the ground pattern 504 is designated R504, as in the first embodiment. In Fig. 13, the region R504 is indicated by a dashed line. Moreover, when the module body 310B is viewed in the Z-axis direction, the region surrounding the conductor pattern 710B is designated R710. When the module body 310B is viewed in the Z-axis direction, the region R504 overlaps with a part or the whole of the region R710.

[0154] In this embodiment, when the module body 310B is viewed in the Z-axis direction, the region R504 is a rectangular region with the smallest area among the regions surrounding the ground pattern 504. In other words, when the module body 310B is viewed in the Z-axis direction, the region R504 is a region surrounded by the outline of the ground pattern 504. Also, in this embodiment, when the module body 310B is viewed in the Z-axis direction, the region R710 is a rectangular region with the smallest area among the regions surrounding the conductor pattern 710B. In other words, when the module body 310B is viewed in the Z-axis direction, the region R710 is a region surrounded by the outline of the conductor pattern 710B.

[0155] The conductor section 700B has a plurality of connection conductors that electrically connect the ground pattern 504 and the conductor pattern 710B. In this embodiment, the plurality of connection conductors are a plurality of via conductors 711B arranged in a portion where the ground pattern 504 and the conductor pattern 710B overlap when viewed in the Z-axis direction. The plurality of via conductors 711B are three or more via conductors arranged at intervals in the X-axis direction and the Y-axis direction. Each via conductor is arranged across the substrate 571B and the substrate 572B. With the above configuration, a parallel circuit of the ground pattern 504 and the conductor section 700B is formed.

[0156] The parallel circuit between the ground pattern 504 and the conductor portion 700B reduces the resistance ratio in equation (1). The reduced resistance ratio reduces the induced noise voltage V cmos This reduces noise superimposed on the generated image, thereby improving the quality of the image generated by image sensor 301B.

[0157] Moreover, the voltage drop in the ground pattern 504 can be reduced, and the DC voltage applied to each pixel 201 can be prevented from falling below the reference voltage. This makes it possible to prevent unevenness such as smear or shading from occurring in the image generated by the image sensor 301B. Therefore, the quality of the image generated by the image sensor 301B can be improved.

[0158] Since the conductor pattern 710B is arranged in a plane on the substrate 572B, the electrical resistance value of the conductor portion 700B can be reduced. Furthermore, since the ground pattern 504 and the conductor pattern 710B are connected by a plurality of via conductors 711B, the electrical resistance value of the parallel circuit of the ground pattern 504 and the conductor portion 700B can be reduced. This makes it possible to more effectively reduce the voltage drop in the ground pattern 504. Therefore, the quality of the image generated by the image sensor 301B can be further improved.

[0159] Ground pattern 504 may be a solid pattern, but is preferably mesh-like to reduce warping of image sensor 301B due to temperature changes. Conductive pattern 710B may be a solid pattern, but is preferably mesh-like to reduce warping of image sensor 301B due to temperature changes.

[0160] Although the at least one third conductor pattern arranged on the base 650B is one conductor pattern 710B in the above description, the present invention is not limited to this. The at least one third conductor pattern may be two or more conductor patterns.

[0161] Also, although the case where conductor pattern 710B is arranged on board 572B has been described, it may be arranged on board 571B. When there are multiple conductor patterns 710B, any one of the multiple conductor patterns 710B may be arranged on board 571B, and the rest may be arranged on board 572B.

[0162] Moreover, the ground pattern 504 and the conductor pattern 710B do not have to overlap when viewed in the Z-axis direction. That is, the conductor portion 700B may be configured similarly to the conductor portion 700 of the first embodiment.

[0163] Example 3 Hereinafter, a description will be given of Example 3 corresponding to the third embodiment. As in Example 1, the noise voltage generated at both ends of the ground pattern 504 in the Y-axis direction was evaluated by the resistance ratio of equation (3) related to equation (1).

[0164] Hereinafter, the resistance value of the ground pattern 504 is R1, the resistance value of the conductor pattern 710B is R2, and the resistance value of the ground pattern 604 is R3. Furthermore, the multiple via conductors 711B are assumed to be 108 via conductors. The combined resistance value of these via conductors 711B is R4+R5. The combined resistance value of the nine connecting conductor parts 391 is R6, and the combined resistance value of the nine connecting conductor parts 392 is R7.

[0165] Furthermore, the resistance values ​​of the pads 551 and 651 were ignored for each of the nine connection conductors 391. The combined resistance value of the nine connection lines 561 was set to R6a, the combined resistance value of the nine wires 351 to R6b, and the combined resistance value of the nine via conductors 671 to R6c. That is, R6=R6a+R6b+R6c.

[0166] Furthermore, the resistance values ​​of the pads 552 and 652 were ignored for each of the nine connection conductors 392. The combined resistance value of the nine connection lines 562 was set to R7a, the combined resistance value of the nine wires 352 to R7b, and the combined resistance value of the nine via conductors 672 to R7c. That is, R7=R7a+R7b+R7c.

[0167] The resistance values ​​calculated in Example 3 will be described. The width D0 of each of the wirings 511 and 512 (see FIG. 5) in the ground pattern 504 was set to 0.7 [μm], the thickness to 0.6 [μm], and the length to 20 [mm]. The material of the ground pattern 504 was aluminum (Al), and the resistivity was 2.82×10 -8 The number of wires 512 was set to 6000. This resulted in a resistance value R1 of 0.224 [Ω].

[0168] In the conductor portion 700B, the width of the conductor pattern 710B was 32 mm, the thickness was 0.6 μm, and the length was 20 mm. The material of the conductor pattern 710B was copper (Cu), and the resistivity was 1.68×10 -8 [Ωm]. This resulted in a resistance value of R2 of 2.36×10 -11 It became [Ω].

[0169] The multiple via conductors 711B had the same configuration. Each via conductor 711B had a diameter of 10 [μm] and a length of 10 [μm]. The material of each via conductor 711B was copper (Cu), and the resistivity was 1.68×10 -8 [Ωm]. This results in a resistance value of R4+R5 of 1.56×10 -5 It became [Ω].

[0170] The nine connection conductors 391 had the same shape and size. Each connection line 561 had a width of 20 μm, a thickness of 0.6 μm, and a length of 2 mm. The material of each connection line 561 was aluminum (Al), and the resistivity was 2.82×10 -8 [Ωm]. This resulted in a resistance value of R6a of 0.522 [Ω].

[0171] The nine connection conductors 392 were of the same shape and size. Each connection line 562 had a width of 20 μm, a thickness of 0.6 μm, and a length of 2 mm. The material of each connection line 562 was aluminum (Al), and the resistivity was 2.82×10 -8 [Ωm]. This resulted in a resistance value of R7a of 0.522 [Ω].

[0172] The diameter of each wire 351 was 20 [μm] and the length was 1.6 [mm]. The material of each wire 351 was gold (Au), and the resistivity was 2.44×10 -8 [Ωm]. This resulted in a resistance value of R6b of 0.014 [Ω].

[0173] The diameter of each wire 352 was 20 [μm] and the length was 1.6 [mm]. The material of each wire 352 was gold (Au), and the resistivity was 2.44×10 -8 [Ωm]. This resulted in a resistance value of R7b of 0.014 [Ω].

[0174] The diameter of each via conductor 671 is 100 [μm] and the length is 80 [μm]. The material of each via conductor 671 is copper (Cu), and the resistivity is 1.68×10 -8 [Ωm]. This resulted in a resistance value of R6c of 1.90×10 -5 It became [Ω].

[0175] The diameter of each via conductor 672 is 100 [μm] and the length is 80 [μm]. The material of each via conductor 672 is copper (Cu), and the resistivity is 1.68×10 -8 [Ωm]. This resulted in a resistance value of R7c of 1.90×10 -5 It became [Ω].

[0176] The ground pattern 604 was rectangular when viewed in the Z-axis direction. The ground pattern 604 had a width of 36 mm, a thickness of 15 μm, and a length of 26 mm. The material of the ground pattern 604 was copper (Cu), and the resistivity was 1.68×10 -8 [Ωm]. This resulted in a resistance value of R3 of 0.0008 [Ω].

[0177] Therefore, in Example 3, the resistance value A was 0.00081 [Ω], and the resistance value B was 1.073 [Ω]. Therefore, in Example 3, B>A. Also, in Example 3, the resistance ratio A / (A+B) was 0.00075. Here, the resistance ratio A / (A+B) corresponds to the resistance ratio in formulas (1) and (3).

[0178] In Comparative Example 1, the resistance value A was R1, which was 0.224 [Ω]. In Comparative Example 1, the resistance value B was 1.073 [Ω], similar to Example 3. In Comparative Example 1, the resistance ratio A / (A+B) was 0.173.

[0179] In Example 3, R1 = 0.224 [Ω], R2 = 2.36 × 10 -11 [Ω], R4 = 1.56 × 10 -5 [Ω], R5 = 1.56 × 10 -5 [Ω]. Therefore, in Example 3, R1>R2+R4+R5.

[0180] 14 is a graph of the resistance ratio A / (A+B) of Example 3 and Comparative Example 1. The resistance ratio A / (A+B) is a function of the induced noise voltage V noise Since it is proportional to noise In Comparative Example 1, the resistance ratio was 0.173, and in Example 3, the resistance ratio was 0.00081. Therefore, the induced noise voltage V noise The reduction in the induced noise voltage V noise was found to be reduced.

[0181] [Fourth embodiment] Next, an imaging module according to a fourth embodiment will be described. Fig. 15(a) and Fig. 15(b) are cross-sectional views of an imaging module 300C according to the fourth embodiment. Fig. 16 is a plan view of the imaging module 300C according to the fourth embodiment. In the fourth embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and detailed descriptions thereof will be omitted. The imaging device of the fourth embodiment includes an imaging module 300C instead of the imaging module 300 in Fig. 1.

[0182] Fig. 15(a) shows a schematic cross-sectional view of the imaging module 300C along the XZ plane. Fig. 15(b) shows a schematic cross-sectional view of the imaging module 300C along the YZ plane. Fig. 16 shows a schematic plan view of the imaging module 300C viewed in a direction perpendicular to the XY plane.

[0183] The imaging module 300C has a module body 310C, a frame 311, and a cover glass 312. Note that the cover glass 312 is not shown in Fig. 16. The module body 310C includes an image sensor 301C and a printed wiring board 302C on which the image sensor 301C is mounted. The module body 310C also includes a printed wiring board 320C fixed on the printed wiring board 302C.

[0184] The printed wiring board 302C has wiring such as a power supply wiring, a ground wiring, and a signal wiring. The printed wiring board 302C is a rigid wiring board. In this embodiment, the image sensor 301C and the printed wiring board 302C are connected by wire bonding. That is, the module body 310C has a plurality of wires 303 that electrically connect the image sensor 301C and the printed wiring board 302C, and a plurality of wires 723C that electrically connect the image sensor 301C and the printed wiring board 320C. Each of the wires 303 and 723C is made of a metal such as gold. These wires 303 and 723C are also called bonding wires.

[0185] The module body 310C includes a ground line 350C. Fig. 16 illustrates a wire 351 and a wire 352 that are part of the ground line 350C, among the multiple wires 303. The ground line 350C is connected to the negative terminal of a battery, which is a DC power source.

[0186] The image sensor 301C is a CCD image sensor or a CMOS image sensor, and in this embodiment, a case where the image sensor is a CMOS image sensor will be described. The image sensor 301C is a front-illuminated image sensor. The image sensor 301C has a base 550, which is an example of a first base, as in the first embodiment, and a pixel section 200 and a ground wiring section 500C as in the first embodiment. The pixel section 200 and the ground wiring section 500C are provided on the base 550. The ground wiring section 500C is included in the ground line 350C. The ground wiring section 500C is formed of a metal such as copper, aluminum, or tungsten.

[0187] The ground wiring section 500C is used to apply a voltage to each pixel 201 (FIG. 3) of the pixel section 200. Specifically, the ground wiring section 500C is used to apply the ground potential, of the power supply potential and the ground potential, to each pixel 201.

[0188] The ground wiring section 500C has a ground pattern 504, which is an example of a first conductor pattern, similarly to the first embodiment. The arrangement relationship between the pixel section 200 and the ground pattern 504 is similar to that of the first embodiment. The ground pattern 504 has a plurality of wirings 511 and a plurality of wirings 512. The plurality of wirings 511 and the plurality of wirings 512 are arranged to cross each other to form a mesh. Light L0 passes through the mesh of the ground pattern 504 and is incident on the photodiode 211 of each pixel 201 of the pixel section 200 shown in FIG. 3. In addition, since the ground pattern 504 is mesh-shaped, it is possible to suppress warping of the image sensor 301C due to temperature changes in the imaging module 300C.

[0189] The printed wiring board 302C has a base 650C, which is an example of a second base, and a ground wiring section 600C provided on the base 650C. The base 650C is an insulating substrate made of an insulating material such as glass epoxy resin or ceramics. As shown in Fig. 15(a) and Fig. 15(b), a frame 311 is sandwiched between a cover glass 312 and the base 650C.

[0190] The ground wiring section 600C is included in the ground line 350C. The ground wiring section 600C is formed of a metal such as copper, aluminum, or tungsten. As in the first embodiment, the ground wiring section 600C has a ground pattern 604, which is an example of a second conductor pattern. The ground pattern 604 is disposed, for example, on an inner layer of a base 650C of the printed wiring board 302C.

[0191] The ground pattern 504 and the ground pattern 604 are electrically connected to each other by a plurality of (for example, nine) connection conductors 391 and a plurality of (for example, nine) connection conductors 392, similarly to the first embodiment.

[0192] 16, like the first embodiment, each connection conductor 391 includes a pad 551, a connection line 561, a wire 351, a pad 651, and a via conductor 671. Also, like the first embodiment, each connection conductor 392 includes a pad 552, a connection line 562, a wire 352, a pad 652, and a via conductor 672.

[0193] As shown in Fig. 15(b), when the module main body 310C is viewed from the side in the X-axis direction, a loop structure L4 made of a conductor is formed in a part of the ground line 350C. The loop structure L4 includes a ground pattern 504, a ground pattern 604, a connecting conductor portion 391, and a connecting conductor portion 392. The magnetic fields 150 and 151 shown in Fig. 1 are linked to the loop structure L4. Therefore, an induced current is generated in the loop structure L4. This induced current generates a noise voltage in the pixel 201 (Fig. 3) of the pixel unit 200.

[0194] In the fourth embodiment, a ground line 350C of a module body 310C has at least one conductor portion connected in parallel to the ground pattern 504, in addition to the ground pattern 604. In the fourth embodiment, the at least one conductor portion is two conductor portions 700C.

[0195] In the fourth embodiment, each conductor portion 700C is formed across an image sensor 301C and a printed wiring board 320C. A specific configuration of each conductor portion 700C will be described below.

[0196] Each conductor portion 700C includes a conductor pattern 710C as an example of at least one fifth conductor pattern. Here, the printed wiring board 320C has a base 750C, which is an example of a third base. The conductor pattern 710C is provided on the base 750C. That is, the conductor pattern 710C is included in the printed wiring board 320C. The base 750C is an insulating substrate, for example, an organic substrate such as a glass epoxy substrate. The conductor pattern 710C is formed to extend in the Y-axis direction along a side of the ground pattern 504 extending in the Y-axis direction. The conductor pattern 710C is disposed on the base 750C so as to approach the ground pattern 504 in the Z-axis direction. This makes it possible to make a loop structure (not shown) other than the loop structure L4, including the conductor portion 700C and the ground pattern 504, as small as possible when the module main body 310C is viewed from the side in the X-axis direction. It is preferable that the position of conductor pattern 710C in the Z-axis direction be the same as the position of ground pattern 504 in the Z-axis direction.

[0197] Each conductor portion 700C has a plurality of connection conductors that electrically connect the ground pattern 504 and the conductor pattern 710C. The plurality of connection conductors are arranged at intervals in the Y-axis direction. In the fourth embodiment, the plurality of connection conductors are two connection conductors 711C and 712C, as shown in FIG. 16. In the fourth embodiment, the connection conductor 711C and the connection conductor 712C have the same configuration, and the connection conductor 711C will be specifically described below. The connection conductor 711C includes a pad 721C, a connection line 722C, a wire 723C, and a pad 724C.

[0198] The pad 721C and the connection line 722C are included in the ground wiring portion 500C of the image sensor 301C. That is, the pad 721C and the connection line 722C are provided on the base 550. The pad 721C and the ground pattern 504 are connected by the connection line 722C.

[0199] The pad 724C is included in the printed wiring board 320C. The conductive pattern 710C is formed on the outer layer of the base 750C. In the printed wiring board 320C, the pad 724C and the conductive pattern 710C are integrally formed. The conductive pattern 710C may be formed on an inner layer of the base 750C. In this case, the pad 724C and the conductive pattern 710C may be connected by a via conductor.

[0200] Pad 721C of image sensor 301C and pad 724C of printed wiring board 320C are connected by wire 723C. With the above configuration, a parallel circuit is formed between ground pattern 504 and conductor portion 700C.

[0201] The parallel circuit between the ground pattern 504 and the conductor portion 700C reduces the resistance ratio in equation (1). The reduced resistance ratio reduces the induced noise voltage V cmos This reduces noise superimposed on the generated image, thereby improving the quality of the image generated by the image sensor 301C.

[0202] In addition, the voltage drop in the ground pattern 504 can be reduced, and the DC voltage applied to each pixel 201 can be prevented from falling below the reference voltage. This makes it possible to prevent unevenness such as smear or shading from occurring in the image generated by the image sensor 301C. This improves the quality of the image generated by the image sensor 301C.

[0203] Moreover, since the conductor pattern 710C is disposed on the base 750C of the printed wiring board 320C, the thickness can be made thicker than when disposed on the image sensor 301C. Moreover, the area of ​​the conductor pattern 710C can be made larger as viewed in the Z-axis direction than when disposed outside the pixel unit 200 in the image sensor 301C. This can further reduce the electrical resistance value of the conductor unit 700C, and further effectively reduce the voltage drop in the ground pattern 504. Therefore, the quality of the image generated by the image sensor 301C can be further improved.

[0204] Furthermore, conductor pattern 710C is included in printed wiring board 320C other than image sensor 301C and printed wiring board 302C, so that wiring resources in image sensor 301C and printed wiring board 302C can be secured.

[0205] Although the at least one fourth conductor pattern included in the conductor section 700C is one conductor pattern 710C in the above description, the present invention is not limited to this. The at least one fourth conductor pattern may be two or more conductor patterns.

[0206] Also, although the case where the module body 310C has two conductor parts 700C has been described, the present invention is not limited to this. For example, the module body 310C may have one conductor part connected in parallel to the ground pattern 504. Also, the module body 310C may have three or more conductor parts connected in parallel to the ground pattern 504.

[0207] In addition, although the image sensor 301C is a front-illuminated image sensor, the present invention is not limited to this. For example, the image sensor 301C may be a back-illuminated image sensor. Even in this case, the ground pattern 504 is preferably formed in a mesh shape, which can prevent the image sensor 301C from warping due to temperature changes in the imaging module 300C.

[0208] Moreover, the conductive pattern 710C may be formed by evaporating or applying a metal material such as silver (Ag) onto the base 750C.

[0209] [Fifth embodiment] Next, an imaging module according to a fifth embodiment will be described. Fig. 17(a) and Fig. 17(b) are cross-sectional views of an imaging module 300D according to the fifth embodiment. Fig. 18 is a plan view of the imaging module 300D according to the fifth embodiment. In the fifth embodiment, the same components as those in the first and second embodiments are denoted by the same reference numerals, and detailed descriptions thereof will be omitted. The imaging device according to the fifth embodiment includes an imaging module 300D instead of the imaging module 300 in Fig. 1.

[0210] Fig. 17(a) shows a schematic cross-sectional view of the imaging module 300D along the XZ plane. Fig. 17(b) shows a schematic cross-sectional view of the imaging module 300D along the YZ plane. Fig. 18 shows a schematic plan view of the imaging module 300D viewed in a direction perpendicular to the XY plane.

[0211] The imaging module 300D has a module body 310D and a cover glass 312. Note that the cover glass 312 is not shown in Fig. 18. The module body 310D includes an image sensor 301D and a printed wiring board 302D on which the image sensor 301D is mounted.

[0212] The printed wiring board 302D has wiring such as a power supply wiring, a ground wiring, and a signal wiring. The printed wiring board 302D is a rigid wiring board. In this embodiment, the image sensor 301D and the printed wiring board 302D are connected by wire bonding. That is, as shown in FIG. 18, the module body 310D includes a plurality of wires 303D that electrically connect the image sensor 301D and the printed wiring board 302D. Each wire 303D is made of a metal such as gold. These wires 303D are also called bonding wires.

[0213] The module body 310D includes a ground line 350D. Of the multiple wires 303D, wires 351, 352, and 723D that are part of the ground line 350D are illustrated in Fig. 18. The ground line 350D is connected to the negative terminal of a battery that is a DC power source.

[0214] The image sensor 301D is a CCD image sensor or a CMOS image sensor, and in this embodiment, a case where the image sensor is a CMOS image sensor will be described. The image sensor 301D is a front-illuminated image sensor. The image sensor 301D has a base 550, which is an example of a first base, as in the first embodiment, and a pixel section 200 and a ground wiring section 500D as in the first embodiment. The pixel section 200 and the ground wiring section 500D are provided on the base 550. The ground wiring section 500D is included in the ground line 350D. The ground wiring section 500D is formed of a metal such as copper, aluminum, or tungsten.

[0215] The ground wiring unit 500D is used to apply a voltage to each pixel 201 (FIG. 3) of the pixel unit 200. Specifically, the ground wiring unit 500D is used to apply the ground potential, of the power supply potential and the ground potential, to each pixel 201.

[0216] The ground wiring section 500D has a ground pattern 504, which is an example of a first conductor pattern, as in the first embodiment. When the module body 310D is viewed in the Z-axis direction, a region surrounding the ground pattern 504 is defined as R504 as in the first embodiment. When the module body 310D is viewed in the Z-axis direction, a region surrounding the pixel section 200 is defined as R200 as in the first embodiment. When the module body 310D is viewed in the Z-axis direction, the region R504 overlaps with a part or the whole of the region R200. In this embodiment, when the module body 310D is viewed in the Z-axis direction, the region R504 overlaps with the whole of the region R200. In other words, when the module body 310D is viewed in the Z-axis direction, the region R504 includes the region R200.

[0217] The ground pattern 504 is disposed on the light incident side of the pixel section 200, that is, on the incident side of the light L0 with respect to the photodiode 211 (FIG. 3) of each pixel 201 of the pixel section 200, as in the first embodiment. Also, the ground pattern 504 is formed in a mesh shape so that the light L0 passes through the photodiode 211 of each pixel 201, as in the first embodiment. That is, the ground pattern 504 has a plurality of wirings 511 extending in the Y-axis direction and arranged at intervals in the X-axis direction, and a plurality of wirings 512 extending in the X-axis direction and arranged at intervals in the Y-axis direction. The plurality of wirings 511 and the plurality of wirings 512 are arranged to cross each other to form a mesh. The light L0 passes through the mesh of the ground pattern 504 and is incident on the photodiode 211 of each pixel 201 of the pixel section 200.

[0218] The printed wiring board 302D has a base 650D, which is an example of the second base, and a ground wiring section 600D provided on the base 650D. The base 650D is an insulating substrate formed of an insulating material such as glass epoxy resin or ceramics. In the first embodiment, as shown in FIG. 4(a) and FIG. 4(b), the frame 311 is sandwiched between the cover glass 312 and the base 650, but in the fifth embodiment, there is no frame. The base 650D of the fifth embodiment has a convex portion 651D that corresponds to the frame and surrounds the image sensor 301D. The cover glass 312 is fixed to the upper surface of the convex portion 651D of the base 650D with an adhesive or the like. Thus, the base 650D is a cavity substrate, and the surface of the base 650D on which the image sensor 301D is arranged is formed in a concave shape. The cavity substrate is a countersunk substrate or a laminated substrate.

[0219] The ground wiring section 600D is included in the ground line 350D. The ground wiring section 600D is formed of a metal such as copper, aluminum, or tungsten. As in the first embodiment, the ground wiring section 600D has a ground pattern 604, which is an example of a second conductor pattern. The ground pattern 604 is disposed, for example, on an inner layer of a base 650D of the printed wiring board 302D.

[0220] The ground pattern 504 and the ground pattern 604 are electrically connected to each other by a plurality of (for example, nine) connection conductors 391 and a plurality of (for example, nine) connection conductors 392, similarly to the first embodiment.

[0221] 18, each connection conductor 391, like the first embodiment, includes a pad 551, a connection line 561, a wire 351, a pad 651, and a via conductor 671. Also, each connection conductor 392, like the first embodiment, includes a pad 552, a connection line 562, a wire 352, a pad 652, and a via conductor 672.

[0222] As shown in Fig. 17(b), when the module main body 310D is viewed from the side in the X-axis direction, a loop structure L5 made of a conductor is formed in a part of the ground line 350D. The loop structure L5 includes a ground pattern 504, a ground pattern 604, a connecting conductor portion 391, and a connecting conductor portion 392. The magnetic fields 150 and 151 shown in Fig. 1 are linked to the loop structure L5. For this reason, an induced current is generated in the loop structure L5. This induced current generates a noise voltage in the pixel 201 (Fig. 3) of the pixel unit 200.

[0223] In the fifth embodiment, a ground line 350D of a module body 310D has at least one conductor portion connected in parallel to the ground pattern 504, in addition to the ground pattern 604. In the fifth embodiment, the at least one conductor portion is two conductor portions 700D.

[0224] In the fifth embodiment, each conductor portion 700D is formed across the image sensor 301D and the printed wiring board 302D. A specific configuration of each conductor portion 700D will be described below.

[0225] Each conductor portion 700D includes one conductor pattern 710D as an example of at least one fourth conductor pattern provided on the base 650D. The conductor pattern 710D is formed to extend in the Y-axis direction along a side of the ground pattern 504 that extends in the Y-axis direction.

[0226] Each conductor portion 700D has a plurality of connection conductors that electrically connect the ground pattern 504 and the conductor pattern 710D. The plurality of connection conductors are arranged at intervals in the Y-axis direction. In the fifth embodiment, the plurality of connection conductors are two connection conductors 711D and 712D, as shown in FIG. 18. In the fifth embodiment, the connection conductor 711D and the connection conductor 712D have the same configuration, and the connection conductor 711D will be specifically described below. The connection conductor 711D includes a pad 721D, a connection line 722D, a wire 723D, a pad 724D, and a via conductor 725D.

[0227] The pad 721D and the connection line 722D are included in the ground wiring portion 500D of the image sensor 301D. That is, the pad 721D and the connection line 722D are provided on the base 550. The pad 721D and the ground pattern 504 are connected by the connection line 722D.

[0228] The pad 724D and the via conductor 725D are included in the ground wiring portion 600D of the printed wiring board 302D. That is, the pad 724D and the via conductor 725D are provided on the base 650D. In the printed wiring board 302D, the pad 724D and the conductor pattern 710D are connected by the via conductor 725D.

[0229] A pad 721D of the image sensor 301D and a pad 724D of the printed wiring board 302D are connected by a wire 723D. With the above configuration, a parallel circuit is formed between the ground pattern 504 and the conductor portion 700D.

[0230] The parallel circuit between the ground pattern 504 and the conductor portion 700D reduces the resistance ratio in equation (1). The reduced resistance ratio reduces the induced noise voltage V cmos This reduces noise superimposed on the generated image, thereby improving the quality of the image generated by the image sensor 301D.

[0231] Moreover, the voltage drop in the ground pattern 504 can be reduced, and the DC voltage applied to each pixel 201 can be prevented from falling below the reference voltage. This makes it possible to prevent unevenness such as smear or shading from occurring in the image generated by the image sensor 301D. Therefore, the quality of the image generated by the image sensor 301D can be improved.

[0232] Furthermore, since the conductor pattern 710D is disposed on the base 650D of the printed wiring board 302D, the thickness can be made thicker than if disposed on the image sensor 301D. This can further reduce the electrical resistance value of the conductor portion 700D, and more effectively reduce the voltage drop in the ground pattern 504. This can further improve the quality of the image generated by the image sensor 301D.

[0233] Although the at least one fourth conductor pattern arranged on the base 650D is one conductor pattern 710D, the present invention is not limited to this. The at least one fourth conductor pattern may be two or more conductor patterns.

[0234] Also, although the case where the module body 310D has two conductor parts 700D has been described, the present invention is not limited to this. For example, the module body 310D may have one conductor part connected in parallel to the ground pattern 504. Also, the module body 310D may have three or more conductor parts connected in parallel to the ground pattern 504.

[0235] In addition, although the image sensor 301D is a front-illuminated image sensor, the present invention is not limited to this. For example, the image sensor 301D may be a back-illuminated image sensor. Even in this case, the ground pattern 504 is preferably formed in a mesh shape, which can prevent the image sensor 301D from warping due to temperature changes in the imaging module 300D.

[0236] 17(a), the distance in the Z-axis direction between the ground pattern 504 and the conductor pattern 710D is assumed to be H. If this distance H is greater than 0, then as shown in FIG 17(b), a loop structure L6 including the conductor portion 700D and the ground pattern 504 and different from the loop structure L5 is formed in a side view of the module main body 310D in the X-axis direction.

[0237] The noise voltage V induced in the ground pattern 504 by the two loop structures L5 and L6 noise is expressed by equation (6).

number

[0238] 19 is an equivalent circuit diagram of the ground line of the imaging module 300D according to the fifth embodiment. The resistance value of the ground pattern 504 is R1. The resistance value of the conductor pattern 710D is R2. The resistance value of the ground pattern 604 is R3. The resistance values ​​of the connection conductors 711D and 712D between the ground pattern 504 and the conductor pattern 710D are R4 and R5, respectively. The resistance values ​​of the connection conductors 391 and 392 between the ground pattern 504 and the ground pattern 604 are R6 and R7, respectively. The voltage induced in the loop 1301 between the ground pattern 504 and the conductor 700D is V1, and the voltage induced in the loop 1302 between the conductor 700D and the ground pattern 604 is V2.

[0239] From the above formula (6), it is preferable that the distance H in the Z-axis direction between the ground pattern 504 and the conductor pattern 710D is smaller than 1 / 2 the distance between the ground pattern 504 and the ground pattern 604. In other words, it is preferable that the distance H between the conductor pattern 710D and the ground pattern 504 in the Z-axis direction is shorter than the distance between the conductor pattern 710D and the ground pattern 604. This makes it possible to suppress image noise caused by the magnetic fields 150 and 151 interlinking with the loop structure L6. It is preferable that the distance H is 0 at which the loop structure L6 disappears. Note that if the distance H is 0, the via conductor 725D can be omitted.

[0240] Example 4 Hereinafter, a fourth example corresponding to the fifth embodiment will be described. In the fourth example, the distance H is changed to measure the induced noise voltage V noise was calculated based on equation (6). The induced noise voltage V noise The voltages that contribute more than the resistance value are voltage V1 induced in the loop formed by ground pattern 504 and conductor portion 700D and voltage V2 induced in the loop formed by ground pattern 604 and conductor portion 700D. The induced noise voltage is proportional to the loop area.

[0241] Hereinafter, the resistance value of ground pattern 504 is R1, the resistance value of conductor pattern 710D is R2, and the resistance value of ground pattern 604 is R3. Furthermore, the combined resistance value of two connecting conductors 711D is R4, and the combined resistance value of two connecting conductors 712D is R5. The combined resistance value of nine connecting conductor parts 391 is R6, and the combined resistance value of nine connecting conductor parts 392 is R7.

[0242] Furthermore, the resistance values ​​of the pads 551 and 651 were ignored for each of the nine connection conductors 391. The combined resistance value of the nine connection lines 561 was set to R6a, the combined resistance value of the nine wires 351 to R6b, and the combined resistance value of the nine via conductors 671 to R6c. That is, R6=R6a+R6b+R6c.

[0243] Furthermore, the resistance values ​​of the pads 552 and 652 were ignored for each of the nine connection conductors 392. The combined resistance value of the nine connection lines 562 was set to R7a, the combined resistance value of the nine wires 352 to R7b, and the combined resistance value of the nine via conductors 672 to R7c. That is, R7=R7a+R7b+R7c.

[0244] Additionally, the resistance values ​​of the pads 721D and 724D in each of the two connection conductors 711D were ignored. The combined resistance value of the two connection lines 722D in the two connection conductors 711D was set to R4a. The combined resistance value of the two wires 723D in the two connection conductors 711D was set to R4b. The combined resistance value of the two via conductors 725D in the two connection conductors 711D was set to R4c. In other words, R4=R4a+R4b+R4c.

[0245] Additionally, the resistance values ​​of the pads 721D and 724D in each of the two connection conductors 712D were ignored. The combined resistance value of the two connection lines 722D in the two connection conductors 712D was set to R5a. The combined resistance value of the two wires 723D in the two connection conductors 712D was set to R5b. The combined resistance value of the two via conductors 725D in the two connection conductors 712D was set to R5c. In other words, R5=R5a+R5b+R5c.

[0246] Then, the resistance values ​​R1 to R7 thus determined are substituted into R1 to R7 in equation (6) to obtain the induced noise voltage V noise asked for.

[0247] The resistance values ​​R1 to R7 calculated in Example 4 will be described. The width D0 of each of the wirings 511 and 512 in the ground pattern 504 was set to 0.7 [μm], the thickness to 0.6 [μm], and the length to 20 [mm]. The material of the ground pattern 504 was aluminum (Al), and the resistivity was 2.82×10 -8 The number of wires 512 was set to 6000. This resulted in a resistance value R1 of 0.224 [Ω].

[0248] The two conductor parts 700D have a symmetrical shape as shown in Fig. 18. In each conductor part 700D, the width of each conductor pattern 710D is 3 [mm], the thickness is 15 [μm], and the length is 20 [mm]. The material of each conductor pattern 710D is copper (Cu), and the resistivity is 1.68 × 10 -8 [Ωm]. This resulted in a resistance value of R2 of 0.0019 [Ω].

[0249] The two connection conductors 711D and the two connection conductors 712D have the same configuration. The connection line 722D has a width of 500 [μm], a thickness of 0.6 [μm], and a length of 2 [mm]. The material of the connection line 722D is aluminum (Al), and the resistivity is 2.82×10 -8 As a result, the resistance value of R4a was 0.0094[Ω] and the resistance value of R5a was 0.0094[Ω].

[0250] The diameter of the wire 723D is 20 [μm] and the length is 1.0 [mm]. The material of the wire 723D of the connection conductor 711D is gold (Au), and the resistivity is 2.44×10 -8 As a result, the resistance value of R4b was 0.039 [Ω], and the resistance value of R5b was 0.039 [Ω].

[0251] The diameter of the via conductor 725D was set to 100 [μm], and the length was set to a distance H [mm]. The distance H was changed between 0 and 0.7 [mm]. The material of the via conductor 725D was set to copper (Cu), and the resistivity was set to 1.68×10 -8 The resistance values ​​R4c and R5c change according to the distance H.

[0252] The nine connection conductors 391 had the same shape and size. Each connection line 561 had a width of 20 μm, a thickness of 0.6 μm, and a length of 2 mm. The material of each connection line 561 was aluminum (Al), and the resistivity was 2.82×10 -8 [Ωm]. This resulted in a resistance value of R6a of 0.522 [Ω].

[0253] The nine connection conductors 392 were of the same shape and size. Each connection line 562 had a width of 20 μm, a thickness of 0.6 μm, and a length of 2 mm. The material of each connection line 562 was aluminum (Al), and the resistivity was 2.82×10 -8 [Ωm]. This resulted in a resistance value of R7a of 0.522 [Ω].

[0254] The diameter of each wire 351 was 20 [μm] and the length was 1.6 [mm]. The material of each wire 351 was gold (Au), and the resistivity was 2.44×10 -8 [Ωm]. This resulted in a resistance value of R6b of 0.014 [Ω].

[0255] The diameter of each wire 352 was 20 [μm] and the length was 1.6 [mm]. The material of each wire 352 was gold (Au), and the resistivity was 2.44×10 -8 [Ωm]. This resulted in a resistance value of R7b of 0.014 [Ω].

[0256] The diameter of each via conductor 671 was 100 [μm] and the length was 0.4 [mm]. The material of each via conductor 671 was copper (Cu), and the resistivity was 1.68×10 -8 [Ωm]. This results in a resistance value of R6c of 9.50×10-5 It became [Ω].

[0257] The diameter of each via conductor 672 is 100 [μm] and the length is 0.4 [mm]. The material of each via conductor 672 is copper (Cu), and the resistivity is 1.68×10 -8 [Ωm]. This results in a resistance value of R7c of 9.50×10 -5 It became [Ω].

[0258] The ground pattern 604 was rectangular when viewed in the Z-axis direction. The ground pattern 604 had a width of 36 mm, a thickness of 15 μm, and a length of 26 mm. The material of the ground pattern 604 was copper (Cu), and the resistivity was 1.68×10 -8 [Ωm]. This resulted in a resistance value of R3 of 0.0008 [Ω].

[0259] FIG. 20 shows the induced noise voltage V noise 1 is a graph showing the calculation results of the above. The horizontal axis is the distance H [mm], and the vertical axis is the induced noise voltage V noise [V]. The induced noise voltage V noise Therefore, the shorter the distance H, the smaller the area of ​​the loop structure L6, and the smaller the induced noise voltage V noise Moreover, if the distance H is 0, that is, if the position in the Z-axis direction of the conductor pattern 710D is the same as the position in the Z-axis direction of the ground pattern 504, the loop structure L6 disappears and the induced noise voltage V noise This is more preferable because it is further reduced.

[0260] It should be noted that the present invention is not limited to the above-described embodiments, and many modifications are possible within the technical concept of the present invention. Furthermore, the effects described in the embodiments are merely a list of the most preferable effects resulting from the present invention, and the effects of the present invention are not limited to those described in the embodiments.

[0261] In the above first to fifth embodiments, the imaging module of the present invention is applied to an imaging device such as a digital camera, but the present invention is not limited to this. For example, the imaging module of the present invention can be applied to electronic devices that can be equipped with an imaging module, such as mobile communication devices such as smartphones, tablet PCs, and game consoles, and wearable devices.

[0262] In addition, in the above first to fifth embodiments, examples have been described in which the present invention is applied to a loop structure of a ground line, but the present invention is not limited to this and can be applied to a power supply line connected to a pixel.

[0263] In the above first embodiment, the conductor pattern 710 is formed linearly along one side of the ground pattern 504, but the present invention is not limited thereto. For example, the conductor pattern 710 may be formed in a U-shape or a ring shape so as to surround the ground pattern 504 when viewed in the Z-axis direction. In the above second embodiment, the conductor patterns 710A1 and 710A2 are formed linearly along one side of the ground pattern 504, but the present invention is not limited thereto. For example, the conductor patterns 710A1 and / or 710A2 may be formed in a U-shape or a ring shape so as to surround the ground pattern 504 when viewed in the Z-axis direction. In the above fourth embodiment, the conductor pattern 710C is formed linearly along one side of the ground pattern 504, but the present invention is not limited thereto. For example, the conductor pattern 710C may be formed in a U-shape or a ring shape so as to surround the ground pattern 504 when viewed in the Z-axis direction. In the above fifth embodiment, the conductor pattern 710D is formed linearly along one side of the ground pattern 504, but the present invention is not limited to this. For example, the conductor pattern 710D may be formed in a U-shape or a ring shape so as to surround the ground pattern 504 when viewed in the Z-axis direction. [Explanation of symbols]

[0264] 100...imaging device (electronic device), 200...pixel section, 201...pixel, 300...imaging module, 301...image sensor, 302...printed wiring board, 310...module body, 350...ground line, 391...connecting conductor section (first connecting conductor section), 392...connecting conductor section (second connecting conductor section), 504...ground pattern (first conductor pattern), 550...base (first base), 604...ground pattern (second conductor pattern), 650...base (second base), 700...conductor section

Claims

1. an image sensor having a first chip and a second chip bonded together; a wiring board on which the image sensor is mounted; a first connection conductor portion connecting the image sensor and the wiring board; a second connection conductor portion connecting the image sensor and the wiring board; The image sensor includes: a pixel unit provided in the first chip and including a plurality of pixels; a first conductor pattern provided on the first chip and used to apply a voltage to the plurality of pixels of the pixel unit; a logic circuit provided in the second chip; Each of the plurality of pixels includes a photodiode and a transistor that controls transfer of charge generated by photoelectric conversion in the photodiode; The wiring board includes: A substrate; A second conductor pattern is provided on the base, a first portion of the second conductor pattern is electrically connected to a first portion of the first conductor pattern via the first connection conductor portion; a second portion of the second conductor pattern is electrically connected to a second portion of the first conductor pattern via the second connection conductor portion; a loop structure of a conductor is formed including the first conductor pattern, the second conductor pattern, the first connecting conductor portion, and the second connecting conductor portion; the image sensor further includes a third conductor pattern provided on the second chip; the first portion of the second conductor pattern is electrically connected to the first portion of the third conductor pattern via the first connection conductor portion; the second portion of the second conductor pattern is electrically connected to the second portion of the third conductor pattern via the second connection conductor portion, the third conductor pattern is connected in parallel to the first conductor pattern; An imaging module comprising:

2. An image sensor having a first chip and a second chip joined to each other; a wiring board on which the image sensor is mounted; a first connection conductor portion connecting a first pad of the image sensor and the wiring board; a second connection conductor portion connecting a second pad of the image sensor and the wiring board; The image sensor includes: a pixel unit provided in the first chip and including a plurality of pixels; a first conductor pattern provided on the first chip and used to apply a voltage to the plurality of pixels of the pixel unit; a logic circuit provided in the second chip; The wiring board includes: A substrate; A second conductor pattern is provided on the base, a first portion of the second conductor pattern is electrically connected to a first portion of the first conductor pattern via the first connection conductor portion; a second portion of the second conductor pattern is electrically connected to a second portion of the first conductor pattern via the second connection conductor portion; a loop structure of a conductor is formed including the first conductor pattern, the second conductor pattern, the first connecting conductor portion, and the second connecting conductor portion; the image sensor further includes a third conductor pattern provided on the second chip; the first portion of the second conductor pattern is electrically connected to the first portion of the third conductor pattern via the first connection conductor portion; the second portion of the second conductor pattern is electrically connected to the second portion of the third conductor pattern via the second connection conductor portion, the third conductor pattern is connected in parallel to the first conductor pattern, at least a portion of the first conductor pattern overlaps with the pixel portion in a direction in which the image sensor and the wiring board are arranged; a resistance value between the first pad and the second pad in a portion of the loop structure not passing through the first connection conductor portion, the second connection conductor portion, and the second conductor pattern, but passing through the first conductor pattern and the third conductor pattern, is smaller than a resistance value between the first pad and the second pad in a portion of the loop structure not passing through the first conductor pattern and the third conductor pattern, but passing through the first connection conductor portion, the second connection conductor portion, and the second conductor pattern. An imaging module comprising:

3. At least a portion of the second conductor pattern overlaps with the pixel portion in the direction.

3. The imaging module according to claim 2.

4. At least a portion of the third conductor pattern overlaps with the pixel portion in the direction.

4. The imaging module according to claim 2, wherein the first and second electrodes are arranged in a first direction.

5. At least a portion of the third conductor pattern overlaps with the first conductor pattern in the direction; a resistance value between the first portion of the first conductor pattern and the second portion of the first conductor pattern in the first conductor pattern is greater than a resistance value between the first portion of the third conductor pattern and the second portion of the third conductor pattern in the third conductor pattern.

5. The imaging module according to claim 2, wherein the first and second electrodes are arranged in a first direction.

6. the image sensor is disposed between the first connection conductor and the second connection conductor.

6. The imaging module according to claim 1, wherein the first and second electrodes are arranged in a first direction.

7. a plurality of connection conductors electrically connecting the first conductor pattern and the third conductor pattern are disposed between the first conductor pattern and the third conductor pattern; 7. The imaging module according to claim 1, wherein the first and second electrodes are arranged in a first direction.

8. a plurality of connection conductors connecting the first conductor pattern and the third conductor pattern are disposed across the first chip and the second chip; 8. The imaging module according to claim 1, wherein the first and second electrodes are arranged in a first direction.

9. a distance between the third conductor pattern and the first conductor pattern is smaller than a distance between the third conductor pattern and the second conductor pattern; 9. The imaging module according to claim 1, wherein the first and second electrodes are arranged in a first direction.

10. The first chip and the second chip are electrically connected to each other by direct bonding of Cu-Cu.

10. The imaging module according to claim 1, wherein the first and second electrodes are arranged in a first direction.

11. The distance between the first connection conductor and the second connection conductor is greater than 20 mm.

11. The imaging module according to claim 1,

12. The first conductor pattern is formed in a mesh shape.

12. The imaging module according to claim 1, wherein the first and second electrodes are arranged in a first direction.

13. A transparent body, A frame body, the image sensor and the frame are disposed between the transparent body and the wiring board such that the frame surrounds the image sensor.

13. The imaging module according to claim 1, wherein the imaging module is a semiconductor laser.

14. the loop structure is included in a power supply line or a ground line used to apply a voltage to the plurality of pixels of the pixel section; 14. The imaging module according to claim 1, wherein the imaging module is a semiconductor laser.

15. The base is formed of glass epoxy resin or ceramics.

15. The imaging module according to claim 1,

16. A housing and and an imaging module according to any one of claims 1 to 15, disposed inside the housing.

1. An electronic device comprising:

17. further comprising an inductor disposed within the housing.

17. The electronic device according to claim 16 .

18. A housing and and the imaging module according to any one of claims 1 to 15, which is disposed inside the housing; The lens device is detachable from the housing.

1. An electronic device comprising:

19. Further comprising an image stabilization module disposed inside the housing.

19. The electronic device according to claim 16, wherein the first and second electrodes are arranged in a first direction.

20. The electronic device is a mobile communication device or a wearable device.

20. The electronic device according to claim 16, wherein the first and second electrodes are arranged in a first direction.

Images